Burn-in board and burn-in apparatus

Abstract

To obtain a burn-in board capable of performing accurate burn-in testing on a plurality of semiconductor elements connected to a plurality of sockets of the burn-in board regardless of the arrangement positions of the sockets.SOLUTION: A burn-in board includes: a first substrate having a plurality of sockets to which semiconductor elements to be tested are connected, at least one first connector, and a plurality of first wires connecting the sockets and the first connector; and a second substrate having a plurality of regulator elements that stabilize a test voltage applied to the semiconductor elements, at least one second connector that is connected to the first connector, and a plurality of second wires that connect the regulator elements and the second connector.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a burn-in board and a burn-in device.

Background Art

[0002] Patent Document 1 discloses a burn-in board related to the background art. The burn-in board includes a wiring board, a plurality of sockets arranged in a matrix on the wiring board, connection terminals arranged on one side of the wiring board, and one front circuit device arranged on the wiring board. The front circuit device is arranged between the plurality of sockets and the connection terminals. The front circuit device has one regulator circuit. The regulator circuit outputs a test voltage of a desired value by stabilizing the power supply voltage supplied from a power supply unit outside the burn-in board via the connection terminals.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] According to the burn-in board related to the background art, the wiring lengths of the wirings connecting the front circuit device and the sockets are significantly different between the sockets close to the front circuit device and the sockets far from the front circuit device. In particular, in a large-sized burn-in board, this difference in wiring length becomes remarkable. Therefore, even if the regulator circuit outputs a test voltage of a desired value, the test voltage input to the socket far from the front circuit device is greatly reduced from the desired value due to the voltage drop according to the wiring resistance. As a result, an accurate burn-in test cannot be performed on the semiconductor element to be tested connected to the socket far from the front circuit device.

[0005] The present invention aims to obtain a burn-in board and a burn-in device capable of performing an accurate burn-in test regardless of the arrangement position of sockets, with respect to a plurality of semiconductor elements connected to the sockets of the burn-in board.

Means for Solving the Problems

[0006] The burn-in board according to the first aspect of the present invention includes a first substrate having a plurality of sockets to which semiconductor elements to be tested are connected, at least one first connector, and a plurality of first wirings connecting the sockets and the first connector, a plurality of regulator elements for stabilizing the test voltage applied to the semiconductor elements, a second substrate having at least one second connector connected to the first connector and a plurality of second wirings connecting the regulator elements and the second connector.

[0007] According to the first aspect, since the second substrate has a plurality of regulator elements, the difference in wiring length between each regulator element and each socket is small. As a result, an accurate burn-in test can be performed with respect to a plurality of semiconductor elements connected to the plurality of sockets of the burn-in board regardless of the arrangement position of the sockets.

[0008] In addition, by providing the second substrate having a plurality of regulator elements as a separate substrate from the first substrate having a plurality of sockets, it is not necessary to secure space on the first substrate for mounting the regulator elements, so more sockets can be mounted on the first substrate. Furthermore, by adding the second substrate, it becomes possible to additionally mount other semiconductor elements such as a voltage detection circuit on the second substrate instead of the first substrate.

[0009] The burn-in board according to the second aspect of the present invention is, in the first aspect, a plurality of the sockets are connected to one of the first connectors, and a plurality of the regulator elements are connected to one of the second connectors.

[0010] According to the second aspect, since the plurality of sockets and the plurality of regulator elements can be electrically connected by connecting the first connector and the second connector, the assembly process of the burn-in board can be facilitated and the physical connection strength can also be improved. In addition, one second substrate can be commonly used for a plurality of types of first substrates having different numbers or sizes of sockets, etc.

[0011] In the burn-in board according to the third aspect of the present invention, in the first or second aspect, one of the regulator elements is connected to one of the sockets via the second wiring, the second connector, the first connector, and the first wiring.

[0012] According to the third aspect, since one socket is connected to one regulator element, a test voltage of a desired value can be accurately supplied to each semiconductor element.

[0013] In the burn-in board according to the fourth aspect of the present invention, in the first or second aspect, one of the regulator elements is connected to a plurality of the sockets via the second wiring, the second connector, the first connector, and a plurality of the first wirings.

[0014] According to the fourth aspect, since a plurality of sockets are connected to one regulator element, the number of mounted regulator elements can be reduced. As a result, cost reduction, weight reduction, and reduction of the number of components of the burn-in board can be realized.

[0015] In the burn-in board according to the fifth aspect of the present invention, in the fourth aspect, the plurality of sockets are arranged in a matrix, and a plurality of the sockets in a plurality of rows and a plurality of columns are connected to one of the regulator elements.

[0016] According to the fifth aspect, since a plurality of sockets in a plurality of rows and a plurality of columns are connected to one regulator element, the difference in wiring length between each regulator element and each socket can be made smaller compared to a configuration in which a plurality of sockets having a large difference in wiring length are connected to one regulator element.

[0017] The burn-in device according to the sixth aspect of the present invention includes a burn-in board according to any one of the first to fifth aspects, a test tank in which the burn-in board is housed, and a power supply board that supplies a power supply voltage for generating a test voltage applied to a semiconductor element to be tested to the burn-in board.

[0018] According to the sixth aspect, it is possible to realize a burn-in device capable of performing an accurate burn-in test regardless of the arrangement position of the sockets.

Effect of the Invention

[0019] According to the present invention, it is possible to obtain a burn-in board and a burn-in device capable of performing an accurate burn-in test on a plurality of semiconductor elements connected to a plurality of sockets of the burn-in board regardless of the arrangement position of the sockets.

Brief Description of the Drawings

[0020]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Best Mode for Carrying Out the Invention

[0021] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that elements denoted by the same reference numerals in different drawings indicate the same or corresponding elements.

[0022] FIG. 1 is a diagram schematically showing the configuration of a burn-in apparatus 100 according to an embodiment of the present invention. The burn-in apparatus 100 includes a burn-in board 1, a relay board 2, a power supply board 3, and a test bath 4.

[0023] The burn-in board 1 has a plurality of sockets 31 arranged in a matrix. Each socket 31 houses and electrically connects a semiconductor element 43 (see FIG. 5), which is a test object of the burn-in test. For example, the semiconductor element 43 is a semiconductor IC such as a packaged memory IC or logic IC, and the socket 31 is an IC socket. In the present embodiment, an example of the burn-in board 1 having a total of 64 sockets 31 arranged in 8 rows and 8 columns will be described, but the present invention is not limited to this example. The burn-in board 1 may have a larger number of sockets 31, such as 16 rows and 16 columns.

[0024] In the burn-in test, the burn-in board 1 is housed in the test bath 4. The test bath 4 is, for example, a thermostatic bath, and the temperature of the internal space can be set to a desired value. Thereby, thermal stress is applied to the semiconductor element 43 in the burn-in test.

[0025] The power supply board 3 supplies a power supply voltage for generating a test voltage applied to the semiconductor element 43 in the burn-in test to the burn-in board 1 via the relay board 2.

[0026] The relay board 2 is arranged to penetrate the side wall of the test tank 4. The relay board 2 has a female connector 13 on the inner side of the test tank 4 and a male connector 14 on the outer side of the test tank 4. By connecting the male connection terminal 12 of the burn-in board 1 to the connector 13, the burn-in board 1 and the relay board 2 are connected. Also, by connecting the female connector 15 of the power supply board 3 to the connector 14, the power supply board 3 and the relay board 2 are connected.

[0027] Figure 2 is a diagram showing a simplified configuration of the burn-in board 1. The burn-in board 1 includes a first substrate 21, a second substrate 22, and a housing 23. The second substrate 22 has an outer shape that is slightly smaller than that of the first substrate 21. The housing 23 has an open upper surface. The first substrate 21 and the second substrate 22 are connected to each other to form a connection body. By fixing the first-substrate side of the connection body to the upper surface of the housing 23, the burn-in board 1 is assembled. The second substrate 22 is disposed in the gap between the first substrate 21 and the bottom surface of the housing 23. That is, the outer size of the burn-in board 1 is the same as the outer size of the existing burn-in board without the second substrate 22. Therefore, in the burn-in device of the prior art, not only can the burn-in board of the prior art be used, but also the burn-in board 1 having the second substrate 22 can be introduced at low cost and without modification.

[0028] A plurality of sockets 31 are arranged on the surface of the first substrate 21. The connection terminal 12 is arranged on the side surface of the first substrate 21. Although not shown in Figure 2, a female first connector 35 (see Figure 3) is arranged on the back surface of the first substrate 21. The socket 31 is connected to the first connector 35 via first wirings 34A, 34B (not shown in Figure 2, see Figure 3) formed on the back surface of the first substrate 21.

[0029] On the surface of the second substrate 22, a plurality of regulator elements 32 are arranged. In the example of the present embodiment, the plurality of sockets 31 and the plurality of regulator elements 32 correspond one-to-one, and the second substrate 22 has a total of 64 regulator elements 32 arranged in 8 rows and 8 columns. The regulator element 32 generates and outputs a stabilized test voltage by stepping down the power supply voltage input from the power supply board 3 to a reference voltage of a constant value.

[0030] Also, on the surface of the second substrate 22, a male second connector 33 is arranged. The regulator element 32 is connected to the second connector 33 via second wirings 36A and 36B (not shown in FIG. 2, see FIG. 4) formed on the surface of the second substrate 22. By connecting the first connector 35 arranged on the back surface of the first substrate 21 and the second connector 33 arranged on the surface of the second substrate 22, the socket 31 and the regulator element 32 are electrically connected via the first wirings 34A and 34B, the first connector 35, the second connector 33, and the second wirings 36A and 36B.

[0031] FIG. 3 is a top view schematically showing the configuration of the first substrate 21. On the surface of the first substrate 21, a total of 64 sockets 31 11 ~31 18 ,31 21 ~31 28 ,31 31 ~31 38 ,31 41 ~31 48 ,31 51 ~31 58 ,31 61 ~31 68 ,31 71 ~31 78 ,31 81 ~31 88 are arranged. On the back surface of the first substrate 21, the socket 31 41 ~31 48 and the socket 31 51 ~31 58One first connector 35 extending in the row direction is arranged in the gap with [the object]. Further, on the back surface of the first substrate 21, first wirings 34A and 34B connecting each socket 31 and the first connector 35 are formed. The first substrate 21 is fixed to the housing 23 by screws 9 inserted through screw holes formed at the four corners.

[0032] FIG. 4 is a top view schematically showing the configuration of the second substrate 22. On the surface of the second substrate 22, a total of 64 regulator elements 32 arranged in 8 rows and 8 columns 11 ~32 18 ,32 21 ~32 28 ,32 31 ~32 38 ,32 41 ~32 48 ,32 51 ~32 58 ,32 61 ~32 68 ,32 71 ~32 78 ,32 81 ~32 88 are arranged. In the gap between the regulator element 32 41 ~32 48 and the regulator element 32 51 ~32 58 , one second connector 33 extending in the row direction is arranged. Further, on the surface of the second substrate 22, second wirings 36A and 36B connecting each regulator element 32 and the second connector 33 are formed. The second substrate 22 is fixed to the first substrate 21.

[0033] FIG. 5 is a diagram showing the circuit configuration of the regulator element 32. The regulator element 32 is configured using a general three-terminal series regulator and includes an operational amplifier 41, an N-channel MOSFET 42, resistors 44 to 46, and capacitors 47 and 48.

[0034] One end of the first wiring 34A is connected to one end of the second wiring 36A via the first connector 35 and the second connector 33. The other end of the first wiring 34A is connected to the power supply terminal (VCC) of the semiconductor element 43 via the socket 31 (not shown in FIG. 5). The other end of the second wiring 36A is connected to the source terminal (S) of the MOSFET 42. One end of the first wiring 34B is connected to one end of the second wiring 36B via the first connector 35 and the second connector 33. The other end of the first wiring 34B is connected to the first wiring 34A in the vicinity of the power supply terminal (VCC) of the semiconductor element 43. The other end of the second wiring 36B is connected to the inverting input terminal (-) of the operational amplifier 41 via the resistor 46. A detected value of the test voltage input to the power supply terminal (VCC) of the semiconductor element 43 is input to the inverting input terminal of the operational amplifier 41. A reference voltage Vref corresponding to the desired value of the test voltage is input to the non-inverting input terminal (+) of the operational amplifier 41. The output terminal of the operational amplifier 41 is connected to the gate terminal (G) of the MOSFET 42 via the resistor 44. The power supply voltage (POWER) is input to the drain terminal (D) of the MOSFET 42 from the power supply board 3 via the relay board 2.

[0035] Note that the first wiring 34B may be omitted, and one end of the second wiring 36B may be connected to the second wiring 36A in the vicinity of the second connector 33.

[0036] The operational amplifier 41 controls the driving amount of the gate terminal (G) of the MOSFET 42 so that the detected value of the test voltage becomes equal to the reference voltage Vref corresponding to the desired value of the test voltage. Thereby, a stabilized test voltage can be applied from the source terminal (S) of the MOSFET 42 to the power supply terminal (VCC) of the semiconductor element 43 via the second wiring 36A and the first wiring 34A.

[0037] According to this embodiment, since the second substrate 22 has a plurality of regulator elements 32 corresponding to each socket 31, the difference in the wiring length between each regulator element 32 and each socket 31 is small as compared with the configuration in which only one regulator element is provided. As a result, regarding the plurality of semiconductor elements 43 connected to the plurality of sockets 31 on the burn-in board 1, an accurate burn-in test can be executed regardless of the arrangement position of the sockets 31.

[0038] In addition, since the second substrate 22 having a plurality of regulator elements 32 is provided as a separate substrate from the first substrate 21 having a plurality of sockets 31, it is not necessary to secure space on the first substrate 21 for mounting the regulator elements 32. Therefore, more sockets 31 can be mounted on the first substrate 21, or other semiconductor elements such as a voltage detection circuit can be additionally mounted on the second substrate 22.

[0039] In addition, according to this embodiment, since the plurality of sockets 31 and the plurality of regulator elements 32 can be electrically connected by connecting the first connector 35 and the second connector 33, the assembly process of the burn-in board 1 can be facilitated and the physical connection strength can also be improved. And since the plurality of sockets 31 and the plurality of regulator elements 32 can be electrically connected by connecting the first connector 35 and the second connector 33, even when changing the number, size, or layout, etc. of the sockets 31 on the first substrate 21, it is possible to electrically connect the sockets 31 and the regulator elements 32 without changing the number, size, or layout, etc. of the regulator elements 32 on the second substrate 22. For this reason, one second substrate 22 can be commonly used for a plurality of types of first substrates 21 having different numbers, sizes, or layouts, etc. of the sockets 31.

[0040] In addition, according to this embodiment, since one socket 31 is connected to one regulator element 32, a test voltage of a desired value can be accurately supplied to each semiconductor element 43.

[0041] <First Modification> FIG. 6 is a top view schematically showing the configuration of the second substrate 22 according to the first modification. The second substrate 22 has a plurality (four in this example) of second connectors 33A to 33D instead of the single second connector 33 shown in FIG. 4. For example, the second connector 33A is disposed in the gap between the regulator elements 32 21 ~32 24 and the regulator elements 32 31 ~32 34 Among a total of 64 regulator elements 32 arranged in 8 rows and 8 columns, 16 regulator elements 32 11 ~32 14 ,32 21 ~32 24 ,32 31 ~32 34 ,32 41 ~32 44 in 4 rows and 4 columns are connected to the second connector 33A via the second wiring 36. The first substrate 21 has a plurality of first connectors 35 corresponding to the number and arrangement positions of the plurality of second connectors 33.

[0042] Note that the number of divisions of each of the second connector 33 and the first connector 35 is not limited to four shown in FIG. 6, and may be any plurality of two or more.

[0043] According to this modification, even when the burn-in board 1 is enlarged and it is not possible to prepare one long second connector 33 and one long first connector 35, by dividing each of the second connector 33 and the first connector 35 into a plurality, it is possible to cope with the enlargement of the burn-in board 1.

[0044] <Second Modification> In the above embodiment, the plurality of sockets 31 and the plurality of regulator elements 32 correspond one-to-one, but a plurality of sockets 31 may correspond to one regulator element 32.

[0045] FIG. 7 is a top view schematically showing the configuration of the first substrate 21. The configuration of FIG. 7 is a form in which a plurality of sockets 31 in a plurality of adjacent rows and a plurality of adjacent columns are classified into one group X. Specifically, a total of 64 sockets 31 are classified into 16 groups Xa to Xp. Each of the groups Xa to Xp includes four sockets 31 in two adjacent rows and two adjacent columns. For example, group Xa includes sockets 31 11 , 31 12 , 31 21 , 31 22 .

[0046] FIG. 8 is a top view schematically showing the configuration of the second substrate 22 according to the second modification example, showing the configuration of the second substrate 22 corresponding to the first substrate 21 of FIG. 7. On the surface of the second substrate 22, 16 regulator elements 32a to 32p corresponding to the 16 groups Xa to Xp of the first substrate 21 are arranged. For example, the regulator element 32a applies a common test voltage to the four sockets 31 11 , 31 12 , 31 21 , 31 22 .

[0047] FIG. 9 is a top view schematically showing still another configuration of the first substrate 21. The configuration of FIG. 9 is another form in which a plurality of sockets 31 in a plurality of adjacent rows and a plurality of adjacent columns are classified into one group X. A total of 64 sockets 31 are classified into four groups Xs to Xv. Each of the groups Xs to Xv includes 16 sockets 31 in four adjacent rows and four adjacent columns. For example, group Xs includes sockets 31 11 ~31 14 , 31 21 ~31 24 , 31 31 ~31 34 , 31 41 ~31 44 .

[0048] The first wiring 34 11 connects the socket 31 11 to the first connector 35, and the first wiring 34 21 connects the socket 31 21and connect it to the first connector 35, the first wiring 34 31 is the socket 31 31 and connect it to the first connector 35, the first wiring 34 41 is the socket 31 41 and connect it to the first connector 35. The first wiring 34 11 ,34 21 ,34 31 ,34 41 The wiring length of each of the wirings 34 is longer as the distance between the socket 31 and the first connector 35 becomes longer. Therefore, the cross-sectional area of the wiring may be increased for the first wiring 34 with a longer wiring length to reduce the wiring resistance. Thereby, the voltage drop in the first wiring 34 can be made uniform among the first wirings 34 11 ,34 21 ,34 31 ,34 41 with different wiring lengths. The same applies to the other first wirings 34 11 ,34 21 ,34 31 ,34 41 other than 34.

[0049] FIG. 10 is a top view schematically showing another configuration of the second substrate 22 according to the second modification example, and shows the configuration of the second substrate 22 corresponding to the first substrate 21 in FIG. 9. On the surface of the second substrate 22, four regulator elements 32s to 32v corresponding to the four groups Xs to Xv of the first substrate 21 are arranged. For example, the regulator element 32s applies a common test voltage to the 16 sockets 31 11 ~31 14 ,31 21 ~31 24 ,31 31 ~31 34 ,31 41 ~31 44 included in the group Xs.

[0050] Note that the mode of grouping the plurality of sockets 31 is not limited to the two rows and two columns shown in FIG. 7 or the four rows and four columns shown in FIG. 9, and may be any plurality of rows and columns such as two rows and four columns, or four rows and two columns.

[0051] According to this modification example, since a plurality of sockets 31 are connected to one regulator element 32, the number of mounted regulator elements 32 can be reduced. As a result, cost reduction, weight reduction, and reduction in the number of components of the burn-in board 1 can be achieved.

[0052] Further, according to this modification example, since a plurality of sockets 31 arranged in a plurality of rows and a plurality of columns are connected to one regulator element 32, the difference in wiring length between each regulator element 32 and each socket 31 can be made smaller compared to a configuration in which a plurality of sockets 31 with a large difference in wiring length are connected to one regulator element 32.

[0053] Note that the first wiring 34 is not limited to the back surface of the first substrate 21, and may be provided on any layer such as the front surface or the intermediate layer of the first substrate 21. Also, the second wiring 36 is not limited to the front surface of the second substrate 22, and may be provided on any layer such as the back surface or the intermediate layer of the second substrate 22.

Explanation of Reference Numerals

[0054] 1 Burn-in board 3 Power supply board 4 Test tank 21 First substrate 22 Second substrate 31, 31 11 ~31 88 Socket 32, 32 11 ~32 88 , 32a~32p, 32s~32v Regulator element 33, 33A~33D Second connector 34, 34A, 34B First wiring 35 First connector 36, 36A, 36B Second wiring 43 Semiconductor element 100 Burn-in device

Claims

1. A plurality of sockets to which a semiconductor device to be tested is connected, At least one first connector, A plurality of first wirings connecting the socket and the first connector, A first substrate having the above, A plurality of regulator elements for stabilizing the test voltage applied to the semiconductor device, At least one second connector connected to the first connector, A plurality of second wirings connecting the regulator element and the second connector, A second substrate having the above, A burn-in board comprising the above.

2. A plurality of the sockets are connected to one of the first connectors, A plurality of the regulator elements are connected to one of the second connectors, The burn-in board according to Claim 1.

3. One of the regulator elements is connected to one of the sockets via the second wiring, the second connector, the first connector, and the first wiring. The burn-in board according to Claim 1.

4. One of the regulator elements is connected to a plurality of the sockets via the second wiring, the second connector, the first connector, and a plurality of the first wirings. The burn-in board according to Claim 1.

5. The plurality of sockets are arranged in a matrix, One of the regulator elements is connected to a plurality of the sockets in a plurality of rows and a plurality of columns. The burn-in board according to Claim 4.

6. The burn-in board according to any one of Claims 1 to 5, A test tank in which the burn-in board is housed, A power supply board for supplying a power supply voltage for generating a test voltage applied to a semiconductor device to be tested to the burn-in board, A burn-in device comprising the above.

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