Camera housing

Abstract

To provide a camera housing capable of effectively cooling an image capturing device regardless of a mounting position and the shape of the accommodated image capturing device.SOLUTION: A camera housing for accommodating an image capturing device is provided, the camera housing comprising a heat conductive base member configured to hold the image capturing device, heat exchanging means, and blowing means, where air temperature-adjusted by the heat exchanging means is blown by the blowing means through a flow path formed by the base member.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a camera housing.

Background Art

[0002] In recent years, with the increasing functionality of imaging devices, their power consumption has been on the rise. On the other hand, in imaging devices, it is known that thermal noise increases as the temperature of the imaging element rises, deteriorating the image quality of photography. Further, when an imaging device is used in a high-temperature environment exceeding its operating temperature, there are concerns about malfunctions of the device or causes of failures.

[0003] An imaging device may be housed in a camera housing to improve its dustproof, waterproof, shock-resistant performance, etc., or to provide a pan-tilt function. The inside of the camera housing may become hotter than the outside air temperature due to the heat generated by the housed imaging device or the influence of the rise in the housing exterior temperature due to sunlight. In such cases, the temperature of the imaging device becomes higher than when the camera housing is not used. In particular, in a sealed camera housing having high dustproof and waterproof performance, this tendency is remarkable because there is no air exchange with the outside air. Therefore, a high cooling performance for the housed imaging device is required for the camera housing. As an example of such a housing having high cooling performance, there is a cooling housing using a Peltier module.

[0004] In Patent Document 1, a forced circulation air flow path is provided in a pan-tilt mechanism section in which an imaging device is housed in a pan-tilt device. And a technique is disclosed in which air whose temperature is adjusted by an active temperature element (Peltier module) is blown by a fan against the air flow path to enable temperature adjustment inside the device.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, in the technology disclosed in Patent Document 1 above, the air flow path blown by the fan is not clearly defined in the vicinity of the imaging device. Generally, since air flow has the property of flowing in the direction with less ventilation resistance, depending on the mounting position and shape of the imaging device, most of the air flow may pass through a relatively open space separated from the imaging device, and there has been a concern that it cannot sufficiently contribute to reducing the temperature of the imaging device.

[0007] Therefore, an object of the present invention is to provide a camera housing that can effectively cool an imaging device regardless of the mounting position and shape of the imaging device to be accommodated.

Means for Solving the Problems

[0008] In order to achieve the above object, a camera housing according to one aspect of the present invention is a camera housing in which an imaging device can be mounted, and includes a pedestal member having heat conductivity configured to hold the imaging device, heat exchange means, and blowing means. The air whose temperature is adjusted by the heat exchange means is blown into the flow path formed by the pedestal member by the blowing means.

Effects of the Invention

[0009] According to the present invention, the imaging device can be effectively cooled regardless of the mounting position and shape of the imaging device to be accommodated.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Best Mode for Carrying Out the Invention

[0011] Hereinafter, preferred embodiments of the present invention will be described in detail based on the accompanying drawings. However, the embodiments of the present invention are not limited to the following embodiments. The same or equivalent components, members, and processes shown in each drawing are denoted by the same reference numerals, and repeated explanations will be omitted as appropriate. Also, some of the members that are not important for the explanation in each drawing are omitted from the display.

[0012] <Embodiment 1>

[0013] FIG. 1 is a perspective view of the camera housing 10 according to the present embodiment as viewed from the front and rear, respectively. FIG. 1(A) is a perspective view of the camera housing 10 according to the present embodiment as viewed from above on the front side. FIG. 1(B) is a perspective view of the camera housing 10 according to the present embodiment as viewed from below on the rear side. In the following description, the side of the transparent window 13 provided in the camera housing 10 is defined as the front, and the opposite surface is defined as the rear. Also, in the camera housing 10 shown in FIG. 1(A), the vertically upper side is defined as the top, and the vertically lower side is defined as the bottom. Further, as shown in FIGS. 1(A) and 1(B), a three-dimensional coordinate system is set. Here, the X, Y, and Z directions correspond to the front-rear, left-right, and up-down directions, respectively. That is, the vertically upper side is the +Z direction, and the vertically lower side is the -Z direction. Note that the direction along the optical axis OA is the X direction.

[0014] As shown in FIGS. 1(A) and 1(B), the camera housing 10 includes a main body portion 11 and an upper cover (lid portion) 12. The upper cover 12 is fixed to the main body portion 11 by fixing screws 19 in a state where the inside of the camera housing 10 is sealed. Further, as shown in FIG. 1(B), the upper cover 12 is held by a hinge 16 so as to be openable and closable with respect to the main body portion 11. With such a configuration in the camera housing 10 of the present embodiment, an imaging device (camera) 20 and an interchangeable lens attached thereto can be mounted and housed therein as will be described later. In the present embodiment, the main body portion 11 and the upper cover 12 constitute an exterior portion, and the imaging device 20 is protected by being housed and fixed in the exterior portion.

[0015] Also, as shown in FIG. 1(A), a transparent window 13 is provided in front of the camera housing 10, and the imaging device 20 housed in the camera housing 10 can capture an image of the front of the camera housing 10. On the other hand, as shown in FIG. 1(B), an intake hole 15 is provided at the rear of the camera housing 10. Further, exhaust holes 14a, 14b, and 14c are provided on both left and right side surfaces and the bottom surface of the camera housing 10, respectively.

[0016] Next, the main components inside the camera housing 10 with the imaging device 20 accommodated therein will be described. FIG. 2 is a perspective view of the camera housing 10 with the imaging device 20 according to Embodiment 1 accommodated therein, as viewed from the front and the rear, respectively. FIG. 2(A) is a perspective view of the camera housing 10 with the imaging device 20 accommodated therein, as viewed from the front. FIG. 2(B) is a perspective view of the camera housing 10 with the imaging device 20 accommodated therein, as viewed from the rear. For convenience of explanation, in FIGS. 2(A) and 2(B), the external components of the camera housing 10 shown in FIG. 1 are indicated by dashed lines. Further, in the present embodiment, at least one computer including a CPU, a memory, etc. of the imaging device is configured, and one or more control boards (control units) for controlling the entire imaging device 20 are not shown and their description is omitted. Note that one or more control boards (control units) are arranged in the imaging device 101.

[0017] As shown in FIGS. 2(A) and 2(B), the inside of the camera housing 10 is partitioned (divided) into two spaces on the front side and the rear side by a partition plate 18. In the present embodiment, the space on the front side inside the camera housing 10 partitioned by the partition plate 18 is defined as a sealed space A1. Further, the space on the rear side inside the camera housing 10 partitioned by the partition plate 18 is defined as an open space A2.

[0018] In the sealed space A1, when the upper cover 12 is closed, it is sealed by a sealing member (not shown) that fills the gap between the main body 11 and the upper cover 12. Thereby, at least the intrusion of raindrops and foreign matters (such as dust and dirt) from outside the camera housing 10 into the sealed space A1 is prevented. On the other hand, in the open space A2, air inside and outside the camera housing 10 can freely enter and exit through the exhaust holes 14a, 14b, 14c (vent holes provided in the main body 11) and the intake hole 15.

[0019] In the sealed space A1, a first exchange lens 30, an imaging device 20, a camera pedestal (pedestal member) 200, a duct 300, and a part of the heat exchange unit 100 (the portion in front of the partition plate 18) are respectively arranged. The imaging device 20 is detachably accommodated in the sealed space A1 with the first exchange lens 30 mounted thereon. Thus, the intrusion of raindrops and dust from outside the camera housing 10 into the imaging device 20 and the first exchange lens 30 is prevented. Here, the imaging device 20 is, for example, an interchangeable-lens imaging device, and in addition to the first exchange lens 30, various exchange lenses with different lengths and various performances can be mounted.

[0020] The first exchange lens 30 is arranged at a position that overlaps the transparent window 13 in projection when the camera housing 10 is viewed from the front in the optical axis OA direction. Through the transparent window 13, the light incident into the camera housing 10 from the front is condensed through the first exchange lens 30 arranged behind the transparent window 13 and forms an image on the imaging surface of an imaging element (not shown) built in the imaging device 20.

[0021] A heat exchange unit 100 is provided behind the camera housing 10. The heat exchange unit 100 is a unit including a Peltier module 150 described later and functions as a heat exchange means for adjusting the temperature (temperature control) of the air in the sealed space A1. Specifically, the heat exchange unit 100 cools the air in the sealed space A1. The detailed configuration of the heat exchange unit 100 will be described later with reference to FIG. 3.

[0022] The imaging device 20 is fixed within the camera housing 10 while being attached to the camera pedestal 200. Here, the camera pedestal 200 is composed of a top surface portion (fixing member) 210 to which the imaging device 20 is fixed and a base portion (base member) 220 that is fixed to the camera housing 10. In the direction orthogonal to the optical axis OA (radial direction), a gap is provided between the surface of the top surface portion 210 and the surface of the base portion 220 of the camera pedestal 200. And a flow path extending in the direction of the optical axis OA having the flow path outlet O2 is formed by the said gap. That is, a predetermined gap is formed between the surface of the base portion 220 facing the surface on the opposite side of the surface of the top surface portion 210 to which the imaging device 20 is fixed in the direction orthogonal to the optical axis OA (between them in the Z direction).

[0023] Here, the top surface portion 210 of the camera pedestal 200 is formed of a material having heat conductivity. For example, it is desirable that the top surface portion 210 be composed of a material with high heat conductivity such as an aluminum alloy. Thereby, it becomes possible to effectively diffuse the heat generated by the imaging device 20 to the top surface portion 210.

[0024] Furthermore, the camera housing 10 is provided with a duct 300 that functions as a blowing means and connects the exhaust port of the first fan 110 of the heat exchange unit 100 to the aforementioned flow path. Incidentally, the duct 300 is composed of a material with a lower heat conductivity (smaller heat conductivity) than the top surface portion 210, for example, a low heat conductivity material such as resin. Thereby, it becomes possible to reduce the influence of the air temperature outside the duct 300 on the air temperature inside the duct 300.

[0025] On the other hand, as shown in FIG. 2(B), in the open space A2, a component group behind the partition plate 18 within the heat exchange unit 100 is accommodated. The second fan 130 is an axial flow fan of the heat exchange unit 100, and its intake port is provided at a position corresponding to the intake hole 15 at the rear of the main body portion 11. The air outside the camera housing 10 is taken into the open space A2 through the intake hole 15 by the drive of the second fan 130, blown toward the second heat sink 140, and then exhausted outside the camera housing 10 through the exhaust holes 14a, 14b, and 14c.

[0026] FIG. 3 is an exploded perspective view of the heat exchange unit 100 according to the present embodiment as viewed from the front and the rear, respectively. FIG. 3(A) is an exploded perspective view of the heat exchange unit 100 as viewed from the front, and FIG. 3(B) is an exploded perspective view of the heat exchange unit 100 as viewed from the rear.

[0027] The heat exchange unit 100 incorporates a Peltier module 150. Further, as shown in FIG. 3, the heat exchange unit 100 is configured to include a first fan 110, a first heat sink (first heat sink) 120, a second fan 130, a second heat sink 140, and the like. In the present embodiment, with a partition plate 18 interposed therebetween, on the front side, the first heat sink 120 and the first fan 110 are arranged so as to sandwich the Peltier module 150, and on the rear side, the second heat sink 140 and the second fan 130 are arranged so as to sandwich the Peltier module 150. Here, the cooling surface S1 and the heat dissipation surface S2 of the Peltier module 150 are arranged on the front side and the rear side with the partition plate 18 interposed therebetween, respectively. That is, in a state where the Peltier module 150 is arranged on the partition plate 18, the cooling surface S1 of the Peltier module 150 is exposed to the sealed space A1 side (first space side), and the heat dissipation surface S2 is exposed to the open space A2 side (second space side).

[0028] On the front side of the partition plate 18, the first heat sink 120 and the first fan 110 are fixed by screws (not shown) and a first fan fixing screw 115, respectively. In the present embodiment, by using the first fan 110 included in the heat exchange unit 100 as a centrifugal fan, the length in the front-rear direction on the front side of the partition plate 18 is shortened.

[0029] On the rear side of the partition plate 18, as shown in FIG. 3(B), the Peltier module 150 and a sealing member 160 are respectively incorporated into a groove D formed by the partition plate 18 and the rear surface of the first heat sink 120. Here, the sealing member 160 is an elastic member having a substantially U shape and is composed of, for example, a cushioning material or the like. The air gap between the periphery of the Peltier module 150 and the groove D is filled by the sealing member 160.

[0030] Further, the second heat sink 140 holds the Peltier module 150 and the sealing member 160 in the groove D and is fixed to the partition plate 18 by the fixing screw 145. At this time, the sealing member 160 is held in a compressed state in the X-axis direction (the direction of the optical axis OA) by the first heat sink 120 and the second heat sink 140. In addition, the lead wires of the Peltier module 150 are wired to a power supply unit (not shown) outside the groove D in a state where the gap generated between the lead wires and the partition plate 18 is filled by the sealing member 160. Further, the second fan 130 is fixed to the second heat sink 140 by the second fan fixing screw 135 from behind the second heat sink 140.

[0031] As described above, the Peltier module 150 is held in a sealed state in the groove D while being surrounded by the first heat sink 120, the second heat sink 140, and the sealing member 160. Therefore, when the heat exchange unit 100 is driven, condensation caused by the temperature difference between the air around the Peltier module 150 and the cooling surface S1 of the Peltier module 150 is prevented.

[0032] In addition, the cooling surface S1 and the heat dissipation surface S2 of the Peltier module 150 are thermally connected to the first heat sink 120 and the second heat sink 140, respectively, via a heat conduction material (not shown) such as heat conduction grease or a heat conduction sheet. That is, the first heat sink 120 and the air around it are cooled by the cooling surface S1, and the second heat sink 140 and the air around it are heated by the heat dissipation surface S2. As a result, the air around the first heat sink 120 and the second heat sink 140 becomes lower and higher in temperature than the ambient air temperature, respectively.

[0033] Next, with reference to FIGS. 3(A) and 3(B), the air flow generated by the first fan 110 and the second fan 130 provided in the heat exchange unit 100 will be described. The low-temperature air near the first heat sink 120 is sucked in from the intake port 111 of the first fan 110 and then blown downward from the exhaust port 112 of the first fan 110. The air flow at this time is indicated by F11.

[0034] On the other hand, after the outside air is sucked in from the intake port 131 of the second fan 130, it is blown toward the second heat sink 140 from the exhaust port 132 of the second fan 130. The air flow at this time is indicated by F21. As described above, since the second heat sink 140 is at a higher temperature than the surrounding air, i.e., the outside air, it will be cooled by the outside air blown by the second fan 130.

[0035] Next, a method of housing the imaging device 20 in the camera housing 10 will be described with reference to FIG. 4. FIG. 4 is a perspective view of the camera housing 10 when viewed from the front and rear with the upper cover 12 open. FIG. 4(A) is a perspective view of the camera housing 10 when viewed from the front with the upper cover 12 open. FIG. 4(B) is a perspective view of the camera housing 10 when viewed from the rear with the upper cover 12 open.

[0036] The imaging device 20 is attached to the camera pedestal 200, and the base portion 220 of the camera pedestal 200 is fixed to the pedestal attachment portion 17 by fixing screws 215, so that it is housed in the camera housing 10. As described above, the camera pedestal 200 is composed of a top surface portion 210 and a base portion 220, and between the two members in a direction orthogonal to the optical axis OA, a flow path Fp is formed through which an air flow having a direction substantially parallel to the optical axis OA of the imaging device 20 as the main flow direction can be ventilated. Note that the flow path Fp will be described later with reference to FIG. 5.

[0037] At both front and rear ends of the camera pedestal 200, a flow path outlet O2 and a flow path inlet O1 of the flow path Fp are respectively formed. Further, a duct 300 is connected to the first fan 110 of the heat exchange unit 100 described above. Furthermore, an outlet 303 is provided at the front end of the duct 300, and when the camera pedestal 200 is fixed to the camera housing 10, the outlet 303 and the flow path inlet O1 are connected. That is, the air near the first heat sink 120 cooled by the heat exchange unit 100 is blown by the first fan 110 through the duct 300 into the flow path Fp in the camera pedestal 200.

[0038] Next, a method of attaching the imaging device 20 to the camera pedestal 200 will be described with reference to FIG. 5. FIG. 5 is an exploded perspective view of the imaging device 20 and the camera pedestal 200. Mounting holes 201a and 201b are provided in front of and behind the top surface portion 210, respectively. The mounting holes 201a and 201b are elongated holes (loose holes) that can fix the imaging device 20 at an arbitrary position with respect to the optical axis OA direction.

[0039] The imaging device 20 is fixed to the top surface portion 210 by a camera fixing screw 25 inserted into either the mounting hole 201a or the mounting hole b according to its mounting position. For example, as shown in FIG. 5, assume a case where the first interchangeable lens 30 that is relatively long in the optical axis OA direction is mounted on the imaging device 20. In that case, the camera fixing screw 25 is inserted into the mounting hole 201b at the rear of the top surface portion 210 and screwed into the tripod screw portion or the like of the imaging device 20, thereby fixing the imaging device 20 to the top surface portion 210. At this time, since the imaging device 20 is fixed to the top surface portion 210 so as to cover the mounting hole 201b, the mounting hole 201b is sealed by the imaging device 20. On the other hand, the hole of the mounting hole 201a is sealed by attaching a sealing member 202 thereto.

[0040] As a result, the openings in the flow path formed by the camera pedestal 200 are only the flow path inlet O1 and the flow path outlet O2 shown in FIGS. 4(A) and 4(B). The camera pedestal 200 is integrated by fixing the top surface portion 210 on which the imaging device 20 is mounted to the base portion 220 with a fixing screw 215. Then, a flow path Fp is formed by a gap generated between both members, that is, a gap between the surface of the base portion 220 facing the surface of the top surface portion 210 on the opposite side to the surface where the imaging device 20 of the top surface portion 210 is fixed in a direction orthogonal to the optical axis OA.

[0041] In the above description, with reference to FIG. 5, the case where the first interchangeable lens 30, which is a relatively long interchangeable lens in the optical axis OA direction, is attached to the imaging device 20 has been described. On the other hand, in the case where a lens that is relatively short in the optical axis OA direction is attached, as will be described later with reference to FIG. 6(B), in order to prevent the occurrence of peeling due to the structure inside the camera housing 10, the imaging device 20 is attached to the front side of the top surface portion 210 in the optical axis OA direction. The lens that is relatively short in the optical axis OA direction is an interchangeable lens that is shorter than the interchangeable lens that is relatively long in the optical axis OA direction. And the imaging device 20 is attached using the attachment hole 201a. Therefore, contrary to the case where the first interchangeable lens 30, which is a relatively long interchangeable lens in the optical axis OA direction, is attached, the attachment hole 201a is sealed by the imaging device 20, while the attachment hole 201b is blocked by the sealing member 202. Thus, according to the camera pedestal 200 of the present embodiment, it is possible to adjust the attachment position of the imaging device 20 in the direction along the optical axis OA according to the type of lens attached to the imaging device 20.

[0042] Next, with reference to FIG. 6, the flow of heat and air in the sealed space A1 inside the camera housing 10 will be described. FIG. 6 is a cross-sectional view of a main part showing the flow of air and heat inside the camera housing 10 when interchangeable lenses having different lengths in the optical axis OA direction according to the present embodiment are attached to the imaging device 20. FIG. 6(A) is a cross-sectional view of a main part showing the flow of air and heat inside the camera housing 10 when the first interchangeable lens 30, which is a relatively long interchangeable lens in the optical axis OA direction, is attached to the imaging device 20. FIG. 6(B) is a cross-sectional view of a main part showing the flow of air and heat inside the camera housing 10 when the second interchangeable lens 40, which is a relatively short interchangeable lens in the optical axis OA direction, is attached to the imaging device 20.

[0043] As described above, inside the camera housing 10, it is divided into a front sealed space A1 and a rear open space A2 by the partition plate 18. In the sealed space A1, a structure is formed in which the main body 11, the upper cover 12, the partition plate 18, and an elastic member (not shown) prevent the inflow and outflow of outside air. On the other hand, behind the partition plate 18, a structure is formed that allows the inflow and outflow of outside air through the intake holes 15 and the exhaust holes 14a, 14b, and 14c described with reference to FIG. 2.

[0044] Hereinafter, with reference to FIG. 6(A), the air flow in the sealed space A1 will be described. First, the air that has passed through the gaps between the fins of the first heat sink 120 cooled by the heat exchange unit 100 is sucked in by the first fan 110. The air flow at this time is indicated by F10. That is, at this time, the air moves from the rear side to the front side of the camera housing 10 in the direction of the optical axis OA. Here, the air passes near the low-temperature first heat sink 120 and thus becomes cooler than the ambient air temperature in the sealed space A1. The low-temperature air cooled by being temperature-adjusted in this way is blown by the first fan 110 in the direction of the inlet 302 of the duct 300. The air flow at this time is indicated by F11. That is, at this time, the air moves downward (-Z direction) in the duct inside the sealed space A1 in a direction substantially orthogonal to the optical axis OA.

[0045] Thereafter, the low-temperature air is bent by the bending portion 301 of the duct 300 by approximately 90 degrees in its traveling direction and is blown toward the inlet O1 of the flow path Fp connected to the outlet 303 at the front end of the duct 300. The air flow at this time is indicated by F12. That is, at this time, the air moves forward (+X direction) in the flow path Fp inside the sealed space A1 in the direction along the optical axis OA.

[0046] The low-temperature air flowing in from the flow path inlet O1 flows in the direction of the transparent window 13 substantially parallel to the optical axis OA in the flow path Fp as shown by the flow F12, and is eventually exhausted (discharged) out of the flow path Fp from the flow path outlet O2. That is, it is exhausted from the flow path Fp into the sealed space A1. The air flow exhausted into the sealed space A1 flows from the front side (+X direction) to the rear side (-X direction) of the sealed space A1 through a path like the flow F13 by moving through the sealed space A1. Incidentally, the main flow direction of the low-temperature air whose temperature is adjusted by the heat exchange unit 100 in the flow path Fp as described above is the direction along the optical axis OA of the imaging device 20.

[0047] After that, the air flow forms the flow F10 again by the first fan 110, and after the temperature is lowered by the heat exchange unit 100, it is sucked by the first fan 110. Then, the low-temperature air whose temperature is adjusted again moves in the duct 300 and in the flow path Fp in the same manner as above by the first fan 110, and is exhausted into the sealed space A1 (inside the first space) from the flow path outlet O2. That is, in the sealed space A1, a circulating flow that repeats the flows F10 to F13 is formed by the first fan 110. In other words, in the configuration of the camera housing 10 in the present embodiment, by driving the first fan 110, the first fan 110 can form a circulating flow by the low-temperature air whose temperature is lowered by the heat exchange unit 100 in the sealed space A1. Thereby, the imaging device 20 can be effectively cooled while maintaining the low-temperature air.

[0048] Next, the heat flow in the sealed space A1 will be described. As described above, the imaging device 20 is fixed in a state of being thermally connected to the top surface portion 210 by the camera fixing screw 25. Therefore, the heat generated by the imaging device 20 is transferred to the top surface portion 210 as shown by the heat flow H1 from the mounting surface of the imaging device 20 to the top surface portion 210. Further, the heat transferred from the imaging device 20 is diffused in the surface directions (X direction and Y direction) of the top surface portion 210. Therefore, the temperature of the top surface portion 210 becomes higher than the air temperature in the sealed space A1. The heat transferred to the top surface portion 210 is transferred not only to the vicinity of the mounting surface of the imaging device 20 but also to the flow F12, which is a low-temperature air flow in the flow path Fp, from the entire lower surface of the top surface portion 210 as shown by the heat flow H3.

[0049] As described above, in the camera housing 10 of the present embodiment, the flow path of the cooled air is limited to the flow path Fp formed by the camera pedestal 200 that is thermally connected to the imaging device 20. By doing so, it is possible to reliably blow low-temperature air with a high flow rate to the top surface portion 210 that is thermally connected to the imaging device 20 as compared with the case where the flow path Fp is not provided, and it is possible to more effectively cool the imaging device 20.

[0050] Subsequently, the air and heat flows in the open space A2 will be described. As shown using FIG. 3, the heat radiation surface S2 of the Peltier module 150 included in the heat exchange unit 100 is thermally connected to the second heat sink 140. Therefore, the second heat sink 140 is at a high temperature with respect to the outside air. In order to improve the cooling efficiency of the sealed space A1 by the heat exchange unit 100, it is necessary to lower the temperature of the heat radiation surface S2 of the Peltier module 150, that is, to lower the temperature of the second heat sink 140. In the camera housing 10 of the present embodiment, the open space A2 is a space opened to the outside air, and outside air is taken in through the intake hole 15 using the second fan 130. The air flow at this time is shown as F20.

[0051] The air introduced into the open space A2 from the intake hole 15 is blown toward the second heat sink 140 through the intake port 131 of the second fan 130. The air flow at this time is flow F21. After the air passing through the second heat sink 140 takes away the heat of the second heat sink 140, it is exhausted to the outside of the camera housing 10 through the exhaust holes 14a, 14b, and 14c. The air flow at this time is shown as flow F22.

[0052] Next, the heat flow when the second interchangeable lens 40, which is a lens relatively short in the optical axis OA direction, is attached to the imaging device 20 will be described with reference to FIG. 6(B). Note that since the air flow in the sealed space A1 and the air and heat flows in the open space A2 are the same as those when the first interchangeable lens 30 is attached, detailed description thereof will be omitted.

[0053] Here, when an interchangeable lens relatively short in the optical axis OA direction is used, as shown in FIG. 6(B), in order to prevent vignetting caused by the structure in the camera housing 10, the imaging device 20 is fixed on the front side as compared with the case of FIG. 6(A).

[0054] That is, due to the difference in the interchangeable lens to be attached, the attachment position of the imaging device 20 with respect to the top surface portion 210 changes. The heat generated by the imaging device 20 is heat-conducted forward of the top surface portion 210 as shown by the heat flow H2 from the attachment surface of the imaging device 20 with respect to the top surface portion 210. Thereafter, as in the case shown in FIG. 6(A), the above heat is diffused in the plane direction of the top surface portion 210 as shown by the heat flow H4. Further, after the above heat is heat-conducted to the low-temperature air blown into the flow path by the first fan 110, it is eventually exhausted (discharged) into the sealed space A1 from the flow path outlet O2.

[0055] As shown in FIGS. 6(A) and 6(B), in the camera housing 10 according to the present embodiment, even when the attachment position of the imaging device 20 with respect to the top surface portion 210 changes, the air and heat flows are the same.

[0056] In addition, in this embodiment, since the heat of the imaging device 20 is cooled through the top surface portion 210 of the camera pedestal 200, the imaging device 20 can be effectively cooled regardless of its shape. Further, by setting the direction of the flow path Fp to be substantially the same as the optical axis of the first exchange lens 30, the distance from the flow path inlet O1 to the flow path outlet O2 becomes longer, and the area of the top surface portion 210 that can receive heat from the low-temperature air blown by the first fan 110 becomes larger. As a result, the low-temperature air can receive the heat of the top surface portion 210 and the imaging device 20 thermally connected thereto, and as a result, the temperature of the imaging device 20 can be effectively reduced.

[0057] From the above, according to the camera housing 10 of this embodiment, the imaging device 20 can be effectively cooled regardless of the mounting position or shape of the imaging device 20.

[0058] <Embodiment 2> FIG. 7 is a cross-sectional view of a main part of the camera housing 50 in Embodiment 2. In addition, in the camera housing 50 in Embodiment 2, the same reference numerals as those in Embodiment 1 denote the same configurations as those in Embodiment 1, and the description thereof will be omitted.

[0059] Further, the difference from the camera housing 10 of Embodiment 1 is only that a third heat sink (second heat sink) 450 is added to the top surface portion 210 on which the imaging device 20 is mounted. As shown in FIG. 7, the third heat sink 450 extends from the lower surface of the top surface portion 210 toward the flow path Fp. In other words, the third heat sink 450 is disposed on the surface of the top surface portion 210 opposite to the surface on which the imaging device 20 is disposed so as to be located within the flow path Fp formed by the camera pedestal 200. The third heat sink 450 is made of a material having high thermal conductivity, such as an aluminum alloy, for example.

[0060] FIG. 8 is an exploded perspective view of the camera pedestal 400 in Embodiment 2 as viewed from below the imaging device 20. The camera pedestal 400 in Embodiment 2 may include a third heat sink 450 in addition to the members in Embodiment 1. The third heat sink 450 is disposed on the top surface portion 210 and extends in the direction of the base portion 220 (-Z axis direction). Further, a plurality of fins having a direction substantially parallel to the flow path Fp shown in FIG. 7 (the main flow direction of the low-temperature air) as the longitudinal direction are disposed on the third heat sink 450. Furthermore, the third heat sink 450 is provided with a through hole 451 through which a camera fixing screw 25 for fixing the imaging device 20 can be inserted at a position avoiding the fins.

[0061] In the camera pedestal 400 of the present embodiment, the imaging device 20 is fixed to the top surface portion 210 by the camera fixing screw 25 together with the third heat sink 450. Therefore, the third heat sink 450 is thermally connected to the imaging device 20 via the top surface portion 210.

[0062] Further, the top surface portion 210 and the third heat sink 450 have a through hole (hole portion) 451. The third heat sink 450 is configured to be fixed to the imaging device 20 with the camera fixing screw 25 inserted through the through hole 451. Therefore, the third heat sink 450 can be disposed directly below the mounting surface of the imaging device 20 regardless of the mounting position of the imaging device 20 on the top surface portion 210. Thereby, it is possible to reduce the thermal resistance of the imaging device 20 and the third heat sink 450 regardless of the mounting position of the imaging device 20.

[0063] By configuring as described above, it is possible to effectively transfer the heat of the imaging device 20 into the flow path Fp in a state where the imaging device 20 is housed in the camera housing 50. Then, similar to Embodiment 1, the heat of the imaging device 20 is transferred to the top surface portion 210 as a heat flow H5.

[0064] Thereafter, as shown by the heat flow H6, it is diffused in the plane direction of the top surface portion 210, and a part of the heat is further diffused to the third heat sink 450. The heat of the third heat sink 450 and the top surface portion 210 is transferred to the low-temperature air flow generated by the first fan 110 and the Peltier module 150 in the flow path Fp, similar to the first embodiment.

[0065] In the second embodiment, by disposing the third heat sink 450 in the flow path Fp, although the ventilation resistance in the flow path Fp increases, it is possible to prevent a decrease in the flow rate by increasing the rotation speed of the first fan 110 or the like. Therefore, according to the camera housing of the second embodiment, it is possible to more effectively cool the imaging device 20 compared to the first embodiment by preventing a decrease in the flow rate by increasing the rotation speed of the first fan 110 or the like.

[0066] As described above, the present invention has been described based on its preferred embodiments, but the present invention is not limited to these specific embodiments, and various forms within the scope not departing from the gist of the present invention are also included in the present invention.

[0067] For example, in the heat exchange unit 100 in the first and second embodiments, although the configuration includes the Peltier module 150, it is not limited thereto. That is, any configuration may be used as long as the air whose temperature is adjusted by the heat exchange unit 100 is blown against the flow path Fp formed in the camera pedestal 200 by a fan. For example, a configuration may be adopted in which air whose temperature is adjusted by a water cooling device, a heat pipe, or the like is blown into the flow path by the first fan 110.

[0068] Also, in the first and second embodiments, the first fan 110 is a centrifugal fan and the second fan 130 is an axial flow fan, but the type of the fan, which is also a blowing means, is not limited to a specific one. Further, in the camera pedestal 200 and the camera pedestal 400, although the top surface portion 210 is attached to the base portion 220, it is not limited thereto. For example, the base portion 220 may be eliminated, and the top surface portion 210 may be directly attached to the attachment portion provided in the camera housing 10 to form the flow path Fp.

[0069] The disclosure of this embodiment includes the following configurations.

[0070] (Configuration 1) A camera housing to which an imaging device can be detachably attached, A pedestal member having thermal conductivity and configured to hold the imaging device, Heat exchange means, Blowing means, and is provided with The air whose temperature is adjusted by the heat exchange means is blown into the flow path formed by the pedestal member by the blowing means. A camera housing characterized by this.

[0071] (Configuration 2) Further provided with a duct connecting the exhaust port of the blowing means and the flow path, The air whose temperature is adjusted by the heat exchange means is blown into the flow path through the duct, and the camera housing according to Configuration 1 is characterized by this.

[0072] (Configuration 3) The pedestal member has a fixing member to which the imaging device is fixed, The duct is made of a material having a lower thermal conductivity than the fixing member, and the camera housing according to Configuration 2 is characterized by this.

[0073] (Configuration 4) The pedestal member includes a fixing member to which the imaging device is fixed and a base member configured to have a predetermined gap in a direction orthogonal to the optical axis with respect to the fixing member, The camera housing according to any one of Configurations 1 to 3, characterized in that the flow path is formed by the predetermined gap.

[0074] (Configuration 5) The heat exchange means includes a Peltier module, and the camera housing according to any one of Configurations 1 to 4 is characterized by this.

[0075] (Configuration 6) A first space in which the imaging device is stored while being held, and a second space that allows air to flow in and out of the outside of the camera housing. The camera housing according to any one of Configurations 1 to 5, wherein the first space and the second space are separated from each other by a partition plate.

[0076] (Configuration 7) The heat exchange means includes a Peltier module. The camera housing according to Configuration 6, wherein the Peltier module is disposed on the partition plate, such that the cooling surface of the heat exchange means is exposed to the first space side and the heat dissipation surface of the heat exchange means is exposed to the second space side.

[0077] (Configuration 8) The camera housing according to any one of Configurations 1 to 7, wherein the pedestal member is configured to be adjustable in the mounting position in the direction along the optical axis of the imaging device.

[0078] (Configuration 9) The camera housing according to any one of Configurations 1 to 8, wherein the main flow direction of the air whose temperature is adjusted by the heat exchange means in the flow path is the direction along the optical axis of the imaging device.

[0079] (Configuration 10) The camera housing according to any one of Configurations 1 to 9, wherein the air whose temperature is adjusted by the heat exchange means is blown into the flow path by the blowing means and then exhausted into the space where the imaging device is held.

[0080] (Configuration 11) The camera housing according to any one of Configurations 1 to 10, wherein the blowing means forms a circulation flow by sucking the air whose temperature is adjusted again by the heat exchange means with the air exhausted into the space where the imaging device is held after passing through the flow path, and then blowing the air into the flow path.

[0081] (Configuration 12) The air blowing means forms a circulation flow by the air whose temperature is adjusted by the heat exchange means in the first space, in the camera housing according to Configuration 6 or 7.

[0082] (Configuration 13) The heat exchange means includes a first heat sink, The pedestal member and the air blowing means are disposed in the first space, The first heat sink is disposed between the air blowing means and the partition plate in the optical axis direction, in the camera housing according to Configuration 6 or 7.

[0083] (Configuration 14) The air blowing means sucks the temperature-adjusted air through the first heat sink and then blows the air into the flow path to form a circulation flow in the first space, in the camera housing according to Configuration 13.

[0084] (Configuration 15) The air blowing means is a centrifugal fan, in the camera housing according to any one of Configurations 1 to 14.

[0085] (Configuration 16) Further includes a second heat sink, The second heat sink is disposed on the pedestal member so as to be located in the flow path, in the camera housing according to any one of Configurations 1 to 15.

[0086] (Configuration 17) A plurality of fins having the main flow direction in the flow path as the longitudinal direction are disposed on the second heat sink, in the camera housing according to Configuration 16.

[0087] (Configuration 18) A hole through which a fixing screw for fixing the imaging device to the pedestal member is inserted is provided in the second heat sink, in the camera housing according to Configuration 16 or 17.

[0088] (Configuration 19) It further includes an exterior part composed of a main body part for accommodating the imaging device in a mountable manner and a lid part fixed to the main body part. The imaging device is protected by the exterior part, and the camera housing according to any one of Configurations 1 to 18 is characterized in this regard.

Explanation of Reference Signs

[0089] 10 Camera housing 18 Partition plate 20 Imaging device 110 First fan 100 Heat exchange unit 200 Camera pedestal A1 Sealed space A2 Open space Fp Flow path

Claims

1. A camera housing that can be detachably attached to an imaging device, comprising: a pedestal member having thermal conductivity and configured to hold the imaging device; heat exchange means; air blowing means, wherein the air whose temperature is adjusted by the heat exchange means is blown into a flow path formed by the pedestal member by the air blowing means. A camera housing characterized by the above.

2. Further comprising a duct connecting an exhaust port of the air blowing means and the flow path, wherein the air whose temperature is adjusted by the heat exchange means is blown into the flow path through the duct. The camera housing according to claim 1, characterized by the above.

3. The pedestal member has a fixing member to which the imaging device is fixed, wherein the duct is made of a material having a lower thermal conductivity than that of the fixing member. The camera housing according to claim 2, characterized by the above.

4. The pedestal member includes a fixing member to which the imaging device is fixed and a base member configured to have a predetermined gap in a direction perpendicular to the optical axis of the fixing member, wherein the flow path is formed by the predetermined gap. The camera housing according to claim 1, characterized by the above.

5. The heat exchange means includes a Peltier module. The camera housing according to claim 1, characterized by the above.

6. having a first space in which the imaging device is housed in a held state and a second space that allows air to enter and exit to and from the outside of the camera housing, wherein the first space and the second space are separated from each other by a partition plate. The camera housing according to claim 1, characterized by the above.

7. The heat exchange means includes a Peltier module, wherein the Peltier module is disposed on the partition plate, so that a cooling surface of the heat exchange means is exposed on the first space side and a heat dissipation surface of the heat exchange means is exposed on the second space side. The camera housing according to claim 6, characterized by the above.

8. The pedestal member is configured to be adjustable in an attachment position in a direction along the optical axis of the imaging device. The camera housing according to claim 1, characterized by the above.

9. The main flow direction of the air whose temperature is adjusted by the heat exchange means in the flow path is a direction along the optical axis of the imaging device. The camera housing according to claim 1, characterized by the above.

10. The air whose temperature is adjusted by the heat exchange means is blown into the flow path by the blowing means and then exhausted into the space where the imaging device is held. The camera housing according to claim 1, characterized in that.

11. After the blowing means passes through the flow path and sucks in the air whose temperature has been adjusted again by the heat exchange means with the air exhausted into the space where the imaging device is held, the blowing means forms a circulation flow by blowing the air into the flow path. The camera housing according to claim 1, characterized in that.

12. The blowing means forms a circulation flow by the air whose temperature is adjusted by the heat exchange means in the first space. The camera housing according to claim 6, characterized in that.

13. The heat exchange means includes a first heat sink, The pedestal member and the blowing means are arranged in the first space, The first heat sink is arranged between the blowing means and the partition plate in the optical axis direction. The camera housing according to claim 6, characterized in that.

14. After the blowing means sucks in the temperature-adjusted air through the first heat sink, the blowing means forms a circulation flow in the first space by blowing the air into the flow path. The camera housing according to claim 13, characterized in that.

15. The blowing means is a centrifugal fan. The camera housing according to claim 1, characterized in that.

16. Further comprising a second heat sink, The second heat sink is arranged on the pedestal member so as to be located in the flow path. The camera housing according to claim 1, characterized in that.

17. A plurality of fins having the main flow direction in the flow path as the longitudinal direction are arranged on the second heat sink. The camera housing according to claim 16, characterized in that.

18. A hole through which a fixing screw for fixing the imaging device to the pedestal member is inserted is provided in the second heat sink. The camera housing according to claim 16, characterized in that.

19. Further comprising an exterior portion composed of a main body portion for detachably housing the imaging device and a lid portion fixed to the main body portion, The imaging device is protected by the exterior portion. The camera housing according to claim 1, characterized in that.

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