High-current contact device for transmitting electrical energy

Abstract

To provide a high-current contact device with improved measurement of the temperature of an electrical contact element.SOLUTION: A high-current contact device 1 for transmitting electrical energy, particularly for a vehicle, includes a contact housing 2, at least one contact element 3 fixed to the contact housing 2, at least one temperature sensor 10, and a support plate 6, the support plate 6 has an upper surface 7 and a lower surface 8, the upper surface 7 transitions over a side wall 9 to the lower surface 8, the side wall 9 of the support plate 6 faces the contact element 3, the temperature sensor 10 is arranged on the side wall 9 of the support plate 6, the temperature sensor 10 is designed to detect a temperature of the contact element 3.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates in particular to a high-current contact device for transmitting electrical energy for a vehicle, and a method for manufacturing the high-current contact device.

Background Art

[0002] German Patent Application Publication No. 10 2020 116 533 A1 discloses a high-current contact device that has an electrical contact element and a temperature sensor. The temperature sensor is arranged on the upper surface of a support plate at a distance from the electrical contact element. The support plate is arranged perpendicular to the longitudinal axis of the contact element.

Summary of the Invention

Problems to be Solved by the Invention

[0003] An object of the present invention is to provide a high-current contact device in which the measurement of the temperature of the electrical contact element is improved. In addition, an object of the present invention is to provide an improved method for manufacturing a high-current contact device.

Means for Solving the Problems

[0004] The object of the present invention is achieved by the independent patent claims.

[0005] Advantageous developments are described in the dependent claims.

[0006] In particular, a high-current contact device for transmitting electrical energy, especially for vehicles, is proposed. The high-current contact device has a contact housing and at least one contact element fixed to the contact housing. A temperature sensor fixed to a support plate is also provided. The support plate has an upper surface and a lower surface, and the upper surface of the support plate transitions to the lower surface of the support plate over a side wall. The side wall of the support plate faces the contact element. The temperature sensor is fixed to the side wall of the support plate. The temperature sensor is designed to detect the temperature of the contact element. The arrangement of the temperature sensor on the side wall of the support plate whose front face faces the contact element means that the temperature sensor is arranged closer to the contact element. Additionally, this arrangement means that a larger surface area of the temperature sensor is arranged closer to the electrical contact element. Thereby, the temperature transfer from the contact element to the temperature sensor is improved. Additionally, the support plate does not block temperature radiation. Furthermore, this arrangement of the contact element means that the support plate having the contact element can have a low ground height and can thus be arranged in a space-saving manner in the vicinity of the contact element in the high-current contact device. Thereby, the temperature transfer between the contact element and the temperature sensor is improved. The longitudinal axis of the contact element is preferably arranged parallel to the outer surface of at least a part of the contact element.

[0007] In one embodiment, the side wall of the support plate is oriented at an angle between 0 degrees and 45 degrees with respect to the longitudinal axis of the contact element. Preferably, the side wall is arranged parallel to the longitudinal axis of the contact element. Preferably, the upper and lower surfaces of the support plate are arranged parallel to each other, and the side wall is oriented perpendicular to the upper and lower surfaces of the support plate. Depending on the selected embodiment, the side wall may be oriented at a different angle with respect to the upper and / or lower surface. Depending on the selected embodiment, the support plate may be arranged at a different angle with respect to the longitudinal axis of the contact element. In this embodiment, the side wall may be arranged perpendicular to the upper and lower surfaces of the support plate, but not parallel to the longitudinal axis of the contact element. However, due to the arrangement of the temperature sensor on the front surface of the side wall of the support plate, these arrangements also have improved heat transfer between the contact element and the temperature sensor compared to the arrangement of the temperature sensor on the upper or lower surface of the support plate.

[0008] In a further embodiment, the support plate has a first electrical contact on the side wall. The first electrical contact may be designed in the form of a conductive coating. Depending on the selected embodiment, the first electrical contact may be arranged in a recess of the side wall. For example, the recess may be formed in a circular segment shape perpendicular to the plane of the side wall in cross-section. In addition, the coating constituting the first electrical contact may be formed as a sleeve-segment shaped coating. The temperature sensor has further electrical contacts, and these second electrical contacts are conductively connected to the first electrical contact of the support plate. For example, a conductive connection material, in particular solder, is used for the conductive connection between the first electrical contact and the second electrical contact.

[0009] In a further embodiment, the support plate has at least one recess in the side wall, and the first electrical contact is arranged in the recess. The first electrical contact may have a conductive coating applied to the side wall. The conductive coating is connected to the electrical wire of the support plate. Solder material may be provided for forming a conductive connection between the conductive coating of the support plate and the second electrical contact of the temperature sensor.

[0010] The first recess and the second recess may be arranged parallel to each other and preferably have the same or identical shape.

[0011] In a further embodiment, the support plate has at least two recesses in the side wall that are spaced apart from each other. These recesses are arranged at a predetermined distance in the lateral direction. The first electrical contact of the support plate is formed in the first recess. A further first electrical contact of the support plate is formed in the second recess. Depending on the selected embodiment, the two recesses may be formed in the base region in a further recess provided in the side wall of the support plate.

[0012] In a further embodiment, the recess is guided along at least a predetermined distance along the thickness of the support plate starting from the upper surface and / or the lower surface of the support plate. The recess is preferably formed from the upper surface to the lower surface of the support plate. The electrical wire of the support plate is arranged on the upper surface of the support plate and extends to or into the recess, in particular to form a conductive connection with the conductive coating of the first electrical contact of the support plate.

[0013] In a further embodiment, solder material is arranged on the side wall of the support plate, and the solder material forms a conductive connection between the first electrical contact of the support plate and the second electrical contact of the temperature sensor. Depending on the selected embodiment, the solder material may in particular be arranged in the recess.

[0014] In a further embodiment, the side wall of the support plate has a further depression, the temperature sensor is arranged at least partially in the further depression, and the first electrical contact of the support plate is arranged in the further depression. Depending on the selected embodiment, the temperature sensor may be arranged completely in the further depression. Additionally, two depressions may be arranged in the further depression for the formation of the first electrical contact of the support plate. In particular, the two depressions of the first electrical contact are arranged in the base region of the further depression. The base region is recessed from the side wall and is preferably arranged parallel to the side wall.

[0015] In a further embodiment, the support plate has a portion with a predetermined width protruding from the side wall. The thickness of the portion corresponds to the thickness of the carrier plate, and the portion is part of the carrier plate.

[0016] The temperature sensor is arranged on the side wall of the protrusion. Due to the protrusion, the temperature sensor is thermally connected more weakly to the more distant material of the support plate. Thus, the temperature sensitivity of the temperature sensor for detecting the temperature of the contact element is improved.

[0017] In a further embodiment, a heat conduction element is arranged between the electrical contact element and the temperature sensor. The heat conduction element is designed to conduct heat from the contact element towards the temperature sensor. The heat conduction element may in particular be of an electrically insulating design. Additionally, the heat conduction element is made of a heat-conducting material. In a further embodiment, the heat conduction element is thermally coupled to the contact element, for example in direct contact with the contact element. Additionally, in one embodiment, the heat conduction element is thermally coupled to the temperature sensor, for example in direct contact with the temperature sensor. By providing the heat conduction element, the heat conduction between the contact element and the temperature sensor is improved.

[0018] In one embodiment, the heat conduction element has a recess, and the temperature sensor is at least partially disposed in the recess. Depending on the selected embodiment, the temperature sensor may be completely disposed in the recess of the heat conduction element. In particular, the temperature sensor may be in direct contact with the heat conduction element by means of at least one side surface, in particular by means of a plurality of side surfaces. This arrangement of the temperature sensor in the heat conduction element improves the thermal coupling between the contact element and the temperature sensor. Depending on the selected embodiment, a part of the carrier plate may be disposed in the recess of the heat conduction element. Thereby, the thermal coupling between the contact element and the temperature sensor is further improved.

[0019] In a further embodiment, the electrical contact is disposed in a recess of the side wall, and the recess is formed in a bow shape perpendicular to the plane of the side wall in cross section.

[0020] In a further embodiment, an embodiment of the circuit for the temperature sensor is provided on a support plate, and the completed circuit is connected to the temperature sensor via an electric wire.

[0021] The support plate may be designed as a printed circuit board, for example.

[0022] An improved method for manufacturing the contact device is proposed. The temperature sensor is first fixed to the side wall of the support plate, and two solder depots are arranged on the upper surface of the support plate adjacent to the temperature sensor. The solder depots are laterally spaced from each other. The solder depots are melted by heat treatment, and as a result, the liquid solder of the solder depots on the upper surface of the support plate flows to the side wall of the support plate as two separate solder flows. Thus, the liquid solder is introduced between the first electrical contact of the support plate and the second electrical contact of the temperature sensor. After cooling, the hardened solder forms an electrically conductive connection between the first electrical contact of the support plate and the second electrical contact of the temperature sensor.

[0023] The temperature sensor may be fixed to the support surface of the side wall, for example, using an adhesive. The support surface is preferably located between two first contacts of the support plate.

[0024] In a further embodiment, at least one recess is introduced into the side wall of the support plate before the temperature sensor is fixed to the side wall of the support plate. Preferably, two recesses are introduced into the side wall, and each of the recesses is provided for forming a first electrical contact of the support plate. The recess may be formed, for example, in an arcuate shape in a cross-section perpendicular to the side wall.

[0025] The recess may extend a predetermined distance, particularly to the lower surface, from the upper surface of the support plate towards the lower surface.

[0026] In addition, preferably, further recesses may be formed in the side wall of the support plate. The recesses for the first electrical contacts may be introduced into the base region of the further recesses. The base region recedes from the plane of the side wall. The further recesses are used, at least in part, particularly completely, for receiving the temperature sensor.

[0027] Hereinafter, the present invention will be described in more detail with reference to the drawings. The drawings are as follows.

Brief Description of the Drawings

[0028]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Embodiments for Carrying Out the Invention

[0029] Figure 1 shows a schematic view of a high-current contact device 1 having a contact housing 2, in which a conductive contact element 3 is fixed to the contact housing 2. In the illustrated embodiment, the contact element is in the form of a contact pin, and its first end has an electrical connection area for an electrical cable. The contact element 3 has a longitudinal axis 5 shown as a dashed line. For example, the contact element 3 has a cylindrical shape that is at least partially aligned along the longitudinal axis 5. Similarly, a support plate 6 that is mechanically connected to the contact housing 2 is provided laterally spaced from the contact element 3. The support plate 6 has an upper surface 7 and a lower surface 8. The upper surface 7 of the support plate 6 transitions over a side wall 9 to the lower surface 8 of the support plate 7. The side wall 9 faces the contact element 3. A temperature sensor 10 is arranged on the side wall 9. The arrangement of the temperature sensor 10 on the side wall 9 rather than on the upper surface 7 or the lower surface 8 means that the temperature sensor 10 is arranged closer to the contact element 3. In addition, the heat transfer from the contact element 3 to the temperature sensor 10 is not blocked by the support plate 6.

[0030] In the illustrated exemplary embodiment, the support plate 6 is of a plate-shaped design. Depending on the selected embodiment, the support plate 6 may be of a bar-shaped or block-shaped design. In addition, in the illustrated embodiment, the upper surface 7 and the lower surface 8 are arranged parallel to each other. Depending on the selected embodiment, the upper surface 7 and the lower surface 8 may be arranged at different angles to each other. In addition, in the illustrated embodiment, the plane of the side wall 9 is arranged perpendicular to the plane of the upper surface 7 and perpendicular to the plane of the lower surface 8. Depending on the selected embodiment, the plane of the side wall 9 may be arranged at different angles to the upper and lower surfaces. The advantage of the proposed arrangement of the temperature sensor 10 on the front side wall 9 of the support plate 6 is realized even when the side wall 9 is not arranged parallel to the longitudinal axis 5 of the contact element 3. For example, the side wall 9 and the longitudinal axis 5 of the contact element 3 may be arranged at an angle of 0 to 45 degrees. An angle of 0 degrees means an arrangement of the side wall 9 parallel to the longitudinal axis 5.

[0031] Figure 2 shows an enlarged schematic view of the arrangement of the first electrical contact 11 on the side wall 9 of the support plate 6. The first electrical contact 11 is connected to an evaluation circuit, for example, via an electrical wire (not shown) arranged on or within the support plate 6. In addition, the temperature sensor 10 has a second electrical contact 12 that faces the first electrical contact 11 and is connected to the first electrical contact 11 directly or via a conductive connection material.

[0032] Figure 3 shows the arrangement of the first electrical contact 11 on the side wall 9 in a schematic perspective partial view of the support plate 6. In this figure, the temperature sensor 10 is shown as transparent so that the arrangement of the first electrical contact 11 is more visible. The first electrical contact 11 is led to the upper surface 7 of the support plate 6 and extends beyond the central part of the side wall 9, particularly to the lower surface 8 of the support plate 6. The first electrical contact 11 is made of a conductive material and is designed in particular as a coated surface.

[0033] Figure 4 shows a schematic perspective partial view of an embodiment of the support plate 6 in which the support plate 6 has a first recess 14 and a second recess 15 in the side wall 9. In the illustrated embodiment, the recesses 14, 15 are formed from the upper surface 7 to the lower surface 8. The recesses have, for example, a cylinder segment shape. Thus, the recesses 14, 15 preferably have an outer shape of a cylinder segment in a cross-section perpendicular to the side wall 9. Conductive coatings 16, 17 are provided in the recesses 14, 15 and, in the illustrated embodiment, are led to the upper surface 7 of the support plate 6 and conductively connected to the electrical wire 13. A support surface 18 represented by the side wall 9 is formed between the two recesses 14, 15. In the illustrated exemplary embodiment, the support surface 18 is arranged in the same plane as the side wall 9.

[0034] FIG. 5 shows a schematic view of the support plate 6 of FIG. 4, where the temperature sensor 10 is attached to the support surface 18 via the connection layer 19. In addition, the temperature sensor 10 has two electrical contacts 12, each of which faces one of the depressions 14, 15 and is connected to the conductive coatings 16, 17 of the first electrical contact 11 via a conductive material. For example, the second electrical contact 12 of the temperature sensor 10 may be connected to the first electrical contact 11 of the support plate 6 via a solder material as the conductive connection material 20. The connection layer 19 may be formed of, for example, an adhesive material. Depending on the selected embodiment, another connection material may be used to form the connection layer 19.

[0035] FIG. 6 shows a schematic perspective view of a further embodiment of the support plate 6, where a further depression 21 is introduced into the side wall 9. In the illustrated embodiment, the further depression 21 extends from the upper surface 7 to the lower surface 8 of the support plate 6. Depending on the selected embodiment, the further depression 21 may be introduced only into the side wall 9 without reaching the upper and / or lower surfaces of the support plate.

[0036] The further depression 21 has a base region 22 which is arranged recessed from the adjacent region of the side wall 9. The base region 22 may be arranged perpendicular to the upper surface 7 and the lower surface 8 of the support plate. The first electrical contact 11 is arranged in the base region 22. Depending on the selected embodiment, the first electrical contact 11 may be formed in the depressions 14, 15 as illustrated and outlined in FIG. 4. For this purpose, the conductive coatings 16, 17 connected to the electric wire 13 are arranged in the depressions 14, 15.

[0037] The further depression 21 preferably has a size such that the temperature sensor 10 can be at least partially, particularly completely, arranged in the further depression 21. Depending on the selected embodiment, the temperature sensor 10 may project laterally beyond the front face of the side wall 9 when arranged in the further depression 21. The electrical contact of the temperature sensor 10 arranged in the further depression 21 may be realized, for example, in the same way as in FIG. 5.

[0038] Figure 7 shows a schematic perspective view of a further embodiment of a support plate having a further recess 21. In this embodiment, the further recess 21 also extends from the upper surface 7 to the lower surface 8 of the support plate 6. The recess 8 is formed as two cylindrical segment-shaped recesses 23, 24 connected to each other via a contact surface 18. The support surface 18 recedes inward from the side wall 9. Thus, as schematically shown in Figure 7, at least a part of the temperature sensor 10 can be received in the further recess 21. Conductive films 16, 17 are provided on the first recess 23 and the second recess 24.

[0039] The support surface 18 does not have a conductive film, so that the two films 16, 17 are electrically insulated from each other. In the illustrated embodiment, the films 16, 17 are led to the upper surface 7, and the electric wires 13 connected to the films 16, 17 are arranged on the upper surface 7. The temperature sensor 10 abuts against the support surface 18 by the lower surface and is connected to the support surface via, for example, a connection layer 19. In addition, a second electrical contact 12 of the temperature sensor 10 formed on the lower surface of the temperature sensor 10 in the same manner is connected to the films 16, 17 via a conductive material, particularly a solder material.

[0040] Figure 8 shows a further embodiment of the support plate 6 formed substantially according to the embodiment of Figure 7. However, the further recess 21 is formed deeper so that the temperature sensor 10 can be completely arranged in the further recess 21 without protruding beyond the side wall 9 at the front.

[0041] Figure 9 shows another embodiment of the support plate 6 formed substantially according to the embodiment of Figure 7. However, the support surface 18 along the side wall 9 is designed to be longer than in the embodiments of Figures 7 and 8. Otherwise, the arrangement and fixation of the temperature sensor 10 are formed in the same manner as in the embodiments of Figures 7 and 8.

[0042] Figure 10 shows a further embodiment of the support plate 6 having the protrusion 25. The protrusion 25 may be realized by, for example, two recesses 26, 27. Also in this embodiment, the temperature sensor 10 is arranged on the front surface of the side wall 9 of the support plate 6. Improved thermal insulation of the temperature sensor 10 with respect to the support plate 6 is realized by the protrusion 25. The electrical contact between the temperature sensor 10 and the first electrical contact 11 of the support plate 6 may be realized according to the aforementioned embodiments of electrical contact. In the illustrated embodiment, two depressions 14, 15 are introduced into the side wall 9. Coatings 16, 17 connected to the electric wire 13 of the support plate 6 are provided in the depressions 14, 15. A non-conductive support surface 18 to which the temperature sensor 10 is mechanically connected, for example by a connection layer 19, is formed between the coatings 16, 17. In addition, two electrical contacts 12 formed on the lower surface of the temperature sensor 10 are connected to the coatings 16, 17 via, for example, a connection material 20, in particular a solder material.

[0043] Figure 11 shows a schematic view of the arrangement of FIG. 1 in which a heat conduction element 28 is further provided between the contact element 3 and the temperature sensor 10. The heat conduction element 28 is formed from a heat conductive material and is preferably electrically insulating. Depending on the selected embodiment, the heat conduction element is thermally coupled to the contact element 3, in particular, the heat conduction element 28 abuts directly against the contact element 3. In addition, the heat conduction element 28 is thermally coupled to the temperature sensor, in particular, the heat conduction element 28 abuts directly against the temperature sensor. Depending on the selected embodiment, the heat conduction element 28 may abut against the support plate 6. Depending on the selected embodiment, the heat conduction element has a recess 29 and the temperature sensor is at least partially arranged in the recess 29. Depending on the selected embodiment, the temperature sensor may be completely arranged in the recess 29. In addition, at least a part of the support plate may be arranged in the recess 29 of the heat conduction element 28.

[0044] FIG. 12 shows a schematic cross-section passing through the arrangement of FIG. 11. It can be seen that part of the temperature sensor 10 and the support plate 6 are arranged in the recess 29 of the heat conduction element 28. Similarly, all of the support plate embodiments described may be thermally coupled to the heat conduction element and at least partially in contact with the heat conduction element, and in particular may be arranged in the recess 29 of the heat conduction element. As already explained, if the heat element only partially contacts the temperature sensor or is further spaced apart from the temperature sensor 10, the recess 29 may be omitted.

[0045] FIG. 13 shows a schematic diagram of a cross-section through a high-current contact device 1 designed substantially according to FIG. 1. However, the support plate 6 is designed according to FIG. 10, and the protrusion 25 is arranged in the recess 29 of the heat conduction element 28 together with the temperature sensor 10.

[0046] The heat conduction element may be of an elastic design. For example, the heat conduction element has at least one matrix material including at least silicone and / or polyethylene and / or polyurethane and / or temperature-stable plastic. For example, the following particulate fillers, namely copper, aluminum, silver, aluminum oxide, aluminum nitride, silicon oxide, silicon nitride, boron, boron nitride, a conductive metal, preferably based on iron or non-ferrous metal, a non-conductive and heat-conductive metal compound may be embedded in the matrix material. The heat conduction element may have an elastic deformation ability of at least 1%, preferably 10% or up to 40%. The thermal conductivity of the heat conduction element may be in the range of 0.9 watts per meter per kelvin to 2 watts per meter per kelvin. Even when the heat conduction element contacts the electrical contact element and the temperature sensor or the support plate, it is desirable that the heat conduction element be designed to be electrically insulating so that no conductive connection is formed between the electrical contact element and the temperature sensor or the support plate.

[0047] The temperature sensor may be in the form of, for example, an SMD component, in particular an NTC component. For example, a high-current contact device may be provided to transmit electrical energy in the range of, for example, 10 kW to 300 kW at a high current between, for example, 3 amperes and 500 amperes. The electrical contact element is heated in this process. The temperature sensor is used to monitor the heating of the electrical contact element. The temperature sensor may be connected to an evaluation circuit that outputs a warning signal when the maximum temperature of the contact element is reached or outputs a cutoff signal for cutting off the power line via the high-current contact device.

[0048] The contact housing is at least partially formed from an electrically insulating material so that the contact element is electrically insulated.

[0049] FIG. 14 shows a schematic method sequence for manufacturing a support plate for a high-current contact device. At program point 100, a first electrical contact is provided on the side wall of the support plate. Then, at program point 110, a temperature sensor is fixed to the support surface 18 between two electrical contact elements, for example by means of a connection layer 19. On the upper surface of the support plate, two solder deposits are arranged adjacent to the first recess 14 and the second recess 15. At the subsequent program point 120, the solder deposits are melted and the liquid solder flows into the recesses 14, 15 and is arranged between the coatings 16, 17 and the second electrical contact 12 of the temperature sensor 10. After the liquid solder has cooled, the solder forms a conductive connection between the second electrical contact 12 of the temperature sensor 10 and the coatings 16, 17, i.e., the first electrical contact 11 of the support plate 6.

[0050] Subsequently, a support plate 6 having a temperature sensor may be fixed to one of the high-current contact devices described, for example as shown in FIG. 1 or FIG. 11.

[0051] The method described is applicable to all illustrated exemplary embodiments of the support plate.

Explanation of reference numerals

[0052] 1 High-current contact device 2 Contact housing 3 Contact element 4 First connection region 5 Longitudinal axis 6 Support plate 7 Upper surface 8 Lower surface 9 Side wall 10 Temperature sensor 11 First electrical contact 12 Second electrical contact 13 Electric wire 14 First depression 15 Second depression 16 First coating 17 Second coating 18 Support surface 19 Connection layer 20 Conductive connection material 21 Further depression 22 Base region 23 First cylindrical segment-shaped recess 24 Second cylindrical segment-shaped recess 25 Portion 26 First recess 27 Second recess 28 Heat conduction element 29 Recess 30 Evaluation circuit

Claims

1. A high-current contact device (1) for transmitting electrical energy, in particular for vehicles, comprising a contact housing (2), at least one contact element (3) fixed to said contact housing (2), at least one temperature sensor (10), and a support plate (6), The support plate (6) has an upper surface (7) and a lower surface (8); The upper surface (7) transitions over a side wall (9) into the lower surface (8); The side wall (9) of the support plate (6) faces the contact element (3), The temperature sensor (10) is arranged on the side wall (9) of the support plate (6); the temperature sensor (10) is designed to detect the temperature of the contact element (3); A high current contact device (1).

2. An angle between the side wall (9) and the longitudinal axis (5) of the contact element (3) is formed between 0° and 45°, In particular, the side walls are arranged parallel to the longitudinal axis (5) of the contact element (3), High current contact device (1) according to claim 1.

3. The support plate (6) has a first electrical contact (11) on the side wall (9), said first electrical contacts (11) being arranged in particular in recesses (14, 15) in said side wall (9); In particular, said recesses (14, 15) are formed in cross section as arcuate shapes perpendicular to the plane of said side wall (9); The temperature sensor (10) has a second electrical contact (12); The second electrical contact (12) is conductively connected to the first electrical contact (11). High current contact device (1) according to claim 1 or 2.

4. The support plate (6) has at least one further recess (21) in the side wall (9), The first electrical contact (11) is arranged in the further recess (21), The first electrical contact comprises a conductive coating (16, 17) on the sidewall (9), The coating (16, 17) is connected to the electric wire (13) of the support plate (6), In particular, an electrically conductive connection material (20) is disposed between the coating (16, 17) and the second electrical contact of the temperature sensor (10) to form an electrically conductive connection. High current contact device (1) according to any one of the preceding claims.

5. The support plate (6) has at least two recesses (14, 15) in the side wall (9), The recesses (14, 15) are laterally spaced apart from one another; a first electrical contact (11) of each of said support plates (6) is arranged in a recess (14, 15); In particular, said two recesses are formed in the base region of a further recess (21), High current contact device (1) according to any one of the preceding claims.

6. Starting from the upper surface (7) and / or the lower surface (8) of the support plate (6), the recesses (14, 15) extend along the thickness of the support plate (6) for at least a predetermined distance; In particular, said recesses (14, 15) extend from said upper surface (7) to said lower surface (8) of said support plate (6); Electrical wires (13) are arranged on the support plate (6), the electrical wire (13) extends to or into the recess (14, 15) and is connected to the first electrical contact (11); High current contact device (1) according to any one of claims 4 or 5.

7. a solder material (20) is disposed on the side wall (9) of the support plate (6) and forms a conductive connection between the first electrical contact (11) of the support plate (6) and the second electrical contact (12) of the temperature sensor (10); The solder material is in particular arranged in the recesses (14, 15). High current contact device (1) according to any one of claims 3 to 6.

8. The side wall (9) of the support plate (6) has a further recess (21), said temperature sensor (10) being at least partially arranged in said further recess (21); In particular, said temperature sensor (10) is arranged entirely in said further recess, the first electrical contact (11) is arranged in the further recess (21); High current contact device (1) according to any one of the preceding claims.

9. The support plate (6) has a lateral protrusion (25) having a predetermined width, The temperature sensor (10) is disposed on the side wall (9) of the protrusion (25). High current contact device (1) according to any one of the preceding claims.

10. a heat conducting element (28) is disposed between the contact element (3) and the temperature sensor (10); The heat conducting element (28) conducts heat from the contact element (3) in a direction to the temperature sensor (10); said heat conducting element (28) being of particular electrically insulating design; The heat conducting element (28) is in particular thermally coupled to the contact element (3), in particular abutting the contact element (3) and / or the heat conducting element (28) is in particular thermally coupled to the temperature sensor (10), in particular abutting the temperature sensor (10); High current contact device (1) according to any one of the preceding claims.

11. The heat conducting element (28) has a recess (29), The temperature sensor (10) is at least partially disposed in the recess (29); the temperature sensor (10) is in particular completely arranged in the recess (29), In particular, the heat conducting element (28) is in direct contact with the surface of the temperature sensor (10). High current contact device (1) according to claim 10.

12. a portion of the support plate is disposed in the recess of the heat conducting element; The high current contact device of claim 10.

13. The first electrical contact (11) is arranged in a recess (14, 15) in the side wall (9); The recesses (14, 15) are formed in cross section as arcuate shapes perpendicular to the plane of the side wall (9); In particular, the support plate (6) comprises an evaluation circuit (30) for the temperature sensor (10), In particular, the evaluation circuit (30) is connected to the temperature sensor (10) via an electrical line (13). High current contact device (1) according to any one of the preceding claims.

14. A method for manufacturing a high current contact device according to any one of claims 1 to 13, comprising the steps of: The temperature sensor is first fixed to the side wall of the support plate; two solder deposits disposed on the upper surface of the support plate adjacent the temperature sensor; The solder deposit is melted by a heat treatment; liquid solder of the solder deposit flows from the top surface of the support plate to the sidewall of the support plate in two separate solder flows; after the solder flowing between the sidewall of the support plate and the electrical contact of the temperature sensor cools, the cooled solder forms an electrically conductive connection between the first electrical contact of the support plate and the second electrical contact of the temperature sensor. method.

15. Before the temperature sensor is fixed to the side wall of the support plate, at least one recess is inserted into the side wall starting from the upper surface; the recess is provided for receiving at least a portion of at least one electrical contact of the support plate and / or the temperature sensor. The method of claim 14.

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