Connector and connector unit

Abstract

To improve the connection strength with a circuit board while the size is reduced.SOLUTION: A connector 100 is used for being connected to other connection components, and includes an insulating layer 20 and a pad portion 32 electrically connected to a circuit board, a conductor layer 30 formed on one side of the insulating layer 20, a metal support layer having a bent portion and formed on the other side of the insulating layer 20, and an opening 34 formed in a mounting area 42 including the pad portion 32 and penetrating at least the metal support layer and the insulating layer 20, and the metal support layer is bent along the bent portion to form a connection area for connecting to other connection components.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a connector and a connector unit.

Background Art

[0002] Connectors are used to connect circuit boards in electronic devices. A connector includes a plurality of conductive terminals, and the plurality of terminals are mounted on a circuit board by soldering or the like.

[0003] Patent Document 1 describes an electronic device having an insertion mounting structure in which the terminals of a connector are inserted into through holes of a circuit board and soldered to lands formed on the wall surfaces of the through holes. This connector includes, as terminals, a plurality of types of terminals formed by punching a metal plate of a predetermined thickness and having different cross-sections along the direction of the substrate surface of the insertion portion.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in Patent Document 1, due to the limit of the processing accuracy of the metal thin plate material, it is difficult to reduce the width between a plurality of terminals of the connector. Also, in order to narrow the width between a plurality of terminals, it is conceivable to form a terminal pattern by a manufacturing technique of a wiring circuit board. However, when a terminal formed with a pattern on the connector is connected to a wiring terminal formed on a circuit board, it is connected by solder between the surface of the terminal and the surface of the wiring terminal of the circuit board. For this reason, it is difficult to obtain sufficient strength to connect the connector to the circuit board.

[0006] An object of the present invention is to provide a connector that improves the connection strength with a circuit board while being miniaturized.

[0007] Another object of the present invention is to provide a connector unit that improves the connection strength with a circuit board while being miniaturized.

Means for Solving the Problems

[0008] A connector according to one aspect of the present invention is a connector used for connection with other connection components, and includes an insulating layer, a mounting portion electrically connected to a circuit board, a conductor layer formed on one surface of the insulating layer, a metal support layer formed on the other surface of the insulating layer and having a bent portion, and an opening formed in a mounting region including the mounting portion and penetrating at least the metal support layer and the insulating layer. When the metal support layer is bent along the bent portion, a connection region for connection with other connection components is formed.

[0009] A connector unit according to another aspect of the present invention is a connector used for connection with other connection components, and includes an insulating layer, a mounting portion electrically connected to a circuit board, a conductor layer formed on one surface of the insulating layer, a metal support layer formed on the other surface of the insulating layer and having a bent portion, and a metal connection layer extending from the mounting portion to the metal support layer through an end face of the insulating layer. When the metal support layer is bent along the bent portion, a connection region for connection with other connection components is formed.

[0010] A connector unit according to another aspect of the present invention includes a first connector which is the above-described connector, and a second connector connected to the connection region of the first connector.

Effects of the Invention

[0011] According to the present invention, it is possible to provide a connector and a connector unit that improve the connection strength with a circuit board while being miniaturized.

Brief Description of the Drawings

[0012]

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MODE FOR CARRYING OUT THE INVENTION

[0013] 1. First Embodiment (1) Configuration of Connector Hereinafter, a connector and a connector unit according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing the configuration of a connector unit according to the first embodiment of the present invention. As shown in FIG. 1, the connector unit 1 includes two connectors 100. Each connector 100 is manufactured by bending a laminate including a metal support layer 10, an insulating layer 20, and a conductor layer 30 into a predetermined shape. In FIG. 1, for easy understanding of the structure, a hatching pattern is applied to the metal support layer 10, and a dot pattern is applied to the insulating layer 20.

[0014] In the following description, when distinguishing between the two connectors 100, the two connectors 100 are called connector 100A and 100B, respectively. Connector 100A is a plug-type connector and has a convex portion 101 formed by bending. Connector 100B is a receptacle-type connector and has a concave portion 102 formed by bending. When the convex portion 101 of connector 100A and the concave portion 102 of connector 100B are fitted, the conductor layers 30 of each other come into contact. Thereby, connector 100A and connector 100B are electrically connected.

[0015] FIG. 2 is a plan view showing the configuration of the connector 100 before bending. As shown in FIG. 2, before bending, the metal support layer 10 has a substantially rectangular shape. The longitudinal direction of the metal support layer 10 is referred to as the first direction, and the width direction of the metal support layer 10 is referred to as the second direction. The metal support layer 10 is formed of a material having, for example, spring characteristics. In this example, the metal support layer 10 is formed of stainless steel. The insulating layer 20 includes, for example, a resin material and is formed on the entire surface of the metal support layer 10. In this example, the insulating layer 20 includes polyimide. The thickness of the insulating layer 20 is, for example, 3 μm or more and 30 μm or less.

[0016] The conductor layer 30 includes, for example, copper and is formed on the insulating layer 20. The conductor layer 30 has a plurality of conductor patterns 31, 35. The plurality of conductor patterns 31 are provided on the insulating layer 20 so as to extend in the first direction and be arranged in the second direction. The width of each conductor pattern 31 is, for example, 10 μm or more and 400 μm or less, preferably 50 μm or more and 250 μm or less, and more preferably 50 μm or more and 150 μm or less. The pitch (interval between adjacent conductor patterns 31) of the plurality of conductor patterns 31 is, for example, 50 μm or more and 400 μm or less, preferably 50 μm or more and 250 μm or less, and more preferably 0.2 mm (200 μm) or less. In this case, the connector 100 can be easily miniaturized.

[0017] Each of the plurality of conductor patterns 31 has one end connected to the pad portions 32 and 33. The plurality of pad portions 33 are provided at positions in contact with one end portion of the insulating layer 20 in the first direction. Each of the plurality of pad portions 33 is connected to an end portion of any one of the plurality of conductor patterns 31. The plurality of pad portions 32 are provided at positions farther from the first direction than the plurality of pad portions 33 from one end portion of the insulating layer 20 in the first direction. Each of the plurality of pad portions 32 is connected to an end portion of any one of the plurality of conductor patterns 31. An opening 34 is formed within the region where each of the plurality of pad portions 32 is formed. The opening 34 is a hole penetrating the conductor layer 30, the insulating layer 20, and the metal support layer 10. The plurality of pad portions 32 and 33 are each connected to a plurality of land portions 60 (see FIGS. 8 and 11) of the circuit board by solder as described later. Thereby, the connector 100 is mounted on the circuit board.

[0018] The plurality of conductor patterns 35 are provided on the insulating layer 20 so as to extend in the first direction and be arranged in the second direction. The plurality of conductor patterns 35 are arranged in a region outside the region where the plurality of conductor patterns 31 are formed in the second direction. It is preferable that the plurality of conductor patterns 35 have a longer width in the second direction than the plurality of conductor patterns 31.

[0019] In this example, the conductor layer 30 includes six conductor patterns 31, three pad portions 32, three pad portions 33, and two conductor patterns 35. The two conductor patterns 35 are arranged at positions sandwiching the six conductor patterns 31 in the second direction. The six conductor patterns 31 are used, for example, as signal lines, and the two conductor patterns 35 are used as power lines.

[0020] In this example, when distinguishing the six conductor patterns 31, the six conductor patterns 31 are respectively referred to as conductor patterns 31a to 31f. When distinguishing the three pad portions 32, the three pad portions 32 are respectively referred to as pad portions 32a, 32c, and 32e. Also, when distinguishing the three pad portions 33, the three pad portions 33 are respectively referred to as pad portions 33b, 33d, and 33f. Further, when distinguishing the two conductor patterns 35, the two conductor patterns 35 are respectively referred to as conductor patterns 35a and 35b.

[0021] The pad portions 32a, 32c, and 32e are arranged in the second direction, and the pad portions 33b, 33d, and 33f are arranged in the second direction. The conductor patterns 31a, 31c, and 31e respectively extend from the pad portions 32a, 32c, and 32e in the first direction. The conductor patterns 31b, 31d, and 31f respectively extend from the pad portions 33b, 33d, and 33f in the first direction.

[0022] Each of the pad portions 33b, 33d, and 33f is provided at a position in contact with one end portion of the insulating layer 20 in the first direction. The pad portions 32a, 32c, and 32e are provided at positions separated from the pad portions 33b, 33d, and 33f by a predetermined distance in the first direction from one end portion of the insulating layer 20 in the first direction. The predetermined distance is longer than the length of the pad portions 33b, 33d, and 33f in the first direction. In the second direction, the pad portion 33b is located between the pad portion 32a and the pad portion 32c, the pad portion 33d is located between the pad portion 32c and the pad portion 32e, and the pad portion 32e is located between the pad portion 33d and the pad portion 33f. Note that in the second direction, the pad portion 33b may overlap the pad portion 32a and the pad portion 32c, the pad portion 33d may overlap the pad portion 32c and the pad portion 32e, and the pad portion 32e may overlap the pad portion 33d and the pad portion 33f.

[0023] According to this configuration, the conductor patterns 31a to 31f extend in the first direction in a state where they are arranged in this order in the second direction. Here, since the pad portion 32 and the pad portion 33 are arranged at different positions in the first direction, even when the pitch between adjacent conductor patterns 31 is small, the pitch between the adjacent pad portions 32 and 33 in the second direction is maintained relatively large. Thereby, it is possible to prevent a short circuit between the pad portions 32 due to solder when the connector 100 is mounted on the circuit board while reducing the pitch between adjacent conductor patterns 31.

[0024] Since the configuration of the connector 100 has been described with reference to FIG. 2, further features of each of the connectors 100A and 100B will be described below. FIG. 3 is a diagram showing the configuration of one connector 100A. A plan view of the connector 100A before bending is shown in the left part of FIG. 3, and a perspective view of the connector 100A after bending is shown in the right part of FIG. 3. As shown in the left part of FIG. 3, the metal support layer 10 of the connector 100A extends in the second direction and has three bending portions A1, A2, and A3 arranged in this order in the first direction.

[0025] In this example, the region of the connector 100A including the bending portions A2 and A3 becomes a connection region 40 for connecting to the connector 100B. That is, the portion of the conductor pattern 31 in the connection region 40 becomes a contact portion 41 for contacting the conductor pattern 31 of the connector 100B. Therefore, the contact portion 41 is provided so as to straddle the bending portions A2 and A3. In the left part of FIG. 3, the contact portions 41 in each conductor pattern 31 are shown in a hatching pattern. Nickel plating or gold (Au) plating may be formed on the contact portion 41. In this case, the electrical connectivity of the contact portion 41 is improved.

[0026] The connector 100A is bent along the bending portions A1 to A3 such that the metal support layer 10 is on the inside and the conductor layer 30 is on the outside. In this example, the bending angle of the connector 100A at each of the bending portions A1 to A3 is approximately 90 degrees. That is, the connector 100A is bent such that the angle formed by the two regions sandwiching each of the bending portions A1 to A3 in the metal support layer 10 is approximately 90 degrees.

[0027] When the connector 100A is bent, as shown in the right part of FIG. 3, the connection area 40 becomes convex. As a result, a convex portion 101 is formed on the connector 100A. After bending, the dimensions of the connector 100A in the second direction (width direction), height direction, and depth direction are, for example, 1 mm or more and 3 mm or less. In the example of the right part of FIG. 3, the vertical direction is the height direction, and the direction orthogonal to the width direction and the height direction is the depth direction.

[0028] Also, the connector 100A is in the state of the shape shown on the right side of FIG. 3, and the mounting area 42 serving as its bottom surface is connected to a circuit board or the like. The mounting area 42 of the connector 100A is an area where the pad portions 32, 33 are formed.

[0029] FIG. 4 is a diagram showing the configuration of the other connector 100B. A plan view of the connector 100B before bending is shown in the left part of FIG. 4, and a perspective view of the connector 100B after bending is shown in the right part of FIG. 4. As shown in the left part of FIG. 4, the metal support layer 10 of the connector 100B extends in the second direction and has six bending portions B1 to B6 arranged in this order in the first direction.

[0030] In this example, the area of the connector 100B including the bending portions B4 and B5 becomes the connection area 40 for connecting to the connector 100A. That is, the portion of the conductor pattern 31 in the connection area 40 becomes the contact portion 41 for contacting the conductor pattern 31 of the connector 100A. Therefore, the contact portion 41 is provided so as to straddle the bending portions B4 and B5. In the left part of FIG. 4, the contact portions 41 in each conductor pattern 31 are shown in a hatching pattern. Similar to the connector 100A, nickel plating or gold plating may be formed on the contact portion 41.

[0031] Connector 100B is bent along the bending portions B1 to B6 such that the metal support layer 10 is on the inner side and the conductor layer 30 is on the outer side. In this example, the bending angle of the connector 100B at each of the bending portions B1 to B6 is approximately 90 degrees. That is, in the metal support layer 10, the connector 100B is bent such that the angle formed by two regions sandwiching each of the bending portions B1 to B6 is approximately 90 degrees.

[0032] When the connector 100B is bent, as shown in the right part of FIG. 4, the connection region 40 becomes concave. As a result, a recess 102 is formed in the connector 100B. After bending, each dimension of the connector 100B in the second direction (width direction), height direction, and depth direction is, for example, 1 mm or more and 3 mm or less. In the example of the right part of FIG. 4, the vertical direction is the height direction, and the direction orthogonal to the width direction and the height direction is the depth direction.

[0033] Also, in the state of the shape shown on the right side of FIG. 4, the mounting region 42 that is the bottom surface of the connector 100B is connected to a circuit board or the like. The mounting region 42 of the connector 100B is a region where the pad portions 32 and 33 are formed.

[0034] FIG. 5 is a bottom view showing the configuration of the connector 100 before bending. In FIG. 5, the conductor layer 30 is shown by a dotted line. Referring to FIG. 5, an opening 34 is formed inside the region where each of the plurality of pad portions 32 is formed. The opening 34 is a hole that penetrates the conductor layer 30, the insulating layer 20, and the metal support layer 10. Although an example in which the cross section of the opening 34 is circular is shown, the cross-sectional shape is not limited to a circle. The cross-sectional shape of the opening 34 may be any of a triangle, a rectangle, and a polygon. A recess 32A surrounding the opening 34 is formed in the metal support layer 10. The recess 32A is formed at a position separated from the opening 34 by a predetermined distance and penetrates the metal support layer 10. Due to the recess 32A, the portion of the metal support layer 10 surrounded by the recess 32A of the metal support layer 10 is electrically isolated from the portion outside the recess 32A of the metal support layer 10.

[0035] Further, a recess 33A is formed in the metal support layer 10 at a position facing the pad portion 33. The recess 33A penetrates the metal support layer 10. The recess 33A includes two straight portions extending a predetermined distance in a first direction from one end of the metal support layer 10 and a connecting portion connecting the ends of the two straight portions. In a second direction, the pad portion 33 is located between the two straight portions. In plan view, the two straight portions do not overlap the pad portion 33. Preferably, in plan view, the two straight portions are formed at a position separated from the pad portion 33 by a predetermined distance. Due to the recess 33A, the portion surrounded by the recess 33A of the metal support layer 10 and the end of the metal support layer 10 is electrically insulated from the portion outside the recess 33A of the metal support layer 10. Here, the recess 33A is formed in a shape composed of two straight portions and a connecting portion, but the shape of the recess 33A is not limited. The recess 33A may be in the shape of a part of an annular ring or a part of an elliptical ring.

[0036] FIG. 6 is a cross-sectional view taken along line A-A of FIG. 5. FIG. 7 is an enlarged view of region R of FIG. 6. Referring to FIGS. 6 and 7, the connector 100 includes a metal support layer 10, an insulating layer 20, and a conductor layer 30 laminated in this order. At the ends of the metal support layer 10, the insulating layer 20, and the conductor layer 30, a metal connection layer 50 is formed so as to cover the metal support layer 10, the insulating layer 20, and the conductor layer 30. The metal connection layer 50 is made of a metal material and is formed by vapor deposition. Note that the metal connection layer 50 may be formed by sputtering or electroless plating. Examples of the material of the metal connection layer 50 include gold, chromium, copper, nickel, titanium, or alloys thereof. The metal connection layer 50 extends from the pad portion 33 through the end face of the pad portion 33, the end face of the insulating layer 20, and the end face of the metal support layer 10 to the surface of the metal support layer 10 opposite to the surface in contact with the insulating layer 20.

[0037] A recess 33A is formed in the metal support layer 10 at a position separated from the end face by a predetermined distance. The metal connection layer 50 extends from the end face of the metal support layer 10 to the recess 33A on the surface of the metal support layer 10 opposite to the surface in contact with the insulating layer 20.

[0038] FIG. 8 is a diagram partially enlarging and showing an example of a state where a connector is connected to a circuit board by soldering. A state where the connector 100 is connected to the land portion 60 of the circuit board by solder 61 is shown. Referring to FIG. 8, the pad portion 33 is located at a position facing the land portion 60, and a portion of the metal connection layer 50 formed on the surfaces of the land portion 60 and the pad portion 33 is connected by the solder 61 existing therebetween. Further, the solder 61 flows in a liquid state on the surface of the highly wettable metal connection layer 50. Since the metal connection layer 50 is formed on the end faces of the pad portion 33, the insulating layer 20, and the metal support layer 10 respectively, the solder 61 connects the land portion 60 to the pad portion 33, the insulating layer 20, and the metal support layer 10. Furthermore, the solder 61 fixes the connector 100 to the land portion 60 at a portion of the metal connection layer 50 formed on the surface opposite to the surface connected to the insulating layer 20 of the metal support layer 10.

[0039] Since the solder 61 connects the land portion 60 to a portion of the metal connection layer 50 formed on the surface of the pad portion 33 and also connects the land portion 60 to portions of the metal connection layer 50 formed on the end faces of the metal support layer 10 and the insulating layer 20 respectively, the area of contact between the connector 100 and the solder 61 increases. Also, the solder 61 contacts a portion of the metal connection layer 50 formed on the surface of the pad portion 33 of the connector 100 and a portion of the metal connection layer 50 formed on the surface of the metal support layer 10 of the connector 100, and has a shape that sandwiches the connector 100. For this reason, the connector 100 can be firmly connected to the circuit board.

[0040] FIG. 9 is a cross-sectional view taken along line B-B of FIG. 5. FIG. 10 is an enlarged view of region R in FIG. 9. Referring to FIGS. 9 and 10, in the connector 100, a metal support layer 10, an insulating layer 20, and a conductor layer 30 are laminated in this order. At the ends of the metal support layer 10, the insulating layer 20, and the conductor layer 30, a metal connection layer 50 is formed so as to cover the metal support layer 10, the insulating layer 20, and the conductor layer 30. An opening 34 is formed that penetrates the pad portion 32, the insulating layer 20, and the metal support layer 10. The metal connection layer 50 is formed on the inner peripheral surface of the opening 34, the surface of the metal support layer 10 opposite to the surface in contact with the insulating layer 20, and the surface of the pad portion 32 opposite to the surface in contact with the insulating layer 20. The metal connection layer 50 extends from the surface of the pad portion 33 opposite to the surface in contact with the insulating layer 20 through the inner peripheral surface of the opening 34 to the surface of the metal support layer 10 opposite to the surface in contact with the insulating layer 20. A recess 32A is formed in the metal support layer 10 at a position spaced a predetermined distance from the opening 34. The metal connection layer 50 extends from the opening 34 to the recess 32A on the surface of the metal support layer 10 opposite to the surface in contact with the insulating layer 20.

[0041] FIG. 11 is a diagram partially enlarging and showing an example of a state where the connector is connected to the circuit board by soldering. A state where the connector 100A is connected to the land portion 60 of the circuit board by solder 61 is shown. Referring to FIG. 11, the pad portion 32 is located at a position facing the land portion 60, and the land portion 60 and the portion of the metal connection layer 50 formed on the surface of the pad portion 32 are connected by the solder 61 existing therebetween. Also, the solder 61 flows in a liquid state on the surface of the highly wettable metal connection layer 50. Since the metal connection layer 50 is formed on the inner peripheral surface of the opening 34, the solder 61 connects the land portion 60 to the pad portion 32, the insulating layer 20, and the metal support layer 10. Further, the solder 61 fixes the connector 100 to the land portion 60 at the portion of the metal connection layer 50 formed on the surface of the metal support layer 10 opposite to the surface connected to the insulating layer 20.

[0042] The solder 61 connects the land portion 60 to the portion of the metal connection layer 50 formed on the surface of the pad portion 33, and also connects the land portion 60 to the portions of the metal connection layer 50 formed on the end faces of the metal support layer 10 and the insulating layer 20 respectively. As a result, the area of contact between the connector 100 and the solder 61 increases. Further, the solder 61 contacts the portion of the metal connection layer 50 formed on the surface of the pad portion 33 of the connector 100 and the portion of the metal connection layer 50 formed on the surface of the metal support layer 10 of the connector 100, and has a shape that sandwiches the connector 100. For this reason, the connector 100 can be firmly connected to the circuit board.

[0043] (2) Method for manufacturing a connector FIG. 12 is a perspective view showing a connector assembly sheet. As shown in FIG. 12, in the present embodiment, a plurality of connectors 100 are formed on the connector assembly sheet 2 in an aligned state by a roll-to-roll method. The connector 100A and the connector 100B may be formed on separate connector assembly sheets 2.

[0044] Hereinafter, a method for manufacturing the connector 100 will be described with reference to a cross section of one connector 100 formed on the connector assembly sheet 2. FIGS. 13 to 21 are diagrams for explaining an example of the method for manufacturing the connector 100. FIGS. 13 to 21 correspond to a cross-sectional view taken along line B-B of the connector 100 in FIG. 5. Although the method for manufacturing the connector 100A is described in FIGS. 13 to 20, the method for manufacturing the connector 100B is the same except that the bent portions B1 to B6 are formed on the metal support layer 10 instead of the bent portions A1 to A3 in FIGS. 14 to 16.

[0045] First, as shown in FIG. 13, a metal sheet 2A made of, for example, stainless steel is prepared. The thickness of the metal sheet 2A is, for example, 50 μm or more. The material of the metal sheet 2A is not limited to stainless steel, and may be other metals such as aluminum.

[0046] Next, as shown in FIG. 14, an insulating layer 20 is formed on the upper surface of the metal support layer 10. The insulating layer 20 may be formed by applying a photosensitive resin precursor over the entire upper surface of the metal support layer 10 and exposing it to ultraviolet light through a mask having an opening 34. In this example, the material of the insulating layer 20 is polyimide, but it may be other resins such as epoxy.

[0047] Thereafter, as shown in FIG. 15, a mask 130 having a predetermined pattern opening 131 is formed on the upper surface of the insulating layer 20. The mask 130 may be formed, for example, by exposing and developing a photosensitive dry film resist. Next, as shown in FIG. 16, a conductor layer 30 is formed on the upper surface of the insulating layer 20 through the pattern opening 131 of the mask 130, for example, by copper plating. The conductor layer 30 includes a plurality of conductor patterns 31 and a plurality of pad portions 32, 33. Also, the portion of the conductor pattern 31 in the connection region 40 becomes the contact portion 41.

[0048] Subsequently, as shown in FIG. 17, the unnecessary portions of the mask 130 are sequentially removed. Note that in FIGS. 15 to 17, the conductor layer 30 is formed by a semi-additive method, but the embodiment is not limited thereto. The conductor layer 30 may be formed by an additive method or a subtractive method.

[0049] Then, as shown in FIG. 18, a mask 120 having an opening 121 and a plurality (three in this example) of linear slits 121A corresponding to the opening 34 and the recess 32A respectively is formed on the metal support layer 10. The mask 120 may be formed, for example, by exposing and developing a photosensitive dry film resist. Subsequently, etching is performed on the portion of the metal support layer 10 exposed from the opening 121 of the mask 120 using an etching solution. Also, etching is performed on the portion of the metal support layer 10 exposed from the slit 121A of the mask 120 for a relatively short time. The etching solution may be, for example, a ferric chloride solution. As a result, as shown in FIG. 15, an opening 34, a recess 32A, and a plurality (three in this example) of linear shallow groove portions a1, a2, a3 are formed in the metal support layer 10. At this stage, the metal support layer 10 is formed on the metal sheet 2A. Note that the etching for forming the opening 34 and the recess 32A and the etching for forming the plurality of linear shallow groove portions a1, a2, a3 are performed in separate steps.

[0050] Thereafter, as shown in FIG. 20, the mask 120 is removed from the metal support layer 10. In the metal support layer 10, the portions where the groove portions a1 to a3 are formed become the bending portions A1 to A3 of the metal support layer 10 respectively. Also, the region including the bending portions A2 and A3 becomes the connection region 40 of the connector 100. Note that the groove portions a1 to a3 may be formed by laser processing using, for example, a YAG (yttrium aluminum garnet) laser or the like instead of the steps of FIGS. 18 to 20.

[0051] Then, as shown in FIG. 21, a metal connection layer 50 is formed. The metal connection layer 50 is formed by vapor deposition using a mask. Note that the metal connection layer 50 may be formed by electroless plating or sputtering. By forming the metal connection layer 50, the connector assembly sheet 2 of FIG. 12 in which a plurality of connectors 100A before bending are formed is completed.

[0052] Thereafter, the connector 100A is recovered from the connector assembly sheet 2. Finally, the recovered connector 100A is bent along the bending portions A1 to A3. As a result, the connector 100A on the right side of FIG. 3 is completed. According to the above manufacturing method, in the manufacture of the connector 100, it is not necessary to use an adhesive layer. Thereby, the heat resistance of the connector 100 can be improved.

[0053] <First Modification Example> FIG. 22 is a plan view showing the configuration of the connector 100 before bending in the first modification example. In FIG. 22, the recesses 32A and 33A formed in the metal support layer 10 are indicated by dotted lines. The differences from the connector 100 shown in FIG. 2 are that an opening 36 is formed in the conductor pattern 35 and a recess 36A is formed in the metal support layer 10. Since the other configurations are the same as those shown in FIG. 2, the description will not be repeated here.

[0054] The opening 36 is formed in a portion within the mounting region of the conductor pattern 35. The opening 36 is a hole that penetrates the conductor layer 30, the insulating layer 20, and the metal support layer 10. The opening 36 has the same configuration as the opening 34 and is formed by the same manufacturing method as the opening 34.

[0055] An opening 36a is formed in the conductor pattern 35a, and an opening 36b is formed in the conductor pattern 35b. A recess 36A is formed between the opening 36a and the opening 36b in the metal support layer 10. The recess 36A is a groove that extends from one end to the other end of the metal support layer 10 and penetrates the metal support layer 10. Here, the recess 36A has a shape that extends linearly in the first direction. Since the metal support layer 10 is divided into two by the recess 36A, one part and the other part of the metal support layer 10 that are divided into two are electrically insulated.

[0056] The conductor patterns 35a and 35b are used as power lines. Therefore, when the conductor patterns 35a and 35b are soldered to connection terminals of a circuit board or the like, in the same manner as described with reference to FIG. 11 for the opening 34, the conductor pattern 35a is electrically connected to one part of the metal support layer 10 by the solder 61, and the conductor pattern 35b is electrically connected to the other part of the metal support layer 10 by the solder 61. Since the one part and the other part of the metal support layer 10 are electrically insulated by the recess 36A, the conductor pattern 35a and the conductor pattern 35a are electrically insulated from each other.

[0057] Since the connector 100 in the first modification has the opening 36 in addition to the opening 34, the contact area with the solder becomes larger in a state of being connected to the circuit board by the solder. Therefore, the connector 100 can be firmly connected to the circuit board. Further, since the recess 36A is formed in the metal support layer 10, the conductor pattern 35a and the conductor pattern 35b can be electrically insulated from each other.

[0058] Although an example in which the openings 36 and 34 are formed in the metal support layer 10 has been shown, either one of the openings 36 and 34 may be formed in the metal support layer 10. In this case, the connection strength between the connector 100 and the circuit board becomes small, but the connection strength between the connector 100 and the circuit board can be increased as compared with the case where the openings 36 and 34 are not formed in the metal support layer 10.

[0059] <Second Modification> FIG. 23 is a plan view showing the configuration of the connector before bending in the second modification. Referring to FIG. 23, the difference from the connector 100 shown in FIG. 2 is that a dummy pattern 37 is added to the conductor layer 30. Since the other configurations are the same as those shown in FIG. 2, the description will not be repeated here.

[0060] The dummy pattern 37 is formed in a portion of the mounting area 42 of the connector 100 where no other conductor layer 30 is formed. The other conductor layers 30 are the conductor pattern 31, the pad portion 32, the pad portion 33, and the conductor pattern 35. In FIG. 23, the dummy pattern 37 includes two, and the two dummy patterns 37a and 37b are arranged at positions sandwiching the other conductor layer 30 therebetween.

[0061] An opening 37A is formed inside the dummy pattern 37a, and two openings 37A are formed inside the dummy pattern 37b. The three openings 37A are different in shape and size, but penetrate the conductor layer 30, the insulating layer 20, and the metal support layer 10. The opening 37A is formed by the same manufacturing method as the opening 34, and the metal connection layer 50 is formed.

[0062] When the dummy pattern 37 is connected to a dummy land portion formed on a circuit board or the like by solder, the dummy pattern 37 and the land portion 60 are connected by the solder 61 existing therebetween. Also, the solder 61 flows in a liquid state onto the highly wettable metal connection layer 50. Thereby, the solder 61 is connected to the end face of the dummy pattern 37 and the surface of the metal connection layer 50. For this reason, the solder 61 connects the land portion 60 to the dummy pattern 37. Since the metal connection layer 50 is formed on the inner peripheral surface of the opening 34, the solder 61 connects the land portion 60 to the insulating layer 20 and the metal support layer 10. Further, the solder 61 contacts the dummy pattern 37 of the connector 100 and the portion on the side opposite to the dummy pattern 37 of the connector 100, and has a shape that sandwiches the connector 100.

[0063] The connector 100 in the second modification has the opening 37A in addition to the opening 34, so that the contact area with the solder becomes larger in a state of being connected to the circuit board by the solder. For this reason, the connector 100 can be more firmly connected to the circuit board.

[0064] <The Third Modification> In the third modification example, the connector 100 partially connects the metal support layer 10 and the conductor layer 30. FIG. 24 is a cross-sectional view showing a part of the connector in the third modification example. The cross-sectional view shown in FIG. 24 corresponds to the cross-section taken along line A-A in FIG. 5. Referring to FIG. 24, compared with the cross-section of the connector 100 in the first embodiment shown in FIG. 8, the insulating layer 20 is not formed up to the end of the metal support layer 10. The metal support layer 10 and the conductor layer 30 are connected at the portion where the insulating layer 20 is not formed. The insulating layer 20 is formed up to between the recess 33A of the metal support layer 10 and the end face of the metal support layer 10. For this reason, the portion where the insulating layer 20 is not formed is the inner portion of the recess 33A of the metal support layer 10. The inner portion of the recess 33A of the metal support layer 10 and the outer portion of the recess 33A are electrically insulated from each other.

[0065] Note that in the third modification example, the metal connection layer 50 may not be formed. Even in this case, since the solder 61 spreads along the pad portion 33 of the conductor layer 30 and the metal support layer 10, the connector 100 can be firmly fixed to the land portion 60 with the solder 61 in the same manner as when the metal connection layer 50 is formed.

[0066] <Fourth Modification Example> In the fourth modification example, the connector 100 changes the region where the metal connection layer 50 is formed. FIG. 25 is a cross-sectional view showing a part of the connector in the fourth modification example. The cross-sectional view shown in FIG. 25 corresponds to the cross-section taken along line A-A in FIG. 5. Referring to FIG. 25, compared with the cross-section of the connector 100 in the first embodiment shown in FIG. 8, the metal connection layer 50 is not formed on the surface opposite to the surface in contact with the insulating layer 20 of the metal support layer 10. The metal connection layer 50 is formed on the surface of the pad portion 33 and on the end faces of the pad portion 33, the insulating layer 20, and the metal support layer 10, respectively.

[0067] In the fourth modification example, when the metal connection layer 50 is formed by vapor deposition, it can be formed in one vapor deposition process. For this reason, the number of processes can be reduced, and thus the manufacturing is easy.

[0068] <Fifth Modification Example> The fifth modification is a combination of the third modification and the fourth modification. FIG. 26 is a cross-sectional view showing a part of the connector in the fifth modification. The cross-sectional view shown in FIG. 26 corresponds to the cross-section taken along line A-A in FIG. 5. Referring to FIG. 26, compared with the cross-section of the connector 100 in the first embodiment shown in FIG. 8, the insulating layer 20 is not formed up to the end of the metal support layer 10, and the metal connection layer 50 is not formed on the surface of the metal support layer 10 opposite to the surface in contact with the insulating layer 20.

[0069] The connector in the fifth modification can achieve the same effects as the connectors 100 in the third modification and the fourth modification.

[0070] <The sixth modification> The connector 100 in the sixth modification partially connects the metal support layer 10 and the conductor layer 30. FIG. 26 is a cross-sectional view showing a part of the connector in the sixth modification. The cross-sectional view shown in FIG. 26 corresponds to the cross-section taken along line B-B in FIG. 5. Referring to FIG. 26, compared with the cross-section of the connector 100 in the first embodiment shown in FIG. 11, the insulating layer 20 is not formed up to the end of the metal support layer 10. The metal support layer 10 and the conductor layer 30 are connected at the portion where the insulating layer 20 is not formed. The insulating layer 20 is formed up to between the recess 32A of the metal support layer 10 and the opening 34 of the metal support layer 10. Therefore, the portion where the insulating layer 20 is not formed is the inner portion of the recess 32A of the metal support layer 10. The inner portion of the recess 32A of the metal support layer 10 and the outer portion of the recess 32A are electrically insulated.

[0071] In addition, in the sixth modification, the metal connection layer 50 may not be formed. Even in this case, since the solder 61 spreads along the pad portion 33 of the conductor layer 30 and the metal support layer 10 through the opening 34, the connector 100 can be firmly fixed to the land portion 60 with the solder 61 in the same manner as when the metal connection layer 50 is formed.

[0072] <The seventh modification> In the seventh modification, the connector 100 has a modified area for forming the metal connection layer 50. FIG. 27 is a cross-sectional view showing a part of the connector in the seventh modification. The cross-sectional view shown in FIG. 27 corresponds to the cross-section taken along line B-B in FIG. 5. Referring to FIG. 27 and comparing it with the cross-section of the connector 100 in the first embodiment shown in FIG. 11, the metal connection layer 50 is not formed on the surface opposite to the surface where it contacts the insulating layer 20 of the metal support layer 10. The metal connection layer 50 is formed on the surface of the pad portion 33 and on the end faces of the pad portion 33, the insulating layer 20, and the metal support layer 10, respectively.

[0073] In the seventh modification, when the metal connection layer 50 is formed by vapor deposition, the connector 100 can be formed in a single vapor deposition process. Therefore, the number of processes can be reduced, making the manufacturing easy.

[0074] <The Eighth Modification> The eighth modification is a combination of the sixth modification and the seventh modification. FIG. 29 is a cross-sectional view showing a part of the connector in the eighth modification. The cross-sectional view shown in FIG. 29 corresponds to the cross-section taken along line B-B in FIG. 5. Referring to FIG. 29 and comparing it with the cross-section of the connector 100 in the first embodiment shown in FIG. 11, the insulating layer 20 is not formed up to the end of the metal support layer 10, and the metal connection layer 50 is not formed on the surface opposite to the surface where it contacts the insulating layer 20 of the metal support layer 10.

[0075] The connector in the eighth modification can achieve the same effects as the connectors 100 in the sixth and seventh modifications.

[0076] 2. The Second Embodiment In the connector 100 of the first embodiment, openings 34, 36, and 37A are formed in the conductor layer 30. In the connector 100 of the second embodiment, no openings are formed in the conductor layer 30. In the connector 100 of the second embodiment, openings are formed in the mounting region 42 that penetrate the insulating layer 20 and the metal support layer 10.

[0077] FIG. 30 is a plan view showing the configuration of the connector before bending in the second embodiment. Referring to FIG. 30, the differences from the connector 100 shown in FIG. 2 are that the opening 34 is changed to the opening 38 and the recess 32A is changed to the recess 32B. Since the other configurations are the same as those shown in FIG. 2, the description will not be repeated here.

[0078] The opening 38 is formed in a region where the conductor layer 30 of the mounting region 42 is not formed. The opening 38 is a hole penetrating the insulating layer 20 and the metal support layer 10. In this example, the opening 38 is disposed at a position adjacent to the pad portion 32. The opening 38 has a rectangular cross-sectional shape, and one side thereof overlaps with one side of the pad portion 32. Note that the opening 38 may be formed at a position separated from the pad portion 32 by a predetermined distance.

[0079] The recess 32B is formed in the metal support layer 10 at a position facing the pad portion 32. The recess 32B penetrates the metal support layer 10. The recess 32B includes two straight portions extending a predetermined distance in the first direction from one end of the opening 38 and a connecting portion connecting the ends of the two straight portions. In the second direction, the pad portion 32 is located between the two straight portions. In plan view, the two straight portions do not overlap the pad portion 32. Preferably, in plan view, the two straight portions are formed at positions separated from the pad portion 32 by a predetermined distance. Due to the recess 32B, the portion surrounded by the recess 33A and the opening 38 of the metal support layer 10 is electrically insulated from the other portions of the metal support layer 10.

[0080] FIG. 31 is a cross-sectional view taken along line C-C of FIG. 30. FIG. 32 is an enlarged view of region R in FIG. 31. Referring to FIGS. 31 and 32, the connector 100 includes a metal support layer 10, an insulating layer 20, and a conductor layer 30 laminated in this order. The conductor layer 30 includes a conductor pattern 31 and a pad portion 32. The metal connection layer 50 is made of a metal material and is formed by vapor deposition, sputtering, or electroless plating. The metal connection layer 50 extends from the pad portion 32 through the end faces of the insulating layer 20 and the metal support layer 10 to the face on the opposite side of the face of the metal support layer 10 that contacts the insulating layer 20.

[0081] A recess 32B is formed in the metal support layer 10 at a position separated from the end face by a predetermined distance. The metal connection layer 50 extends from the end face of the metal support layer 10 to the recess 32B on the surface opposite to the surface in contact with the insulating layer 20 of the metal support layer 10.

[0082] FIG. 33 is a diagram showing a partially enlarged view of an example of a state where the connector in the second embodiment is connected to the circuit board by soldering. A state where the connector 100 is connected to the land portion 60 of the circuit board by solder 61 is shown. Referring to FIG. 33, a pad portion 32 is located at a position facing the land portion 60, and the land portion 60 and the pad portion 32 are connected by the solder 61 existing therebetween. Further, the solder 61 flows in a liquid state onto the highly wettable metal connection layer 50. Thereby, the solder 61 is connected to the end face of the pad portion 32 and the portion of the metal connection layer 50 formed on the surface of the pad portion 32. Since the metal connection layer 50 is formed on the end faces of the insulating layer 20 and the metal support layer 10 respectively, the solder 61 connects the land portion 60 to the insulating layer 20 and the metal support layer 10. Since the solder 61 connects the land portion 60 to the pad portion 32 and also connects the land portion 60 to the metal support layer 10 and the insulating layer 20, the area of contact between the connector 100 and the solder 61 increases. Also, the solder 61 contacts the pad portion 32 of the connector 100 and the portion on the side opposite to the pad portion 32 of the connector 100, and has a shape that sandwiches the connector 100. For this reason, the connector 100 can be firmly connected to the circuit board.

[0083] <The Ninth Modification> The opening formed in the connector 100 in the ninth modification is formed in the region where the conductor layer 30 of the mounting region 42 is formed. This opening penetrates the metal support layer 10 and the insulating layer 20, but does not penetrate the conductor layer 30.

[0084] FIG. 34 is a plan view showing the configuration of the connector before bending in the ninth modification. Referring to FIG. 34, the difference from the connector 100 shown in FIG. 2 is that the opening 34 is changed to an opening 39. Since the other configurations are the same as those shown in FIG. 2, the description will not be repeated here.

[0085] The opening 39 is formed in the region where the conductor layer 30 of the mounting region 42 is formed. Specifically, the opening 39 is formed in the region including the pad portion 32 and the peripheral portion surrounding the pad portion 32, the region including the pad portion 33 and the peripheral portion surrounding the pad portion 33, and the region including one end portion of the conductor pattern 35 and the peripheral portion of the one end portion. The opening 39 is a hole penetrating the insulating layer 20 and the metal support layer 10. The opening 39 does not penetrate the conductor layer 30. In the connector 100 in the ninth modification, after the insulating layer 20 is laminated on the metal support layer 10 and the conductor layer 30 is formed on the insulating layer 20, the opening 39 is formed in the metal support layer 10.

[0086] FIG. 35 is a cross-sectional view taken along line D-D of FIG. 34. FIG. 36 is an enlarged view of region R in FIG. 35. Referring to FIGS. 35 and 36, in the connector 100, the metal support layer 10, the insulating layer 20, and the conductor layer 30 are laminated in this order. The conductor layer 30 includes a conductor pattern 31 and a pad portion 32. The opening 39 penetrates the insulating layer 20 and the metal support layer 10, but does not penetrate a part of the pad portion 32 and the conductor pattern 31. The cross-section of the opening 39 is larger than that of the pad portion 32.

[0087] FIG. 37 is a diagram partially enlarging and showing an example of a state where the connector in the ninth modification is connected to a circuit board by solder. A state where the connector 100 in the ninth modification is connected to the land portion 60 of the circuit board by solder 61 is shown. Referring to FIG. 37, the pad portion 32 is located at a position facing the land portion 60. The solder 61 connects the conductor layer 30 to the land portion 60 over the entire surface of the portion including the pad portion 32 of the conductor layer 30. Therefore, since the solder 61 connects the pad portion 32 to the conductor layer 30 over the entire surface of the portion including the pad portion 32 of the conductor layer 30, the contact area between the connector 100 and the solder 61 becomes large. Also, the solder 61 has a shape that sandwiches the pad portion 32 of the connector 100 and the portion including the pad portion 32 of the conductor layer 30 of the connector 100. For this reason, the connector 100 can be firmly connected to the circuit board.

[0088] <Tenth Modification> In the tenth modification example, the connector 100 has a single opening 39A instead of the plurality of openings 39 formed in the connector 100 of the ninth modification example.

[0089] FIG. 38 is a plan view showing the configuration of the connector before bending in the tenth modification example. Referring to FIG. 38, the difference from the connector 100 in the ninth modification example shown in FIG. 34 is that the plurality of openings 39 are changed to an opening 39A. Since the other configurations are the same as those shown in FIG. 34, the description will not be repeated here.

[0090] One opening 39A is formed in a portion including the region where the conductor layer 30 of the mounting region 42 is formed. Specifically, the opening 39A is formed in a region including the pad portion 32 and one end portion of the conductor pattern 35. The opening 39A penetrates the insulating layer 20 and the metal support layer 10. The opening 39A does not penetrate the conductor layer 30. In the connector 100 in the tenth modification example, after the insulating layer 20 is laminated on the metal support layer 10 and the conductor layer 30 is formed on the insulating layer 20, the opening 39A is formed in the metal support layer 10.

[0091] When the connector 100 in the tenth modification example is connected to the land portion 60 of the circuit board by solder 61, similar to the case where the connector 100 in the ninth modification example is connected to the land portion 60 of the circuit board by solder 61, the solder 61 connects the conductor layer 30 to the land portion 60 over the entire surface of the portion including the pad portion 32 of the conductor layer 30. For this reason, the area where the connector 100 contacts the solder 61 increases. Also, the solder 61 has a shape that sandwiches the pad portion 32 of the connector 100 and the portion including the pad portion 32 of the conductor layer 30 of the connector 100. For this reason, the connector 100 can be firmly connected to the circuit board.

[0092] 3. Third Embodiment FIG. 39 is a plan view showing the configuration of the connector before bending in the third embodiment. Referring to FIG. 39, the difference between the connector 100 in the third embodiment and the connector 100 before bending in the first modification shown in FIG. 22 is that a second opening 38 is added. The connector 100 in the third embodiment has a first opening 34 formed in the region where the pad portion 32 of the mounting region 42 is formed, and a second opening 38 formed in the region where the conductor layer 30 is not formed. The first opening 34 penetrates the metal support layer 10, the insulating layer 20, and the conductor layer 30, and the second opening 38 penetrates the metal support layer 10 and the insulating layer 20.

[0093] Referring to FIG. 39, a first opening 34 is formed inside the region where each of the plurality of pad portions 32 is formed. The first opening 34 is a hole that penetrates the conductor layer 30, the insulating layer 20, and the metal support layer 10. Although an example in which the cross section of the first opening 34 is circular is shown, the cross-sectional shape is not limited to a circle. The cross-sectional shape of the first opening 34 may be any of a triangle, a rectangle, and a polygon.

[0094] A second opening 38 is formed at a position adjacent to the pad portion 32. The second opening 38 is formed in the region where the conductor layer 30 of the mounting region 42 is not formed. The second opening 38 is a hole that penetrates the insulating layer 20 and the metal support layer 10. The second opening 38 has a rectangular cross-sectional shape, and one side thereof overlaps with one side of the pad portion 32. Note that the second opening 38 may be formed at a position separated from the pad portion 32 by a predetermined distance.

[0095] A recess 32B is formed in the metal support layer 10 at a position facing the pad portion 32. The recess 32B penetrates the metal support layer 10. The recess 32B includes two straight portions extending a predetermined distance in a first direction from one end of the second opening 38, and a connecting portion connecting the ends of the two straight portions. In a second direction, the pad portion 32 is located between the two straight portions. In plan view, the two straight portions do not overlap the pad portion 32. Preferably, in plan view, the two straight portions are formed at positions separated from the pad portion 32 by a predetermined distance. The portion of the metal support layer 10 surrounded by the recess 33A and the second opening 38 of the metal support layer 10 is electrically isolated from the other portions of the metal support layer 10 by the recess 32B.

[0096] The plurality of pad portions 33 are provided at positions in contact with one end portion of the insulating layer 20 in the first direction. A first opening 34A is formed inside the region where each of the plurality of pad portions 33 is formed. The first opening 34A is a hole penetrating the conductor layer 30, the insulating layer 20, and the metal support layer 10. Although an example in which the cross section of the first opening 34A is circular is shown, the cross-sectional shape is not limited to a circle. The cross-sectional shape of the first opening 34A may be any of a triangle, a rectangle, and a polygon.

[0097] A recess 33A is formed in the metal support layer 10 at a position facing the pad portion 33. The recess 33A penetrates the metal support layer 10. The recess 33A includes two straight portions extending a predetermined distance in a first direction from one end of the metal support layer 10, and a connecting portion connecting the ends of the two straight portions. In a second direction, the pad portion 33 is located between the two straight portions. In plan view, the two straight portions do not overlap the pad portion 33. Preferably, in plan view, the two straight portions are formed at positions separated from the pad portion 33 by a predetermined distance. The portion of the metal support layer 10 surrounded by the recess 33A and the end portion of the metal support layer 10 is electrically isolated from the portion outside the recess 33A of the metal support layer 10 by the recess 33A.

[0098] FIG. 40 is a cross-sectional view taken along line E-E of FIG. 39. FIG. 41 is an enlarged view of region R of FIG. 40. Referring to FIGS. 40 and 41, the connector 100 has a metal support layer 10, an insulating layer 20, and a conductor layer 30 laminated in this order. The conductor layer 30 includes a conductor pattern 31 and a pad portion 33. The metal connection layer 50 is made of a metal material and is formed on the insulating layer 20 by vapor deposition, sputtering, or electroless plating. The metal connection layer 50 extends from the pad portion 32 through the end face of the pad portion 32, the end face of the insulating layer 20, and the end face of the metal support layer 10 to the surface on the opposite side of the surface of the metal support layer 10 that contacts the insulating layer 20. The metal connection layer 50 includes a first portion that extends from the pad portion 32 through the first opening 34 and the second opening 38 to the metal support layer 10, and a second portion that extends from the pad portion 32 through the first opening 34 to the metal support layer 10. The first portion covers the region between the first opening 34 and the second opening 38 on the surface of the pad portion 32. Also, the first portion covers the region between the first opening 34 and the second opening 38 on the lower surface of the metal support layer 10. The second portion covers the upper surface of the pad portion 32 and covers the region between the first opening 34 and the recess 32A on the lower surface of the metal support layer 10.

[0099] FIG. 42 is a diagram partially enlarging and showing an example of a state where the connector in the third embodiment is connected to a circuit board by solder. A state where the connector 100 is connected to the land portion 60 of the circuit board by solder 61 is shown. Referring to FIG. 42, the pad portion 32 is located at a position facing the land portion 60, and the land portion 60 and the portion of the metal connection layer 50 formed on the surface of the pad portion 32 are connected by the solder 61 existing therebetween. Also, the solder 61 flows in a liquid state on the surface of the highly wettable metal connection layer 50. The solder 61 flows along the first portion and the second portion of the metal connection layer 50. The solder 61 flowing along the first portion of the metal connection layer 50 flows through the first opening 34 above the metal support layer 10 and also flows through the second opening 38 above the metal support layer 10. Thereby, the solder 61 flowing through the two paths joins above the metal support layer 10. The solder 61 flowing along the second portion of the metal connection layer 50 flows through the first opening 34 above the metal support layer 10.

[0100] As a result, the solder 61 connects the land portion 60 to a portion of the metal connection layer 50 formed on the surface of the pad portion 33. Since the metal connection layer 50 is formed on the end faces of the insulating layer 20 and the metal support layer 10 respectively, the solder 61 connects the land portion 60 to the insulating layer 20 and the metal support layer 10. Further, the solder 61 fixes the connector 100 to the land portion 60 on the surface opposite to the surface connected to the insulating layer 20 of the metal support layer 10. Also, since the solder 61 flowing through the first opening 34 and the second opening 38 joins above the metal support layer 10, the solder 61 surrounds a part of the connector 100. As a result, the connector 100 is firmly connected by the land portion 60.

[0101] 4. Fourth Embodiment In the second to fourth embodiments, an example in which the connector 100 is connected to another circuit board with solder 61 has been shown, but the present invention is not limited to this. When the connector 100 is electrically connected to another circuit board with solder and then or simultaneously fixed with resin by underfill, the openings can be utilized. In this case, since the resin used for underfill reaches the upper surface of the connector 100 through the openings, the area of contact between the connector 100 and the resin becomes larger, so that the connector 100 can be firmly connected to the circuit board. Also, since the resin used for underfill is an insulator, it is not necessary to provide a recess in the metal support layer 10.

[0102] In the connector 100 in the first modification shown in FIG. 22, the opening 36 can be used as an unfillet. In this case, the recess 36A is unnecessary. In the connector 100 in the second modification shown in FIG. 23, the opening 37A can be used as an unfillet. In the connector 100 in the second embodiment shown in FIG. 24, the opening 38 can be used as an unfillet. In this case, the recess 32B is unnecessary. In the connector 100 in the tenth modification shown in FIG. 34, the opening 39 can be used as an unfillet. In the connector 100 in the third embodiment shown in FIG. 39, the openings 36 and 38 can be used as unfillets. In this case, the recess 36A is unnecessary.

[0103] 5. Other Embodiments (1) In the first embodiment, the opening 34 is formed in the pad portion 32, but the opening 34 may be formed in the conductor pattern 31 as long as it is within the mounting region 42.

[0104] (2) The connector 100 in the first embodiment shows an example having the pad portion 32 and the pad portion 33, but it may not have the pad portion 32 or may have the pad portion 33 without having the pad portion 32.

[0105] (3) In the present embodiment, an example in which the shapes of the pad portion 32 and the pad portion 33 are rectangular is shown, but the shape is not limited. Also, examples in which the shapes of the recesses 32A, 32B, 33A, 36A and the openings 34, 36, 36a, 36b, 37A, 38, 39, 39A are rectangular are shown, but the shape is not limited. Those shapes can be any shape such as circular or elliptical.

[0106] 6. Effects In the connector 100 according to this embodiment, a conductor layer 30 having a pad portion 32 as a mounting portion is formed on one surface of the insulating layer 20. Further, a metal support layer 10 having bent portions A1 to A3 or bent portions B1 to B6 is formed on the other surface of the insulating layer 20. By bending the metal support layer 10 along the bent portions A1 to A3 or the bent portions B1 to B6, a connection region 40 is formed.

[0107] According to this configuration, it is possible to manufacture the connector 100 using the manufacturing technology of a wiring circuit board. Therefore, the connection region 40 can be formed in a small size. Further, since the pattern of the conductor layer 30 can be arbitrarily formed by the manufacturing technology of the wiring circuit board, the degree of freedom in arranging the mounting portion is improved. Therefore, even when the connection region 40 is formed in a small size, the mounting portion can be arranged so that no short circuit occurs when the mounting portion is mounted on a circuit board or the like by solder. As a result of these, the connector 100 can be miniaturized.

[0108] Further, the opening formed in the mounting region 42 of the connector 100 penetrates at least the metal support layer 10 and the insulating layer 20. For this reason, when the connector 100 is mounted on a circuit board, the connection material used for connection enters the opening. As a result, the mounting region 42 and the circuit board are connected by the connection material, and the metal support layer 10 and the insulating layer 20 and the circuit board are connected by the connection material that has entered the opening. For this reason, compared with the case where there is no opening, the contact area between the connector 100 and the connection material becomes large, so that the connector 100 can be firmly connected to the circuit board.

[0109] Further, an opening 34 is formed in the pad portion 32, and the opening 34 penetrates the metal support layer 10, the insulating layer 20, and the conductor layer 30. For this reason, when the pad portion 32 is electrically connected to the land portion 60 of the circuit board by solder 61, the pad portion 32 is fixed to the land portion 60 by the solder 61 existing between the pad portion 32 and the land portion 60, and the metal support layer 10 and the insulating layer 20 are fixed to the land portion 60 by the solder 61 that has entered the opening 34. For this reason, the connector 100 can be firmly connected to the circuit board.

[0110] Also, since the pad portion 32 has the opening 34, the land portion 60 can be formed in a flat shape. Therefore, since there is no need to change the shape of the circuit board, the connector 100 can be electrically connected to various circuit boards.

[0111] The connector 100 includes a pad portion 33 disposed at an end of the metal support layer 10, and a metal connection layer 50 that passes through an end face of the insulating layer 20 and extends from the pad portion 33 to the metal support layer 10. When the pad portion 33 is electrically connected to the land portion 60 of the circuit board by the solder 61, the solder 61 covers the metal support layer 10 via the metal connection layer 50. Therefore, the pad portion 33 is fixed to the land portion 60 by the solder between the pad portion 33 and the land portion 60, and the metal support layer 10 and the insulating layer 20 are fixed to the land portion 60 by the solder 61 that covers the metal support layer 10. Therefore, the connector 100 can be strongly connected to the circuit board.

[0112] Also, in a state where the pad portion 32 is electrically connected to the land portion 60 by the solder 61, the pad portion 32 may be electrically connected to the metal support layer 10. Since the recess 32A that surrounds the outside of the opening 34 is formed in the metal support layer 10, the conductor layer 30 can be electrically insulated from the portion outside the recess 32A of the metal support layer 10.

[0113] In the connector 100 according to the first modification, in a state where the conductor patterns 35a and 35b are electrically connected to the circuit board, the conductor patterns 35a and 35b may be electrically connected to the metal support layer 10. In the connector 100 according to the first modification, since the recess 36A that passes between the openings 36a and 36b formed in the conductor patterns 35a and 35b, respectively, and extends from one end to the other end in one direction of the metal support layer 10 is formed in the metal support layer 10, the conductor patterns 35a and 35b can be electrically insulated.

[0114] The connector 100 in the second embodiment has an opening 38 formed in a portion of the mounting region 42 where the conductor layer 30 is not formed, and has a metal connection layer 50 that extends from the pad portion 32 to the metal support layer 10 through the opening 38. When the pad portion 32 is electrically connected to the land portion 60 of the circuit board by the solder 61, the pad portion 32 is fixed to the land portion 60 by the solder between the pad portion 32 and the land portion 60, and since the solder 61 covers the metal connection layer 50, the metal support layer 10 and the insulating layer 20 are fixed to the circuit board by the solder 61 passing through the opening 38. Therefore, the connector 100 can be firmly connected to the circuit board.

[0115] In the connector 100 in the third embodiment, an opening 39 including the pad portion 32 is formed in the mounting region 42. The opening 39 penetrates the metal support layer 10 and the insulating layer 20 but does not penetrate the conductor layer 30. When the pad portion 32 is electrically connected to the land portion 60 of the circuit board by the solder 61, the solder contacts a plurality of surfaces of the pad portion 32. Therefore, the connector 100 can be firmly connected to the circuit board.

[0116] Since the connector 100 in the fourth embodiment has an opening in the mounting region 42, when the connector is fixed to the circuit board by underfill, the resin used in the underfill is guided into the opening. The connector is fixed to the circuit board by the resin between the mounting region 42 of the connector 100 and the circuit board, and the insulating layer and the metal support layer of the connector 100 are fixed to the circuit board by the resin in the opening. Therefore, compared with the case where there is no opening, the contact area between the connector 100 and the resin becomes larger, so the connector 100 can be firmly connected to the circuit board.

[0117] Since the connector unit 1 includes connectors 100A and 100B connected to each other, it is possible to miniaturize the connector unit 1. Thereby, the connector unit 1 can be mounted on a small electronic device such as a mobile device.

[0118] 7. Summary of the Embodiment (Item 1) A connector used for connection with other connection components, an insulating layer, having a mounting portion electrically connected to a circuit board, a conductor layer formed on one surface of the insulating layer, having a bent portion, a metal support layer formed on the other surface of the insulating layer, formed in a mounting area including the mounting portion, and having an opening penetrating at least the metal support layer and the insulating layer, a connector in which a connection area for connection with the other connection components is formed by bending the metal support layer along the bent portion.

[0119] According to this aspect, a conductor layer having a mounting portion electrically connected to a circuit board is formed on one surface of the insulating layer, and a metal support layer having a bent portion is formed on the other surface of the insulating layer. By bending the metal support layer along the bent portion, a connection area is formed. Therefore, it is possible to manufacture the connector using the manufacturing technology of a wiring circuit board. As a result, the connection area can be formed in a small size. As a result of these, the connector can be miniaturized. Further, the opening formed in the mounting area penetrates at least the metal support layer and the insulating layer. Therefore, when the connector is mounted on the circuit board, the connection material used for connection enters the opening. Therefore, the mounting area and the circuit board are connected by the connection material, and the metal support layer and the insulating layer and the circuit board are connected by the connection material that has entered the opening. Therefore, compared with the case where there is no opening, the contact area between the connector and the connection material becomes larger, so that the connector can be firmly connected to the circuit board. As a result of these, it is possible to provide a connector that improves the connection strength with the circuit board while being miniaturized.

[0120] (Item 2) The connector according to Item 1, wherein the opening is formed in the mounting portion and further penetrates the mounting portion.

[0121] According to this aspect, the opening is formed in the mounting portion and penetrates the mounting portion. Therefore, when the mounting portion is electrically connected to the circuit board by solder, the mounting portion is fixed to the circuit board by the solder existing between the mounting portion and the circuit board, and the metal support layer and the insulating layer are fixed to the circuit board by the solder that has entered the opening. Therefore, the connector can be firmly connected to the circuit board.

[0122] (Item 3) The connector according to Item 2, wherein the opening has solder present therein with the mounting portion being connected to the other connection component by solder.

[0123] According to this aspect, since solder is present in the opening with the mounting portion being connected to the other connection component by solder, the portion of the circuit board that is electrically connected to the mounting portion can be made flat. Therefore, since there is no need to change the shape of the circuit board, a connector that can be electrically connected to various circuit boards can be provided.

[0124] (Item 4) The connector according to any one of Items 1 to 3, further comprising a recess formed in the metal support layer and surrounding the outside of the opening.

[0125] According to this aspect, a recess surrounding the outside of the opening is formed in the metal support layer. When the mounting portion is electrically connected to the circuit board, the mounting portion may be electrically connected to the metal support layer. Since a recess surrounding the opening is formed in the metal support layer, the conductor layer can be electrically insulated from the portion outside the recess of the metal support layer.

[0126] (Item 5) The conductor layer includes a plurality of conductor layers, the opening includes a plurality of openings respectively corresponding to the plurality of conductor layers, The connector according to any one of Items 1 to 4, further comprising a recess formed in the metal support layer, passing between two adjacent ones of the plurality of openings, and extending from one end to the other end of the metal support layer in one direction.

[0127] In this aspect, a plurality of openings corresponding to the plurality of conductor layers are formed, and a recess is formed in the metal support layer that passes between two adjacent openings of the plurality of openings and extends from one end to the other end in one direction of the metal support layer. When the mounting portion is electrically connected to the circuit board, the mounting portion may be electrically connected to the metal support layer. Since a recess is formed in the metal support layer that passes between two adjacent openings and extends from one end to the other end in one direction of the metal support layer, each of the plurality of conductor layers can be electrically insulated from the other conductor layers.

[0128] (Item 6) The opening is formed in a portion of the mounting region where the conductor layer is not formed. The connector according to any one of Items 1 to 5, further comprising a metal connection layer that extends from the mounting portion to the metal support layer through the opening.

[0129] In this aspect, a metal connection layer that extends from the mounting portion to the metal support layer is provided through an opening formed in a portion of the mounting region where the conductor layer is not formed. When the mounting portion is electrically connected to the circuit board by solder, the solder between the mounting portion and the circuit board fixes the mounting portion to the circuit board, and since the solder covers the metal connection layer, the metal support layer and the insulating layer are fixed to the circuit board by the solder passing through the opening. Therefore, the connector can be firmly connected to the circuit board.

[0130] (Item 7) The opening is formed in the mounting region. The connector according to any one of Items 1 to 6.

[0131] In this aspect, when the connector is fixed to the circuit board by underfill, the resin used in the underfill is guided into the opening. The connector is fixed to the circuit board by the resin between the mounting region of the connector and the circuit board, and the insulating layer and the metal support layer of the connector are fixed to the circuit board by the resin in the opening. Therefore, compared with the case where there is no opening, the contact area between the connector and the resin increases, so the connector can be firmly connected to the circuit board.

[0132] (Item 8) The connector according to any one of Items 1 to 7, wherein the opening is formed in the mounting portion of the mounting area and does not penetrate the mounting portion.

[0133] According to this aspect, since the opening is formed in the mounting portion and does not penetrate the mounting portion, when the mounting portion is electrically connected to the circuit board by solder, the solder contacts a plurality of surfaces of the mounting portion. Therefore, the connector can be firmly connected to the circuit board.

[0134] (Item 9) A connector used for connection with other connection components, an insulating layer, a mounting portion electrically connected to the circuit board, and a conductor layer formed on one surface of the insulating layer, a metal support layer having a bent portion and formed on the other surface of the insulating layer, and a metal connection layer extending from the mounting portion to the metal support layer through an end face of the insulating layer. The connector, wherein a connection area for connecting with the other connection component is formed by bending the metal support layer along the bent portion.

[0135] According to this aspect, it is possible to manufacture the connector using the manufacturing technology of a wiring circuit board. Therefore, the connection area can be formed in a small size. As a result, the connector can be miniaturized. Further, it includes a metal connection layer extending from the mounting portion to the metal support layer through an end face of the insulating layer. When the mounting portion is electrically connected to the circuit board by solder, the solder covers the metal connection layer. Therefore, the mounting portion is fixed to the circuit board by the solder between the mounting portion and the circuit board, and the metal support layer and the insulating layer are fixed to the circuit board by the solder covering the metal connection layer. Therefore, it is possible to provide a connector that improves the connection strength with the circuit board while being miniaturized.

[0136] (Item 10) A first connector that is the connector according to any one of Items 1 to 9, and a second connector connected to the connection area of the first connector.

Description of Reference Numerals

[0137] 1... connector unit, 2... connector assembly sheet, 2A... sheet, 10... metal support layer, 11... metal pattern, 20... insulating layer, 30... conductor layer, 50... metal connection layer, 31, 31a to 31f, 35, 35a, 35b... conductor patterns, 32, 32a, 32c, 32e, 33, 33b, 33d, 33f... pad portions, 32A, 32B, 33A, 36A... recesses, 34, 36, 36a, 36b, 37A, 38, 39, 39A... openings, 37, 37a, 37b... dummy patterns, 42... mounting area, 60... land portion, 61... solder 40... connection area, 41... contact portion, 100, 100A, 100B... connectors, 101... convex portion, 102... concave portion, 110, 120, 130... masks, 121... slit, 131... pattern opening, A1 to A3, B1 to B6... bent portions, a1 to a3... groove portions.

Claims

1. A connector used for connection with other connection components, comprising an insulating layer, a mounting portion electrically connected to a circuit board, a conductor layer formed on one surface of the insulating layer, a metal support layer having a bent portion and formed on the other surface of the insulating layer, and an opening formed in a mounting area including the mounting portion and penetrating at least the metal support layer and the insulating layer. The connector, wherein a connection area for connection with the other connection components is formed by bending the metal support layer along the bent portion.

2. The connector according to claim 1, wherein the opening is formed in the mounting portion and further penetrates the mounting portion.

3. The connector according to claim 2, wherein the opening has solder present therein when the mounting portion is connected to the other connection component by solder.

4. The connector according to claim 1, further comprising a recess formed in the metal support layer and surrounding the outside of the opening.

5. The conductor layer includes a plurality of conductor layers, the opening includes a plurality of openings respectively corresponding to the plurality of conductor layers, The connector according to claim 1, further comprising a recess formed in the metal support layer, passing between two adjacent ones of the plurality of openings, and extending from one end to the other end of the metal support layer in one direction.

6. The connector according to claim 1, wherein the opening is formed in a portion of the mounting area where the conductor layer is not formed, and further comprising a metal connection layer extending from the mounting portion to the metal support layer through the opening.

7. The connector according to claim 1, wherein the opening is formed in the mounting area.

8. The connector according to claim 1, wherein the opening is formed in the mounting portion of the mounting area and does not penetrate the mounting portion.

9. A connector used for connection with other connection components, comprising an insulating layer, a mounting portion electrically connected to a circuit board, a conductor layer formed on one surface of the insulating layer, a metal support layer having a bent portion and formed on the other surface of the insulating layer, and a metal connection layer extending from the mounting portion to the metal support layer through an end face of the insulating layer. The connector, wherein a connection area for connection with the other connection components is formed by bending the metal support layer along the bent portion.

10. A first connector which is the connector according to any one of claims 1 to 9, A connector unit including a second connector connected to the connection region of the first connector.

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