Method for manufacturing head module
The method secures the inkjet head to the module base through controlled load application and simplified configuration, addressing displacement and complexity issues in existing technologies, ensuring stable operation.
Patent Information
- Application Number
- JP2023214053
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-12-19
- Publication Date
- 2025-07-01
AI Technical Summary
Existing methods for fixing an inkjet head to a module base using clamping screws result in displacement due to torque, and the configuration is complicated by the use of biasing and position adjusting means, leading to potential displacement during operation and increased component count.
A method involving positioning the inkjet head with chuck jaws, applying a downward load to press it against the module base, and fastening screws through the head's through holes into the base's screw holes, simplifying the configuration and ensuring secure fixation.
This method suppresses displacement of the inkjet head relative to the module base, reduces component complexity, and stabilizes the head during operation, even under vibrations, by precise positioning and controlled load application.
Smart Images

Figure 2025097707000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a method for manufacturing a head module including a module base and an inkjet head.
Background Art
[0002] In order to fix an inkjet head to a module base, clamping screws are usually used. On the other hand, due to the torque generated when tightening the clamping screws, displacement of the inkjet head with respect to the module base may occur. In other words, displacement of the inkjet head may occur at the final stage of attaching the inkjet head. Therefore, in the head module described in Patent Document 1, the inkjet head is attached to a module base (referred to as a sub-carriage in Patent Document 1) by the following configuration without using clamping screws.
[0003] The head module is provided with first biasing means for biasing the inkjet head along the Y direction. At a position facing the first biasing means in the head module, first position adjusting means for adjusting the position of the inkjet head toward the first biasing means side is provided. The first position adjusting means clamps the inkjet head in cooperation with the first biasing means.
[0004] The base plate to which the head module is attached is provided with second biasing means for biasing the inkjet head in the X direction by an elastic member. At a position facing the second biasing means in the base plate, second position adjusting means for adjusting the position of the inkjet head along the X direction is provided. The second position adjusting means clamps the inkjet head in cooperation with the second biasing means.
Prior Art Documents
Patent Documents
[0005]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0006] By the way, in the technology described in Patent Document 1, although there is no displacement of the inkjet head with respect to the module base at the final stage of attaching the inkjet head, the inkjet head is not firmly fixed to the module base. Therefore, there is a problem that the inkjet head is displaced due to vibrations or the like that occur during the operation of the inkjet image forming apparatus equipped with the head module.
[0007] Further, in the technology described in Patent Document 1, since the head module includes the first biasing means, the first position adjusting means, the second biasing means, and the second position adjusting means, there is a problem that the number of components of the head module increases and the configuration of the head module becomes complicated.
[0008] Therefore, an object of the present invention is to provide a method for manufacturing a head module that can suppress displacement of an inkjet head with respect to a module base while simplifying the configuration of the head module.
Means for Solving the Problems
[0009] One aspect of the method for manufacturing a head module according to the present invention is a positioning step of positioning the inkjet head with respect to a module base by moving the pair of chuck jaws in the XY direction while holding both ends of the inkjet head with the pair of chuck jaws; a load applying step of pressing the inkjet head against the module base by applying a downward load, which is one side in the Z direction, to each chuck jaw by a load device after the completion of the positioning step; A fastening step of fixing the inkjet head to the module base by fastening a fastening screw inserted through a through hole of the inkjet head to a screw hole of the module base in a state where the inkjet head is pressed against the module base.
Advantages of the Invention
[0010] According to the present invention, while simplifying the configuration of the head module, it is possible to suppress displacement of the inkjet head with respect to the module base.
Brief Description of the Drawings
[0011]
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[0012] Hereinafter, this embodiment will be described with reference to the drawings. In this embodiment, the X direction is one of the horizontal directions and is the longitudinal direction of the module base. The Y direction is the horizontal direction orthogonal to the X direction and is the short-side direction of the module base. The Z direction is the vertical direction (perpendicular direction) orthogonal to the X direction and the Y direction. The θ direction is the direction of rotation around an axis parallel to the Z direction. The XY direction is at least one of the X direction and the Y direction. The XYθ direction is at least one of the X direction, the Y direction, and the θ direction.
[0013] With reference to FIGS. 1 to 3, the configuration of the head module 10 which is the object to be manufactured by the manufacturing method of the head module according to this embodiment will be described. FIG. 1 is a schematic perspective view of the head module 10 according to this embodiment. FIG. 2 is a schematic plan view of the head module 10 according to this embodiment. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2.
[0014] As shown in FIGS. 1 to 3, the head module 10 according to the present embodiment is used in an inkjet image forming apparatus (not shown) that ejects ink toward a recording medium (not shown) to form an image. The head module 10 is attached to a carriage (not shown) in the inkjet image forming apparatus.
[0015] The head module 10 includes a plate-shaped module base 12 that can be attached to the carriage. An opening 12a is formed in the module base 12. Two positioning pins 14 spaced apart in the X direction are formed on the lower surface of the module base 12, and each positioning pin 14 can be engaged with a positioning hole (not shown) formed in the carriage. Two sets of two screw holes 12h spaced apart in the X direction are formed in the module base 12, and the two sets of screw holes 12h are spaced apart in the Y direction. In other words, four screw holes 12h (only two of the screw holes 12h are shown) spaced apart in the X direction and the Y direction are formed in the module base 12.
[0016] The head module 10 includes two inkjet heads 16 provided on the module base 12 and ejecting ink. The bottom side of each inkjet head 16 is disposed within the opening 12a of the module base 12. Each inkjet head 16 has a nozzle portion 18 on its bottom side, and the nozzle portion 18 includes a plurality of nozzles (not shown) for ejecting ink. Each inkjet head 16 has a pair of flange portions 20 protruding in the X direction on its lower end side. The pair of flange portions 20 corresponds to both ends of the inkjet head 16. A concave portion 20d is formed on the end surface of each flange portion 20, and a through hole 20h for inserting a tightening screw 22 is formed at a position of each flange portion 20 that aligns with each screw hole 12h.
[0017] By tightening each fastening screw 22 inserted through the through-hole 20h of each flange portion 20 and fastening it to each screw hole 12h of the module base 12, the inkjet head 16 can be fixed to the module base 12. Further, by interposing a washer 24 such as a spring washer between the head of each fastening screw 22 and the upper surface of each flange portion 20, the inkjet head 16 can be firmly fixed to the module base 12.
[0018] The fastening screw 22 for fixing one flange portion 20 to the module base 12 and the fastening screw 22 for fixing the other flange portion 20 to the module base 12 may be left - hand and right - hand screws with respect to each other. Instead of the head module 10 including two inkjet heads 16, it may include one or three or more inkjet heads 16.
[0019] Subsequently, with reference to FIGS. 3 to 5, the manufacturing equipment 26 used in the manufacturing method of the bed module according to the present embodiment will be described. FIG. 4 is a conceptual front view of the manufacturing equipment 26 according to the present embodiment. FIG. 5 is a conceptual perspective view of a part of the manufacturing equipment 26 according to the present embodiment. FIG. 6 is a schematic perspective view of the chuck mechanism 42 according to the present embodiment. FIG. 7 is a schematic perspective view of the chuck mechanism 42 according to the present embodiment as viewed from below. FIG. 8 is a schematic perspective view of the buffer mechanism 56 according to the present embodiment.
[0020] As shown in FIG. 4, the manufacturing equipment 26 according to the present embodiment includes a pedestal 28 that supports the module base 12. An opening 28a corresponding to the opening 12a of the module base 12 is formed in the pedestal 28. Further, a plurality of pressing members 30 that press the module base 12 toward the pedestal 28 side are provided on the pedestal 28.
[0021] Below the pedestal 28, an imaging unit 32 for imaging the nozzle portion 18 of the inkjet head 16 is provided. The imaging unit 32 includes a first camera 34 that images the nozzles arranged on one end side in the X direction in the nozzle portion 18, and a second camera 36 that images the nozzles arranged on the other end side in the X direction in the nozzle portion 18. The first camera 34 and the second camera 36 are each configured to be movable relative to the pedestal 28 in the Y direction. By moving the first camera 34 and the second camera 36 relative to the pedestal 28 in the Y direction, the nozzle portions 18 of the two inkjet heads 16 can be imaged.
[0022] As shown in FIGS. 4 and 5, an XYθ stage 38 movable in the XYθ directions is provided behind the pedestal 28, which is on one side (rear side) in the Y direction of the pedestal 28, and the XYθ stage 38 has a well-known configuration. A chuck base 40 is provided on the XYθ stage 38, and the planar shape of the chuck base 40 is an inverted U shape.
[0023] As shown in FIGS. 4 to 7, a pair of chuck mechanisms 42 for holding the pair of flange portions 20 of the inkjet head 16 are provided on the chuck base 40, and the pair of chuck mechanisms 42 face each other in the X direction. The pair of chuck mechanisms 42 move in the XYθ directions integrally with the chuck base 40, the XYθ stage 38, and the chuck base 40 by moving the XYθ stage 38 in the XYθ directions. The pair of chuck mechanisms 42 are configured to be movable relative to the chuck base 40 (XYθ stage 38) in the X direction.
[0024] Each chuck mechanism 42 has a chuck claw 44 that holds the end of the flange portion 20 of the inkjet head 16. Each chuck claw 44 has an engaging portion 46 that engages with the recess 20d of the flange portion 20 of the inkjet head 16, and a pressing portion 48 that is located above the engaging portion 46 and presses the upper surface of the flange portion 20 of the inkjet head 16. Each chuck mechanism 42 is immovable in the XY direction with respect to the chuck base 40. Each chuck mechanism 42 incorporates a slide mechanism (not shown) for moving up and down (moving in the Z direction) relative to the chuck base 40 (XYθ stage 38). In other words, each chuck mechanism 42 is configured to be movable up and down (movable in the Z direction) relative to the chuck base 40 (XYθ stage 38).
[0025] As shown in FIG. 4, a movable plate 50 is provided above the pedestal 28 so as to be movable in the Y direction. The movable plate 50 is provided with a pair of load devices 52 that apply a downward load, which is one side in the Z direction, to the chuck claws 44, and the pair of load devices 52 are arranged at a distance from each other in the X direction. Each load device 52 is an actuator such as an electric cylinder, for example, and has a liftable load rod 54. The pair of load devices 52 move in the Y direction integrally with the movable plate 50 when the movable plate 50 moves in the Y direction.
[0026] As shown in FIGS. 4 and 8, a buffer mechanism 56 for buffering the load acting on the XYθ stage 38 is installed on the upper surface of each chuck claw 44. Each buffer mechanism 56 has an annular frame body 58 disposed on the upper surface of each chuck claw 44, and a sphere 60 that is allowed to move in the XY direction inside the frame body 58 and transmits the load from each load device 52 to each chuck claw 44. Each sphere 60 is supported on the upper surface of each chuck claw 44 and can contact the lower surface of each load rod 54.
[0027] Each buffer mechanism 56 has a plurality of guide pipes 62 provided at intervals in the circumferential direction on the frame body 58, and an operating rod 64 movably provided in each guide pipe 62. The plurality of guide pipes 62 are arranged at equal intervals in the circumferential direction of the frame body 58. Each operating rod 64 biases the spherical body 60 toward the center of the frame body 58 by a spring (not shown) built in each guide pipe 62.
[0028] As shown in FIG. 4, the movable plate 50 is provided with a pair of electric drivers 66 for tightening the tightening screw 22, and the pair of electric drivers 66 are spaced apart in the X direction. Each electric driver 66 has a detachable driver bit 68. Each electric driver 66 is configured to be able to move up and down with respect to the movable plate 50. The pair of electric drivers 66 move integrally in the Y direction with the movable plate 50 and the pair of load devices 52 when the movable plate 50 moves in the Y direction.
[0029] Referring to FIG. 9, the control configuration of the equipment device 26 according to the present embodiment will be described. FIG. 9 is a control block diagram of the equipment device 26 according to the present embodiment.
[0030] As shown in FIG. 9, the equipment device 26 includes a control unit 70 that controls an imaging unit 32, an XYθ stage 38, a pair of chuck mechanisms 42, a movable plate 50, a load device 52, an electric driver 66, etc. The control unit 70 plays a role of controlling the entire equipment device 26. The control unit 70 has a CPU (Central Processing Unit) 72, a ROM (Read Only Memory) 74, a RAM (Random Access Memory) 76, and a storage unit 78.
[0031] The CPU 72 comprehensively controls the overall operation of the equipment device 26. The CPU 72 reads out various control programs and setting data stored in the ROM 74, stores them in the RAM 76, and executes the programs to perform various arithmetic processes. The RAM 76 provides a working memory space for the CPU 72 and stores temporary data. Also, when performing various arithmetic processes, the CPU 72 refers to various data stored in the storage unit 78. The storage unit 78 is constituted by, for example, a non-volatile semiconductor memory or a hard disk drive.
[0032] Referring to FIGS. 4, 9, and 10, a method for manufacturing a head module according to the present embodiment will be described. FIG. 10 is a flowchart for explaining the method for manufacturing the head module according to the present embodiment.
[0033] As shown in FIGS. 4 and 10, the method for manufacturing a head module according to the present embodiment is a method for manufacturing a head module 10 including a module base 12 and an inkjet head 16. The method for manufacturing a head module according to the present embodiment includes a setting step, a positioning step, a load application step, a load release step, a fastening step, and a repetition step. And the specific contents of each step in the method for manufacturing a head module according to the present embodiment are as follows.
[0034] (Setting step) As shown in FIGS. 4 and 10, each positioning pin 14 of the module base 12 is brought into contact with a predetermined portion on the inner wall surface of the opening 28a of the pedestal 28, and the module base 12 on which two inkjet heads 16 are placed is positioned on the pedestal 28. Then, the module base 12 is fixed to the pedestal 28 by pressing the module base 12 toward the pedestal 28 with a plurality of pressing members 30 (step S101 in FIG. 10). Thereby, the module base 12 on which two inkjet heads 16 are placed can be set on the pedestal 28.
[0035] (Positioning step) After the completion of the setting process, as shown in FIGS. 4, 9, and 10, the control unit 70 controls the imaging unit 32 to image the nozzles of the nozzle portion 18 of the inkjet head 16 by the first camera 34 and the second camera 36 (step S102 in FIG. 10). Next, the control unit 70 calculates the amount of displacement of the inkjet head 16 with respect to the normal position (normal mounting position) on the module base 12 based on the captured images acquired from the first camera 34 and the second camera 36 (step S103 in FIG. 10). Then, the control unit 70 controls the pair of chuck mechanisms 42 to hold both ends of the flange portion 20 of the inkjet head 16 by the pair of chuck claws 44. Further, the control unit 70 moves the XYθ stage 38 in the XYθ direction to move the pair of chuck claws 44 in the XY direction (XYθ direction) to position the inkjet head 16 with respect to the module base 12 (step S104 in FIG. 10).
[0036] (Load application process) After the completion of the positioning process, as shown in FIGS. 4, 9, and 10, the control unit 70 controls the pair of load devices 52 to apply a downward load to each chuck claw 44 by each load device 52 with the buffer mechanism 56 installed on the upper surface of each chuck claw 44 (step S105 in FIG. 10). Thereby, while relatively lowering each chuck mechanism 42 (each chuck claw 44) with respect to the XYθ stage 38, the inkjet head 16 is pressed against the module base 12.
[0037] Thereafter, the control unit 70 controls the imaging unit 32 to image the nozzles of the nozzle portion 18 of the inkjet head 16 by the first camera 34 and the second camera 36 (step S106 in FIG. 10). Next, the control unit 70 calculates the amount of displacement of the inkjet head 16 with respect to the normal position on the module base 12 based on the captured images acquired from the first camera 34 and the second camera 36 (step S107 in FIG. 10). Then, the control unit 70 determines whether or not the amount of displacement of the inkjet head 16 is within a preset allowable range (step S108 in FIG. 10).
[0038] (Load Release Process) As shown in FIGS. 9 and 10, when the amount of displacement of the inkjet head 16 exceeds the allowable range (in the case of NO in step S108 of FIG. 10), the control unit 70 stops driving each load device 52, thereby releasing the downward load on each chuck claw 44 (step S109 in FIG. 10). As a result, the inkjet head 16 is made movable with respect to the module base 12. In this case, the control unit 70 returns the process to step S104 and executes the positioning process and the load application process again.
[0039] (Fastening Process) As shown in FIGS. 4, 9, and 10, when the amount of displacement of the inkjet head 16 is within the allowable range (in the case of YES in step S108 of FIG. 10), the control unit 70 controls the pair of electric drivers 66 to lower the electric drivers 66 with respect to the movable plate 50 while rotating the driver bits 68. Then, with the inkjet head 16 pressed against the module base 12, each fastening screw 22 inserted through each through hole 16h of the inkjet head 16 can be fastened to each screw hole 12h of the module base 12 by the electric drivers 66 (step S110 in FIG. 10). As a result, the inkjet head 16 can be fixed to the module base 12 (step S111 in FIG. 10).
[0040] (Repeating Process) After the fastening process is completed, as shown in FIGS. 9 and 10, the control unit 70 determines whether there is another inkjet head 16 to be fixed to the module base 12 (step S112 in FIG. 10). If there is another inkjet head 16 (YES in step S112 in FIG. 10), the control unit 70 returns the process to step 102 in FIG. 10 and repeats the processes after step S102. Thereby, the other inkjet head 16 can be fixed to the module base 12. When repeating the processes after step S102, the control unit 70 moves the movable plate 50 in the Y direction to position the pair of load devices 52 and the pair of electric drivers 66 at positions corresponding to the other inkjet head 16.
[0041] On the other hand, if there is no other inkjet head 16 (NO in step S112 in FIG. 10), a series of processes in the manufacturing method of the head module are terminated.
[0042] According to the configuration of the manufacturing method of the head module according to the present embodiment, with the inkjet head 16 pressed against the module base 12, each fastening screw 22 is fastened to each screw hole 12h of the module base 12. Therefore, even if a large torque is generated when fastening the fastening screw 22, displacement of the inkjet head 16 with respect to the module base 12 can be suppressed.
[0043] Further, by fastening each fastening screw 22 to each screw hole 12h of the module base 12, the inkjet head 16 is fixed to the module base 12. Therefore, even if vibrations or the like occur during the operation of the inkjet image forming apparatus, displacement of the inkjet head 16 with respect to the module base 12 can be suppressed.
[0044] Furthermore, the head module 10 does not require a configuration corresponding to the first biasing means and the first position adjusting means in the technology described in Patent Document 1. Therefore, the components of the head module 10 can be reduced, and the configuration of the head module 10 can be simplified.
[0045] That is, according to the manufacturing method of the head module according to the present embodiment, while simplifying the configuration of the head module 10, it is possible to suppress the displacement of the inkjet head 16 with respect to the module base 12.
[0046] According to the configuration of the manufacturing method of the head module according to the present embodiment, by moving the XYθ stage 38 in the XYθ directions, the pair of chuck jaws 44 are moved in the XY directions. Therefore, according to the manufacturing method of the head module according to the present embodiment, the inkjet head 16 can be positioned with high precision with respect to the module base 12.
[0047] According to the configuration of the manufacturing method of the head module according to the present embodiment, when applying a downward load to each chuck jaw 44 by the load device 52, each chuck mechanism 42 is relatively lowered with respect to the XYθ stage 38. Therefore, according to the manufacturing method of the head module according to the present embodiment, it is possible to suppress the downward load by the load device 52 from acting on the XYθ stage 38 and improve the operation stability of the XYθ stage 38.
[0048] According to the configuration of the manufacturing method of the head module according to the present embodiment, after applying a downward load to each chuck jaw 44, if the displacement amount of the inkjet head 16 exceeds the allowable range, the downward load on each chuck jaw 44 is released. Then, the control unit 70 re-executes the positioning process and the load application process. Therefore, the positioning of the inkjet head 16 is repeatedly performed until the displacement amount of the inkjet head 16 is within the allowable range. Thereby, according to the manufacturing method of the head module according to the present embodiment, it is possible to further suppress the displacement of the inkjet head 16 with respect to the module base 12.
[0049] According to the configuration of the manufacturing method of the head module according to the present embodiment, while the buffer mechanism 56 is installed on the upper surface of each chuck jaw 44, a downward load is applied to each chuck jaw 44 by each load device 52. Therefore, the buffer mechanism 56 can relieve the load acting in the XY direction from each load device 52, and only a downward load can be applied to each chuck jaw 44, and the distortion of the manufacturing facility 26 when a downward load is applied to each chuck jaw 44 can be suppressed. As a result, according to the manufacturing method of the head module according to the present embodiment, the displacement of the inkjet head 16 with respect to the suppression module base 12 due to the distortion of the manufacturing facility 26 when a downward load is applied to each chuck jaw 44 can be further suppressed.
[0050] According to the configuration of the manufacturing method of the head module according to the present embodiment, the tightening screw 22 for fixing one flange portion 20 to the module base 12 and the tightening screw 22 for fixing the other flange portion 20 to the module base 12 are reverse threads. Therefore, according to the manufacturing method of the head module according to the present embodiment, the tightening screw 22 is difficult to loosen, and the displacement of the inkjet head 16 with respect to the module base 12 can be stably suppressed.
[0051] Although the present embodiment has been specifically described above, the present invention is not limited to the specific embodiments described above. Various modifications and changes can be made to the specific examples described in the above embodiments within the scope of the gist of the present invention described in the claims.
Industrial Applicability
[0052] The present invention is useful as a manufacturing method of a head module capable of suppressing the displacement of an inkjet head with respect to a module base.
Examples
[0053] Referring to FIGS. 11 to 15, the embodiments will be described. FIG. 11 is a table showing the variation state of the misalignment of the inkjet head in the cases of Embodiments 1 to 3 and Comparative Example 1. FIG. 12 is a histogram showing the relationship between the misalignment amount and the frequency of the inkjet head in the case of Embodiment 1. FIG. 13 is a histogram showing the relationship between the misalignment amount and the frequency of the inkjet head in the case of Embodiment 2. FIG. 14 is a histogram showing the relationship between the misalignment amount and the frequency of the inkjet head in the case of Embodiment 3. FIG. 15 is a histogram showing the relationship between the misalignment amount and the frequency of the inkjet head in the case of the comparative example.
[0054] As shown in FIG. 11, while changing the downward load applied to each chuck claw, the mounting operation of the head module by tightening the fastening screw was performed 40 times, and the misalignment amount of the inkjet head with respect to the normal position on the module base was measured. Specifically, in the case of Embodiment 1, a load of 3 kg was applied to each chuck claw, and the mounting operation of the head module by tightening the fastening screw was performed 40 times to measure the misalignment amount of the inkjet head. In the case of Embodiment 2, a load of 10 kg was applied to each chuck claw, and the mounting operation of the head module by tightening the fastening screw was performed 40 times to measure the misalignment amount of the inkjet head. In the case of Embodiment 3, a load of 30 kg was applied to each chuck claw, and the mounting operation of the head module by tightening the fastening screw was performed 40 times to measure the misalignment amount of the inkjet head. In the case of the comparative example, the mounting operation of the head module by tightening the fastening screw was performed 40 times without applying a load to each chuck claw, and the misalignment amount of the inkjet head was measured.
[0055] As shown in FIGS. 11 and 12, in the case of Example 1, it was confirmed that by applying a load of 3 kg to each chuck jaw, the variation in the misalignment of the inkjet head could be reduced to an acceptable level. As shown in FIGS. 11 and 13, in the case of Example 2, it was confirmed that by applying a load of 10 kg to each chuck jaw, the variation in the misalignment of the inkjet head could be further reduced. As shown in FIGS. 11 and 14, in the case of Example 3, it was confirmed that by applying a load of 30 kg to each chuck jaw, the variation in the misalignment of the inkjet head could be substantially eliminated.
[0056] On the other hand, as shown in FIGS. 11 and 15, in the case of the comparative example, since no load was applied to each chuck jaw, it was confirmed that the variation in the misalignment of the inkjet head greatly exceeded the acceptable level, resulting in a defective mounting of the inkjet head.
[0057] That is, it was found that by applying an appropriate load to each chuck jaw, the variation in the misalignment of the inkjet head could be reduced, and the misalignment of the inkjet head could be suppressed.
Explanation of Signs
[0058] 10 Head module 12 Module base 12a Opening 12h Screw hole 14 Positioning pin 16 Inkjet head 18 Nozzle part 20 Flange part 20d Concave part 20h Through hole 22 Tightening screw 24 Spring washer 26 Equipment device 28 Pedestal 28a Opening 30 Pressing member 32 Imaging unit 34 First camera 36 Second camera 38 XYθ Stage 40 Chuck Base 42 Chuck Mechanism 44 Chuck Claw 46 Engagement Part 48 Pressing Part 50 Movable Plate 52 Load Device 54 Load Rod 56 Buffer Mechanism 58 Frame 60 Sphere 62 Guide Pipe 64 Actuating Rod 66 Electric Driver 68 Driver Bit 70 Control Unit 72 CPU 74 ROM 76 RAM 78 Memory Unit
Claims
1. A positioning step of positioning the inkjet head with respect to the module base by moving the pair of chuck jaws in the XY direction while holding both ends of the inkjet head with the pair of chuck jaws; A load applying step of pressing the inkjet head against the module base by applying a downward load, which is one side in the Z direction, to each chuck jaw by a load device after the positioning step is completed; A fastening step of fastening the inkjet head to the module base by fastening a fastening screw inserted through a through hole of the inkjet head to a screw hole of the module base while the inkjet head is pressed against the module base, comprising: A method for manufacturing a head module.
2. In the positioning step, the pair of chuck jaws provided on the XYθ stage is moved in the XY direction by moving the XYθ stage in the XYθ directions to position the inkjet head with respect to the module base. The method for manufacturing a head module according to Claim 1.
3. In the load applying step, the inkjet head is pressed against the module base while relatively lowering each chuck jaw with respect to the XYθ stage by applying a downward load to each chuck jaw by the load device. The method for manufacturing a head module according to Claim 2.
4. After the load applying step is completed and before the fastening step is started, when the amount of displacement of the inkjet head with respect to the normal position on the module base exceeds a preset allowable range, the driving of the load device is stopped, the downward load on each chuck jaw is released, and a load releasing step of making the inkjet head movable with respect to the module base is further provided. After the load releasing step is completed, the positioning step and the load applying step are executed again. The method for manufacturing a head module according to Claim 1.
5. In the load applying step, a buffer mechanism including a frame body disposed on the upper surface of each chuck jaw and a sphere that is allowed to move in the XY directions inside the frame body and transmits the load from the load device to each chuck jaw is used, and the buffer mechanism is installed on the upper surface of each chuck jaw, and a downward load is applied to each chuck jaw by the load device. The manufacturing method of the head module according to claim 1.
6. Each buffer device further includes a plurality of guide pipes provided at intervals in the circumferential direction on the frame body, and an operating rod movably provided in each guide pipe and biasing the spherical body toward the center of the frame body. The manufacturing method of the head module according to claim 5.
7. The fastening screws for fixing one end of the inkjet head to the module base and the fastening screws for fixing the other end of the inkjet head to the module base are reverse threads of each other. The manufacturing method of the head module according to claim 1.
Citation Information
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