Multilayer electronic component

Abstract

To provide a multilayer electronic component that improves the moisture resistance reliability of a multilayer electronic component by complementing the interface structure between the main body and the side margin and preventing the penetration of moisture from the outside.SOLUTION: In a multilayer electronic component including first and second side margin portions, the first and second side margin portions include first extension portions 114-2, 115-2, and when the widthwise size of the first extension portion at the center in the second direction is WM1 and the widthwise size of the first extension portion at the end portion in the second direction is WC1, WM1<WC1 is satisfied.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-type capacitor that is mounted on printed circuit boards of various electronic products such as video devices like liquid crystal display (LCD) devices and plasma display panel (PDP) panels, computers, smartphones, and mobile phones, and plays a role in charging or discharging electricity.

[0003] Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and being easy to mount. As various electronic devices such as computers and mobile devices are miniaturized and have increased output power, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] In order to miniaturize and increase the capacitance of a multilayer ceramic capacitor, it is required to maximize the effective area of the electrodes (by increasing the effective volume fraction necessary for realizing capacitance). In order to realize such a small and high-capacitance multilayer ceramic capacitor, when manufacturing the multilayer ceramic capacitor, the internal electrodes are exposed in the width direction of the main body, and the area of the internal electrodes in the width direction is maximized by a design without a margin. After manufacturing such a main body and before firing, a method is applied in which a ceramic green sheet for a side margin portion is separately attached to the electrode exposed surface in the width direction of the main body and then sintered.

[0005] By forming the side margin portion by a method of separately attaching a ceramic green sheet for the side margin portion, the capacitance per unit volume of the capacitor can be improved. However, due to the penetration of moisture from the outside through the interface bonding portion between the main body and the side margin portion or the penetration of the plating solution during the plating process, problems such as a shortened chip life or the occurrence of defects may occur.

[0006] In addition, electric field concentration may occur due to pores generated at the interface where the main body and the side margin portion are in contact, which may cause a problem that the breakdown voltage (BDV) decreases. There is a possibility that the moisture resistance reliability decreases due to the decrease in the sintering density caused by the pores. Due to the occurrence of an interface bonding portion at the boundary between the main body and the side margin portion, there is a possibility that the bonding force decreases and the moisture resistance reliability decreases accordingly.

[0007] Therefore, in ultra-small and high-capacity products, a design that can prevent a decrease in the breakdown voltage (BDV) and a decrease in moisture resistance reliability is required.

Prior Art Documents

Patent Documents

[0008]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0009] One of the several problems to be solved by the present invention is to provide a laminated electronic component with improved moisture resistance reliability by complementing the interface structure between the main body and the side margin portion and preventing the penetration of moisture from the outside.

[0010] One of the problems to be solved by the present invention is to improve the bonding strength between the main body and the side margin portion and prevent the occurrence of interfacial peeling or interfacial lifting of the side margin portion.

[0011] However, several problems to be solved by the present invention are not limited to the above-described content and can be more easily understood in the process of describing specific embodiments of the present invention.

Means for Solving the Problems

[0012] A laminated electronic component according to an embodiment of the present invention includes a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and facing each other in a third direction, a main body, a first external electrode and a second external electrode respectively arranged on the third surface and the fourth surface, and a first side margin portion and a second side margin portion respectively arranged on the fifth surface and the sixth surface. The first side margin portion and the second side margin portion include a first extension portion extending and arranged on a part of the first surface and the second surface. When the size in the third direction at the central portion in the second direction of the first extension portion is WM1 and the size in the third direction at the end portion in the second direction of the first extension portion is WC1, WM1 < WC1 can be satisfied.

[0013] A multilayer electronic component according to another embodiment of the present invention includes a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and facing each other in a third direction. The multilayer electronic component further includes a main body, a first external electrode and a second external electrode respectively arranged on the third surface and the fourth surface, and a first side margin portion and a second side margin portion respectively arranged on the fifth surface and the sixth surface. The first side margin portion and the second side margin portion include a second extension portion extending and arranged on a part of the third surface and the fourth surface. When the size in the third direction at the central portion in the first direction of the second extension portion is WM2 and the size in the third direction at the end portion in the first direction of the second extension portion is WC2, WM2 < WC2 can be satisfied.

Advantages of the Invention

[0014] One of the several advantages of the present invention is to improve the moisture resistance reliability of the multilayer electronic component by complementing the interface structure between the main body and the side margin portion and preventing the penetration of moisture from the outside.

[0015] One of the several advantages of the present invention is to improve the bonding force between the main body and the side margin portion and prevent the occurrence of interface peeling or interface lifting of the side margin portion.

[0016] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0017]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0018] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shapes and sizes of the elements in the drawings can be exaggerated for a clearer explanation, and the elements denoted by the same reference numerals in the drawings are the same elements.

[0019] And, in order to clearly explain the present invention in the drawings, parts not related to the explanation are omitted, and the sizes and thicknesses of each configuration shown in the drawings are arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited to what is shown in the drawings. Note that components having the same function within the scope of the same concept are described using the same reference numerals. Further, throughout the specification, when a certain part says that a certain component "includes", this means that, unless otherwise stated to the contrary, it does not exclude other components, but may further include other components.

[0020] In the figure, the first direction can be defined as the stacking direction or the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0021] Multilayer electronic component FIG. 1 schematically shows a perspective view of a multilayer electronic component according to an embodiment of the present invention. FIG. 2 shows a perspective view of the multilayer electronic component of FIG. 1 excluding external electrodes. FIG. 3 schematically shows a perspective view of the multilayer electronic component of FIG. 1 excluding external electrodes and side margin portions. FIG. 4 schematically shows a cross-sectional view taken along the line I-I' of FIG. 1. FIG. 5 schematically shows a plan view of FIG. 2 (viewed from above in the first direction). FIG. 6 schematically shows a side view of FIG. 2 (viewed from the left side in the second direction).

[0022] Hereinafter, with reference to FIGS. 1 to 6, a multilayer electronic component according to an embodiment of the present invention will be described in detail. However, although a multilayer ceramic capacitor will be described as an example of the multilayer electronic component, the present invention can also be applied to various electronic products using a dielectric composition, such as inductors, piezoelectric elements, varistors, or thermistors.

[0023] A multilayer electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction, a first surface 1 and a second surface 2 facing each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and facing each other in a third direction. The multilayer electronic component 100 also includes a main body 110, a first external electrode 131 and a second external electrode 132 respectively arranged on the third surface 3 and the fourth surface 4, and a first side margin portion 114 and a second side margin portion 115 respectively arranged on the fifth surface 5 and the sixth surface 6. The first side margin portion 114 and the second side margin portion 115 include first extension portions 114-1, 114-2, 115-1, and 115-2 extending to a part of the first surface and the second surface. When the size in the third direction at the central portion in the second direction of the first extension portions 114-1, 114-2, 115-1, and 115-2 is WM1, and the size in the third direction at the end portion in the second direction of the first extension portions 114-1, 114-2, 115-1, and 115-2 is WC1, WM1 < WC1 can be satisfied.

[0024] The main body 110 may have a dielectric layer 111 and internal electrodes 121 and 122 alternately laminated thereon.

[0025] More specifically, the main body 110 may include a capacitance forming portion Ac that is disposed inside the main body 110 and forms capacitance by including a first internal electrode 121 and a second internal electrode 122 that are alternately disposed so as to face each other with the dielectric layer 111 interposed therebetween.

[0026] There is no particular limitation on the specific shape of the main body 110. As shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic particles contained in the main body 110 during the firing process, the main body 110 does not have a perfect hexahedron shape with straight lines, but can substantially have a hexahedron shape.

[0027] The main body 110 can have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and face each other in a third direction.

[0028] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated to such an extent that it is difficult to confirm without using a Scanning Electron Microscope (SEM).

[0029] The raw material for forming the dielectric layer 111 is not limited as long as sufficient capacitance can be obtained. Generally, perovskite (ABO3) - based materials can be used. For example, barium titanate - based materials, lead - composite perovskite - based materials, or strontium titanate - based materials can be used. The barium titanate - based material can include BaTiO3 - based ceramic particles. As examples of the ceramic particles, BaTiO3, BaTiO3 in which Ca (calcium), Zr (zirconium), etc. are partially solid - solved (Ba 1-x Ca x)TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3(0 < y < 1), etc. can be mentioned.

[0030] Also, as raw materials for forming the dielectric layer 111, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to particles such as barium titanate (BaTiO3) according to the object of the present invention.

[0031] The thickness td of the dielectric layer 111 does not need to be particularly limited.

[0032] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness of the dielectric layer 111 may be 1.0 μm or less, preferably 0.6 μm or less, and more preferably 0.4 μm or less.

[0033] Here, the thickness td of the dielectric layer 111 can mean the thickness td of the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122.

[0034] On the other hand, the thickness td of the dielectric layer 111 can mean the size of the dielectric layer 111 in the first direction. Also, the thickness td of the dielectric layer 111 can mean the average thickness td of the dielectric layer 111, and can mean the average size of the dielectric layer 111 in the first direction.

[0035] The average size of the dielectric layer 111 in the first direction can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average size of one dielectric layer 111 in the first direction can mean the average value calculated by measuring the size of one dielectric layer 111 in the first direction at 30 equally spaced points in the second direction in the scanned image. The 30 equally spaced points can be specified in the capacitance forming portion Ac. Also, when the measurement of such an average value is extended to 10 dielectric layers 111 to measure the average value, the average size of the dielectric layer 111 in the first direction can be further generalized.

[0036] The internal electrodes 121 and 122 may be alternately laminated with the dielectric layer 111.

[0037] The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be respectively exposed on the third surface 3 and the fourth surface 4 of the main body 110.

[0038] More specifically, the first internal electrode 121 can be separated from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed through the fourth surface 4. A first external electrode 131 can be arranged on the third surface 3 of the main body 110 and connected to the first internal electrode 121, and a second external electrode 132 can be arranged on the fourth surface 4 of the main body 110 and connected to the second internal electrode 122.

[0039] That is, the first internal electrode 121 can be connected to the first external electrode 131 and not connected to the second external electrode 132, and the second internal electrode 122 can be connected to the second external electrode 132 and not connected to the first external electrode 131. At this time, the first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 arranged in the middle.

[0040] On the one hand, the main body 110 can be formed by alternately laminating a ceramic green sheet printed with a first internal electrode 121 and a ceramic green sheet printed with a second internal electrode 122, and then firing them.

[0041] The materials for forming the internal electrodes 121 and 122 are not particularly limited, and materials with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0042] Also, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet. As the printing method of the conductive paste for internal electrodes, a screen printing method or a gravure printing method can be used, etc., but the present invention is not limited thereto.

[0043] On the other hand, the thickness te of the internal electrodes 121 and 122 does not need to be particularly limited.

[0044] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness of the internal electrodes 121 and 122 may be 1.0 μm or less, preferably 0.6 μm or less, and more preferably 0.4 μm or less.

[0045] Here, the thickness te of the internal electrodes 121 and 122 can mean the size of the internal electrodes 121 and 122 in the first direction. Also, the thickness te of the internal electrodes 121 and 122 can mean the average thickness te of the internal electrodes 121 and 122, and can mean the average size of the internal electrodes 121 and 122 in the first direction.

[0046] The average size of the internal electrodes 121 and 122 in the first direction can be measured by scanning an image of the cross-section of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average size of one internal electrode in the first direction can be the average value calculated by measuring the size of one internal electrode in the first direction at 30 equally spaced points in the second direction in the scanned image. The 30 equally spaced points can be specified in the capacitance forming portion Ac. Also, when such measurement of the average value is extended to 10 internal electrodes 121 and 122 to measure the average value, the average size of the internal electrodes 121 and 122 in the first direction can be further generalized.

[0047] On the other hand, the main body 110 can include cover portions 112 and 113 disposed on both end-surfaces of the capacitance forming portion Ac in the first direction.

[0048] Specifically, it can include a first cover portion 112 disposed on one surface of the capacitance forming portion Ac in the first direction and a second cover portion 113 disposed on the other surface of the capacitance forming portion Ac in the first direction. More specifically, it can include an upper cover portion 112 disposed above the capacitance forming portion Ac in the first direction and a lower cover portion 113 disposed below the capacitance forming portion Ac in the first direction.

[0049] The upper cover portion 112 and the lower cover portion 113 can be formed by laminating a single dielectric layer 111 or two or more dielectric layers 111 in the first direction on the upper and lower surfaces of the capacitance forming portion Ac, and can basically play a role of preventing damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0050] The upper cover portion 112 and the lower cover portion 113 do not include the internal electrodes 121 and 122 and can include the same material as the dielectric layer 111. That is, the upper cover portion 112 and the lower cover portion 113 can include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0051] On the other hand, the thickness tc of the cover portions 112 and 113 does not need to be particularly limited.

[0052] However, in order to more easily achieve miniaturization and high capacity of the stacked electronic component, the thickness tc of the cover portions 112 and 113 may be 100 μm or less, preferably 30 μm or less, and in the case of an ultra-small product, more preferably 20 μm or less.

[0053] Here, the thickness tc of the cover portions 112 and 113 can mean the size of the cover portions 112 and 113 in the first direction. Further, the thickness tc of the cover portions 112 and 113 can mean the average thickness tc of the cover portions 112 and 113, and can mean the average size of the cover portions 112 and 113 in the first direction.

[0054] The average size of the cover portions 112 and 113 in the first direction can be measured by scanning an image of the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, in an image obtained by scanning one cover portion, it can be the average value calculated by measuring the sizes in the first direction at 30 points equally spaced in the second direction.

[0055] Note that the average size of the cover portion in the first direction measured by the above-described method can have substantially the same size as the average size of the cover portion in the first direction in the cross-sections of the main body 110 in the first and third directions.

[0056] On the other hand, side margin portions 114 and 115 can be arranged on both end-surfaces of the main body 110 in the third direction.

[0057] More specifically, the side margin portions 114 and 115 can include a first side margin portion 114 disposed on the fifth surface 5 of the main body 110 and a second side margin portion 115 disposed on the sixth surface 6. That is, the side margin portions 114 and 115 may be disposed on both end - surfaces in the third direction of the main body 110.

[0058] As shown in the figure, the side margin portions 114 and 115 can mean the regions between the boundaries of both ends in the third direction of the first internal electrode 121 and the second internal electrode 122 and the main body 110, based on the cross - sections of the main body 110 in the first and third directions.

[0059] The side margin portions 114 and 115 can basically play a role in preventing damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0060] For the side margin portions 114 and 115, except for the locations where the side margin portions 114 and 115 are formed on the ceramic green sheet, a conductive paste is applied to form the internal electrodes 121 and 122. In order to suppress the step difference caused by the internal electrodes 121 and 122, after cutting so that the internal electrodes 121 and 122 after lamination are exposed on the fifth surface 5 and the sixth surface 6 of the main body 110, a single dielectric layer 111 or two or more dielectric layers 111 can be laminated in the third direction on both end - surfaces in the third direction of the capacitance forming portion Ac.

[0061] The first side margin portion 114 and the second side margin portion 115 do not include the internal electrodes 121 and 122 and can include the same material as the dielectric layer 111. That is, the first side margin portion 114 and the second side margin portion 115 can include a ceramic material, for example, a barium titanate (BaTiO3) - based ceramic material.

[0062] On the other hand, the width WM0 of the first side margin portion 114 and the second side margin portion 115 does not need to be particularly limited.

[0063] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the width WM0 of the first side margin portion 114 and the second side margin portion 115 may be 100 μm or less, preferably 30 μm or less, and in the case of ultra-small products, more preferably 20 μm or less.

[0064] Here, the width WM0 of the side margin portions 114 and 115 can mean the size in the third direction of each of the side margin portions 114 and 115. Also, the width WM0 of the side margin portions 114 and 115 can mean the average width WM0 of the side margin portions 114 and 115, and can mean the average size in the third direction of the side margin portions 114 and 115.

[0065] The average size in the third direction of the side margin portions 114 and 115 can be measured by scanning an image of the cross-section of the main body 110 in the first and third directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, in an image obtained by scanning one side margin portion, it can mean the average value calculated by measuring the size in the third direction at 10 equally spaced points in the first direction.

[0066] On the other hand, for miniaturization and high capacitance of the multilayer ceramic capacitor, maximization of the effective electrode area (increasing the effective volume fraction required for capacitance realization) is required. In order to realize the above-mentioned miniaturized and high-capacitance multilayer ceramic capacitor, when manufacturing the multilayer ceramic capacitor, by exposing the internal electrode in the width direction of the main body, the area in the width direction of the internal electrode is maximized by a design without a margin, and after manufacturing such a main body and before firing, a method is applied in which a ceramic green sheet for the side margin portion is separately attached to the electrode exposed surface in the width direction of the main body and then sintered.

[0067] By forming the side margin portion by a method of separately attaching a ceramic green sheet for the side margin portion, the capacitance per unit volume of the capacitor can be increased. However, due to the penetration of moisture from the outside or the penetration of the plating solution during the plating process through the interface joint portion between the main body and the side margin portion, there may be problems such as a shortened chip life or the occurrence of defects.

[0068] In addition, electric field concentration may occur due to pores generated at the interface where the main body and the side margin portion come into contact, which may cause a problem that the breakdown voltage (BDV) decreases. There may be a possibility that the moisture resistance reliability decreases due to the decrease in the sintering density caused by the pores. When an interface joint portion is generated at the boundary between the main body and the side margin portion, there may be a decrease in the bonding force and thus a decrease in the moisture resistance reliability.

[0069] The present invention can improve the above-mentioned problems by blocking or distancing the penetration paths of moisture and plating solution from the outside that can penetrate through the interface joint portion formed at the boundary between the main body and the side margin portion by extending and arranging the side margin portion longer than the conventional side margin portion so as to cover the main body.

[0070] Therefore, in the laminated electronic component 100 according to an embodiment of the present invention, the first side margin portion 114 and the second side margin portion 115 can include first extension portions 114-1, 114-2, 115-1, 115-2 that extend and are arranged on a part of the first surface 1 and the second surface 2.

[0071] That is, the first side margin portion 114 can include first extension portions 114-1 and 114-2 disposed on a part of the first surface 1 and the second surface 2. Specifically, the first extension portions 114-1 and 114-2 of the first side margin portion can include a second-1 extension portion 114-1 disposed on a part of the first surface 1 and a second-2 extension portion 114-2 disposed on a part of the second surface 2. The second side margin portion 115 can include first extension portions 115-1 and 115-2 disposed on a part of the first surface 1 and the second surface 2. Specifically, the first extension portions 115-1 and 115-2 of the second side margin portion can include a first-1 extension portion 115-1 disposed on a part of the first surface 1 and a first-2 extension portion 115-2 disposed on a part of the second surface 2.

[0072] More specifically, the first side margin portion 114 can include a main portion 114-0 disposed on the fifth surface 5, a first-1 extension portion 114-1 extending and disposed on a part of the first surface 1, and a first-2 extension portion 114-2 extending and disposed on a part of the second surface 2. The second side margin portion 115 can include a main portion 115-0 disposed on the sixth surface 6, a first-1 extension portion 115-1 extending and disposed on a part of the first surface 1, and a first-2 extension portion 115-2 extending and disposed on a part of the second surface 2.

[0073] In the present invention, unless otherwise specified, the description regarding the first extension portions 114-1 and 114-2 of the first side margin portion is equally applicable to the first-1 extension portion 114-1 disposed on a part of the first surface 1 and the first-2 extension portion 114-2 disposed on a part of the second surface 2. The description regarding the first extension portions 115-1 and 115-2 of the second side margin portion is equally applicable to the first-1 extension portion 115-1 disposed on a part of the first surface 1 and the first-2 extension portion 115-2 disposed on a part of the second surface 2.

[0074] By including the first extension portions 114-1, 114-2, 115-1, and 115-2 in which the first side margin portion 114 and the second side margin portion 115 extend and are disposed on a part of the first surface 1 and the second surface 2 of the main body, the penetration of moisture and plating solution from the outside can be effectively prevented, and the moisture resistance reliability can be improved.

[0075] At this time, when the size in the third direction at the central part in the second direction of the first extension parts 114-1, 114-2, 115-1, 115-2 is WM1 and the size in the third direction at the end part in the second direction of the first extension parts 114-1, 114-2, 115-1, 115-2 is WC1, WM1 < WC1 can be satisfied.

[0076] Since the first extension parts 114-1, 114-2, 115-1, 115-2 satisfy WM1 < WC1, the interfacial adhesive force between the main body 110 and the side margin parts 114, 115 can be excellent. In particular, the penetration of moisture from the outside can be more suppressed in the corner part of the main body 110 where moisture penetration is easy, for example, in the region where the main body 110, the side margin parts 114, 115, and the external electrodes 131, 132 are in contact, and the moisture resistance reliability of the laminated electronic component 100 can be further improved.

[0077] When the first extension parts 114-1, 114-2, 115-1, 115-2 are WC1 < WM1, the penetration of moisture from the outside becomes easy, and there is a possibility that the moisture resistance reliability may decrease.

[0078] Regarding WM1 and WC1 of the first extension parts 114-1, 114-2, 115-1, 115-2, taking the first-2 extension part 114-2 of the first side margin part as an example, it will be described more specifically as follows.

[0079] In the first-second extension part 114-2 of the first side margin part disposed on the second surface 2, when the first-second extension part 114-2 of the first side margin part is equally divided into three parts in the second direction, the central region among the three equal parts can correspond to the central part of the first-second extension part 114-2 of the first side margin part, and the remaining both side regions can correspond to the end parts of the first-second extension part 114-2 of the first side margin part. At this time, the size in the third direction at any point in the second direction in the central part of the first-second extension part 114-2 of the first side margin part can be defined as WM1, and the size in the third direction at any point in the second direction in the end part of the first-second extension part 114-2 of the first side margin part can be defined as WC1.

[0080] Taking a more preferable example, the minimum size in the third direction of the first-second extension part 114-2 of the first side margin part in the central part of the first-second extension part 114-2 of the first side margin part can be defined as WM1, and the size in the third direction of the first-second extension part 114-2 of the first side margin part located on the extension surface of the third surface 3 in the end part of the first-second extension part 114-2 of the first side margin part can be defined as WC1. However, it is not particularly limited thereto, and the size in the third direction of the first-second extension part 114-2 of the first side margin part located on the extension surface of the fourth surface 4 in the end part of the first-second extension part 114-2 of the first side margin part can also be defined as WC1. In this description, the first-second extension part 114-2 of the first side margin part is described as an example, but it is obvious that the description thereof is also applicable to the first-first extension part 114-1 of the first side margin part and the first-first and first-second extension parts 115-1, 115-2 of the second side margin part in the same manner.

[0081] Also, in the stacked electronic component 100 according to an embodiment of the present invention, the first extensions 114-1, 114-2, 115-1, 115-2 of the first side margin part and the second side margin part may include a substantially concave-shaped region, and preferably, may be a substantially concave-shaped region.

[0082] Further, in the stacked electronic component 100 according to an embodiment of the present invention, the first extension portions 114-1, 114-2, 115-1, 115-2 of the first side margin portion and the second side margin portion may include a region where the size in the third direction of the first extension portions 114-1, 114-2, 115-1, 115-2 of the first side margin portion and the second side margin portion increases from the central portion in the second direction of the first extension portions 114-1, 114-2, 115-1, 115-2 of the first side margin portion and the second side margin portion toward the end portion in the second direction of the first extension portions 114-1, 114-2, 115-1, 115-2 of the first side margin portion and the second side margin portion, and preferably, it may be a region where the size increases.

[0083] By including a region where the first extension portions 114-1, 114-2, 115-1, 115-2 of the first side margin portion and the second side margin portion substantially include a concave shape or the size in the third direction increases from the central portion in the second direction toward the end portion in the second direction, the interfacial bonding force between the main body 110 and the side margin portions 114, 115 can be excellent, and the moisture resistance reliability can be further improved.

[0084] On the other hand, in the stacked electronic component 100 according to an embodiment of the present invention, when the average size of the main body 110 in the third direction is Wb, the average size of each of the first side margin portion 114-0 and the second side margin portion 115-0 disposed on the fifth surface 5 and the sixth surface 6 in the third direction is WM0, and the size in the third direction of the first extension portions 114-1, 114-2, 115-1, 115-2 located on the extension surfaces of the third surface 3 and the fourth surface 4 is the above-mentioned MC1, and CR1 = 2*(WC1 - WM0) / Wb, 0 < CR1 < 10% can be satisfied, and more preferably, 4% ≦ CR1 ≦ 6% can be satisfied.

[0085] By satisfying 0 < CR1 < 10%, the bonding force between the main body 110 and the side margin portions 114, 115 can be excellent, and the moisture resistance reliability can be improved.

[0086] When 10% ≤ C1, the size of the first extension parts 114-1, 114-2, 115-1, 115-2 extended and arranged on the first surface 1 and the second surface 2 in the third direction becomes excessively large, and the end parts of the first extension parts may become thick or warp. As a result, the bonding force between the main body 110 and the side margin parts 114, 115 may decrease, and there may be a risk of interface lifting between the main body 110 and the side margin parts 114, 115. And when the interface adhesion force decreases, some components may fall off, inducing foreign matter defects.

[0087] Here, Wb can mean the average size of the main body 110 in the third direction, and can mean the value obtained by measuring and averaging the sizes in the third direction at 10 equally spaced points in the second direction.

[0088] WM0 can mean the average size of the main part 114-0 of the first side margin part arranged on the fifth surface 5 or the average size of the main part 115-0 of the second side margin part arranged on the sixth surface 6 in the third direction, and in the main parts 114-0, 115-0 of the first side margin part and the second side margin part, can mean the value obtained by measuring and averaging the sizes in the third direction at 5 equally spaced points in the second direction.

[0089] Regarding WM1, taking the first - 2 extension part 114-2 of the first side margin part as an example, it can mean the minimum size in the third direction at the central part in the second direction of the first - 2 extension part 114-2 of the first side margin part. When it is difficult to accurately grasp the minimum size in the third direction, it can mean the size in the third direction at the central point in the second direction of the first - 2 extension part 114-2 of the first side margin part. In this description, only the WM1 of the first - 2 extension part 114-2 of the first side margin part is described, but it is obvious that the description regarding WM1 can be similarly applied to the first - 1 extension part 114-1 of the first side margin part and the first - 1, first - 2 extension parts 115-1, 115-2 of the second side margin part.

[0090] Regarding WC1, taking the 1-2 extension 114-2 of the first side margin part as an example, it can mean the size in the third direction of the 1-2 extension 114-2 of the first side margin part located on the extension surface of the third surface 3 among the 1-2 extensions 114-2 of the first side margin part. However, it is not limited thereto, and WC1 can also mean the size in the third direction of the 1-2 extension 114-2 of the first side margin part located on the extension surface of the fourth surface 4 among the 1-2 extensions 114-2 of the first side margin part. In this description, only WC1 of the 1-2 extension 114-2 of the first side margin part is described, but it is obvious that the description regarding WC1 can be similarly applied to the 1-1 extension 114-1 of the first side margin part, and the 1-1 and 1-2 extensions 115-1 and 115-2 of the second side margin part.

[0091] On the other hand, in the stacked electronic component 100 according to another embodiment of the present invention, the first side margin part 114 and the second side margin part 115 can include second extensions 114-3, 114-4, 115-3, 115-4 that extend and are arranged on a part of the third surface 3 and the fourth surface 4.

[0092] That is, the first side margin part 114 can include second extensions 114-3, 114-4 arranged on a part of the third surface 3 and the fourth surface 4. Specifically, the second extensions 114-3, 114-4 of the first side margin part can include a 2-1 extension 114-3 arranged on a part of the third surface 3 and a 2-2 extension 114-4 arranged on a part of the fourth surface 4. The second side margin part 115 can include second extensions 115-3, 115-4 arranged on a part of the third surface 3 and the fourth surface 4. Specifically, the second extensions 115-3, 115-4 of the second side margin part can include a 2-1 extension 115-3 arranged on a part of the third surface 3 and a 2-2 extension 115-4 arranged on a part of the fourth surface 4.

[0093] More specifically, the first side margin portion 114 can include a main portion 114-0 disposed on the fifth surface 5, a second-1 extension portion 114-3 extending and disposed on a part of the third surface 3, and a second-2 extension portion 114-4 extending and disposed on a part of the fourth surface 4. The second side margin portion 115 can include a main portion 115-0 disposed on the sixth surface 6, a second-1 extension portion 115-3 extending and disposed on a part of the third surface 3, and a second-2 extension portion 115-4 extending and disposed on a part of the fourth surface 4.

[0094] In the present invention, unless otherwise specified, the description regarding the second extension portions 114-3 and 114-4 of the first side margin portion is similarly applicable to the second-1 extension portion 114-3 disposed on a part of the third surface 3 and the second-2 extension portion 114-4 disposed on a part of the fourth surface 4. The description regarding the second extension portions 115-3 and 115-4 of the second side margin portion is similarly applicable to the second-1 extension portion 115-3 disposed on a part of the third surface 3 and the second-2 extension portion 115-4 disposed on a part of the fourth surface 4.

[0095] By including the second extension portions 114-3, 114-4, 115-3, and 115-4 where the first side margin portion 114 and the second side margin portion 115 extend and are disposed on parts of the third surface 3 and the fourth surface 4 of the main body, the penetration of moisture and plating solution from the outside can be effectively prevented, and the moisture resistance reliability can be improved.

[0096] At this time, when the size in the third direction at the central portion in the first direction of the second extension portions 114-3, 114-4, 115-3, and 115-4 is WM2, and the size in the third direction at the end portion in the first direction of the second extension portions 114-3, 114-4, 115-3, and 115-4 is WC2, WM2 < WC2 can be satisfied.

[0097] When the second extension parts 114-3, 114-4, 115-3, and 115-4 satisfy WM2 < WC2, the interfacial adhesive force between the main body 110 and the side margin parts 114 and 115 can be excellent. In particular, it is possible to further suppress the penetration of moisture in the corner part of the main body 110 where the penetration of external moisture is easy, for example, in the region where the main body 110, the side margin parts 114 and 115, and the external electrodes 131 and 132 are in contact, and the moisture resistance reliability of the laminated electronic component 100 can be further improved.

[0098] When the second extension parts 114-3, 114-4, 115-3, and 115-4 satisfy WC2 < WM2, the penetration of external moisture becomes easy, and there is a risk of a decrease in moisture resistance reliability.

[0099] Regarding WM2 and WC2 of the second extension parts 114-3, 114-4, 115-3, and 115-4, taking the second-1 extension part 114-3 of the first side margin part as an example, it will be described more specifically as follows.

[0100] In the second-1 extension part 114-3 of the first side margin part disposed on the third surface 3, when the second-1 extension part 114-3 of the first side margin part is equally divided into three parts in the first direction, the central region among the three equal parts can correspond to the central part of the second-1 extension part 114-3 of the first side margin part, and the remaining upper and lower regions can correspond to the end parts of the second-1 extension part 114-3 of the first side margin part. At this time, the size in the third direction at an arbitrary point in the first direction in the central part of the second-1 extension part 114-3 of the first side margin part can be defined as WM2, and the size in the third direction at an arbitrary point in the first direction in the end part of the second-1 extension part 114-3 of the first side margin part can be defined as WC2.

[0101] To give a more preferable example, among the central part of the second-1 extension part 114-3 of the first side margin part, the minimum size in the third direction of the second-1 extension part 114-3 of the first side margin part can be defined as WM2. Among the ends of the second-1 extension part 114-3 of the first side margin part, the size in the third direction of the second-1 extension part 114-3 of the first side margin part located on the extension plane of the first surface 1 can be defined as WC2. However, it is not particularly limited thereto. Among the ends of the second-1 extension part 114-3 of the first side margin part, the size in the third direction of the second-1 extension part 114-3 of the first side margin part located on the extension plane of the second surface 2 can also be defined as WC2. In this description, the second-1 extension part 114-3 of the first side margin part is described as an example, but it is obvious that the description thereof can be similarly applied to the second-2 extension part 114-4 of the first side margin part, and the second-1 extension part 115-3 and the second-2 extension part 115-4 of the second side margin part.

[0102] Also, in the stacked electronic component 100 according to another embodiment of the present invention, the second extension parts 114-3, 114-4 of the first side margin part and the second extension parts 115-3, 115-4 of the second side margin part may include a substantially concave-shaped region, and preferably, may be a substantially concave-shaped region.

[0103] Also, in the stacked electronic component 100 according to an embodiment of the present invention, the second extension parts 114-3, 114-4 of the first side margin part and the second extension parts 115-3, 115-4 of the second side margin part may include a region where the size in the third direction of the second extension parts 114-3, 114-4 of the first side margin part and the second extension parts 115-3, 115-4 of the second side margin part increases from the central part in the first direction of the second extension parts 114-3, 114-4 of the first side margin part and the second extension parts 115-3, 115-4 of the second side margin part toward the ends in the first direction of the second extension parts 114-3, 114-4 of the first side margin part and the second extension parts 115-3, 115-4 of the second side margin part, and preferably, may be an increasing region.

[0104] By including the second extension portions 114-3 and 114-4 of the first side margin portion and the second extension portions 115-3 and 115-4 of the second side margin portion in a substantially concave shape, or by including a region where the size in the third direction increases from the central portion in the first direction toward the end portion in the first direction, the interfacial bonding force between the main body 110 and the side margin portions 114 and 115 can be excellent, and the moisture resistance reliability can be further improved.

[0105] On the other hand, in the laminated electronic component 100 according to another embodiment of the present invention, when the average size of the main body 110 in the third direction is Wb, the average size of each of the first side margin portion 114-0 and the second side margin portion 115-0 disposed on the fifth surface 5 and the sixth surface 6 in the third direction is WM0, and the size in the third direction of the second extension portions 114-3, 114-4, 115-3, and 115-4 located on the extension surfaces of the first surface 1 and the second surface 2 is defined as the above-described MC2, and CR2 = 2*(WC2 - WM0) / Wb, 0 < CR2 < 10% can be satisfied, and more preferably, 2% ≦ CR2 ≦ 4% can be satisfied.

[0106] By satisfying 0 < CR2 < 10%, the bonding force between the main body 110 and the side margin portions 114 and 115 can be excellent, and the moisture resistance reliability can be improved.

[0107] When 10% ≦ C2, the size in the third direction of the second extension portions 114-3, 114-4, 115-3, and 115-4 extended and disposed on the third surface 3 and the fourth surface 4 becomes excessively large, and the end portions of the second extension portions may become thick or warp, whereby the bonding force between the main body 110 and the side margin portions 114 and 115 may decrease, and interfacial lifting between the main body 110 and the side margin portions 114 and 115 may occur.

[0108] Here, Wb can mean the average size of the main body 110 in the third direction, and can mean a value obtained by measuring and averaging the sizes in the third direction at 10 points equally spaced in the first direction.

[0109] WM0 can mean the average size in the third direction of the main part 114-0 of the first side margin part arranged on the fifth surface 5, or the average size in the third direction of the main part 115-0 of the second side margin part arranged on the sixth surface 6. In the main parts 114-0 and 115-0 of the first side margin part and the second side margin part, it can mean the value obtained by measuring and averaging the sizes in the third direction at five equally spaced points in the first direction.

[0110] Regarding WM2, taking the 2-1 extension part 114-3 of the first side margin part as an example, it can mean the minimum size in the third direction at the central part in the first direction of the 2-1 extension part 114-3 of the first side margin part. When it is difficult to accurately grasp the minimum size in the third direction, it can mean the size in the third direction at the central point in the second direction of the 2-1 extension part 114-3 of the first side margin part. In this description, only the WM2 of the 2-1 extension part 114-3 of the first side margin part is described, but it is obvious that the description about WM2 can also be similarly applied to the 2-2 extension part 114-4 of the first side margin part, the 2-1 extension part 114-3 of the second side margin part, and the 2-2 extension part 114-4.

[0111] Regarding WC2, taking the 2-1 extension part 114-3 of the first side margin part as an example, it can mean the size in the third direction of the 2-1 extension part 114-3 of the first side margin part located on the extension surface of the first surface 1 of the 2-1 extension part 114-3 of the first side margin part. However, it is not limited to this. WC2 can also mean the size in the third direction of the 2-1 extension part 114-3 of the first side margin part located on the extension surface of the second surface 2 of the 2-1 extension part 114-3 of the first side margin part. In this description, only the WC2 of the 1-2 extension part 114-2 of the first side margin part is described, but it is obvious that the description about WC2 can also be similarly applied to the 2-2 extension part 114-4 of the first side margin part, the 2-1 and 2-2 extension parts 115-3 and 115-4 of the second side margin part.

[0112] Further, the second extension portions 114-3, 114-4, 115-3, and 115-4 can be arranged to contact a part of the internal electrodes 121 and 122 exposed on one surface of the main body 110.

[0113] More specifically, the second-1 extension portion 114-3 of the first side margin portion may be arranged to contact a part of the first internal electrode 121 exposed on the third surface 3, and the second-2 extension portion 114-4 of the first side margin portion may be arranged to contact a part of the second internal electrode 122 exposed on the fourth surface 4. The second-1 extension portion 115-3 of the second side margin portion may be arranged to contact a part of the first internal electrode 121 exposed on the third surface 3, and the second-2 extension portion 115-4 of the second side margin portion may be arranged to contact a part of the second internal electrode 122 exposed on the fourth surface 4.

[0114] By arranging the second extension portions 114-3, 114-4, 115-3, and 115-4 to contact a part of the first internal electrode 121 and the second internal electrode 122 exposed on the third surface 3 and the fourth surface 4 of the main body 110 respectively, it is possible to more effectively prevent moisture from the outside from penetrating inside and deteriorating the internal electrodes.

[0115] At this time, the second extension portions 114-3, 114-4, 115-3, and 115-4 may be arranged to contact the end portions in the second direction of the first internal electrode 121 and the second internal electrode 122 exposed on the third surface 3 and the fourth surface 4 respectively.

[0116] That the second extension portions 114-3, 114-4, 115-3, and 115-4 are arranged to contact a part of the internal electrodes 121 and 122 can mean that the second extension portions 114-3, 114-4, 115-3, and 115-4 are arranged to cover a part of the internal electrodes 121 and 122.

[0117] In another embodiment of the present invention, the first side margin portion 114 and the second side margin portion 115 can simultaneously include the first extension portions 114-1, 114-2, 115-1, 115-2 and the second extension portions 114-3, 114-4, 115-3, 115-4. Since the description thereof is the same as that described above, it is omitted.

[0118] In one embodiment of the present invention, the structure in which the ceramic electronic component 100 has two external electrodes 131 and 132 is described. However, the number, shape, etc. of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 and other purposes.

[0119] The external electrodes 131 and 132 are disposed on the main body 110 and can be connected to the internal electrodes 121 and 122.

[0120] More specifically, the external electrodes 131 and 132 can be respectively disposed on the third surface 3 and the fourth surface 4 of the main body 110, and include a first external electrode 131 and a second external electrode 132 respectively connected to the first internal electrode 121 and the second internal electrode 122. That is, the first external electrode 131 can be disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 can be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0121] In addition, the external electrodes 131 and 132 may extend and be disposed on a part of the first surface 1 and the second surface 2 of the main body 110, or may extend and be disposed on a part of the fifth surface 5 and the sixth surface 6 of the main body 110. That is, the first external electrode 131 can be disposed on a part of the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6 of the main body 110, and on the third surface 3 of the main body 110, and the second external electrode 132 can be disposed on a part of the first surface 1, the second surface 2, the fifth surface 5 and the sixth surface 6 of the main body 110, and on the third surface 3 of the main body 110.

[0122] In the case where the external electrodes 131 and 132 are disposed on the side margin portions 114 and 115, the external electrodes 131 and 132 can be disposed thicker by the thickness of the side margin portions 114 and 115. For example, the regions of the external electrodes 131 and 132 disposed on the side margin portions 114 and 115 can include a convex shape, and the regions of the external electrodes 131 and 132 not disposed on the side margin portions 114 and 115 can include a non-convex shape.

[0123] The external electrodes 131 and 132 may be formed of any material as long as it has electrical conductivity such as metal. A specific material may be determined in consideration of electrical characteristics, structural stability, etc. Further, it may have a multilayer structure.

[0124] For example, the external electrodes 131 and 132 can include electrode layers 131a and 132a disposed on the main body 110 and plating layers 131b and 132b disposed on the electrode layers 131a and 132a.

[0125] More specific examples of the electrode layers 131a and 132a are that the electrode layers 131a and 132a may be fired electrodes including a conductive metal and glass, or resin-based electrodes including a conductive metal and a resin.

[0126] Also, the electrode layers 131a and 132a may be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body 110.

[0127] Also, the electrode layers 131a and 132a may be formed by a method of transferring a sheet containing a conductive metal onto the main body 110, or may be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode.

[0128] The conductive metal used for the electrode layers 131a and 132a is not particularly limited as long as it can be electrically connected to the internal electrodes 121 and 122 for forming capacitance. For example, it can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The electrode layers 131a and 132a can be formed by applying a conductive paste provided by adding glass frit to the conductive metal particles and then firing.

[0129] The plating layers 131b and 132b can play a role in improving the mounting characteristics.

[0130] The types of the plating layers 131b and 132b are not particularly limited, and can be single-layer plating layers 131b and 132b containing one or more of nickel (Ni), tin (Sn), silver (Ag), palladium (Pd), and alloys thereof, or can be formed of multiple layers.

[0131] More specific examples of the plating layers 131b and 132b are as follows. The plating layers 131b and 132b may be Ni plating layers or Sn plating layers, or may be in a form where a Ni plating layer and an Sn plating layer are sequentially formed on the electrode layers 131a and 132a, or may be in a form where an Sn plating layer, a Ni plating layer, and an Sn plating layer are sequentially formed. Also, the plating layers 131b and 132b can include multiple Ni plating layers and / or multiple Sn plating layers.

[0132] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0133] However, in order to simultaneously achieve miniaturization and high capacitance, the thickness of the dielectric layer and the internal electrodes needs to be reduced and the number of laminations needs to be increased. Therefore, in the multilayer electronic component 100 having a size of 1005 (length × width: 1.0 mm × 0.5 mm) or less, the effects according to the present invention can be more remarkable.

[0134] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the technical field within the scope not departing from the technical idea of the present invention described in the claims, and this can also be said to belong to the scope of the present invention.

[0135] In addition, the expression "one embodiment" used in this specification does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, it does not exclude that the above-presented one embodiment can be realized in combination with the features of another one embodiment. For example, even if the matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to the other one embodiment as long as there is no explanation contrary to or conflicting with that matter in the other one embodiment.

[0136] The terms used in this specification are merely used to explain one embodiment and are not intended to limit the present invention. At this time, the singular expression includes the plural expression unless the context clearly indicates a different meaning.

Explanation of Reference Numerals

[0137] 100: Multilayer electronic component 110: Body 111: Dielectric layer 112, 113: Cover part 114, 115: Side margin part 121, 122: Internal electrode 131, 132: External electrode

Claims

1. a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing each other in the third direction; a first external electrode and a second external electrode disposed on the third surface and the fourth surface, respectively; a first side margin portion and a second side margin portion disposed on the fifth surface and the sixth surface, respectively; The first side margin portion and the second side margin portion each include a first extension portion that is disposed to extend to a portion of the first surface and a portion of the second surface, When a size in the third direction at a center portion in the second direction of the first extension portion is defined as WM1, and a size in the third direction at an end portion in the second direction of the first extension portion is defined as WC1, A multilayer electronic component that satisfies WM1<WC1.

2. The multilayer electronic component according to claim 1 , wherein the first extension portion includes a substantially concave region.

3. 2. The multilayer electronic component according to claim 1, wherein the first side margin portion and the second side margin portion include a region in which a size of the first extension portion in the third direction increases from a center of the first extension portion in the second direction toward an end of the first extension portion in the second direction.

4. When the average size of the main body in the third direction is Wb, and the average size in the third direction of each of the first side margin portion and the second side margin portion arranged on the fifth surface and the sixth surface is WM0, 2. The multilayer electronic component according to claim 1, wherein, when CR1=2*(WC1-WM0) / Wb, 0<CR1<10% is satisfied.

5. The first side margin portion and the second side margin portion further include a second extension portion extending to a portion of the third surface and a portion of the fourth surface, When a size in the third direction at a center portion in the first direction of the second extension portion is defined as WM2, and a size in the third direction at an end portion in the first direction of the second extension portion is defined as WC2, The multilayer electronic component according to claim 1 , wherein WM2<WC2 is satisfied.

6. The multilayer electronic component according to claim 5 , wherein the second extension portion includes a concave region.

7. 6. The multilayer electronic component according to claim 5, wherein the first side margin portion and the second side margin portion include a region in which a size of the second extension portion in the third direction increases from a center portion of the second extension portion in the first direction toward an end portion of the second extension portion in the first direction.

8. The average size of the main body in the third direction is defined as Wb, the average size of the first side margin portion and the second side margin portion disposed on the fifth surface and the sixth surface in the third direction is defined as WM0, and the average size of the second extension portion located on the extension surface of the first surface and the second surface in the third direction is defined as WC2, 6. The multilayer electronic component according to claim 5, wherein, when CR2=2*(WC2-WM0) / Wb, 0<CR2<10% is satisfied.

9. the internal electrodes include a first internal electrode exposed to the third surface and a second internal electrode exposed to the fourth surface; 9. The multilayer electronic component according to claim 5, wherein the second extension portion is disposed so as to contact parts of the first internal electrode and the second internal electrode on the third surface and the fourth surface.

10. a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing each other in the third direction; a first external electrode and a second external electrode disposed on the third surface and the fourth surface, respectively; a first side margin portion and a second side margin portion disposed on the fifth surface and the sixth surface, respectively; The first side margin portion and the second side margin portion include a second extension portion extending to a part of the third surface and a part of the fourth surface, When a size in the third direction at a center portion in the first direction of the second extension portion is defined as WM2, and a size in the third direction at an end portion in the first direction of the second extension portion is defined as WC2, A multilayer electronic component that satisfies WM2<WC2.

11. The multilayer electronic component according to claim 10 , wherein the second extension portion includes a concave region.

12. 11. The multilayer electronic component according to claim 10, wherein the first side margin portion and the second side margin portion include a region in which a size of the second extension portion in the third direction increases from a center of the second extension portion in the first direction toward an end of the second extension portion in the first direction.

13. When the average size of the main body in the third direction is Wb, and the average size in the third direction of each of the first side margin portion and the second side margin portion arranged on the fifth surface and the sixth surface is WM0, 11. The multilayer electronic component according to claim 10, wherein, when CR2=2*(WC2-WM0) / Wb, 0<CR2<10% is satisfied.

14. the internal electrodes include a first internal electrode exposed to the third surface and a second internal electrode exposed to the fourth surface; The multilayer electronic component according to claim 10 , wherein the second extension portion is disposed so as to contact parts of the first internal electrode and the second internal electrode on the third surface and the fourth surface.

15. The first side margin portion and the second side margin portion further include a first extension portion extending to a portion of the first surface and a portion of the second surface, When a size in the third direction at a center portion in the second direction of the first extension portion is defined as WM1, and a size in the third direction of the first extension portion located on an extension surface of the third surface and the fourth surface located at an end portion in the second direction of the first extension portion is defined as WC1, The multilayer electronic component according to claim 10 , wherein WM1<WC1 is satisfied.

16. 16. The multilayer electronic component according to claim 15, wherein the first side margin portion and the second side margin portion include a region in which a size of the first extension portion in the third direction increases from a center of the first extension portion in the second direction toward an end of the first extension portion in the second direction.

17. An average size in the third direction of the main body is Wb, and an average size in the third direction of each of the first side margin portion and the second side margin portion arranged on the fifth surface and the sixth surface is WM0, 16. The multilayer electronic component according to claim 15, wherein, when CR1=2*(WC1-WM0) / Wb, 0<CR1<10% is satisfied.

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