Adhesive laminate sheet, laminate, and method for manufacturing wiring board

Abstract

To provide an adhesive laminate sheet which can be rapidly peeled and removed after being used as a reinforcing sheet.SOLUTION: An adhesive laminate sheet comprises a carrier, a release layer provided on the carrier, and an adhesive layer provided on the release layer and containing an adhesive material.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an adhesive laminated sheet, a laminate, and a method for manufacturing a wiring board.

Background Art

[0002] In recent years, in order to increase the mounting density and miniaturize printed wiring boards, multi-layered printed wiring boards have been widely used. Such multi-layer printed wiring boards are used in many portable electronic devices for the purpose of weight reduction and miniaturization. And for such multi-layer printed wiring boards, further reduction in the thickness of the interlayer insulating layer and further weight reduction as a wiring board are required.

[0003] As a technique to meet such requirements, a method for manufacturing a multi-layer printed wiring board using a coreless build-up method has been adopted. The coreless build-up method is a method of alternately laminating (building up) an insulating layer and a wiring layer without using a so-called core substrate to form a multi-layer structure. In the coreless build-up method, it has been proposed to use a copper foil with a carrier so that the separation between the support and the multi-layer printed wiring board can be easily performed. For example, Patent Document 1 (Japanese Patent Application Laid-Open No. 2005-101137) discloses a method for manufacturing a package substrate for mounting a semiconductor element, which includes attaching an insulating resin layer to the carrier surface of a copper foil with a carrier as a support, forming a first wiring conductor on the ultra-thin copper layer side of the copper foil with a carrier by processes such as photoresist processing, pattern electrolytic copper plating, and resist removal, then forming a build-up wiring layer, peeling the support substrate with a carrier, and removing the ultra-thin copper layer.

[0004] In addition, for the miniaturization of the embedded circuit as shown in Patent Document 1, a copper foil with a carrier having a thickness of the ultra-thin copper layer of 1 μm or less is desired. Therefore, in order to achieve the reduction in the thickness of the ultra-thin copper layer, it has been proposed to form the ultra-thin copper layer by a vapor phase method such as sputtering. For example, Patent Document 2 (International Publication No. 2017 / 150283) discloses a copper foil with a carrier on which a release layer, an antireflection layer, and an ultra-thin copper layer are formed by sputtering on a carrier such as glass or ceramics. Further, Patent Document 3 (International Publication No. 2017 / 150284) discloses a copper foil with a carrier on which an intermediate layer (for example, an adhesion metal layer and a release assisting layer), a release layer, and an ultra-thin copper layer (for example, a film thickness of 300 nm) are formed by sputtering on a carrier such as glass or ceramics. Patent Documents 2 and 3 teach that by interposing an intermediate layer composed of a predetermined metal, excellent stability of the mechanical peeling strength of the carrier can be achieved, and by the antireflection layer exhibiting a desired dark color, the visibility in image inspection (for example, automatic optical inspection (AOI)) can be improved.

[0005] In particular, with the further miniaturization and power saving of electronic devices, the need for higher integration and thinning of semiconductor chips and printed wiring boards is increasing. As next-generation packaging technologies that meet such needs, the adoption of FO-WLP (Fan-Out Wafer Level Packaging) and PLP (Panel Level Packaging) has been considered in recent years. Also in FO-WLP and PLP, the adoption of a coreless build-up method has been considered. As one such method, there is a method called the RDL-First (Redistribution Layer-First) method in which a wiring layer and, if necessary, a build-up wiring layer are formed on the surface of a coreless support, and after the support is peeled off if necessary, a chip is mounted. For example, Patent Document 4 (Japanese Unexamined Patent Application Publication No. 2015-35551) discloses the formation of a metal peeling layer on the main surface of a support made of glass or a silicon wafer, the formation of an insulating resin layer thereon, the formation of a redistribution layer including a build-up layer thereon, the mounting and sealing of a semiconductor integrated circuit thereon, the exposure of the peeling layer by removing the support, the exposure of secondary mounting pads by removing the peeling layer, the formation of solder bumps on the surface of the secondary mounting pads, and a method for manufacturing a semiconductor device including secondary mounting.

[0006] In recent years, with the adoption of FO-WLP and PLP being considered, there has been a demand for thinning the build-up layer. However, when the build-up layer is thin, when peeling the substrate from the substrate with a build-up layer produced by the coreless build-up method, the build-up layer may locally bend significantly. Such a large bend in the build-up layer can cause disconnection or peeling of the wiring layer inside the build-up layer, and as a result, can reduce the connection reliability of the wiring layer. To address such problems, it has been proposed to laminate a reinforcing sheet on the multilayer laminate to improve handleability. For example, Patent Document 5 (Japanese Patent No. 6731060) discloses laminating a reinforcing sheet on a laminate with a multilayer wiring layer including a peelable substrate via a second peel layer that provides a predetermined peel strength in the manufacture of a multilayer wiring board. According to such a method, it is said that the substrate and the reinforcing sheet can be peeled in this order without locally bending the multilayer wiring layer significantly. Patent Document 6 (Japanese Patent No. 6731061) discloses laminating a reinforcing sheet with a Vickers hardness lower than that of the substrate on a laminate with a multilayer wiring layer including a peelable substrate to improve the connection reliability of the multilayer wiring layer and the flatness of the surface of the multilayer wiring layer. Patent Document 7 (Japanese Patent No. 7112962) discloses providing an opening in the reinforcing sheet and using a soluble adhesive layer for laminating the reinforcing sheet on the multilayer laminate. Patent Document 8 (Japanese Patent No. 7208011) discloses using a soluble adhesive layer for laminating the reinforcing sheet on the multilayer laminate and providing a non-occupied area where the soluble adhesive layer is not formed within a predetermined region. According to the methods disclosed in Patent Documents 7 and 8, it is said that the peeling of the reinforcing sheet that has served its purpose can be carried out in an extremely short time while minimizing the stress applied to the multilayer laminate by means such as dissolution peeling.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Patent Document 2

[0008] When the reinforcing sheets disclosed in Patent Documents 7 and 8 are laminated on a multilayer laminate, the peeling of the reinforcing sheet after fulfilling its role can be performed in a short time. However, even more rapid peeling of the reinforcing sheet is required.

[0009] The inventors of the present invention have now found that in an adhesive laminated sheet, by providing a release layer and an adhesive layer containing an adhesive material on a carrier in this order, peeling and removal after use as a reinforcing sheet can be carried out promptly.

[0010] Accordingly, an object of the present invention is to provide an adhesive laminated sheet capable of promptly performing peeling and removal after use as a reinforcing sheet.

[0011] According to the present invention, the following aspects are provided. [Aspect 1] A carrier, a release layer provided on the carrier, an adhesive layer provided on the release layer and containing an adhesive material, and an adhesive laminated sheet comprising the same. [Aspect 2] The adhesive laminated sheet according to Aspect 1, further comprising a metal layer provided between the release layer and the adhesive layer. [Aspect 3] The adhesive laminated sheet according to aspect 1 or 2, wherein the carrier is made of metal. [Aspect 4] The adhesive laminated sheet according to any one of aspects 1 to 3, wherein the carrier is composed of at least one selected from the group consisting of aluminum, stainless steel, copper, titanium, nickel, and duralumin. [Aspect 5] The adhesive laminated sheet according to any one of aspects 1 to 4, wherein the adhesive material is at least one selected from the group consisting of a thermosetting epoxy resin, a thermosetting polyimide resin, a photosensitive polyimide resin, an acrylic resin, and a phenolic resin. [Aspect 6] The adhesive laminated sheet according to any one of aspects 1 to 5, wherein the adhesive layer has a thickness of 1 μm or more and 2000 μm or less. [Aspect 7] The planar area A of the carrier C to the planar area A of the adhesive layer A ratio A A / A C is 0.03 or more and 1.0 or less, and the adhesive laminated sheet according to aspect 1 or 2. [Aspect 8] The adhesive laminated sheet according to any one of aspects 2 to 7, wherein the metal layer is composed of at least one metal selected from the group consisting of Ti, Cu, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo. [Aspect 9] The adhesive laminated sheet according to any one of aspects 2 to 8, wherein the metal layer has a thickness of 10 nm or more and 1000 nm or less. [Aspect 10] The adhesive laminated sheet according to any one of aspects 1 to 9, wherein the release layer contains carbon. [Aspect 11] A laminate including the adhesive laminated sheet according to any one of aspects 1 to 10, a resin-containing layer provided on the adhesive layer of the adhesive laminated sheet, and an additional metal layer provided on the resin-containing layer. [Aspect 12] The laminate according to aspect 11, further comprising an additional release layer provided on the additional metal layer and an additional carrier provided on the additional release layer. [Aspect 13] A method for manufacturing a wiring board, comprising: preparing a laminate including a first carrier, a first release layer, a first metal layer, and a resin-containing layer in this order; laminating an adhesive laminate sheet on the laminate, the adhesive laminate sheet including a second carrier, a second release layer, and an adhesive layer including an adhesive material in this order, and laminating the adhesive laminate sheet on the laminate such that the adhesive layer abuts the resin-containing layer; peeling the first carrier from the laminate on which the adhesive laminate sheet is laminated, using the first release layer; peeling the second carrier from the laminate from which the first carrier has been peeled, using the second release layer; removing the second release layer from the laminate from which the second carrier has been peeled, thereby exposing the adhesive layer; removing the adhesive layer from the laminate from which the second release layer has been removed; A method for manufacturing a wiring board, including the above steps. [Aspect 14] The method for manufacturing a wiring board according to aspect 13, wherein the adhesive sheet further includes a second metal layer between the second release layer and the adhesive layer. [Aspect 15] The method for manufacturing a wiring board according to aspect 13 or 14, wherein the resin-containing layer includes a first redistribution layer provided on the first metal layer, a mold resin layer provided on the first redistribution layer, and a second redistribution layer provided on the mold resin layer. [Aspect 16] The method for manufacturing a wiring board according to aspect 15, wherein the mold resin layer includes an epoxy resin and / or a phenolic resin. [Aspect 17] The method for manufacturing a wiring board according to any one of aspects 13 to 16, wherein the peeling of the first carrier is performed by a laser lift-off method or a mechanical method. [Aspect 18] The manufacturing method of the wiring board according to any one of Aspects 13 to 17, further including a step of heating the laminate at 100°C or higher and 350°C or lower after laminating the adhesive laminate sheet on the laminate and before peeling the second carrier. [Aspect 19] After peeling the first carrier from the laminate and before peeling the second carrier, the method further includes a step of laminating an additional adhesive laminate sheet on the surface of the laminate on the side from which the first carrier has been peeled. The additional adhesive laminate sheet includes a third carrier, a third release layer, and a second adhesive layer including an adhesive material, in this order. The method for manufacturing a wiring board according to any one of Aspects 13 to 18, wherein the additional adhesive laminate sheet is laminated on the laminate such that the second adhesive layer contacts the surface of the laminate on the side from which the first carrier has been peeled.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0013] Adhesive laminated sheet An example of the adhesive laminate sheet of the present invention is schematically shown in FIG. 1. As shown in FIG. 1, the adhesive laminate sheet 10 includes a carrier 12, a release layer 16, and an adhesive layer 20 in this order. The release layer 16 is provided on the carrier 12. The adhesive layer 20 is provided on the release layer 16 and contains an adhesive material. The adhesive laminate sheet 10 preferably further includes a metal layer 18 between the release layer 16 and the adhesive layer 20. If desired, the adhesive laminate sheet 10 may further have an intermediate layer 14 between the carrier 12 and the release layer 16. Each of the intermediate layer 14, the release layer 16, the metal layer 18, and the adhesive layer 20 may be a single layer composed of one layer or a multilayer composed of two or more layers. In this way, in the adhesive laminate sheet 10, by providing the release layer 16 and the adhesive layer 20 containing an adhesive material on the carrier 12, it becomes possible to quickly perform peeling and removal after use as a reinforcing sheet.

[0014] The use of the adhesive laminated sheet 10 as a reinforcing sheet and subsequent peeling and removal can be carried out, for example, as follows. First, by attaching the adhesive layer 20 side of the adhesive laminated sheet 10 to an adherend (for example, a laminated body with a wiring layer), the adherend is reinforced by the carrier 12 or the like, and the handling property and the like are improved. And since the release layer 16 is provided between the carrier 12 and the adhesive layer 20, the carrier 12 (and the intermediate layer 14 if present) that has served as the reinforcing sheet can be peeled at the position of the release layer 16. After peeling of the carrier 12 or the like, by removing the release layer 16 (and the metal layer 18 if present), most or all of the surface of the adhesive layer 20 is exposed. By using a method such as bringing a release liquid into contact with the surface of the adhesive layer 20 thus exposed, the adhesive layer 20 is removed. Thus, according to the adhesive laminated sheet 10 of the present invention, after peeling of the carrier 12 or the like that can function as a reinforcing sheet, the exposed adhesive layer 20 can be directly removed. Therefore, compared with the conventional method in which the reinforcing sheet itself is present when dissolving or softening the soluble adhesive layer as disclosed in Patent Document 7 (Japanese Patent No. 7112962) or Patent Document 8 (Japanese Patent No. 7208011) and the contact area with the dissolving liquid or the like is not sufficiently large, it is possible to more quickly perform peeling and removal of the sheet and removal of the adhesive layer.

[0015] The adhesive layer 20 is preferably a layer that can attach the adhesive laminated sheet 10 to the adherend with a desired adhesiveness and can be removed from the adherend after use. The adhesion mode between the adhesive laminated sheet 10 and the adherend via the adhesive layer 20 is not particularly limited, and may be, for example, mechanical bonding (i.e., adhesion by an anchor effect), physical interaction (i.e., adhesion by van der Waals force), chemical bonding, or the like. Examples of the adhesive material contained in the adhesive layer 20 include phenol resin, urea resin, melamine resin, epoxy resin, polyimide resin, ethylene-vinyl acetate copolymer resin (EVA), urethane resin, acrylic resin, synthetic rubber, and starch, and preferably a thermosetting epoxy resin, a thermosetting polyimide resin, a photosensitive polyimide resin, an acrylic resin, a phenol resin, or a combination thereof.

[0016] When the adhesive laminated sheet 10 is used as a reinforcing sheet for an adherend (for example, a laminated body with a wiring layer) that is subjected to heat treatment at a high temperature (for example, for several minutes at 260 ° C), the adhesive layer 20 can retain its adhesiveness even after such heat treatment and is preferably removable after use. From this perspective, the adhesive material preferably contains a thermosetting resin. Preferred examples of the thermosetting resin include thermosetting epoxy resins, thermosetting polyimide resins, thermosetting phenolic resins, thermosetting melamine resins, and combinations thereof, and more preferably a thermosetting epoxy resin. An example of a product of an adhesive layer containing a thermosetting epoxy resin is TSA-16 manufactured by Toray Industries, Inc.

[0017] The adhesive layer 20 preferably has a thickness of 1 μm or more and 2000 μm or less, more preferably 3 μm or more and 1000 μm or less, still more preferably 5 μm or more and 800 μm or less, and particularly preferably 10 μm or more and 500 μm or less. With such a thickness, it becomes easier to control the adhesion to the adherend within a desired range, and the peeling and removal of the adhesive laminated sheet 10 after use as a reinforcing sheet or the like can be performed in an even shorter time.

[0018] The adhesive layer 20 is preferably a layer that exhibits adhesiveness at room temperature and is soluble or softenable upon contact with a dissolving solution. Therefore, the adhesive layer 20 preferably contains a solution-soluble resin, for example, an acid-soluble resin or an alkali-soluble resin. Since this solution-soluble resin can be efficiently dissolved or softened by contact with the dissolving solution, the removal of the adhesive layer 20 can be performed more rapidly. In particular, the adhesive layer 20 preferably contains an alkali-soluble resin. Preferred examples of the alkali-soluble resin include the above-mentioned thermosetting resins.

[0019] The method for forming the adhesive layer 20 is not particularly limited, and known methods can be adopted. For example, an adhesive layer 20 can be formed by applying a coating solution in which an adhesive material is dissolved in a solvent onto the release layer 16 (or the metal layer 18 if present), and drying to volatilize the solvent. Alternatively, after placing a commercially available adhesive film on the release layer 16 (or the metal layer 18 if present), it may be bonded by a method such as roll lamination or vacuum lamination.

[0020] The adhesive laminated sheet 10 has a ratio A C of the planar area A A of the adhesive layer 20 to the planar area A A of the carrier 12 C of 0.03 or more and 1.0 or less, more preferably 0.05 or more and 0.95 or less, still more preferably 0.08 or more and 0.93 or less, and particularly preferably 0.10 or more and 0.90 or less. The planar areas A C and A A mean the area of the carrier 12 and the area of the adhesive layer 20 when the adhesive laminated sheet 10 is viewed in plan, respectively. By forming the adhesive layer 20 sufficiently large with respect to the carrier 12 in this way, the adhesive laminated sheet 10 can be stably and reliably adhered to the adherend. Nevertheless, since the adhesive laminated sheet 10 can bring a dissolving solution or the like into contact with almost all or all of the surface of the adhesive layer 20 after the release of the carrier 12 as described above, the adhesive layer 20 can be removed in a short time.

[0021] Typically, the carrier 12 has a function of reinforcing the adherend and improving its handleability when the adhesive laminated sheet 10 is laminated on the adherend. The carrier 12 has a spring limit value Kb 0.1 measured in accordance with the repeated bending test of JIS H 3130 - 2012 2 of 100 N / mm 2 or more and 1500 N / mm 2 or less, more preferably 150 N / mm 2 or more and 1200 N / mm 2 or less, still more preferably 200 N / mm2 are as follows.

[0022] For reference, the spring limit value Kb for various candidate materials 0.1 is illustrated in Tables 1 and 2 below.

[0023] [Table 1]

[0024] [Table 2]

[0025] The carrier 12 is preferably composed of resin, metal (including alloys and intermetallic compounds, etc.), glass, ceramics, silicon, or a combination thereof, and more preferably composed of metal. By using a metal carrier, when the adhesive laminated sheet 10 is used as a reinforcing sheet, it is possible to effectively prevent damage to the carrier 12 during handling, and it has advantages such as the recyclability of the carrier 12 after use. Examples of the metal constituting the carrier 12 include, from the viewpoints of the above spring limit value Kb 0.1 and Young's modulus, etc., aluminum (including aluminum alloys), stainless steel, copper (including copper alloys such as bronze, phosphor copper, copper nickel alloy, copper titanium alloy, etc.), titanium (including titanium alloys), nickel (including nickel alloys), and duralumin (for example, A2017, A2024, and A7075 in JIS standards), but stainless steel is particularly preferred from the viewpoint of chemical resistance. Examples of the resin include epoxy resin, polyimide resin, polyethylene resin, and phenolic resin, and a prepreg composed of such a resin and a fiber reinforcing material may also be used. The carrier 12 made of silicon may be any one containing Si as an element, and SiO2 substrate, SiN substrate, Si single crystal substrate, Si polycrystalline substrate, etc. can be applied. Preferred examples of the glass constituting the carrier 12 include quartz glass, borosilicate glass, alkali-free glass, soda-lime glass, aluminosilicate glass, and combinations thereof.

[0026] The form of the carrier 12 is not limited to a sheet form as long as it can prevent or suppress the bending of the adherend, and may be other forms such as a film, a plate, and a foil, preferably in the form of a sheet or a plate. The carrier 12 may be a laminate of these sheets, films, plates, foils, etc. Typical examples of the carrier 12 include a metal sheet, a resin sheet (particularly a hard resin sheet), and a glass sheet. The thickness of the carrier 12 is preferably 10 μm or more and 1 mm or less, more preferably 50 μm or more and 800 μm or less, and still more preferably 100 μm or more and 600 μm or less, from the viewpoints of maintaining the strength of the carrier 12 and facilitating the handling of the carrier 12. When the carrier 12 is a metal sheet (for example, a stainless steel sheet), the ten-point average roughness Rz-jis (measured in accordance with JIS B 0601-2001) of the surface of the metal sheet on the side where the release layer 16 (or the intermediate layer 14 if present) is formed is preferably 0.05 μm or more and 500 μm or less, more preferably 0.5 μm or more and 400 μm or less, and still more preferably 1 μm or more and 300 μm or less. With such a surface roughness, it becomes easy to control the peel strength between the carrier and the adhesive layer to a desired value due to the anchor effect caused by the unevenness of the surface.

[0027] The intermediate layer 14 provided as desired is a layer interposed between the carrier 12 and the release layer 16 and contributing to ensuring the adhesion between the carrier 12 and the release layer 16. Examples of the metal constituting the intermediate layer 14 include Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, Mo, and combinations thereof (hereinafter sometimes referred to as metal M). Preferably, they are Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, Mo, and combinations thereof. More preferably, they are Cu, Ti, Zr, Al, Cr, W, Ni, Mo, and combinations thereof. Even more preferably, they are Cu, Ti, Al, Cr, Ni, Mo, and combinations thereof. Particularly preferably, they are Cu, Ti, Al, Ni, and combinations thereof. The intermediate layer 14 may be a pure metal or an alloy. The metal constituting the intermediate layer 14 may contain impurities caused by raw material components, film formation processes, etc. Also, although not particularly limited, when the intermediate layer 14 is exposed to the atmosphere after film formation, the presence of oxygen mixed therein due to this is acceptable. The upper limit of the content of the above metal is not particularly limited and may be 100 atomic%. The intermediate layer 14 is preferably a layer formed by a physical vapor deposition (PVD) method, more preferably a layer formed by sputtering. The intermediate layer 14 is particularly preferably a layer formed by a magnetron sputtering method using a metal target from the viewpoint of the uniformity of the film thickness distribution. The thickness of the intermediate layer 14 is preferably 10 nm or more and 1000 nm or less, more preferably 30 nm or more and 800 nm or less, even more preferably 60 nm or more and 600 nm or less, and particularly preferably 100 nm or more and 400 nm or less. By setting the thickness in this way, it becomes possible to obtain an intermediate layer having the same roughness as the carrier. This thickness is a value measured by analyzing the layer cross-section with an energy dispersive X-ray spectrometer (TEM-EDX) of a transmission electron microscope.

[0028] The intermediate layer 14 may be a single-layer structure or a multi-layer structure of two or more layers. When the intermediate layer 14 is a single-layer structure, the intermediate layer 14 preferably comprises a layer containing a metal composed of Cu, Al, Ti, Ni, or a combination thereof (e.g., alloy or intermetallic compound), more preferably Al, Ti, or a combination thereof (e.g., alloy or intermetallic compound), and still more preferably a layer mainly containing Al or a layer mainly containing Ti. On the other hand, when a metal or alloy that does not have a sufficiently high adhesion to the carrier 12 is used for the intermediate layer 14, it is preferable to form the intermediate layer 14 into a two-layer structure. An example of a preferable two-layer structure of the intermediate layer 14 is a laminated structure composed of a Ti-containing layer adjacent to the carrier 12 and a Cu-containing layer adjacent to the release layer 16. Further, since the peel strength changes when the balance of the constituent elements and thicknesses of each layer in the two-layer structure is changed, it is preferable to appropriately adjust the constituent elements and thicknesses of each layer. In this specification, the category of the "layer containing metal M" includes alloys containing elements other than metal M as long as the peelability of the carrier is not impaired. Therefore, the intermediate layer 14 can also be said to be a layer mainly containing metal M. From the above points, the content ratio of metal M in the intermediate layer 14 is preferably 50 atomic% or more and 100 atomic% or less, more preferably 60 atomic% or more and 100 atomic% or less, still more preferably 70 atomic% or more and 100 atomic% or less, particularly preferably 80 atomic% or more and 100 atomic% or less, and most preferably 90 atomic% or more and 100 atomic% or less.

[0029] When the intermediate layer 14 is made of an alloy, examples of preferred alloys include Ni alloys. The Ni alloy preferably has a Ni content of 45 wt% or more and 98 wt% or less, more preferably 55 wt% or more and 90 wt% or less, and even more preferably 65 wt% or more and 85 wt% or less. A preferred Ni alloy is an alloy of Ni and at least one selected from the group consisting of Cr, W, Ta, Co, Cu, Ti, Zr, Si, C, Nd, Nb, and La, and more preferably an alloy of Ni and at least one selected from the group consisting of Cr, W, Cu, and Si. When the intermediate layer 14 is a Ni alloy layer, it is particularly preferable from the viewpoint of the uniformity of the film thickness distribution that the layer is formed by a magnetron sputtering method using a Ni alloy target.

[0030] The release layer 16 is a layer that enables or facilitates the release of the carrier 12 and, if present, the intermediate layer 14. In addition to being peelable by physically applying force, the release layer 16 may also be peelable by a laser peeling method (laser lift-off, LLO). When the release layer 16 is made of a material that can be peeled off by laser lift-off, the release layer 16 may be made of a resin whose interfacial adhesion strength decreases upon irradiation with a laser beam after curing, or may be a layer of silicon, silicon carbide, metal oxide, etc. that is modified by laser beam irradiation. Also, the release layer 16 may be either an organic release layer or an inorganic release layer, but is preferably an inorganic release layer from the viewpoint of heat resistance. Examples of organic components used in the organic release layer include nitrogen-containing organic compounds, sulfur-containing organic compounds, carboxylic acids, etc. Examples of nitrogen-containing organic compounds include triazole compounds, imidazole compounds, etc. On the other hand, examples of inorganic components used in the inorganic release layer include metal oxides or metal oxynitrides containing at least one of Ni, Mo, Co, Cr, Fe, Ti, W, P, Zn, Cu, Al, Nb, Zr, Ta, Ag, In, Sn, Ga, or a carbon layer, etc. Among these, in particular, the release layer 16 preferably contains carbon, more preferably a carbon-containing layer, i.e., a layer mainly composed of carbon, from the viewpoints of ease of peeling and film-forming properties, etc., still more preferably a layer mainly composed of carbon or hydrocarbon, and particularly preferably a layer made of amorphous carbon which is a hard carbon film. In this case, the release layer 16 (i.e., the carbon-containing layer) preferably has a carbon concentration measured by XPS of 60 atomic% or more, more preferably 70 atomic% or more, still more preferably 80 atomic% or more, and particularly preferably 85 atomic% or more. The upper limit value of the carbon concentration is not particularly limited and may be 100 atomic%, but 98 atomic% or less is realistic. The release layer 16 may contain impurities (e.g., oxygen, hydrogen, etc. derived from the surrounding environment such as the atmosphere). Also, due to film-forming techniques such as the metal layer 18, etc., metal atoms of types other than the metal contained as the release layer 16 may be mixed into the release layer 16.When a carbon-containing layer is used as the release layer 16, the mutual diffusibility and reactivity with the carrier are small, and even when subjected to press working or the like at a temperature exceeding 300°C, the formation of metal bonds due to high-temperature heating between the metal layer (if present) and the bonding interface can be prevented, and the state where the carrier can be easily peeled off and removed can be maintained. This release layer 16 is preferably a layer formed by a vapor phase method such as sputtering from the viewpoint of suppressing excessive impurities in the release layer 16 and the point of continuous productivity with the film formation of the intermediate layer 14 provided as desired. When a carbon-containing layer is used as the release layer 16, the thickness is preferably 1 nm or more and 20 nm or less, more preferably 1 nm or more and 10 nm or less. By setting the thickness in this way, it is possible to obtain a release layer having roughness equivalent to that of the carrier and having a release function. This thickness is a value measured by analyzing the layer cross section with an energy dispersive X-ray spectrometer (TEM-EDX) of a transmission electron microscope.

[0031] The release layer 16 may include each layer of a metal oxide layer and a carbon-containing layer, or may be a layer containing both a metal oxide and carbon. In particular, when the adhesive laminate sheet 10 includes the intermediate layer 14 and the metal layer 18, the carbon-containing layer contributes to stable peeling of the carrier 12, and the metal oxide layer can suppress the diffusion accompanying the heating of the metal elements derived from the intermediate layer 14 and the metal layer 18. As a result, stable peelability can be maintained even after heating at a high temperature of, for example, 350° C. or higher. The metal oxide layer is preferably a layer containing an oxide of a metal composed of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, Mo, or a combination thereof. The metal oxide layer is particularly preferably a layer formed by a reactive sputtering method in which sputtering is performed in an oxidizing atmosphere using a metal target, because the film thickness can be easily controlled by adjusting the film formation time. The thickness of the metal oxide layer is preferably 0.1 nm or more and 100 nm or less. The upper limit value of the thickness of the metal oxide layer is more preferably 60 nm or less, still more preferably 30 nm or less, and particularly preferably 10 nm or less. This thickness is a value measured by analyzing the layer cross section with an energy dispersive X-ray spectrometer (TEM-EDX) of a transmission electron microscope. At this time, the order in which the metal oxide layer and the carbon layer are laminated as the release layer 16 is not particularly limited. Further, the release layer 16 may exist in a state of a mixed phase (that is, a layer containing both a metal oxide and carbon) in which the boundary between the metal oxide layer and the carbon-containing layer is not clearly specified.

[0032] Similarly, from the viewpoint of maintaining stable peelability even after heat treatment at a high temperature, the release layer 16 may be a metal-containing layer in which the surface on the side adjacent to the adhesive layer 20 (or the metal layer 18 if present) is a fluorinated surface and / or a nitrided surface. In the metal-containing layer, it is preferable that a region where the sum of the fluorine content and the nitrogen content is 1.0 atomic% or more (hereinafter referred to as the “(F+N) region”) exists over a thickness of 10 nm or more, and the (F+N) region is preferably present on the adhesive layer 20 side of the metal-containing layer. The thickness (in terms of SiO2 conversion) of the (F+N) region is a value specified by performing depth-direction elemental analysis of the adhesive laminated sheet 10 using XPS. The fluorinated surface or nitrided surface can be preferably formed by reactive ion etching (RIE) or reactive sputtering method. On the other hand, the metal element contained in the metal-containing layer preferably has a negative standard electrode potential. Preferred examples of the metal element contained in the metal-containing layer include Cu, Ag, Sn, Zn, Ti, Al, Nb, Zr, W, Ta, Mo, and combinations thereof (for example, alloys and intermetallic compounds). The content rate of the metal element in the metal-containing layer is preferably 50 atomic% or more and 100 atomic% or less. The metal-containing layer may be a single layer composed of one layer or a multilayer composed of two or more layers. The thickness of the entire metal-containing layer is preferably 10 nm or more and 1000 nm or less, more preferably 30 nm or more and 500 nm or less, still more preferably 50 nm or more and 400 nm or less, and particularly preferably 100 nm or more and 300 nm or less. The thickness of the metal-containing layer itself is a value measured by analyzing the layer cross section with an energy dispersive X-ray spectrometer (TEM-EDX) of a transmission electron microscope.

[0033] Alternatively, the release layer 16 may be a metal oxynitride-containing layer instead of a carbon layer or the like. The surface of the metal oxynitride-containing layer on the side opposite to the carrier 12 (i.e., the adhesive layer 20 side) preferably contains at least one metal oxynitride selected from the group consisting of TaON, NiON, TiON, NiWON, and MoON. Further, when the adhesive laminated sheet 10 includes the metal layer 18, from the viewpoint of ensuring the adhesion between the carrier 12 and the metal layer 18, the surface of the metal oxynitride-containing layer on the carrier 12 side preferably contains at least one selected from the group consisting of Cu, Ti, Ta, Cr, Ni, Al, Mo, Zn, W, TiN, and TaN. By doing so, it becomes possible to suppress the number of foreign particles on the surface of the metal layer 18 and maintain a stable release strength even after being heated at a high temperature for a long time. The thickness of the metal oxynitride-containing layer is preferably 5 nm or more and 500 nm or less, more preferably 10 nm or more and 400 nm or less, still more preferably 20 nm or more and 200 nm or less, and particularly preferably 30 nm or more and 100 nm or less. This thickness is a value measured by analyzing the layer cross section with an energy dispersive X-ray spectrometer (TEM-EDX) of a transmission electron microscope.

[0034] The metal layer 18 provided as desired is a layer composed of a metal. By interposing the metal layer 18 between the release layer 16 and the adhesive layer 20, the carrier 12 (and the intermediate layer 14 if present) can be peeled off more smoothly. The metal layer 18 may be a single-layer structure or a multi-layer structure of two or more layers. Preferred examples of the metal constituting the metal layer 18 include Ti, Cu, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, Mo, and combinations thereof. More preferably, they are Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, Mo, and combinations thereof. Even more preferably, they are Cu, Ti, Al, Cr, Ni, Mo, and combinations thereof. Particularly preferably, they are Cu, Ti, Al, Ni, and combinations thereof. The metal layer 18 may be a pure metal or an alloy. The metal constituting the metal layer 18 may contain impurities due to raw material components, film formation processes, etc. Also, the upper limit of the content of the above metal is not particularly limited and may be 100 atomic%. The metal layer 18 is preferably a layer formed by a physical vapor deposition (PVD) method, more preferably a layer formed by sputtering. The thickness (total thickness) of the metal layer 18 is preferably 10 nm or more and 1000 nm or less, preferably 20 nm or more and 900 nm or less, more preferably 30 nm or more and 800 nm or less, even more preferably 40 nm or more and 700 nm or less, and particularly preferably 50 nm or more and 500 nm or less. By doing so, the removal of the metal layer 18 can be performed in an extremely short time, and the peeling and removal of the adhesive laminated sheet 10 after being used as a reinforcing sheet can be performed more promptly. The thickness of the metal layer 18 is a value measured by analyzing the layer cross-section with an energy dispersive X-ray spectrometer (TEM-EDX) of a transmission electron microscope.

[0035] The formation of each of the intermediate layer 14 (if present), the release layer 16, and the metal layer 18 (if present) is preferably performed by a physical vapor deposition (PVD) method. Examples of the physical vapor deposition (PVD) method include a sputtering method, a vacuum evaporation method, and an ion plating method. However, the sputtering method is most preferable in terms of the fact that film thickness control can be performed in a wide range such as 0.05 nm or more and 5000 nm or less, and the film thickness uniformity can be ensured over a wide width or area. In particular, by forming all of the intermediate layer 14 (if present), the release layer 16, and the metal layer 18 (if present) by the sputtering method, the manufacturing efficiency is significantly increased. Therefore, the intermediate layer 14 (if present), the release layer 16, and the metal layer 18 (if present) are all preferably physical vapor deposition (PVD) films, that is, films formed by the physical vapor deposition (PVD) method, and more preferably sputtered films, that is, films formed by the sputtering method.

[0036] Film formation by physical vapor deposition (PVD) method may be carried out according to known conditions using a known vapor deposition apparatus and is not particularly limited. For example, when the sputtering method is adopted, the sputtering method may be various known methods such as magnetron sputtering, two-pole sputtering method, opposed target sputtering method, etc., but magnetron sputtering is preferable in terms of high film formation speed and high productivity. Sputtering may be performed using either DC (direct current) or RF (radio frequency) power supply. Also, a plate-shaped target, which is widely known, can be used as the target shape, but it is desirable to use a cylindrical target from the viewpoint of target use efficiency. The purity of the target is preferably 99.9% or more. As the gas used for sputtering, an inert gas such as argon gas is preferably used. The flow rate of argon gas may be appropriately determined according to the sputtering chamber size and film formation conditions and is not particularly limited. Also, from the viewpoint of continuously forming a film without operating failures such as abnormal discharge and poor plasma irradiation, the pressure during film formation is preferably in the range of 0.1 Pa or more and 20 Pa or less. This pressure range may be set by adjusting the film formation power and the flow rate of argon gas according to the apparatus structure, capacity, exhaust capacity of the vacuum pump, rated capacity of the film formation power supply, etc. Also, the sputtering power may be appropriately set within the range of 0.05 W / cm 2 or more and 10.0 W / cm 2 or less per unit area of the target considering film thickness uniformity, productivity, etc.

[0037] When the adhesive laminated sheet 10 has a metal layer 18 or the like, it is preferable that the metal layer 18, optionally the intermediate layer 14, and optionally the release layer 16 (that is, at least the metal layer 18, for example, the metal layer 18 and the intermediate layer 14) extend to the end face of the carrier 12 so that the end face is covered. That is, it is preferable that not only the surface of the carrier 12 but also the end face is covered with at least the metal layer 18. By covering the end face as well, it is possible to prevent the infiltration of chemical solutions into the carrier 12 in the manufacturing process of the wiring board and the like. In addition, it is possible to strongly prevent chipping due to peeling at the side end when handling the adhesive laminated sheet 10, that is, chipping of the film (that is, the metal layer 18) on the release layer 16. The covered area at the end face of the carrier 12 is preferably an area of 0.1 mm or more, more preferably an area of 0.2 mm or more, and still more preferably an area covering the entire end face of the carrier 12, in the thickness direction (that is, the direction perpendicular to the carrier surface) from the surface of the carrier 12.

[0038] The thickness of the entire adhesive laminated sheet 10 is not particularly limited, but is preferably 100 μm or more and 5000 μm or less, more preferably 130 μm or more and 4800 μm or less, still more preferably 150 μm or more and 4500 μm or less, and particularly preferably 200 μm or more and 4000 μm or less. The size of the adhesive laminated sheet 10 is not particularly limited, but is preferably a diameter of 10 cm or more or a 10 cm square or more, more preferably a diameter of 20 cm or more or a 20 cm square or more, and still more preferably a diameter of 25 cm or more or a 25 cm square or more. The upper limit of the size of the adhesive laminated sheet 10 is not particularly limited, but a diameter of 1000 cm or a 1000 cm square can be mentioned as one guide for the upper limit. Further, the adhesive laminated sheet 10 is in a form that can be handled alone.

[0039] Laminated body According to a preferred embodiment of the present invention, a laminate including an adhesive laminate sheet is provided. An example of the laminate of the present invention is shown in FIG. 2. As shown in FIG. 2, the laminate 30 includes an adhesive laminate sheet 10, a resin-containing layer 40 provided on the adhesive layer 20 of the adhesive laminate sheet 10, and an additional metal layer 38 provided on the resin-containing layer 40. Optionally, the laminate 30 may further include an additional release layer 36 provided on the additional metal layer 38 and an additional carrier 32 provided on the additional release layer 36. Further, the laminate 30 may further include an additional intermediate layer 34 between the additional release layer 36 and the additional carrier 32.

[0040] The laminate 30 corresponds to an intermediate product after laminating the adhesive laminate sheet 70 on the laminate 50 or an intermediate product after peeling off the first carrier 52 or the like in the method for manufacturing a wiring board described below. Therefore, the preferred embodiments of the laminate 50 described below are directly applicable as the preferred embodiments of the laminate 30.

[0041] Method for manufacturing a wiring board According to another preferred embodiment of the present invention, a method for manufacturing a wiring board using an adhesive laminate sheet is provided. This method includes the steps of: (1) preparing a laminate; (2) laminating an adhesive laminate sheet; (3) peeling off the first carrier; (4) optionally laminating an additional adhesive laminate sheet; (5) peeling off the second carrier; (6) removing the second release layer; and (7) removing the adhesive layer. Hereinafter, each of steps (1) to (7) will be described with reference to the drawings.

[0042] (1) Preparation of a laminate An example of the method for manufacturing a wiring board of the present invention is shown in FIGS. 3 to 6. First, as shown in FIG. 3(i), a laminate 50 is prepared. This laminate 50 includes a first carrier 52, a first intermediate layer 54 (optional layer) if desired, a first release layer 56, a first metal layer 58, and a resin-containing layer 60 in this order. The first carrier 52, the first intermediate layer 54, the first release layer 56, and the first metal layer 58 may be in accordance with a metal foil with a carrier as disclosed in Patent Document 2 (International Publication No. 2017 / 150283) and Patent Document 3 (International Publication No. 2017 / 150284), and are not particularly limited. Alternatively, these various layers may be in accordance with the preferred embodiments of the carrier 12, the intermediate layer 14, the release layer 16, and the metal layer 18 described above with respect to the adhesive laminate sheet 10.

[0043] The resin-containing layer 60 is a layer containing resin and preferably includes a rewiring layer. In the present invention, the rewiring layer means a layer including an insulating layer and a wiring layer formed inside and / or on the surface of the insulating layer. As will be described later, the resin-containing layer 60 preferably includes a first rewiring layer 60a provided on the first metal layer 58, a mold resin layer 60b provided on the first rewiring layer 60a, and a second rewiring layer 60c provided on the mold resin layer 60b. The mold resin layer 60b is a layer containing resin for encapsulating an electronic element such as a chip. Therefore, the mold resin layer 60b can embed an electronic element. Examples of the electronic element include a semiconductor element, a chip capacitor, a resistor, and the like. Preferred examples of the resin contained in the resin-containing layer 60 (typically the mold resin layer 60b) include an epoxy resin and a phenol resin.

[0044] An example of a preferred method for forming the resin-containing layer 60 is shown in FIGS. 7 and 8. First, a metal foil with a carrier having a first intermediate layer 54 (optional layer), a first release layer 56, and a first metal layer 58 in this order is prepared on the first carrier 52 (FIG. 7(i)). On the surface of the first metal layer 58 of this metal foil with a carrier, a wiring layer and an insulating layer are formed by a coreless build-up method to obtain a first rewiring layer 60a (FIG. 7(ii)). Specifically, a photoresist is laminated on the first metal layer 58, exposed and developed to form a resist pattern so as to have a predetermined pattern. Then, electroplating (for example, electrocopper plating) is performed between the resist patterns, and after peeling the resist pattern, unnecessary portions of the first metal layer 58 (that is, portions where wiring patterns are not formed) exposed by peeling the resist pattern are removed by etching to form a first wiring layer. Thereafter, an insulating layer and an nth wiring layer (n is an integer of 2 or more) are alternately formed on the surface of the metal foil with a carrier on which the first wiring layer is formed. In this way, a first rewiring layer 60a including an insulating layer and a wiring layer formed inside and / or on the surface of the insulating layer is obtained. If desired, formation of pillars (columnar electrodes) P, mounting of chips C, etc. can also be performed on the first rewiring layer 60a (FIG. 7(iii)). By embedding the pillars P, chips C, etc. with an insulating resin, a molded resin layer 60b may be formed (FIG. 8(iv)). Further, by surface polishing the molded resin layer 60b, the pillars P, etc. may be exposed from the molded resin layer 60b (FIG. 8(v)). Preferred examples of surface polishing include grinding using a grindstone and chemical mechanical polishing (CMP). Thereafter, a second rewiring layer 60c is formed on the surface of the molded resin layer 60b by the coreless build-up method described above (FIG. 8(vi)). In this way, a laminate 50 including a resin-containing layer 60 including a first rewiring layer 60a, a molded resin layer 60b, and a second rewiring layer 60c can be preferably produced on the first metal layer 58 of the metal foil with a carrier.

[0045] If desired, before laminating the adhesive laminated sheet described later, the peripheries of the first carrier 52, the first intermediate layer 54, the first release layer 56, the first metal layer 58 and / or the resin-containing layer 60 may be trimmed (FIG. 3(ii)). By doing so, starting from the trimmed portion, the release of the first carrier 52 and the like described later can be made even easier. The trimming method is not particularly limited, and for example, a cutting tool T (for example, a cutter) or a machine tool (for example, a cutting blade) as shown in FIG. 3(ii) can be used.

[0046] (2) Lamination of the Adhesive Laminated Sheet The adhesive laminated sheet 70 is laminated on the laminate 50 (FIG. 3(iii)). The adhesive laminated sheet 70 includes a second carrier 72, a second intermediate layer 74 (optional layer) if desired, a second release layer 76, a second metal layer 78 (optional layer) if desired, and an adhesive layer 80 containing an adhesive material in this order. Then, the adhesive laminated sheet 70 is laminated on the laminate 50 such that the adhesive layer 80 and the resin-containing layer 60 are in contact with each other. By doing so, the resin-containing layer 60 can be reinforced by the second carrier 72 and the like, and it is possible to prevent or suppress the resin-containing layer 60 from locally curving greatly when the first carrier 52 is peeled off or the like. In particular, when the resin-containing layer 60 includes a redistribution layer, it is possible to avoid disconnection or peeling of the wiring layer on the surface and / or inside of the redistribution layer, and improve the connection reliability of the redistribution layer. In addition, by effectively preventing or suppressing the curvature, the flatness (coplanarity) of the surface of the redistribution layer can also be improved. When laminating the adhesive laminated sheet 70 on the laminate 50, an additional release layer (not shown) may be interposed between the adhesive layer 80 and the resin-containing layer 60. By doing so, after peeling off the first carrier 52 described later, when peeling off the second carrier 72, the second carrier 72 and the like can be peeled off starting from the additional release layer, and the amount of residue of the adhesive layer 80 that may remain on the surface of the resin-containing layer 60 can be significantly reduced. The preferred embodiment of the additional release layer is not particularly limited, and for example, it may be in accordance with the preferred embodiment of the release layer 16 described above.

[0047] The preferred embodiments of the above-described adhesive laminated sheet 10 are directly applicable to the adhesive laminated sheet 70 as well. That is, the second carrier 72, the second intermediate layer 74, the second release layer 76, the second metal layer 78, and the adhesive layer 80 may each conform to the carrier 12, the intermediate layer 14, the release layer 16, the metal layer 18, and the adhesive layer 20 described above. When the adhesive layer 80 contains a thermosetting resin as an adhesive material, it is preferable to perform a curing treatment (cure treatment) after laminating the adhesive laminated sheet 70 on the laminate 50. The conditions of the curing treatment can be appropriately determined according to the type of the thermosetting resin and the like, and are not particularly limited.

[0048] The second carrier 72 preferably has a Vickers hardness lower than that of the first carrier 52. Thereby, by the second carrier 72 itself being bent, the stress that may occur during lamination or peeling can be effectively released, and as a result, the bending of the resin-containing layer 60 can be more effectively prevented or suppressed. The Vickers hardness of the second carrier 72 is preferably 2% or more and 99% or less of the Vickers hardness of the first carrier 52, more preferably 6% or more and 90% or less, and still more preferably 10% or more and 85% or less. Preferably, the Vickers hardness of the second carrier 72 is 50 HV or more and 700 HV or less, and the Vickers hardness of the first carrier 52 is 500 HV or more and 3000 HV or less. More preferably, the Vickers hardness of the second carrier 72 is 150 HV or more and 550 HV or less, and the Vickers hardness of the first carrier 52 is 550 HV or more and 2500 HV or less. Still more preferably, the Vickers hardness of the second carrier 72 is 200 HV or more and 500 HV or less, and the Vickers hardness of the first carrier 52 is 600 HV or more and 2000 HV or less. In this specification, the Vickers hardness is measured in accordance with the "Vickers hardness test" described in JIS Z 2244-2009.

[0049] For reference, the Vickers hardness HV of various candidate materials is exemplified below: sapphire glass (2300 HV), cemented carbide (1700 HV), cermet (1650 HV), quartz (crystal) (1103 HV), SKH56 (high-speed tool steel, HSS) (722 HV), tempered glass (640 HV), SUS440C (stainless steel) (615 HV), SUS630 (stainless steel) (375 HV), 60 types of titanium alloys (64 alloys) (around 280 HV), Inconel (heat-resistant nickel alloy) (150 HV or more and 280 HV or less), S45C (carbon steel for mechanical structures) (201 HV or more and 269 HV or less), Hastelloy alloy (corrosion-resistant nickel alloy) (100 HV or more and 230 HV or less), SUS304 (stainless steel) (187 HV), SUS430 (stainless steel) (183 HV), cast iron (160 HV or more and 180 HV or less), titanium alloy (110 HV or more and 150 HV or less), brass (80 HV or more and 150 HV or less), and bronze (50 HV or more and 100 HV or less).

[0050] (3) Peeling of the first carrier The first carrier 52 (and the first intermediate layer 54 if present) is peeled off from the laminate 50 on which the adhesive laminate sheet 70 is laminated by the first release layer 56 (Fig. 4(iv)). At this time, since the second carrier 72 or the like reinforces the resin-containing layer 60, it is possible to prevent the resin-containing layer 60 from being locally and greatly curved when the first carrier 52 or the like is peeled off. That is, the second carrier 72 or the like can reinforce the resin-containing layer 60 against the peeling force while the first carrier 52 is being peeled off, and can effectively prevent or suppress the curvature. The peeling of the first carrier 52 is preferably performed by a laser lift-off method of peeling with a laser or a mechanical method of peeling by physically applying a force using a machine.

[0051] If desired, after peeling the first carrier 52, the remaining first release layer 56 and the first metal layer 58 may be removed from the laminate 50 (Fig. 4(v)). The method for removing the first release layer 56 and the first metal layer 58 is not particularly limited, and a known method may be appropriately selected according to the material of the first release layer 56 and the first metal layer 58, etc. For example, when the first release layer 56 is a carbon layer, the first release layer 56 can be preferably removed by performing oxygen plasma treatment on the laminate. Also, the removal of the first metal layer 58 can be performed, for example, by bringing an etching solution capable of dissolving the first metal layer 58 into contact therewith.

[0052] After removing the first release layer 56 and the first metal layer 58, various electronic elements such as integrated passive devices I and solder balls B may be mounted on the resin-containing layer 60 (for example, the first rewiring layer 60a) by a known method (Fig. 4(vi)), and then resin encapsulation may be performed. Also, in order to smoothly peel the second carrier 72 described later, the periphery of the adhesive laminated sheet 70 (for example, the second carrier 72, the second intermediate layer 74, the second release layer 76 and / or the second metal layer 78) may be trimmed using a cutting tool T or the like (Fig. 5(vii)).

[0053] If desired, after laminating the adhesive laminated sheet 70 and before peeling the second carrier 72 described later, the laminate 50 may be heated at 100°C or higher and 350°C or lower (preferably 200°C or higher and 300°C or lower). Such a heat treatment can be performed, for example, for the purpose of reflow soldering of the various electronic elements described above.

[0054] (4) Lamination of an additional adhesive laminated sheet (optional process) If desired, after peeling the first carrier 52 and before peeling the second carrier 72 described later, an additional adhesive laminated sheet 90 is laminated on the surface of the laminate 50 on the side from which the first carrier 52 has been peeled (FIG. 5(viii)). The additional adhesive laminated sheet 90 includes a third carrier 92, a third intermediate layer 94 (optional layer) if desired, a third release layer 96, a third metal layer 98 (optional layer) if desired, and a second adhesive layer 100 containing an adhesive material, in this order. Then, the additional adhesive laminated sheet 90 is laminated on the laminate 50 such that the second adhesive layer 100 contacts the surface of the laminate 50 on the side from which the first carrier 52 has been peeled. By doing so, the handleability of the laminate after peeling the second carrier 72 is improved, and local bending of the resin-containing layer 60 can be further prevented or suppressed. When, after peeling the first carrier 52 or the like, integrated passive devices I, solder balls B, etc. are mounted on the resin-containing layer 60 (for example, the first rewiring layer 60a), as shown in FIG. 5(viii), it is preferable to laminate the additional adhesive laminated sheet 90 such that the solder balls B or the like are embedded in the second adhesive layer 100. Therefore, the thickness of the second adhesive layer 100 is preferably greater than the height of the solder balls B or the like mounted on the resin-containing layer 60.

[0055] The preferred embodiments of the adhesive laminated sheet 10 described above also apply as they are to the additional adhesive laminated sheet 90. That is, the third carrier 92, the third intermediate layer 94, the third release layer 96, the third metal layer 98, and the second adhesive layer 100 may each conform to the carrier 12, the intermediate layer 14, the release layer 16, the metal layer 18, and the adhesive layer 20 described above.

[0056] (5) Peeling of the second carrier The second carrier 72 is peeled from the laminate 50 from which the first carrier 52 has been peeled, using the second release layer 76 (FIG. 5(ix)). By first peeling and removing the second carrier 72 that has served as a reinforcing sheet, it becomes possible to smoothly remove the second release layer 76, the second metal layer 78 (if present), and the adhesive layer 80 described later.

[0057] The method for peeling the second carrier 72 may be appropriately determined according to the material of the second release layer 76 and the like, and is not particularly limited. For example, the above-described laser lift-off method or mechanical method can be preferably employed.

[0058] (6) Removal of the second release layer The second release layer 76 (and the second metal layer 78 if present) is removed from the laminate 50 from which the second carrier 72 has been peeled, thereby exposing the adhesive layer 80 (FIG. 6(x)). The method for removing the second release layer 76 is not particularly limited, and a known method may be appropriately selected according to the material of the second release layer 76 and the like. For example, when the second release layer 76 is a carbon layer, the second release layer 76 can be preferably removed by performing oxygen plasma treatment on the laminate 50. When the adhesive laminate sheet 70 has the second metal layer 78 and the amount of the second release layer 76 remaining in the laminate 50 is small, etc., instead of removing the second release layer 76 alone, the second release layer 76 and the second metal layer 78 may be removed simultaneously. That is, by removing the second metal layer 78 first, the second release layer 76 can also be removed together. The second metal layer 78 can be removed, for example, by bringing an etching solution capable of dissolving the second metal layer 78 into contact therewith.

[0059] (7) Removal of the adhesive layer The adhesive layer 80 is removed from the laminate 50 from which the second release layer 76 and the like have been removed (FIG. 6(xi)). The method for removing the adhesive layer 80 is not particularly limited, and a known method may be appropriately selected according to the material of the adhesive layer 80 and the like. For example, the adhesive layer 80 can be dissolved or softened and removed by bringing a solution capable of dissolving the adhesive layer 80 into contact therewith. In any case, according to the present invention, since the adhesive layer 80 can be directly removed without the intervention of a reinforcing sheet (such as the second carrier 72), it is possible to realize the peeling and removal of the adhesive laminate sheet 70 in a short time.

[0060] After removing the subsequent layer 80, a step of mounting an electronic element such as a chip on the exposed resin-containing layer 60 (for example, the second rewiring layer 60c) may be further performed to obtain a wiring board. By stacking a plurality of IC packages together with the chip C that can be embedded in the resin-containing layer 60 (for example, the mold resin layer 60b) described above and mounting them on a substrate, the integration density can be improved. Also, the third carrier 92, the third intermediate layer 94 (if present), the third release layer 96, the third metal layer 98 (if present), and the second adhesive layer 100 may be removed by the same method as the adhesive laminated sheet 70. In any case, by performing various known processes on the laminate 50, a wiring board as a final product can be obtained.

[0061] Examples of the electronic element mounted on the resin-containing layer 60 assumed as an optional step include semiconductor elements, chip capacitors, resistors, etc. as described above. Examples of the method of mounting the electronic element include a flip chip mounting method, a die bonding method, etc. The flip chip mounting method is a method of joining the mounting pads of the electronic element and a rewiring layer or the like. Pillars, solder bumps, etc. may be formed on this mounting pad, and an NCF (Non-Conductive Film), which is a sealing resin film, etc. may be attached to the surface of the rewiring layer before mounting. The joining is preferably performed using a low melting point metal such as solder, but an anisotropic conductive film or the like may also be used. The die bonding adhesion method is a method of adhering the surface of the mounting pad surface of the electronic element to the rewiring layer on the side opposite to it. For this adhesion, it is preferable to use a paste or a film, which is a resin composition containing a thermosetting resin and a thermally conductive inorganic filler.

Example

[0062] The present invention will be described more specifically by the following examples.

[0063] Example 1 After laminating a resin-containing layer on a metal foil with a carrier to obtain a laminate, an adhesive laminated sheet was attached to this laminate. Then, the adhesive laminated sheet and the like were peeled off and removed. Specifically, it is as follows.

[0064] (1) Preparation of the laminate As the first carrier 52, a glass substrate with a size of 100 mm square and a thickness of 1.1 mm (material: soda-lime glass) was prepared. On this first carrier 52, a titanium layer (thickness 50 nm) and a copper layer (thickness 200 nm) as the first intermediate layer 54 with a two-layer structure, an amorphous carbon layer (thickness 6 nm) as the first release layer 56, and a titanium layer (thickness 100 nm) and a copper layer (thickness 300 nm) as the first metal layer 58 with a two-layer structure were deposited in this order by sputtering to obtain a metal foil with a carrier. At this time, by depositing the first metal layer 58 so as to extend to the end face of the carrier 12, the end portion of the first release layer 56 was covered.

[0065] On the first metal layer 58 (metal foil) of the metal foil with a carrier, an insulating layer (material: polyimide resin) with a size of 100 mm square and a thickness of 30 μm was formed as the resin-containing layer 60 to obtain a laminate 50 (see Fig. 3(i)). Then, the peripheral portion (width 10 mm) of the laminate 50 was trimmed using a cutter (see Fig. 3(ii)).

[0066] (2) Lamination of the adhesive laminate sheet As the second carrier 72, a stainless steel sheet with a size of 130 mm square and a thickness of 0.3 mm was prepared. On this second carrier 72, a titanium layer (thickness 50 nm) and a copper layer (thickness 200 nm) as the second intermediate layer 74 with a two-layer structure, an amorphous carbon layer (thickness 6 nm) as the second release layer 76, and a titanium layer (thickness 100 nm) and a copper layer (thickness 300 nm) as the second metal layer 78 with a two-layer structure were deposited in this order by sputtering. Then, a thermosetting epoxy resin film (manufactured by Toray Industries, Inc., TSA-16) with a size of 100 mm square and a thickness of 20 μm was placed on the second metal layer 78, and vacuum lamination was performed for 1 minute under the conditions of a pressure of 0.5 MPa and a temperature of 80 °C to obtain an adhesive laminate sheet 70.

[0067] The obtained adhesive laminated sheet 70 was laminated on the laminate 50 such that the subsequent layer 80 and the resin-containing layer 60 were in contact with each other, and vacuum lamination was performed for 1 minute under the conditions of a pressure of 0.2 MPa and a temperature of 80°C. Thereafter, as a curing treatment, heat treatment was performed at 100°C for 1 hour in an air atmosphere, and then heat treatment was further performed at 170°C for 2 hours. Thus, the adhesive laminated sheet 70 was laminated on the laminate 50 (see Fig. 3(iii)).

[0068] (3) Heat treatment Heat treatment assuming solder reflow was performed on the laminate 50 after the adhesive laminated sheet 70 was laminated. This heat treatment was performed at 260°C for 1 minute in a nitrogen atmosphere.

[0069] (4) Peeling of the first carrier The first carrier 52 was peeled off from the laminate 50 after the heat treatment together with the first intermediate layer 54 (see Fig. 4(iv)). That is, with the adhesive laminated sheet 70 fixed, a force was applied in the direction in which the first carrier 52 and the resin-containing layer 60 were separated, thereby peeling off the first carrier 52 and the first intermediate layer 54.

[0070] (5) Peeling of the second carrier, The second carrier 72 was peeled off from the laminate 50 from which the first carrier 52 had been peeled off together with the second intermediate layer 74 (see Fig. 5(ix)). That is, with the resin-containing layer 60 side (the side from which the first carrier 52 had been peeled off) of the laminate 50 fixed, a force was applied in the direction in which the second carrier 72 and the resin-containing layer 60 were separated, thereby peeling off the second carrier 72 and the second intermediate layer 74.

[0071] (6) Removal of the second release layer and the second metal layer The second release layer 76 remaining in the laminate 50 was removed by ashing. That is, the laminate 50 was placed in an ashing chamber, and after introducing oxygen gas, oxygen was activated by the plasma generation power. As a result, carbon, which is the main component of the second release layer 76, was combined with the activated oxygen to form carbon dioxide, and the second release layer 76 was removed as a reaction product gas. Thereafter, the second metal layer 78 exposed on the surface of the laminate 50 was removed by etching. Specifically, the Ti layer was removed by treating at about 40 °C for 1 minute using a hydrogen peroxide-based alkaline etching solution, and the Cu layer was removed by treating at about 25 °C for 1 minute using a sulfuric acid-hydrogen peroxide-based etching solution. Thus, the adhesive layer 80 was exposed (see Fig. 6(x)).

[0072] (7) Removal of the adhesive layer The resist stripping solution (manufactured by Tokyo Ohka Kogyo Co., Ltd., ST-120) was immersed in the laminate 50 after removing the second release layer 76 and the second metal layer 78 at 50 °C for 3 minutes. As a result, the adhesive layer 80 exposed on the surface of the laminate 50 swelled and dissolved (see Fig. 6(xi)). Thus, according to the adhesive laminate sheet of the present invention, it was confirmed that the peeling and removal after being used as a reinforcing sheet can be carried out promptly.

Claims

1. Career and a release layer disposed on the carrier; a metal layer provided on the release layer and having a thickness of 10 nm to 1000 nm; an adhesive layer provided on the metal layer and including an adhesive material; An adhesive laminated sheet comprising:

2. The adhesive laminate sheet of claim 1 , wherein the carrier is composed of a metal.

3. 3. The adhesive laminate sheet according to claim 1, wherein the carrier is made of at least one material selected from the group consisting of aluminum, stainless steel, copper, titanium, nickel, and duralumin.

4. 3. The adhesive laminate sheet according to claim 1, wherein the adhesive material is at least one selected from the group consisting of thermosetting epoxy resins, thermosetting polyimide resins, photosensitive polyimide resins, acrylic resins, and phenolic resins.

5. The adhesive laminate sheet according to claim 1 or 2, wherein the adhesive layer has a thickness of 1 μm or more and 2000 μm or less.

6. Plan view area A of the carrier Ｃ The planar area A of the adhesive layer Ａ Ratio A Ａ / A Ｃ The adhesive laminate sheet according to claim 1 or 2, wherein the σ is 0.03 or more and 1.0 or less.

7. 3. An adhesive laminate sheet according to claim 1 or 2, wherein the metal layer is composed of at least one metal selected from the group consisting of Ti, Cu, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga and Mo.

8. 3. The adhesive laminate sheet of claim 1, wherein the release layer comprises carbon.

9. A laminate comprising the adhesive laminate sheet according to claim 1 or 2, a resin-containing layer provided on the adhesive layer of the adhesive laminate sheet, and an additional metal layer provided on the resin-containing layer.

10. The laminate of claim 9 , further comprising an additional release layer disposed on the additional metal layer, and an additional carrier disposed on the additional release layer.

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