IC module and IC card

Abstract

To provide an IC module and an IC card that can suppress peeling and damage to an antenna coil.SOLUTION: An IC module according to an embodiment comprises a substrate having a first main surface, an antenna coil provided on the first main surface and formed in a spiral shape, an IC chip mounted at an inner side of the antenna coil on the first main surface and connected to the antenna coil, and a sealing portion formed on the first main surface. The sealing portion comprises a sealing portion main body covering the IC chip, and an extension portion extending from the sealing portion main body outward beyond an outer periphery of the antenna coil and covering a portion of the antenna coil.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] Embodiments of the present invention relate to an IC module and an IC card.

Background Art

[0002] As an IC card (smart card), there is an IC card capable of communicating with the outside in a non-contact manner via an antenna. An IC module used for such an IC card includes, for example, a substrate, an antenna coil provided on the substrate, a large-scale integrated circuit (LSI) which is an IC chip mounted on the inner peripheral side of the antenna coil, and a sealing portion covering the IC chip for protecting the IC chip.

[0003] For example, when forming the sealing portion by injection molding, a sealing portion covering the IC chip and a runner located on the antenna coil are formed on the substrate by resin. After molding, the runner is cut off on the inner peripheral side of the antenna coil and removed from the substrate. At this time, there is a risk that the antenna coil is peeled off or damaged together with the runner, resulting in a decrease in the manufacturing yield of the IC module.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] An object of the present embodiment is to provide an IC module and an IC card capable of suppressing peeling and damage of an antenna coil.

Means for Solving the Problems

[0006] The IC module according to the embodiment includes a substrate, an antenna coil, an IC chip, and a sealing portion. The substrate has a first main surface. The antenna coil is provided on the first main surface and is formed in a spiral shape. The IC chip is mounted on the inner peripheral side of the antenna coil on the first main surface and is connected to the antenna coil. The sealing portion is formed on the first main surface. The sealing portion includes a sealing portion main body and an extending portion. The sealing portion main body covers the IC chip. The extending portion extends outward from the sealing portion main body beyond the outer peripheral edge of the antenna coil and covers a part of the antenna coil.

Brief Description of the Drawings

[0007]

Figure 1

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Figure 12

Best Mode for Carrying Out the Invention

[0008] Hereinafter, each embodiment of the present invention will be described with reference to the drawings. Note that the disclosure is merely an example, and those that can be easily conceived by those skilled in the art for appropriate modifications while maintaining the gist of the invention are naturally included in the scope of the present invention. In addition, in order to make the drawings and the description clearer, the width, thickness, shape, etc. of each part may be schematically represented compared to the actual state, but this is merely an example and does not limit the interpretation of the present invention. Also, in this specification and each figure, the same reference numerals may be assigned to the same elements as those described above with respect to the previously shown figures, and detailed descriptions may be appropriately omitted.

[0009] (First Embodiment) Hereinafter, with reference to the drawings, the IC module according to the first embodiment and the IC card including the same will be described in detail. FIG. 1 is a plan view of an IC card 10 according to the first embodiment. FIG. 2 is a cross-sectional view taken along line A-A shown in FIG. 1. In the figure, the X direction, Y direction, and Z direction that are perpendicular to each other are defined. The X direction corresponds to the length direction of the IC card 10. The Y direction corresponds to the width direction of the IC card 10. The Z direction corresponds to the thickness direction of the IC card 10.

[0010] As shown in FIGS. 1 and 2, the IC card 10 according to the first embodiment constitutes a contact / non-contact composite type IC card. The IC card 10 includes a rectangular plate-shaped card substrate 20 and an antenna integrated type IC module 30 embedded in the card substrate 20. The IC module 30 has a contact terminal portion 100 provided with a plurality of contact terminals that are exposed on the surface of the card substrate 20.

[0011] FIG. 3 is a plan view of the card substrate 20. FIG. 4 is a cross-sectional view of the card substrate 20 taken along line B-B shown in FIG. 3. As shown in FIGS. 3 and 4, the card substrate 20 includes a first recess 21 formed on the surface of the card substrate 20 and a second recess 22 formed at the bottom of the first recess 21.

[0012] As shown in FIGS. 2, 3, and 4, the first recess 21 includes a first accommodating portion 211 that accommodates a substrate 40 of an IC module 30 and an antenna coil 50 to be described later. The first accommodating portion 211 is formed in a size and shape corresponding to the substrate 40 and the antenna coil 50. The second recess 22 includes a second accommodating portion 221 that accommodates a sealing portion main body 71 of a sealing portion 70 to be described later and a third accommodating portion 222 that accommodates an extending portion 72 of the sealing portion 70. The second accommodating portion 221 is formed in a size and shape corresponding to the sealing portion main body 71. The third accommodating portion 222 is formed in a size and shape corresponding to the extending portion 72. By configuring the card substrate 20 in this way, the IC module 30 according to the first embodiment to be described later can be mounted on the card substrate 20, and the structure of the card substrate 20 can be prevented from becoming complicated.

[0013] The card substrate 20 is formed, for example, by laminating a plurality of thin plastic sheets including materials such as polyethylene terephthalate (PET), PET-G, polyvinyl chloride (PVC), and polycarbonate (PC), adhering them by hot pressing to form a sheet having a thickness (0.76 ± 0.08 mm) defined in ISO / IEC 7810, and then punching the sheet into a card shape of a predetermined size and forming the first recess 21 and the second recess 22 by cutting or the like. Alternatively, the card substrate 20 may be injection-molded from a synthetic resin using a card-shaped mold. A transparent overcoat layer may be further laminated on the outermost surface of the card substrate 20.

[0014] Next, the antenna-integrated IC module 30 will be described. FIG. 5 is a perspective view of the IC module 30 according to the first embodiment. FIG. 6 is a plan view of the IC module 30 as viewed from the first main surface S1 side of the substrate 40 excluding the sealing portion 70. In FIG. 6, the sealing portion 70 is represented by a two-dot chain line. FIG. 7 is a cross-sectional view of the IC module 30 taken along the line C-C shown in FIG. 6. FIG. 8 is a plan view of an example of the contact terminal portion 100 of the IC module according to the first embodiment.

[0015] As shown in FIGS. 5, 6, and 7, the IC module 30 includes a substrate 40, an antenna coil 50, an IC chip 60, and a sealing portion 70. The sealing portion 70 includes a sealing portion main body 71 and an extending portion 72.

[0016] The substrate 40 is formed in a plate shape and is rectangular in a plan view. The substrate 40 has a first main surface S1 and a second main surface S2 on the side opposite to the first main surface S1. The substrate 40 is formed of a material having electrical insulation properties, for example, glass epoxy.

[0017] The antenna coil 50 is provided on the first main surface S1 of the substrate 40 and is formed in a spiral shape along the outer peripheral edge of the substrate 40. The antenna coil 50 is formed of a metal such as aluminum, copper, and silver. The antenna coil 50 has an outer peripheral edge 50a that is the outermost periphery and an inner peripheral edge 50b that is the innermost periphery. In one example, the outer peripheral edge 50a has a substantially rectangular shape and is located along the outer peripheral edge of the substrate 40 with a predetermined interval from the outer peripheral edge of the substrate 40. In one example, the inner peripheral edge 50b has a substantially rectangular shape.

[0018] Note that the antenna coil 50 is not limited to a rectangular shape corresponding to the shape of the substrate 40, and may be circular, elliptical, or any other shape. Similarly, the substrate 40 is not limited to a rectangular shape and can be any other arbitrary shape. The number of turns of the antenna coil 50 is not limited to the illustrated example and can be arbitrarily set.

[0019] On the first main surface S1 of the substrate 40, a plurality of connection terminals 81, 82, and antenna connection terminals 51, 52 are provided in the region inside the antenna coil 50. In one example, the antenna connection terminal 51 and the four connection terminals 81 are arranged in a row, and the antenna connection terminal 52 and the four connection terminals 82 are arranged in a row. The row of the antenna connection terminal 51 and the four connection terminals 81 is arranged at an interval from the row of the antenna connection terminal 52 and the four connection terminals 82.

[0020] The antenna connection terminal 51 is connected to one end (inner peripheral side end) 53 of the antenna coil 50 via a wiring 55. The antenna connection terminal 52 is connected to the other end (outer peripheral side end) 54 of the antenna coil 50 via a through hole SH and a wiring 56 formed in the substrate 40. The above-described antenna connection terminals 51, 52, connection terminals 81, 82, and antenna coil 50 are formed by patterning a conductive layer, for example, a metal layer, formed on the first main surface S1.

[0021] FIG. 8 is a plan view of a contact terminal portion 100 provided on the second main surface S2 of the substrate 40. As shown in FIGS. 7 and 8, the composite IC module 30 includes a contact terminal portion 100 provided on the second main surface S2 of the substrate 40. The contact terminal portion 100 includes, for example, contact terminals C1, C2, C3, C4, C5, C6, C7, and C8 for contact communication defined in ISO / IEC 7816. As shown in FIGS. 6 and 7, the connection terminals 81, 82 provided on the first main surface S1 are electrically connected to the corresponding contact terminals C1, C2, C3, C4, C5, C6, C7, and C8 via through holes SH, respectively.

[0022] As shown in FIGS. 6 and 7, the IC chip 60 is mounted on the first main surface S1 of the substrate 40 and on the inner peripheral side of the antenna coil 50. The IC chip 60 is mounted on the first main surface S1 of the substrate 40 via, for example, an adhesive. The IC chip 60 is disposed between four connection terminals 81 and four connection terminals 82. The IC chip 60 is, for example, a semiconductor chip including a large-scale integration (LSI).

[0023] The IC chip 60 is electrically connected to the antenna coil 50. In one example, two electrodes of the IC chip 60 are connected to the antenna connection terminals 51 and 52 by the first connection wiring 91, respectively. Thereby, the IC chip 60 is connected to the inner peripheral end 53 and the outer peripheral end 54 of the antenna coil 50 via the first connection wiring 91 and the antenna connection terminals 51 and 52. The first connection wiring 91 is, for example, a bonding wire formed of a gold wire or the like.

[0024] The IC chip 60 is electrically connected to the contact terminals of the contact terminal portion 100. In one example, a plurality of electrodes of the IC chip 60 are respectively connected to the corresponding connection terminals 81 and 82 by the second connection wiring 92, and are electrically connected to the contact terminals via these connection terminals 81 and 82. The second connection wiring 92 is, for example, a bonding wire formed of a gold wire or the like.

[0025] As shown in FIGS. 5, 6, and 7, a sealing portion 70 is formed on the first main surface S1 of the substrate 40. The sealing portion 70 has a sealing portion main body 71 and an extending portion 72. The sealing portion 70 is formed of a mold resin having electrical insulation properties, for example, an epoxy resin having thermosetting properties.

[0026] The sealing portion main body 71 is formed to overlap with the area inside the antenna coil 50 on the first main surface S1 of the substrate 40. The outer contour of the sealing portion main body 71 is formed in, for example, a rectangular shape and corresponds to the shape of the inner peripheral edge 50b of the antenna coil 50. The sealing portion main body 71 covers the IC chip 60 and protects the IC chip 60. Further, the sealing portion main body 71 covers the antenna connection terminals 51, 52, the connection terminals 81, 82, and a part of the inner peripheral side of the antenna coil 50.

[0027] The extending portion 72 extends from one side of the sealing portion main body 71 across the antenna coil 50 to the outside of the outer peripheral edge 50a of the antenna coil 50. The extending portion 72 has substantially the same thickness as the sealing portion main body 71 (the thickness in the direction perpendicular to the first main surface S1) and is formed to have a width sufficiently smaller than the width of one side of the sealing portion main body 71. The extending portion 72 covers a part of the antenna coil 50. By configuring the sealing portion 70 in this way, in the manufacturing method of the IC module 30 described later, the runner 301 can be cut off outside the outer peripheral edge 50a of the antenna coil 50 and removed from the substrate. Therefore, peeling and damage of the antenna coil can be suppressed, and the manufacturing yield of the IC module can be improved.

[0028] The extending portion 72 has an extending end 73 located between the outer peripheral edge 50a of the antenna coil 50 and the outer peripheral edge of the substrate 40. The extending end 73 only needs to be located at least outside the outer peripheral edge 50a of the antenna coil 50, that is, on the side of the outer peripheral edge of the substrate 40, and may coincide with the outer peripheral edge of the substrate 40. By having the extending portion 72 configured in this way, the sealing portion 70 can accommodate the X - Y plane of the second recess 22 of the card base material 20 that houses the sealing portion 70 within the X - Y plane of the first recess 21. Therefore, it is possible to suppress the complication of the structure of the card base material 20.

[0029] The extending portion 72 is formed such that the cross-sectional area orthogonal to its extending direction is the smallest at the extending end 73. In one example, as shown in FIGS. 5 and 6, the extending portion 72 is formed such that its length in the Y direction decreases toward the extending end 73. Also, in one example, the extending portion 72 is formed such that its thickness in the Z direction decreases toward the extending end 73. Further, in one example, the extending portion 72 is formed such that both its length in the Y direction and its thickness in the Z direction decrease toward the extending end 73. By configuring the extending portion 72 in this way, in the manufacturing method of the IC module 30 described later, the strength of the runner 301 becomes the weakest at the cutting position 302 outside the outer peripheral edge 50a of the antenna coil 50 of the substrate 40. Therefore, the runner 301 can be easily separated at the cutting position 302.

[0030] As shown in FIGS. 1 and 2, the IC module 30 configured as described above is mounted on the card base material 20 by accommodating the substrate 40 and the antenna coil 50 in the first recess 21 of the card base material 20 and accommodating the sealing portion 70 in the second recess 22. Further, the peripheral portion of the first main surface S1 of the substrate 40 of the IC module 30 is adhered to the bottom portion 212 of the first recess 21 by the adhesive 11. The contact terminal portion 100 of the IC module 30 is disposed substantially flush with the surface of the card base material 20 and is exposed to the outside.

[0031] A manufacturing method of the IC module 30 configured as described above will be described. FIGS. 9(a) to (e) are cross-sectional views for explaining the manufacturing process of the IC module 30 according to the first embodiment. FIG. 10 is a plan view of the cavity 201 formed by the upper mold 210 and the lower mold 220 of the transfer molding apparatus 200.

[0032] First, a substrate 40 is prepared on which an antenna coil 50 is provided on the first main surface S1, an IC chip 60 is mounted, and a contact terminal portion 100 is provided on the second main surface S2. Next, a transfer molding apparatus 200 having an upper mold 210 and a lower mold 220 is prepared. As shown in Fig. 9(a), the substrate 40 is placed on the lower mold 220 of the transfer molding apparatus 200 such that the first main surface S1 of the substrate 40 faces upward, and the upper mold 210 and the lower mold 220 are clamped. At this time, as shown in Figs. 9(a) and 10, a cavity 201 having a space 202 with the same shape as the sealing portion main body 71 of the sealing portion 70 and a flow path 203 for supplying resin is formed in the mold. As shown in Figs. 9(b) and (c), the molten resin 300 is supplied to the cavity 201 through the flow path 203. After holding until the resin 300 hardens, the substrate 40 is taken out of the mold. As a result, as shown in Fig. 9(d), on the first main surface S1 of the substrate 40, a sealing portion main body 71 covering the IC chip 60 and a runner 301 formed by hardening of the resin in the flow path 203 and extending outward from the outer peripheral edge of the substrate 40 from the sealing portion main body 71 are formed. As shown in Figs. 9(d) and (e), by cutting the runner 301 at a cutting position 302 outside the outer peripheral edge 50a of the antenna coil 50, an extending portion 72 and an extending end 73 that extend outward from the outer peripheral edge 50a of the antenna coil 50 from the sealing portion main body 71 and cover a part of the antenna coil 50 are formed. In one example, as shown in Fig. 9(d), the cutting position 302 of the runner 301 is located between the outer peripheral edge 50a of the antenna coil 50 and the outer peripheral edge of the substrate 40.

[0033] The shape of the flow path 203 of the cavity 201 is designed such that the cross-sectional area orthogonal to the direction d in which the molten resin 300 is supplied is minimized at the cutting position 302 of the runner 301. Thereby, since the strength of the runner 301 is minimized at the cutting position 302, the runner 301 can be easily cut at the cutting position 302. In one example, as shown in FIG. 10, the shape of the flow path 203 is designed such that its length in the Y direction is minimized at the cutting position 302 of the runner 301. Also, in one example, the flow path 203 is designed such that its thickness in the Z direction is minimized at the cutting position 302 of the runner 301. Also, in one example, the flow path 203 is designed such that both its length in the Y direction and its thickness in the Z direction are minimized at the cutting position 302 of the runner 301.

[0034] As described above, the IC module 30 can be manufactured.

[0035] According to the IC module and the IC card described above, a substrate having a first main surface, an antenna coil provided on the first main surface and formed in a spiral shape, an IC chip mounted on the inner peripheral side of the antenna coil on the first main surface and connected to the antenna coil, and a sealing portion formed on the first main surface are provided. Further, the sealing portion includes a sealing portion main body that covers the IC chip, and an extending portion that extends outward from the outer peripheral edge of the antenna coil from the sealing portion main body and covers a part of the antenna coil. Thereby, in the manufacture of the IC module, the runner can be separated outside the outer peripheral edge of the antenna coil and removed from the substrate. Therefore, peeling and damage of the antenna coil can be suppressed, and the manufacturing yield of the IC module can be improved.

[0036] Also, the IC module and the IC card have an extending end where the extending portion is located between the outer peripheral edge of the antenna coil and the outer peripheral edge of the substrate. Thereby, since the X-Y plane of the second recess of the card base material that houses the sealing portion can be accommodated within the X-Y plane of the first recess, it is possible to suppress the complexity of the structure of the card base material.

[0037] In addition, in the IC module and the IC card, the extension portion is formed such that the cross-sectional area orthogonal to the extension direction is the smallest at the extension end. As a result, when manufacturing the IC module, the strength of the runner is the weakest at the cutting position outside the outer peripheral edge of the antenna coil, so the runner can be easily separated at the cutting position.

[0038] Further, the IC card includes a first recess formed on the surface of the card substrate and a second recess communicating with the bottom of the first recess. The first recess includes a first accommodation portion that accommodates the substrate and the antenna coil, and the second recess includes a second accommodation portion that accommodates the sealing portion main body and a third accommodation portion that accommodates the extension portion. Thereby, the IC module configured as described above can be mounted on the card substrate, and the complexity of the structure of the card substrate can be suppressed.

[0039] Next, an IC card according to another embodiment will be described. In the other embodiments described below, the same parts as those in the above-described first embodiment are denoted by the same reference numerals, and the detailed description thereof is simplified or omitted, and the parts different from the first embodiment will be described in detail. (Second Embodiment) The IC card according to the second embodiment will be described. The IC module 30 and the IC card 10 according to the second embodiment are configured in the same manner as in the first embodiment except for the configuration described in the second embodiment. FIG. 11 is a plan view showing the IC card 10 according to the second embodiment. FIG. 12 is a cross-sectional view taken along line D-D shown in FIG. 11.

[0040] According to the second embodiment, the IC card constitutes a non-contact type IC card 10. As shown in FIGS. 11 and 12, the card substrate 20 of the IC card 10 has a base member 23 and oversheet materials 24a and 24b.

[0041] The base member 23 is formed to extend in a plate shape and has a first plane 231 and a second plane 232 on the side opposite to the first plane 231. The base member 23 is formed of a resin such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), and polycarbonate (PC). The IC module 30 is mounted on the base member 23 such that the second main surface S2 of the substrate 40 is in contact with the first plane 231 of the base member 23.

[0042] The oversheet material 24a covers the first main surface S1 side of the IC module 30 and the first plane 231 of the base member 23, and the oversheet material 24b covers the second plane 232 of the base member 23. The oversheet materials 24a and 24b are formed of a resin such as polyvinyl chloride or polycarbonate. In an example shown in FIG. 12, the oversheet material 24a is composed of two sheets, a surface layer 24a1 and a core layer 24a2. The IC module 30 has the side surface of the substrate 40, the first main surface S1 of the substrate 40 where the sealing portion 70 is not formed, and the side surface of the sealing portion 70 surrounded by the core layer 24a2, and the surface of the sealing portion 70 is covered by the surface layer 24a1. In this way, the IC module 30 is embedded in the card base material 20.

[0043] As shown in FIGS. 11 and 12, the IC module 30 according to the second embodiment does not include a contact terminal portion 100. Therefore, the IC module 30 according to the second embodiment does not have connection terminals 81 and 82 and a second connection wiring 92 for electrically connecting the IC chip 60 to the contact terminals of the contact terminal portion 100.

[0044] Other configurations of the IC module 30 and the IC card 10 are the same as those of the first embodiment described above, and the same reference numerals are given to the same parts and the detailed description thereof is omitted. Also in the second embodiment configured as described above, the same operational effects as those of the first embodiment described above can be obtained.

[0045] Although some embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalent scope thereof. It is also possible to combine a plurality of embodiments as necessary.

Explanation of Reference Numerals

[0046] 10…IC card, 20…card substrate, 30…IC module, 40…substrate, 50…antenna coil, 60…IC chip, 70…sealing portion, 71…sealing portion main body, 72…extension portion, 73…extension end, 81, 82…connection terminals, 91…first connection wiring, 92…second connection wiring, 100…contact terminal portion.

Claims

1. A substrate having a first main surface, An antenna coil provided on the first main surface and formed in a spiral shape, An IC chip mounted on the inner peripheral side of the antenna coil on the first main surface and connected to the antenna coil, A sealing portion formed on the first main surface, comprising: The sealing portion includes a sealing portion main body that covers the IC chip, An extension portion that extends outward from the outer peripheral edge of the antenna coil from the sealing portion main body and covers a part of the antenna coil, an IC module.

2. The IC module according to claim 1, wherein the extension portion has an extension end located between the outer peripheral edge of the antenna coil and the outer peripheral edge of the substrate.

3. The IC module according to claim 2, wherein the extension portion is formed such that the cross-sectional area perpendicular to the extension direction is the smallest at the extension end.

4. A card substrate, An IC module embedded in the card substrate, comprising: The IC module is A substrate having a first main surface, An antenna coil provided on the first main surface and formed in a spiral shape, An IC chip mounted on the inner peripheral side of the antenna coil on the first main surface and connected to the antenna coil, A sealing portion formed on the first main surface and covering the IC chip, comprising: The sealing portion includes a sealing portion main body that covers the IC chip, An extension portion that extends outward from the outer peripheral edge of the antenna coil from the sealing portion main body and covers a part of the antenna coil, an IC card.

5. The card substrate includes a first recess formed on the surface of the card substrate and a second recess communicating with the bottom of the first recess, The first recess includes a first accommodating portion that accommodates the substrate and the antenna coil, The second recess includes a second accommodating portion that accommodates the sealing portion main body and a third accommodating portion that accommodates the extension portion, the IC card according to claim 4.

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