Multilayer electronic component
The multilayer electronic component design addresses moisture penetration issues by incorporating groove portions and plating layers in the external electrodes, enhancing reliability.
Patent Information
- Application Number
- JP2024186968
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-12-20
- Filing Date
- 2024-10-23
- Publication Date
- 2025-07-02
AI Technical Summary
Multilayer ceramic capacitors face issues with moisture penetration that degrade their breakdown voltage and reliability.
A multilayer electronic component design featuring internal electrodes with dielectric layers, external electrodes with plating layers, and groove portions on band portions to complicate moisture penetration paths.
Enhances the moisture resistance reliability of the component by complicating moisture penetration paths, thereby improving overall reliability.
Smart Images
Figure 2025098932000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a multilayer electronic component.
Background Art
[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-type capacitor that is mounted on a printed circuit board of various electronic products such as video devices like liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays a role in charging or discharging electricity. Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its advantages of being small in size, having a guaranteed high capacitance, and being easy to mount.
[0003] In recent years, with the harshness of the usage environment of multilayer ceramic capacitors, there has been a problem that moisture and the like from the outside penetrate into the inside of the main body and deteriorate the breakdown voltage and the like of the multilayer ceramic capacitor. Along with this, research to improve the moisture resistance reliability of multilayer ceramic capacitors has been continuously carried out.
Summary of the Invention
Problems to be Solved by the Invention
[0004] One of the various objects of the present invention is to provide a multilayer electronic component with excellent reliability.
[0005] However, the object of the present invention is not limited to the above content and can be more easily understood in the process of explaining the specific embodiments of the present invention.
Means for Solving the Problems
[0006] A body including a dielectric layer, a first internal electrode and a second internal electrode alternately arranged with the dielectric layer interposed therebetween, a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction, a first connection portion disposed on the third surface, and a first external electrode including a first band portion extending from the first connection portion onto at least one of the first surface, the second surface, the fifth surface, and the sixth surface, a second connection portion disposed on the fourth surface, and a second external electrode including a second band portion extending from the second connection portion onto at least one of the first surface, the second surface, the fifth surface, and the sixth surface, the first external electrode including a first base electrode layer in contact with the first internal electrode, a first lower plating layer disposed on the first base electrode layer, and a first upper plating layer disposed on the first lower plating layer, the second external electrode including a second base electrode layer in contact with the second internal electrode, a second lower plating layer disposed on the second base electrode layer, and a second upper plating layer disposed on the second lower plating layer, the body including a first groove portion and a second groove portion disposed on end portions of the first band portion and the second band portion, respectively, and spaced apart from each other, ends of the first lower plating layer and the first upper plating layer each filling at least a part of the first groove portion, and ends of the second lower plating layer and the second upper plating layer each filling at least a part of the second groove portion, a multilayer electronic component is provided.
Effect of the Invention
[0007] As one of various effects of the present invention, a multilayer electronic component with excellent reliability can be provided.
Brief Description of the Drawings
[0008]
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Figure 12
Embodiments for Carrying Out the Invention
[0009] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various different forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape, size, etc. of the elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.
[0010] In the drawings, parts not relevant to the description are omitted for the purpose of clearly explaining the present invention. The sizes and thicknesses of the components shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to what is shown in the drawings. Also, components having the same function within the scope of the same concept are described using the same reference numerals. Further, throughout the specification, when a part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.
[0011] In the drawings, the first direction can be defined as the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.
[0012] Multilayer electronic component FIG. 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention, FIG. 2 is a perspective view schematically showing the main body of FIG. 1, FIG. 3 is a plan view schematically showing the multilayer electronic component seen from the first surface of FIG. 1, FIG. 4 is a cross-sectional view schematically showing the I-I' cut surface of FIG. 1, FIG. 5 is a cross-sectional view schematically showing the II-II' cut surface of FIG. 1, FIG. 6 is a cross-sectional view schematically showing the III-III' cut surface of FIG. 4, FIG. 7 is an enlarged view of the A region of FIG. 4, and FIG. 12 is an enlarged view schematically showing a conventional multilayer electronic component, which is a view corresponding to FIG. 7.
[0013] Hereinafter, with reference to FIGS. 1 to 7, a multilayer electronic component 100 according to an embodiment of the present invention will be described in detail. Note that, as an example of the multilayer electronic component, a multilayer ceramic capacitor will be described, but the present invention is not limited thereto and can also be applied to various multilayer electronic components, such as inductors, piezoelectric elements, varistors, thermistors, and the like.
[0014] The size of the multilayer electronic component 100 is not particularly limited. The maximum size of the multilayer electronic component 100 in the second direction may be, for example, 0.2 mm to 3.2 mm, and the maximum size of the multilayer electronic component in the third direction may be, for example, 0.1 mm to 1.6 mm.
[0015] Referring to FIG. 1, the multilayer electronic component 100 can include a main body 110 and external electrodes 131 and 132 disposed on the main body 110.
[0016] The specific shape of the main body 110 is not particularly limited. As shown in FIG. 2, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 and the polishing of the corners during the firing process, the main body 110 can have a substantially hexahedron shape although it does not have a hexahedron shape with perfect straight lines.
[0017] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and facing each other in a third direction.
[0018] Referring to FIG. 4, the main body 110 can include a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111. The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).
[0019] The average thickness td of the dielectric layer 111 is not particularly limited. The average thickness td of the dielectric layer 111 can be, for example, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.
[0020] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the ceramic slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as it can provide sufficient capacitance. For example, barium titanate-based materials, lead composite perovskite-based materials, strontium titanate-based materials, etc. can be used. As examples of the ceramic powder, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. can be mentioned. As the organic solvent, ethanol, etc. can be used, and as the binder, polyvinyl butyral, etc. can be used. As the organic solvent and the binder, known substances used in the art can be used.
[0021] Referring to FIG. 4, the internal electrodes 121 and 122 can include, for example, a first internal electrode 121 and a second internal electrode 122 that are alternately arranged in the first direction with the dielectric layer 111 interposed therebetween. That is, the first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having different polarities, can be arranged so as to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.
[0022] The first internal electrode 121 is spaced apart from the fourth surface 4 and can be connected to the first external electrode 131 on the third surface 3 side. The second internal electrode 122 is spaced apart from the third surface 3 and can be connected to the second external electrode 132 on the fourth surface 4 side.
[0023] The conductive metal contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys, and it is more preferable to contain Ni, but the present invention is not limited thereto.
[0024] The average thickness te of the internal electrodes 121 and 122 is not particularly limited. The average thickness te of the internal electrodes 121 and 122 may be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.
[0025] The internal electrodes 121 and 122 can be formed by applying a conductive paste for internal electrodes containing a conductive metal on the ceramic green sheet with a predetermined thickness and firing it. As the printing method of the conductive paste for internal electrodes, a screen printing method, a gravure printing method, or the like can be used, but the present invention is not limited thereto.
[0026] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 respectively mean the average magnitudes in the first direction of the dielectric layer 111 and the internal electrodes 121 and 122. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average thickness td of the dielectric layer 111 can be measured by measuring the thicknesses at a plurality of points on one dielectric layer 111, for example, 30 points equally spaced in the second direction, and then taking the average value. Also, the average thickness te of the internal electrodes 121 and 122 can be measured by measuring the thicknesses at a plurality of points on one internal electrode 121 or 122, for example, 30 points equally spaced in the second direction, and then taking the average value. The 30 equally spaced points can be specified by the capacitance forming portion Ac. On the other hand, if such average value measurements are performed for 10 dielectric layers 111 and 10 internal electrodes 121 and 122 respectively and then the average value is measured, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be more generalized.
[0027] Referring to FIG. 4, the main body 110 includes a capacitance forming portion Ac in which a capacitance is formed by including a first internal electrode 121 and a second internal electrode 122 that are arranged alternately with each other with the dielectric layer 111 interposed therebetween and are arranged inside the main body 110, and a first cover portion 112 and a second cover portion 113 that are respectively arranged on both surfaces facing the first direction of the capacitance forming portion Ac. The cover portions 112 and 113 can basically play a role of preventing damage to the internal electrodes due to physical or chemical stress. The cover portions 112 and 113 can have a configuration similar to that of the dielectric layer 111 except for not including the internal electrodes.
[0028] The average thickness tc of the cover portions 112 and 113 is not particularly limited. The average thickness tc of the cover portions 112 and 113 may be, for example, 150 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. The average thickness tc of the cover portions 112 and 113 may be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average thickness tc of the cover portions 112 and 113 means the average thickness of each of the first cover portion 112 and the second cover portion 113.
[0029] The average thickness tc of the cover portions 112 and 113 can mean the average size in the first direction of the cover portions 112 and 113, and may be a value obtained by averaging the sizes in the first direction measured at five points equally spaced in the second direction in the cross sections in the first direction and the second direction cut at the center in the third direction of the main body 110.
[0030] The cover portions 112 and 113 can be formed by laminating a predetermined number of ceramic green sheets on which the conductive paste for the internal electrodes is not applied on both surfaces facing the first direction of the capacitance forming portion Ac and then firing.
[0031] Referring to FIG. 5, the main body 110 can include a first margin portion 114 and a second margin portion 115 respectively disposed on both surfaces facing the third direction of the capacitance forming portion Ac. That is, the margin portions 114 and 115 mean the regions between the interfaces of both ends of the internal electrodes 121 and 122 and the main body 110 in the cross section obtained by cutting the main body 110 in the first direction and the third direction.
[0032] The margin portions 114 and 115 can have a configuration similar to that of the dielectric layer 111 except for not including the internal electrodes 121 and 122. The margin portions 114 and 115 can basically serve to prevent damage to the internal electrodes 121 and 122 due to physical or chemical stress.
[0033] The margin portions 114 and 115 may be formed by applying and firing a conductive paste for internal electrodes except in the regions where the margin portions are formed on the ceramic green sheet. Alternatively, in order to suppress the step difference caused by the internal electrodes 121 and 122, after lamination, the internal electrodes 121 and 122 are cut so as to be exposed from the fifth surface 5 and the sixth surface 6 of the main body, and then one or more ceramic sheets for forming margin portions are laminated and fired on both surfaces facing the third direction of the capacitance forming portion Ac to form the margin portions 114 and 115.
[0034] The average thickness tm of the margin portions 114 and 115 is not particularly limited. The average thickness tm of the margin portions 114 and 115 may be, for example, 150 μm or less, 100 μm or less, 20 μm or less, or 15 μm or less. The average thickness tm of the margin portions 114 and 115 may be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average thickness tm of the margin portions 114 and 115 means the average thickness of each of the first margin portion 114 and the second margin portion 115.
[0035] The average thickness tm of the margin portions 114 and 115 can mean the average size in the third direction of the margin portions 114 and 115, and may be a value obtained by averaging the sizes in the third direction measured at five points equally spaced in the first direction in the cross section in the first direction and the third direction cut at the center in the second direction of the main body 110.
[0036] The external electrodes 131 and 132 can include a first connection portion C1 disposed on the third surface 3, and a first external electrode 131 including a first band portion B1 extending from the first connection portion C1 onto at least one of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The external electrodes 131 and 132 can also include a second connection portion C2 disposed on the fourth surface 4, and a second external electrode 132 including a second band portion B2 extending from the second connection portion C2 onto at least one of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The first band portion B1 can extend from the first connection portion C1 onto a part of each of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, and the second band portion B2 can extend from the second connection portion C2 onto a part of each of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6.
[0037] The first connection portion C1 can mean a region disposed outside a virtual plane P3 parallel to the third surface within the first external electrode 131, and the first band portion B1 can mean a region disposed inside the virtual plane P3 parallel to the third surface within the first external electrode 131. That is, the boundary between the first connection portion C1 and the first band portion B1 can be located on the virtual plane P3 parallel to the third surface.
[0038] The second connection portion C2 can mean a region disposed outside a virtual plane P4 parallel to the fourth surface within the second external electrode 132, and the second band portion B2 can mean a region disposed inside the virtual plane P4 parallel to the fourth surface within the second external electrode 132. That is, the boundary between the second connection portion C2 and the second band portion B2 can be located on the virtual plane P4 parallel to the fourth surface.
[0039] The first external electrode 131 can include a first base electrode layer 131a that contacts the first internal electrode 121, a first lower plating layer 131b disposed on the first base electrode layer 131a, and a first upper plating layer 131c disposed on the first lower plating layer 131b. The second external electrode 132 can include a second base electrode layer 132a that contacts the second internal electrode 122, a second lower plating layer 132b disposed on the second base electrode layer 132a, and a second upper plating layer 132c disposed on the second lower plating layer 132b.
[0040] The first base electrode layer 131a and the second base electrode layer 132a can each include a metal and glass. The first base electrode layer 131a can be disposed on the first connection portion C1 and the first band portion B1, and the second base electrode layer 132a can be disposed on the second connection portion C2 and the second band portion B2. The base electrode layers 131a, 132a can be formed by dipping the third surface 3 and the fourth surface 4 into a conductive paste containing metal powder and glass frit and then firing. The metal contained in the base electrode layers 131a, 132a can include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or an alloy containing the same.
[0041] On the other hand, the base electrode layers 131a, 132a may be composed of only one layer containing a metal and glass, but the present invention is not limited thereto, and the base electrode layers 131a, 132a may have a multilayer structure. For example, the first base electrode layer 131a and the second base electrode layer 132a can each include a first layer containing a metal and glass, and a second layer disposed on the first layer and containing a metal and a resin.
[0042] The metal contained in the second layer is not particularly limited, and may include one or more selected from the group consisting of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof. The resin contained in the second layer can include, for example, one or more of epoxy resin, acrylic resin, and ethyl cellulose. The second layer can be formed by applying and drying a conductive resin composition containing metal powder and resin on the first layer, and then performing a curing heat treatment.
[0043] The first lower plating layer 131b and the first upper plating layer 131c can be disposed on the first connection portion C1 and the first band portion B1, and the second lower plating layer 132b and the second upper plating layer 132c can be disposed on the second connection portion C2 and the second band portion B2. The lower plating layers 131b, 132b and the upper plating layers 131c, 132c can improve the mounting characteristics. The types of the lower plating layers 131b, 132b and the upper plating layers 131c, 132c are not particularly limited, and the lower plating layers 131b, 132b and the upper plating layers 131c, 132c can include Ni, Sn, Pd, and / or alloys containing them. In one embodiment, the first lower plating layer 131b and the second lower plating layer 132b can each contain Ni, and the first upper plating layer 131c and the second upper plating layer 132c can each contain Sn. The lower plating layers 131b, 132b and the upper plating layers 131c, 132c can be formed using an electrolytic plating method and / or an electroless plating method.
[0044] In the drawings, the structure in which the multilayer electronic component 100 has two external electrodes 131, 132 is described, but it is not limited thereto, and the number, shape, etc. of the external electrodes 131, 132 may be changed according to the form of the internal electrodes 121, 122 and other purposes.
[0045] The main body 110 can include a first groove portion 141 and a second groove portion 142 that are respectively arranged on the end sides of the first band portion B1 and the second band portion B2 and are spaced apart from each other. The first groove portion 141 can be arranged along the end of the first band portion B1, and the second groove portion 142 can be arranged along the end of the second band portion B2. As shown in FIGS. 2 and 3, the first groove portion 141 and the second groove portion 142 can be continuously arranged on at least one of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. It is more preferable that the first groove portion 141 and the second groove portion 142 are continuously arranged on the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, respectively. The groove portions 141 and 142 can extend in the third direction on the first surface 1 and the second surface 2, and can extend in the first direction on the fifth surface 5 and the sixth surface 6.
[0046] The method of forming the groove portions 141 and 142 in the main body 110 is not limited. However, since there is a risk of defects such as cracks when a strong physical impact is applied to the main body 110, the groove portions 141 and 142 are preferably formed using a laser ablation method or the like.
[0047] According to an embodiment of the present invention, the ends of the first lower plating layer 131b and the first upper plating layer 131c can respectively fill at least a part of the first groove portion 141, and the ends of the second lower plating layer 132b and the second upper plating layer 132c can respectively fill at least a part of the second groove portion 142.
[0048] Moisture from the outside can generally penetrate into the inside of the main body 110 through the ends of the external electrodes 131 and 132, that is, the ends of the band portions B1 and B2. As shown in FIG. 12, in a conventional laminated electronic component in which no groove is arranged in the main body 10, moisture from the outside can penetrate linearly between the main body 10 and the external electrode 31. That is, conventionally, since the penetration path PM of moisture from the outside is simple, moisture from the outside can easily penetrate into the inside of the main body 10, and there has been a problem that the reliability of the laminated electronic component is reduced due to the moisture from the outside that has penetrated into the inside of the main body 10.
[0049] On the other hand, in one embodiment of the present invention, as shown in FIG. 7, by the ends of the first lower plating layer 131b and the first upper plating layer 131c filling at least a part of the first groove portion 141 respectively, compared with the conventional laminated electronic component, the penetration path PM of moisture from the outside can be complicated, and as a result, the moisture resistance reliability of the laminated electronic component 100 can be improved.
[0050] There is no need to particularly limit the shape of the groove portion. Although the cross-section of the internal space of the first groove portion 141 is shown as a semi-circle in FIG. 7, the present invention is not limited thereto, and the cross-section of the internal space of the first groove portion 141 can have various shapes such as a triangle, a quadrilateral, a trapezoid, an ellipse, etc. There is no need to particularly limit the size of the groove portion. However, in one embodiment, the maximum size T1 in the first direction of the first groove portion may be 2 μm to 20 μm. If T1 is less than 2 μm, the effect of improving the moisture resistance reliability of the present invention is small. If T1 exceeds 20 μm, an excessive space that cannot be filled by the first lower plating layer 131b and the first upper plating layer 131c is generated in the first groove portion 141, and there is a risk that foreign matter penetrates into the space and causes defects in the laminated electronic component 100. In one embodiment, the maximum size L1 in the second direction of the first groove portion may be 2 μm to 20 μm. If L1 is less than 2 μm, the effect of improving the moisture resistance reliability of the present invention is small. If L1 exceeds 20 μm, an excessive space that cannot be filled by the first lower plating layer 131b and the first upper plating layer 131c is generated in the first groove portion 141, and there is a risk that foreign matter penetrates into the space and causes defects in the laminated electronic component 100.
[0051] On one hand, it is only necessary that the lower plating layers 131b and 132b and the upper plating layers 131c and 132c each fill at least a part of the groove portions 141 and 142, and the form in which the lower plating layers 131b and 132b and the upper plating layers 131c and 132c are arranged within the groove portions 141 and 142 is not particularly limited. However, in one embodiment, the end of the first lower plating layer 131b fills the region adjacent to the first connection portion C1 within the first groove portion 141, and the end of the first upper plating layer 131c can fill other regions within the first groove portion 141 except for the region adjacent to the first connection portion. The end of the second lower plating layer 132b fills the region adjacent to the second connection portion C2 within the second groove portion 142, and the end of the second upper plating layer 132c can fill other regions within the second groove portion 142 except for the region adjacent to the second connection portion. It is preferable that the lower plating layers 131b and 132b and the upper plating layers 131c and 132c completely fill the internal spaces of the groove portions 141 and 142, but the present invention is not limited thereto.
[0052] Also, it is only necessary that the lower plating layers 131b and 132b and the upper plating layers 131c and 132c each fill at least a part of the groove portions 141 and 142, and the ends of the base electrode layers 131a and 132a may or may not be arranged within the groove portions 141 and 142. For example, referring to FIG. 7, the end of the first base electrode layer 131a does not have to be arranged inside the first groove portion 141.
[0053] FIG. 8 is a modification of FIG. 7. Referring to FIG. 8, in one embodiment, the end of the first base electrode layer 131a can fill at least a part of the first groove portion 141. In that case, within the first groove portion 141, the end of the first base electrode layer 131a, the end of the first lower plating layer 131b, and the end of the first upper plating layer 131c can be arranged in this order at positions closer to the first connection portion C1.
[0054] On the one hand, FIGS. 7 and 8 are enlarged views showing an enlarged view of the first external electrode 131 and the first groove portion 141 side. However, since the first external electrode 131 and the first groove portion 141 have substantially the same configuration as the second external electrode 132 and the second groove portion 142, the descriptions of FIGS. 7 and 8 can also be similarly applied to the second external electrode 132 and the second groove portion 142.
[0055] FIG. 9 is a cross-sectional view schematically showing a multilayer electronic component 100' according to another embodiment of the present invention, which is a view corresponding to FIG. 4, and FIG. 10 is an enlarged view of region B in FIG. 9.
[0056] Hereinafter, with reference to FIGS. 9 and 10, the multilayer electronic component 100' according to another embodiment of the present invention will be described. The same / similar reference numerals are used for the same / similar configurations as those of the multilayer electronic component 100 described in FIGS. 1 to 7, and the overlapping descriptions are omitted.
[0057] The main body 110' of the multilayer electronic component 100' according to an embodiment of the present invention may include a first additional groove portion 151 covered by a first base electrode layer 131a disposed in the first band portion B1 and a second additional groove portion 152 covered by a second base electrode layer 132a disposed in the second band portion B2. That is, the main body 110' may include a first additional groove portion 151 covered by the first band portion B1 and a second additional groove portion 152 covered by the second band portion B2.
[0058] The additional groove portions 151 and 152 can be continuously disposed on at least one of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. It is more preferable that the additional groove portions 151 and 152 are continuously disposed on the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6.
[0059] In the multilayer electronic component 100' according to an embodiment of the present invention, the first base electrode layer 131a can fill at least a part of the first additional groove portion 151, and the second base electrode layer 132a can fill at least a part of the second additional groove portion 152. In that case, as shown in FIG. 10, the penetration path PM of moisture from the outside can be made more complex, and as a result, the moisture resistance reliability of the multilayer electronic component 100' can be more effectively improved. In one embodiment, a plurality of the first additional groove portions 151 and a plurality of the second additional groove portions 152 can be arranged respectively. When a plurality of the additional groove portions 151 and 152 are arranged, the effect of improving the moisture resistance reliability of the present invention becomes more prominent. The shapes and sizes of the additional groove portions 151 and 152 do not need to be particularly limited, but they can have shapes and sizes similar to those of the groove portions 141 and 142.
[0060] FIG. 11 is a plan view of a multilayer electronic component 100'' according to another embodiment of the present invention, and is a view corresponding to FIG. 3.
[0061] Hereinafter, with reference to FIG. 11, a multilayer electronic component 100'' according to another embodiment of the present invention will be described. The same / similar reference numerals are used for the same / similar configurations as those of the multilayer electronic component 100 described in FIGS. 1 to 7, and the overlapping descriptions will be omitted.
[0062] The multilayer electronic component 100'' according to an embodiment of the present invention can include a first external electrode 131'' including a first connection portion C1'' and a first band portion B1'', and a second external electrode 132'' including a second connection portion C2'' and a second band portion B2''.
[0063] According to an embodiment of the present invention, on the first surface, the central portions of the first band portion B1'' and the second band portion B2'' in the third direction can be made larger in the second direction than both end portions of the first band portion B1'' and the second band portion B2'' in the third direction. Here, the first groove portion 141'' of the main body 110'' can be arranged along the end portion of the first band portion B1'', and the second groove portion 142'' can be arranged along the end portion of the second band portion B2''. Thereby, the central portions of the groove portions 141'', 142'' in the third direction can be adjacent to the inside of the main body 110' than both end portions of the groove portions 141'', 142'' in the third direction.
[0064] Therefore, by preventing the first base electrode layer from completely filling the first groove portion, it is possible to facilitate filling the first groove portion with the end portions of the first lower plating layer and the first upper plating layer. By preventing the second base electrode layer from completely filling the second groove portion, it is possible to facilitate filling the second groove portion with the end portions of the second lower plating layer and the second upper plating layer. As a result, the moisture resistance reliability of the laminated electronic component 100'' can be more effectively improved.
[0065] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitution, modification, and change can be made by those having ordinary knowledge in the technical field without departing from the technical idea of the present invention described in the claims, and it can be said that they also belong to the scope of the present invention.
[0066] Note that the expression "an embodiment" does not mean the same embodiment, but is provided to emphasize and explain different unique features. However, the above-presented embodiment does not exclude being implemented in combination with the features of other embodiments. For example, matters described in a specific embodiment can be understood as descriptions related to other embodiments as long as there is no description contrary to or conflicting with the descriptions of other embodiments, even if they are not described in other embodiments.
[0067] Also, expressions such as first and second are used to distinguish one component from another, and do not limit the order and / or importance of such components. In some cases, within the scope not departing from the scope of the claims, the first component can also be named the second component, and similarly, the second component can be named the first component.
Description of Reference Numerals
[0068] 100, 100', 100'' Multilayer electronic component 110, 110', 110'' Body 111 Dielectric layer 112, 113 Cover part 114, 115 Margin part 121, 122 Internal electrode 131, 132, 131'', 132'' External electrode C1, C2, C1'', C2'' Connection part B1, B2, B1'', B2'' Band part 131a, 132a Base electrode layer 131b, 132b Lower plating layer 131c, 132c Upper plating layer 141, 142, 141'', 142'' Groove part 151, 152 Additional groove part
Claims
1. a main body including a dielectric layer, and first internal electrodes and second internal electrodes alternately disposed with the dielectric layer sandwiched therebetween, the main body including a first surface and a second surface facing a first direction, a third surface and a fourth surface connected to the first surface and the second surface facing the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface facing the third direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion onto at least one of the first surface, the second surface, the fifth surface, and the sixth surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion onto at least one of the first surface, the second surface, the fifth surface, and the sixth surface; the first external electrode includes a first base electrode layer in contact with the first internal electrode, a first lower plating layer disposed on the first base electrode layer, and a first upper plating layer disposed on the first lower plating layer; the second external electrode includes a second base electrode layer in contact with the second internal electrode, a second lower plating layer disposed on the second base electrode layer, and a second upper plating layer disposed on the second lower plating layer; The body includes a first groove and a second groove that are disposed at end sides of the first band portion and the second band portion, respectively, and are spaced apart from each other. an end portion of the first lower plating layer and an end portion of the first upper plating layer each fill at least a portion of the first groove portion, and an end portion of the second lower plating layer and an end portion of the second upper plating layer each fill at least a portion of the second groove portion.
2. an end portion of the first lower plating layer fills a region of the first groove portion adjacent to the first connection portion, and an end portion of the first upper plating layer fills a region of the first groove portion other than the region of the first groove portion adjacent to the first connection portion; 2. The multilayer electronic component according to claim 1, wherein an end of the second lower plating layer fills an area in the second groove portion adjacent to the second connection portion, and an end of the second upper plating layer fills an area in the second groove portion other than the area adjacent to the second connection portion.
3. 2. The multilayer electronic component according to claim 1, wherein the first groove portion and the second groove portion are each continuously disposed on at least one of the first surface, the second surface, the fifth surface, and the sixth surface.
4. 2 . The multilayer electronic component according to claim 1 , wherein the first groove portion and the second groove portion are continuously disposed on the first surface, the second surface, the fifth surface, and the sixth surface, respectively.
5. The multilayer electronic component according to claim 1 , wherein an end portion of the first base electrode layer is not disposed inside the first groove portion.
6. The multilayer electronic component according to claim 1 , wherein the end portion of the first base electrode layer fills at least a portion of the first groove portion.
7. The laminated electronic component according to claim 6, wherein within the first groove portion, an end of the first basic electrode layer, an end of the first lower plating layer, and an end of the first upper plating layer are positioned in that order closest to the first connection portion.
8. 2. The multilayer electronic component according to claim 1, wherein the maximum size of the first groove portion in the first direction is 2 μm to 20 μm.
9. 2. The multilayer electronic component according to claim 1, wherein the maximum size of the first groove portion in the second direction is 2 μm to 20 μm.
10. The main body further includes a first additional groove portion covered by the first base electrode layer disposed in the first band portion, and a second additional groove portion covered by the second base electrode layer disposed in the second band portion, The multilayer electronic component according to claim 1 , wherein the first base electrode layer fills at least a portion of the first additional groove portion, and the second base electrode layer fills at least a portion of the second additional groove portion.
11. The multilayer electronic component according to claim 10 , wherein a plurality of the first additional groove portions and a plurality of the second additional groove portions are disposed.
12. On the first surface, a central portion of the first band portion and the second band portion in the third direction has a size in the second direction larger than both end portions of the first band portion and the second band portion in the third direction, 12. The multilayer electronic component according to claim 1, wherein the first groove portion is disposed along an end portion of the first band portion, and the second groove portion is disposed along an end portion of the second band portion.
13. The multilayer electronic component according to claim 1 , wherein the first base electrode layer and the second base electrode layer each include a metal and a glass.
14. The laminated electronic component according to any one of claims 1 to 11, wherein the first base electrode layer and the second base electrode layer each include a first layer including metal and glass, and a second layer disposed on the first layer and including metal and resin.
15. the first lower plating layer and the second lower plating layer each contain Ni; The multilayer electronic component according to claim 1 , wherein the first upper plating layer and the second upper plating layer each contain Sn.