Multilayer electronic component

Abstract

To provide a multilayer electronic component having improved bending strength and improved reliability.SOLUTION: A multilayer electronic component according to one embodiment of the present invention includes: a body including a dielectric layer, and an internal electrode layer 121, 122 laminated alternately with the dielectric layer; and an external electrode disposed on the body. The internal electrode layer includes: an internal electrode 121a, 122a that includes a main portion 121a-1, 122a-1 and a lead portion 121a-2, 122a-2, the internal electrode extending from the main portion and connected to the external electrode through the lead portion; and a dummy electrode 121b, 122b disposed to be spaced apart from the internal electrode and connected to the external electrode. The width of the lead portion is smaller than the width of the main portion, at least a portion of the dummy electrode overlaps the internal electrode in a length direction, and the dummy electrode does not overlap the internal electrode of another layer in a lamination direction.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-type capacitor mounted on a printed circuit board of various electronic products such as video devices like liquid crystal display (LCD) and plasma display panel (PDP), computers, smartphones, and mobile phones, and plays a role of charging or discharging electricity.

[0003] Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and being easy to mount. As various electronic devices such as computers and mobile devices are miniaturized and have increased output power, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] On the other hand, an internal electrode, which is a component of a multilayer ceramic capacitor, can be exposed on the body and covered and connected by an external electrode. However, the portion where the internal electrode and the external electrode are connected can become a penetration path for moisture from the outside and may be vulnerable to moisture resistance reliability. Therefore, a structure that reduces the exposed area of the internal electrode to improve the vulnerable moisture resistance reliability is applied, but step defects with the dielectric layer may occur in the reduced exposed area of the internal electrode.

[0005] In addition, the main body, which is a component of the multilayer ceramic capacitor, mainly contains a ceramic material that is a brittle substance and has a property of being vulnerable to tensile stress. Therefore, the bending stress becomes weaker by the area of the reduced internal electrode, and it cannot withstand the stress applied from the outside according to the manufacturing process or the use environment, which may cause a problem that cracks occur in the main body and the lifespan is shortened.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] One of the several problems to be solved by the present invention is to provide a multilayer electronic component with improved moisture resistance reliability.

[0008] One of the several problems to be solved by the present invention is to provide a multilayer electronic component with improved bending strength.

[0009] One of the several problems to be solved by the present invention is to provide a multilayer electronic component with improved reliability.

[0010] However, several problems to be solved by the present invention are not limited to the above - described content and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Means for Solving the Problems

[0011] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer and internal electrode layers alternately arranged with the dielectric layer in a first direction, and includes a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and facing each other in a third direction. The multilayer electronic component also includes a main body, a first external electrode and a second external electrode disposed on the third surface and the fourth surface respectively. The internal electrode layers include a first internal electrode layer and a second internal electrode layer. The first internal electrode layer includes a first main portion and a first lead portion extending from the first main portion and exposed on the third surface to be connected to the first external electrode, and a first dummy electrode disposed apart from the first internal electrode and exposed on the third surface to be connected to the first external electrode. The second internal electrode layer includes a second main portion and a second lead portion extending from the second main portion and exposed on the fourth surface to be connected to the second external electrode, and a second dummy electrode disposed apart from the second internal electrode and exposed on the fourth surface to be connected to the second external electrode. The size of the first lead portion in the third direction is smaller than the size of the first main portion in the third direction, and the size of the second lead portion in the third direction is smaller than the size of the second main portion in the third direction. The first dummy electrode does not overlap with the second internal electrode in the first direction, and the second dummy electrode does not overlap with the first internal electrode in the first direction. At least a part of the first dummy electrode overlaps with the first internal electrode in the second direction, and at least a part of the second dummy electrode can overlap with the second internal electrode in the second direction.

Advantages of the Invention

[0012] One of several advantages of the present invention is to improve the moisture resistance reliability of the multilayer electronic component.

[0013] One of several advantages of the present invention is to improve the bending strength of the multilayer electronic component.

[0014] One of several advantages of the present invention is to improve the reliability of the multilayer electronic component.

[0015] However, the diverse and beneficial advantages and effects of the present invention are not limited to the above-described content and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Modes for Carrying Out the Invention

[0017] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, the shapes and sizes of elements in the drawings can be exaggerated for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0018] To clearly describe the present invention in the drawings, parts not relevant to the description are omitted, and the sizes and thicknesses of the components shown in the drawings are arbitrarily shown for convenience of description. Therefore, the present invention is not necessarily limited to what is shown in the drawings. For components having the same functions within the scope of the same concept, the same reference numerals are used for description. Further, throughout the specification, when a certain part refers to a certain component as "including", this means that other components can be further included, rather than excluding other components, unless otherwise stated specifically.

[0019] In the drawings, the first direction can be defined as the stacking direction or the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0020] Stacked electronic component FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. FIG. 2 schematically shows an exploded perspective view showing a stacked structure of a conventional internal electrode. FIGS. 3(a) and (b) schematically show an internal electrode layer of an embodiment of the present invention. FIGS. 4(a) to (d) schematically show an internal electrode layer of an embodiment of the present invention. FIGS. 5(a) and (b) schematically show an internal electrode layer of an embodiment of the present invention. FIGS. 6(a) to (d) schematically show an internal electrode layer of an embodiment of the present invention. FIG. 7 schematically shows the internal electrode layer of FIG. 5(b). FIGS. 8(a) to (c) schematically show an internal electrode layer of any one of various embodiments of the present invention.

[0021] Hereinafter, with reference to FIGS. 1 to 8(c), a stacked electronic component according to an embodiment of the present invention will be described in detail. However, as an example of the stacked electronic component, a multilayer ceramic capacitor will be described, but the present invention can also be applied to various electronic products using a dielectric composition, such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0022] The stacked electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111 and internal electrode layers 121 and 122 alternately arranged with the dielectric layer 111 in a first direction, and includes first and second surfaces 1 and 2 facing each other in the first direction, third and fourth surfaces 3 and 4 facing each other in a second direction and connected to the first and second surfaces 1 and 2, and fifth and sixth surfaces 5 and 6 facing each other in a third direction and connected to the first to fourth surfaces 1, 2, 3, and 4. The stacked electronic component 100 also includes first and second external electrodes 131 and 132 respectively disposed on the third and fourth surfaces 3 and 4. The internal electrode layers 121 and 122 include a first internal electrode layer 121 and a second internal electrode layer 122. The first internal electrode layer 121 includes a first main portion 121a-1 and a first lead portion 121a-2 extending from the first main portion 121a-1 and exposed on the third surface 3 and connected to the first external electrode 131, and a first dummy electrode 121b disposed apart from the first internal electrode 121a and exposed on the third surface 3 and connected to the first external electrode 131. The second internal electrode layer 122 includes a second main portion 122a-1 and a second lead portion 122a-2 extending from the second main portion 122a-1 and exposed on the fourth surface 4 and connected to the second external electrode 132, and a second dummy electrode 122b disposed apart from the second internal electrode 122a and exposed on the fourth surface 4 and connected to the second external electrode 132. The size of the first lead portion 121a-2 in the third direction is smaller than the size of the first main portion 121a-1 in the third direction, and the size of the second lead portion 122a-2 in the third direction is smaller than the size of the second main portion 122a-1 in the third direction. The first dummy electrode 121b does not overlap the second internal electrode 122a in the first direction, and the second dummy electrode 122b does not overlap the first internal electrode 121a in the first direction. At least a part of the first dummy electrode 121b may overlap the first internal electrode 121a in the second direction, and at least a part of the second dummy electrode 122b may overlap the second internal electrode 122a in the second direction.

[0023] The main body 110 may have the dielectric layer 111 and the internal electrode layers 121 and 122 alternately stacked.

[0024] More specifically, the main body 110 can include a capacitance forming portion disposed inside the main body 110 and including a first internal electrode layer 121 and a second internal electrode layer 122 that are alternately arranged in a first direction with a dielectric layer 111 interposed therebetween. However, it is not particularly limited thereto, and the internal electrode layer can further include third and fourth internal electrode layers, and more specific details will be described later.

[0025] There is no particular limitation on the specific shape of the main body 110. As shown in the figure, the main body 110 can have a hexahedral shape or a shape similar thereto. Due to the shrinkage of the ceramic particles contained in the main body 110 during the firing process, the main body 110 does not have a hexahedral shape with perfect straight lines, but can have a substantially hexahedral shape.

[0026] The main body 110 can have a first and a second surface 1, 2 facing each other in a first direction, a third and a fourth surface 3, 4 connected to the first and second surfaces 1, 2 and facing each other in a second direction, and a fifth and a sixth surface 5, 6 connected to the first to fourth surfaces 1, 2, 3, 4 and facing each other in a third direction.

[0027] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0028] The raw material for forming the dielectric layer 111 is not limited as long as sufficient capacitance can be obtained. Generally, perovskite (ABO3)-based materials can be used. For example, barium titanate-based materials, lead composite perovskite-based materials, or strontium titanate-based materials can be used. The barium titanate-based material can include BaTiO3-based ceramic particles. As an example of the ceramic particles, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Cay )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. can be mentioned.

[0029] In addition, as raw materials for forming the dielectric layer 111, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to particles such as barium titanate (BaTiO3) according to the purpose of the present invention.

[0030] The thickness of the dielectric layer 111 does not particularly need to be limited.

[0031] In order to ensure the reliability of the multilayer electronic component 100 under a high voltage environment, the thickness of the dielectric layer 111 may be 10.0 μm or less. Also, in order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness of the dielectric layer 111 may be 3.0 μm or less. In order to more easily achieve ultra-miniaturization and high capacitance, the thickness of the dielectric layer 111 may be 1.0 μm or less, preferably 0.6 μm or less, and more preferably 0.4 μm or less.

[0032] Here, the thickness of the dielectric layer 111 can mean the thickness of the dielectric layer 111 disposed between the first and second internal electrode layers 121 and 122.

[0033] On the other hand, the thickness of the dielectric layer 111 can mean the size of the dielectric layer 111 in the first direction. Also, the thickness of the dielectric layer 111 means the average thickness of the dielectric layer 111 and can mean the average size of the dielectric layer 111 in the first direction.

[0034] The average size of the dielectric layer 111 in the first direction can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average size of one dielectric layer 111 in the first direction can mean the average value calculated by measuring the size in the first direction at 10 equally spaced points in the second direction for one dielectric layer 111 in the scanned image. The 10 equally spaced points can be specified in the capacitance forming part. Also, when the measurement of such an average value is extended to 10 dielectric layers 111 to measure the average value, the average size of the dielectric layer 111 in the first direction can be further generalized.

[0035] The internal electrode layers 121 and 122 may be alternately laminated with the dielectric layer 111.

[0036] The internal electrode layers 121 and 122 can include internal electrodes 121a and 122a that form capacitance, and dummy electrodes 121b and 122b that are arranged separately from the internal electrodes 121a and 122a and do not form capacitance.

[0037] In the present invention, unless there are special circumstances, the description of the internal electrode layers 121 and 122 can correspond to the description including the internal electrodes 121a and 122a and the dummy electrodes 121b and 122b.

[0038] The internal electrode layers 121 and 122 can include a first internal electrode layer 121 and a second internal electrode layer 122. However, it is not particularly limited thereto, and the internal electrode layer can further include third and fourth internal electrode layers, and more specific details will be described later.

[0039] The internal electrode layers 121 and 122 can include internal electrodes 121a and 122a, and dummy electrodes 121b and 122b that are arranged separately from the internal electrodes 121a and 122a. More specifically, the first internal electrode layer 121 can include a first internal electrode 121a and a first dummy electrode 121b that is arranged separately from the first internal electrode 121a, and the second internal electrode layer 122 can include a second internal electrode 122a and a second dummy electrode 122b that is arranged separately from the second internal electrode 122a.

[0040] In other words, the internal electrodes 121a and 122a and the dummy electrodes 121b and 122b may be electrically insulated. That is, the first internal electrode 121a may be electrically insulated from the first dummy electrode 121b, and the second internal electrode 122a may be electrically insulated from the second dummy electrode 122b.

[0041] More specifically, the first internal electrode layer 121 can be separated from the fourth surface 4 and can be exposed through the third surface 3, and the second internal electrode layer 122 can be separated from the third surface 3 and can be exposed through the fourth surface 4. In other words, the internal electrodes 121a and 122a and the dummy electrodes 121b and 122b can be exposed through at least the same one surface of the main body 110.

[0042] The internal electrodes 121a and 122a can include main portions 121a-1 and 122a-1 that form a capacitance, and lead portions 121a-2 and 122a-2 that extend from the main portions 121a-1 and 122a-1 without forming a capacitance and are exposed on one surface of the main body 110 and connected to the external electrodes 131 and 132.

[0043] More specifically, the first internal electrode 121a can include a first main portion 121a-1 that forms a capacitance, and a first lead portion 121a-2 that extends from the first main portion 121a-1 without forming a capacitance and is exposed on the third surface 3 and connected to the first external electrode 131, and the second internal electrode 122a can include a second main portion 122a-1 that forms a capacitance, and a second lead portion 122a-2 that extends from the second main portion 122a-2 without forming a capacitance and is exposed on the fourth surface 4 and connected to the second external electrode 132.

[0044] On the other hand, the lead portions 121a-2 and 122a-2 may be arranged adjacent to any one of the fifth and sixth surfaces 5 and 6.

[0045] More specifically, the first lead portion 121a-2 can be arranged adjacent to the sixth surface 6, and the second lead portion 122a-2 can be arranged adjacent to the fifth surface 5. However, it is not particularly limited thereto, and the first and second lead portions 121a-2 and 122a-2 can be arranged adjacent to the fifth surface 5, the first lead portion 121a-2 can be arranged adjacent to the sixth surface 6, the second lead portion 122a-2 can be arranged adjacent to the fifth surface 5, or vice versa.

[0046] Here, when the lead portions 121a-2 and 122a-2 are arranged adjacent to any one of the fifth and sixth surfaces 5 and 6, it can be meant that, with reference to the third direction, the centers of the lead portions 121a-2 and 122a-2 are arranged more adjacent to any one of the fifth and sixth surfaces 5 and 6 than the centers of the main portions 121a-1 and 122a-1, or, with reference to the third direction, the centers of the lead portions 121a-2 and 122a-2 are arranged more adjacent to any one of the fifth and sixth surfaces 5 and 6 than the center of the dielectric layer 111, but it is not particularly limited thereto. The "center of the lead portion" can mean the center of the lead portions 121a-2 and 122a-2 in the third direction, but when it is difficult to clearly grasp the center, it can mean the center of the area of the lead portions 121a-2 and 122a-2.

[0047] Here, the sizes of the main portions 121a-1 and 122a-2 in the second and third directions may be substantially constant.

[0048] More specifically, the size of the first main part 121a-1 in the second direction can be substantially constant, and the size of the first main part 121a-1 in the third direction can be substantially constant. The size of the second main part 122a-1 in the second direction can be substantially constant, and the size of the second main part 122a-1 in the third direction can be substantially constant.

[0049] In the present invention, that the size is substantially constant can mean that the maximum size and the minimum size have values within 10% of their average value. Here, "size" can be a concept including the size in the first direction, the size in the second direction, the size in the third direction, the thickness, the length, or the width of a certain configuration, unless there are special circumstances.

[0050] The size of the lead parts 121a-2 and 122a-2 in the third direction may be smaller than the size of the main parts 121a-1 and 122a-1 in the third direction.

[0051] That is, the size of the first lead part 121a-2 in the third direction may be smaller than the size of the first main part 121a-1 in the third direction, and the size of the second lead part 122a-2 in the third direction may be smaller than the size of the second main part 122a-2 in the third direction.

[0052] For example, the lead parts 121a-2 and 122a-2 can at least partially include a region smaller than the size of the main parts 121a-1 and 122a-1 in the third direction, can at least partially include a region where the size of the lead parts 121a-2 and 122a-2 gradually decreases as it moves away from the main parts 121a-1 and 122a-1, or can at least partially include a region where the size gradually increases as it moves away from at least one of the exposed third and fourth surfaces 3 and 4.

[0053] Thereby, the lead parts 121a-2 and 122a-2 can be exposed on one of the third and fourth surfaces 3 and 4 at a position adjacent to one of the fifth and sixth surfaces 5 and 6.

[0054] More specifically, the first lead portion 121a-2 can be exposed through the third surface 3 at a position adjacent to the fifth surface 5, and the second lead portion 122a-2 can be exposed through the fourth surface 4 at a position adjacent to the sixth surface 6.

[0055] The dummy electrodes 121b and 122b are spaced apart from one of the third and fourth surfaces 3 and 4 and can be exposed on the other surface to be connected to the external electrodes 131 and 132.

[0056] More specifically, the first dummy electrode 121b can be exposed on the third surface 3 while being spaced apart from the fourth surface 4 and connected to the first external electrode 131, and the second dummy electrode 122b can be exposed on the fourth surface 4 while being spaced apart from the third surface 3 and connected to the second external electrode 132.

[0057] At this time, at least a part of the dummy electrodes 121b and 122b can overlap with the internal electrodes 121a and 122a in the second direction.

[0058] More specifically, at least a part of the first dummy electrode 121b can overlap with the first internal electrode 121a in the second direction, and at least a part of the second dummy electrode 122b can overlap with the second internal electrode 122a in the second direction.

[0059] For example, the dummy electrodes 121b and 122b are arranged in at least a part of at least a part of the region where the sizes of the lead portions 121a-2 and 122a-2 in the third direction are smaller than the sizes of the internal electrodes 121a-1 and 122a-2 in the third direction, so that at least a part of the dummy electrodes 121b and 122b can overlap with the internal electrodes 121a and 122a in the second direction. More specifically, at least a part of the dummy electrodes 121b and 122b can overlap with the main portions 121a-1 and 122a-1 in the second direction.

[0060] At least a part of the dummy electrodes 121b and 122b overlaps with the internal electrodes 121a and 122a in the second direction, so that the decrease in the bending strength of the lead portions 121a-2 and 122a-2 with a reduced size in the third direction can be compensated, and the step can be minimized to improve the mechanical strength of the multilayer electronic component 100.

[0061] The dummy electrodes 121b and 122b may not overlap with the internal electrodes 121a and 122a of the other internal electrode layers 121 and 122 in the first direction.

[0062] More specifically, the first dummy electrode 121b does not overlap with the second internal electrode 122a in the first direction, and the second dummy electrode 122b does not overlap with the first internal electrode 121a in the first direction. More specifically, the first dummy electrode 121b may not overlap with the second main portion 122a-1 in the first direction, and the second dummy electrode 122b may not overlap with the first main portion 121a-1 in the first direction.

[0063] Since the dummy electrodes 121b and 122b do not overlap with the internal electrodes 121a and 122a of the other internal electrode layers 121 and 122 in the first direction, even if the moisture resistance reliability of the dummy electrodes 121b and 122b deteriorates due to the penetration of moisture from the outside, the capacitance or reliability of the multilayer electronic component 100 can be prevented from decreasing.

[0064] That is, when the lead portions 121a-2 and 122a-2 are exposed on one of the third and fourth surfaces 3 and 4 at a position adjacent to one of the fifth and sixth surfaces 5 and 6, the dummy electrodes 121b and 122b can be exposed on one of the third and fourth surfaces 3 and 4 at a position adjacent to one of the sixth and fifth surfaces 6 and 5 where the lead portions 121a-2 and 122a-2 are not arranged.

[0065] For example, the first lead portion 121a-2 is exposed through the third surface 3 at a position adjacent to the fifth surface 5, the first dummy electrode 121b is exposed through the third surface 3 at a position adjacent to the sixth surface 6, the second lead portion 122a-2 is exposed through the fourth surface 4 at a position adjacent to the fifth surface 5, and the second dummy electrode 122b can be exposed through the fourth surface 4 at a position adjacent to the sixth surface 6.

[0066] On the other hand, the dummy electrodes 121b and 122b may be arranged in any one of the third directions in both directions of each of the lead portions 121a-2 and 122a.

[0067] More specifically, the first dummy electrode 121b can be arranged in any one of the third directions in both directions of the first lead portion 121a-2, and the second dummy electrode 122b can be arranged in any one of the third directions in both directions of the second lead portion 122a-2.

[0068] For example, when the first lead portion 121a-2 is arranged at a position adjacent to the fifth surface 5 and is arranged to be exposed through the third surface 3, the first dummy electrode 121b is arranged at a position adjacent to the sixth surface 6 rather than the first lead portion 121a-2 and is arranged to be exposed through the third surface 3, and can be arranged at a position not adjacent to the fifth surface 5 rather than the first lead portion 121a-2.

[0069] The dummy electrodes 121b and 122b can be separated from the internal electrodes 121a and 122a and can include a region formed along the internal electrodes 121a and 122a.

[0070] Taking FIGS. 3(a) and 3(b) as examples, when the lead portions 121a-2 and 122a-2 extend from the main portions 121a-1 and 122a-1 and are exposed through at least one of the third and fourth surfaces 3 and 4, it can be confirmed that the size in the third direction gradually decreases as the lead portions 121a-2 and 122a-2 move away from the main portions 121a-1 and 122a-1, and it can be confirmed that the size in the third direction gradually increases as the lead portions 121a-2 and 122a-2 move away from at least one of the third and fourth surfaces 3 and 4. At this time, it can also be confirmed that the size in the third direction of the dummy electrodes 121b and 122b gradually increases as the dummy electrodes 121b and 122b move away from at least one of the third and fourth surfaces 3 and 4, and it can be confirmed that the dummy electrodes 121b and 122b include the region formed along the internal electrodes 121a and 122a while having a substantially constant separation size.

[0071] In this way, by arranging the dummy electrodes 121b and 122b in the region of the internal electrodes 121a and 122a where the size has decreased, the reduced bending strength of the region can be compensated, the step can be minimized, the mechanical characteristics of the multilayer electronic component 100 can be improved, and the reliability can be enhanced.

[0072] At least a part of the interval by which the internal electrodes 121a and 122a and the dummy electrodes 121b and 122b are separated is of a substantially constant size, and preferably, the size of the interval by which the internal electrodes 121a and 122a and the dummy electrodes 121b and 122b are separated can be of a substantially constant size.

[0073] The distance between the internal electrodes 121a and 122a and the dummy electrodes 121b and 122b may be in contact with at least one of the third and fourth surfaces 3 and 4. The size of the region in contact with at least one of the third and fourth surfaces 3 and 4 at the distance between the internal electrodes 121a and 122a and the dummy electrodes 121b and 122b may be 0.004 times or more and 0.15 times or less the size of the main portions 121a-1 and 122a-1 in the third direction. For example, when the average size of the main portions 121a-1 and 122a-1 in the third direction is W1, and the size of the region in contact with at least one of the third and fourth surfaces 3 and 4 at the distance between the internal electrodes 121a and 122a and the dummy electrodes 121b and 122b in the third direction is W4, 0.004×W1≦W4≦0.15×W1 can be satisfied. More specific details will be described later.

[0074] On the other hand, in one embodiment of the present invention, the dummy electrodes 321b and 322b can be further exposed on at least one of the fifth and sixth surfaces 5 and 6.

[0075] For example, the first dummy electrode 321b can be further exposed on the sixth surface 6, and the second dummy electrode 322b can be further exposed on the sixth surface 6. However, it is not limited thereto. The first dummy electrode may be further exposed on the fifth surface 5, the second dummy electrode may be further exposed on the fifth surface 5, the first dummy electrode may be further exposed on the sixth surface 6, the second dummy electrode may be further exposed on the fifth surface 5, or the first dummy electrode may be further exposed on the fifth surface 5, and the second dummy electrode may be further exposed on the sixth surface 6.

[0076] At this time, the external electrodes 331 and 332 may be arranged to cover the exposed portions of the dummy electrodes 321b and 322b.

[0077] More specifically, when the first dummy electrode 321b is exposed on the third surface 3 and at least one of the fifth and sixth surfaces 5 and 6, the first external electrode 331 is disposed on the third surface 3 and disposed on at least one of the fifth and sixth surfaces 5 and 6 extending from the third surface 3 so as to cover the exposed portion of the first dummy electrode 321b. And when the second dummy electrode 322b is exposed on the fourth surface 4 and at least one of the fifth and sixth surfaces 5 and 6, the second external electrode 332 is disposed on the fourth surface 4 and disposed on at least one of the fifth and sixth surfaces 5 and 6 extending from the fourth surface 4 so as to cover the exposed portion of the second dummy electrode 322b.

[0078] Here, the external electrodes 331 and 332 are arranged to cover the exposed portions of the dummy electrodes 321b and 322b, which can mean that the external electrodes 331 and 332 completely cover the dummy electrodes 321b and 322b exposed on any one surface of the main body 110, and when the multilayer electronic component 300 is visually observed, it can mean that the exposed portions of the dummy electrodes 321b and 322b are not visible. However, it is not particularly limited thereto. For example, when the length of the region where the second dummy electrode 322b is exposed on the sixth surface 6 is L1, the length disposed on the sixth surface 6 of the second external electrode 332 arranged to cover the second dummy electrode 322b exposed on the sixth surface 6 may be larger than L1, and preferably may be 1.05×L1 or more.

[0079] By arranging the external electrodes 331 and 332 to cover the exposed portions of the dummy electrodes 321b and 322b, the penetration of moisture from the outside can be effectively prevented, and the moisture resistance reliability of the multilayer electronic component 300 can be further improved.

[0080] On the other hand, taking FIG. 7 as an example, the second internal electrode layer 322 of an embodiment of the present invention will be described in more detail. However, the present invention is not limited thereto, and the description of the second internal electrode layer can be similarly applied to the corresponding configuration of the first internal electrode layer. When the third and fourth internal electrode layers are included, it can be similarly applied to the corresponding configurations of the third and fourth internal electrode layers.

[0081] First, the average size of the main body 110 in the second direction can be defined as L, and the average size of the main body 110 in the third direction can be defined as W. Here, the average sizes of the main body 310 in the second and third directions can correspond to the average sizes of the dielectric layer 311 in the second and third directions.

[0082] At this time, when the average size of the second main portion 322a-1 in the third direction is defined as W1, the average size W1 of the second main portion in the third direction can satisfy 0.4×W≦W1≦0.95×W. By having such a size, sufficient capacitance can be realized, and the reliability will not be reduced due to the penetration of moisture from the outside or the stress from the outside.

[0083] When the size of the region of the second lead portion 322a-2 exposed on the fourth surface 4 in the third direction is defined as W2, the size W2 of the second lead portion 322a-2 exposed on the fourth surface 4 in the third direction can satisfy 0.5×W1≦W2≦0.76×W1. By having such a size, sufficient electrical connectivity with the external electrode 332 can be ensured, and the reliability due to bending stress will not be reduced.

[0084] When the size of the region of the second dummy electrode 322b exposed on the fourth surface 4 in the third direction is defined as W3, the size W3 of the second dummy electrode 322b exposed on the fourth surface 4 in the third direction can satisfy 0.28×W≦W3≦0.5×W. By having such a size, the mechanical properties due to bending stress will not be reduced, and the occurrence of cracks and delamination can be reduced.

[0085] At this time, when the second dummy electrode 322b is exposed on the sixth surface 6, if the size in the second direction of the region exposed on the sixth surface 6 is L1, the size in the second direction of the second external electrode 332 disposed on the sixth surface 6 may be L1 or more, and preferably may be 1.05×L1 or more. That is, by arranging the second external electrode 332 so as to completely cover the second dummy electrode 322b exposed on the sixth surface 6, the penetration path of moisture from the outside can be suppressed, step compensation can be performed, and the bending stress can be further improved.

[0086] The interval at which the second internal electrode 322a and the second dummy electrode 322b are separated can be substantially constant. The size of such an interval can be defined as the interval between the region where the second lead portion 322a-2 is exposed on the fourth surface 4 and the region where the second dummy electrode 322b is exposed on the fourth surface 4. When the size of the interval on the fourth surface 4 is W4, 0.004×W1≦W4≦0.15×W1 can be satisfied. By having such a size, electrical insulation between the internal electrode 322a and the dummy electrode 322b can be achieved, and the bending stress can be further improved.

[0087] On the other hand, the main body 110 can be formed by alternately laminating a first ceramic green sheet printed with the first internal electrode layer 121 and a second ceramic green sheet printed with the second internal electrode layer 122, and then firing.

[0088] The materials for forming the internal electrode layers 121 and 122 are not particularly limited, and materials having excellent electrical conductivity can be used. For example, the internal electrode layers 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0089] In addition, the internal electrode layers 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet. As the printing method of the conductive paste for internal electrodes, a screen printing method, a gravure printing method, or the like can be used, and the present invention is not limited thereto.

[0090] On the other hand, the thickness of the internal electrode layers 121 and 122 does not need to be particularly limited.

[0091] In order to ensure the reliability of the multilayer electronic component 100 in a high voltage environment, the thickness of the internal electrode layers 121 and 122 may be 3.0 μm or less. Further, in order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness of the internal electrode layers 121 and 122 may be 1.0 μm or less. In order to more easily achieve ultra-miniaturization and high capacitance, the thickness of the internal electrode layers 121 and 122 may be 0.6 μm or less, and more preferably 0.4 μm or less.

[0092] Here, the thickness of the internal electrode layers 121 and 122 can mean the size of the internal electrode layers 121 and 122 in the first direction. Note that the thickness of the internal electrode layers 121 and 122 means the average thickness of the internal electrode layers 121 and 122, and can mean the average size of the internal electrode layers 121 and 122 in the first direction.

[0093] The average size of the internal electrode layers 121 and 122 in the first direction can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, the average size of one internal electrode layer in the first direction can be the average value calculated by measuring the size in the first direction at 10 points that are equally spaced in the second direction and include one internal electrode and one dummy electrode in the scanned image. The 10 equally spaced points can be specified in the capacitance forming section. Also, when the measurement of such an average value is extended to 10 internal electrode layers to measure the average value, the average size of the internal electrode layers in the first direction can be further generalized.

[0094] On the other hand, in one embodiment of the present invention, the average thickness of at least one of the plurality of dielectric layers 111 and the average thickness of at least one of the plurality of internal electrode layers 121 and 122 can satisfy 2×te < td.

[0095] In other words, the average thickness of one dielectric layer 111 may be greater than twice the average thickness of one internal electrode layer 121 or 122. Preferably, the average thickness of the plurality of dielectric layers 111 may be greater than twice the average thickness of the plurality of internal electrode layers 121 and 122.

[0096] Generally, for electronic components for high-voltage electrical equipment, the main issue is the reliability problem due to the decrease in the breakdown voltage (BDV) in a high-voltage environment.

[0097] Therefore, in order to prevent the decrease in the breakdown voltage in a high-voltage environment, by making the average thickness of the dielectric layer 111 greater than twice the average thickness of the internal electrode layers 121 and 122, the thickness of the dielectric layer, which is the distance between the internal electrode layers, can be increased, and the breakdown voltage characteristics can be improved.

[0098] When the average thickness of the dielectric layer 111 is less than or equal to twice the average thickness of the internal electrode layers 121 and 122, the average thickness of the dielectric layer, which is the distance between the internal electrode layers, becomes thin, and the breakdown voltage may decrease, and a short circuit may occur between the internal electrode layers.

[0099] On the other hand, the main body 110 can include cover portions 112 and 113 disposed on both end - surfaces in the first direction of the capacitance - forming portion.

[0100] Specifically, it can include a first cover portion 112 disposed on one surface in the first direction of the capacitance - forming portion and a second cover portion 113 disposed on the other surface in the first direction of the capacitance - forming portion. More specifically, it can include an upper cover portion 112 disposed on the upper part in the first direction of the capacitance - forming portion and a lower cover portion 113 disposed on the lower part in the first direction of the capacitance - forming portion.

[0101] The upper cover portion 112 and the lower cover portion 113 can be formed by laminating a single dielectric layer 111 or two or more dielectric layers 111 in the first direction on the upper and lower surfaces of the capacitance - forming portion, and basically, they can play a role in preventing damage to the internal electrode layers 121 and 122 due to physical or chemical stress.

[0102] The upper cover portion 112 and the lower cover portion 113 do not include the internal electrode layers 121 and 122 and can include the same material as the dielectric layer 111. That is, the upper cover portion 112 and the lower cover portion 113 can include a ceramic material, for example, a barium titanate (BaTiO3) - based ceramic material.

[0103] On the other hand, the thickness of the cover portions 112 and 113 does not need to be particularly limited.

[0104] However, in order to more easily achieve miniaturization and high - capacitance of the multilayer electronic component, the thickness of the cover portions 112 and 113 may be 100 μm or less, preferably 30 μm or less, and in the case of ultra - small products, more preferably 20 μm or less.

[0105] Here, the thicknesses of the cover portions 112 and 113 can represent the sizes of the cover portions 112 and 113 in the first direction. Note that the thicknesses of the cover portions 112 and 113 represent the average thicknesses of the cover portions 112 and 113, and can represent the average sizes of the cover portions 112 and 113 in the first direction.

[0106] The average sizes of the cover portions 112 and 113 in the first direction can be measured by scanning images of the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, in an image of a scanned cover portion, it can represent the average value calculated by measuring the sizes in the first direction at 10 equally spaced points in the second direction.

[0107] Also, the average sizes of the cover portions in the first direction measured by the above-described method can have substantially the same sizes as the average sizes of the cover portions in the first direction in the cross-sections of the main body 110 in the first and third directions.

[0108] In one embodiment of the present invention, the structure in which the stacked electronic component 100 has two external electrodes 131 and 132 is described, but the number, shape, etc. of the external electrodes 131 and 132 can be changed according to the form of the internal electrode layers 121 and 122 and other purposes.

[0109] The external electrodes 131 and 132 are disposed on the main body 110 and can be connected to the internal electrode layers 121 and 122.

[0110] More specifically, the external electrodes 131 and 132 can include first and second external electrodes 131 and 132 respectively disposed on the third and fourth surfaces 3 and 4 of the main body 110 and connected to the first and second internal electrode layers 121 and 122 respectively. That is, the first external electrode 131 can be disposed on the third surface 3 of the main body and connected to the first internal electrode layer 121, and the second external electrode 132 can be disposed on the fourth surface 4 of the main body and connected to the second internal electrode layer 122.

[0111] That is, the first external electrode 131 is disposed on the third surface 3 and can be connected to the first internal electrode 121a and the first dummy electrode 121b exposed on the third surface 3 via the first lead portion 121a-2 exposed on the third surface 3. The second outer surface electrode 122b is disposed on the fourth surface 4 and can be connected to the second internal electrode 122a and the second dummy electrode 122b exposed on the fourth surface 4 via the second lead portion 122a-2 exposed on the fourth surface 4.

[0112] Also, the external electrodes 131 and 132 may be extended and disposed on a part of the first and second surfaces 1 and 2 of the main body 110, or may be extended and disposed on a part of the fifth and sixth surfaces 5 and 6 of the main body 110. That is, the first external electrode 131 can be disposed on a part of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the main body 110 and on the third surface 3 of the main body 110. The second external electrode 132 can be disposed on a part of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the main body 110 and on the third surface 3 of the main body 110.

[0113] At this time, when the dummy electrodes 321b and 322b are exposed on at least one of the fifth and sixth surfaces 5 and 6, the first and second external electrodes 331 and 332 can be disposed so as to cover the dummy electrodes 321b and 322b exposed on at least one of the fifth and sixth surfaces 5 and 6.

[0114] On the other hand, the external electrodes 131 and 132 may be formed of any material as long as it has electrical conductivity, such as metal. A specific material may be determined in consideration of electrical characteristics, structural stability, etc., and may further have a multilayer structure.

[0115] For example, the external electrodes 131 and 132 can include an electrode layer disposed on the main body 110 and a plating layer disposed on the electrode layer.

[0116] More specifically, regarding the electrode layer, the electrode layer may include a first electrode layer which is a fired electrode containing a first conductive metal and glass, or may include a second electrode layer which is a resin-based electrode containing a second conductive metal and resin.

[0117] Here, the conductive metal contained in the first electrode layer can be referred to as the first conductive metal, and the conductive metal contained in the second electrode layer can be referred to as the second conductive metal. At this time, the first conductive metal and the second conductive metal may be the same as or different from each other. When including a plurality of conductive metals, only a part may contain the same conductive metal, but it is not particularly limited thereto.

[0118] Further, the electrode layer may be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body 110.

[0119] Further, the electrode layer may be formed by a method of transferring a sheet containing a conductive metal onto the main body, or may be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode.

[0120] As the conductive metal contained in the electrode layer, a material with excellent electrical conductivity can be used. For example, the conductive metal can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, but is not particularly limited thereto.

[0121] In one embodiment of the present invention, the electrode layer can have a two-layer structure including a first electrode layer and a second electrode layer. Thus, the external electrodes 131 and 132 can include a first electrode layer containing a first conductive metal and glass and a second electrode layer containing a second conductive metal and resin, which is disposed on the first electrode layer.

[0122] By including glass in the first electrode layer, it plays a role in improving the bonding property with the main body 110, and by including resin in the second electrode layer, it can play a role in improving the bending strength.

[0123] The first conductive metal contained in the first electrode layer is not particularly limited as long as it can be electrically connected to the internal electrode layers 121 and 122 for forming capacitance. For example, it can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0124] The first electrode layer can be formed by applying a conductive paste provided by adding glass frit to first conductive metal particles and then firing.

[0125] The second conductive metal contained in the second electrode layer can play a role of being electrically connected to the first electrode layer.

[0126] The conductive metal contained in the second electrode layer is not particularly limited as long as it can be electrically connected to the electrode layer, and can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0127] The second conductive metal contained in the second electrode layer can include one or more of spherical particles and flaky particles. That is, the second conductive metal can consist only of flaky particles, or only of spherical particles, or can be in a form in which flaky particles and spherical particles are mixed. Here, the spherical particles can include forms that are not completely spherical, for example, forms having a length ratio of the major axis to the minor axis (major axis / minor axis) of 1.45 or less. The flaky particles mean particles having a flat and elongated form, and are not particularly limited, but for example, the length ratio of the major axis to the minor axis (major axis / minor axis) can be 1.95 or more. The lengths of the major axis and the minor axis of the above-mentioned spherical particles and flaky particles can be measured from an image obtained by scanning cross-sections in the first and second directions cut at the central portion in the third direction of the multilayer electronic component with a scanning electron microscope (SEM).

[0128] The resin contained in the second electrode layer can play a role in ensuring bonding properties and absorbing shock. The resin contained in the second electrode layer is not particularly limited as long as it has bonding properties and shock absorbency and can be mixed with the second conductive metal particles to form a paste. For example, it can include an epoxy resin.

[0129] Also, the second electrode layer can include a plurality of second conductive metal particles, an intermetallic compound, and a resin. By including an intermetallic compound, the electrical connectivity with the first electrode layer can be further improved. The intermetallic compound can play a role in connecting a plurality of metal particles to improve electrical connectivity, and can play a role in surrounding and connecting a plurality of metal particles to each other.

[0130] At this time, the intermetallic compound can contain a metal having a melting point lower than the curing temperature of the resin. That is, since the intermetallic compound contains a metal having a melting point lower than the curing temperature of the resin, the metal having a melting point lower than the curing temperature of the resin melts during the drying and curing processes, forms a part of the metal particles and the intermetallic compound, and comes to surround the metal particles. At this time, the intermetallic compound can preferably contain a low-melting-point metal of 300 °C or lower.

[0131] For example, Sn having a melting point of 213 to 220 °C can be included as the intermetallic compound. Sn melts during the drying and curing processes, and the molten Sn wets high-melting-point metal particles such as Ag, Ni, or Cu by capillary action and reacts with a part of the Ag, Ni, or Cu metal particles to form intermetallic compounds such as Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn. Ag, Ni, or Cu that did not participate in the reaction remains in the form of metal particles.

[0132] Therefore, the plurality of second conductive metal particles can contain one or more of Ag, Ni, and Cu, and the intermetallic compound can contain one or more of Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn.

[0133] The plating layer can play a role in improving the mounting characteristics.

[0134] The type of the plating layer is not particularly limited, and it may be a single-layer plating layer 131c, 132c containing one or more of nickel (Ni), tin (Sn), silver (Ag), palladium (Pd), and alloys thereof, or may be formed of a plurality of layers.

[0135] More specific examples of the plating layer are as follows. The plating layer may be a Ni plating layer or a Sn plating layer, or may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer, or may be in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Further, the plating layer may contain a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0136] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0137] However, in order to simultaneously achieve miniaturization and high capacity, since the thicknesses of the dielectric layer and the internal electrode layer must be reduced and the number of layers increased, the effects according to the present invention can be more remarkable in the multilayer electronic component 100 having a size of 3216 (length × width: 3.2 mm × 1.6 mm) or less.

[0138] Hereinafter, the present invention will be described in more detail with various embodiments or modifications of the present invention, which is for helping the specific understanding of the present invention and the scope of the present invention is not limited thereby.

[0139] <First Embodiment> Referring to FIGS. 1 and 3, the laminated electronic component 100 according to the first embodiment of the present invention will be described in more detail. The laminated electronic component 100 according to the first embodiment of the present invention includes a dielectric layer 111 and internal electrode layers 121 and 122 alternately arranged with the dielectric layer 111 in a first direction. The laminated electronic component 100 includes a main body having first and second surfaces 1 and 2 facing each other in the first direction, third and fourth surfaces 3 and 4 facing each other in a second direction and connected to the first and second surfaces 1 and 2, and fifth and sixth surfaces 5 and 6 facing each other in a third direction and connected to the first to fourth surfaces 1, 2, 3, and 4, and first and second external electrodes 131 and 132 respectively disposed on the third and fourth surfaces 3 and 4. The internal electrode layers 121 and 122 include a first internal electrode layer 121 and a second internal electrode layer 122. The first internal electrode layer 121 includes a first main portion 121a-1 and a first lead portion 121a-2 extending from the first main portion 121a-1 and exposed on the third surface 3 and connected to the first external electrode 131. The first dummy electrode 121b is disposed apart from the first internal electrode 121a and exposed on the third surface 3 and connected to the first external electrode 131. The second internal electrode layer 122 includes a second main portion 122a-1 and a second lead portion 122a-2 extending from the second main portion 122a-1 and exposed on the fourth surface 4 and connected to the second external electrode 132. The second dummy electrode 122b is disposed apart from the second internal electrode 122a and exposed on the fourth surface 4 and connected to the second external electrode 132. The size of the first lead portion 121a-2 in the third direction is smaller than the size of the first main portion 121a-1 in the third direction. The size of the second lead portion 122a-2 in the third direction is smaller than the size of the second main portion 122a-1 in the third direction. The first dummy electrode 121b does not overlap the second internal electrode 122a in the first direction. The second dummy electrode 122b does not overlap the first internal electrode 121a in the first direction. At least a part of the first dummy electrode 121b can overlap the first internal electrode 121a in the second direction. At least a part of the second dummy electrode 122b can overlap the second internal electrode 122a in the second direction.

[0140] Further, the first lead portion 121a-2 is disposed adjacent to the fifth surface 5, and the second lead portion 122a-2 is disposed adjacent to the fifth surface 5.

[0141] And the first dummy electrode 121b can be disposed further adjacent to the sixth surface 6 than the first lead portion 121a-2, and the second dummy electrode 122b can be disposed further adjacent to the sixth surface 6 than the second lead portion 122a-2.

[0142] Also, the respective sizes of the first and second main portions 121a-1 and 122a-1 in the second and third directions may be substantially constant.

[0143] Also, the size of the exposed portion of each of the first and second lead portions 121a-2 and 122a-2 in the third direction may be smaller than the average size of each of the first and second main portions 121a-1 and 122a-1 in the third direction.

[0144] Also, at least a part of each interval by which the first and second internal electrodes 121a and 122a are separated from the first and second dummy electrodes 121b and 122b may have a substantially constant size.

[0145] It is obvious that the multilayer electronic component 100 according to the first embodiment of the present invention can be explained by the above-described content except for conflicting content.

[0146] <Modification Example of the First Embodiment> Hereinafter, with reference to FIG. 5, a multilayer electronic component 300 according to a modification example of the first embodiment will be described. On the other hand, descriptions of the same configurations as those of the multilayer electronic component 100 according to the first embodiment will be omitted, but it is obvious that an ordinary technician can easily understand the omitted parts.

[0147] In the multilayer electronic component 300 according to a modification of the first embodiment of the present invention, the first dummy electrode 321b further exposes on the sixth surface 6 and is connected to the first external electrode 331, and can be covered by the first external electrode 331. The second dummy electrode 322b further exposes on the sixth surface 6 and is connected to the second external electrode 332, and can be covered by the second external electrode 332.

[0148] In the multilayer electronic component 300 of this embodiment, by arranging the dummy electrodes 321b and 322b to extend in the third direction so as to further expose on the sixth surface 6, the bending strength of the multilayer electronic component 300 can be further improved.

[0149] Also, by arranging the external electrodes 331 and 341 to cover the exposed dummy electrodes 321b and 322b, the moisture resistance reliability can be further improved.

[0150] <Second Embodiment> Hereinafter, the multilayer electronic component 200 according to the second embodiment will be described with reference to FIG. 4. On the other hand, the description of the configuration similar to that of the multilayer electronic component 100 according to the first embodiment will be omitted, but it is obvious that an ordinary technician can easily understand the omitted parts.

[0151] In the stacked electronic component 200 according to the second embodiment of the present invention, the internal electrode layers 221, 222, 223, 224 further include a third internal electrode layer 223 and a fourth internal electrode layer 224. The third internal electrode layer 223 includes a third main portion 223a-1 and a third lead portion 223a-2 that extends from the third main portion 223a-1 and is exposed on the third surface 3 and connected to the first external electrode 231. The third dummy electrode 223b is disposed separately from the third internal electrode 223a and is exposed on the third surface 3 and connected to the first external electrode 231. The fourth internal electrode layer 224 includes a fourth main portion 224a-1 and a fourth lead portion 224a-2 that extends from the fourth main portion 224a-1 and is exposed on the fourth surface 4 and connected to the second external electrode 232. The fourth dummy electrode 224b is disposed separately from the fourth internal electrode 224a-1 and is exposed on the fourth surface 4 and connected to the second external electrode 232. The size of the third lead portion 223a-2 in the third direction is smaller than the size of the third main portion 223a-1 in the third direction. The size of the fourth lead portion 224a-2 in the third direction is smaller than the size of the fourth main portion 224a-1 in the third direction. The third dummy electrode 223b does not overlap with the fourth internal electrode 224a in the first direction. The fourth dummy electrode 224b does not overlap with the third internal electrode 223a in the first direction. At least a part of the third dummy electrode 223b overlaps with the third internal electrode 223a in the second direction. At least a part of the fourth dummy electrode 224b overlaps with the fourth internal electrode 224a in the second direction. The first lead portion 221a-1 can be disposed closer to the fifth surface 5 than the third lead portion 223a-1. The second lead portion 222a-1 can be disposed closer to the fifth surface 5 than the fourth lead portion 224a-1.

[0152] At this time, the first internal electrode layer 221 and the third internal electrode layer 223 can be symmetric in the third direction with respect to the axis in the second direction, and the second internal electrode layer 222 and the fourth internal electrode layer 224 can be symmetric in the third direction with respect to the axis in the second direction.

[0153] Here, being symmetric with respect to the third direction based on the axis in the second direction is not limited to being symmetric with respect to the axis in the second direction based on the center of the third direction, but can mean being symmetric with respect to the axis in the second direction at any point in the third direction.

[0154] Also, the first lead portion 221a-2 is disposed adjacent to the fifth surface 5, the second lead portion 222a-2 is disposed adjacent to the fifth surface 5, the third lead portion 223a-2 is disposed adjacent to the sixth surface 6, and the fourth lead portion 224a-2 is disposed adjacent to the sixth surface 6.

[0155] And, the first dummy electrode 221b is disposed even more adjacent to the sixth surface 6 than the first lead portion 221a-2, the second dummy electrode 222b is disposed even more adjacent to the sixth surface 6 than the second lead portion 222a-2, the third dummy electrode 223b is disposed even more adjacent to the fifth surface 5 than the third lead portion 223a-2, and the fourth dummy electrode 224b is disposed even more adjacent to the fifth surface 5 than the fourth lead portion 224a-2.

[0156] Similarly, the respective sizes in the second and third directions of each of the third and fourth main portions 223a-1 and 224a-1 may be substantially constant.

[0157] Also, the size in the third direction of the exposed portion of each of the third and fourth lead portions 223a-2 and 224a-2 may be smaller than the size in the third direction of each of the third and fourth main portions 223a-1 and 224a-1.

[0158] Furthermore, at least a part of each interval by which the third and fourth internal electrodes 223a and 224a and the third and fourth dummy electrodes 223b and 224b are separated may have a substantially constant size.

[0159] <Modification of the Second Embodiment> Hereinafter, with reference to FIG. 6, the stacked electronic component 400 according to a modified example of the second embodiment will be described. On the other hand, descriptions of configurations similar to those of the stacked electronic component 300 according to the modified example of the first embodiment and the stacked electronic component 200 according to the second embodiment are omitted, but it is obvious that an ordinary technician can easily understand the omitted parts.

[0160] In the stacked electronic component 400 according to the modified example of the second embodiment of the present invention, the third dummy electrode 423b is further exposed on the fifth surface 5 and connected to the first external electrode 431, and can be covered by the first external electrode 431. The fourth dummy electrode 424b is further exposed on the fifth surface 5 and connected to the second external electrode 432, and can be covered by the second external electrode 332.

[0161] In the stacked electronic component 400 of the present embodiment, by extending and arranging the third and fourth dummy electrodes 423b and 424b in the third direction so as to be further exposed on at least one of the fifth and sixth surfaces 5 and 6, the bending strength of the stacked electronic component 400 can be further improved.

[0162] Further, by arranging the external electrodes 431 and 441 so as to cover the third and fourth dummy electrodes 423b and 424b that are exposed, the moisture resistance reliability can be further improved.

[0163] <Various Modified Examples of the First and Second Embodiments> Hereinafter, the stacked electronic components 500, 600, and 700 according to the first and second embodiments or modified examples of the first and second embodiments will be described. Descriptions of configurations similar to those of the stacked electronic components 100, 200, 300, and 400 according to the first and second embodiments or modifications of the first and second embodiments are omitted, but it is obvious that an ordinary technician can easily understand the omitted parts.

[0164] Describing with reference to the second internal electrode layers 522, 622, and 722, it is as follows.

[0165] First, the size of the second lead portion 522a-2 in the third direction may be smaller than the size of the second main portion 522a-1 in the third direction. At this time, the sizes of the first lead portion 522a-2 in the second and third directions may each be substantially constant. And the distance between the second dummy electrode 522b and the second internal electrode 522a may be substantially constant. Thereby, the sizes of the second dummy electrode 522b in the second and third directions can each be substantially constant.

[0166] As another modification, the size of the second lead portion 622a-2 in the third direction may gradually decrease as it moves away from the second main portion 622a-1. However, in the region where the second main portion 622a-1 and the second lead portion 622a-2 are in contact, the size of the second main portion 622a-1 in the third direction may be larger than the size of the second lead portion 622a-2 in the third direction. Therefore, the second lead portion 622a-2 can include an inclined region or can include an inclined side. Here, "inclined" can mean not being substantially parallel to the third to sixth surfaces. And the distance between the second dummy electrode 622b and the second internal electrode 622a may be substantially constant. Thereby, the size of the second dummy electrode 622b in the third direction can gradually decrease as it moves away from the fourth surface 4.

[0167] As another modification, the size of the second lead portion 722a-2 in the third direction may be smaller than the size of the second main portion 722a-1 in the third direction. At this time, the second lead portion 722a-2 can include a first region that is smaller than and constant compared to the size of the second main portion 722a-1 in the third direction, and a second region that is smaller than and constant compared to the size of the first region in the third direction. In other words, the size of the second lead portion 722a-2 can decrease stepwise in the third direction. And the distance between the second dummy electrode 722b and the second internal electrode 722a may be substantially constant. Thereby, the second dummy electrode 722b can have a stepped shape.

[0168] Although the second internal electrode layer has been described as an example in this modification, it is obvious to an ordinary technician that the same applies to the shapes of the first internal electrode layer, or the third and fourth internal electrode layers.

[0169] As described above in detail for the embodiments of the present invention, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the technical field within the scope not departing from the technical idea of the present invention described in the claims, and it can be said that these also belong to the scope of the present invention.

[0170] In addition, the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being realized in combination with the features of another one embodiment. For example, even if the matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to another one embodiment as long as there is no explanation contrary to or conflicting with that matter in another one embodiment.

[0171] The terms used in the present invention are merely used to explain one embodiment and are not intended to limit the present invention. At this time, the singular expression includes the plural expression unless the context clearly indicates a different meaning.

Explanation of Reference Numerals

[0172] 100: Multilayer electronic component 110: Body 111: Dielectric layer 121, 122: Internal electrode layer 121a, 122a: Internal electrode 121b, 122b: dummy electrode 131, 132: External electrode

Claims

1. a body including dielectric layers and internal electrode layers alternately disposed with the dielectric layers in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction; first and second external electrodes disposed on the third and fourth surfaces, respectively; The internal electrode layers include a first internal electrode layer and a second internal electrode layer, the first internal electrode layer includes a first internal electrode including a first main part and a first lead part extending from the first main part and exposed to the third surface to be connected to the first external electrode, and a first dummy electrode disposed apart from the first internal electrode, exposed to the third surface to be connected to the first external electrode, the second internal electrode layer includes a second main portion, a second internal electrode including a second lead portion extending from the second main portion and exposed to the fourth surface to be connected to the second external electrode, and a second dummy electrode disposed apart from the second internal electrode, exposed to the fourth surface to be connected to the second external electrode, a size of the first lead portion in the third direction is smaller than a size of the first main portion in the third direction, and a size of the second lead portion in the third direction is smaller than a size of the second main portion in the third direction; the first dummy electrode does not overlap the second internal electrode in the first direction, the second dummy electrode does not overlap the first internal electrode in the first direction, at least a portion of the first dummy electrode overlaps with the first internal electrode in the second direction, and at least a portion of the second dummy electrode overlaps with the second internal electrode in the second direction.

2. The multilayer electronic component according to claim 1 , wherein the first and second lead portions are disposed adjacent to one of the fifth and sixth surfaces.

3. 2 . The multilayer electronic component according to claim 1 , wherein the first and second dummy electrodes are arranged in either one of a third direction and a third direction of the first and second lead portions, respectively.

4. 2 . The multilayer electronic component according to claim 1 , wherein a size in the third direction of each of the exposed portions of the first and second lead portions is smaller than an average size in the third direction of each of the first and second main portions.

5. 2. The multilayer electronic component according to claim 1, wherein at least a part of the intervals separating said first and second internal electrodes from said first and second dummy electrodes is substantially constant.

6. The multilayer electronic component according to claim 1 , wherein the first and second dummy electrodes are further exposed on at least one of the fifth and sixth surfaces.

7. 7. The multilayer electronic component according to claim 6, wherein the first and second external electrodes are disposed so as to cover exposed portions of the first and second dummy electrodes, respectively.

8. The internal electrode layers further include a third internal electrode layer and a fourth internal electrode layer, the third internal electrode layer includes a third main portion, a third internal electrode including a third lead portion extending from the third main portion and exposed to the third surface to be connected to the first external electrode, and a third dummy electrode disposed apart from the third internal electrode, exposed to the third surface to be connected to the first external electrode, the fourth internal electrode layer includes a fourth main portion, a fourth internal electrode including a fourth lead portion extending from the fourth main portion and exposed to the fourth surface to be connected to the second external electrode, and a fourth dummy electrode disposed apart from the fourth internal electrode, exposed to the fourth surface to be connected to the second external electrode, a size of the third lead portion in the third direction is smaller than a size of the third main portion in the third direction, and a size of the fourth lead portion in the third direction is smaller than a size of the fourth main portion in the third direction; the third dummy electrode does not overlap the fourth internal electrode in the first direction, the fourth dummy electrode does not overlap the third internal electrode in the first direction, At least a portion of the third dummy electrode overlaps with the third internal electrode in the second direction, and at least a portion of the fourth dummy electrode overlaps with the fourth internal electrode in the second direction, 2. The multilayer electronic component according to claim 1, wherein the first lead portion is disposed closer to the fifth surface than the third lead portion, and the second lead portion is disposed closer to the fifth surface than the fourth lead portion.

9. the first internal electrode layer and the third internal electrode layer are symmetrical in the third direction with respect to an axis in the second direction; 9. The multilayer electronic component according to claim 8, wherein the second internal electrode layer and the fourth internal electrode layer are symmetrical in the third direction with respect to an axis in the second direction.

10. 9. The multilayer electronic component according to claim 8, wherein the first and second lead portions are disposed adjacent to one of the fifth and sixth surfaces.

11. 9. The multilayer electronic component according to claim 8, wherein the first to fourth dummy electrodes are arranged in either one of a third direction between the first to fourth lead portions.

12. 9. The multilayer electronic component according to claim 8, wherein a size in the third direction of each of the exposed portions of the first to fourth lead portions is smaller than an average size in the third direction of each of the first to fourth main portions.

13. 9. The multilayer electronic component according to claim 8, wherein at least a part of the intervals at which the first to fourth internal electrodes are separated from the first to fourth dummy electrodes is substantially constant.

14. 9. The multilayer electronic component according to claim 8, wherein the first to fourth dummy electrodes are further exposed on at least one of the fifth and sixth surfaces.

15. 15. The multilayer electronic component according to claim 14, wherein the first and second external electrodes are disposed so as to cover exposed portions of the first to fourth dummy electrodes.

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