Multilayer electronic component

Abstract

To provide a multilayer electronic component with excellent mechanical strength and electric characteristics.SOLUTION: A multilayer electronic component 100a includes: a main body 110 including a dielectric layer and first and second internal electrodes disposed alternately in a first direction with the dielectric layer held therebetween, first and second surfaces 1 and 2 facing each other in the first direction, third and fourth surfaces 3 and 4 connected to the first surface and the second surface and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing each other in a third direction; first external electrodes 131 and 133 disposed on at least one surface of the first, second, fifth, and sixth surfaces and connected to the first internal electrode; second external electrodes 132 and 134 disposed on at least one surface of the first, second, third, and fourth surfaces and connected to the second internal electrode; and a first connection electrode penetrating the dielectric layer and connecting two of the first internal electrodes adjacent in the first direction to each other. In the first connection electrode, a plurality of first via electrodes disposed displaced from each other in a direction perpendicular to the first direction are stacked in the first direction.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one of multilayer electronic components, is a chip-type capacitor that is mounted on a printed circuit board of various electronic products such as video devices such as liquid crystal display devices (LCDs) and plasma display panel (PDP) panels, computers, smartphones, and mobile phones, and plays a role of charging or discharging electricity. The MLCC is small in size but has a high capacitance guaranteed, and is used as a component of various electronic devices due to the advantage of being easy to mount.

[0003] An MLCC generally includes a main body including a plurality of internal electrodes alternately arranged with dielectric layers, and external electrodes arranged outside the main body and connected to the plurality of internal electrodes.

[0004] On the other hand, in the firing process for manufacturing an MLCC, the internal electrodes may shrink, cracks may occur in the main body, and the connection between the internal electrodes and the external electrodes may be broken. Due to such a phenomenon, there is a problem that the capacitance of the MLCC decreases.

Summary of the Invention

Problems to be Solved by the Invention

[0005] One of several objects of the present invention is to provide a multilayer electronic component excellent in mechanical strength and electrical characteristics.

[0006] However, the object of the present invention is not limited to the above-described content, and can be more easily understood in the process of explaining specific embodiments of the present invention.

Means for Solving the Problems

[0007] One embodiment of the present invention includes a dielectric layer and first and second internal electrodes alternately arranged in a first direction with the dielectric layer therebetween, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction, a main body, a first external electrode disposed on at least one of the first surface, the second surface, the fifth surface, and the sixth surface and connected to the first internal electrode, a second external electrode disposed on at least one of the first surface, the second surface, the third surface, and the fourth surface and connected to the second internal electrode, and a first connection electrode passing through the dielectric layer and connecting two adjacent first internal electrodes in the first direction to each other. The first connection electrode provides a stacked electronic component in which a plurality of first via electrodes arranged to be offset from each other in a direction perpendicular to the first direction are stacked in the first direction.

[0008] One embodiment of the present invention includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction. A first internal electrode layer including a first dielectric layer and a first internal electrode disposed on the first dielectric layer, the first internal electrode including a first main portion and a first lead portion extending from the first main portion toward the fifth surface or the sixth surface; and a second dielectric layer and a second internal electrode layer disposed on the second dielectric layer, the second internal electrode layer including a second internal electrode overlapping the first main portion in the first direction and a first auxiliary electrode disposed spaced apart from the second internal electrode in the third direction. A main body in which the first and second internal electrode layers are alternately arranged in the first direction, a first external electrode disposed on at least one of the first surface, the second surface, the fifth surface, and the sixth surface and connected to the first internal electrode, a second external electrode disposed on at least one of the first surface, the second surface, the third surface, and the fourth surface and connected to the second internal electrode, a first via electrode penetrating the first dielectric layer and connecting the first lead portion and the first auxiliary electrode, and a second via electrode penetrating the second dielectric layer and connecting the first lead portion and the first auxiliary electrode. The first via electrode and the second via electrode are arranged to be displaced from each other in a direction perpendicular to the first direction, thereby providing a stacked electronic component.

Effects of the Invention

[0009] As one of various effects of the present invention, it is possible to provide a stacked electronic component having excellent mechanical strength and electrical characteristics.

Brief Description of the Drawings

[0010]

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Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of elements in the drawings can be exaggerated for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0012] In the drawings, parts not relevant to the description are omitted for the sake of clearly explaining the present invention. The sizes and thicknesses of the components shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to what is shown in the drawings. For components with the same functions within the same scope of idea, the same reference numerals are used for explanation. Further, throughout the specification, when a part says that a certain component "includes", this means that, unless otherwise stated, it does not exclude other components, but may further include other components.

[0013] In the drawings, the first direction can be defined as the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0014] (First Embodiment) FIG. 1 is a perspective view schematically showing a stacked electronic component according to the first embodiment of the present invention, FIG. 2 is a cross-sectional view schematically showing a cut cross-section along the line I1-I1' of FIG. 1, FIG. 3 is a cross-sectional view schematically showing a cut cross-section along the line II1-II1' of FIG. 1, FIG. 4 is a cross-sectional view schematically showing a cut cross-section along the line III1-III1' of FIG. 1, FIG. 5 is a cross-sectional view schematically showing a cut cross-section along the line IV1-IV1' of FIG. 2, FIG. 6 is a cross-sectional view schematically showing a cut cross-section along the line V1-V1' of FIG. 2, and FIG. 7 is a partially enlarged cross-sectional view of FIG. 2.

[0015] Hereinafter, with reference to FIGS. 1 to 7, the stacked electronic component 100a according to the first embodiment of the present invention will be described in detail. Also, as an example of the stacked electronic component, a multilayer ceramic capacitor will be described, but the present invention is not limited thereto and can also be applied to various stacked electronic components, such as inductors, piezoelectric elements, varistors, or thermistors.

[0016] The size of the multilayer electronic component 100a is not particularly limited. However, the dimension (L size) of the multilayer electronic component 100a in the second direction may be, for example, 0.2 mm to 3.2 mm, the dimension (W size) of the multilayer electronic component 100a in the third direction may be, for example, 0.1 mm to 2.5 mm, and the dimension (T size) of the multilayer electronic component 100a in the first direction may be, for example, 0.05 mm to 2.5 mm.

[0017] The multilayer electronic component 100a according to the first embodiment of the present invention can include a main body 110 including a dielectric layer 111 and internal electrodes 121 and 122, and external electrodes 131, 132, 133, 134 and connection electrodes 141 and 143.

[0018] There is no particular limitation on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the main body 110 during the firing process or the polishing process for the corners of the main body 110, the main body 110 does not have a perfect hexahedron shape with straight lines, but can have a substantially hexahedron shape.

[0019] The main body 110 can have a first surface and a second surface 1 and 2 facing each other in the first direction, a third surface and a fourth surface 3 and 4 facing each other in the second direction and connected to the first surface and the second surface 1 and 2, and a fifth surface and a sixth surface 5 and 6 facing each other in the third direction.

[0020] The main body 110 can include a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111. The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so as to be difficult to confirm without using a scanning electron microscope (SEM).

[0021] The dielectric layer 111 can contain, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 is, for example, BaTiO3, (Ba 1-x Ca x)TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3(0 < y < 1), CaZrO3, or (Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 < x ≤ 0.5, 0 < y ≤ 0.5) may also be used.

[0022] The main body 110 can include a first internal electrode 121 and a second internal electrode 122 that are alternately arranged in the first direction with the dielectric layer 111 interposed therebetween. That is, the first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having different polarities, may be arranged so as to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0023] The metal contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys, and more preferably may contain Ni, but the present invention is not limited thereto.

[0024] The first internal electrode 121 can include a first main portion 121a that overlaps the second internal electrode 122 in the first direction, and first lead portions 121b and 121c that extend from the first main portion 121a toward the fifth surface 5 or the sixth surface 6. The first internal electrode 121 can be separated from the third surface and the fourth surface 3 and 4, for example, and can be exposed to the fifth surface and the sixth surface 5 and 6 through the pair of first lead portions 121b and 121c. However, the present invention is not limited thereto, and although not shown in the drawings, the first internal electrode 121 may be exposed only to either one of the fifth surface and the sixth surface 5 and 6.

[0025] The first main part 121a can have, for example, a flat plate shape perpendicular to the first direction. The first main part 121a may be arranged at a distance from the outer surface of the main body 110.

[0026] The first lead parts 121b and 121c may have dimensions in the second direction that are smaller than those of the first main part 121a. On the other hand, in the drawings, the dimensions of the first lead parts 121b and 121c in the second direction are shown as being constant, but the present invention is not limited to this. For example, the dimensions of the first lead parts 121b and 121c in the second direction may gradually narrow from the first main part 121a toward the first external electrodes 131 and 133, or may gradually widen from the first main part 121a toward the first external electrodes 131 and 133.

[0027] Referring to FIGS. 2 and 5, in one embodiment, the thickness te of the end portions of the first lead parts 121b and 121c that are exposed on the fifth surface 5 or the sixth surface 6 may be greater than the thickness tc of the central portion of the first main part 121a in the third direction. Thereby, the connectivity between the first internal electrode 121 and the first external electrodes 131 and 133 can be improved.

[0028] The second internal electrode 122 can include a second main part 122a that overlaps the first internal electrode 121 in the first direction, and second lead parts 122b and 122c that extend from the second main part 122a toward the third surface 3 or the fourth surface 4. The second internal electrode 122 can be, for example, separated from the fifth surface and the sixth surface 5 and 6 and exposed on the third surface and the fourth surface 3 and 4 via the pair of second lead parts 122b and 122c.

[0029] The second main part 122a can have, for example, a flat plate shape perpendicular to the first direction. The second main part 122a may be arranged at a distance from the outer surface of the main body 110.

[0030] On the one hand, in the drawings, it is shown that the dimensions of the second lead portions 122b and 122c in the third direction are constant, but the present invention is not limited thereto. For example, the dimensions of the second lead portions 122b and 122c in the second direction may gradually become narrower from the second main portion 122a toward the second external electrodes 132 and 134, or may gradually become wider from the second main portion 122a toward the second external electrodes 132 and 134.

[0031] The average thicknesses of the dielectric layer 111 and the internal electrodes 121 and 122 are not particularly limited. The average thickness of the dielectric layer 111 may be, for example, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm. The average thickness of the internal electrodes 121 and 122 may be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0032] The average thickness of the dielectric layer 111 and the average thicknesses of the internal electrodes 121 and 122 respectively mean the average dimensions of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction. The average thickness of the dielectric layer 111 and the average thicknesses of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, after measuring the thicknesses at a number of points of one dielectric layer 111, for example, 30 points at equal intervals in the second direction, the average thickness of the dielectric layer 111 can be measured by taking the average value. Also, after measuring the thicknesses at a number of points of one internal electrode 121 or 122, for example, 30 points at equal intervals in the second direction, the average thickness of the internal electrodes 121 and 122 can be measured by taking the average value. The 30 points at the above equal intervals can be specified in the capacitance forming portion Ac. On the other hand, after performing such measurement of the average value for 10 dielectric layers 111 and 10 internal electrodes 121 and 122 respectively and then measuring the average value, the average thickness of the dielectric layer 111 and the average thicknesses of the internal electrodes 121 and 122 can be further generalized.

[0033] The main body 110 is disposed inside the main body 110, and a capacitance forming portion Ac in which first and second internal electrodes 121 and 122 are alternately arranged in a first direction with a dielectric layer 111 interposed therebetween to form a capacitance, and cover portions 112 and 113 disposed on both surfaces facing the first direction of the capacitance forming portion Ac can be included. The cover portions 112 and 113 can have a configuration similar to that of the dielectric layer 111, except that they do not include internal electrodes.

[0034] The average thickness of the cover portions 112 and 113 is not particularly limited. The average thickness of the cover portions 112 and 113 may be, for example, 40 μm or less, 30 μm or less, or 20 μm or less. The average thickness of the cover portions 112 and 113 may be, for example, 5 μm or more, or 10 μm or more. Here, the average thickness of the cover portions 112 and 113 means the average thickness of each of the first cover portion 112 and the second cover portion 113.

[0035] The average thickness of the cover portions 112 and 113 can mean the average dimension of the cover portions 112 and 113 in the first direction, and can be a value obtained by averaging the dimensions of the cover portions 112 and 113 in the first direction measured at five points equally spaced in the second direction in the cross section in the first and second directions cut at the center in the third direction of the main body 110.

[0036] The first external electrodes 131 and 133 are disposed on at least one of the first surface, the second surface, the fifth surface, and the sixth surface 1, 2, 5, 6, and can be connected to the first internal electrode 121. For example, a pair of first external electrodes 131 and 133 are respectively disposed on the fifth surface and the sixth surface 5, 6, and can be connected to the first lead portions 121b and 121c. The pair of first external electrodes 131 and 133 may extend and be disposed on a part of the first surface and the second surface 1, 2. However, the present invention is not limited thereto. Although not shown in the drawings, the first external electrode may be disposed on only one of the fifth surface and the sixth surface 5, 6, and the first external electrode 131 disposed on the fifth surface and the first external electrode 133 disposed on the sixth surface 6 may be connected to each other on the first surface 1 and / or the second surface 2.

[0037] The second external electrodes 132 and 134 are disposed on at least one of the first surface, the second surface, the third surface, and the fourth surfaces 1, 2, 3, and 4, and can be connected to the second internal electrode 122. For example, a pair of second external electrodes 132 and 134 are respectively disposed on the third surface and the fourth surface 3 and 4, and can be connected to the second lead portions 122b and 122c. The pair of second external electrodes 132 and 134 may extend and be disposed on a part of the first surface and the second surface 1 and 2.

[0038] The types of the external electrodes 131, 132, 133, and 134 are not particularly limited, and may have a multilayer structure. The external electrodes 131, 132, 133, and 134 can include, for example, an underlying electrode layer that contacts the internal electrodes 121 and 122 and a plating layer disposed on the underlying electrode layer. The underlying electrode layer can include, for example, one or more of a fired electrode layer, a conductive resin layer, and a thin film electrode layer.

[0039] The fired electrode layer can include metal and glass. The metal included in the fired electrode layer can include one or more of Cu, Ni, Pd, Pt, Au, Ag, Pb, and alloys thereof, but the present invention is not limited thereto. The glass included in the underlying electrode layer can include oxides of one or more of Ba, Ca, Zn, Al, B, and Si, but the present invention is not limited thereto.

[0040] The above conductive resin layer can contain metal particles and a resin. The metal particles contained in the above conductive resin layer can contain one or more of spherical particles and flake-shaped particles. Here, the spherical particles can also include forms that are not completely spherical. For example, they can include forms where the length ratio of the major axis to the minor axis (major axis / minor axis) is 1.45 or less. The flake-shaped particles mean particles having a flat and elongated shape. For example, the length ratio of the major axis to the minor axis (major axis / minor axis) can be 1.95 or more. The metal particles contained in the above conductive resin layer can contain, for example, one or more of Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and their alloys. The resin contained in the above conductive resin layer can contain, for example, one or more of epoxy resin, acrylic resin, and ethyl cellulose.

[0041] The above conductive resin layer can also be made of a conductive polymer. The above conductive polymer can contain, for example, one or more of polypyrrole, polyaniline, polythiophene, and PEDOT:PSS.

[0042] The above thin film electrode layer can be formed, for example, using an electrolytic plating method, an electroless plating method, an atomic layer deposition (ALD) method, a chemical vapor deposition (CVD) method, and / or a sputtering method.

[0043] The above base electrode layer can be, for example, the above fired electrode layer, or can be a form in which the above fired electrode layer and the conductive resin layer are sequentially laminated, or can be a form in which the above thin film electrode layer and the fired electrode layer are sequentially laminated.

[0044] The above plating layer can contain, for example, Ni, Sn, Pd, and / or their alloys, and can also be formed from multiple layers. The above plating layer can be, for example, a Ni plating layer or a Sn plating layer, or can be a form in which a Ni plating layer and a Sn plating layer are sequentially formed. Also, the above plating layer can contain multiple Ni plating layers and / or multiple Sn plating layers.

[0045] In the drawings, a structure of the multilayer electronic component 100a having a pair of first external electrodes 131 and 133 and a pair of second external electrodes 132 and 134 is described. However, the present invention is not limited thereto, and the number, shape, etc. of the external electrodes 131, 132, 133, and 134 can be changed according to the form of the internal electrodes 121, 122, and other purposes.

[0046] The multilayer electronic component 100a according to the first embodiment of the present invention may include first connection electrodes 141 and 143 that penetrate the dielectric layer 111 and connect two adjacent first internal electrodes 121 in the first direction to each other. The first connection electrodes 141 and 143 can connect adjacent ones among the plurality of first internal electrodes 121.

[0047] For example, the first connection electrodes 141 and 143 can penetrate regions adjacent to the fifth and sixth surfaces 5 and 6 of the dielectric layer 111 and connect adjacent ones among the plurality of first lead portions 121b and 121c. For example, the first connection electrodes 141 and 143 can penetrate the regions where the fifth and sixth surfaces 5 and 6 and the second internal electrode 122 are separated in the third direction (hereinafter referred to as "first margin regions").

[0048] In the conventional case, there has been a problem that the connection between the internal electrode and the external electrode is broken due to shrinkage of the internal electrode in the firing process, cracks generated in the main body, etc. As the number of internal electrodes whose connection with the external electrode is broken increases among the plurality of internal electrodes, the capacitance of the multilayer electronic component may decrease.

[0049] On the other hand, according to the first embodiment of the present invention, even if some of the first internal electrodes 121 shrink due to the firing process and the contact with the first external electrodes 131 and 133 is broken on the fifth surface 5 or the sixth surface 6, the first internal electrodes can be electrically connected to the first external electrodes 131 and 133 via the first connection electrodes 141 and 143 and the first internal electrodes 121 of other layers. Thereby, it is possible to prevent the capacitance of the multilayer electronic component 100a from decreasing.

[0050] In addition, the first connection electrodes 141 and 143 are arranged in the first margin area, and can suppress the phenomenon that the first margin area sinks due to a step difference caused by a difference in the number of stacked layers of the internal electrodes 121 and 122 between the first margin area and the capacitance forming portion Ac or external stress.

[0051] According to the first embodiment of the present invention, the first connection electrodes 141 and 143 can have a form in which a plurality of first via electrodes 141a, 141b, 143a, and 143b arranged to be displaced from each other in a direction perpendicular to the first direction are stacked in the first direction.

[0052] Referring to FIG. 7, the fact that the plurality of first via electrodes 141a and 141b are arranged to be displaced from each other in a direction perpendicular to the first direction means that in a cross section of the main body 110 in the first direction and the third direction, a virtual line L11a connecting the upper and lower half points of one first via electrode 141a and a virtual line L11b connecting the upper and lower half points of another adjacent first via electrode 141b do not coincide with each other.

[0053] The first connection electrodes 141 and 143 can be formed, for example, in the process of laminating two dielectric sheets in which vias are formed. At this time, the vias formed in each dielectric sheet may not be perfectly aligned with each other, and as a result, the two stacked first via electrodes 141a, 141b, 143a, and 143b may be arranged to be displaced from each other in a direction perpendicular to the first direction. Different from the conventional method of drilling the fired main body using a drill or a punching machine to form the first connection electrode, the first embodiment of the present invention can form the first connection electrodes 141 and 143 by laminating dielectric sheets in which vias are formed, so that the problem of cracks occurring in the main body 110 due to drilling can be prevented.

[0054] In one embodiment, a plurality of first connection electrodes 141 and 143 penetrating the same dielectric layer 111 can be arranged. The plurality of first connection electrodes 141 and 143 penetrating the same dielectric layer 111 may be arranged in the second and third directions. Here, arranging a plurality of first connection electrodes 141 and 143 penetrating the same dielectric layer 111 means arranging a plurality of first connection electrodes 141 and a plurality of first connection electrodes 143, respectively.

[0055] For example, a plurality of first connection electrodes 141 and 143 arranged at the same level may be arranged, and the plurality of first connection electrodes 141 and 143 arranged at the same level may be arranged in the second and third directions.

[0056] The number of the first connection electrodes 141 and 143 penetrating the same dielectric layer 111 is not particularly limited and may vary depending on the size of the stacked electronic component 100a, the size of the first connection electrodes 141 and 143, and the like. For example, the number of the first connection electrodes 141 and 143 penetrating the same dielectric layer 111 may be 5 or more and 300 or less. Here, the number of the first connection electrodes 141 and 143 means the number of each of the first connection electrode 141 and the first connection electrode 143.

[0057] In one embodiment, the width of the upper surface of the first via electrodes 141a, 141b, 143a, and 143b may be wider than the width of the lower surface of the first via electrodes 141a, 141b, 143a, and 143b. As will be described later, a via formed in a dielectric sheet can be formed, for example, by irradiating the dielectric sheet with a laser. At this time, the amount of energy of the laser light can become lower as it goes from one surface of the dielectric sheet irradiated with the laser to the other opposite surface. Thereby, the width of the first via electrodes 141a, 141b, 143a, and 143b can gradually become narrower from the upper surface of the first via electrodes 141a, 141b, 143a, and 143b toward the first via electrodes 141a, 141b, 143a, and 143b.

[0058] On the one hand, in the drawings, the cross-sections of the first via electrodes 141a, 141b, 143a, and 143b are trapezoidal, but the present invention is not limited thereto. By adjusting the irradiation conditions of the laser, the cross-sections of the first via electrodes 141a, 141b, 143a, and 143b can have various forms, and the side walls of the first via electrodes 141a, 141b, 143a, and 143b can also have curved surfaces.

[0059] On the other hand, the maximum widths of the first via electrodes 141a, 141b, 143a, and 143b can vary depending on the size of the multilayer electronic component 100a, the thickness of the dielectric layer 111, and the like. The maximum widths of the first via electrodes 141a, 141b, 143a, and 143b are not particularly limited, but may be 0.03 μm to 10 μm.

[0060] FIG. 8 is a perspective view schematically showing a multilayer electronic component according to a first modification of the first embodiment of the present invention, FIG. 9 is a cross-sectional view schematically showing a cut cross-section along the line I2-I2' of FIG. 8, FIG. 10 is a cross-sectional view schematically showing a cut cross-section along the line II2-II2' of FIG. 8, FIG. 11 is a cross-sectional view schematically showing a cut cross-section along the line IV2-IV2' of FIG. 9, and FIG. 12 is a cross-sectional view schematically showing a cut cross-section along the line V2-V2' of FIG. 9.

[0061] Hereinafter, with reference to FIGS. 8 to 12, the multilayer electronic component 100b according to the first modification of the first embodiment of the present invention will be described. The same / similar reference numerals are used for the same / similar configurations as those of the multilayer electronic component 100a described with reference to FIGS. 1 to 7, and the overlapping descriptions will be omitted.

[0062] The multilayer electronic component 100b can include second connection electrodes 142 and 144 that penetrate the dielectric layer 111 and connect two adjacent second internal electrodes 122 in the first direction to each other. The second connection electrodes 142 and 144 can connect adjacent ones of the plurality of second internal electrodes 122.

[0063] For example, the second connection electrodes 142 and 144 can connect adjacent ones among the plurality of second lead portions 122b and 122c through the regions adjacent to the third surface and the fourth surface 3 and 4 of the dielectric layer 111. For example, the second connection electrodes 142 and 144 can penetrate the third surface and the fourth surface 3 and 4 and the region where the first internal electrode 121 is separated in the second direction (hereinafter referred to as the "second margin region").

[0064] The second connection electrodes 142 and 144 can have a form in which a plurality of second via electrodes 142a, 142b, 144a, and 144b arranged to be displaced from each other in a direction perpendicular to the first direction are stacked in the first direction.

[0065] As described above, when the plurality of second via electrodes 142a, 142b, 144a, and 144b are arranged to be displaced from each other in a direction perpendicular to the first direction, it can be meant that in the cross section of the main body 110 in the first direction and the second direction, a virtual line connecting the upper and lower half points of one second via electrode 142a, 144a and a virtual line connecting the upper and lower half points of another adjacent second via electrode 142b, 144b do not coincide with each other.

[0066] According to the first modification of the first embodiment of the present invention, by further including the second connection electrodes 142 and 144 in addition to the first connection electrodes 142 and 144, the mechanical strength and electrical characteristics of the stacked electronic component 100b can be more effectively improved.

[0067] In one embodiment, a plurality of second connection electrodes 142 and 144 penetrating the same dielectric layer 111 can be arranged. The plurality of second connection electrodes 142 and 144 penetrating the same dielectric layer 111 may be arranged in the second and third directions.

[0068] For example, a plurality of second connection electrodes 142 and 144 arranged at the same level may be arranged, and the plurality of second connection electrodes 142 and 144 arranged at the same level may be arranged in the second and third directions.

[0069] The number of the second connection electrodes 142 and 144 penetrating the same dielectric layer 111 is not particularly limited and may vary depending on the size of the multilayer electronic component 100b, the size of the second connection electrodes 142 and 144, and the like. For example, the number of the second connection electrodes 142 and 144 penetrating the same dielectric layer 111 may be 5 or more and 1000 or less. Here, the number of the second connection electrodes 142 and 144 means the respective numbers of the second connection electrode 142 and the second connection electrode 144.

[0070] Hereinafter, detailed description of the second connection electrodes 142 and 144 will be omitted. However, there is only a difference that the first connection electrodes 141 and 143 are connected to the first internal electrodes 121, and the second connection electrodes 142 and 144 are connected to the second internal electrodes 122, and the second connection electrodes 142 and 144 can have a configuration similar to that of the first connection electrodes 141 and 143. Therefore, the above description of the first connection electrodes 141 and 143 can be similarly applied to the second connection electrodes 142 and 144 as long as there is no contradiction.

[0071] FIG. 13 is a perspective view schematically showing a multilayer electronic component according to a second modification of the first embodiment of the present invention, FIG. 14 is a cross-sectional view schematically showing a cut section along line I3-I3' of FIG. 13, FIG. 15 is a cross-sectional view schematically showing a cut section along line II3-II3' of FIG. 13, FIG. 16 is a cross-sectional view schematically showing a cut section along line IV3-IV3' of FIG. 14, and FIG. 17 is a cross-sectional view schematically showing a cut section along line V3-V3' of FIG. 14.

[0072] Hereinafter, with reference to FIGS. 13 to 17, a multilayer electronic component 100c according to a second modification of the first embodiment of the present invention will be described. The same / similar reference numerals are used for the same / similar configurations as those of the multilayer electronic components 100a and 100b described with reference to FIGS. 1 to 12, and redundant description will be omitted.

[0073] The multilayer electronic component 100c can include first auxiliary electrodes 151 and 153 that are arranged at a distance from the second internal electrodes 122 in the third direction and are arranged between adjacent ones of the plurality of first via electrodes 141a, 141b, 143a, and 143b.

[0074] The pair of first auxiliary electrodes 151 and 153 can be connected to the first external electrodes 131 and 133 on the fifth surface and the sixth surface 5 and 6, respectively. However, the present invention is not limited thereto, and the first auxiliary electrodes 151 and 153 may be arranged separately from the fifth surface and the sixth surface 5 and 6.

[0075] The first auxiliary electrode 151 exposed on the fifth surface 5 is connected to a plurality of first connection electrodes 141 penetrating the same dielectric layer 111, and the first auxiliary electrode 153 exposed on the sixth surface 6 can be connected to a plurality of first connection electrodes 143 penetrating the same dielectric layer.

[0076] By arranging the first auxiliary electrodes 151 and 153, it is possible to suppress the occurrence of a step due to the difference in the number of stacked layers between the first margin region and the capacitance forming portion Ac. Thereby, the phenomenon that the first margin region sinks can be suppressed. Further, by appropriately arranging the first auxiliary electrodes 151 and 153, even if the alignment of the first via electrodes 141a, 141b, 143a, and 143b constituting the first connection electrodes 141 and 143 is excessively distorted, the electrical connection between the adjacent first internal electrodes 121 can be ensured.

[0077] The metal contained in the first auxiliary electrodes 151 and 153 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys. The first auxiliary electrodes 151 and 153 can contain the same metal as the internal electrodes 121 and 122, but the present invention is not limited thereto.

[0078] On the other hand, in order to prevent a short circuit due to the contact between the second internal electrode 122 to which voltages of different polarities are applied and the first auxiliary electrodes 151 and 153, the distance between the second internal electrode 122 and the first auxiliary electrodes 151 and 153 is preferably 10% to 90% of the distance between the second internal electrode 122 and the fifth surface 5 or the sixth surface 6.

[0079] The multilayer electronic component 100c can include second auxiliary electrodes 152 and 154 that are arranged separately from the first internal electrode 121 in the second direction and are arranged between adjacent ones of the plurality of second via electrodes 142a, 142b, 144a, and 144b.

[0080] The pair of second auxiliary electrodes 152 and 154 can be connected to the second external electrodes 132 and 134 on the third surface and the fourth surface 3 and 4, respectively. However, the present invention is not limited thereto, and the second auxiliary electrodes 152 and 154 may be arranged separately from the third surface and the fourth surface 3 and 4.

[0081] The second auxiliary electrode 152 exposed on the third surface 3 can be connected to a plurality of second connection electrodes 142 that penetrate the same dielectric layer 111, and the second auxiliary electrode 154 exposed on the fourth surface 4 can be connected to a plurality of second connection electrodes 144 that penetrate the same dielectric layer.

[0082] By arranging the second auxiliary electrodes 152 and 154, it is possible to suppress the occurrence of a step due to the difference in the number of stacked layers between the second margin region and the capacitance forming portion Ac. Thereby, the phenomenon that the second margin region sinks can be suppressed. Further, by appropriately arranging the second auxiliary electrodes 152 and 154, even if the alignment of the second via electrodes 142a, 142b, 144a, and 144b constituting the second connection electrodes 142 and 144 is excessively distorted, the electrical connection between adjacent second internal electrodes 122 can be ensured.

[0083] On the other hand, in order to prevent a short circuit due to contact between the first internal electrode 121 and the second auxiliary electrodes 152 and 154 to which voltages of different polarities are applied, the distance between the first internal electrode 121 and the second auxiliary electrodes 152 and 154 is preferably 10% to 90% of the distance between the first internal electrode 121 and the third surface 3 or the fourth surface 4.

[0084] FIG. 18 is a perspective view schematically showing a laminated electronic component according to a third modification of the first embodiment of the present invention, FIG. 19 is a cross-sectional view schematically showing a cut cross-section along line I4-I4' of FIG. 18, FIG. 20 is a cross-sectional view schematically showing a cut cross-section along line II4-II4' of FIG. 18, FIG. 21 is a cross-sectional view schematically showing a cut cross-section along line III4-III4' of FIG. 18, and FIG. 22 is a cross-sectional view schematically showing a cut cross-section along line VI4-VI4' of FIG. 20.

[0085] Hereinafter, with reference to FIGS. 18 to 22, a laminated electronic component 100d according to a third modification of the first embodiment of the present invention will be described. The same / similar reference numerals are used for the same / similar configurations as those of the laminated electronic components 100a and 100b described with reference to FIGS. 1 to 12, and redundant descriptions are omitted.

[0086] According to the third modification of the first embodiment of the present invention, two adjacent first connection electrodes 141d and 143d in the first direction can be arranged so as to be displaced from each other in a direction perpendicular to the first direction. Two adjacent first connection electrodes 141d and 143d in the first direction can mean two first connection electrodes 141d and 143d that are in contact with the same first internal electrode 121 and are arranged at different levels from each other.

[0087] Here, the fact that two adjacent first connection electrodes 141d and 143d are arranged so as to be displaced from each other means that in a cross-section of the main body 110 in the first direction and the second direction or in a cross-section of the main body 110 in the first direction and the third direction, a virtual line connecting the midpoints of the upper and lower surfaces of one of the first connection electrodes 141d and 143d and a virtual line connecting the midpoints of the upper and lower surfaces of the other first connection electrode 141d and 143d do not coincide with each other.

[0088] According to the third modification of the first embodiment of the present invention, two first connection electrodes 141d and 143d adjacent to each other in the first direction are arranged so as to be displaced from each other, and the first connection electrodes 141d and 143d can be dispersedly arranged within the first margin region. Thereby, the mechanical strength of the multilayer electronic component 100d can be effectively improved as compared with the number of the first connection electrodes 141d and 143d.

[0089] Further, two second connection electrodes 142d and 144d adjacent to each other in the first direction can be arranged so as to be displaced from each other in a direction perpendicular to the first direction. Two second connection electrodes 142d and 144d adjacent to each other in the first direction can mean two second connection electrodes 142d and 144d that are in contact with the same second internal electrode 122 and are arranged at different levels from each other.

[0090] Hereinafter, detailed description of the second connection electrodes 142d and 144d will be omitted. The second connection electrodes 142d and 144d can have a configuration similar to that of the first connection electrodes 141d and 143d. Therefore, the description of the first connection electrodes 141d and 143d described above can be similarly applied to the second connection electrodes 142d and 144d as long as there is no contradiction.

[0091] FIG. 23 is a perspective view schematically showing a multilayer electronic component according to a fourth modification of the first embodiment of the present invention, FIG. 24 is a cross-sectional view schematically showing a cut section along line I5-I5' of FIG. 23, FIG. 25 is a cross-sectional view schematically showing a cut section along line II5-II5' of FIG. 23, FIG. 26 is a cross-sectional view schematically showing a cut section along line III5-III5' of FIG. 23, and FIG. 27 is a cross-sectional view schematically showing a cut section along line VI5-VI5' of FIG. 25.

[0092] Hereinafter, with reference to FIGS. 23 to 27, a multilayer electronic component 100e according to the third modification of the first embodiment of the present invention will be described. For the configurations identical / similar to those of the multilayer electronic components 100a and 100b described in FIGS. 1 to 12, the same / similar reference numerals are used, and redundant descriptions are omitted.

[0093] The first external electrodes 131 and 133 can be arranged on at least one of the first surface and the second surfaces 1 and 2. For example, a pair of first external electrodes 131 and 133 are respectively arranged on the fifth surface and the sixth surface 5 and 6, and can extend on at least one of the first surface and the second surfaces 1 and 2.

[0094] The second external electrodes 132 and 134 can be arranged on at least one of the first surface and the second surfaces 1 and 2. For example, a pair of second external electrodes 132 and 134 are respectively arranged on the third surface and the fourth surface 3 and 4, and can extend on at least one of the first surface and the second surfaces 1 and 2.

[0095] The multilayer electronic component 100e can include first contact electrodes 161 and 163 that penetrate the cover parts 112 and 113 and connect between a first internal electrode 121 arranged on the outermost periphery with reference to the first direction and the first external electrodes 131 and 133.

[0096] The first contact electrodes 161 and 163 can be formed by laminating two or more cover part forming sheets in which vias are formed. Thereby, the first contact electrodes 161 and 163 can have a form in which a plurality of via electrodes are laminated. The number of via electrodes forming the first contact electrodes 161 and 163 is not particularly limited and may vary depending on the number of the cover part forming sheets. Also, a plurality of the first contact electrodes 161 and 163 may be respectively arranged on the first and second cover parts 112 and 113.

[0097] The first contact electrodes 161 and 163 connect between regions extending on the first surface 1 or the second surface 2 among the first internal electrode 121 arranged on the outermost periphery with reference to the first direction and the first external electrodes 131 and 133, thereby increasing the current path of the multilayer electronic component 100e, and as a result, reducing the equivalent series resistance (ESR) of the multilayer electronic component 100e.

[0098] The multilayer electronic component 100e can include second contact electrodes 162 and 164 that penetrate the cover portions 112 and 113 and connect between the second internal electrode 122 and the second external electrodes 132 and 134 disposed on the outermost periphery with respect to the first direction.

[0099] Similar to the second connection electrodes 142 and 144, the second contact electrodes 162 and 164 can be formed by laminating two or more cover portion forming sheets in which vias are formed. Thereby, the second contact electrodes 162 and 164 can have a form in which a plurality of via electrodes are laminated. The number of via electrodes forming the second contact electrodes 162 and 164 is not particularly limited and can vary depending on the number of the cover portion forming sheets. A plurality of the second contact electrodes 162 and 164 may be respectively disposed on the first and second cover portions 112 and 113.

[0100] FIG. 28 is a perspective view schematically showing a multilayer electronic component according to a fifth modification of the first embodiment of the present invention, FIG. 29 is a cross-sectional view schematically showing a cut cross-section along line I6-I6' of FIG. 28, and FIG. 30 is a cross-sectional view schematically showing a cut cross-section along line II6-II6' of FIG. 28.

[0101] Hereinafter, with reference to FIGS. 28 to 30, a multilayer electronic component 100f according to a fifth modification of the first embodiment of the present invention will be described. The same / similar reference numerals are used for the same / similar configurations as those of the multilayer electronic component 100e described with reference to FIGS. 23 to 27, and redundant descriptions are omitted.

[0102] The first external electrodes 131f and 133f are disposed on the second surface 2, but may not be disposed on the first surface 1. For example, the pair of first external electrodes 131f and 133f may be disposed spaced apart from each other in the third direction on the second surface 2. The first external electrodes 131f and 133f do not have to extend on the fifth and sixth surfaces 5 and 6, but the present invention is not limited thereto, and the first external electrodes 131f and 133f may extend on at least one of the fifth and sixth surfaces 5 and 6.

[0103] The second external electrodes 132f and 134f are disposed on the second surface 2, but may not be disposed on the first surface 1. For example, the pair of second external electrodes 132f and 134f may be disposed spaced apart from each other in the second direction on the second surface 2. The second external electrodes 132f and 134f do not have to extend onto the third to sixth surfaces 3, 4, 5, and 6, but the present invention is not limited thereto, and the second external electrodes 132f and 134f may extend onto at least one of the third to sixth surfaces 3, 4, 5, and 6.

[0104] The multilayer electronic component 100f can include first contact electrodes 161 and 163 that penetrate the cover portion 113 and connect between the first internal electrode 121f disposed on the outermost periphery with reference to the first direction and the first external electrodes 131f and 133f. The first contact electrodes 161 and 163 are disposed on the second cover portion 113, but may not be disposed on the first cover portion 112.

[0105] The multilayer electronic component 100f can include second contact electrodes 162 and 164 that penetrate the cover portion 113 and connect between the second internal electrode 122f disposed on the outermost periphery with reference to the first direction and the second external electrodes 132f and 134f. The second contact electrodes 162 and 164 are disposed on the second cover portion 113, but may not be disposed on the first cover portion 112.

[0106] On the other hand, since the first contact electrodes 161 and 163 electrically connect the first internal electrode 121f and the first external electrodes 131f and 133f, and the second contact electrodes 162 and 164 electrically connect the second internal electrode 122f and the second external electrodes 132f and 134f, the internal electrodes 121f and 122f do not have to be exposed on the outer surface of the main body 110. That is, the internal electrodes 121f and 122f may be disposed spaced apart from the third to sixth surfaces 3, 4, 5, and 6. Thereby, it is possible to prevent the moisture resistance reliability of the multilayer electronic component 100f from deteriorating.

[0107] Further, by disposing the external electrodes 131f and 132f only on the second surface 2, the capacitance per unit volume and the bending strength of the multilayer electronic component 100f can be improved.

[0108] FIG. 31 is a perspective view schematically showing a stacked electronic component according to a sixth modification of the first embodiment of the present invention, FIG. 32 is a cross-sectional view schematically showing a cut cross-section along the line I7-I7' of FIG. 31, and FIG. 33 is a cross-sectional view schematically showing a cut cross-section along the line II7-II7' of FIG. 31.

[0109] Hereinafter, with reference to FIGS. 31 to 33, a stacked electronic component 100g according to a sixth modification of the first embodiment of the present invention will be described. For the configurations that are the same as / similar to those of the stacked electronic component 100f described in FIGS. 28 to 30, the same / similar reference numerals are used, and redundant descriptions are omitted.

[0110] The first external electrodes 131f, 133f, 131g, and 133g can be respectively arranged on the first surface and the second surfaces 1 and 2. For example, a pair of the first external electrodes 131f and 133f can be arranged to be spaced apart from each other in the third direction on the second surface 2, and a pair of the first external electrodes 131g and 133g can be arranged to be spaced apart from each other in the third direction on the first surface 1.

[0111] The first external electrodes 131g and 133g arranged on the first surface 1 and the first external electrodes 131f and 133f arranged on the second surface 2 can be arranged to be spaced apart from each other. The first external electrodes 131f, 133f, 131g, and 133g do not have to extend on the fifth and sixth surfaces 5 and 6, but the present invention is not limited thereto, and the first external electrodes 131f, 133f, 131g, and 133g may extend on at least one of the fifth and sixth surfaces 5 and 6.

[0112] The second external electrodes 132f, 134f, 132g, and 134g can be respectively arranged on the first surface and the second surfaces 1 and 2. For example, a pair of the second external electrodes 132f and 134f can be arranged to be spaced apart from each other in the second direction on the second surface 2, and a pair of the second external electrodes 132g and 134g can be arranged to be spaced apart from each other in the second direction on the first surface 1.

[0113] The second external electrodes 132g and 134g disposed on the first surface 1 and the second external electrodes 132f and 134f disposed on the second surface 2 can be arranged to be separated from each other. The second external electrodes 132f, 134f, 132g, and 134g may not extend onto the third to sixth surfaces 3, 4, 5, and 6, but the present invention is not limited thereto, and the second external electrodes 132f, 134f, 132g, and 134g may extend onto at least one of the third to sixth surfaces 3, 4, 5, and 6.

[0114] The multilayer electronic component 100g can include first contact electrodes 161 and 163 that penetrate the cover portions 112 and 113 and connect between the first internal electrode 121f disposed on the outermost periphery with reference to the first direction and the first external electrodes 131f, 133f, 131g, and 133g. The first contact electrodes 161 and 163 can be respectively disposed on the first and second cover portions 112 and 113.

[0115] The multilayer electronic component 100e can include second contact electrodes 162 and 164 that penetrate the cover portions 112 and 113 and connect between the second internal electrode 122f disposed on the outermost periphery with reference to the first direction and the second external electrodes 132f, 134f, 132g, and 134g. The second contact electrodes 162 and 164 can be respectively disposed on the first and second cover portions 112 and 113.

[0116] Since the first external electrodes 131f, 133f, 131g, 133g and the second external electrodes 132f, 134f, 132g, 134g are respectively disposed on the first surface and the second surface 1 and 2, the multilayer electronic component 100g can ensure the convenience of mounting compared to the multilayer electronic component 100f.

[0117] (Second Embodiment) FIG. 34 is a perspective view schematically showing a multilayer electronic component according to a second embodiment of the present invention, FIG. 35 is an exploded perspective view schematically showing a part of the main body of the multilayer electronic component according to the second embodiment of the present invention, FIG. 36 is a cross-sectional view schematically showing a cut cross-section along line I8-I8' of FIG. 34, FIG. 37 is a cross-sectional view schematically showing a cut cross-section along line II8-II8' of FIG. 34, FIG. 38 is a cross-sectional view schematically showing a cut cross-section along line III8-III8' of FIG. 34, FIG. 39 is a plan view schematically showing a first internal electrode layer of the multilayer electronic component according to the second embodiment of the present invention, FIG. 40 is a plan view schematically showing a second internal electrode layer of the multilayer electronic component according to the second embodiment of the present invention, and FIG. 41 is a partially enlarged cross-sectional view of FIG. 36.

[0118] Hereinafter, with reference to FIGS. 34 to 41, the multilayer electronic component 200a according to the second embodiment of the present invention will be described. For the configurations that are the same as / similar to those of the multilayer electronic component 100a described in FIGS. 1 to 7, the same / similar reference numerals are used, and redundant descriptions are omitted.

[0119] The multilayer electronic component 200a according to the second embodiment of the present invention includes a main body 210, first external electrodes 231 and 233, second external electrodes 232 and 234, first via electrodes 241a and 243a, and second via electrodes 241b and 243b.

[0120] The main body 210 can have a first surface and a second surface 1 and 2 facing each other in a first direction, a third surface and a fourth surface 3 and 4 facing each other in a second direction and connected to the first surface and the second surface 1 and 2, and a fifth surface and a sixth surface 5 and 6 facing each other in a third direction.

[0121] The main body 210 can include a first internal electrode layer 220a and a second internal electrode layer 220b alternately arranged in a first direction. The main body 210 is disposed inside the main body 210, and a capacitance forming portion Ac is formed by alternately arranging first and second internal electrodes 221 and 222 with the first dielectric layer 211a or the second dielectric layer 211b interposed therebetween, and can include cover portions 212 and 213 disposed on both surfaces of the capacitance forming portion Ac facing the first direction.

[0122] The first internal electrode layer 220a can include a first dielectric layer 211a and a first internal electrode 221 disposed on the first dielectric layer 211a. The second internal electrode layer 220b is disposed on the second dielectric layer 211b, and can include a second internal electrode 222 overlapping with the first main portion 221a in the first direction and first auxiliary electrodes 251 and 253 spaced apart from the second internal electrode 222 in a third direction.

[0123] The first internal electrode 221 can include a first main portion 221a overlapping with the second internal electrode 222 in the first direction, and first lead portions 221b and 221c extending from the first main portion 221a toward the fifth surface 5 or the sixth surface 6. The first internal electrode 221 can be exposed on the fifth surface and the sixth surface 5 and 6 via a pair of first lead portions 221b and 221c. In one embodiment, the thickness of the end portion of the first lead portions 221b and 221c exposed on the fifth surface 5 or the sixth surface 6 may be greater than the thickness of the central portion of the first main portion 221a in the third direction.

[0124] The second internal electrode 222 can include a second main portion 222a overlapping with the first internal electrode 221 in the first direction, and second lead portions 222b and 222c extending from the second main portion 222a toward the third surface 3 or the fourth surface 4. The second internal electrode 222 can be exposed on the third surface and the fourth surface 3 and 4 via a pair of second lead portions 222b and 222c.

[0125] The pair of first auxiliary electrodes 251 and 253 can be connected to the first external electrodes 231 and 233 on the fifth and sixth surfaces 5 and 6. However, the present invention is not limited thereto, and the first auxiliary electrodes 251 and 253 may be arranged separately from the first external electrodes 231 and 233.

[0126] The first external electrodes 231 and 233 are arranged on at least one of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 and can be connected to the first internal electrode 221. For example, the pair of first external electrodes 231 and 233 are respectively arranged on the fifth and sixth surfaces 5 and 6 and can be connected to the first lead portions 221b and 221c. The pair of first external electrodes 231 and 233 may extend and be arranged on a part of the first and second surfaces 1 and 2.

[0127] The second external electrodes 232 and 234 are arranged on at least one of the first, second, third, and fourth surfaces 1, 2, 3, and 4 and can be connected to the second internal electrode 222. For example, the pair of second external electrodes 232 and 234 are respectively arranged on the third and fourth surfaces 3 and 4 and can be connected to the second lead portions 222b and 222c. The pair of second external electrodes 232 and 234 may extend and be arranged on a part of the first and second surfaces 1 and 2.

[0128] The external electrodes 231, 232, 233, and 234 can include, for example, an underlying electrode layer that contacts the internal electrodes 221 and 222, and a plating layer arranged on the underlying electrode layer. The underlying electrode layer can include, for example, one or more of a fired electrode layer, a conductive resin layer, and a thin film electrode layer.

[0129] The multilayer electronic component 200a according to the second embodiment of the present invention can include first via electrodes 241a and 243a that penetrate the first dielectric layer 211a and connect the first lead portions 221b and 221c to the first auxiliary electrodes 251 and 253, and second via electrodes 241b and 243b that penetrate the second dielectric layer 211b and connect the first lead portions 221b and 221c to the first auxiliary electrodes 251 and 253.

[0130] For example, the first via electrodes 241a and 243a can connect the first lead portions 221b and 221c and the first auxiliary electrodes 251 and 253 to each other by penetrating through the regions adjacent to the fifth and sixth surfaces 5 and 6 of the first dielectric layer 211a, respectively. For example, the second via electrodes 241b and 243b can connect the first lead portions 221b and 221c and the first auxiliary electrodes 251 and 253 to each other by penetrating through the regions adjacent to the fifth and sixth surfaces 5 and 6 of the second dielectric layer 211b, respectively.

[0131] According to the second embodiment of the present invention, even if some of the first internal electrodes 221 shrink during the firing process and the contact with the first external electrodes 231 and 233 is broken at the fifth surface 5 or the sixth surface 6, the first internal electrodes can be electrically connected to the first external electrodes 231 and 233 via the first and second via electrodes 241a, 243a, 241b, 243b and the first internal electrodes of other layers. Thereby, it is possible to prevent the capacitance of the multilayer electronic component 200a from decreasing.

[0132] According to the second embodiment of the present invention, the first via electrodes 241a and 243a and the second via electrodes 241b and 243b can be arranged so as to be displaced from each other in a direction perpendicular to the first direction. That is, the first via electrode 241a can be arranged so as to be displaced from the second via electrode 241b in a direction perpendicular to the first direction, and the first via electrode 243a can be arranged so as to be displaced from the second via electrode 243b in a direction perpendicular to the first direction.

[0133] Referring to FIG. 41, the fact that the first via electrode 241a and the second via electrode 241b are arranged so as to be displaced from each other in a direction perpendicular to the first direction means that in the cross section of the main body 210 in the first and third directions, a virtual line L21a connecting the midpoints of the upper and lower surfaces of the first via electrode 241a and a virtual line L21b connecting the midpoints of the upper and lower surfaces of the second via electrode 241b do not coincide with each other.

[0134] By arranging the first via electrodes 241a and 243a and the second via electrodes 241b and 243b so as to be displaced from each other, the via electrodes 241a, 243a, 241b, and 243b can be dispersedly arranged in a margin region where the fifth and sixth surfaces 5 and 6 and the capacitance forming portion Ac are separated in the third direction. Thereby, it is possible to suppress a phenomenon in which the margin region sinks due to a density difference between a region where the via electrodes 241a, 243a, 241b, and 243b are arranged and a region where the via electrodes 241a, 243a, 241b, and 243b are not arranged in the margin region, or due to external stress. Further, by dispersedly arranging the via electrodes 241a, 243a, 241b, and 243b in the margin region, the mechanical strength of the stacked electronic component 200a can be effectively improved as compared with the number of the via electrodes 241a, 243a, 241b, and 243b.

[0135] In one embodiment, the first via electrodes 241a and 243a and the second via electrodes 241b and 243b may not overlap each other in the first direction. When the first via electrodes 241a and 243a and the second via electrodes 241b and 243b are arranged so as to be displaced from each other, the effect of improving the mechanical strength of the stacked electronic component 200a intended in the present invention can be exhibited. However, when the first via electrodes 241a and 243a and the second via electrodes 241b and 243b are arranged so as not to overlap each other in the first direction, the effect of improving the mechanical strength of the present invention can be more remarkable.

[0136] Referring to FIG. 41, the fact that the first via electrode 241a does not overlap the second via electrode 241b in the first direction means that a virtual line TL in the first direction in contact with the second via electrode 241b does not intersect the first via electrode 241a at a point where the width of the second via electrode 241b is maximum.

[0137] In one embodiment, a plurality of first via electrodes 241a and 243a penetrating the same first dielectric layer 211a can be arranged, and the plurality of first via electrodes 241a and 243a penetrating the same first dielectric layer 211a can be arranged in the second and third directions. For example, a plurality of first via electrodes 241a and 243a arranged at the same level may be arranged, and the plurality of first via electrodes 241a and 243a arranged at the same level may be arranged in the second and third directions. Here, the arrangement of a plurality of first via electrodes 241a and 243a penetrating the same first dielectric layer 211a means that a plurality of first via electrodes 241a and a plurality of first via electrodes 243a are arranged respectively.

[0138] Similarly, a plurality of second via electrodes 241b and 243b penetrating the same second dielectric layer 211b can be arranged, and the plurality of second via electrodes 241b and 243b penetrating the same second dielectric layer 211b can be arranged in the second and third directions. For example, a plurality of second via electrodes 241b and 243b arranged at the same level may be arranged, and the plurality of second via electrodes 241b and 243b arranged at the same level may be arranged in the second and third directions. Here, the arrangement of a plurality of second via electrodes 241b and 243b penetrating the same second dielectric layer 211b means that a plurality of second via electrodes 241b and a plurality of second via electrodes 243b are arranged respectively.

[0139] Referring to FIGS. 39 and 40, the plurality of first via electrodes 241a and 243a penetrating the same first dielectric layer 211a can form first grating patterns LP1a and LP3a by being arranged so as to be displaced from each other with reference to the second and third directions, and the plurality of second via electrodes 241b and 243b penetrating the same second dielectric layer 211b can form second grating patterns LP1b and LP3b by being arranged so as to be displaced from each other with reference to the second and third directions.

[0140] The first grid patterns LP1a and LP3a and the second grid patterns LP1b and LP3b can be alternately arranged with each other in the main body 210 with the first internal electrode 221 or the first auxiliary electrodes 251 and 253 therebetween. The first grid patterns LP1a and LP3a and the second grid patterns LP1b and LP3b each include a plurality of via electrodes 241a, 243a, 241b, and 243b arranged in a staggered manner, and by not overlapping each other in the first direction, the effect of improving the mechanical strength of the present invention can be made more remarkable.

[0141] For example, the first dielectric layer 211a includes first regions R1 and R3 disposed between two first via electrodes 241a and 243a adjacent to each other in the second or third direction among the plurality of first via electrodes 241a and 243a, and the plurality of second via electrodes 241b and 243b can overlap the first regions R1 and R3.

[0142] In one embodiment, the width of the upper surface of the first via electrodes 241a and 243a may be wider than the width of the lower surface of the first via electrodes 241a and 243a, and the width of the upper surface of the second via electrodes 241b and 243b may be wider than the width of the lower surface of the second via electrodes 241b and 243b. The width of the first via electrodes 241a and 243a may gradually become narrower, for example, from the upper surface of the first via electrodes 241a and 243a toward the lower surface of the first via electrodes 241a and 243a, and the width of the second via electrodes 241b and 243b may gradually become narrower, for example, from the upper surface of the second via electrodes 241b and 243b toward the lower surface of the second via electrodes 241b and 243b.

[0143] FIG. 42 is a perspective view schematically showing a multilayer electronic component according to a first modification of the second embodiment of the present invention, FIG. 43 is an exploded perspective view schematically showing a part of the main body of the multilayer electronic component according to the first modification of the second embodiment of the present invention, FIG. 44 is a cross-sectional view schematically showing a cut cross-section along line I9-I9' of FIG. 42, FIG. 45 is a cross-sectional view schematically showing a cut cross-section along line II9-II9' of FIG. 42, FIG. 46 is a plan view schematically showing a first internal electrode layer of the multilayer electronic component according to the first modification of the second embodiment of the present invention, and FIG. 47 is a plan view schematically showing a second internal electrode layer of the multilayer electronic component according to the first modification of the second embodiment of the present invention.

[0144] Hereinafter, with reference to FIGS. 42 to 47, a multilayer electronic component 200b according to a first modification of the second embodiment of the present invention will be described. For configurations that are the same as or similar to those of the multilayer electronic component 200a described with reference to FIGS. 34 to 41, the same or similar reference numerals will be used, and redundant descriptions will be omitted.

[0145] The main body 210 of the multilayer electronic component 200b can include a first internal electrode layer 220a and a second internal electrode layer 220b alternately arranged in a first direction.

[0146] The first internal electrode layer 220a can include a first dielectric layer 211a, a first internal electrode 221 disposed on the first dielectric layer 211a, and second auxiliary electrodes 252 and 254 disposed at a distance from the first internal electrode 221 in a second direction.

[0147] The pair of second auxiliary electrodes 252 and 254 can be connected to the second external electrodes 232 and 234 on the third and fourth surfaces 3 and 4. However, the present invention is not limited thereto, and the second auxiliary electrodes 252 and 254 may be disposed at a distance from the second external electrodes 232 and 234.

[0148] The multilayer electronic component 200b can include third via electrodes 242a and 244a that penetrate the first dielectric layer 211a and connect the second lead portions 222b and 222c to the second auxiliary electrodes 252 and 254, and fourth via electrodes 242b and 244b that penetrate the second dielectric layer 211b and connect the second lead portions 222b and 222c to the second auxiliary electrodes 252 and 254.

[0149] For example, the third via electrodes 242a and 244a can penetrate regions adjacent to the third and fourth surfaces 3 and 4 of the first dielectric layer 211a to connect the second lead portions 222b and 222c to the second auxiliary electrodes 252 and 254 to each other. For example, the fourth via electrodes 242b and 244b can penetrate regions adjacent to the third and fourth surfaces 3 and 4 of the second dielectric layer 211b to connect the second lead portions 222b and 222c to the second auxiliary electrodes 252 and 254 to each other.

[0150] According to the second embodiment of the present invention, the third via electrodes 242a and 244a and the fourth via electrodes 242b and 244b can be arranged to be displaced from each other in a direction perpendicular to the first direction. In one embodiment, the third via electrodes 242a and 244a and the fourth via electrodes 242b and 244b may not overlap each other in the first direction.

[0151] According to the first modification of the second embodiment of the present invention, by including not only the first and second via electrodes 241a, 243a, 241b, and 243b but also the third and fourth via electrodes 242a, 244a, 242b, and 244b, the mechanical strength and electrical characteristics of the multilayer electronic component 200b can be more effectively improved.

[0152] In one embodiment, a plurality of third via electrodes 242a and 244a penetrating the same first dielectric layer 211a can be arranged, and the plurality of third via electrodes 242a and 244a penetrating the same first dielectric layer 211a can be arranged in the second and third directions. For example, a plurality of third via electrodes 242a and 244a arranged at the same level may be arranged, and the plurality of third via electrodes 242a and 244a arranged at the same level may be arranged in the second and third directions. Here, the arrangement of a plurality of third via electrodes 242a and 244a penetrating the same first dielectric layer 211a means that a plurality of third via electrodes 242a and a plurality of third via electrodes 244a are arranged respectively.

[0153] Similarly, a plurality of fourth via electrodes 242b and 244b penetrating the same second dielectric layer 211b can be arranged, and the plurality of fourth via electrodes 242b and 244b penetrating the same second dielectric layer 211b can be arranged in the second and third directions. For example, a plurality of fourth via electrodes 242b and 244b arranged at the same level may be arranged, and the plurality of fourth via electrodes 242b and 244b arranged at the same level may be arranged in the second and third directions. Here, the arrangement of a plurality of fourth via electrodes 242b and 244b penetrating the same second dielectric layer 211b means that a plurality of fourth via electrodes 242b and a plurality of fourth via electrodes 244b are arranged respectively.

[0154] Referring to FIGS. 46 and 47, the plurality of third via electrodes 242a and 244a penetrating the same first dielectric layer 211a can form third lattice patterns LP2a and LP4a by being arranged so as to be displaced from each other with reference to the second and third directions, and the plurality of fourth via electrodes 242b and 244b penetrating the same second dielectric layer 211b can form fourth lattice patterns LP2b and LP4b by being arranged so as to be displaced from each other with reference to the second and third directions.

[0155] The third grid patterns LP2a and LP4a and the fourth grid patterns LP2b and LP4b can be alternately arranged with each other in the main body 210 with the second internal electrode 222 or the second auxiliary electrodes 252 and 254 interposed therebetween. The third grid patterns LP2a and LP4a and the fourth grid patterns LP2b and LP4b each include a plurality of via electrodes 242a, 244a, 242b, and 244b arranged in a staggered pattern and do not overlap with each other in the first direction, so that the effect of improving the mechanical strength of the present invention can be more remarkable.

[0156] For example, the first dielectric layer 211a includes second regions R2 and R4 disposed between two third via electrodes 242a and 244a adjacent to each other in the second or third direction among the plurality of third via electrodes 242a and 244a, and the plurality of fourth via electrodes 242b and 244b can overlap the second regions R2 and R4.

[0157] Hereinafter, detailed descriptions of the third via electrodes 242a and 244a and the fourth via electrodes 242b and 244b are omitted. However, the third via electrodes 242a and 244a and the fourth via electrodes 242b and 244b can have a configuration similar to that of the first via electrodes 241a and 243a and the second via electrodes 241b and 243b. Therefore, the descriptions of the first via electrodes 241a and 243a and the second via electrodes 241b and 243b described above can be similarly applied to the third via electrodes 242a and 244a and the fourth via electrodes 242b and 244b as long as there is no contradiction.

[0158] FIG. 48 is a perspective view schematically showing a multilayer electronic component according to a second modification of the second embodiment of the present invention, FIG. 49 is a cross-sectional view schematically showing a cut section along the line I10-I10' of FIG. 48, and FIG. 50 is a cross-sectional view schematically showing a cut section along the line II10-II10' of FIG. 48.

[0159] Hereinafter, with reference to FIGS. 48 to 50, a multilayer electronic component 200c according to a second modification of the second embodiment of the present invention will be described. The same / similar reference numerals are used for the same / similar configurations as those of the multilayer electronic components 200a and 200b described with reference to FIGS. 34 to 47, and redundant descriptions are omitted.

[0160] The first external electrodes 231 and 233 can be disposed on at least one of the first surface and the second surfaces 1 and 2. For example, the pair of first external electrodes 231 and 233 are respectively disposed on the fifth surface and the sixth surface 5 and 6, and can extend on at least one of the first surface and the second surfaces 1 and 2.

[0161] The second external electrodes 232 and 234 can be disposed on at least one of the first surface and the second surfaces 1 and 2. For example, the pair of second external electrodes 232 and 234 are respectively disposed on the third surface and the fourth surface 3 and 4, and can extend on at least one of the first surface and the second surfaces 1 and 2.

[0162] The multilayer electronic component 200c can include first contact structures 261 and 263 that penetrate the cover portions 212 and 213 and connect between the first internal electrode 221 or the first auxiliary electrodes 251 and 253 disposed on the outermost periphery with reference to the first direction and the first external electrodes 231 and 233.

[0163] The first contact structures 261 and 263 can include first through electrodes 261a and 263a and first dummy electrodes 261b and 263b that are alternately arranged in the first direction. The first dummy electrodes 261b and 263b can be connected to the first external electrodes 231 and 233 on the fifth surface and the sixth surface 5 and 6, but the present invention is not limited thereto. The first contact structures 261 and 263 can be respectively disposed on the first and second cover portions 212 and 213.

[0164] The first contact structures 261 and 263 can be formed in a manner similar to that of the auxiliary electrodes and the via electrodes. For example, the first contact structures 261 and 263 can be formed by forming a dummy electrode pattern on a cover portion forming sheet in which vias are formed, and laminating two or more layers of the cover portion forming sheet on which the dummy electrode pattern is formed.

[0165] The first contact structures 261 and 263 can have a structure similar to that of the auxiliary electrodes 251 and 253 and the via electrodes 241a, 243a, 241b, and 243b. For example, a plurality of first through electrodes 261a and 263a may be arranged, and the plurality of first through electrodes 261a and 263a may be arranged in the second and third directions. For example, the plurality of first through electrodes 261a and 263a arranged at the same level may have a first or second lattice pattern.

[0166] The stacked electronic component 200c can include second contact structures 262 and 264 that penetrate the cover portions 212 and 213 and connect between the second internal electrode 222 or the second auxiliary electrodes 252 and 254 arranged on the outermost periphery with reference to the first direction and the second external electrodes 232 and 234.

[0167] The second contact structures 262 and 264 can include second through electrodes 262a and 264a and second dummy electrodes 262b and 264b that are alternately arranged in the first direction. The second dummy electrodes 262b and 264b can be connected to the second external electrodes 232 and 234 on the third and fourth surfaces 3 and 4, but the present invention is not limited thereto. The second contact structures 262 and 264 may be respectively arranged on the first and second cover portions 212 and 213.

[0168] For example, a plurality of second through electrodes 262a and 264a may be arranged, and the plurality of second through electrodes 262a and 264a may be arranged in the second and third directions. For example, the plurality of second through electrodes 262a and 264a arranged at the same level may have a third or fourth lattice pattern.

[0169] Hereinafter, a detailed description of the second contact structures 262 and 264 will be omitted. However, the second contact structures 262 and 264 can have a configuration similar to that of the first contact structures 261 and 263. Therefore, the description of the first contact structures 261 and 263 described above can be similarly applied to the second contact structures 262 and 264 as long as there is no contradiction.

[0170] FIG. 51 is a perspective view schematically showing a multilayer electronic component according to a third modification of the second embodiment of the present invention, FIG. 52 is a cross-sectional view schematically showing a cut cross-section along line I11-I11' of FIG. 51, and FIG. 53 is a cross-sectional view schematically showing a cut cross-section along line II11-II11' of FIG. 51.

[0171] Hereinafter, with reference to FIGS. 51 to 53, the multilayer electronic component 200d according to the third modification of the second embodiment of the present invention will be described. The same / similar reference numerals are used for the same / similar configurations as those of the multilayer electronic component 200c described with reference to FIGS. 48 to 50, and the overlapping description will be omitted.

[0172] The first external electrodes 231d and 233d are arranged on the second surface 2, but may not be arranged on the first surface 1. For example, the pair of first external electrodes 231d and 233d may be arranged to be separated from each other in the third direction on the second surface 2. The first external electrodes 231d and 233d do not have to extend on the fifth and sixth surfaces 5 and 6, but the present invention is not limited thereto, and the first external electrodes 231d and 233d may extend on at least one of the fifth and sixth surfaces 5 and 6.

[0173] The second external electrodes 232d and 234d are arranged on the second surface 2, but may not be arranged on the first surface 1. For example, the pair of second external electrodes 232d and 234d may be arranged to be separated from each other in the second direction on the second surface 2. The second external electrodes 232d and 234d do not have to extend on the third to sixth surfaces 3, 4, 5, and 6, but the present invention is not limited thereto, and the second external electrodes 232d and 234d may extend on at least one of the third to sixth surfaces 3, 4, 5, and 6.

[0174] The multilayer electronic component 200d can include first contact structures 261 and 263 that penetrate the cover portion 213 and connect between a first internal electrode 221d or first auxiliary electrodes 251d and 253d disposed on the outermost periphery with reference to the first direction and first external electrodes 231d and 233d. The first contact structures 261 and 263 are disposed on the second cover portion 113, but may not be disposed on the first cover portion 112.

[0175] The multilayer electronic component 200d can include second contact structures 262 and 264 that penetrate the cover portion 113 and connect between a second internal electrode 222d or second auxiliary electrodes 252d and 254d disposed on the outermost periphery with reference to the first direction and second external electrodes 232d and 234d. The second contact structures 262 and 264 are disposed on the second cover portion 113, but may not be disposed on the first cover portion 112.

[0176] The internal electrodes 221d and 222d can be disposed at a distance from the third to sixth surfaces 3, 4, 5, and 6. Similarly, the auxiliary electrodes 251d, 252d, 253d, 254d and the dummy electrodes 261b, 262b, 263b, 264b can be disposed at a distance from the third to sixth surfaces 3, 4, 5, and 6. Thereby, it is possible to prevent the moisture resistance reliability of the multilayer electronic component 200d from degrading.

[0177] Also, by disposing the external electrodes 231d, 232d, 233d, and 234 only on the second surface 2, it is possible to improve the capacitance per unit volume and the bending strength of the multilayer electronic component 100f.

[0178] FIG. 54 is a perspective view schematically showing a multilayer electronic component according to a fourth modification of the second embodiment of the present invention, FIG. 55 is a cross-sectional view schematically showing a cut cross-section along line I12-I12' of FIG. 54, and FIG. 56 is a cross-sectional view schematically showing a cut cross-section along line II12-II12' of FIG. 54.

[0179] Hereinafter, with reference to FIGS. 54 to 56, a multilayer electronic component 200e according to a fourth modification of the second embodiment of the present invention will be described. For configurations that are the same as or similar to those of the multilayer electronic component 200d described in FIGS. 51 to 53, the same or similar reference numerals are used, and redundant descriptions are omitted.

[0180] The first external electrodes 231d, 233d, 231e, and 233e can be respectively arranged on the first surface and the second surfaces 1 and 2. For example, a pair of the first external electrodes 231d and 233d may be arranged to be spaced apart from each other in the third direction on the second surface 2, and a pair of the first external electrodes 231e and 233e may be arranged to be spaced apart from each other in the third direction on the first surface 1.

[0181] The first external electrodes 231e and 233e arranged on the first surface 1 and the first external electrodes 231d and 233d arranged on the second surface 2 can be arranged to be spaced apart from each other. The first external electrodes 231d, 233d, 231e, and 233e do not have to extend onto the fifth and sixth surfaces 5 and 6, but the present invention is not limited thereto, and the first external electrodes 231d, 233d, 231e, and 233e may extend onto at least one of the fifth and sixth surfaces 5 and 6.

[0182] The second external electrodes 232d, 234d, 232e, and 234e can be respectively arranged on the first surface and the second surfaces 1 and 2. For example, a pair of the second external electrodes 232d and 234d may be arranged to be spaced apart from each other in the second direction on the second surface 2, and a pair of the second external electrodes 232e and 234e may be arranged to be spaced apart from each other in the second direction on the first surface 1.

[0183] The second external electrodes 232e and 234e arranged on the first surface 1 and the second external electrodes 232d and 234d arranged on the second surface 2 can be arranged to be spaced apart from each other. The second external electrodes 232d, 234d, 232e, and 234e do not have to extend onto the third to sixth surfaces 3, 4, 5, and 6, but the present invention is not limited thereto, and the second external electrodes 232d, 234d, 232e, and 234e may extend onto at least one of the third to sixth surfaces 3, 4, 5, and 6.

[0184] The internal electrodes 221d and 222d can be arranged separately from the third to sixth surfaces 3, 4, 5, and 6. Similarly, the auxiliary electrodes 251d, 252d, 253d, 254d and the dummy electrodes 261b, 262b, 263b, 264b can be arranged separately from the third to sixth surfaces 3, 4, 5, and 6. Thereby, it is possible to prevent the moisture resistance reliability of the multilayer electronic component 200e from degrading.

[0185] In addition, since the first external electrodes 231d, 233d, 231e, 233e and the second external electrodes 232d, 234d, 232e, 234e are respectively arranged on the first and second surfaces 1 and 2, the multilayer electronic component 200e can ensure the convenience of mounting compared to the multilayer electronic component 200d.

[0186] (Method for manufacturing a multilayer electronic component) FIG. 57 is a cross-sectional view schematically showing the filling and printing steps for manufacturing a multilayer electronic component according to the first or second embodiment of the present invention.

[0187] Hereinafter, with reference to FIG. 57, an example of a method for manufacturing the multilayer electronic components 100a and 200a according to the first or second embodiment of the present invention will be described.

[0188] On the other hand, the method for manufacturing a multilayer electronic component will be described based on the multilayer electronic components 100a and 200a according to the first or second embodiment. However, this can be directly applied to the multilayer electronic components 100b, 100c, 100d, 100e, 100f, 100g according to the first to sixth modification examples of the first embodiment and the multilayer electronic components 200b, 200c, 200d, 200e according to the first to fourth modification examples of the second embodiment as long as there is no contradiction.

[0189] Hereinafter, the method for manufacturing a multilayer electronic component will be described for each step.

[0190] (Dielectric sheet preparation step) First, prepare dielectric powder for forming the dielectric sheet 10. Examples of the above dielectric powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, or (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5), etc. BaTiO3 powder can be synthesized, for example, by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. Examples of the synthesis method of the above dielectric powder include a solid-phase method, a sol-gel method, a hydrothermal synthesis method, etc., but the present invention is not limited thereto.

[0191] Next, after drying and pulverizing the prepared dielectric powder, an organic solvent such as ethanol and a binder such as polyvinyl butyral are mixed to produce a dielectric slurry, and then the dielectric sheet 10 can be produced by applying and drying the dielectric slurry on a carrier film.

[0192] The dielectric layer can be formed by firing the unit laminate described later with the dielectric sheet 10.

[0193] (Via formation step) The produced dielectric sheet 10 can be continuously supplied, for example, by moving the dielectric sheet 10 from a supply roller (not shown) around which the dielectric sheet 10 is wound to a recovery roller (not shown) that unwinds the dielectric sheet 10.

[0194] At this time, vias 20 can be formed in the continuously supplied dielectric sheet 10. The step of forming the vias 20 can be performed, for example, by irradiating the dielectric sheet 10 with a laser. The above laser may be irradiated from a laser device 50 disposed on the dielectric sheet 10.

[0195] The type of the laser device 50 is not particularly limited, and for example, a CO2 laser, a YAG laser, a femtosecond laser, or a picosecond UV laser can be used. The vias 20 can have a tapered shape in which the width gradually decreases from one surface of the dielectric sheet 10 irradiated with the laser toward the opposite other surface as the vias 20 are formed by laser processing.

[0196] (Filling step) Next, a filling step of filling the vias 20 with an electrode paste (EP) can be performed. The electrode paste (EP) can contain, for example, metal powder, a binder, an organic solvent, and the like.

[0197] The method of filling the vias 20 with the electrode paste (EP) is not particularly limited. For example, as shown in FIG. 57, the dielectric sheet 10 can pass between an application roller 61 and a cylinder 71. The application roller 61 can be in contact with the electrode paste (EP), and the recess (not shown) formed on the outer peripheral surface of the application roller 61 can be filled with the electrode paste (EP) by the rotational drive of the application roller 61.

[0198] On the other hand, the application roller 61 and the cylinder 71 can rotate in opposite directions to apply pressure to the dielectric sheet 10. The electrode paste (EP) applied to the outer peripheral surface of the application roller 61 can be filled into the vias 20 formed in the dielectric sheet 10 as the electrode paste (EP) moves due to the above pressure. The electrode paste (EP) filled in the vias 20 can form via electrodes by firing the unit laminate described later.

[0199] The excess electrode paste (EP) applied to the outer surface of the coating roller 61 can be removed using a doctor blade (DB).

[0200] (Printing stage) A printing stage can be performed to print the internal electrode pattern 30 connected to the via 20 on the dielectric sheet 10. The method of forming the internal electrode pattern 30 is not particularly limited. For example, the internal electrode pattern 30 can be formed using a coating roller 61 and a cylinder 71. That is, the printing stage can include a stage of supplying the electrode paste (EP) to the outer peripheral surface of the coating roller 61 and a stage of bringing the dielectric sheet 10 into contact with the coating roller 61 to apply the electrode paste (EP) onto the dielectric sheet 10.

[0201] In this case, by adjusting the form of the recess (not shown) formed on the outer surface of the coating roller 61, the inside of the via 20 can be filled with the electrode paste (EP) and the internal electrode pattern 30 can be formed. That is, in one embodiment, the filling stage and the printing stage can be performed simultaneously. The printed internal electrode pattern 30 can be dried using a drying device or the like.

[0202] The internal electrode pattern 30 can form an internal electrode by firing the unit laminate described later. Although not shown, an auxiliary electrode pattern for forming an auxiliary electrode by firing the unit laminate can also be formed in the same manner as the internal electrode pattern 30.

[0203] (Laminating stage) FIG. 61 is a plan view schematically showing a dielectric sheet on which an internal electrode pattern and a via are formed for manufacturing a laminated electronic component according to the first embodiment of the present invention.

[0204] In order to form the multilayer electronic component 100a according to the first embodiment, a dielectric sheet 10 printed with different internal electrode patterns 30 can be laminated in a predetermined number to form a laminate. In order to form the connection electrodes 141, 142, 143, 144, it is necessary to align the alignment between the vias 20 formed in the dielectric sheets 10 different from each other at the lamination stage. However, the vias 20 formed in each dielectric sheet 10 may not be perfectly aligned with each other. As a result, the laminated vias 20 may be laminated such that their central axes are shifted from each other. On the other hand, since the via 20 has a tapered shape, it is possible to more easily align the alignment between the vias formed in the dielectric sheets 10 different from each other.

[0205] FIG. 62 is a plan view schematically showing a dielectric sheet in which an internal electrode pattern and vias are formed for manufacturing a multilayer electronic component according to the second embodiment of the present invention.

[0206] In order to form the multilayer electronic component 200a according to the second embodiment, a dielectric sheet 10 printed with different internal electrode patterns 30 can be laminated in a predetermined number to form a laminate. Further, an auxiliary electrode pattern 40 can be appropriately formed on the dielectric sheet 10.

[0207] In the case of the laminate for forming the multilayer electronic component 200a according to the second embodiment, since the auxiliary electrode pattern 40 is included, it is not necessary to align the alignment between the vias 20 formed in the dielectric sheets 10 different from each other, so that the convenience of the process can be ensured.

[0208] On the upper and lower portions of the laminate in the first direction, a cover portion forming sheet in which no internal electrode pattern and auxiliary electrode pattern are formed can be laminated in a predetermined number of layers in order to form a cover portion after firing.

[0209] On the other hand, in order to form the multilayer electronic components 100e, 100f, and 100g according to the fourth to sixth modified examples of the first embodiment of the present invention, cover portion forming sheets having vias formed therein may be laminated a predetermined number of layers on the upper and lower portions of the multilayer body in the first direction.

[0210] Also, in order to manufacture the multilayer electronic components 200c, 200d, and 200e according to the second to fourth modified examples of the second embodiment of the present invention, cover portion forming sheets having vias and dummy electrode patterns formed therein may be laminated a predetermined number of layers on the upper and lower portions of the multilayer body in the first direction.

[0211] (Cutting and Firing Stages) Thereafter, after pressing the multilayer body, unit multilayer bodies can be obtained by cutting the multilayer body along a plurality of cutting lines CL1 and CL2.

[0212] Also, the unit multilayer body can be fired to obtain a main body. The firing can be performed, for example, at a temperature of 1000°C or higher and 1400°C or lower, but the present invention is not limited thereto.

[0213] (External Electrode Formation Stage) Thereafter, external electrodes can be formed on the main body. The method of forming the external electrodes is not particularly limited.

[0214] When the external electrodes include a fired electrode layer, the external electrode formation stage may include a step of dipping the main body into a fired paste containing metal powder, glass frit, binder, and organic solvent, etc., and then firing the fired paste at a temperature of 500°C to 900°C.

[0215] However, the present invention is not limited thereto. In order to manufacture the multilayer electronic components 100f, 100g, 200d, and 200e according to the fifth and sixth modified examples of the first embodiment and the third and fourth modified examples of the second embodiment of the present invention having a bottom electrode structure, the external electrode formation stage may also include a step of transferring a sheet containing metal to the main body.

[0216] When the external electrode includes a conductive resin layer, the external electrode formation stage may include a step of dipping the body into a conductive resin composition containing metal powder, resin, binder, organic solvent, etc., and then performing a curing heat treatment at a temperature of 250°C to 550°C.

[0217] When the external electrode includes a thin film electrode layer, the external electrode formation stage may include a step of performing an atomic layer deposition (ALD) method, a chemical vapor deposition (CVD) method, and / or a sputtering method.

[0218] Also, an electrolytic plating method and / or an electroless plating method may be further performed to form a plating layer.

[0219] Figs. 58 to 60 are cross-sectional views showing modified examples of Fig. 57.

[0220] Hereinafter, with reference to Figs. 58 to 60, a modified example of the manufacturing method of the laminated electronic component according to the first embodiment or the second embodiment of the present invention will be described.

[0221] For the same / similar configurations as those described in Fig. 57, the same / similar reference numerals are used, and the overlapping descriptions are omitted.

[0222] Referring to Fig. 58, the step of forming via 20 can be performed by bringing dielectric sheet 10 into contact with imprint roller 80 having convex portion 81 disposed on its outer peripheral surface.

[0223] Specifically, dielectric sheet 10 can pass between imprint roller 80 and cylinder 72. At this time, imprint roller 80 and cylinder 72 rotate in opposite directions to apply pressure to dielectric sheet 10. Via 20 can be formed in dielectric sheet 10 by the above pressure and convex portion 81.

[0224] Convex portion 81 formed on the outer peripheral surface of imprint roller 80 can have a pattern corresponding to the grid pattern of the via electrode.

[0225] Referring to FIG. 59, after irradiating the dielectric sheet 10 with a laser to form the vias 20, the vias 20 can be filled with an electrode paste (EP) using the coating roller 61 and the cylinder 71.

[0226] Thereafter, an internal electrode pattern 30 can be separately formed by applying an electrode paste (EP) onto the dielectric sheet 10 using the coating roller 62 and the cylinder 73. That is, the above filling step and printing step can be sequentially performed.

[0227] Referring to FIG. 60, after forming the vias 20 in the dielectric sheet 10 using the imprint roller 80 having the convex portions 81 disposed on the outer peripheral surface and the cylinder 72, the vias 20 can be filled with an electrode paste (EP) using the coating roller 61 and the cylinder 71.

[0228] Specifically, the dielectric sheet 10 can pass between the imprint roller 80 and the cylinder 72. At this time, the imprint roller 80 and the cylinder 72 can apply pressure to the dielectric sheet 10 by rotating in opposite directions to each other, whereby the vias 20 can be formed in the dielectric sheet 10.

[0229] Next, an internal electrode pattern 30 can be separately formed by applying an electrode paste (EP) onto the dielectric sheet 10 using the coating roller 62 and the cylinder 73. That is, the above filling step and printing step can be sequentially performed.

[0230] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art, and this can also be said to belong to the scope of the present invention.

[0231] Also, the expression "one embodiment" does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the one embodiment presented above does not exclude being realized in combination with the features of other embodiments. For example, even if a matter described in a specific embodiment is not described in other embodiments, it can be understood as related to the description of other embodiments as long as there is no description contrary to or conflicting with that matter in other embodiments.

[0232] In the present invention, "connected" includes not only being directly connected but also being indirectly connected via an adhesive layer or the like. Also, "electrically connected" is a concept that includes both the case of being physically connected and the case of not being connected.

[0233] Furthermore, expressions such as "first", "second" are used to distinguish one component from another component, and do not limit the order and / or importance of the component. In some cases, within the scope not departing from the scope of the claims, the first component may be named the second component, and similarly the second component may be named the first component.

Description of Reference Numerals

[0234] 100a, 100b, 100c, 100d, 100e, 100g, 100f, 200a, 200b, 200c, 200d, 200e: Multilayer electronic components 110, 210: Bodies 220a, 220b: Internal electrode layers 111, 211a, 211b: Dielectric layers 112, 113, 212, 213: Cover parts 121, 122, 221, 222: Internal electrodes 151, 152, 153, 154, 251, 252, 253, 254: Auxiliary electrodes 131, 132, 133, 134, 231, 232, 233, 234: External electrodes 141, 142, 143, 144, 241, 242, 243, 244: Connecting electrodes 141a, 141b, 142a, 142b, 143a, 143b, 144a, 144b, 241a, 241b, 242a, 242b, 243a, 243b, 244a, 244b: Via electrodes 161, 162, 163, 164: Contact electrodes 261, 262, 263, 264: Contact structures 10: Dielectric sheet 20: Via 30: Internal electrode pattern 61, 62: Coating rollers 71, 72, 73: Cylinders 80: Imprint roller

Claims

1. A main body including a dielectric layer and first and second internal electrodes alternately arranged in a first direction with the dielectric layer therebetween, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction; A first external electrode disposed on at least one of the first surface, the second surface, the fifth surface, and the sixth surface and connected to the first internal electrode; A second external electrode disposed on at least one of the first surface, the second surface, the third surface, and the fourth surface and connected to the second internal electrode; A first connection electrode passing through the dielectric layer and connecting two adjacent first internal electrodes in the first direction to each other; and The first connection electrode is a stacked electronic component in which a plurality of first via electrodes arranged to be displaced from each other in a direction perpendicular to the first direction are stacked in the first direction.

2. The stacked electronic component according to claim 1, wherein a plurality of the first connection electrodes passing through the same dielectric layer are arranged.

3. The stacked electronic component according to claim 2, wherein the plurality of first connection electrodes passing through the same dielectric layer are arranged in the second and third directions.

4. Further including a second connection electrode passing through the dielectric layer and connecting two adjacent second internal electrodes in the first direction to each other; and The second connection electrode is a stacked electronic component according to claim 1, in which a plurality of second via electrodes arranged to be displaced from each other in a direction perpendicular to the first direction are stacked in the first direction.

5. The stacked electronic component according to claim 1, further including a first auxiliary electrode disposed at a distance from the second internal electrode in the third direction and between adjacent ones of the plurality of first via electrodes.

6. The stacked electronic component according to claim 4, further including a second auxiliary electrode disposed at a distance from the first internal electrode in the second direction and between adjacent ones of the plurality of second via electrodes.

7. The stacked electronic component according to claim 1, wherein two adjacent first connection electrodes in the first direction are arranged to be displaced from each other in a direction perpendicular to the first direction.

8. The main body includes a capacitance forming portion in which the first and second internal electrodes are alternately arranged in the first direction with the dielectric layer therebetween, and cover portions disposed on both surfaces of the capacitance forming portion facing each other in the first direction. The first external electrode is disposed on at least one of the first surface and the second surface, The multilayer electronic component according to claim 1, further comprising a first contact electrode that penetrates the cover portion and connects between the first internal electrode disposed on the outermost periphery with reference to the first direction and the first external electrode.

9. The multilayer electronic component according to claim 8, wherein the first and second external electrodes are each disposed on the second surface but not on the first surface.

10. The first external electrode is disposed on the first surface and the second surface respectively, and the second external electrode is disposed on the first surface and the second surface respectively, The multilayer electronic component according to claim 8, wherein the first and second external electrodes disposed on the first surface are separated from the first and second external electrodes disposed on the second surface.

11. The first internal electrode includes a first main portion that overlaps the second internal electrode in the first direction, and a first lead portion that extends from the first main portion toward the fifth surface or the sixth surface, The multilayer electronic component according to claim 1, wherein the thickness of the end portion of the first lead portion exposed on the fifth surface or the sixth surface is thicker than the thickness of the central portion of the first main portion in the third direction.

12. The multilayer electronic component according to claim 1, wherein the width of the upper surface of the first via electrode is wider than the width of the lower surface of the first via electrode.

13. including a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction, a first internal electrode layer including a first dielectric layer and a first internal electrode disposed on the first dielectric layer and including a first main portion and a first lead portion extending from the first main portion toward the fifth surface or the sixth surface, and a second internal electrode layer including a second dielectric layer, a second internal electrode disposed on the second dielectric layer and overlapping the first main portion in the first direction, and a first auxiliary electrode disposed separately from the second internal electrode in the third direction, a main body in which the first and second internal electrode layers are alternately arranged in the first direction, a first external electrode disposed on at least one of the first surface, the second surface, the fifth surface, and the sixth surface and connected to the first internal electrode, and a second external electrode disposed on at least one of the first surface, the second surface, the third surface, and the fourth surface and connected to the second internal electrode, a first via electrode that penetrates the first dielectric layer and connects the first lead portion and the first auxiliary electrode; a second via electrode that penetrates the second dielectric layer and connects the first lead portion and the first auxiliary electrode, and includes: a multilayer electronic component in which the first via electrode and the second via electrode are arranged so as to be displaced from each other in a direction perpendicular to the first direction.

14. The multilayer electronic component according to claim 13, wherein the first and second via electrodes do not overlap each other in the first direction.

15. A plurality of the first via electrodes penetrating the same first dielectric layer are arranged, and a plurality of the second via electrodes penetrating the same second dielectric layer are arranged, The first via electrodes penetrating the same first dielectric layer are arranged in the second and third directions, and the second via electrodes penetrating the same second dielectric layer are arranged in the second and third directions. The multilayer electronic component according to claim 13.

16. The first dielectric layer includes a first region disposed between two first via electrodes adjacent to each other in the second or third direction among the plurality of first via electrodes, The plurality of second via electrodes overlap the first region in the first direction. The multilayer electronic component according to claim 15.

17. The second internal electrode includes a second main portion overlapping the first internal electrode in the first direction, and a second lead portion extending from the second main portion to the third surface or the fourth surface, The first internal electrode layer is disposed on the first dielectric layer, and further includes a second auxiliary electrode disposed at a distance from the first internal electrode in the second direction, further including a third via electrode that penetrates the first dielectric layer and connects the second lead portion and the second auxiliary electrode, and a fourth via electrode that penetrates the second dielectric layer and connects the second lead portion and the second auxiliary electrode, The multilayer electronic component according to claim 13, wherein the third via electrode and the fourth via electrode are arranged so as to be displaced from each other in a direction perpendicular to the first direction.

18. A plurality of the third via electrodes penetrating the same first dielectric layer are arranged, and a plurality of the fourth via electrodes penetrating the same second dielectric layer are arranged, The third via electrodes penetrating the same first dielectric layer are arranged in the second and third directions, and the fourth via electrodes penetrating the same second dielectric layer are arranged in the second and third directions. The multilayer electronic component according to claim 17.

19. The first dielectric layer includes a second region disposed between two third via electrodes among the plurality of third via electrodes that are adjacent to each other in the second direction or the third direction. The plurality of fourth via electrodes overlap the second region in the first direction. The multilayer electronic component according to claim 18.

20. The main body includes a capacitance forming portion in which first and second internal electrodes are alternately disposed with the first dielectric layer or the second dielectric layer interposed therebetween, and cover portions disposed on both surfaces of the capacitance forming portion facing each other in the first direction. The first external electrode is disposed on at least one of the first surface and the second surface. The multilayer electronic component according to claim 13, further including a first contact structure that penetrates the cover portion and connects between a first internal electrode or a first auxiliary electrode disposed on the outermost periphery with reference to the first direction and the first external electrode.

21. The first and second external electrodes are each disposed on the second surface but not on the first surface. The multilayer electronic component according to claim 20.

22. The first external electrode is disposed on the first surface and the second surface respectively, and the second external electrode is disposed on the first surface and the second surface respectively. The first and second external electrodes disposed on the first surface are separated from the first and second external electrodes disposed on the second surface. The multilayer electronic component according to claim 20.

23. The thickness of the end portion exposed on the fifth surface or the sixth surface of the first lead portion is thicker than the thickness of the central portion in the third direction of the first main portion. The multilayer electronic component according to claim 13.

24. The width of the upper surface of the first via electrode is wider than the width of the lower surface of the first via electrode, and the width of the upper surface of the second via electrode is wider than the width of the lower surface of the second via electrode. The multilayer electronic component according to claim 17.

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