Multilayer electronic component

Abstract

To provide a multilayer electronic component having excellent reliability.SOLUTION: One embodiment of the present invention provides a multilayer electronic component which includes: a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween, the first and second internal electrodes being spaced apart from fifth and sixth surfaces; first and second external electrodes disposed on the body and respectively connected to the first and second internal electrodes; a first through-electrode passing through a space in which the second internal electrode and the fifth surface are spaced apart from each other, and disposed between one ends of two adjacent first internal electrodes in a third direction to connect them; and a second through-electrode passing through a space in which the first internal electrode and the sixth surface are spaced apart from each other, and disposed between one ends of two adjacent second internal electrodes in the third direction to connect them.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor mounted on a printed circuit board of various electronic products such as liquid crystal display (LCD) devices and plasma display panel (PDP) devices, computers, smartphones, and mobile phones, and serves to charge or discharge electricity. Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and being easy to mount.

[0003] Generally, the manufacturing process of a multilayer ceramic capacitor includes a step of laminating and pressing ceramic green sheets printed with internal electrode patterns. At this time, a step may occur between the area where the internal electrode pattern is printed and the area where the internal electrode pattern is not printed on the ceramic green sheet, and due to such a step, the phenomenon that the end of the internal electrode pattern bends may occur during the pressing process.

[0004] When the end of the internal electrode pattern bends, an electric field may concentrate on the corresponding part, resulting in high voltage shock (HVS) in the multilayer ceramic capacitor or a defect such as a decrease in the insulation resistance (IR) of the multilayer ceramic capacitor.

[0005] In order to solve such problems, Patent Document 1 discloses a step of cutting a mother laminate so that internal electrode patterns are exposed on both side surfaces of a ceramic laminate, and then applying a ceramic paste to both side surfaces of the ceramic laminate so as to cover the exposed portions of the internal electrode patterns to form side margin portions.

[0006] However, when separately forming side margin portions by the process of Patent Document 1, a spreading phenomenon may occur between the main body and the side margin portions, and as a result, there may be a problem that the moisture resistance reliability of the multilayer ceramic capacitor decreases.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] One of various objects of the present invention is to provide a multilayer electronic component with excellent reliability.

[0009] However, the object of the present invention is not limited to the above-described content, and can be more easily understood in the process of describing specific embodiments of the present invention.

Means for Solving the Problems

[0010] One embodiment of the present invention includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction. The embodiment further includes a main body including a dielectric layer and first and second internal electrodes alternately arranged in the first direction with the dielectric layer therebetween and spaced apart from the fifth surface and the sixth surface, first and second external electrodes disposed on the main body and connected to the first and second internal electrodes respectively, a first through electrode penetrating through a space between the second internal electrode and the fifth surface and disposed between one ends of two adjacent first internal electrodes in the third direction to connect them, and a second through electrode penetrating through a space between the first internal electrode and the sixth surface and disposed between one ends of two adjacent second internal electrodes in the third direction to connect them. A laminated electronic component is provided.

Advantages of the Invention

[0011] As one of various advantages of the present invention, a laminated electronic component with excellent reliability can be provided.

Brief Description of the Drawings

[0012]

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Embodiments for Carrying Out the Invention

[0013] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0014] For the purpose of clearly explaining the present invention in the drawings, parts not related to the explanation are omitted. The sizes and thicknesses of the illustrated components are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited by the illustrations. Also, components having the same functions within the scope of the same concept are described using the same reference numerals. Further, throughout the specification, when a part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0015] In the drawings, the first direction can be defined as the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0016] Multilayer electronic component FIG. 1 is a perspective view schematically showing a stacked electronic component according to an embodiment of the present invention. FIG. 2 is a cross-sectional view schematically showing a cut cross-section along the line I-I' of FIG. 1. FIG. 3 is a cross-sectional view schematically showing a cut cross-section along the line II-II' of FIG. 1. FIG. 4 is an enlarged view of the K1 region of FIG. 3. FIG. 5 is a cross-sectional view schematically showing a cut cross-section along the line III-III' of FIG. 2. FIG. 6 is a cross-sectional view schematically showing a cut cross-section along the line IV-IV' of FIG. 2. FIG. 7 is a drawing showing FIGS. 5 and 6 superimposed.

[0017] Hereinafter, with reference to FIGS. 1 to 7, a stacked electronic component 100 according to an embodiment of the present invention will be described in detail. Also, as an example of the stacked electronic component, a multilayer ceramic capacitor will be described, but the present invention is not limited thereto and can also be applied to various stacked electronic components, such as inductors, piezoelectric elements, varistors, or thermistors.

[0018] The size of the multilayer electronic component 100 is not particularly limited. The length (L size) of the multilayer electronic component 100 in the second direction can be, for example, 0.2 mm to 3.2 mm, the width (W size) of the multilayer electronic component 100 in the third direction can be, for example, 0.1 mm to 1.6 mm, and the thickness (T size) of the multilayer electronic component 100 in the first direction can be, for example, 0.05 mm to 2.0 mm.

[0019] The multilayer electronic component 100 can include a main body 110, external electrodes 131 and 132, and through electrodes 123 and 124.

[0020] There is no particular limitation on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process and the polishing of the edge portions, the main body 110 does not have a perfect hexahedron shape with straight lines, but can have a substantially hexahedron shape.

[0021] The main body 110 can have a first surface and a second surface 1 and 2 facing each other in the first direction, a third surface and a fourth surface 3 and 4 facing each other in the second direction and connected to the first surface and the second surface 1 and 2, and a fifth surface and a sixth surface 5 and 6 facing each other in the third direction.

[0022] The main body 110 can include a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111. The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so that it is difficult to confirm without using a scanning electron microscope (SEM).

[0023] The dielectric layer 111 can contain, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 is, for example, CaZrO3, (Ca 1-x Sr x )(Zr 1-y Ti y)O3(0 < x ≤ 0.5, 0 < y ≤ 0.5), BaTiO3, (Ba 1-x Ca x )TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3(0 < y < 1), etc.

[0024] The average thickness of the dielectric layer 111 is not particularly limited. The average thickness of the dielectric layer 111 can be, for example, 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0025] The internal electrodes 121 and 122 can include, for example, a first internal electrode 121 and a second internal electrode 122 that are alternately arranged in the first direction with the dielectric layer 111 interposed therebetween. That is, the first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having different polarities, can be arranged so as to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0026] The first internal electrode 121 can be separated from the fourth surface 4 and exposed on the third surface 3. The second internal electrode 122 can be separated from the third surface 3 and exposed on the fourth surface 4. The first and second internal electrodes 121 and 122 can be arranged separated from the fifth and sixth surfaces 5 and 6.

[0027] The first internal electrode 121 and the second internal electrode 122 can be arranged to be displaced from each other in the third direction. For example, the distance in the third direction between the first internal electrode 121 and the fifth surface 5 is shorter than the distance in the third direction between the first internal electrode 121 and the sixth surface 6, and the distance in the third direction between the second internal electrode 122 and the sixth surface 6 can be shorter than the distance in the third direction between the second internal electrode 122 and the fifth surface 5.

[0028] The conductive metal contained in the internal electrodes 121 and 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and more preferably can contain Ni, but the present invention is not limited thereto.

[0029] The average thickness of the internal electrodes 121 and 122 is not particularly limited. The average thickness of the internal electrodes 121 and 122 can be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0030] The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 respectively mean the average thickness in the first direction of the dielectric layer 111 and the internal electrodes 121 and 122. The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 can be measured by scanning the cross-sections in the first and second directions of the main body 110 with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, after measuring the thickness at a number of points of one dielectric layer 111, for example, 30 points at equal intervals in the second direction, the average thickness of the dielectric layer 111 can be measured by taking the average value. Also, after measuring the thickness at a number of points of one internal electrode 121 or 122, for example, 30 points at equal intervals in the second direction, the average thickness of the internal electrodes 121 and 122 can be measured by taking the average value. The 30 points at equal intervals can be specified by the capacitance forming portion Ac. On the other hand, after performing such average value measurement for 10 dielectric layers 111 and 10 internal electrodes 121 and 122 respectively and then measuring the average value, the average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 can be further generalized.

[0031] The main body 110 includes a capacitance forming portion Ac that is disposed inside the main body 110 and forms a capacitance including first and second internal electrodes 121 and 122 that are alternately arranged with each other with a dielectric layer 111 interposed therebetween, and first and second cover portions 112 and 113 that are respectively disposed on both surfaces facing each other in the first direction of the capacitance forming portion Ac. The cover portions 112 and 113 can basically serve to prevent damage to the internal electrodes due to physical or chemical stress. The cover portions 112 and 113 can have a configuration similar to that of the dielectric layer 111 except that they do not include internal electrodes.

[0032] The average thickness of the cover portions 112 and 113 is not particularly limited. The average thickness of the cover portions 112 and 113 can be, for example, 150 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. The average thickness of the cover portions 112 and 113 can be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average thickness of the cover portions 112 and 113 means the respective average thicknesses of the first cover portion 112 and the second cover portion 113.

[0033] The average thickness of the cover portions 112 and 113 can mean the average thickness in the first direction of the cover portions 112 and 113, and can be a value obtained by averaging the thicknesses in the first direction measured at five equally spaced points in the second direction in the cross-sections in the first and second directions obtained by cutting the center of the main body 110 in the third direction.

[0034] The main body 110 is disposed on one side in the third direction of the capacitance forming portion Ac, and includes a first side portion S1 in which adjacent ones of the plurality of first internal electrodes 121 do not sandwich the second internal electrode 122 and overlap in the first direction, and a second side portion S2 disposed on the other side in the third direction of the capacitance forming portion Ac, in which adjacent ones of the plurality of second internal electrodes 122 do not sandwich the first internal electrode 121 and overlap in the first direction.

[0035] The main body 110 can include a first margin portion 114 disposed between the first side portion S1 and the fifth surface 5, and a second margin portion 115 disposed between the second side portion S2 and the sixth surface 6. That is, the margin portions 114 and 115 can mean the regions between the boundaries of the main body 110 and both ends of the internal electrodes 121 and 122 in the cross section obtained by cutting the main body 110 in the first direction and the third direction. The margin portions 114 and 115 can have a configuration similar to that of the dielectric layer 111, except that they do not include the internal electrodes 121 and 122.

[0036] The external electrodes 131 and 132 can be disposed on the main body 110 and include a first external electrode 131 and a second external electrode 132 that are respectively connected to the first and second internal electrodes 121 and 122. The first external electrode 131 can be disposed on the third surface 3, and the second external electrode 132 can be disposed on the fourth surface 4. The first external electrode 131 can extend and be disposed on a part of the first surface, the second surface, the fifth surface, and the sixth surface 1, 2, 5, 6 on the third surface 3, and the second external electrode 132 can extend and be disposed on a part of the first surface, the second surface, the fifth surface, and the sixth surface 1, 2, 5, 6 on the fourth surface 4.

[0037] The type and form of the external electrodes are not particularly limited, and they can also have a multilayer structure. For example, the external electrodes 131 and 132 can include a base electrode layer 131a, 132a in contact with the internal electrodes 121, 122 and a plating layer 131b, 132b disposed on the base electrode layer 131a, 132a.

[0038] The base electrode layers 131a and 132a can be sintered electrodes including metal and glass. The metal included in the base electrode layers 131a and 132a can include Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or an alloy containing the same, etc., but the present invention is not limited thereto. The glass included in the base electrode layers 131a and 132a can include one or more oxides of Ba, Ca, Zn, Al, B, and Si, but the present invention is not limited thereto.

[0039] On the one hand, the underlying electrode layers 131a and 132a can be composed of only the first layer containing metal and glass, but the present invention is not limited thereto, and the underlying electrode layers 131a and 132a can have a multilayer structure. For example, the underlying electrode layers 131a and 132a can include a first layer containing metal and glass and a second layer disposed on the first layer and containing metal and resin.

[0040] The metal contained in the second layer can include one or more of spherical particles and flaky particles. Here, the spherical particles can include forms that are not completely spherical. For example, it can include forms with an aspect ratio (major axis / minor axis) of 1.45 or less. The flaky particles mean powders having a flat and elongated form and are not particularly limited. For example, the aspect ratio (major axis / minor axis) can be 1.95 or more. The metal contained in the second layer can include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and / or an alloy containing these. The resin contained in the second layer can include, for example, one or more of epoxy resin, acrylic resin, and ethyl cellulose.

[0041] The plating layers 131b and 132b can improve the mounting characteristics. The plating layers 131b and 132b can include, for example, Ni, Sn, Pd, and / or an alloy containing these, and can also be formed from multiple layers. The plating layers 131b and 132b can be, for example, Ni plating layers or Sn plating layers, or can be in a form where a Ni plating layer and a Sn plating layer are sequentially formed. Also, the plating layers 131b and 132b can include multiple Ni plating layers and / or multiple Sn plating layers.

[0042] In the drawings, a structure in which the stacked electronic component 100 has two external electrodes 131 and 132 is described, but it is not limited thereto. The number and shape of the external electrodes 131 and 132 can vary according to the form of the internal electrodes 121 and 122 and other purposes.

[0043] The multilayer electronic component 100 can include, for example, a first through electrode 123 that penetrates through a space SP1 where the second internal electrode 122 and the fifth surface 5 are separated, and is disposed between one ends in the third direction of two adjacent first internal electrodes 121 to connect them, and a second through electrode 124 that penetrates through a space SP2 where the first internal electrode 121 and the sixth surface 6 are separated, and is disposed between one ends in the third direction of two adjacent second internal electrodes 122 to connect them. The multilayer electronic component 100 can include, for example, the first through electrode 123 that is disposed on the first side portion S1 and connects adjacent ones among the plurality of first internal electrodes 121, and the second through electrode 124 that is disposed on the second side portion S2 and connects adjacent ones among the plurality of second internal electrodes 122.

[0044] As described above, in the process of manufacturing a conventional multilayer electronic component, a step may occur between a region where an internal electrode pattern is printed and a region where no internal electrode pattern is printed on a ceramic green sheet. Due to such a step, there is a possibility that the end portions of the internal electrodes in the third direction after crimping and firing may bend toward the central portion of the main body. In this case, an electric field may concentrate at the end portions of the internal electrodes in the third direction, resulting in the occurrence of HVS in the multilayer electronic component or the occurrence of a defect such as a decrease in the IR of the multilayer electronic component.

[0045] On the other hand, according to an embodiment of the present invention, by disposing the first through electrode 123 between one ends in the third direction of two adjacent first internal electrodes 121 and disposing the second through electrode 124 between one ends in the third direction of two adjacent second internal electrodes 122, it is possible to suppress the phenomenon that the end portions of the internal electrodes 121 and 122 in the third direction bend toward the central portion of the main body 110. As a result, it is possible to prevent the electric field from concentrating in this portion and suppress the occurrence of HVS generation defects and / or IR degradation defects.

[0046] Referring to FIG. 4, in one embodiment, when the distance in the third direction between the fifth surface 5 and the first internal electrode 121 is d1, and the distance in the third direction between the fifth surface 5 and the first through electrode 123 is d2, d2>d1 can be satisfied. As will be described later, the first through electrode 123 can be formed by a method of forming a through hole in the ceramic green sheet and then filling the through hole with a conductive paste. At this time, (d2 - d1) can be a process margin for arranging the first through electrode 123 between the respective ends of two adjacent first internal electrodes 121. That is, by forming a through hole in the ceramic green sheet and filling the through hole with a conductive paste, the through electrodes 123 and 124 can be integrally formed with the main body 110, and it is not necessary to separately form through electrodes or margin portions on both side surfaces of the main body. As a result, the phenomenon of electric field concentration can be prevented without reducing the moisture resistance reliability of the multilayer electronic component 100.

[0047] In one embodiment, when the thickness of the first internal electrode 121 is te and the thickness of the first through electrode 123 is tp, tp>te can be satisfied. When tp>te is satisfied, the phenomenon that the end portion of the first internal electrode 121 bends can be more effectively prevented. The upper limit of tp is not particularly limited, but tp can be 3×te or less.

[0048] In one embodiment, when the thickness of the dielectric layer 111 is td and the distance in the second direction between the first through electrode 123 and the second internal electrode 122 is d3, d3>td can be satisfied. If the first through electrode 123 and the second internal electrode 122 come into contact with each other, there is a risk of short circuit, so it is preferable that the above d3 is larger than td. The upper limit of d3 is not particularly limited, but in order to prevent the capacitance of the multilayer electronic component 100 from decreasing excessively, d3 can be 3×td or less.

[0049] On the other hand, since the configurations of the first through electrode 123 and the second through electrode 124 are substantially the same, the description of the first through electrode 123 through FIG. 4 above can also be directly applied to the second through electrode 124.

[0050] Referring to FIGS. 5 to 7, the first through electrode 123 can extend in the second direction and be spaced apart from the second external electrode 132, and the second through electrode 124 can extend in the second direction and be spaced apart from the first external electrode 131. The longer the lengths of the through electrodes 123 and 124 in the second direction, the more effectively the bending phenomenon at the ends of the internal electrodes can be prevented. However, the longer the lengths of the through electrodes 123 and 124 in the second direction, the more likely a short circuit due to contact with the external electrodes 132 and 131 of the other polarity becomes a problem. In one embodiment, the first through electrode 123 can be spaced apart from the first external electrode 131, and the second through electrode 124 can be spaced apart from the second external electrode 132.

[0051] The length of the through electrode is not particularly limited. However, when the length of the first internal electrode 121 in the second direction is Le and the length of the second through electrode 124 in the second direction is Lp, Le > Lp can be satisfied. The lower limit of Lp is not particularly limited, but Lp > 0.6×Le can be satisfied in order to effectively prevent the bending phenomenon at the ends of the internal electrodes.

[0052] FIG. 8 is a modified example of FIG. 7. For example, referring to FIG. 8, the first through electrode 123' can be connected to the first external electrode 131, and the second through electrode 124' can be connected to the second external electrode 132. According to the modified example shown in FIG. 8, the length of the first through electrode 123' in the second direction can be substantially the same as the length of the first internal electrode 121 in the second direction, and the length of the second through electrode 124' in the second direction can be substantially the same as the length of the first internal electrode 122 in the second direction.

[0053] FIGS. 9 and 10 are drawings schematically showing the steps of manufacturing a multilayer electronic component according to an embodiment of the present invention. Hereinafter, with reference to FIGS. 9 and 10, an example of a method for manufacturing a multilayer electronic component 100 according to an embodiment of the present invention will be described.

[0054] First, ceramic powders for forming ceramic green sheets 11a and 11b are prepared. The ceramic powders are, for example, CaZrO3, (Ca1-x Sr x )(Zr 1-y Ti y )O3(0 < x ≦ 0.5, 0 < y ≦ 0.5), BaTiO3, (Ba 1-x Ca x )TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3(0 < y < 1) can be. BaTiO3 powder can be synthesized, for example, by reacting a titanium raw material such as titanium dioxide and a barium raw material such as barium carbonate. Examples of the synthesis method of the ceramic powder include a solid-phase method, a sol-gel method, a hydrothermal synthesis method, etc., but the present invention is not limited thereto. Next, after drying and pulverizing the prepared ceramic powder, an organic solvent such as ethanol and a binder such as polyvinyl butyral are mixed to produce a ceramic slurry, and then the ceramic slurry is applied and dried on a carrier film to provide ceramic green sheets 11a, 11b.

[0055] Next, two through-holes TH spaced apart from each other are formed in the first ceramic green sheet 11a. The two through-holes TH are each filled with a conductive paste to form a first through-electrode pattern 23a and a second through-electrode pattern 24a. After that, as shown in FIG. 10, a first internal electrode pattern 21 is formed on the first ceramic green sheet 11a. At this time, the first internal electrode pattern 21 is connected to the first through-electrode pattern 23a and spaced apart from the second through-electrode pattern 24a.

[0056] Similarly, two through-holes TH spaced apart from each other are formed in the second ceramic green sheet 11b. The two through-holes TH are each filled with a conductive paste to form a third through-electrode pattern 23b and a fourth through-electrode pattern 24b. Thereafter, as shown in FIG. 10, a second internal electrode pattern 22 is formed on the second ceramic green sheet 11b. At this time, the second internal electrode pattern 22 is connected to the fourth through-electrode pattern 24b and is spaced apart from the third through-electrode pattern 23b.

[0057] The internal electrode patterns 21 and 22 can be formed by printing an internal electrode conductive paste containing a metal powder, a binder, an organic solvent, etc. using a screen printing method or a gravure printing method.

[0058] Thereafter, the first and second ceramic green sheets 11a and 11b peeled off with a carrier film are alternately laminated by a predetermined number of layers and then pressure-bonded to form a body before firing. At this time, the first through-electrode pattern 23a of the first ceramic green sheet 11a and the third through-electrode pattern 23b of the second ceramic green sheet 11b can form a first through-electrode 123 after firing. Also, the second through-electrode pattern 24a of the first ceramic green sheet 11a and the fourth through-electrode pattern 24b of the second ceramic green sheet 11b can form a second through-electrode 124 after firing. On the upper and lower portions of the body before firing, a ceramic green sheet having no through-holes and internal electrode patterns formed thereon can be laminated by a predetermined number of layers in order to form cover portions 112 and 113 after firing. Thereafter, the body before firing can be fired at a temperature of 1000°C or higher and 1400°C or lower to form a body 110. On the other hand, FIGS. 9 and 10 show a state in which one internal electrode pattern 21, 22 is formed on the ceramic green sheets 11a, 11b. However, after laminating and pressure-bonding the ceramic green sheets 11a, 11b in which a plurality of through-holes TH and a plurality of internal electrode patterns 21, 22 are formed to form a ceramic laminate, the ceramic laminate can be cut into chip units and then fired to form a body 110.

[0059] Thereafter, after dipping the main body 110 into a conductive paste containing metal powder, glass frit, binder, organic solvent, etc., the base electrode layers 131a and 132a can be formed by baking. When the base electrode layers 131a and 132a include a first layer containing metal and glass and a second layer containing metal and resin, the second layer can be formed by dipping the above first layer into a conductive resin composition containing metal powder, resin, binder, organic solvent, etc., and then performing a curing heat treatment at a temperature of 250°C to 550°C.

[0060] Next, the laminated electronic component 100 can be manufactured by forming plating layers 131b and 132b using an electrolytic plating method and / or an electroless plating method. However, the above-described manufacturing method is an example, and the manufacturing method of the laminated electronic component 100 is not limited to the above-described manufacturing method.

[0061] FIG. 11 is a perspective view schematically showing a laminated electronic component according to another embodiment of the present invention, FIG. 12 is a cross-sectional view schematically showing a cut section along the line V-V' of FIG. 11, FIG. 13 is a plan view showing a first internal electrode and a second through electrode of the laminated electronic component shown in FIG. 11, FIG. 14 is a plan view showing a second internal electrode and a first through electrode of the laminated electronic component shown in FIG. 11, and FIG. 15 is a drawing showing FIGS. 13 and 14 superimposed.

[0062] Hereinafter, with reference to FIGS. 11 to 15, a laminated electronic component 200 according to another embodiment of the present invention will be described. For the same / similar configurations as those of the laminated electronic component 100 described in FIGS. 1 to 7, the same / similar reference numerals will be used, and redundant descriptions will be omitted.

[0063] According to an embodiment of the present invention, a multilayer electronic component 200 includes a main body 210 including a dielectric layer 211 and first internal electrodes 221 and second internal electrodes 222 alternately arranged in a first direction with the dielectric layer 211 interposed therebetween, and can include first and second external electrodes 231 and 232 disposed on the main body 210 and connected to the first and second internal electrodes 221 and 222, respectively. The first internal electrode 221 can be disposed spaced apart from the third to sixth surfaces 3, 4, 5, 6, and the second internal electrode 222 can be disposed spaced apart from the third to sixth surfaces 3, 4, 5, 6.

[0064] The multilayer electronic component 200 can include, for example, a first through electrode 223 that penetrates a space SP1 in which the second internal electrode 222 is spaced apart from the fifth surface 5 and is disposed between one ends in a third direction of two adjacent first internal electrodes 221 to connect them, and a second through electrode 224 that penetrates a space SP2 in which the first internal electrode 221 is spaced apart from the sixth surface 6 and is disposed between one ends in a third direction of two adjacent second internal electrodes 222 to connect them. The multilayer electronic component 200 can include, for example, a first through electrode 223 disposed on the first side portion S1 to connect adjacent ones of the plurality of first internal electrodes 221 and a second through electrode 224 disposed on the second side portion S2 to connect to adjacent ones of the plurality of second internal electrodes 222. The first through electrode 223 can be disposed spaced apart from the third to sixth surfaces 3, 4, 5, 6, and the second through electrode 224 can be disposed spaced apart from the third to sixth surfaces 3, 4, 5, 6.

[0065] According to an embodiment of the present invention, the first and second external electrodes 231 and 232 can be disposed on the second surface 2, respectively. That is, the first and second external electrodes 231 and 232 can have a bottom electrode structure disposed only on the second surface 2, which is the surface on which the multilayer electronic component 200 is mounted. The first and second external electrodes 231 and 232 can be spaced apart from each other in the third direction on the second surface 2. The first and second external electrodes 231 and 232 can extend in the second direction. The length of the first external electrode 231 in the second direction can be greater than the width in the third direction, and the length of the second external electrode 232 in the second direction can be greater than the width in the third direction.

[0066] The multilayer electronic component 200 can include a first connection electrode 241 that connects the first internal electrode 221 that penetrates a part of the main body 210 and is closest to the second surface 2 and the first external electrode 231 to each other, and a second connection electrode 242 that connects the second internal electrode 222 that penetrates a part of the main body 210 and is closest to the second surface 2 and the second external electrode 232 to each other. The first and second connection electrodes 241 and 242 can have a configuration similar to that of the through electrodes 223 and 224, except that they are in contact with the first and second external electrodes 231 and 232, respectively.

[0067] FIG. 16 is a perspective view schematically showing a multilayer electronic component according to another embodiment of the present invention, and FIG. 17 is a cross-sectional view schematically showing a cut cross-section taken along line VI-VI' of FIG. 16.

[0068] Hereinafter, with reference to FIGS. 16 and 17, a multilayer electronic component 200' according to another embodiment of the present invention will be described. For the same / similar configurations as those of the multilayer electronic component 200 described with reference to FIGS. 11 to 15, the same / similar reference numerals will be used, and redundant descriptions will be omitted.

[0069] According to an embodiment of the present invention, the multilayer electronic component 200' can include a first external electrode 231 and a second external electrode 232 that are disposed apart from each other on the second surface 2, and a third external electrode 233 and a fourth external electrode 234 that are disposed apart from each other on the first surface 1. The third external electrode 233 and the fourth external electrode 234 can be disposed apart from each other in the third direction on the first surface 1. The first to fourth external electrodes 231, 232, 233, 234 can extend in the second direction, and the length in the second direction of each can be greater than the width in the third direction.

[0070] The multilayer electronic component 200' can include a third connection electrode 243 that connects the first internal electrode 221, which penetrates a part of the main body 210 and is closest to the first surface 1, and the third external electrode 233 to each other, and a fourth connection electrode 244 that connects the second internal electrode 222, which penetrates a part of the main body 210 and is closest to the first surface 1, and the fourth external electrode 234 to each other. The third and fourth connection electrodes 243, 244 can have a configuration similar to that of the through electrodes 223, 224, except that they are in contact with the third and fourth external electrodes 233, 234, respectively.

[0071] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art, and it can be said that these also belong to the scope of the present invention.

[0072] Also, the expression "an embodiment" does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented embodiment does not exclude being implemented in combination with the features of other embodiments. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as an explanation related to the other embodiment as long as there is no explanation contrary to or conflicting with that matter in the other embodiment.

[0073] Furthermore, expressions such as first and second are used to distinguish one component from another, and do not limit the order and / or importance of the corresponding components. In some cases, without departing from the scope of the rights, the first component can also be named the second component, and similarly, the second component can be named the first component.

Explanation of Reference Numerals

[0074] 100, 200, 200' Multilayer Electronic Components 110, 210 Bodies 111, 211 Dielectric Layers 112, 113 Cover Parts 114, 115 Margin Parts 121, 122, 221, 222 Internal Electrodes 123, 124, 223, 224 Through Electrodes 131, 132, 231, 232, 233, 234 External Electrodes 131a, 132a Base Electrode Layers 131b, 132b Plating Layers 241, 242, 243, 244 Connecting Electrodes 11a, 11b Ceramic Green Sheets 21, 22 Internal Electrode Patterns 23a, 23b, 24a, 24b Through Electrode Patterns

Claims

1. A body including a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction, a dielectric layer, and first and second internal electrodes alternately arranged in the first direction with the dielectric layer therebetween and spaced apart from the fifth surface and the sixth surface; first and second external electrodes disposed on the body and connected to the first and second internal electrodes, respectively; a first through electrode that penetrates a space between the second internal electrode and the fifth surface and is disposed between one ends of two adjacent first internal electrodes in the third direction to connect them; a second through electrode that penetrates a space between the first internal electrode and the sixth surface and is disposed between one ends of two adjacent second internal electrodes in the third direction to connect them, the multilayer electronic component comprising:

2. The multilayer electronic component according to claim 1, wherein when a distance in the third direction between the fifth surface and the first internal electrode is d1 and a distance in the third direction between the fifth surface and the first through electrode is d2, d2 > d1 is satisfied.

3. The multilayer electronic component according to claim 1, wherein the first internal electrode and the second internal electrode are arranged offset from each other in the third direction.

4. The first through electrode extends in the second direction and is spaced apart from the second external electrode, and the second through electrode extends in the second direction and is spaced apart from the first external electrode, the multilayer electronic component according to claim 1.

5. The first through electrode is spaced apart from the first external electrode, and the second through electrode is spaced apart from the second external electrode, the multilayer electronic component according to claim 1.

6. The first through electrode is connected to the first external electrode, and the second through electrode is connected to the second external electrode, the multilayer electronic component according to claim 1.

7. The multilayer electronic component according to claim 1, wherein when a thickness of the first internal electrode is te and a thickness of the first through electrode is tp, tp > te is satisfied.

8. The multilayer electronic component according to claim 1, wherein when a thickness of the dielectric layer is td and a distance in the second direction between the first through electrode and the second internal electrode is d3, d3 > td is satisfied.

9. The multilayer electronic component according to claim 1, wherein when a length of the first internal electrode in the second direction is Le and a length of the second through electrode in the second direction is Lp, Le > Lp is satisfied.

10. The first and second internal electrodes are each exposed on the third and fourth surfaces, The laminated electronic component according to claim 1, wherein the first and second external electrodes are respectively disposed on the third and fourth surfaces.

11. The first and second external electrodes are respectively disposed on the second surface, The laminated electronic component according to claim 1, further comprising a first connection electrode that penetrates a part of the main body and connects the first internal electrode and the first external electrode that are closest to the second surface to each other, and a second connection electrode that penetrates a part of the main body and connects the second internal electrode and the second external electrode that are closest to the second surface to each other.

12. The laminated electronic component according to claim 11, wherein the first internal electrode is spaced apart from the third and fourth surfaces, and the second internal electrode is spaced apart from the third and fourth surfaces.

13. The laminated electronic component according to claim 11, further comprising a third external electrode and a fourth external electrode that are spaced apart from each other on the first surface, a third connection electrode that penetrates a part of the main body and connects the first internal electrode and the third external electrode that are closest to the first surface to each other, and a fourth connection electrode that penetrates a part of the main body and connects the second internal electrode and the fourth external electrode that are closest to the first surface to each other.

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