Conveyance system

Abstract

To provide a conveyance system capable of reducing exposure.SOLUTION: In a conveyance system 100, a conveyance unit 1 is capable of automatically conveying a target substrate 50 during multiple steps in the production of radioisotopes. In this case, the conveyance unit 1 is capable of automating some or all of the tasks that are likely to generate radiation exposure to workers. Therefore, the conveyance system 100 is capable of reducing worker exposure during the entire process of producing radioisotopes.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a transport system.

Background Art

[0002] As a conventional radioactive isotope production system, the one described in Patent Document 1 is known. In this radioactive isotope production system, a solid target is held by a target device at the position of an irradiation port for a particle beam. When the irradiation of the particle beam on the solid target is completed, the target device releases the holding and drops the solid target, and then inputs it to a receiving member. Thereby, the solid target input to the receiving member is transported to a recovery unit while rolling on a transport duct.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, in the radioactive isotope production system as described above, between a plurality of steps related to the production of radioactive isotopes, since the target substrate was transported by the labor of an operator, it has been required to suppress the possibility of exposure.

[0005] One aspect of the present invention has been made to solve such problems, and an object thereof is to provide a transport system capable of suppressing exposure.

Means for Solving the Problems

[0006] A transport system according to an aspect of the present invention is a transport system for transporting a target substrate, and includes a transport unit that automatically transports the target substrate between a plurality of steps related to the production of a radioisotope.

[0007] The transport unit can automatically transport the target substrate between a plurality of steps related to the production of a radioisotope. In this case, the transport unit can automatically perform part or all of the work in which an operator is likely to be exposed to radiation. Therefore, the transport system can suppress the exposure of the operator in a series of steps for producing a radioisotope.

[0008] The transport unit may transport the target substrate between a transport end position where the target substrate on which the radioisotope is generated arrives and another position. In this case, exposure can be suppressed as compared with the case where an operator takes out the irradiated target substrate at the transport end position.

[0009] The transport unit may transport the target substrate between an assembly / disassembly position where an assembly / disassembly device that assembles and disassembles the target substrate and a holder that holds the target substrate and another position. In this case, exposure can be suppressed as compared with the case where an operator transports the irradiated target substrate to the assembly / disassembly position and performs assembly / disassembly.

[0010] The transport unit may transport the target substrate between a shielding container unit that transfers and disassembles the target substrate to a shielding container for transporting to a radioisotope purification device and another position. In this case, exposure can be suppressed as compared with the case where an operator transfers and disassembles the irradiated target substrate to the shielding container.

[0011] The transport unit may transport the target substrate between a maintenance position for maintaining the target substrate and a holder that holds the target substrate and another position. In this case, exposure can be suppressed as compared with the case where an operator approaches the irradiated area and transports the target substrate or the holder to the maintenance position.

[0012] The transfer unit may include an articulated robot. In this case, the transfer unit can transfer the target substrate to a plurality of surrounding transfer destinations with a high degree of freedom of movement.

Advantages of the Invention

[0013] According to one aspect of the present invention, there is provided a transfer system capable of suppressing exposure.

Brief Description of the Drawings

[0014]

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Modes for Carrying Out the Invention

[0015] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and redundant descriptions are omitted.

[0016] FIG. 1 is a block diagram showing an RI manufacturing system 200 including a transport system 100 according to this embodiment. FIG. 2 is a view showing a target substrate 50 held by a holder 51. The RI manufacturing system 200 is a system for manufacturing and purifying RI (Radio Isotope) using the target substrate 50. The RI manufacturing system 200 transports the target substrate 50 between a plurality of processes related to the production of radioisotopes and performs predetermined processing in each process.

[0017] First, with reference to FIG. 2, the target substrate 50 will be described. The target substrate 50 is a member having a layer of a target material 52 formed on its surface. In this embodiment, the target substrate 50 is an oval plate material, but the shape is not particularly limited. As the material of the target substrate 50, a material that is not dissolved in a dissolving solution is adopted, and for example, Au, Pt, etc. may be adopted. Examples of the target material 52 include bismuth. Examples of the RI generated corresponding to the target material 52 include 211At. Note that the target material 52 and the RI to be purified are not particularly limited, and other RIs may be generated. The target material 52 is formed in a layer by plating or the like at the central position of one main surface of the target substrate 50. When the target material 52 is irradiated with a particle beam, RI is generated. The particles of the particle beam to be irradiated are, for example, protons, deuterons, alpha particles or 3 He, etc. The holder 51 is a member for holding the target substrate 50. The holder 51 has an oval shape similar to the target substrate 50 and is configured as a plate material having a greater thickness than the target substrate 50. Depending on each process, the target substrate 50 is processed while being held by the holder 51 and processed while being removed from the holder 51.

[0018] As shown in Fig. 1, the radioisotope (RI) production system 200 includes an RI production apparatus 201, an RI purification apparatus 202, a plating apparatus 203, and a transport system 100.

[0019] The RI production apparatus 201 is an apparatus for producing RI using a target substrate 50. The RI production apparatus 201 is composed of, for example, an accelerator (cyclotron) having a particle beam irradiation port. In the RI production apparatus 201, the target substrate 50 held by a holder 51 is installed at the irradiation port. The RI production apparatus 201 irradiates a particle beam onto a target material 52 of the target substrate 50 installed at the irradiation port. As a result, RI is generated at the location of the target material 52 irradiated with the particle beam.

[0020] The RI purification apparatus 202 is an apparatus for purifying and extracting RI from the target substrate 50 after particle beam irradiation. The RI purification apparatus 202 dissolves the target material 52 containing RI of the target material 52. The RI purification apparatus 202 dissolves the target material 52 by putting the target substrate 50 removed from the holder 51 into a tank. The RI purification apparatus 202 purifies high-purity RI by extracting RI from the solution.

[0021] The plating apparatus 203 is an apparatus for forming the target material 52 on the target substrate 50 by plating. The plating apparatus 203 forms the target material 52 on the target substrate 50 after the target material 52 is dissolved in the RI production apparatus 201, so that RI can be produced again in the RI production apparatus 201.

[0022] The transfer system 100 is a system for transferring the target substrate 50. The transfer system 100 includes a transfer device 1 (transfer unit) that automatically transfers the target substrate 50 between a plurality of processes related to the manufacture of RI. Here, automatic transfer means that the transfer device 1 transfers the target substrate 50 by the automatic operation of the device without the intervention of an operator's manual operation. The processes related to the manufacture of RI include an RI manufacturing process by the RI manufacturing apparatus 201, an RI purification process by the RI purification apparatus 202, and a plating process by the plating apparatus 203. As will be described later, the processes related to the manufacture of RI may include a process of holding the target substrate 50 with the holder 51 and a process of removing the target substrate 50 from the holder 51.

[0023] Specifically, when switching from the RI manufacturing process by the RI manufacturing apparatus 201 to the RI purification process by the RI purification apparatus 202, the transfer system 100 automatically transfers the target substrate 50 from the RI manufacturing apparatus 201 to the RI purification apparatus 202. When switching from the RI purification process by the RI purification apparatus 202 to the plating process by the plating apparatus 203, the transfer system 100 automatically transfers the target substrate 50 from the RI purification apparatus 202 to the plating apparatus 203. When switching from the plating process by the plating apparatus 203 to the RI manufacturing process by the RI manufacturing apparatus 201, the transfer system 100 automatically transfers the target substrate 50 from the plating apparatus 203 to the RI manufacturing apparatus 201. Note that between these RI manufacturing process, RI purification process, and plating process, a process of holding the target substrate 50 with the holder 51 and a process of removing the target substrate 50 from the holder 51 may intervene.

[0024] The RI manufacturing apparatus 201 has a delivery location 204 for delivering the target substrate 50 to and from the transfer apparatus 1. The RI purification apparatus 202 has a delivery location 206 for delivering the target substrate 50 to and from the transfer apparatus 1. The plating apparatus 203 has a delivery location 207 for delivering the target substrate 50 to and from the transfer apparatus 1. The transfer apparatus 1 automatically transfers the target substrate 50 among these delivery locations 204, 206, and 207. However, within each apparatus, when transferring the target substrate 50 between the delivery locations 204, 206, 207 and the processing unit of each apparatus, it may be manual transfer by an operator or automatic transfer by the apparatus.

[0025] Next, the specific configuration of the transfer system 100 will be described with reference to FIG. 3. FIG. 3 is a plan view of the transfer system 100. For convenience of explanation, an XY coordinate system is set for the description. The X-axis direction is one direction in the horizontal direction. The Y-axis direction is the direction orthogonal to the X-axis direction in the horizontal direction. The transfer system 100 is disposed in a space surrounded by the concrete wall portion 2 and the partition wall portion 3. The concrete wall portion 2 is provided on the positive side in the X-axis direction. A partition wall portion 3 surrounding three directions is provided on the negative side in the X-axis direction of the concrete wall portion 2. The transfer system 100 is provided in the indoor space SP surrounded by these wall portion 2 and partition wall portion 3.

[0026] The transfer system 100 includes a transfer apparatus 1, a transfer end position 4, an assembly / disassembly position 6, an assembly / disassembly apparatus 7, a shielding container unit 8, and a maintenance position 9.

[0027] The transfer device 1 is a device that automatically transfers the target substrate 50 between the transfer end position 4, the assembly / disassembly position 6, the shielding container unit 8, and the maintenance position 9. The transfer device 1 includes an articulated robot 10. In this embodiment, a scalar robot is adopted as the articulated robot 10. FIG. 3 is a view of the articulated robot 10 seen from the lateral direction. The articulated robot 10 includes a base portion 11, an arm portion 12, and a holding portion 13. The base portion 11 is a portion fixed to the floor portion. The arm portion 12 has one end rotatably supported with respect to the base portion 11 and is a member extending horizontally from the base portion 11. The base portion 11 is provided near the central position in the indoor space SP. The holding portion 13 is a member that holds the target substrate 50. One end of the holding portion 13 is rotatably supported with respect to the tip end portion of the arm portion 12. A rod portion 14 extending downward is provided on the lower surface of the tip end side of the holding portion 13. A chuck portion 16 that holds the target substrate 50 or the holder 51 is provided at the lower end portion of the rod portion 14. The rod portion 14 is telescopable in the vertical direction. As shown in FIG. 3, since the arm portion 12 rotates around the base portion 11 and the holding portion 13 is rotatable around the arm portion 12, the holding portion 13 can move freely within the movement range ME.

[0028] The transfer end position 4 is the position where the target substrate 50 on which the RI is generated arrives. The transfer end position 4 is on the positive side in the X-axis direction and on the negative side in the Y-axis direction with respect to the base portion 11 of the transfer device 1. The transfer end position 4 is provided at the tip of the air supply pipe 21 extending from the outside through the concrete wall portion 2. The target substrate 50 in a state where the RI is generated by the processing in the RI manufacturing apparatus 201 arrives at the transfer end position 4 through the air supply pipe 21. The transfer end position 4 corresponds to the delivery location 204 of the RI manufacturing apparatus 201. The target substrate 50 arrives at the transfer end position 4 while being held by the holder 51. A direction correction unit 22 is provided at the transfer end position 4. The direction correction unit 22 corrects the direction of the target substrate 50 at the transfer end position 4. The posture of the target substrate 50 rotates during the air conveyance through the air supply pipe 21. Therefore, the direction correction unit 22 corrects the direction of the target substrate 50 at the transfer end position 4 so that the transfer device 1 can easily hold it.

[0029] The assembly / disassembly position 6 is the position where the assembly and disassembly of the target substrate 50 and the holder 51 holding the target substrate 50 are performed. The assembly / disassembly position 6 is provided at a position on the positive side in the Y-axis direction of the base portion 11 of the transfer device 1. The assembly / disassembly position 6 is a space for installing the target substrate 50 held by the holder 51 or the target substrate 50 with the holder 51 removed.

[0030] The assembly / disassembly device 7 is a device that performs the assembly and disassembly of the target substrate 50 and the holder 51 that holds the target substrate 50. The assembly / disassembly device 7 is provided on the positive side in the X-axis direction and the positive side in the Y-axis direction at the assembly / disassembly position 6. As shown in FIGS. 3 and 5, the assembly / disassembly device 7 includes an X-axis guide portion 26, a Y-axis guide portion 27, a slider portion 28, and a lifting portion 29. The X-axis guide portion 26 is a member that guides the Y-axis guide portion 27 to move in the X-axis direction. The Y-axis guide portion 27 is a member that guides the slider portion 28 to move in the Y-axis direction. The slider portion 28 is a member that is slidably supported by the Y-axis guide portion 27 and is connected to the lifting portion 29. The lifting portion 29 is a member that moves up and down in the vertical direction. A tool 30 (see FIG. 4) capable of performing operations such as screwing is provided at the lower end of the lifting portion 29. With such a configuration, the assembly / disassembly device 7 can move the tool 30 in three axial directions: the X-axis direction, the Y-axis direction, and the vertical direction. The assembly / disassembly device 7 can remove and fix the fixing bolts from the holder 51 and the target substrate 50 disposed at the assembly / disassembly position 6.

[0031] The shielding container unit 8 is a unit that transfers and disassembles the target substrate 50 with respect to the shielding container 31 for conveyance to the RI purification apparatus 202. The shielding container 31 is a container that shields leakage of radiation to the outside by housing the target substrate 50 that has been generated and activated by RI. The shielding container 31 houses the target substrate 50 in a state removed from the holder 51. The shielding container unit 8 is provided at a position on the negative side in the X-axis direction and the positive side in the Y-axis direction of the base portion 11 of the transfer device 1. The shielding container unit 8 includes an X-axis guide portion 32 that moves the shielding container 31 in the X-axis direction, and a Y-axis guide portion 33 that moves the X-axis guide portion 32 in the Y-axis direction. The shielding container 31 receives the target substrate 50 from the transfer device 1 at a position on the negative side in the Y-axis direction in the Y-axis guide portion 33. The shielding container 31 with the lid receiving the target substrate 50 moves to the positive side in the Y-axis direction. Then, the shielding container 31 moves to the negative side in the X-axis direction and is pulled out from the opening 34 of the partition portion 3. The pulled-out shielding container 31 is conveyed by an operator to the processing portion of the RI purification apparatus 202. The shielding container unit 8 corresponds to the delivery location 206 of the RI purification apparatus 202.

[0032] The maintenance position 9 is a position for performing maintenance on the target substrate 50 and the holder 51 that holds the target substrate 50. The maintenance position 9 is provided at a position on the negative side in the X-axis direction and the negative side in the Y-axis direction of the base portion 11 of the transfer device 1. The maintenance position 9 includes a container 36 that houses the target substrate 50 or the holder 51, and an X-axis guide portion 37 that moves the container 36 in the X-axis direction. The container 36 housing the target substrate 50 or the holder 51 moves to the negative side in the X-axis direction and is pulled out from the opening 38 of the partition portion 3. The container 36 housing the holder 51 is conveyed by an operator to a location for performing maintenance such as an O-ring of the holder 51. Alternatively, the container 36 housing the target substrate 50 is conveyed by an operator to the processing portion of the plating apparatus 203. The maintenance position 9 corresponds to the delivery location 207 of the plating apparatus 203.

[0033] In the conveying system 100 configured as described above, the conveying device 1 can convey the target substrate 50 between the conveying end position 4, the assembly / disassembly position 6, the shielding container unit 8, and the maintenance position 9. Note that the combination of positions from which and to which the conveying device 1 conveys is not particularly limited, and it can be conveyed in any combination. With reference to FIGS. 6 to 11, the conveyance of the target substrate 50 in the conveying system 100 will be specifically described.

[0034] First, as shown in FIG. 6, the target substrate 50 held by the holder 51 reaches the conveying end position 4 via the pneumatic conveying pipe 21. The conveying device 1 moves the holding part 13 to the conveying end position 4 and chucks the holder 51 with the chuck part (see FIG. 4). Next, as shown in FIG. 7, the conveying device 1 moves the holding part 13 to the assembly / disassembly position 6 and places the holder 51 holding the target substrate 50 at the assembly / disassembly position 6.

[0035] Next, as shown in FIG. 8, the conveying device 1 moves the holding part 13 to a position where it does not interfere with the assembly / disassembly device 7. The assembly / disassembly device 7 moves the elevating part 29 to the assembly / disassembly position 6 and lowers the tool 30 (see FIG. 5). Thereby, the assembly / disassembly device 7 removes the bolts and removes the target substrate 50 from the holder 51. Next, when the conveying device 1 moves the holding part 13 to the assembly / disassembly position 6 and chucks the holder 51 with the chuck part (see FIG. 4), as shown in FIG. 9, it moves to the maintenance position 9. At the maintenance position 9, the holder 51 housed in the container 36 is pulled out from the opening 38 and manually conveyed to a place where maintenance such as an O-ring is performed.

[0036] Next, as shown in FIG. 10, the conveying device 1 moves the holding part 13 to the assembly / disassembly position 6 and chucks the target substrate 50 with the chuck part (see FIG. 4). Next, as shown in FIG. 11, the conveying device 1 moves the holding part 13 to the shielding container unit 8 and houses the target substrate 50 in the shielding container 31. When the lid of the shielding container 31 is closed, it is pulled out from the opening 34 and manually conveyed to the processing part of the RI purification device 202.

[0037] Note that the above operations are merely examples, and some operations may be omitted. Further, the transfer device 1 may receive the holder 51 and the target substrate 50 returned from the outside at the maintenance position 9 or the shielding container unit 8.

[0038] Next, the operation and effect of the transfer system 100 according to the present embodiment will be described.

[0039] FIG. 12 shows an RI manufacturing system 300 according to a comparative example. In the RI manufacturing system 300 according to the comparative example, in the RI manufacturing apparatus 201, when the irradiation at the irradiation port is completed, the target substrate is dropped and transferred to accommodate the target substrate in the shielding container. The target substrate 50 is accommodated in the shielding container in a state of being accommodated in the substrate case. The shielding container is automatically closed and transferred to the RI purification apparatus 202. In the RI purification apparatus 202, an operator takes out the substrate case from the shielding container and further takes out the target substrate 50 from the substrate case. Further, the transfer of the target substrate 50 from the RI purification apparatus 202 to the plating apparatus 203 and the transfer of the target substrate 50 from the plating apparatus 203 to the RI manufacturing apparatus 201 are performed manually. In the RI manufacturing system 300 according to the comparative example, in the RI purification apparatus 202, since an operation for an operator to take out the target substrate 50 from the substrate case occurs, suppression of exposure has been required. Further, as a transfer method during transfer, since free fall is used, only the forward path can be handled, and the return path transfer cannot be performed. Further, in the RI manufacturing apparatus 201, it is necessary to install the target substrate 50 at the target station directly below the irradiation port for irradiation preparation.

[0040] In the transfer system 100 according to the present embodiment, the transfer device 1 can automatically transfer the target substrate 50 between a plurality of processes related to the production of radioactive isotopes. In this case, the transfer device 1 can automatically perform part or all of the operations in which an operator is likely to be exposed. Therefore, the transfer system 100 can suppress the exposure of the operator in a series of processes for producing radioactive isotopes.

[0041] The transfer device 1 may transfer the target substrate 50 between the transfer end position 4 where the target substrate 50 on which the radioisotope is generated arrives and another position. In this case, exposure can be suppressed as compared with the case where an operator takes out the radioactive target substrate 50 at the transfer end position 4.

[0042] The transfer device 1 may transfer the target substrate 50 between the assembly / disassembly position 6 by the assembly / disassembly device 7 that assembles and disassembles the target substrate 50 and the holder 51 that holds the target substrate 50 and another position. In this case, exposure can be suppressed as compared with the case where an operator transfers the radioactive target substrate 50 to the assembly / disassembly position 6 and performs assembly and disassembly. That is, different from the comparative example, the operator does not need to perform the operation of taking out the target substrate 50 from a substrate case or the like in the RI purification device 202.

[0043] The transfer device 1 may transfer the target substrate 50 between the shielding container unit 8 that transfers and disassembles the target substrate 50 to the shielding container 31 for transferring to the RI purification device 202 and another position. In this case, exposure can be suppressed as compared with the case where an operator transfers and disassembles the radioactive target substrate 50 with respect to the shielding container 31.

[0044] The transfer device 1 may transfer the target substrate 50 between the maintenance position 9 for maintaining the target substrate 50 and the holder 51 that holds the target substrate 50 and another position. In this case, exposure can be suppressed as compared with the case where an operator approaches the radioactive area (for example, the assembly / disassembly position 6) and transfers the target substrate 50 and the holder 51 to the maintenance position 9.

[0045] The transfer device 1 may include an articulated robot 10. In this case, the transfer device 1 can transfer the target substrate 50 to a plurality of surrounding transfer destinations by operating with a high degree of freedom. Also, since it is an automatic transfer using the articulated robot 10, it is not necessary to use a transfer method by free fall as in the comparative example. Therefore, the transfer device 1 can perform not only the transfer on the return path but also the transfer on the forward path.

[0046] Also, according to the transfer system 100, since each device can be arranged within the movement range ME of one transfer device 1, the space required for installation can be small. Therefore, the dimensions of the indoor space SP can be reduced. Also, according to the transfer system 100, it is possible to transfer even if the shape of the target substrate 50 changes, and the system can have versatility.

[0047] The present invention is not limited to the above-described embodiments.

[0048] For example, the transfer locations that are the transfer targets of the transfer device 1 may be appropriately omitted from the above-described embodiments. For example, the assembly / disassembly position 6 and the maintenance position 9 may be omitted.

[0049] Also, the articulated robot of the transfer device 1 is not limited to a scalar robot, and for example, a robot arm or the like may be adopted. Also, the transfer device 1 does not have to be an articulated robot. Also, in the above-described embodiments, one transfer device 1 was used, but a plurality of transfer devices 1 may be used.

Explanation of Reference Numerals

[0050] 1... Transfer device (transfer unit), 4... Transfer end position, 6... Assembly / disassembly position, 7... Assembly / disassembly device, 8... Shielding container unit, 9... Maintenance position, 50... Target substrate, 100... Transfer system.

Claims

1. A transport system for transporting a target substrate, comprising a transport unit for automatically transporting the target substrate between a plurality of processes related to the production of radioisotopes.

2. The transport system according to claim 1, wherein the transport unit transports the target substrate between a transport end position where the target substrate on which the radioisotope is generated arrives and another position.

3. The transport system according to claim 1, wherein the transport unit transports the target substrate between an assembly / disassembly position by an assembly / disassembly device that assembles and disassembles the target substrate and a holder for holding the target substrate, and another position.

4. The transport system according to claim 1, wherein the transport unit transports the target substrate between a shielding container unit that transfers and disassembles the target substrate to a shielding container for transporting to a radioisotope purification device, and another position.

5. The transport system according to claim 1, wherein the transport unit transports the target substrate between a maintenance position for maintaining the target substrate and a holder for holding the target substrate, and another position.

6. The transport system according to claim 1, wherein the transport unit includes an articulated robot. ​

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