Liquid discharge method, liquid discharge device, imprint method, and imprint device

Abstract

To provide a liquid discharge device and a liquid discharge method for discharging liquid from a plurality of nozzles, and to prevent the influence of crosstalk between the nozzles.SOLUTION: There is provided a liquid discharge method using a liquid discharge device having a liquid discharge head having a plurality of nozzles and driving means that generates energy for discharging liquid from the nozzles, the method including: a discharge step of discharging liquid to a substrate from the liquid discharge head to form a discharge pattern on the substrate; a step of correcting a control value of each of discharge nozzles of the plurality of nozzles on the basis of the relationship with the other discharge nozzles in the discharge step; and a step of performing the discharge step multiple times by using the corrected control values while relatively moving the liquid discharge head and the substrate, to form a droplet pattern comprising a plurality of discharge patterns in a discharge area on the substrate. In the discharge step for forming, on the substrate, a first discharge pattern of the plurality of discharge patterns forming the droplet pattern, a second discharge pattern different from the first discharge pattern is formed on the substrate in place of the first discharge pattern.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a liquid ejection method, a liquid ejection device, an imprint method, and an imprint device.

Background Art

[0002] As the demand for miniaturization of semiconductor devices and MEMS progresses, the development of an imprint technology for molding uncured resin on a substrate with a mold and forming a resin pattern on the substrate has advanced. By using the imprint technology, a fine structure on the order of nanometers can be formed on the substrate.

[0003] One of the imprint technologies is the photo-curing method. In this imprint method using the photo-curing method, first, an uncured photo-curable resin (imprint material) is supplied onto a substrate (wafer). Next, the resin on the substrate and the mold are brought into contact (imprinting step). Then, by irradiating light (ultraviolet light) in a state where the resin and the mold are in contact (curing step), the resin is cured. After curing the resin, by increasing the distance between the substrate and the mold (releasing step), the mold is separated from the cured resin and a resin pattern is formed on the substrate.

[0004] As a method of applying the imprint material onto the substrate, there is a method of ejecting droplets of the imprint material onto the substrate using an inkjet-type liquid ejection device having a plurality of nozzles. In such a liquid ejection device, there is an influence of crosstalk between the nozzles that eject the liquid simultaneously. This is because the pressure generated from the driving means such as a piezo element for ejecting the liquid from the nozzle propagates to other nozzles through the liquid and changes the ejection state of other nozzles. Patent Document 1 describes a technique for reducing crosstalk between nozzles by dividing the droplet pattern into a plurality of sub-patterns and ejecting the liquid.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0006] Even if the droplet pattern is divided into a plurality of sub-patterns as in Patent Document 1, if there are a plurality of nozzles that simultaneously eject liquid, there is an influence of crosstalk between the nozzles, so the ejection accuracy of the liquid may decrease. In order to improve the ejection accuracy of the liquid, it is desirable to correct the control values of the driving means for ejection from each nozzle in consideration of crosstalk.

[0007] However, the way the crosstalk affects depends on the number of combinations of the presence or absence of liquid ejection for each of the plurality of nozzles (if it is a liquid ejection head having N nozzles, there are 2 N patterns). In order to store correction information for correcting the influence of crosstalk for all combinations of the presence or absence of ejection of each nozzle, a large storage area is required in the storage device of the control device.

[0008] An object of the present invention is to suppress the influence of crosstalk between nozzles in a liquid ejection device and a liquid ejection method for ejecting liquid from a plurality of nozzles.

MEANS FOR SOLVING THE PROBLEMS

[0009] The present invention includes a liquid ejection head having a plurality of nozzles for ejecting liquid, a plurality of driving means for generating energy for ejecting liquid from each of the plurality of nozzles, and a liquid ejection method by a liquid ejection device for ejecting liquid onto a substrate, comprising: an ejection step of forming, on the substrate, an ejection pattern composed of one or a plurality of droplets arranged in the direction in which the plurality of nozzles are arranged by ejecting liquid from the liquid ejection head onto the substrate; a step of correcting control values of the driving means for each of the ejection nozzles that eject in accordance with the ejection pattern in the ejection step among the plurality of nozzles, based on the relationship with other ejection nozzles in the ejection step; a step of forming a droplet pattern composed of a plurality of the ejection patterns arranged in the direction of the relative movement within a predetermined ejection region on the substrate by performing the ejection step a plurality of times while relatively moving the liquid ejection head and the substrate, using the control values corrected by the correcting; having In the ejection step for forming a first ejection pattern among the plurality of ejection patterns constituting the droplet pattern on the substrate, instead of the first ejection pattern, a liquid ejection method characterized by forming a second ejection pattern different from the first ejection pattern among the plurality of ejection patterns constituting the droplet pattern on the substrate.

[0010] The present invention includes a liquid ejection head having a plurality of nozzles for ejecting a liquid, a plurality of driving means for generating energy for ejecting the liquid from each of the plurality of nozzles, a moving means for relatively moving the liquid ejection head with respect to a substrate that is an object to which the liquid is ejected, a control means, and is a liquid ejection apparatus having the control means includes an ejection step of forming an ejection pattern composed of one or a plurality of droplets arranged in the direction in which the plurality of nozzles are arranged on the substrate by ejecting the liquid from the liquid ejection head onto the substrate; a step of correcting control values of the driving means for each of the ejection nozzles that eject in accordance with the ejection pattern in the ejection step among the plurality of nozzles, based on the relationship with other ejection nozzles in the ejection step; While relatively moving the liquid ejection head and the substrate, by performing the ejection process a plurality of times using the control value corrected in the correcting step, a droplet pattern composed of a plurality of the ejection patterns arranged in the direction of the relative movement is formed within a predetermined ejection region on the substrate; Execute, In the ejection step for forming the first ejection pattern among the plurality of ejection patterns constituting the droplet pattern on the substrate, instead of the first ejection pattern, a second ejection pattern different from the first ejection pattern among the plurality of ejection patterns constituting the droplet pattern is formed on the substrate. A liquid ejection device characterized by that.

Effect of the Invention

[0011] According to the present invention, in a liquid ejection device and a liquid ejection method for ejecting liquid from a plurality of nozzles, the influence of crosstalk between nozzles can be suppressed.

Brief Description of the Drawings

[0012]

Figure 1

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[0013] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The present invention is not intended to limit the scope of the subject matter described in the claims or the subject matter. Note that not all of the combinations of features described in the embodiments are necessarily essential to the solution.

[0014] FIG. 1 is a schematic diagram of an imprint apparatus 100 according to the embodiment.

[0015] The imprint apparatus 100 has a base plate 1, and a substrate stage 5 is provided on the base plate 1 via a stage driving means 4 formed of a linear motor or the like. The substrate stage 5 holds a semiconductor wafer (hereinafter also simply referred to as a substrate) 6 and is configured to be movable.

[0016] The substrate stage 5 has a built-in distance measurement sensor 7 capable of measuring distance, and can measure the distance to an opposing object.

[0017] The stage driving means 4 is a moving means that moves this substrate stage 5 in the illustrated X and Y directions parallel to the upper surface of the base 1. The substrate stage 5 feeds back position information detected by means (not shown), such as an interferometer or an encoder, to the stage driving means 4.

[0018] A frame 2 is provided on the surface plate 1 via a damper 3 that cancels vibrations from the floor, and an imprint module 8 having a Z drive mechanism is attached to this frame 2.

[0019] The imprint module 8 has a mold holding mechanism 10 that holds a mold 9 at a position facing the substrate 6. A gas supply mechanism 11 is connected to the mold holding mechanism 10, and it is possible to supply any gas to the periphery of the mold 9 through the mold holding mechanism 10.

[0020] The mold 9 is carried in and out via a mold transfer mechanism 12 from outside the imprint apparatus 100. The mold transfer mechanism 12 has a mechanism for receiving the mold 9 from outside the imprint apparatus 100, and after performing alignment at a fixed position with an alignment mechanism inside the mold transfer function 12, it has a transfer mechanism for transferring the mold 9 to the mold holding mechanism 10.

[0021] The mold 9 has a concavo-convex pattern formed on the surface facing the substrate 6. The imprint module 8 is vertically drivable in a direction perpendicular to the surface of the substrate 6 (the Z direction shown in the figure), and is a pressing means for pressing the mold 9 against the imprint material applied on the substrate 6. Further, the imprint module 8 is a peeling means for peeling the mold 9 from the substrate 6.

[0022] The imprint apparatus 100 discharges a liquid imprint material (hereinafter also simply referred to as liquid) from the liquid discharge device 16 onto the substrate 6 while relatively moving the substrate 6 with respect to the liquid discharge device 16, and applies the liquid to the substrate 6. The imprint apparatus 100 has an exposure light source 13 which is a curing means for irradiating light having a wavelength for curing the imprint material. While the imprint material applied to the substrate 6 is in a liquid state, the mold holding mechanism 10 is lowered and the mold 9 is pressed against the substrate 6. Thereafter, the light irradiated from the exposure light source 13 passes through the shutter 15, is irradiated onto the substrate 6 via the reflection unit 14 and the imprint module 8, and cures the imprint material.

[0023] After curing, when the mold holding mechanism 10 is raised and separated from the substrate 6, concavo-convexities of the same mold as the mold 9 are formed on the substrate 6.

[0024] FIG. 8 is a block diagram showing the functional configuration and hardware configuration of the imprint apparatus 100. The control device 800 includes a CPU 801, a storage device 802, an input I / F 803, a network I / F 805, a stage I / F 807, and a discharge device I / F 809, which are interconnected via a bus 811. The bus 811 is configured to transfer data among the components within the control device 800. The CPU 801 executes various instructions for controlling the operation of the control device 800. The storage device 802 includes a RAM that functions as the main memory and work area of the CPU 801, a ROM that stores various programs and data, and a fixed disk that stores various setting information, calculation results, and the like. An input device 804 such as a keyboard is connected to the input I / F 803. A network 806 such as a local network or the Internet is connected to the network I / F 805. Various stage devices 808 related to imprinting, such as a stage driving means 4, a distance measurement sensor 7, a mold holding mechanism 10, a gas supply mechanism 11, a mold transfer mechanism 12, an exposure light source 13, and a shutter 15, are connected to the stage I / F 807. A liquid discharge device 16 is connected to the discharge device I / F 809.

[0025] The control device 800 controls the operations of the stage device 808 and the discharge operation of the imprint material by the liquid discharge device 16.

[0026] FIG. 2 is a diagram schematically showing a liquid discharge head 205 provided in the liquid discharge device 16. FIG. 9 is a cross-sectional view of an element substrate 20 of the liquid discharge head 205, showing a cross-section along line AA in FIG. 2.

[0027] As shown in FIG. 2, the liquid discharge head 205 is constituted by an element substrate 20 having a plurality of nozzles (six nozzles 21, 22, 23, 24, 25, 26 in the example of FIG. 2) for discharging liquid. Note that the number of nozzles is not limited to this.

[0028] As shown in FIG. 9, the element substrate 20 of the liquid ejection head 205 has a piezoelectric element 108 as a driving means for generating energy to eject liquid from the nozzles. The base material 106 has an insulating film 209, a diaphragm 301, a flow path forming substrate 302, and a nozzle plate 303. Nozzles 26 are formed in the nozzle plate 303. Liquid (in the embodiment, an imprint material or a resist material) is ejected from the nozzles 26. The flow path forming substrate 302 is provided on the nozzle plate 303, and by partitioning the space between the nozzle plate 303 and the diaphragm 301, a pressure chamber 305 is formed. Although not shown in FIG. 9 for simplification, various flow paths for allowing the liquid to flow are formed in the flow path forming substrate 302 in addition to the pressure chamber 305. The piezoelectric element 108 is electrically connected to a control device 800 as a control means via an ejection device I / F 809, and operates based on a driving signal output from the control device 800. The diaphragm 301 is deformed by the operation of the piezoelectric film 110, changing the internal pressure of the pressure chamber 305, and liquid is ejected from the nozzles 26 thereby.

[0029] The piezoelectric element 108 has, on the first surface of the base material 106, a lower electrode 202, a piezoelectric film 110 formed on the upper surface of the lower electrode 202, and an upper electrode 111 formed on the upper surface of the piezoelectric film 110, in this order. Further, the piezoelectric element 108 has an insulating film 211 that covers a portion of the upper surface of the lower electrode 202 where the piezoelectric film 110 is not formed, a portion of the upper surface of the piezoelectric film 110 where the upper electrode 111 is not formed, the upper surface of the upper electrode 111, and the side surface of the piezoelectric film 110. The piezoelectric element 108 is provided with a signal wiring 200 for supplying an operation signal and a common wiring 201 for applying a common potential. An upper electrode pad 114 is disposed at an end of the piezoelectric element 108 and is electrically connected to the signal wiring 200 and the upper electrode 111 of the piezoelectric element 108. Further, in the vicinity of the end portion opposite to the upper electrode pad 114 of the piezoelectric element 108, there is an extended region of the lower electrode 202, and a lower electrode pad 115 is disposed on its upper layer. The lower electrode pad 115 is electrically connected to the common wiring 201 and the lower electrode 202.

[0030] Referring to FIG. 2, crosstalk between nozzles when liquid is discharged from a liquid discharge head 205 having a plurality of nozzles will be described.

[0031] When liquid is simultaneously discharged by a plurality of nozzles, the pressure generated from a piezoelectric element 108 for discharging the liquid from each nozzle propagates to other nozzles through the liquid. For example, in FIG. 2, let nozzles 21 to 24 be discharge nozzles that perform discharge, and let nozzles 25 and 26 be non-discharge nozzles that do not perform discharge. Waveform 210 schematically shows the pressure propagating from nozzle 21, waveform 220 schematically shows the pressure propagating from nozzle 22, and waveform 230 schematically shows the pressure propagating from nozzle 23 to nozzle 24. Therefore, the discharge state from nozzle 24 changes due to the discharges from nozzles 21 to 23. This is the influence of crosstalk between nozzles.

[0032] FIG. 3(A) is a schematic diagram showing an element substrate 20 of the liquid discharge head 205. FIG. 3(B) is a diagram showing a droplet pattern formed within a predetermined discharge region on the substrate by discharging liquid from the liquid discharge head 205 onto the substrate.

[0033] As shown in FIG. 3(A), the element substrate 20 has a nozzle row 32 and a nozzle row 33. The nozzle row 32 and the nozzle row 33 are arranged side by side along the direction (Y direction) in which the liquid discharge head 205 scans the substrate 6. The nozzle row 32 and the nozzle row 33 each have a plurality of nozzles 37 arranged in the longitudinal direction (X direction) of the element substrate 20. The nozzle row 32 is arranged offset in the X direction with respect to the nozzle row 33 so that the X-direction positions of the plurality of nozzles 37 in the nozzle row 32 and the X-direction positions of the plurality of nozzles 37 in the nozzle row 33 do not overlap each other.

[0034] FIG. 3(B) shows a droplet pattern formed in a predetermined ejection region 36 on the substrate 6 by ejecting liquid onto the substrate 6 by the nozzle array 33. By ejecting liquid from the nozzle array 33 of the liquid ejection head 205 onto the substrate 6, an ejection pattern composed of one or more droplets 35 arranged one-dimensionally in the direction (X direction) in which the plurality of nozzles 37 are arranged is formed on the substrate 6. The step of forming one ejection pattern on the substrate 6 is defined as the ejection step.

[0035] By performing the ejection step a plurality of times while relatively moving the liquid ejection head 205 and the substrate 6, a droplet pattern 38 composed of a plurality of ejection patterns arranged in the relative movement direction (Y direction) is formed within a predetermined ejection region 36 on the substrate 6. In the example of FIG. 3(B), the droplet pattern 38 formed within the ejection region 36 is composed of 15 ejection patterns, and the types of ejection patterns are 6 (ejection patterns 41, 42, 43, 44, 45, 46).

[0036] How to arrange what types of ejection patterns within the ejection region 36 is determined according to the presence or absence, depth, etc. of the concavities and convexities engraved on the mold 9. In the example of FIG. 3(B), the droplet pattern 38 is composed of 7 regions P1, P2, P3, P4, P5, P6, P7 arranged in the Y direction.

[0037] Region P1 is formed by 3 ejection patterns 41. Region P2 is formed by 3 ejection patterns 42. Region P3 is formed by 2 ejection patterns 43. Region P4 is formed by 2 ejection patterns 44. Region P5 is formed by 1 ejection pattern 45. Region P6 is formed by 2 ejection patterns 46. Region P7 is formed by 2 ejection patterns 41.

[0038] In the region of the mold 9 corresponding to region P1, since patterns requiring a large amount of imprint material are concentrated, region P1 is formed by the ejection pattern 41 in which liquid is ejected from all the nozzles 37.

[0039] In the region of the mold 9 corresponding to the region P2, since patterns that require a large amount of imprinting material concentrate near the center, the region P2 is formed by the discharge pattern 42 in which liquid is discharged from the nozzles 37 near the center.

[0040] In the region of the mold 9 corresponding to the region P3, since patterns that require a large amount of imprinting material concentrate on one side in the X direction (the lower side in FIG. 3(B)), the region P3 is formed by the discharge pattern 43 in which liquid is discharged from the nozzles 37 on one side in the X direction.

[0041] In the region of the mold 9 corresponding to the region P4, since there are patterns that do not require a large amount of imprinting material, the region P4 is formed by the discharge pattern 44 with a small number of nozzles 37 to be discharged.

[0042] In the region of the mold 9 corresponding to the region P5, since there are patterns that hardly require imprinting material, the region P5 is formed by the discharge pattern 45 with an even smaller number of nozzles 37 to be discharged.

[0043] In the region of the mold 9 corresponding to the region P6, since patterns that require a large amount of imprinting material are partially concentrated, similar to the region P1, the region P6 is formed by the discharge pattern 41.

[0044] In this way, by determining the droplet pattern 38 in the discharge region 36 according to the shape of the mold 9, it becomes possible to make the resist film thickness uniform after imprinting of the mold 9.

[0045] FIG. 10 is a diagram showing an example of a drive signal (control value) applied to a piezoelectric element 108 to generate energy for discharging liquid from a nozzle 37 by the piezoelectric element 108. As shown in FIG. 10, the drive signals 51, 52, and 53 can be pulse signals applied to the piezoelectric element 108 at a predetermined amplitude, pulse length, and timing, for example. By changing the amplitudes Va, Vb, and Vc and the rise timings ta, tb, and tc of the drive signals 51, 52, and 53, the discharge amount and discharge timing of the liquid discharged from the nozzle 37 can be changed.

[0046] As described above, among the plurality of nozzles 37 of the liquid discharge head 205, there may be a plurality of discharge nozzles that perform discharge in the discharge process. For example, in the discharge process for forming the above-described discharge patterns 41 to 46, there are a plurality of discharge nozzles in each case. In this way in such a case, due to the influence of crosstalk between the discharge nozzles, the discharge amount and discharge timing from each discharge nozzle may deviate from the target discharge amount and discharge timing. Therefore, by correcting the control value (amplitude, pulse length, timing, etc.) of the drive signal for each discharge nozzle based on the relationship with other discharge nozzles in the discharge process, the influence of crosstalk can be reduced.

[0047] FIG. 5 is a diagram showing an example of a method for correcting the control value of a discharge nozzle to reduce the influence of crosstalk. In Equation 1 shown in FIG. 5, a correction value for correcting the influence of other nozzles on the nozzle to be corrected is calculated according to the distance between the nozzle to be corrected and other nozzles. For example, as the distance d between adjacent nozzles, a correction value for correcting the influence of another nozzle n away from the nozzle to be corrected is set to a value F(d*n) determined by d*n. Then, the control value of the nozzle to be corrected is corrected using the value Σ(F(d*n)) (Equation 1) obtained by summing the correction values over all other nozzles.

[0048] In the step of forming the droplet pattern 38 on the substrate 6 while relatively moving the liquid ejection head 205 with respect to the substrate 6, the ejection process for forming each ejection pattern is performed using the corrected control value. Thereby, it becomes possible to form an ejection pattern with reduced influence of crosstalk.

[0049] Information on the control values of the corrected respective nozzles 37, or correction information (for example, the correction value calculated by Equation 1) used for correcting the control values of the respective nozzles 37 is stored in the storage device 802 which is the storage means of the control device 800. Then, in the ejection process, the piezoelectric element 108 corresponding to each nozzle 37 is driven using the corrected control value acquired from the storage device 802 or the control value corrected based on the correction information acquired from the storage device 802.

[0050] Here, if the number of nozzles 37 constituting the nozzle row 33 in FIG. 3(A) is N, the maximum number of types of ejection patterns is 2 N types, and the number thereof becomes enormous. And the information on the corrected control values or the correction information (hereinafter, also simply referred to as correction information) for reducing the influence of crosstalk between the ejection nozzles is different for each ejection pattern. Therefore, if it is attempted to store the correction information in the storage device 802 for all the ejection patterns constituting the droplet pattern 38, depending on the number of types of ejection patterns, a large amount of storage area is required in the storage device 802. Further, the time required for transferring the correction information becomes long, and there is a possibility that the throughput of the apparatus decreases.

[0051] Therefore, in the embodiment, in the ejection process for forming the first ejection pattern on the substrate 6 among the plurality of ejection patterns constituting the droplet pattern 38, instead of the first ejection pattern, a second ejection pattern different from the first ejection pattern is formed on the substrate 6. In other words, in the droplet pattern 38, the first ejection pattern is replaced with the second ejection pattern. Note that the ejection pattern to be replaced may be one type or a plurality of types. That is, in the ejection process for forming a part of the plurality of ejection patterns constituting the droplet pattern 38 on the substrate 6, instead of the part of the ejection patterns, a different ejection pattern may be formed on the substrate 6.

[0052] Then, the correction information corresponding to the first ejection pattern is not stored in the storage device 802. As a result, since the amount of correction information stored in the storage device 802 can be reduced, the necessary storage area of the storage device 802 can be reduced, and the time required for transferring the correction information can be shortened, thereby improving the throughput of the device.

[0053] For example, when the droplet pattern 38 is composed of ejection patterns 41 to 46 as shown in FIG. 3(B), by replacing the ejection pattern 45 with the ejection pattern 44 , only five types of correction information are required. Also, by replacing the ejection patterns 44 to 46 with the ejection pattern 41, only three types of correction information are required.

[0054] Hereinafter, some specific examples of the method for replacing the ejection pattern will be described. Note that the method for replacing the ejection pattern described below is for illustrative purposes only, and the replacement method is not limited thereto.

[0055] (Example 1) In Example 1, among the plurality of ejection patterns constituting the droplet pattern 38, the ejection pattern with the least number of appearances in the droplet pattern 38 is replaced with the ejection pattern with the most number of appearances.

[0056] FIG. 4 is a flowchart showing the process of crosstalk correction in the first embodiment. The process of this flowchart is executed by the control device 800.

[0057] In steps S41 to S47, the control device 800 counts the number of appearances and performs crosstalk correction on the control values for each ejection pattern constituting the droplet pattern 38 formed in the ejection area 36.

[0058] First, in step S41, the control device 800 determines whether the ejection pattern to be determined is an ejection pattern for which crosstalk correction has already been performed. For example, the control device 800 determines the type of ejection pattern from the ejection pattern located at one end in the scan direction (Y direction) of the liquid ejection head 205 toward the other end. If the ejection pattern to be determined is an ejection pattern for which crosstalk correction has already been performed (if it is an already appeared ejection pattern in the droplet pattern 38) (step S41: Yes), the control device 800 executes step S46. If the ejection pattern to be determined is an ejection pattern for which crosstalk correction has not been performed (if it is an ejection pattern that has appeared for the first time in the droplet pattern 38) (step S41: No), the control device 800 executes step S42.

[0059] In step S42, the control device 800 stores the information of the ejection pattern to be determined (information such as the presence or absence of ejection for each nozzle 37 and control values) in the storage device 802.

[0060] In step S43, the control device 800 sets the count of the number of appearances of the ejection pattern to be determined to 1.

[0061] In step S44, the control device 800 calculates correction information for crosstalk correction of the control values of each nozzle 37 for forming the ejection pattern to be determined based on the information of the ejection pattern stored in step S42 (for example, Equation 1 in FIG. 5).

[0062] In step S45, the control device 800 calculates ejection information, which is information on the control values of each nozzle 37 for forming the ejection pattern to be determined. The control device 800 calculates the ejection information by correcting the default control value corresponding to the ejection pattern to be determined using the correction information calculated in step S44.

[0063] In step S46, the control device 800 adds 1 to the count of the number of occurrences of the ejection pattern to be determined.

[0064] In step S47, the control device 800 determines whether crosstalk correction has been performed for all the ejection patterns constituting the droplet pattern 38. When crosstalk correction has been completed for all the ejection patterns constituting the droplet pattern 38 (step S47: Yes) , the control device 800 executes step S48. On the other hand, when there are remaining ejection patterns for which crosstalk correction has not been performed (step S47: No), the control device 800 returns to step S41.

[0065] In step S48, the control device 800 determines whether there is an area in the storage device 802 for storing the ejection information for all the ejection patterns constituting the droplet pattern 38. When there is an area capable of storing all the ejection information (step S48: Yes), the control device 800 executes step S51, and when there is no area capable of storing all the ejection information (step S48: No), the control device 800 executes step S49.

[0066] In step S49, the control device 800 searches for the ejection pattern with the least number of occurrences in the droplet pattern 38 among the plurality of ejection patterns constituting the droplet pattern 38.

[0067] In step S50, the control device 800 searches for the ejection pattern with the highest number of occurrences in the droplet pattern 38 among the plurality of ejection patterns that make up the droplet pattern 38. Then, the ejection pattern with the lowest number of occurrences in the droplet pattern 38 is replaced with the ejection pattern with the highest number of occurrences. Subsequently, the control device 800 executes step S48 again.

[0068] In step S51, the control device 800 transfers the ejection information to the liquid ejection device 16.

[0069] When the above processing is applied to the droplet pattern 38 shown in Fig. 3(B), the ejection pattern with the lowest number of occurrences is the ejection pattern 45 with 1 occurrence, and the ejection pattern with the highest number of occurrences is the ejection pattern 41 with 5 occurrences. Therefore, the ejection pattern 45 is replaced with the ejection pattern 41, and the modified droplet pattern 381 becomes as shown in Fig. 11. As a result, the ejection information to be stored in the storage device 802 is for 5 types, namely the ejection patterns 41, 42, 43, 44, and 46. Thus, the storage area required to store the ejection information in the storage device 802 can be reduced. Also, since the data amount of the ejection information to be transferred to the liquid ejection device 16 is reduced, the time required for data transfer can be reduced, and the throughput of the liquid ejection device 16 is improved.

[0070] Note that in the above flowchart, an example of replacing the ejection pattern is shown when there is no storage area capable of storing all the ejection information in the storage device 802 (step S48), but this process may be omitted. That is, even if there is a storage area capable of storing all the ejection information in the storage device 802, the ejection information may be transferred to the liquid ejection device 16 after replacing the ejection pattern with the lowest number of occurrences with the ejection pattern with the highest number of occurrences. As a result, since the data amount of the ejection information is reduced, the effect of improving the throughput of the liquid ejection device 16 can be obtained.

[0071] In the above flowchart, an example of replacement processing for one type of ejection pattern was shown. However, the number of types of ejection patterns to be replaced may be plural. For example, if the storage area is still insufficient even after performing the process of replacing the ejection pattern with the least number of occurrences with the ejection pattern with the most number of occurrences once, steps S49 and S50 may be executed again for the changed droplet pattern 381. In the case of the changed droplet pattern 381 shown in FIG. 11, the ejection patterns 43, 44, and 46 are the ejection patterns with the least number of occurrences, and the ejection pattern 41 is the ejection pattern with the most number of occurrences. Therefore, any one of the ejection patterns 43, 44, and 46 may be replaced with the ejection pattern 41. For example, the changed droplet pattern 381 when the ejection pattern 43 is replaced with the ejection pattern 41 is as shown in FIG. 12. In this case, in the original droplet pattern 38, the ejection pattern with the least number of occurrences and the ejection pattern with the second least number of occurrences are replaced with the ejection pattern with the most number of occurrences.

[0072] Also, in this case as well, the ejection pattern may be replaced regardless of whether the storage area of the storage device 802 is insufficient.

[0073] Also, all ejection patterns other than the ejection pattern with the most number of occurrences among the plurality of ejection patterns constituting the droplet pattern 38 may be replaced with the ejection pattern with the most number of occurrences. Thereby, while suppressing the difference between the changed droplet pattern due to the replacement of the ejection pattern and the original droplet pattern, the storage area required for storing the ejection information in the storage device 802 can be minimized.

[0074] (Example 2) In Example 2, an example in which the ejection patterns located at the ends of the ejection area 36 of the substrate 6 among the plurality of ejection patterns constituting the droplet pattern 38 are not subject to replacement will be described. That is, among the ejection patterns other than the ejection patterns located at the ends of the ejection area 36 of the substrate 6, the ejection pattern with the least number of occurrences in the droplet pattern 38 is replaced with the ejection pattern with the most number of occurrences.

[0075] The droplet pattern is determined so that the density of the concavo-convex pattern of the mold 9 and the imprint material do not ooze out from the mesa. Specifically, the edge portion of the mesa is set with a discharge pattern such that bleeding is unlikely to occur even when a landing error occurs. Therefore, if the discharge pattern of the edge portion of the mesa is replaced with another discharge pattern, unintended bleeding may occur. Therefore, among the droplet patterns, the discharge patterns located at the ends of the discharge region 36 (the discharge patterns at the start and end positions of the discharge process) are not subject to replacement with other discharge patterns.

[0076] FIG. 6 is a flowchart showing the crosstalk correction process of the second embodiment. The process of this flowchart is executed by the control device 800.

[0077] In steps S61 to S69, the control device 800 counts the number of appearances, corrects the crosstalk of the control value, and sets a non-replaceable flag for each discharge pattern constituting the droplet pattern formed in the discharge region 36.

[0078] First, in step S61, the control device 800 determines whether the discharge pattern to be determined is a discharge pattern located at the end of the discharge region 36. If the discharge pattern to be determined is located at the end of the discharge region 36 (when it is at the start and end positions of the discharge process) (step S61: Yes), the control device 800 executes step S62, and in other cases (step S61: No), step S63 is executed.

[0079] In step S62, the control device 800 sets the non-replaceable flag indicating that the discharge pattern to be determined is not subject to replacement with other discharge patterns to ON. The default of the non-replaceable flag is OFF, and for discharge patterns other than those for which the non-replaceable flag is set to ON, it is assumed that the non-replaceable flag is set to OFF.

[0080] The processes of step S63 to step S70 are the same as those of step S41 to step S48 in the first embodiment, and thus detailed description thereof will be omitted. In the second embodiment, when it is determined in step S70 that there is an area capable of storing all ejection information (step S70: Yes), the control device 800 executes step S73. On the other hand, when it is determined that there is no area capable of storing all ejection information (step S70: No), the control device 800 executes step S71.

[0081] In step S71, the control device 800 searches for the ejection pattern with the least number of appearances in the droplet pattern among the ejection patterns with the non-replaceable flag OFF that constitute the droplet pattern.

[0082] In step S72, the control device 800 searches for the ejection pattern with the most number of appearances in the droplet pattern among the plurality of ejection patterns that constitute the droplet pattern. Then, the ejection pattern with the least number of appearances among the ejection patterns with the non-replaceable flag OFF that constitute the droplet pattern is replaced with the ejection pattern with the most number of appearances. Subsequently, the control device 800 executes step S70 again.

[0083] In step S73, the control device 800 transfers the ejection information to the liquid ejection device 16.

[0084] The case where the above processing is applied to the droplet pattern 383 shown in FIG. 13 will be described. In the droplet pattern 383, the ejection pattern 45 located at one end of the ejection region 36 (at the start position of the ejection process) and the ejection pattern 46 located at the other end of the ejection region 36 (at the end position of the ejection process) have the non-replaceable flag set to ON. Therefore, in step S72, any one of the ejection patterns 43 and 44 with the minimum number of appearances among the ejection patterns 41, 42, 43, and 44 with the non-replaceable flag OFF is replaced with the ejection pattern 41 with the maximum number of appearances. As a result, similar to Example 1, the storage area required for storing the ejection information in the storage device 802 can be reduced. In addition, since the data amount of the ejection information to be transferred to the liquid ejection device 16 is reduced, the time required for data transfer can be reduced, and the throughput of the liquid ejection device 16 is improved. Further, in Example 2, since the ejection pattern located at the end of the ejection region 36 cannot be replaced, it is possible to suppress the occurrence of unintended liquid seepage from the mesa.

[0085] (Example 3) In Example 3, among the plurality of ejection patterns constituting the droplet pattern 38, the ejection pattern with the least number of appearances in the droplet pattern 38 is replaced with the ejection pattern closest to the number of ejection nozzles among the ejection patterns.

[0086] In replacing the ejection pattern to be replaced (the ejection pattern with the minimum number of appearances) with another ejection pattern, since the ejection pattern closest to the number of ejection nozzles of the ejection pattern to be replaced is used, the deviation from the original droplet pattern can be reduced.

[0087] FIG. 7 is a flowchart showing the crosstalk correction process of Example 3. The process of this flowchart is executed by the control device 800.

[0088] The processes of steps S81 to S89 and step S91 are the same as the processes of steps S41 to S49 and step S51 of Example 1, so detailed description thereof will be omitted.

[0089] In step S90, the control device 800 searches for a discharge pattern with the minimum number of occurrences in the droplet pattern 38 among the plurality of discharge patterns constituting the droplet pattern 38 and a discharge pattern whose number of discharge nozzles is closest to the number of discharge nozzles (hereinafter also referred to as an approximate pattern). Then, the discharge pattern with the minimum number of occurrences in the droplet pattern 38 is replaced with the approximate pattern. Subsequently, the control device 800 executes step S88 again.

[0090] When the above processing is applied to the droplet pattern 38 shown in FIG. 3(B), the discharge pattern with the minimum number of occurrences is the discharge pattern 45 with 1 occurrence, and the number of discharge nozzles of the discharge pattern 45 is 6 pieces. The number of discharge nozzles of the other discharge patterns 41, 42, 43, 44, and 46 are 19, 11, 16, 10, and 12, respectively. Therefore, the approximate pattern of the discharge pattern 45 with the minimum number of occurrences is the discharge pattern 44, and in step S90, the discharge pattern 45 in the droplet pattern 38 is replaced with the discharge pattern 44. Thus, similar to the first embodiment, the storage area required for storing the discharge information in the storage device 802 can be reduced. In addition, since the data amount of the discharge information to be transferred to the liquid discharge device 16 is reduced, the time required for data transfer can be reduced, and the throughput of the liquid discharge device 16 is improved. Further, in the third embodiment, since the discharge pattern to be replaced is replaced with an approximate pattern having a close number of discharge nozzles, the deviation of the droplet pattern actually formed in the discharge area 36 from the original droplet pattern can be suppressed.

[0091] The method of replacing the discharge pattern is not limited to the methods exemplified in the above embodiments. For example, a discharge pattern that forms at least a part of a region with a low droplet density in the droplet pattern can be replaced with a discharge pattern that forms at least a part of a region with a high droplet density. Also, in the droplet pattern, a discharge pattern that constitutes a region with low importance can be replaced with a discharge pattern that constitutes a region with high importance. The number of occurrences and droplet density in the droplet pattern described above can be regarded as an example of an index of importance.

[0092] (Other Embodiments) The present invention can also be implemented by supplying a program that realizes one or more functions of the above-described embodiments to a system or device via a network or a storage medium, and causing one or more processors in a computer of the system or device to read and execute the program. It can also be implemented by a circuit (for example, an ASIC) that realizes one or more functions.

[0093] The disclosure of this embodiment includes the following configurations. (Configuration 1) A liquid ejection head having a plurality of nozzles for ejecting a liquid, A plurality of driving means for generating energy for ejecting the liquid from each of the plurality of nozzles, A liquid ejection method by a liquid ejection device that has the above and ejects a liquid onto a substrate, A ejection step of forming, on the substrate, an ejection pattern composed of one or a plurality of droplets arranged in a direction in which the plurality of nozzles are arranged by ejecting the liquid from the liquid ejection head onto the substrate; A correction step of correcting a control value of the driving means for each of ejection nozzles that eject in accordance with the ejection pattern in the ejection step among the plurality of nozzles, based on a relationship with other ejection nozzles in the ejection step; A step of forming, within a predetermined ejection region on the substrate, a droplet pattern composed of a plurality of the ejection patterns arranged in a direction of the relative movement, by performing the ejection step a plurality of times using the control value corrected by the correction step while relatively moving the liquid ejection head and the substrate; having In the ejection step for forming the first ejection pattern among the plurality of ejection patterns constituting the droplet pattern on the substrate, instead of the first ejection pattern, a second ejection pattern different from the first ejection pattern among the plurality of ejection patterns constituting the droplet pattern is formed on the substrate. A liquid ejection method characterized by this. (Configuration 2) The liquid discharge method according to Configuration 1, wherein the control value is a control value related to the discharge amount and discharge timing of each nozzle. (Configuration 3) The first discharge pattern is the discharge pattern that appears the fewest number of times among the plurality of discharge patterns constituting the droplet pattern in the liquid discharge method according to Configuration 1 or 2. (Configuration 4) The second discharge pattern is the discharge pattern that appears the most number of times among the plurality of discharge patterns constituting the droplet pattern in the liquid discharge method according to Configuration 1 or 2. (Configuration 5) The first discharge pattern is a discharge pattern other than the discharge pattern located at the end of the discharge region of the substrate among the plurality of discharge patterns constituting the droplet pattern in the liquid discharge method according to any one of Configurations 1 to 4. (Configuration 6) The second discharge pattern is the discharge pattern that is closest to the first discharge pattern in terms of the number of nozzles that discharge among the plurality of discharge patterns constituting the droplet pattern in the liquid discharge method according to Configuration 1 or 2. (Configuration 7) The liquid discharge method further includes a storage step of storing information on the control value corrected in the correction step in a storage means of the liquid discharge device. In the discharge step, the plurality of nozzles are driven using the control value acquired from the storage means. In the storage step, the liquid discharge method according to any one of Configurations 1 to 6 does not store information on the control value corresponding to the first discharge pattern in the storage means. (Configuration 8) The liquid discharge method further includes a storage step of storing correction information used for correcting the control value in a storage means of the liquid discharge device in the correction step. In the correction step, the control value is corrected using the correction information acquired from the storage means. In the storage step, the liquid discharge method according to any one of Configurations 1 to 6 does not store correction information used for correcting the control value corresponding to the first discharge pattern in the storage means. (Configuration 9) A liquid ejection head having a plurality of nozzles for ejecting a liquid, A plurality of driving means for generating energy for ejecting the liquid from each of the plurality of nozzles, and a liquid ejection method by a liquid ejection apparatus that has the above and ejects the liquid onto a substrate, A discharging step of forming a discharge pattern composed of one or a plurality of droplets arranged in the direction in which the plurality of nozzles are arranged on the substrate by discharging the liquid from the liquid ejection head onto the substrate; A correction step of correcting a control value of the driving means for each of the discharge nozzles that are the nozzles that perform discharge according to the discharge pattern in the discharge step among the plurality of nozzles based on the relationship with other discharge nozzles in the discharge step; A step of forming a droplet pattern composed of a plurality of the discharge patterns arranged in the direction of the relative movement within a predetermined discharge region on the substrate by performing the discharge step a plurality of times using the control value corrected by the correction step while relatively moving the liquid ejection head and the substrate; and having, In the discharge step for forming a part of the plurality of discharge patterns constituting the droplet pattern on the substrate, instead of the part of the discharge pattern, a discharge pattern different from the part of the discharge patterns among the plurality of discharge patterns constituting the droplet pattern is formed on the substrate. A liquid ejection method characterized by this. (Configuration 10) The part of the discharge pattern is the plurality of discharge patterns among the plurality of discharge patterns constituting the droplet pattern, The liquid ejection method according to Configuration 9 including a plurality of types of discharge patterns. (Configuration 11) A liquid ejection head having a plurality of nozzles for ejecting a liquid, A plurality of driving means for generating energy for ejecting the liquid from each of the plurality of nozzles, Moving means for relatively moving the liquid ejection head with respect to a substrate that is an object for ejecting the liquid, Control means, A liquid ejection device having wherein the control means By ejecting liquid from the liquid ejection head onto the substrate, a discharge pattern composed of one or a plurality of droplets arranged in the direction in which the plurality of nozzles are arranged is formed on the substrate; a discharge step A correction step of correcting the control value of the driving means for each of the discharge nozzles that discharge according to the discharge pattern in the discharge step among the plurality of nozzles, based on the relationship with other discharge nozzles in the discharge step While relatively moving the liquid ejection head and the substrate, the discharge step is performed a plurality of times using the control value corrected by the correction step, so that a droplet pattern composed of a plurality of the discharge patterns arranged in the direction of the relative movement is formed within a predetermined discharge area on the substrate; a step is executable, In the discharge step for forming the first discharge pattern among the plurality of discharge patterns constituting the droplet pattern on the substrate, instead of the first discharge pattern, a second discharge pattern different from the first discharge pattern among the plurality of discharge patterns constituting the droplet pattern is formed on the substrate. A liquid ejection device characterized by this. (Configuration 12) A liquid ejection head having a plurality of nozzles for ejecting liquid, A plurality of driving means for generating energy for ejecting liquid from each of the plurality of nozzles, Moving means for relatively moving the liquid ejection head with respect to a substrate that is an object for ejecting liquid, Control means, A liquid ejection device having wherein the control means By ejecting liquid from the liquid ejection head onto the substrate, a discharge pattern composed of one or a plurality of droplets arranged in the direction in which the plurality of nozzles are arranged is formed on the substrate; a discharge step A correction step of correcting a control value of the driving means for each of the ejection nozzles that eject according to the ejection pattern in the ejection step among the plurality of nozzles, based on the relationship with other ejection nozzles in the ejection step; A step of forming a droplet pattern composed of a plurality of the ejection patterns arranged in the direction of the relative movement within a predetermined ejection region on the substrate, by performing the ejection step a plurality of times using the control value corrected by the correction step while relatively moving the liquid ejection head and the substrate; having In the ejection step for forming a part of the plurality of ejection patterns constituting the droplet pattern on the substrate, instead of the part of the ejection patterns, a liquid ejection device characterized in that an ejection pattern different from the part of the ejection patterns among the plurality of ejection patterns constituting the droplet pattern is formed on the substrate. (Configuration 13) A step of forming the droplet pattern on the substrate by the liquid ejection method according to any one of Configurations 1 to 10; A step of pressing the surface on which the concavo-convex pattern of the mold having the concavo-convex pattern is formed against the surface of the substrate on which the droplet pattern is formed; A step of curing the liquid in a state where the mold is pressed against the substrate; A step of peeling the mold from the substrate; An imprint method having (Configuration 14) The liquid ejection device according to Configuration 11 or 12; A mold having a concavo-convex pattern; Pressing means for pressing the surface on which the concavo-convex pattern of the mold is formed against the surface of the substrate on which the droplet pattern is formed by the liquid ejection device; Curing means for curing the liquid in a state where the mold is pressed against the substrate; Peeling means for peeling the mold from the substrate; An imprint device having

Explanation of Reference Numerals

[0094] 6: Substrate, 16: Liquid ejection device, 21, 22, 23, 24, 25, 26: Nozzles, 36: Ejection area, 37: Nozzle, 38: Droplet pattern, 41, 42, 43, 44, 45, 46: Ejection pattern, 108: Piezoelectric element, 205: Liquid ejection head, 800: Control device

Claims

1. A liquid ejection head having a plurality of nozzles for ejecting a liquid, a plurality of driving means for generating energy for ejecting the liquid from each of the plurality of nozzles, and a liquid ejection method by a liquid ejection apparatus for ejecting a liquid onto a substrate, comprising: a ejection step of forming, on the substrate, an ejection pattern composed of one or a plurality of droplets arranged in a direction in which the plurality of nozzles are arranged, by ejecting the liquid from the liquid ejection head onto the substrate; a correction step of correcting a control value of the driving means for each of ejection nozzles that eject in accordance with the ejection pattern in the ejection step, based on a relationship with other ejection nozzles in the ejection step; a step of forming, within a predetermined ejection region on the substrate, a droplet pattern composed of a plurality of the ejection patterns arranged in a direction of the relative movement, by performing the ejection step a plurality of times using the control value corrected by the correcting while relatively moving the liquid ejection head and the substrate; and in the ejection step for forming the first ejection pattern among the plurality of ejection patterns constituting the droplet pattern on the substrate, instead of the first ejection pattern, forming on the substrate a second ejection pattern different from the first ejection pattern among the plurality of ejection patterns constituting the droplet pattern. A liquid ejection method characterized by this.

2. The liquid ejection method according to claim 1, wherein the control value is a control value related to an ejection amount and an ejection timing of each nozzle.

3. The liquid ejection method according to claim 1 or 2, wherein the first ejection pattern is an ejection pattern having the smallest number of appearances in the droplet pattern among the plurality of ejection patterns constituting the droplet pattern.

4. The liquid ejection method according to claim 1 or 2, wherein the second ejection pattern is an ejection pattern having the largest number of appearances in the droplet pattern among the plurality of ejection patterns constituting the droplet pattern.

5. The liquid ejection method according to claim 1 or 2, wherein the first ejection pattern is an ejection pattern other than an ejection pattern located at an end of the ejection region of the substrate among the plurality of ejection patterns constituting the droplet pattern.

6. The liquid ejection method according to claim 1 or 2, wherein the second ejection pattern is an ejection pattern having the closest number of nozzles to be ejected to the first ejection pattern among a plurality of ejection patterns constituting the droplet pattern.

7. Further comprising a step of storing information on the control value corrected in the correcting step in a storage means of the liquid ejection apparatus, In the ejection step, the plurality of nozzles are driven using the control value acquired from the storage means, The liquid ejection method according to claim 1 or 2, wherein in the storing step, information on the control value corresponding to the first ejection pattern is not stored in the storage means.

8. Further comprising a step of storing correction information used for correcting the control value in a storage means of the liquid ejection apparatus in the correcting step, In the correcting step, the control value is corrected using the correction information acquired from the storage means, The liquid ejection method according to claim 1 or 2, wherein in the storing step, correction information used for correcting the control value corresponding to the first ejection pattern is not stored in the storage means.

9. A liquid ejection head having a plurality of nozzles for ejecting a liquid, A plurality of driving means for generating energy for ejecting the liquid from each of the plurality of nozzles, A liquid ejection method by a liquid ejection apparatus for ejecting a liquid onto a substrate, comprising: An ejection step of forming an ejection pattern constituted by one or a plurality of droplets arranged in a direction in which the plurality of nozzles are arranged on the substrate by ejecting the liquid from the liquid ejection head onto the substrate; A step of correcting a control value of the driving means for each of ejection nozzles, which are the nozzles that eject in accordance with the ejection pattern in the ejection step among the plurality of nozzles, based on a relationship with other ejection nozzles in the ejection step; A step of forming a droplet pattern constituted by a plurality of the ejection patterns arranged in the direction of the relative movement within a predetermined ejection region on the substrate by performing the ejection step a plurality of times using the control value corrected by the correcting step while relatively moving the liquid ejection head and the substrate; Comprising In the discharging step for forming, on the substrate, some of the plurality of discharging patterns that constitute the droplet pattern, instead of the some of the discharging patterns, a discharging pattern different from the some of the discharging patterns among the plurality of discharging patterns that constitute the droplet pattern is formed on the substrate. A liquid discharging method characterized by this.

10. The liquid discharging method according to claim 9, wherein the some of the discharging patterns include a plurality of types of discharging patterns among the plurality of discharging patterns that constitute the droplet pattern.

11. A liquid discharging head having a plurality of nozzles for discharging a liquid, A plurality of driving means for generating energy for discharging the liquid from each of the plurality of nozzles, Moving means for relatively moving the liquid discharging head with respect to a substrate that is an object for discharging the liquid, Control means, A liquid discharging device having: The control means: A discharging step of forming, on the substrate, a discharging pattern constituted by one or a plurality of droplets arranged in a direction in which the plurality of nozzles are arranged by discharging the liquid from the liquid discharging head onto the substrate; A step of correcting a control value of the driving means for each of discharging nozzles, which are nozzles that discharge according to the discharging pattern in the discharging step among the plurality of nozzles, based on a relationship with other discharging nozzles in the discharging step; A step of forming, within a predetermined discharging region on the substrate, a droplet pattern constituted by a plurality of the discharging patterns arranged in the direction of the relative movement by performing the discharging step a plurality of times using the control value corrected by the correcting step while relatively moving the liquid discharging head and the substrate; executes, In the discharging step for forming, on the substrate, a first discharging pattern among the plurality of discharging patterns that constitute the droplet pattern, instead of the first discharging pattern, a second discharging pattern different from the first discharging pattern among the plurality of discharging patterns that constitute the droplet pattern is formed on the substrate. A liquid discharging device characterized by this.

12. A liquid discharging head having a plurality of nozzles for discharging a liquid, A plurality of driving means for generating energy for discharging the liquid from each of the plurality of nozzles, Moving means for relatively moving the liquid discharging head with respect to a substrate that is an object for discharging the liquid, Control means, A liquid discharging device having: The control means: A discharging step of forming, on the substrate, a discharge pattern composed of one or a plurality of droplets arranged in the direction in which the plurality of nozzles are arranged by discharging a liquid from the liquid discharge head onto the substrate; A step of correcting control values of the driving means for each of the discharge nozzles that discharge according to the discharge pattern in the discharging step among the plurality of nozzles, based on the relationship with other discharge nozzles in the discharging step; A step of forming, within a predetermined discharge region on the substrate, a droplet pattern composed of a plurality of the discharge patterns arranged in the direction of the relative movement, by performing the discharging step a plurality of times using the control values corrected in the correcting step while relatively moving the liquid discharge head and the substrate; Execute, In the discharging step for forming, on the substrate, some of the plurality of discharge patterns constituting the droplet pattern, instead of the some of the discharge patterns, a different discharge pattern from the some of the discharge patterns among the plurality of discharge patterns constituting the droplet pattern is formed on the substrate. A liquid discharge device characterized by this.

13. A step of forming the droplet pattern on the substrate by the liquid discharge method according to Claim 1 or 2; A step of pressing the surface on which the concavo-convex pattern of the mold having the concavo-convex pattern is formed against the surface of the substrate on which the droplet pattern is formed; A step of curing the liquid in a state where the mold is pressed against the substrate; A step of peeling the mold from the substrate; An imprint method having these.

14. The liquid discharge device according to Claim 11 or 12; A mold having a concavo-convex pattern; Pressing means for pressing the surface on which the concavo-convex pattern of the mold is formed against the surface of the substrate on which the droplet pattern is formed by the liquid discharge device; Curing means for curing the liquid in a state where the mold is pressed against the substrate; Peeling means for peeling the mold from the substrate; An imprint device having these.

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