Substrate processing apparatus and substrate processing method

Abstract

To describe a substrate processing apparatus and a substrate processing method capable of suppressing adhesion of foreign material (e.g., particles) to a substrate.SOLUTION: A substrate processing apparatus comprises: a holding unit configured to hold a substrate; a supply unit that includes a nozzle configured to supply processing liquid to a surface of the substrate held by the holding unit; a liquid receiving unit that includes an opening that is open upward so as to receive processing liquid dummy-ejected from the nozzle; a first driving unit configured to move the nozzle between above the substrate held by the holding unit and outside of the substrate held by the holding unit; and a second driving unit configured to move the liquid receiving unit between above the substrate held by the holding unit and the outside of the substrate held by the holding unit.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method.

Background Art

[0002] Patent Document 1 discloses a liquid processing method in which, when not processing, a processing liquid is not supplied from a nozzle to a substrate, the nozzle is positioned in a nozzle bath, and the processing liquid is dummy-dispensed from the nozzle to the nozzle bath.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure describes a substrate processing apparatus and a substrate processing method capable of suppressing the adhesion of foreign substances (for example, particles, etc.) to a substrate.

Means for Solving the Problems

[0005] An example of a substrate processing apparatus includes a holding unit configured to hold a substrate, a supply unit including a nozzle configured to supply a processing liquid to the surface of the substrate held by the holding unit, a liquid receiving unit including an opening that is open upward to receive the processing liquid dummy-discharged from the nozzle, a first driving unit configured to move the nozzle between above the substrate held by the holding unit and outside the substrate held by the holding unit, and a second driving unit configured to move the liquid receiving unit between above the substrate held by the holding unit and outside the substrate held by the holding unit.

Effects of the Invention

[0006] According to the substrate processing apparatus and substrate processing method according to the present disclosure, it is possible to suppress the adhesion of foreign substances (for example, particles, etc.) to the substrate.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

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Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

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Figure 15

Best Mode for Carrying Out the Invention

[0008] In the following description, the same reference numerals will be used for the same elements or elements having the same function, and redundant descriptions will be omitted. In this specification, when referring to the top, bottom, right, and left of a figure, the orientation of the reference numerals in the figure shall be the reference.

[0009] [Substrate Processing System] First, with reference to FIG. 1, a substrate processing system 1 configured to process a substrate W will be described. The substrate processing system 1 includes a loading / unloading station 2, a processing station 3, and a controller Ctr (control unit). The loading / unloading station 2 and the processing station 3 may be arranged in a line, for example, in the horizontal direction.

[0010] The substrate W may have a disk shape, or may have a plate shape other than circular, such as a polygon. The substrate W may have a cutout portion where a part is cut out. The cutout portion may be, for example, a notch (a groove such as a U-shape or a V-shape), or a linear portion (so-called orientation flat) extending linearly. The substrate W may be, for example, a semiconductor substrate (silicon wafer), a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, or other various substrates. The diameter of the substrate W may be, for example, about 200 mm to 450 mm.

[0011] The loading / unloading station 2 includes a placement unit 4, a loading / unloading unit 5, and a shelf unit 6. The placement unit 4 includes a plurality of placement tables (not shown) arranged in the width direction (the vertical direction in FIG. 1). Each placement table is configured to be able to place a carrier 7. The carrier 7 is configured to accommodate at least one substrate W in a sealed state. The carrier 7 includes an opening / closing door (not shown) for taking in and out the substrate W.

[0012] The loading / unloading unit 5 is arranged adjacent to the placement unit 4 in the direction in which the loading / unloading station 2 and the processing station 3 are aligned (the left - right direction in FIG. 1). The loading / unloading unit 5 includes an opening / closing door (not shown) provided for the placement unit 4. With the carrier 7 placed on the placement unit 4, when both the opening / closing door of the carrier 7 and the opening / closing door of the loading / unloading unit 5 are opened, the inside of the loading / unloading unit 5 and the inside of the carrier 7 communicate with each other.

[0013] The loading / unloading unit 5 incorporates a transfer arm A1 and a shelf unit 6. The transfer arm A1 is configured to be capable of horizontal movement in the width direction of the loading / unloading unit 5, vertical movement in the vertical direction, and swivel movement around the vertical axis. The transfer arm A1 is configured to take out the substrate W from the carrier 7 and deliver it to the shelf unit 6, and also to receive the substrate W from the shelf unit 6 and return it into the carrier 7. The shelf unit 6 is located near the processing station 3 and is configured to accommodate the substrate W.

[0014] The processing station 3 includes a transfer unit 8 and a processing liquid supply device 10 (substrate processing device). The transfer unit 8 extends horizontally, for example, in the direction in which the loading / unloading station 2 and the processing station 3 are aligned (the left - right direction in FIG. 1). The transfer unit 8 incorporates a transfer arm A2 (transfer unit). The transfer arm A2 is configured to be capable of horizontal movement in the longitudinal direction of the transfer unit 8, vertical movement in the vertical direction, and swivel movement around the vertical axis. The transfer arm A2 is configured to take out the substrate W from the shelf unit 6 and deliver it to the liquid processing unit U, and also to receive the substrate W from the liquid processing unit U and return it into the shelf unit 6.

[0015] The processing liquid supply device 10 includes a plurality of liquid processing units U (processing parts). The processing liquid supply device 10 supplies the processing liquid L to the plurality of liquid processing units U and is configured to perform predetermined processing (for example, removal processing of dirt and foreign substances, etching processing, cleaning processing, etc.) on the substrate W in each liquid processing unit U. The plurality of liquid processing units U are arranged in a row along the longitudinal direction (the left - right direction in FIG. 1) on each of both sides of the transfer unit 8.

[0016] The controller Ctr is configured to control the substrate processing system 1 partially or entirely.

[0017] [Processing liquid supply device] Subsequently, with reference to FIGS. 2 and 3, the processing liquid supply device 10 will be described in detail. The processing liquid supply device 10 (supply unit) includes a plurality of liquid processing units U (supply units) and a liquid supply unit 11 (supply unit).

[0018] The liquid processing unit U is configured to discharge the processing liquid L onto the substrate W to process the substrate W. As illustrated in FIGS. 2 and 3, the liquid processing unit U includes a chamber U1, a rotation holding unit U2 (holding unit), a nozzle N, an arm unit Am1, a driving unit MT1 (first driving unit), a liquid receiving unit 100, an arm unit Am2, and a driving unit MT2.

[0019] The chamber U1 is a housing configured to be able to carry in and out the substrate W therein. An inlet / outlet (not shown) is formed in the side wall of the chamber U1. The substrate W is carried into the chamber U1 through the inlet / outlet by the transfer arm A2 and is carried out from the chamber U1 to the outside.

[0020] The rotation holding unit U2 may be configured to operate based on an operation signal from the controller Ctr and rotate the substrate W around a rotation center axis perpendicular to the surface of the substrate W with the posture of the substrate W being substantially horizontal.

[0021] The nozzle N is disposed within the liquid processing unit U. The nozzle N may be disposed above the substrate W such that the discharge port faces downward.

[0022] As illustrated in FIGS. 2 and 3, the arm unit Am1 is configured to hold the nozzle N. The tip of the arm unit Am1 is connected to the nozzle N. The arm unit Am1 may extend linearly along the horizontal direction.

[0023] The drive unit MT1 operates based on the operation signal from the controller Ctr and is configured to drive the nozzle N together with the arm unit Am1. The drive unit MT1 may be configured to horizontally move the nozzle N, for example, between above the substrate W held by the rotation holding unit U2 and outside the substrate W held by the rotation holding unit U2 (outside the outer peripheral edge of the substrate W) (see arrow Ar1 in FIG. 3). The drive unit MT1 may be an actuator such as an electric motor, for example.

[0024] The liquid receiving unit 100 is configured to receive the processing liquid L discharged as a dummy from the nozzle N through an opening 111 (described later). Here, dummy discharge means discharging the processing liquid L from the nozzle N for the purpose of simply discarding it, not for the purpose of supplying it to the surface of the substrate W.

[0025] The liquid receiving unit 100 includes a main body unit 110. The main body unit 110 may have a cylindrical shape as a whole, as illustrated in FIG. 3. Therefore, the main body unit 110 may include an opening 111 opened upward and a discharge port 112 provided below the main body unit 110. The opening 111 and the discharge port 112 communicate with each other in the main body unit 110, for example, extending in the vertical direction. The inner peripheral surface 113 of the main body unit 110 connecting the opening 111 and the discharge port 112 may have a shape that narrows downward (for example, a conical surface), as illustrated in FIG. 3.

[0026] As illustrated in FIGS. 2 and 3, the arm unit Am2 is configured to hold the main body unit 110 from below. The tip of the arm unit Am2 is connected to the main body unit 110. The arm unit Am2 may extend linearly along the horizontal direction. Inside the arm unit Am2, a pipe D4 is arranged, as illustrated in FIG. 3. The pipe D4 is fluidly connected to the discharge port 112 of the main body unit 110 and constitutes a flow path through which the processing liquid L discharged as a dummy into the main body unit 110 flows.

[0027] The drive unit MT2 operates based on the operation signal from the controller Ctr and is configured to drive the main body 110 together with the arm unit Am2. The drive unit MT2 may be configured to horizontally move the main body 110, for example, between above the substrate W held by the rotation holding unit U2 and outside the substrate W held by the rotation holding unit U2 (outside the outer peripheral edge of the substrate W) (see arrow Ar2 in FIG. 3). The drive unit MT2 may be an actuator such as an electric motor, for example.

[0028] The liquid supply unit 11 is configured to supply the processing liquid L to the surface of the substrate W. As illustrated in FIG. 2, the processing liquid supply unit 11 includes a supply unit 20, a storage tank T, pumps P2 and P3, a filter F, a heater H, and pipes D1 to D5.

[0029] The supply unit 20 includes a liquid source 21, a pump P1, a valve V1, and a pipe D1. The liquid source 21 is a supply source of the processing liquid L. The processing liquid L may be, for example, an acid-based chemical solution, an alkali-based chemical solution, or an organic-based chemical solution. The acid-based chemical solution may include, for example, SC-2 solution (a mixed solution of hydrochloric acid, hydrogen peroxide, and pure water), SPM (a mixed solution of sulfuric acid and hydrogen peroxide solution), HF solution (hydrofluoric acid), DHF solution (dilute hydrofluoric acid), HNO3+HF solution (a mixed solution of nitric acid and hydrofluoric acid), etc. The alkali-based chemical solution may include, for example, SC-1 solution (a mixed solution of ammonia, hydrogen peroxide, and pure water), hydrogen peroxide solution, etc.

[0030] The pump P1 operates based on the operation signal from the controller Ctr and is configured to send out the processing liquid L sucked from the liquid source 21 to the storage tank T via the pipe D1 and the valve V1. The valve V1 operates based on the operation signal from the controller Ctr and is configured to transition between an open state that allows the flow of fluid in the pipe D1 and a closed state that prevents the flow of fluid in the pipe D1.

[0031] The pipe D1 connects, in order from the upstream side, the liquid source 21, the pump P1, the valve V1, and the storage tank T. In other words, the upstream end of the pipe D1 is connected to the liquid source 21, and the downstream end of the pipe D1 is connected to the storage tank T. The downstream end of the pipe D1 may be connected to, for example, the top wall of the storage tank T.

[0032] The storage tank T is a supply source of the processing liquid L to the liquid processing unit U and is configured to temporarily store the processing liquid L from the supply unit 20.

[0033] A pipe D2 for discharging the processing liquid L in the storage tank T to the outside is connected to the storage tank T. The upstream end of the pipe D2 may be connected to the bottom wall of the storage tank T. The downstream end of the pipe D2 may be connected to the nozzle N. The pipe D2 is provided with, in order from the upstream side, a valve V2, a pump P2, a filter F, and a heater H.

[0034] The valve V2 operates based on an operation signal from the controller Ctr and is configured to transition between an open state that allows the flow of fluid in the pipe D2 and a closed state that obstructs the flow of fluid in the pipe D2. The pump P2 operates based on an operation signal from the controller Ctr and is configured to send out the processing liquid L sucked from the storage tank T to the downstream side.

[0035] The filter F is configured to collect foreign substances (such as particles, etc.) contained in the processing liquid L flowing through the pipe D2. The heater H operates based on an operation signal from the controller Ctr and is configured to heat the processing liquid L flowing through the pipe D2. By heating the processing liquid L with the heater H, the processing liquid L reaches a temperature suitable for processing the substrate W.

[0036] From between the heater H and the nozzle N in the pipe D2, a pipe D3 branches off. The downstream end of the pipe D3 extends outside the processing liquid supply device 10 and functions as a drainage channel for discharging unnecessary processing liquid L to the outside. A valve V3 is provided in the pipe D3. The valve V3 operates based on an operation signal from the controller Ctr and is configured to transition between an open state that allows the flow of fluid in the pipe D3 and a closed state that obstructs the flow of fluid in the pipe D3. After the processing liquid L is discharged from the nozzle N, the controller Ctr instructs the valve V3 to open the valve V3, thereby performing a process (so-called suck-back) of drawing the processing liquid L deeper than the discharge port of the nozzle N. The processing liquid L drawn in by the suck-back is discarded to the outside through the pipe D3.

[0037] The pipe D4 connects the main body portion 110, the pump P3, and the valve V4 in order from the upstream side. In other words, the upstream end of the pipe D4 is connected to the discharge port 112 of the main body portion 110 as described above, and the downstream end of the pipe D4 is connected to the storage tank T. The downstream end of the pipe D4 may be connected to, for example, the top wall of the storage tank T.

[0038] The pump P3 (suction portion) operates based on an operation signal from the controller Ctr and is configured to suck the processing liquid L dummy-discharged into the main body portion 110 through the pipe D4. The valve V4 operates based on an operation signal from the controller Ctr and is configured to transition between an open state that allows the flow of fluid in the pipe D4 and a closed state that obstructs the flow of fluid in the pipe D4.

[0039] Among the pipes D4, a pipe D5 branches off between the pump P3 and the valve V4. The downstream end of the pipe D5 extends outside the processing liquid supply device 10 and functions as a drainage channel for discharging unnecessary processing liquid L to the outside. A valve V5 is provided in the pipe D5. The valve V5 operates based on an operation signal from the controller Ctr and is configured to transition between an open state that allows the flow of fluid in the pipe D5 and a closed state that obstructs the flow of fluid in the pipe D5. Therefore, when the pump P3 operates with the valve V4 in the open state and the valve V5 in the closed state, the processing liquid L dummy-discharged to the main body 110 is returned to the storage tank T. On the other hand, when the pump P3 operates with the valve V4 in the open state and the valve V5 in the closed state, the processing liquid L dummy-discharged to the main body 110 is discarded to the outside.

[0040] [Details of the Controller] Subsequently, with reference to FIG. 4, the controller Ctr will be described in more detail. The controller Ctr includes, as functional modules, a reading unit M1, a storage unit M2, a processing unit M3, and an instruction unit M4. These functional modules are merely a division of the functions of the controller Ctr into a plurality of modules for convenience, and do not necessarily mean that the hardware constituting the controller Ctr is divided into such modules. Each functional module is not limited to being realized by the execution of a program, and may be realized by a dedicated electric circuit (for example, a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit) integrating the same.

[0041] The reading unit M1 is configured to read a program from a computer-readable recording medium RM. The recording medium RM stores a program for operating each part of the substrate processing system 1. The recording medium RM may be, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or a magneto-optical recording disk. In this specification, each part of the substrate processing system 1 may include, for example, a rotation holding unit U2, pumps P1 to P3, valves V1 to V5, a heater H, driving units MT1 and MT2, etc.

[0042] The storage unit M2 is configured to store various data. The storage unit M2 may store, for example, a program read from the recording medium RM by the reading unit M1, setting parameters (so-called processing recipes) when operating each part of the substrate processing system 1, setting data input from an operator via an external input device (not shown), etc.

[0043] The processing unit M3 is configured to process various data. The processing unit M3 may be configured to generate an operation signal for operating each part of the substrate processing system 1 based on various data stored in the storage unit M2, for example.

[0044] The instruction unit M4 is configured to transmit the operation signal generated by the processing unit M3 to each part of the substrate processing system 1.

[0045] The hardware of the controller Ctr may be constituted by, for example, one or more control computers. As shown in FIG. 5, the controller Ctr may include a circuit Ctr1 as a hardware configuration. The circuit Ctr1 may be constituted by electrical circuitry. The circuit Ctr1 may include, for example, a processor Ctr2, a memory Ctr3, a storage Ctr4, a driver Ctr5, and an input / output port Ctr6.

[0046] Processor Ctr2 may be configured to execute a program in cooperation with at least one of memory Ctr3 and storage Ctr4, and to execute input / output of signals via input / output port Ctr6, so as to realize each of the above-described functional modules. Memory Ctr3 and storage Ctr4 may function as storage unit M2. Driver Ctr5 may be a circuit configured to drive each part of substrate processing system 1. Input / output port Ctr6 may be configured to mediate input / output of signals between driver Ctr5 and each part of substrate processing system 1.

[0047] Substrate processing system 1 may include one controller Ctr, or may include a group of controllers (control unit) composed of a plurality of controllers Ctr. When substrate processing system 1 includes a group of controllers, each of the above-described functional modules may be realized by one controller Ctr, or may be realized by a combination of two or more controllers Ctr. When controller Ctr is composed of a plurality of computers (circuit Ctr1), each of the above-described functional modules may be realized by one computer (circuit Ctr1), or may be realized by a combination of two or more computers (circuit Ctr1). Controller Ctr may have a plurality of processors Ctr2. In this case, each of the above-described functional modules may be realized by one processor Ctr2, or may be realized by a combination of two or more processors Ctr2.

[0048] [Substrate Processing Method] Subsequently, with reference to FIGS. 6 to 8, a method for processing substrate W with processing liquid L will be described. First, controller Ctr controls drive unit MT1. As a result, as illustrated in FIG. 7(a), nozzle N is moved so as to be positioned above substrate W held by rotation holding unit U2 (for example, above the center of substrate W) (see step S1 in FIG. 6 and arrow Ar3 in FIG. 7(a)).

[0049] Next, the controller Ctr controls the drive unit MT2. As a result, as illustrated in FIG. 7(b), the main body 110 is moved so as to be positioned above the substrate W held by the rotation holding unit U2 (for example, above the central portion of the substrate W) (see step S2 in FIG. 6 and arrow Ar4 in FIG. 7(b)). Therefore, in the vertical direction, the nozzle N and the main body 110 overlap each other, that is, the main body 110 is positioned below the nozzle N.

[0050] Next, the controller Ctr controls the pump P2 and the valve V2. As a result, as illustrated in FIG. 7(c), dummy discharge of the processing liquid L is started from the nozzle N toward the main body 110 (see step S3 in FIG. 6). The discharge flow rate of the processing liquid L at this time may be a relatively low flow rate (for example, a flow rate lower than the flow rate when supplying the processing liquid L to the substrate W). The discharge flow rate may be, for example, about 50 ml / min to 1000 ml / min.

[0051] At this time, the controller Ctr also controls the pump P3 and the valve V2. As a result, the processing liquid L dummy-discharged to the main body 110 is discharged to the outside of the processing liquid supply device 10 through the pipes D4 and D5. Depending on the type of the processing liquid L, after a predetermined time has elapsed since the valve V5 was opened, the controller Ctr may control the valves V4 and V5 to open the valve V4 and close the valve V5. In this case, the processing liquid L with relatively low cleanliness at the initial stage of dummy discharge is drained, while the processing liquid L with relatively high cleanliness thereafter is returned to the storage tank T. Therefore, the processing liquid L can be effectively used, and it is possible to improve the productivity of the processing of the substrate W.

[0052] Next, when the controller Ctr determines that the discharge amount from the nozzle N exceeds a predetermined value, the controller Ctr controls the drive unit MT2 while continuing to discharge the processing liquid L from the nozzle N. As a result, as illustrated in FIG. 7(d), the main body 110 is moved so that the nozzle N and the main body 110 do not overlap in the vertical direction (see step S4 in FIG. 6, arrow Ar5 in FIG. 7(d), and arrow Ar6 in FIG. 8(a)). At this time, when the processing liquid L overrides the upper edge of the opening 111 of the main body 110, the discharge destination of the processing liquid L from the nozzle N is switched from the main body 110 to the surface of the substrate W. Note that the moving speed of the main body 110 may be, for example, about 10 cm / sec to 100 cm / sec.

[0053] Next, when the controller Ctr determines that a predetermined time has elapsed since the processing liquid L was discharged onto the surface of the substrate W, the controller Ctr controls the valve V2. As a result, as illustrated in FIG. 8(b), the discharge of the processing liquid L from the nozzle N onto the surface of the substrate W stops (see step S5 in FIG. 6). Thereafter, the controller Ctr controls the valve V3 to open and close the valve V3. As a result, a suck-back process is performed, and the processing liquid L in the nozzle N is drawn deeper than the discharge port of the nozzle N.

[0054] Next, the controller Ctr controls the drive unit MT2. As a result, as illustrated in FIG. 8(c), the main body 110 is moved so as to be positioned above the substrate W held by the rotation holding unit U2 (for example, above the center of the substrate W) (see step S6 in FIG. 6 and arrow Ar7 in FIG. 8(c)). Therefore, in the vertical direction, the nozzle N and the main body 110 overlap, that is, the main body 110 is positioned below the nozzle N.

[0055] Next, the controller Ctr controls the drive units MT1 and MT2 respectively. As a result, as illustrated in FIG. 8(d), the nozzle N and the main body 110 are each moved so that the nozzle N and the main body 110 are positioned outside the substrate W held by the rotation holding unit U2. (Refer to step S7 in FIG. 6 and arrows Ar8 and Ar9 in FIG. 8(d)). Thus, the processing of the substrate W with the processing liquid L is completed.

[0056] [Operation] According to the above example, the main body 110 including the opening 111 opened upward to receive the processing liquid L dummy-discharged from the nozzle N is movable by the drive unit MT2. Therefore, for example, after discharging the processing liquid L at the initial stage of discharge, including foreign matters generated from the valve V3 and deteriorated processing liquid, from the nozzle N to the main body 110 above the substrate W, the main body 110 is retracted, so that the clean processing liquid L is supplied to the substrate W without opening and closing the valve V3. Therefore, it is possible to suppress the adhesion of foreign matters (for example, particles, etc.) to the substrate W.

[0057] According to the above example, after the nozzle N and the main body 110 are overlapped in the vertical direction, the nozzle N and the main body 110 are each moved to the outside of the substrate W held by the rotation holding unit U2. In this case, before the nozzle N and the main body 110 are retracted to the outside of the substrate W, since they are overlapped in the vertical direction, even if the processing liquid L unexpectedly drops from the nozzle N due to vibration or impact at the start of movement of the nozzle N, the dropped processing liquid L can be received by the main body 110. Therefore, it is possible to suppress contamination of the substrate W and the like.

[0058] According to the above example, the main body 110 includes an inner peripheral surface 113 having a shape that narrows downward. In this case, it becomes easier to collect the processing liquid L discharged from the nozzle N into the main body 110, and when the main body 110 in a state of collecting the processing liquid L discharged from the nozzle N is moved, it becomes easier to drain the processing liquid L at the edge of the main body 110 (the upper end edge of the inner peripheral surface 113). Therefore, it is possible to more appropriately supply the processing liquid L to the substrate W while suppressing contamination of the substrate W and the like.

[0059] According to the above example, the processing liquid L dummy-discharged into the main body 110 is sucked by the pump P3 through the pipe D4. In this case, the processing liquid L flowing through the pipe D4 is forcibly sucked by the pump P3. Therefore, for example, even when a processing liquid L having a property of being likely to crystallize is used, it is possible to suppress clogging of the processing liquid L in the pipe D4.

[0060] [Modification Example] The disclosure in this specification should be considered as illustrative in all respects and not restrictive. Various omissions, substitutions, changes, etc. may be made to the above example without departing from the scope of the claims and their gist.

[0061] (1) Steps S1 and S2 may be executed in the reverse order. That is, first, the controller Ctr controls the drive unit MT2. Thereby, as illustrated in FIG. 9(a), the main body 110 is moved so as to be positioned above the substrate W held by the rotation holding unit U2 (for example, above the central portion of the substrate W). Next, first, the controller Ctr controls the drive unit MT1. Thereby, as illustrated in FIG. 9(b), the nozzle N is moved so as to be positioned above the substrate W held by the rotation holding unit U2 (for example, above the central portion of the substrate W) (see arrow Ar10 in FIG. 9(b)). Therefore, in the vertical direction, the nozzle N and the main body 110 overlap, that is, the main body 110 is positioned below the nozzle N.

[0062] (2) Steps S1 and S2 may be executed substantially simultaneously. That is, the controller Ctr controls the drive units MT1 and MT2. Thereby, the nozzle N and the main body 110 are respectively moved so that the nozzle N and the main body 110 are respectively positioned above the substrate W held by the rotation holding unit U2 (for example, above the central portion of the substrate W) (see arrows Ar11 and Ar12 in FIG. 9(c)). Therefore, in the vertical direction, the nozzle N and the main body 110 overlap, that is, the main body 110 is positioned below the nozzle N.

[0063] (3) Steps S1 to S3 may be executed substantially simultaneously. That is, the controller Ctr controls the drive units MT1 and MT2, the pump P2, and the valve V2. Thereby, the nozzle N and the main body 110 are respectively moved so that the nozzle N and the main body 110 are respectively positioned above the substrate W held by the rotation holding unit U2 (for example, above the central portion of the substrate W) (see arrows Ar13 and Ar14 in FIG. 10(a)). And during the movement of the nozzle N and the main body 110, the controller Ctr controls the pump P2 and the valve V2. Thereby, as illustrated in FIG. 10(a), during the movement of the nozzle N and the main body 110, dummy discharge of the processing liquid L is started from the nozzle N toward the main body 110. In this case, while the initial processing liquid L including foreign matters generated from the valve V3 and deteriorated processing liquid L is discharged to the main body 110, the nozzle N and the main body 110 move above the substrate W. That is, dummy discharge is performed during the movement of the nozzle N and the main body 110. Therefore, it is possible to improve productivity.

[0064] (4) In step S7, when moving the nozzle N and the main body 110 to the outside of the substrate W held by the rotation holding unit U2, the nozzle N and the main body 110 may be moved in different directions. In this case, since the nozzle N and the main body 110 move in different directions, even when the space above the substrate W is relatively narrow, it is possible to move both while avoiding interference between them.

[0065] (5) In step S7, when moving the nozzle N and the main body 110 to the outside of the substrate W held by the rotation holding part U2, as illustrated in FIG. 10(b), the nozzle N and the main body 110 may be moved in the same direction. In this case, when retracting the nozzle N and the main body 110 to the outside of the substrate W, since the state where they overlap in the vertical direction continues, even if the processing liquid L accidentally drops from the nozzle N due to vibration or impact during the movement of the nozzle N, the dropped processing liquid L can be received by the main body 110. Therefore, it is possible to suppress contamination of the substrate W and the like.

[0066] (6) The main body 110 may be detachably attached to the arm part Am2. In this case, since the main body 110 can be removed from the arm part Am2 to perform cleaning of the main body 110 and the like, the maintenance work of the main body 110 becomes easy.

[0067] (7) As illustrated in FIG. 11, each of the arm parts Am1 and Am2 may be configured to be rotatable about an axis whose base end portion extends along the vertical direction. In this case, the nozzle N swings while drawing an arc between the center portion of the substrate W and the outside of the substrate W by the rotation of the arm part Am1 (see arrow Ar17 in FIG. 11). Similarly, the main body 110 also swings while drawing an arc between the center portion of the substrate W and the outside of the substrate W by the rotation of the arm part Am2 (see arrow Ar18 in FIG. 11).

[0068] (8) As illustrated in FIG. 12, each of the arm parts Am1 and Am2 may be constituted by a single-joint arm or a multi-joint arm. That is, the arm part Am1 may be configured such that adjacent arm members are connected by a joint and these arm members are movable with a predetermined degree of freedom around the joint (see arrow Ar19 in FIG. 12). Similarly, the arm part Am2 may be configured such that adjacent arm members are connected by a joint and these arm members are movable with a predetermined degree of freedom around the joint (see arrow Ar20 in FIG. 12).

[0069] (9) As illustrated in Fig. 13, the arm portion Am2 may be a telescopic arm configured to be telescopically extendable along a predetermined direction (for example, the horizontal direction). For example, the distal end portion Am2b may be nested (a nested type) with respect to the proximal end portion Am2a of the arm portion Am2, and the distal end portion Am2b may be insertable and removable with respect to the proximal end portion Am2a. That is, when the distal end portion Am2b protrudes outward from the proximal end portion Am2a (see the arrow Ar21 in Fig. 13(a)), the arm portion Am2 becomes longer as a whole. On the other hand, when the distal end portion Am2b is housed on the proximal end portion Am2a side (see the arrow Ar22 in Fig. 13(b)), the arm portion Am2 becomes shorter as a whole. In the case of the example in Fig. 13, in order to avoid an unintended external force acting on the pipe D4 as the length of the arm portion Am2 changes, the pipe D4 extending inside the arm portion Am2 may be constituted by a bellows in a bellows shape. That is, when the distal end portion Am2b protrudes outward from the proximal end portion Am2a (see the arrow Ar21 in Fig. 13(a)), the pipe D4 has the bellows extended and becomes longer. On the other hand, when the distal end portion Am2b is housed on the proximal end portion Am2a side (see the arrow Ar22 in Fig. 13(b)), the pipe D4 has the bellows folded and becomes shorter. Note that the arm portion Am1 may also be a telescopic arm configured to be telescopically extendable along a predetermined direction (for example, the horizontal direction), similar to the arm portion Am2.

[0070] In the case of the examples in Figs. 11 to 13, since the movement paths of the nozzle N and the main body portion 110 diversify, even when the space above the substrate W is relatively narrow, it is possible to move them while avoiding mutual interference between the nozzle N and the main body portion 110.

[0071] As illustrated in FIG. 14, the main body 110 of the liquid receiving portion 100 may have a rectangular tubular shape. In the example of FIG. 14, an intermediate wall 120 is provided between the opposing side walls 114 and 115, and a tapered wall 130 is provided at the upper portion of the intermediate wall 120. Also, a tapered wall 140 is provided at the upper portion of the side wall 115. These tapered walls 130 and 140 are inclined in the direction from the side wall 114 toward the side wall 115 as they go upward. That is, the tapered wall 130 includes an inclined surface 131 that is inclined so as to approach the facing side wall 114 as it goes downward. In this case, the processing liquid L discharged from the nozzle N into the main body 110 is received by the tapered wall 130 and flows from the lower space of the main body 110 into the pipe D4. Then, for example, when the main body 110 moves toward the left side in FIG. 14, the processing liquid L is cut off at the upper edge of the tapered wall 130 (the upper edge of the inclined surface 131). The processing liquid L that has flowed around the tapered wall 130 by the liquid cutoff falls into the lower space of the main body 110 through the space between the tapered wall 130 and the tapered wall 140 and flows into the pipe D4. Also in the example of FIG. 14, it becomes easier to collect the processing liquid L discharged from the nozzle N in the main body 110, and when the main body 110 in a state of collecting the processing liquid L discharged from the nozzle N is moved, it becomes easier to cut off the processing liquid L at the edge of the tapered wall 130 (the upper edge of the inclined surface 131). Therefore, it is possible to more appropriately supply the processing liquid L to the substrate W while suppressing contamination of the substrate W and the like.

[0072] Note that a plurality of the main bodies 110 illustrated in FIG. 14 may be arranged and unitized, and different types of processing liquid L may be collected in each main body 110. Drainage channels may be provided individually for each main body 110. In these cases, it becomes possible to suppress the reaction between different types of processing liquid L. Also, different storage tanks T may be prepared for each type of processing liquid L, the main body 110 and the storage tank T may be connected by pipes for each type of processing liquid L, and the processing liquid L collected in each main body 110 may be recovered in the storage tank T for each type of processing liquid L.

[0073] (11) As illustrated in FIG. 15(a), the liquid supply unit 11 may include a detection unit SE configured to detect the processing liquid L flowing through the main body 110 or the pipe D4. In this case, based on the detection result of the processing liquid L by the detection unit SE, for example, it becomes possible to detect an overflow of the processing liquid L from the main body 110 due to a clogging of the pipe D4, an abnormality in the discharge state of the processing liquid L from the nozzle N, and the like. Examples of such an abnormality include an abnormality of the valve V2 due to the detection unit SE not detecting the presence of the processing liquid L even though the controller Ctr transmitted an instruction signal to the valve V2 to discharge the processing liquid L from the nozzle N.

[0074] (12) As illustrated in FIG. 15(b), the inner peripheral surface or the outer peripheral surface of the main body 110 may be formed of a porous material 200. Examples of the porous material 200 include plastics (such as PTFE (polytetrafluoroethylene)) and ceramics (such as SiC (silicon carbide)). When the inner peripheral surface of the main body 110 is the porous material 200, liquid splashing of the processing liquid L discharged from the nozzle N onto the inner peripheral surface of the main body 110 is suppressed. When the outer peripheral surface of the main body 110 is the porous material 200, even if the processing liquid L adheres to the outer peripheral surface, dripping of the processing liquid L is suppressed. Therefore, scattering of the processing liquid L to the surroundings hardly occurs, so that contamination of the substrate W or the like can be suppressed.

[0075] (13) The main body 110 and the pipe D4 may be cleaned by periodically or irregularly supplying a cleaning liquid (for example, pure water) from the nozzle N toward the main body 110. In this case, the cleaning liquid may be supplied from the nozzle N to the main body 110 in a state where the nozzle N and the main body are located above the substrate W, or the cleaning liquid may be supplied from the nozzle N to the main body 110 in a state where the nozzle N and the main body are located outside the substrate W.

[0076] [Other Examples] Example 1. An example of a substrate processing apparatus includes a holding unit configured to hold a substrate, a supply unit including a nozzle configured to supply a processing liquid to the surface of the substrate held by the holding unit, a liquid receiving unit including an opening that is open upward to receive the processing liquid dummy discharged from the nozzle, a first driving unit configured to move the nozzle between above the substrate held by the holding unit and outside the substrate held by the holding unit, and a second driving unit configured to move the liquid receiving unit between above the substrate held by the holding unit and outside the substrate held by the holding unit.

[0077] By the way, usually, when supplying the processing liquid from the nozzle to the substrate, after moving the nozzle above the substrate, the processing liquid is discharged from the nozzle toward the surface of the substrate. Then, the discharge of the processing liquid from the nozzle is stopped, and the nozzle is retracted from above the substrate. However, if the nozzle after the discharge stop of the processing liquid is simply moved, the processing liquid remaining at the tip of the nozzle may unexpectedly fall due to the vibration or impact during the movement of the nozzle, adhere to the substrate or surrounding equipment, and lead to contamination of these. Therefore, after stopping the discharge of the processing liquid from the nozzle, the valve provided in the drain line for draining is opened, the processing liquid is drawn deeper than the discharge port of the nozzle (so-called suck-back), and then the nozzle may be retracted from above the substrate.

[0078] However, when the processing liquid is supplied from the nozzle to the substrate after suck-back, foreign matter (for example, particles, etc.) may adhere mainly at the central portion of the substrate. Therefore, as a result of intensive studies by the present inventors, a new finding was obtained that dirt accumulated in the valve may be discharged onto the substrate as foreign matter when the valve is opened and closed.

[0079] In addition, regarding the cause of foreign matter adhering to the substrate, the inventors of the present invention further conducted intensive studies and found that when time elapses with the processing liquid being drawn into the back of the nozzle due to sacking, depending on the type of the processing liquid, the processing liquid may deteriorate. For example, when an organic solvent that may be oxidized by contacting the outside air or a chemical solution in which the solute is extremely likely to vaporize from the gas-liquid interface is used as the processing liquid, the processing liquid at the leading part of the processing liquid drawn into the back of the nozzle may deteriorate. Therefore, even when a processing liquid with such properties is used, foreign matter (for example, particles, etc.) may adhere mainly to the central part of the substrate.

[0080] Therefore, according to the apparatus of Example 1, a liquid receiving part including an opening that is open upward to receive the processing liquid dummy discharged from the nozzle is movable by a second driving part. Therefore, for example, after discharging the processing liquid at the initial stage of discharge including foreign matter generated from the valve or deteriorated processing liquid from the nozzle to the liquid receiving part above the substrate, by retracting the liquid receiving part, clean processing liquid can be supplied to the substrate without opening and closing the valve. Therefore, it is possible to suppress the adhesion of foreign matter (for example, particles, etc.) to the substrate.

[0081] Example 2. The apparatus of Example 1 may further include a control unit. The control unit is configured to execute a first process of controlling the first driving part to move the nozzle above the substrate held by the holding part, a second process of controlling the second driving part to move the liquid receiving part below the nozzle, and a third process of controlling the supply part to cause the processing liquid to be dummy discharged from the nozzle toward the liquid receiving part. In this case, the same operational effects as those of Example 1 can be obtained.

[0082] Example 3. In the apparatus of Example 2, the control unit may be further configured to execute a fourth process of controlling at least one of the first driving part and the second driving part to move at least one of the nozzle and the liquid receiving part to a position where the nozzle and the liquid receiving part do not overlap when viewed from above while the processing liquid is being discharged from the nozzle. In this case, the same operational effects as those of Example 1 can be obtained.

[0083] Example 4. In the apparatus of Example 3, the fourth process may include controlling the second driving unit to move the liquid receiving part to a position where the nozzle and the liquid receiving part do not overlap when viewed from above while the processing liquid is being discharged from the nozzle. In this case, the same operational effects as in Example 1 can be obtained.

[0084] Example 5. In any of the apparatuses of Examples 2 to 4, the control unit may be further configured to execute a fifth process of controlling the supply unit to stop discharging the processing liquid from the nozzle, a sixth process of controlling the second driving unit to move the liquid receiving part below the nozzle, and a seventh process of controlling the first driving unit and the second driving unit to move the nozzle and the liquid receiving part to the outside of the substrate held by the holding part while the nozzle and the liquid receiving part overlap when viewed from above. In this case, when the nozzle and the liquid receiving part retract from the substrate, they overlap in the vertical direction, so even if the processing liquid accidentally drops from the nozzle due to vibration or impact during the movement of the nozzle, the dropped processing liquid can be received by the liquid receiving part. Therefore, it is possible to suppress contamination of the substrate or the like.

[0085] Example 6. The apparatus of Example 1 may further include a control unit. The control unit may be configured to execute a first process of controlling the supply unit to perform dummy discharge of the processing liquid from the nozzle toward the liquid receiving part in a state where the nozzle is located above the liquid receiving part, and a second process of controlling the first driving unit and the second driving unit to move the nozzle and the liquid receiving part above the substrate held by the holding part while the processing liquid is being discharged from the nozzle toward the liquid receiving part as a dummy discharge. In this case, the same operational effects as in Example 1 can be obtained. Also, in this case, while the processing liquid at the initial stage of discharge, including foreign matter generated from the valve or deteriorated processing liquid, is being discharged to the liquid receiving part, the nozzle and the liquid receiving part move above the substrate. That is, dummy discharge is performed while the nozzle and the liquid receiving part are moving. Therefore, it is possible to improve productivity.

[0086] Example 7. In the apparatus of Example 6, the control unit may be further configured to perform a third process of controlling at least one of the first driving unit and the second driving unit in a state where the processing liquid is being discharged from the nozzle, and moving at least one of the nozzle and the liquid receiving unit to a position where the nozzle and the liquid receiving unit do not overlap when viewed from above. In this case, the same operational effects as in Example 1 can be obtained.

[0087] Example 8. In the apparatus of Example 7, the third process may include controlling the second driving unit in a state where the processing liquid is being discharged from the nozzle, and moving the liquid receiving unit to a position where the nozzle and the liquid receiving unit do not overlap when viewed from above. In this case, the same operational effects as in Example 1 can be obtained.

[0088] Example 9. In the apparatus of any one of Examples 6 to 8, the control unit may be further configured to perform a fourth process of controlling the supply unit to stop the discharge of the processing liquid from the nozzle, a fifth process of controlling the second driving unit to move the liquid receiving unit below the nozzle, and a sixth process of controlling the first driving unit and the second driving unit to move the nozzle and the liquid receiving unit outside the substrate held by the holding unit while the nozzle and the liquid receiving unit overlap when viewed from above. In this case, the same operational effects as in Example 5 can be obtained.

[0089] Example 10. In the apparatus of any one of Examples 1 to 9, the second driving unit may be configured to move the liquid receiving unit in a direction different from the moving direction of the nozzle by the first driving unit. In this case, since the nozzle and the liquid receiving unit move in different directions, it is possible to move both while avoiding interference between them even when the space above the substrate is relatively narrow.

[0090] Example 11. The apparatus of any one of Examples 1 to 10 may further include a detection unit configured to detect the processing liquid flowing inside the liquid receiving unit. In this case, based on the detection result of the processing liquid by the detection unit, it is possible to detect an overflow of the processing liquid from the liquid receiving unit, an abnormality in the discharge state of the processing liquid from the nozzle, etc.

[0091] Example 12. In any of the apparatuses of Examples 1 to 11, it may include an inner peripheral surface having a shape that narrows downward, or an inclined surface that inclines so as to approach the side wall located opposite as it goes downward. In this case, it becomes easier to collect the processing liquid discharged from the nozzle inside the liquid receiving portion, and when the liquid receiving portion in a state of collecting the processing liquid discharged from the nozzle is moved, it becomes easier to drain the processing liquid at the edge of the liquid receiving portion (the upper edge of the inner peripheral surface or the upper edge of the inclined surface). Therefore, it is possible to more appropriately supply the processing liquid to the substrate while suppressing contamination of the substrate and the like.

[0092] Example 13. In any of the apparatuses of Examples 1 to 12, the liquid receiving portion may include a main body portion including an opening, a flow path connected to a discharge port provided below the main body portion through which the processing liquid discharged as dummy flows, and a suction portion configured to suck the processing liquid through the flow path. In this case, the processing liquid flowing through the flow path is forcibly sucked by the suction portion. Therefore, for example, even when a processing liquid having a property of being likely to crystallize is used, it is possible to suppress clogging of the processing liquid in the flow path.

[0093] Example 14. The apparatus of Example 13 may further include an arm portion whose tip is connected to the main body portion. The arm portion may be a single-joint arm, a multi-joint arm, a telescopic arm configured to be telescopic along a predetermined direction, or a rotary arm configured to be rotatable around an axis whose base end portion extends along the vertical direction. In this case, since the movement path of the liquid receiving portion diversifies, it is possible to move the liquid receiving portion while avoiding interference with the nozzle even when the space above the substrate is relatively narrow.

[0094] Example 15. In the apparatus of Example 14, the main body portion may be detachably attached to the arm portion. In this case, the maintenance work of the main body portion becomes easy.

[0095] Example 16. In any of the apparatuses of Examples 13 to 15, the inner peripheral surface or the outer peripheral surface of the main body portion may be formed of a porous material. When the inner peripheral surface of the main body portion is a porous material, splashing of the processing liquid discharged from the nozzle onto the inner peripheral surface of the main body portion is suppressed. When the outer peripheral surface of the main body portion is a porous material, even if the processing liquid adheres to the outer peripheral surface, dripping of the processing liquid is suppressed. Therefore, scattering of the processing liquid to the surroundings hardly occurs, so that contamination of a substrate or the like can be suppressed.

[0096] Example 17. An example of a substrate processing method includes a first step of moving a nozzle above a substrate held by a holding portion, a second step of moving a liquid receiving portion below the nozzle, and a third step of dummy discharging a processing liquid from the nozzle toward the liquid receiving portion. In this case, the same operational effects as those of the apparatus of Example 2 can be obtained.

[0097] Example 18. The method of Example 17 may further include a fourth step of moving at least one of the nozzle and the liquid receiving portion to a position where the nozzle and the liquid receiving portion do not overlap when viewed from above while the processing liquid is being discharged from the nozzle. In this case, the same operational effects as those of the apparatus of Example 3 can be obtained.

[0098] Example 19. Another example of a substrate processing method includes a first step of dummy discharging a processing liquid from a nozzle toward a liquid receiving portion while the nozzle is positioned above the liquid receiving portion, and a second step of moving the nozzle and the liquid receiving portion above a substrate held by a holding portion while the processing liquid is being dummy discharged from the nozzle toward the liquid receiving portion. In this case, the same operational effects as those of the apparatus of Example 6 can be obtained.

[0099] Example 20. The method of Example 19 may further include a third step of moving at least one of the nozzle and the liquid receiving portion to a position where the nozzle and the liquid receiving portion do not overlap when viewed from above while the processing liquid is being discharged from the nozzle. In this case, the same operational effects as those of the apparatus of Example 7 can be obtained.

Explanation of Reference Numerals

[0100] 1… Substrate processing system, 10… Processing liquid supply device (substrate processing device), 11… Liquid supply unit (supply section), 100… Liquid receiving section, 110… Main body section, 111… Opening, 112… Drain port, 113… Inner peripheral surface, 131… Inclined surface, 200… Porous material, Am2… Arm section, Ctr… Controller (control section), D4… Pipe (flow path), L… Processing liquid, MT1… Driving section (first driving section), MT2… Driving section (second driving section), N… Nozzle, P3… Pump (suction section), SE… Detection section, U… Liquid processing unit (supply section), U2… Rotation holding section (holding section), W… Substrate.

Claims

1. A holding unit configured to hold a substrate, A supply unit including a nozzle configured to supply a processing liquid to the surface of the substrate held by the holding unit, A liquid receiving unit including an opening opened upward to receive the processing liquid dummy discharged from the nozzle, A first driving unit configured to move the nozzle between above the substrate held by the holding unit and outside the substrate held by the holding unit, A substrate processing apparatus comprising a second driving unit configured to move the liquid receiving unit between above the substrate held by the holding unit and outside the substrate held by the holding unit.

2. Further comprising a control unit, The control unit, A first process of controlling the first driving unit to move the nozzle above the substrate held by the holding unit, A second process of controlling the second driving unit to move the liquid receiving unit below the nozzle, The apparatus according to claim 1, wherein the supply unit is configured to execute a third process of controlling the supply unit to cause the processing liquid to be dummy discharged from the nozzle toward the liquid receiving unit.

3. The control unit is configured to further execute a fourth process of controlling at least one of the first driving unit and the second driving unit while the processing liquid is being discharged from the nozzle, so that at least one of the nozzle and the liquid receiving unit is moved to a position where the nozzle and the liquid receiving unit do not overlap when viewed from above. The apparatus according to claim 2.

4. The fourth process includes moving the liquid receiving unit to a position where the nozzle and the liquid receiving unit do not overlap when viewed from above by controlling the second driving unit while the processing liquid is being discharged from the nozzle. The apparatus according to claim 3.

5. The control unit, A fifth process of controlling the supply unit to stop the discharge of the processing liquid from the nozzle, A sixth process of controlling the second driving unit to move the liquid receiving unit below the nozzle, The apparatus according to claim 2, wherein the first driving unit and the second driving unit are controlled to further execute a seventh process of moving the nozzle and the liquid receiving unit outside the substrate held by the holding unit while the nozzle and the liquid receiving unit overlap when viewed from above.

6. Further comprising a control unit, The control unit, In a state where the nozzle is positioned above the liquid receiving portion, a first process of controlling the supply unit to cause the processing liquid to be dummy discharged from the nozzle toward the liquid receiving portion; The apparatus according to claim 1, configured to execute a second process of controlling the first driving unit and the second driving unit to move the nozzle and the liquid receiving portion above the substrate held by the holding unit while the processing liquid is being dummy discharged from the nozzle toward the liquid receiving portion.

7. The apparatus according to claim 6, wherein the control unit is further configured to execute a third process of controlling at least one of the first driving unit and the second driving unit in a state where the processing liquid is being discharged from the nozzle, to move at least one of the nozzle and the liquid receiving portion to a position where the nozzle and the liquid receiving portion do not overlap when viewed from above.

8. The apparatus according to claim 7, wherein the third process includes controlling the second driving unit in a state where the processing liquid is being discharged from the nozzle, to move the liquid receiving portion to a position where the nozzle and the liquid receiving portion do not overlap when viewed from above.

9. The control unit A fourth process of controlling the supply unit to stop the discharge of the processing liquid from the nozzle; A fifth process of controlling the second driving unit to move the liquid receiving portion below the nozzle; The apparatus according to claim 6, further configured to execute a sixth process of controlling the first driving unit and the second driving unit to move the nozzle and the liquid receiving portion outside the substrate held by the holding unit while the nozzle and the liquid receiving portion overlap when viewed from above.

10. The apparatus according to any one of claims 1 to 9, wherein the second driving unit is configured to move the liquid receiving portion in a direction different from the moving direction of the nozzle by the first driving unit.

11. The apparatus according to any one of claims 1 to 9, further comprising a detection unit configured to detect the processing liquid flowing in the liquid receiving portion.

12. The apparatus according to any one of claims 1 to 9, wherein the liquid receiving portion includes an inner peripheral surface having a shape that tapers downward, or an inclined surface that inclines so as to approach the side walls located opposite to each other as it goes downward.

13. The liquid receiving portion A main body portion including the opening, A flow path that is connected to a discharge port provided below the main body portion and through which the processed liquid discharged as dummy flows, and a suction unit configured to suck the processed liquid through the flow path, the apparatus according to any one of claims 1 to 9.

14. further comprising an arm portion having a tip end connected to the main body portion, wherein the arm portion is a single-joint arm, a multi-joint arm, a telescopic arm configured to be telescopic along a predetermined direction, or a rotary arm configured to be rotatable about an axis whose base end portion extends along a vertical direction, the apparatus according to claim 13.

15. wherein the main body portion is detachably attached to the arm portion, the apparatus according to claim 14.

16. wherein an inner peripheral surface or an outer peripheral surface of the main body portion is formed of a porous material, the apparatus according to claim 13.

17. a first step of moving a nozzle above a substrate held by a holding portion, a second step of moving a liquid receiving portion below the nozzle, and a third step of dummy discharging a processing liquid from the nozzle toward the liquid receiving portion, a substrate processing method.

18. further comprising a fourth step of moving at least one of the nozzle and the liquid receiving portion to a position where the nozzle and the liquid receiving portion do not overlap when viewed from above while the processing liquid is being discharged from the nozzle, the method according to claim 17.

19. a first step of dummy discharging a processing liquid from the nozzle toward the liquid receiving portion while the nozzle is positioned above the liquid receiving portion, and a second step of moving the nozzle and the liquid receiving portion above a substrate held by a holding portion while the processing liquid is being dummy discharged from the nozzle toward the liquid receiving portion, a substrate processing method.

20. further comprising a third step of moving at least one of the nozzle and the liquid receiving portion to a position where the nozzle and the liquid receiving portion do not overlap when viewed from above while the processing liquid is being discharged from the nozzle, the method according to claim 19.

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