Light-emitting device

Abstract

To provide a highly reliable light-emitting device which includes an organic EL element and is lightweight.SOLUTION: There is provided a light-emitting device including: a first organic resin layer; a first glass layer which is over the first organic resin layer and in contact with one face of the first organic resin layer; a second glass layer over a light-emitting element; and a second organic resin layer which is over the second glass layer and in contact with one face of the second glass layer. The first organic resin layer and the first glass layer each have a property of transmitting visible light. The thickness of the first glass layer and the thickness of the second glass layer are independently greater than or equal to 25 μm and less than or equal to 100 μm. The light-emitting element includes, from a first glass layer side, a first electrode having a property of transmitting visible light, a layer containing a light-emitting organic compound, and a second electrode.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a light-emitting device using organic electroluminescence (EL: Electroluminescence). The present invention also relates to a lighting device using the light-emitting device.

Background Art

[0002] Research and development of an element using the organic electroluminescence phenomenon (also referred to as an organic EL element) has been actively conducted. The basic configuration of an organic EL element is one in which a layer containing a light-emitting organic compound is sandwiched between a pair of electrodes. By applying a voltage to this element, light emission from the light-emitting organic compound can be obtained.

[0003] Since an organic EL element can be formed in a film shape, a large-area element can be easily formed, and it has high utility value as a surface light source applicable to lighting and the like.

[0004] For example, Non-Patent Document 1 discloses a light-emitting device provided with an organic EL element on a plastic substrate. When plastic is used for the substrate, it is possible to reduce the weight of the light-emitting device as compared with the case where glass or the like is used.

Prior Art Documents

Non-Patent Documents

[0005]

Non-Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] The organic EL element has a problem that its reliability is impaired by intruding moisture, oxygen, impurities, etc. There is a problem.

[0007] When moisture, oxygen, or impurities penetrate from the outside of the organic EL element into the organic compounds and metal materials contained in the organic EL element, the life of the organic EL element may be significantly reduced. The organic EL element uses organic compounds and metal materials that react with moisture, oxygen, or impurities and deteriorate. Therefore.

[0008] Plastic substrates such as those used in Non-Patent Document 1 are likely to allow moisture, oxygen, impurities, etc. to pass through. Therefore, the intrusion of external moisture, oxygen, impurities, etc. from the side using the plastic substrate may have an adverse effect on the life of the organic EL element and the light-emitting device. There is a problem.

[0009] Therefore, one aspect of the present invention aims to provide a light-emitting device that includes an organic EL element, is lightweight, and has high reliability. There is a problem.

Means for Solving the Problem

[0010] The inventors of the present invention focused on using a substrate in which an organic resin layer and a thin glass layer are bonded together as the substrate of the light-emitting device. There is a problem.

[0011] Specifically, one aspect of the present invention includes a first organic resin layer, a first glass layer in contact with one surface of the first organic resin layer on the first organic resin layer, a light-emitting element on the first glass layer, a second glass layer on the light-emitting element, and a second organic resin layer in contact with one surface of the second glass layer on the second glass layer, and the first organic resin layer and the first glass layer have translucency with respect to visible light. There is a problem. There is a problem. There is a problem. having, the first glass layer and the second glass layer are each independently 25 μm or more and 100 μm or less in thickness, and the light-emitting element has translucency with respect to visible light from the first glass layer side A light-emitting device having a first electrode, a layer containing a light-emitting organic compound, and a second electrode .

[0012] By applying one aspect of the present invention, the light-emitting device can be reduced in weight. Furthermore, moisture, oxygen, and non- pure substances and the like can be prevented from entering the organic compounds and metal materials contained in the light-emitting element from outside the light-emitting device .

[0013] In the above light-emitting device, it is preferable that the first organic resin layer and the second organic resin layer are made of the same material . By forming with the same material, it is possible to suppress shape defects due to thermal distortion and physical shock . Therefore, it is possible to suppress deformation and breakage of the light-emitting device during production and use .

[0014] In the above light-emitting device, it is preferable to provide a sealing layer that contacts the first glass layer and covers the light-emitting element . By providing the sealing layer, it is possible to further suppress moisture, oxygen, or impurities and the like from entering the organic compounds and metal materials contained in the light-emitting element from outside the light-emitting element .

[0015] In addition, since a light-emitting device using an organic EL element emits light in a region where the refractive index is higher than that of the atmosphere, total reflection occurs inside the light-emitting device or at the interface between the light-emitting device and the atmosphere when light is taken out into the atmosphere, and there is a problem that the light extraction efficiency of the light-emitting device is less than 100%. Generally speaking, the light extraction efficiency of the light-emitting device is said to be about 20 to 30%.

[0016] ​For example, when light is incident from a medium A with a high refractive index to a medium B with a low refractive index, total reflection may occur depending on the incident angle at that time.

[0017] At this time, it is preferable to provide an uneven structure on the interface between the medium A and the medium B. By configuring it in this way, light incident from the medium A to the medium B at an angle exceeding the critical angle is totally reflected, and the phenomenon that light leaks in the light emitting device and the light extraction efficiency decreases can be suppressed. The light extraction efficiency of the light emitting device according to one aspect of the present invention described below can be about 1.2 to 2 times that of a light emitting device to which the present invention is not applied. In the above light emitting device, it is preferable that the first organic resin layer has an uneven structure on the surface that does not contact the first glass layer. Since the refractive index of the first organic resin layer is larger than that of the atmosphere, total reflection may occur at the interface between the first organic resin layer and the atmosphere. By providing an uneven structure on the interface between the atmosphere and the first organic resin layer, light that cannot be extracted into the atmosphere due to the influence of total reflection can be reduced, and the light extraction efficiency of the light emitting device can be improved.

[0018] Generally, the refractive index of glass is about 1.5, which is lower than that of a layer containing a light emitting organic compound (for example, 1.6 or more). Therefore, when light is incident from the first electrode to the first glass layer, total reflection may occur. Therefore, it is preferable to provide an uneven structure on the interface between the first electrode and the first glass layer. However, in an organic EL element, if the first electrode has unevenness, there is a risk of leakage current occurring in a layer containing a light emitting organic compound formed on the first electrode.

[0019] In the above light emitting device, it is preferable that the first organic resin layer has an uneven structure on the surface that does not contact the first glass layer. Since the refractive index of the first organic resin layer is larger than that of the atmosphere, total reflection may occur at the interface between the first organic resin layer and the atmosphere. Therefore, light that cannot be extracted into the atmosphere due to the influence of total reflection can be reduced, and the light extraction efficiency of the light emitting device can be improved. By providing an uneven structure on the interface between the atmosphere and the first organic resin layer, light that cannot be extracted into the atmosphere due to the influence of total reflection can be reduced, and the light extraction efficiency of the light emitting device can be improved. In the above light emitting device, it is preferable that the first organic resin layer has an uneven structure on the surface that does not contact the first glass layer.

[0020] Also, generally, the refractive index of glass is about 1.5, which is lower than that of a layer containing a light emitting organic compound (for example, 1.6 or more). Therefore, when light is incident from the first electrode to the first glass layer, total reflection may occur. Therefore, it is preferable to provide an uneven structure on the interface between the first electrode and the first glass layer. However, in an organic EL element, if the first electrode has unevenness, there is a risk of leakage current occurring in a layer containing a light emitting organic compound formed on the first electrode.

[0021] However, in an organic EL element, if the first electrode has unevenness, there is a risk of leakage current occurring in a layer containing a light emitting organic compound formed on the first electrode. At this time, it is preferable to provide an uneven structure on the interface between the medium A and the medium B. By configuring it in this way, light incident from the medium A to the medium B at an angle exceeding the critical angle is totally reflected, and the phenomenon that light leaks in the light emitting device and the light extraction efficiency decreases can be suppressed.

[0022] Therefore, in the above light-emitting device, there is a concavo-convex structure on the first glass layer, and on the concavo-convex structure there is a first resin layer, and on the first resin layer there is a first electrode. It is preferable that the refractive index of the first resin layer is equal to or greater than the refractive index value of the layer containing the light-emitting organic compound. Or, in the above light-emitting device, there is a concavo-convex structure on the first glass layer, a first resin layer on the concavo-convex structure, and a first electrode on the first resin layer. It is preferable that the refractive index of the first resin layer is equal to or greater than the refractive index value of the first electrode. By adopting such a configuration, since there is no need to provide a concavo-convex structure for suppressing the reduction of the light extraction efficiency at the interface between the first resin layer and the first electrode, the first electrode can be made into a flat film, and the generation of leakage current in the layer containing the light-emitting organic compound and the like caused by the concavity and convexity of the first electrode can be suppressed.

[0023] In addition, since there is a concavo-convex structure between the first resin layer and the first glass layer, the light that cannot be extracted to the atmosphere due to the influence of total reflection can be reduced, and the light extraction efficiency of the light-emitting device can be improved.

[0024] Also, in the above light-emitting device, there is a first protective layer provided in contact between the first resin layer and the first electrode, and it is preferable that the refractive index of the first protective layer is equal to or greater than the refractive index of the first resin layer. By providing the protective layer, the intrusion of moisture and impurities from the first resin layer into the light-emitting element can be suppressed.

[0025] The light-emitting device according to one aspect of the present invention described above has a bottom emission structure in which light is extracted from the surface on the substrate side where the element is formed with respect to the light-emitting element, or a substrate on which the element is formed side.

[0026] On the basis of the light-emitting element, the bottom emission structure that extracts light from the surface on the substrate side where the element is formed, or the substrate on which the element is formed side It is a top emission structure that extracts light emission from the surface opposite to the substrate. In the present invention One aspect of can also be applied to a dual emission structure that extracts light emission from both of the above-mentioned surfaces. It can be applied.

[0027] In the above-mentioned light-emitting device, it is preferable that the second organic resin layer, the second glass layer, and the second electrode have translucency with respect to visible light. By adopting such a configuration, a light-emitting device having a dual emission structure can be realized. can be realized.

[0028] In the above-mentioned light-emitting device, it is preferable that the second organic resin layer has an uneven structure on the surface that does not contact the second glass layer. Since the refractive index of the second organic resin layer is larger than the refractive index of the atmosphere total reflection may occur at the interface between the second organic resin layer and the atmosphere. By providing an uneven structure at the interface between the atmosphere and the second organic resin layer, light that cannot be extracted into the atmosphere due to the influence of total reflection can be reduced, and the light extraction efficiency of the light-emitting device can be improved. and the light extraction efficiency of the light-emitting device can be improved.

[0029] In the above-mentioned light-emitting device, it has a second resin layer on the second electrode, an uneven structure on the second resin layer and a second glass layer on the uneven structure, and it is preferable that the refractive index of the second resin layer is equal to or higher than the refractive index of the layer containing the light-emitting organic compound. and a second glass layer on the uneven structure, and it is preferable that the refractive index of the second resin layer is equal to or higher than the refractive index of the layer containing the light-emitting organic compound.

[0030] Alternatively, in the above-mentioned light-emitting device, it has a second resin layer on the second electrode, an uneven structure on the second resin layer, and a second glass layer on the uneven structure, and it is preferable that the refractive index of the second resin layer is equal to or higher than the refractive index of the second electrode.

[0031] By adopting such a configuration, at the interface between the second resin layer and the second electrode, the light extraction efficiency Since there is no need to provide a concavo-convex structure for suppressing lowering, the second electrode is formed as a flat film. This makes it possible to suppress the generation of leakage current in a layer containing a light-emitting organic compound or the like due to the unevenness of the second electrode.

[0032] In addition, total reflection may occur at the interface between the second resin layer and the second glass layer. However, since the light-emitting device described above has a concavo-convex structure at the interface between the second resin layer and the second glass layer, it is possible to reduce the light that cannot be extracted into the atmosphere due to the influence of total reflection, and improve the light extraction efficiency of the light-emitting device.

[0033] In the above light-emitting device, it preferably has a second resin layer provided in contact between the second electrode and the second resin layer, and the refractive index of the second protective layer is equal to or greater than the refractive index of the second resin layer. By providing the protective layer, it is possible to suppress the intrusion of moisture and impurities from the second resin layer into the light-emitting element.

[0034] The above light-emitting device preferably has flexibility. For example, by setting the thickness of the glass layers in the above light-emitting device to be 25 μm or more and 75 μm or less respectively, a lightweight and bend-resistant and break-resistant light-emitting device can be realized.

[0035] In addition, one aspect of the present invention is the above light-emitting device including a converter. In one aspect of the present invention, the converter can be incorporated without changing the thickness of the light-emitting device.

[0036] In addition, one aspect of the present invention is an illumination device including the above light-emitting device as a light-emitting unit.

Effects of the Invention

[0037] ​​​​​​​​​In one aspect of the present invention, a light-emitting device including an organic EL element, being lightweight, and having high reliability can be provided.

Brief Description of the Drawings

[0038]

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[0039] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it will be easily understood by those skilled in the art that the form and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention is not to be construed as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same reference numerals are commonly used for the same parts or parts having similar functions among different drawings, and the repeated description thereof will be omitted. and it will be easily understood by those skilled in the art that the form and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention is not to be construed as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same reference numerals are commonly used for the same parts or parts having similar functions among different drawings, and the repeated description thereof will be omitted. and it will be easily understood by those skilled in the art that the form and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention is not to be construed as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same reference numerals are commonly used for the same parts or parts having similar functions among different drawings, and the repeated description thereof will be omitted. and it will be easily understood by those skilled in the art that the form and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention is not to be construed as being limited to the description of the embodiments shown below. In the configuration of the invention described below, the same reference numerals are commonly used for the same parts or parts having similar functions among different drawings, and the repeated description thereof will be omitted. In the configuration of the invention described below, the same reference numerals are commonly used for the same parts or parts having similar functions among different drawings, and the repeated description thereof will be omitted. and the repeated description thereof will be omitted.

[0040] In the present embodiment, the first electrode functions as an anode, and the second electrode functions as a cathode. The present invention is not limited to this, and it may include a first electrode that functions as a cathode and a second electrode that functions as an anode. The present invention is not limited to this, and it may include a first electrode that functions as a cathode and a second electrode that functions as an anode. and a second electrode that functions as an anode.

[0041] (Embodiment 1) In the present embodiment, a light-emitting device according to one aspect of the present invention will be described with reference to FIGS. 1 to 5.

[0042] A plan view of a light-emitting device according to one aspect of the present invention is shown in FIG. 1. In FIG. 1, some configurations (for example, the sealing material 114 shown in FIG. 2(A), etc.) are omitted.

[0043] In FIG. 1, a first glass layer 101a is formed on the first organic resin layer 100a, and a light-emitting element (a first electrode 103, an EL layer 102, and a second electrode 1 is formed on the first glass layer 101a. It has . And, a second glass layer 101b is provided on the light-emitting element, and a second organic resin layer 100b is formed on the second glass layer 101b.

[0044] The second electrode 108 is connected to the connection electrode 411. The connection electrode 411 can be formed of the same material as the first electrode 1 03.

[0045] Furthermore, the light-emitting device according to an aspect of the present invention may include a converter. The light-emitting device including the converter will be described in detail in Embodiment 7.

[0046] <Configuration Example 1> FIG. 2(A) shows an example of a light-emitting device having a bottom emission structure. FIG. 2(A) corresponds to a cross-sectional view taken along line A-B of FIG. 1.

[0047] The light-emitting device shown in FIG. 2(A) includes a first organic resin layer 100a, a first glass layer 101a, a light-emitting element (a first electrode 103, an EL layer 102, and a second electrode 108), a sealing layer 110, a second glass layer 101b, and a second organic resin layer 100b.

[0048] Since Configuration Example 1 has a bottom emission structure, the first electrode 103 has light transmissivity (hereinafter referred to as light transmittance) with respect to visible light.

[0049] In FIG. 2(A), the first glass layer 101a and the second glass layer 101b are bonded together with a sealing material 114. The light-emitting device shown in FIG. 2(A) has a structure in which a light-emitting element is provided in a space 112 surrounded by the first glass layer 101a, the second glass layer 101b, and the sealing material 114.

[0050] Note that the space 112 is filled with an inert gas (such as nitrogen or argon) as a filler. Also, as shown in Fig. 2(B), a configuration in which the space is filled with the sealing material 114 can also be applied. Also, as shown in Fig. 2(C), the space 112 can be filled with a filling material 115 different from the sealing materials 114 and 116. As the filling material 115, among the materials used as the sealing material, by using a material with low viscosity, it becomes easy to fill the space 112.

[0051] A space may be provided between the sealing material 114 and the sealing material 116 (for example, Fig. 2(A)). Also, the sealing material 114 and the sealing material 116 may be in contact with each other (for example, Fig. 2(B)).

[0052] Also, in Configuration Example 1, by adopting a configuration in which the second electrode 108 has translucency instead of the first electrode 103, a light-emitting device with a top emission structure can be realized.

[0053] <Configuration Example 2> Fig. 3 shows another example of a light-emitting device with a bottom emission structure. Fig. 3 corresponds to the cross-sectional view between A and B in Fig. 1.

[0054] The light-emitting device shown in Fig. 3 includes a first organic resin layer 100a having an uneven structure 118a, a first glass layer 101a, a light-emitting element (the first electrode 103, the EL layer 102, and the second electrode 108 ), a sealing layer 110, a second glass layer 101b, and a second organic resin layer 100b. )

[0055] Since the refractive index of the first organic resin layer 100a is larger than the refractive index of the atmosphere, total reflection may occur at the interface between the first organic resin layer 100a and the atmosphere. In Configuration Example 2, between the atmosphere and the first organic resin Since the uneven structure 118a is provided at the interface of the resin layer 100a, light that cannot be extracted into the atmosphere due to the influence of total reflection can be reduced, and the light extraction efficiency of the light-emitting device can be improved.

[0056] As for other configurations, the same configurations as those in Configuration Example 1 can be applied.

[0057] <Configuration Example 3> Fig. 4 shows an example of a light-emitting device with a dual emission structure. Fig. 4 corresponds to the cross-sectional view between A and B in Fig. 1.

[0058] The light-emitting device shown in Fig. 4 includes a first organic resin layer 100a, a first glass layer 101a, a light-emitting element (the first electrode 103, the EL layer 102, and the second electrode 107), a sealing layer 110, a second glass layer 101b, and a second organic resin layer 100b. ( )

[0059] Configuration Example 3 is a light-emitting device with a dual emission structure. Therefore, not only the first electrode 10 3 but also the second electrode 107 has light-transmitting properties.

[0060] As for other configurations, the same configurations as those in Configuration Example 1 can be applied.

[0061] <Configuration Example 4> Fig. 5(A) shows another example of a light-emitting device with a dual emission structure. Fig. 5(A) corresponds to the cross-sectional view between A and B in Fig. 1.

[0062] The light-emitting device shown in Fig. 5(A) includes a first organic resin layer 100a having an uneven structure 118a, a first glass layer 101a, a light-emitting element (the first electrode 103, the EL layer 102, and the second electrode 107), a sealing layer 110, a second glass layer 101b, and a second organic resin layer 100b.

[0063] ​​​​Configuration Example 4 is a light-emitting device with a dual-emission structure. Therefore, the first electrode 10 3 and the second electrode 107 are light-transmissive.

[0064] Since the refractive index of the first organic resin layer 100a is greater than that of the atmosphere, total reflection may occur at the interface between the first organic resin layer 100a and the atmosphere. As in Configuration Example 4, by providing the concavo-convex structure 118a at the interface between the atmosphere and the first organic resin layer 100a, the light that cannot be extracted into the atmosphere due to the influence of total reflection can be reduced, and the light extraction efficiency of the light-emitting device can be improved.

[0065] Similarly, the surface of the second organic resin layer 100b in contact with the atmosphere may have a concavo-convex structure.

[0066] Note that in the light-emitting device shown in Fig. 5(A), the light emitted from the EL layer 102 is extracted into the space 112 (in an inert gas) through the second electrode 107. Here, since the refractive index of the second electrode 107 is greater than that of the space 112, total reflection may occur at the interface between the second electrode 107 and the space 112. Therefore, it is preferable to provide concavo-convexities on the surface of the second electrode 107 in contact with the space 112. After the light is once extracted into the space 112, components that cannot be extracted into the atmosphere due to total reflection or the like do not occur, so the concavo-convex structure may or may not be provided.

[0067] Also, in the light-emitting device shown in Fig. 5(B), the space is filled with the sealing material 114. In such a configuration, at the interface between the second organic resin layer 100b and the atmosphere, there are conditions for total reflection to occur , so it is preferable to have the concavo-convex structure 118b.

[0068] In a light-emitting device with a dual-emission structure, the first organic resin layer 100a and the second organic​​​​​​ By providing an uneven structure on the surface of the organic resin layer 100b that contacts the atmosphere, light that cannot be extracted into the atmosphere due to the influence of total reflection can be reduced, and the light extraction efficiency of the light-emitting device can be improved. This is possible.

[0069] For other configurations, the same configurations as those in Configuration Example 1 can be applied.

[0070] An example of the material that can be used for each layer is described below.

[0071] [Organic resin layer] As materials for the first organic resin layer 100a and the second organic resin layer 100b, for example, polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, or polyvinyl chloride resin can be used. Also, a substrate impregnated with resin in glass fiber or a substrate in which an inorganic filler is mixed in an organic resin can be used.

[0072] By forming the first organic resin layer 100a and the second organic resin layer 100b with the same material, shape defects due to thermal distortion and physical shock can be suppressed. Therefore, deformation and breakage of the light-emitting device during production and use can be suppressed.

[0073] Also, even when different materials are used for the first organic resin layer 100a and the second organic resin layer 100b, it is preferable to appropriately adjust the combination of materials and the film thickness to form a configuration in which shape defects due to thermal distortion and physical shock are suppressed. ​​​​​​​​​

[0074] [Glass layer] As the materials for the first glass layer 101a and the second glass layer 101b, glass with a thickness of 25 μm or more and 10 0 μm or less can be used.

[0075] The light-emitting device according to one aspect of the present invention uses, as a support substrate and a sealing substrate for the light-emitting element, a substrate in which an organic resin layer and a glass layer are bonded together. Therefore, the light-emitting device can be made lighter in weight. Furthermore, it is possible to suppress the intrusion of moisture or impurities or the like from the outside of the light-emitting device into the organic compounds and metal materials included in the light-emitting element.

[0076] [Light-emitting element] Configuration Examples 1 and 2 are light-emitting devices having a bottom emission structure. Therefore, the first electrode 1 03 has translucency. Also, Configuration Examples 3 and 4 are light-emitting devices having a dual emission structure and. Therefore, the first electrode 103 and the second electrode 107 have translucency.

[0077] As the material having translucency that can be used for the first electrode 103 (or the second electrode 107), indium oxide, indium tin oxide (ITO), indium zinc oxide, zinc oxide, zinc oxide added with gallium, graphene, etc. can be used.

[0078] Also, as the first electrode 103 (or the second electrode 107), metal materials such as gold, platinum, nickel, tungsten, stainless steel, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium can be used. Or, nitrides of these metal materials (for example, titanium nitride) etc. can be used. Note that when using a metal material (or its nitride), it may be made thin enough to have translucency. ​​​

[0079] The EL layer 102 has a layer containing at least a light-emitting organic compound. In addition, a layer containing a substance with high electron transport properties, a layer containing a substance with high hole transport properties, a layer containing a substance with high electron injection properties , a layer containing a substance with high hole injection properties, a layer containing a bipolar substance (a substance with high electron transport and hole transport properties), etc. can be appropriately combined to form a laminated structure. The configuration example of the EL layer 102 will be described in detail in Embodiment 8.

[0080] In Configuration Example 1 and Configuration Example 2, the second electrode 108 is provided on the side opposite to the light extraction side and is formed using a reflective material. As the reflective material, metals such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium can be used. In addition, alloys containing aluminum such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium (aluminum alloy), or alloys containing silver such as an alloy of silver and copper can also be used. An alloy of silver and copper is preferable because of its high heat resistance. Furthermore, oxidation of the aluminum alloy film can be suppressed by laminating a metal film or a metal oxide film in contact with the aluminum alloy film. Examples of the materials for the metal film and the metal oxide film include titanium and titanium oxide.

[0081] [Sealing layer] The sealing layer 110 is in contact with the first glass layer 101a and covers the light-emitting element. The sealing layer 110 is not necessarily required, but by providing it, it is possible to further suppress the intrusion of moisture or impurities, etc. from the outside of the light-emitting element into the organic compounds and metal materials contained in the light-emitting element. Sealing As the material of layer 110, for example, silicon nitride, silicon oxide, alumina, etc. can be used. It is possible.

[0082] [Sealing material] As the sealing material, known materials can be used. For example, thermosetting materials or ultraviolet-curable materials can be used. For the sealing material 114, a material capable of bonding glasses to each other is used, and for the sealing material 116, a material capable of bonding organic resins to each other is used. These materials are preferably materials that hardly permeate moisture and oxygen. Also, a sealing material containing a desiccant can be used. It is possible to put a desiccant in the space 112. For example, substances that absorb moisture by chemical adsorption, such as oxides of alkaline earth metals (calcium oxide, barium oxide, etc.), can be used. As other desiccants, substances that adsorb moisture by physical adsorption, such as zeolite and silica gel, can also be used. In the space 112, a desiccant may be put. For example, substances that absorb moisture by chemical adsorption, such as oxides of alkaline earth metals (calcium oxide, barium oxide, etc.), can be used. As other desiccants, substances that adsorb moisture by physical adsorption, such as zeolite and silica gel, can also be used. These materials are preferably materials that hardly permeate moisture and oxygen. Also, a sealing material containing a desiccant can be used. It is possible to put a desiccant in the space 112. For example, substances that absorb moisture by chemical adsorption, such as oxides of alkaline earth metals (calcium oxide, barium oxide, etc.), can be used. As other desiccants, substances that adsorb moisture by physical adsorption, such as zeolite and silica gel, can also be used.

[0083] In the space 112, a desiccant may be put. For example, substances that absorb moisture by chemical adsorption, such as oxides of alkaline earth metals (calcium oxide, barium oxide, etc.), can be used. As other desiccants, substances that adsorb moisture by physical adsorption, such as zeolite and silica gel, can also be used. As the substances that absorb moisture by chemical adsorption, such as oxides of alkaline earth metals (calcium oxide, barium oxide, etc.), can be used. As other desiccants, substances that adsorb moisture by physical adsorption, such as zeolite and silica gel, can also be used. For the uneven structures 118a and 118b, a stripe shape is also effective, but a matrix shape is preferred. The uneven pattern is not particularly limited, and for example, it can be a shape having vertices such as semi-spherical, conical, pyramidal (triangular pyramid, square pyramid, etc.), umbrella-shaped, etc. For the uneven structures 118a and 118b, a stripe shape is also effective, but a matrix shape is preferred. The uneven pattern is not particularly limited, and for example, it can be a shape having vertices such as semi-spherical, conical, pyramidal (triangular pyramid, square pyramid, etc.), umbrella-shaped, etc.

[0084] [Uneven structure formed on the organic resin layer] The uneven structures 118a and 118b are effective even in a stripe shape, but a matrix shape is preferred. The uneven pattern is not particularly limited, and for example, it can be a shape having vertices such as semi-spherical, conical, pyramidal (triangular pyramid, square pyramid, etc.), umbrella-shaped, etc. For the uneven structures 118a and 118b, a stripe shape is also effective, but a matrix shape is preferred. The uneven pattern is not particularly limited, and for example, it can be a shape having vertices such as semi-spherical, conical, pyramidal (triangular pyramid, square pyramid, etc.), umbrella-shaped, etc. For the uneven structures 118a and 118b, a stripe shape is also effective, but a matrix shape is preferred. The uneven pattern is not particularly limited, and for example, it can be a shape having vertices such as semi-spherical, conical, pyramidal (triangular pyramid, square pyramid, etc.), umbrella-shaped, etc. It is possible.

[0085] Regarding the size and height of the unevenness, it is preferably about 0.1 μm or more and 1000 μm or less, but a structure with a size and height exceeding 1000 μm may also be adopted. In particular, when it is 1 μm or more, it is preferable because the influence due to light interference can be suppressed. Regarding the size and height of the unevenness, it is preferably about 0.1 μm or more and 1000 μm or less, but a structure with a size and height exceeding 1000 μm may also be adopted. In particular, when it is 1 μm or more, it is preferable because the influence due to light interference can be suppressed. Regarding the size and height of the unevenness, it is preferably about 0.1 μm or more and 1000 μm or less, but a structure with a size and height exceeding 1000 μm may also be adopted. In particular, when it is 1 μm or more, it is preferable because the influence due to light interference can be suppressed.

[0086] The pattern is preferably provided so that no gap is formed in adjacent portions. . Therefore, the pattern preferably has a shape that can be arranged on a plane without gaps. Also, the pattern may be formed on the entire surface or a part of the surface of the organic resin layer that contacts the atmosphere. It is preferably formed at least in the light-emitting region.

[0087] As a method of directly forming an uneven structure on the organic resin layer, for example, an etching method, an abrasive grain processing method (sandblasting method), a microblasting method, a droplet discharge method, a printing method (a method in which a pattern is formed such as screen printing or offset printing), a coating method such as a spin coating method, a dipping method, a dispenser method, a nanoimprint method, etc. can be appropriately used.

[0088] Alternatively, a hemispherical lens, a microlens array, a film with an uneven structure, a light diffusion film, etc. may be adhered to the surface of the organic resin layer using a known adhesive or the like to form an uneven structure. formed.

[0089] As described above, the light-emitting device shown in this embodiment uses a substrate in which an organic resin layer and a glass layer are bonded together as a support substrate and a sealing substrate for the light-emitting element. Therefore, the light-emitting device can be made lighter in weight. Furthermore, it is possible to suppress moisture, impurities, etc. from entering the organic compounds and metal materials contained in the light-emitting element from the outside of the light-emitting device.

[0090] Furthermore, in the light-emitting device, by providing an uneven structure on the surface in contact with the atmosphere, light that cannot be taken out to the atmosphere due to the influence of total reflection can be reduced, and the light extraction efficiency of the light-emitting device can be improved.

[0091] ​​​​This embodiment can be freely combined with other embodiments.

[0092] (Embodiment 2) In this embodiment, a method for manufacturing a light-emitting device according to one aspect of the present invention shown in Embodiment 1 will be described with reference to FIGS. 7 and 8.

[0093] <<Manufacturing Method 1>> <<Configuration Example 1>> An example of the manufacturing method of Configuration Example 1 (see FIG. 2(A)) will be described with reference to FIG. 7.

[0094] First, a first glass layer 101a is formed on a first organic resin layer 100a using an adhesive (FIG. 7(A)).

[0095] Next, a light-emitting element (a first electrode 103, an EL layer 102, and a second electrode 108) is formed on the first glass layer 101a.

[0096] The first electrode 103 and the second electrode 108 can be formed by, for example, sputtering or vapor deposition (including vacuum vapor deposition). The EL layer 102 can be formed by methods such as vapor deposition (including vacuum vapor deposition), inkjet printing, or coating.

[0097] Then, a sealing layer 110 is formed on the first glass layer 101a so as to cover the light-emitting element (FIG. 7(B)). In this embodiment, a silicon nitride film is formed using sputtering. .

[0098] Then, the first glass layer 101a and the second glass layer 101b are bonded together using a sealing material 114 (FIG. 7(C)). In this embodiment, a sealing material containing a desiccant is used as the sealing material 114.

[0099] Furthermore, the first organic resin layer 100a and the second organic resin layer 100b are bonded together using a sealing material 116 (Fig. 7(D)). (Fig. 7(D)).

[0100] Through the above steps, the light-emitting device shown in Configuration Example 1 can be fabricated.

[0101] <Configuration Example 2> After the fabrication process of Configuration Example 1, by providing an uneven structure 118a on the surface of the first organic resin layer 100a that contacts the atmosphere, Configuration Example 2 (see Fig. 3) can be fabricated (Fig. 7(E)). (Fig. 7(E)). There is no limitation on the timing of forming the uneven structure 118a in the first organic resin layer 100a. Since it is possible to prevent the uneven structure 118a from being damaged during the process of forming light-emitting elements, etc. or during transportation, it is preferable to form the uneven structure 118a after forming (or encapsulating) light-emitting elements, etc. on the first organic resin layer 100a. (Fig. 7(E)). The other layers can be fabricated using the same fabrication method as in Configuration Example 1. (Fig. 7(E)).

[0102] (Fig. 7(E)).

[0103] <Configuration Example 3> In the fabrication process of the above Configuration Example 1, by forming the second electrode using a material having light-transmitting properties, Configuration Example 3 (see Fig. 4) can be fabricated. The other layers can be fabricated using the same fabrication method as in Configuration Example 1. (Fig. 4). (Fig. 4).

[0104] <Configuration Example 4> After the fabrication process of Configuration Example 3, by providing an uneven structure 118a on the surface of the first organic resin layer 100a that contacts the atmosphere, Configuration Example 4 shown in Fig. 5(A) can be fabricated. Furthermore, by providing an uneven structure 118b on the surface of the second organic resin layer 100b that contacts the atmosphere, Configuration Example 4 shown in Fig. 5(B) can be fabricated. (Fig. 5(A)). (Fig. 5(B)). (Fig. 5(B)).

[0105] The light-emitting device according to one aspect of the present invention shown in Embodiment 1 can be manufactured by the method described above. It is possible.

[0106] <<Manufacturing Method 2>> <<Configuration Example 1>> Another example of the manufacturing method of Configuration Example 1 (see Fig. 2(A)) will be described with reference to Fig. 8.

[0107] First, a light-emitting element (first electrode 103, EL layer 102, and second electrode 108) is formed on the first glass layer 101a. Then, a sealing layer 110 is formed on the first glass layer 101a so as to cover the light-emitting element (Fig. 8(A)). When the first glass layer 101a has flexibility, a roll-to-roll method can be applied in which the light-emitting element is formed on the roll-shaped first glass layer 101a.

[0108]

[0109]

[0110] Next, the first glass layer 101a and the second glass layer 101b are bonded together using a sealing material 114 (Fig. 8(B)). Hereinafter, the configuration shown in Fig. 8(B) will be referred to as laminate A.

[0111]

[0111] In this embodiment, laminate A is disposed between the first organic resin layer 100a and the second organic resin layer 100b, and this is inserted between a pair of pressing rollers. Then, pressure is applied while heating. An adhesive or a sealing material 116 is previously applied (or dropped, laminated, etc.) to the first organic resin layer 100a and the second organic resin layer 100b, and by heating and applying pressure, the first organic resin layer 100a and the second organic resin layer 100b are bonded together to seal laminate A (Fig. 8(C)). Resin layer 100a and the first glass layer 101a, the second organic resin layer 100b and the second glass layer 101b, and the first organic resin layer 100a and the second organic resin layer 100b are adhered to each other respectively. Note that when the adhesive or the sealing material is not thermosetting (for example, ultraviolet curable type, etc.) heating is not required.

[0112] Through the above steps, the light-emitting device shown in Configuration Example 1 can be manufactured.

[0113] <Configuration Example 2> After the manufacturing process of Configuration Example 1, by providing the uneven structure 1 18a on the surface of the first organic resin layer 100a in contact with the atmosphere, Configuration Example 2 (see FIG. 3) can be manufactured (FIG. 8(D)). Alternatively, the first organic resin layer 100a provided with the uneven structure 118a may be bonded to the second organic resin layer 100b using the sealing material 116 The other layers can be manufactured by applying the same manufacturing method as in Configuration Example 1.

[0114] The other layers can be manufactured by applying the same manufacturing method as in Configuration Example 1.

[0115] <Configuration Example 3> In the manufacturing process of the above Configuration Example 1, by forming the second electrode using a material having light-transmitting properties Configuration Example 3 (see FIG. 4) can be manufactured. The other layers can be manufactured by applying the same manufacturing method as in Configuration Example 1.

[0116] <Configuration Example 4> After the manufacturing process of Configuration Example 3, by providing the uneven structure 1 18a on the surface of the first organic resin layer 100a in contact with the atmosphere, Configuration Example 4 shown in FIG. 5(A) can be manufactured. Further, by providing the uneven structure 118b on the surface of the second organic resin layer 100b in contact with the atmosphere, Configuration Example 4 shown in FIG. 5( B) can be manufactured.

[0117] Alternatively, the first organic resin layer 100a provided with the concavo-convex structure 118a and the concavo-convex structure 118b provided with the second organic resin layer 100b are bonded together using the sealing material 116. This may also be acceptable.

[0118] The light-emitting device according to one aspect of the present invention can be manufactured by the manufacturing method described above.

[0119] This embodiment can be freely combined with other embodiments and applied.

[0120] (Embodiment 3) In this embodiment, a light-emitting device according to one aspect of the present invention, which is different from the configuration shown in Embodiment 1, will be described with reference to FIGS. 1 and 6.

[0121] In Embodiment 1, the configuration where the first electrode 103 of the light-emitting element and the first glass layer 101a are in contact was shown (see FIGS. 2 to 5). Generally, the refractive index of glass is about 1.5, which is lower than that of the EL layer 102 (for example, 1.6 or more). Therefore, when light is incident from the first electrode 103 to the first glass layer 101a, total reflection may occur. Therefore, it is preferable to provide a concavo-convex structure between the first electrode 103 and the first glass layer 101a.

[0122] However, if the first electrode 103 has concavo-convexities, there is a risk of leakage current occurring in the EL layer 102 formed on the first electrode 103 and the like.

[0123] The light-emitting device described in this embodiment has a concavo-convex structure on the first glass layer, and a first resin layer is provided on the concavo-convex structure, and a first electrode is provided on the flat first resin layer. Therefore, the occurrence of leakage current in the EL layer and the like can be suppressed.

[0124] Moreover, since it has a concavo-convex structure, light that cannot be extracted into the atmosphere due to the influence of total reflection at the interface between the first glass layer and the first resin layer is reduced, and the light extraction efficiency of the light-emitting device can be improved.

[0125] Moreover, the first resin layer is formed of a material having a refractive index equal to or higher than that of the EL layer (particularly, a layer containing a light-emitting organic compound), thereby realizing a light-emitting device configured to suppress total reflection occurring within the light-emitting device.

[0126] <Configuration Example 5> FIG. 6(A) shows an example of a light-emitting device having a bottom emission structure.

[0127] The light-emitting device shown in FIG. 6(A) includes a first organic resin layer 100a having a concavo-convex structure 118a, a first glass layer 101a having a concavo-convex structure 122a, a first resin layer 124a, a first protection layer 120a, a light-emitting element (a first electrode 103, an EL layer 102, and a second electrode 108) , a second glass layer 101b, and a second organic resin layer 100b.

[0128] Since Configuration Example 5 has a bottom emission structure, the first electrode 103 has translucency.

[0129] In Configuration Example 5, the refractive index of the first resin layer 124a is equal to or higher than the refractive index of the layer containing the light-emitting organic compound included in the EL layer 102 or the refractive index of the first electrode 103. Further, the refractive index of the first protection layer 120a is equal to or higher than the refractive index of the first resin layer 124a. With such a configuration, total reflection can be suppressed at the interface between the first resin layer 124a and the first protection layer 120a and at the interface between the first protection layer 120a and the first electrode 103.

[0130] In Configuration Example 5, the refractive index of the first glass layer 101a is lower than the refractive index of the layer containing the light-emitting organic compound included in the EL layer 102 (for example, 1.6 or more). Therefore, there are conditions under which total reflection occurs at the interface between the first glass layer 101a and the first resin layer 124a. In Configuration Example 5, the first glass layer 101a has a concavo-convex structure 122a on the surface in contact with the first resin layer 124a. Therefore, light incident beyond the critical angle is totally reflected, and it is possible to suppress the phenomenon in which light is guided within the light-emitting device and the light extraction efficiency decreases. At the interface between the first glass layer 101a and the first resin layer 124a, there are conditions for total reflection.

[0131] In Configuration Example 5, the first glass layer 101a has a concavo-convex structure 122a on the surface in contact with the first resin layer 124a. Therefore, light incident beyond the critical angle is totally reflected, and the phenomenon in which light is guided within the light-emitting device and the light extraction efficiency decreases can be suppressed. For other configurations, the same configurations as in Configuration Example 1 can be applied.

[0132] For other configurations, the same configurations as in Configuration Example 1 can be applied.

[0133] <Configuration Example 6> FIG. 6(B) shows an example of a light-emitting device having a dual emission structure.

[0134] The light-emitting device shown in FIG. 6(B) includes a first organic resin layer 100a having a concavo-convex structure 118a, a first glass layer 101a having a concavo-convex structure 122a, a first resin layer 124a, a first protective layer 120a, a light-emitting element (a first electrode 103, an EL layer 102, and a second electrode 107), a second protective layer 120b, a second resin layer 124b, a second glass layer 101b having a concavo-convex structure 122b, and a second organic resin layer 100b having a concavo-convex structure 118b. In Configuration Example 6, since it is a dual emission structure, the first electrode 103 and the second electrode 107 have translucency. a first protective layer 120a, a light-emitting element (a first electrode 103, an EL layer 102, and a second electrode 107), a second protective layer 120b, a second resin layer 124b, a second glass layer 101b having a concavo-convex structure 122b, and a second organic resin layer 100b having a concavo-convex structure 118b. In Configuration Example 6, since it is a dual emission structure, the first electrode 103 and the second electrode 107 have translucency. .

[0135] In Configuration Example 6, since it is a dual emission structure, the first electrode 103 and the second electrode 107 have translucency. In Configuration Example 6, the refractive index of the first resin layer 124a is the same as that of the layer containing the light-emitting organic compound included in the EL layer 102 (for example, 1.6 or more).

[0136] In Configuration Example 6, the refractive index of the first resin layer 124a is the same as that of the layer containing the light-emitting organic compound included in the EL layer 102 (for example, 1.6 or more). It is equal to or greater than the refractive index of the layer containing the organic compound or the refractive index of the first electrode 103. Also, the second The refractive index of the resin layer 124b is equal to or greater than the refractive index of the layer containing the light-emitting organic compound included in the EL layer 102 or equal to or greater than the refractive index of the second electrode 108. Also, the refractive index of the first protective layer 120a is equal to or greater than the refractive index of the first resin layer 124a. Also, the refractive index of the second protective layer 120b is equal to or greater than the refractive index of the second resin layer 124b.

[0137] With such a configuration, at the interface between the first resin layer 124a and the first protective layer 120a, at the interface between the first protective layer 120a and the first electrode 103, at the interface between the second resin layer 124b and the second protective layer 120b, and at the interface between the second protective layer 120b and the second electrode 107, total reflection can be suppressed respectively.

[0138] In Configuration Example 6, the refractive indices of the first glass layer 101a and the second glass layer 101b are lower than the refractive index of the layer containing the light-emitting organic compound included in the EL layer 102 (for example, 1.6 or more). Therefore, at the interface between the first glass layer 101a and the first resin layer 124a, and at the interface between the second glass layer 101b and the second resin layer 124b, there are conditions for total reflection to occur.

[0139] In Configuration Example 6, the first glass layer 101a is provided with a concavo-convex structure 122a on the surface in contact with the first resin layer 124a. Furthermore, the second glass layer 101b is provided with a concavo-convex structure 122b on the surface in contact with the second resin layer 124b. Therefore, light incident beyond the critical angle is totally reflected

[0140] and the phenomenon that light is guided in the light-emitting device and the light extraction efficiency decreases can be suppressed.

[0140] As for other configurations, the same configurations as in Configuration Example 1 can be applied.

[0141] An example of a material that can be used for each layer is described below.

[0142] The organic resin layer, glass layer, light-emitting element, and unevenness formed on the organic resin layer in this embodiment can be formed of the same materials as in Embodiment 1.

[0143] [Resin layer] As materials for the first resin layer 124a and the second resin layer 124b, liquids or resins with a high refractive index and the like can be mentioned. The first resin layer 124a and the second resin layer 124b have translucency. High refractive index resins include resins containing bromine, resins containing sulfur, etc. For example, sulfur-containing polyimide resin, episulfide resin, thiourethane resin, or brominated aromatic resin and the like can be used. Also, PET (polyethylene terephthalate), TAC (triacetyl cellulose) and the like can also be used. As the liquid with a high refractive index, a contact liquid (refractive liquid) containing sulfur and methylene iodide and the like can be used. As the film-forming method , various methods suitable for the material may be applied. For example, the aforementioned resin can be formed by spin-coating and curing it by heat or light. It can be appropriately selected in consideration of the adhesive strength and ease of processing.

[0144] [Protective layer] As the first protective layer 120a and the second protective layer 120b, for example, a silicon nitride film, nitride silicon oxide film, aluminum nitride film, etc. can be used. The first protective layer 120a and the second protective layer 120b do not necessarily have to be provided, but the first resin layer 124a and the second It is possible to prevent moisture from entering the EL layer 102 from the resin layer 124b, and it is possible to suppress a decrease in the life of the light-emitting device. The reduction of the life can be suppressed.

[0145] [The concavo-convex structure formed on the glass layer] The concavo-convex structure can be formed by adhering a hemispherical lens, a microlens array, a film with a concavo-convex structure, a light diffusion film, etc. to the surface of the glass layer using a known adhesive or the like. It can be formed by adhering a hemispherical lens, a microlens array, a film with a concavo-convex structure, a light diffusion film, etc. to the surface of the glass layer using a known adhesive or the like. It can be formed.

[0146] The concavo-convex structure formed on the glass layer has an effect even if it is in a stripe shape, but it is preferably in a matrix shape. The concavo-convex pattern is not particularly limited, and for example, it can be a shape having a vertex such as a hemispherical shape, a circular cone, a pyramid (triangular pyramid, square pyramid, etc.), an umbrella shape. The concavo-convex pattern is not particularly limited, and for example, it can be a shape having a vertex such as a hemispherical shape, a circular cone, a pyramid (triangular pyramid, square pyramid, etc.), an umbrella shape. The concavo-convex pattern is not particularly limited, and for example, it can be a shape having a vertex such as a hemispherical shape, a circular cone, a pyramid (triangular pyramid, square pyramid, etc.), an umbrella shape.

[0147] Regarding the size and height of the concavo-convex, it is preferably about 0.1 μm or more and 1000 μm or less. In particular, when it is 1 μm or more, the influence due to light interference can be suppressed, so it is preferable. Also, the size and height of the concavo-convex affect the amount of material used for the resin layer. When the size and height of the concavo-convex are 100 μm or less, it is possible to suppress the use of a large amount of the material used for the resin layer, which is preferable. In particular, when it is 1 μm or more, the influence due to light interference can be suppressed, so it is preferable. Also, the size and height of the concavo-convex affect the amount of material used for the resin layer. When the size and height of the concavo-convex are 100 μm or less, it is possible to suppress the use of a large amount of the material used for the resin layer, which is preferable. It is preferable.

[0148] In the range of the size of the concavo-convex formed on the glass layer, if the concavo-convex pattern has periodicity, the concavo-convex acts like a diffraction grating, and the interference effect becomes stronger, and light of a specific wavelength may be easily emitted into the atmosphere. Therefore, it is preferable that the concavo-convex pattern has no periodicity. Also, the pattern only needs to be formed at least in the light-emitting region. In the range of the size of the concavo-convex formed on the glass layer, if the concavo-convex pattern has periodicity, the concavo-convex acts like a diffraction grating, and the interference effect becomes stronger, and light of a specific wavelength may be easily emitted into the atmosphere. Therefore, it is preferable that the concavo-convex pattern has no periodicity. Also, the pattern only needs to be formed at least in the light-emitting region.

[0149] As described above, the light-emitting device shown in this embodiment uses a substrate in which an organic resin layer and a glass layer are bonded together as the support substrate and the encapsulation substrate of the light-emitting element. Therefore, the weight of the light-emitting device can be reduced. Further, it is possible to suppress moisture, impurities, etc. from entering the organic compounds and metal materials contained in the light-emitting element from outside the light-emitting device. Furthermore, in the light-emitting device, by providing unevenness on the interface having the condition for total reflection to occur, light incident beyond the critical angle is totally reflected, and the phenomenon that light is guided in the light-emitting device and the light extraction efficiency is reduced can be suppressed. This embodiment can be freely combined with other embodiments.

[0150] Furthermore, in the light-emitting device, by providing unevenness on the interface having the condition for total reflection to occur, light incident beyond the critical angle is totally reflected, and the phenomenon that light is guided in the light-emitting device and the light extraction efficiency is reduced can be suppressed. This embodiment can be freely combined with other embodiments.

[0151] This embodiment can be freely combined with other embodiments.

[0152] (Embodiment 4) In this embodiment, a method for manufacturing the light-emitting device according to one aspect of the present invention shown in Embodiment 3 will be described with reference to FIGS. 9 and 10.

[0153] <Configuration Example 5> An example of the manufacturing method of Configuration Example 5 (see FIG. 6(A)) will be described with reference to FIG. 9.

[0154] First, a first glass layer 101a is formed on the first organic resin layer 100a using an adhesive, and a structure 122a with unevenness is formed on the first glass layer 101a (FIG. 9(A)). Next, a first resin layer 124a is formed on the structure 122a with unevenness. Here, the first resin layer 124a is formed such that the other surface is flatter than the surface in contact with the structure 122a with unevenness (FIG. 9(B)).

[0155] Next, a first resin layer 124a is formed on the uneven structure 122a. Here, the first resin layer 124a is formed so that the other surface is flatter than the surface in contact with the uneven structure 122a. (FIG. 9(B)).

[0156] Then, a first protective layer 120a is formed on the first resin layer 124a, and a light-emitting element (first electrode 103, EL layer 102, and second electrode 108) is formed on the first protective layer 120 a (Fig. 9(C)). (Fig. 9(C)).

[0157] Thereafter, the first glass layer 101a and the second glass layer 101b are bonded together using a sealing material (not shown ). Then, the first organic resin layer 100a and the second organic resin layer 100 b are bonded together using a sealing material. At this time, the first organic resin layer 100a having the concavo-convex structure 118a formed thereon can be bonded to the second organic resin layer 100b. Also , after bonding the first organic resin layer 100a and the second organic resin layer 100b together, the concavo-convex structure 118a may be formed. (Fig. 9(D)).

[0158] Through the above steps, the light-emitting device shown in Configuration Example 5 can be manufactured (Fig. 9(D)).

[0159] Note that, as in Manufacturing Method 2 shown in Embodiment 2, a light-emitting element or the like is manufactured on the first glass layer 101a, and after bonding the first glass layer 101a and the second glass layer 101b together, the first organic resin layer 100a and the second organic resin layer 100b may be bonded to the first glass layer 1 01a or the second glass layer 101b, respectively.

[0160] <Configuration Example 6> An example of the manufacturing method of Configuration Example 6 (see Fig. 6(B)) will be described with reference to Figs. 9 and 10 .

[0161] First, in the same manner as the manufacturing process of Configuration Example 5, a first glass layer 10 1a is formed on the first organic resin layer 100a, and a concavo-convex structure 122a is formed on the first glass layer 101a (Fig. 9(A Next, a first resin layer 124a is formed on the concavo-convex structure 122a. Here, the first resin layer 124a is formed such that the other surface is flatter than the surface in contact with the concavo-convex structure 122a (FIG. 9(B)).

[0162] Then, a first protective layer 120a is formed on the first resin layer 124a, and a light-emitting element (first electrode 103, EL layer 102, and second electrode 108) is formed on the first protective layer 120 a (FIG. 9(C)). (FIG. 9(C)).

[0163] On the other hand, as shown in FIG. 10(A), a concavo-convex structure 122b is provided on the second glass layer 101b , a second resin layer 124b is formed on the concavo-convex structure 122b, and a second protective layer 120b is formed on the second resin layer 124 b. Here, the second resin layer 124b is formed such that the other surface is flatter than the surface in contact with the concavo-convex structure 122b .

[0164] Then, the first glass layer 101a and the second glass layer 101b are bonded together using a sealing material (not shown ) (FIG. 10(B)).

[0165] Furthermore, the first organic resin layer 100a and the second organic resin layer 100b are bonded together using a sealing material . At this time, the first organic resin layer 100a having the concavo-convex structure 118a formed thereon can be bonded to the second organic resin layer 100b having the concavo-convex structure 118b formed thereon . Also, after bonding the first organic resin layer 100a and the second organic resin layer 100b together, the concavo-convex structure 118a and the concavo-convex structure 118b may be formed

[0166] Through the above steps, the light-emitting device shown in Configuration Example 6 can be manufactured (FIG. 10(C)) .

[0167] In addition, like the manufacturing method 2 shown in the second embodiment, a light-emitting element or the like is manufactured on the first glass layer 101a, and after the first glass layer 101a and the second glass layer 101b are bonded together, the first organic resin layer 100a and the second organic resin layer 100b may be bonded to the first glass layer 1 01a or the second glass layer 101b, respectively.

[0168] This embodiment can be freely combined with other embodiments.

[0169] (Embodiment 5) In this embodiment, a light-emitting device according to an aspect of the present invention, which is different from the configuration shown in the previous embodiment, will be described.

[0170] In a light-emitting device, when light is incident from an EL layer into a medium having a refractive index different from that of the EL layer, part of the light is reflected. The greater the difference in refractive index between the two media, the easier it is for the light to be reflected,

[0171] and the light extraction efficiency of the light-emitting device decreases. In the first embodiment, the configuration in which the first electrode 103 of the light-emitting element is in contact with the first glass layer 101a was shown (see FIGS. 2 to 5).

[0172] Generally, the refractive index of glass is about 1.5. The refractive index of the first electrode 103 is, for example, 2.0 when ITO is used. Thus, the first glass layer 101a and the first electrode 103 may have a large difference in refractive index.

[0173] ​​​​​​​The refractive index of the insulating film containing Al, Zn, and O is such that the differences from the refractive index of the glass layer and the refractive index of the electrode are each 0.2 or less. Therefore, reflection of light due to the difference in refractive index can be suppressed.

[0174] Furthermore, when the difference in refractive index from the adjacent layer is 0.15 or less, reflection of light (in the case of normal incidence) due to the difference in refractive index can be suppressed to 1% or less, which is preferable. The smaller the difference in refractive index, the more the reflection of light due to the difference in refractive index can be suppressed.

[0175] <Configuration Example 7> FIG. 11 shows an example of a light-emitting device with a bottom emission structure. FIG. 11 corresponds to the cross-sectional view between A and B in FIG. 1.

[0176] The light-emitting device shown in FIG. 11 has a first organic resin layer 100a, a first glass layer 101a, an insulating film 138, a light-emitting element (a first electrode 103, an EL layer 102, and a second electrode 108), a sealing layer 110, a second glass layer 101b, and a second organic resin layer 100b.

[0177] Since Configuration Example 7 has a bottom emission structure, the first electrode 103 has translucency.

[0178] In Configuration Example 7, the sealing layer 110 is configured to cover the entire insulating film 138 and the light-emitting element. However, the present invention is not limited to this. For example, the sealing layer 110 may be formed on a part of the insulating film 138 and configured to cover the light-emitting element.

[0179] The refractive index of the insulating film 138 is set such that the difference from the refractive index of the adjacent layer is 0.2 or less. The insulating film 138 is composed of an insulating film containing one or more layers of Ga or Al, Zn, and O.

[0180] ​​​​​The refractive index of the first glass layer 101a is 1.5, and the refractive index of the first electrode 103 is 2.0 In a case where, for example, the insulating film 138 is composed of two layers, a first layer on the first glass layer 101a is provided with an insulating film containing Ga, Zn, and O with a refractive index of 1.7, and on this insulating film, a first elec trode 103 is provided with an insulating film containing Ga, Zn, and O with a refractive index of 1.8 in contact therewith, whereby reflection of light due to the difference in refractive index can be suppressed.

[0181] The insulating film 138 has translucency. Therefore, it does not inhibit the extraction of light and can be suitably used.

[0182] The insulating film 138 may contain nitrogen (N). By combining these elements for production it is possible to set the refractive index of the insulating film to a desired value while maintaining translucency with respect to visible light.

[0183] For example, materials used for the insulating film 138 include Ga-Zn-O-based materials, Al-Zn-O -based materials, Ga-Zn-O-N-based materials, Al-Zn-O-N-based materials, Ga-Al-Z n-O-based materials, and Ga-Al-Zn-O-N-based materials. Here, for example, the G a-Zn-O-based material means a material mainly composed of gallium, zinc, and oxygen.

[0184] Further, it is preferable that the sum of Ga, Al, Zn, O, and N in the insulating film 138 is 0.90 or more in atomic ratio and particularly preferably 0.97 or more. In other words, the sum of elements other than Ga, Al, Zn, O, and N is preferably 0.10 or less in atomic ratio, and particularly preferably 0.03 or less.

[0185] ​​The insulating film 138 is formed, for example, by using a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO =1:5 to 5:1 [molar ratio]) in an oxygen atmosphere or an argon and oxygen (flow rate ratio is, as an example, argon:oxygen = 7:3) mixed atmosphere by sputtering method . Also, it can be obtained by using an Al-Zn-O-based metal oxide target (Al2O3:Zn O = 1:5 to 5:1 [molar ratio]) and forming a film in a similar atmosphere . Further, by forming a film of the same target in an argon, oxygen and nitrogen (flow rate ratio is, as an example, arg on:oxygen:nitrogen = 3:6:1) mixed atmosphere, an insulating film containing Ga or A l containing nitrogen, Zn, and O can be obtained.

[0186] When the resistivity of the insulating film 138 at 20 °C is 10 10 Ωcm or more, the insulating film 138 can have sufficient insulation properties, which is preferable.

[0187] As described above, the light-emitting device shown in this embodiment uses a substrate in which an organic resin layer and a glass layer are bonded together as the support substrate and the sealing substrate of the light-emitting element. Therefore, the light-emitting device can be made lighter . Further, it is possible to suppress moisture, impurities, etc. from entering the organic compounds and metal materials contained in the light-emitting element from the outside of the light-emitting device.

[0188] Furthermore, in the light-emitting device, by providing one or more insulating films containing Ga or Al, Zn, and O between two layers with a large difference in refractive index, it is possible to suppress light reflection due to the difference in refractive index and provide a light-emitting device with high light extraction efficiency.

[0189] This embodiment can be freely combined with other embodiments. ​​

[0190] (Embodiment 6) In this embodiment, a modified example of the light-emitting device according to one aspect of the present invention shown in Embodiment 1 will be described.

[0191] The light-emitting device according to one aspect of the present invention employs a substrate in which an organic resin layer and a thin glass layer are bonded together. Therefore, when the thin glass layer has a thickness such that it has flexibility, a light-emitting device having a curved surface or a flexible light-emitting device can be realized.

[0192] <Modified Example> The light-emitting device having a curved surface shown in FIG. 12(D) includes a first organic resin layer 100a, a first glass layer 101a, a light-emitting element (a first electrode 103, an EL layer 102, and a second electrode 108), a sealing layer 110, a second glass layer 101b, and a second organic resin layer 100b.

[0193] In the modified example, the first glass layer 101a is made of glass having a thickness thin enough to have flexibility. For example, the first glass layer 101a can have a thickness of 25 μm or more and 75 μm or less.

[0194] As for the other configurations, the same configurations as those of Configuration Example 1 shown in Embodiment 1 can be applied.

[0195] An example of the manufacturing method of the modified example will be described.

[0196] First, the first glass layer 101a is formed on the first organic resin layer 100a having a curved surface using an adhesive (FIG. 12(A)).

[0197] Next, a light-emitting element (a first electrode 103, an EL layer 102, and a second electrode 108) is formed on the first glass layer 101a. ​​​​​​​

[0198] Then, a sealing layer 110 is formed on the first glass layer 101a so as to cover the light-emitting element. (Fig. 12(B)).

[0199] Then, the first glass layer 101a and the second glass layer 101b are bonded together using a sealing material 114 (Fig. 12(C)). At this time, the space 112 is filled with an inert gas.

[0200] Furthermore, the first organic resin layer 100a and the second organic resin layer 100b are bonded together using a sealing material (not shown) (Fig. 12(D)).

[0201] Through the above steps, the light-emitting device shown as a modified example can be manufactured.

[0202] Next, another example of the manufacturing method of the modified example will be described.

[0203] First, a light-emitting element is formed on the first glass layer 101a. Then, a sealing layer 110 is formed on the first glass layer 10 1a so as to cover the light-emitting element (Fig. 13(A)).

[0204] Here, since the first glass layer 101a has flexibility, a roll-to-roll method can be applied to form a light-emitting element on the roll-shaped first glass layer 10 1a.

[0205] Next, the first glass layer 101a and the second glass layer 101b are bonded together using a sealing material 114 (Fig. 13(B)). Hereinafter, the structure shown in Fig. 13(B) is referred to as laminate B.

[0206] Finally, the first organic resin layer 100a and the second organic resin layer 100b having a curved surface are bonded together using a sealing material 116 to seal the laminate B (Fig. 13(C)).

[0207] For example, as described in the previous embodiment, using a pressure roller, the first organic resin layer 100 a and the first glass layer 101a, the second organic resin layer 100b and the second glass layer 101b and the first organic resin layer 100a and the second organic resin layer 100b can be adhered to each other respectively.

[0208] Through the above steps, the light-emitting device shown as a modified example can be manufactured.

[0209] As described above, the light-emitting device shown in this embodiment uses a substrate in which an organic resin layer and a glass layer are laminated as the support substrate and the sealing substrate of the light-emitting element. Therefore, the light-emitting device can be made lighter. Furthermore, it is possible to prevent moisture, impurities, etc. from entering the organic compounds and metal materials contained in the light-emitting element from the outside of the light-emitting device. Furthermore, since the thin glass layer used in this embodiment has a thickness that provides flexibility, it is possible to realize a light-emitting device having a curved surface.

[0210] This embodiment can be freely combined with other embodiments.

[0211]

[0212] (Embodiment 7) In this embodiment, a configuration in which a converter is incorporated in a light-emitting device according to an aspect of the present invention will be described with reference to FIG. 14. In the following description, descriptions of the same parts as those in the above embodiment will be omitted. Here, in this embodiment, the converter refers to a constant current power supply that converts the input power into a constant current suitable for the specifications of the light-emitting device and inputs it to the light-emitting device, or converts it into a constant voltage suitable for the specifications and inputs it to the light-emitting device.

[0213] inputs it to the light-emitting device, or a constant voltage power supply that converts it into a constant voltage suitable for the specifications and ​​This refers to a converter circuit that functions as a constant voltage power supply input to a light-emitting device.

[0214] FIG. 14(B) is a cross-sectional view of the light-emitting device shown in FIG. 14(A) between C and D and between E and F. In FIG. 14(A), a part of the configuration shown in FIG. 14(B) is omitted.

[0215] The light emitting device of this embodiment includes a first organic resin layer 100a, a first glass layer 101a, a light emitting The element (the first electrode 103, the EL layer 102, and the second electrode 108), the sealing layer 110, the second The insulating film 100 includes a first glass layer 101b, a second organic resin layer 100b, and a converter 150.

[0216] In FIG. 14(A), the first electrode 103 is electrically connected to the converter 150. The second electrode 108 is electrically connected to the connection electrodes 411a and 411b. The connection electrode 411a is electrically connected to the converter 150. The connection electrode 411b is Electrical connection is made to converter 150 via line 135 .

[0217] In the CD cross section of FIG. 14(B), the first glass layer 10 is formed on the first organic resin layer 100a. 1a is formed, and a first electrode 103 is formed so as to cover the edge of the first glass layer 101a. It is provided.

[0218] A sealant 114 is provided between the first electrode 103 and the second glass layer 101b. A sealant 116 is provided between the first electrode 103 and the second organic resin layer 100b.

[0219] The portion of the first electrode 103 that is connected to the converter 150 is called an extraction electrode 410. a, and the portion of the first electrode 103 that is connected to the connection wiring 135 is taken out as an electrode 410 Let's call it b.

[0220] In FIG. 14(B), the connection electrodes 411a and 411b are on the same plane as the extraction electrodes 410a and 410b. On the extraction electrode 410a and the connection electrode 411a, a converter 150 is provided. The extraction electrode 410b and the connection electrode 411b are electrically connected to the converter 150 via a connection wiring 1 35. Therefore, the first electrode 10 3 and the second electrode 108 are electrically connected to the converter 150, and a current applied according to the specifications by the converter 150 is input to the light-emitting element. Since currents are input to the light-emitting element from both ends and are dispersed, reduction of luminance unevenness and concentration of load on a part of the light-emitting element are suppressed.

[0221] As the connection wiring 135, a metal wiring or the like can be used. Also, a printed circuit board on which the wiring is mounted may be used.

[0222] In FIG. 14(A), the connection wiring 135 passes over the non-light-emitting region of the light-emitting device and electrically connects the extraction electrode 410b or 411b and the converter 150. The arrangement of the connection wiring is not limited to this configuration, but it is preferably arranged so as not to reduce the light extraction efficiency of the light-emitting device. For example, in a light-emitting device configured to extract light from one side, it is also possible to pass it on the substrate on the side where light is not emitted. The connection wiring and the converter can be provided outside the light-emitting device, but as shown in the present embodiment, by providing them in the non-light-emitting region of the light-emitting device, the non-light-emitting region on the first organic resin layer 100a can be utilized.

[0223] The connection wiring 135 and the converter 150 are encapsulated by an encapsulating resin 151.​​​​​​​​ For the sealing resin 151, epoxy resins, acrylic resins, silicone resins, phenolic resins, etc. can be used.

[0224] The converter 150 is a DC / DC converter. As shown in the E-F cross-section of Fig. 14(B), the converter 150 has a printed circuit board 140, a first circuit element 130a, a second circuit element 130b, and a third circuit element 130c.

[0225] The printed circuit board 140 is provided with an opening that penetrates from the upper surface to the lower surface. By embedding a conductive material such as a silver paste or solder in the opening by plating or the like, the light-emitting element and the converter 1 50 are electrically connected.

[0226] To create an opening that penetrates the printed circuit board 140, mechanical polishing methods using an end mill, punching, sand blasting, etc., chemical polishing methods using a laser, etching, etc., or a method combining these can be used.

[0227] In this embodiment, the printed circuit board 140 is a printed circuit board with a conductive material coated on one side of an insulating substrate. When using a printed circuit board, the insulation on the connection surface between the printed circuit board and the extraction electrode and the connection electrode is guaranteed, so that the alignment when arranging on the extraction electrode and the connection electrode can be easily performed. Also, for the printed circuit board 140, a flexible flexible printed circuit board (FPC) or a semi-flexible printed circuit board having flexibility in part may be used. By using a flexible printed circuit board, a converter can be incorporated into a flexible light-emitting device or a light-emitting device having a curved surface.

[0228] On the printed circuit board 140, a first circuit element 130a, a second circuit element 130b, and a third circuit element 130c are provided. The first circuit element 130a, the second circuit element 130b, and the third circuit element 130c are electrically connected on the printed circuit board to form a DC / DC converter circuit. Examples of the first circuit element 130a, the second circuit element 130b, and the third circuit element 130c include a switch, a transistor, a capacitive element, a diode, an inductor, a semiconductor chip, and the like. The first circuit element 130a, the second circuit element 130b, and the third circuit element 130c may well form a circuit that functions as a DC / DC converter, and the specific circuit configuration thereof will not be mentioned. Also, a configuration may be adopted in which some elements constituting the converter are provided on the printed circuit board 140 and the remaining elements are connected from the outside.

[0229] The first circuit element 130a, the second circuit element 130b, and the third circuit element 130c are electrically connected to the extraction electrode 410a and the connection electrode 411a through openings provided in the printed circuit board 140. Therefore, a voltage conforming to the specifications is input to the light-emitting element by the converter 150. At the other end of the light-emitting element, the converter 150 and the light-emitting element are electrically connected through the connection wiring 135.

[0230] As a method of providing the converter 150 on the extraction electrode 410a and the connection electrode 411a, the printed circuit board 140 previously provided with the first circuit element 130a, the second circuit element 130b, and the third circuit element 130c may be connected onto the extraction electrode 410a and the connection electrode 411a using an adhesive or the like, or a conductive material may be poured into the openings of the printed circuit board 140. Using this, the extraction electrode 410a, the connection electrode 411a, and the printed circuit board 140 may be connected. It may be.

[0231] When providing the converter 150 on the extraction electrode 410a and the connection electrode 411a, in order to prevent an increase in the thickness of the light-emitting device, circuit elements included in the converter 150 may be formed so as to be embedded in the first organic resin layer 100a.

[0232] For example, the second circuit element 130b in FIG. 14(B) is provided so as to be embedded in an opening provided in the printed circuit board 140 and the first organic resin layer 100a.

[0233] Also, as shown in FIG. 14(C), when an uneven structure 118a is provided in the light-emitting region of the light-emitting device, a configuration in which the second circuit element 130b penetrates through the opening of the first organic resin layer 100a may also be adopted. It can be adopted.

[0234] By applying these configurations, a light-emitting device having the same thickness as a configuration including a converter and a configuration not including a converter can be realized. It is possible to realize.

[0235] The opening for embedding the second circuit element 130b is provided in a region on the first organic resin layer 100a where the extraction electrode and the connection electrode do not exist. The opening may be appropriately adjusted in width and height so that the second circuit element 130b can be embedded. The opening may be provided in different processes for the first organic resin layer 100a and the printed circuit board 140, respectively, or may be provided simultaneously for the first organic resin layer 100a and the printed circuit board 140 after arranging the printed circuit board 140 on the first organic resin layer 100a. It may be provided in different processes for the first organic resin layer 100a and the printed circuit board 140, respectively, or may be provided simultaneously for the first organic resin layer 100a and the printed circuit board 140 after arranging the printed circuit board 140 on the first organic resin layer 100a. It may be provided.

[0236] The method for fabricating the opening of the first organic resin layer 100a can use mechanical polishing using an end mill, sandblasting, etc., chemical polishing such as laser or etching, or a combination of these methods. can be used.

[0237] Also, as shown in FIG. 14(C), when using the first organic resin layer 100a having the concavo-convex structure 118a, a part of the organic resin material constituting the first organic resin layer 100a can be processed to provide the concavo-convex structure 118a. At this time, when processing a part of the organic resin material, an opening may be formed simultaneously. Moreover, when fabricating an opening in the printed circuit board 140, it is preferable to simultaneously fabricate the opening with the extraction electrode 410a and the connection electrode 411a because the number of working steps is reduced.

[0238] By adopting the configuration in which the converter is built in the light-emitting device as described above, even if the input voltage changes, it has the function of supplying a stable current suitable for the element, so that the problem of overcurrent flowing through the light-emitting element can be prevented.

[0239] Note that the converter included in the light-emitting device shown in this embodiment is not limited to a DC / DC converter, and an AC / DC converter that converts an AC voltage into a DC voltage may also be used. When using an AC / DC converter, an AC power supply can be directly applied and used.

[0240] In addition, the converter included in the light-emitting device of this embodiment is not limited to a DC / DC converter, and an AC / DC converter that converts an AC voltage into a DC voltage may also be used. When using an AC / DC converter, an AC power supply can be directly applied and used.

[0241] Also, in the light-emitting device of this embodiment, one converter is electrically connected to one light-emitting element, but the present invention is not limited to this configuration. When the light-emitting device includes a plurality of light-emitting elements, not only a configuration in which the same number of converters as the number of light-emitting elements are provided, but also a configuration in which a plurality of A configuration for electrically connecting the light-emitting element can be adopted.

[0242] In this embodiment, a light-emitting device having a bottom emission structure has been described, but it can be applied to any of the light-emitting devices having the configuration examples described in other embodiments.

[0243] In one aspect of the present invention, by incorporating a converter into the light-emitting device, a light-emitting device that can be used without providing a converter externally can be provided, thereby expanding the range of use of the light-emitting device. It spreads.

[0244] Also, by providing a converter or connection wiring on the non-light-emitting area of the light-emitting device, effective use of space can be achieved.

[0245] As described above, the light-emitting device described in this embodiment uses a substrate in which an organic resin layer and a glass layer are bonded together as the support substrate and the sealing substrate of the light-emitting element. Therefore, the light-emitting device can be made lighter. Furthermore, it is possible to suppress the intrusion of moisture, impurities, etc. from the outside of the light-emitting device into the organic compounds and metal materials contained in the light-emitting element.

[0246] This embodiment can be freely combined with other embodiments.

[0247] (Embodiment 8) In this embodiment, an example of an EL layer applicable to one aspect of the present invention will be described with reference to FIG. 15.

[0248] The EL layer 102 shown in FIG. 15(A) is provided between the first electrode 103 and the second electrode 108. The first electrode 103 and the second electrode 108 can have the same configuration as that in Embodiment 1.

[0249] In this embodiment, the EL layer 102 includes, from the side of the first electrode 103, a hole injection layer 701, a hole transport layer 702, a layer 703 containing a light-emitting organic compound, an electron transport layer 704, and an electron injection layer 705, which are laminated in this order.

[0250] A method for manufacturing the light-emitting element shown in Fig. 15(A) will be described.

[0251] The hole injection layer 701 is a layer containing a substance with high hole injection properties. Examples of substances with high hole injection properties include, for example, metal oxides such as molybdenum oxide, titanium oxide, vanadium oxide, rhenium oxide, ruthenium oxide, chromium oxide, zirconium oxide, hafnium oxide, tantalum oxide, silver oxide, tungsten oxide, manganese oxide, etc. It is also possible to use phthalocyanine-based compounds such as phthalocyanine (abbreviation: H2Pc), copper(II) phthalocyanine (abbreviation: C uPc). Moreover, 4,4',4''-tris(N,N-diphenylamino

[0252] ) triphenylamine (abbreviation: TDATA), 4,4',4''-tris[N-(3-methylphenyl)- N-phenylamino] triphenylamine (abbreviation: MTDATA), 4 ,4'-bis[N-(4-diphenylaminophenyl)-N-phenylamino] biphenyl (abbreviation: DPAB), 4,4'-bis(N-{4-[N'-(3-methylphenyl)- N'-phenylamino]phenyl}-N-phenylamino) biphenyl (abbreviation: DNTP D), 1,3,5-tris[N-(4-diphenylaminophenyl)-N-phenylamino benzene (abbreviation: DPA3B), 3-[N-(9-phenylcarbazol-3-yl ), etc., which are low-molecular organic compounds, can also be used. )-N-Phenylamino]-9-phenylcarbazole (abbreviation: PCzPCA1), 3, 6-bis[N-(9-phenylcarbazol-3-yl)-N-phenylamino]-9- phenylcarbazole (abbreviation: PCzPCA2), 3-[N-(1-naphthyl)-N-( 9-phenylcarbazol-3-yl)amino]-9-phenylcarbazole (abbreviation: P CzPCN1) and other aromatic amine compounds can be used.

[0253] Furthermore, high molecular compounds (oligomers, dendrimers, polymers, etc.) can also be used. . For example, poly(N-vinylcarbazole) (abbreviation: PVK), poly(4-vinyltri enylamine) (abbreviation: PVTPA), poly[N-(4-{N’-[4-(4-dipheny lamino)phenyl]phenyl-N’-phenylamino}phenyl)methacrylamide] (abbreviation: PTPDMA), poly[N,N’-bis(4-butylphenyl)-N,N’-bi s(phenyl)benzidine] (abbreviation: Poly-TPD) and other high molecular compounds can be mentioned. In addition, high molecular compounds added with acids such as poly(3,4-ethylenedioxythiophene) / poly(styrenesulfonic acid) (PEDOT / PSS), polyaniline / poly(styrenesulfonic acid) (PAni / PS S) can be used.

[0254] In particular, as the hole injection layer 701, it is preferable to use a composite material in which a hole transporting organic compound contains an acceptor substance. By using a composite material in which a substance with high hole transporting property contains an acceptor substance, the hole injection property from the first electrode 103 can be improved, and the driving voltage of the light emitting element can be reduced. These composite materials have high hole transporting property. It can be formed by co-evaporating a donor substance and an acceptor substance. The composite material is used to form a hole injection layer 701, facilitating hole injection from the first electrode 103 to the EL layer 102 .

[0255] As the organic compound used in the composite material, various compounds such as aromatic amine compounds, carbazole derivatives, aromatic hydrocarbons, and polymer compounds (oligomers, dendrimers, polymers, etc.) can be used. It should be noted that the organic compound used in the composite material is preferably an organic compound with high hole transportability. Specifically, it is preferably a substance having a hole mobility of 10 cm -6 / Vs or more. However, as long as it is a substance with higher hole transportability than electrons, other substances can also be used. Hereinafter, the organic compounds that can be used in the composite material will be specifically listed 2 .

[0256] Examples of the organic compounds that can be used in the composite material include TDATA, MTDATA , DPAB, DNTPD, DPA3B, PCzPCA1, PCzPCA2, PCzPCN 1, 4,4'-bis[N-(1-naphthyl)-N-phenylamino]biphenyl (abbreviation: NPB or α-NPD), N,N'-bis(3-methylphenyl)-N,N'-diphenyl -4,4'-diamine (abbreviation: TPD), 4-phenyl- 4'-(9-phenylfluoren-9-yl)triphenylamine (abbreviation: BPAFLP ) and other aromatic amine compounds, 4,4'-di(N-carbazolyl)biphenyl (abbreviation: C BP), 1,3,5-tris[4-(N-carbazolyl)phenyl]benzene (abbreviation: T ​​​CPB), 9-[4-(10-phenyl-9-anthryl)phenyl]-9H-carbazole -yl (abbreviation: CzPA), 9-phenyl-3-[4-(10-phenyl-9-anthryl )phenyl]-9H-carbazole (abbreviation: PCzPA), 1,4-bis[4-(N-c arbazolyl)phenyl]-2,3,5,6-tetraphenylbenzene and other carbazole derivatives can be used.

[0257] Also, 2-tert-butyl-9,10-di(2-naphthyl)anthracene (abbreviation: t- BuDNA), 2-tert-butyl-9,10-di(1-naphthyl)anthracene, 9 ,10-bis(3,5-diphenylphenyl)anthracene (abbreviation: DPPA), 2-t ert-butyl-9,10-bis(4-phenylphenyl)anthracene (abbreviation: t-B uDBA), 9,10-di(2-naphthyl)anthracene (abbreviation: DNA), 9,10- diphenylanthracene (abbreviation: DPAnth), 2-tert-butylanthracene ( abbreviation: t-BuAnth), 9,10-bis(4-methyl-1-naphthyl)anthracene (abbreviation: DMNA), 9,10-bis[2-(1-naphthyl)phenyl]-2-tert -butylanthracene, 9,10-bis[2-(1-naphthyl)phenyl]anthracene , 2,3,6,7-tetramethyl-9,10-di(1-naphthyl)anthracene and other aromatic hydrocarbon compounds can be used.

[0258] Furthermore, 2,3,6,7-tetramethyl-9,10-di(2-naphthyl)anthracene, 9,9’-bianthryl, 10,10’-diphenyl-9,9’-bianthryl, 10, 10’-bis(2-phenylphenyl)-9,9’-bianthryl, 10,10’-bis [(2,3,4,5,6-Pentaphenyl)phenyl]-9,9'-bianthryl, anthracene acene, tetracene, rubrene, perylene, 2,5,8,11-tetra(tert-butyl) perylene, pentacene, coronene, 4,4'-bis(2,2-diphenylvinyl) biphenyl (abbreviation: DPVBi), 9,10-bis[4-(2,2-diphenylvinyl) phenyl]anthracene (abbreviation: DPVPA), and other aromatic hydrocarbon compounds can be used. It is possible.

[0259] In addition, as the electron acceptor, 7,7,8,8-tetracyano-2,3,5,6-tetrafluoroquinodimethane (abbreviation: F4-TCNQ), organic compounds such as chloranil, and transition metal oxides can be mentioned. Also, oxides of metals belonging to Groups 4 to 8 in the periodic table of elements can be mentioned. Specifically, vanadium oxide, niobium oxide, tantalum oxide, chromium oxide, molybdenum oxide, tungsten oxide, manganese oxide, and rhenium oxide are preferred because of their high electron accepting properties. Among them, molybdenum oxide is particularly preferred because it is stable even in the atmosphere, has low hygroscopicity, and is easy to handle. high electron accepting properties, so it is preferred. Among them, molybdenum oxide is particularly preferred because it is stable even in the atmosphere, has low hygroscopicity, and is easy to handle.

[0260] Note that composite materials can be formed using the above-mentioned polymer compounds such as PVK, PVTPA, PTPDMA, and Poly-TPD and the above-mentioned electron acceptor, and they can also be used for the hole injection layer 701.

[0261] The hole transport layer 702 is a layer containing a substance with high hole transport properties. As a substance with high hole transport properties for example, NPB, TPD, BPAFLP, 4,4'-bis[N-(9,9-dimethyl fluoren-2-yl)-N-phenylamino]biphenyl (abbreviation: DFLDPBi) , 4,4'-bis[N-(spiro-9,9'-bifluoren-2-yl)-N-phenyl aromatic amine compounds such as amino]biphenyl (abbreviation: BSPB) can be used. The substances described here mainly have a hole mobility of 10 -6 cm 2 / Vs or more. However, as long as the substance has higher hole transportability than electrons, other substances may be used. Note that the layer containing a substance with high hole transportability may be not only a single layer, but also a layer formed by laminating two or more layers of the above substances.

[0262] In addition, for the hole transport layer 702, carbazole derivatives such as CBP, CzPA, and PCzPA or anthracene derivatives such as t-BuDNA, DNA, and DPAnth may be used.

[0263] In addition, for the hole transport layer 702, any polymer compound such as PVK, PVTPA, PTPDMA, and Poly-TPD can be used.

[0264] The layer 703 containing a light-emitting organic compound can use a fluorescent compound that emits fluorescence or a phosphorescent compound that emits phosphorescence.

[0265] Examples of fluorescent compounds that can be used for the layer 703 containing a light-emitting organic compound include , as a blue light-emitting material, N,N'-bis[4-(9H-carbazol-9-yl)phenyl]-N,N'-diphenylstilbene-4,4'-diamine (abbreviation: YGA2S) , 4-(9H-carbazol-9-yl)-4'-(10-phenyl-9-anthryl) triphenylamine (abbreviation: YGAPA), 4-(10-phenyl-9-anthryl)- ​​​​4'-(9-Phenyl-9H-carbazol-3-yl)triphenylamine (abbreviation: P CBAPA), etc. can be mentioned. Also, as a green light-emitting material, N-(9,10-dif enyl-2-anthryl)-N,9-diphenyl-9H-carbazole-3-amine (abbreviation: 2PCAPA), N-[9,10-bis(1,1'-biphenyl-2-yl)-2- anthryl]-N,9-diphenyl-9H-carbazole-3-amine (abbreviation: 2PCA BPhA), N-(9,10-diphenyl-2-anthryl)-N,N',N'-triphenyl -1,4-phenylenediamine (abbreviation: 2DPAPA), N-[9,10-bis( 1,1'-biphenyl-2-yl)-2-anthryl]-N,N',N'-triphenyl -1,4-phenylenediamine (abbreviation: 2DPABPhA), N-[9,10-bis(1 ,1'-biphenyl-2-yl)]-N-[4-(9H-carbazol-9-yl)phenyl nil]-N-phenylanthracene-2-amine (abbreviation: 2YGABPhA), N,N, 9-triphenylanthracene-9-amine (abbreviation: DPhAPhA), etc. can be mentioned. . Also, as a yellow light-emitting material, rubrene, 5,12-bis(1,1'-biphenyl- 4-yl)-6,11-diphenyltetracene (abbreviation: BPT), etc. can be mentioned. Also , as a red light-emitting material, N,N,N',N'-tetrakis(4-methylphenyl)tetra racene-5,11-diamine (abbreviation: p-mPhTD), 7,14-diphenyl-N, N,N',N'-tetrakis(4-methylphenyl)acenaphtho[1,2-a]fluorene -3,10-diamine (abbreviation: p-mPhAFD), etc. can be mentioned.

[0266] In addition, examples of the phosphorescent compound that can be used for the layer 703 containing a light-emitting organic compound include For example, as a blue light-emitting material, bis[2-(4’,6’-difluorophenyl)pyridine-N,C dinato-N,C 2’ iridium(III) tetrakis(1-pyrazolyl)borate (abbreviation: FIr6), bis[2-(4’,6’-difluorophenyl)pyridinato-N,C iridium(III) picolinate (abbreviation: FIrpic), bis{2-[3’,5 2 ’ ’-bis(trifluoromethyl)phenyl]pyridinato-N,C }iridium(III 2’ I) picolinate (abbreviation: Ir(CF3ppy)2(pic)), bis[2-(4’,6 ’-difluorophenyl)pyridinato-N,C iridium(III) acetylacet 2’ tonate (abbreviation: FIr(acac)), etc. Further, as a green light-emitting material, tris(2-phenylpyridinato-N,C 2’ )iridium(III) (abbreviation: Ir (ppy)3), bis(2-phenylpyridinato-N,C(ppy)3)、ビス(2-フェニルピリジナト-N,C 2’ )iridium(III) ac etylacetonate (abbreviation: Ir(ppy)2(acac)), bis(1,2-diphenyl -1H-benzimidazolato)iridium(III) acetylacetonate (abbreviation: I r(pbi)2(acac)), bis(benzo[h]quinolinato)iridium(III) acetylacetonate (abbreviation: Ir(bzq)2(acac)), tris(benzo[h] quinolinato)iridium(III) (abbreviation: Ir(bzq)3), etc. are included. Also as a yellow light-emitting material, bis(2,4-diphenyl-1,3-oxazolato-N,C 2’Iridium(III) acetylacetonate (abbreviation: Ir(dpo)2(acac ))、bis[2-(4’-perfluorophenylphenyl)pyridinato]iridium(I II) acetylacetonate (abbreviation: Ir(p-PF-ph)2(acac)), bis( 2-phenylbenzothiazolato-N,C 2’ ) iridium(III) acetylacetonato (abbreviation: Ir(bt)2(acac)), (acetylacetonato)bis[2,3-bis (4-fluorophenyl)-5-methylpyrazinato]iridium(III) (abbreviation: Ir (Fdppr-Me)2(acac)), (acetylacetonato)bis{2-(4-meth oxyphenyl)-3,5-dimethylpyrazinato}iridium(III) (abbreviation: Ir(d mmoppr)2(acac)) and the like. Also, as orange light-emitting materials, tris (2-phenylquinolinato-N,C 2’ ) iridium(III) (abbreviation: Ir(pq )3), bis(2-phenylquinolinato-N,C 2’ ) iridium(III) acetylacetonato (abbreviation: Ir(pq)2(acac)), (acetylacetonato)bis(3, 5-dimethyl-2-phenylpyrazinato)iridium(III) (abbreviation: Ir(mppr -Me)2(acac)), (acetylacetonato)bis(5-isopropyl-3-methyl yl-2-phenylpyrazinato)iridium(III) (abbreviation: Ir(mppr-iPr) 2(acac)) and the like. Also, as red light-emitting materials, bis[2-(2’ -benzo[4,5-α]thienyl)pyridinato-N,C 3’ iridium(III) acety lacetonato (abbreviation: Ir(btp)2(acac)), bis(1-phenylisox Norinato-N,C 2’ ) Iridium(III) acetylacetonate (abbreviation: Ir(pi q)2(acac)), (acetylacetonato)bis[2,3-bis(4-fluorophen yl)quinoxalinato]iridium(III) (abbreviation: Ir(Fdpq)2(acac) ), (acetylacetonato)bis(2,3,5-triphenylpyrazinato)iridium( III) (abbreviation: Ir(tppr)2(acac)), (dipivaloylmethanato)bis( 2,3,5-triphenylpyrazinato)iridium(III) (abbreviation: Ir(tppr) 2(dpm)), 2,3,7,8,12,13,17,18-octaethyl-21H,2 3H-porphyrin platinum(II) (abbreviation: PtOEP) and other organometallic complexes can be mentioned. In addition, tris(acetylacetonato)(monophenanthroline) terbium(III)( abbreviation: Tb(acac)3(Phen)), tris(1,3-diphenyl-1,3-pro pandionato)(monophenanthroline) europium(III) (abbreviation: Eu(DBM )3(Phen)), tris[1-(2-thenoyl)-3,3,3-trifluoroacet nato](monophenanthroline) europium(III) (abbreviation: Eu(TTA)3(P hen)) and other rare earth metal complexes are luminescence from rare earth metal ions (electron transition between different multiplicities), so it can be used as a phosphorescent compound.

[0267] Note that as the light-emitting organic compound-containing layer 703, the above-described light-emitting organic compound (guest material) may be dispersed in another substance (host material). As the host material , various materials can be used, and the lowest unoccupied molecular orbital level (LUMO level) It is preferable to use a substance having a high lowest unoccupied molecular orbital level (LUMO level) and a low highest occupied molecular orbital level (HOMO level).

[0268] Specific examples of the host material include tris(8-quinolinolato)aluminum(III) (abbreviation: Alq), tris(4-methyl-8-quinolinolato)aluminum(III)( abbreviation: Almq3), bis(10-hydroxybenzo[h]quinolinato)beryllium(II I)(abbreviation: BeBq2), bis(2-methyl-8-quinolinolato)(4-phenylphen enolato)aluminum(III)(abbreviation: BAlq), bis(8-quinolinolato)zinc( II)(abbreviation: Znq), bis[2-(2-benzoxazolyl)phenolato]zinc(II I)(abbreviation: ZnPBO), bis[2-(2-benzothiazolyl)phenolato]zinc(II I)(abbreviation: ZnBTZ) and other metal complexes, 2-(4-biphenylyl)-5-(4-te rt-butylphenyl)-1,3,4-oxadiazole(abbreviation: PBD), 1,3-bis [5-(p-tert-butylphenyl)-1,3,4-oxadiazol-2-yl benzene(abbreviation: OXD-7), 3-(4-biphenylyl)-4-phenyl-5-(4 -tert-butylphenyl)-1,2,4-triazole(abbreviation: TAZ), 2,2’ ,2’’-(1,3,5-benzenetriyl)tris(1-phenyl-1H-benzimid azole)(abbreviation: TPBI), bathophenanthroline(abbreviation: BPhen), bathocuproin (abbreviation: BCP) and other heterocyclic compounds, 9-[4-(10-phenyl-9-anthr yl)phenyl]-9H-carbazole(abbreviation: CzPA), 3,6-diphenyl- 9-[4-(10-phenyl-9-anthryl)phenyl]-9H-carbazole(abbreviation :DPCzPA), 9,10-bis(3,5-diphenylphenyl)anthracene (abbreviation :DPPA), 9,10-di(2-naphthyl)anthracene (abbreviation: DNA), 2-te rt-butyl-9,10-di(2-naphthyl)anthracene (abbreviation: t-BuDNA), 9,9'-bianthryl (abbreviation: BANT), 9,9'-(stilbene-3,3'-diyl diphenanthrene (abbreviation: DPNS), 9,9'-(stilbene-4,4'-diyl )diphenanthrene (abbreviation: DPNS2), 3,3',3''-(benzene-1,3,5 -triyl)tripyrene (abbreviation: TPB3), 9,10-diphenylanthracene (abbreviation :DPAnth), 6,12-dimethoxy-5,11-diphenylchrysene and other condensed aro matic compounds, N,N-diphenyl-9-[4-(10-phenyl-9-anthryl)phenyl amine]-9H-carbazole-3-amine (abbreviation: CzA1PA), 4-(10-phenyl -9-anthryl)triphenylamine (abbreviation: DPhPA), N,9-diphenyl- N-[4-(10-phenyl-9-anthryl)phenyl]-9H-carbazole-3- amine (abbreviation: PCAPA), N,9-diphenyl-N-{4-[4-(10-phenyl -9-anthryl)phenyl]phenyl}-9H-carbazole-3-amine (abbreviation: P CAPBA), N-(9,10-diphenyl-2-anthryl)-N,9-diphenyl- 9H-carbazole-3-amine (abbreviation: 2PCAPA), NPB (or α-NPD) , aromatic amine compounds such as TPD, DFLDPBi, BSPB, etc. can be used .

[0269] Also, multiple types of host materials can be used. For example, rubrene is used to suppress crystallization A substance that suppresses crystallization such as etc. may be further added. Also, NPB, or Alq etc. may be further added in order to more efficiently perform energy transfer.

[0270] By adopting a configuration in which the guest material is dispersed in the host material, crystallization of the layer 703 containing the light-emitting organic compound can be suppressed. Also, concentration quenching due to a high concentration of the guest material can be suppressed.

[0271] Also, a polymer compound can be used as the layer 703 containing the light-emitting organic compound. Specifically, as blue light-emitting materials, poly(9,9-dioctylfluorene-2,7-diyl) (abbreviation: PFO), poly[(9,9-dioctylfluorene-2,7-diyl)- co-(2,5-dimethoxybenzene-1,4-diyl)] (abbreviation: PF-DMOP), poly{(9,9-dioctylfluorene-2,7-diyl)-co-[N,N’-di-( p-butylphenyl)-1,4-diaminobenzene]} (abbreviation: TAB-PFH), etc. can be mentioned. Also, as green light-emitting materials, poly(p-phenylene vinylene) (abbreviation: PPV), poly[(9,9-dihexylfluorene-2,7-diyl)-alt-co- (benzothieno[2,1,3]thiadiazole-4,7-diyl)] (abbreviation: PFBT), poly [(9,9-dioctyl-2,7-divinylenefluorenylene)-alt-co-(2- methoxy-5-(2-ethylhexyloxy)-1,4-phenylene)], etc. can be mentioned . Also, as orange to red light-emitting materials, poly[2-methoxy-5-(2’-ethylhexyl oxy)-1,4-phenylene vinylene] (abbreviation: MEH-PPV), poly(3-butyl thiophene-2,5-diyl) (abbreviation: R4-PAT), poly{[9,9-dihexyl- 2,7-Bis(1-cyanovinylene)fluorenylene]-alt-co-[2,5-bis (N,N'-diphenylamino)-1,4-phenylene]}, poly{[2-methoxy-5 -(2-ethylhexyloxy)-1,4-bis(1-cyanovinylenephenylene)]-a lt-co-[2,5-bis(N,N'-diphenylamino)-1,4-phenylene]} (abbreviation: CN-PPV-DPD) and others.

[0272] In addition, a plurality of layers containing a light-emitting organic compound are provided, and each layer emits a different light color. By doing so, it is possible to obtain light emission of a desired color from the light-emitting element as a whole. In a light-emitting element having two layers containing an organic compound, the first layer containing a light-emitting organic compound The emission color of the first layer and the emission color of the second layer containing a light-emitting organic compound are made to have a complementary color relationship. It is also possible to obtain a light emitting element that emits white light as a whole. refers to the relationship between colors that become achromatic when mixed. In other words, it is a color that emits colors that are complementary to each other. By mixing the light from these materials, white light can be obtained. The same applies to the case of a light emitting element having three or more layers containing a compound.

[0273] The electron transport layer 704 is a layer containing a substance having a high electron transport property. Examples of the aluminum compounds include tris(8-quinolinolato)aluminum (Alq), tris(4 -Methyl-8-quinolinolatoaluminum (abbreviation: Almq3), bis(10-hydro Bis(2-methyl-8-oxobenzo[h]quinolinato)beryllium (abbreviation: BeBq2) (4-Phenylphenolato)quinolinolatoaluminum (abbreviation: BAlq), etc., and metal complexes having a quinoline skeleton or a benzoquinoline skeleton can be mentioned. In addition, other metal complexes having oxazole-based or thiazole-based ligands such as bis [2-(2-Hydroxyphenyl)benzoxazolato]zinc (abbreviation: Zn(BOX)2 ), bis[2-(2-hydroxyphenyl)benzothiazolato]zinc (abbreviation: Zn(BT Z)2) can also be used. Furthermore, in addition to metal complexes, 2-(4-biphenylyl)-5-(4-tert -butylphenyl)-1,3,4-oxadiazole (abbreviation: PBD), 1,3-bis [5-(p-tert-butylphenyl)-1,3,4-oxadiazol-2-yl] benzene (abbreviation: OXD-7), 3-(4-biphenylyl)-4-phenyl-5-(4- tert-butylphenyl)-1,2,4-triazole (abbreviation: TAZ), bathophenanthroline (abbreviation: BPhen), bathocuproine (abbreviation: BCP), etc. can also be used. The substances described here mainly have an electron mobility of 10 cm / Vs or more. Also, the electron transport layer may be not only a single layer but also a laminate of two or more layers made of the above substances. The electron injection layer 705 is a layer containing a substance with high electron injection properties. For the electron injection layer 705, alkali metals, alkaline earth metals, or their compounds such as lithium, cesium, calcium, lithium fluoride, cesium fluoride, calcium fluoride, -6 lithium oxide, etc. can be used. Also, rare earth metal compounds such as erbium fluoride can be used. 2 substances. Moreover, the electron transport layer may be not only a single layer but also a laminate of two or more layers composed of the above substances.

[0274] The electron injection layer 705 is a layer containing a substance with high electron injection properties. In the electron injection layer 705, lithium, cesium, calcium, lithium fluoride, cesium fluoride, calcium fluoride, lithium oxide, etc. can be used. Also, rare earth metal compounds such as erbium fluoride can be used. such as alkali metals, alkaline earth metals, or their compounds. Moreover, rare earth metal compounds such as erbium fluoride can be used. It is also possible to use the material constituting the above-described electron transport layer 704.

[0275] In addition, the above-described hole injection layer 701, hole transport layer 702, layer 70 3 containing a light-emitting organic compound, electron transport layer 704, and electron injection layer 705 can each be formed by a method such as a vapor deposition method (including a vacuum vapor deposition method), inkjet method, coating method, or the like.

[0276] As shown in FIG. 15(B), the EL layer 102 may be laminated a plurality of times between the first electrode 103 and the second electrode 108. In this case, it is preferable to provide a charge generation layer 803 between the laminated first EL layer 800 and the second EL layer 801. The charge generation layer 803 can be formed of the above-described composite material. Further, the charge generation layer 803 may have a laminated structure of a layer made of a composite material and a layer made of another material. In this case, as the layer made of another material, a layer containing an electron-donating substance and a substance having high electron transport properties, a layer made of a transparent conductive film, or the like can be used. Such a light-emitting element has a structure in which problems such as energy transfer and quenching are less likely to occur, and by widening the range of material selection, it is easy to obtain a light-emitting element having high luminous efficiency and long life. Also, it is easy to obtain phosphorescent emission in one EL layer and fluorescent emission in the other. This structure can be used in combination with the structure of the above-described EL layer. Moreover, by making the emission colors of the respective EL layers different, it is possible to obtain light emission of a desired color for the entire light-emitting element. For example, in a light-emitting element having two EL layers, by making the emission color of the first EL layer and the emission color of the second EL layer be in a complementary color relationship, it is also possible to obtain a light-emitting element that emits white light as a whole. Also, for three or more EL layers, it is possible to obtain a light-emitting element that emits white light as a whole. Also, for three or more EL layers, by making the emission colors of the respective EL layers different, it is possible to obtain light emission of a desired color for the entire light-emitting element. For example, in a light-emitting element having two EL layers, by making the emission color of the first EL layer and the emission color of the second EL layer be in a complementary color relationship, it is possible to obtain a light-emitting element that emits white light as a whole. Also, for three or more EL layers, it is possible to obtain a light-emitting element having high luminous efficiency and long life by making it difficult for problems such as energy transfer and quenching to occur and widening the range of material selection. Also, it is easy to obtain phosphorescent emission in one EL layer and fluorescent emission in the other. This structure can be used in combination with the structure of the above-described EL layer. This structure can be used in combination with the structure of the above-described EL layer.

[0277] Furthermore, by making the emission colors of the respective EL layers different, it is possible to obtain light emission of a desired color for the entire light-emitting element. For example, in a light-emitting element having two EL layers, by making the emission color of the first EL layer and the emission color of the second EL layer be in a complementary color relationship, it is possible to obtain a light-emitting element that emits white light as a whole. Also, for three or more EL layers, by making the emission colors of the respective EL layers different, it is possible to obtain light emission of a desired color for the entire light-emitting element. For example, in a light-emitting element having two EL layers, by making the emission color of the first EL layer and the emission color of the second EL layer be in a complementary color relationship, it is possible to obtain a light-emitting element that emits white light as a whole. Also, for three or more EL layers, The same applies to the case of a light-emitting element having the same.

[0278] As shown in Fig. 15(C), the EL layer 102 is located between the first electrode 103 and the second electrode 108. There may be a hole injection layer 701, a hole transport layer 702, a layer 703 containing a light-emitting organic compound, an electron transport layer 704, an electron injection buffer layer 706, an electron relay layer 707, and a composite material layer 708 in contact with the second electrode 10 8.

[0279] By providing the composite material layer 708 in contact with the second electrode 108, particularly when forming the second electrode 108 using a sputtering method, the damage to the EL layer 102 can be reduced, which is preferable. The composite material layer 708 can use a composite material obtained by incorporating an acceptor substance into the above-described organic compound having high hole transport properties. This is preferable because it can reduce the damage to the EL layer 102 when forming the second electrode 108, especially when using the sputtering method. The composite material layer 708 can use a composite material obtained by incorporating an acceptor substance into the above-described organic compound having high hole transport properties. This is preferable because it can reduce the damage to the EL layer 102 when forming the second electrode 108, especially when using the sputtering method. The composite material layer 708 can use a composite material obtained by incorporating an acceptor substance into the above-described organic compound having high hole transport properties. This is preferable because it can reduce the damage to the EL layer 102 when forming the second electrode 108, especially when using the sputtering method. The composite material layer 708 can use a composite material obtained by incorporating an acceptor substance into the above-described organic compound having high hole transport properties.

[0280] Furthermore, by providing the electron injection buffer layer 706, the injection barrier between the composite material layer 708 and the electron transport layer 7 04 can be alleviated, so that the electrons generated in the composite material layer 708 can be easily injected into the electron transport layer 704.

[0281] For the electron injection buffer layer 706, substances with high electron injection properties such as alkali metals, alkaline earth metals, rare earth metals, and their compounds (including alkali metal compounds (such as oxides like lithium oxide, halides, carbonates like lithium carbonate and cesium carbonate), alkaline earth metal compounds (including oxides, halides, carbonates), or compounds of rare earth metals (including oxides, halides, carbonates)) can be used. This is because substances with high electron injection properties such as alkali metals, alkaline earth metals, rare earth metals, and their compounds (including alkali metal compounds (such as oxides like lithium oxide, halides, carbonates like lithium carbonate and cesium carbonate), alkaline earth metal compounds (including oxides, halides, carbonates), or compounds of rare earth metals (including oxides, halides, carbonates)) can be used. This is because substances with high electron injection properties such as alkali metals, alkaline earth metals, rare earth metals, and

[0282] In addition, the electron injection buffer layer 706 is formed by containing a material having a high electron transporting property and a donor material. In the case where the compound is formed, the mass ratio of the compound to the substance having high electron transport properties is 0.001 or more and 0.1 or less. It is preferable to add the donor substance in a ratio of 1:1. Alkali metals, alkaline earth metals, rare earth metals, and their compounds (alkali metal compounds ( Includes oxides such as lithium oxide, halides, and carbonates such as lithium carbonate and cesium carbonate. ), alkaline earth metal compounds (including oxides, halides, and carbonates), or rare earth metals In addition to compounds of the group (including oxides, halides, and carbonates), tetrathianaphthacene (abbreviated Organic compounds such as TTN, nickelocene, and decamethylnickelocene can also be used. As the substance having a high electron transporting property, the same material as the material of the electron transporting layer 704 described above can be used. The present invention can be formed using a variety of materials.

[0283] Furthermore, an electron relay layer 707 is provided between the electron injection buffer layer 706 and the composite material layer 708. The electron relay layer 707 is not necessarily required, but may be formed as an electron relay layer. By providing the electron relay layer 707 with high transportability, electrons can be transferred to the electron injection buffer layer 706. This makes it possible to send it quickly.

[0284] An electron relay layer 707 is sandwiched between the composite layer 708 and the electron injection buffer layer 706. The structure includes an acceptor material contained in a composite material layer 708 and an electron injection buffer layer 70 The structure is such that it is difficult for the donor substance contained in 6 to interact with each other and inhibit each other's functions. Therefore, the increase in the driving voltage can be suppressed.

[0285] The electron relay layer 707 contains a substance with high electron transport property, and the LUM O level is formed to be between the LUMO level of the acceptor substance contained in the composite material layer 708 and the LUMO level of the substance with high electron transport property contained in the electron transport layer 70 4. When the electron relay layer 707 contains a donor substance, the donor level of the donor substance is also set to be between the LUMO level of the acceptor substance contained in the composite material layer 708 and the LUMO level of the substance with high electron transport property contained in the electron transport layer 70 4. Specifically, as for the numerical value of the energy level, the L UMO level of the substance with high electron transport property contained in the electron relay layer 707 is -5.0 eV or higher, preferably -5.0 eV or higher and -3.0 eV or lower, which is good.

[0286] As the substance with high electron transport property contained in the electron relay layer 707, it is preferable to use a phthalocyanine-based material or a metal complex having a metal-oxygen bond and an aromatic ligand.

[0287] Specifically, as the phthalocyanine-based material contained in the electron relay layer 707, CuPc, S nPc (Phthalocyanine tin(II) complex), ZnPc (Phthalocyanine zinc complex), CoPc (Cobal t(II)phthalocyanine, β-form), FePc (Phthal ocyanine Iron) and PhO-VOPc (Vanadyl 2,9,16, 23-tetraphenoxy-29H,31H-phthalocyanine) is preferably used.

[0288] ​​As the metal complex having a metal-oxygen bond and an aromatic ligand contained in the electronic relay layer 707, , it is preferable to use a metal complex having a metal-oxygen double bond. Since the metal-oxygen double bond has acceptor properties (the property of easily accepting electrons), the transfer (donation and acceptance) of electrons becomes easier. In addition, a metal complex having a metal-oxygen double bond is considered to be stable. Therefore, by using a metal complex having a metal-oxygen double bond, the light-emitting element can be driven more stably at a low voltage.

[0289] As the metal complex having a metal-oxygen bond and an aromatic ligand, a phthalocyanine-based material is preferable. Specifically, any of VOPc (Vanadyl phthalocyanine), SnO Pc (Phthalocyanine tin(IV) oxide complex) and TiOPc (Phthalocyanine titanium oxide co mplex) is preferable because the metal-oxygen double bond in the molecular structure easily acts on other molecules and has high acceptor properties.

[0290] Note that as the above-described phthalocyanine-based material, those having a phenoxy group are preferable. Specifically, phthalocyanine derivatives having a phenoxy group, such as PhO-VOPc, are preferable. Phthalocyanine derivatives having a phenoxy group are soluble in a solvent. Therefore, they have the advantage of being easy to handle in forming the light-emitting element. In addition, since they are soluble in a solvent, they have the advantage of facilitating the maintenance of the apparatus used for film formation.

[0291] The electronic relay layer 707 may further contain a donor substance. As the donor substance, Alkali metals, alkaline earth metals, rare earth metals, and their compounds (alkali metal compounds (including oxides such as lithium oxide, halides, and carbonates such as lithium carbonate and cesium carbonate ), alkaline earth metal compounds (including oxides, halides, and carbonates), or rare earth metal compounds (including oxides, halides, and carbonates)), in addition to tetrathianaphthacene (abbreviation: TTN), nickelocene, decamethylnickelocene, and other organic compounds can be used . By including these donor substances in the electron relay layer 707, the movement of electrons becomes easier, and the light-emitting element can be driven at a lower voltage.

[0292] When a donor substance is included in the electron relay layer 707, as substances with high electron transport properties, in addition to the materials mentioned above , substances having a LUMO level higher than the acceptor level of the acceptor substance included in the composite material layer 708 can be used. As specific energy levels , substances having a LUMO level of -5.0 eV or higher, preferably in the range of -5.0 eV or higher and -3.0 eV or lower are preferably used. Examples of such substances include perylene derivatives and nitrogen-containing condensed aromatic compounds. Since nitrogen-containing condensed aromatic compounds are stable , they are preferred materials for forming the electron relay layer 707.

[0293] . Specific examples of perylene derivatives include 3,4,9,10-perylenetetracarboxylic dianhydride (abbreviation: PTCDA), 3,4,9,10-perylenetetracarboxylic bisbenzimidazole (abbreviation: PTCBI), N,N'-dioctyl-3,4,9,10-perylene tetracarboxylic diimide (abbreviation: PTCDI-C8H), N,N'-dihexyl- Examples include 3,4,9,10-perylenetetracarboxylic diimide (abbreviation: Hex PTC), etc. and the like.

[0294] In addition, specific examples of the nitrogen-containing condensed aromatic compounds include pyrazino[2,3-f][1,10] phenanthroline-2,3-dicarbonitrile (abbreviation: PPDN), 2,3,6,7,1 0,11-hexacyano-1,4,5,8,9,12-hexaazatriphenylene (abbreviation : HAT(CN)6), 2,3-diphenylpyrido[2,3-b]pyrazine (abbreviation: 2P YPR), 2,3-bis(4-fluorophenyl)pyrido[2,3-b]pyrazine (abbreviation : F2PYPR), etc.

[0295] Other examples include 7,7,8,8-tetracyanoquinodimethane (abbreviation: TCNQ), 1,4, 5,8-naphthalenetetracarboxylic dianhydride (abbreviation: NTCDA), perfluoropent acene, copper hexadecafluorophthalocyanine (abbreviation: F 16 CuPc), N,N'-bis (2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-pentadecafluoro octyl)-1,4,5,8-naphthalenetetracarboxylic diimide (abbreviation: NTCD I-C8F), 3',4'-dibutyl-5,5''-bis(dicyanomethylene)-5,5 ''-dihydro-2,2':5',2''-terthiophene)(abbreviation: DCMT), meth nofullerene (for example, [6,6]-phenyl C 61 methyl butyrate), etc. can be used. and the like.

[0296] When the electron relay layer 707 contains a donor substance, a substance with high electron transport property and a donor The electron relay layer 707 may be formed by a method such as co-evaporation with a single substance.

[0297] The hole injection layer 701, the hole transport layer 702, the layer 703 containing a light-emitting organic compound, and the electron transport layer 704 may be formed using the above-described materials, respectively.

[0298] As described above, the EL layer 102 of the present embodiment can be manufactured.

[0299] The present embodiment can be freely combined with other embodiments.

[0300] (Embodiment 9) In the present embodiment, an example of a lighting device completed using a light-emitting device according to an aspect of the present invention will be described with reference to FIG. 21.

[0301] In one aspect of the present invention, a lighting device in which a light-emitting portion has a curved surface can be realized.

[0302] Further, in one aspect of the present invention, a lighting device having a see-through light-emitting portion can be realized.

[0303] In addition, one aspect of the present invention can also be applied to vehicle lighting, for example, lighting can be installed on a dashboard, on a front windshield, on a ceiling, or the like.

[0304] In FIG. 21(A), an indoor lighting device 901 and a desk lamp 903 to which one aspect of the present invention is applied are shown. Since the light-emitting device can also be made large in area, it can be used as a large-area lighting device. In addition, it can also be used as a roll-type lighting device 902.

[0305] An example of another lighting device is shown in FIG. 21(B). The desk lamp shown in FIG. 21(B) has a lighting unit 9 ​It includes a support column 9501, a support base 9503, a support platform 9505, etc. The lighting unit 9501 is one aspect of the present invention includes a light-emitting device. Thus, in one aspect of the present invention, a lighting device having a curved surface or a lighting device having a lighting unit that bends flexibly can be realized. In this way, by using a flexible light-emitting device as a lighting device, the degree of freedom in the design of the lighting device is improved not only, but also, for example, it becomes possible to install a lighting device in places having a curved surface such as the ceiling or dashboard of an automobile

[0306] This embodiment can be freely combined with other embodiments

Example

[0307] In this example, an example of a film containing gallium (Ga), zinc (Zn), and oxygen (O) (hereinafter referred to as a GZO film) will be described with reference to FIGS. 16 and 17

[0308] ≪Fabrication of samples≫ First, the GZO film fabricated in this example will be described. The GZO film fabricated in this example is of three types shown in Table 1

[0309]

Table 1

[0310] In all the configuration examples of this example, the distance between the substrate and the target is 110 mm , and film formation by sputtering was performed under the conditions of a pressure of 0.8 Pa, a DC power supply of 200 W, and a substrate heating temperature of 200°C in an oxygen atmosphere

[0311] As Configuration Example 1, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 1:5 ​​​Using [mole ratio], a GZO film with a thickness of 100 nm was formed.

[0312] As a structural example 2, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 1:1 [mole ratio]) was used to form a GZO film with a thickness of 100 nm.

[0313] As a structural example 3, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 5:1 [mole ratio]) was used to form a GZO film with a thickness of 100 nm.

[0314] ≪Measurement of refractive index≫ Next, the refractive indices of Structural Examples 1 to 3 were measured respectively. In this example, the refractive index was obtained using the ellipsometry method.

[0315] The refractive indices of Structural Examples 1 to 3 are shown in Fig. 16. In Fig. 16, the horizontal axis represents the wavelength (nm) and the vertical axis represents the refractive index.

[0316] The refractive indices of Structural Examples 1 to 3 showed almost no wavelength dependence in the region where the wavelength was 400 nm or more and 800 nm or less (hereinafter, referred to as the visible light region).

[0317] As can be seen from Fig. 16, in the visible light region, Structural Example 1 (the target with a large proportion of ZnO ) had a higher refractive index than Structural Example 3 (the target with a large proportion of Ga2O3).

[0318] From the above results, it was suggested that by changing the ratio of Ga2O3 and ZnO contained in the Ga-Zn-O-based metal oxide target, the refractive index of the obtained GZO film changes.

[0319] ≪Measurement of transmittance≫ Next, the transmittances of Configuration Examples 1 to 3 were measured respectively. In this example, a spectrophotometer was used to obtain the transmittance values.

[0320] The transmittances of Configuration Examples 1 to 3 are shown in FIG. 17. In FIG. 17, the horizontal axis represents the wavelength (nm) and the vertical axis represents the transmittance.

[0321] The transmittances of Configuration Examples 1 to 3 were very high, at 75% or more, in the region where the wavelength was 400 nm or more. It was high.

[0322] From the above results, it was found that the GZO film has very high light transmittance for visible light.

[0323] As can be seen from this example, the film containing Ga, Zn, and O has very high light transmittance for visible light. Furthermore, by changing the ratio of Ga and Zn, the refractive index of the obtained film changes significantly. Therefore, it was found that it can be suitably used as a functional layer in the present invention. It was found.

Example

[0324] In this example, another example of a film containing Ga, Zn, and O (hereinafter referred to as a GZO film) applicable to one aspect of the present invention will be described with reference to FIGS. 18 to 20. film) will be described using FIGS. 18 to 20.

[0325] ≪Preparation of Sample≫ First, the GZO film produced in this example will be described. The GZO film produced in this example is shown in Table 2 and there are 12 types.

[0326]

Table 2

[0327] In all the configuration examples of this example, the distance between the substrate and the target was 110 mm, Film formation was carried out by sputtering under the conditions of a pressure of 0.8 Pa and a DC power supply of 200 W. done.

[0328] As a structural example A-1, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 1 :5 [molar ratio]) was used to form a 250-nm-thick GZO film at room temperature in an argon and oxygen (flow ratio: argon:oxygen = 7: 3) mixed atmosphere.

[0329] As a structural example A-2, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 1 :5 [molar ratio]) was used to form a 90-nm-thick GZO film at room temperature in an oxygen atmosphere. done.

[0330] As a structural example A-3, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 1 :5 [molar ratio]) was used to form a 200-nm-thick GZO film at a substrate heating temperature of 200 °C in an argon and oxygen (flow ratio: argon:oxygen = 7: 3) mixed atmosphere. done.

[0331] As a structural example A-4, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 1 :5 [molar ratio]) was used to form a 15 0-nm-thick GZO film at a substrate heating temperature of 200 °C in an oxygen atmosphere.

[0332] As a structural example B-1, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 1 :1 [molar ratio]) was used to form a 180-nm-thick GZO film at room temperature in an argon and oxygen (flow ratio: argon:oxygen = 7: 3) mixed atmosphere.

[0333] As a structural example B-2, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 1 : 1 [mole ratio]) was used to form a GZO film with a thickness of 50 nm at room temperature in an oxygen atmosphere. This was done.

[0334] In Configuration Example B-3, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 1: 1 [mole ratio]) was used, and a GZO film with a thickness of 150 nm was formed under a mixed atmosphere of argon and oxygen (flow rate ratio: argon:oxygen = 7:3 ) at a substrate heating temperature of 200 °C.

[0335] As Configuration Example B-4, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 1 : 1 [mole ratio]) was used, and a GZO film with a thickness of 90 nm was formed under an oxygen atmosphere at a substrate heating temperature of 200 °C.

[0336] As Configuration Example C-1, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 5 : 1 [mole ratio]) was used, and a GZO film with a thickness of 160 nm was formed at room temperature under a mixed atmosphere of argon and oxygen (flow rate ratio: argon:oxygen = 7: 3).

[0337] As Configuration Example C-2, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 5 : 1 [mole ratio]) was used to form a GZO film with a thickness of 50 nm at room temperature in an oxygen atmosphere. This was done.

[0338] As Configuration Example C-3, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 5 : 1 [mole ratio]) was used, and a GZO film with a thickness of 160 nm was formed under a mixed atmosphere of argon and oxygen (flow rate ratio: argon:oxygen = 7: 3) at a substrate heating temperature of 200 °C. .

[0339] As Configuration Example C-4, a Ga-Zn-O-based metal oxide target (Ga2O3:ZnO = 5 :1 [molar ratio]) was used to form a 90 nm-thick GZO film under an oxygen atmosphere at a substrate heating temperature of 200 °C.

[0340] ≪Measurement of Refractive Index≫ Next, the refractive indices of Configuration Examples A-1 to A-4, Configuration Examples B-1 to B-4, and Configuration Examples C- 1 to C-4 were measured respectively.

[0341] The refractive index was measured using the same method as in Example 1.

[0342] The refractive indices of Configuration Examples A-1 to A-4 are shown in Fig. 18. The refractive indices of Configuration Examples B-1 to B-4 are shown in Fig. 19. The refractive indices of Configuration Examples C-1 to C-4 are shown in Fig. 20. In Figs. 1 8 to 20, the horizontal axis represents the wavelength (nm), and the vertical axis represents the refractive index.

[0343] The refractive indices of the configuration examples fabricated in this example showed almost no wavelength dependence in the visible light region.

[0344] From the results of this example, it was found that by changing the ratio of Ga and Zn and conditions such as the film formation atmosphere, the refractive index of the obtained GZO film changes. For example, it was suggested that a GZO film showing a refractive index in the range of 1.7 or more and 2.0 or less can be formed in the visible light region.

Explanation of Signs

[0345] 100a First organic resin layer 100b Second organic resin layer 101a First glass layer 101b Second glass layer 102 EL layer 103 First electrode 107 Second electrode 108 Second electrode 110 Sealing layer 112 Space 114 Sealing material 115 Filling material 116 Sealing material 118a Concave-convex structure 118b Concave-convex structure 120a First protective layer 120b Second protective layer 122a Concave-convex structure body 122b Concave-convex structure body 124a First resin layer 124b Second resin layer 130a First circuit element 130b Second circuit element 130c Third circuit element 135 Connection wiring 138 Insulating film 140 Printed circuit board 150 Converter 151 Sealing resin 410a Extraction electrode 410b Extraction electrode 411 Connection electrode 411a Connection electrode 411b Connection electrode 701 Hole injection layer 702 Hole transport layer 703 Layer containing light-emitting organic compound 704 Electron transport layer 705 Electron injection layer 706 Electron injection buffer layer 707 Electron relay layer 708 Composite material layer 800 First EL layer 801 Second EL layer 803 Charge generation layer 901 Lighting device 902 Lighting device 903 Desktop lighting fixture 9501 Lighting section 9503 Support column 9505 Support Stand

Claims

1. An organic resin film, A light-emitting device having a light-emitting element located in a region above the organic resin film, wherein The light-emitting element includes a first electrode having a region in contact with the upper surface of the organic resin film, an EL layer having a region located above the first electrode, and a second electrode having a region located above the EL layer, In a cross-sectional view, the organic resin film has a first region in which a plurality of convex portions are continuously arranged with respect to the emission direction of the light-emitting element, and a second region having no such convex portions, The organic resin film has an opening in the second region, The first electrode has a region overlapping the first region and a region overlapping the opening. A light-emitting device.

2. A glass substrate, An organic resin film disposed on the glass substrate, A light-emitting device having a light-emitting element located in a region above the organic resin film, wherein The light-emitting element includes a first electrode having a region in contact with the upper surface of the organic resin film, an EL layer having a region located above the first electrode, and a second electrode having a region located above the EL layer, In a cross-sectional view, the organic resin film has a first region in which a plurality of convex portions are continuously arranged with respect to the emission direction of the light-emitting element, and a second region having no such convex portions, The organic resin film has an opening in the second region, The first electrode has a region overlapping the first region and a region overlapping the opening, In a cross-sectional view, a maximum height of one of the plurality of convex portions is 0.1 μm or more and 100 μm or less. A light-emitting device.

3. In Claim 1 or 2, The first electrode has a region that does not overlap the EL layer and overlaps at least one of the plurality of convex portions. A light-emitting device.

Images