Heat detector
The thermal sensor addresses alignment and visibility issues by incorporating a mortar-shaped hole and cylindrical design in the case lid, enabling easy assembly and improved light visibility, thus enhancing usability and design quality.
Patent Information
- Application Number
- JP2025068553
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-04-18
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2041-12-15
AI Technical Summary
The alignment of the element support member with the top plate in conventional thermal sensors is difficult due to poor visibility of the light-guiding element, making assembly challenging and light visibility during operation suboptimal.
The thermal sensor design includes a case lid with a mortar-shaped hole and a cylindrical portion that extends downward, forming a translucent member, and a top plate with a stepped configuration, allowing easy alignment and visibility of light through the top plate opening.
Facilitates easy assembly by ensuring the cylindrical part is visible during alignment and enhances light visibility during operation, improving the usability and design quality of the thermal sensor.
Smart Images

Figure 2025106576000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a thermal sensor including a light source.
Background Art
[0002] Conventionally, a thermal sensor includes a sensor composed of a thermistor or the like that detects heat, and senses the occurrence of a fire by detecting the heat of a hot air flow generated by the fire. In the thermal sensor, a substrate is disposed inside a case body, and the sensor is attached to the substrate such that a heat-sensitive portion is exposed through an opening provided in the lower surface of the case body. Among such thermal sensors, there is one that includes a light source mounted on the substrate and lights up the light source when a fire occurs (see, for example, Patent Document 1). The thermal sensor of Patent Document 1 includes an element support member that is mounted on the substrate and guides light from the light source, and a main body cover (top plate) disposed below the substrate and the element support that houses them. The heat-sensitive portion of the sensor protrudes downward from a top plate opening provided in the top plate.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] In the thermal sensor of Patent Document 1, the element support member that guides light is mounted on the substrate, entirely housed inside the case body, and disposed above the main body cover (top plate). Therefore, when assembling the main body cover, it is difficult to perform alignment because the alignment portion in the element support member is difficult for an operator to visually recognize, and there is a problem that the visibility of light is not good during the operation of the thermal sensor.
[0005] The present disclosure has been made to solve the above-described problems, and an object thereof is to provide a thermal sensor that can easily align a translucent member such as an element support member with a top plate and that allows light from a light source transmitted through the translucent member to be easily visible at the top plate opening.
Means for Solving the Problems
[0006] The thermal sensor of the present disclosure includes a case body having an opening that houses a substrate on which a sensor for sensing heat and a light source are mounted, a case lid provided below the case body, a top plate positioned below the case lid, and a protector having a protection part provided on the top plate for protecting the sensor. The case lid has a hole through which the sensor is inserted. The hole includes a mortar-shaped part whose opening width gradually increases downward and a cylindrical part extending downward from the lower end of the mortar-shaped part. The top plate is provided with a top plate opening in which the cylindrical part is disposed, and the hole is formed of a translucent member that transmits light from the light source.
[0007] Further, in the above thermal sensor, the case lid has a frame part extending outward from the outer peripheral surface of the hole and a plurality of leg parts extending upward from the frame part along the inner surface of the case body.
[0008] Further, in the above thermal sensor, a first stepped part having a larger outer diameter on the upper side is provided on the outer peripheral surface of the cylindrical part, and a second stepped part facing the first stepped part on the upper surface side is provided on the inner wall of the top plate opening of the top plate.
Advantages of the Invention
[0009] According to the present disclosure, since the cylindrical part continuous from the lower end of the mortar-shaped part in the hole of the case lid is disposed in the top plate opening of the top plate and the hole is formed of a translucent member that transmits light from the light source, when assembling the main body cover, the cylindrical part can be visually recognized from the top plate opening, so that alignment can be easily performed, and during the operation of the thermal sensor, light from the light source transmitted through the hole of the case lid is easily visible at the top plate opening.
Brief Description of the Drawings
[0010]
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
Modes for Carrying Out the Invention
[0011] Embodiment 1. FIG. 1 is a bottom view of the thermal sensor 100 according to Embodiment 1. FIG. 2 is an exploded perspective view showing the configuration of the thermal sensor 100 according to Embodiment 1. FIG. 3 is a schematic diagram showing a state where the thermal sensor of FIG. 1 is installed on a ceiling. FIG. 4 is a plan view of the protector 60 of the thermal sensor 100 of FIG. 2. FIG. 5 is a cross-sectional view showing a B-B cross-section of the top plate of the protector of FIG. 4. FIG. 6 is a front view of the protector 60 of FIG. 4. FIG. 7 is a side view of the protector 60 of FIG. 6. Hereinafter, the schematic configuration of the thermal sensor 100 will be described based on FIGS. 1 to 3, and the detailed configuration of the protector 60 will be described based on FIGS. 1 to 7.
[0012] The thermal sensor 100 shown in FIG. 1 is installed, for example, in a monitoring space in a building to monitor the ambient temperature. When the ambient temperature becomes equal to or higher than a certain temperature, the thermal sensor 100 outputs a signal indicating a fire to a fire receiver (not shown).
[0013] As shown in FIG. 2, the thermal sensor 100 includes a case body 10 having an opening 11, a substrate 20, a sensor 40 for detecting heat, a light source 50 for emitting light, a case lid 30 disposed at the opening 11 of the case body 10, and a protector 60 for protecting the sensor 40.
[0014] The substrate 20 is housed in the case body 10 through the opening 11. Various electronic components including the sensor 40 and the light source 50 are mounted on the substrate 20. The case lid 30 is detachably attached to the case body 10 in which the substrate 20 is housed. The case lid 30 is provided so as to cover the whole or a part of the opening of the case body 10. A first hole 31 through which the sensor 40 is inserted is formed in the central portion of the case lid 30. The protector 60 is provided to protect the tip of the sensor 40 protruding in the thermal sensor 100. A second hole 69 through which air flow passes is formed in the protector 60. The second hole 69 will be described later. Further, the first hole 31 of the case lid 30 is exposed from a top plate opening 64a provided at the center of the top plate 64 of the protector 60 described later. Here, the first hole 31 refers to the entire wall around the hole through which the sensor 40 is inserted.
[0015] As shown in FIG. 3, the thermal sensor 100 is installed, for example, in a recess 202 formed in a ceiling 200 or the like on the side opposite to the monitoring space. Specifically, the case body 10 is housed in the recess 202 of the ceiling 200, and the thermal sensor 100 is installed on the ceiling 200 such that the protector 60 protrudes from the ceiling surface 201 into the monitoring space.
[0016] In each figure, the arrow Z direction will be described as representing the height direction (vertical direction) of the thermal sensor 100 when it is installed on the ceiling 200. That is, as shown in FIG. 3, in the state where the thermal sensor 100 is installed on the ceiling 200, the side closer to the floor is defined as the bottom. The protector 60 is attached below the case body 10. In the state where the thermal sensor 100 is installed on the ceiling 200, the case body 10 that constitutes the upper outer surface of the thermal sensor 100 faces the inner surface of the recess 202 of the ceiling 200, and the protector 60 that constitutes the lower outer surface of the thermal sensor 100 is exposed in the indoor monitoring space. Also, in each figure, the arrow X direction represents the width direction (left - right direction) of the thermal sensor 100, and the arrow Y direction represents the depth direction (front - back direction) of the thermal sensor 100.
[0017] As shown in FIG. 2, the opening 11 of the case body 10 is formed on the lower surface of the case body 10. In the example shown in FIG. 2, the case body 10 has a box shape with an open bottom surface. The case lid 30 is provided on the lower side, that is, the opening side, of the case body 10.
[0018] (Configuration of the Protector 60) As shown in FIG. 2, the protector 60 is disposed below the case lid 30. The protector 60 includes a protection plate 62 disposed below the case lid 30 so as to face the first hole 31 of the case lid 30, a top plate 64 disposed above the protection plate 62, and a plurality of support columns 63 that support the protection plate 62. As shown in FIG. 3, the top plate 64 is attached to the case body 10 and is disposed below the case body 10 so as to cover the recess 202 of the ceiling 200 in a state where the heat sensor 100 is installed on the ceiling 200. The plurality of support columns 63 connect the protection plate 62 and the top plate 64. The plurality of support columns 63 and the protection plate 62 constitute a protection part 61 that protects the sensor 40 and the heat-sensitive part 41 that is the tip of the sensor 40 from external factors such as fingers.
[0019] Also, as shown in FIGS. 2 and 4, a top plate opening 64a is formed at the center of the top plate 64. As shown in FIG. 2, the top plate 64 has a disk shape. The sensor 40 protruding from the case body 10 through the first hole 31 provided in the central portion of the case lid 30 is inserted into the top plate opening 64a. Also, the lower part of the first hole 31 is disposed in the top plate opening 64a.
[0020] Also, as shown in FIG. 5, a second step 64r is formed on the inner wall of the top plate opening 64a of the top plate 64 on the upper surface 64s1 side, and the top plate opening 64a is formed such that the opening width Di2a in the upper part is larger than the opening width Di2b in the lower part. The first step 32p of the case lid 30 shown in FIG. 8 described later is disposed on the second step 64r of the top plate 64.
[0021] Also, as shown in FIGS. 4, 6, and 7, a plurality of hooks 65a, 65b, 65c, and 65d are provided on the top plate 64 of the protector 60, and the protector 60 is attached to the case body 10 (see FIG. 3) by these hooks 65a to 65d. The plurality of hooks 65a to 65d are provided so as to extend upward from the upper surface 64s1 of the top plate 64, and folded-back portions 65a1, 65b1, 65c1, or 65d1 folded outward are formed at the tip portions of the respective hooks 65a, 65b, 65c, or 65d. Further, as shown in FIG. 4, a plurality of positioning recesses 66 are formed in the upper surface 64s1 of the top plate 64 of the protector 60. When the protector 60 is attached to the case body 10 (see FIG. 3) by the hooks 65a to 65d, the positioning convex portions 17 formed on the case body 10 shown in FIG. 8 described later are inserted into the positioning recesses 66 of the top plate 64, whereby the case body 10 and the protector 60 are positioned.
[0022] In the example shown in FIG. 4, the protector 60 has two sets of a pair of hooks provided on both sides of the top plate opening 64a. In each of the pair of left-right hooks composed of the left hook 65a and the right hook 65b, and the pair of front-rear hooks composed of the front hook 65c and the rear hook 65d, the folded-back portions of the two opposing hooks face outward. As shown in FIG. 6, in the pair of left-right hooks (in the direction of arrow X), the inner angle θ1 of the folded-back portions 65a1 and 65b1 of the two hooks 65a and 65b is substantially a right angle. Specifically, the inner angle θ1 is a right angle (i.e., 90°), or an obtuse angle slightly larger than 90° (for example, an obtuse angle larger than 90° and equal to or less than 92°). On the other hand, as shown in FIG. 7, in the pair of front-rear hooks (in the direction of arrow Y), the inner angle θ2 of the folded-back portions 65c1 and 65d1 of the two hooks 65c and 65d is an acute angle.
[0023] Note that the number of pairs of hooks provided on the top plate 64 is not limited to two pairs. The number of pairs of hooks may be, for example, one pair or three or more pairs. Also, the number of hooks provided on the top plate 64 may be appropriately determined according to the shape of the case body 10 and may be an odd number of 3 or more. Further, in the examples shown in FIGS. 4, 6, and 7, among the two pairs of hooks that form a pair, in the pair of front-rear hooks, the inner angles θ2 of the folded portions 65c1 and 65d1 are configured to be acute angles. However, the inner angles θ1 of the folded portions 65a1 and 65b1 may be acute angles in the pair of left-right hooks. Also, when the number of pairs of hooks that form a pair is two or more, it is sufficient that the inner angle of the folded portion in the opposing hooks is an acute angle in at least one pair.
[0024] As shown in FIG. 7, by making the inner angles θ2 of the folded portions 65c1 and 65d1 acute angles in the pair of hooks, when the folded portions 65c1 and 65d1 are inserted into the hook holes 14c and 14d of the case body 10 shown in FIG. 12 described later, they are caught on the edges. Therefore, as shown in FIG. 3, the protector 60 attached to the case body 10 is suppressed from coming off the case body 10.
[0025] Also, as shown in FIG. 2, two springs 67 extending from the surface on the case body 10 side (the upper surface 64s1 shown in FIG. 4) to the outer peripheral side are provided on the top plate 64 of the protector 60. In the example shown in FIG. 2, strip-shaped springs 67 extending outward are provided at the front edge and the rear edge on the upper surface 64s1 of the top plate 64. In the state where the case body 10 is housed in the recess 202 of the ceiling 200 as shown in FIG. 3, the two springs 67 provided on the top plate 64 of the protector 60 push the left and right inner surfaces of the recess 202, so that the top plate 64 is held by the recess 202 of the ceiling 200. Therefore, it is suppressed that the top plate 64 and the case body 10 attached to the top plate 64 fall out of the recess 202 of the ceiling 200.
[0026] Note that the shape of the spring is not particularly limited thereto. Further, the attachment configuration of the heat sensor 100 to the ceiling 200 is not limited to such a configuration. Further, as shown in FIGS. 1 and 3, the outer diameter Do2 of the top plate 64 is set to a dimension larger than the maximum width of the case body 10, and the recess 202 of the case body 10 and the ceiling 200 is configured to be invisible to the user.
[0027] As shown in FIGS. 1 and 2, a protection plate opening 62o is formed at the center of the protection plate 62, and the protection plate 62 has a disk shape. The outer diameter Do1, the inner diameter (the opening width Di1 of the protection plate opening 62o), or the difference between the outer diameter Do1 and the inner diameter (the opening width Di1) of the protection plate 62 shown in FIG. 1 is such that when the user views the heat sensor 100 at a predetermined elevation angle, the first hole 31 of the case lid 30 can be seen through the second hole 69 (see FIG. 2) of the protector 60. Note that at least one of the gaps 63g between the protection plate opening 62o and the plurality of support columns 63 shown in FIG. 2 may be configured such that the first hole 31 can be seen by the user. Here, the predetermined elevation angle is the angle at which the user looks up at the heat sensor 100. For example, it may be the angle at which a user located 15 meters horizontally away from the heat sensor 100 looks up at the heat sensor 100 installed at a height of 3 meters from the floor. The inner diameter of the protection plate 62, that is, the opening width of the protection plate opening 62o, is preferably set to a dimension (for example, 8 mm or less) that can prevent a test finger or the like from entering and touching the heat-sensitive portion 41.
[0028] In the plan view of the protector 60 shown in FIG. 4, the center of the protection plate opening 62o of the protection plate 62 and the center of the top plate opening 64a of the top plate 64 are located on a straight line extending in the vertical direction (the arrow Z direction shown in FIG. 3). Then, as shown in FIG. 1, in the bottom view of the heat sensor 100, the center of the protection plate opening 62o of the protection plate 62, the center of the top plate opening 64a (see FIG. 4) of the top plate 64, and the center of the first hole 31 of the case lid 30 are located on a straight line extending in the vertical direction (the arrow Z direction shown in FIG. 3). And the sensor 40 is arranged along this straight line.
[0029] As shown in FIG. 4, it is preferable that the inner diameter of the protection plate 62, that is, the opening width Di1 of the protection plate opening 62o, is set to a dimension equal to or less than the inner diameter of the top plate 64, that is, the opening width Di2b at the lower part of the top plate opening 64a. Further, as shown in FIG. 1, both the opening width Di1 of the protection plate opening 62o and the opening width Di2b of the top plate opening 64a shown in FIG. 4 are larger than the diameter of the tip of the sensor 40 to be inserted (the diameter of the heat-sensitive part 41 shown in FIG. 2), and preferably, are larger than the inner diameter of the case lid 30, that is, the minimum opening width Di0 of the first hole 31. With such a configuration, as shown in FIG. 1, in the bottom view of the heat sensor 100, through the protection plate opening 62o of the protector 60, the part of the case lid 30 located inside the protector 60, specifically, the inner wall part of the first hole 31 can be visually recognized from the outside of the heat sensor 100.
[0030] As shown in FIGS. 2, 3, 6, and 7, the support columns 63 of the protector 60 are formed of, for example, plate-like members, and the plurality of support columns 63 are arranged radially with gaps 63g between adjacent support columns 63. The gap 63g is preferably set to a dimension (for example, 8 mm or less) that can prevent a test finger or the like from entering. The support column 63 is formed of, for example, an opaque member. As shown in FIGS. 6 and 7, each support column 63 extends downward from the peripheral part of the top plate opening 64a on the lower surface 64s2 of the top plate 64 and is connected to the peripheral part of the protection plate opening 62o (see FIG. 4) on the upper surface of the protection plate 62. And the outer diameter Do1 of the protection plate 62 is set to a dimension larger than the outer diameter Do3 formed by the plurality of support columns 63 arranged radially. With such a configuration, the plurality of support columns 63 of the heat sensor 100 can be made difficult to be seen by a user viewing from below, so that the appearance can be improved and the design property can be enhanced.
[0031] As shown in FIG. 3, an air flow passage space SP is formed within the protector 60 by the protection plate 62, the plurality of support columns 63, and the top plate 64 of the protector 60, and the first hole portion 31 (see FIG. 2) of the case lid 30. When the heat sensor 100 is installed on the ceiling 200, vertical air flow flows into the passage space SP through the protection plate opening 62o (see FIG. 2). Here, the vertical air flow refers to the air flow that flows in a direction perpendicular to the ceiling surface 201. Further, horizontal air flow flows into the passage space SP through the gaps 63g formed between the support columns 63, and the air flow in the passage space SP flows out to the outside of the heat sensor 100. Here, the horizontal air flow refers to the air flow that flows in a direction parallel to the ceiling surface 201. That is, as shown in FIG. 2, the protection plate opening 62o provided in the protection plate 62 and the gaps 63g between the plurality of support columns 63 each function as a second hole portion 69 through which air flow passes in the protector 60.
[0032] Note that the configuration of the protector 60 is not limited to the above configuration. Although the configuration in which the first hole portion 31 of the case lid 30 can be seen through the second hole portion 69 of the protector 60 when the user views the heat sensor 100 at a predetermined elevation angle has been described with reference to FIG. 2, for example, within a range that does not affect the heat reception of the sensor 40, the thickness of the support column 63 can be increased, or the number of support columns 63 can be increased, so that the sensor 40 is difficult to be seen by the user through the gap 63g but light can be seen.
[0033] FIG. 8 is a schematic perspective view showing the state in which the protector 60 of the heat sensor 100 in FIG. 1 is removed from the lower diagonal direction. FIG. 9 is a perspective view of the case lid 30 of the heat sensor 100 in FIG. 2. FIG. 10 is a side view of the case lid 30 in FIG. 9. FIG. 11 is a cross-sectional view showing the A-A cross-section of the heat sensor 100 in FIG. 1. FIG. 12 is a schematic perspective view showing the state in which the protector 60 and the case lid 30 of the heat sensor 100 in FIG. 1 are removed from the lower diagonal direction. FIG. 13 is a bottom view of the heat sensor 100 in FIG. 12. FIG. 14 is a schematic perspective view showing the state in which wiring is connected to the heat sensor 100 in FIG. 8 from the lower diagonal direction. Hereinafter, based on FIGS. 1 to 14, the structures of the case lid 30, the substrate 20, the sensor 40, the light source 50, and the case body 10 will be described in detail.
[0034] (Configuration of the case lid 30) As shown in FIGS. 8 to 11, the opening of the first hole 31 formed in the central portion of the case lid 30 has an opening width equal to or larger than the diameter of the heat-sensitive portion 41 protruding from the case lid 30 at the sensor 40 so that the sensor 40 can be inserted during the assembly of the heat sensor 100. The case lid 30 has a frame portion 34 extending outward from the outer peripheral surface 32o of the first hole 31, and is configured to cover a part of the lower surface 21 of the substrate 20 with the frame portion 34 while exposing the heat-sensitive portion 41 of the sensor 40 to the outside from the opening of the first hole 31. As shown in FIG. 11, in the first hole 31 formed in the central portion of the case lid 30, the inner peripheral surface facing the lead portion 42 of the sensor 40 and the lower end 31b are exposed to the flow space SP in the case lid 30.
[0035] In the example shown in FIG. 8, the frame portion 34 has a rectangular planar shape, and the first hole 31 is formed in the center of the frame portion 34. Note that the frame portion 34 and the first hole 31 in the case lid 30 may be formed of separate members. Further, the shape of the frame portion 34 is not limited to a rectangular shape.
[0036] The case lid 30 is made of a translucent member. As shown in FIGS. 8 to 11, the first hole 31 has a mortar-shaped portion 33 whose opening width gradually increases downward, and a cylindrical portion 32 extending downward from the lower end 33b of the mortar-shaped portion 33. In the example shown in FIG. 11, the upper end surface 31a of the wall portion is inclined from the horizontal direction because the wall portion of the mortar-shaped portion 33 is inclined. Therefore, in the example shown in FIG. 11, strictly speaking, the upper end portion of the mortar-shaped portion 33 has a shape in which the opening width gradually decreases downward, and the portion below the upper end portion of the mortar-shaped portion 33 has a shape in which the opening width gradually increases downward. When configured in this way, it is easy to pass the sensor 40 through the first hole 31 when attaching the case lid 30 to the case body 10.
[0037] As shown in Fig. 11, in the mortar-shaped portion 33, the opening width at the light source 50 side, i.e., the upper end (i.e., the minimum opening width Di0 of the first hole portion 31), is made larger than the thickness of the tip of the sensor 40 and the same as or smaller than the opening width Di1 of the protection plate opening 62o of the protector 60. The lower end of the cylindrical portion 32 is the lower end 31b of the first hole portion 31. In the example shown in Fig. 11, the cylindrical portion 32 has a cylindrical shape with a constant opening width Di32 from the upper end connected to the lower end 33b of the mortar-shaped portion 33 to the lower end 31b.
[0038] As shown in Fig. 11, the cylindrical portion 32 of the first hole portion 31 is provided so as to protrude downward from the frame portion 34 and is disposed in the top plate opening 64a provided in the top plate 64. The cylindrical portion 32 is formed to have a height H such that the surface of the lower end 31b of the cylindrical portion 32 is flush with the lower surface 64s2 of the top plate 64. In the example shown in Fig. 11, the cylindrical portion 32 has a height H that is substantially the same as the thickness T of the top plate 64 of the protector 60, and the entire cylindrical portion 32 in the vertical direction (arrow Z direction) is configured to be inserted into the top plate opening 64a of the top plate 64. In this way, the cylindrical portion 32 of the first hole portion 31 is disposed in the top plate opening 64a through which the sensor 40 provided in the top plate 64 passes, and the surface of the lower end 31b of the cylindrical portion 32 is exposed from the lower surface 64s2 of the top plate 64. Thus, during the assembly of the thermal sensor 100, most of the cylindrical portion 32 is easily visible to the operator through the top plate opening 64a provided at the center of the top plate 64. Therefore, the alignment between the case lid 30 and the protector 60 becomes easy.
[0039] Also, as shown in FIGS. 8 to 11, a first stepped portion 32p is provided on the outer peripheral surface 32o of the cylindrical portion 32. In the example shown in FIG. 10, the first stepped portion 32p is formed so as to protrude toward the outer peripheral side at the upper end portion of the outer peripheral surface 32o of the cylindrical portion 32. And the cylindrical portion 32 is configured such that the outer diameter D32a on the frame portion 34 side where the first stepped portion 32p is provided is larger than the outer diameter D32b of the lower portion. As shown in FIG. 11, the top plate 64 of the protector 60 is disposed below the frame portion 34 of the case lid 30 such that the first stepped portion 32p provided on the outer peripheral surface 32o of the cylindrical portion 32 and the second stepped portion 64r provided on the upper surface 64s1 of the top plate 64 face each other.
[0040] Note that the first stepped portion 32p only needs to be provided in a shape and position that meshes with the second stepped portion 64r of the top plate 64, and the shape and position of the first stepped portion 32p are not limited to the illustrated embodiment. Specifically, the first stepped portion 32p may be provided so as to protrude or recess on the surface of the case lid 30 that faces the top plate 64 of the protector 60. The first stepped portion 32p may be provided, for example, on the lower surface of the frame portion 34 of the case lid 30 so as to protrude downward.
[0041] When the case lid 30 and the top plate 64 are aligned in the vertical direction, the first stepped portion 32p and the second stepped portion 64r mesh with each other, so that the case lid 30 and the protector 60 can be roughly aligned in a direction parallel to the top plate 64, that is, in the horizontal direction. Note that the final arrangement of the case lid 30 and the protector 60 is determined by fixing the protector 60 to the case body 10.
[0042] It is sufficient that the top plate 64 and the first hole portion 31 can be arranged so that the space inside the case body 10 is not directly visible to the user. Therefore, the first stepped portion 32p of the case lid 30 and the second stepped portion 64r of the protector 60 only need to be able to roughly align the case lid 30 and the protector 60 in the horizontal direction, and do not need to be fitted. In that case, the protector 60 is fixed to the case lid 30 by attaching it to the case body 10 with a plurality of hooks 65a to 65d.
[0043] By the way, in the example shown in FIG. 11, the height H of the cylindrical portion 32 was the same as the thickness T of the top plate 64 of the protector 60. However, if the surface of the lower end 31b of the cylindrical portion 32 is flush with the lower surface 64s2 of the top plate 64, the height H of the cylindrical portion 32 does not have to be the same as the thickness T of the top plate 64. For example, only a part of the cylindrical portion 32 in the vertical direction may be configured to be inserted into the top plate opening 64a. In this case, by making the height H of the first step portion 32p from the lower surface of the frame portion 34 larger than the depth Ds (see FIG. 5) of the second step portion 64r from the upper surface 64s1 of the top plate 64, the surface of the lower end 31b of the cylindrical portion 32 and the lower surface 64s2 of the top plate 64 can be arranged to be flush.
[0044] Note that the configuration of the first hole portion 31 is not limited to the above configuration. For example, the cylindrical portion 32 does not have to have a constant opening width D32 from its upper end to its lower end 31b. For example, the cylindrical portion 32 may be inclined as long as the inner peripheral surface of the cylindrical portion 32 shown in FIG. 11 is a gentler inclined surface than the inner peripheral surface of the mortar-shaped portion 33.
[0045] Also, in the present embodiment, the portion above the cylindrical portion 32 in the first hole portion 31 has been described as having a mortar shape, but the shape of the upper portion of the first hole portion 31 is not limited to this. In the upper portion of the first hole portion 31, if the opening width at the cylindrical portion 32 side, that is, the lower end 33b, is larger than the opening width at the light source 50 side, that is, the upper end (that is, the minimum opening width Di0 of the first hole portion 31), the light emitted from the light source 50 can be diffused in the upper portion of the first hole portion 31, and the light emission area can be increased.
[0046] As shown in FIG. 8, the frame portion 34 is provided so as to extend from the lower end 33b of the mortar-shaped portion 33 to the outer peripheral side. A plurality of leg portions 35 are provided at the edge of the frame portion 34 so as to extend upward from the frame portion 34, that is, toward the substrate 20 side. Further, as shown in FIGS. 8 and 9, a plurality of lid protrusion portions 34p protruding to the outer peripheral side are formed at the edge of the frame portion 34. In the example shown in FIG. 9, leg portions 35 extending upward are provided at the four corners of the frame portion 34, a lid protrusion portion 34p protruding forward is provided at the front edge of the frame portion 34, and a lid protrusion portion 34p protruding rearward is provided at the rear edge of the frame portion 34. Further, as shown in FIGS. 9 and 10, in the case lid 30, on the side surface that contacts the inner surface of the case body 10 (see FIG. 8), a claw portion 34x protruding to the outer peripheral side is provided at a position above the lid protrusion portion 34p.
[0047] As shown in FIG. 8, the case lid 30 is attached to the case body 10 such that the plurality of leg portions 35 and the frame portion 34 are accommodated in the case body 10 and the first hole portion 31 protrudes downward from the opening 11 of the case body 10. When the case lid 30 is attached to the case body 10, the case lid 30 is pushed in so that the plurality of leg portions 35 slide on the inner surface of the case body 10. Then, when the case lid 30 is pushed in to a certain depth, the lid protrusion portion 34p of the frame portion 34 is disposed in the first notch portion 15 formed at the edge of the opening 11 of the case body 10 shown in FIG. 12 described later, thereby stopping the movement of the case lid 30, and the claw portion 34x shown in FIG. 9 is engaged by hanging on the claw hole 14e of the case body 10 shown in FIG. 12 described later.
[0048] As described above, the case lid 30 can be fixed to the case body 10 with a simple configuration such as the claw portion 34x.
[0049] Note that it is not necessary to provide a structure for fixing the case lid 30 to the case body 10. In this case, by adopting a configuration in which the case lid 30 is fitted into the case body 10 such that the frame portion 34 of the case lid 30 is clamped by the case body 10, the structure can be simplified and the assembly becomes easy. The plurality of leg portions 35 function as guides when fitting the case lid 30 into the case body 10.
[0050] The length of the leg portion 35 is determined so as not to contact the substrate 20 or various electronic components mounted on the substrate 20. Note that the length of the leg portion 35 may be provided such that the tip of the leg portion 35 contacts the lower surface 21 of the substrate 20 housed in the case body 10 in a state where the case lid 30 is installed on the case body 10. In this case, the substrate 20 can be pressed upward by the tip of the leg portion 35, and the movement of the substrate 20 in the case body 10 is suppressed.
[0051] As shown in FIG. 8, the size of the frame portion 34 is smaller than the size of the opening 11 of the case body 10, and gaps are formed on both sides of the frame portion 34 in a state where the case lid 30 is installed on the case body 10. In the example shown in FIG. 8, the width of the frame portion 34 in the front-rear direction (arrow Y direction) is formed to be approximately the same as the opening width in the front-rear direction of the opening 11, the width of the frame portion 34 in the left-right direction (arrow X direction) is smaller than the opening width in the left-right direction of the opening 11, and gaps are formed on the right side and the left side of the frame portion 34. During the manufacture of the heat sensor 100, after the substrate 20 is housed in the case body 10 and the case lid 30 is installed, a filler is injected into the case body 10 through the gap. The filler will be described later.
[0052] Note that the size of the frame portion 34 is not limited to the above case. For example, the size of the frame portion 34 may be made the same as the size of the opening 11, and an injection port may be provided in the frame portion 34. Further, when the size of the frame portion 34 is made the same as the size of the opening 11, the filler may be injected through the first hole portion 31.
[0053] As shown in FIG. 8, in the case lid 30, a groove 34c in which hooks 65c and 65d of the protector 60 are arranged is formed on the side surface that contacts the inner surface of the case body 10. Specifically, as shown in FIG. 9, the groove 34c is formed in the frame portion 34 and the leg portion 35 so as to extend in the vertical direction (arrow Z direction).
[0054] In the example shown in FIG. 8, grooves 34c are formed on the front and rear side surfaces of the case lid 30, and a pair of hooks 65c and 65d shown in FIGS. 4 and 6 are attached to the case body 10 through these grooves 34c. Further, in the example shown in FIG. 8, gaps are formed on the left and right sides of the frame portion 34 in the opening 11, and a pair of hooks 65a and 65b shown in FIGS. 4 and 7 are attached to the case body 10 through these gaps.
[0055] (Substrate 20) As shown in FIGS. 2 and 13, the substrate 20 is composed of, for example, a polygonal printed circuit board. In the example shown in FIG. 2, the substrate 20 has an elongated shape with a long side extending in the left-right direction (arrow X direction), and both surfaces of the substrate 20 are arranged in the case body 10 so as to face upward and downward. Various electronic components are mounted on the substrate 20 to form a control circuit.
[0056] Note that the arrangement of the substrate 20 is not limited to the above case. The substrate 20 may be placed vertically in the case body 10. For example, the substrate 20 may have a substantially rectangular shape with a long side extending in the vertical direction (arrow Z direction), and both surfaces of the substrate 20 may be arranged in the case body 10 so as to face forward and backward.
[0057] As shown in FIGS. 2, 8, and 12, a light source 50 and a sensor 40 are attached to a predetermined position on the lower surface 21 of the substrate 20 by soldering.
[0058] Further, as shown in FIG. 13, a wiring connection portion 26 is provided on the substrate 20, and one end of a wiring 27 shown in FIG. 14 is connected to the wiring connection portion 26. The other end of the wiring 27 connected to the substrate 20 is drawn out of the case body 10.
[0059] Further, a notch 23 is formed at the edge of the substrate 20. As shown in FIGS. 12 and 13, a guide projection 13 provided on the inner wall of the case body 10 is disposed in the notch 23. The configuration of the guide projection 13 will be described later. As shown in FIG. 13, the notch 23 is provided at a position eccentric from the center on the longitudinal side of the substrate 20. In the example shown in FIG. 13, the notch 23 is formed at a position on the front side and the rear side, which are the long sides of the substrate 20, to the left of the center in the left-right direction (arrow X direction).
[0060] The control circuit formed on the substrate 20 receives the output value of the sensor 40 and determines the ambient temperature based on the output value. Then, when it is determined that the ambient temperature is equal to or higher than a certain temperature, the control circuit transmits a fire signal to a receiver (not shown) and controls the light source 50 to turn on or blink.
[0061] (Sensor 40) As shown in FIG. 11, the sensor 40 has a heat-sensitive portion 41 that detects heat and detects the heat of the airflow flowing into the flow space SP. The heat-sensitive portion 41 is composed of, for example, a thermistor whose resistance changes due to heat transmitted from the airflow, and converts the temperature change into an electrical signal and outputs it.
[0062] The sensor 40 is composed of, for example, a heat-sensitive part 41, a rod-shaped lead part 42 made of lead wires, a sensor base 44 having two pins (not shown) attached to the substrate 20, and a connection part 43 connecting the lead part 42 and the sensor base 44. The heat-sensitive part 41 is attached to the tip of the lead part 42, and the heat-sensitive part 41 and the lead part 42 are integrally coated. The connection part 43 connects the base end of the lead part 42 and the tips of the two pins of the sensor base 44, and is covered with resin or the like. Then, the two pins of the sensor base 44 are fixed to the substrate 20 by soldering respectively, and the heat-sensitive part 41 is electrically connected to the control circuit of the substrate 20.
[0063] In order to detect the heat of the vertical air flow, the heat-sensitive part 41 is arranged directly above the center of the protection plate opening 62o of the protector 60 in the flow space SP. Specifically, the heat-sensitive part 41 is arranged at a preset position in the flow space SP by the sensor base 44 and the lead part 42 connected to the sensor base 44. In the example shown in FIG. 11, the sensor 40 is arranged in the vertical direction (arrow Z direction) perpendicular to the substrate 20 arranged horizontally in the case body 10.
[0064] (Light source 50) The light source 50 is composed of, for example, an LED (Light Emitting Diode) or the like. As shown in FIG. 11, the light source 50 is soldered to the lower surface 21 of the substrate 20 at the upper part of the light source 50 so that the light emitting surface 51 faces downward. The light source 50 is preferably mounted at a position above the first hole 31 of the case lid 30 on the lower surface 21 of the substrate 20. By providing the light source 50 in this way, it is possible to suppress the light emitted from the light source 50 from being blocked by electronic components other than the light source 50 mounted on the substrate 20 before reaching the first hole 31.
[0065] In the example shown in FIG. 13, two light sources 50 are mounted on the substrate 20, one light source 50 is disposed in front of the sensor 40, and the other light source 50 is disposed behind the sensor 40. In the bottom view of FIG. 13, the two light sources 50 are arranged such that the centers of the two light emitting surfaces 51 in the front-rear direction (arrow Y direction) coincide with the center position of the sensor 40. The distance K between the two light sources 50 shown in FIG. 13 is preferably equal to or less than the inner diameter of the top plate 64 of the protector 60 shown in FIG. 5, that is, the opening width Di2b below the top plate opening 64a. In this case, the light of each light source 50 is less likely to be blocked by the top plate opening 64a, making it easier to visually recognize. Also, in this case, it is preferable to make the distance K between the two light sources 50 longer than the minimum opening width Di0 of the first hole 31 shown in FIG. 1. In this case, it is possible to avoid the downward light, which is particularly strong in intensity, among the light emitted by the light source 50 from directly exiting through the gap between the first hole 31 and the sensor 40. Also, since the strong downward light can be made to enter and be diffused by the light-transmitting member of the case lid 30, the directivity of the light can be reduced.
[0066] Note that the number of light sources 50 and the arrangement of the light sources 50 are not limited to the above case. For example, the two light sources 50 may be arranged in the left-right direction (arrow X direction).
[0067] Also, the distance K between the two light sources 50 in the front-rear direction (arrow Y direction) shown in FIG. 13 may be further increased to be larger than the opening width Di1 of the protection plate opening 62o shown in FIG. 4. Thereby, in the first hole 31 shown in FIG. 1, the locally bright portion directly below the light source 50 (see FIG. 8) can be covered by the protection plate 62, so that glare can be reduced.
[0068] Also, as shown in FIG. 11, in order to make the light emitted by the light source 50 provided on the lower surface 21 of the substrate 20 enter the entire first hole 31 of the case lid 30, the distance between the lower surface of the substrate 20 and the frame portion 34 of the case lid 30 may be adjusted based on the light directivity characteristics of the light source 50. In order to make the light enter as wide a range as possible of the first hole 31 of the case lid 30, the distance between the lower surface of the substrate 20 and the frame portion 34 of the case lid 30 may be increased.
[0069] (Case body 10) As shown in FIG. 12, the case body 10 has a case outer shell 12 having a box shape with an open bottom surface. In the state where the heat sensor 100 is installed on the ceiling 200 as shown in FIG. 11, the outer surface of the case outer shell 12 and the inner surface of the recess 202 of the ceiling 200 face each other.
[0070] Also, as shown in FIG. 12, guide protrusions 13 are provided on the inner wall of the case outer shell 12 at positions corresponding to the notches 23 of the substrate 20. The guide protrusions 13 are provided at positions on the inner wall of the case body 10 that face the notches 23 provided on the substrate 20. In the example shown in FIG. 13, the guide protrusions 13 are formed at positions shifted to the left from the center in the left - right direction (arrow X direction) on the front side and the rear side extending in the longitudinal direction of the case body 10. By providing the guide protrusions 13 corresponding to the notches 23 of the substrate 20 on the inner wall of the case body 10, it is possible to prevent the substrate 20 from being inserted in the wrong orientation during assembly.
[0071] Note that the number and positions of the notches 23 of the substrate 20 and the guide protrusions 13 of the case body 10 are not limited to the above - mentioned cases. For example, the notches 23 of the substrate 20 and the guide protrusions 13 of the case body 10 may be provided at only one location. Even in this case, it is possible to prevent the substrate 20 from being inserted in the wrong orientation during assembly.
[0072] As shown in FIG. 12, on the inner wall of the case body 10, the guide protrusions 13 are provided so as to extend in the vertical direction (arrow Z direction). By making the guide protrusions 13 have a shape extending in the vertical direction, when the substrate 20 is accommodated in the case body 10 during assembly, the guide protrusions 13 function as a guide for the substrate 20.
[0073] Also, as shown in FIGS. 12 and 13, a first notch portion 15 is formed at the edge of the opening 11 of the case body 10. A lid protrusion 34p provided on the frame portion 34 of the case lid 30 is disposed in the first notch portion 15. In the example shown in FIGS. 12 and 13, the first notch portion 15 is formed at a portion of the front and rear side walls of the case body 10 that faces the frame portion 34 (see FIG. 8).
[0074] Also, as shown in FIG. 12, a claw hole 14e for engaging with a claw portion 34x shown in FIG. 9 is formed in the case body 10. In the example shown in FIG. 12, the claw hole 14e is formed at a portion of the front and rear side walls of the case body 10 that faces the claw portion 34x (see FIG. 9), that is, at a position above the first notch portion 15.
[0075] Also, as shown in FIGS. 13 and 14, a second notch portion 16 is formed at the edge of the opening 11 of the case body 10. A part of the wiring 27 connected to and drawn out from the substrate 20 is disposed in the second notch portion 16. In the example shown in FIG. 13, wiring connection portions 26 are provided at three of the four corners of the substrate 20, and three second notch portions 16 are formed at the edge of the opening 11 so that the path of the wiring 27 connected to the wiring connection portion 26 in the case body 10 is the shortest. Specifically, the second notch portion 16 is formed at the left end portion of the front side wall of the case body 10 and at the left and right end portions of the rear side wall of the case body 10, respectively.
[0076] As shown in FIG. 14, providing the second notch portion 16 facilitates the drawing out of the wiring 27. Also, by providing the second notch portion 16, even after the substrate 20 to which the wiring 27 is connected is housed in the case body 10, the movement of the wiring 27 is suppressed by disposing the wiring 27 in the second notch portion 16, making the subsequent assembly work easier.
[0077] Also, as shown in FIGS. 8 and 12, a positioning convex portion 17 protruding downward is formed at the edge of the opening 11 of the case body 10. In the example shown in FIG. 8, the positioning convex portions 17 are provided at two locations in the front and rear on the lower surfaces of the left and right side walls of the case body 10, respectively. By inserting the positioning convex portions 17 of the case body 10 shown in FIG. 8 into the positioning concave portions 66 (see FIG. 4) on the upper surface 64s1 of the top plate 64 shown in FIG. 4, the positioning between the case body 10 and the protector 60 is performed. As a result, the positional relationship between the case lid 30 attached to the case body 10 and the protector 60 is also determined.
[0078] Also, as shown in FIG. 12, hook holes 14a, 14b, 14c, and 14d into which the folded-back portions 65a1, 65b1, 65c1, and 65d1 of the plurality of hooks 65a to 65d of the protector 60 shown in FIGS. 4, 6, and 7 are inserted are formed in the case body 10. The folded-back portions 65a1 and 65b1 of the hooks 65a and 65b shown in FIG. 6 are inserted into the hook holes 14a and 14b provided in the left and right side walls of the case body 10 and are hooked on the case outer periphery 12. Further, the folded-back portions 65c1 and 65d1 of the hooks 65c and 65d shown in FIG. 7 are inserted into the hook holes 14c and 14d provided in the front and rear side walls of the case body 10.
[0079] The folded-back portions 65a1, 65b1, 65c1, and 65d1 that are folded outward and provided at the tip ends of the plurality of hooks 65a, 65b, 65c, and 65d shown in FIGS. 6 and 7 are in contact with and supported by the inner surfaces below the hook holes 14a, 14b, 14c, and 14d of the case body 10 shown in FIG. 12. Therefore, even when the weight of the protector 60 is applied, the protector 60 will not fall off from the case body 10. In particular, in the pair of hooks 65c and 65d that face each other in the front-rear direction (arrow Y direction) as shown in FIG. 7, their folded-back portions 65c1 and 65d1 face outward from each other, and the inner angle θ2 of the folded-back portions 65c1 and 65d1 is configured to be an acute angle, so they fit into the lower edges of the hook holes 14c and 14d in the case outline 12 shown in FIG. 12. Therefore, it is possible to more reliably prevent the protector 60 from coming off the case body 10.
[0080] Although not shown, the space inside the case body 10 is filled with a filling agent during the manufacture of the heat sensor 100. When the filling agent hardens, the substrate 20 on which various electronic components are mounted, the case body 10, and the case lid 30 are fixed. Also, when the filling agent hardens, the substrate 20 is waterproofed. As the filling agent, a transparent or translucent member that transmits light, such as polyurethane, is used. The filling agent is preferably provided so that the light source 50 mounted on the substrate 20 is covered by the filling agent. Thereby, the light emitted by the light source 50 can be diffused in the filling agent, and it is possible to suppress the local concentration of light incident on the first hole portion 31 of the case lid 30. Note that the filling agent can be omitted.
[0081] Next, with reference to FIGS. 1 and 11, the operation of the thermal sensor 100 will be described. When the hot air flow generated during a fire passes through the central portion of the flow space SP shown in FIG. 11, heat is transferred from the hot air flow to the heat-sensitive portion 41. The light emitted by the light source 50 is emitted into the flow space SP within the protector 60 through the circular first hole portion 31 formed in the central portion of the case lid 30. The light from the light source 50 first enters the mortar-shaped portion 33 in the first hole portion 31 and diffuses in the mortar-shaped portion 33. After diffusing in the mortar-shaped portion 33, the light from the light source 50 enters the cylindrical portion 32 from the lower end 33b of the mortar-shaped portion 33 and is guided downward. The light that diffuses in the first hole portion 31, is guided downward, and is emitted into the flow space SP within the protector 60 illuminates the portion of the protector 60 facing the flow space SP. Then, the light emitted into the flow space SP exits the thermal sensor 100 through the circular protector opening 62o formed in the center of the protective plate 62 of the protector 60 and the gaps 63g between the plurality of support columns 63 radially arranged on the side surface of the protector 60. Therefore, since light is emitted from the central portion of the thermal sensor 100, the user can visually recognize the light emission indicating the operation of the thermal sensor 100 from any direction by utilizing the fact that the central portion of the thermal sensor 100 emits light with the sensor 40 as the center.
[0082] As described above, in the first embodiment, the thermal sensor 100 includes a case body 10 having an opening 11 that houses a substrate 20 on which a sensor 40 for sensing heat and a light source 50 are mounted, and a case lid 30 provided below the case body 10 and composed of a light-transmitting member that transmits the light of the light source 50. Further, the thermal sensor 100 includes a protector 60 having a top plate 64 located below the case lid 30 and a protection portion 61 provided on the top plate 64 for protecting the sensor 40. The case lid 30 has a hole portion (first hole portion 31) through which the sensor 40 is inserted, and the hole portion includes a cylindrical portion 32 extending downward. The top plate 64 is provided with a top plate opening 64a in which the cylindrical portion 32 is disposed, and the cylindrical portion 32 is formed at a height H flush with the lower surface 64s2 of the top plate 64.
[0083] As a result, the cylindrical portion 32 in the hole (first hole 31) of the case lid 30 formed of the light-transmitting member is disposed in the top plate opening 64a of the top plate 64 and is flush with the lower surface 64s2 of the top plate 64. Therefore, at the top plate opening 64a of the top plate 64, the wall constituting the hole of the case lid 30 transmits the light from the light source 50, making the light easier to view.
[0084] Further, the hole (first hole 31) has a mortar-shaped portion 33 whose opening width gradually increases downward, and includes the above-described cylindrical portion 32 so as to extend downward from the lower end of the mortar-shaped portion 33. Further, the case lid 30 has a frame portion 34 extending from the lower end 33b of the mortar-shaped portion 33 toward the outer peripheral side. Thereby, the light emitted from the light source 50 can be diffused in the mortar-shaped portion 33 of the first hole 31, and the surface area on the side where the light is emitted in the first hole 31 can be increased, so that the thermal sensor 100 can be more easily visible even when viewed from the side (front, rear, left, or right).
[0085] Further, a first stepped portion 32p having a larger outer diameter on the upper side, that is, on the frame portion 34 side, is provided on the outer peripheral surface 32o of the cylindrical portion 32, and a second stepped portion 64r facing the first stepped portion 32p is provided on the upper surface of the top plate 64. Thereby, alignment between the case lid 30 and the protector 60 becomes easy. Also, the internal space of the case body 10 becomes difficult to be seen by the user, improving the design quality.
[0086] Further, the case lid 30 has a plurality of leg portions 35 extending upward along the inner surface of the case body 10. Thereby, when attaching the case lid 30 to the case body 10, the plurality of leg portions 35 function as guides, making the attachment easy.
[0087] Also, one end of a wiring 27 led to the outside is connected to the substrate 20, and a notch (second notch 16) for arranging the wiring 27 is formed at the edge of the opening 11 of the case body 10. Further, a notch 23 is formed at the edge of the substrate 20, and on the inner wall of the case body 10, a projection (guide projection 13) to be arranged in the notch 23 of the substrate 20 is provided so as to extend in the vertical direction. Thus, by providing the notch (second notch 16) in the case body 10, the movement of the wiring 27 can be suppressed, and when the substrate 20 is accommodated in the case body 10, the projection (guide projection 13) of the case body 10 serves as a guide for the substrate 20, so that the assembly of the case body 10 and the substrate 20 becomes easy. As a result, it leads to an improvement in assemblability.
[0088] Also, on the top plate 64 of the protector 60, a pair of hooks 65c and 65d are provided which extend upward and have folded-back portions 65c1 and 65d1 that face outward from each other at the tip portions. The inner angles θ2 of the folded-back portions 65c1 and 65d1 are acute angles, and in the case body 10, hook holes 14c and 14d into which the respective hooks 65c and 65d are fitted are formed. Thus, since the pair of hooks 65c and 65d are fitted to the edges of the hook holes 14c and 14d of the case body 10, it is suppressed that they come off after the assembly of the protector 60 and the case body 10.
[0089] Note that the embodiments of the present disclosure are not limited to the above embodiments, and various modifications can be made. For example, the shape of the case outer shell 12 is not limited to the above case, and can be, for example, a cylindrical shape having an upper surface. Also, for example, although the case lid 30 as a whole is made of a light-transmitting member, only the first hole 31 in the case lid 30 may be made of a light-transmitting member, and the portion other than the first hole 31 in the case lid 30 may be made of a light-blocking member. Further, regarding the second hole 69, although it is configured by the protection plate opening 62o and the gap 63g, it is not limited thereto, and it may be configured only by the protection plate opening 62o or only by the gap 63g. Also, the above-described heat sensor 100 can be installed on the side wall of the room. In this case, the heat sensor 100 is installed on the side wall so that the light-emitting side of the first hole 31, that is, the protector 60 side, is exposed to the interior of the room.
Description of Reference Numerals
[0090] 10 Case body, 11 Opening, 12 Case outer contour, 13 Guide protrusion, 14a, 14b, 14c, 14d Hook holes, 14e Claw hole, 15 First notch, 16 Second notch, 17 Positioning convex part, 20 Substrate, 21 Lower surface, 23 Notch, 26 Wiring connection part, 27 Wiring, 30 Case lid, 31 First hole part, 31a Upper end surface, 31b Lower end, 32 Cylindrical part, 32o Outer peripheral surface, 32p First step part, 33 Bowl-shaped part, 33b Lower end, 34 Frame part, 34c Groove, 34p Lid protrusion part, 34x Claw part, 35 Leg part, 40 Sensor, 41 Heat-sensitive part, 42 Lead part, 43 Connection part, 44 Sensor base, 50 Light source, 51 Light-emitting surface, 60 Protector, 61 Protection part, 62 Protection plate, 62o Protection plate opening, 63 Support column, 63g Gap, 64 Top plate, 64a Top plate opening, 64r Second step part, 64s1 Upper surface, 64s2 Lower surface, 65a, 65b, 65c, 65d Hooks, 65a1, 65b1, 65c1, 65d1 Folded-back parts, 66 Positioning concave part, 67 Spring, 69 Second hole part, 100 Thermal sensor, 200 Ceiling, 201 Ceiling surface, 202 Concave part, D32a Outer diameter, D32b Outer diameter, Di32 Opening width, Di0 Minimum opening width, Di1 Opening width, Di2a Opening width, Di2b Opening width, Do1 Outer diameter, Do2 Outer diameter, Do3 Outer diameter, Ds Depth, H Height, K Distance, SP Flow-through space, T Thickness, θ1 Inner angle, θ2 Inner angle.
Claims
1. A case body having an opening for housing a substrate on which a heat sensor and a light source are mounted, a case lid provided below the case body, a top plate located below the case lid, and a protector having a protection part provided on the top plate for protecting the sensor, A heat sensor comprising: The case lid has a hole through which the sensor is inserted. The hole includes a mortar-shaped part whose opening width gradually increases downward, and a cylindrical part extending downward from the lower end of the mortar-shaped part. The top plate is provided with a top plate opening for arranging the cylindrical part. The hole is composed of a light-transmitting member that transmits the light of the light source. Heat sensor.
2. The case lid has a frame part extending outward from the outer peripheral surface of the hole, and a plurality of leg parts extending upward along the inner surface of the case body from the frame part. The heat sensor according to Claim 1.
3. A first stepped part with a larger outer diameter on the upper side is provided on the outer peripheral surface of the cylindrical part. A second stepped part facing the first stepped part on the upper surface side is provided on the inner wall of the top plate opening of the top plate. The heat sensor according to Claim 1 or 2.
Citation Information
Patent Citations
Fire sensor
JP1996180273A
Heat sensor
JP2021111298A
Fire detector
KR1020090113659A
Supply device of engine oil for vehicle
JP1999001298A