Determination system, determination device and determination method

Abstract

To provide a determination system capable of determining a plating condition during plating processing.SOLUTION: A determination system 100 comprises: a determination device 200 that comprises an input unit 201 into which information regarding an interface between a holder holding a plating solution and a member to be processed during plating processing in which the holder is brought into contact with the member to be processed, a determination unit 202 that determines the quality of a plated portion formed on the interface during the plating processing based on the information, a detection unit 203, a proposal unit 204, a determination unit 205, a quality DB 206, a defect DB 207, and an output unit 208; and cameras 109, 110.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a determination system, a determination device, and a determination method.

Background Art

[0002] Due to the recent increase in environmental awareness, products and services that consider the environment are in demand. In order to contribute to environmental conservation, it is preferable to reduce carbon dioxide emissions and efficiently utilize resources by looking at the entire life cycle of the product.

[0003] Repairing and reusing used members (parts, etc.) is more effective from the perspective of reducing the environmental load than recycling as a material. However, the recovered members are often in different usage states and damage states. Even local wear, scratches, etc. may greatly affect the performance, so it is preferable to recover local wear, scratches, etc. by repair. As a local repair method for metal members, there is a repair method by plating treatment, and repair can be performed on-site without moving to a large repair factory or the like. However, since the repair is performed on-site, the quality of the repair may vary depending on the state of the member (the state of pretreatment), the surrounding environment, the skill of the operator, etc. Therefore, a technique for determining the quality of the plated portion obtained by plating treatment is known.

[0004] Patent Document 1 describes "an electroplating inspection apparatus comprising: illumination means for irradiating a plate-shaped metal product with illumination light; imaging means for imaging the plate-shaped metal product to obtain image information; conveying means for moving the plate-shaped metal product in one direction at a constant speed; a supply / discharge unit for supplying and discharging the plate-shaped metal products one by one onto the conveying means; a processing control unit for processing the image information of the electroplating reference product to obtain inspection information, comparing the inspection information with the image information of the plate-shaped metal product to determine the electroplating state, obtaining an inspection result, and performing operation control of the entire apparatus; storage means for storing the image information and inspection result of the plate-shaped metal product and the image information and inspection information of the electroplating reference product; and electroplating state management means for comparing the inspection result and the tendency of the image information of the plate-shaped metal product with reference to the image information of the electroplating reference product."

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] In the invention described in Patent Document 1, the state of the plated portion (plating state) is inspected based on the image information of the plated portion taken after the plating process. However, the plating state also changes during the plating process. For this reason, in the invention described in Patent Document 1, the inspection of the plating state during the plating process is insufficient. The problem to be solved by the present disclosure is to provide a determination system, a determination device, and a determination method capable of determining the plating state during the plating process.

Means for Solving the Problems

[0007] The determination system of the present disclosure includes an input unit into which information regarding the interface between the holding body and the member to be processed is input during the plating process in which the holding body holding the plating solution is brought into contact with the member to be processed, and a determination unit that determines the quality of the plated portion formed at the interface during the plating process based on the information. Other means for solving the problem will be described later in the mode for carrying out the invention.

Effects of the Invention

[0008] According to the present disclosure, it is possible to provide a determination system, a determination device, and a determination method capable of determining the plating state during the plating process.

Brief Description of the Drawings

[0009]

Figure 1

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Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments for implementing the present disclosure will be described with reference to the drawings (referred to as embodiments). In the description of the following one embodiment, descriptions of other embodiments applicable to the one embodiment will be given as appropriate. The present disclosure is not limited to the following one embodiment, and different embodiments can be combined with each other or arbitrarily modified within a range that does not significantly impair the effects of the present disclosure. Also, the same members will be denoted by the same reference numerals, and redundant descriptions will be omitted. Furthermore, those having the same function will be given the same name. The illustrated content is merely schematic, and for the convenience of illustration, it may be changed from the actual configuration within a range that does not significantly impair the effects of the present disclosure, or the illustration of some members may be omitted or deformed between the drawings. Also, in the same embodiment, it is not necessarily required to include all configurations.

[0011] FIG. 1 is a block diagram showing a determination system 100 and a determination device 200 of the present disclosure. Both the determination system 100 and the determination device 200 determine the quality (state) of a plating portion 105 (FIG. 5) formed during plating processing on a member to be processed 107 (FIG. 2). The quality can be classified, for example, as good or bad, but is not limited thereto. The determination by the determination system 100 is usually performed during plating processing. However, the determination may be performed after plating processing using information such as an image during plating processing (described later). When the determination is made after plating processing, the execution conditions (processing method, etc.) of the next plating processing can be determined based on the determination result obtained after plating processing.

[0012] FIG. 2 is a schematic diagram of a member to be processed 107 on which plating processing is performed. The member to be processed 107 is, for example, a conductive structure made of, for example, metal. The metal constituting the member to be processed 107 is, for example, stainless steel, copper, steel, aluminum, etc. In the illustrated example, the member to be processed 107 is a shaft made of SUS304, but is not limited thereto. Also, the member to be processed 107 is, for example, a component constituting an arbitrary finished product, but may be the component itself constituting the finished product.

[0013] On the surface of a structure made of, for example, metal such as a shaft, wear, cracks, etc. occur due to reasons such as use and aging. In the example of FIG. 2, a worn portion 108 generated along with the use (rotation) of the shaft has occurred on the surface of the shaft. In the worn portion 108, local thinning is progressing. Therefore, by plating the worn portion 108, build-up is performed on the worn portion 108. The local thinning can be eliminated by the build-up, and the shaft can be reused. Note that the plating process is not limited to repair uses such as build-up on the worn portion 108, for example.

[0014] FIG. 3 is a schematic diagram showing the determination system 100 of the present disclosure and the state of the plating process. Details regarding the configuration of the determination system 100 will be described later. The plating process is performed by bringing a holding body 113 holding a plating solution into contact with a member to be processed 107. The composition of the plating solution can be appropriately determined according to the composition of the plated portion 105 (FIG. 5), the composition of the member to be processed 107, and the like. The plating solution is usually an aqueous solution. Examples of the type of plating solution include a Watts bath, a sulfamic acid bath, a citric acid bath, a Wood bath, and the like. For example, if the plated portion 105 is nickel plating, a dull Watts bath for nickel plating can be used as the plating solution. When a dull Watts bath for nickel plating is used, nickel ions in the holding body 113 move by energization inside the holding body 113, and a plating reaction (plating deposition reaction) of the plated portion 105 proceeds at the interface 118 (FIG. 5) between the holding body 113 and the member to be processed 107.

[0015] The holding body 113 is arranged along the surface of the member 107 to be processed. The holding body 113 is arranged between the electrode 111 and the metallic member 107 to be processed. In the holding body 113, the electrode 111 is arranged on the side opposite to the interface 118 (Fig. 5), which is the contact portion between the holding body 113 and the member 107 to be processed. For example, the holding body 113 is integrally formed with the electrode 111. The electrode 111 and the member 107 to be processed are connected to a processing device 112 including, for example, a power supply, and a voltage is applied between the electrode 111 and the member 107 to be processed. Thereby, an electric current flows through the holding body 113, and a plating portion 105 (Fig. 5) is formed at the interface 118 between the holding body 113 and the member 107 to be processed. The material constituting the electrode 111 is, for example, a metal such as pure nickel (pure Ni), a nickel alloy, platinum, iridium oxide (Ir oxide).

[0016] The size of the holding body 113 preferably has a size equal to or larger than the area of the worn portion 108. Thereby, the holding body 113 can be arranged so as to cover the worn portion 108. The arrangement may be performed, for example, on the worn portion 108 washed with a cleaning agent such as an arbitrary acid (dilute sulfuric acid, etc.) or an alkali.

[0017] In the example of the present disclosure, the holding body 113 holding the plating solution is a light-transmissive gel containing the plating solution. The plating process using the gel is sometimes referred to as, for example, "gel plating process". By using such a holding body 113, although details will be described later, the interface 118 between the holding body 113 and the member 107 to be processed can be photographed from above the holding body 113 using the camera 109. Further, since the plating solution is held by the gel, it is difficult for the plating solution to leak from the gel, and it is easy to perform the plating process only on a desired portion of the member 107 to be processed. Furthermore, since the number of bubbles 114 generated during plating can be accurately calculated by the light-transmissive gel, the plating state during the plating process can be determined.

[0018] The light transmittance of the gel is not particularly limited, but it preferably has a transmittance (transparency, light transmittance) such that the interface 118 can be photographed by the camera 109, such as semi-transparency. Further, the composition of the gel is, for example, gelatin, agar, locust bean gum, xanthan gum, or the like.

[0019] The conditions for the plating process using the holding member 113 are not particularly limited and are arbitrary. The conditions are, for example, at least one of the current value to be energized, the voltage value to be applied, the energization time, the type (composition) of the plating solution, the composition of the holding member 113 (for example, gel), the temperature of the holding member 113 during plating, the material of the electrode 111, the distance between the electrode 111 and the member to be processed 107 (the thickness of the holding member 113), and the like.

[0020] In another embodiment, the holding member 113 is a porous body having holes (not shown) for holding the plating solution. By using such a holding member 113, the plating solution can be supplied from the holes to the contact portion (interface 118) with the member to be processed 107, and plating can be performed. Further, by using a porous body, it is possible to easily perform plating on a wide range of portions of the member to be processed 107 all at once.

[0021] The porous body preferably has at least one of flexibility and elasticity. Thereby, it is possible to easily bring the holding member 113 into close contact with the member to be processed 107. Examples of the porous body having at least one of flexibility and elasticity include a sponge. The sponge preferably has light transmittance, but it may not have light transmittance. In the case of a sponge without light transmittance, the plated portion 105 (FIG. 5) formed at the interface 118 can be grasped, for example, by photographing the interface 118 from the side of the member to be processed 107 and the holding member 113 using the camera 109.

[0022] Returning to FIG. 1, the determination system 100 includes cameras 109 and 110, a determination device 200, an input device 300, and an output device 400. The input device 300 inputs information to the input unit 201 of the determination device 200. The information to be input is, for example, the conditions for plating processing using the processing device 112 (such as the content shown in FIG. 8 described later), etc. The input device 300 is, for example, a keyboard, a mouse, a touch panel, etc.

[0023] The processing device 112 is connected to the determination system 100 via the network 500. The determination device 200 determines the plated portion 105 formed during the plating process. The cameras 109 and 110, the determination device 200, and the processing device 112 that performs the plating process are connected via the network 500.

[0024] The determination system 100 includes an input unit 201, a determination unit 202, a detection unit 203, a proposal unit 204, a decision unit 205, a quality database (hereinafter, appropriately referred to as the quality DB 206), a defect database (hereinafter, appropriately referred to as the defect DB 207), and an output unit 208. In the example of the present disclosure, the input unit 201, the determination unit 202, the detection unit 203, the proposal unit 204, the decision unit 205, the quality DB 206, the defect DB 207, and the output unit 208 are all provided in the determination device 200. However, at least one of the input unit 201, the determination unit 202, the detection unit 203, the proposal unit 204, the decision unit 205, the quality DB 206, the defect DB 207, and the output unit 208 may be provided in a server (not shown) connectable via, for example, the network 500. For example, the quality DB 206 and the defect DB 207 may be stored in a remote server (not shown) connectable from the determination device 200 via the network 500.

[0025] The camera 109 grasps the temperature distribution on the surface of the holding body 113 between the electrode 111 and the member to be processed 107, that is, on the side surface. As described above, the electrode 111 contacts the holding body 113 on the surface of the holding body 113 opposite to the contact portion (interface 118) with the member to be processed 107. The camera 109 is, for example, a thermal camera arranged on the side of the holding body 113 to photograph the side surface of the holding body 113. There may be one camera 109 or a plurality of cameras 109.

[0026] FIG. 4 is a schematic diagram showing the temperature distribution on the side surface of the holding body 113. FIG. 4 is a view of the holding body 113 seen from the extending direction of the member to be processed 107. As described above, the plating process is performed by energizing the holding body 113. By energization, the temperature of the holding body 113 rises, but the degree of the temperature rise varies depending on the distance from the electrode 111 (the distance from the member to be processed 107). The distance here is the distance in the thickness direction of the holding body 113, and is the distance (the length of the line segment) in the line segment that connects the electrode 111 and the member to be processed 107 in the shortest way. If the holding body 113 is arranged in an ideal state and the plating process is executed in an ideal state, the closer to the member to be processed 107 from the electrode 111, the higher the temperature of the holding body 113 rises, and the temperature is the highest near the interface 118 (the lower surface 1132 of the holding body 113) between the electrode 111 and the member to be processed 107. Conversely, the temperature is the lowest on the upper surface 1131 of the holding body 113 closest to the electrode 111.

[0027] Therefore, in the holding body 113, a temperature difference is generated between the upper surface 1131 and the lower surface 1132 of the holding body 113 due to the plating process. Also, this temperature difference expands as the plating process progresses during the plating process. That is, the temperature difference is almost 0 immediately after the start of energization for the plating process, but the temperature difference increases as the plating process progresses. For this reason, by photographing the temperature distribution on the side surface with the camera 109, the progress of the plating process can be grasped.

[0028] In addition, depending on the method of performing the plating process, such as the structure of the holder 113, the electrode 111, and the member to be processed 107, and the form of installation of the holder 113, uneven temperature distribution may occur. That is, as described above, in addition to the distribution in which the temperature gradually rises from the upper surface 1131 to the lower surface 1132, a temperature distribution due to another reason occurs. For example, during the plating process, gas such as hydrogen may be generated at the interface 118. The generated gas exists as bubbles 114 (FIG. 5) at the interface 118. Therefore, it becomes difficult for current to flow in the portion of the bubbles 114, and the portion of the bubbles 114 becomes a locally high temperature state. Thus, the camera 109 can indirectly grasp the presence of the bubbles 114 by photographing the temperature distribution of the holder 113, for example, on the side as shown in FIG. 4, and detecting the locally high temperature portion near the interface 118.

[0029] In addition, when a locally significant high temperature, a locally significant low temperature, or a significant temperature difference is recognized, unexpected problems may occur. Therefore, in these cases, for example, it may be notified to the output device 400. Whether or not unexpected problems have occurred can be determined, for example, in advance by experiments, calculations, simulations, etc., and can be judged by comparing a threshold value indicating whether or not unexpected problems have occurred with the temperature of the upper surface 1131, the temperature of the lower surface 1132, or the temperature difference between these.

[0030] Returning to FIG. 1, the camera 110 photographs the interface 118 through the holder 113. As described above, since the holder 113 has light transmissibility (translucency), the camera 110 can photograph the interface 118 through the holder 113. The camera 110 is installed above the holder 113, for example, diagonally above the holder 113. The camera 110 is, for example, a digital camera, an optical camera, or the like. In addition, instead of the camera 110, the state of the interface 118 may be grasped using electromagnetic waves such as X-rays.

[0031] FIG. 5 is a schematic diagram showing a state of photographing the interface 118 using the camera 110. In the example of FIG. 5, the camera 110 photographs a photographing area 115 which is a part of the interface 118. When the plated portion 105 is formed on the surface of the member to be processed 107 by the plating process, the outer surface of the newly formed plated portion 105 functions as the surface of the member to be processed 107. The camera 110 may photograph all of the interface 118. Also, one camera 110 may be used, or a plurality of cameras 110 may be used.

[0032] As described above, bubbles 114 such as hydrogen may be generated at the interface 118 due to the progress of the plating process. Therefore, by using the camera 110, the bubbles 114 present at the interface 118 can be confirmed. Since the generation of the bubbles 114 is one of the factors of plating defects, it is preferable that the number of the bubbles 114 is small.

[0033] Regarding the camera 110, when the holding member 113 is light-impermeable, that is, when the interface 118 cannot be photographed through the holding member 113, similar to the camera 109 which is a thermal camera, the interface 118 can be photographed from the side of the holding member 113. In this case, only the presence of the bubbles 114 in the interface 118 extending from one direction to the other direction in the image can be confirmed, and the presence of the bubbles 114 in the depth direction as viewed from the camera 110 cannot be confirmed. Therefore, based on the number of the bubbles 114 in the image photographed by the camera 110, for example, by estimating the number of the bubbles 114 in the depth direction, the number of the bubbles 114 at the interface 118 can be estimated.

[0034] Returning to FIG. 1, the input unit 201 is for inputting information regarding the interface 118 photographed by, for example, the camera 110. The information here is information regarding the interface 118 during the plating process. For example, during the plating process, when the camera 110 photographs the interface 118 constantly or every predetermined time, the image obtained by the photographing is input to the input unit 201 as information regarding the interface 118. The information input to the input unit 201 is appropriately stored in a storage unit (not shown) provided in the determination device 200.

[0035] In the present embodiment using the light-transmissive holding member 113, information on the interface 118 photographed through the holding member 113 is input to the input unit 201 using the camera 110. By inputting such information, the quality of the plating portion 105 can be determined based on the phenomenon occurring at the interface 118 (for example, the generation of bubbles 114).

[0036] The information to be input is preferably image information regarding the image of the interface 118 photographed using the camera 110. The image information may be the image of the interface 118 photographed using the camera 110 itself, or information obtained from the image rather than the image itself (for example, digitized information. For example, the number of bubbles 114, etc.).

[0037] Furthermore, the above temperature distribution information is input to the input unit 201. The temperature distribution information here is information determined based on, for example, an image photographed by the camera 109, and is information regarding the temperature distribution on the surface of the holding member 113 between the electrode 111 and the member to be processed 107 (the side surface of the holding member 113). By inputting such temperature distribution information, as will be described in detail later, the determination unit 202 can determine the quality of the plating portion 105 based on the temperature distribution information.

[0038] The temperature distribution information may be, for example, the image itself showing the temperature distribution photographed by the camera 109, or information obtained from the image rather than the image itself (for example, digitized information. For example, the temperature difference between the upper surface 1131 and the lower surface 1132 of the holding member 113, etc.).

[0039] The determination unit 202 determines the quality of the plating portion 105 formed at the interface 118 during the plating process based on the information (for example, image information, temperature distribution information, etc.) input to the input unit 201. By providing the determination unit 202, the state of the plating portion 105 during the plating process can be determined.

[0040] The determination unit 202 calculates quantifiable information from the information input to the input unit 201, and determines the quality of the plating portion 105 based on the calculated numerical value. By doing so, since the determination can be made based on an objective index of a numerical value, the variation in the determination can be reduced. The quantifiable information referred to here is not limited to these, but for example, at least one of the number of bubbles 114, the temperature difference between the upper surface 1131 and the lower surface 1132 of the holder 113, the diameter (size) of the bubbles 114, the total area of the sizes of the bubbles 114 at the interface 118, the temperature gradient of the holder 113, etc.

[0041] The determination unit 202 determines the quality of the plating portion 105 by comparing the calculated numerical value with a predetermined threshold value. By doing so, since the determination can be made based on an objective index of a numerical value, the variation in the determination can be reduced. The predetermined threshold value can be appropriately determined according to, for example, a value set by a user such as the member to be processed 107, the determination system 100, the determination device 200, etc., or the purpose of use or application of the member to be processed 107.

[0042] FIG. 6 is a diagram for explaining a method for determining the plating portion 105 based on the number of bubbles 104. The horizontal axis represents the time (elapsed time from the start of the plating process) starting from 0 at the start of the plating process, and the vertical axis represents the number of bubbles 114 generated at the interface 118 per unit time. The graph shown in FIG. 6 can be created by the determination unit 202 based on, for example, a photographed image of the interface 118 using the camera 110. Specifically, the determination unit 202 calculates, for example, the generation number (generation frequency) of the bubbles 114 per unit time at predetermined times by image analysis from an image of the interface 118 during the plating process. Then, the graph shown in FIG. 6 can be created by plotting the calculated generation number on the two-axis coordinates of the vertical axis and the horizontal axis shown in FIG. 6.

[0043] FIG. 7 is a diagram for explaining a method of determining the plating portion 105 based on the temperature difference between the upper surface 1131 and the lower surface 1132 of the holder 113. The horizontal axis represents the time when plating treatment starts (elapsed time from the start of the treatment), and the vertical axis represents the temperature difference between the temperature of the upper surface 1131 and the temperature of the lower surface 1132 of the holder 113. The graph shown in FIG. 7 can be created by the determination unit 202 based on, for example, a captured image of the side surface 119 using the camera 109. Specifically, the determination unit 202 determines the temperature of the upper surface 1131 at each predetermined time and the temperature of the lower surface 1132 at each predetermined time from the captured image of the side surface 119. Then, based on the determined temperatures of both, the temperature difference is calculated, and the calculated temperature difference is plotted on the two-axis coordinates of the vertical axis and the horizontal axis shown in FIG. 7 at each predetermined time, thereby creating the graph shown in FIG. 7.

[0044] However, the upper surface 1131 and the lower surface 1132 extend with a length from one direction to the other direction in the image in the camera 109. And at all parts of each of the upper surface 1131 and the lower surface 1132, they do not necessarily have the same temperature. Therefore, for example, the temperature of an arbitrary part on the upper surface 1131 or the average value of the temperatures of an arbitrary number of places (for example, 2 to 10 places) can be adopted as the temperature of the upper surface 1131. The same applies to the temperature of the lower surface 1132, and the temperature of an arbitrary part on the lower surface 1132 or the average value of the temperatures of an arbitrary number of places (for example, 2 to 10 places) can be adopted as the temperature of the lower surface 1132.

[0045] As shown in FIGS. 6 and 7, as time elapses, the number of generated bubbles 114 increases and the temperature difference also increases. That is, it is considered that as the number of generated bubbles 114 increases, the resistance at the interface 118 increases, and the temperature at the lower surface 1132 (interface 118) of the holder 113 becomes higher. Therefore, it is considered that there is a certain degree of correlation between the number of bubbles 114 and the temperature difference. However, since it is considered that the temperature difference expands due to the generation of the bubbles 114, it can be said that it is preferable to grasp at least the number of generated bubbles 114 (behavior).

[0046] For example, regarding the number of bubbles 114, if the threshold value of the number of bubbles 114 is set to 5, for example, the determination unit 202 determines that the quality of the plating portion 105 formed until the time t1 when the number of bubbles 114 reaches 5 is good, and the quality of the plating portion 105 formed after the time t1 is poor. Similarly, for example, regarding the temperature difference, if the threshold value of the temperature difference is set to 20°C, for example, the determination unit 202 determines that the quality of the plating portion 105 formed until the time t2 when the temperature difference reaches 20°C is good, and the quality of the plating portion 105 formed after the time t2 is poor.

[0047] Note that the time t1 and the time t2 may be the same or different. When the time t1 and the time t2 are different, the earlier time from the start of plating can be adopted. For example, when t1 < t2, based on FIGS. 6 and 7, for example, it can be determined that the plating portion 105 formed after the time t1 is defective. In this case, it is also determined that the plating portion 105 formed after the time t2 includes defects.

[0048] FIG. 8 is a diagram for explaining the content of the quality database (quality DB206). In FIG. 8, the case where a gel is used as the holding body 113 is illustrated. In FIG. 8, X1 to X7 (X is any one of the alphabets A to R (excluding O)) are numerical values. The quality DB206 is created in advance based on, for example, experiments, simulations, literature values, etc. The quality DB206 is a database that associates the conditions of the plating process, the monitoring results when the plating process is performed under the conditions, the quality results of the plating portion 105 when the plating process is performed under the conditions, and the productivity of the plating process under the conditions. Note that the specific content of the database is not limited to the example shown in FIG. 8.

[0049] For example, as the conditions of the plating process, the current A1 (mA / cm 2), voltage B1 (V), time C1 (min), type of plating solution is a Watts bath, material of processed member 107 is stainless steel, composition of gel which is support 113 is gelatin, temperature of processed member 117 during plating is D1 (°C), material of electrode 111 is pure nickel, distance between electrode 111 and processed member 107 (thickness of support 113) is E1 (mm). During plating under these conditions, monitoring results show that the number of bubbles 114 is F1 (bubbles / cm2 of area of interface 118). 2 per unit area), maximum diameter H1 of the bubble 114 (mm), total area of the bubble 114 (mm 2 / Area of interface 118 cm 2 The temperature gradient of the gel is J1 (°C / mm thickness of the holder 113). The quality result of the plated portion 105 obtained after the plating process is the number of voids K1 (number / cm area of the plated portion 105). 2 per unit area), maximum diameter of void L1 (mm), total area of void (mm 2 / 105cm2 of plated area 2 per mm), hardness N1 (Hv) of the plated portion 105, adhesion of the plated portion 105 (N / area of the plated portion 105 1 mm 2 As an example of productivity during plating, the plating speed is R1 (μm / min).

[0050] Returning to FIG. 1, the determination unit 202 uses the quality DB 206 (an example of a database) to determine a threshold value corresponding to the quality desired by the user. For example, if the plated portion 105 has a design, it is preferable that the number of voids and the void area present in the plated portion 105 are as small as possible. Therefore, in this case, it is preferable that the threshold value for forming voids is set small. Therefore, the determination unit 202 refers to the quality DB 206 and determines the threshold value so as to include quality results in which the number of voids and the void area are relatively small. For example, in the example of the present disclosure, the threshold value is determined so that only the number and temperature of the smallest bubbles 114 are included among the numbers and temperatures of the bubbles 114 stored in the quality DB 206. This makes it possible to form a plated portion 105 having the desired quality.

[0051] In the example of the present disclosure, the quality database 206 does not include a threshold value, and the threshold value is indirectly determined from the stored information in the quality database 206. However, the threshold value itself may be stored in the quality database. Further, the threshold value does not necessarily have to be determined by the determination unit 202 using the quality database 206. For example, the user may arbitrarily input the threshold value to the input device 300.

[0052] The detection unit 203 detects a sign of defect in the plating portion 105 based on the determination result by the determination unit 202. By providing the detection unit 203, it is possible to detect a sign of defect before a defect actually occurs in the plating portion 105, and the workability of the plating process can be improved. It can also contribute to a reduction in rework of each process executed in the plating process, a reduction in waste costs due to defects, and the like.

[0053] In the determination by the determination unit 202, for example, the number of bubbles 114 and the temperature difference are calculated. Since the calculated number and temperature difference can be plotted as in the graphs shown in FIGS. 6 and 7 above, the determination unit 202 determines a case where the number and temperature difference are likely to exceed a threshold value (for example, 5 and 20°C). If the threshold value is exceeded, it is considered that a plating defect occurs. The determination unit 202 plots each time the number and temperature difference are calculated and determines the time when the threshold value is likely to be exceeded. Thereby, the detection unit 203 can detect a sign of defect in the plating portion 105. Note that when a sign is detected, the determination unit 202 may issue an alarm via, for example, the output device 400.

[0054] Note that the determination unit 202 can determine that there is a sign of defect in the plating portion 105 when, for example, the number of bubbles 114 and the temperature difference exceed a value obtained by multiplying a predetermined ratio (for example, 80% or the like) by a predetermined threshold value.

[0055] When the detection unit 203 detects a sign of a defect in the plating portion 105, the proposal unit 204 proposes a method for executing the plating process that can avoid the defect in the plating portion 105. By doing so, the defect in the plating portion 105 can be avoided by performing the plating process according to the newly proposed execution method, and the workability of the plating process can be improved. For example, the proposal unit 204 can propose the execution method to the user by outputting the execution method newly determined by the proposal unit 204 to the output device 400 (described later).

[0056] The method for executing the plating process referred to here includes, for example, the installation method (installation form, installation conditions) of the holding body 113 executed by the user, in addition to the conditions of the plating process shown in FIG. 8 above.

[0057] The proposal unit 204 proposes an execution method using the quality DB 206 (an example of a database). The quality DB 206 is also an association of the information (the number of bubbles 114 and the temperature difference) used when the detection unit 203 detects a sign with the execution method (for example, the conditions of the plating process). Although the temperature gradient is illustrated in the quality DB 206 shown in FIG. 8 above instead of the temperature difference, the temperature difference may be illustrated together with the temperature gradient or instead of the temperature gradient. In the process of the proposal unit 204 proposing in this way, it is possible to propose plating conditions that can avoid the plating conditions that cause plating defects.

[0058] In the quality DB206, as described above, the monitoring results, quality results, and productivity are associated with each plating process condition. Therefore, when a sign is detected based on the monitoring results, the proposal unit 204 determines a plating condition that is less likely to cause plating defects than the plating condition at the time of the sign. Specifically, the proposal unit 204 proposes a current value obtained by reducing the current as the plating condition at the time of detecting the sign by a predetermined ratio. However, the productivity also decreases due to the decrease in the current value or the like. For this reason, the proposal unit 204 reads out the plating process conditions from the quality DB206 that can obtain the desired quality results without significantly reducing the productivity, and, for example, reduces the current value so as to satisfy the read plating process conditions. By making a proposal while considering the balance between the productivity and quality of the plating portion 105 in this way, it is possible to propose plating conditions that can avoid plating defects without significantly reducing the productivity.

[0059] In addition, the method of executing the plating process includes, for example, in addition to the plating process conditions (current value, current density, time control of current on / off, etc.), proposals such as the degree of adhesion (distance securing) between the holding body 113 and the member to be processed 117.

[0060] When the determination unit 202 determines a defect in the plating portion 105, the output unit 208 outputs to the output device 400 the factors considered as the factors causing the defect. Thereby, for example, the user can change the method of executing the subsequent plating process according to the output factors. By doing so, it is possible for the user to make it difficult to cause plating defects.

[0061] FIG. 9 is a diagram for explaining the content of the defect DB207 (an example of a database). The defect DB207 is a database that associates the defect mode regarding the specific example of the defective state obtained by plating repair, the cause of the defect obtained by plating repair, and the countermeasure for eliminating the cause. The defect DB207 is created in advance based on, for example, experiments, simulations, information described in documents, and the like. Note that the specific content of the database is not limited to the example shown in FIG. 9.

[0062] For example, when surface voids occur in the plating portion 105 as a defective mode, possible causes include, for example, the generation of bubbles 114 such as hydrogen. Therefore, in order to eliminate this cause, for example, separating the holding body 113 such as a gel from the member to be processed 107, adjusting the waveform of the current, lowering the current value, reviewing the material of the electrode 111, reviewing the pretreatment conditions (such as cleaning) for the member to be processed 107, etc. are considered. Also, when adhesion failure (peeling, cracking, etc. of the plating portion 105) occurs as a defective mode, possible causes include the generation of bubbles 114, dirt on the surface of the member to be processed 107, etc. Therefore, as a countermeasure against the generation of bubbles 114, it can be countered in the same way as when the defective mode is the occurrence of surface voids. Also, when the cause is surface dirt, for example, reviewing the pretreatment conditions (such as cleaning) for the member to be processed 107, adding a chemical to the gel or the like, or changing to a new holding body 113, etc. can be mentioned.

[0063] Furthermore, when the film thickness of the plating portion 105 is insufficient as a defective mode, possible causes include, for example, the generation of bubbles 114, low temperature during the plating process, component variations in the plating solution, etc. Therefore, in order to eliminate these causes, for example, as a countermeasure against the generation of bubbles 114, it can be countered in the same way as when the defective mode is the occurrence of surface voids. As a countermeasure for the case of low temperature during the plating process, for example, checking the temperature of the member to be processed 107 can be mentioned. As a countermeasure for component variations in the plating solution, checking the components of the plating solution can be mentioned.

[0064] Returning to FIG. 1, the determination unit 202 determines, for example, a defect mode of the plating portion 105 based on the information obtained from the input unit 201, such as the formation of voids on the surface of the plating portion 105, poor adhesion of the plating portion 105, insufficient film thickness of the plating portion 105, etc. For example, voids are generated corresponding to the position and shape of the bubbles 114. Therefore, by detecting the bubbles 114, the presence or absence of voids can be determined from the number of bubbles 114 or the like. When the determination unit 202 determines a defect in the plating portion, the determination unit 205 determines a factor considered as a factor causing the defect (defect mode shown in FIG. 9) or a countermeasure capable of eliminating the factor. Thereby, a plating process capable of eliminating the defect mode can be executed using the determined factor or countermeasure. Therefore, the construction efficiency of the plating process can be improved.

[0065] The determination unit 202 determines a factor and a countermeasure using a defect DB 207 (an example of a database) that associates the content of the defect (defect mode) with the factor and the countermeasure. By doing so, based on the content of the actual defect, the factor and possible countermeasures can be determined. The defect DB 207 does not necessarily need to include both the factor and the countermeasure, and only one of them may be sufficient. Also, the determined items do not necessarily need to include both the factor and the countermeasure, and only one of them may be sufficient. Therefore, the determination unit 202 can determine at least one of the factor or the countermeasure using the defect DB 207 associated with at least one of the factor or the countermeasure.

[0066] The output unit 208 outputs each piece of information determined in the determination system 100 and the determination device 200 to the output device 400. The output device 400 is, for example, a display device 401 such as a display, a monitor, a speaker, etc., but may also be, for example, the processing device 112. When the output device 400 is the processing device 112, the processing device 112 can perform a plating process, for example, based on the plating process conditions input to the processing device 112 when a sign is determined.

[0067] FIG. 10 is a schematic diagram showing a table 402 of quality determination results output from the output unit 208 and displayed on the display device 401. The table 402 includes the results of quality determination, the reasons for the determination, and countermeasures. When the determination unit 202 determines a defect in the plating portion 105, the determination unit 202 causes the display device 401 to display the table 402 via the output unit 208. In the example of FIG. 10, the determination unit 202 indicates in the table 402 that the result of the quality determination is determined to be NG, the reason for the determination is that "the number of bubbles exceeded the threshold", and the countermeasure is to "review the pretreatment conditions".

[0068] FIG. 11 is a schematic diagram showing a table 403 of defect omens output from the output unit 208 and displayed on the display device 401. The table 403 includes the results of defect omens, the causes thereof, and countermeasures. When the detection unit 203 detects an omen of a defect in the plating portion 105, the detection unit 203 causes the display device 401 to display the table 403 via the output unit 208. In the example of FIG. 11, the detection unit 203 indicates in the table 403 that the defect omen (defect will occur as it is) is determined to be NG, the possible cause is "generation of hydrogen gas", and the possible countermeasure is to "reduce the current value".

[0069] FIG. 12 is a schematic diagram showing a table 404 of execution methods output from the output unit 208 and displayed on the display device 401. The table 404 includes the execution method of the plating process. For example, when the proposal unit 204 proposes an execution method of the plating process, the proposal unit 204 causes the display device 401 to display the table 404 via the output unit 208. In the example of FIG. 12, the proposal unit 204 indicates in the table 404 that the current is A11 (mA / cm 2 ), the voltage is B11 (V), the time is C11 (min), the type of the plating solution is a Wood's bath, the material of the member 107 to be processed is stainless steel, the composition of the gel of the holding body 113 is agar, the temperature of the member 107 to be processed during the plating process is D11 (°C), the material of the electrode 111 is a nickel alloy, and the distance between the electrode 111 and the member 107 to be processed (the thickness of the holding body 113) is E11 (mm).

[0070] FIG. 13 is a block diagram showing the hardware configuration of the determination system 100 and the determination device 200 of the present disclosure. The determination system 100 and the determination device 200 are configured to include, for example, a CPU (Central Processing Unit) 1001, a RAM (Random Access Memory) 1002, a ROM (Read Only Memory) 1003, an I / F (Inter Face) 1004, a bus 1005, and the like. The CPU 1001, the RAM 1002, the ROM 1003, and the I / F 1004 are connected via, for example, a bus 1005. The determination system 100 and the determination device 200 are realized by a predetermined determination program (for example, the determination method of the present disclosure) stored in the ROM 1003 being expanded in the RAM 1002 and executed by the CPU 1001. The exchange of signals and information between the determination system 100 and the determination device 200 and various devices (such as servers) and the external network 500 and the like is performed hardware-wise through the I / F 1004.

[0071] FIG. 14 is a flowchart showing the determination method of the present disclosure. The determination method of the present disclosure can be executed by the above-described determination system 100 and determination device 200. Therefore, the description of FIG. 14 will be made with appropriate reference to FIG. 1, and the matters described with respect to the determination system 100 and the determination device 200 can be similarly applied to the determination method of the present disclosure described below.

[0072] The determination method of the present disclosure is a method for determining the quality (state) of the plating portion 105 during the plating process on the workpiece 107. The determination method of the present disclosure includes steps S1 to S5. Step S1 is an input step in which information regarding the interface 118 between the holder 113 and the workpiece 107 during the plating process is input to the input unit 201. As described above, the plating process is performed by bringing the holder 113 holding the plating solution into contact with the workpiece 107. The information to be input is, for example, the temperature distribution on the side surface of the holder 113, the image of the interface 118 (including information regarding the bubbles 114 such as the position and size of the bubbles 114), and the like, as described above.

[0073] Step S2 is a determination step of determining the quality of the plating portion 105 formed on the interface 118 during the above plating process based on the information input in Step S1. Step S2 is executed by the determination unit 202. In Step S2, for example, the determination is executed by comparing the number of bubbles 114 and the temperature difference between the upper surface 1131 and the lower surface 1132 of the holder 113 with a predetermined threshold value (for example, the above 5 pieces, 20 °C).

[0074] As a result of the determination in Step S2, if the quality of the plating portion 105 is "good", the plating conditions are maintained and the plating process is continued (Step S3). Then, the film thickness of the plating portion 105 is confirmed using, for example, the camera 109 (Step S4). If it is the desired film thickness (Yes), the plating process ends. If it is less than the desired film thickness, the steps after Step S2 are performed again.

[0075] On the other hand, if the quality of the plating portion 105 is "bad", the plating conditions are adjusted (Step S5). The adjustment can use, for example, the plating conditions capable of avoiding plating defects proposed using the above quality DB206, in the same manner as when determining a defect in the plating portion (plating defect). By using the plating conditions capable of avoiding plating defects, plating defects can be avoided in the plating process performed after the plating portion 105 determined to be defective.

[0076] The proposed method of executing the plating process is output to the output device 400 (for example, a display device, the processing device 112, etc.) by the output unit 208, for example. The adjustment may be executed by the user using the plating conditions proposed by the proposal unit 204, or may be performed by the processing device 112 itself. After adjusting the plating conditions, the above Step S4 is performed. Also, when changing the plating conditions, it may be displayed via the output device 400 as shown in FIG. 15, and after receiving the presence or absence of condition change from the user, the processing device 112 itself may adjust the plating conditions.

[0077] 100 Determination system 105 Plating portion 107 Member to be processed 108 Worn portion 109 Camera 110 Camera 111 Electrode 112 Processing device 113 Holder 1131 Upper surface 1132 Lower surface 114 Bubble 115 Photographing area 117 Member to be processed 118 Interface 119 Side surface 200 Judgment device 201 Input section 202 Judgment section 203 Detection section 204 Proposal section 205 Decision section 206 Quality DB (Database) 207 Defect DB (Database) 208 Output section 300 Input device 400 Output device 401 Display device 500 Network

Claims

1. An input unit into which information regarding the interface between the holding member and the member to be processed is input during the plating process, the plating process being performed by bringing a holding member holding a plating solution into contact with the member to be processed; And a determination unit that determines the quality of the plated portion formed at the interface during the plating process based on the information. A determination system characterized by the above.

2. The determination system according to claim 1, wherein the determination system includes a detection unit that detects a sign of a defect in the plated portion based on the determination result by the determination unit. A determination system characterized by the above.

3. The determination system according to claim 2, wherein the determination system includes a proposal unit that proposes a method of performing a plating process capable of avoiding the defect when the detection unit detects a sign of a defect in the plated portion. A determination system characterized by the above.

4. The determination system according to claim 3, wherein the proposal unit proposes the method of execution using a database that associates the information used when the detection unit detects a sign with the method of execution. A determination system characterized by the above.

5. The determination system according to claim 1, wherein the input unit further receives input of temperature distribution information on the surface between the electrode that contacts the holding member on a surface of the holding member opposite to the contact portion with the member to be processed and the member to be processed. A determination system characterized by the above.

6. The determination system according to claim 1, wherein the determination system includes a decision unit that determines a factor that is considered as a factor causing the defect or a countermeasure capable of eliminating the factor when the determination unit determines a defect in the plated portion. A determination system characterized by the above.

7. The determination system according to claim 6, wherein the determination unit determines at least one of the factor or the countermeasure using a database that associates the content of the defect with at least one of the factor or the countermeasure. A determination system characterized by the above.

8. The determination system according to claim 1, wherein the determination unit calculates information that can be quantified from the information input to the input unit and determines the quality of the plated portion based on the calculated numerical value. A determination system characterized by the above.

9. The determination system according to claim 8, wherein the determination unit determines the quality of the plated portion by comparing the calculated numerical value with a predetermined threshold value. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ A determination system characterized by the above.

10. The determination system according to claim 9, wherein the determination unit determines the threshold value corresponding to the quality desired by the user using a database. A determination system characterized by the above.

11. The determination system according to claim 1, wherein the holding body is a light-transmissive gel containing the plating solution. A determination system characterized by the above.

12. The determination system according to claim 11, wherein information on the interface photographed through the holding body arranged along the surface of the member to be processed is input to the input unit. A determination system characterized by the above.

13. The determination system according to claim 1, wherein the holding body is a porous body having pores holding the plating solution. A determination system characterized by the above.

14. An input unit into which information on the interface between the holding body and the member to be processed during plating treatment performed by bringing the holding body holding the plating solution into contact with the member to be processed is input, and a determination unit that determines the quality of the plated portion formed at the interface during the plating treatment based on the information. A determination device characterized by the above.

15. An input step in which information on the interface between the holding body and the member to be processed during plating treatment performed by bringing the holding body holding the plating solution into contact with the member to be processed is input to the input unit, and a determination step of determining the quality of the plated portion formed at the interface during the plating treatment based on the information. A determination method characterized by the above.

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