Light-emitting module

Abstract

To provide a light-emitting module that restrains scattering of light emitted from a light source and is excellent in reliability, and a method for manufacturing the light-emitting module.SOLUTION: A light-emitting module 100 includes a plurality of light-emitting elements 1, a first substrate 10 having an element mounting area 13 on which the light-emitting elements are mounted, and a plurality of first terminals 110 arranged along the element mounting area outside the element mounting area, a second substrate 20 that has a substrate mounting area 23 on which the first substrate is mounted, and a plurality of second terminals 120 arranged along the substrate mounting area outside the substrate mounting area, a plurality of wires 130 that are connected to the first and second terminals and arranged along the outer edge of the first substrate, a light-shielding covering member 40 covering the plurality of wires outside the element mounting area, and a light-transmitting first convex portion 41 that is arranged along the element mounting area between the element mounting area and the first terminals and is in contact with the covering member.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a light-emitting module.

Background Art

[0002] Conventionally, a light-emitting module that uses a plurality of light-emitting elements as a light source for in-vehicle use or a projector has been used. When using a light-emitting module as a light source, for example, a configuration is adopted in which light is irradiated to the outside from the light source through a lens. As such a light-emitting module, a configuration is known in which a plurality of light-emitting elements are arranged on a submount, the submount is further mounted on a wiring board, and the submount and the wiring board are connected by wires (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An embodiment according to the present disclosure aims to provide a light-emitting module that suppresses scattering of light emitted from a light source and has excellent reliability.

Means for Solving the Problems

[0005] The light-emitting module according to an embodiment of the present disclosure includes a plurality of light-emitting elements, an element mounting region on an upper surface for mounting the plurality of light-emitting elements, and further, on the upper surface outside the element mounting region, a first substrate having a plurality of first terminals arranged along the element mounting region, a second substrate having a substrate mounting region on an upper surface for mounting the first substrate, and further, on the upper surface outside the substrate mounting region, a second substrate having a plurality of second terminals arranged along the substrate mounting region, a plurality of wires connected to the first terminals and the second terminals and arranged along an outer edge of the first substrate, a light-shielding covering member covering the plurality of wires outside the element mounting region, and a light-transmitting first convex portion arranged along the element mounting region and in contact with the covering member between the element mounting region and the first terminals.

[0006] The manufacturing method of the light-emitting module according to an embodiment of the present disclosure includes an element mounting step of mounting a plurality of light-emitting elements on an element mounting region of a first substrate, a substrate mounting step of mounting the first substrate on a substrate mounting region of a second substrate, a wire connection step of connecting a plurality of first terminals arranged outside the element mounting region of the first substrate and a plurality of second terminals arranged outside the substrate mounting region of the second substrate with wires, a first convex portion arranging step of arranging a light-transmitting first convex portion along the element mounting region between the element mounting region and the first terminals, and a covering member arranging step of arranging a light-shielding covering member in contact with the first convex portion and covering the wires outside the first convex portion.

Advantages of the Invention

[0007] According to the embodiment of the present disclosure, it is possible to provide a light-emitting module that suppresses scattered light and has excellent reliability, and a manufacturing method thereof.

Brief Description of the Drawings

[0008]

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Mode for Carrying Out the Invention

[0009] Hereinafter, the light-emitting module according to the embodiment will be described with reference to the drawings. Note that the sizes and positional relationships of the members shown in each drawing may be exaggerated for clarity of explanation. Also, the dimensions and arrangement positions of the members may not exactly match between the plan view and the corresponding cross-sectional view. To avoid excessive complexity of the drawings, the illustration of some elements may be omitted, or an end view showing only the cut surface as a cross-sectional view may be used. Further, in the following description, up, down, left, right, front, and rear are relative and do not indicate absolute directions. And for the same names and reference numerals, in principle, the same or homogeneous members are indicated, and detailed descriptions may be omitted as appropriate. Also, in the embodiment, "covering" and "cover" include not only the case of direct contact but also the case of covering indirectly, for example, via other members. In this specification, a plan view means observing from the light extraction surface side of the light-emitting module.

[0010] <First Embodiment> [Configuration of Light-Emitting Module] The configuration of the light-emitting module according to the embodiment will be described with reference to FIGS. 1 to 7. FIG. 1 is a perspective view schematically showing the entire light-emitting module according to the embodiment. FIG. 2 is a plan view schematically showing the entire light-emitting module according to the embodiment. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 2. FIG. 5 is a cross-sectional view taken along line V-V in FIG. 2. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 2. FIG. 7 is a plan view schematically showing the first convex portion, the second convex portion, and the wire in the light-emitting module according to the embodiment.

[0011] The light-emitting module 100 includes a plurality of light-emitting elements 1, an element mounting region 13 on the upper surface for mounting the plurality of light-emitting elements 1, and further includes a first substrate 10 having a plurality of first terminals 110 arranged along the element mounting region 13 on the upper surface outside the element mounting region 13, a second substrate 20 having a substrate mounting region 23 on the upper surface for mounting the first substrate 10, and further includes a plurality of second terminals 120 arranged along the substrate mounting region 23 on the upper surface outside the substrate mounting region 23, a plurality of wires 130 connected to the first terminals 110 and the second terminals 120 and arranged along the outer edge of the first substrate, a light-shielding coating member 40 covering the plurality of wires 130 outside the element mounting region 13, and a light-transmitting first convex portion arranged along the element mounting region 13 and in contact with the coating member 40 between the element mounting region 13 and the first terminals 110. The coating member 40 is arranged across the upper surface of the first substrate 10 and the upper surface of the second substrate 20. The first convex portion 41 is arranged in a frame shape on the first substrate 10 so as to surround, for example, the plurality of light-emitting elements 1.

[0012] Note that the light-emitting module 100 can include a reflective member 7 that exposes the upper surfaces of the plurality of light-emitting elements 1 and covers the side surfaces in the element mounting region 13 on the first substrate 10. Further, the light-emitting module can include a wavelength conversion member 5 that covers the upper surfaces of the plurality of light-emitting elements 1.

[0013] The light-emitting module 100 mainly includes a plurality of light-emitting elements 1, a first substrate 10 on which the plurality of light-emitting elements 1 are mounted, a second substrate 20 on which the first substrate 10 is mounted, a first wire 31 and a second wire 32 which are the first wire 130 that electrically connects the first substrate 10 and the second substrate 20, a covering member 40 that covers the wire 130, a first convex portion 41 disposed on the first substrate 10 and in contact with the covering member 40, a second convex portion 42 disposed on the second substrate and in contact with the covering member 40, a reflective member 7 that covers the side surface of the light-emitting element 1 on the first substrate 10, and a wavelength conversion member 5 that covers the upper surface of the light-emitting element 1. Hereinafter, each component will be described.

[0014] (First Substrate) The first substrate 10 includes a flat support member and wirings disposed on the upper surface of the support member. The first substrate 10 has an element mounting region 13 on the upper surface for mounting a plurality of light-emitting elements, and wirings are arranged in the element mounting region 13 so as to form a predetermined electric circuit. The first substrate has a plurality of first terminals 110 as wirings disposed on the upper surface outside the element mounting region, and the first terminals 110 are electrically connected to the wirings disposed in the element mounting region. The first substrate 10 is a semiconductor substrate such as silicon, for example, and the region where no wiring is disposed on the upper surface is covered with an insulating film. The wirings may also be disposed inside or on the lower surface of the support member. For example, the first substrate 10 can use an integrated circuit (IC) substrate on which a circuit for driving and controlling a plurality of light-emitting elements is integrated. A plurality of light-emitting elements 1 are mounted in a matrix in the element mounting region 13. The element mounting region 13 in plan view can be, for example, a rectangular region. Here, the element mounting region 13 is rectangular, and the first terminals 110 are arranged in rows along the opposing long sides of the rectangle so as to sandwich the element mounting region 13.

[0015] The first terminal 110 includes a plurality of first external connection terminals 11 arranged in a row along one long side of the rectangular element mounting area 13 outside the element mounting area 13, and a plurality of second external connection terminals 12 arranged in a row along the other long side opposite to the one long side. The first external connection terminal 11 is a terminal to which one end of the first wire 31 is connected. The second external connection terminal 12 is a terminal to which one end of the second wire 32 is connected. Here, as an example, each of the plurality of first external connection terminals 11 and the plurality of second external connection terminals 12 is substantially rectangular, and they are arranged in rows along the long side of the element mounting area 13 while being separated from each other. Note that, as an example, the first external connection terminals 11 are arranged at equal intervals. The intervals at which the first external connection terminals 11 are aligned and the intervals at which the second external connection terminals 12 are aligned can be 20 μm or more and 100 μm or less. The intervals at which the first external connection terminals 11 are aligned with each other and the intervals at which the second external connection terminals 12 are aligned with each other may be the same or different.

[0016] Here, as an example, the first substrate 10 includes a plurality of first drive terminals 15 that handle drive signals for turning on or off the light-emitting element 1. The first drive terminals 15 can be arranged alternately with the first external connection terminals 11 in the same row, for example. A third wire 33 described later is connected to the first drive terminals 15. In addition, the plurality of light-emitting elements 1 are mounted in a matrix on the first substrate 10 and are electrically connected to any one of the first terminals (that is, the first external connection terminals 11 and the second external connection terminals 12). The plurality of light-emitting elements 1 may be connected in series or in parallel to the first terminals as groups of a predetermined number. The wiring can be formed using, for example, a metal such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe, Ni or an alloy thereof. Such wiring can be formed by electrolytic plating, electroless plating, vapor deposition, sputtering, or the like.

[0017] (The second substrate) The second substrate 20 includes a flat base material and wirings disposed on at least the upper surface of the base material. The second substrate 20 has a substrate mounting region 23 on which the first substrate 10 is placed, and further includes a second terminal 120 on the upper surface outside the substrate mounting region 23. The substrate mounting region 23 is a region where the first substrate 10 is placed via a bonding member. This substrate mounting region 23 is set as a region having an area equivalent to the planar shape of the first substrate 10. If the first substrate 10 is rectangular in plan view, the substrate mounting region 23 can also be rectangular. Here, the second terminal 120 includes a first wire connection terminal 21 connected to the first external connection terminal 11 via a wire and a second wire connection terminal 22 connected to the second external connection terminal 12 via a wire. The first wire connection terminal 21 and the second wire connection terminal 22 are disposed on the second substrate 20 with the substrate mounting region 23 therebetween.

[0018] A plurality of the first wire connection terminals 21 are arranged in a row along one long side of the rectangular substrate mounting region 23 outside the substrate mounting region 23. The first wire connection terminal 21 is a terminal to which the other end of a first wire 31 having one end connected to the first external connection terminal 11 is connected. A plurality of the second wire connection terminals 22 are arranged in a row along the other long side of the rectangular substrate mounting region 23 (that is, the side located on the opposite side across the substrate mounting region 23 from the aforementioned one long side) outside the substrate mounting region 23. The second wire connection terminal 22 is a terminal to which the other end of a second wire 32 having one end connected to the second external connection terminal 12 is connected. Here, as an example, each of the first wire connection terminal 21 and the second wire connection terminal 22 is substantially rectangular, and they are spaced apart from each other and arranged in a single row along the substrate mounting region 23.

[0019] The intervals at which the first wire connection terminals and the second wire connection terminals 22 are aligned can be 50 μm or more and 200 μm or less. The interval at which the first wire connection terminals 21 are aligned with each other and the interval at which the second wire connection terminals 22 are aligned with each other may be the same or different. The second terminal can be formed, for example, by the same material and formation method as the wiring of the first substrate 10 already described. Here, as an example, the second substrate 20 includes a plurality of second drive terminals 16 for handling drive signals for turning on or off the light-emitting element 1 on the upper surface. The second drive terminals 16 are arranged, for example, on the upper surface inside (that is, on the substrate placement region side) of the first wire connection terminal. A third wire 33 described later is connected to the second drive terminal 16.

[0020] It is preferable to use a material with high heat dissipation for the base material, and it is more preferable that the material has high light-shielding properties and base material strength. Specifically, ceramics such as alumina, aluminum nitride, and mullite, resins such as phenolic resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), polyphthalamide (PPA), and further, composite materials composed of resin and metal or ceramics, etc. can be mentioned. As the base material, a flat plate-shaped one can be used, or a base material having a cavity on the upper surface can also be used. In this case, the second substrate 20 can place the first substrate 10 in the cavity with the bottom of the cavity as the substrate placement region. The second substrate 20 may be provided with wiring for placing the first substrate 10 on the surface of the substrate placement region 23. The first substrate 10 and the second substrate 20 can be joined via a joining material such as an Ag sintered body, solder, or adhesive resin.

[0021] (Wire) As the wire 130, a conductive wire made of a metal such as gold, copper, platinum, aluminum or an alloy containing at least these metals can be used. In particular, it is preferable to use gold which is excellent in thermal resistance and the like. The diameter of the wire is, for example, 15 μm or more and 50 μm or less. The wire 130 includes a first wire and a second wire connected to the first terminal and the second terminal, and a third wire for handling a driving signal for lighting or extinguishing the light emitting element 1. The third wire 33 is connected between a first driving terminal 15 disposed on the first substrate 10 and a second driving terminal 16 disposed on the second substrate 20. The first wire, the second wire, and the third wire 33 can be formed of equivalent members only with different lengths.

[0022] The wire 130 can be arranged, for example, so as to be substantially orthogonal to the long side across the long side of the first substrate 10 which is substantially rectangular in plan view. Among the plurality of first wires 31 arranged in a row, the first wire 31 located at the center of the row is arranged so as to be substantially orthogonal to the long side of the first substrate 10 in plan view as described above, and the first wire 31 located at the end side can be arranged obliquely with respect to the long side of the first substrate 10 in plan view. The same applies to the second wire 32. The intervals at which the plurality of first wires 31 are aligned may be the same or different. The interval at which the first wires 31 are aligned can be 20 μm or more and 100 μm or less. The intervals at which the second wires 32 are aligned may be the same or different. The interval at which the second wires 32 are aligned can be 20 μm or more and 100 μm or less.

[0023] (Light emitting element) The light-emitting element 1 has, for example, a substantially rectangular planar shape, and includes a semiconductor laminate and positive and negative electrodes disposed on the surface of the semiconductor laminate. The light-emitting element 1 has positive and negative electrodes on the same surface side, and is flip-chip mounted on the first substrate 10 with the surface provided with the electrodes as the lower surface. In this case, the upper surface facing the surface on which the electrodes are disposed becomes the main light extraction surface of the light-emitting element 1. In the light-emitting module 100, the light-emitting elements 1 are arranged and mounted on the first substrate 10 at predetermined intervals in the matrix direction. The size and number of the light-emitting elements 1 to be used can be appropriately selected according to the form of the light-emitting module to be obtained. Among them, it is preferable to mount more of the smaller light-emitting elements 1 at a higher density. Thereby, the irradiation range can be controlled with a larger number of divisions, and it can be used as a light source for a high-resolution lighting system. For example, there is an example in which 1,000 to 20,000 light-emitting elements 1 having a rectangular planar shape with a side length of 40 to 100 μm are arranged in a matrix so as to form a rectangle as a whole.

[0024] The light-emitting element 1 can select an object of any wavelength. For example, as the blue or green light-emitting element 1, those using ZnSe, nitride semiconductors (In X Al Y Ga 1-X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), or GaP can be selected. Also, as the red light-emitting element 1, semiconductors represented by GaAlAs and AlInGaP can be preferably used. Furthermore, semiconductor light-emitting elements made of materials other than these can also be used. The composition and emission color of the light-emitting element 1 to be used can be appropriately selected according to the purpose.

[0025] (Bonding member) Note that, as shown in FIG. 6, the light-emitting element 1 is joined by a conductive joining member to a wiring disposed in the element mounting region 13 of the first substrate 10. When flip-chip mounting the light-emitting element 1 on the first substrate 10, as the joining member, bumps made of a metal material such as Au, Ag, Cu, Al, etc. can be used. Also, as the joining member, solders such as AuSn-based alloys and Sn-based lead-free solders may be used. In this case, the light-emitting element 1 can be joined to the first substrate 10 by the reflow method. Also, as the joining member, a conductive adhesive containing conductive particles in a resin can be used. The joining between the light-emitting element 1 and the first substrate 10 may be formed using a plating method. Examples of the material include copper. Also, the joining between the light-emitting element 1 and the first substrate 10 may be such that the electrode of the light-emitting element 1 and the wiring of the first substrate 10 are directly joined without passing through a joining member.

[0026] (Reflective member) As shown in FIG. 6, the reflective member 7 is a member that covers the upper surface of the first substrate 10 and the side surface of the light-emitting element 1. The upper surface of the light-emitting element 1 is exposed from the reflective member 7. The reflective member 7 may cover the space between the lower surface of the light-emitting element 1 and the first substrate 10. The reflective member 7 can reflect the light emitted from the side surface of the light-emitting element 1 and cause it to be emitted from the upper surface of the wavelength conversion member 5 which is the light-emitting surface of the light-emitting module 100. Therefore, the light extraction efficiency of the light-emitting module 100 can be increased. Also, when the light-emitting element 1 is individually lit, the boundary between the light-emitting area and the non-light-emitting area can be made clear. Thereby, the contrast ratio between the light-emitting area and the non-light-emitting area is improved. Also, the reflective member 7 may be disposed at a distance from the covering member 40 (the first convex portion 41), or may be disposed in contact with the covering member 40.

[0027] Note that it is preferable to use a soft resin with relatively low elasticity and excellent shape followability for the reflective member 7. As the material of the reflective member 7, a resin material having good permeability and insulation properties, for example, a thermosetting resin such as an epoxy resin or a silicone resin can be preferably used. Further, it is preferable to use a white resin in which particles of a light-reflective substance are contained in the base resin for the reflective member 7. As the light-reflective substance, for example, titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, glass filler, etc. can be preferably used. Note that the reflective member 7 may contain a light-absorbing substance such as carbon black or graphite.

[0028] (Wavelength conversion member) The wavelength conversion member 5 covers the upper surfaces of the plurality of light-emitting elements 1. The wavelength conversion member 5 covers the upper surfaces of the plurality of light-emitting elements 1 and the upper surface of the reflective member together. The upper surface of the wavelength conversion member 5 constitutes the light-emitting surface of the light-emitting module 100. The wavelength conversion member 5 can wavelength-convert at least a part of the light emitted from the light-emitting element 1 and extract it to the outside. The wavelength conversion member 5 is substantially rectangular in plan view and is arranged so as to enclose the plurality of light-emitting elements 1.

[0029] The wavelength conversion member 5 may be arranged on the light-emitting element 1 in a sheet-like or plate-like form processed, or may be applied in a layer on the light-emitting element 1 by spraying or the like. Alternatively, it may be formed by injection molding using a mold or the like, a transfer molding method, compression molding, or the like. Examples of the wavelength conversion member include a sintered body of a phosphor and a material in which phosphor powder is contained in a base material such as resin, glass, or other inorganic substances. As the base material, a translucent material such as an epoxy resin, a silicone resin, a resin obtained by mixing these, or glass can be used. The thickness of the wavelength conversion member 5 can be, for example, about 20 μm or more and 100 μm or less. Note that the wavelength conversion member 5 is formed to a size that covers all of the upper surfaces of the plurality of light-emitting elements 1. Further, the wavelength conversion member 5 is provided so as to extend to a position where it abuts against a first convex portion 41, which will be described later, here.

[0030] As the phosphor, yttrium aluminum garnet-based phosphors (for example, Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (for example, Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (for example, Tb3(Al,Ga)5O 12 :Ce), β-sialon-based phosphors (for example, (Si,Al)3(O,N)4:Eu), α-sialon phosphors (for example, Ca(Si,Al) 12 (O,N) 16 :Eu), CASN-based phosphors (for example, CaAlSiN3:Eu) or SCASN-based phosphors (for example, (Sr,Ca)AlSiN3:Eu) and other nitride-based phosphors, KSF-based phosphors (for example, K2SiF6:Mn), KSAF-based phosphors (for example, K2(Si,Al)F6:Mn) or MGF-based phosphors (for example, 3.5MgO·0.5MgF2·GeO2:Mn) and other fluoride-based phosphors, phosphors having a perovskite structure (for example, CsPb(F,Cl,Br,I)3), or quantum dot phosphors (for example, CdSe, InP, AgInS2 or AgInSe2) can be used.

[0031] (Coating member) The coating member 40 is a light-shielding resin that covers the wires 130 (specifically, the first wire 31 and the second wire 32) outside the element mounting region 13. As an example, the coating member 40 is arranged in a frame shape in plan view so as to cover the first wire 31 and the second wire 32 and surround the element mounting region 13. The coating member 40 is arranged so as to be in contact with the first convex portion described later. The coating member 40 also covers the third wire 33. The coating member 40 is arranged at a distance from the wavelength conversion member 5.

[0032] The distance between the reflective member 7 and the coating member 40 is preferably 100 μm or more and 500 μm or less. The distance between the wavelength conversion member 5 and the coating member 40 may be the same as or different from the distance between the reflective member 7 and the coating member 40. In addition, the covering member 40 arranged in a frame shape has a wider width on the long side of the rectangular first substrate in a plan view than in the region of the short side. Further, the height of the covering member 40 (that is, the distance from the upper surface of the second substrate 20 to the upper surface of the covering member 40) is arranged to be the highest directly above the top of the wire 130 (here, the loop top of the wire). In other words, the covering member 40 is arranged such that the top 40a of the covering member 40 overlaps with the top of the wire 130. Note that the position of the top 40a of the covering member 40 is arranged to be above the top 41a of the first convex portion 41 described later.

[0033] Examples of the light-shielding covering member 40 include resins containing a light-shielding filler. As the base resin, for example, a silicone resin, a modified silicone resin, an epoxy resin, a modified epoxy resin, an acrylic resin, or the like can be used. Examples of the light-shielding filler include pigments, carbon black, light-absorbing substances such as graphite, and light-reflective substances similar to those contained in the above-described reflective member. Specifically, a white resin excellent in light reflectivity, a black resin excellent in light absorption, and a gray resin having both light reflectivity and light absorption can be mentioned. Further, the covering member 40 may have a plurality of these resin layers laminated thereon. Among them, in consideration of the deterioration of the resin due to light absorption, it is preferable that the covering member 40 uses a white resin having light reflectivity at least on the outermost surface.

[0034] (First convex portion, second convex portion) The light-emitting module has a light-transmissive first convex portion that is arranged along the element mounting region 13 and contacts the covering member 40 on the first substrate 10 between the element mounting region 13 and the first terminal 110. Further, the light-emitting module has a second convex portion that is arranged outside the second terminal 120 and contacts the covering member 40 on the upper surface of the second substrate 20. That is, the covering member 40 is arranged between the first convex portion and the second convex portion across the upper surface of the first substrate 10 to the upper surface of the second substrate 20. The covering member 40 is disposed between a first convex portion 41 disposed on the first substrate 10 so as to surround the element placement region 13 and a second convex portion 42 disposed on the second substrate 20 so as to surround the substrate placement region 23. Such an arrangement of the covering member 40 can be formed by supplying uncured resin constituting the covering member 40 into the frame surrounded by the first convex portion 41 and the second convex portion 42. In other words, the first convex portion 41 and the second convex portion 42 can be used as dams for blocking the flow of the uncured resin when the covering member 40 is supplied.

[0035] The first convex portion 41 and the second convex portion 42 can be set to a predetermined height by providing the uncured resin so as to overlap in the height direction. For example, the first convex portion 41 and the second convex portion 42 are formed to have a predetermined height by arranging the resin adjusted to a predetermined viscosity from a nozzle on the substrate in one layer and repeating the operation.

[0036] In the light-emitting module, the first convex portion 41 is disposed on the first substrate such that the top is located above the light-emitting element 1 and the wavelength conversion member 5. The height of the first convex portion 41 from the upper surface of the first substrate may be the same as or different from the height of the second convex portion from the upper surface of the second substrate. When they are different, it is preferable to make the second convex portion higher than the first convex portion. In this case, the difference between the height from the upper surface of the second substrate to the top of the first convex portion and the height from the upper surface of the second substrate to the top of the second convex portion can be made smaller than the thickness of the first substrate 10 (that is, the distance from the upper surface to the lower surface of the first substrate 10). Thereby, when the covering member 40 is disposed between the first convex portion 41 and the second convex portion 42, it is possible to suppress the uncured covering member 40 from overflowing outside the second convex portion. As the first convex portion and the second convex portion, the resin exemplified as the base material of the above-described covering member can be used. Note that it is preferable to use a resin having a higher viscosity than the resin constituting the covering member 40 for the resin constituting the first convex portion and the second convex portion. The viscosity of the resin can be adjusted, for example, by the amount of the viscosity-adjusting filler contained in the resin.

[0037] The first convex portion 41 has translucency with respect to the light emitted from the light-emitting element 1 and the wavelength conversion member 5. For the first convex portion 41, a resin material having light transmissibility and insulation properties, such as a thermosetting resin such as an epoxy resin or a silicone resin, can be preferably used. The first convex portion 41 is arranged in a rectangular frame shape surrounding the element placement area in a plan view. As an example, the covering member 40 is arranged so as to contact the top of the first convex portion 41. The first convex portion 41 is arranged in a rectangular frame shape in a plan view on the first substrate 10 along the outer periphery of the element placement area 13. In the position along the longitudinal direction of the element placement area 13, the first convex portion 41 is located between the side in the longitudinal direction of the element placement area 13 and the plurality of first terminals 110. In the position along the short side direction of the element placement area 13, it is arranged on the first substrate 10 between the element placement area 13 and the outer edge of the first substrate.

[0038] In addition, the first convex portion 41 preferably has an inclined surface that inclines from the substrate side toward the top of the first convex portion. The inclined surface is preferably a convex curved surface on the outside. Specifically, the first convex portion 41 preferably has a semi-circular or semi-elliptical cross-sectional shape. Thereby, the surface of the covering member 40 that contacts the first convex portion 41 can be a convex curved surface on the side of the covering member 40. Since the covering member 40 has such a surface shape, the light emitted from the wavelength conversion member 5, transmitted through the first convex portion, and directed toward the covering member 40 can be reflected toward the first substrate 10 side. Thereby, unintended leakage light and stray light are suppressed from going upward (the light extraction side), so that a light-emitting module with suppressed light scattering can be obtained.

[0039] The second convex portion 42 is disposed below (i.e., on the side opposite to the light extraction side) the light-emitting element 1 and the wavelength conversion member 5 in the light-emitting module. Therefore, the second convex portion 42 may or may not have light-transmitting properties with respect to the light emitted from the light-emitting element 1. In the manufacturing process, the second convex portion 42 can be used as a dam for blocking the uncured coating member 40, similar to the first convex portion 41. For this reason, it is preferably disposed in the same process as or a continuous process with the first convex portion 41, and from the viewpoint of simplifying the manufacturing method, it is preferable to use a light-transmitting resin similar to the first convex portion 41.

[0040] Even when the first substrate 10 is rectangular and the wire 130 is disposed only on the long side of the rectangle, it is preferable that the top of the coating member 40 provided on the short side of the first substrate 10 is at substantially the same height as the top of the coating member 40 provided on the long side of the first substrate 10. Since the first convex portion 41 of the light-emitting module 100 has light-transmitting properties, the light emitted from the wavelength conversion member 5 can pass through the first convex portion 41. Then, since the light-emitting module 100 can reflect the light that has passed through the first convex portion 41 toward the first substrate 10 side at the interface with the coating member 40, scattered light can be suppressed.

[0041] The light-emitting module 100 having the above configuration can be used as a light source for a vehicle headlight, for example. At this time, for example, a configuration is adopted in which light is irradiated to the outside from the light source through a lens. The light-emitting module 100 turns on the light-emitting element 1 by an external power switch. Note that the light-emitting module 100 is configured to be able to individually drive some or all of the preset light-emitting elements 1.

[0042] In the light-emitting module 100, since the covering member 40 has light-shielding properties and is disposed in contact with the first convex portion 41, the light transmitted through the first convex portion 41 can be absorbed by the covering member 40 or reflected toward the substrate side. As a result, external light scattering can be suppressed, and the light-emitting module 100 with suppressed leakage light and stray light can be obtained. Since the stray light of the light-emitting module 100 is suppressed, when used in combination with a lens, the optical design of the lens can be easily performed. Further, since the covering member 40 contains a light-reflective substance and / or a light-absorbing substance as a filler for having light-shielding properties, the amount of resin in the covering member 40 can be reduced compared to the case where a translucent resin not containing these fillers is used. Thereby, the load on the wire due to the thermal expansion of the resin can be suppressed. Since the wire is less affected by heat, the connectivity of the wire is improved, and a light-emitting module with excellent reliability can be obtained.

[0043] [Manufacturing Method of Light-Emitting Module] Next, a manufacturing method of the light-emitting module will be described with reference to FIGS. 8, 9A to 9H. FIG. 8 is a flowchart for explaining a manufacturing method of the light-emitting module according to the embodiment. FIGS. 9A to 9H are plan views schematically showing the manufacturing method of the light-emitting module according to the embodiment. Although the light-emitting elements 1 are placed at a predetermined interval, the interval is omitted in the drawings other than the enlarged plan view of FIG. 9C.

[0044] The manufacturing method of the light-emitting module includes an element placement step S11 of placing a plurality of light-emitting elements on the element placement region of the first substrate, a substrate placement step S13 of placing the first substrate on the substrate placement region of the second substrate, a wire connection step S14 of connecting a plurality of first terminals arranged outside the element placement region of the first substrate and a plurality of second terminals arranged outside the substrate placement region of the second substrate with wires, a first convex portion placement step S16 of arranging a light-transmissive first convex portion along the element placement region between the element placement region and the first terminal, and a covering member placement step S18 of arranging a light-shielding covering member that contacts the first convex portion and covers the wires outside the first convex portion. Here, a second convex portion placement step S17 of arranging a second convex portion arranged outside the second terminal on the second substrate is performed before or after the first convex portion placement step S16. Further, here, a reflective member placement step S12 is performed after the element placement step S11. Hereinafter, each step will be described.

[0045] The element placement step S11 is a step of placing a plurality of light-emitting elements 1 on the element placement region 13 of the first substrate 10. The element placement step S11 prepares a plurality of light-emitting elements arranged on a support substrate at a predetermined interval, pastes the plurality of light-emitting elements 1 on the element placement region of the first substrate, and then peels off the support substrate. It is preferable to prepare the first substrate 10 on which wirings such as the first terminals are arranged in advance before performing the element placement step S11. The first terminal 110 can be formed by pasting a metal foil such as Cu or Al, applying a paste of metal powder such as Cu or Ag, plating such as Cu, etc. Also, the wiring electrically connected to the light-emitting element 1 in the element placement region can be patterned by an etching method, a printing method, or the like. The first substrate 10 may be prepared by purchase or the like. The light-emitting element 1 can be electrically joined to the element placement region 13 on the first substrate 10 by, for example, a plating method. The light-emitting elements 1 are placed in alignment in the matrix direction at a predetermined interval in the element placement region. The light-emitting elements 1 can be prepared by undergoing part or all of the manufacturing process, such as through a process of semiconductor growth. Alternatively, it may be prepared by purchase or the like.

[0046] The reflective member arranging step S12 is a step of covering the side surfaces of the light-emitting elements 1 with a reflective member after the light-emitting elements 1 are placed on the element placement region 13 of the first substrate 10. Here, after the light-emitting elements 1 are placed on the first substrate 10, a reflective member, for example, white resin, is arranged between the light-emitting elements 1 on the side surfaces of the light-emitting elements 1. In the reflective member arranging step S12, before arranging the reflective member 7, the upper surfaces of the light-emitting elements 1 are covered with a mask, and after arranging the reflective member 7, the mask is removed, so that the upper surfaces of the light-emitting elements 1 can be exposed from the reflective member 7.

[0047] The substrate placing step S13 is a step of placing the first substrate 10 on the substrate placement region 23 of the second substrate 20. Here, the first substrate 10 on which the light-emitting elements 1 are placed is arranged on the substrate placement region 23 of the second substrate 20 and joined via a joining material such as sintered Ag. Before performing the substrate placing step S13, the second substrate 20 on which wirings such as second terminals are arranged in advance is prepared.

[0048] The wire connecting step S14 connects the first terminals 110 of the first substrate 10 and the second terminals 120 of the second substrate 20 with wires 130. Specifically, a plurality of first external connection terminals 11 of the first substrate 10 and a plurality of first wire connection terminals 21 of the second substrate 20 are connected with a plurality of first wires 31, and a plurality of second external connection terminals 12 of the first substrate 10 and a plurality of second wire connection terminals 22 of the second substrate 20 are connected with a plurality of second wires 32. The wire connecting step S14 includes a step of connecting a third wire 33 to the first drive terminal 15 of the first substrate 10 and the second drive terminal 16 of the second substrate 20. The wire is preferably first connected to the first external connection terminal 11 provided on the first substrate 10 and then connected to the first wire connection terminal 21 provided on the second substrate. By connecting the wire in such an order, the top of the wire can be arranged closer to the first external connection terminal 11. That is, since the wire can be formed along the step between the first substrate 10 and the second substrate 20, in the covering member arranging step described later, the amount of resin arranged below the wire can be suppressed, and disconnection of the wire due to thermal expansion of the covering member can be suppressed.

[0049] The wavelength conversion member arrangement step S15 is a step of arranging a wavelength conversion member 5 that covers a plurality of light emitting elements 1. The wavelength conversion member 5 is prepared by processing it in advance into a sheet shape of a predetermined size and is arranged on the light emitting element 1. The wavelength conversion member 5 may be fixed on the light emitting element 1 via a light-transmissive bonding member such as resin, or may be fixed by utilizing the tackiness of the wavelength conversion member without using a bonding member.

[0050] The first convex portion arrangement step S16 is a step of arranging a light-transmissive first convex portion 41 along the element placement region 13 between the upper surface of the first substrate 10 and the first terminal 110. In the first convex portion arrangement step S16, the first convex portion 41 is arranged by moving the nozzle along the element placement region 13 while supplying the uncured resin that forms the first convex portion 41 from the nozzle of the dispenser.

[0051] The second convex portion arrangement step S17 arranges second convex portions outside the second terminal on the upper surface of the second substrate 20. It is preferable to use the same material for the first convex portion 41 and the second convex portion 42, whereby the first convex portion arrangement step S16 and the second convex portion arrangement step S17 can be performed as the same step. In the first convex portion arrangement step S16 and the second convex portion arrangement step S17, first, the second convex portion 42 may be arranged by the second convex portion arrangement step S17, and then the first convex portion 41 may be arranged by the first convex portion arrangement step S16. Further, the first convex portion arrangement step S16 may be performed simultaneously with the second convex portion arrangement step S17 so that the first convex portion 41 and the second convex portion 42 are arranged substantially simultaneously.

[0052] The covering member arranging step S18 is a step of arranging a light-shielding covering member that contacts the first convex portion and covers the wire outside the first convex portion. Specifically, it is a step of arranging a light-shielding covering member 40 made of a resin having a lower viscosity than the first convex portion 41 and the second convex portion 42 between the first convex portion 41 and the second convex portion 42 as a base material. The covering member 40 is arranged across the first substrate 10 and the second substrate 20. Therefore, the covering member 40 also covers the side surface of the first substrate 10. Note that the position of the top portion 40a of the covering member 40 arranged by the covering member arranging step S18 is formed to be higher than the top portion 41a of the first convex portion 41. As an example, in order to make the position of the top portion 40a of the covering member 40 higher than the top portion 41a of the first convex portion 41, it is preferable to repeatedly supply the resin a plurality of times before the supplied resin cures. The supply of the covering member 40 is preferably performed directly above the top of the wire. Thereby, the top of the wire is easily coated with the covering member 40.

[0053] In the first convex portion arranging step S16, the second convex portion arranging step S17, and the covering member arranging step S18, for example, the first convex portion 41 and the second convex portion 42 are silicone resins, and the covering member is also a silicone resin. The viscosity of the uncured resin forming the covering member can be adjusted by, for example, the physical properties of the resin used for the resin and adding a filler for viscosity adjustment. Further, in this step, arranging the first convex portion 41 and the second convex portion 42 includes the case of arranging an uncured or preferably semi-cured resin material, and is not limited to the case where it is completed until full curing.

[0054] Note that the covering member 40 and the first convex portion 41 may have a configuration as shown in FIGS. 10A to 10C. Hereinafter, each modification of the embodiment will be described with reference to each figure. FIG. 10A is a cross-sectional view schematically showing a first modification of the embodiment. FIG. 10B is a cross-sectional view schematically showing a second modification of the embodiment. FIG. 10C is a cross-sectional view schematically showing a third modification of the embodiment. Note that the configurations already described are denoted by the same reference numerals, and the description is omitted or the description is omitted in order not to repeat the same description.

[0055] (First Modification Example) As shown in FIG. 10A, in the light-emitting module 100A, the covering member 40 may be configured to include a first covering member 141 that contacts the first convex portion 41 and covers the wire 130, and a second covering member 142 that covers the first covering member 141. The first covering member 141 is disposed across the first substrate 10 and the second substrate 20 so as to cover the first wire 31, the second wire 32, and the third wire 33. And the first covering member 141 is disposed such that one end on the first substrate 10 side contacts the first convex portion 41. Also, the other end of the first covering member 141 on the second substrate 20 side is disposed at a distance from the second convex portion 42.

[0056] As the first covering member 141, a dark-colored resin (for example, black or gray resin) containing a light-absorbing substance as a filler having light-shielding properties in the base resin can be used. As the base material, a thermosetting resin such as an epoxy resin or a silicone resin can be used. Since the first covering member 141 covers the wire 130, it is preferable to use a resin having lower elasticity than the second covering member 142. By making the first covering member 141 a low-elasticity resin, the influence of heat on the wire can be further reduced, and the connection reliability of the wire can be improved. When the first covering member 141 is a dark-colored resin, it is preferable that the second covering member 142 covering the first covering member 141 is a white resin having light reflectivity. Thereby, deterioration of the first covering member 141 due to absorption of external light is suppressed, and the reliability as a light-emitting module can be ensured.

[0057] The second covering member 142 is preferably arranged to cover the first covering member 141 and contact the first convex portion 41. The second covering member 142 is preferably formed of a white resin containing a light-reflective substance as described above. The second covering member 142 is preferably formed of a higher elastic resin than the first covering member 141. One end side of the second covering member 142 is arranged to contact the first convex portion 41, and the other end side is arranged to contact the second convex portion 42. Note that the elasticity of the first covering member 141 and the second covering member 142 can be adjusted by adding a plasticizer or using different resin materials. By forming the first covering member 141 of a low elastic resin and the second covering member 142 of a high elastic resin, the mechanical influence from the outside can be reduced, and the influence of thermal expansion on the wire 130 can be reduced.

[0058] In the manufacturing method of the light-emitting module 100A, as shown in FIG. 11, in the manufacturing method already described, the covering member arranging step S18 includes a first covering member arranging step S18A and a second covering member arranging step S18B. In the first covering member arranging step S18A, the first covering member 141 is supplied from a nozzle and arranged so as to cover the wire 130. One end side of the first covering member 141 is arranged to contact the outer surface of the first convex portion 41. Also, the other end side of the first covering member 141 is arranged to be separated from the second convex portion. In the second covering member arranging step S18B, the second covering member 142 is arranged so as to cover the first covering member 141. One end side of the second covering member 142 is arranged to contact the first convex portion. The second covering member 142 is arranged on the first covering member 141 such that the top portion is higher than the top portion 41a of the first convex portion 41.

[0059] (Second and third modification examples) As shown in FIGS. 10B and 10C, in the light-emitting modules 100B and 100C, the first convex portion 241 may be arranged to cover the outer periphery of the wavelength conversion member 5. As shown in FIGS. 10B and 10C, the first convex portion 241 includes a first portion 241a that covers the wavelength conversion member 5, a second portion 241b that constitutes the top of the first convex portion 241, and a third portion 241c that absorbs or reflects light incident on the first convex portion 241.

[0060] The first portion 241a is arranged to cover at least a part of the outer edge of the wavelength conversion member 5 that does not face the light emitting element 1 of the wavelength conversion member 5. By covering the outer edge of the wavelength conversion member 5, the first portion 241a makes it easier for scattered light to enter the first convex portion 241. As a position where the first portion 241a covers the wavelength conversion member 5, it may cover the outer edge on the long side of the wavelength conversion member 5 that is rectangular in plan view. Of course, it may also cover the outer edge on the short side of the wavelength conversion member 5 together with the outer edge on the long side. The second portion 241b constitutes the top of the first convex portion 241 and has a convex curved surface facing upward. By arranging the second portion 241b at a position higher than the top of the wire at the top of the first convex portion 241, it serves as a dam when arranging the covering member 40. The third portion 241c is formed to have a convex curved shape on the covering member 40 side at the interface between the first convex portion 241 and the covering member 40. The third portion 241c forms a curved surface from the top to the outer surface and is formed to reflect the light entering the first convex portion 241 toward the first substrate 10 side. By providing the third portion 241c, the light incident on the first convex portion 241 is reflected toward the first substrate 10 side, making it difficult for the light to exit to the outside.

[0061] In the light emitting module 100B, one end side of the covering member 40 has the same configuration as the light emitting module 100 shown in FIG. 6 described above, and is arranged to be in contact with the outer surface of the first convex portion 241 up to a position beyond the top of the first convex portion 241, or up to the position of the top, or even up to a position in front of the top. In the light-emitting module 100C, the first convex portion 241 has the same configuration as that of the light-emitting module 100B in Modification 2 shown in FIG. 10B, and the covering member 40 has the same configuration as that of the light-emitting module 100A in Modification 1 shown in FIG. 10A. Therefore, in the light-emitting module 100C, one end side of the first covering member 141 and one end side of the second covering member 142 are arranged so as to be in contact with the outer surface of the first convex portion 241.

[0062] In the light-emitting modules 100B and 100C, since the first convex portion 241 has the first portion 241a covering the outer edge of the wavelength conversion member 5, it is difficult for the first convex portion 241 and the wavelength conversion member 5 to be separated, and the light-emitting element 1 can be protected from dust and moisture. As a result, the reliability of the light-emitting module is enhanced. In particular, when an integrated circuit (IC) substrate is used as the first substrate 10, this configuration is preferable.

[0063] The manufacturing method of the light-emitting module 100B or the light-emitting module 100C includes, as the first convex portion arranging step S16A, arranging the uncured resin for forming the first convex portion 241 on the first substrate 10 so as to overlap in two or more layers in the first convex portion arranging step S16 already described. At this time, it is supplied so that the second-stage resin is arranged outside the first-stage resin and overlaps the first-stage resin. Thereby, the first convex portion 241 having the first portion 241a covering the outer peripheral edge of the wavelength conversion member 5, the second portion 241b constituting the top of the first convex portion 241, and the third portion 241c having a curved surface continuous from the top is arranged.

[0064] In the manufacturing method of the light-emitting module 100B, the covering member arranging step S18 can be performed by the same steps as those of the light-emitting module 100 already described. In addition, in the manufacturing method of the light-emitting module 100C, in the covering member arranging step S18, the steps of the first covering member arranging step S18A and the second covering member arranging step S18B can be performed in the same manner as those of the light-emitting module 100A already described.

[0065] Further, as shown in FIG. 12, the light-emitting module 100D may have a recess 24 in the center of the second substrate 20D, and a substrate placement region 23D may be provided in the recess 24. In this way, the light-emitting module 100D can reduce the overall thickness by having the recess 24 in which the second substrate 20D constitutes the substrate placement region 23D.

[0066] Furthermore, in each of the light-emitting modules described above, the arrangement of the first convex portion 41N and the second convex portion 42N as shown in FIGS. 13 and 14 may be adopted. That is, in each light-emitting module, as shown in FIG. 13, the first convex portion 41N is arranged on the first substrate 10 so as to face each other with the element placement region 13 interposed therebetween. That is, the first convex portions 41N are arranged linearly opposite to each other along the longitudinal direction of the element placement region 13. The light-transmissive first convex portion 41N is arranged along the element placement region 13 so as to be in contact with the wavelength conversion member 5 between the element placement region 13 and the first external connection terminal 11 and the second external connection terminal 12 which are the first terminals 110.

[0067] Also, the second convex portion 42N is arranged on the upper surface of the second substrate 20 outside the first wire connection terminal 21 and the second wire connection terminal 22 which are the second terminals 120, and is arranged so as to be in contact with the covering member 40. The second convex portion 42N is arranged linearly with a length facing the first convex portion 41N. Note that in each light-emitting module, the second convex portion 42N may not be arranged as shown in FIG. 14.

Example

[0068] Next, an example of the light-emitting module according to the present invention will be described with reference to FIGS. 15 to 17. Needless to say, the present invention is not limited to this example. A light-emitting module having the following configuration was created, a pulse current of 2.5 mA (Duty: 10%) was passed through each light-emitting element, and the average luminance (cd / m 2) is measured. FIGS. 17A and 17B are graphs showing the relationship with the relative value (Relative Luminance (a.u.)) with respect to the average luminance of the light-emitting region on the vertical axis and the distance from the approximate center of the light-emitting region on the horizontal axis. The light-emitting region is defined as the region directly above the light-emitting element in the light-emitting module 100S. The basic configuration of the light-emitting module 100S is as follows as shown in FIGS. 15 and 16. The shape of the first convex portion 241 is the configuration already described as the second modification example, and the members constituting the first convex portion 241 and the members constituting the covering member 40 are made to satisfy the following conditions 1 to 5. Note that the reference numerals of the configurations shown in FIGS. 15 and 16 are the same as those of the configurations already described, and the description will be omitted as appropriate.

[0069] <Common basic configuration of the light-emitting module> (1) The first substrate 10 is a silicon substrate with an embedded IC. The substrate size of the first substrate 10 has a rectangular shape with a planar view shape of 14.5 mm × 5.39 mm and a thickness of 0.615 mm. (2) The light-emitting element 1 has an inverted cone shape, with a rectangular upper surface of 45 μm × 45 μm and a thickness of 8.5 μm. The light-emitting element 1 is disposed on the first substrate 10 via a 3-μm-thick Cu plating as an element bonding member. And a reflective member is disposed between the light-emitting elements on the first substrate 10. The reflective member is composed of a dimethyl silicone resin containing titanium oxide. The light-emitting elements 1 are arranged such that the distance between the light-emitting elements is 50 μm. The number of light-emitting elements 1 disposed on the first substrate 10 is 16,384 in total as 64 rows × 64 columns × 4 segments.

[0070] (3) The second substrate 20 is a Cu core substrate with Cu encapsulated inside, and wiring layers are disposed on the front and back surfaces. The second substrate 20 has a planar view size of 20 mm × 13 mm and a thickness of 0.522 mm. (4) The second substrate 20 and the first substrate 10 are joined by an Ag paste containing a silicone resin. (5) The first terminal disposed on the first substrate 10 and the second terminal disposed on the second substrate 20 are electrically connected by a wire 130. The wire 130 is made of Au and has a diameter φ of 45 μm.

[0071] (6) On the upper surface of the light-emitting element 1, a sheet-like wavelength conversion member 5 having a rectangular shape with a planar view shape of 13.7 mm × 4.0 mm and a thickness of 0.03 mm is disposed. The wavelength conversion member 5 is composed of a dimethyl silicone resin containing a YAG phosphor. The particle size of the YAG phosphor contained in the wavelength conversion member 5 is 10 μm or less. (7) The covering member 40 that covers the wire 130 and is disposed across the first substrate 10 and the second substrate 20 commonly contains a filler having a light-shielding property in a dimethyl silicone resin as a base material. (8) The first convex portion 241 is disposed at a distance of 200 μm from the light-emitting region. The first convex portion 241 covers the periphery of the wavelength conversion member 5 and is disposed on the first substrate 10. The width of the first convex portion 241 (that is, the shortest distance from the end on the light-emitting element 1 side to the end on the outer edge side of the first substrate 10 in the first convex portion 241) is 400 μm, and the height of the top of the first convex portion 241 from the first substrate 10 is 260 μm. The first convex portion 241 is formed such that the upper surface in the cross-sectional shape is formed by two connected arcs, and the arc top portion located on the covering member 40 side is higher than the circular top portion located on the light-emitting element 1 side. In the first convex portion 241, the distance from the top of the first convex portion 241 (that is, the top of the arc located on the covering member 40 side) to the end on the covering member side is 115 μm. Note that the light-emitting modules 100S under Conditions 1 to 5 are created with the above numerical values as design values, but the created light-emitting modules 100S may include errors due to member tolerances and mounting tolerances of about ±50 μm.

[0072] <Configuration of the First Convex Portion and Configuration of the Covering Member> The configurations of the first convex portion 241 and the covering member 40 under Conditions 1 to 5 are as follows. [Condition 1] The first convex portion 241 and the covering member 40 are made of a black resin. As the black resin, a dimethyl silicone resin containing a commercially available carbon filler is used.

[0073] [Condition 2] The first convex portion 241 is made of a translucent resin. As the translucent resin, a dimethyl silicone resin is used. Further, as the covering member 40, a white resin in which aluminum oxide as a reflective filler is contained in a dimethyl silicone resin is used. The concentration of aluminum oxide in this white resin is about 13% by mass. [Condition 3] The first convex portion 241 is made of a translucent resin. As the translucent resin, a dimethyl silicone resin having a different viscosity from that in Condition 2 is used. The covering member 40 uses a white resin having the same conditions as in Condition 2.

[0074] [Condition 4] The first convex portion 241 is made of a white resin. As the white resin, a white resin in which hollow silica filler is contained in a dimethyl silicone resin as a reflective filler is used. The concentration of the hollow silica filler in this white resin is about 33% by mass. The covering member 40 uses a white resin having the same conditions as in Condition 2. [Condition 5] The first convex portion 241 is made of a white resin. As the white resin, a dimethyl silicone resin containing aluminum oxide as a reflective filler is used. The concentration of aluminum oxide in this white resin is about 13% by mass. The covering member 40 uses a white resin having the same conditions as in Condition 2. In addition, in Conditions 1 to 5, in order to make the first convex portion 241 and the covering member 40 have a desired shape, a trace amount of a silica-based nanofiller is appropriately added to the above-described members to adjust the viscosity and thixotropy of the resin.

[0075] <Considerations in Conditions 1 to 5> As shown in FIGS. 17A and 17B, at the position from the light-emitting region to the covering member beyond the first convex portion, the average luminance (cd / mm of the front light of the light-emitting module 100S 2) is measured to check the generation state of stray light (reflection and scattering of unnecessary light generated outside the light-emitting region). In FIGS. 17A and 17B, the light-emitting region is considered as a region of 0 μm or more and 1600 μm or less, the first convex portion is a region of 1800 μm or more and 2200 μm or less, and the region where the first convex portion and the covering member are in contact is considered as a region of 2080 μm or more and 2200 μm or less. In the experimental data, the configuration in which the value of the relative luminance rapidly decreases at the outer edge of the light-emitting region and the relative luminance is maintained at a low level as the distance from the light-emitting region increases is the most excellent configuration. Also, even if a peak of the relative luminance map is confirmed in a region away from the light-emitting region, the configuration with a smaller maximum value of the peak is an excellent configuration. For example, if the peak of the relative luminance value confirmed at a position away from the light-emitting region is about 2.2% or less, the influence of stray light in the optical system unit using the light-emitting module as a light source is considered to be small. In the light-emitting module 100S, the generation state of stray light is examined with all the mounted light-emitting elements lit. In FIGS. 17A and 17B, the thick solid line indicates condition 1, the two-dot chain line indicates condition 2, the dotted line indicates condition 3, the one-dot chain line indicates condition 4, and the thin solid line indicates condition 5.

[0076] In the configuration of condition 5, a peak of the relative luminance value exceeding 7% was confirmed at the position of the first convex portion away from the light-emitting region. On the other hand, in the configuration of condition 4, a peak of the relative luminance value exceeding 4% was confirmed at the position of the first convex portion. Also, in the configuration of condition 1, a peak of the relative luminance value of about 2.2% was confirmed at a position slightly closer to the light-emitting surface than the first convex portion. In the configuration of condition 2, a weak peak of the relative luminance value below 2.2% was confirmed at a position outside (on the covering member side) the position of the first convex portion. In the configuration of condition 3, a weak peak of the relative luminance value of about 2.2% was confirmed at a position outside (on the covering member side) the first convex portion 241.

[0077] From the above results, it was confirmed that by using a translucent member for the first convex portion 241 as in condition 2 and condition 3, the value of the relative luminance of the generated stray light can be reduced to a level comparable to that of the black resin. In addition, based on the above-described experimental data, the same is presumed to be true also in the configuration of the first convex portion 41 and the coating member 40 according to the first embodiment. It is considered that by making the first convex portion 41 translucent, stray light (unintentional scattered light) in the light-emitting module can be suppressed.

[0078] As described above, the light-emitting module and the method for manufacturing the same according to the present invention have been specifically described by the embodiments for carrying out the invention. However, the gist of the present invention is not limited to these descriptions and must be broadly interpreted based on the descriptions in the claims. Needless to say, various changes, modifications, etc. based on these descriptions are also included in the gist of the present invention.

Industrial Applicability

[0079] The light-emitting module 100 according to the embodiment of the present disclosure can be used for various light sources such as vehicle headlights and projectors.

Explanation of Reference Numerals

[0080] 1 Light-emitting element 5 Wavelength conversion member 7 Reflective member 10 First substrate 110 First terminal 11 First external connection terminal 12 Second external connection terminal 13 Element mounting region 15 First drive terminal 16 Second drive terminal 20, 20A Second substrate 120 Second terminal 21 First wire connection terminal 22 Second wire connection terminal 23 Substrate mounting region 24 Recess 130 Wire 31 First wire 31a Top of the first wire 32 Second wire 32a Top of the second wire 33rd wire 40 Coating member 41 First convex part 42 Second convex part 100, 100A Light-emitting module S11 Element mounting process S12 Reflective member placement process S13 Substrate mounting process S14 Wire connection process S15 Wavelength conversion member placement process S16 First convex part placement process S17 Second convex part placement process S18 Coating member placement process

Claims

1. A plurality of light-emitting elements including a semiconductor laminate and electrodes disposed on the surface of the semiconductor laminate, a first substrate on which the plurality of light-emitting elements are placed on the upper surface, a second substrate on which the first substrate is placed on the upper surface, a plurality of wires connecting the first substrate and the second substrate across the outer edge of the first substrate, a light-shielding covering member covering the plurality of wires and containing a light-reflective substance, and a light-transmissive first convex portion disposed on the first substrate so as to surround the plurality of light-emitting elements and contacting the covering member. A light-emitting module comprising:

2. further comprising a second convex portion disposed on the second substrate and contacting the covering member, The light-emitting module according to claim 1, wherein the covering member is disposed between the first convex portion and the second convex portion.

3. The height from the upper surface of the second substrate to the top of the second convex portion is higher than the height from the upper surface of the first substrate to the top of the first convex portion. The light-emitting module according to claim 2.

4. The difference between the height from the upper surface of the second substrate to the top of the first convex portion and the height from the upper surface of the second substrate to the top of the second convex portion is smaller than the distance from the upper surface to the lower surface of the first substrate. The light-emitting module according to claim 2 or claim 3.

5. comprising a wavelength conversion member covering the plurality of light-emitting elements, The light-emitting module according to any one of claims 1 to 4, wherein the wavelength conversion member encloses the plurality of light-emitting elements in a plan view.

6. The light-emitting module according to claim 5, wherein the wavelength conversion member contacts the first convex portion.

7. The light-emitting module according to claim 5 or claim 6, wherein the thickness of the wavelength conversion member is 20 μm or more and 100 μm or less.

8. The light-emitting module according to any one of claims 1 to 7, wherein the plurality of light-emitting elements are arranged in a matrix so as to form a rectangle as a whole.

9. The light-emitting module according to any one of claims 1 to 8, wherein the interface between the first convex portion and the covering member has a convex curved shape on the covering member side.

10. The light-emitting module according to any one of claims 1 to 9, wherein the light-emitting element is flip-chip mounted on the first substrate.

11. the second substrate has a recess on the upper surface, The light-emitting module according to any one of claims 1 to 10, wherein the first substrate is disposed in the recess.

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