System and method for reprocessing ultra-high molecular weight polymer film offcuts
The reprocessing apparatus and method efficiently pulverize ultra-high molecular weight polymer film fragments into fine particles, addressing the challenges of reuse and waste in thin film production by producing high-quality recycled resin materials.
Patent Information
- Application Number
- JP2024212986
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-12-08
- Filing Date
- 2024-12-06
- Publication Date
- 2025-07-23
AI Technical Summary
Ultra-high molecular weight polymers, such as ultra-high molecular weight polyethylene, cannot be easily melted or regranulated due to their high molecular weight and high melt viscosity, leading to incomplete melting and reduced quality in subsequent thin film production processes, resulting in waste and increased production costs.
A reprocessing apparatus and method that includes a supply device and a pulverizing device with a cutting plate having overlapping cutting openings and protrusions, which pulverizes the polymer film fragments without blocking, allowing for the production of high-quality granular base materials suitable for reuse.
The apparatus effectively pulverizes ultra-high molecular weight polymer film fragments into fine particles for reuse, reducing waste and lowering production costs by enabling the production of high-quality recycled resin materials for ultra-high molecular weight polymer thin films.
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Figure 2025108364000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a reprocessing apparatus and a reprocessing method for ultra-high molecular weight polymer film fragments of a thin film, particularly a thin film for a separator including a battery separation thin film (BSF-film).
Background Art
[0002] During the production of thin films, particularly during the production of packaging thin films and biaxially stretched thin films applied technically, it is customary to reprocess the production waste generated, directly recycle the fragmented form of the production waste as a basic thin film material into the production process, collect the materials again, and agglomerate them.
[0003] Thin films formed of ultra-high molecular weight polymers are a special case among biaxially stretched thin films. This type of thin film is used, for example, as a battery separation thin film (also referred to as a separator film or BSF film) that avoids direct contact between the positive and negative electrodes of a battery. The separation thin film is a porous, particularly microporous thin film, and is used in the production of batteries as an ion separator of a lithium-ion battery.
[0004] In contrast to ordinary thin film production methods, when producing a porous ultra-high molecular weight polymer thin film, there is no step of extruding the molten resin of granular resin from a mold. Since the granular resin has a very high molecular weight of usually 400,000 g / mol to ≧2,000,000 g / mol, an ultra-high molecular weight polymer having extremely high melt viscosity cannot be easily melted by a conventional screw extruder.
[0005] For example, ultra-high molecular weight polyethylene (UHMWPE), which is an ultra-high molecular weight polymer provided in powder form, is mixed with an oil component, particularly a white oil component, to improve processability. The mass fraction of the oil component usually corresponds to the range of 50% by weight to 90% by weight or 60% by weight to 80% by weight. For example, the mass fraction of the oil component is 70% by weight.
[0006] The ultra-high molecular weight polymer and the oil can be mixed in advance and / or during the extrusion process. This means that, for example, the oil can be directly pumped together with the ultra-high molecular weight polymer into an extruder or a twin-screw extruder. The ultra-high molecular weight polyethylene and the oil form a homogeneous and highly viscous melt in the extruder. A suspension (also referred to as a "slurry") in which the ultra-high molecular weight polyethylene and the oil are mixed before the extrusion process forms an initial mixing form that can be supplied to the extruder and the melt.
[0007] The polymer-oil mixture is extruded through a die such as a die for thin film extrusion (sheet die), and is further stretched into a thinner thin film in a subsequent manufacturing process. The stretching process is carried out by normal biaxial stretching in the machine direction (MD) and the transverse direction (TD). Biaxial stretching can be carried out sequentially or simultaneously. Similarly, uniaxially stretched thin films that are stretched only in the machine direction or the transverse direction are also known.
[0008] The oil contained in the stretched thin film, especially white oil, is washed in a solvent bath, and the thin film is made into a porous thin film having an open porous structure.
[0009] After washing in the washing bath, the solvent (for example, dichloromethane or hexane) can be evaporated by the heating roller of a thin film drying device. For example, a thin film drying method using a ventilation nozzle such as a suspension dryer or a heating furnace is also known.
[0010] The thin film manufacturing method is also referred to as a wet method. The polymer thin film before the washing bath step is called a wet polymer with 50% to 90% by weight or 60% to 80% by weight of oil. After washing the oil, the thin film becomes substantially oil-free and is called a dry thin film. The dry thin film usually has an oil content of <5% by weight, preferably <1% by weight.
[0011] The production waste of the porous ultra-high molecular weight polymer thin film obtained by cutting and shaving the thin film sheet is not recycled or reused. This applies not only to the "dry" production waste but also to the "wet" production waste. Summary of the Invention Problems to be Solved by the Invention
[0012] The other side, it is impossible to melt ultra-high molecular weight polymers (for example, ultra-high molecular weight polyethylene), and due to its high molecular weight and high melt viscosity, it cannot be regranulated unlike other polymers to which the normal reuse extrusion method is applicable.
[0013] For the reuse or production of a porous ultra-high molecular weight polymer thin film including a battery separation thin film, an ultra-fine granular reuse resin material is required. If the reuse resin material is not formed into ultra-fine particles, the resin material is not sufficiently mixed with the oil content in the extrusion process, and incomplete melting occurs. The incompleteness contained in the particles and the melt in the non-molten state or the incomplete melting state becomes waste materials updated in the production of thin films in the subsequent process and a decrease in quality.
[0014] The reuse resin material, the aggregates, and the base material (particle size > 2 mm) in the form of granular materials to be reprocessed, which are usually thin film extruded products, are not suitable for the production of ultra-high molecular weight polymer thin films.
[0015] Therefore, the waste for wet thin film production and the waste for dry thin film production must currently be used only thermally or landfilled. This cannot use expensive ultra-high molecular weight polymers and constantly supplies new polymers to the extrusion method, resulting in a high production cost and an unfavorable carbon dioxide conversion value. Detailed Description of the Invention
[0016] For this reason, an object of the present invention is to provide a reprocessing apparatus and a reprocessing method for ultra-high molecular weight polymer thin film fragments including a battery separation thin film in particular.
[0017] The object of the present invention is solved by the thin film fragment reprocessing apparatus described in claim 1 and the thin film fragment reprocessing method described in claim 12. Other features of the present invention are described in the dependent claims and the following specification.
[0018] In particular, the object of the present invention is solved by a thin film fragment reprocessing apparatus that reprocesses ultra-high molecular weight polymer thin film fragments including, in particular, fragments of a battery separation thin film (BSF thin film). The thin film fragments may include fragments of the thin film, production scraps including scraps, and fragments of the thin film of a used battery.
[0019] In particular, the polymer film fragments called dry polymer film fragments are polymer film fragments that are substantially oil-free, especially substantially free of white oil. The oil content of the polymer film fragments is especially 5% by weight or less, or 1% by weight or less.
[0020] The film or film fragment to be reprocessed is a film made from a super high molecular weight polymer containing ultra-high molecular weight polyethylene (UHMWPE). In particular, the film is produced in a wet process.
[0021] Ultra-high molecular weight polyethylene belongs to a subpopulation of the thermoplastic polymer polyethylene and is characterized by a high molecular weight. The molecular weight is in the range of 400,000 g / mol to ≥2,000,000 g / mol.
Means for Solving the Problems
[0022] The film fragment reprocessing apparatus of the present invention includes a supply device and a pulverizing device. The supply device supplies the film fragments of the super high molecular weight polymer to the pulverizing device. The supply device is provided with a roller feeding device that controls the supply speed (i.e., the supply amount) in particular to control the amount of film fragments supplied to the pulverizing device. As an alternative or additionally, the supply device is provided with a blower or an air supply device (especially an air suction device).
[0023] For example, production scraps including film fragments and scraps generated during the production of ultra-high molecular weight polymer films are automatically moved and supplied to the pulverizing device by the supply device, so that the production scraps can be automatically and continuously supplied to the pulverizing device.
[0024] The pulverizing device includes at least one cutting plate. The cutting plate has a plurality of cutting openings and a plurality of cutting protrusions. At least one cutting protrusion extends near the cutting opening assigned to the cutting protrusion. In contrast to the perforated cutting plate that forms the cutting opening in the normal direction, the cutting openings of the cutting plate used in the present invention are formed with partial overlap.
[0025] The cutting plate of the pulverizing device generates relative movement with respect to the supplied polymer thin film fragments to pulverize the polymer thin film fragments.
[0026] Due to the relative movement between the cutting plate of the pulverizing device and the polymer thin film fragments, there is no risk of blocking the cutting opening of the cutting plate, and the cross-section of the ultra-high molecular weight polymer thin film can be finely cut. Even during high-speed pulverization during the production of fine agglomerated materials (especially in the case of ultra-high molecular weight polymers), it has been found that the cutting plate does not inhibit the high-speed pulverization of the agglomerated materials. Also, when cutting ultra-high molecular weight polymer thin film fragments containing ultra-high molecular weight polyethylene, the polymer is not in a molten state. Instead, the polymer thin film fragments can be reliably subdivided. Here, the ultra-high molecular weight polymer thin film is significantly different in characteristics from other polymers (for example, polypropylene, polyethylene terephthalate, polyamide, polystyrene, etc.) used in the normal extrusion of thin films. In the pulverization method using a fine cutting plate provided, partially melted or already melted polymers become an obstacle to blocking the cutting plate perforations, making further product discharge impossible, overloading the device, and as a result, blockage or clogging occurs.
[0027] Also, shear stress is generated by the cutting plate and the polymer is not damaged by the thermal effect during crushing, and fracture occurs. During thin film production, especially during the production of battery separator thin films, high-quality granular base materials (or polymer thin film fragments to be broken) obtained can be used as recycled resin materials.
[0028] In an embodiment of the present invention, the thin film fragment reprocessing device further includes a control device. The control device controls the supply speed and / or supply amount of the supply device. Since the input of the pulverizing device serves as an index of the filling amount of the pulverizing device, the supply amount of the supply device can be controlled via the input of the pulverizing device. Therefore, the supply device can control the supply speed to obtain the required supply amount of thin film fragments. For example, the rotational speed of the supply roller or the air flow rate of the blower or pneumatic supply device can be controlled.
[0029] In an embodiment of the present invention, the cutting plate of the pulverizing device moves relative to the polymer thin film fragments. For example, a device (such as a scraping machine or a stirring arm) for moving the thin film fragments toward the cutting plate can be provided.
[0030] In an embodiment of the present invention, the pulverizing device includes at least one rotary cutter and at least one optional stationary cutting tool. By the rotation of at least one rotary cutter, the supplied ultra-high molecular weight polymer thin film fragments are coarsely divided (rough cut). Further, the rotary cutter interacts with at least one stationary cutting tool provided to achieve a continuous cutting action.
[0031] The polymer thin film fragments to be coarsely divided can be moved to a cutting plate (for example, at least one rotary cutting machine that rotates), and further finely divided (micro-cut) by cutting protrusions including the cutting plate. For this purpose, the rotary cutting machine is arranged at a distance from the cutting plate. The distance between the rotary cutting device and the cutting plate is, for example, in the range of 0.8 mm to 3 mm, 1 mm to 2 mm, or 1.2 mm to 2.5 mm.
[0032] For example, the pulverizing device has at least two, at least three, or at least four rotary cutting machines. Further, the pulverizing device has at least two, at least three, or at least four stationary cutting tools.
[0033] In an embodiment of the present invention, the pulverizing device can be designed as a rotary pulverizer or a rotary pulverizer can be provided in the pulverizing device.
[0034] The rotary pulverizer usually has a housing in which at least one rotary cutter is arranged. The rotary cutter is guided through the stationary cutting tool to achieve a cutting action or a pulverizing effect. The polymer thin film fragments to be coarsely divided are removed through the cutting plate and further refined.
[0035] The pulverizing speed is affected by, in addition to the driving force of the pulverizing device, particularly the quantity and shape of the single or plural rotary cutting machines (in particular, the selection of the length of the rotary cutting machine, the rotor diameter of the rotary cutter, etc.).
[0036] As an alternative or additionally, at least one cutting plate can be rotatably arranged. For example, the cutting plate can be formed on the cutting plate barrel or the cutting plate disk. Also, other forms of the cutting plate are possible. In the present embodiment, the thin film fragments to be supplied, particularly the cutting plate, can be moved relative to the supply device.
[0037] The cutting openings of the cutting plate have an equal diameter in the range of 0.5 mm to 1.5 mm or 0.8 mm to 1 mm. The equal diameter indicates the maximum circle diameter that can be configured within the cutting opening. The cutting plate may have a perforated form. That is, all the cutting openings have substantially the same shape and dimensions. In other embodiments, the cutting plate has different perforated types. For example, a cutting plate can be configured to provide at least two holes (with equal diameter) having different shapes of holes and / or dimensions.
[0038] It has been found that a high-quality base material can be formed by a cutting opening having an equal diameter in the range of 0.5 mm to 1.5 mm. When the equal diameter is 0.8 mm, a base material with a particle size in the range of 300 μm to 800 μm (D50 = 560 μm, bulk density about 0.16 kg / l) can be created. When the equal diameter is 0.5 mm, a base material with a particle size in the range of 250 μm to 600 μm (D50 = 430 μm, bulk density about 0.18 kg / l) can be created. The D50 value characterizes the particle size distribution. 50% of the particles are larger than this value and 50% are smaller. In addition to the pore size, the degree of pulverization is also determined through the input power of the rotary cutter and / or grinder.
[0039] In an embodiment of the present invention, cutting openings (628) are arranged in multiple rows in alignment, · The vertical gap v between multiple rows of the cutting openings (628) has a range of 1 mm to 3.6 mm or 1.5 mm to 2.4 mm; · The horizontal gap t between multiple rows of the cutting openings (628) s has a range of 1.2 mm to 4.2 mm or 1.8 mm to 2.8 mm; and / or · The horizontal gap t between columns of the cutting openings (628) adjacent in the vertical direction rThey are arranged to be spaced apart from each other in the range of 0.4 mm to 2.1 mm or 0.6 to 1.4 mm.
[0040] Cutting protrusions can be formed by a punching process.
[0041] Cutting protrusions that extend almost completely across the cutting opening (628) can be formed. The cutting protrusions can convey the base material through the cutting opening. This can prevent the base material from staying on the cutting plate and prevent exposure to excessive shear stress.
[0042] Alternatively, the cutting protrusions can be extended partially from the cutting opening. In this way, the cutting opening can be enlarged. This can be achieved by first punching the first part of the subsequent cutting opening during the punching process and then reworking the cutting protrusions on the second part. This can form an enlarged cutting opening, reducing the risk of the cutting plate inhibiting the retention of the base material.
[0043] Cutting edges can be provided on each cutting protrusion (or its parts). The cutting edges in contact with the production scraps are arranged on the cutting protrusions as shown in the direction of movement (or rotation direction). Punching burrs may be formed on the cutting edges. The punching burrs increase the cutting action of the cutting plate. For example, a sharpened (e.g., by laser or mechanically ground) cutting edge further improves the cutting action.
[0044] The other cutting protrusion on the side opposite to the cutting edge of one edge may be closed. The subdivided thin film fragments can be cut by the cutting edges. The subdivided thin film fragments (base material) can be received on the closed side of the cutting protrusion and guided through the corresponding cutting opening.
[0045] The pulverizing device includes at least one conveying device for removing the polymer thin film fragments (base material) to be pulverized from the pulverizing device. In particular, the conveying device may be a pneumatic conveyor that generates an air flow for conveying the polymer thin film fragments to be pulverized in the pulverizing device.
[0046] Subsequently, the ground polymer thin film fragments supplied to the separating device (e.g., a centrifuge) are separated from the air stream. The separated ground polymer thin film fragments can be packaged and stored (e.g., as a bagged product) or the ground polymer thin film fragments can be supplied to the extruder again.
[0047] The grinding device may be provided with a bagging device for storing, preserving or temporarily storing the ground polymer thin film fragments.
[0048] In an embodiment of the present invention, the grinding device can be provided with a metering device that measures the amount of the supplied ground polymer thin film fragments and supplies them to the extruder. The extrusion device can be configured as part of the grinding device. The extrusion device can extrude the ground polymer thin film fragments together with an oil component, particularly white oil, to produce the polymer thin film once again. The capacity of the ground polymer thin film fragments (i.e., the recycled resin material) ranges from 1 wt% to 50 wt% of the solid content of the extruded thin film. For example, the capacity of the ground thin film fragments corresponds to at least 5 wt%, at least 10 wt%, at least 15 wt% or at least 20 wt% of the solid capacity of the extruded thin film. Accordingly, the extruded thin film can be stretched by a machine direction stretcher and / or a transverse direction stretcher or a simultaneous stretching method.
[0049] Furthermore, since the supply device is configured to automatically collect the polymer thin film fragments, particularly (dried) edge fragments, and supply them to the grinding device, a supply cycle of the polymer thin film fragments is formed, and the formation of the generated waste to be thermally utilized or processed can be significantly reduced.
[0050] Also, the object of the present invention is solved by a method for treating ultra-high molecular weight polymer thin film fragments, particularly preferably battery separation film (BSF) fragments used in a grinding device.
[0051] The thin film fragment reprocessing method of the present invention includes the following steps: · A step of preparing at least one ultra-high molecular weight polymer thin film fragment. The polymer thin film fragment particularly refers to a substantially oil-free, white oil-free polymer thin film fragment or a dried polymer thin film fragment. · A step of supplying the polymer thin film fragment to a grinding device. · A step of pulverizing the polymer thin film fragments (2) by a pulverizing device. The pulverizing device includes at least one cutting plate having a plurality of cutting openings and a plurality of cutting protrusions. At least one cutting protrusion extends near the corresponding cutting opening. In another aspect, the cutting plate is designed as described above.
[0052] The pulverizing step includes a step of relatively moving the polymer thin film fragments relative to the cutting plate (e.g., by a spatula or a stirring arm) and / or moving the cutting plate relative to the polymer thin film fragments to generate relative movement between the supplied polymer thin film fragments and the cutting plate.
[0053] The pulverizing step of the supplied polymer thin film fragments includes a step of pulverizing by at least one rotary cutter (and optional stationary cutting tool) that pulverizes by a rotary cutter before pulverization by the cutting plate. The step of pulverizing the polymer thin film fragments by at least one rotary cutter is a rough cutting step, but the step of pulverizing the supplied polymer thin film fragments (or polymer thin film fragments that have already been roughly pulverized) is a fine cutting step.
[0054] The pulverizing step includes a step of additionally controlling the supply speed and / or supply amount of the supply device and / or the output of the pulverizing device. For example, it includes a step of keeping the rotation speed of the rotary cutter substantially constant.
[0055] In particular, by controlling and / or regulating the supply device and / or the pulverizing device, the polymer thin film fragments (i.e., the base material) can be pulverized to a specific dimensional range of 300 μm to 800 μm or 250 μm to 600 μm. For example, polymer thin film fragments can be formed in a film thickness range of 5 μm to 200 μm, 8 μm to 100 μm, or 10 μm to 30 μm. It has been found that this special dimensional base material can be used as a recycled resin material for manufacturing ultra-high molecular weight polymer thin films, particularly battery separation thin films without quality degradation.
[0056] Furthermore, the method for reprocessing thin film fragments of the present invention includes a step of packaging the crushed thin film fragments (for storage and / or temporary storage) and / or a step of supplying the crushed thin film fragments to an extruder for thin film production. In particular, the composition components of the recycled resin material (i.e., the base material) reach 1% to 50% by weight of the solid components of the extruded thin film for producing ultra-high molecular weight polymer thin films.
Brief Description of the Drawings
[0057] The accompanying drawings show the following aspects of the present invention:
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6A
Figure 6B
Figure 7A
Figure 7B
Figure 8A
Figure 8B
Figure 8C
Figure 9
Modes for Carrying Out the Invention
[0058] FIG. 1 shows a block diagram of a typical manufacturing method of a porous ultra-high molecular weight polymer film such as a battery separator film. An ultra-high molecular weight polymer such as ultra-high molecular weight polyethylene is mixed with an oil component, particularly white oil, in an extruder 10.
[0059] For example, the granular ultra-high molecular weight polymer can be supplied to the extruder through at least one metering device (e.g., differential metering reference). Also, preferably, on a side different from the screw region of the extruder, a measured amount of oil component (particularly white oil) is injected into the extruder, and the oil component can be gradually mixed with the granular ultra-high molecular weight polymer.
[0060] As an alternative method, in an upstream manufacturing process, the granular ultra-high molecular weight polymer can be mixed with an oil component to be processed into a "slurry (turbid liquid)". The slurry can be pumped and supplied to the extruder.
[0061] The granular ultra-high molecular weight polymer can include manufacturing waste or a granular base material manufactured by a device for reprocessing thin film fragments processed as described below.
[0062] The polymer-oil mixture is processed by the extruder 10 and extruded as a (high-viscosity) melt, and supplied to the machine direction orienter 30 through the draw roll 20. The extruded thin film is stretched in the machine direction (MD). Views 1a, 1b, 1c indicate the generation of manufacturing waste, particularly start-up waste. In particular, when the thin film discharged from the extruder is curved or when manufacturing is inhibited at the start (e.g., when tearing is suppressed in the thin film), start-up waste is generated. Corresponding thin film fragments (start-up fragments, torn fragments) can be collected.
[0063] The thin film stretched by the machine direction orienter 30 is then supplied to the transverse direction orienter 40 and removed from the transverse direction orienter 40 by the draw roll 22. It will also be understood that in the prior art, machine direction stretching and transverse direction stretching can be performed simultaneously.
[0064] Thereafter, the thin film can be finished. During finishing, the wet side edges of the thin film still containing at least 50% by weight of oil (especially white oil) are cut off. The cut wet production waste 1 of the thin film containing at least 50% by weight of oil (especially white oil) can be collected.
[0065] The still wet thin film is guided to a washing bath 50 where the oil (especially white oil) is washed off with a solvent (e.g., dichloromethane or hexane), so that the oil content preferably becomes less than 5% by weight of the thin film fragments.
[0066] After the optimal drying process of the thin film to remove the solvent, the dried thin film is fed via a tension roll 24 to another transverse orienter 60. Here, the thin film is stretched transversely and / or relaxed, i.e., the internal stress is removed. The thin film further stretched transversely and / or relaxed via a tension roll 26 is wound up by a winding device 70 and finally stored in a storage 80. The wound thin film can be cut to the desired dimensions (length and / or width) by a cutting device 90.
[0067] After passing through the washing bath, dried production waste is generated. The production waste 2 of the thin film fragments has side edges 2a, 2b that are separated from the actual thin film by finishing the cut ends and scraps 2c, 2d after the washing bath and / or further transverse stretching.
[0068] Figure 2 shows a block diagram of an individual reprocessing device 200 for production waste 2, especially dried production waste. The production waste 2 is fed from a supply device 202 to a grinding device 203 and ground. The supply device 202 especially has a roller feeder for controlling the supply speed. The amount of production waste 2 fed to the grinding device 203 can be controlled.
[0069] The grinding device 203 is especially a cutting machine (e.g., a rotary cutting machine) having at least one cutting plate. The cutting plate has holes with an equivalent diameter in the range of, for example, 0.5 mm to 1.5 mm, especially 0.8 mm to 1 mm. The equivalent diameter indicates the diameter of the largest circle formed within the cutting opening. In particular, the cutting plates are shown in FIGS. 8A - 8C.
[0070] When forming holes with an equivalent diameter of 0.8 mm in the cutting plate, a base material can be generated with a particle size in the range of 30 μm to 800 μm (D50 = 560 μm, bulk density of about 0.16 kg / l). When forming holes with an equivalent diameter of 0.5 mm in the base material, the particle size of the base material is, for example, in the range of 250 μm to 600 μm (D50 = 430 μm, bulk density 0.18 kg / l). The D50 value characterizes the particle size distribution. 50% of the particles are larger than this value, and 50% of the particles are smaller than this value.
[0071] The base material can be transported to the separation device 205 by a transport device 204 such as a blower for transporting the base material. The separation device 205 includes, for example, a centrifuge for separating the base material from the air stream. The transport air stream or the separation air of the transport device can be filtered by the filter 206 to remove, for example, dust / particulate matter.
[0072] The base material can be transported to the storage device 209 through the safety device 207 and the distribution device 208, and the storage device 209 can be filled with the base material. For example, it can be packed in bags or filled into a large bundler with the base material (i.e., recycled resin material 250) for storage. Then, the obtained base material can be directly supplied to an extruder as an additional powdered solid (or a part of the slurry) for reuse. Also, the obtained base material is sufficiently mixed with white oil in an extruder to create a resin melt, so that regardless of the recycled resin material component (for example, the solid content of the thin film is 1 wt% to 50 wt%), a high-quality porous ultra-high molecular weight resin thin film can be manufactured.
[0073] Figure 3 shows a block diagram of an in-line reprocessing device 300 for production waste 2. Production waste such as the edge side of the thin film, especially the dry edge side, generated during the production of the ultra-high molecular weight polymer thin film is automatically guided to the grinding device 306 through the left edge side recovery device 302a and the right edge side recovery device 302b. This constitutes the transport device 303.
[0074] The conveying device 303 is designed as an air suction device. The pair of side edges of the thin film in contact with the left-edge recovery device 302a and the right-edge recovery device 302b are supplied to one or more injectors by an air flow driven by a blower. A part of the supply device 304 can constitute the injector. Since the production waste 2 is sucked through the injector, the production waste 2 is conveyed by air pressure through a pipe to a separation device (for example, a flat separator) 305, and the production waste 2 is separated by the air flow generated by the conveying device 303.
[0075] After passing through the pulverizing device 306, the production waste 2 is treated as a base material. The pulverizing device 306 is a cutting pulverizer (for example, a rotary cutting pulverizer) having at least one cutting plate. The cutting plates are shown in FIGS. 8A to 8C in particular.
[0076] Thereafter, the base material is supplied to a supply container 312 by another conveying device 307 (for example, a radial blower) via the separation device 309 and the optional separation device 311. The base material is separated from the conveying air flow of the separation device 309 (for example, a stretching separation device). For example, a metal component can be separated from the base material of the separation device 311.
[0077] Through the blocking device 308, the base material generated in the unconnected process 250 is supplied to the base material generated in the series system, and the entire composition of the solid component base material / recycled resin material can be blended into the extruded thin film. Through the metering device 313 (for example, a (differential) metering standard), the base material is supplied to the extruder 10. For example, the ratio between the base material generated in the series system and the base material generated in another system can be adjusted to control the blocking device 308 and / or the metering device 313. It is also possible to supply the base material of the series system alone, the base material of another system alone, or a mixture of the base materials generated in the series system and another system to the extruder.
[0078] Figure 4 shows a block diagram of a reprocessing apparatus 400 for production waste 2. In Figure 4, for example, the production waste 2 (dry) generated in the left-edge recovery apparatus 302a and the right-edge recovery apparatus 302b during the production of an ultra-high molecular weight polymer thin film is supplied to the pulverizing apparatuses 403a and 403b via supply apparatuses (for example, intake cylinders) 402a and 402b, respectively. The pulverizing apparatuses 403a and 403b are cutting pulverizers (for example, rotary cutting pulverizers) provided with at least one cutting plate. Different shape forms of the cutting plate are particularly shown in FIGS. 6A to 8C. Each of the corresponding supply apparatuses 402a and 402b and the pulverizing apparatuses 403a and 403b is provided corresponding to each edge side (left and right) of the thin film. The supply apparatuses 402a and 402b and the pulverizing apparatuses 403a and 403b are designed as described above. The base material generated by the pulverizing apparatuses 403a and 403b is conveyed to the next process (the series process shown in FIGS. 3 and 5 or the non-series process shown in FIG. 2) via a conveying apparatus (particularly an air current conveying apparatus).
[0079] Figure 5 shows a block diagram of an in-line reprocessing apparatus 500 for production waste 2. In contrast to the in-line reprocessing apparatus shown in FIG. 3, in the in-line reprocessing apparatus 500 of FIG. 5, the production waste 2, particularly a pair of (dry) edge sides of the thin film, is taken in by a pulverizing apparatus 503 (for example, a (rotary) cutting pulverizer). The generated base material is supplied to a separating apparatus 505 (for example, a centrifuge) via a conveying apparatus 504 (for example, an air current conveying apparatus), and the conveying air current is supplied to a filter 509.
[0080] The base material is supplied to a bagging apparatus 507 via a distribution guide 506, bagged, and (temporarily) stored. Similarly, the base material is supplied to a weighing apparatus 512 (for example, a differential weighing standard), and then supplied to an extruder via another conveying apparatus 508 (for example, an air current conveying apparatus), and further supplied to another separating apparatus 511 (for example, a centrifuge). The conveying air current of the conveying apparatus 508 is supplied to a filter 510.
[0081] Figures 6A and 6B show side views of the reprocessing apparatuses 600A and 600B for ultra-high molecular weight polymer film production waste. Production waste, particularly dry production waste, is supplied to a pulverizing device via a supply device. As shown in FIG. 6A, the supply device 610 includes, for example, a controllable roller feeder that supplies a desired amount of production waste per unit time to the pulverizing device. In another embodiment shown in FIG. 6B, the supply device 611 can be designed as a stretching separator in the form of a dust collector or a flat separator.
[0082] The pulverizing devices in FIGS. 6A and 6B include a rotary cutting pulverizer 615 having a rotatable rotor 621. At least one rotary blade 622 is attached to the rotor 621. For example, at least two, at least three, at least four, or at least eight rotary blades 622 can be attached to the rotor 621. The rotary blades 622 can be attached at evenly angled intervals along the circumference of the rotor 621.
[0083] The rotary cutting pulverizer 615 includes a housing that houses stationary cutting tools 623 to be arranged. For example, the rotary cutting pulverizer 615 includes at least two, at least three, at least four, or at least eight stationary cutting tools 623.
[0084] A cutting plate cage having at least one cutting plate 620 is arranged below the rotor 621. At least one cutting plate is provided that surrounds the rotor 621 in an angular range of at least 90 degrees to 180 degrees.
[0085] The production waste is supplied to the rotary cutting pulverizer 615 via the supply devices 610, 611 and can be pulverized into a base material. After being roughly pulverized / cut by the rotary blades 622 and the stationary cutting tools 623, it is guided through the cutting plate 620 and further pulverized into a base material (fine cutting).
[0086] In the fine cutting process, the material to be roughly cut by the rotary blade 622 in the tangential direction along the cutting protrusions of the cutting plate 620 is moved. The manufacturing waste is held in the rotary cutting mill 615 until it is sufficiently cut. Thereafter, since the base material can pass through the cutting plate 620, a base material with a sufficiently refined particle size can be ensured. The base material is received by a suction tank disposed below the cutting plate 620 and further conveyed to the next process (in-line process or separate process).
[0087] FIGS. 7A and 7B show cross-sectional views of another cutting plate 620, 620' used in the rotary cutting mill shown in FIGS. 6A and 6B, for example. The cutting plate 620 includes a plurality of cutting protrusions 626 on which the cutting plate 620 is impressed, and the cutting protrusions 626 extend at least partially near the cutting openings 628. The cutting protrusions 626 have a cutting side edge 627 that contacts the production waste and crushes the production waste as the base material.
[0088] The other side edge of the cutting protrusion 626 opposite to the cutting side edge 627 is closed. The thin film fragments to be crushed are cut by the cutting side edge 627. The closed side edge 627 of the cutting protrusion receives the thin film fragments (base material) to be crushed and guides them through the corresponding cutting opening 628.
[0089] The cutting side edge 627 forms an impressed cutting side edge with a punching burr. The punching burr increases the cutting operation of the cutting plate. Also, the cutting side edge 627 has, for example, a sharp (e.g., by laser polishing or mechanical polishing) processed cutting side edge, which improves the cutting function. Through the impressing operation of the cutting protrusion 626, a cutting opening 628 for removing the base material is formed.
[0090] Substantially the same as the cutting plate shown in FIG. 7A, the cutting plate 620' shown in FIG. 7B is formed. It differs in that the cutting opening 628' is enlarged by the cross-section c compared to the cutting opening 628. The cross-section c can be impressed during the impressing of the cutting hole 626' or in a separate process. The enlarged cutting opening 628' has the advantage that the forming tolerance value of the cutting plate against the interference during the punching of the cutting hole can be set high.
[0091] Figures 8A to 8C illustrate the perforation shapes of different cutting plates of cutting protrusions corresponding to the perforation shapes. Figure 8A shows an arcuate perforation shape (and the corresponding arcuate cutting protrusion), Figure 8B shows a triangular perforation shape (and the corresponding triangular cutting protrusion), and Figure 8C shows a trapezoidal perforation shape (and the corresponding trapezoidal cutting protrusion). The cutting plate has perforations with an equal diameter d in the range of 0.5 mm to 1.5 mm. The cutting openings 626a, 626b, 626c are formed in a row. Each row interval v in the height direction particularly has a range of 1 mm to 3.6 mm or 1.5 mm to 2.4 mm. Each row interval t in the horizontal direction s is in the range of 2 mm to 4.2 mm or 1.8 mm to 2.8 mm. Also, each cutting opening in adjacent rows is arranged spaced apart from each other by an interval t r only. For example, the interval t r is in the range of 0.4 mm to 2.1 mm or 0.6 mm to 1.4 mm.
[0092] The cutting protrusions 626a, 626b, 626c shown in Figure 9 extend at least partially near the assigned cutting openings 628a, 628b, 628c. The cutting protrusions 626a, 626b, 626c can be formed in different forms by indentation. For example, the cutting protrusions 626a, 626b, 626c are formed in an arc shape, a triangular shape, and a trapezoidal shape respectively.
Explanation of reference numerals
[0093] 1··Wet production waste, 1a··Startup waste (wet), 1b··Startup waste (wet), 1c··Startup waste (wet), 1d··Edge side (wet), 2··Dry production waste (polymer film fragments), 2a, 2b··Edge side (dry), 2c··Fragment (dry) / waste material, 2d··Edge fragment / waste material, 10··Extruder, 20··Tension roll, 22, 24, 26··Tension roll, 30··Machine direction orienter, 40··Cross direction orienter, 50··Washing bath, 60··Another cross direction orienter, 70··Take-up device, 80··Storage, 90··Cutting device, 200··Reprocessing device, 202··Feeding device, 203··Grinding device, 204··Blower, 205··Separator, 206··Filter, 207··Locking device, 208··Distribution guide, 209··Bag device, 250··Reprocessing resin material, 300··Reprocessing device, 302··Edge collection device, 303··Conveyor, 304··Feeding device, 305··Separator, 306··Grinding device, 307··Conveyor, 308··Blocking device, 309··Separator, 310··Filtering device, 311··Separator (metal), 312··Refill container, 313··Measuring device, 400··Reprocessing device, 402a··Feeding device, 402b··Feeding device, 403a··Grinding device, 403b··Grinding device, 404a··Conveyor, 404b··Conveyor, 500··Reprocessing device, 502a··Feeding device, 502b··Feeding device, 503··Grinding device, 504··Conveyor, 505··Separator, 506··Distribution device, 507··Bag device, 508··Conveyor, 509, 510··Filtering device, 511··Separator, 512··Measuring device, 600a, 600b··Reprocessing device, 610··Mechanical feeding device (feeding roller), 611··Air flow feeding device (centrifugal type, flat type or lattice separator), 615··Rotary cutting and grinding machine, 620··Cutting plate, 621··Rotor, 622··Rotary cutting machine, 623··Fixed cutting tool, 626··Cutting projection, 627··Cutting edge, 628··Cutting opening, 630··Suction device, d··Equal diameter, v··Feeding operation, t s ··Perforation distribution, t r ··Separation,
Claims
1. In a reprocessing apparatus (200, 300, 400, 500, 600A, 600B) for a thin film fragment (2) of an ultra-high molecular weight polymer thin film including a thin film for separating a storage battery, a supply device (202, 304, 402, 502), and a pulverizing device (203, 306, 403a, 403b, 503), the supply device (202, 304, 402, 502) supplies the thin film fragment (2) of the ultra-high molecular weight polymer thin film to the pulverizing device (203, 306, 403a, 403b, 503), the pulverizing device (203, 306, 403a, 403b, 503) includes at least one cutting plate (620) having a plurality of cutting openings (628) and a plurality of cutting protrusions (626), and at least one cutting protrusion (626) extends near the assigned cutting opening (628), the pulverizing device (203, 306, 403a, 403b, 503) generates relative movement between the supplied thin film fragment (2) and the cutting plate (620) to pulverize the thin film fragment (2), and is characterized in that it is a thin film fragment reprocessing device.
2. The thin film fragment reprocessing device according to claim 1, further comprising a control device for controlling the supply speed and / or supply amount of the supply device (202, 304, 402, 502).
3. The pulverizing device (203, 306, 403a, 403b, 503) relatively moves the thin film fragment (2) with respect to the cutting plate (620), and the cutting plate (620) is rotatably provided. The thin film fragment reprocessing device according to claim 1 or 2.
4. The pulverizing device (203, 306, 403a, 403b, 503) includes at least one rotary cutter (622) and at least one arbitrary fixed cutting tool (623). The thin film fragment reprocessing device according to any one of claims 1 to 3.
5. The cutting opening (628) has an equivalent diameter in the range of 0.5 mm to 1.5 mm or 0.8 mm to 1 mm. The thin film fragment reprocessing device according to any one of claims 1 to 4.
6. The cutting openings (628) are arranged in a row, and the vertical interval (v) between the rows of cutting openings (628) has a range of 1 mm to 3.6 mm or 1.5 mm to 2.4 mm. The horizontal interval (t s ) of the cutting openings (628) columns has a range of 2 mm to 4.2 mm or a range of 1.8 mm to 2.8 mm, and The horizontal gap (t r ) between the cutting openings (628) of adjacent columns in the vertical direction is arranged to be separated from each other by a range of 0.4 mm to 2.1 mm or a range of 0.6 mm to 1.4 mm. The thin film fragment reprocessing apparatus according to any one of claims 1 to 5.
7. Each cutting protrusion (626) having a cutting edge (627) is preferably a punching cutting protrusion (626). The thin film fragment reprocessing device according to any one of claims 1 to 6.
8. The thin film fragment reprocessing apparatus according to any one of claims 1 to 7, comprising a conveying device (204, 307, 404a, 404b, 504, 508) for removing the thin film fragments (2) from the pulverizing device (203, 306, 403a, 403b, 503).
9. The thin film fragment reprocessing apparatus according to any one of claims 1 to 8, comprising a packaging device for packaging and storing or temporarily storing the thin film fragments (2).
10. The thin film fragment reprocessing apparatus according to any one of claims 1 to 9, comprising a weighing device (313, 512) for weighing the thin film fragments (2) and supplying them to the extruder (10).
11. The supply device (304, 502a, 502b) automatically collects the thin film fragments (2), particularly the edge side of the thin film fragments (2), and supplies them to the pulverizing device (203, 306, 403a, 403b, 503). The thin film fragment reprocessing apparatus according to any one of claims 1 to 10.
12. Preferably, in a thin film fragment reprocessing method for reprocessing thin film fragments (2) of a ultra-high molecular weight polymer thin film including a thin film for separating a storage battery used in the thin film fragment reprocessing apparatus according to any one of claims 1 to 11, A step of preparing at least one kind of thin film fragment (1, 2) of an ultra-high molecular weight polymer; A step of supplying the polymer thin film fragment (2) to a pulverizing device (203, 306, 403a, 403b, 503) having a plurality of cutting openings (628) and at least one cutting protrusion (626) assigned to the plurality of cutting openings (628), and the plurality of cutting protrusions (626) extending near the cutting openings (628); A step of pulverizing the thin film fragment (2) by the pulverizing device (203, 306, 403a, 403b, 503); A thin film fragment reprocessing method characterized by including a step of generating relative movement between the supplied thin film fragment (2) and the cutting plate (620) during pulverization.
13. The step of pulverizing the supplied thin film fragment includes a step of pulverizing the thin film fragment by at least one rotary cutter, and a step of pulverizing the thin film fragment by the rotary cutter before pulverization by the cutting plate. The thin film fragment reprocessing method according to claim 12.
14. The thin film fragment reprocessing method according to claim 12 or 13, including a step of controlling the supply speed and / or supply amount of the supply device and / or the output of the pulverizing device.
15. A step of packaging the pulverized thin film fragment; A step of supplying the crushed thin film fragments to an extruder to produce a thin film is included. The thin film fragment reprocessing method according to any one of claims 12 to 14, wherein the volume of the thin film fragments to be crushed reaches 1% to 50% by weight of the individual volume of the extruded thin film.
Citation Information
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