Manufacturing method of light-emitting device

Abstract

To provide a manufacturing method for a light-emitting device that can increase manufacturing efficiency.SOLUTION: A method for manufacturing a light-emitting device includes the steps of: preparing an aggregate substrate including an outer frame, at least one substrate portion located inside the outer frame in a planar view, a substrate including a connection portion connecting the outer frame to the substrate portion or between the substrate portions, and a light source arranged on the upper surface of the substrate portion, and at least one intended light source portion including the substrate portion and the light source; preparing an aggregate substrate support portion that supports the aggregate substrate and has a substrate suction hole on its upper surface, and placing the aggregate substrate with its lower surface in contact with the upper surface of the aggregate substrate support portion; and cutting at the boundary between the substrate portion and the connection portion to separate the intended light source portion from the aggregate substrate to obtain a light source portion. The step of placing the aggregate substrate includes the step of placing and fixing the aggregate substrate on the aggregate substrate support portion such that the substrate suction hole is located in a position excluding the substrate portion in a planar view.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a light-emitting device.

Background Art

[0002] A light-emitting device in which a lens is adhered to a substrate on which a light-emitting element is disposed is known (see, for example, Patent Document 1). In such a light-emitting device, it is required to improve manufacturing efficiency.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] A method for manufacturing a light-emitting device according to an embodiment of the present disclosure aims to provide a method for manufacturing a light-emitting device capable of improving manufacturing efficiency.

Means for Solving the Problems

[0005] A method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes: a step of preparing an integrated substrate, the integrated substrate including: a substrate including an outer frame, at least one substrate portion located inside the outer frame in a plan view, and a connection portion connecting the outer frame and the substrate portion or between the substrate portions; a light source disposed on an upper surface of the substrate portion; a step of preparing an integrated substrate including at least one light source portion planned portion including the substrate portion and the light source; a step of supporting the integrated substrate and preparing an integrated substrate support portion having a substrate suction hole on an upper surface, and disposing the integrated substrate in a state where a lower surface of the integrated substrate is in contact with the upper surface of the integrated substrate support portion; A step of separating the light source unit planned portion from the integrated substrate by cutting at the boundary between the substrate portion and the connection portion to obtain a light source unit; comprising; The step of disposing the integrated substrate is; a step of disposing and fixing the integrated substrate on the integrated substrate support portion such that the substrate suction holes are disposed at positions excluding the substrate portion in a plan view.

Advantages of the Invention

[0006] A method for manufacturing a light-emitting device according to an embodiment of the present disclosure can provide a method for manufacturing a light-emitting device capable of improving manufacturing efficiency.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

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Figure 10

Figure 11

Figure 12

Figure 13

Mode for Carrying Out the Invention

[0008] Hereinafter, embodiments according to the present disclosure will be described with reference to the drawings. Note that the manufacturing method of the light-emitting device according to the present disclosure described below is for embodying the technical idea of the present disclosure, and unless otherwise specified, the present disclosure is not limited to the following. In each drawing, members having the same function may be given the same reference numerals. For the sake of easy explanation or understanding of the gist, the embodiments may be shown separately for convenience, but partial substitution or combination of the configurations shown in different embodiments is possible. The size, positional relationship, etc. of the members shown in each drawing may be exaggerated for clarity of explanation. As a cross-sectional view, an end view showing only the cut surface may be used.

[0009] (Light-emitting device) As shown in FIGS. 1 and 2, the light-emitting device 1 manufactured by the manufacturing method of the light-emitting device according to Embodiments 1 and 2 of the present embodiment includes, for example, a light source unit 10 including a substrate 2 and a light source 13 disposed on the upper surface of the substrate 2, and a lens member 5 disposed on the substrate 2 so as to cover the light source 13.

[0010] (Substrate) The substrate 2 is a member on which the light source 13 is disposed. The substrate 2 includes a base 3 and a wiring 4. The substrate 2 has an upper surface 3a, a lower surface 3b, and a side surface 3c connecting the upper surface 3a and the lower surface 3b. The substrate 2 is, for example, a flat member. The thickness of the substrate 20 is, for example, 0.15 mm or more and 0.30 mm or less. The substrate 2 is enclosed by the lens member 5 in a top view. As shown in FIG. 2, the wiring 4 is disposed on the upper surface 3a and the lower surface 3b of the substrate 2. The wiring 4 includes a first wiring 4a disposed on the upper surface 3a of the substrate 2 and a second wiring 4b disposed on the lower surface 3b of the substrate 2. The first wiring 4a and the second wiring 4b are electrically connected via an inner layer wiring such as a via. The light-emitting element 13a is electrically connected to the first wiring 4a. The second wiring 4b functions as an external electrode of the light-emitting device 1. Examples of the base body 3 include ceramic substrates such as aluminum nitride, silicon nitride, and aluminum oxide, and resin substrates such as aluminum and glass epoxy. The wiring 4 is a wiring that supplies power to the light-emitting element 13a and is patterned in a predetermined shape on the upper surface of the base body 3. The wiring 4 can be made of a metal material. For example, a single metal such as gold (Au), silver (Ag), aluminum (Al), nickel (Ni), rhodium (Rh), copper (Cu), titanium (Ti), platinum (Pt), palladium (Pd), molybdenum (Mo), chromium (Cr), tungsten (W), or an alloy containing these metals can be preferably used.

[0011] (Light source) In the light-emitting device 1, a light source 13 including the light-emitting element 13a is disposed on the substrate 2. The light source 13 includes at least one light-emitting element 13a. Here, the light source 13 includes the light-emitting element 13a, a covering member 15 that covers the side surface of the light-emitting element 13a, and a light-transmitting member 14 disposed on the upper surface of the light-emitting element 13a. The upper surface of the light-transmitting member 14 serves as the light-emitting surface of the light source 13 and is exposed from the covering member 15. The light source 13 is, for example, substantially rectangular parallelepiped in shape, has a light-emitting surface on the upper surface, and positive and negative electrodes 13b on the lower surface. The light source 13 is disposed on the substrate 2 via a bonding member 12 known in the art such as solder or bumps. Here, two light sources 13 are disposed on the substrate 2 with their side surfaces facing each other.

[0012] (Light-emitting element) The light-emitting element 13a includes a translucent support substrate such as sapphire and a semiconductor structure. The semiconductor structure includes, for example, an n-side semiconductor layer, an active layer, and a p-side semiconductor layer in this order from the support substrate side. As the light-emitting element 13a capable of emitting ultraviolet light or visible light, for example, In X Al Y Ga 1-X-Y It includes semiconductors of all compositions in which the composition ratios X and Y are changed within their respective ranges in the chemical formula consisting of N (0≦X, 0≦Y, X+Y≦1). The semiconductor structure may include a plurality of light-emitting portions including an n-side semiconductor layer, an active layer, and a p-side semiconductor layer. When the semiconductor structure includes a plurality of light-emitting portions, each light-emitting portion may include a well layer having a different emission peak wavelength or a well layer having the same emission peak wavelength. Note that the planar shape of the light-emitting element 13a is, for example, a rectangular shape, but may be a polygon such as a circular shape, an elliptical shape, a triangular shape, or a hexagonal shape. The light-emitting element 13a preferably has positive and negative electrodes on the same surface side, whereby flip chip mounting on the substrate 2 can be performed.

[0013] (Translucent member) The light-transmitting member 14 is a plate-shaped member having a substantially rectangular shape in plan view, and is disposed on the light-emitting element 13a so as to cover the upper surface of the light-emitting element 13a. As the light-transmitting member 14, a light-transmitting resin, an inorganic substance such as ceramics or glass can be used. As the resin, a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenolic resin can be used. Further, a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a methylpentene resin, or a polynorbornene resin can be used. Among them, a silicone resin or a modified resin thereof having excellent light resistance and heat resistance can be preferably used. Here, the light transmittance refers to the property of being able to transmit 60% or more of the light from the light-emitting element 13a. Further, the light-transmitting member 14 may contain a light-diffusing member or a phosphor that wavelength-converts at least a part of the light from the light-emitting element 13a. Examples of the light-transmitting member 14 containing a phosphor include those in which a phosphor is contained in the above-described resin material, ceramics, glass, etc., and a sintered body of a phosphor.

[0014] Examples of the phosphor include yttrium aluminum garnet-based phosphors (for example, Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (for example, Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (for example, Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (for example, Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (for example, Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphors (for example, Ca8MgSi4O 16 Cl2:Eu), β-sialon-based phosphors (for example, (Si,Al)3(O,N)4:Eu) or α-sialon-based phosphors (for example, Ca(Si,Al) 12 (O,N) 16Oxynitride-based phosphors such as (Eu), SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu), SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu), or nitride-based phosphors such as BSESN-based phosphors ((Ba,Sr)2Si5N8), KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2Si 0.99 Al 0.01 F 5.99 :Mn), or fluoride-based phosphors such as MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), phosphors having a perovskite structure (e.g., CsPb(F,Cl,Br,I)3), or quantum dot phosphors (e.g., CdSe, InP, AgInS 2、 AgInSe 2、 AgInGaS2 or CuAgInS2), etc. can be used.

[0015] For example, a blue light-emitting element can be used as the light-emitting element 13a, and a light source 13 that emits white light can be obtained by including a yellow phosphor in the light-transmitting member 14. As the light-diffusing member included in the light-transmitting member 14, for example, titanium oxide, barium titanate, aluminum oxide, silicon oxide, etc. can be used. The light-transmitting member 14 may have a laminated structure including a light-transmitting layer containing a phosphor and / or a light-transmitting layer containing a light-diffusing member.

[0016] (Coating member) The covering member 15 is a member that protects the side surface of the light-emitting element 13a, and directly or indirectly covers the side surface of the light-emitting element 13a. The covering member 15 may further cover the side surface of the light-transmitting member 14. The upper surface of the light-transmitting member 14 is exposed from the covering member 15 and constitutes the light-emitting surface (i.e., the main light extraction surface) of the light source 13. From the viewpoint of light extraction efficiency, it is preferable that the covering member 15 has high light reflectivity. For the covering member 15, for example, a resin containing a light-reflective substance can be used. Examples of the light-reflective substance include titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, aluminum nitride, boron nitride, zinc oxide, mullite, etc. As the resin, it is preferable to use a resin mainly composed of a thermosetting resin such as an epoxy resin, a silicone resin, a silicone-modified resin, or a phenol resin as the base material. Note that the covering member 15 can also be composed of a member having translucency to visible light as needed. Further, the covering member 15 can contain, as needed, in addition to the light-reflective substance, a light-absorbing substance such as carbon, a pigment, or the above-described phosphor.

[0017] (Electronic component) As shown in FIG. 1, the light-emitting device 1 may include an electronic component 11 in addition to the light-emitting element 13a. The electronic component 11 is, for example, a light-receiving element, a protection element, a capacitor, a thermistor, or the like. A plurality of each of the electronic components 11 may be provided. Similar to the light-emitting element 13a, the electronic component 11 can be arranged on the wiring 4 of the substrate 2.

[0018] (Lens member) The lens member 5 is a member for emitting the light emitted from the light source 13 in a predetermined direction. The lens member 5 mainly includes an optical function portion 6 through which the light emitted from the light source 13 passes, and a lens support portion 7 that surrounds the optical function portion 6 and supports the optical function portion 6. The lens support portion 7 is fixed to the substrate 2 via an adhesive member such as a resin. As the adhesive member, it is preferable to use a translucent resin, and for example, a silicone resin can be preferably used.

[0019] The optical functional unit 6 is, for example, a lens having a circular shape in a top view. As shown in FIG. 1, the optical functional unit 6 is arranged at a position overlapping at least the light source 13 in a top view. Here, as an example, a Fresnel lens is used for the optical functional unit 6. The Fresnel lens is arranged such that the lower surface with unevenness is directed toward the light source 13, the light emitted from the light source 13 is incident thereon, and the light is emitted from the flat upper surface. By using a Fresnel lens as the optical functional unit 6, the thickness of the optical functional unit 6 can be reduced. Thereby, the light-emitting device 1 can be miniaturized. Further, by reducing the thickness of the optical functional unit 6, it becomes easier to arrange an air layer between the optical functional unit 6 and the light source 13. By arranging the air layer, the spread of the light from the light source 13 can be adjusted. Note that the optical functional unit 6 may have a plurality of lens units each having an optical axis corresponding to each light source according to the number of the light sources 13. As an example, when the light-emitting device 1 includes two light sources 13, the optical functional unit 6 is configured by a compound-eye lens including two lenses each configured by a Fresnel lens.

[0020] As shown in FIG. 2, the lens support portion 7 is continuous with the optical functional unit 6. The lens member 5 may be separate from the optical functional unit 6 and the lens support portion 7, but it is preferable that the optical functional unit 6 and the lens support portion 7 are integrated. Thereby, the positioning between the optical functional unit 6 and the light source 13 can be performed with high accuracy. The lens support portion 7 is joined to the substrate 2. The lens support portion 7 is joined to at least the outer periphery and the side surface 3c of the upper surface 3a of the substrate 2 via an adhesive member. The lens support portion 7 extends laterally from the outer edge of the optical functional unit 6 and is arranged so as to surround the optical functional unit 6 in a top view. Here, the upper surface of the optical functional unit 6 is flat, and the upper surface of the lens support portion 7 is arranged to be at the same height as the optical functional unit 6. The lens support portion 7 has a stepped portion 8 continuous with the lower surface 7a on the lower surface 7a side. The stepped portion 8 is a concave portion having a shape along the outer periphery and the side surface 3c of the upper surface of the substrate 2. The outer periphery and the side surface 3c of the upper surface 3a of the substrate 2 are arranged in the stepped portion 8, and the stepped portion 8 and the outer periphery and the side surface 3c of the upper surface of the substrate 2 are joined via an adhesive member. Thereby, the lens member 5 and the substrate 2 are fixed.

[0021] 2. Manufacturing method according to the embodiment The manufacturing method of the light-emitting device according to the present embodiment is as follows (1) A step of preparing an integrated substrate, which includes a substrate including an outer frame, at least one substrate portion located inside the outer frame in a plan view, and a connecting portion connecting the outer frame and the substrate portion or between the substrate portions, and a light source disposed on the upper surface of the substrate portion, and a step of preparing an integrated substrate including at least one light source portion planned portion including the substrate portion and the light source; (2) A step of preparing an integrated substrate support portion that supports the integrated substrate and has a substrate suction hole on the upper surface, and disposing the integrated substrate in a state where the lower surface of the integrated substrate is in contact with the upper surface of the integrated substrate support portion; (3) A step of separating the light source portion planned portion from the integrated substrate by cutting at the boundary between the substrate portion and the connecting portion to obtain the light source portion. It includes the above steps. And the step of disposing the integrated substrate includes a step of disposing and fixing the integrated substrate on the integrated substrate support portion so that the substrate suction hole is disposed at a position excluding the substrate portion in a plan view. In the manufacturing method of the light-emitting device according to the present disclosure configured as described above, since the integrated substrate is disposed and fixed on the integrated substrate support portion so that the substrate suction hole is disposed at a position excluding the substrate portion, it is possible to reduce the scattering of dust generated when cutting at the boundary between the substrate portion and the connecting portion to the periphery of the substrate portion, and it is possible to reduce the dust adhering to the light source portion planned portion. As a result, the amount of dust adhering to the light source portion planned portion can be reduced, so the working time for removing dust adhering to the light source portion planned portion can be shortened, and the manufacturing efficiency can be improved. In addition, since the number of defective products due to dust adhering to the light source portion planned portion can be reduced, the yield can be improved, and the manufacturing efficiency can be improved.

[0022] Here, the step of obtaining the light source unit includes, for example, in the integrated substrate, a step of irradiating a laser beam to a connection portion located on the outer periphery of the substrate portion to cut the connection portion. Further, the step of disposing the integrated substrate includes, for example, an outer frame support portion that supports the outer frame, a connection portion support portion that supports the connection portion, and a substrate portion support portion that supports the substrate portion, which are disposed with a gap therebetween, and at least one of the outer frame support portion and the connection portion support portion is provided with a substrate suction hole, and includes a step of preparing an integrated substrate support portion in which an opening of the substrate suction hole is located on the upper surface of at least one of the outer frame support portion and the connection portion support portion. Hereinafter, the manufacturing method of the light emitting device according to the embodiment will be described in detail with reference to the drawings.

[0023] Embodiment 1 (1) Step of preparing an integrated substrate In the step of preparing the integrated substrate, an integrated substrate including at least one light source unit candidate portion including a substrate portion and a light source is prepared as follows. In the following description, an integrated substrate including a plurality of light source unit candidate portions will be described as an example.

[0024] (1-1) Substrate preparation First, prepare a substrate 20 shown in FIG. 3. The substrate 20 includes an outer frame 23, a plurality of substrate portions 21 located inside the outer frame 23, and a connection portion 22 that connects the outer frame 23 and the substrate portion 21 or between the substrate portions 21. Here, FIG. 3 is a top view of the substrate 20 including a plurality of substrate portions 21. In FIG. 3, the circular two-dot chain line indicates the outer periphery of the substrate portion 21, in other words, the boundary between the substrate portion 21 and the connection portion 22. Further, in FIG. 3, the portion separated by the rectangular two-dot chain line is a unit region including one substrate portion 21, and the unit region includes one substrate portion 21 and the connection portion 22 located around the substrate portion. In the substrate 20, the portion located between the outermost two-dot chain line and the outer periphery is the outer frame 23. Here, in this specification, a substrate including the substrate portion 21, the outer frame 23, and the connection portion 22 is denoted by reference numeral 20 to distinguish it from the substrate 2 in each of the light emitting devices 1 shown in FIGS. 1 and 2. The plurality of substrate portions 21 are arranged separately from each other via the connection portion 22.

[0025] In the substrate 20, the substrate portion 21 is arranged, for example, in a matrix of n rows and m columns (n ≥ 2, m ≥ 2). As shown in FIG. 3, the frame portions 22 are connected between adjacent unit regions. Note that the unit regions may be square unit regions or rectangular unit regions. Also, the unit regions are not limited to rectangles and may be, for example, hexagons or the like. When the unit region is a hexagon, for example, the substrate portions are arranged such that the centers of the substrate portions coincide with the lattice points of a hexagonal lattice. Hereinafter, the shapes and arrangements of the substrate portion 21 and the frame portion 22 will be described by taking as an example a rectangular unit region arranged in a matrix of n rows and m columns (n ≥ 2, m ≥ 2).

[0026] (1-2) Light source arrangement The light sources 13 are respectively arranged on the substrate portions 21 of the prepared substrate 20. Thereby, an assembled substrate M20 including a plurality of light source unit planned portions P10 in which the light sources 13 are provided on the substrate portions 21 can be prepared. Note that, in FIG. 4, an assembled substrate M20 in which the light sources 13 are arranged on each substrate portion 21 is illustrated, but electronic components 11 may be arranged in addition to the light sources 13 on each substrate portion 21.

[0027] (2) Step of arranging the assembled substrate (2-1) Step of preparing an assembled substrate support portion Here, an assembled substrate support portion having a substrate suction hole on the upper surface and sucking and supporting the assembled substrate through the substrate suction hole on the upper surface is prepared. As described above, the substrate suction hole is arranged at a position excluding the portion that supports the substrate portion in a plan view. FIG. 5 is a top view of the assembled substrate support portion 30 of Embodiment 1. Hereinafter, the assembled substrate support portion 30 of Embodiment 1 will be described with reference to FIG. 5. As shown in FIG. 5, the assembled substrate support portion 30 includes a base portion 34, an outer frame support portion 33 provided on the base portion 34 and supporting the outer frame 23 of the assembled substrate M20, a connection portion support portion 32 supporting the connection portion 22 of the assembled substrate M20, and a substrate portion support portion 31 supporting the substrate portion 21. And in the assembled substrate support portion 30 of Embodiment 1, a substrate suction hole 37 is provided in the outer frame support portion 33. The substrate suction hole 37 is provided on the upper surface of the outer frame support portion 33 such that the opening of the substrate suction hole 37 is positioned thereon. Thereby, with the lower surface of the assembled substrate M20 in close contact with the upper surface of the outer frame support portion 33 (the portion excluding the opening of the substrate suction hole) on the upper surface of the outer frame support portion 33, the assembled substrate M20 can be sucked and fixed. The substrate portion support portion 31 and the connection portion support portion 32 are each provided, for example, in a cylindrical shape protruding on the base portion 34. Further, the substrate portion support portion 31 is provided at a position that supports the substrate portion 21 when the assembled substrate M20 is disposed. For example, when the substrate portions 21 in the assembled substrate M20 are arranged in a matrix of, for example, n rows and m columns (n≥2, m≥2), the substrate portion support portions 31 are also arranged in a matrix of n rows and m columns (n≥2, m≥2) on the base portion 37.

[0028] The connection portion support portion 32 is provided, for example, at a position separated from the substrate portion support portion 31 between four adjacent substrate portion support portions 31. The connection portion support portion 32 may be provided at all positions between four adjacent substrate portion support portions 31, or may be provided at every other position between four adjacent substrate portion support portions 31 as shown in FIG. 5.

[0029] According to the assembled substrate support portion 30 configured as described above, when the assembled substrate M20 is disposed on the assembled substrate support portion 30, the outer frame 23 of the assembled substrate M20 can be sucked by the substrate suction hole 37 to fix the assembled substrate M20. Here, in the first embodiment, an example in which the substrate suction hole 37 is provided in the outer frame support portion 33 of the assembled substrate support portion 30 has been shown. However, the substrate suction hole 37 may be provided not only in the outer frame support portion 33 but also in the connection portion support portion 32, or the substrate suction hole 37 may be provided in the connection portion support portion 32 instead of the outer frame support portion 33. When the substrate suction hole is provided in the connection portion support portion 32, the substrate suction hole 37 is provided such that the opening of the substrate suction hole opens on the upper surface of the connection portion support portion 32.

[0030] The collective substrate support portion 30 is configured such that when the collective substrate M20 is placed on the collective substrate support portion 30, a closed space is formed within the space surrounded by the collective substrate M20 and the collective substrate support portion 30, and this closed space can be made into a negative pressure when the collective substrate M20 is sucked by the substrate suction holes 37. The collective substrate support portion 30 preferably further includes a communication portion 38 that connects the substrate suction holes 37 and the above-mentioned space. Here, the communication portion 38 is provided to include an opening that opens on the side surface (inner surface) of the outer frame support portion 33. Also, in the collective substrate support portion 30 shown in FIG. 5, the closed space that can be made into a negative pressure when the collective substrate M20 is sucked by the substrate suction holes 37 is, for example, the space surrounded by the collective substrate M20, the outer frame support portion 33, and the base portion 34. According to the collective substrate support portion 30 configured as described above, in the process of obtaining the light source portion described later, the closed space can be made into a negative pressure by the communication portion 38, and the collective substrate M20 can be effectively fixed on the collective substrate support portion 30. Here, the closed space only needs to be able to be made into a negative pressure smaller than the external air pressure (for example, atmospheric pressure) when the collective substrate M20 is adsorbed by the substrate suction holes 37. Preferably, it is a space that can be made into a negative pressure of -0.2 atm or less based on atmospheric pressure. As long as it can be made into the above-mentioned negative pressure, it may include air vents or the like. For example, in the collective substrate support portion 30, when the collective substrate M20 is placed on the upper surface of the collective substrate support portion 30, the lower surface of the outer frame 23 of the collective substrate M20 is configured to contact the portion of the upper surface of the outer frame support portion 33 excluding the opening of the substrate suction holes 37, and the base portion 34 is configured by a flat plate facing the entire lower surface of the collective substrate M20, thereby forming a closed space. Here, the collective substrate support portion 30 is preferably configured such that the closed space is not connected to the external space except through the communication portion 38, whereby the closed space can be easily made into a low negative pressure.

[0031] Also, when creating a negative pressure in a closed space formed by the collective substrate M20, the outer frame support portion 33, the base portion 34, etc., as shown in FIG. 5, the collective substrate support portion 30 may be provided with a separation portion 33a that divides the closed space into a plurality of parts. By making the upper surface of the separation portion 33a contact the lower surface of the collective substrate M20, the volume of the closed space in the negative pressure state can be reduced, and the collective substrate M20 can be more effectively fixed on the collective substrate support portion 30. In addition, when the substrate suction hole 37 is provided in the connection portion support portion 32, the communication portion 38 is provided so as to open on the side surface of the connection portion support portion 32. Also, as shown in FIG. 5, the communication portion 38 is preferably provided so as to open on the upper surface side of the side surface of the outer frame support portion 33 or the connection portion support portion 32. This makes it easier to separate the dust deposited on the base portion 34 from the opening of the communication portion 38, and can reduce the clogging of the opening of the communication portion 38 with dust. As a result, the number of times of cleaning the communication portion 38 and the substrate suction hole 37 can be reduced, and the manufacturing efficiency can be improved.

[0032] (2-2) Step of arranging the collective substrate Here, the collective substrate M20 is arranged on the collective substrate support portion 30 in a state where the lower surface of the collective substrate M20 is in contact with the upper surface of the collective substrate support portion 30, and the collective substrate M20 is adsorbed and fixed by the substrate suction hole 37. The adsorption of the collective substrate M20 by the substrate suction hole 37 is, for example, adsorbed in a state where the negative pressure is -0.2 atm or less based on the atmospheric pressure. The step of arranging the collective substrate may further include a step of arranging a pressing portion that presses the collective substrate M20 from above when the collective substrate M20 is arranged on the collective substrate support portion 30. Thereby, the collective substrate M20 can be more firmly fixed on the collective substrate support portion 30. The pressing portion is arranged, for example, above the outer frame support portion 33 or the connection portion support portion 32 provided with the substrate suction hole 37 connected to the communication portion 38.

[0033] (3) Step of obtaining the light source unit Here, with the integrated substrate M20 fixed on the integrated substrate support portion 30, the light source unit 10 is obtained by separating the light source unit planned portion P10 from the integrated substrate M20 by cutting at the boundary between the substrate portion 21 and the connection portion 22. When the integrated substrate M20 includes two or more light source unit planned parts P10, the step of obtaining the light source unit preferably includes: a first removal step of removing a part of the connection part 22 in the height direction at the outer periphery of each of the two or more substrate parts 21; and a second removal step of separating the light source unit planned part P10 by removing the remaining part of the connection part 22 in the height direction. FIG. 11 is a top view schematically showing the state when the first removal step is being carried out, and FIG. 12 is a top view schematically showing the state when the second removal step is being carried out. Here, the hatched part in FIG. 11 indicates that the lower part of the cut part remains without being removed, showing that the closed space is maintained at a negative pressure without being connected to the external space at the outer peripheral part of the substrate part 21. Also, the part shown in white at the outer peripheral part of the substrate part 21 in FIG. 12 indicates that the lower part of the cut part has been removed and penetrated, showing that the closed space at the outer peripheral part of the cut substrate part 21 is connected to the external space. By including the first removal step and the second removal step in this way, in a state where the negative pressure of the above-mentioned closed space is effectively maintained, that is, in a state where the integrated substrate M20 is more firmly fixed on the integrated substrate support part 30, the first removal step can be carried out, and the separation of the light source unit 10 in the step of obtaining the light source unit can be efficiently carried out, so that the manufacturing efficiency can be improved. For example, if all of the connection parts 22 in the height direction are removed at once at the outer periphery of each of the two or more substrate parts 21, as the number of separated substrate parts 21 increases, the closed space and the external space are connected by the separation part, the negative pressure state of the closed space decreases, and the stability of the fixation of the integrated substrate M20 on the integrated substrate support part 30 decreases. When the stability of the fixation of the integrated substrate M20 decreases, it is necessary to, for example, reduce the irradiation intensity of the laser so that a large force is not applied to the substrate part during the separation of the substrate part 21, and there is a possibility that the separation will take time.However, as described above, by performing the first removal step and the second removal step separately, the negative pressure state in the closed space is maintained at a relatively low level, that is, in a state where the assembled substrate M20 is more firmly fixed on the assembled substrate support portion 30. The first removal step can be carried out with a high laser irradiation intensity in a short time, and then the second removal step can be carried out with a low laser irradiation intensity. Therefore, the separation step can be separated in a short time without reducing the yield. This is the same even when separating by means other than laser irradiation. For example, even when separating mechanically by grinding or the like, a similar effect can be obtained by increasing the grinding amount in the first removal step and decreasing the grinding amount in the second removal step.

[0034] Hereinafter, the case of separating by laser irradiation will be described. The laser beam is preferably irradiated perpendicularly to the upper surface of the substrate portion 21 along the outer peripheral line of the substrate portion 21. The laser beam is, for example, pulsed laser light. The pulse width P of the pulsed laser light is, for example, 15 picoseconds or more and 90 nanoseconds or less, and preferably 5 nanoseconds or more and 75 nanoseconds or less. The frequency F of the pulsed laser light is, for example, 300 kHz or more and 500 kHz or less. The intensity of the pulsed laser light is, for example, 4 W or more and 10 W or less. The laser irradiation may include a plurality of one-pass irradiations in which the laser beam is scanned once along the outer peripheral line C1 of the substrate portion 21 and irradiated. In this case, after performing one-pass irradiation on the entire unit area, it is preferable to perform the second one-pass irradiation on the entire unit area, and then repeat the one-pass irradiation on the entire unit area. By repeating the one-pass irradiation over the entire unit area in this way, the temperature rise due to the laser irradiation in the unit area can be reduced, and the deformation and / or breakage of the substrate portion 21 due to the temperature rise can be reduced. Note that after performing one-pass irradiation a plurality of times for each unit area, it may be moved to an adjacent unit area and one-pass irradiation may be performed a plurality of times in the unit area, and the unit areas may be sequentially moved. The number of times of performing one-pass irradiation is appropriately set according to, for example, the material of the substrate 20 and the above-described respective irradiation conditions, but is, for example, 10 times or more and 40 times or less. The width at which the substrate portion 21 and the connection portion 22 are separated by laser irradiation is, for example, 0.01 mm or more and 0.1 mm or less, preferably 0.01 mm or more and 0.05 mm or less. In addition, when including the above-described first removal step and second removal step and separating the substrate portion 21 by laser irradiation, for example, the first removal step includes a plurality of passes of the one-pass irradiation described above, and the second removal step includes one or a plurality of passes of the one-pass irradiation described above. In this case, for example, the laser irradiation intensity in the first removal step may be made higher than the laser irradiation intensity in the second removal step.

[0035] In the step of obtaining the light source portion, when the collective substrate M20 includes a plurality of light source portion planned portions P10, the light source portion planned portions P10 are, in order from the one arranged at the central portion. In other words, the light source portion planned portion P10 arranged at the central portion away from the outer frame 33 provided with the substrate suction hole 37 is separated first, and the light source portion planned portions P10 arranged in a spiral shape in a plan view from the central portion are separated in order, and finally the light source portion planned portion P10 arranged on the outermost side along the outer frame 33 is separated. Thereby, it becomes possible to separate the light source portion planned portion P10 to be separated in a more securely fixed state, and it is possible to separate efficiently and reduce the occurrence of defective products due to separation. In addition, when the separation unit 33a that divides the closed space in the collective substrate support unit 30 into a plurality is provided and the substrate suction hole is provided in the separation unit 33a, for example, it is preferable to separate in order from the light source portion planned portion P10 closer to the central portion in each separated closed space. Also, when including the above-described first removal step and second removal step, for example, after the first removal step is performed in order from the central portion toward the outside, the second removal step is performed in order from the central portion toward the outside.

[0036] (5) Lens member arrangement step In the lens member arranging step, as shown in FIG. 11, the lens member 5 is arranged above the light source 13 on the substrate portion 21. For example, the outer peripheral side surface 21c of the substrate portion 21 and the lens member 5 can be adhered via an adhesive member. The alignment of the lens member 5 can be performed by positioning the outer periphery and the side surface 3c of the upper surface 3a of the substrate 2 within the step portion 8 of the lens support portion 7. As described above, the light emitting device 1 shown in FIGS. 1 and 2 can be manufactured.

[0037] In the manufacturing method of the above-described Embodiment 1, in the collective substrate support portion 30, since the substrate suction hole 37 is provided in the outer frame 33 which is a position excluding the substrate portion support portion 31, when separating the substrate portion 21 in a state where the collective substrate M20 is fixed on the collective substrate support portion 30, the scattering of dust generated around the substrate portion 21 can be reduced. Thereby, the amount of dust adhering to the separated light source portion 2, particularly the substrate portion 21 of the light source portion 2, can be reduced, the removal of the dust adhering to the separated light source portion 2, particularly the substrate portion 21 of the light source portion 2, can be efficiently performed in a short time, and defective products due to dust adhesion can be reduced. Therefore, according to the manufacturing method of the light emitting device according to Embodiment 1 of the present disclosure, the manufacturing efficiency can be increased.

[0038] Manufacturing method of Embodiment 2 The manufacturing method of Embodiment 2 of the present disclosure is the same as the manufacturing method of Embodiment 1 except that the step of arranging the collective substrate and the step of obtaining the light source portion are different from those of the manufacturing method of Embodiment 1. Hereinafter, the parts different from the manufacturing method of Embodiment 1 will be described with reference to FIGS. 8 to 10. (2a) Step of arranging the collective substrate (2a-1) Preparation of the collective substrate support portion Here, the collective substrate support portion 30a shown in FIGS. 8 to 10 is prepared. The collective substrate support portion 30a includes a base portion 34a, an outer frame support portion 33a provided on the base portion 34a for supporting the outer frame 23 of the collective substrate M20, a connection portion support portion 32a for supporting the connection portion 22 of the collective substrate M20, and a substrate portion support portion 31a for supporting the substrate portion 21. And as shown in FIG. 9, in the collective substrate support portion 30a of Embodiment 2, substrate suction holes 37a are respectively provided in the connection portion support portions 32a. The substrate suction holes 37a are provided such that the opening of the substrate suction hole is located on the upper surface of the connection portion support portion 32a and penetrates the base portion 34a. Thereby, the lower surface of the collective substrate M20 can be attracted to the upper surface of the connection portion support portion 32a in a state where the lower surface of the collective substrate M20 is in close contact with the upper surface of the connection portion support portion 32a (the portion excluding the opening of the substrate suction hole), and the collective substrate M20 can be fixed. In the collective substrate support portion 30a of Embodiment 2, as shown in FIG. 8, the connection portion support portions 32a are provided at all positions between four adjacent substrate portion support portions 31a, and it is preferable to provide the substrate suction holes 37a in all the substrate portion support portions 31a. Thereby, the collective substrate M20 can be fixed more reliably. However, they may be provided at every other position at the positions between four adjacent substrate portion support portions 31. Also, in the collective substrate support portion 30a of Embodiment 2, substrate suction holes may be further provided in the outer frame support portion 33a.

[0039] Also, as shown in FIG. 10, in the collective substrate support portion 30a of Embodiment 2, dust collection suction portions H31 are respectively provided in the substrate portion support portions 31a. By providing the dust collection suction portions H31 in the substrate portion support portions 31a, the dust generated when cutting the substrate portion 21 and the connection portion 22 can be effectively discharged to the outside from the dust collection suction portions H31. The dust collection suction portion H31 is constituted by, for example, a hole through which the internal space sandwiched between the collective substrate support portion 30a and the collective substrate M20 communicates with the external space. The opening, which is the dust suction inlet in the internal space, is provided on the side surface of the substrate portion support portion 31a. The opening of the dust collection suction portion H31 is provided on the side surface of the substrate portion support portion 31a at a position away from the upper surface of the substrate portion support portion 31a, that is, the surface on which the substrate portion 21 of the collective substrate M20 is disposed. Thus, by providing the opening of the dust collection suction portion H31 at a position away from the upper surface of the substrate portion support portion 31a, the adhesion of the dust generated when cutting the substrate portion 21 and the connection portion 22 to the substrate portion 21 can be reduced.

[0040] As shown in Fig. 10, the dust collection suction part H31 may include a plurality of dust collection suction parts including a first dust collection suction part H31a1 having a first opening that opens at a position away from the upper surface of the substrate part support part 31a, and a second dust collection suction part H31a2 having a second opening located below the first opening. When including a plurality of dust collection suction parts, it may include a third dust collection suction part H31b that connects the plurality of dust collection suction parts, thereby simplifying the suction force adjustment and the dust collection mechanism to the dust collector.

[0041] In the collective substrate support part 30a, the outer frame support part 33a may have a ventilation hole H33 that connects the space surrounded by the collective substrate M20 and the collective substrate support part 30a and the external space when the collective substrate M20 is arranged on the collective substrate support part 30a. Thereby, dust can be more effectively collected by the dust collection suction part H31. Here, the ventilation hole H33 has a function of inhaling air from the external space into the space surrounded by the collective substrate M20 and the collective substrate support part 30a so that dust collection by the dust collection suction part H31 can be effectively carried out. On the other hand, the communication part 38 of Embodiment 1 has a function of sucking the space surrounded by the collective substrate M20 and the collective substrate support part 30a to make the closed space have a negative pressure, and the functions of both are different. That is, in Embodiment 2, the collective substrate M20 is arranged on the upper surface of the collective substrate support part 30a, and the space surrounded by the collective substrate M20 and the collective substrate support part 30a is maintained at substantially normal pressure in order to efficiently collect dust. The ventilation hole H33 is provided at the same height as the first dust collection suction part H31a1, for example, so that the central axes of both coincide when viewed from the side. By doing so, the turbulent flow of the substrate sucked by the ventilation hole H33 is reduced, and dust can be efficiently sucked into the first dust collection suction part H31a1. Incidentally, the ventilation hole H33 may be provided at the same height as the second dust collection suction part H31a1, for example, so that the central axes of both coincide when viewed from the side. Also, the configuration or position of the dust collection suction part H31 and the shape or position of the ventilation hole H33 are appropriately set in consideration of the configuration and arrangement of the base part 34a, the outer frame support part 33a, the connection part support part 32a, and the substrate part support part 31a in the collective substrate support part 30a so that dust can be effectively collected by the dust collection suction part H31.

[0042] (2a-2) Step of arranging the integrated substrate Here, with the lower surface of the integrated substrate M20 in contact with the upper surface of the integrated substrate support portion 30a, the integrated substrate M20 is arranged on the integrated substrate support portion 30a, and the integrated substrate M20 is adsorbed and fixed by the substrate suction holes 37a provided in the connection portion support portion 32a. In Embodiment 2, since the substrate suction holes 37a are provided in the connection portion support portions 32a respectively, the integrated substrate M20 can be fixed at a position close to the substrate portion 21, and it is possible to reduce the instability of the substrate portion 21 to be separated when separating the substrate portion 21. That is, in Embodiment 1, when separating the substrate portion 21 by making the closed space between the integrated substrate support portion 30 and the integrated substrate M20 into negative pressure, the instability of the substrate portion 21 to be separated is reduced, whereas in Embodiment 2, even if the space between the integrated substrate support portion 30 and the integrated substrate M20 is at normal pressure, the instability of the substrate portion 21 to be separated can be reduced by adsorbing with the substrate suction holes 37a respectively at positions close to the substrate portion 21.

[0043] (3) Step of obtaining the light source unit Here, with the integrated substrate M20 fixed on the integrated substrate support portion 30a, the light source unit 10 is obtained by separating the light source unit planned portion P10 from the integrated substrate M20 by cutting at the boundary between the substrate portion 21 and the connection portion 22. In Embodiment 2, although the method of fixing the integrated substrate M20 and the dust collection mechanism when implementing the step of obtaining the light source unit are different, the step of obtaining the light source unit is implemented in the same manner as in Embodiment 1. Also, in Embodiment 2, when the integrated substrate M20 includes two or more light source unit planned portions P10, the step of obtaining the light source unit preferably includes a first removing step of removing a part of the connection portion 22 in the height direction at the outer periphery of each of the two or more substrate portions, and a second removing step of separating the light source unit planned portion P10 by removing the remaining part of the connection portion 22 in the height direction. By doing so, the first removing step can be implemented with the integrated substrate M20 more firmly fixed on the integrated substrate support portion 30a, and the separation of the light source unit 10 in the step of obtaining the light source unit can be efficiently implemented, so that the manufacturing efficiency can be improved.

[0044] In the manufacturing method of Embodiment 2 described above, in the integrated substrate support portion 30a, the substrate suction hole 37a is provided in the connection portion support portion 32a. Thereby, with the integrated substrate M20 arranged on the integrated substrate support portion 30a and the periphery of the substrate portion 21 stably fixed, the substrate portion 21 can be separated, and the substrate portion 21 can be separated efficiently. Further, a dust collection suction portion H31 is provided in the substrate portion support portion 31a, and by providing the opening portion of the dust collection suction portion H31 at a position away from the upper surface of the substrate portion support portion 31a, dust generated when separating the substrate portion 21 can be collected without scattering to the periphery of the substrate portion 21. Thereby, the amount of dust adhering to the light source unit 2 after separation, particularly to the substrate portion 21 of the light source unit 2, can be reduced, the removal of dust adhering to the light source unit 2 after separation, particularly to the substrate portion 21 of the light source unit 2, can be efficiently performed in a short time, and defective products due to dust adhesion can be reduced. Therefore, according to the manufacturing method of the light emitting device according to Embodiment 2 of the present disclosure, the manufacturing efficiency can be increased.

[0045] As described above, the preferred embodiments and the like have been described, but the present invention is not limited to the above-described embodiments and the like, and various modifications and substitutions can be made to the above-described embodiments and the like without departing from the scope described in the claims.

[0046] The light emitting device according to the embodiment of the present disclosure includes, for example, the following aspects. [Item 1] A step of preparing an integrated substrate, a substrate including an outer frame, at least one substrate portion located inside the outer frame in a plan view, and a connection portion connecting the outer frame and the substrate portion or between the substrate portions, a light source disposed on the upper surface of the substrate portion, a step of preparing an integrated substrate including at least one light source unit planned portion including the substrate portion and the light source, a step of supporting the integrated substrate and preparing an integrated substrate support portion having a substrate suction hole on the upper surface, and disposing the integrated substrate in a state where the lower surface of the integrated substrate is in contact with the upper surface of the integrated substrate support portion A step of separating a light source unit planned part from the integrated substrate to obtain a light source unit by cutting at a boundary between the substrate part and the connection part; comprising; The step of disposing the integrated substrate is: A method for manufacturing a light-emitting device, including a step of disposing and fixing the integrated substrate on the integrated substrate support part so that the substrate suction hole is disposed at a position excluding the substrate part in a plan view. [Item 2] The step of obtaining the light source unit includes a step of irradiating a laser beam to the connection part located on the outer periphery of the substrate part in the integrated substrate to cut the connection part, according to the method for manufacturing a light-emitting device according to Item 1. [Item 3] The step of disposing the integrated substrate is: Including an outer frame support part that supports the outer frame, a connection part support part that supports the connection part, and a substrate part support part that are disposed with a gap therebetween, and at least one of the outer frame support part and the connection part support part is provided with the substrate suction hole, and preparing the integrated substrate support part in which an opening of the substrate suction hole is located on an upper surface of at least one of the outer frame support part and the connection part support part, according to the method for manufacturing a light-emitting device according to Item 1 or 2. [Item 4] In the step of disposing the integrated substrate, When the integrated substrate is disposed on the integrated substrate support part, a space surrounded by the integrated substrate and the integrated substrate support part is formed, The integrated substrate support part further includes a communication part that connects the substrate suction hole and the space, In the step of obtaining the light source unit, Separating the light source unit planned part from the integrated substrate with the space under a negative pressure by the communication part, according to the method for manufacturing a light-emitting device according to Item 3. [Item 5] An opening of the communication part is provided on an upper surface side of a side surface of the outer frame support part or the connection part support part provided with the substrate suction hole, according to the method for manufacturing a light-emitting device according to Claim 4. [Item 6] The substrate suction hole is provided in the outer frame support portion, The communication portion is provided so as to connect the substrate suction hole provided in the outer frame support portion and the space, the manufacturing method of the light emitting device according to claim 4 or 5. [Item 7] The step of preparing the integrated substrate includes The step of preparing an integrated substrate including two or more of the substrate portions, The step of obtaining the light source portion includes A first removing step of removing a part of the connecting portion in the height direction on the outer periphery of each of the two or more substrate portions, A second removing step of separating the light source portion planned portion by removing the remaining portion of the connecting portion in the height direction, the manufacturing method of the light emitting device according to any one of claims 4 to 7. [Item 8] The step of arranging the integrated substrate includes When the integrated substrate is arranged on the integrated substrate support portion, the step of arranging a pressing portion for pressing the integrated substrate from above is further included, The pressing portion is arranged above the outer frame support portion or the connecting portion support portion provided with the substrate suction hole connected to the communication portion, the manufacturing method of the light emitting device according to any one of claims 4 to 7. [Item 9] In the step of preparing the integrated substrate support portion, The substrate portion support portion has an upper surface and a side surface on which the substrate portion is arranged, and further has a dust collection suction portion having an opening on the side surface, The opening is provided at a position on the side surface away from the upper surface, the manufacturing method of the light emitting device according to claim 3. [Item 10] The opening has a first opening located on the upper surface side and a second opening located below the first opening, the manufacturing method of the light emitting device according to claim 9. [Item 11] In the step of arranging the integrated substrate, When the integrated substrate is arranged on the integrated substrate support portion, a space surrounded by the integrated substrate and the integrated substrate support portion is formed, The method for manufacturing a light-emitting device according to claim 9 or 10, wherein the outer frame support portion has a ventilation hole connecting the space and the external space.

Explanation of Signs

[0047] 1 Light-emitting device 2 Substrate 3 Substrate body 3a Upper surface 3b Lower surface 4 Wiring 4a First wiring 4b Second wiring 5 Lens member 6 Optical function portion 7 Lens support portion 7a Lower surface 8 Step portion 10 Light source portion 11 Electronic component 12 Joining member 13 Light source 13a Light-emitting element 13b Electrode 14 Translucent member 15 Coating member M20 Assembly substrate 20 Substrate 21 Substrate portion 22 Connection portion 23 Outer frame 30, 30a Assembly substrate support member 31, 31a Substrate portion support 32, 32a Frame portion support 33, 33a Outer frame support portion 34, 34a Base portion 37, 37a Substrate suction hole 38 Communication portion H31 Dust collection suction portion H31a1 First dust collection suction portion H31a2 Second dust collection suction portion H31b Third dust collection suction portion

Claims

1. A step of preparing an integrated substrate, comprising: a substrate including an outer frame, at least one substrate portion located inside the outer frame in a plan view, and a connection portion connecting the outer frame and the substrate portion or between the substrate portions; a light source disposed on the upper surface of the substrate portion; a step of preparing an integrated substrate including at least one light source unit planned portion including the substrate portion and the light source; a step of preparing an integrated substrate support portion that supports the integrated substrate and has a substrate suction hole on the upper surface, and disposing the integrated substrate in a state where the lower surface of the integrated substrate is in contact with the upper surface of the integrated substrate support portion; a step of separating the light source unit planned portion from the integrated substrate by cutting at the boundary between the substrate portion and the connection portion to obtain a light source unit; comprising: The step of disposing the integrated substrate includes: a step of disposing and fixing the integrated substrate on the integrated substrate support portion so that the substrate suction hole is disposed at a position excluding the substrate portion in a plan view, a manufacturing method of a light emitting device.

2. The step of obtaining the light source unit includes a step of irradiating a laser beam on the connection portion located on the outer periphery of the substrate portion in the integrated substrate to cut the connection portion, the manufacturing method of the light emitting device according to claim 1.

3. The step of disposing the integrated substrate includes: including an outer frame support portion that supports the outer frame, a connection portion support portion that supports the connection portion, and a substrate portion support portion that are disposed with a gap therebetween, and at least one of the outer frame support portion and the connection portion support portion is provided with the substrate suction hole, and preparing the integrated substrate support portion in which an opening of the substrate suction hole is located on an upper surface of at least one of the outer frame support portion and the connection portion support portion, the manufacturing method of the light emitting device according to claim 1.

4. In the step of disposing the integrated substrate, when the integrated substrate is disposed on the integrated substrate support portion, a space surrounded by the integrated substrate and the integrated substrate support portion is formed, the integrated substrate support portion further includes a communication portion connecting the substrate suction hole and the space, In the step of obtaining the light source unit, separating the light source unit planned portion from the integrated substrate with the space under negative pressure by the communication portion, the manufacturing method of the light emitting device according to claim 3.

5. The opening of the communication portion is provided on the upper surface side of the side surface of the outer frame support portion or the connection portion support portion provided with the substrate suction hole, the manufacturing method of the light emitting device according to claim 4.

6. The substrate suction hole is provided in the outer frame support portion. The manufacturing method of the light-emitting device according to claim 4, wherein the communication portion is provided so as to connect the substrate suction hole provided in the outer frame support portion and the space.

7. The step of preparing the integrated substrate includes a step of preparing an integrated substrate including two or more of the substrate portions, The step of obtaining the light source portion includes a first removing step of removing a part of the connecting portion in the height direction at the outer periphery of each of the two or more substrate portions, and a second removing step of separating the light source portion planned portion by removing the remaining portion of the connecting portion in the height direction. The manufacturing method of the light-emitting device according to claim 4.

8. The step of arranging the integrated substrate further includes a step of arranging a pressing portion that presses the integrated substrate from above when the integrated substrate is arranged on the integrated substrate support portion, The manufacturing method of the light-emitting device according to any one of claims 4 to 7, wherein the pressing portion is arranged above the outer frame support portion or the connecting portion support portion provided with the substrate suction hole connected to the communication portion.

9. In the step of preparing the integrated substrate support portion, the substrate portion support portion has an upper surface and a side surface on which the substrate portion is arranged, and further has a dust collection suction portion having an opening on the side surface, The manufacturing method of the light-emitting device according to claim 3, wherein the opening is provided at a position on the side surface away from the upper surface.

10. The manufacturing method of the light-emitting device according to claim 9, wherein the opening has a first opening located on the upper surface side and a second opening located below the first opening.

11. In the step of arranging the integrated substrate, when the integrated substrate is arranged on the integrated substrate support portion, a space surrounded by the integrated substrate and the integrated substrate support portion is formed, The manufacturing method of the light-emitting device according to claim 9, wherein the outer frame support portion has a ventilation hole connecting the space and the external space.

Images