Laser irradiation device

Abstract

To provide a laser irradiation device capable of accurately irradiating an irradiation-object.SOLUTION: A laser irradiation device has: a laser element; a moving mechanism changing a relative position of the laser element and an irradiation-object and a relative position of the laser element and an-inspection object; an imaging portion imaging the inspection-object; and a control portion. The control portion: controls the laser element and the moving mechanism to perform first processing which irradiates the inspection-object with the laser light while laser element and the inspection-object face each other; controls the imaging portion to perform second processing which images the inspection object irradiated with the laser beam; and controls the laser element and the moving mechanism to perform a third processing which change the relative position of the laser element and the irradiation object while irradiating the irradiation object with the laser beam on the basis of a result of imaging in the second processing with the laser element and the irradiation object facing each other.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a laser irradiation device.

Background Art

[0002] There are known processing devices that irradiate laser light to process an object to be processed, and recording devices that perform recording such as printing on a recording object.

[0003] For example, Patent Document 1 describes a three-dimensional printer device having a printer head configured to include a light-emitting element array in which laser elements are arranged, a liquid tank that stores a photocurable liquid cured by light emitted from the printer head, and a stage portion to which a molded object formed by curing with light adheres.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In a laser irradiation device that irradiates laser light as described above, for example, when laser processing is repeated, the characteristics of the laser element may deviate from the design values. When irradiating an irradiation object in a state where the characteristics of the laser element deviate from the design values, accurate irradiation cannot be performed.

Means for Solving the Problems

[0006] One aspect of the laser irradiation device according to the present invention is a laser element that irradiates laser light, a moving mechanism that changes the relative position between the laser element and the irradiation object, and the relative position between the laser element and the inspection object, an imaging unit that images the inspection object, a control unit that controls the laser element, the moving mechanism, and the imaging unit; and has The control unit a first process of controlling the laser element and the moving mechanism to irradiate the inspection object with laser light in a state where the laser element faces the inspection object; a second process of controlling the imaging unit to image the inspection object irradiated with the laser light; a third process of controlling the laser element and the moving mechanism to change the relative position between the laser element and the irradiation object while irradiating the irradiation object with laser light based on the imaging result in the second process in a state where the laser element faces the irradiation object; and performs.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Embodiments for Carrying Out the Invention

[0008] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. Note that the embodiments described below do not unduly limit the content of the present invention described in the claims. Also, not all of the configurations described below are essential constituent elements of the present invention.

[0009] 1. First Embodiment 1. Laser Irradiation Apparatus 1.1.1. Configuration First, the laser irradiation apparatus according to the first embodiment will be described with reference to the drawings. FIGS. 1 and 2 are perspective views schematically showing the laser irradiation apparatus 100 according to the first embodiment. In FIGS. 1 and 2, the X-axis, Y-axis, and Z-axis are shown as three axes orthogonal to each other. The X-axis direction and the Y-axis direction are, for example, horizontal directions. The Z-axis direction is, for example, the vertical direction.

[0010] As shown in FIGS. 1 and 2, for example, the laser irradiation device 100 includes a head 10, a moving mechanism 20, a first optical element 30, a first support portion 40, an imaging unit 50, a second optical element 60, a second support portion 70, and a control unit 80. The laser irradiation device 100 is, for example, a laser processing device. The laser irradiation device 100 is, for example, a metal 3D printer that uses the selective laser melting (SLM) method.

[0011] The head 10 is supported by the rail 22 of the moving mechanism 20. The head 10 irradiates laser light L. In the illustrated example, the head 10 irradiates the laser light L in the -Z axis direction. The head 10 processes the irradiation object 2 with the laser light L. Here, FIG. 3 is a bottom view schematically showing the head 10.

[0012] As shown in FIG. 3, the head 10 includes, for example, a first substrate 12 and a laser element array 14. The first substrate 12 supports the laser element array 14. The material of the first substrate 12 is not particularly limited, but is, for example, a metal such as aluminum, iron, or copper.

[0013] The laser element array 14 is provided on the first substrate 12. In the illustrated example, the laser element array 14 has a shape extending in the Y axis direction. For example, a plurality of laser element arrays 14 are provided. The number of laser element arrays 14 is not particularly limited. In the illustrated example, two laser element arrays 14 are provided. The two laser element arrays 14 are arranged in the X axis direction.

[0014] The laser element array 14 includes, for example, a second substrate 16 and a laser element 18. The second substrate 16 is provided on the first substrate 12. The material of the second substrate 16 is not particularly limited, but is, for example, aluminum oxide, aluminum nitride, ceramic, or the like.

[0015] The laser element 18 is provided on the second substrate 16. The laser element 18 is supported by the rail 22 via the first substrate 12 and the second substrate 16. The laser element 18 irradiates laser light L. In the illustrated example, the shape of the laser element 18 is a circle. The laser element 18 is, for example, a Photonic Crystal Surface Emitting Laser (PCSEL) that utilizes the photonic crystal effect. The laser light L emitted from the laser element 18 that is a PCSEL has a narrow emission angle and a high optical output.

[0016] A plurality of laser elements 18 are provided in one laser element array 14. In the illustrated example, the plurality of laser elements 18 are arranged in the Y-axis direction in one laser element array 14. In the laser element arrays 14 adjacent to each other in the X-axis direction, the laser elements 18 are displaced in the Y-axis direction. That is, the center of the laser element 18 of one laser element array 14 among the laser element arrays 14 adjacent to each other in the X-axis direction does not overlap with the center of the laser element 18 of the other laser element array 14 when viewed from the X-axis direction. Thereby, the irradiation area of the laser light L emitted from the head 10 can be increased.

[0017] The moving mechanism 20 has, for example, a rail 22 and a motor (not shown). As shown in FIGS. 1 and 2, the rail 22 supports the head 10. The moving mechanism 20 changes the relative positions of the head 10 and the irradiation object 2, and the relative positions of the head 10 and the inspection object 102 by a motor (not shown). That is, the moving mechanism 20 changes the relative positions of the laser element 18 and the irradiation object 2, and the relative positions of the laser element 18 and the inspection object 102. The moving mechanism 20 relatively moves the head 10 with respect to the irradiation object 2 and the inspection object 102 by, for example, a motor (not shown). That is, the moving mechanism 20 relatively moves the laser element 18 with respect to the irradiation object 2 and the inspection object 102. The motor is controlled by the control unit 80. In the illustrated example, the moving mechanism 20 moves the head 10 along the X-axis direction. The rail 22 has, for example, a shape extending in the X-axis direction. The moving mechanism 20 moves the head 10 along the rail 22. The moving mechanism 20 may further have an encoder (not shown). The moving mechanism 20 does not move the irradiation object 2 and the inspection object 102.

[0018] The moving mechanism 20 moves the head 10 to make the laser element 18 face the inspection object 102 as shown in FIG. 1. In the illustrated example, the laser element 18 faces the inspection object 102 via the first optical element 30. Further, the moving mechanism 20 moves the head 10 to make the laser element 18 face the irradiation object 2 as shown in FIG. 2. In the illustrated example, the laser element 18 faces the irradiation object 2 via the second optical element 60. In this way, the moving mechanism 20 can switch between the state where the laser element 18 faces the inspection object 102 and the state where the laser element 18 faces the irradiation object 2.

[0019] As shown in FIG. 1, laser light L emitted from the laser element 18 is incident on the first optical element 30. The first optical element 30 is provided between the head 10 and the first support portion 40. The first optical element 30 is provided between the laser element 18 and the inspection object 102. Although not shown, the first optical element 30 may be supported by the rail 22. The first optical element 30 is, for example, a lens array. A plurality of lenses constituting the first optical element 30 are provided, for example, corresponding to the number of laser elements 18.

[0020] The first support portion 40 is provided, for example, in the -Z axis direction of the first optical element 30. The first support portion 40 supports the inspection object 102. The first support portion 40 may be a stage that supports the inspection object 102. Laser light L from the laser element 18 is incident on the inspection object 102 in the calibration process.

[0021] As shown in FIGS. 1 and 2, the imaging unit 50 is supported, for example, by the rail 22 of the moving mechanism 20. In the illustrated example, the imaging unit 50 is fixed to the rail 22. The imaging unit 50 faces the inspection object 102. The imaging unit 50 is located above the inspection object 102. In the example shown in FIG. 1, the head 10 is located between the inspection object 102 and the imaging unit 50. The imaging unit 50 images the inspection object 102. The imaging unit 50 is, for example, a CCD (Charge Coupled Device) image sensor, a CMOS (Complementary Metal Oxide Semiconductor) image sensor, a camera, or the like.

[0022] Here, FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 2 schematically showing the laser irradiation apparatus 100. For convenience, the illustration of the moving mechanism 20 is omitted in FIG. 4.

[0023] As shown in FIGS. 2 and 4, the second optical element 60 receives the laser light L emitted from the laser element 18. The second optical element 60 is provided between the head 10 and the second support portion 70. The second optical element 60 is provided between the laser element 18 and the irradiation object 2. Although not shown, the second optical element 60 may be supported by the rail 22. The second optical element 60 is, for example, a lens array. The focal point of the lens constituting the second optical element 60 is preferably located on the irradiation object 2. Thereby, the irradiation time of the irradiation object 2 can be shortened. A plurality of lenses constituting the second optical element 60 are provided, for example, corresponding to the number of laser elements 18.

[0024] The second support portion 70 is provided, for example, in the -Z axis direction of the second optical element 60. In the illustrated example, the first support portion 40 and the second support portion 70 are arranged in the X axis direction. The second support portion 70 is located in the -X axis direction of the first support portion 40. The second support portion 70 supports the irradiation object 2. The second support portion 70 may be a stage that supports the irradiation object 2. In the processing, the laser light L from the laser element 18 is incident on the irradiation object 2. The irradiation object 2 is, for example, an object to be processed that is processed by the laser light L from the laser element 18. The irradiation object 2 is, for example, metal powder that can be melted by the laser light L. The irradiation object 2 is supplied by a feeder (not shown). The materials of the irradiation object 2 and the inspection object 102 are, for example, the same. Note that the materials of the irradiation object 2 and the inspection object 102 may be different.

[0025] As shown in FIG. 4, the second support portion 70 has, for example, a stage base 72, an elevator mechanism 74, and a housing 76 that houses the stage base 72 and the elevator mechanism 74.

[0026] The irradiation object 2 is supplied onto the stage base 72. The head 10 irradiates the irradiation object 2 on the stage base 72 with the laser beam L, and forms a melted portion 2a and a non-melted portion 2b on the irradiation object 2. The melted portion 2a is in a state of being melted by the irradiation of the laser beam L and then cooled and solidified. The non-melted portion 2b is not irradiated with the laser beam L. Therefore, the non-melted portion 2b is not solidified and remains as metal powder.

[0027] The elevator mechanism 74 supports the stage base 72. In the illustrated example, the elevator mechanism 74 moves the stage base 72 along the -Z axis direction. Along with the movement of the stage base 72, the irradiation object 2 is moved. After the stage base 72 is moved along the -Z axis direction, the feeder supplies the second-layer irradiation object 2 again. The second-layer irradiation object 2 is supplied onto the first-layer irradiation object 2. Then, the head 10 irradiates the second-layer irradiation object 2 with the laser beam L.

[0028] As described above, by repeating a series of steps including the supply of the irradiation object 2 by the feeder, the irradiation of the laser beam L by the head 10, and the movement of the stage base 72 by the elevator mechanism 74, a laminate composed of a plurality of layers of the irradiation object 2 can be formed. Then, by removing the non-melted portion 2b of the laminate with a removal device (not shown), a three-dimensional shaped object with a predetermined shape is shaped. Examples of the removal device include air blow, brush, etc.

[0029] The control unit 80 is constituted by, for example, a computer having a processor, a main storage device, and an input / output interface for performing signal input / output with the outside. The control unit 80 exhibits various functions by, for example, the processor executing a program read into the main storage device. Specifically, the control unit 80 controls the laser element 18, the movement mechanism 20, the imaging unit 50, and the elevator mechanism 74. Note that the control unit 80 may be constituted by a combination of a plurality of circuits instead of a computer.

[0030] 1.1.2. Operation Next, the operation of the laser irradiation device 100 according to the first embodiment will be described with reference to the drawings. Specifically, the processing of the control unit 80 of the laser irradiation device 100 according to the first embodiment will be described with reference to the drawings. FIG. 5 is a flowchart for explaining the processing of the control unit 80.

[0031] The user operates, for example, an operation unit (not shown) to output a processing start signal for starting the processing to the control unit 80. The operation unit is constituted by, for example, a mouse, a keyboard, a touch panel, or the like. When receiving the processing start signal, the control unit 80 starts the processing.

[0032] First, as shown in FIG. 5, the control unit 80 performs data acquisition processing for acquiring shaping data for shaping the three-dimensional object (step S1).

[0033] The shaping data includes information regarding, for example, the material of the metal powder constituting the irradiation object 2, the number of layers of the irradiation object 2, the moving speed of the head 10, the on / off states of the plurality of laser elements 18, and the like.

[0034] The shaping data is created, for example, by causing slicer software installed in a computer connected to the laser irradiation device 100 to read the shape data. The shape data is data representing the target shape of a three-dimensional object created using three-dimensional CAD (Computer Aided Design) software, three-dimensional CG (Computer Graphics) software, or the like. As the shape data, for example, data in the STL (Standard Triangulated Language) format, AMF (Additive Manufacturing File Format), or the like is used. The slicer software divides the target shape of the three-dimensional object into layers of a predetermined thickness and creates shaping data for each layer. The shaping data is represented by G-codes, M-codes, or the like. The control unit 80 acquires the shaping data from a computer connected to the laser irradiation device 100 or a recording medium such as a USB (Universal Serial Bus) memory.

[0035] Next, the control unit 80 controls the laser element 18 and the moving mechanism 20 to perform an irradiation process of irradiating the inspection object 102 with the laser light L in a state where the laser element 18 and the inspection object 102 face each other as shown in FIG. 1 (step S2).

[0036] Specifically, the control unit 80 moves the laser element 18 with the moving mechanism 20 to bring the laser element 18 and the inspection object 102 into a facing state. Next, the control unit 80 irradiates the laser element 18 with the laser light L. The laser light L from the laser element 18 is irradiated onto the inspection object 102 through the first optical element 30.

[0037] Next, the control unit 80 controls the moving mechanism 20 to perform a moving process of relatively moving the laser element 18 and the irradiation object 2 to bring the laser element 18 and the irradiation object 2 into a facing state as shown in FIG. 2 (step S3).

[0038] Specifically, the control unit 80 moves the laser element 18 along the -X axis direction of the moving mechanism 20, and makes the laser element 18 face the irradiation object 2. In the moving process, the control unit 80 does not irradiate the laser element 18 with the laser beam L.

[0039] Next, the control unit 80 controls the imaging unit 50 to perform a calibration process of imaging the inspection object 102 irradiated with the laser beam L (step S4). In the calibration process, the control unit 80 determines, for example, the injection current to the laser element 18 in the processing based on the imaging result of the imaging unit 50.

[0040] Here, FIG. 6 is a plan view and a cross-sectional view schematically showing the inspection object 102. FIG. 6 shows the inspection object 102 after being irradiated with the laser beam L. As shown in FIG. 6, the inspection object 102 is provided with an alignment mark M.

[0041] For example, in the imaging by the imaging unit 50, when the line width W of the irradiation mark R irradiated with the laser beam L is smaller than a predetermined value, the control unit 80 determines to make the injection current to the laser element 18 in the processing larger than the injection current to the laser element 18 in the irradiation process of step S2. Conversely, when the line width W is larger than the predetermined value, the control unit 80 determines to make the injection current to the laser element 18 in the processing smaller than the injection current to the laser element 18 in the irradiation process of step S2. The predetermined value may be stored in a storage unit (not shown).

[0042] Furthermore, in the calibration process, the control unit 80 may determine, for example, the laser element 18 to be driven in the processing based on the imaging result of the imaging unit 50. For example, in the imaging by the imaging unit 50, as shown in FIG. 6, when the irradiation mark R is in the +Y axis direction from the alignment mark M, the control unit 80 drives the laser element 18 in the -Y axis direction rather than the laser element 18 driven in the irradiation process in the processing.

[0043] In this way, the control unit 80 feeds back the imaging result obtained by the imaging unit 50 to the processing. The calibration process is a process for calibrating the light output of the laser beam L in the processing.

[0044] Next, the control unit 80 controls the laser element 18 and the moving mechanism 20, and while the laser element 18 and the irradiation object 2 are opposed to each other, based on the imaging result in the calibration process of step S4, the laser beam L is irradiated onto the irradiation object 2, and a processing process is performed to change the relative position between the laser element 18 and the irradiation object 2 (step S5).

[0045] Specifically, with the laser element 18 and the irradiation object 2 opposed to each other, based on the imaging result obtained by the imaging unit 50 and the shaping data, while irradiating the laser element 18 with the laser beam L, the control unit 80 drives the motor of the moving mechanism 20 to move the laser element 18 along the +X axis direction. Thereby, the irradiation object 2 can be processed. As shown in FIG. 4, a melted portion 2a and a non-melted portion 2b are formed on the irradiation object 2.

[0046] Next, as shown in FIG. 5, the control unit 80 performs a determination process of determining whether or not the formation of all layers of the irradiation object 2 has been completed based on the shaping data (step S6).

[0047] If it is determined that the formation of all layers of the irradiation object 2 has not been completed (''NO'' in step S6), the control unit 80 returns the process to step S2. The control unit 80 repeats steps S2 to S6 until it is determined in step S6 that the formation of all layers of the irradiation object 2 has been completed.

[0048] Note that the control unit 80 may also return the process to step S5. Then, the control unit 80 may repeat steps S5 and S6 until it is determined in step S6 that the formation of all layers of the irradiation object 2 has been completed.

[0049] On the other hand, when the control unit 80 determines that the formation of all layers of the irradiation object 2 is completed ( "YES" in step S6), the control unit 80 performs a non-molten part removal process of causing the removal device to remove the non-molten part 2b of the laminate formed of the irradiation object 2 (step S7). Thereby, a three-dimensional shaped object is shaped. Then, the control unit 80 ends the process.

[0050] Note that the non-molten part 2b may be removed manually by the user. In this case, after the control unit 80 determines that the formation of all layers of the irradiation object 2 is completed, the process ends.

[0051] Here, FIGS. 7 and 8 are graphs for explaining the relationship between the current injected into the laser element and the optical output. When irradiating the light receiving element with laser light in the irradiation process for calibration, in order to prevent damage to the light receiving element, as shown in FIG. 7, the injection current cannot be increased. The injection current in the irradiation process for calibration is smaller than the injection current in the processing.

[0052] On the other hand, in the laser irradiation device 100, in order to calibrate the laser element 18, the laser light L is not made to enter the light receiving element, but is made to enter the inspection object 102. Therefore, since the light receiving element is not damaged by the laser light L, as shown in FIG. 8, the injection current in the irradiation process for calibration can be made close to the injection current in the processing. For example, in the laser irradiation device 100, the laser light L can be irradiated from the laser element 18 under the same conditions in the irradiation process for calibration and the processing.

[0053] Note that in FIG. 6, the alignment mark M is shown as a line, but as shown in FIG. 9, the alignment mark M may be a dot. The irradiation mark R by the laser light L may be in a dot shape. In this case, the control unit 80 determines the injection current to the laser element 18 in the processing based on the dot diameter D of the irradiation mark R.

[0054] 1.1.3. Operational Effects A laser element 18 that irradiates laser light L, a moving mechanism 20 that changes the relative position between the laser element 18 and the irradiation object 2 and the relative position between the laser element 18 and the inspection object 102, an imaging unit 50 that images the inspection object 102, and a control unit 80 that controls the laser element 18, the moving mechanism 20, and the imaging unit 50. The control unit 80 controls the laser element 18 and the moving mechanism 20 to perform an irradiation process as a first process of irradiating the inspection object 102 with the laser light L in a state where the laser element 18 faces the inspection object 102, controls the imaging unit 50 to perform a calibration process as a second process of imaging the inspection object 102 irradiated with the laser light L, and controls the laser element 18 and the moving mechanism 20 to perform a processing process as a third process of changing the relative position between the laser element 18 and the irradiation object 2 while irradiating the irradiation object 2 with the laser light L based on the imaging result in the calibration process in a state where the laser element 18 faces the irradiation object 2.

[0055] Therefore, in the laser irradiation apparatus 100, even if the characteristics of the laser element 18 deviate from the design values, the deviation can be detected by the calibration process and fed back to the processing process. Thereby, the irradiation object 2 can be irradiated accurately in the processing process. For example, when a plurality of laser elements 18 are provided, uniform irradiation can be performed by the plurality of laser elements 18.

[0056] Furthermore, in the laser irradiation apparatus 100, the laser light L is irradiated onto the inspection object 102 in a state where the laser element 18 faces the inspection object 102. Therefore, for example, compared with the case where the optical path of the laser light L from the laser element to the irradiation object 2 is changed by an optical path changing element such as a mirror or a beam splitter to irradiate the inspection object 102 with the laser light L, damage to the optical path changing element by the laser light L can be suppressed. When the optical path changing element is damaged, the laser light L may not be able to be guided to the inspection object 102. In particular, when the laser element is a PCSEL, since the emission angle is narrow, if an optical path changing element is used, the optical path changing element is easily damaged.

[0057] Furthermore, in the laser irradiation device 100, in the processing, the laser light L is irradiated onto the irradiation object 2 based on the imaging result by the imaging unit 50. Therefore, in the laser irradiation device 100, there is no need to use a light receiving element for calibration of the laser element 18, and damage to the light receiving element can be prevented. Thus, in the irradiation process for calibration and the processing, the laser light L can be irradiated from the laser element 18 under the same conditions. Therefore, highly accurate calibration can be performed.

[0058] In the laser irradiation device 100, the laser element 18 and the imaging unit 50 are supported by the moving mechanism 20. Therefore, in the laser irradiation device 100, the device can be simplified as compared with the case where a support member for supporting the imaging unit is separately provided, for example.

[0059] The laser irradiation device 100 includes a first support portion 40 that supports the inspection object 102 and a second support portion 70 that supports the irradiation object 2. The moving mechanism 20 relatively moves the laser element 18 in the X-axis direction as the first direction, and the first support portion 40 and the second support portion 70 are arranged side by side in the X-axis direction. Therefore, in the laser irradiation device 100, the moving direction of the laser element 18 in the processing and the moving direction of the laser element 18 for shifting from the state where the laser element 18 faces the inspection object 102 to the state where the laser element 18 faces the irradiation object 2 can be the same X-axis direction. Thereby, the device can be simplified.

[0060] In the laser irradiation device 100, the materials of the irradiation object 2 and the inspection object 102 are the same. Therefore, in the laser irradiation device 100, for example, the difference in the line width W of the laser light L in the irradiation process for calibration and the processing can be reduced.

[0061] In the laser irradiation device 100, the irradiation object 2 is a processing object to be processed by the laser light L from the laser element 18. Therefore, in the laser irradiation device 100, the irradiation object 2 can be processed with high accuracy.

[0062] In the laser irradiation device 100, the laser element 18 is a PCSEL. Therefore, in the laser irradiation device 100, the emission angle of the laser beam L from the laser element 18 can be narrowed. As a result, the irradiation time of the irradiation object 2 can be shortened.

[0063] 1.2. Modified examples of the laser irradiation device 1.2.1. First modified example Next, a laser irradiation device according to a first modified example of the first embodiment will be described with reference to the drawings. FIG. 10 is a cross-sectional view schematically showing a laser irradiation device 110 according to the first modified example of the first embodiment.

[0064] Hereinafter, in the laser irradiation device 110 according to the first modified example of the first embodiment, members having the same functions as the constituent members of the laser irradiation device 100 according to the first embodiment described above are denoted by the same reference numerals, and detailed descriptions thereof are omitted. This also applies to the laser irradiation device according to the second modified example of the first embodiment described later.

[0065] In the above-described laser irradiation device 100, as shown in FIG. 1, in the machining process, the head 10 was moved along the +X axis direction.

[0066] On the other hand, in the laser irradiation device 110, as shown in FIG. 10, the head 10 is fixed to the first fixing portion 112. The laser irradiation device 110 has, for example, a first fixing portion 112, a second fixing portion 114, and a base 116.

[0067] The first fixing portion 112 is provided straddling the rail 22 of the moving mechanism 20. The head 10 is not moved in the machining process. The head 10 is separated from the moving mechanism 20 and is located above the moving mechanism 20.

[0068] The second fixing part 114 fixes the imaging part 50. In the illustrated example, two second fixing parts 114 are provided. Two imaging parts 50 are provided. When viewed from the Z-axis direction, the inspection object 102 is provided between the two imaging parts 50.

[0069] The base 116 supports the rail 22. The rail 22 is provided on the base 116. In the laser irradiation device 110, the first support part 40 and the second support part 70 are provided on the rail 22. In the processing, the control part 80 controls the moving mechanism 20 to move the second support part 70 along the +X-axis direction. Along with the movement of the second support part 70, the irradiation object 2 is moved along the +X-axis direction. Thereby, the relative position between the laser element 18 and the irradiation object 2 is changed.

[0070] 1.2.2. Second modification example Next, a laser irradiation device according to a second modification example of the first embodiment will be described with reference to the drawings. FIG. 11 is a bottom view schematically showing the head 10 of the laser irradiation device 120 according to the second modification example of the first embodiment.

[0071] In the above-described laser irradiation device 100, as shown in FIG. 1, the imaging part 50 was supported by the rail 22 of the moving mechanism 20.

[0072] On the other hand, in the laser irradiation device 120, as shown in FIG. 11, the imaging part 50 is supported by the head 10. In the illustrated example, the laser element array 14 has a shape extending in a direction inclined with respect to the X-axis and the Y-axis. A plurality of laser element arrays 14 are provided. In the illustrated example, eight are provided. The plurality of laser element arrays 14 are arranged in the Y-axis direction. The imaging part 50 is provided in the -Y-axis direction of the column of the plurality of laser element arrays 14.

[0073] 2. Second embodiment 2.1. Laser irradiation device Next, the laser irradiation device according to the second embodiment will be described with reference to the drawings. FIG. 12 is a perspective view schematically showing the laser irradiation device 200 according to the second embodiment. FIG. 13 is a cross-sectional view taken along line XIII-XIII of FIG. 12 schematically showing the laser irradiation device 200 according to the second embodiment.

[0074] Hereinafter, in the laser irradiation device 200 according to the second embodiment, members having the same functions as the constituent members of the laser irradiation device 100 according to the first embodiment described above are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

[0075] In the above-described laser irradiation device 100, as shown in FIGS. 1 and 2, the irradiation object 2 was an object to be processed processed by the laser beam L from the laser element 18.

[0076] On the other hand, in the laser irradiation device 200, as shown in FIGS. 12 and 13, the irradiation object 2 is an object to be recorded recorded by the laser beam L from the laser element 18. The laser irradiation device 200 is a recording device.

[0077] In the laser irradiation device 200, the moving mechanism 20 has, for example, a transport unit 24. The transport unit 24 transports the irradiation object 2 toward the second support unit 70 in the recording process on the irradiation object 2. In the illustrated example, the transport unit 24 transports the irradiation object 2 in the -X axis direction. In the recording process, the head 10 is, for example, fixed. The irradiation object 2 is wound around the transport unit 24. The transport unit 24 is, for example, a roller that supplies the irradiation object 2 to the second support unit 70. The shape of the irradiation object 2 is, for example, sheet-like. The rotation of the transport unit 24 is controlled by, for example, the control unit 80.

[0078] The second support part 70 is provided, for example, in the -X axis direction of the conveyance part 24. The second support part 70 supports the irradiation object 2 conveyed from the conveyance part 24 during recording on the irradiation object 2. The second support part 70 is, for example, a platen roller. In the illustrated example, the conveyance part 24 and the second support part 70 rotate about the Y axis. Due to the rotation of the conveyance part 24 and the second support part 70, the moving mechanism 20 moves the irradiation object 2 along the -X axis direction.

[0079] In the recording process on the irradiation object 2, the irradiation object 2 is positioned between the head 10 and the second support part 70. The irradiation object 2 has, for example, a recording sheet 4 and an ink ribbon 6 provided on the recording sheet 4. As shown in FIG. 13, the ink ribbon 6 has, for example, an ink layer 7 made of a heat-fusible ink and a base 8 provided on the ink layer 7. The base 8 is, for example, transparent. When the laser beam L is irradiated from the head 10, the irradiated part of the ink layer 7 is melted and transferred to the recording sheet 4. Thereby, recording such as printing can be performed on the recording sheet 4. The laser irradiation device 200 is, for example, a thermal transfer type thermal printer. For the sake of convenience of explanation, in FIG. 13, the recording sheet 4 and the ink ribbon 6 are separated from each other, but usually, the recording sheet 4 and the ink ribbon 6 are in contact with each other.

[0080] Here, FIG. 14 is a flowchart for explaining the processing of the control part 80 of the laser irradiation device 200. The user operates, for example, an operation part (not shown) to output a processing start signal for starting the processing to the control part 80. When the control part 80 receives the processing start signal, it starts the processing.

[0081] First, as shown in FIG. 14, the control part 80 performs a data acquisition process of acquiring the print data generated by the user (step S11).

[0082] Next, the control part 80 performs an irradiation process (step S12). The irradiation process is basically the same as the irradiation process of the laser irradiation device 100 described above.

[0083] Next, the control unit 80 performs a movement process (step S13). The movement process is basically the same as the movement process of the laser irradiation device 100 described above.

[0084] Next, the control unit 80 performs a calibration process (step S14). The calibration process is basically the same as the calibration process of the laser irradiation device 100 described above.

[0085] Next, the control unit 80 controls the laser element 18 and the movement mechanism 20, and based on the imaging result in the calibration process of step S14 with the laser element 18 facing the irradiation object 2, a processing process is performed to change the relative position between the laser element 18 and the irradiation object 2 while irradiating the irradiation object 2 with the laser beam L (step S5).

[0086] Specifically, with the laser element 18 facing the irradiation object 2, based on the imaging result by the imaging unit 50 and the shaping data, while irradiating the laser element 18 with the laser beam L, the control unit 80 drives the transport unit 24 of the movement mechanism 20 to move the irradiation object 2 along the -X axis direction. Thereby, it can be recorded on the irradiation object 2.

[0087] Then, the control unit 80 ends the process.

[0088] In the laser irradiation device 200, it is the recording object recorded by the laser beam L from the laser element 18. Therefore, in the laser irradiation device 200, it can be accurately recorded on the irradiation object 2.

[0089] 2.2. Modification Example of Laser Irradiation Device Next, a laser irradiation device according to a modification example of the second embodiment will be described with reference to the drawings. FIG. 15 is a perspective view schematically showing a laser irradiation device 210 according to a modification example of the second embodiment.

[0090] Hereinafter, in the laser irradiation device 210 according to the modification of the second embodiment, members having the same functions as the constituent members of the laser irradiation device 200 according to the above-described second embodiment are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

[0091] The laser irradiation device 210 is different from the above-described laser irradiation device 200 in that it is a receipt printer. The laser irradiation device 210 is provided, for example, at a cash register in a store such as a supermarket, a convenience store, or a restaurant. In the laser irradiation device 210, in accordance with the accounting performed at the cash register, the result of printing an image on the irradiation object 2 is issued as a receipt. The material of the irradiation object 2 is, for example, paper. Note that the material of the irradiation object 2 may be polyethylene (PE), polyethylene terephthalate (PET), or polypropylene (PP).

[0092] As shown in FIG. 15, the laser irradiation device 210 has, for example, a housing portion 220 and a cutter 230.

[0093] The housing portion 220 houses the irradiation object 2 wound in a roll, the inspection object 102, the head 10, the moving mechanism 20, the first support portion 40, the imaging portion 50, the second support portion 70, and the cutter 230. The housing portion 220 has an openable and closable cover 222. The cover 222 is opened when the lever 224 is pushed down by the user. The user can replenish or replace the irradiation object 2 wound in a roll with the cover 222 open. The cover 222 is provided with a discharge port 226 for discharging the irradiated object 2 after printing. Further, the housing portion 220 is provided with a power switch 228 for switching the power of the laser irradiation device 210 on and off.

[0094] The cutter 230 is provided at a position corresponding to the discharge port 226. The cutter 230 cuts the printed irradiation object 2. Thereby, a receipt is generated. The shape of the cutter 230 is not particularly limited as long as it can cut the irradiation object 2.

[0095] Note that the use of the laser irradiation device according to the present invention is not particularly limited. For example, it may be a laser cleaner that removes rust or the like attached to a metal by laser light, or a laser annealing device that heats the surface of a metal or resin by laser light.

[0096] Also, the material of the object to be irradiated is not particularly limited, and may be, for example, a resin such as a photocurable resin, wood, glass, paper, leather, a mineral, or the like.

[0097] The above-described embodiments and modifications are examples and are not limited thereto. For example, it is also possible to appropriately combine each embodiment and each modification.

[0098] The present invention includes a configuration that is substantially the same as the configuration described in the embodiments, for example, a configuration having the same functions, methods, and results, or a configuration having the same objectives and effects. The present invention also includes a configuration in which a non-essential part of the configuration described in the embodiments is replaced. The present invention also includes a configuration that exhibits the same operational effects as the configuration described in the embodiments or a configuration that can achieve the same objective. The present invention also includes a configuration in which a known technique is added to the configuration described in the embodiments.

[0099] The following content is derived from the above-described embodiments and modifications.

[0100] One aspect of the laser irradiation device is a laser element that irradiates laser light, a moving mechanism that changes the relative position between the laser element and the object to be irradiated, and the relative position between the laser element and the object to be inspected, an imaging unit that images the object to be inspected, a control unit that controls the laser element, the moving mechanism, and the imaging unit, and has The control unit Controlling the laser element and the moving mechanism, in a state where the laser element and the inspection object face each other, a first process of irradiating the inspection object with laser light; Controlling the imaging unit to perform a second process of imaging the inspection object irradiated with laser light; Controlling the laser element and the moving mechanism, in a state where the laser element and the irradiation object face each other, while irradiating the irradiation object with laser light based on the imaging result in the second process, a third process of changing the relative position between the laser element and the irradiation object; Perform.

[0101] According to this laser irradiation device, the irradiation object can be irradiated accurately.

[0102] In one aspect of the laser irradiation device, The laser element and the imaging unit may be supported by the moving mechanism.

[0103] According to this laser irradiation device, simplification of the device can be achieved.

[0104] In one aspect of the laser irradiation device, A first support portion for supporting the inspection object; A second support portion for supporting the irradiation object; Have, The moving mechanism moves the laser element along a first direction, The first support portion and the second support portion may be arranged side by side along the first direction.

[0105] According to this laser irradiation device, simplification of the device can be achieved.

[0106] In one aspect of the laser irradiation device, The materials of the irradiation object and the inspection object may be the same.

[0107] According to this laser irradiation device, for example, the difference in the line width of the laser light in the first process and the third process can be reduced.

[0108] In one aspect of the laser irradiation device, The object to be irradiated may be an object to be processed that is processed by the laser light from the laser element.

[0109] According to this laser irradiation device, the object to be irradiated can be processed with high precision.

[0110] In one aspect of the laser irradiation device, The object to be irradiated may be an object to be recorded that is recorded by the laser light from the laser element.

[0111] According to this laser irradiation device, recording can be performed on the object to be irradiated with high precision.

[0112] In one aspect of the laser irradiation device, The laser element may be a photonic crystal surface emitting laser.

[0113] According to this laser irradiation device, the emission angle of the laser light from the laser element can be narrowed.

Explanation of symbols

[0114] 2…Object to be irradiated, 2a…Melted part, 2b…Non-melted part, 4…Recording sheet, 6…Ink ribbon, 7…Ink layer, 8…Base, 10…Head, 12…First substrate, 14…Laser element array, 16…Second substrate, 18…Laser element, 20…Moving mechanism, 22…Rail, 24…Conveyor section, 30…First optical element, 40…First support section, 50…Imaging section, 60…Second optical element, 70…Second support section, 72…Stage base, 74…Elevator mechanism, 76…Housing, 80…Control section, 100, 110…Laser irradiation device, 112…First fixing section, 114…Second fixing section, 116…Base, 120, 200, 210…Laser irradiation device, 220…Storage section, 222…Cover, 224…Lever, 226…Outlet, 228…Power switch, 230…Cutter

Claims

1. A laser element that irradiates laser light, A moving mechanism that changes the relative position between the laser element and the object to be irradiated, and the relative position between the laser element and the object to be inspected, An imaging unit that images the object to be inspected, A control unit that controls the laser element, the moving mechanism, and the imaging unit, having, The control unit, A first process of controlling the laser element and the moving mechanism to irradiate the object to be inspected with laser light in a state where the laser element and the object to be inspected face each other, A second process of controlling the imaging unit to image the object to be inspected irradiated with laser light, A third process of controlling the laser element and the moving mechanism to change the relative position between the laser element and the object to be irradiated while irradiating the object to be irradiated with laser light based on the imaging result in the second process in a state where the laser element and the object to be irradiated face each other, A laser irradiation device that performs.

2. In Claim 1, The laser element and the imaging unit are supported by the moving mechanism, a laser irradiation device.

3. In Claim 1, A first support portion that supports the object to be inspected, A second support portion that supports the object to be irradiated, having, The moving mechanism moves the laser element along a first direction, The first support portion and the second support portion are arranged side by side along the first direction, a laser irradiation device.

4. In Claim 1, The materials of the object to be irradiated and the object to be inspected are the same, a laser irradiation device.

5. In Claim 1, The object to be irradiated is a processing object to be processed by laser light from the laser element, a laser irradiation device.

6. In Claim 1, The object to be irradiated is a recording object to be recorded by laser light from the laser element, a laser irradiation device.

7. In any one of Claims 1 to 6, The laser element is a photonic crystal surface emitting laser, a laser irradiation device.

Images