Dielectric substrate and method for forming the same

Abstract

To provide improved dielectric material and layer that can be used in PCB and other high frequency applications.SOLUTION: In a dielectric substrate that can include a polymer-based core film and a fluoropolymer-based adhesive layer, the polymer-based core film can include a resin matrix component and a ceramic filler component. The ceramic filler component can include a first filler material. The first filler material can have a particle size distribution with a D10 of at least about 1.0 micrometer and no greater than about 1.7, a D50 of at least about 1.0 micrometer and no greater than about 3.5 micrometers, and a D90 of at least about 2.7 micrometers and no greater than about 6 micrometers.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to dielectric substrates and methods of forming the same. In particular, the present disclosure relates to copper clad laminates. The present invention relates to a dielectric substrate for use in a plate structure and a method for forming the same. [Background technology]

[0002] Copper-clad laminate (CCL) is a laminate consisting of two layers of conductive copper foil or Subsequent work has demonstrated that such CCLs can be printed on a Used to form a PCB. When used, the conductive copper foil is selectively etched to form circuits with through holes. Through holes are drilled between layers and metallized, i.e. plated, to form the interconnects within a multilayer PCB. Therefore, CCL must exhibit excellent thermomechanical stability. PCBs also may be subject to excessively high temperatures during manufacturing operations, e.g., soldering, as well as during use. As a result, PCBs can withstand temperatures exceeding 200°C continuously without deformation. They must function at temperatures ranging from 100 to 200°C, withstanding extreme temperature fluctuations while resisting moisture absorption. The dielectric layer of the CCL acts as a spacer between the conductive layers and provides a conductive barrier. By isolating the dielectric, electrical signal loss and crosstalk can be minimized. The lower the dielectric constant (permittivity) of a layer, the faster an electrical signal will travel through the layer. The low loss factor, which depends on temperature and frequency, as well as the polarizability of the material, is a key advantage for high frequency applications. Accordingly, improvements that can be used in PCB and other high frequency applications are being made. Improved dielectric materials and layers are desired.

Summary of the Invention

[0003] According to a first aspect, the dielectric substrate may include a polymer-based core film and a fluoropolymer-based adhesive layer. The polymer-based core film may include a resin matrix component and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have at least about 0.5 micrometers and a D of about 1.6 or less, at least about 0.8 micrometers and a D of about 2.7 micrometers or less, and at least about 1.5 micrometers and a D of about 4.7 micrometers or less. The polymer-based core film may include a resin matrix component and a ceramic filler component. The ceramic filler component may include a first filler material. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have at least about 0.5 micrometers and a D of about 1.6 or less, at least about 0.8 micrometers and a D of about 2.7 micrometers or less, and at least about 1.5 micrometers and a D of about 4.7 micrometers or less. D 10 The particle size distribution of the first filler material may have at least about 0.5 micrometers and a D of about 1.6 or less, at least about 0.8 micrometers and a D of about 2.7 micrometers or less, and at least about 1.5 micrometers and a D of about 4.7 micrometers or less. D 50 The particle size distribution of the first filler material may have at least about 0.5 micrometers and a D of about 1.6 or less, at least about 0.8 micrometers and a D of about 2.7 micrometers or less, and at least about 1.5 micrometers and a D of about 4.7 micrometers or less. D 90 The particle size distribution of the first filler material may have at least about 0.5 micrometers and a D of about 1.6 or less, at least about 0.8 micrometers and a D of about 2.7 micrometers or less, and at least about 1.5 micrometers and a D of about 4.7 micrometers or less.

[0004] According to another aspect, the dielectric substrate may include a polymer-based core film and a fluoropolymer-based adhesive layer. The polymer-based core film may include a resin matrix component and a ceramic filler component. The ceramic filler component may include a first filler material. The polymer-based core film may include a resin matrix component and a ceramic filler component. The ceramic filler component may include a first filler material. The ceramic filler component may include a first filler material. The ceramic filler component may include a first filler material. The first filler material may further have an average particle size of about 10 micrometers or less and a particle size distribution span (PSDS) of about 5 or less. The PSDS is equal to (D - D) / D, where D is equal to the D particle size distribution measurement value of the first filler material, D is equal to the D particle size distribution measurement value of the first filler material, and D is equal to the D particle size distribution measurement value of the first filler material. The first filler material may further have an average particle size of about 10 micrometers or less and a particle size distribution span (PSDS) of about 5 or less. The PSDS is equal to (D - D) / D, where D is equal to the D particle size distribution measurement value of the first filler material, D is equal to the D particle size distribution measurement value of the first filler material, and D is equal to the D particle size distribution measurement value of the first filler material. PSDS 90 -D 10 ) / D 50 The PSDS is equal to (D - D) / D, where D is equal to the D particle size distribution measurement value of the first filler material, D is equal to the D particle size distribution measurement value of the first filler material, and D is equal to the D particle size distribution measurement value of the first filler material. 90 D 90 grain The PSDS is equal to (D - D) / D, where D is equal to the D particle size distribution measurement value of the first filler material, D is equal to the D particle size distribution measurement value of the first filler material, and D is equal to the D particle size distribution measurement value of the first filler material. 10 D 10 The PSDS is equal to (D - D) / D, where D is equal to the D particle size distribution measurement value of the first filler material, D is equal to the D particle size distribution measurement value of the first filler material, and D is equal to the D particle size distribution measurement value of the first filler material. D 50 The PSDS is equal to (D - D) / D, where D is equal to the D particle size distribution measurement value of the first filler material, D is equal to the D particle size distribution measurement value of the first filler material, and D is equal to the D particle size distribution measurement value of the first filler material. 50 The PSDS is equal to (D - D) / D, where D is equal to the D particle size distribution measurement value of the first filler material, D is equal to the D particle size distribution measurement value of the first filler material, and D is equal to the D particle size distribution measurement value of the first filler material.

[0005] According to yet another aspect, the dielectric substrate may include a polymer-based core film and a fluoropolymer-based adhesive layer. The polymer-based core film may include a resin matrix component and a ceramic filler component. The ceramic filler component may include a first filler material. The first filler material may further have an average particle size of about 10 micrometers or less and an average surface area of about 8.0 m / g or less. According to another aspect, the copper-clad laminate may include a copper foil layer and a dielectric substrate covering the copper foil layer. The dielectric substrate may include a polymer-based core film and a fluoropolymer-based adhesive layer. The polymer-based core film may include a resin matrix component and a ceramic filler component. The ceramic filler component may include a first filler material that may include silica. The particle size distribution of the first filler material may have a D of at least about 0.5 micrometers and about 1.6 or less, a D of at least about 0.8 micrometers and about 2.7 micrometers or less, and a D of at least about 1.5 micrometers and about 4.7 micrometers or less. According to yet another aspect, the copper-clad laminate may include a copper foil layer and a dielectric substrate covering the copper foil layer. The dielectric substrate may include a polymer-based core film and a fluoropolymer-based adhesive layer. The polymer-based core film may include a resin matrix component and a ceramic filler component. The ceramic filler component may include a first filler material. m 2 / g or less.

[0006] According to another aspect, the copper-clad laminate may include a copper foil layer and a dielectric substrate covering the copper foil layer. The dielectric substrate may include a polymer-based core film and a fluoropolymer-based adhesive layer. The polymer-based core film may include a resin matrix component and a ceramic filler component. The ceramic filler component may include a first filler material that may include silica. The particle size distribution of the first filler material may have a D of at least about 0.5 micrometers and about 1.6 or less, a D of at least about 0.8 micrometers and about 2.7 micrometers or less, and a D of at least about 1.5 micrometers and about 4.7 micrometers or less. The ceramic filler component may include a first filler material that may include silica. The particle size distribution of the first filler material may have a D of at least about 0.5 micrometers and about 1.6 or less, a D of at least about 0.8 micrometers and about 2.7 micrometers or less, and a D of at least about 1.5 micrometers and about 4.7 micrometers or less. The particle size distribution of the first filler material may have a D of at least about 0.5 micrometers and about 1.6 or less, a D of at least about 0.8 micrometers and about 2.7 micrometers or less, and a D of at least about 1.5 micrometers and about 4.7 micrometers or less. 10 10 The particle size distribution of the first filler material may have a D of at least about 0.5 micrometers and about 1.6 or less, a D of at least about 0.8 micrometers and about 2.7 micrometers or less, and a D of at least about 1.5 micrometers and about 4.7 micrometers or less. 50 50 The particle size distribution of the first filler material may have a D of at least about 0.5 micrometers and about 1.6 or less, a D of at least about 0.8 micrometers and about 2.7 micrometers or less, and a D of at least about 1.5 micrometers and about 4.7 micrometers or less. 90 90 The particle size distribution of the first filler material may have a D of at least about 0.5 micrometers and about 1.6 or less, a D of at least about 0.8 micrometers and about 2.7 micrometers or less, and a D of at least about 1.5 micrometers and about 4.7 micrometers or less.

[0007] According to yet another aspect, the copper-clad laminate may include a copper foil layer and a dielectric substrate covering the copper foil layer. The dielectric substrate may include a polymer-based core film and a fluoropolymer-based adhesive layer. The polymer-based core film may include a resin matrix component and a ceramic filler component. The ceramic filler component may include a first filler material. The ceramic filler component may include a first filler material. The first filler material may include a first filler material that may include silica. The particle size distribution of the first filler material may have a D of at least about 0.5 micrometers and about 1.6 or less, a D of at least about 0.8 micrometers and about 2.7 micrometers or less, and a D of at least about 1.5 micrometers and about 4.7 micrometers or less. The filler material may further have an average particle size of about 10 micrometers or less and a particle size distribution span ( PSDS) of about 5 or less, where PSDS is (D 90 -D 10 ) / D 50 , D 90 is equal to the D 90 particle size distribution measurement value of the first filler material, and D 10 is equal to the D of the first filler 10 material's particle size distribution measurement value, and D 50 is equal to the D 50 particle size distribution measurement value of the first filler material.

[0008] According to yet another aspect, the copper-clad laminate may include a copper foil layer and a dielectric substrate covering the copper foil layer. The dielectric substrate may include a polymer-based core film and a fluoropolymer-based adhesive layer. The polymer-based core film may include a resin matrix component and a ceramic filler component. The ceramic filler component may include the first filler material. The first filler material may further have an average particle size of about 10 micrometers or less and an average 2 surface area of about 8.0 m / g or less.

[0009] According to another aspect, a method of forming a dielectric substrate may include forming a mixture by combining a resin matrix precursor component and a ceramic filler precursor component, forming the mixture into a polymer-based core film, and coating the polymer-based core film with a fluoropolymer-based adhesive layer. The ceramic filler precursor component may include the first filler precursor material. The particle size distribution of the first filler material is at least about 0.5 micrometers and D of about 1.6 or less, at least about 0.8 micrometers and at least about 1.6 or less, and at least about 0.8 micrometers and at least about 1.6 or less, and at least about 0.8 micrometers and at least about 1.6 or less, and at least about 0.8 micrometers 10 and at least about 1.6 or less, and at least about 0.8 micrometers Torque and D of about 2.7 micrometers or less 50 and at least about 1.5 micrometers Torque and D of about 4.7 micrometers or less 90 may be included.

[0010] According to another aspect, a method for forming a dielectric substrate includes forming a mixture by combining a resin matrix precursor component and a ceramic filler precursor component, forming the mixture into a polymer-based core film, and coating the polymer-based core film with a fluoropolymer-based adhesive layer. The ceramic filler precursor component may include a first filler precursor material. The first filler precursor material may further have an average particle size of about 10 micrometers or less and a particle size distribution span (PSDS) of about 5 or less. The PSDS is equal to (D - D ), where D is equal to the D particle size distribution measurement value of the first filler precursor material, D is equal to the D particle size of the first filler precursor material, and D 90 is equal to the D 10 particle size distribution measurement value of the first filler precursor material. 50 90 material, and D is equal to the D 90 particle size distribution measurement value of the first filler precursor material, D 10 is equal to the D 10 particle size distribution measurement value of the first filler precursor material, and D 50 is equal to the D 50 particle size distribution measurement value of the first filler precursor material.

[0011] According to yet another aspect, a method for forming a dielectric substrate includes forming a mixture by combining a resin matrix precursor component and a ceramic filler precursor component, forming the mixture into a polymer-based core film, and coating the polymer-based core film with a fluoropolymer-based adhesive layer. The ceramic filler precursor component ​​​​​The minute may include a first filler precursor material. The first filler material may further have an average particle size of about 10 micrometers or less, and an average surface area of about 8.0 m / g or less. 2

[0012] According to another aspect, a method of forming a copper-clad laminate may include providing a copper foil layer, forming a mixture by combining a resin matrix precursor component and a ceramic filler precursor component, forming the mixture into a polymer-based core film, and providing a fluoropolymer-based adhesive layer between the polymer-based core film and the copper foil. The ceramic filler precursor component may include a first filler precursor material. The particle size distribution of the first filler material may have at least about 0.5 micrometer and a D of about 1.6 or less, 10 at least about 0.8 micrometer and a D of about 2.7 micrometers or less, 50 and at least about 1.5 micrometers and a D of about 4.7 micrometers or less. 90

[0013] According to yet another aspect, a method of forming a copper-clad laminate may include providing a copper foil layer, forming a mixture by combining a resin matrix precursor component and a ceramic filler precursor component, forming the mixture into a polymer-based core film, and providing a fluoropolymer-based adhesive layer between the polymer-based core film and the copper foil. The ceramic filler precursor component may include a first filler precursor material. The first filler precursor material may have an average particle size of about 10 micrometers or less, and a particle size distribution span (PSDS) of about 5 or less. The PSDS is (D -D 90 -D10 ) / D 50 is equal to to D 90 is the D of the first filler precursor material 90 equal to the measured value of the particle size distribution of D 10 is the D of the first filler precursor material 10 equal to the measured value of the particle size distribution of D 50 is the first filler precursor material's D 50 equal to the measured value of the particle size distribution.

[0014] According to yet another aspect, a method of forming a copper-clad laminate includes providing a copper foil layer and forming a mixture by combining a resin matrix precursor component and a ceramic filler precursor component, forming the mixture into a polymer-based core film, and providing a fluoropolymer-based adhesive layer between the polymer-based core film and the copper foil. The ceramic filler precursor component may include a first filler precursor material. The first filler material may further have an average particle size of about 10 micrometers or less and an average surface area of about 8.0 m / g or less. resin matrix precursor component and a ceramic filler precursor component to form a mixture forming, forming the mixture into a polymer-based core film, and providing a fluoropoly mer-based adhesive layer between the polymer-based core film and the copper foil. The ceramic filler precursor component may include a first filler precursor material. The first filler material may further have an average particle size of about 10 micrometers or less and an average surface area of about 8.0 m / g or less. mer-based adhesive layer between the polymer-based core film and the copper foil. The ceramic filler precursor component may include a first filler precursor material. The first filler material may further have an average particle size of about 10 micrometers or less and an average surface area of about 8.0 m / g or less. filling material has an average particle size of about 10 micrometers or less and an average surface area of about 8.0 m 2 / g or less and an average surface area.

Brief Description of the Drawings

[0015] Embodiments are shown by way of example and are not limited to the accompanying drawings.

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

[0016] Those skilled in the art should understand that the elements in the figures are illustrated for the purpose of simplification and clarity, and are not necessarily drawn to scale. It is to be understood that they are not drawn to scale.

Embodiments for Carrying Out the Invention

[0017] The following discussion focuses on specific embodiments and implementations of the teachings. The detailed description is provided to assist in explaining specific embodiments and should not be construed as a limitation on the scope or applicability of the present disclosure or teachings. It will be understood that other embodiments can be used based on the present disclosure and teachings provided herein.

[0018] The terms “comprises,” “comprising,” “includes,” “ including,” “has,” “having,” or any other variations thereof are intended to cover non-exclusive inclusion. For example, a method, article, or device that includes a list of features is not necessarily limited to only those features, but may include other features not explicitly listed or other features inherent to such a method, article, or device. Further, unless there is a conflicting description, “or” refers to inclusive or and not exclusive or. For example, condition A or B is satisfied by any one of the following: A is true (or exists) and B is false (or does not exist), or A is false (or does not exist) and B is true (or exists). For example, condition A or B is satisfied by any one of the following: A is true (or exists) and B is false (or does not exist), or A is false (or does not exist) and B is true (or exists). A is false (or does not exist), B is true (or exists), and both A and B are true (or exist).

[0019] Also, the use of "a" or "an" is employed to describe the elements and components described herein. This is done merely for convenience and to give a general meaning to the scope of the present invention. This description is clearly meant not to mean otherwise, unless one, at least one, or the singular form is taken to include the plural form or vice versa as understood. For example, if a single article is described herein, two or more articles can be used instead of the single article. Similarly, if two or more articles are described herein, those two or more articles can be replaced by a single article if possible.

[0020] The embodiments described herein generally relate to a dielectric substrate that may include a polymer-based core film and a fluoropolymer-based adhesive layer. According to certain embodiments, the polymer-based core film may include a resin matrix component and a ceramic filler component.

[0021] Referring first to a method of forming a dielectric substrate, FIG. 1 includes a diagram showing a forming method 100 for forming a dielectric substrate according to the embodiments described herein. According to certain embodiments, the forming method 100 includes a first step 110 of combining a resin matrix precursor component and a ceramic filler precursor component to form a forming mixture, a second step 120 of forming the forming mixture into a polymer-based core film, and a step of forming the polymer-based core film into a full filling the polymer-based core film with a fluoropolymer-based adhesive layer ​​​​​​A third step 130 of coating with an oropolymer-based adhesive layer can be included .

[0022] According to a particular embodiment, the ceramic filler precursor component can have particular properties that can improve the performance of the dielectric substrate formed by the forming method 100 and may include a first filler precursor material .

[0023] According to a particular embodiment, the first filler precursor material may have a particular size distribution . For the purposes of the embodiments described herein, the particle size distribution of a material, e.g., the particle size distribution of the first filler precursor material, can be described using any combination 10 of D 50 , D 90 . The D value from the particle size distribution is defined as the particle size value at which 10% of the particles are smaller than that value 10 and 90% of the particles are larger than that value. The D value from the particle size distribution 50 is defined as the particle size value at which 50% of the particles are smaller than that value and 50% of the particles are larger than that value . The D value from the particle size distribution is defined as the particle size value at which 90% of the particles are smaller than that value and 90 10% of the particles are larger than that value. For the purposes of the embodiments described herein, the particle size measurement of a particular material is performed using laser diffraction spectroscopy . According to a particular embodiment, the first filler precursor material may have a particular size distribution D

[0024] value 10 . For example, the D of the first filler precursor material can be at least about 0.5 micrometer 10 , e.g., at least about 0.6 micrometer, or at least about 0.7 mic rometer 1.6 micrometers, or at least about 0.8 micrometers, or at least about 0.9 micro meters, or at least about 1.0 micrometers, or at least about 1.1 micro meters, or even at least about 1.2 micrometers. Further According to other embodiments, the D of the first filler material 10 is about 1.6 micrometers or less, for example, about 1.5 micrometers or less, or even about 1.4 micrometers or less may be. The D of the first filler precursor material 10 is understood to be any value between and including any of the above minimum values and the maximum values. It will be understood that the D of the first filler precursor material is within and includes the range between and including any of the above minimum values and the maximum value. 10 It will be further understood that the D of the first filler precursor material is within and includes the range between and including any of the above minimum values and the maximum value. will be.

[0025] According to other embodiments, the first filler precursor material may have a specific size distribution D 50 value. For example, the D of the first filler precursor material is at least about 0.8 micro 50 meters, for example, at least about 0.9 micrometers, or at least about 1.0 micro meters, or at least about 1.1 micrometers, or at least about 1.2 micro meters, or at least about 1.3 micrometers, or at least about 1.4 micro meters, or at least about 1.5 micrometers, or at least about 1.6 micro meters, or at least about 1.7 micrometers, or at least about 1.8 micro meters, or at least about 1.9 micrometers, or at least about 2.0 micro meters, or at least about 2.1 micrometers, or at least about 2.2 micro Chrometer, or at least about 2.1 micrometers, or even at least about 2. 2 micrometers may be sufficient. According to still other embodiments, the D of the first filler material 50 is, for example, about 2.6 micrometers or less, or about 2.5 micrometers or less, or even about 2.4 micrometers or less may be sufficient. The D of the first filler precursor material 50 is understood to be any value between and including any of the above minimum values and any of the maximum values will be understood. The D of the first filler precursor material 50 is further understood to be within and including any of the above minimum values and any of the maximum values range.

[0026] According to other embodiments, the first filler precursor material has a specific size distribution D 90 value may be sufficient. For example, the D of the first filler precursor material 90 is at least about 1.5 micrometers For example, at least about 1.6 micrometers, or at least about 1.7 microns Chrometer, or at least about 1.8 micrometers, or at least about 1.9 microns Chrometer, or at least about 2.0 micrometers, or at least about 2.1 microns Chrometer, or at least about 2.2 micrometers, or at least about 2.3 microns Chrometer, or at least about 2.4 micrometers, or at least about 2.5 microns Chrometer, or at least about 2.6 micrometers, or even at least about 2. 7 micrometers may be sufficient. According to still other embodiments, the D of the first filler material 90is about 8.0 micrometers or less, for example, about 7.5 micrometers or less, or about 7.0 micrometers or less, or about 6.5 micrometers or less, or about 6.0 mic rometers or less, or about 5.5 micrometers or less, or about 5.4 micrometers or less, or about 5.3 micrometers or less, or about 5.2 micrometers or less, or fur ther may be about 5.1 micrometers or less. The D of the first filler precursor material 90 is between any of the above minimum values and any of the maximum values and any value including them may be understood. The D of the first filler precursor material 90 is within the range between any of the above minimum values and any of the maximum values and including them and may be further understood.

[0027] According to still other embodiments, the first filler precursor material may have a specific average particle size measured using laser diffraction spectroscopy For example, the average particle size of the first filler precursor material is about 10 micrometers or less, for example, about 9 micrometers or less, or about 8 mic rometers or less, or about 7 micrometers or less, or about 6 micrometers or less, or about 5 micrometers or less, or about 4 micrometers or less, or about 3 micrometers or less, or even further may be about 3 micrometers or less. The average particle size of the first filler precursor mate rial is any value between any of the above values and including any of the above values and may be understood. The average particle size of the first filler precursor material is any value within the range between the above values and including the above values and may be further understood .

[0028] According to yet another embodiment, the first filler precursor material may be described as having a specific particle size distribution span (P SDS), where PSDS is (D 90 - D 10 ) / D5 equal to 0, D 90 is equal to the D 90 particle size distribution measurement value of the first filler precursor material, D1 0 is equal to the D 10 particle size distribution measurement value of the first filler precursor material, D 50 is equal to the D particle size distribution measurement value of the first filler 50 precursor material. For example, the PS DS of the first filler precursor material is about 5 or less, for example, about 4.5 or less, or about 4.0 or less, or about 3.5 or less, or about 3.0 or less, or even about 2.5 or less. The PS DS of the first filler precursor material may be any value between the above-mentioned arbitrary values and including the above-mentioned arbitrary values as will be understood. The PSDS of the first filler precursor material may be any value within the range between the above-mentioned values and including the above-mentioned values, which will be further understood as well.

[0029] According to yet another embodiment, the first filler precursor material can be described as having a specific average surface area measured using the Brunauer - Emmett - Teller (BET) surface area analysis method (nitrogen adsorption). For example, the first filler precursor material has an average surface area of about 8 m / g or less, for example, about 7.9 m 2 / g or less, or about 7.5 m 2 / g or less, or 2 is about 7.0 m / g or less, or about 6.5 m 2 / g or less, or about 6.0 m 2 / g or less, or 2 ​ about 5.5 m 2 / g or less, or about 5.0 m 2 / g or less, or about 4.5 m 2 / g or less, or about 4.0 m 2 / g or less, or even about 3.5 m 2 It may have an average surface area of / g or less. Further According to other embodiments, the first filler precursor material is at least about 1.2 m 2 / g, for example, at least about 2.2 m 2 / g. The average surface area of the first filler precursor material may be between any of the above minimum values and any of the maximum values and any value including them will be understood. The average surface area of the first filler precursor material may be between any of the above minimum values and any of the maximum values and within a range including them will be further understood. any value including them will be understood. The average surface area of the first filler precursor material may be between any of the above minimum values and any of the maximum values and within a range including them will be further understood.

[0030] According to other embodiments, the first filler precursor material may include a specific material. In particular According to certain embodiments, the first filler precursor material may include a silica-based compound. Further According to other embodiments, the first filler precursor material may be composed of a silica-based compound as well. According to other embodiments, the first filler precursor material may include silica. Further still According to other embodiments, the first filler precursor material may be composed of silica.

[0031] According to still other embodiments, the forming mixture may include a ceramic filler precursor component in a specific content. For example, the content of the ceramic filler precursor component is at least about 45% by volume, for example, at least about 46% by volume, or at least about, with respect to the total volume of the forming mixture At least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or even at least about 54% by volume. According to yet other embodiments, the content of the ceramic filler precursor component is relative to the total volume of the forming mixture and may be about 57% by volume or less, for example, about 56% by volume or less, or even about 55% by volume or less. It will be understood that the content of the ceramic filler precursor component may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the ceramic filler precursor component may be within the range between and including any of the above minimum values and any of the above maximum values.

[0032] According to yet other embodiments, the ceramic filler precursor component may include a first filler precursor material at a specific content. For example, the content of the first filler precursor material is at least about 80% by volume relative to the total volume of the ceramic filler precursor component, for example, at least about 81% by volume, or at least about 82% by volume, or at least about 83% by volume, or at least about 84% by volume, or at least about 85% by volume, or at least about 86% by volume, or at least about 87% by volume, or at least about 88% by volume, or at least about 89% by volume, or even at least about 90% by volume. According to yet other embodiments, the content of the first filler precursor material is about 100% by volume or less relative to the total volume of the ceramic filler precursor component, for example, about 99% by volume or less, or about 98% by volume or less, or about 97% by volume or less, Or about 96% by volume or less, or about 95% by volume or less, or about 94% by volume or less, or about 93 % by volume or less, or even about 92% by volume or less. The content of the first filler precursor material may be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the content of the first filler precursor material may be within and including the range between any of the above minimum values and any of the above maximum values. It will be further understood that it may be so.

[0033] According to still other embodiments, the ceramic filler precursor component may include a second filler precursor material.

[0034] According to still other embodiments, the second filler precursor material may include a specific material. For example, the second filler precursor material may include a high dielectric constant ceramic material, for example, a ceramic material having a dielectric constant of at least about 14. According to a specific embodiment, the second filler precursor material may include a high dielectric constant ceramic material, for example, TiO2, SrTiO3, Zr Ti2O6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof.

[0035] According to still other embodiments, the second filler precursor material may include TiO2. According to still other embodiments, the second filler precursor material may be composed of TiO2.

[0036] According to still other embodiments, the ceramic filler precursor component may include a second filler precursor material having a specific content. For example, the content of the second filler precursor material may be ceramic At least about 1 volume %, for example, at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or even at least about 10 volume % may be sufficient with respect to the total volume of the hook filler precursor component. According to still other embodiments, the content of the second filler precursor material is about 20 volume % or less, for example, about 19 volume % or less, or about 18 volume % or less, or about 17 volume % or less, or about 16 volume % or less, or about 15 volume % or less, or about 14 volume % or less, or about 13 volume % or less, or about 12 volume % or less, with respect to the total volume of the ceramic filler precursor component. It will be understood that the content of the second filler precursor material may be any value between and including any of the above minimum values and any of the above maximum values. The content of the second filler precursor material may be further understood to be within and including the range between any of the above minimum values and any of the above maximum values.

[0037] According to still other embodiments, the ceramic filler precursor component may include an amorphous material in a specific content. For example, the ceramic filler precursor component may include at least about 97%, for example, at least about 98%, or even at least about 99% of the amorphous material. It will be understood that the content of the amorphous material may be any value between any of the above values and including any value that includes any of the above values. The content of the content of the amorphous material may be further understood to be any value within the range between the above values and including the above values. It will be possible. According to other embodiments, the resin matrix precursor component may include a specific material. For example, the resin matrix precursor component may include a perfluoropolymer. According to still other embodiments, the resin matrix precursor component may be composed of a perfluoropolymer.

[0038] According to still other embodiments, the perfluoropolymer of the resin matrix precursor component may be a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. According to other embodiments, the perfluoropolymer of the resin matrix precursor component may be a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. According to still other embodiments, the perfluoropolymer of the resin matrix precursor component may include polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the perfluoropolymer of the resin matrix precursor component

[0039] According to still other embodiments, the perfluoropolymer of the resin matrix precursor component may include polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the perfluoropolymer of the resin matrix precursor component may include a combination of polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. The fluoropolymers are polytetrafluoroethylene (PTFE), perfluoroalkoxy Polymer resin (PFA), fluorinated ethylene propylene (FEP), or any of these It may also consist of a combination.

[0040] According to yet another embodiment, the forming mixture comprises a specific content of resin matrix precursor. For example, the content of the resin matrix precursor component may be less than the total content of the forming mixture. By volume, at least about 45% by volume, for example, at least about 46% by volume, or less At least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at ... at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or is at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume According to yet another embodiment, the content of the resin matrix precursor component may be % by volume. The amount is about 63% by volume or less, or about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less The content of the resin matrix precursor component is preferably about 57% by volume or less. Any value between and including one of the minimum and one of the maximum values. It will be understood that the content of the resin matrix precursor component may be the same as that of the resin matrix precursor component described above. The range is between one of the minimum values and one of the maximum values, including It will be further understood that

[0041] According to yet another embodiment, the forming mixture contains a specific content of perfluoropolymer. For example, the content of the perfluoropolymer may be At least about 45% by volume, for example, at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume. According to further other embodiments, the content of the perfluoropolymer may be about 63% by volume or less, for example, about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less, or even about 57% by volume or less, with respect to the total volume of the forming mixture. It will be understood that the content of the perfluoropolymer may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the perfluoropolymer may be within the range between and including any of the above minimum values and any of the above maximum values. Here, referring to an embodiment of a dielectric substrate formed according to forming method 100, FIG. 2 includes a diagram of a dielectric substrate 200. As shown in FIG. 2, the dielectric substrate 200 may include a polymer-based core film 203 and a fluoropolymer-based adhesive layer 207. As further shown in FIG. 2, the polymer-based core film 203 may include a resin matrix component 210 and a ceramic filler component 220. According to a particular embodiment, the ceramic filler component 220 affects the performance of the dielectric substrate 200.

[0042]

[0043] It may include a first filler material that can have specific properties that can be improved. Yes.

[0044] According to a particular embodiment, the first filler material of the ceramic filler component 220 may have a specific size distribution. For the purposes of the embodiments described herein, the particle size distribution of the material, e.g., the particle size distribution of the first filler material, can be described using any combination of 10 D 50 and 90 D from the particle size distribution. The 10 D value from the particle size distribution is defined as the particle size value at which 10% of the particles are smaller than that value and 90% of the particles are larger than that value. The D value from the particle size distribution is defined as the particle size value at which 50% of the particles are smaller than that 50 value and 50% of the particles are larger than that value. The 90 D value from the particle size distribution is defined as the particle size value at which 90% of the particles are smaller than that value and 10% of the particles are larger than that value. For the purposes of the embodiments described herein, the particle size measurement of a particular material is performed using laser diffraction spectroscopy as. Done.

[0045] According to a particular embodiment, the first filler material of the ceramic filler component 220 may have a specific size distribution 10 D value. For example, the 10 D of the first filler material is at least about 0.5 micrometers, e.g., at least about 0.6 micrometers, or at least about 0.7 micrometers, or at least about 0.8 micrometers, or at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least is at least about 1.1 micrometers, or even at least about 1.2 micrometers This may be the case. According to still other embodiments, the D of the first filler material 10 is about 1.6 microns or less, for example, about 1.5 micrometers or less, or even about 1.4 micrometers or less. The D of the first filler material 10 may be any value between and including any of the above minimum values and any of the above maximum values, as will be understood . The D of the first filler material is further understood to be within a range between and including any of the above minimum values and any of the above maximum values 10 . This will be further understood .

[0046] According to other embodiments, the first filler material of the ceramic filler component 220 may have a specific size distribution D 50 . For example, the D of the first filler material 50 is at least about 0.8 micrometers, for example, at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or at least about 1.2 micrometers, or at least about 1.3 micrometers, or at least about 1.4 micrometers, or at least about 1.5 micrometers, or at least about 1.6 micrometers, or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers, or at least about 2.0 micrometers, or at least about 2.1 micrometers, or even at least about 2.2 micrometers. According to still other embodiments, the first ​D of the filler material 50 is, for example, about 2.6 micrometers or less, or about 2.5 micrometers or less, or even about 2.4 micrometers or less. D of the first filler material 50 is understood to be any value between and including any of the above minimum values and any of the above maximum values. D of the first filler material is further understood to be within a range between and including any of the above minimum values 50 and any of the above maximum values. .

[0047] According to other embodiments, the first filler material of the ceramic filler component 220 may have a specific size distribution D 90 value. For example, D of the first filler material 90 is at least about 1.5 micrometers, for example, at least about 1.6 micrometers, or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers, or at least about 2.0 micrometers, or at least about 2.1 micrometers, or at least about 2.2 micrometers, or at least about 2.3 micrometers, or at least about 2.4 micrometers, or at least about 2.5 micrometers, or at least about 2.6 micrometers, or even at least about 2.7 micrometers. According to still other embodiments, D of the first filler material 90 is about 8.0 micrometers or less, for example, about 7.5 micrometers or less, or about 7.0 micrometers or less, or about 6.5 micrometers or less, or about 6.0 micrometers or less, or about 5.5 micrometers or less, or about 5.4 micrometers or less, or about 5.3 micrometers or less, or about 5.2 micrometers or less, or even about 5.1 micrometers or less. The D of the first filler material of 90 may be any value between any of the above minimum values and any of the above maximum values and including them as will be understood. The D of the first filler material 90 is between any of the above minimum values and any of the above maximum values and within a range including them as will be further understood.

[0048] According to yet other embodiments, the first filler material of the ceramic filler component 220 may have a specific average particle size measured by laser diffraction spectroscopy. For example, the average particle size of the first filler material may be about 10 micrometers or less, for example, about 9 micrometers or less , or about 8 micrometers or less, or about 7 micrometers or less, or about 6 micrometers or less, or about 5 micrometers or less, or about 4 micrometers or less, or about 3 micrometers or less, or even about 2 micrometers or less. The average particle size of the first filler material may be any value between any of the above values and including any of the above values as will be understood. The average particle size of the first filler material may be any value within the range between the above values and including the above values as will be further understood. as will be further understood.

[0049] According to yet other embodiments, the first filler material of the ceramic filler component 220 is specifically It may be described as having a specific particle size distribution span (PSDS), and the PSDS may be D 90 -D 10 ) / D 50 is equal to D 90 is the D of the first filler material 90 Particle size distribution measurement value is equal to D 10 is the D of the first filler material 10 D is equal to the particle size distribution measurement 50 teeth, D of the first filler material 50 Equivalent to a particle size distribution measurement, e.g., the PSD of the first filler material S is about 5 or less, for example, about 4.5 or less, or about 4.0 or less, or about 3.5 or less, or about The PSDS of the first filler material may be 3.0 or less, or even about 2.5 or less. It may be any value between and including any of the values above. It will be understood that the PSDS of the first filler material may be any value within the range between the values above. It will be further understood that the value may be inclusive of the values stated above.

[0050] According to yet another embodiment, the first filler material of the ceramic filler component 220 is B Runauer-Emmett-Teller (BET) surface area analysis (nitrogen adsorption) was used. The surface area of the particles can be described as having a particular average surface area measured using, for example, The first filler material is about 8 m 2 / g or less, for example, about 7.9m 2 / g or less, or about 7.5 m 2 / g or less, or about 7.0m 2 / g or less, or about 6.5m 2 / g or less, or about 6.0m 2 / g or less, or about 5.5m 2 / g or less, or about 5.0m 2 / g or less, or about 4.5m2 less than or equal to about 4.0 m² / g, or even about 3.5 m² / g 2 less than or equal to about 3.5 m² / g, or even about 3.0 m² / g 2 and may have an average surface area of less than or equal to about 3.0 m² / g According to yet other embodiments, the first filler material may have an average surface area of at least about 1.2 m² / g, for example, at least about 2.2 m² / g 2 / g. The average surface area of the first filler material may be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the average surface area of the first filler material may be within the range between and including any of the above minimum values and any of the above maximum values 2 / g. The average surface area of the first filler material may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the average surface area of the first filler material may be within the range between and including any of the above minimum values and any of the above maximum values and may include any value therebetween and including such values. It will be understood that the average surface area of the first filler material may be within the range between and including any of the above minimum values and any of the above maximum values and may include any value therebetween and including such values. It will be further understood that the average surface area of the first filler material may be within the range between and including any of the above minimum values and any of the above maximum values and may include any value therebetween and including such values. It will be understood that the average surface area of the first filler material may be within the range between and including any of the above minimum values and any of the above maximum values and may include any value therebetween and including such values. It will be further understood that the average surface area of the first filler material may be within the range between and including any of the above minimum values and any of the above maximum values

[0051] According to yet other embodiments, the fluoropolymer-based adhesive layer 207 may have a specific average thickness . For example, the average thickness of the adhesive layer 207 may be at least about 0.2 micrometers, for example, at least about 0.5 micrometers, or at least about 1.0 micrometer, or at least about 1.5 micrometers, or at least about 2.0 micrometers, or at least about 2.5 micrometers, or even at least about 3.0 micrometers . According to yet other embodiments, the average thickness of the adhesive layer 207 may be . For example, the average thickness of the adhesive layer 207 may be at least about 0.2 micrometers, for example, at least about 0.5 micrometers, or at least about 1.0 micrometer, or at least about 1.5 micrometers, or at least about 2.0 micrometers, or at least about 2.5 micrometers, or even at least about 3.0 micrometers . For example, the average thickness of the adhesive layer 207 may be at least about 0.2 micrometers, for example, at least about 0.5 micrometers, or at least about 1.0 micrometer, or at least about 1.5 micrometers, or at least about 2.0 micrometers, or at least about 2.5 micrometers, or even at least about 3.0 micrometers . For example, the average thickness of the adhesive layer 207 may be at least about 0.2 micrometers, for example, at least about 0.5 micrometers, or at least about 1.0 micrometer, or at least about 1.5 micrometers, or at least about 2.0 micrometers, or at least about 2.5 micrometers, or even at least about 3.0 micrometers . According to yet other embodiments, the average thickness of the adhesive layer 207 may be . For example, the average thickness of the adhesive layer 207 may be at least about 0.2 micrometers, for example, at least about 0.5 micrometers, or at least about 1.0 micrometer, or at least about 1.5 micrometers, or at least about 2.0 micrometers, or at least about 2.5 micrometers, or even at least about 3.0 micrometers . For example, the average thickness of the adhesive layer 207 may be at least about 0.2 micrometers, for example, at least about 0.5 micrometers, or at least about 1.0 micrometer, or at least about 1.5 micrometers, or at least about 2.0 micrometers, or at least about 2.5 micrometers, or even at least about 3.0 micrometers . For example, the average thickness of the adhesive layer 207 may be at least about 0.2 micrometers, for example, at least about 0.5 micrometers, or at least about 1.0 micrometer, or at least about 1.5 micrometers, or at least about 2.0 micrometers, or at least about 2.5 micrometers, or even at least about 3.0 micrometers less than a meter, or less than about 4.2 micrometers, or less than about 4.1 micrometers , or less than about 4.1 micrometers, or less than about 4.0 micrometers, or about 3. 9 micrometers or less, or less than about 3.8 micrometers, or less than about 3.7 micrometers or less, or less than about 3.6 micrometers, or even less than about 3.5 micrometers may be sufficient. It is understood that the average thickness of the adhesive layer 207 may be any value between and including any of the above minimum values and any of the maximum values . It will further be understood that the average thickness of the adhesive layer 207 may be within the range between and including any of the above minimum values and any of the maximum values . .

[0052] According to yet another embodiment, the fluoropolymer-based adhesive layer 207 may contain certain materials . For example, the fluoropolymer-based adhesive layer 207 may be a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP), etc copolymers and terpolymers of tetrafluoroethylene, perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), and derivatives and blends thereof ), but is not limited thereto. According to yet another embodiment, the fluoropolymer-based adhesive layer 207 may be a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP), etc copolymers and terpolymers of tetrafluoroethylene, perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), and derivatives and blends thereof ), but is not limited thereto. According to yet another embodiment, the fluoropolymer-based adhesive layer 207 may be a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified ​Polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP) Copolymers and terpolymers of tetrafluoroethylene such as perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), and may be composed of derivatives and blends thereof.

[0053] According to other embodiments, the first filler material of the ceramic filler component 220 may include a specific material. According to a specific embodiment, the first filler material may include a silica-based compound Further according to other embodiments, the first filler material may be composed of a silica-based compound According to other embodiments, the first filler material may include silica. Further According to other embodiments, the first filler material may be composed of silica.

[0054] According to still other embodiments, the polymer-based core film 203 may include a specific content of ceramic filler component 220. For example, the content of the ceramic filler component 220 is at least about 45% by volume, for example, at least at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume , or at least about 52% by volume, or at least about 53% by volume, or even at least about 54% by volume. According to still other embodiments, the content of the ceramic filler component 220 is about 57% by volume or less, for example, about 56% by volume or less, or even about 55% by volume or less, based on the total volume of the polymer-based core film 203. The ceramic filler component 22 The content of 0 may be any value between any of the above-mentioned minimum values and any of the maximum values and including them. It will be understood that the content of the ceramic filler component 22 0 may also be within the range between any of the above-mentioned minimum values and any of the maximum values and including them. It will be further understood that The content of 0 may be between any of the above-mentioned minimum values and any of the maximum values and including them and within the range including them.

[0055] According to yet another embodiment, the dielectric substrate 200 may include a ceramic filler component 220 with a specific content. For example, the content of the ceramic filler component 220 may be at least about 45% by volume, such as at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 5 2% by volume, or at least about 53% by volume, or even at least about 54% by volume, based on the total volume of the dielectric substrate 200. According to yet another embodiment, the content of the ceramic filler component 220 may be about 57% by volume or less, such as about 56% by volume or less, or even about 5 5% by volume or less, based on the total volume of the dielectric substrate 200. The content of the ceramic filler component 220 may be any value between any of the above-mentioned minimum values and any of the maximum values and including them and it will be understood that. The content of the ceramic filler component 220 may also be within the range between any of the above-mentioned minimum values and any of the maximum values and including them and it will be further understood that. According to yet another embodiment, the ceramic filler component 220 may include a first one with a specific content and a second one with a specific content. For example, the content of the first ceramic filler component 220 may be at least about 45% by volume, such as at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 5 2% by volume, or at least about 53% by volume, or even at least about 54% by volume, based on the total volume of the dielectric substrate 200. The content of the second ceramic filler component 220 may be about 57% by volume or less, such as about 56% by volume or less, or even about 5 5% by volume or less, based on the total volume of the dielectric substrate 200. The content of the ceramic filler component 220 may be any value between any of the above-mentioned minimum values and any of the maximum values and including them and it will be understood that. The content of the ceramic filler component 220 may also be within the range between any of the above-mentioned minimum values and any of the maximum values and including them and it will be further understood that.

[0056] According to yet another embodiment, the ceramic filler component 220 may include a first one with a specific content It may contain a filler material. For example, the content of the first filler material is at least about 80% by volume, such as at least about 81% by volume, with respect to the total volume of the ceramic filler component 220, for example, at least about 82% by volume, or at least about 83% by volume, or at least about 84% by volume, or at least about 85% by volume, or at least about 86% by volume, or at least about 87% by volume, or at least about 88% by volume, or at least about 89% by volume, or even at least about 90% by volume. According to still other embodiments, the content of the first filler material is about 100% by volume or less, such as about 99% by volume or less, or about 98% by volume or less, or about 97% by volume or less, or about 96% by volume or less, or about 95% by volume or less, or about 94% by volume or less, or about 93% by volume or less, or even about 92% by volume or less, with respect to the total volume of the ceramic filler component 220. It will be understood that the content of the first filler material may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the first filler material may be within the range between and including any of the above minimum values and any of the above maximum values. According to still other embodiments, the ceramic filler component 220 may contain a second filler material. According to still other embodiments, the second filler material of the ceramic filler component 220 may contain a specific material. For example, the second filler material may contain a high dielectric constant ceramic material, such as a ceramic material having a dielectric constant of at least about 14. In a specific embodiment, the second filler material of the ceramic filler component 220 may contain a high dielectric constant ceramic material, such as a ceramic material having a dielectric constant of at least about 14. It will be understood that the content of the first filler material may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the first filler material may be within the range between and including any of the above minimum values and any of the above maximum values. It will be understood that the content of the first filler material may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the first filler material may be within the range between and including any of the above minimum values and any of the above maximum values. It will be understood that the content of the first filler material may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the first filler material may be within the range between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the first filler material may be within the range between and including any of the above minimum values and any of the above maximum values. According to still other embodiments, the ceramic filler component 220 may contain a second filler material.

[0057] According to still other embodiments, the ceramic filler component 220 may contain a second filler material. According to still other embodiments, the second filler material of the ceramic filler component 220 may contain a specific material. For example, the second filler material may contain a high dielectric constant ceramic material, such as

[0058] a ceramic material having a dielectric constant of at least about 14. In a specific embodiment, the second filler material of the ceramic filler component 220 may contain a specific material. For example, the second filler material may contain a high dielectric constant ceramic material, such as a ceramic material having a dielectric constant of at least about 14. In a specific embodiment, According to this, the second filler material of the ceramic filler component 220 is a high dielectric constant ceramic material , for example, it may include TiO2, SrTiO3, ZrTi2O6, MgTiO3, CaTiO3, B aTiO4, or any combination thereof.

[0059] According to still other embodiments, the second filler material of the ceramic filler component 220 is T iO2 may be included. According to still other embodiments, the second filler material is from TiO2 It may be composed.

[0060] According to still other embodiments, the ceramic filler component 220 may include a specific content of the second filler material. For example, the content of the second filler material is at least about 1 volume % with respect to the total volume of the ceramic filler component 220, for example, at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or even at least about 10 volume %. According to still other embodiments the content of the second filler material is relative to the total volume of the ceramic filler component 220 about 20 volume % or less, for example, about 19 volume % or less, or about 18 volume % or less, or about 17 volume % or less, or about 16 volume % or less, or about 15 volume % or less, or about 14 volume % or less, or about 13 volume % or less, or about 12 volume % or less. The content of the second filler material is understood to be any value between and including any of the above minimum values and any of the above maximum values . It is understood that the content of the second filler material is within the range between and including any of the above minimum values and any of the above maximum values. It will be further understood that this may be the case.

[0061] According to still other embodiments, the ceramic filler component 220 may include a specific content of amorphous material. For example, the ceramic filler component 220 may include at least about 97%, for example, at least about 98%, or even at least about 99% of the amorphous material. It will be understood that the content of the amorphous material may be any value between any of the above values and may include any of the above values. It will be further understood that the content of the amorphous material may be any value within the range between the above values and may include the above values. It will be further understood that the content of the amorphous material may be any value within the range between the above values and may include the above values. It will be further understood that the content of the amorphous material may be any value within the range between the above values and may include the above values.

[0062] According to other embodiments, the resin matrix component 210 may include a specific material. For example, the resin matrix component 210 may include a perfluoropolymer. Further According to other embodiments, the resin matrix component 210 may be composed of a perfluoropolymer. It may be composed of a perfluoropolymer.

[0063] According to still other embodiments, the perfluoropolymer of the resin matrix component 210 is a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP ), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. According to other embodiments, the resin matrix component 210 of the perfluoropolymer may include a copolymer of tetrafluoroethylene (TFE), a hexafluoropropylene (HFP ), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. ), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. ), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof.

[0064] According to still other embodiments, the perfluoropolymer of the resin matrix component 210 is , polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (P FA), fluorinated ethylene propylene (FEP), or any combination thereof may be included . According to still other embodiments, the perfluoropolymer of the resin matrix component 210 is , polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof may consist of.

[0065] According to still other embodiments, the polymeric core film 203 may include a specific content of the resin matrix component 210. For example, the content of the resin matrix component 210 is , at least about 45% by volume, for example, at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume , or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume , or even at least about 55% by volume. According to still other embodiments, the content of the resin matrix component 210 is with respect to the total volume of the polymeric core film 203 about 63% by volume or less, or about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less, or even about 57% by volume or less . The content of the resin matrix component 210 is any of the above minimum values and the maximum value It will be understood that it may be any value between and including any of these. The content of the resin matrix component 210 may be any of the above minimum values and the maximum value It will be further understood that it may be within the range between and including any of these. of them.

[0066] According to still other embodiments, the dielectric substrate 200 may include a resin matrix component 210 in a specific content. For example, the content of the resin matrix component 210 is at least about 45% by volume, for example, at least about 46% by volume with respect to the total volume of the dielectric substrate 200, or at least about 47% by volume, or at least about 48% by volume , or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 5 2% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume. According to still other embodiments, the content of the resin matrix component 210 is about 63% by volume or less, or about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less, or even about 57% by volume or less with respect to the total volume of the dielectric substrate 200. The content of the resin matrix component 210 may be any value between and including any of the above minimum values and any of the maximum values. It will be understood that the content of the resin matrix component 210 may be within the range between and including any of the above minimum values and any of the maximum values.

[0067] According to still other embodiments, the polymer-based core film 203 has a specific content of per It may contain a fluoropolymer. For example, the content of the perfluoropolymer is at least about 45% by volume, for example, at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume, based on the total volume of the polymer system core film 203. According to still other embodiments, the content of the perfluoro polymer is about 63% by volume or less, for example, about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less, or even about 57% by volume or less, based on the total volume of the polymer system core film 203. It will be understood that the content of the perfluoropolymer may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the perfluoro polymer may be within the range between and including any of the above minimum values and any of the above maximum values.

[0068] According to still other embodiments, the dielectric substrate 200 may contain a perfluoropoly mer at a specific content. For example, the content of the perfluoropolymer is at least about 45% by volume, for example, at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or even at least about 53% by volume, based on the total volume of the dielectric substrate 200. is at least about 53% by volume, or at least about 54% by volume, or even at least about 55 % by volume. According to still other embodiments, the perfluoropolymer content is, with respect to the total volume of the dielectric substrate 200, about 63% by volume or less, for example, about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less, or even about 57% by volume or less. The perfluoropolymer content is any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the perfluoropolymer content is within the range between and including any of the above minimum values and any of the above maximum values. It will be further understood that the perfluoropolymer content may be within the range between and including any of the above minimum values and any of the above maximum values.

[0069] According to still other embodiments, the polymer-based core film 203 may include a specific porosity measured using X-ray diffraction. For example, the porosity of the polymer-based core film 203 is about 10% by volume or less, for example, about 9% by volume or less, or about 8% by volume or less, or about 7% by volume or less, or about 6% by volume or less, or even about 5% by volume or less. The porosity of the dielectric polymer-based core film 203 may be any value between any of the above values and including any of the above values. It will be understood that the porosity of the polymer-based core film 203 may be any value within the range between the above values and including the above values. It will be further understood that the porosity of the polymer-based core film 203 may be any value within the range between the above values and including the above values.

[0070] According to still other embodiments, the polymer-based core film 203 may have a specific average thickness. For example, the average thickness of the polymer-based core film 203 is at least about 10 µm ​​​ Micrometers, for example, at least about 15 micrometers, or at least about 20 micr ometers, or at least about 25 micrometers, or at least about 30 micr ometers, or at least about 35 micrometers, or at least about 40 micromet ers, or at least about 45 micrometers, or at least about 50 micrometers ers, or at least about 55 micrometers, or at least about 60 micrometers, or at least about 65 micrometers, or at least about 70 micrometers, or even at least about 75 micrometers may be sufficient. According to still o ther embodiments, the average thickness of the polymer-based core film 203 is about 2000 micrometers or less, for example about 1800 micrometers or less, about 1600 micrometers or less, about 1400 micrometers or less, about 1200 micrometers or less, or about 1000 micro meters or less, or about 800 micrometers or less, or about 600 micrometers or less, or about 400 micrometers or less, or about 200 micrometers or le ss, or about 190 micrometers or less, or about 180 micrometers or less, or about 170 micrometers or less, or about 160 micrometers or less, or a bout 140 micrometers or less, or about 120 micrometers or less, or even about 100 micrometers or less may be sufficient. It will be understood th at the average thickness of the polymer-based core film 203 may be any val Within and including the range between any one of the above-mentioned minimum values and any one of the maximum values It will be further understood that it may be so.

[0071] According to still other embodiments, the polymeric core film 203 may have a specific dissipation factor (Df) measured in the range of 5G at 20% RH Hz. For example, the polymeric core film 203 may have a loss factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0 .0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.001 5 or less, or about 0.0014 or less. The loss factor of the polymeric core film 203 may be any value between any of the above values and including any of the above values It will be understood that it may be so. The loss factor of the polymeric core film 203 may be any value within the range between the above values and including the above values. It will be further understood that it may be so.

[0072] According to still other embodiments, the polymeric core film 203 may have a specific loss factor (Df) measured in the range of 5G at 80% RH Hz. For example, the polymeric core film 203 may have a loss factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0 014 or less. The loss factor of the polymeric core film 203 may be any value between any of the above values and including any of the above values. It will be understood that it may be any value between any of the above values and including any of the above values.​ It will be. The loss factor of the polymer core film 203 can be any value within the range between the above values and may also be a value including the above values, which will be further understood. It will be further understood that the loss factor of the polymer core film 203 can be any value within the range between the above values and may also be a value including the above values.

[0073] According to still other embodiments, the polymer core film 203 may have a specific loss factor (Df) measured in the range of 10 GHz at 20% RH. For example, the polymer core film 203 may have a loss factor of about 0.005 or less, such as about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The loss factor of the polymer core film 203 can be any value between any of the above values and may also be a value including any of the above values, which will be understood. It will be further understood that the loss factor of the polymer core film 203 can be any value within the range between the above values and may also be a value including the above values. It will be further understood that the loss factor of the polymer core film 203 can be any value within the range between the above values and may also be a value including the above values. It will be further understood that the loss factor of the polymer core film 203 can be any value within the range between the above values and may also be a value including the above values. It will be further understood that the loss factor of the polymer core film 203 can be any value within the range between the above values and may also be a value including the above values. It will be further understood that the loss factor of the polymer core film 203 can be any value within the range between the above values and may also be a value including the above values. It will be understood that the loss factor of the polymer core film 203 can be any value between any of the above values and may also be a value including any of the above values. It will be understood that the loss factor of the polymer core film 203 can be any value within the range between the above values and may also be a value including the above values. It will be further understood that the loss factor of the polymer core film 203 can be any value within the range between the above values and may also be a value including the above values.

[0074] According to still other embodiments, the polymer core film 203 may have a specific loss factor (Df) measured in the range of 10 GHz at 80% RH. For example, the polymer core film 203 may have a loss factor of about 0.005 or less, such as about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The loss factor of the polymer core film 203 can be any value between any of the above values and may also be a value including any of the above values, which will be understood. It will be understood that the loss factor of the polymer core film 203 can be any value between any of the above values and may also be a value including any of the above values. It will be understood that the loss factor of the polymer core film 203 can be any value between any of the above values and may also be a value including any of the above values. It will be understood that the loss factor of the polymer core film 203 can be any value between any of the above values and may also be a value including any of the above values. It will be understood that the loss factor of the polymer core film 203 can be any value between any of the above values and may also be a value including any of the above values. It will be understood that the loss factor of the polymer core film 203 can be any value between any of the above values and may also be a value including any of the above values. It will be understood that the loss factor of the polymer core film 203 can be any value between any of the above values and may also be a value including any of the above values. will be. The loss factor of the polymer core film 203 is within the range between the above values and it will be further understood that it may be any value, including the above values.

[0075] According to still other embodiments, the polymer core film 203 may have a specific loss factor (Df) measured in the range of 28 GHz at 20% RH. For example, the polymer core film 203 may have a loss factor of about 0.005 or less, such as about 0.004 or less, or about 0.00 3 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0. 0014 or less. The loss factor of the polymer core film 203 may be any value between the above values, including any of the above values, as will be understood. will be. The loss factor of the polymer core film 203 is within the range between the above values and it will be further understood that it may be any value, including the above values.

[0076] According to still other embodiments, the polymer core film 203 may have a specific loss factor (Df) measured in the range of 28 GHz at 80% RH. For example, the polymer core film 203 may have a loss factor of about 0.005 or less, such as about 0.004 or less, or about 0.00 3 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0. 0014 or less. The loss factor of the polymer core film 203 may be any value between the above values, including any of the above values, as will be understood. It will be. The loss factor of the polymer core film 203 is within the range between the above values It will be further understood that it may be any value, including the above values.

[0077] According to still other embodiments, the polymer core film 203 may have a specific loss factor (Df) measured in the range of 39 GHz at 20% RH. For example, the polymer core film 203 may have a loss factor of about 0.005 or less, for example, about 0.004 or less, or about 0.00 3 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0. 0014 or less. It will be understood that the loss factor of the polymer core film 203 may be any value between the above any values, including any of the above values. It will be. The loss factor of the polymer core film 203 is within the range between the above values It will be further understood that it may be any value, including the above values.

[0078] According to still other embodiments, the polymer core film 203 may have a specific loss factor (Df) measured in the range of 39 GHz at 80% RH. For example, the polymer core film 203 may have a loss factor of about 0.005 or less, for example, about 0.004 or less, or about 0.00 3 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0. 0014 or less. It will be understood that the loss factor of the polymer core film 203 may be any value between the above any values, including any of the above values. will be. The loss factor of the polymer core film 203 is within the range between the above values and it will be further understood that it may be any value, including the above values.

[0079] According to still other embodiments, the polymer core film 203 may have a specific loss factor (Df) measured in the range of 76 to 81 GHz at 20% RH. For example, the polymer core film 203 may have a loss factor of about 0.005 or less, such as about 0.004 or less, or about 0 .003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less , or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The loss factor of the polymer core film 203 may be any value between any of the above values, including any of the above values and it will be understood. The loss factor of the polymer core film 203 may be any value within the range between the above values and it will be further understood that it may be any value, including the above values. will be.

[0080] According to still other embodiments, the polymer core film 203 may have a specific loss factor (Df) measured in the range of 76 to 81 GHz at 80% RH. For example, the polymer core film 203 may have a loss factor of about 0.005 or less, such as about 0.004 or less, or about 0 .003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less , or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The loss factor of the polymer core film 203 may be , any value between and including any of the above values. It will be understood that the loss factor of the polymer-based core film 203 may fall within the range between the above values. It will be further understood that the value may be any value within the range, inclusive of the values stated above. cormorant.

[0081] According to yet another embodiment, the polymer-based core film 203 is IPC-TM-65 0 2.4.24 Rev.C Glass Transition Temperat ure and Z-Axis Thermal Expansion by TMA Therefore, the polymer-based core film may have a specific coefficient of thermal expansion that is measured. 203 may have a coefficient of thermal expansion of about 80 ppm / °C or less.

[0082] Any of the dielectric substrates described herein (e.g., polymer-based core film 203 ) may also include an additional polymer-based layer on the outer surface of the first-mentioned dielectric substrate; and the additional polymer-based layer may include a filler as described herein (i.e., a filler The polymer layer may be filled (i.e., a non-filled polymer layer) or may be free of fillers (i.e., a non-filled polymer layer). It will be understood that the thickness of the layer is 1 / 2 mm.

[0083] According to yet other embodiments, the dielectric substrate 200 may have a particular average thickness. For example, the average thickness of the dielectric substrate 200 is at least about 10 micrometers, e.g., At least about 15 micrometers, or at least about 20 micrometers, or less at least about 25 micrometers, or at least about 30 micrometers, or at least at least about 35 micrometers, or at least about 40 micrometers, or at least about 45 micrometers, or at least about 50 micrometers, or at least about 55 micrometers, or at least about 60 micrometers, or at least about 65 micr ometers, or at least about 70 micrometers, or even at least about 75 micr ometers may be. According to still other embodiments, the average thick ness of the dielectric substrate 200 is about 2000 micrometers or less, fo r example, about 1800 micrometers or less, about 1600 micrometers or less, about 1400 micrometers or less, about 1200 micr ometers or less, or about 1000 micrometers or less, or about 800 micromet ers or less, or about 600 micrometers or less, or about 400 micrometers o r less, or about 200 micrometers or less, or about 190 micrometers or le ss, or about 180 micrometers or less, or about 170 micrometers or less, or about 160 micrometers or less, or about 150 micrometers or less, or about a bout 140 micrometers or less, or about 120 micrometers or less, or even about 100 micrometers or less. It will be understood that the av erage thickness of the dielectric substrate 200 may be any value between a ny of the above minimum values and any of the above maximum values and

[0084] include them. It will be further understood that the average thickness of the dielectric substrate 200 may be within a range between any of the abo Less than 0.005, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less, and may have a loss factor of It is understood that the loss factor of the dielectric substrate 200 may be any value between any of the above values and may be a value including any of the above values. The loss factor of the dielectric substrate 200 may be any value within the range between the above values and may be a value including the above values. This will be further understood. According to still other embodiments, the dielectric substrate 200 may have a specific loss factor (Df) measured in the range of 5 GHz at 80% RH. For example, the dielectric substrate 200 may be about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less, and may have a loss factor of

[0085] It is understood that the loss factor of the dielectric substrate 200 may be any value between any of the above values and may be a value including any of the above values. The loss factor of the dielectric substrate 200 may be any value within the range between the above values and may be a value including the above values. This will be further understood. According to still other embodiments, the dielectric substrate 200 may have a specific loss factor (Df) measured in the range of 10 GHz at 20% RH. For example, the dielectric substrate 200 may be about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less, and may have a loss factor of It is understood that the loss factor of the dielectric substrate 200 may be any value between any of the above values and may be a value including any of the above values. The loss factor of the dielectric substrate 200 may be any value within the range between the above values and may be a value including the above values. This will be further understood. It is understood that the loss factor of the dielectric substrate 200 may be any value within the range between the above values and may be a value including the above values. This will be further understood. According to still other embodiments, the dielectric substrate 200 may have a specific loss factor (Df) measured in the range of 10 GHz at 20% RH. For example, the dielectric substrate 200 may be about

[0086] 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less, and may have a loss factor of or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or has a loss factor of about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less The loss factor of the dielectric substrate 200 may be any value between any of the above values. It will be understood that the value may be any value including any of the values above. The loss factor of can be any value within the range of the above values, including the above values. It will be better understood.

[0087] According to yet another embodiment, the dielectric substrate 200 is rated for a temperature in the range of 10 GHz at 80% RH. For example, the dielectric substrate 200 may have a particular loss factor (Df) measured at about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or has a loss factor of about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less The loss factor of the dielectric substrate 200 may be any value between any of the above values. It will be understood that the value may be any value including any of the values above. The loss factor of can be any value within the range of the above values, including the above values. It will be better understood.

[0088] According to yet another embodiment, the dielectric substrate 200 is rated for a range of 28 GHz at 20% RH. For example, the dielectric substrate 200 may have a particular loss factor (Df) measured at about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or has a loss factor of about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less The loss factor of the dielectric substrate 200 may be any value between any of the above values. It will be understood that the value may be any value including any of the values above. The loss factor of can be any value within the range of the above values, including the above values. It will be better understood.

[0089] According to yet another embodiment, the dielectric substrate 200 is configured to operate in the range of 28 GHz at 80% RH. For example, the dielectric substrate 200 may have a particular loss factor (Df) measured at about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or has a loss factor of about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less The loss factor of the dielectric substrate 200 may be any value between any of the above values. It will be understood that the value may be any value including any of the values above. The loss factor of can be any value within the range of the above values, including the above values. It will be better understood.

[0090] According to yet another embodiment, the dielectric substrate 200 is configured to operate in the range of 39 GHz at 20% RH. For example, the dielectric substrate 200 may have a particular loss factor (Df) measured at about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or may have a loss coefficient of about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the loss coefficient of the dielectric substrate 200 may be any value between any of the above values and may be a value including any of the above values. The loss coefficient of the dielectric substrate 200 may be any value within the range between the above values and may be a value including the above values. This will be further understood.

[0091] According to still other embodiments, the dielectric substrate 200 may have a specific loss coefficient (Df) measured in the range of 39 GHz at 80% RH. For example, the dielectric substrate 200 may have a loss coefficient of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or may have a loss coefficient of about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the loss coefficient of the dielectric substrate 200 may be any value between any of the above values and may be a value including any of the above values. The loss coefficient of the dielectric substrate 200 may be any value within the range between the above values and may be a value including the above values. This will be further understood.

[0092] According to still other embodiments, the dielectric substrate 200 may have a specific loss coefficient (Df) measured in the range of 76 - 81 GHz at 20% RH. For example, the dielectric substrate 200 may be about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0. 002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less. a loss of less than or about 0.0016 or less than or about 0.0015 or less than or about 0.0014 and may have a coefficient. The loss coefficient of the dielectric substrate 200 can be any value between any of the above values and is understood to be a value that can be any value including any of the above values. The dielectric substrate 200 may have a loss coefficient that is any value within the range between the above values and that includes the above values and this will be further understood.

[0093] According to yet another embodiment, the dielectric substrate 200 may have a specific loss coefficient (Df) measured in the range of 76 - 81 GHz at 80% RH For example, the dielectric substrate 200 may have a loss coefficient of less than or about 0.005, for example, less than or about 0.004 or less than or about 0.003 or less than or about 0. 002 or less than or about 0.0019 or less than or about 0.0018 or less than or about 0.0017 or less than or about 0.0016 or less than or about 0.0015 or less than or about 0.0014 and may have a coefficient. The loss coefficient of the dielectric substrate 200 can be any value between any of the above values and is understood to be a value that can be any value including any of the above values. The dielectric substrate 200 may have a loss coefficient that is any value within the range between the above values and that includes the above values and this will be further understood.

[0094] According to yet another embodiment, the dielectric substrate 200 may have a specific coefficient of thermal expansion measured according to IPC - TM - 650 2.4. 24 Rev.C Glass Transition Temperature an d Z - Axis Thermal Expansion by TMA. For example, the dielectric substrate 200 may have a coefficient of thermal expansion of less than or about 80 ppm / °C.

[0095] Any dielectric substrate described herein (e.g., dielectric substrate 200) may initially include an additional polymer-based layer on the outer surface of the described dielectric substrate, and the additional po lymer-based layer may include a filler described herein (i.e., it may be a filled polymer layer ), or it may not include a filler (i.e., an unfilled polymer layer), which will be understood.

[0096] Here, refer to an embodiment of a copper-clad laminate that may include a dielectric substrate described herein. Such additional embodiments described herein generally relate to copper-clad laminates that may include a copper foil layer and a dielectric substrate covering the copper foil layer. According to a particular embodiment , the dielectric substrate may include a polymer-based core film and a fluoropolymer-based adhesive layer. According to a particular embodiment, the polymer-based core film may include a resin matrix component and a ceramic filler component.

[0097] Next, referring to a method of forming a copper-clad laminate, FIG. 3 includes a diagram showing a forming method 300 for forming a copper-clad laminate according to an embodiment described herein. According to a particular embodiment , the forming method 300 may include a first step 310 of providing a copper foil layer, and a second step 320 of combining a resin matrix precursor component and a ceramic filler precursor component to form a forming mixture, and a third step 3 30 of forming the forming mixture into a polymer-based core film, and a fourth step 340 of coating the polymer-based core film with a fluoropolymer-based adhesive layer to form a copper-clad laminate.

[0098] According to certain embodiments, the ceramic filler precursor component can have specific properties that can improve the performance of the dielectric substrate formed by forming method 300 and may include a first filler precursor material having specific properties that can improve the performance of the dielectric substrate formed by forming method 300 precursor material.

[0099] According to certain embodiments, the first filler precursor material may have a specific size distribution For the purposes of the embodiments described herein, the particle size distribution of a material, e.g., the particle size distribution of the first filler precursor material, can be described using any combination of particle size distribution D values, D 10 , D 50 and D 90 . The D value from the particle size distribution is defined as the particle size value at which 10% of the particles are smaller than that value 10 and 90% of the particles are larger than that value. The D value from the particle size distribution 50 is defined as the particle size value at which 50% of the particles are smaller than that value and 50% of the particles are larger than that value . The D value from the particle size distribution is defined as the particle size value at which 90% of the particles are smaller than that value and 90 10% of the particles are larger than that value. For the purposes of the embodiments described herein, the particle size measurement of a specific material is performed using laser diffraction spectroscopy . According to certain embodiments, the first filler precursor material may have a specific size distribution D

[0100] value 10 . For example, the D of the first filler precursor material can be at least about 0.5 micrometers 10 , e.g., at least about 0.6 micrometers, or at least about 0.7 micrometers , or at least about 0.8 micrometers, or at least about 0.9 micrometers , or at least about 1.0 micrometers, or at least about 1.1 micrometers , or at least about 1.2 micrometers. It may be 1.2 micrometers or even at least about 1.2 micrometers. Further According to other embodiments, the D of the first filler material 10 is 1.6 micrometers or less, for example, 1.5 micrometers or less, or even 1.4 micrometers or less. The D of the first filler precursor material 10 is understood to be any value between and including any of the above minimum values and any of the maximum values. It will be understood that the D of the first filler precursor material is understood to be within the range between and including any of the above minimum values and any of the maximum 10 values. It will be further understood that the D of the first filler precursor material is within the range between and including any of the above minimum values and any of the maximum

[0101] According to other embodiments, the first filler precursor material may have a specific size distribution D 50 value. For example, the D of the first filler precursor material is at least about 0.8 micrometers 50 For example, at least about 0.9 micrometers, or at least about 1.0 micrometers or at least about 1.1 micrometers, or at least about 1.2 micrometers, or at least about 1.3 micrometers or at least about 1.4 micrometers, or at least about 1.5 micrometers, or at least about 1.6 micrometers or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers or at least about 2.0 micrometers, or at least about 2.1 micrometers, or even at least about 2.2 micrometers. According to still other embodiments, the D of the first filler material is at least about 0.8 micrometers, for example, at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or at least about 1.2 micrometers, or at least about 1.3 micrometers, or at least about 1.4 micrometers, or at least about 1.5 micrometers, or at least about 1.6 micrometers, or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers, or at least about 2.0 micrometers, or at least about 2.1 micrometers, or even at least about 2. 2 micrometers. According to yet other embodiments, the D of the first filler material 50 is about 2.7 micrometers or less, for example, about 2.6 micrometers or less, or about 2.5 micrometers or less, or even about 2.4 micrometers or less may be. The D of the first filler precursor material 50 will be understood to be any value between and including any of the above minimum values and any of the maximum values. The D of the first filler precursor material 50 will be further understood to be within a range between and including any of the above minimum values and any of the maximum values.

[0102] According to other embodiments, the first filler precursor material may have a specific size distribution D 90 value For example, the D of the first filler precursor material 90 is at least about 1.5 micrometers , for example, at least about 1.6 micrometers, or at least about 1.7 micro meters, or at least about 1.8 micrometers, or at least about 1.9 micro meters, or at least about 2.0 micrometers, or at least about 2.1 micro meters, or at least about 2.2 micrometers, or at least about 2.3 micro meters, or at least about 2.2 micrometers, or at least about 2.5 micro meters, or at least about 2.6 micrometers, or even at least about 2. 7 micrometers may be. According to still other embodiments, the D of the first filler material 90 is about 8.0 micrometers or less, for example, about 7.5 micrometers or less, or about 7.0 micrometers or less, or about 6.5 micrometers or less, or about 6.0 micro ​​Less than or equal to about 5.5 micrometers, or less than or equal to about 5.4 micrometers, or about 5.4 micrometers or less, or less than or equal to about 5.3 micrometers, or less than or equal to about 5.2 micrometers, or even it may be less than or equal to about 5.1 micrometers. The D of the first filler precursor material 90 is between any of the above minimum values and any of the above maximum values and any value including them may be understood. The D of the first filler precursor material 90 is within the range between any of the above minimum values and any of the above maximum values and including them and it will be further understood that it may be.

[0103] According to still other embodiments, the first filler precursor material may have a specific average particle size measured using laser diffraction spectroscopy. For example, the average particle size of the first filler precursor material is less than or equal to about 10 micrometers, for example, less than or equal to about 9 micrometers, or less than or equal to about 8 micrometers, or less than or equal to about 7 micrometers, or less than or equal to about 6 micrometers, or less than or equal to about 5 micrometers, or less than or equal to about 4 micrometers, or less than or equal to about 3 micrometers or even less than or equal to about 2 micrometers. The average particle size of the first filler precursor material is any value between any of the above values and including any of the above values, and it will be understood that it may be. The average particle size of the first filler precursor material is any value within the range between the above values and including the above values, and it will be further understood that it may be.

[0104] According to still other embodiments, the first filler precursor material may be described as having a specific particle size distribution span (PSDS), and the PSDS is (D SDS), where90 -D 10 ) / D5 equal to 0, D 90 is the D of the first filler precursor material 90 equal to the particle size distribution measurement value of D1 0 is the D of the first filler precursor material 10 equal to the particle size distribution measurement value of D 50 is the first filling D of the agent precursor material 50 equal to the particle size distribution measurement value. For example, the PS of the first filler precursor material DS is about 5 or less, for example, about 4.5 or less, or about 4.0 or less, or about 3.5 or less, or about 3.0 or less, or even about 2.5 or less. The PS of the first filler precursor material DS can be any value between the above-mentioned arbitrary values and can be a value including the above-mentioned arbitrary values will be understood. The PSDS of the first filler precursor material can be any value within the range between the above-mentioned values and can be a value including the above-mentioned values, which will be further understood will be understood.

[0105] According to still other embodiments, the first filler precursor material can be described as having a specific average surface area measured using the Brunauer-Emmett-Teller (BET) surface area analysis method (nitrogen adsorption). For example, the first filler precursor material has an average surface area of about 8 m / g or less, for example, about 7.9 m 2 / g or less, or about 7.5 m 2 / g or less, or 2 is about 7.0 m / g or less, or about 6.5 m 2 / g or less, or about 6.0 m 2 / g or less, or 2 about 5.5 m / g or less, or about 5.0 m 2 / g or less, or about 4.5 m 2 / g or less, or about 2 4.0 m / g or less​2 It may have an average surface area of less than or equal to about 3.5 m² / g, or even further down to about 3.5 m² / g. 2 According to other embodiments, the first filler precursor material may have an average surface area of less than or equal to about 3.5 m² / g. Furthermore, according to other embodiments, the first filler precursor material may have an average surface area of at least about 1.2 m² / g, 2 for example, at least about 2.2 m² / g. 2 The average surface area of the first filler precursor material may be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the average surface area of the first filler precursor material may be within the range between and including any of the above minimum values and any of the above maximum values. It will be further understood that the average surface area of the first filler precursor material may be within the range between and including any of the above minimum values and any of the above maximum values. According to other embodiments, the first filler precursor material may contain specific materials. According to certain embodiments, the first filler precursor material may contain silica-based compounds.

[0106] Furthermore, according to other embodiments, the first filler precursor material may be composed of silica-based compounds. According to other embodiments, the first filler precursor material may contain silica. Furthermore, according to other embodiments, the first filler precursor material may be composed of silica. According to yet other embodiments, the first filler precursor material may contain silica. Furthermore, according to yet other embodiments, the first filler precursor material may be composed of silica.

[0107] According to yet other embodiments, the forming mixture may contain a specific content of the ceramic filler precursor component. For example, the content of the ceramic filler precursor component may be at least about 45% by volume, for example, at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or at least about 55% by volume, or at least about 56% by volume, or at least about 57% by volume, or at least about 58% by volume, or at least about 59% by volume, or at least about 60% by volume, or at least about 61% by volume, or at least about 62% by volume, or at least about 63% by volume, or at least about 64% by volume, or at least about 65% by volume, or at least about 66% by volume, or at least about 67% by volume, or at least about 68% by volume, or at least about 69% by volume, or at least about 70% by volume, or at least about 71% by volume, or at least about 72% by volume, or at least about 73% by volume, or at least about 74% by volume, or at least about 75% by volume, or at least about 76% by volume, or at least about 77% by volume, or at least about 78% by volume, or at least about 79% by volume, or at least about 80% by volume, or at least about 81% by volume, or at least about 82% by volume, or at least about 83% by volume, or at least about 84% by volume, or at least about 85% by volume, or at least about 86% by volume, or at least about 87% by volume, or at least about 88% by volume, or at least about 89% by volume, or at least about 90% by volume, or at least about 91% by volume, or at least about 92% by volume, or at least about 93% by volume, or at least about 94% by volume, or at least about 95% by volume, or at least about 96% by volume, or at least about 97% by volume, or at least about 98% by volume, or at least about 99% by volume, or at least about 100% by volume, based on the total volume of the forming mixture. may be at least about 53% by volume, or even at least about 54% by volume. Further, in other embodiments, according to the content of the ceramic filler precursor component, relative to the total volume of the forming mixture is about 57% by volume or less, for example, about 56% by volume or less, or even about 55% by volume or less may be. It is understood that the content of the ceramic filler precursor component may be any value between and including any of the above minimum values and any of the maximum values will be. It is further understood that the content of the ceramic filler precursor component may be within and including the range between any of the above minimum values and any of the maximum values will be. will be further understood.

[0108] In yet other embodiments, the ceramic filler precursor component may include a first filler precursor material having a specific content. For example, the content of the first filler precursor material is at least about 80% by volume, for example, at least about 81% by volume, or at least about 82% by volume, or at least about 83% by volume, or at least about 84% by volume, or at least about 85% by volume, or at least about 86% by volume, or at least about 87% by volume, or at least about 88% by volume, or at least about 89% by volume, or even at least about 90% by volume may be. In yet other embodiments, the content of the first filler precursor material is about 100% by volume or less, for example, about 99% by volume or less, or about 98% by volume or less, or about 97% by volume or less, or about 96% by volume or less, or about 95% by volume or less, or about 94% by volume or less, or about 93% by volume or even about 92% by volume or less may be. The content of the first filler precursor material It will be understood that it may be any value between and including any of the above-mentioned minimum values and any of the maximum values. The content of the first filler precursor material is also understood to be within a range between and including any of the above-mentioned minimum values and any of the maximum values.

[0109] According to yet another embodiment, the ceramic filler precursor component may include a second filler precursor material.

[0110] According to yet another embodiment, the second filler precursor material may include a specific material. For example, the second filler precursor material may include a high dielectric constant ceramic material, for example, a ceramic material having a dielectric constant of at least about 14. According to a specific embodiment, the second filler precursor material may include a high dielectric constant ceramic material, for example, TiO2, SrTiO3, Zr Ti2O6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof.

[0111] According to yet another embodiment, the second filler precursor material may include TiO2. According to yet another embodiment, the second filler precursor material may be composed of TiO2.

[0112] According to yet another embodiment, the ceramic filler precursor component may include a second filler precursor material having a specific content. For example, the content of the second filler precursor material is at least about 1% by volume, for example, at least about 2% by volume, or at least about 3% by volume, or at least about 4% by volume, or at least about 5% by volume, based on the total volume of the ceramic filler precursor component. ​​​​​by volume, or at least about 6% by volume, or at least about 7% by volume, or at least about 8% by volume, or at least about 9% by volume, or even at least about 10% by volume. According to still other embodiments, the content of the second filler precursor material is about 20% by volume or less, e.g., about 19% by volume or less, or about 18% by volume or less, or about 17% by volume or less, or about 16% by volume or less, or about 15% by volume or less, or about 14% by volume or less, or about 13% by volume or less, or about 12% by volume or less, with respect to the total volume of the ceramic filler precursor component. It will be understood that the content of the second filler precursor material may be any value between and including any of the above minimum values and any of the above maximum values. The content of the second filler precursor material may be further understood to be within and including the range between any of the above minimum values and any of the above maximum values.

[0113] According to still other embodiments, the ceramic filler precursor component may include an amorphous material in a specific content. For example, the ceramic filler precursor component may include at least about 97%, e.g., at least about 98%, or even at least about 99% amorphous material. The content of the amorphous material may be any value between any of the above values and including any of the above values, and it will be understood that the content may be any value that includes the above values. The content of the amorphous material content may be further understood to be any value within the range between the above values and including the above values.

[0114] Now, referring to an embodiment of a copper-clad laminate formed according to forming method 300, FIG. 4 includes a diagram of a copper-clad laminate 400. As shown in FIG. 4, the copper-clad laminate 400 may include a copper foil layer 4 02 and a dielectric substrate 405 covering the surface of the copper foil layer 402. As further shown in FIG. 4 The dielectric substrate 405 can include a polymer-based core film 403 and a fluoropolymer Based adhesive layer 407. As further shown in FIG. 4, the polymer-based core film 403 may include a resin matrix component 410 and a ceramic filler component 420 too.

[0115] According to a particular embodiment, the ceramic filler component 420 may include a first filler material having particular properties that can improve the performance of the copper-clad laminate 400 It may also be included. Yes.

[0116] According to a particular embodiment, the first filler material of the ceramic filler component 420 may have a particular Size distribution. For the purposes of the embodiments described herein, the particle size distribution of the material , for example, the particle size distribution of the first filler material, can be described using any combination of particle size distribution D values, D 10 , D 50 And D 90 of The D value from the particle size distribution can be described using any combination of particle size distribution D values, D 10 The value is defined as the particle size value such that 10% of the particles are smaller than that value and 90% of the particles are larger than that value. The D value from the particle size distribution The value is defined as the particle size value such that 50% of the particles are smaller than that value and 50% of the particles are larger than that value. The D value from the particle size distribution The D value from the particle size distribution 50 The value is defined as the particle size value such that 50% of the particles are smaller than that value and 50% of the particles are larger than that value. The D value from the particle size distribution The D value from the particle size distribution 90 The value is defined as the particle size value such that 90% of the particles are smaller than that value and 10% of the particles are larger than that value. For the purposes of the embodiments described herein, the particle size measurement of a particular material is performed using laser diffraction spectroscopy It is done. It is done. Yes.

[0117] According to certain embodiments, the first filler material of the ceramic filler component 420 is specific size distribution D 10 may have a value. For example, the D of the first filler material 10 is at least about 0.5 micrometers, for example, at least about 0.6 micrometers, or at least about 0.7 micrometers, or at least about 0.8 micrometers, or at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or even at least about 1.2 micrometers may be. According to still other embodiments, the D of the first filler material 10 is about 1.6 microns or less, for example, about 1.5 micrometers or less, or even about 1.4 micrometers or less. The D of the first filler material 10 may be any value between and including any of the above minimum values and any of the maximum values, as will be understood It will be understood that the D of the first filler material may be within and including the range between any of the above minimum values and any of the maximum values, as will be further understood 10 between any of the above minimum values and any of the maximum values and within the range including them. will be.

[0118] According to other embodiments, the first filler material of the ceramic filler component 420 is specific size distribution D 50 may have a value. For example, the D of the first filler material 50 is at least about 0.8 micrometers, for example, at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or at least to be about 1.2 micrometers, or at least about 1.3 micrometers, or at least to be about 1.4 micrometers, or at least about 1.5 micrometers, or at least to be about 1.6 micrometers, or at least about 1.7 micrometers, or at least to be about 1.8 micrometers, or at least about 1.9 micrometers, or at least to be about 2.0 micrometers, or at least about 2.1 micrometers, or even at least about 2.2 micrometers. According to still other embodiments, the D of the first filler material 50 is about 2.7 micrometers or less, for example, about 2.6 micrometers or less, or about 2.5 micrometers or less, or even about 2.4 micrometers or less. The D 50 of the first filler material may be any value between and including any of the above minimum values and any of the above maximum values, as will be understood. The D 50 of the first filler material may further be understood to be within the range between and including any of the above minimum values and any of the above maximum values.

[0119] According to other embodiments, the first filler material of the ceramic filler component 420 may have a specific 90 size distribution D 90 value. For example, the D of the first filler material is at least about 1.5 micrometers, for example, at least about 1.6 micrometers, or at least to be about 1.7 micrometers, or at least about 1.8 micrometers, or at least to be about 2.1 micrometers, or at least about 2.2 micrometers, or at least to be about 2.3 micrometers, or at least about 2.2 micrometers, or at least to be about 2.5 micrometers, or at least about 2.6 micrometers, or even at least about 2.7 micrometers. According to still other embodiments, the first filler material's D 90 is about 8.0 micrometers or less, for example, about 7.5 micrometers or less, or about 7.0 micrometers or less, or about 6.5 micrometers or less, or about 6.0 micrometers or less, or about 5.5 micrometers or less, or about 5.4 micrometers or less, or about 5.3 micrometers or less, or about 5.2 micrometers or less, or even about 5.1 micrometers or less. The first filler material 's D 90 is understood to be any value between any of the above minimum values and any of the above maximum values and including them. It will be understood that the D of the first filler material 90 is also understood to be within a range between any of the above minimum values and any of the above maximum values and including them.

[0120] According to still other embodiments, the first filler material of the ceramic filler component 420 may have a specific average particle size measured by laser diffraction spectroscopy. For example, the average particle size of the first filler material is about 10 micrometers or less, for example, about 9 micrometers or less or about 8 micrometers or less, or about 7 micrometers or less, or about 6 micrometers or less, or about 5 micrometers or less, or about 4 micrometers or less, or about 3 It may be less than or equal to micrometers, or even less than or equal to about 2 micrometers. The first charge The average particle size of the filler material is any value between any of the above values and includes any of the above values It will be understood that it may be a value. The average particle size of the first filler material is any value within the range between the above values It will be further understood that it may be a value including the above values.

[0121] According to yet another embodiment, the first filler material of the ceramic filler component 420 may be described as having a specific particle size distribution span (PSDS), where the PSDS is ( equal to ( D 90 -D 10 ) / D 50 where D 90 is equal to the D 90 particle size distribution measurement value of the first filler material, and D 10 is equal to the D 10 particle size distribution measurement value of the first filler material, and D 50 is equal to the D 50 particle size distribution measurement value of the first filler material. For example, the PSD S of the first filler material is about 5 or less, for example, about 4.5 or less, or about 4.0 or less, or about 3.5 or less, or about 3.0 or less, or even about 2.5 or less. The PSDS of the first filler material is any value between any of the above values and may be a value including any of the above values It will be understood. The PSDS of the first filler material is any value within the range between the above values and may be a value including the above values. It will be further understood.

[0122] According to yet another embodiment, the first filler material of the ceramic filler component 420 uses the Brunauer-Emmett-Teller (BET) surface area analysis method (nitrogen adsorption) ​​ The surface area of the particles can be described as having a particular average surface area measured using, for example, The first filler material is about 8 m 2 / g or less, for example, about 7.9m 2 / g or less, or about 7.5 m 2 / g or less, or about 7.0m 2 / g or less, or about 6.5m 2 / g or less, or about 6.0m 2 / g or less, or about 5.5m 2 / g or less, or about 5.0m 2 / g or less, or about 4.5m 2 / g or less, or about 4.0m 2 / g or less, or even about 3.5m 2 / g or less average surface area According to yet another embodiment, the first filler material may have a thickness of at least about 1.2 m. 2 / g, e.g., at least about 2.2 m 2 The first filling may have an average surface area of 1 / g. The average surface area of the agent material is between one of the minimum and one of the maximum values above. It will be understood that the first filler material may be any value inclusive of and including: The average surface area of the material is between one of the minimum and one of the maximum values above and It will be further understood that the range may include these.

[0123] According to yet another embodiment, the fluoropolymer adhesive layer 407 has a particular average thickness For example, the adhesive layer 407 may have an average thickness of at least about 0.2 micrometers. For example, at least about 0.5 micrometers, or at least about 1.0 micrometers or at least about 1.5 micrometers, or at least about 2.0 micrometers - Torr, or at least about 2.5 micrometers, or even at least about 3.0 micro meters. According to yet other embodiments, the average thickness of the adhesive layer 407 is about 7 micrometers or less, for example, about 6.5 or less, or about 6.0 or less, or about 5.0 or less , about 4.9 micrometers or less, or about 4.8 micrometers or less, or about 4.7 micro meters or less, or about 4.6 micrometers or less, or about 4.5 micrometers or less, or about 4.4 micrometers or less, or about 4.3 micrometers or less, or about 4.2 micrometers or less, or about 4.1 micrometers or less, or about 4.1 micro meters or less, or about 4.0 micrometers or less, or about 3.9 micrometers or less, or about 3.8 micrometers or less, or about 3.7 micrometers or less, or about 3.6 micrometers or less, or even about 3.5 micrometers or less. The average thickness of the adhesive layer 407 may be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the average thickness of the adhesive layer 407 may be within the range between and including any of the above minimum values and any of the above maximum values.

[0124] According to yet other embodiments, the fluoropolymer-based adhesive layer 407 may contain specific materials. For example, the fluoropolymer-based adhesive layer 207 may contain a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE ), copolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP), etc. ) - and terpolymers, perfluoroalkoxy polymer resins (PFA), and modified perfluoro oroalkoxy polymer resins (mPFA), and derivatives and blends thereof, inclu ding, but not limited to, these. According to still other embodiments, the fluoropolymer-based ad hesive layer 407 may be composed of a fluoropolymer (e.g., polytetrafluoroethylene (PTFE) , modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (F EP), etc., copolymers and terpolymers of tetrafluoroethylene, perfluoroalk oxy polymer resins (PFA), and modified perfluoroalkoxy polymer resins (mPF A), and derivatives and blends thereof.

[0125] According to other embodiments, the first filler material of the ceramic filler component 420 may include a specific material. According to a specific embodiment, the first filler material may include a silica-based compound and, according to still other embodiments, the first filler material may be composed of a silica-based compound. Acco rding to other embodiments, the first filler material may include silica, and according to still other embodiments, the first filler material may be composed of silica.

[0126] According to still other embodiments, the polymer-based core film 403 may include a specific content of the ceram ic filler component 420. For example, the content of the ceramic filler component 420 may be at least about 45 vol% with respect to the total volume of the polymer-based core film 203, such as at least about 46 vol%, or at least about 47 vol%, or at least about 48 vol%, or at least about 49 vol%, or at least about 50 vol%, or at least about 51 vol% or more. , or at least about 52% by volume, or at least about 53% by volume, or even at least about 54% by volume. According to yet other embodiments, the content of the ceramic filler component 420 is about 57% by volume or less, for example, about 56% by volume or less, or even about 55% by volume or less, based on the total volume of the polymeric core film 203. The content of the ceramic filler component 42 0 can be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the content of the ceramic filler component 42 0 can be within and include any range between and including any of the above minimum values and any of the above maximum values.

[0127] According to yet other embodiments, the dielectric substrate 405 may include a ceramic filler component 420 at a specific content. For example, the content of the ceramic filler component 420 is at least about 45% by volume, for example, at least about 46% by volume with respect to the total volume of the dielectric substrate 405, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume 52% by volume, or at least about 53% by volume, or even at least about 54% by volume. According to yet other embodiments, the content of the ceramic filler component 420 is about 57% by volume or less, for example about 56% by volume or less, or even about 5 5% by volume or less with respect to the total volume of the dielectric substrate 400. The content of the ceramic filler component 420 can be any value between and including any of the above minimum values and any of the above maximum values ​​​​​​​It will be understood. The content of the ceramic filler component 420 may be within and including the range between any of the above minimum values and any of the maximum values. It will be further understood.

[0128] According to still other embodiments, the ceramic filler component 420 may include a first filler material at a specific content. For example, the content of the first filler material is at least about 80% by volume, such as at least about 81% by volume with respect to the total volume of the ceramic filler component 420, or at least about 82% by volume, or at least about 83% by volume, or at least about 84% by volume or at least about 85% by volume, or at least about 86% by volume, or at least about 87% by volume or at least about 88% by volume, or at least about 89% by volume, or even at least about 90% by volume. According to still other embodiments, the content of the first filler material is about 100% by volume or less, such as about 99% by volume or less, or about 98% by volume or less, or about 97% by volume or less, or about 96% by volume or less with respect to the total volume of the ceramic filler component 220, or about 95% by volume or less, or about 94% by volume or less, or about 93% by volume or less, or even about 92% by volume or less. It will be understood that the content of the first filler material may be any value between and including any of the above minimum values and any of the maximum values. It will be further understood that the content of the first filler material may be within and including the range between any of the above minimum values and any of the maximum values. It will be understood that the content of the first filler material may be within and including the range between any of the above minimum values and any of the maximum values. It will be further understood.

[0129] According to still other embodiments, the ceramic filler component 420 includes a second filler material That's fine.

[0130] According to yet another embodiment, the second filler material of the ceramic filler component 420 is, in particular, For example, the second filler material may include a high dielectric constant ceramic material, such as For example, the ceramic material may include a ceramic material having a dielectric constant of at least about 14. According to the present invention, the second filler material of the ceramic filler component 420 is a high dielectric constant ceramic material. , for example, TiO2, SrTiO3, ZrTi2O6, MgTiO3, CaTiO3, B aTiO4, or any combination thereof.

[0131] According to yet another embodiment, the second filler material of the ceramic filler component 420 is T According to yet another embodiment, the second filler material may comprise TiO. It may be configured.

[0132] According to yet another embodiment, the ceramic filler component 420 comprises a specific content of a second For example, the content of the second filler material may be greater than or equal to the content of the ceramic filler component. At least about 1% by volume, for example, at least about 2% by volume, based on the total volume of the component 420; is at least about 3% by volume, or at least about 4% by volume, or at least about 5% by volume, or At least about 6% by volume, or at least about 7% by volume, or at least about 8% by volume, or less It may be at least about 9% by volume, or even at least about 10% by volume. According to an embodiment, the content of the second filler material is about 100% by volume of the ceramic filler component 220. and about 20% by volume or less, for example, about 19% by volume or less, or about 18% by volume or less, or about 1 7% by volume or less, or about 16% by volume or less, or about 15% by volume or less, or about 14% by volume or less; Or it may be about 13% by volume or less, or about 12% by volume or less. The content of the second filler material may be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the content of the second filler material is within and includes the range between any of the above minimum values and any of the above maximum values. It will be further understood that the content of the second filler material may be within and include the range between any of the above minimum values and any of the above maximum values.

[0133] According to yet other embodiments, the ceramic filler component 420 may include an amorphous material in a specific content. For example, the ceramic filler component 420 may include at least about 97%, e.g., at least about 98%, or even at least about 99% amorphous material. The content of the amorphous material may be any value between any of the above values and including any of the above values. It will be understood that the content of the amorphous material may be any value within the range between any of the above values and including any of the above values. It will be further understood that the content of the amorphous material may be any value within the range between any of the above values and including any of the above values.

[0134] According to other embodiments, the resin matrix component 410 may include a specific material . For example, the resin matrix component 410 may include a perfluoropolymer. According to yet other embodiments, the resin matrix component 410 may be composed of a perfluoropolymer .

[0135] According to yet other embodiments, the perfluoropolymer of the resin matrix component 410 is , a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP ), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof ​​​can include the combination. According to other embodiments, the perfluoropolymer of the resin matrix component 410 may be composed of a copolymer of tetrafluoroethylene (TFE), a copolymer of hexaflu luoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof.

[0136] According to still other embodiments, the perfluoropolymer of the resin matrix component 410 is polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (P FA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the perfluoropoly mer of the resin matrix component 410 is polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof.

[0137] According to still other embodiments, the polymeric core film 403 can include a resin matrix component 410 in a specific content. For example, the content of the resin matrix component 410 is at least about 45 volume %, for example, at least about 4 6 volume %, or at least about 47 volume %, or at least about 48 volume %, or at least about 49 volume %, or at least about 50 volume %, or at least about 51 volume %, or at least about 52 volume %, or at least about 53 volume %, or at least about 54 volume %, or further at least about 55 volume %. According to still other embodiments, the resin matrix ​​The content of the curable component 410 is about 63% by volume or less, or about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less, or even about 57% by volume or less, based on the total volume of the polymeric core film 403. It will be understood that the content of the resin matrix component 410 may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the resin matrix component 410 may be within a range between and including any of the above minimum values and any of the above maximum values.

[0138] According to still other embodiments, the dielectric substrate 400 may include a resin matrix component 410 having a specific content. For example, the content of the resin matrix component 410 may be at least about 45% by volume, such as at least about 46% by volume or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 5 2% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume, based on the total volume of the dielectric substrate 400. According to still other embodiments, the content of the resin matrix component 410 is about 63% by volume or less, or about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less, or even about 57% by volume or less, based on the total volume of the dielectric substrate 400. The content of the resin matrix component 410 is between any of the above minimum values and any of the above maximum values and includes them. It will be understood that any value including may be used. Resin matrix component 410 The content of may be between any of the above minimum values and any of the maximum values and those It will be further understood that it may be within the range including them.

[0139] According to yet another embodiment, the polymeric core film 403 may include a perfluoropolymer having a specific content. For example, the content of the perfluoropolymer may be at least about 45% by volume, such as at least about 46% by volume with respect to the total volume of the dielectric substrate 405, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume %, or at least about 50% by volume, or at least about 51% by volume, or at least about 5 2% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 5 5% by volume. According to yet another embodiment, the content of the perfluoropolymer may be about 63% by volume or less, such as about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume with respect to the total volume of the polymeric core film 403, or about 58% by volume or less, or even about 57% by volume or less. It will be understood that the content of the perfluoropolymer may be any value between any of the above minimum values and any of the maximum values and may include any value between them. It will be further understood that the content of the perfluoropolymer may be within the range between any of the above minimum values and any of the maximum values and including them. It will be understood that the content of the perfluoropolymer may be any value between any of the above minimum values and any of the maximum values and may include any value between them. The content of the perfluoropolymer may be between any of the above minimum values and any of the maximum values and including them. It will be further understood that it may be within the range including them.

[0140] According to yet another embodiment, the dielectric substrate 405 may include a perfluoropolymer having a specific content. It may contain a mark. For example, the content of the perfluoropolymer is at least about 45% by volume, for example, at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55 % by volume, based on the total volume of the dielectric substrate 405. According to still other embodiments, the content of the perfluoropolymer is about 63% by volume or less, for example, about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less, or even about 57% by volume or less, based on the total volume of the dielectric substrate 200. It will be understood that the content of the perfluoropolymer may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the perfluoropolymer may be within the range between and including any of the above minimum values and any of the above maximum values.

[0141] According to still other embodiments, the polymer-based core film 403 may include a specific porosity measured using X-ray diffraction. For example, the porosity of the substrate 405 is about ⑴0% by volume or less for example, about 9% by volume or less, or about 8% by volume or less, or about 7% by volume or less, or about 6% by volume or less, or even about 5% by volume or less. It will be understood that the porosity of the polymer-based core film 403 may be any value between any of the above values and including any of the above values. The porosity of the polymer-based core film 403 is between the above values ​ It will be further understood that any value within the range, including the above values, may be used. This is understandable.

[0142] According to still other embodiments, the polymeric core film 403 may have a specific average thickness. For example, the average thickness of the polymeric core film 403 may be at least about 10 micrometers, e.g., at least about 15 micrometers, or at least about 20 micrometers, or at least about 25 micrometers, or at least about 30 micrometers, or at least about 35 micrometers, or at least about 40 micrometers, or at least about 45 micrometers, or at least about 50 micrometers, or at least about 55 micrometers, or at least about 60 micrometers, or at least about 65 micrometers, or at least about 70 micrometers, or even at least about 75 micrometers. According to still other embodiments, the average thickness of the polymeric core film 403 may be about 2000 micrometers or less, e.g., about 1800 micrometers or less, about 1600 micrometers or less, about 1400 micrometers or less, about 1200 micrometers or less, or about 1000 micrometers or less, or about 800 micrometers or less, or about 600 micrometers or less, or about 400 micrometers or less, or about 200 micrometers or less, or about 190 micrometers or less, or about 180 micrometers or less, or about 170 micrometers or less, or about 160 micrometers or less, or about 150 micrometers or less, or about 1 40 micrometers or less, or about 120 micrometers or less, or even about 100 micrometers It may be 1 micrometer or less. The average thickness of the polymer core film 403 is between any one of the above minimum values and any one of the maximum values and may be any value including them will be understood. The average thickness of the polymer core film 403 is between any one of the above minimum values and any one of the maximum values and within a range including them will be further understood.

[0143] According to still another embodiment, the polymer core film 403 may have a specific loss factor (Df) measured in the range of 5G Hz at 20% RH. For example, the polymer core film 403 may have a loss factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0 014 or less. The loss factor of the polymer core film 403 may be any value between the above any values and may be a value including the above any values will be understood It will be understood that the loss factor of the polymer core film 403 may be any value within the range between the above values and may be a value including the above values. It will be further understood that the loss factor of the polymer core film 403 may be any value within the range between the above values and may be a value including the above values.

[0144] According to still another embodiment, the polymer core film 403 may have a specific loss factor (Df) measured in the range of 5G Hz at 80% RH. For example, the polymer core film 403 may have a loss factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0 It may have a loss factor of about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The loss factor of the polymer core film 403 can be any value between any of the above values and can be a value including any of the above values, as will be understood. The loss factor of the polymer core film 403 can be any value within the range between the above values and can be a value including the above values, as will be further understood. According to still other embodiments, the polymer core film 403 may have a specific loss factor (Df) measured in the range of 10 GHz at 20% RH. For example, the polymer core film 403 may have a loss factor of about 0.005 or less, such as about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The loss factor of the polymer core film 403 can be any value between any of the above values and can be a value including any of the above values, as will be understood. The loss factor of the polymer core film 403 can be any value within the range between the above values and can be a value including the above values, as will be further understood. It will be understood that it can be any value between any of the above values and can be a value including any of the above values. The loss factor of the polymer core film 403 can be any value within the range between the above values and can be a value including the above values, as will be further understood. It will be further understood that it can be any value within the range between the above values and can be a value including the above values.

[0145] According to still other embodiments, the polymer core film 403 may have a specific loss factor (Df) measured in the range of 10 GHz at 20% RH. For example, the polymer core film 403 may have a loss factor of about 0.005 or less, such as about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The loss factor of the polymer core film 403 can be any value between any of the above values and can be a value including any of the above values, as will be understood. The loss factor of the polymer core film 403 can be any value within the range between the above values and can be a value including the above values, as will be further understood. It may have a loss factor of about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The loss factor of the polymer core film 403 can be any value between any of the above values and can be a value including any of the above values, as will be understood. The loss factor of the polymer core film 403 can be any value within the range between the above values and can be a value including the above values, as will be further understood. It will be understood that it can be any value between any of the above values and can be a value including any of the above values. The loss factor of the polymer core film 403 can be any value within the range between the above values and can be a value including the above values, as will be further understood.

[0146] According to still other embodiments, the polymer core film 403 may have a specific loss factor (Df) measured in the range of 10 GHz at 80% RH. For example, the polymer core film 403 may have a loss factor of about 0.005 or less, such as about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The loss factor of the polymer core film 403 can be any value between any of the above values and can be a value including any of the above values, as will be understood. The loss factor of the polymer core film 403 can be any value within the range between the above values and can be a value including the above values, as will be further understood. may have a loss factor of about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0. 0014 or less. The loss factor of the polymer-based core film 403 is any value between any of the above values, and may be a value including any of the above values, which will be understood It will be. The loss factor of the polymer-based core film 403 is within the range between the above values Any value, and it will be further understood that it may be a value including the above values.

[0147] According to still other embodiments, the polymer-based core film 403 may have a specific loss factor (Df) measured in the range of 28 GHz at 20% RH. For example, the polymer-based core film 403 may be about 0.005 or less, for example, about 0.004 or less, or about 0.00 3 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or may be about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0. 0014 or less. The loss factor of the polymer-based core film 403 is any value between any of the above values, and may be a value including any of the above values, which will be understood It will be. The loss factor of the polymer-based core film 403 is within the range between the above values Any value, and it will be further understood that it may be a value including the above values.

[0148] According to still other embodiments, the polymer-based core film 403 may have a specific loss factor (Df) measured in the range of 28 GHz at 80% RH. For example, the polymer-based core film 403 may be about 0.005 or less, for example, about 0.004 or less, or about 0.00 3 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or may have a loss factor of about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0. 0014 or less. The loss factor of the polymer-based core film 403 may be any value between any of the above values, and may be a value including any of the above values, as will be understood It will be. The loss factor of the polymer-based core film 403 may be any value within the range between the above values and may be a value including the above values, as will be further understood.

[0149] According to yet another embodiment, the polymer-based core film 403 may have a specific loss factor (Df) measured in the range of 39 GHz at 20% RH. For example, the polymer-based core film 403 may have a loss factor of about 0.005 or less, for example, about 0.004 or less, or about 0.00 3 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or may have a loss factor of about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0. 0014 or less. The loss factor of the polymer-based core film 403 may be any value between any of the above values, and may be a value including any of the above values, as will be understood It will be. The loss factor of the polymer-based core film 403 may be any value within the range between the above values and may be a value including the above values, as will be further understood.

[0150] According to yet another embodiment, the polymer-based core film 403 may have a specific loss factor (Df) measured in the range of 39 GHz at 80% RH. For example, the polymer-based core film 403 may have a loss factor of about 0.005 or less, for example, about 0.004 or less, or about 0.00 3 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or is about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0. 0014 or less. The loss factor of the polymer core film 403 is as described above any value between any of the above values, and may be a value including any of the above values, which will be understood will be. The loss factor of the polymer core film 403 is within the range between the above values any value, and may be a value including the above values, which will be further understood

[0151] According to yet another embodiment, the polymer core film 403 may have a specific loss factor (Df) measured in the range of 76 to 81 GHz at 20% RH. For example, the poly mer core film 403 is about 0.005 or less, for example, about 0.004 or less, or about 0 .003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The loss factor of the polymer core film 403 is any value between any of the above values, and may be a value including any of the above values, which will be understood. The loss factor of the polymer core film 403 is within the range between the above values any value, and may be a value including the above values, which will be further understood will be

[0152] According to yet another embodiment, the polymer core film 403 may have a specific loss factor (Df) measured in the range of 76 to 81 GHz at 80% RH. For example, the poly mer core film 403 is about 0.005 or less, for example, about 0.004 or less, or about 0 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The polymer core film 403 may have a loss coefficient of . The loss coefficient of the polymer core film 403 may be any value between any of the above values and including any of the above values, as will be understood. The loss coefficient of the polymer core film 403 may be any value within the range between the above values and including the above values, which will be further understood, as will be understood. In yet other embodiments, the polymer core film 403 may have a specific coefficient of thermal expansion as measured in accordance with IPC-TM-65 0 2.4.24 Rev.C Glass Transition Temperat

[0153] ure and Z-Axis Thermal Expansion by TMA. For example, the polymer core film 403 may have a coefficient of thermal expansion of about 80 ppm / °C or less. ure and Z-Axis Thermal Expansion by TMA. Accordingly, it may have a specific coefficient of thermal expansion. For example, the polymer core film 403 may have a coefficient of thermal expansion of about 80 ppm / °C or less.

[0154] In yet other embodiments, the dielectric substrate 405 may have a specific porosity as measured using X-ray diffraction. For example, the porosity of the substrate 405 may be about 10 volume % or less, for example, about 9 volume % or less, or about 8 volume % or less, or about 7 volume % or less, or about 6 volume % or less, or even further about 5 volume % or less. The porosity of the dielectric substrate 405 may be any value between any of the above values and including any of the above values, as will be understood, . The porosity of the dielectric substrate 405 may be any value within the range between the above values and including the above values, which will be further understood, as will be understood. The porosity of the dielectric substrate 405 may be any value within the range between the above values and including the above values, which will be further understood, as will be understood.

[0155] According to still other embodiments, the dielectric substrate 405 may have a specific average thickness. For example, the average thickness of the dielectric substrate 405 is at least about 10 micrometers, for example, at least about 15 micrometers, or at least about 20 micrometers, or at least about 25 micrometers, or at least about 30 micrometers, or at least about 35 micrometers, or at least about 40 micrometers, or at least about 45 micrometers, or at least about 50 micrometers, or at least about 55 micrometers, or at least about 60 micrometers, or at least about 65 micr ometers, or at least about 70 micrometers, or even at least about 75 micr ometers. According to still other embodiments, the average thicknes s of the dielectric substrate 405 is about 2000 micrometers or less, for example, about 1800 micrometers or less, about 1600 micrometers or less, about 1400 micrometers or less, about 1200 micr ometers or less, or about 1000 micrometers or less, or about 800 micrometers or less , or about 600 micrometers or less, or about 400 micrometers or less, or about 2 00 micrometers or less, or about 190 micrometers or less, or about 180 micrometers or less , or about 170 micrometers or less, or about 160 micrometers or less , or about 150 micrometers or less, or about 140 micrometers or less, or about 12 0 micrometers or less, or even about 100 micrometers or less. The average thickness of the dielectric substrate 405 is any one of the above minimum values and any one of the maximum values above. It will be understood that any value between and including them may be used. The dielectric substrate The average thickness of 405 may be between any of the above minimum values and any of the maximum values and may further be understood to be within the range including them.

[0156] According to yet another embodiment, the dielectric substrate 405 may have a specific loss tangent (Df) measured in the range of 5 GHz at 20% RH . For example, the dielectric substrate 405 may have a loss tangent of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less , or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The loss tangent of the dielectric substrate 405 may be any value between any of the above values and may be understood to be any value including any of the above values. The loss tangent of the dielectric substrate 405 may be any value within the range between the above values and may be understood to be any value including the above values. It will be further understood that the loss tangent of the dielectric substrate 405 may be any value within the range between the above values and may be any value including the above values.

[0157] According to yet another embodiment, the dielectric substrate 405 may have a specific loss tangent (Df) measured in the range of 5 GHz at 80% RH . For example, the dielectric substrate 405 may have a loss tangent of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less , or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The loss tangent of the dielectric substrate 405 may be any value between any of the above values and may be understood to be any value including any of the above values. It will be understood that the value may be any value including the above-mentioned arbitrary values. The dielectric substrate 405 The loss coefficient may be any value within the range between the above values and may be a value including the above values. It will be further understood.

[0158] According to still other embodiments, the dielectric substrate 405 may have a specific loss coefficient (Df) measured in the range of 10 GHz at 20% RH. For example, the dielectric substrate 405 may be about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the loss coefficient of the dielectric substrate 405 may be any value between any of the above values and may be a value including any of the above values. The dielectric substrate 405 The loss coefficient of the dielectric substrate 405 may be any value within the range between the above values and may be a value including the above values. It will be understood. The dielectric substrate 405 The loss coefficient of the dielectric substrate 405 may be any value within the range between the above values and may be a value including the above values. It will be further understood.

[0159] According to still other embodiments, the dielectric substrate 405 may have a specific loss coefficient (Df) measured in the range of 10 GHz at 80% RH. For example, the dielectric substrate 405 may be about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the loss coefficient of the dielectric substrate 405 may be any value between any of the above values and may be a value including any of the above values. The loss coefficient of the dielectric substrate 405 may be any value between any of the above values and may be a value including any of the above values. It will be understood. The dielectric substrate 405 The loss factor may be any value within the range between the above values and may include the above values. This will be further understood.

[0160] According to still other embodiments, the dielectric substrate 405 may have a specific loss factor (Df) measured in the range of 28 GHz at 20% RH. For example, the dielectric substrate 405 may have a loss factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the loss factor of the dielectric substrate 405 may be any value between any of the above values and may include any of the above values. It will be understood that the loss factor of the dielectric substrate 405 may be any value within the range between the above values and may include the above values. This will be further understood. This will be further understood.

[0161] According to still other embodiments, the dielectric substrate 405 may have a specific loss factor (Df) measured in the range of 28 GHz at 80% RH. For example, the dielectric substrate 405 may have a loss factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the loss factor of the dielectric substrate 405 may be any value between any of the above values and may include any of the above values. It will be understood that the loss factor of the dielectric substrate 405 may be any value between any of the above values and may include any of the above values. The loss factor may be any value within the range between the above values, including the above values. This will be further understood to be good.

[0162] According to yet another embodiment, the dielectric substrate 405 may have a specific loss factor (Df) measured in the range of 39 GHz at 20% RH. For example, the dielectric substrate 405 may have a loss factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the loss factor of the dielectric substrate 405 may be any value between any of the above values and may include any of the above values. It will be understood that the loss factor of the dielectric substrate 405 may be any value within the range between the above values, including the above values. This will be further understood to be good.

[0163] According to yet another embodiment, the dielectric substrate 405 may have a specific loss factor (Df) measured in the range of 39 GHz at 80% RH. For example, the dielectric substrate 405 may have a loss factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the loss factor of the dielectric substrate 405 may be any value between any of the above values and may include any of the above values. It will be understood that the loss factor of the dielectric substrate 405 may be any value within the range between the above values, including the above values. This will be further understood.

[0164] According to still other embodiments, the dielectric substrate 405 may have a specific loss factor (Df) measured in the range of 76 - 81 GHz at 20% RH. For example, the dielectric substrate 405 may have a loss factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0. 002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the loss factor of the dielectric substrate 405 can be any value between any of the above values and can be a value including any of the above values. It will be further understood that the loss factor of the dielectric substrate 405 can be any value within the range between the above values and can be a value including the above values. This will be further understood.

[0165] According to still other embodiments, the dielectric substrate 405 may have a specific loss factor (Df) measured in the range of 76 - 81 GHz at 80% RH. For example, the dielectric substrate 405 may have a loss factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0. 002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the loss factor of the dielectric substrate 405 can be any value between any of the above values and can be a value including any of the above values. It will be understood that the loss factor of the dielectric substrate 405 can be any value within the range between the above values and can be a value including the above values. This will be further understood.

[0166] According to yet another embodiment, the dielectric substrate 405 is measured according to IPC-TM-650 2.4. 24 Rev.C Glass Transition Temperature an d Z-Axis Thermal Expansion by TMA, and may have a specific coefficient of thermal expansion. For example, the dielectric substrate 405 may have a coefficient of thermal expansion of about 80 ppm / °C or less.

[0167] Any copper-clad laminate described herein may include an additional polymer-based layer between the outer surface of the dielectric substrate described first and any copper foil layer of the copper-clad laminate. It will be understood that this is possible. Also, as described herein, the additional polymer-based layer may include a filler as described herein (i.e., it may be a filled polymer layer), or may not include a filler (i.e., it may be an unfilled polymer layer).

[0168] Next, referring to a method of forming a printed circuit board, FIG. 5 includes a diagram showing a forming method 500 for forming a printed circuit board according to an embodiment described herein. According to a particular embodiment, the forming method 500 may include a first step 510 of providing a copper foil layer, a second step 520 of combining a resin matrix precursor component and a ceramic filler precursor component to form a mixture, a third step 530 of forming the mixture into a polymer-based core film, a fourth step 540 of coating the polymer-based core film with a fluoropolymer-based adhesive layer to form a copper-clad laminate, and a fourth step 550 of forming the copper-clad laminate into a printed circuit board. ​​​​​​​​​​​

[0169] All the descriptions, details, and features provided herein with reference to forming method 100 and / or forming method 300 may be further applicable to or may describe corresponding aspects of forming method 500. It will be understood that this is the case. Here, referring to an embodiment of a printed circuit board formed according to forming method 500,

[0170] FIG. 6 includes a diagram of a printed circuit board 600. As shown in FIG. 6, the printed circuit board 6 00 may include a copper foil layer 602 and a dielectric substrate 605 covering the surface of the copper foil layer 402, or may include a copper-clad laminate 601. As further shown in FIG. 6, the dielectric substrate 605 may include a polymer-based core film 603 and a fluoropolymer-based adhesive layer 607. As still further shown in FIG. 6, the polymer-based core film 603 may include a resin matrix component 610 and a ceramic filler component 620. Here too, all the descriptions provided herein regarding the dielectric substrate 200(405) and / or the copper-clad laminate 400

[0171] will be understood to be further applicable to modified aspects of the printed circuit board 600 including all the components of the printed circuit board 600. Many different aspects and embodiments are possible. Some of these aspects and embodiments

[0172] are described herein. After reading this specification, those skilled in the art will understand that these aspects and embodiments are merely exemplary and do not limit the scope of the present invention. Embodiments can follow any one or more of the embodiments listed below.

[0173] Embodiment 1. A dielectric substrate comprising a polymer-based core film and a fluoropolymer-based adhesive layer, wherein the polymer-based core film comprises a resin matrix component and a ceramic filler component, and the ceramic filler component comprises a first filler material, and the particle size distribution of the first filler material is at least about 0.5 micrometers and less than about 1.6 micrometers of D , at least about 0.8 micrometers and less than about 2.7 micrometers of D and at least about 1.5 micrometers and less than about 4.7 micrometers of D 10 ; a dielectric substrate. D 50 ; and at least about 1.5 micrometers and less than about 4.7 micrometers of D 90 including.

[0174] Embodiment 2. A dielectric substrate comprising a polymer-based core film and a fluoropolymer-based adhesive layer, wherein the polymer-based core film comprises a resin matrix component and a ceramic filler component, and the ceramic filler component comprises a first filler material, and the first filler material further comprises an average particle size of about 10 micrometers or less and a particle size distribution span (PSD ) of about 5 or less, and PSDS is equal to (D -D ) / D , where D 90 is equal to the D 10 particle size distribution measurement value of the first filler material, D 50 is equal to the D 90 particle size distribution measurement value of the first filler material, and D 90 is equal to the D 10 particle size distribution measurement value of the first filler material, and D 10 is equal to the D particle size distribution measurement value of the first filler material; a dielectric substrate. 50 ; a dielectric substrate equal to the D 50 particle size distribution measurement value of the first filler material. electric substrate.

[0175] Embodiment 3. A dielectric substrate comprising a polymer-based core film and a fluoropolymer-based adhesive layer, The polymer-based core film is a conductive substrate, and the polymer-based core film is a composite of a resin matrix component and a ceramic filler. and a filler component, the ceramic filler component comprising a first filler material, the first filler material The material has an average particle size of approximately 10 micrometers or less and a particle size of approximately 8 m. 2 / g or less average surface area a dielectric substrate.

[0176] Embodiment 4. The particle size distribution of the first filler material is at least about 0.5 micrometers. and D of approximately 1.6 micrometers or less 10 The dielectric group of embodiment 2 or 3, comprising Board.

[0177] Embodiment 5. The particle size distribution of the first filler material is at least about 0.8 micrometers. and D of approximately 2.7 micrometers or less 50 The dielectric group of embodiment 2 or 3, comprising Board.

[0178] Embodiment 6. The particle size distribution of the first filler material is at least about 1.5 micrometers. and D of approximately 4.7 micrometers or less 90 The dielectric group of embodiment 2 or 3, comprising Board.

[0179] Embodiment 7. The first filler material further comprises an average particle size of about 10 micrometers or less. Included are the dielectric substrates described in embodiment 1.

[0180] Embodiment 8. The first filler material is about 10 micrometers or less, or about 9 micrometers or less. meters or less, or about 8 micrometers or less, or about 7 micrometers or less, or about 6 micrometers or less, or about 5 micrometers or less, or about 4 micrometers or less or less, or about 3 micrometers or less, or about 2 micrometers or less, The dielectric substrate according to any one of Embodiments 2, 3, and 7.

[0181] In Embodiment 9, the first filler material includes a particle size distribution span (PSDS) of about 5 or less, wherein the PSDS is (D 90 - D 10 ) / D 50 and D 90 is equal to the D9 0 particle size distribution measurement value of the first filler material, and D 10 is equal to the D 10 particle size distribution measurement value of the first filler material, and D 50 is equal to the D 50 particle size distribution measurement value of the first filler material, the dielectric substrate according to Embodiment 1 or 3. as described.

[0182] In Embodiment 10, the first filler material further includes an average surface area of about 8 m 2 / g or less, the dielectric substrate according to Embodiment 1 or 2. as described.

[0183] In Embodiment 11, the fluoropolymer-based adhesive layer has an average thickness of at least about 0.2 micrometer , the dielectric substrate according to any one of Embodiments 1, 2, and 3.

[0184] In Embodiment 12, the fluoropolymer-based adhesive layer has an average thickness of about 7 micrometers or less , the dielectric substrate according to any one of Embodiments 1, 2, and 3.

[0185] In Embodiment 13, the fluoropolymer-based adhesive layer is a fluoropolymer (for example, polytetra fluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), copolymers and terpolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP), perfluoroalkoxy polymer resin (PFA), and modified perfluoro A dielectric substrate comprising a lower alkoxy polymer resin (mPFA), and derivatives and blends thereof, as described in any one of Embodiments 1, 2, and 3. According to still other embodiments, The fluoropolymer-based adhesive layer 207 may be composed of a fluoropolymer (e.g., polytetrafluoroethylene ethylene (PTFE), modified polytetrafluoroethylene). It may be composed of.

[0186] Embodiment 14. The fluoropolymer-based adhesive layer is a fluoropolymer (e.g., polytetra fluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), copolymers and terpolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP), perfluoroalkoxy polymer resin (PFA), and modified perfluoro lower alkoxy polymer resin (mPFA), and derivatives and blends thereof, as described in any one of Embodiments 1, 2, and 3. According to still other embodiments, The fluoropolymer-based adhesive layer 207 may be composed of a fluoropolymer (e.g., polytetra fluoroethylene (PTFE), modified polytetrafluoroethylene). It may be composed of. .

[0187] Embodiment 15. The fluoropolymer-based adhesive layer is a PFA layer, as described in any one of Embodiments 1, 2, and 3 of the dielectric substrates described.

[0188] Embodiment 16. The first filler material contains a silica-based compound, as described in any one of Embodiments 1, 2, and 3 of the dielectric substrates described.

[0189] Embodiment 17. The first filler material contains silica, as described in any one of Embodiments 1, 2, and 3. The dielectric substrate described in any one of them.

[0190] Embodiment 18. The resin matrix includes a perfluoropolymer, and is the dielectric substrate according to any one of Embodiments 1, 2 , and 3.

[0191] Embodiment 19. The perfluoropolymer includes a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene ( TFE), or any combination thereof, and is the dielectric substrate according to Embodiment 18.

[0192] Embodiment 20. The perfluoropolymer includes polytetrafluoroethylene (PTFE) , perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FE P), or any combination thereof, and is the dielectric substrate according to Embodiment 18.

[0193] Embodiment 21. The perfluoropolymer is composed of polytetrafluoroethylene (PTFE) , perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FE P), or any combination thereof, and is the dielectric substrate according to Embodiment 18 .

[0194] Embodiment 22. The content of the resin matrix component is at least about 45% by volume with respect to the total volume of the polymer-based core film, and is the dielectric substrate according to any one of Embodiments 1, 2, and 3 .

[0195] Embodiment 23. The content of the resin matrix component is about 63% by volume or less with respect to the total volume of the polymer-based core film, and is the dielectric substrate according to any one of Embodiments 1, 2, and 3 .

[0196] ​​​​ Embodiment 24. The content of the perfluoropolymer is at least about 45% by volume with respect to the total volume of the polymer-based core film, the dielectric substrate according to Embodiment 18.

[0197] Embodiment 25. The content of the perfluoropolymer is about 63% by volume or less with respect to the total volume of the polymer-based core film, the dielectric substrate according to Embodiment 18.

[0198] Embodiment 26. The content of the ceramic filler component is at least about 45% by volume with respect to the total volume of the polymer-based core film, the dielectric substrate according to any one of Embodiments 1, 2, and 3.

[0199] Embodiment 27. The content of the ceramic filler component is about 57% by volume or less with respect to the total volume of the polymer-based core film, the dielectric substrate according to any one of Embodiments 1, 2, and 3.

[0200] Embodiment 28. The content of the first filler material is at least about 80% by volume with respect to the total volume of the ceramic filler component, the dielectric substrate according to any one of Embodiments 1, 2, and 3.

[0201] Embodiment 29. The content of the first filler material is about 100% by volume or less with respect to the total volume of the ceramic filler component, the dielectric substrate according to any one of Embodiments 1, 2, and 3.

[0202] Embodiment 30. The ceramic filler component further includes a second filler material, the dielectric substrate according to any one of Embodiments 1, 2, and 3.

[0203] Embodiment 31. The second filler material includes a high dielectric constant ceramic material, and is the dielectric substrate described in Embodiment 30. The dielectric substrate described in

[0204] Embodiment 32. The high dielectric constant ceramic material has a dielectric constant of at least about 14, and is the dielectric substrate described in Embodiment 31. The dielectric substrate described in

[0205] Embodiment 33. The ceramic filler component further includes TiO2, SrTiO3, ZrTi2O6 , MgTiO3, CaTiO3, BaTiO4, or any combination thereof, and is the dielectric substrate described in Embodiment 31. The dielectric substrate described in

[0206] Embodiment 34. The content of the second filler material is at least about 1 volume% with respect to the total volume of the ceramic filler component, and is the dielectric substrate described in Embodiment 30. The dielectric substrate described in

[0207] Embodiment 35. The content of the second filler material is about 20 volume% or less with respect to the total volume of the ceramic filler component, and is the dielectric substrate described in Embodiment 30. The dielectric substrate described in

[0208] Embodiment 36. The ceramic filler component is at least about 97% amorphous, and is the dielectric substrate described in any one of Embodiments 1, 2, and 3. The dielectric substrate described in

[0209] Embodiment 37. The polymer core film includes a porosity of about 10 volume% or less, and is the dielectric substrate described in any one of Embodiments 1, 2, and 3. The dielectric substrate described in

[0210] Embodiment 38. The polymer core film includes an average thickness of at least about 10 micrometers, and is the dielectric substrate described in any one of Embodiments 1, 2, and 3. The dielectric substrate described in

[0211] Embodiment 39. The polymer core film has an average A dielectric substrate according to any one of Embodiments 1, 2, and 3, including thickness.

[0212] Embodiment 40. The dielectric substrate has a loss factor of about 0.005 or less (5 GHz, 20% RH ) and is a dielectric substrate according to any one of Embodiments 1, 2, and 3.

[0213] Embodiment 41. The dielectric substrate has a loss factor of about 0.0014 or less (5 GHz, 20% R H) and is a dielectric substrate according to any one of Embodiments 1, 2, and 3.

[0214] Embodiment 42. The dielectric substrate has a coefficient of thermal expansion (total axis) of about 80 ppm / °C or less and is a dielectric substrate according to any one of Embodiments 1, 2, and 3.

[0215] Embodiment 43. The dielectric substrate has a moisture absorption of about 0.05% or less and is a dielectric substrate according to any one of Embodiments 1, 2 , and 3.

[0216] Embodiment 44. A copper-clad laminate including a copper foil layer and a dielectric substrate covering the copper foil layer, wherein the dielectric substrate includes a polymer-based core film and a fluoropolymer-based adhesive layer, and the polymer -based core film includes a resin matrix component and a ceramic filler component, and the ceramic filler component includes a first filler material, and the particle size distribution of the first filler material is at least about 0.5 micrometer and D of about 1.6 micrometers or less 10 , at least about 0.8 micrometer and D of about 2.7 micrometers or less 50 , and at least about 1.5 micrometers and D of about 4.7 micrometers or less 90 and is a copper-clad laminate.

[0217] Embodiment 45. A copper clad laminate comprising a copper foil layer and a dielectric substrate covering the copper foil layer, The dielectric substrate includes a polymer-based core film and a fluoropolymer-based adhesive layer. The ceramic-based core film contains a resin matrix component and a ceramic filler component. The ionic filler component includes a first filler material, the first filler material having a particle size of about 10 microns. and a particle size distribution span (PSDS) of about 5 or less. is (D 90 -D 10 ) / D 50 is equal to D 90 is the D of the first filler material 90 Particle size Fabric measurement equals D 10 is the D of the first filler material 10 Particle size distribution measurement equals D5 0 is the D of the first filler material 50 Copper clad laminate, equivalent to particle size distribution measurements.

[0218] Embodiment 46. A copper clad laminate comprising a copper foil layer and a dielectric substrate covering the copper foil layer, The dielectric substrate includes a polymer-based core film and a fluoropolymer-based adhesive layer. The ceramic-based core film contains a resin matrix component and a ceramic filler component. The ionic filler component includes a first filler material, the first filler material having a particle size of about 10 microns. Average particle size of less than 1000mm and approx. 8m 2 / g or less.

[0219] Embodiment 47. The particle size distribution of the first filler material is at least about 0.5 micrometers. and D of approximately 1.6 micrometers or less 10 47. The copper of embodiment 45 or 46, comprising Tension laminate.

[0220] Embodiment 48. The particle size distribution of the first filler material is at least about 0.8 micrometer and D of about 2.7 micrometers or less 50 The copper clad laminate according to Embodiment 45 or 46.

[0221] Embodiment 49. The particle size distribution of the first filler material is at least about 1.5 micrometer and D of about 4.7 micrometers or less 90 The copper clad laminate according to Embodiment 45 or 46.

[0222] Embodiment 50. The first filler material further has an average particle size of about 10 micrometers or less The copper clad laminate according to Embodiment 44.

[0223] Embodiment 51. The first filler material has an average particle size of about 10 micrometers or less The copper clad laminate according to any one of Embodiments 44, 45, and 46.

[0224] Embodiment 52. The first filler material has a particle size distribution span (PSDS) of about 5 or less , where PSDS is (D 90 -D 10 ) / D 50 equal to, where D 90 is equal to the D 90 particle size distribution measurement value of the first filler material, and D 10 is equal to the D 10 particle size distribution measurement value of the first filler material equally, and D 50 is equal to the D 50 particle size distribution measurement value of the first filler material, the copper clad laminate according to Embodiment 44 or 46.

[0225] Embodiment 53. The first filler material further has an average surface area of about 8 m 2 / g or less, the copper clad laminate according to Embodiment 44 or 45.

[0226] Embodiment 54. The fluoropolymer-based adhesive layer has an average thickness of at least about 0.2 micrometers, and is the copper-clad laminate according to any one of Embodiments 44, 45, and 46. Board.

[0227] Embodiment 55. The fluoropolymer-based adhesive layer has an average thickness of about 7 micrometers or less, and is the copper-clad laminate according to any one of Embodiments 44, 45, and 46.

[0228] Embodiment 56. The fluoropolymer-based adhesive layer contains fluoropolymers (for example, copolymers and terpolymers of tetrafluoroethylene such as polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP), perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), as well as their derivatives and blends), and is the copper-clad laminate according to any one of Embodiments 44, 45, and 46. In yet another embodiment, the fluoropolymer-based adhesive layer 207 may be composed of a fluoropolymer (for example, polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene).

[0229] Embodiment 57. The fluoropolymer-based adhesive layer contains fluoropolymers (for example, copolymers and terpolymers of tetrafluoroethylene such as polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP), perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), as well as their derivatives and blends). Lower alkoxy polymer resins (mPFA), and their derivatives and blends, The copper-clad laminate according to any one of Embodiments 44, 45, and 46. In yet other embodiments Accordingly, the fluoropolymer-based adhesive layer 207 may be composed of a fluoropolymer (e.g., polytetra Fluoroethylene (PTFE), modified polytetrafluoroethylene .

[0230] Embodiment 58. The fluoropolymer-based adhesive layer is a PFA layer, the copper-clad laminate according to any one of Embodiments 44, 4 5, and 46.

[0231] Embodiment 59. The first filler material contains a silica-based compound, the copper-clad laminate according to any one of Embodiments 44, 45, and 46.

[0232] Embodiment 60. The first filler material contains silica, the copper-clad laminate according to any one of Embodiments 44, 45, and 46 .

[0233] Embodiment 61. The resin matrix contains a perfluoropolymer, the copper-clad laminate according to any one of Embodiments 44, 45, and 46.

[0234] Embodiment 62. The perfluoropolymer is a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene ( TFE), or any combination thereof, the copper-clad laminate according to Embodiment 61 . The copper-clad laminate.

[0235] Embodiment 63. The perfluoropolymer is polytetrafluoroethylene (PTFE) , perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FE The copper-clad laminate according to Embodiment 61, comprising (P), or any combination thereof.

[0236] Embodiment 64. The perfluoropolymer is polytetrafluoroethylene (PTFE). , perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FE). P), or the copper-clad laminate according to Embodiment 61, composed of any combination thereof. .

[0237] Embodiment 65. The content of the resin matrix component is at least about 45% by volume based on the total volume of the polymer-based core film. The copper-clad laminate according to any one of Embodiments 44, 45, and 46.

[0238] Embodiment 66. The content of the resin matrix component is about 63% by volume or less based on the total volume of the polymer-based core film. The copper-clad laminate according to any one of Embodiments 44, 45, and 46.

[0239] Embodiment 67. The content of the perfluoropolymer is at least about 45% by volume based on the total volume of the polymer-based core film. The copper-clad laminate according to Embodiment 61.

[0240] Embodiment 68. The content of the perfluoropolymer is about 63% by volume or less based on the total volume of the polymer-based core film. The copper-clad laminate according to Embodiment 61.

[0241] Embodiment 69. The content of the ceramic filler component is at least about 45% by volume based on the total volume of the polymer-based core film. The copper-clad laminate according to any one of Embodiments 44, 45, and 46.

[0242] Embodiment 70. The content of the ceramic filler component is up to about 57% by volume with respect to the total volume of the polymer-based core film, the copper-clad laminate described in any one of Embodiments 44, 45, and 46.

[0243] Embodiment 71. The content of the first filler material is at least about 80% by volume with respect to the total volume of the ceramic filler component, the copper-clad laminate described in any one of Embodiments 44, 45, and 46.

[0244] Embodiment 72. The content of the first filler material is up to about 100% by volume with respect to the total volume of the ceramic filler component, the copper-clad laminate described in any one of Embodiments 44, 45, and 46.

[0245] Embodiment 73. The ceramic filler component further includes a second filler material, the copper-clad laminate described in any one of Embodiments 44, 45, and 46.

[0246] Embodiment 74. The second filler material includes a high dielectric constant ceramic material, the copper-clad laminate described in Embodiment 73.

[0247] Embodiment 75. The high dielectric constant ceramic material has a dielectric constant of at least about 14, the copper-clad laminate described in Embodiment 74.

[0248] Embodiment 76. The ceramic filler component further includes TiO2, SrTiO3, ZrTi2O6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof, the copper-clad laminate described in Embodiment 74.

[0249] Embodiment 77. The content of the second filler material is with respect to the total volume of the ceramic filler component, ​​​​​​​​​​​The copper-clad laminate according to Embodiment 73, which is at least about 1% by volume.

[0250] Embodiment 78. The content of the second filler material is based on the total volume of the ceramic filler component The copper-clad laminate according to Embodiment 73, which is about 20% by volume or less.

[0251] Embodiment 79. The ceramic filler component is at least about 97% amorphous, and is the copper-clad laminate according to any one of Embodiments 44, 45, and 46.

[0252] Embodiment 80. The polymer-based core film contains a porosity of about 10% by volume or less, and is the copper-clad laminate according to any one of Embodiments 44, 45, and 46.

[0253] Embodiment 81. The polymer-based core film has an average thickness of at least about 10 micrometers, and is the copper-clad laminate according to any one of Embodiments 44, 45, and 46.

[0254] Embodiment 82. The polymer-based core film has an average thickness of about 2000 micrometers or less, and is the copper-clad laminate according to any one of Embodiments 44, 45, and 46.

[0255] Embodiment 83. The polymer-based core film has a loss factor (5 GHz, 20% RH) of about 0.005 or less, and is the copper-clad laminate according to any one of Embodiments 44, 45, and 46.

[0256] Embodiment 84. The polymer-based core film has a loss factor (5 GHz, 20% RH) of about 0.0014 or less, and is the copper-clad laminate according to any one of Embodiments 44, 45, and 46.

[0257] ​​​​​​​​Embodiment 85. The polymer-based core film has a coefficient of thermal expansion (in all axes) of about 80 ppm / °C or less, and is the copper-clad laminate according to any one of Embodiments 44, 45, and 46.

[0258] Embodiment 86. The polymer-based core film has a moisture absorption of about 0.05% or less, and is the copper-clad laminate according to any one of Embodiments 44, 45, and 46.

[0259] Embodiment 87. The copper-clad laminate has a porosity of about 10% by volume or less, and is the copper-clad laminate according to any one of Embodiments 44, 4 5, and 46.

[0260] Embodiment 88. The copper-clad laminate has a peel strength of at least about 6 lb / in between the copper foil layer and the dielectric substrate, and is the copper-clad laminate according to any one of Embodiments 44, 45, and 46

[0261] Embodiment 89. A printed circuit board including a copper-clad laminate, the copper-clad laminate including a copper foil layer and a dielectric substrate covering the copper foil layer, the dielectric substrate including a polymer-based core film and a fully oropolymer-based adhesive layer, the polymer-based core film including a resin matrix component and a ceramic filler component, the ceramic filler component including a first filler material, the particle size distribution of the first filler material having a D of at least about 0.5 micrometer and about 1.6 micrometers or less, a D of at least about 0.8 micrometer and about 2.7 micrometers 10 or less, and a D of at least about 1.5 micrometer and about 4.7 micrometers or less, and including a printed circuit board. 50 90

[0262] Embodiment 90. A printed circuit board including a copper-clad laminate, the copper-clad laminate including a copper foil layer and a dielectric substrate covering the copper foil layer, the dielectric substrate including a polymer-based core film and a full oropolymer-based adhesive layer, the polymer-based core film including a resin matrix component and , a ceramic filler component, the ceramic filler component including a first filler material, the first filler material having an average particle size of about 10 micrometers or less and a particle size distribution span (PSDS) of about 5 or less, the PSDS being further defined as (D 90 -D 10 ) / D 50 , where D9 0 is equal to the D 90 particle size distribution measurement value of the first filler material, D 10 is equal to the D particle size distribution measurement value of the first filler material 10 , and D 50 is equal to the D 50 particle size distribution measurement value of the first filler material. A printed circuit board

[0263] Embodiment 91. A printed circuit board including a copper-clad laminate, the copper-clad laminate including a copper foil layer and a dielectric substrate covering the copper foil layer, the dielectric substrate including a polymer-based core film and a full oropolymer-based adhesive layer, the polymer-based core film including a resin matrix component and , a ceramic filler component, the ceramic filler component including a first filler material, the first filler material having an average particle size of about 10 micrometers or less and an average surface area of about 8 m 2 / g or less. A printed circuit board

[0264] Embodiment 92. The particle size distribution of the first filler material includes at least about 0.5 micrometer and a D of about 1.6 micrometers or less. The printed circuit board according to Embodiment 90 or 91 10 ​ Lint circuit board.

[0265] Embodiment 93. The particle size distribution of the first filler material is at least about 0.8 micrometer and D of about 2.7 micrometers or less 50 The printed circuit board according to Embodiment 90 or 91, including Lint circuit board.

[0266] Embodiment 94. The particle size distribution of the first filler material is at least about 1.5 micrometer and D of about 4.7 micrometers or less 90 The printed circuit board according to Embodiment 90 or 91, including Lint circuit board.

[0267] Embodiment 95. The first filler material further has an average particle size of about 10 micrometers or less The printed circuit board according to Embodiment 89.

[0268] Embodiment 96. The first filler material has an average particle size of about 10 micrometers or less The printed circuit board according to any one of Embodiments 89, 90, and 91.

[0269] Embodiment 97. The first filler material has a particle size distribution span (PSDS) of about 5 or less where PSDS is (D 90 - D 10 ) / D 50 equal to, D 90 is equal to the D of the first filler material 90 particle size distribution measurement value, and D 10 is equal to the D of the first filler material 10 particle size distribution measurement value equal to, and D 50 is equal to the D of the first filler material 50 particle size distribution measurement value, the printed circuit board according to Embodiment 89 or 91.

[0270] Embodiment 98. The first filler material further includes an average surface area of about 8 m 2 / g or less, and the printed circuit board according to Embodiment 89 or 90.

[0271] Embodiment 99. The fluoropolymer-based adhesive layer has an average thickness of at least about 0.2 micrometers, and the printed circuit board according to any one of Embodiments 89, 90, and 91.

[0272] Embodiment 100. The fluoropolymer-based adhesive layer has an average thickness of about 7 micrometers or less, and the printed circuit board according to any one of Embodiments 89, 90, and 91.

[0273] Embodiment 101. The fluoropolymer-based adhesive layer includes fluoropolymers (for example, polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), copolymers and terpolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP), perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), and their derivatives and blends, and the printed circuit board according to any one of Embodiments 89, 90, and 91. According to still other embodiments, the fluoropolymer-based adhesive layer 207 may be composed of fluoropolymers (for example, polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene).

[0274] Embodiment 102. The fluoropolymer-based adhesive layer includes fluoropolymers (for example, polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), , copolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP) and terpolymers, perfluoroalkoxy polymer resins (PFA), and modified perfluoro oroalkoxy polymer resins (mPFA), and those consisting of their derivatives and blends , the printed circuit board according to any one of Embodiments 89, 90, and 91. According to still other embodiments , the fluoropolymer-based adhesive layer 207 may be composed of a fluoropolymer (for example, polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene .

[0275] Embodiment 103. The fluoropolymer-based adhesive layer is a PFA layer, the printed circuit board according to any one of Embodiments 89, 90, and 91.

[0276] Embodiment 104. The first filler material contains a silica-based compound, the printed circuit board according to any one of Embodiments 89, 90 , and 91.

[0277] Embodiment 105. The first filler material contains silica, the printed circuit board according to any one of Embodiments 89, 90, and 9 1.

[0278] Embodiment 106. The resin matrix contains a perfluoropolymer, the printed circuit board according to any one of Embodiments 89 , 90, and 91.

[0279] Embodiment 107. The perfluoropolymer is a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof, the printed circuit board according to Embodiment 106 . described.

[0280] Embodiment 108. The perfluoropolymer is polytetrafluoroethylene (PTFE ), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (F EP), or any combination thereof, and is the printed circuit board according to Embodiment 106 .

[0281] Embodiment 109. The perfluoropolymer is composed of polytetrafluoroethylene (PTFE ), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (F EP), or any combination thereof, and is the printed circuit board according to Embodiment 106 .

[0282] Embodiment 110. The content of the resin matrix component is at least about 45% by volume with respect to the total volume of the polymer-based core film, and is the printed circuit board according to any one of Embodiments 89, 90, and 91 . .

[0283] Embodiment 111. The content of the resin matrix component is about 63% by volume or less with respect to the total volume of the polymer-based core film, and is the printed circuit board according to any one of Embodiments 89, 90, and 91 . .

[0284] Embodiment 112. The content of the perfluoropolymer is at least about 45% by volume with respect to the total volume of the polymer-based core film, and is the printed circuit board according to Embodiment 106 . .

[0285] Embodiment 113. The content of the perfluoropolymer is about 63% by volume or less with respect to the total volume of the polymer-based core film, and is the printed circuit board according to Embodiment 106 .

[0286] Embodiment 114. The content of the ceramic filler component is at least about 45% by volume with respect to the total volume of the polymer-based core film, any one of Embodiments 89, 90, and 91 the printed circuit board described in.

[0287] Embodiment 115. The content of the ceramic filler component is about 57% by volume or less with respect to the total volume of the polymer-based core film, any one of Embodiments 89, 90, and 91 the printed circuit board described in.

[0288] Embodiment 116. The content of the first filler material is at least about 80% by volume with respect to the total volume of the ceramic filler component, any one of Embodiments 89, 90, and 91 the printed circuit board described in.

[0289] Embodiment 117. The content of the first filler material is about 100% by volume or less with respect to the total volume of the ceramic filler component, any one of Embodiments 89, 90, and 91 described the printed circuit board of.

[0290] Embodiment 118. The ceramic filler component further includes a second filler material, any one of Embodiments 89, 90, and 91 the printed circuit board described in.

[0291] Embodiment 119. The second filler material includes a high dielectric constant ceramic material, Embodiment 1 118 the printed circuit board described in.

[0292] Embodiment 120. The high dielectric constant ceramic material has a dielectric constant of at least about 14, the printed circuit board described in Embodiment 119.

[0293] ​​​​Embodiment 121. The ceramic filler component further includes TiO2, SrTiO3, ZrTi2O 6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof, and the printed circuit board according to Embodiment 119.

[0294] Embodiment 122. The content of the second filler material is at least about 1% by volume with respect to the total volume of the ceramic filler component, and the printed circuit board according to Embodiment 118.

[0295] Embodiment 123. The content of the second filler material is about 20% by volume or less with respect to the total volume of the ceramic filler component, and the printed circuit board according to Embodiment 118.

[0296] Embodiment 124. The ceramic filler component is at least about 97% amorphous, and the printed circuit board according to any one of Embodiments 89, 90, and 91.

[0297] Embodiment 125. The polymer-based core film includes a porosity of about 10% by volume or less, and the printed circuit board according to any one of Embodiments 89, 90, and 91.

[0298] Embodiment 126. The polymer-based core film includes an average thickness of at least about 10 micrometers, and the printed circuit board according to any one of Embodiments 89, 90, and 91. board.

[0299] Embodiment 127. The polymer-based core film includes an average thickness of about 2000 micrometers or less, and the printed circuit board according to any one of Embodiments 89, 90, and 91. .

[0300] Embodiment 128. The polymer-based core film has a loss factor of about 0.005 or less (5GH A printed circuit board according to any one of Embodiments 89, 90, and 91, including z, 20% RH). Printed circuit board.

[0301] Embodiment 129. The polymer-based core film has a loss factor of about 0.0014 or less (5G Hz, 20% RH), a printed circuit board according to any one of Embodiments 89, 90, and 91. nt circuit board.

[0302] Embodiment 130. The polymer-based core film has a coefficient of thermal expansion of about 80 ppm / °C or less ( Full axis), a printed circuit board according to any one of Embodiments 89, 90, and 91 .

[0303] Embodiment 131. The polymer-based core film includes a moisture absorption of about 0.05% or less, a printed circuit board according to any one of Embodiments 89, 90, and 91.

[0304] Embodiment 132. The copper-clad laminate includes a porosity of about 10% by volume or less, Embodiment 89, 90, and a printed circuit board according to any one of 91.

[0305] Embodiment 133. The copper-clad laminate includes a peel strength of at least about 6 lb / in between the copper foil layer and the printed circuit board, a printed circuit board according to any one of Embodiments 89, 90, and 91. rinted circuit board.

[0306] Embodiment 134. A method of forming a dielectric substrate, the method comprising forming a mixture by combining a resin matrix precursor component and a ceramic filler precursor component, forming the formed mixture into a polymer-based core film, and coating the polymer-based core film with a full oropolymer-based adhesive layer, the ceramic filler precursor component The minute contains a first filler precursor material, and the particle size distribution of the first filler precursor material is at least about 0.5 micrometers and a D of about 1.6 or less 10 and at least about 0.8 micrometers and a D of about 2.7 micrometers or less 50 and at least about 1.5 micrometers and a D of about 4.7 micrometers or less 90 A method including.

[0307] Embodiment 135. A method of forming a dielectric substrate, the method comprising forming a mixture by combining a resin precursor matrix component and a ceramic filler precursor component, forming the formed mixture into a polymer-based core film, and coating the polymer-based core film with a full oropolymer-based adhesive layer, wherein the ceramic filler precursor component contains a first filler precursor material, and the first filler precursor material further includes an average particle size of about 10 micrometers or less and a particle size distribution span (PSDS) of about 5 or less, and the PSDS is (D -D 90 -D 10 ) / D 50 equal to, where D 90 is equal to the D 90 particle size distribution measurement value of the first filler precursor material, and D 10 is equal to the D 10 particle size distribution measurement value of the first filler precursor material, and D is equal to the D 50 particle size distribution measurement value of the first filler precursor material, 50 A method equal to.

[0308] Embodiment 136. A method of forming a dielectric substrate, the method comprising forming a mixture by combining a resin matrix precursor component and a ceramic filler precursor component, Forming a mixture into a polymer-based core film and fully forming the polymer-based core film Coating with an allopolymer-based adhesive layer, the method comprising a ceramic filler precursor composition including a first filler precursor material having an average particle size of about 10 micrometers or less and an average surface area of about 8 m / g or less. 2

[0309] Embodiment 137. The particle size distribution of the first filler precursor material includes at least about 0.5 micrometer and D of about 1.6 micrometers or less and is included in the method according to Embodiment 135 or 13 10 6.

[0310] Embodiment 138. The particle size distribution of the first filler precursor material includes at least about 0.8 micrometer and D of about 2.7 micrometers or less and is included in the method according to Embodiment 135 or 13 50 6.

[0311] Embodiment 139. The particle size distribution of the first filler precursor material includes at least about 1.5 micrometer and D of about 4.7 micrometers or less and is included in the method according to Embodiment 135 or 13 90 6.

[0312] Embodiment 140. The first filler precursor material further includes an average particle diameter of about 10 micrometers or less, and is the method according to Embodiment 134.

[0313] Embodiment 141. The first filler precursor material includes an average particle diameter of about 10 micrometers or less, and is the method according to any one of Embodiments 135, 136, and 140.

[0314] ​​​​​​​Embodiment 142. The first filler precursor material has a particle size distribution span (PSDS ) of about 5 or less, and the PSDS is (D 90 -D 10 ) / D 50 , where D 90 is equal to the D particle size distribution measurement value of the first filler 90 precursor material, and D 10 is equal to the D1 0 particle size distribution measurement value of the first filler precursor material, and D 50 is equal to the D 50 particle size distribution measurement value of the first filler precursor material, the method according to Embodiment 134 or 136.

[0315] Embodiment 143. The first filler precursor material further has an average surface area of about 8 m 2 / g or less, the method according to Embodiment 134 or 135.

[0316] Embodiment 144. The fluoropolymer-based adhesive layer has an average thickness of at least about 0.2 micrometers , the method according to any one of Embodiments 134, 135, and 136.

[0317] Embodiment 145. The fluoropolymer-based adhesive layer has an average thickness of about 7 micrometers or less, the method according to any one of Embodiments 134, 135, and 136.

[0318] Embodiment 146. The fluoropolymer-based adhesive layer is a fluoropolymer (e.g., poly tetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE) , copolymers and terpolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP) and perfluoroalkoxy polymer resin (PFA), and modified perflu Oral alkoxy polymer resins (mPFA), and their derivatives and blends, The method according to any one of Embodiments 134, 135, and 136. In further embodiments According to, the fluoropolymer-based adhesive layer 207 may be composed of a fluoropolymer (e.g., polytetra fluoroethylene (PTFE), modified polytetrafluoroethylene .

[0319] Embodiment 147. The fluoropolymer-based adhesive layer is a fluoropolymer (e.g., poly tetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE) , copolymers and terpolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP), perfluoroalkoxy polymer resin (PFA), and modified perfluoro oroalkoxy polymer resin (mPFA), and their derivatives and blends, the method according to any one of Embodiments 134, 135, and 136. In further embodiments oroalkoxy polymer resin (mPFA), and their derivatives and blends, the method according to any one of Embodiments 134, 135, and 136. In further embodiments , according to, the fluoropolymer-based adhesive layer 207 may be composed of a fluoropolymer (e.g., polytetra rafluoroethylene (PTFE), modified polytetrafluoroethylene It may also be composed of yes.

[0320] Embodiment 148. The fluoropolymer-based adhesive layer is a PFA layer, the method according to any one of Embodiments 134 , 135, and 136.

[0321] Embodiment 149. The first filler precursor material contains a silica-based compound, the method according to any one of Embodiments 13 4, 135, and 136.

[0322] Embodiment 150. The first filler precursor material contains silica, the method according to Embodiments 134, 13 5. The method according to any one of 5 and 136.

[0323] Embodiment 151. The method according to any one of Embodiments 134, 135, and 136, wherein the resin matrix precursor component contains a perfluoropolymer. The method according to any one of Embodiments 134, 135, and 136.

[0324] Embodiment 152. The method according to Embodiment 151, wherein the perfluoropolymer comprises a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. The method according to Embodiment 151, wherein the perfluoropolymer comprises a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. The method according to Embodiment 151, wherein the perfluoropolymer comprises a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. The method according to Embodiment 151, wherein the perfluoropolymer comprises a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof.

[0325] Embodiment 153. The method according to Embodiment 151, wherein the perfluoropolymer comprises polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. The method according to Embodiment 151, wherein the perfluoropolymer comprises polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. The method according to Embodiment 151, wherein the perfluoropolymer comprises polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof.

[0326] Embodiment 154. The method according to Embodiment 151, wherein the perfluoropolymer is composed of polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. The method according to Embodiment 151, wherein the perfluoropolymer is composed of polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. The method according to Embodiment 151, wherein the perfluoropolymer is composed of polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof.

[0327] Embodiment 155. The method according to any one of Embodiments 134, 135, and 136, wherein the content of the resin matrix precursor component is as described in any one of Embodiments 134, 135, and 136. The method according to any one of Embodiments 134, 135, and 136.

[0328] Embodiment 156. The method according to any one of Embodiments 134, 135, and 136, wherein the content of the resin matrix precursor component is about 63% by volume or less based on the total volume of the forming mixture. The method according to any one of Embodiments 134, 135, and 136, wherein the content of the resin matrix precursor component is about 63% by volume or less based on the total volume of the forming mixture. The method according to any one of Embodiments 134, 135, and 136.

[0329] Embodiment 157. The content of the perfluoropolymer is at least about 45% by volume based on the total volume of the forming mixture, the method according to Embodiment 151.

[0330] Embodiment 158. The content of the perfluoropolymer is about 63% by volume or less based on the total volume of the forming mixture, the method according to Embodiment 151.

[0331] Embodiment 159. The content of the ceramic filler precursor component is at least about 45% by volume based on the total volume of the forming mixture, the method according to any one of Embodiments 134, 135, and 136.

[0332] Embodiment 160. The content of the ceramic filler precursor component is about 57% by volume or less based on the total volume of the forming mixture, the method according to any one of Embodiments 134, 135, and 136.

[0333] Embodiment 161. The content of the first filler precursor material is at least about 80% by volume based on the total volume of the ceramic filler precursor component, the method according to any one of Embodiments 134, 135, and 136.

[0334] Embodiment 162. The content of the first filler precursor material is about 100% by volume or less based on the total volume of the ceramic filler precursor component, the method according to any one of Embodiments 134, 135, and 136.

[0335] Embodiment 163. The ceramic filler precursor component further includes a second filler precursor material, the method according to any one of Embodiments 134, 135, and 136.

[0336] Embodiment 164. The second filler precursor material is the method according to Embodiment 163, which includes a high dielectric constant ceramic material.

[0337] Embodiment 165. The high dielectric constant ceramic material has a dielectric constant of at least about 14, and is the method according to Embodiment 164.

[0338] Embodiment 166. The ceramic filler precursor component further includes TiO2, SrTiO3, ZrTi2O6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof, and is the method according to Embodiment 164.

[0339] Embodiment 167. The content of the second filler precursor material is at least about 1% by volume based on the total volume of the ceramic filler precursor component, and is the method according to Embodiment 163.

[0340] Embodiment 168. The content of the second filler precursor material is about 20% by volume or less based on the total volume of the ceramic filler precursor component, and is the method according to Embodiment 163.

[0341] Embodiment 169. The ceramic filler precursor component is at least about 97% amorphous, and is the method according to any one of Embodiments 134, 135, and 136.

[0342] Embodiment 170. The polymer-based core film includes a porosity of about 10% by volume or less, and is the method according to any one of Embodiments 134, 135, and 136.

[0343] Embodiment 171. The polymer-based core film includes an average thickness of at least about 10 micrometers, and is the method according to any one of Embodiments 134, 135, and 136.

[0344] Embodiment 172. The polymer core film has an average thickness of about 2000 micrometers or less, and the method according to any one of Embodiments 134, 135, and 136.

[0345] Embodiment 173. The polymer core film has a loss factor (5 GHz, 20% RH) of about 0.005 or less, and the method according to any one of Embodiments 134, 135, and 136.

[0346] Embodiment 174. The polymer core film has a loss factor (5 GHz, 20% RH) of about 0.0014 or less, and the method according to any one of Embodiments 134, 135, and 136.

[0347] Embodiment 175. The polymer core film has a coefficient of thermal expansion (total axis) of about 80 ppm / °C or less, and the method according to any one of Embodiments 134, 135, and 136.

[0348] Embodiment 176. The polymer core film has a water absorption of about 0.05% or less, and the method according to any one of Embodiments 134, 135, and 136.

[0349] Embodiment 177. A method of forming a copper-clad laminate, the method including providing a copper foil layer, combining a resin matrix precursor component and a ceramic filler precursor component to form a forming mixture, forming the forming mixture into a polymer core film, and providing a fluoropolymer-based adhesive layer between the polymer core film and the copper foil layer, wherein the ceramic filler precursor component includes a first filler precursor material, and the particle size distribution of the first filler precursor material is at least about 0.5 micrometers and D of about 1.6 or less. 10 ​​​​​​​​​​​​​D of at least about 0.8 micrometers and about 2.7 micrometers or less 50 , and D of at least about 1.5 micrometers and about 4.7 micrometers or less 90 comprising , method.

[0350] Embodiment 178. A method of forming a copper-clad laminate, the method comprising providing a copper foil layer and combining a resin matrix precursor component and a ceramic filler precursor component to form a forming mixture forming the forming mixture into a polymer-based core film providing a fluoropolymer-based adhesive layer between the polymer-based core film and the copper foil layer wherein the ceramic filler precursor component comprises a first filler precursor material the first filler precursor material further comprising an average particle size of about 10 micrometers or less and a particle size distribution span (PS DS) of about 5 or less 90 where PSDS = (D 10 - D 50 ) / D 90 where D is equal to the D 90 particle size distribution measurement of the first filler precursor material 10 and D is equal to the D 10 particle size distribution measurement of the first filler precursor material 50 and D 50 is equal to the D particle size distribution measurement of the first filler precursor material, method.

[0351] Embodiment 179. A method of forming a copper-clad laminate, the method comprising providing a copper foil layer and combining a resin matrix precursor component and a ceramic filler precursor component to form a forming mixture forming the forming mixture into a polymer-based core film providing a fluoropolymer-based adhesive layer between the polymer-based core film and the copper foil layer See, the ceramic filler precursor component includes a first filler precursor material, and the first filler precursor material has an average particle size of about 10 micrometers or less and an average surface area of about 8 m 2 / g or less. A method further comprising.

[0352] Embodiment 180. The particle size distribution of the first filler precursor material is at least about 0.5 micro meter and D of about 1.6 micrometers or less 10 The method according to Embodiment 178 or 17 9.

[0353] Embodiment 181. The particle size distribution of the first filler precursor material is at least about 0.8 micro meter and D of about 2.7 micrometers or less 50 The method according to Embodiment 178 or 17 9.

[0354] Embodiment 182. The particle size distribution of the first filler precursor material is at least about 1.5 micro meter and D of about 4.7 micrometers or less 90 The method according to Embodiment 178 or 17 9.

[0355] Embodiment 183. The first filler precursor material further has an average particle size of about 10 micrometers or less. The method according to Embodiment 182.

[0356] Embodiment 184. The first filler precursor material has an average particle size of about 10 micrometers or less. The method according to any one of Embodiments 177, 178, and 179.

[0357] Embodiment 185. The first filler precursor material has a particle size distribution span (PSDS ) of about 5 or less, and PSDS is (D 90 -D 10 ) / D50 equal to D 90 is the first filler D of the precursor material 90 equal to the measured particle size distribution value of D 10 is D1 of the first filler precursor material equal to the measured particle size distribution value of 0 of D 50 is D of the first filler precursor material 50 measured particle size distribution value equal to the method according to Embodiment 177 or 179

[0358] Embodiment 186. The first filler precursor material further has an average surface area of about 8 m 2 / g or less The method according to Embodiment 177 or 179

[0359] Embodiment 187. The fluoropolymer-based adhesive layer has an average thickness of at least about 0.2 micrometers The method according to any one of Embodiments 177, 178, and 179 method

[0360] Embodiment 188. The fluoropolymer-based adhesive layer has an average thickness of about 7 micrometers or less The method according to any one of Embodiments 177, 178, and 179

[0361] Embodiment 189. The fluoropolymer-based adhesive layer is a fluoropolymer (e.g., poly tetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE) copolymers and terpolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP) and perfluoroalkoxy polymer resin (PFA), and modified perfluoro oroalkoxy polymer resin (mPFA), and derivatives and blends thereof, including The method according to any one of Embodiments 177, 178, and 179. Further embodiments According to this, the fluoropolymer-based adhesive layer 207 may be composed of a fluoropolymer (for example, polytetra fluoroethylene (PTFE), modified polytetrafluoroethylene .

[0362] Embodiment 190. The fluoropolymer-based adhesive layer is a fluoropolymer (for example, poly tetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE) , copolymers and terpolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP) and perfluoroalkoxy polymer resin (PFA), and modified perfluoro oroalkoxy polymer resin (mPFA), and their derivatives and blends , the method according to any one of Embodiments 177, 178, and 179. According to still other embodiments , the fluoropolymer-based adhesive layer 207 may be composed of a fluoropolymer (for example, polytetra fluoroethylene (PTFE), modified polytetrafluoroethylene .

[0363] Embodiment 191. The fluoropolymer-based adhesive layer is a PFA layer, the method according to any one of Embodiments 177 , 178, and 179.

[0364] Embodiment 192. The first filler precursor material contains a silica-based compound, the method according to any one of Embodiments 17 7, 178, and 179.

[0365] Embodiment 193. The first filler precursor material contains silica, the method according to any one of Embodiments 177, 17 8, and 179.

[0366] Embodiment 194. The resin matrix contains a perfluoropolymer, the method according to Embodiment 17 The method according to any one of 7, 178, and 179.

[0367] Embodiment 195. The perfluoropolymer is a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof, according to the method described in Embodiment 194. (TFE), or any combination thereof, according to the method described in Embodiment 194. The method according to any one of 7, 178, and 179.

[0368] Embodiment 196. The perfluoropolymer is polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof, according to the method described in Embodiment 194. (TFE), or any combination thereof, according to the method described in Embodiment 194.

[0369] Embodiment 197. The perfluoropolymer is polytetrafluoroethylene (PTFE), (TFE), or any combination thereof, according to the method described in Embodiment 194. perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof, and is composed of any combination thereof, according to the method described in Embodiment 194.

[0370] Embodiment 198. The content of the resin matrix precursor component is at least about 45% by volume based on the total volume of the polymer-based core film, according to any one of Embodiments 177, 178, and 179. The method according to any one of 7, 178, and 179. The method according to any one of 7, 178, and 179.

[0371] Embodiment 199. The content of the resin matrix precursor component is about 63% by volume or less based on the total volume of the polymer-based core film, according to any one of Embodiments 177, 178, and 179. The method according to any one of 7, 178, and 179. The method according to any one of 7, 178, and 179.

[0372] Embodiment 200. The content of the perfluoropolymer is the total volume of the polymer-based core film. The method according to Embodiment 194, which is at least about 45% by volume with respect to the product.

[0373] Embodiment 201. The content of the perfluoropolymer is about 63% by volume or less with respect to the total volume of the polymer-based core film. The method according to Embodiment 194, which is about 63% by volume or less with respect to the product.

[0374] Embodiment 202. The content of the ceramic filler precursor component is at least about 45% by volume with respect to the total volume of the polymer-based core film, according to any one of Embodiments 177, 178, and 179. The method according to any one of Embodiments 177, 178, and 179, which is at least about 45% by volume with respect to the total volume of the polymer-based core film. The method according to any one of Embodiments 177, 178, and 179, which is about 57% by volume or less with respect to the total volume of the polymer-based core film.

[0375] Embodiment 203. The content of the ceramic filler precursor component is about 57% by volume or less with respect to the total volume of the polymer-based core film, according to any one of Embodiments 177, 178, and 179. The method according to any one of Embodiments 177, 178, and 179, which is about 57% by volume or less with respect to the total volume of the polymer-based core film. The method according to any one of Embodiments 177, 178, and 179, which is about 57% by volume or less with respect to the total volume of the polymer-based core film.

[0376] Embodiment 204. The content of the first filler precursor material is at least about 80% by volume with respect to the total volume of the ceramic filler precursor component, according to any one of Embodiments 177, 178, and 179. The method according to any one of Embodiments 177, 178, and 179, which is at least about 80% by volume with respect to the total volume of the ceramic filler precursor component. The method according to any one of Embodiments 177, 178, and 179, which is about 100% by volume or less with respect to the total volume of the ceramic filler precursor component.

[0377] Embodiment 205. The content of the first filler precursor material is about 100% by volume or less with respect to the total volume of the ceramic filler precursor component, according to any one of Embodiments 177, 178, and 179. The method according to any one of Embodiments 177, 178, and 179, which is about 100% by volume or less with respect to the total volume of the ceramic filler precursor component. The method according to any one of Embodiments 177, 178, and 179, which is about 100% by volume or less with respect to the total volume of the ceramic filler precursor component.

[0378] Embodiment 206. The ceramic filler precursor component further includes a second filler material, according to any one of Embodiments 177, 178, and 179. The method according to any one of Embodiments 177, 178, and 179, which is about 100% by volume or less with respect to the total volume of the ceramic filler precursor component.

[0379] Embodiment 207. The second filler material includes a high dielectric constant ceramic material, according to Embodiment 1. The method according to 94.

[0380] Embodiment 208. The high dielectric constant ceramic material has a dielectric constant of at least about 14. The method according to Embodiment 195.

[0381] Embodiment 209. The ceramic filler precursor component is TiO2, SrTiO3, ZrT i2O6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof The method according to Embodiment 195, further comprising.

[0382] Embodiment 210. The content of the second filler material is at least about 1% by volume based on the total volume of the ceramic filler precursor component. The method according to Embodiment 194. The method according to Embodiment 194.

[0383] Embodiment 211. The content of the second filler material is about 20% by volume or less based on the total volume of the ceramic filler precursor component. The method according to Embodiment 194. The method according to Embodiment 194.

[0384] Embodiment 212. The ceramic filler precursor component is at least about 97% amorphous The method according to any one of Embodiments 177, 178, and 179.

[0385] Embodiment 213. The polymer-based core film contains a porosity of about 10% by volume or less. The method according to any one of Embodiments 177, 178, and 179. The method according to any one of Embodiments 177, 178, and 179.

[0386] Embodiment 214. The polymer-based core film has an average thickness of at least about 10 micrometers. The method according to any one of Embodiments 177, 178, and 179. The method according to any one of Embodiments 177, 178, and 179.

[0387] Embodiment 215. The polymer-based core film has a flatness of about 2000 micrometers or less. The method according to any one of embodiments 177, 178, and 179, including uniform thickness.

[0388] Embodiment 216. The polymer-based core film has a loss factor of about 0.005 or less (5GH z, 20%RH), and the method according to any one of embodiments 177, 178, and 179. Method.

[0389] Embodiment 217. The polymer-based core film has a loss factor of about 0.0014 or less (5G Hz, 20%RH), and the method according to any one of embodiments 177, 178, and 179. Method.

[0390] Embodiment 218. The polymer-based core film has a coefficient of thermal expansion of about 80 ppm / °C or less ( total axis), and the method according to any one of embodiments 177, 178, and 179.

[0391] Embodiment 219. The polymer-based core film includes a water absorption of about 0.05% or less, and the method according to any one of embodiments 177, 178, and 179.

[0392] Embodiment 220. The copper-clad laminate includes a porosity of about 10% by volume or less, and the method according to any one of embodiments 177 , 178, and 179.

[0393] Embodiment 221. The copper-clad laminate includes a peel strength of at least about 6 lb / in between the copper foil layer and the dielectric substrate, and the method according to any one of embodiments 177, 178, and 179. Method.

[0394] Embodiment 222. A method of forming a printed circuit board, the method comprising providing a copper foil layer and combining a resin matrix precursor component and a ceramic filler precursor component. forming a forming mixture and forming the forming mixture into a polymeric core film providing a fluoropolymer-based adhesive layer between the polymeric core film and the copper foil layer , wherein the ceramic filler precursor component includes a first filler precursor material, and the first filler precursor material has a particle size distribution with a D1 of at least about 0.5 micrometer and about 1.6 or less 0, a D of at least about 0.8 micrometer and about 2.7 micrometers or less 50 , and a D of at least about 1.5 micrometers and about 4.7 micrometers or less 90 comprising a method.

[0395] Embodiment 223. A method of forming a printed circuit board, the method comprising providing a copper foil layer combining a resin matrix precursor component and a ceramic filler precursor component to form a forming mixture and forming the forming mixture into a polymeric core film providing a fluoropolymer-based adhesive layer between the polymeric core film and the copper foil layer , wherein the ceramic filler precursor component includes a first filler precursor material, and the first filler precursor material has an average particle size of about 10 micrometers or less and a particle size distribution span (PSDS) of about 5 or less (PSDS), where PSDS is (D 90 - D 10 ) / D 50 equal to, where D 90 is the D 90 particle size distribution measurement value of the first filler precursor material, and D 10 is the D particle size distribution measurement value of the first filler precursor 10 material, and D 50 is the D 50 particle size distribution measurement value of the first filler precursor material, a method.

[0396] Embodiment 224. A method of forming a printed circuit board, the method comprising providing a copper foil layer combining a resin matrix precursor component and a ceramic filler precursor component to form a forming mixture, forming the forming mixture into a polymeric core film, providing a fluoropolymer-based adhesive layer between the polymeric core film and the copper foil layer , wherein the ceramic filler precursor component includes a first filler precursor material, and the first filler precursor material further includes an average particle size of about 10 micrometers or less and an average surface 2 area of about 8 m / g or less. A method.

[0397] Embodiment 225. The particle size distribution of the first filler precursor material includes a D of at least about 0.5 micrometer and about 1.6 micrometers or less The method according to Embodiment 223 or 22 10 as described in. 4.

[0398] Embodiment 226. The particle size distribution of the first filler precursor material includes a D of at least about 0.8 micrometer and about 2.7 micrometers or less The method according to Embodiment 223 or 22 50 as described in. 4.

[0399] Embodiment 227. The particle size distribution of the first filler precursor material includes a D of at least about 1.5 micrometer and about 4.7 micrometers or less The method according to Embodiment 223 or 22 90 as described in. 4.

[0400] Embodiment 228. The method according to Embodiment 227, wherein the first filler precursor material further includes an average particle size of about 10 micrometers or less diameter.

[0401] Embodiment 229. The first filler precursor material is the method according to any one of Embodiments 222, 223, and 224, including an average particle size of about 10 micrometers or less. The diameter is included.

[0402] Embodiment 230. The first filler precursor material includes a particle size distribution span (PSDS) of about 5 or less, and the PSDS is equal to (D ) where D 90 - D 10 ) / D 50 , D 90 is equal to the D particle size distribution measurement value of the first filler 90 precursor material, D 10 is equal to the D1 0 particle size distribution measurement value of the first filler precursor material, and D 50 is equal to the D 50 particle size distribution measurement value of the first filler precursor material, which is the method according to Embodiment 222 or 224.

[0403] Embodiment 231. The first filler precursor material further includes an average surface area of about 8 m 2 / g or less, which is the method according to Embodiment 222 or 224.

[0404] Embodiment 232. The fluoropolymer-based adhesive layer has an average thickness of at least about 0.2 micrometers, which is the method according to any one of Embodiments 222, 223, and 224.

[0405] Embodiment 233. The fluoropolymer-based adhesive layer has an average thickness of about 7 micrometers or less, which is the method according to any one of Embodiments 222, 223, and 224.

[0406] Embodiment 234. The fluoropolymer-based adhesive layer is a fluoropolymer (e.g., poly tetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE) , copolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP) and terpolymers, perfluoroalkoxy polymer resins (PFA), and modified perflu oroalkoxy polymer resins (mPFA), and derivatives and blends thereof, The method according to any one of Embodiments 222, 223, and 224. According to still other embodiments The fluoropolymer-based adhesive layer 207 may be composed of a fluoropolymer (e.g., polytetra fluoroethylene (PTFE), modified polytetrafluoroethylene .

[0407] Embodiment 235. The fluoropolymer-based adhesive layer is composed of a fluoropolymer (e.g., polytetra fluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE) , copolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP) and terpolymers, perfluoroalkoxy polymer resins (PFA), and modified perflu oroalkoxy polymer resins (mPFA), and derivatives and blends thereof, The method according to any one of Embodiments 222, 223, and 224. According to still other embodiments The fluoropolymer-based adhesive layer 207 may be composed of a fluoropolymer (e.g., polytetra fluoroethylene (PTFE), modified polytetrafluoroethylene too.

[0408] Embodiment 236. The fluoropolymer-based adhesive layer is a PFA layer, the method according to any one of Embodiments 222 , 223, and 224.

[0409] Embodiment 237. The first filler precursor material contains a silica-based compound, Embodiment 22 The method according to any one of 2, 223, and 224.

[0410] Embodiment 238. The first filler precursor material contains silica, the method according to any one of Embodiments 222, 22 3, and 224.

[0411] Embodiment 239. The resin matrix contains a perfluoropolymer, the method according to any one of Embodiments 22 2, 223, and 224.

[0412] Embodiment 240. The perfluoropolymer is a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof, the method according to Embodiment 239. (TFE), or any combination thereof, the method according to Embodiment 239. described.

[0413] Embodiment 241. The perfluoropolymer is polytetrafluoroethylene (PTFE ), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (F EP), or any combination thereof, the method according to Embodiment 239.

[0414] Embodiment 242. The perfluoropolymer is polytetrafluoroethylene (PTFE ), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (F EP), or any combination thereof, the method according to Embodiment 239.

[0415] Embodiment 243. The content of the resin matrix precursor component is at least about 45% by volume based on the total volume of the polymer-based core film , the method according to any one of Embodiments 222, 223, and 22 4.

[0416] Embodiment 244. The content of the resin matrix precursor component is the polymer-based core film is about 63% by volume or less with respect to the total volume of, any one of Embodiments 222, 223, and 224 The method according to any one of.

[0417] Embodiment 245. The content of the perfluoropolymer is at least about 45% by volume with respect to the total volume of the polymer-based core film The method according to Embodiment 239.

[0418] Embodiment 246. The content of the perfluoropolymer is about 63% by volume or less with respect to the total volume of the polymer-based core film The method according to Embodiment 239.

[0419] Embodiment 247. The content of the ceramic filler precursor component is at least about 45% by volume with respect to the total volume of the polymer-based core film of any one of Embodiments 222, 223, and 22 4 The method according to any one of.

[0420] Embodiment 248. The content of the ceramic filler precursor component is about 57% by volume or less with respect to the total volume of the polymer-based core film of any one of Embodiments 222, 223, and 224 The method according to any one of.

[0421] Embodiment 249. The content of the first filler precursor material is at least about 80% by volume with respect to the total volume of the ceramic filler precursor component of any one of Embodiments 222, 223, and 22 4 The method according to any one of.

[0422] Embodiment 250. The content of the first filler precursor material is about 100% by volume or less with respect to the total volume of the ceramic filler precursor component of any one of Embodiments 222, 223, and 224 The method according to any one of.

[0423] Embodiment 251. The ceramic filler precursor composition further comprises a second filler material. 225. The method according to any one of embodiments 222, 223, and 224.

[0424] Embodiment 252. The second filler material comprises a high dielectric constant ceramic material. 39. The method according to claim 39.

[0425] Embodiment 253. The high dielectric constant ceramic material has a dielectric constant of at least about 14. The method of embodiment 240.

[0426] Embodiment 254. The ceramic filler precursor component is TiO2, SrTiO3, ZrT i2O6, MgTiO3, CaTiO3, BaTiO4 or any combination thereof 241. The method of embodiment 240, further comprising:

[0427] Embodiment 255. The content of the second filler material is the total of the ceramic filler precursor components. 239. The method of claim 239, wherein the amount of the hydroxybenzoate is at least about 1% by volume.

[0428] Embodiment 256. The content of the second filler material is the total of the ceramic filler precursor components. 239. The method of claim 239, wherein the amount of the hydroxyl group is about 20% or less by volume.

[0429] Embodiment 257. The ceramic filler precursor component is at least about 97% amorphous. , A method according to any one of embodiments 222, 223, and 224.

[0430] Embodiment 258. The polymer-based core film comprises a porosity of about 10% by volume or less. 225. The method according to any one of embodiments 222, 223, and 224.

[0431] Embodiment 259. The polymer core film has an average thickness of at least about 10 micrometers, and is the method according to any one of Embodiments 222, 223, and 224.

[0432] Embodiment 260. The polymer core film has an average thickness of about 2000 micrometers or less, and is the method according to any one of Embodiments 222, 223, and 224.

[0433] Embodiment 261. The polymer core film has a loss factor (5 GHz, 20% RH) of about 0.005 or less, and is the method according to any one of Embodiments 222, 223, and 224.

[0434] Embodiment 262. The polymer core film has a loss factor (5 GHz, 20% RH) of about 0.0014 or less, and is the method according to any one of Embodiments 222, 223, and 224.

[0435] Embodiment 263. The polymer core film has a coefficient of thermal expansion (total axis) of about 80 ppm / °C or less, and is the method according to any one of Embodiments 222, 223, and 224.

[0436] Embodiment 264. The polymer core film has a water absorption of about 0.05% or less, and is the method according to any one of Embodiments 222, 223, and 224.

[0437] Embodiment 265. The copper-clad laminate has a porosity of about 10% by volume or less, and is the method according to any one of Embodiments 222, 223, and 224.

[0438] Embodiment 266. The copper-clad laminate has at least about 6 lb / between the copper foil layer and the dielectric substrate. The method according to any one of Embodiments 222, 223, and 224, including the peel strength of in. Method.

Example

[0439] The concepts described herein are further described in the following examples, which do not limit the scope of the invention claimed. The scope of the invention claimed in the claims.

[0440] Example 1 Sample dielectric substrates S1 to S12 were constructed and formed according to the specific embodiments described herein. Formed.

[0441] Each sample dielectric substrate was formed using a cast film process. In this process, a polyimide carrier belt pretreated with a fluoropolymer passes through a dip pan containing an aqueous forming mixture (i.e., a combination of a resin matrix component and a ceramic filler component) at the base of the coating tower. Next, the coated carrier belt passes through a metering zone where a metering bar removes excess dispersion liquid from the coated carrier belt. After the metering zone, the coated carrier belt passes through a drying zone maintained at a temperature of 82 °C to 121 °C to evaporate water. Then, the coated carrier belt having the dried film passes through a baking zone maintained at a temperature of 315 °C to 343 °C. Finally, the carrier belt passes through a melting zone maintained at a temperature of 349 °C to 399 °C to sinter, i.e., combine, the resin matrix material. Next, the coated carrier belt passes through a cooling plenum from which it is fed to a subsequent dip pan to initiate the formation of a further layer of the film. In this process, a polyimide carrier belt pretreated with a fluoropolymer passes through a dip pan containing an aqueous forming mixture (i.e., a combination of a resin matrix component and a ceramic filler component) at the base of the coating tower. At the base of the coating tower, a dip pan containing an aqueous forming mixture (i.e., a combination of a resin matrix component and a ceramic filler component) is passed through. Filler component combination). The coated carrier belt then passes through a metering zone where a metering bar removes excess dispersion liquid from the coated carrier belt. After the metering zone, the coated carrier belt passes through a drying zone maintained at a temperature of 82 °C to 121 °C to evaporate water. The coated carrier belt passes through a drying zone maintained at a temperature of 82 °C to 121 °C to evaporate water. Next, the coated carrier belt having the dried film passes through a baking zone maintained at a temperature of 315 °C to 343 °C. 343 °C. Finally, the carrier belt passes through a melting zone maintained at a temperature of 349 °C to 399 °C to sinter the resin matrix material, i.e., combine it. That is, combine. Next, the coated carrier belt passes through a cooling plenum and from there, to a subsequent dip pan to initiate the formation of a further layer of the film. The coated carrier belt passes through a cooling plenum and from there, to a subsequent dip pan to initiate the formation of a further layer of the film. Or it can be led to any of the stripping devices. When the desired film thickness is achieved the film is peeled off from the carrier belt.

[0442] The resin matrix component of each sample dielectric substrate S1 to S12 is polytetrafluoro ethylene (PTFE). The details of the further configuration and composition of each dielectric substrate S1 to S12 are summarized in Table 1 below.

[0443]

Table 1

[0444] The measured values of the particle size distribution of the silica-based component type used in the sample dielectric substrates S1 to S12 (i.e., D 10 , D 50 , and D 90 ), the particle size distribution span, the average particle size, and the BET surface area are summarized in Table 2 below.

[0445]

Table 2

[0446] The performance characteristics of each sample dielectric substrate S1 to S12 are summarized in Table 3 below. The summarized performance characteristics include the dielectric constant of the sample dielectric substrate measured at 5 GHz ("Dk(5 GHz) "), the loss coefficient of the substrate measured at 5 GHz at 20% RH ("Df(5 GHz, 20% RH)"), the loss coefficient of the sample dielectric substrate measured at 5 GHz at 80% RH ("D f(5 GHz, 80% RH)"), and the coefficient of thermal expansion of the sample dielectric substrate (coefficient of thermal expansion, "CTE").

[0447]

Table 3

[0448] Example 2 For comparison, comparative sample dielectric substrates CS1 to CS10 were constructed and formed.

[0449] Each comparative sample dielectric substrate was formed using a cast film process. In this process, a polyimide carrier belt pretreated with a fluoropolymer passes through a dip pan containing an aqueous forming mixture (i.e., a combination of a resin matrix component and a ceramic filler component) at the base of a coating tower. Next, the coated carrier belt passes through a metering zone where a metering bar removes excess dispersion from the coated carrier belt. After the metering zone, the coated carrier belt passes through a drying zone maintained at a temperature of 82 °C to 121 °C to evaporate water . Next, the coated carrier belt having the dried film passes through a baking zone maintained at a temperature of 315 °C to 343 °C. Finally, the carrier belt passes through a melting zone maintained at a temperature of 349 °C to 399 °C to sinter, i.e., combine, the resin matrix material. Then, the coated carrier belt passes through a cooling plenum and from there can be directed either to a subsequent dip pan to initiate the formation of a further layer of the film or to a stripping device. When the desired film thickness is achieved , the film is peeled off the carrier belt. The resin matrix component of each comparative sample dielectric substrate CS1 to CS10 is polytetra fluoroethylene. When the desired film thickness is achieved, the film is peeled off the carrier belt.

[0450] fluoroethylene. Fluoroethylene (PTFE). Further configurations of the dielectric substrates CS1 to CS10 Composition details are summarized in Table 4 below.

[0451] [Table 4]

[0452] Measurement of particle size distribution of silica-based component types used in sample dielectric substrates CS1 to CS9 value (i.e., D 10 , D 50 , and D 90 ), particle size distribution span, average particle size, and BET Properties including surface area are summarized in Table 2 below.

[0453] [Table 5]

[0454] The performance characteristics of each sample dielectric substrate CS1-S9 are summarized in Table 6 below. Performance characteristics are measured at 5 GHz for the dielectric constant of the sample dielectric substrate (Dk(5 GHz) "), and the loss factor of the board measured at 5 GHz at 20% RH ("Df(5 GHz, 20% RH)"), and the loss factor (D f(5GHz, 80%RH)"), and the coefficient of thermal expansion ("CTE") of the sample dielectric substrate Includes:

[0455] [Table 6]

[0456] Example 3 Sample dielectric substrates S13-S28 are used in accordance with certain embodiments described herein. Thus constructed and formed.

[0457] Each sample dielectric substrate was formed using a cast film process. In this process, a polyimide carrier belt pretreated with a fluoropolymer passes through a dip pan containing an aqueous forming mixture (i.e., a combination of a resin matrix component and a ceramic filler component) at the base of a coating tower. Next, the coated carrier belt passes through a metering zone where a metering bar removes excess dispersion liquid from the coated carrier belt. After the metering zone, the coated carrier belt passes through a drying zone maintained at a temperature of 82 °C to 121 °C to evaporate water. Next, the coated carrier belt having the dried film passes through a baking zone maintained at a temperature of 315 °C to 343 °C. Finally, the carrier belt passes through a melting zone maintained at a temperature of 349 °C to 399 °C to sinter, i.e., combine, the resin matrix material. Next, the coated carrier belt passes through a cooling plenum from where it can be directed to either a subsequent dip pan or a stripping device to initiate the formation of

[0458] further layers of the film. When the desired film thickness is achieved, the film is peeled off the carrier belt. Details regarding the further configuration and composition of each dielectric substrate S13 - S28, including details regarding the type, thickness

[0459]

Table 7

[0460] Measurement of the particle size distribution of the silica-based component type used in the sample dielectric substrates S13 to S28 Values (i.e., D 10 , D 50 , and D 90 ), the particle size distribution span, the average particle size, and the BET characteristics including the surface area are summarized in Table 2 above.

[0461] The performance characteristics of each of the sample dielectric substrates S13 to S28 are summarized in Table 8 below. The summarized performance characteristics include the dielectric constant of the sample dielectric substrate measured at 5 GHz ("Dk(5 GHz )"), the loss coefficient of the substrate measured at 5 GHz at 20% RH ("Df(5 GHz, 20 % RH)"), the loss coefficient of the sample dielectric substrate measured at 5 GHz at 80% RH (" Df(5 GHz, 80% RH)"), and the coefficient of thermal expansion of the sample dielectric substrate ("CTE" ).

[0462]

Table 8

[0463] In a general description or example, not all of the activities described above are required and in some cases, some of the specific activities may not be required, and it should be noted that one or more additional activities may be performed in addition to the activities described. Still further, the order in which the activities are listed is not necessarily the order in which they are performed.

[0464] Benefits, other advantages, and solutions to problems are described above with respect to specific embodiments . However, benefits, advantages, solutions to problems, and any benefits, advantages, or solutions that may result Any feature that may render the invention less or more prominent may be included in any or all of the claims. They should not be construed as necessary or essential features.

[0465] The specification and drawings of the embodiments set forth herein are provided to provide a general understanding of the structure of the various embodiments. The specification and drawings are intended to provide a solution to the problems of the structures or methods described herein. Serves as a comprehensive and comprehensive description of all elements and features of the equipment and systems used It is not intended that separate embodiments be provided in combination in a single embodiment. Conversely, various embodiments that are described in the context of a single embodiment for the sake of brevity may be combined. The features may be provided separately or in any subcombination. Reference to a range of values includes every individual value within that range. Many other embodiments are described herein. Without departing from the scope of this disclosure, Other embodiments may be used so that structural, logical substitutions, or other changes may be made. and can be derived from this disclosure. Accordingly, this disclosure is intended to be illustrative and not restrictive. should be regarded as something.

Claims

1. A dielectric substrate comprising: a polymer-based core film; and a fluoropolymer-based adhesive layer. The polymer-based core film comprises: a resin matrix component; and a ceramic filler component. The ceramic filler component includes a first filler material. The particle size distribution of the first filler material is D of at least about 0.5 micrometers and about 1.6 micrometers or less １ ０ and D of at least about 0.8 micrometers and about 2.7 micrometers or less ５ ０ and D of at least about 1.5 micrometers and about 4.7 micrometers or less ９ ０ A dielectric substrate including [specific components].

2. The first filler material further includes an average particle size of about 10 micrometers or less. The dielectric substrate according to claim 1.

3. The first filler material includes a particle size distribution span (PSDS) of about 5 or less. The dielectric substrate of is (D ９０ - D １０ ) / D ５０ equal to, and D ９０ is the D of the first filler material ９０ grain equal to the particle size distribution measurement value, D １０ is the D of the first filler material １０ equal to the particle size distribution measurement value く, D ５０ is equal to the D of the first filler material ５０ particle size distribution measurement value, as described in claim 1 PSDS

4. The first filler material further includes an average surface area of about 8 m ２ / g or less, as recited in claim 1 The dielectric substrate according to claim above.

5. The first filler material includes a silica-based compound. The dielectric substrate according to claim 1.

6. The resin matrix includes a perfluoropolymer. The dielectric substrate according to claim 1 board.

7. The content of the resin matrix component is at least about 45% by volume and about 63% by volume or less with respect to the total volume of the polymer-based core film. The dielectric substrate according to claim 1

8. 。 The content of the ceramic filler component is at least about 45% by volume and about 57% by volume or less with respect to the total volume of the polymer-based core film. The dielectric substrate according to claim 1

9. The content of the first filler material is at least about 80% by volume and about 100% by volume or less with respect to the total volume of the ceramic filler component. The dielectric substrate according to claim 1. 。

10. The dielectric substrate includes a loss factor of about 0.005 or less (5 GHz, 20% RH). The dielectric substrate according to claim 1.

11. A copper-clad laminate comprising: a copper foil layer; and a dielectric substrate covering the copper foil layer. The dielectric substrate a polymer-based core film; and a fluoropolymer-based adhesive layer. The polymer-based core film a resin matrix component; and a ceramic filler component. The ceramic filler component includes a first filler material. The particle size distribution of the first filler material at least about 0.5 micrometers and about 1.6 micrometers or less at least about 0.8 micrometers and about 2.7 micrometers or less at least about 1.5 micrometers and about 4.7 micrometers or less

12. D １０ and The first filler material further includes an average particle size of about 10 micrometers or less. The copper-clad laminate according to claim D ５０ and 11. D ９０ A copper-clad laminate containing the same.

13. ​ ​ ​ The first filler material includes a particle size distribution span (PSDS) of about 5 or less, and the PSDS is (D ９０ - D １０ ) / D ５０ equal to, where D ９０ is the D of the first filler material ９０ granule equal to the radial distribution measurement value, D １０ is the D of the first filler material １０ equal to the particle size distribution measurement value く, D ５０ is the D of the first filler material ５０ equal to the measured particle size distribution value of Claim 11 copper-clad laminate of the above.

14. The first filler material further includes an average surface area of about 8 m ２ / g or less, according to claim 11 copper-clad laminate described.

15. A printed circuit board including a copper-clad laminate, wherein the copper-clad laminate includes a copper foil layer and a dielectric substrate covering the copper foil layer, the dielectric substrate includes a polymer-based core film and a fluoropolymer-based adhesive layer, the polymer-based core film includes a resin matrix component and a ceramic filler component, the ceramic filler component includes a first filler material, the particle size distribution of the first filler material is at least about 0.5 micrometers and about 1.6 micrometers or less of D １０ and is at least about 0.8 micrometers and about 2.7 micrometers or less of D ５０ and is at least about 1.5 micrometers and about 4.7 micrometers or less D of ９０ A printed circuit board including

Images