Lighting device

Abstract

To provide a lighting device that can combine a light emitting module and a bracket by a simple process and can improve a heat dissipation capability of a circuit board, thereby improving the reliability of the light emitting module.SOLUTION: In a lighting device 1000, a bracket 100 is disposed under a circuit board 300, and the bracket 100 can support a light emitting module 600. The lighting device includes: a light emitting module 600 including a plurality of light emitting elements 400 arranged on the circuit board; and a coupling member 200 coupled to a lower surface of the circuit board. The coupling member can include: a head portion 210 arranged under the circuit board; a support portion 220 bent from both ends of the head portion; an elastic portion 230 extended and bent outwardly from the other end of the support portion; a detachment preventing portion 240 extended and bent from the elastic portion; and a leg portion 250 partially extended in a vertical direction from the detachment preventing portions and partially bent to have an inclined surface.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The embodiments of the invention relate to a lighting device capable of effectively coupling a light-emitting module providing a surface light source and a bracket.

Background Art

[0002] Common lighting applications include not only vehicle lighting but also backlights for displays and signs.

[0003] Light-emitting elements, such as light-emitting diodes (LEDs), have advantages such as low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness compared to existing light sources such as fluorescent lamps and incandescent lamps. Such light-emitting diodes are applied to various lighting devices such as various display devices, indoor lights, or outdoor lights.

[0004] Recently, lamps employing light-emitting diodes have been proposed as vehicle light sources. Compared with incandescent lamps, light-emitting diodes are advantageous in terms of low power consumption. Vehicle lighting uses a light-emitting module including light-emitting diodes arranged on a substrate in combination with a bracket. Conventionally, the bracket and the light-emitting module are coupled by a method such as a hook or a rivet form. However, such existing methods have problems such as blocking the light-emitting surface of the light-emitting module, complicated processes, and detachment of the light-emitting module from the bracket due to external force.

Summary of the Invention

Problems to be Solved by the Invention

[0005] The lighting device according to the embodiment can couple the light-emitting module and the bracket by a simple process. ​​​​​​ The bonding strength between the light-emitting module and the bracket according to the embodiment can be improved.

[0006] The lighting device according to the embodiment can improve the heat dissipation capacity of the circuit board and improve the reliability of the light-emitting module.

Means for Solving the Problems

[0007] The embodiment includes a circuit board and a light-emitting module including a plurality of light-emitting elements arranged on the circuit board, and a coupling member coupled to the lower surface of the circuit board. The coupling member is disposed on the lower surface of the circuit board and includes a head portion including a first side surface, a second side surface opposite to the first side surface, a third side surface connected to the first side surface and the second side surface, and a fourth side surface opposite to the third side surface, a first support portion extending vertically from one end of the head portion, a second support portion extending vertically from the other end of the head portion, a first elastic portion bent from the first support portion in an outer direction of the first support portion, a second elastic portion bent from the second support portion in an outer direction of the second support portion, a first detachment prevention portion extending from an end of the first elastic portion in a direction of the first support portion, a second detachment prevention portion extending from an end of the second elastic portion in a direction of the second support portion, a first leg portion extending from an end of the first detachment prevention portion in a direction of the lower surface of the circuit board, and a second leg portion extending from an end of the second detachment prevention portion in a direction of the lower surface of the circuit board. The first leg portion has a plurality of first elastic pieces, the second leg portion has a plurality of second elastic pieces, the first elastic piece of the first leg portion is inclined outward from the first leg portion, and the second elastic piece of the second leg portion is inclined outward from the second leg portion. ​​​​​​​​​​​​​​​It can include a lighting device that is inclined in a certain direction.

[0008] The head portion of the lighting device according to the embodiment has a width between the first side surface and the second side surface that is larger than the width between the third side surface and the fourth side surface described above, and a second head portion that extends inward from the first side surface and the second side surface of the head portion, respectively, and a first head portion that connects the second head portions can be included. The width between the third side surface and the fourth side surface of the second head portion of the lighting device according to the embodiment is larger than the width between the third side surface and the fourth side surface of the first head portion, and the first head portion can include an opening.

[0009]

[0010] The first head portion of the lighting device according to the embodiment can include grooves recessed at the third side surface and the fourth side surface.

[0011] The first anti-disengagement portion and the second anti-disengagement portion of the lighting device according to the embodiment extend in a direction parallel to the head portion. The connecting portion between the first support portion and the first elastic portion of the lighting device according to the embodiment, the connecting portion between the second support portion and the second elastic portion, the connecting portion between the first elastic portion and the first anti-disengagement portion, and the connecting portion between the second elastic portion and the second anti-disengagement portion can each be a curved surface.

[0012] The angle between the virtual straight line passing through the first elastic portion and the virtual straight line passing through the first support portion of the lighting device according to the embodiment is an acute angle, the angle between the virtual straight line passing through the second elastic portion and the virtual straight line passing through the second support portion is an acute angle, and the angle between the virtual straight line passing through the first anti-disengagement portion and the ​​​​​​​​​​​​The angle between the virtual straight lines passing through the first elastic part is an acute angle, and the angle between the virtual straight line passing through the second detachment prevention part and the virtual straight line passing through the second elastic part may be an acute angle.

[0013] The first leg part and the second leg part of the lighting device according to the embodiment are respectively the first 1-1 leg part and the second 2-1 leg part extending vertically from the ends of the detachment prevention part and the second detachment prevention part, and the first 1-2 leg part and the second-2 leg part extending from the first-1 leg part and the second-2 leg part, and the first elastic piece and the second elastic piece extending from the first-1 leg part and the second-1 leg part and inclined in the outer direction may be included. can be.

Advantages of the Invention

[0014] The embodiment can provide a lighting device with improved coupling force between the bracket and the light emitting module. can. The embodiment can provide a lighting device including a substrate having improved heat dissipation ability.

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

Figure 3

Figure 4

Figures 5a-5b

Figure 6

Figures 7a-7b

Figures 8a-8b

Figure 9

Figure 10

Mode for Carrying Out the Invention

[0016] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical idea of the present invention is not limited to some of the described embodiments, and can be embodied in various forms. Within the scope of the technical idea of the present invention, components between the embodiments can be selectively combined or replaced and used. Also, the terms (including technical and scientific terms) used in the embodiments of the present invention [[ID=2A]] shall, unless specifically defined and described, be construed in a meaning generally understandable to those having ordinary knowledge in the technical field to which the present invention pertains, and terms generally used as defined in a dictionary shall be construed in their meaning in consideration of the context of the relevant technology. Also, the terms used in the embodiments of the present invention are for explaining the embodiments and are not intended to limit the present invention. In this specification, the singular form can include the plural form as well, unless otherwise particularly limited in the description. When described as "at least one (or one or more) of A and B, C", one or more of all the combinations that can be combined with A, B, and C can be included. Also, in the description of the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. are used.

[0017] In this specification, the singular form can include the plural form as well, unless otherwise particularly limited in the description. When described as "at least one (or one or more) of A and B, C", one or more of all the combinations that can be combined with A, B, and C can be included. Also, in the description of the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. are used. can include one or more of all the combinations that can be combined with A, B, and C. Also, in the description of the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. are used. It should be noted that in the translation, there was an error in the original text where "2A" was likely a misprint. It has been left as is in the translation for the purpose of maintaining consistency with the original text. If this was an actual variable or term, it should be corrected in the original text for a more accurate translation. It is possible. Such terms are for distinguishing its components from other components, and do not limit the essence or order of the component by the term. When a component is described as being "connected", "coupled" or "connected" to another component, it includes the case where the component is directly connected or connected to the other component, and all cases where one or more other components are further "connected", "coupled" or "connected" between the components.

[0018] Also, when it is described that it is formed or arranged "above or below" each component, "above or below" includes not only the case where two components are in direct contact, but also the case where one or more other components are formed or arranged between the two components. Also, when expressed as "above or below", it can include the meaning not only in the upper direction but also in the lower direction with respect to one component. It can be included.

[0019] The lighting device according to the present invention is applicable to various lamp devices that require lighting, such as vehicle lamps, household lighting devices or industrial lighting devices. For example, when applied to vehicle lamps, it is applicable to headlamps, width lamps, side mirror lamps, fog lamps, tail lamps, brake lamps, daytime running lamps, vehicle interior lighting, door scuff plates, rear combination lamps, back-up lamps, etc. The lighting device of the present invention is applicable to indoor and outdoor advertising devices, display devices, and various electric vehicle fields as well, and can also be said to be applicable to all fields related to lighting and advertising fields that are currently developed and commercialized, or fields related to advertising that can be realized by future technological developments. It can be said that it is applicable to all fields related to advertising. etc.

[0020] FIG. 1 is a plan view of a lighting device 1000 according to an embodiment, and FIG. 2 is a cross-sectional view taken along line A-A' of another lighting device 1000 in the embodiment. As shown in FIGS. 1 and 2, the lighting device 1000 according to the embodiment includes a circuit board 300, a plurality of light-emitting elements 400 disposed on the circuit board 300, a connector 320 that supplies power to the light-emitting elements 400, a resin layer 500 that covers the light-emitting elements 400, and a light-emitting module 600 including a phosphor layer (not shown) disposed on the resin layer 500. As shown in FIGS. 1 and 2, the lighting device 1000 according to the embodiment includes a circuit board 300, a plurality of light-emitting elements 400 disposed on the circuit board 300, a connector 320 that supplies power to the light-emitting elements 400, a resin layer 500 that covers the light-emitting elements 400, and a light-emitting module 600 including a phosphor layer (not shown) disposed on the resin layer 500. As shown in FIGS. 1 and 2, the lighting device 1000 according to the embodiment includes a circuit board 300, a plurality of light-emitting elements 400 disposed on the circuit board 300, a connector 320 that supplies power to the light-emitting elements 400, a resin layer 500 that covers the light-emitting elements 400, and a light-emitting module 600 including a phosphor layer (not shown) disposed on the resin layer 500. As shown in FIGS. 1 and 2, the lighting device 1000 according to the embodiment includes a circuit board 300, a plurality of light-emitting elements 400 disposed on the circuit board 300, a connector 320 that supplies power to the light-emitting elements 400, a resin layer 500 that covers the light-emitting elements 400, and a light-emitting module 600 including a phosphor layer (not shown) disposed on the resin layer 500. As shown in FIGS. 1 and 2, the lighting device 1000 according to the embodiment includes a circuit board 300, a plurality of light-emitting elements 400 disposed on the circuit board 300, a connector 320 that supplies power to the light-emitting elements 400, a resin layer 500 that covers the light-emitting elements 400, and a light-emitting module 600 including a phosphor layer (not shown) disposed on the resin layer 500. As shown in FIGS. 1 and 2, the lighting device 1000 according to the embodiment includes a circuit board 300, a plurality of light-emitting elements 400 disposed on the circuit board 300, a connector 320 that supplies power to the light-emitting elements 400, a resin layer 500 that covers the light-emitting elements 400, and a light-emitting module 600 including a phosphor layer (not shown) disposed on the resin layer 500. As shown in FIGS. 1 and 2, the lighting device 1000 according to the embodiment includes a circuit board 300, a plurality of light-emitting elements 400 disposed on the circuit board 300, a connector 320 that supplies power to the light-emitting elements 400, a resin layer 500 that covers the light-emitting elements 400, and a light-emitting module 600 including a phosphor layer (not shown) disposed on the resin layer 500.

[0021]

[0022] The lighting device 1000 is applicable to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, in the case of a lighting module applied to a vehicle lamp, it includes a headlamp, a side marker lamp, a side mirror lamp, a fog lamp, a tail lamp, a turn signal lamp, a back up lamp, a stop lamp, a daytime running light, a vehicle interior lighting, a door scarf, a rear The lighting device 1000 is applicable to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, in the case of a lighting module applied to a vehicle lamp, it includes a headlamp, a side marker lamp, a side mirror lamp, a fog lamp, a tail lamp, a turn signal lamp, a back up lamp, a stop lamp, a daytime running light, a vehicle interior lighting, a door scarf, a rear The lighting device 1000 is applicable to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, in the case of a lighting module applied to a vehicle lamp, it includes a headlamp, a side marker lamp, a side mirror lamp, a fog lamp, a tail lamp, a turn signal lamp, a back up lamp, a stop lamp, a daytime running light, a vehicle interior lighting, a door scarf, a rear The lighting device 1000 is applicable to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, in the case of a lighting module applied to a vehicle lamp, it includes a headlamp, a side marker lamp, a side mirror lamp, a fog lamp, a tail lamp, a turn signal lamp, a back up lamp, a stop lamp, a daytime running light, a vehicle interior lighting, a door scarf, a rear The lighting device 1000 is applicable to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, in the case of a lighting module applied to a vehicle lamp, it includes a headlamp, a side marker lamp, a side mirror lamp, a fog lamp, a tail lamp, a turn signal lamp, a back up lamp, a stop lamp, a daytime running light, a vehicle interior lighting, a door scarf, a rear It is applicable to combination lamps, backup lamps, etc.

[0023] The circuit board 300 is a base member located under a plurality of light-emitting elements 400 and a resin layer 500 or can function as a support member. The circuit board 300 can include a printed circuit board (PCB : Printed Circuit Board). For example, the circuit board 300 can include at least one of a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or an FR-4 substrate.

[0024] The upper surface of the circuit board 300 has an X-axis - Y-axis plane, and the thickness of the circuit board 300 may be the height in the Z direction orthogonal to the X direction and the Y direction. Here, the X direction is the first direction whereas the Y direction is the second direction orthogonal to the X direction, and the Z direction may be the third direction orthogonal to the X direction and the Y direction as well.

[0025] The circuit board 300 includes a wiring layer (not shown) on the upper part, and the wiring layer is electrically connected to the light-emitting elements 400. The circuit board 300 can include a reflective member or a protective layer disposed on the upper part of the wiring layer, which can protect the wiring layer. The plurality of light-emitting elements 400 are connected in series, parallel, or series-parallel by the wiring layer of the circuit board 300. The plurality of light-emitting elements 400 have groups of two or more connected in series or parallel or the groups are connected in series or parallel to each other.

[0026] The length x1 of the circuit board 300 in the first direction (X direction) and the length y1 in the second direction (Y direction) are They may be different. For example, the length x1 in the first direction may be arranged to be longer than the length y1 in the second direction. This is acceptable. The length x1 in the first direction may be arranged to be at least twice the length y1 in the second direction. The thickness z1 of the circuit board 300 may be 1.0 mm or less, for example, in the range of 0.5 mm to 1.0 mm. Since the thickness z1 of the circuit board 300 is provided to be thin, the thickness of the lighting module is not increased. Since the circuit board 300 is provided with a thickness z1 of 1.0 mm or less, a flexible module can be supported.

[0027] The thickness (z1 + z2) of the light emitting module 600 may be not more than 1 / 3 of the shorter length among the lengths (x1, y1) in the first direction (X direction) and the second direction (Y direction) of the circuit board 300, but is not limited thereto. The thickness (z1 + z2) of the light emitting module 600 may be 5.5 mm or less from the bottom of the circuit board 300, or may have a range of 4.5 mm to 5.5 mm or a range of 4.5 mm to 5 mm. The thickness (z1 + z2) of the light emitting module 600 may be the linear distance (z1 + z2) between the bottom surface of the circuit board 300 and the upper surface of the resin layer 500. The thickness (z1 + z2) of the light emitting module 600 may have a range of not more than 220% of the thickness z2 of the resin layer 500, for example, in the range of 180% to 220%. Since the light emitting module 600 is provided with a thickness (z1 + z2) of 5.5 mm or less, it can be provided as a flexible and slim surface light source module.

[0028] When the thickness (z1 + z2) of the light emitting module 600 is thinner than the above range, the light diffusion space is reduced and hot spots are generated. When it is larger than the above range, due to the increase in the module thickness ​ The spatial installation constraints and the degree of freedom in design are reduced. Lighting device that can be curved by providing (z1+z2) of 5.5mm or less or 5mm or less This provides a degree of freedom in design and reduces spatial constraints. The ratio of the length y1 of the illumination device 1000 in the Y direction to the thickness (z1+z2) of the roll 600 is 1:m, and may have a ratio relationship of m≧1, and m is at least 1 or more. The number of rows of the light emitting elements 400 may be an integer smaller than m. For example, For example, when m is four times or more larger than the thickness (z1+z2) of the lighting device 1000, The 400 are arranged in four rows.

[0029] The circuit board 300 includes a connector 320 at a part thereof, and supplies power to the light emitting element 400. The area of the circuit board 300 where the connector 320 is arranged can be 310 is a region where the resin layer 500 is not formed, and is a region extending in the Y direction of the circuit board 300. The connector 320 may be flush with the top surface of the circuit board 300. The connector 320 is disposed on the bottom surface of the circuit board 300. In this case, the area may be removed. The bar may be shaped like a square, a regular rectangle, or any other polygonal shape, and may have a curved surface. The connector 320 may have a bar shape. It may be a male connector or a female connector.

[0030] The circuit board 300 may include a protective layer or a reflective layer on the top. Alternatively, the reflective layer can include a member having a solder resist material, and the solder resist material can reflect incident light as a white material.

[0031] As another example, the circuit board 300 can include a transparent material. Since the transparent circuit board 300 is provided, the light emitted from the light-emitting element 400 is emitted in the upward and downward directions of the upper surface of the circuit board 300.

[0032] The light-emitting element 400 is disposed on the circuit board 300. The light-emitting element 400 has a light-emitting surface S1 and a plurality of side surfaces S2. The light-emitting surface S1 faces the upper surface of the resin layer 500 and emits light in the direction of the resin layer 500 from the light-emitting element 400. The light-emitting surface S1 is the upper surface of the light-emitting element 400, and most of the light is emitted. The plurality of side surfaces S2 include at least four side surfaces and emit light in the lateral direction of the light-emitting element 400. Such a light-emitting element 400 is disposed on the circuit board 300 in a flip-chip form as an LED chip that emits light from at least five sides. The light-emitting element 400 may be formed with a thickness of 0.3 mm or less.

[0033] As another example, the light-emitting element 400 can be embodied as a horizontal chip or a vertical chip. In the case of the horizontal chip or the vertical chip, it is connected to other chips or wire patterns by wires. When a wire is connected to the LED chip, the thickness of the diffusion layer increases according to the height of the wire, and the distance between the light-emitting elements 400 increases due to the connection space according to the length of the wire. The light-emitting element 400 according to the embodiment has a directivity angle by emitting light from five The distribution becomes larger. The light-emitting element 400 is flip-chip mounted on the circuit board 300 and arranged thereon. The interval x2 between the light-emitting elements 400 may be the same as or larger than the thickness z2 of the resin layer 500 (z2 ≦x2). The interval x2 between the light-emitting elements 400 may be, for example 2.5 mm or more, and can be varied according to the size of the LED chip. The minimum interval between the light-emitting elements 400 may be the same as or larger than the thickness z2 of the resin layer 500 .

[0034] Since the light-emitting element 400 disclosed in the embodiment is provided as a flip-chip that emits light from at least five sides, the luminance distribution and the directivity angle distribution of the light-emitting element 400 are improved . When the light-emitting elements 400 are arranged in an N×M matrix on the circuit board 300, N is one row or two or more rows, and M can have one column or two or more columns. The N and M are integers of 1 or more. The light-emitting elements 400 are arranged in the Y-axis and X-axis directions respectively .

[0035] The light-emitting element 400 can emit at least one of blue, red, green, ultraviolet (UV) or infrared light as a light-emitting diode (LED) chip. The light-emitting element 400 can emit at least one of, for example, blue, red, and green light. The light-emitting element 400 is electrically connected to the circuit board 300, but is not limited thereto .

[0036] The plurality of light-emitting elements 400 arranged on the circuit board 300 are sealed by a resin layer 500 . The plurality of light-emitting elements 400 can be in contact with the resin layer 500 ​On the side surface and the upper surface of the light-emitting element 400, the resin layer 500 is disposed.

[0037] The light emitted from the light-emitting element 400 is emitted through the resin layer 500. The light emitted from the light-emitting element 400 is emitted to the outside through the resin layer 500 and a phosphor layer (not shown) disposed on the resin layer 500.

[0038] The resin layer 500 may be made of a transparent resin material, for example, a resin material such as UV (Ultra Violet) resin (Resin), silicone or epoxy. The resin layer 500 may be a diffusion layer or a molding layer without a diffusing agent. The UV resin may utilize, for example, a resin (oligomer type) having urethane acrylate oligomer as a main material. For example, it is possible to use urethane acrylate oligomer which is a synthetic oligomer. The monomer may further contain monomers mixed with low-boiling-point diluting reactive monomers such as IBOA (isobornyl acrylate (isobornyl acrylate)), HBA (Hydroxybutyl Acrylate), HEMA (Hydroxy Metaethyl Acrylate), etc., and a photoinitiator (for example, 1-hydroxyc yclohexyl phenyl-ketone (hydroxycyclohexyl phenyl ketone), Diphenyl (diphenyl)) or an antioxidant or the like can be mixed as an additive. The UV resin yclohexyl phenyl-ketone (hydroxycyclohexyl phenyl ketone), Diphenyl (diphenyl)), Diphenyl (2,4,6-trimethylbenzoyl phosphine oxide (trimethylbenzoyl yl phosphine oxide)) or the like. It can be composed of a composition containing 10 - 21% oligomer, 30 - 63% monomer, and 1.5 - 6% additive. In this case, the monomer can consist of a mixture of 10 - 21% IBOA (isobornyl Acrylate), 10 - 21% HBA (Hydroxybutyl Acrylate), and 10 - 21% HEMA (Hydroxy Metaethyl Acrylate). The additive can be a mixture containing 1 - 5% photoinitiator to initiate the photoresponse and 0.5 - 1% antioxidant to improve the yellowing phenomenon. The formation of the resin layer using the above-described composition can form a layer with a resin such as a UV resin instead of a light guide plate, enabling adjustment of the refractive index and thickness, and can satisfy all of the adhesion characteristics, reliability, and mass production speed using the above-described composition. A phosphor layer (not shown) is disposed on the resin layer 500. The phosphor layer is disposed so as to cover the upper surface of the resin layer 500. The phosphor layer can contain a transparent substance. The phosphor layer can contain a transparent insulating substance. The phosphor layer may be a silicon material or a silicon material having different chemical bonds. Silicon is a polymer in which an inorganic silicon and an organic carbon are bonded, having the physical properties of the thermal stability, chemical stability, wear resistance, glossiness, etc. of the inorganic substance and the reactivity, solubility, elasticity, processability, etc. of the characteristics of the organic substance. It can contain general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon can improve the moisture resistance. It can be composed of a composition containing 10 - 21% oligomer, 30 - 63% monomer, and 1.5 - 6% additive. In this case, the monomer can consist of a mixture of 10 - 21% IBOA (isobornyl Acrylate), 10 - 21% HBA (Hydroxybutyl Acrylate), and 10 - 21% HEMA (Hydroxy Metaethyl Acrylate). The additive can be a mixture containing 1 - 5% photoinitiator to initiate the photoresponse and 0.5 - 1% antioxidant to improve the yellowing phenomenon. The formation of the resin layer using the above-described composition can form a layer with a resin such as a UV resin instead of a light guide plate, enabling adjustment of the refractive index and thickness, and can satisfy all of the adhesion characteristics, reliability, and mass production speed using the above-described composition. It can be composed of a composition containing 10 - 21% oligomer, 30 - 63% monomer, and 1.5 - 6% additive. In this case, the monomer can consist of a mixture of 10 - 21% IBOA (isobornyl Acrylate), 10 - 21% HBA (Hydroxybutyl Acrylate), and 10 - 21% HEMA (Hydroxy Metaethyl Acrylate). The additive can be a mixture containing 1 - 5% photoinitiator to initiate the photoresponse and 0.5 - 1% antioxidant to improve the yellowing phenomenon. The formation of the resin layer using the above-described composition can form a layer with a resin such as a UV resin instead of a light guide plate, enabling adjustment of the refractive index and thickness, and can satisfy all of the adhesion characteristics, reliability, and mass production speed using the above-described composition. It can be composed of a composition containing 10 - 21% oligomer, 30 - 63% monomer, and 1.5 - 6% additive. In this case, the monomer can consist of a mixture of 10 - 21% IBOA (isobornyl Acrylate), 10 - 21% HBA (Hydroxybutyl Acrylate), and 10 - 21% HEMA (Hydroxy Metaethyl Acrylate). The additive can be a mixture containing 1 - 5% photoinitiator to initiate the photoresponse and 0.5 - 1% antioxidant to improve the yellowing phenomenon. The formation of the resin layer using the above-described composition can form a layer with a resin such as a UV resin instead of a light guide plate, enabling adjustment of the refractive index and thickness, and can satisfy all of the adhesion characteristics, reliability, and mass production speed using the above-described composition. It can be composed of a composition containing 10 - 21% oligomer, 30 - 63% monomer, and 1.5 - 6% additive. In this case, the monomer can consist of a mixture of 10 - 21% IBOA (isobornyl Acrylate), 10 - 21% HBA (Hydroxybutyl Acrylate), and 10 - 21% HEMA (Hydroxy Metaethyl Acrylate). The additive can be a mixture containing 1 - 5% photoinitiator to initiate the photoresponse and 0.5 - 1% antioxidant to improve the yellowing phenomenon. The formation of the resin layer using the above-described composition can form a layer with a resin such as a UV resin instead of a light guide plate, enabling adjustment of the refractive index and thickness, and can satisfy all of the adhesion characteristics, reliability, and mass production speed using the above-described composition. It can be composed of a composition containing 10 - 21% oligomer, 30 - 63% monomer, and 1.5 - 6% additive. In this case, the monomer can consist of a mixture of 10 - 21% IBOA (isobornyl Acrylate), 10 - 21% HBA (Hydroxybutyl Acrylate), and 10 - 21% HEMA (Hydroxy Metaethyl Acrylate). The additive can be a mixture containing 1 - 5% photoinitiator to initiate the photoresponse and 0.5 - 1% antioxidant to improve the yellowing phenomenon. The formation of the resin layer using the above-described composition can form a layer with a resin such as a UV resin instead of a light guide plate, enabling adjustment of the refractive index and thickness, and can satisfy all of the adhesion characteristics, reliability, and mass production speed using the above-described composition. The formation of the resin layer using the above-described composition can form a layer with a resin such as a UV resin instead of a light guide plate, enabling adjustment of the refractive index and thickness, and can satisfy all of the adhesion characteristics, reliability, and mass production speed using the above-described composition. The formation of the resin layer using the above-described composition can form a layer with a resin such as a UV resin instead of a light guide plate, enabling adjustment of the refractive index and thickness, and can satisfy all of the adhesion characteristics, reliability, and mass production speed using the above-described composition. The formation of the resin layer using the above-described composition can form a layer with a resin such as a UV resin instead of a light guide plate, enabling adjustment of the refractive index and thickness, and can satisfy all of the adhesion characteristics, reliability, and mass production speed using the above-described composition.

[0039] A phosphor layer (not shown) is disposed on the resin layer 500. The phosphor layer is disposed so as to cover the upper surface of the resin layer 500. The phosphor layer can contain a transparent substance. The phosphor layer can contain a transparent insulating substance. The phosphor layer may be a silicon material or a silicon material having different chemical bonds. Silicon is a polymer in which an inorganic silicon and an organic carbon are bonded, having the physical properties of the thermal stability, chemical stability, wear resistance, glossiness, etc. of the inorganic substance and the reactivity, solubility, elasticity, processability, etc. of the characteristics of the organic substance. It can contain general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon can improve the moisture resistance. A phosphor layer (not shown) is disposed on the resin layer 500. The phosphor layer is disposed so as to cover the upper surface of the resin layer 500. The phosphor layer can contain a transparent substance. The phosphor layer can contain a transparent insulating substance. The phosphor layer may be a silicon material or a silicon material having different chemical bonds. Silicon is a polymer in which an inorganic silicon and an organic carbon are bonded, having the physical properties of the thermal stability, chemical stability, wear resistance, glossiness, etc. of the inorganic substance and the reactivity, solubility, elasticity, processability, etc. of the characteristics of the organic substance. It can contain general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon can improve the moisture resistance. A phosphor layer (not shown) is disposed on the resin layer 500. The phosphor layer is disposed so as to cover the upper surface of the resin layer 500. The phosphor layer can contain a transparent substance. The phosphor layer can contain a transparent insulating substance. The phosphor layer may be a silicon material or a silicon material having different chemical bonds. Silicon is a polymer in which an inorganic silicon and an organic carbon are bonded, having the physical properties of the thermal stability, chemical stability, wear resistance, glossiness, etc. of the inorganic substance and the reactivity, solubility, elasticity, processability, etc. of the characteristics of the organic substance. It can contain general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon can improve the moisture resistance. A phosphor layer (not shown) is disposed on the resin layer 500. The phosphor layer is disposed so as to cover the upper surface of the resin layer 500. The phosphor layer can contain a transparent substance. The phosphor layer can contain a transparent insulating substance. The phosphor layer may be a silicon material or a silicon material having different chemical bonds. Silicon is a polymer in which an inorganic silicon and an organic carbon are bonded, having the physical properties of the thermal stability, chemical stability, wear resistance, glossiness, etc. of the inorganic substance and the reactivity, solubility, elasticity, processability, etc. of the characteristics of the organic substance. It can contain general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon can improve the moisture resistance. A phosphor layer (not shown) is disposed on the resin layer 500. The phosphor layer is disposed so as to cover the upper surface of the resin layer 500. The phosphor layer can contain a transparent substance. The phosphor layer can contain a transparent insulating substance. The phosphor layer may be a silicon material or a silicon material having different chemical bonds. Silicon is a polymer in which an inorganic silicon and an organic carbon are bonded, having the physical properties of the thermal stability, chemical stability, wear resistance, glossiness, etc. of the inorganic substance and the reactivity, solubility, elasticity, processability, etc. of the characteristics of the organic substance. It can contain general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon can improve the moisture resistance. A phosphor layer (not shown) is disposed on the resin layer 500. The phosphor layer is disposed so as to cover the upper surface of the resin layer 500. The phosphor layer can contain a transparent substance. The phosphor layer can contain a transparent insulating substance. The phosphor layer may be a silicon material or a silicon material having different chemical bonds. Silicon is a polymer in which an inorganic silicon and an organic carbon are bonded, having the physical properties of the thermal stability, chemical stability, wear resistance, glossiness, etc. of the inorganic substance and the reactivity, solubility, elasticity, processability, etc. of the characteristics of the organic substance. It can contain general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon can improve the moisture resistance. A phosphor layer (not shown) is disposed on the resin layer 500. The phosphor layer is disposed so as to cover the upper surface of the resin layer 500. The phosphor layer can contain a transparent substance. The phosphor layer can contain a transparent insulating substance. The phosphor layer may be a silicon material or a silicon material having different chemical bonds. Silicon is a polymer in which an inorganic silicon and an organic carbon are bonded, having the physical properties of the thermal stability, chemical stability, wear resistance, glossiness, etc. of the inorganic substance and the reactivity, solubility, elasticity, processability, etc. of the characteristics of the organic substance. It can contain general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon can improve the moisture resistance. A phosphor layer (not shown) is disposed on the resin layer 500. The phosphor layer is disposed so as to cover the upper surface of the resin layer 500. The phosphor layer can contain a transparent substance. The phosphor layer can contain a transparent insulating substance. The phosphor layer may be a silicon material or a silicon material having different chemical bonds. Silicon is a polymer in which an inorganic silicon and an organic carbon are bonded, having the physical properties of the thermal stability, chemical stability, wear resistance, glossiness, etc. of the inorganic substance and the reactivity, solubility, elasticity, processability, etc. of the characteristics of the organic substance. It can contain general silicon and fluorosilicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorosilicon can improve the moisture resistance. has an effect.

[0040] The phosphor layer can include wavelength conversion means for providing light that is wavelength - converted when the light emitted from the light - emitting element 400 is incident thereon. For example, the phosphor layer can include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. The phosphor is uniformly arranged inside the phosphor layer. The phosphor can include a fluoride - based phosphor, and for example, can include at least one of an MGF - based phosphor, a KSF - based phosphor, or a KTF - based phosphor. When the phosphor is a red phosphor, the red phosphor can have a wavelength range of 610 nm to 650 nm, and the wavelength can have a width of less than 10 nm. The red phosphor can include a fluoride - based phosphor.

[0041] As shown in FIG. 2, a bracket 100 is disposed under the circuit board 300. The bracket 100 can support the light - emitting module 600. The bracket 100 can include an insertion groove 110 from which a part of the bracket 100 is removed. A coupling member 200 disposed under the light - emitting module 600 is inserted into the insertion groove 110 of the bracket 100, and the bracket 100 and the light - emitting module 600 are coupled. The bracket 100 can be made of metal, plastic material, etc., but is not limited thereto.

[0042]

[0043] As shown in FIG. 2, a bracket 100 is arranged under the circuit board 300. The bracket 100 can support the light - emitting module 600. The bracket 100 can include an insertion groove 110 with a part of the bracket 100 removed. The coupling member 200 arranged under the light - emitting module 600 is inserted into the insertion groove 110 of the bracket 100, and the bracket 100 and the light - emitting module 600 are coupled. The bracket 100 can be made of metal, plastic material, etc., but is not limited to this.

[0044] ​​​​​​​​​ As shown in FIGS. 2 and 3, a coupling member 200 is disposed under the circuit board 300. The coupling member 200 can contact the lower surface of the circuit board 300. For example, the coupling member 200 is bonded to the lower surface of the circuit board 300 by an adhesive. By contacting the coupling member 200 with the lower surface of the circuit board 300, the heat dissipation ability of the circuit board 300 can be improved.

[0045] The lower surface of the circuit board 300 can expose a metal plate that is a part of the circuit board 300. Thereby, the coupling member 200 and the metal plate are joined by a bonding substance such as an adhesive, for example, solder paste, and the heat dissipation area of the circuit board 300 is improved by the joining.

[0046] The coupling member 200 can include a head portion 210 disposed under the circuit board 300, a support portion 220 bent from both ends of the head portion 210, an elastic portion 230 extended and bent outward from the other end of the support portion 220, a detachment prevention portion 240 extended and bent from the elastic portion 230, and a leg portion 250, a part of which is extended in the vertical direction and a part of which is bent to have an inclined surface. The coupling member 200 is inserted into the insertion groove 110 of the bracket 100, and the coupling member 200 and the bracket 100 are fitted and joined, so that the coupling force between the bracket 100 and the light emitting module 6 00 can be improved. 00 can be improved. The thickness of the coupling member 200 can be 0.2 mm ± 0.05 mm. For example,

[0047] If the thickness of the coupling member 200 is 0.15 mm or less, the rigidity of the coupling member 200 decreases, and the coupling force between the coupling member 200 and the bracket 100 becomes weak. When the thickness of the coupling member 200 is 0.25 mm or more, the volume of the coupling member 200 increases, and the coupling member 200 and the bracket 100 may not be properly coupled.

[0048] The width a of the coupling member 200 in the first direction can have 8.6 mm ± 1.0 mm. The widths b3 and e1 of the coupling member 200 in the second direction can have 6 mm ± 1.0 mm. The length c of the coupling member 200 in the third direction can have 6 mm ± 1.0 mm.

[0049] As shown in FIGS. 2 to 4, the head portion 210 is disposed under the circuit board 300. The head portion 210 can be in contact with the lower surface of the circuit board 300. The head portion 210 is disposed under the circuit board 300 and can support the circuit board 300. The head portion 210 extends in the first direction (X direction) and can be in contact with the lower surface of the circuit board 300. The head portion 210 includes a first side surface, a second side surface opposite to the first side surface, a third side surface connected to the first side surface and the second side surface, and a fourth side surface opposite to the third side surface. The width b1 of the head portion 210 in the first direction may be the same as the width b1 between the first side surface and the second side surface. The maximum width b3 of the head portion 210 in the second direction may be the same as the maximum width b3 between the third side surface and the fourth side surface. The width b1 of the head portion 210 in the first ​It may also be smaller than the maximum width b3 in the direction. The ratio of the width b1 of the head portion 210 in the first direction to the maximum width b3 of the head portion 210 in the second direction may be 2:3. The width b1 of the head portion 210 in the first direction may be smaller than the minimum width b6 of the head portion 210 in the second direction. The ratio of the width b1 of the head portion 210 in the first direction to the minimum width b6 of the head portion 210 in the second direction may be 1:1.2. The width b1 of the head portion 210 in the first direction can have 4 mm ± 1.0 mm. The maximum width b3 of the head portion 210 in the second direction can have 6 mm ± 1.0 mm. The minimum width b6 of the head portion 210 in the second direction can have 4.8 mm ± 1.0 mm. The head portion 210 can include an opening 213.

[0050]

[0051] Referring to FIG. 4, the head portion 210 can include grooves 214 recessed inward from both side surfaces of the head portion 210. The grooves 214 of the head portion 210 can contact the bracket 100. The coupling force between the head portion 210 and the bracket 100 can be improved by the stepped structure formed by the grooves 214 of the head portion 210. The width b4 of the groove 214 in the first direction may be larger than the width b5 of the groove 214 in the second direction. The ratio of the width b4 of the groove 214 in the first direction to the width b5 of the groove 214 in the second direction may be 1:0.3. The width b4 of the groove 214 in the first direction can have 2 mm ± 1.0 mm. The width b5 of the groove 214 in the second direction can have 0.6 mm ± 0.3 mm.

[0052] ​​​​​​​​​​​​​​​Referring to FIGS. 3 and 4, the head portion 210 includes a first head portion 211 and a second head portion 212 extending from one end and the other end of the first head portion 211, respectively. The first head portion 211 and the second head portion 212 can be formed with different widths in the first direction (X direction) and the second direction (Y direction), respectively. The width b7 of the second head portion 212 in the first direction may be smaller than the width b4 of the first head portion 211 in the first direction. The ratio of the width b7 of the second head portion 212 in the first direction to the width b4 of the first head portion 211 in the first direction may be 1:2. The width b3 of the second head portion 212 in the second direction may be larger than the width b6 of the first head portion 211 in the second direction. The ratio of the width b3 of the second head portion 212 in the second direction to the width b6 of the first head portion 211 in the second direction may be 1:0.8. For example, the width b4 of the first head portion 211 in the first direction can be 2 mm ± 1.0 mm. For example, the width b7 of the second head portion 212 in the first direction can be 1 mm ± 0.5 mm. For example, the width b6 of the first head portion 211 in the second direction can be 4.8 mm ± 1.0 mm. For example, the width b3 of the second head portion 212 in the second direction can be 6 mm ± 0.5 mm.

[0053] As described above, the first head portion 211 and the second head portion 212 are formed with different widths in the first direction and the second direction, and may include grooves 214 recessed inward from both side surfaces of the first head portion 211. Thereby, since the opposing side surfaces of the head portion 210 have a stepped structure, the coupling force between the head portion 210 and the bracket 100 can be improved.

[0054] ​​​​​​​​​​​​​

[0055] The first head portion 211 may include an opening 213. The first head portion 211 The opening 213 may have a polygonal shape, but is not limited to this. For example, the opening 213 of the first head portion 211 may have a circular shape. The opening 213 of the head portion 211 is formed so that the head portion 210 is attached to the circuit board 30 by adhesive. When the adhesive is attached to the underside of the adhesive layer 210, excess adhesive flows into the opening 213, This can prevent the joining member 200 and the circuit board 300 from being misaligned when they are bonded together.

[0056] 2 and 3, the support portion 220 is perpendicular to the head portion 210. The support part 220 extends in the third direction (Z direction). The support part 220 extends in a direction perpendicular to the direction of the head part 210. The support portion 220 may be disposed so as to extend from the ends of at least two of the side surfaces. , extending from the ends of two opposing sides of the head part 210. This may be done.

[0057] The support part 220 is a first support part extending vertically from one end of the head part 210. 221 and a second support portion 222 extending from the other end of the head portion 210. The first support portion 221 and the second support portion 222 may be disposed opposite to each other. The first support portion 221 and the second support portion 222 may be arranged in parallel. The second support portion 221 and the second support portion 222 may be disposed to extend in parallel with each other.

[0058] The support portion 220 may include a first support portion 221 extending from one end of the second head portion 212. and a second support portion 222 extending from the other end of the second head portion 212. The lengths c in the third direction of the first support portion 221 and the second support portion 222 may be the same, but are not limited thereto. The lengths c in the third direction of the first support portion 221 and the second support portion 22 2 may be greater than the depth of the insertion groove 110.

[0059] The lengths c in the third direction of the first support portion 221 and the second support portion 222 may be longer than the length b1 in the first direction of the head portion 210. The ratio of the length c in the third direction of the first support portion 221 and the second support portion 222 to the length b1 in the first direction of the head portion 210 may be 3:2. For example, the lengths c in the third direction of the first support portion 221 and the second support portion 222 may be 6 mm ± 1.0 mm.

[0060] The elastic portion 230 is bent and extended from the support portion 220. The elastic portion 230 extends from the support portion 220 and may include an inclined surface. The elastic portion 230 is bent from the support portion 220 at an acute angle α1. For example, the elastic portion 230 is bent from the support portion 220 at an angle of 30 degrees ± 10 degrees. For example, the angle α1 between the inclined surface of the elastic portion 230 and the support portion 220 may be 30 degrees. The connecting portion between the elastic portion 2 30 and the support portion 220 is formed as a curved surface, but is not limited thereto.

[0061] The elastic portion 230 includes a first elastic portion that extends and is bent from the first support portion 221. ​including a first elastic portion 231 and a second elastic portion 232 that extends from and is bent from the second support portion 222 It can be. The first elastic portion 231 and the second elastic portion 232 may be bent and extended from the support portion 220 in opposite directions. The first elastic portion 231 and the second elastic portion 232 can include inclined surfaces that extend obliquely in opposite directions. The first elastic portion 231 and the second elastic portion 232 are elastically inclined outwardly of the support portion 220 so that the inclined surface can be inserted into the insertion groove 110 to fix the circuit board 300 and the coupling member 200 It can be.

[0062] The first elastic portion 231 is bent and extended from the first support portion 221. The first elastic portion 231 is arranged to extend with an inclined surface from the first support portion 221 and is bent outwardly of the first support portion 221. The inclined surface of the first elastic portion 231 is arranged corresponding to the first support portion 221. The angle α1 between the first elastic portion 231 and the first support portion 221 may be an acute angle. For example the angle α1 between the first elastic portion 231 and the first support portion 221 may be 30 degrees ± 10 degrees It may be.

[0063] The second elastic portion 232 is bent and extended from the second support portion 222. The second elastic portion 232 is arranged to extend with an inclined surface from the second support portion 222 and is bent outwardly of the second support portion 222. The inclined surface of the second elastic portion 232 is arranged corresponding to the second support portion 222. The first elastic portion 231 and the second elastic portion 232 are each bent and extended in opposite directions It can be. The angle α1 between the second elastic portion 232 and the second support portion 222 may be an acute angle. For example, the angle α1 between the second elastic portion 232 and the second support portion 222 may be 30 degrees ± 10 degrees.

[0064] The length b2 of the first elastic portion 231 and the second elastic portion 232 in the first direction can be 2.3 mm ±1.0 mm. The height d of the first elastic portion 231 and the second elastic portion 232 in the third direction can be 3.3 mm ± 1.0 mm.

[0065] The detachment prevention portion 240 is bent and extended from the elastic portion 230. The detachment prevention portion 240 may be extended and arranged in a direction parallel to the head portion 210. The detachment prevention portion 240 is arranged at a predetermined distance from the support portion 220. The detachment prevention portion 240 is extended and arranged in a direction perpendicular to the direction in which the support portion 220 is extended. The detachment prevention portion 240 is extended from the end of the elastic portion 230 in the direction of the support portion 220. The detachment prevention portion 240 can contact the bracket 100. The upper surface of the detachment prevention portion 240 can contact the lower surface of the bracket 100. The connection portion between the detachment prevention portion 240 and the elastic portion 230 is formed as a curved surface, but is not limited thereto. The detachment prevention portion 240 can contact the lower surface of the circuit board 240 to couple the insertion groove 110 and the coupling member 200.

[0066] The detachment prevention portion 240 includes a first detachment prevention portion 241 bent and extended from the first elastic portion 231, and a second detachment prevention portion bent and extended from the second elastic portion 232. It can include 242. The detachment prevention part 240 includes the first detachment prevention part 241 and the second detachment prevention part 242 which extend from one ends of the first elastic part 231 and the second elastic part 232 respectively towards the first support part 221 and the second support part 222. It can include the first detachment prevention part 241 and the second detachment prevention part 242 which extend from one ends of the first elastic part 231 and the second elastic part 232 respectively towards the first support part 221 and the second support part 222. It can include the first detachment prevention part 241 and the second detachment prevention part 242 which extend from one ends of the first elastic part 231 and the second elastic part 232 respectively towards the first support part 221 and the second support part 222. The first detachment prevention part 241 and the second detachment prevention part 242 may be arranged on the same plane. The first detachment prevention part 241 and the second detachment prevention part 242 can contact the stepped structure of the insertion groove 110. The first detachment prevention part 241 and the second detachment prevention part 242 can be engaged with the stepped structure of the bracket 100 where the insertion groove 110 is formed to couple the circuit board 300 and the bracket 100 which are coupled with the coupling member 200. The first detachment prevention part 241 and the second detachment prevention part 242 can be engaged with the stepped structure of the bracket 100 where the insertion groove 110 is formed to couple the circuit board 300 and the bracket 100 which are coupled with the coupling member 200. The first detachment prevention part 241 and the second detachment prevention part 242 can be engaged with the stepped structure of the bracket 100 where the insertion groove 110 is formed to couple the circuit board 300 and the bracket 100 which are coupled with the coupling member 200. The first detachment prevention part 241 and the second detachment prevention part 242 can be engaged with the stepped structure of the bracket 100 where the insertion groove 110 is formed to couple the circuit board 300 and the bracket 100 which are coupled with the coupling member 200.

[0067] The first detachment prevention part 241 and the second detachment prevention part 242 are respectively bent from the first elastic part 231 and the second elastic part 232 at an acute angle α2. For example, the first detachment prevention part 241 and the second detachment prevention part 242 are bent from the first elastic part 231 and the second elastic part 232 at an angle α2 of 60±10 degrees. The first detachment prevention part 241 and the second detachment prevention part 242 are respectively bent from the first elastic part 231 and the second elastic part 232 at an acute angle α2. For example, the first detachment prevention part 241 and the second detachment prevention part 242 are bent from the first elastic part 231 and the second elastic part 232 at an angle α2 of 60±10 degrees. The first detachment prevention part 241 and the second detachment prevention part 242 are respectively bent from the first elastic part 231 and the second elastic part 232 at an acute angle α2. For example, the first detachment prevention part 241 and the second detachment prevention part 242 are bent from the first elastic part 231 and the second elastic part 232 at an angle α2 of 60±10 degrees. The first detachment prevention part 241 and the second detachment prevention part 242 are respectively bent from the first elastic part 231 and the second elastic part 232 at an acute angle α2. For example, the first detachment prevention part 241 and the second detachment prevention part 242 are bent from the first elastic part 231 and the second elastic part 232 at an angle α2 of 60±10 degrees.

[0068] The width e2 in the first direction of the first detachment prevention part 241 and the second detachment prevention part 242 may be smaller than the width e1 in the second direction of the first detachment prevention part 241 and the second detachment prevention part 242. The ratio of the width e2 in the first direction of the first detachment prevention part 241 and the second detachment prevention part 242 to the width e1 in the second direction of the first detachment prevention part 241 and the second detachment prevention part 242 may be 1:6. The width e2 in the first direction of the first detachment prevention part 241 and the second detachment prevention part 242 may be smaller than the width e1 in the second direction of the first detachment prevention part 241 and the second detachment prevention part 242. The ratio of the width e2 in the first direction of the first detachment prevention part 241 and the second detachment prevention part 242 to the width e1 in the second direction of the first detachment prevention part 241 and the second detachment prevention part 242 may be 1:6. The width e2 in the first direction of the first detachment prevention part 241 and the second detachment prevention part 242 may be smaller than the width e1 in the second direction of the first detachment prevention part 241 and the second detachment prevention part 242. The ratio of the width e2 in the first direction of the first detachment prevention part 241 and the second detachment prevention part 242 to the width e1 in the second direction of the first detachment prevention part 241 and the second detachment prevention part 242 may be 1:6. The width e2 in the first direction of the first detachment prevention part 241 and the second detachment prevention part 242 may be smaller than the width e1 in the second direction of the first detachment prevention part 241 and the second detachment prevention part 242. The ratio of the width e2 in the first direction of the first detachment prevention part 241 and the second detachment prevention part 242 to the width e1 in the second direction of the first detachment prevention part 241 and the second detachment prevention part 242 may be 1:6. The width e2 in the first direction of the first detachment prevention part 241 and the second detachment prevention part 242 may be smaller than the width e1 in the second direction of the first detachment prevention part 241 and the second detachment prevention part 242. The ratio of the width e2 in the first direction of the first detachment prevention part 241 and the second detachment prevention part 242 to the width e1 in the second direction of the first detachment prevention part 241 and the second detachment prevention part 242 may be 1:6.

[0069] The width e2 in the first direction of the first detachment prevention part 241 and the second detachment prevention part 242 is 1mm It can have ±0.5 mm. The first detachment prevention part 241 and the second detachment prevention part The width e1 in the second direction of 242 can have 6 mm ± 1.0 mm. The first detachment prevention The shortest distance between the part 241 and the first support part 221 can have 1 mm. The The shortest distance between the second detachment prevention part 242 and the second support part 222 can be 1 mm.

[0070] As shown in FIGS. 3 to 6, the leg part 250 extends from the detachment prevention part 240. The leg part 250 extends from the end of the detachment prevention part 240 toward the lower surface of the circuit board 300. The leg part 250 is disposed in the insertion groove 110. The leg The part 250 includes a first leg part 251 that extends from the first detachment prevention part 241 toward the lower surface of the circuit board 300, and a second leg part 252 that extends from the second detachment prevention part 242 toward the lower surface of the circuit board 300. The leg part 250 can be inserted into the insertion groove 110 to couple the circuit board 300 and the coupling member 200. A part of the leg part 250 contacts the inner surface of the bracket 100 that forms the insertion groove 110 to improve the coupling force between the coupling member 200 and the circuit board 300. It can be done. 0 to improve the coupling force between the coupling member 200 and the circuit board 300. It can be done.

[0071] Referring to FIG. 5a, the first leg part 251 extends a predetermined distance in the vertical direction from the first detachment prevention part 241. The first leg part 251 extends a predetermined distance in the vertical direction from the first detachment prevention part 241. The first leg part 251 can include a first - 1 leg part 251 - 1 that extends a predetermined distance in the vertical direction from the first detachment prevention part 241. The leg part 250 includes a first - 2 leg part 25 that extends from the first - 1 leg part 251 - 1. ​1-2, and is different from the first-1 leg portion 251-1 and the first-2 leg portion 251-2 and may include a first elastic piece 251-3 that extends at a different angle and includes an inclined surface. The first elastic piece 251-3 is bent from the first-1 leg portion 251-1 at a predetermined angle and extended. The first elastic piece 251-3 can be inclined outward from the first-1 leg portion 251-1.

[0072] The first-2 leg portion 251-2 is arranged to extend in a direction perpendicular to the first detachment prevention portion 241. The first-1 leg portion 251-1 and the first-2 leg portion 251-2 may be arranged to extend in a direction parallel to the first support portion 221 and the second support portion 222. The first-1 leg portion 251-1 and the first-2 leg portion 251-2 are arranged corresponding to the first support portion 221 described above. The first-1 leg portion 251-1 and the first -2 leg portion 251-2 are arranged to face the first support portion 221. The first- 1 leg portion 251-1, the first-2 leg portion 251-2, and the first elastic piece 251-3 are arranged in the insertion groove 110 of the bracket 100.

[0073] The first elastic piece 251-3 can be bent and extended from the first-1 leg portion 251-1 to have an inclined surface. The inclined surface of the first elastic piece 251-3 extends from the first-1 leg portion 251-1 at an angle different from that of the first-1 leg portion 251-1. The angle α3 between the inclined surface of the first elastic piece 251-3 and the first-1 leg portion 251-1 and the first-2 leg portion 251-2 may be 15 ± 5 degrees.

[0074] ​​​ The inclined surface of the first elastic piece 251-3 is in the bracket 1 forming the insertion groove 110. The coupling member 200 can be inserted into the insertion groove 110 and can contact the inner surface of the coupling member 200. Therefore, a part of the inclined surface of the first elastic piece 251-3 is inclined before the insertion groove 110 is formed. The first elastic piece can be overlapped vertically with the inner surface of the bracket 100. The inclined surface of 251-3 and the inner surface of the insertion groove 110 are in the first direction or the first elastic piece. The inclined surface of 251-3 and the inner surface of the insertion groove 110 overlap by 0.1 mm in the vertical direction. The coupling member 200 may be made of an elastic material, and The bracket in which a part of the inclined surface of the first elastic portion 251-3 forms the insertion groove 110 The portion overlapping the inner surface of 100 is pushed out and placed in the insertion groove 110. As a result, the inner surface of the bracket 100 forming the insertion groove 110 and the first elastic piece 2 51-3, the coefficient of friction between the bracket 100 and the connecting member 200 increases. Strength can be improved.

[0075] The length e1 of the first leg portion 251 in the second direction may be 6 mm±1.0 mm. The third leg portion from the first-first leg portion 251-1 to the first-second leg portion 251-2 can be The length f of the first and second legs 25 may be 1.7 mm ± 0.5 mm. The lengths of the first elastic piece 251-2 and the first elastic piece 251-3 in the third direction may be the same, but are not limited to this. The first-second leg portion 251-2 and the first elastic piece 251-3 are not limited to the above. The length in the second direction may be different. For example, the width in the second direction of the first elastic piece 251-3 is may be larger than the width of the first - second leg portion 251 - 2 in the second direction, but is not limited thereto. When the width of the first elastic piece 251 - 3 in the second direction is larger than the width of the first - second leg portion 251 - 2 in the second direction, the area where the first elastic piece 251 - 3 contacts the inner surface of the bracket 100 forming the insertion groove 110 increases, and the coupling force between the coupling member 200 and the bracket 100 can be improved. Referring to FIG. 5b, the second leg portion 252 extends a predetermined distance in the vertical direction from the second anti - detachment portion 242. The second leg portion 252 may include a second - 1 leg portion 252 - 1 that extends a predetermined distance in the vertical direction from the second anti - detachment portion 242. The leg portion 250 includes a second - 2 leg portion 252 - 2 that extends from the second - 1 leg portion 252 - 1, and a second elastic piece 252 - 3 that extends at an angle different from that of the second - 1 leg portion 252 - 1 and the second - 2 leg portion 252 - 2 and includes an inclined surface. The second elastic piece 252 - 3 is bent from the second - 1 leg portion 252 - 1 by a predetermined angle and extended. The second elastic piece 252 - 3 can be inclined outward from the second - 1 leg portion 251 - 1. The second - 2 leg portion 252 - 2 is arranged to extend in the vertical direction with respect to the second anti - detachment portion 242. The second - 1 leg portion 252 - 1 and the second - 2 leg portion 252 - 2 may be arranged to extend in a direction parallel to the first support portion 221 and the second support portion 222.

[0076]

[0077] It is arranged corresponding to the second support portion 222. The second-1 leg portion 252-1 and the second-2 leg portion 252-2 are arranged opposite to the second support portion 222. The second-1 leg portion 252-1 and the second-2 leg portion 252-2 and the second elastic piece 25 2-3 are arranged in the insertion groove 110 of the bracket 100.

[0078] The second elastic piece 252-3 can be bent and extended from the second-1 leg portion 252-1 to have an inclined surface. The inclined surface of the second elastic piece 252-3 extends from the second-1 leg portion 252-1 at an angle different from that of the second-1 leg portion 252-1. For example, the angle α3 between the inclined surface of the second elastic piece 252-3 and the second-1 leg portion 252-1 and the second-2 leg portion 252-2 may be 15 ± 5 degrees.

[0079] The inclined surface of the second elastic piece 252-3 can contact the inner surface of the bracket 100 that forms the insertion groove 110. When the coupling member 200 is inserted into the insertion groove 110, a part of the inclined surface of the second elastic piece 252-3 can overlap with the inner surface of the bracket 100 that forms the insertion groove 110 in the vertical direction. For example, the inclined surface of the second elastic piece 252-3 and the inner surface of the bracket 100 that forms the insertion groove 110 can overlap by 0.1 mm in the vertical direction. And the coupling member 200 can be made of an elastic material, and a part of the inclined surface of the second elastic piece leg portion 252- 3 that overlaps with the inner surface of the bracket 100 that forms the insertion groove 110 is extruded and arranged in the insertion groove 110. Thereby, the insertion groove ... ... ... ... The friction between the inner surface of the bracket 100 forming 110 and the second elastic piece 252-3 increases, and the coupling force between the bracket 100 and the coupling member 200 can be improved. It can be done.

[0080] The length f in the third direction from the second-1 leg portion 251-1 to the second-2 leg portion 252-2 can be 1.7 mm ± 0.5 mm. The length e1 in the second direction of the second leg portion 252 can be 6.0 mm ± 1.0 mm. The length in the third direction of the second-2 leg portion 252-2 and the second elastic piece 252-3 may be the same. The length in the second direction of the second-2 leg portion 252-2 and the second elastic piece 252-3 may be different. For example, the width in the second direction of the second elastic piece 252-3 may be larger than the width in the second direction of the second-2 leg portion 252-2, but is not limited thereto. When the width in the second direction of the second elastic piece 252-3 is larger than the width in the second direction of the second-2 leg portion 252-2, the area where the second elastic piece 252-3 contacts the inner surface of the bracket 100 forming the insertion groove 110 increases, and the coupling force between the coupling member 200 and the bracket 100 can be improved. is larger, the area where the second elastic piece 252-3 contacts the inner surface of the bracket 100 forming the insertion groove 110 increases, and the coupling force between the coupling member 200 and the bracket 100 can be improved. increases, and the coupling force between the coupling member 200 and the bracket 100 can be improved. It can be improved.

[0081] As described above, in the lighting device according to the embodiment, the coupling member 200 disposed under the circuit board 300 is inserted into the insertion groove 110 of the bracket 100, and the coupling member 200 includes a head portion 210 adhered to the lower surface of the circuit board 300, a support portion 220 extending vertically from the head portion 210, an elastic portion 230 bent at a predetermined angle from the support portion 220 , a detachment prevention portion 240 extending in a direction perpendicular to the support portion 220 from the elastic portion 230, and from the elastic portion 230, a detachment prevention portion 240 extending in a direction perpendicular to the support portion 220, It can include a leg portion 250 that extends from the anti-disengagement portion 240 and a part of which is bent from the anti-disengagement portion 240 at a predetermined angle. Thereby, the leg portion 250 of the coupling member 200 contacts the inner surface of the bracket 100 that forms the insertion groove 110, increasing the friction coefficient between the coupling member 200 and the inner surface of the insertion groove 110, and improving the coupling force between the bracket 100 and the light-emitting module 600. Also, since the coupling member 200 is adhered to the lower surface of the circuit board 300, heat generated by the light-emitting element 400 is released to the coupling member 200, improving the heat dissipation ability of the light-emitting module 600 and the reliability of the lighting device.

[0082] Figures 7a to 7c are drawings showing the process in which the coupling member 200 disposed in contact with the lower surface of the circuit board 300 is coupled to the insertion groove 110 of the bracket 100. As shown in Figure 7a, after adhering the coupling member 200 to the lower surface of the circuit board 300 using an adhesive (not shown), as shown in Figure 7b, the coupling member 200 is inserted into the insertion groove 110 of the bracket 100 by an external force, and the coupling member 200 and the bracket 100 are fitted and coupled. Then, as shown in Figure 7c, a part of the inclined surface of the leg portion 250 contacts the inner surface of the bracket 100 that forms the insertion groove 110, increasing the friction coefficient and improving the coupling force. The anti-disengagement portion 240 contacts the lower surface of the bracket 100 to prevent the coupling member 200 from tilting from the bracket 100. Also, since the coupling member 200 is formed on the lower surface of the circuit board 300, the heat dissipation ability of the circuit board 300 can be improved. ​​​​​​​​​​​​​​​​

[0083] As described above, in the lighting device according to the embodiment, the coupling member 200 disposed on the lower surface of the circuit board 300 is coupled to the bracket 100 to improve the coupling force between the bracket 100 and the light emitting module 600. Therefore, in the lighting device according to the embodiment , the coupling member 200 is inserted into the insertion groove 110 of the bracket 100, and the coupling member 200 can be coupled to the light emitting module 600. Thus, the light emitting module 60 0 and the bracket 100 can be coupled by a simple process, and the process cost can be reduced. And, a part 251-3, 252-3 of the leg portion 250 of the coupling member 200 contacts the inner surface of the bracket 100 forming the insertion groove 110 to fix the light emitting module 600 to the bracket 100. Therefore, the coupling force between the light emitting module 600 and the bracket 100 can be improved. 100 can be improved. 100 can be improved.

[0084] FIG. 8a is a drawing showing the heat dissipation ability of the circuit board 300 when the light emitting element 400 is disposed on the circuit board 300 and the coupling member 200 is not disposed under the circuit board 300 , and FIG. 8b is a drawing showing the heat dissipation ability of the circuit board 300 when the light emitting element 400 is disposed on the circuit board 300 and the coupling member 200 is adhered under the circuit board 30 0. Comparing FIG. 8a and FIG. 8b, as shown in FIG. 8a, when the coupling member 200 is not disposed under the circuit board 30 0, only a part of the heat generated from the light emitting element 400 is released to the circuit board 300. Therefore, the temperature of the light emitting element 400 is measured at 49. 4 degrees. As shown in FIG. 8b, when the coupling member 200 is disposed under the circuit board 300 , only a part of the heat generated from the light emitting element 400 is released to the circuit board 300. Therefore, the temperature of the light emitting element 400 is measured at 49. 4 degrees. As shown in FIG. 8b, when the coupling member 200 is adhered under the circuit board 300, the heat generated from the light emitting element 400 is released to the coupling member 200 as well as the circuit board 300, so that the temperature of the light emitting element 400 is measured at 44. 4 degrees. As shown in FIG. 8b, when the coupling member 200 is adhered under the circuit board 300, the heat generated from the light emitting element 400 is released to the coupling member 200 as well as the circuit board 300, so that the temperature of the light emitting element 400 is measured at 44. When it is arranged, the heat generated from the light-emitting element 400 is released to the circuit board 300 and the bonding member 200, so the temperature of the light-emitting element 400 is measured at 45.7 degrees. Thus, when the bonding member 200 is arranged under the circuit board 300, the heat dissipation ability of the circuit board 300 can be improved, and the reliability of the lighting device can be improved. Figure 9 is a plan view of a vehicle to which a vehicle lamp to which the lighting device according to the embodiment is applied is applied, and Figure 10 is a drawing showing a vehicle lamp having the lighting device disclosed in the embodiment. Referring to Figures 9 and 10, in the vehicle 900, the taillight 800 can include a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. Here, the first lamp unit 812 may be a light source for serving as a direction indicator lamp, the second lamp unit 814 may be a light source for serving as a side marker lamp, and the third lamp unit 816 may be a light source for serving as a brake lamp, but is not limited thereto. At least one or all of the first lamp unit to the third lamp unit 812, 814, 816 may include the lighting module disclosed in the embodiment. The housing 810 houses the first lamp unit to the third lamp unit 812, 814, 816 and can be made of a light-transmitting material. At this time, the housing 810 can have a bend according to the design of the vehicle body, and the first lamp unit to the third lamp unit 812, 814, 816 can embody a surface light source having a curved surface according to the shape of the housing 810. Such a vehicle lamp has the above

[0085] When arranged, the heat generated from the light-emitting element 400 is released to the circuit board 300 and the bonding member 200, so the temperature of the light-emitting element 400 is measured at 45.7 degrees. Thus, when the bonding member 200 is arranged under the circuit board 300, the heat dissipation ability of the circuit board 300 can be improved, and the reliability of the lighting device can be improved.

[0086] Referring to Figures 9 and 10, in the vehicle 900, the taillight 800 can include a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. Here, the first lamp unit 812 may be a light source for serving as a direction indicator lamp, the second lamp unit 814 may be a light source for serving as a side marker lamp, and the third lamp unit 816 may be a light source for serving as a brake lamp, but is not limited thereto. At least one or all of the first lamp unit to the third lamp unit 812, 814, 816 may include the lighting module disclosed in the embodiment. The housing 810 houses the first lamp unit to the third lamp unit 812, 814, 816 and can be made of a light-transmitting material. At this time, the housing 810 can have a bend according to the design of the vehicle body, and the first lamp unit to the third lamp unit 812, 814, 816 can embody a surface light source having a curved surface according to the shape of the housing 810. Such a vehicle lamp has the above When arranged, the heat generated from the light-emitting element 400 is released to the circuit board 300 and the bonding member 200, so the temperature of the light-emitting element 400 is measured at 45.7 degrees. Thus, when the bonding member 200 is arranged under the circuit board 300, the heat dissipation ability of the circuit board 300 can be improved, and the reliability of the lighting device can be improved. Referring to Figures 9 and 10, in the vehicle 900, the taillight 800 can include a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. Here, the first lamp unit 812 may be a light source for serving as a direction indicator lamp, the second lamp unit 814 may be a light source for serving as a side marker lamp, and the third lamp unit 816 may be a light source for serving as a brake lamp, but is not limited thereto. At least one or all of the first lamp unit to the third lamp unit 812, 814, 816 may include the lighting module disclosed in the embodiment. The housing 810 houses the first lamp unit to the third lamp unit 812, 814, 816 and can be made of a light-transmitting material. At this time, the housing 810 can have a bend according to the design of the vehicle body, and the first lamp unit to the third lamp unit 812, 814, 816 can embody a surface light source having a curved surface according to the shape of the housing 810. Such a vehicle lamp has the above When arranged, the heat generated from the light-emitting element 400 is released to the circuit board 300 and the bonding member 200, so the temperature of the light-emitting element 400 is measured at 45.7 degrees. Thus, when the bonding member 200 is arranged under the circuit board 300, the heat dissipation ability of the circuit board 300 can be improved, and the reliability of the lighting device can be improved. Referring to Figures 9 and 10, in the vehicle 900, the taillight 800 can include a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. Here, the first lamp unit 812 may be a light source for serving as a direction indicator lamp, the second lamp unit 814 may be a light source for serving as a side marker lamp, and the third lamp unit 816 may be a light source for serving as a brake lamp, but is not limited thereto. At least one or all of the first lamp unit to the third lamp unit 812, 814, 816 may include the lighting module disclosed in the embodiment. The housing 810 houses the first lamp unit to the third lamp unit 812, 814, 816 and can be made of a light-transmitting material. At this time, the housing 810 can have a bend according to the design of the vehicle body, and the first lamp unit to the third lamp unit 812, 814, 816 can embody a surface light source having a curved surface according to the shape of the housing 810. Such a vehicle lamp has the above When arranged, the heat generated from the light-emitting element 400 is released to the circuit board 300 and the bonding member 200, so the temperature of the light-emitting element 400 is measured at 45.7 degrees. Thus, when the bonding member 200 is arranged under the circuit board 300, the heat dissipation ability of the circuit board 300 can be improved, and the reliability of the lighting device can be improved. Referring to Figures 9 and 10, in the vehicle 900, the taillight 800 can include a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. Here, the first lamp unit 812 may be a light source for serving as a direction indicator lamp, the second lamp unit 814 may be a light source for serving as a side marker lamp, and the third lamp unit 816 may be a light source for serving as a brake lamp, but is not limited thereto. At least one or all of the first lamp unit to the third lamp unit 812, 814, 816 may include the lighting module disclosed in the embodiment. The housing 81C houses the first lamp unit to the third lamp unit 812, 814, 816 and can be made of a light-transmitting material. At this time, the housing 810 can have a bend according to the design of the vehicle body, and the first lamp unit to the third lamp unit 812, 814, 816 can embody a surface light source having a curved surface according to the shape of the housing 810. Such a vehicle lamp has the above When arranged, the heat generated from the light-emitting element 400 is released to the circuit board 300 and the bonding member 200, so the temperature of the light-emitting element 400 is measured at 45.7 degrees. Thus, when the bonding member 200 is arranged under the circuit board 300, the heat dissipation ability of the circuit board 300 can be improved, and the reliability of the lighting device can be improved. When the lamp unit is applied to the taillight, brake light, or turn signal lamp of a vehicle, the vehicle can be applied to the turn signal lamp.

[0087] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Also, the features , structures, effects, etc. exemplified in each embodiment can be combined or modified by those with ordinary knowledge in the field to which the embodiment belongs for other embodiments. Therefore, the content related to such combinations and modifications should be construed as being included within the scope of the present invention.

[0088] Also, although the above has been described mainly with reference to the embodiments, this is merely illustrative and does not limit the present invention . For those with ordinary knowledge in the field to which the present invention belongs, various modifications and applications not exemplified above are possible without departing from the essential characteristics of this embodiment. . For example, each component specifically presented in the embodiment can be implemented with modifications. And the differences related to such modifications and applications should be construed as being included within the scope of the present invention defined by the appended claims.

Claims

1. A lighting device including a circuit board, a light emitting module including a plurality of light emitting elements disposed on the circuit board, and a coupling member coupled to a lower surface of the circuit board. The coupling member is disposed on the lower surface of the circuit board, and includes a head portion having a first side surface, a second side surface opposite to the first side surface, a third side surface connected to the first side surface and the second side surface, and a fourth side surface opposite to the third side surface, a first support portion extending vertically from one end of the head portion, a second support portion extending vertically from the other end of the head portion, a first elastic portion bent from the first support portion in an outer direction of the first support portion, a second elastic portion bent from the second support portion in an outer direction of the second support portion, a first detachment prevention portion extending from an end of the first elastic portion in a direction of the first support portion, a second detachment prevention portion extending from an end of the second elastic portion in a direction of the second support portion, a first leg portion extending from an end of the first detachment prevention portion in a direction of the lower surface of the circuit board, a second leg portion extending from an end of the second detachment prevention portion in a direction of the lower surface of the circuit board, wherein the first leg portion has a plurality of first elastic pieces, the second leg portion has a plurality of second elastic pieces, the first elastic pieces of the first leg portion are inclined in an outer direction from the first leg portion, and the second elastic pieces of the second leg portion are inclined in an outer direction from the second leg portion.

2. The width between the first side surface and the second side surface of the head portion is larger than the width between the third side surface and the fourth side surface, and the lighting device according to claim 1, further including a second head portion extending inwardly from the first side surface and the second side surface of the head portion, respectively, and a first head portion connecting the second head portions.

3. The width between the third side surface and the fourth side surface of the second head portion is larger than the width between the third side surface and the fourth side surface of the first head portion, and the lighting device according to claim 2, wherein the first head portion includes an opening.

4. 。 The lighting device according to claim 2 or 3, wherein the first head portion includes grooves recessed at the third side surface and the fourth side surface.

5. The lighting device according to claim 2, wherein the first detachment prevention portion and the second detachment prevention portion extend in a direction parallel to the head portion.

6. A connection portion between the first support portion and the first elastic portion, and a connection portion between the second support portion and the second elastic portion ​ ​ ​ ​ ​ ​ ​ The connecting part, the connecting part between the first elastic part and the first anti-disengagement part, and the second elastic part The connecting part between the second elastic part and the second anti-disengagement part are each a curved surface. The lighting device according to any one of claims 1 to 3 wherein.

7. The angle between the virtual straight line passing through the first elastic part and the virtual straight line passing through the first support part is acute angle, The angle between the virtual straight line passing through the second elastic part and the virtual straight line passing through the second support part is acute angle, The angle between the virtual straight line passing through the first anti-disengagement part and the virtual straight line passing through the first elastic part is an acute angle, The angle between the virtual straight line passing through the second anti-disengagement part and the virtual straight line passing through the second elastic part is an acute angle. The lighting device according to claim 2 or 3.

8. The first leg part and the second leg part each include a first-1 leg part and a second-1 leg part that extend vertically from the ends of the first anti-disengagement part and the second anti-disengagement part, and a first-2 leg part and a second- 2 leg parts extending from the first-1 leg part and the second-1 leg part, and extending from the first-1 leg part and the second-1 leg part, in an outer direction The lighting device according to any one of claims 1 to 3, including the first elastic piece and the second elastic piece inclined therein. wherein.

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