Suction device

Abstract

To provide an aerosol generation device which can be reduced in size and cost.SOLUTION: A suction device comprises: a power source BAT; a receptacle RCP which can be electrically coupled to an outside power source; an MCU 1; a charging IC2 having an input terminal VBUS connected to the receptacle RCP, a charging terminal bat connected to the power source BAT, and an output terminal SYS connected to the MCU1, the charging being configured to convert power input to the input terminal VBUS for outputting the power from the charging terminal bat; and a discharge path which connects the power source BAT and a heater HTR without through the charging CI2. The charging IC2 can supply the power input from the power source BAT to the charging terminal bat through the output terminal SYS, to the MCU 1.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The present invention relates to a suction device.

Background Art

[0002] Patent Document 1 describes an evaporator device having a converter capable of receiving a voltage from a USB power source or a battery and supplying the received voltage to a heating element. This converter is configured to be able to charge the battery with the voltage from the USB power source.

[0003] Patent Document 2 describes a smoking system including a primary device including a primary power source and a charging device for charging the primary power source, and a secondary device including a secondary power source charged by the primary power source and a load that generates heat by power supply from the secondary power source. In this smoking system, direct power supply from the primary power source to the load is possible.

[0004] Patent Document 3 describes an electronic cigarette capable of supplying power from a charger to a heating element of a tobacco cartridge.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0006] When a charging IC is provided in an aerosol generating device equipped with a power source, it is conceivable to use the Power Path function of the charging IC to supply power from an external power source or a built-in power source to loads such as a heater and a controller. However, as the number of loads connected to the output terminal of the charging IC increases, the current output from that output terminal will increase, necessitating the use of a large-scale or high-cost charging IC.

[0007] An object of the present invention is to provide a suction device capable of achieving miniaturization and cost reduction.

Means for Solving the Problems

[0008] A suction device according to one aspect of the present invention is a suction device that generates an aerosol by heating a rod including an aerosol source, and includes a heating unit, a power source, a case provided with an opening into which the rod can be inserted, and housing the heating unit and the power source, a connector electrically connectable to an external power source, a first load configured to control the heating by the heating unit, a first terminal electrically connected to the connector and into which power supplied from the external power source is input, a second terminal electrically connected to the power source, and a third terminal electrically connected to the first load, a charging IC including the above, a first discharge path for supplying power from the power source to the heating unit without passing through the charging IC, and a second discharge path for supplying power from the power source to the first load through the charging IC.

Effects of the Invention

[0009] According to the present invention, it is possible to provide a suction device capable of achieving miniaturization and cost reduction.

Brief Description of the Drawings

[0010]

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Embodiments for Carrying Out the Invention

[0011] Hereinafter, a suction system which is an embodiment of the aerosol generating device in the present invention will be described with reference to the drawings. This suction system includes a non-combustible suction device 100 (hereinafter, also simply referred to as "suction device 100"), which is an embodiment of the power supply unit of the present invention, and a rod 500 heated by the suction device 100. In the following description, a configuration in which the heating unit is non-removably housed in the suction device 100 will be described as an example. However, the heating unit may be configured to be detachable from the suction device 100. For example, an integrated unit of the rod 500 and the heating unit may be configured to be detachable from the suction device 100. That is, the power supply unit of the aerosol generating device may be configured not to include a heating unit as a component. Note that non-removable refers to a mode in which removal is not possible within the scope of the assumed use. Alternatively, an induction heating coil provided in the suction device 100 and a susceptor built into the rod 500 may cooperate to form a heating unit.

[0012] FIG. 1 is a perspective view showing the overall configuration of the suction device 100. FIG. 2 is a perspective view of the suction device 100 showing the state in which the rod 500 is attached. FIG. 3 is another perspective view of the suction device 100. FIG. 4 is an exploded perspective view of the suction device 100. In the following description, for convenience, three mutually perpendicular directions will be described using a rectangular coordinate system in a three-dimensional space, which are the front-rear direction, the left-right direction, and the up-down direction. In the figures, the front is indicated as Fr, the rear as Rr, the right side as R, the left side as L, the upper side as U, and the lower side as D.

[0013] The suction device 100 is configured to generate an aerosol containing a fragrance by heating an elongated substantially cylindrical rod 500 (see FIG. 2) as an example of a fragrance component generation substrate having a filling material including an aerosol source and a fragrance source.

[0014] <Fragrance component generation substrate (rod)> The rod 500 contains a filling material containing an aerosol source that is heated at a predetermined temperature to generate an aerosol.

[0015] The type of the aerosol source is not particularly limited, and extract substances from various natural products and / or their constituent components can be selected according to the use. The aerosol source may be solid, or may be a liquid such as a polyhydric alcohol such as glycerin or propylene glycol, or water. The aerosol source may contain a flavor source such as a tobacco raw material or an extract derived from a tobacco raw material that releases flavor components by heating. The gas to which the flavor component is added is not limited to aerosol, and for example, invisible vapor may be generated.

[0016] The filling of the rod 500 may contain tobacco shreds as a flavor source. The material of the tobacco shreds is not particularly limited, and known materials such as lamina and midrib can be used. The filling may contain one or more kinds of fragrances. The type of the fragrance is not particularly limited, but from the viewpoint of imparting good taste, it is preferably menthol. The flavor source may contain plants other than tobacco (for example, mint, Chinese herbal medicine, or herb, etc.). Depending on the use, the rod 500 may not contain a flavor source.

[0017] <Overall Structure of the Non-Burning Inhaler> Subsequently, the overall structure of the inhaler 100 will be described with reference to FIGS. 1 to 4. The inhaler 100 includes a substantially rectangular parallelepiped case 110 having a front surface, a rear surface, a left surface, a right surface, an upper surface, and a lower surface. The case 110 includes a bottomed cylindrical case body 112 in which the front surface, the rear surface, the upper surface, the lower surface, and the right surface are integrally formed, an outer panel 115 and an inner panel 118 that seal the opening 114 (see FIG. 4) of the case body 112 and constitute the left surface, and a slider 119.

[0018] The inner panel 118 is fixed to the case body 112 with bolts 120. The outer panel 115 is fixed to the case body 112 so as to cover the outer surface of the inner panel 118 by magnets 124 held by a chassis 150 (see FIG. 5) described later housed in the case body 112. By fixing the outer panel 115 with the magnets 124, the user can replace the outer panel 115 according to their preference.

[0019] The inner panel 118 is provided with two through holes 126 formed so that the magnets 124 can pass through. Between the two vertically arranged through holes 126 in the inner panel 118, there are further provided a vertically long slot 127 and a circular round hole 128. This slot 127 is for transmitting light emitted from eight LEDs (Light Emitting Diodes) L1 to L8 built into the case body 112. The button-type operation switch OPS built into the case body 112 passes through the round hole 128. Thereby, the user can detect the light emitted from the eight LEDs L1 to L8 through the LED window 116 of the outer panel 115. Also, the user can press down the operation switch OPS through the pressing portion 117 of the outer panel 115.

[0020] As shown in FIG. 2, an opening 132 into which a rod 500 can be inserted is provided on the upper surface of the case body 112. The slider 119 is coupled to the case body 112 so as to be movable in the front-rear direction between a position where the opening 132 is closed (see FIG. 1) and a position where the opening 132 is open (see FIG. 2).

[0021] The operation switch OPS is used to perform various operations of the suction device 100. For example, as shown in FIG. 2, with the rod 500 inserted into and attached to the opening 132, the user operates the operation switch OPS via the pressing portion 117. Thereby, the heating unit 170 (see FIG. 5) heats the rod 500 without burning it. When the rod 500 is heated, an aerosol is generated from the aerosol source contained in the rod 500, and the fragrance of the fragrance source contained in the rod 500 is added to the aerosol. The user can suck the aerosol containing the fragrance by sucking the suction port 502 of the rod 500 protruding from the opening 132.

[0022] On the lower surface of the case body 112, as shown in FIG. 3, a charging terminal 134 is provided for electrically connecting to an external power source such as an outlet or a mobile battery to receive power supply. In the present embodiment, the charging terminal 134 is a receptacle of the USB (Universal Serial Bus) Type-C shape, but is not limited thereto. The charging terminal 134 will also be referred to as the receptacle RCP hereinafter.

[0023] Note that the charging terminal 134 may be provided with, for example, a power receiving coil and be configured to be able to receive power transmitted from an external power source in a non-contact manner. The power transmission (Wireless Power Transfer) method in this case may be an electromagnetic induction type, a magnetic resonance type, or a combination of an electromagnetic induction type and a magnetic resonance type. As another example, the charging terminal 134 may be connectable to various USB terminals and have the above-described power receiving coil.

[0024] The configuration of the suction device 100 shown in FIGS. 1 to 4 is merely an example. The suction device 100 can be configured in various forms such that it holds the rod 500 and applies an action such as heating to generate a gas with a fragrance component imparted from the rod 500, and the user can suck the generated gas.

[0025] <Internal Configuration of Non-Burning Suction Device> The internal unit 140 of the aspirator 100 will be described with reference to FIGS. 5 to 8. FIG. 5 is a perspective view of the internal unit 140 of the aspirator 100. FIG. 6 is an exploded perspective view of the internal unit 140 of FIG. 5. FIG. 7 is a perspective view of the internal unit 140 with the power supply BAT and the chassis 150 removed. FIG. 8 is another perspective view of the internal unit 140 with the power supply BAT and the chassis 150 removed.

[0026] The internal unit 140 housed in the internal space of the case 110 includes a chassis 150, a power supply BAT, a circuit unit 160, a heating unit 170, a notification unit 180, and various sensors.

[0027] The chassis 150 includes a plate-shaped chassis body 151 disposed substantially at the center of the internal space of the case 110 in the front-rear direction and extending in the vertical and front-rear directions, a plate-shaped front-rear partition wall 152 disposed substantially at the center of the internal space of the case 110 in the front-rear direction and extending in the vertical and left-right directions, a plate-shaped upper-lower partition wall 153 extending forward from substantially the center of the front-rear partition wall 152 in the vertical direction, a plate-shaped chassis upper wall 154 extending rearward from the upper edge portions of the front-rear partition wall 152 and the chassis body 151, and a plate-shaped chassis lower wall 155 extending rearward from the lower edge portions of the front-rear partition wall 152 and the chassis body 151. The left surface of the chassis body 151 is covered by the inner panel 118 and the outer panel 115 of the case 110 described above.

[0028] The internal space of the case 110 is partitioned by the chassis 150 to form a heating unit accommodation region 142 in the upper front portion, a substrate accommodation region 144 in the lower front portion, and a power supply accommodation space 146 extending in the vertical direction in the rear.

[0029] The heating unit 170 accommodated in the heating unit accommodation area 142 is composed of a plurality of cylindrical members, and these are arranged concentrically to form a cylindrical body as a whole. The heating unit 170 has a rod accommodation part 172 capable of accommodating a part of the rod 500 therein, and a heater HTR (see FIGS. 10 to 19) for heating the rod 500 from the outer periphery or the center. It is preferable that the rod accommodation part 172 is made of a heat insulating material or a heat insulating material is provided inside the rod accommodation part 172 so that the surface of the rod accommodation part 172 and the heater HTR are thermally insulated. The heater HTR may be any element capable of heating the rod 500. The heater HTR is, for example, a heating element. Examples of the heating element include a heating resistor, a ceramic heater, and an induction heating type heater. As the heater HTR, for example, those having a PTC (Positive Temperature Coefficient) characteristic in which the resistance value increases as the temperature increases are preferably used. Alternatively, a heater HTR having an NTC (Negative Temperature Coefficient) characteristic in which the resistance value decreases as the temperature increases may be used. The heating unit 170 has a function of defining a flow path of air supplied to the rod 500 and a function of heating the rod 500. The case 110 is formed with a ventilation port (not shown) for allowing air to flow in, and is configured such that air can flow into the heating unit 170.

[0030] The power source BAT accommodated in the power source accommodation space 146 is a rechargeable secondary battery, an electric double layer capacitor, etc., and preferably a lithium ion secondary battery. The electrolyte of the power source BAT may be composed of one of a gel electrolyte, an electrolytic solution, a solid electrolyte, an ionic liquid, or a combination thereof.

[0031] The notification unit 180 notifies various information such as the SOC (State Of Charge) indicating the charging state of the power supply BAT, the preheating time during suction, and the available suction period. The notification unit 180 of the present embodiment includes eight LEDs L1 to L8 and a vibration motor M. The notification unit 180 may be composed of a light-emitting element such as the LEDs L1 to L8, may be composed of a vibration element such as the vibration motor M, or may be composed of a sound output element. The notification unit 180 may be a combination of two or more of the light-emitting element, the vibration element, and the sound output element.

[0032] The various sensors include an intake sensor that detects the user's puff operation (suction operation), a power supply temperature sensor that detects the temperature of the power supply BAT, a heater temperature sensor that detects the temperature of the heater HTR, a case temperature sensor that detects the temperature of the case 110, a cover position sensor that detects the position of the slider 119, and a panel detection sensor that detects the attachment and detachment of the outer panel 115.

[0033] The intake sensor is mainly composed of, for example, a thermistor T2 disposed near the opening 132. The power supply temperature sensor is mainly composed of, for example, a thermistor T1 disposed near the power supply BAT. The heater temperature sensor is mainly composed of, for example, a thermistor T3 disposed near the heater HTR. As described above, it is preferable that the rod housing portion 172 is thermally insulated from the heater HTR. In this case, the thermistor T3 preferably contacts or is close to the heater HTR inside the rod housing portion 172. When the heater HTR has PTC characteristics or NTC characteristics, the heater HTR itself may be used as the heater temperature sensor. The case temperature sensor is mainly composed of, for example, a thermistor T4 disposed near the left surface of the case 110. The cover position sensor is mainly composed of a Hall IC14 including a Hall element disposed near the slider 119. The panel detection sensor is mainly composed of a Hall IC13 including a Hall element disposed near the inner surface of the inner panel 118.

[0034] The circuit section 160 includes four circuit boards, a plurality of ICs (Integrated Circuits), and a plurality of elements. The four circuit boards mainly include an MCU (Micro Controller Unit) mounting board 161 on which an MCU 1 and a charging IC 2 to be described later are arranged, a receptacle mounting board 162 on which a charging terminal 134 is mainly arranged, an LED mounting board 163 on which an operation switch OPS, LEDs L1 to L8, and a communication IC 15 to be described later are arranged, and a hall IC mounting board 164 on which a hall element including a hall element constituting a cover position sensor and a hall IC 14 to be described later are arranged.

[0035] The MCU mounting board 161 and the receptacle mounting board 162 are arranged parallel to each other in the board accommodation area 144. Specifically described, the element arrangement surfaces of the MCU mounting board 161 and the receptacle mounting board 162 are arranged along the left-right direction and the up-down direction, and the MCU mounting board 161 is arranged in front of the receptacle mounting board 162. Openings are provided in the MCU mounting board 161 and the receptacle mounting board 162 respectively. The MCU mounting board 161 and the receptacle mounting board 162 are fastened to the board fixing portion 156 of the front-rear partition wall 152 with bolts 136 with a cylindrical spacer 173 interposed between the peripheral edges of these openings. That is, the spacer 173 fixes the positions of the MCU mounting board 161 and the receptacle mounting board 162 inside the case 110, and mechanically connects the MCU mounting board 161 and the receptacle mounting board 162. Thereby, it is possible to suppress the contact between the MCU mounting board 161 and the receptacle mounting board 162 and the generation of a short-circuit current between them.

[0036] In terms of cost, the surfaces facing the front of the MCU-mounted substrate 161 and the receptacle-mounted substrate 162 are defined as the respective main surfaces 161a and 162a, and the surfaces opposite to the main surfaces 161a and 162a are defined as the respective sub-surfaces 161b and 162b. Then, the sub-surface 161b of the MCU-mounted substrate 161 and the main surface 162a of the receptacle-mounted substrate 162 face each other with a predetermined gap therebetween. The main surface 161a of the MCU-mounted substrate 161 faces the front surface of the case 110, and the sub-surface 162b of the receptacle-mounted substrate 162 faces the front-rear partition wall 152 of the chassis 150. The elements and ICs mounted on the MCU-mounted substrate 161 and the receptacle-mounted substrate 162 will be described later.

[0037] The LED-mounted substrate 163 is disposed between the left side surface of the chassis body 151 and two magnets 124 arranged vertically. The element arrangement surface of the LED-mounted substrate 163 is arranged along the vertical direction and the front-rear direction. In other words, the element arrangement surfaces of the MCU-mounted substrate 161 and the receptacle-mounted substrate 162 respectively and the element arrangement surface of the LED-mounted substrate 163 are orthogonal to each other. Thus, it is preferable that the element arrangement surfaces of the MCU-mounted substrate 161 and the receptacle-mounted substrate 162 respectively and the element arrangement surface of the LED-mounted substrate 163 are not limited to being orthogonal but intersect (non-parallel). Note that the vibration motor M constituting the notification unit 180 together with the LEDs L1 to L8 is fixed to the lower surface of the chassis lower wall 155 and is electrically connected to the MCU-mounted substrate 161.

[0038] The hall IC-mounted substrate 164 is disposed on the upper surface of the chassis upper wall 154.

[0039] <Operation Modes of the Suction Device> FIG. 9 is a schematic diagram for explaining the operation modes of the suction device 100. As shown in FIG. 9, the operation modes of the suction device 100 include a charging mode, a sleep mode, an active mode, a heating initial setting mode, a heating mode, and a heating end mode.

[0040] The sleep mode is a mode mainly for saving power by stopping the power supply to the electronic components necessary for the heating control of the heater HTR.

[0041] The active mode is a mode in which most functions except the heating control of the heater HTR are enabled. When the slider 119 is opened while the suction device 100 is operating in the sleep mode, the operation mode is switched to the active mode. When the slider 119 is closed or the non-operation time of the operation switch OPS reaches a predetermined time while the suction device 100 is operating in the active mode, the operation mode is switched to the sleep mode.

[0042] The heating initial setting mode is a mode for performing initial settings such as control parameters for starting the heating control of the heater HTR. When the suction device 100 detects an operation of the operation switch OPS while operating in the active mode, the operation mode is switched to the heating initial setting mode, and when the initial setting is completed, the operation mode is switched to the heating mode.

[0043] The heating mode is a mode for executing the heating control of the heater HTR (heating control for aerosol generation and heating control for temperature detection). When the operation mode of the suction device 100 is switched to the heating mode, the heating control of the heater HTR is started.

[0044] The heating end mode is a mode for executing the end process of the heating control of the heater HTR (such as the process of storing the heating history). When the suction device 100 is operating in the heating mode, if the energization time to the heater HTR or the number of user suction operations reaches the upper limit, or the slider 119 is closed, the operation mode is switched to the heating end mode. When the end process is completed, the operation mode is switched to the active mode. When the suction device 100 is operating in the heating mode and a USB connection is made, the operation mode is switched to the heating end mode. When the end process is completed, the operation mode is switched to the charging mode. As shown in FIG. 9, in this case, before switching the operation mode to the charging mode, the operation mode may be switched to the active mode. In other words, when the suction device 100 is operating in the heating mode and a USB connection is made, the operation mode may be switched in the order of the heating end mode, the active mode, and the charging mode.

[0045] The charging mode is a mode for charging the power supply BAT with the power supplied from an external power supply connected to the receptacle RCP. When the suction device 100 is operating in the sleep mode or the active mode and an external power supply is connected (USB connection) to the receptacle RCP, the operation mode is switched to the charging mode. When the suction device 100 is operating in the charging mode and the charging of the power supply BAT is completed or the connection between the receptacle RCP and the external power supply is released, the operation mode is switched to the sleep mode.

[0046] <Schematic of the circuit of the internal unit> FIGS. 10, 11, and 12 are diagrams showing the schematic configuration of the electric circuit of the internal unit 140. FIG. 11 is the same as FIG. 10 except that the range 161A (the range surrounded by the thick dashed line) mounted on the MCU mounting board 161 and the range 163A (the range surrounded by the thick solid line) mounted on the LED mounting board 163 in the electric circuit shown in FIG. 10 are added. FIG. 12 is the same as FIG. 10 except that the range 162A mounted on the receptacle mounting board 162 and the range 164A mounted on the Hall IC mounting board 164 in the electric circuit shown in FIG. 10 are added.

[0047] In FIG. 10, the wiring indicated by the thick solid line is a wiring having the same potential as the reference potential (ground potential) of the internal unit 140 (a wiring connected to the ground provided in the internal unit 140), and this wiring is hereinafter referred to as a ground line. In FIG. 10, an electronic component in which a plurality of circuit elements are chip-mounted is shown as a rectangle, and the symbols of various terminals are described inside this rectangle. The power supply terminals VCC and VDD mounted on the chip each indicate a power supply terminal on the high potential side. The power supply terminal VSS and the ground terminal GND mounted on the chip each indicate a power supply terminal on the low potential side (reference potential side). For the chip-mounted electronic component, the potential difference between the potential of the power supply terminal on the high potential side and the potential of the power supply terminal on the low potential side is the power supply voltage. The chip-mounted electronic component executes various functions using this power supply voltage.

[0048] As shown in FIG. 11, on the MCU mounting board 161 (range 161A), as main electronic components, there are an MCU 1 that comprehensively controls the entire suction device 100, a charging IC 2 that controls the charging of the power supply BAT, load switches (hereinafter, LSW) 3, 4, 5 configured by combining capacitors, resistors, transistors, etc., a ROM (Read Only Memory) 6, a switch driver 7, a step-up / down DC / DC converter 8 (described as step-up / down DC / DC 8 in the figure), an operational amplifier OP2, an operational amplifier OP3, flip-flops (hereinafter, FF) 16, 17, a connector Cn(t2) electrically connected to a thermistor T2 that constitutes an intake air sensor (in the figure, the thermistor T2 connected to this connector is described), a connector Cn(t3) electrically connected to a thermistor T3 that constitutes a heater temperature sensor (in the figure, the thermistor T3 connected to this connector is described), a connector Cn(t4) electrically connected to a thermistor T4 that constitutes a case temperature sensor (in the figure, the thermistor T4 connected to this connector is described), and a voltage dividing circuit Pc for USB connection detection.

[0049] The ground terminals GND of each of the charging IC2, LSW3, LSW4, LSW5, switched driver 7, buck-boost DC / DC converter 8, FF16, and FF17 are connected to the ground line. The power supply terminal VSS of the ROM6 is connected to the ground line. The negative power supply terminals of each of the operational amplifiers OP2 and OP3 are connected to the ground line.

[0050] As shown in FIG. 11, on the LED mounting substrate 163 (range 163A), as main electronic components, a Hall IC13 including a Hall element constituting a panel detection sensor, LEDs L1 to L8, an operation switch OPS, and a communication IC15 are provided. The communication IC15 is a communication module for communicating with an electronic device such as a smartphone. Each of the power supply terminal VSS of the Hall IC13 and the ground terminal GND of the communication IC15 is connected to the ground line. The communication IC15 and the MCU1 are configured to be communicable via a communication line LN. One end of the operation switch OPS is connected to the ground line, and the other end of the operation switch OPS is connected to the terminal P4 of the MCU1.

[0051] As shown in FIG. 12, on the receptacle mounting substrate 162 (range 162A), as main electronic components, a power supply connector electrically connected to the power supply BAT (in the figure, the power supply BAT connected to this power supply connector is described), a connector electrically connected to a thermistor T1 constituting a power supply temperature sensor (in the figure, the thermistor T1 connected to this connector is described), a boost DC / DC converter 9 (described as boost DC / DC9 in the figure), a protection IC10, an overvoltage protection IC11, a remaining amount meter IC12, a receptacle RCP, switches S3 to S6 composed of MOSFETs, an operational amplifier OP1, and a pair (positive electrode side and negative electrode side) of heater connectors Cn electrically connected to the heater HTR are provided.

[0052] The two ground terminals GND of the receptacle RCP, the ground terminal GND of the boost DC / DC converter 9, the power supply terminal VSS of the protection IC 10, the power supply terminal VSS of the remaining amount meter IC 12, the ground terminal GND of the overvoltage protection IC 11, and the negative power supply terminal of the operational amplifier OP1 are each connected to the ground line.

[0053] As shown in FIG. 12, a hall IC 14 including a hall element that constitutes a cover position sensor is provided on the hall IC mounting substrate 164 (range 164A). The power supply terminal VSS of the hall IC 14 is connected to the ground line. The output terminal OUT of the hall IC 14 is connected to the terminal P8 of the MCU 1. The MCU 1 detects the opening and closing of the slider 119 based on the signal input to the terminal P8.

[0054] As shown in FIG. 11, a connector electrically connected to the vibration motor M is provided on the MCU mounting substrate 161.

[0055] <Details of the circuit of the internal unit> Hereinafter, with reference to FIG. 10, the connection relationship and the like of each electronic component will be described.

[0056] The two power input terminals V of the receptacle RCP BUS are each connected to the input terminal IN of the overvoltage protection IC 11 via a fuse Fs. When a USB plug is connected to the receptacle RCP and a USB cable including this USB plug is connected to an external power supply, the two power input terminals V of the receptacle RCP BUS are supplied with a USB voltage V USB .

[0057] One end of a voltage dividing circuit Pa composed of a series circuit of two resistors is connected to the input terminal IN of the overvoltage protection IC11. The other end of the voltage dividing circuit Pa is connected to the ground line. The connection point of the two resistors constituting the voltage dividing circuit Pa is connected to the voltage detection terminal OVLo of the overvoltage protection IC11. When the voltage input to the voltage detection terminal OVLo of the overvoltage protection IC11 is less than the threshold value, the overvoltage protection IC11 outputs the voltage input to the input terminal IN from the output terminal OUT. When the voltage input to the voltage detection terminal OVLo of the overvoltage protection IC11 becomes equal to or higher than the threshold value (overvoltage), the overvoltage protection IC11 stops the voltage output from the output terminal OUT (cuts off the electrical connection between the LSW3 and the receptacle RCP), thereby protecting the electronic components downstream of the overvoltage protection IC11. The output terminal OUT of the overvoltage protection IC11 is connected to the input terminal VIN of the LSW3 and one end of a voltage dividing circuit Pc (a series circuit of two resistors) connected to the MCU1. The other end of the voltage dividing circuit Pc is connected to the ground line. The connection point of the two resistors constituting the voltage dividing circuit Pc is connected to the terminal P17 of the MCU1.

[0058] One end of a voltage dividing circuit Pf composed of a series circuit of two resistors is connected to the input terminal VIN of the LSW3. The other end of the voltage dividing circuit Pf is connected to the ground line. The connection point of the two resistors constituting the voltage dividing circuit Pf is connected to the control terminal ON of the LSW3. The collector terminal of a bipolar transistor S2 is connected to the control terminal ON of the LSW3. The emitter terminal of the bipolar transistor S2 is connected to the ground line. The base terminal of the bipolar transistor S2 is connected to the terminal P19 of the MCU1. When the signal input to the control terminal ON of the LSW3 becomes high level, the LSW3 outputs the voltage input to the input terminal VIN from the output terminal VOUT. The output terminal VOUT of the LSW3 is connected to the input terminal VBUS of the charging IC2. While the USB connection is not made, the MCU1 turns on the bipolar transistor S2. As a result, the control terminal ON of the LSW3 is connected to the ground line via the bipolar transistor S2, so that a low-level signal is input to the control terminal ON of the LSW3. The bipolar transistor S2 connected to LSW3 is turned off by the MCU1 when a USB connection is made. When the bipolar transistor S2 turns off, the USB voltage V divided by the voltage dividing circuit Pf USB is input to the control terminal ON of LSW3. Therefore, when a USB connection is made and the bipolar transistor S2 is turned off, a high-level signal is input to the control terminal ON of LSW3. As a result, LSW3 outputs the USB voltage V supplied from the USB cable from the output terminal VOUT. Note that even if a USB connection is made while the bipolar transistor S2 is not turned off, the control terminal ON of LSW3 is connected to the ground line via the bipolar transistor S2. Therefore, it should be noted that as long as the MCU1 does not turn off the bipolar transistor S2, a low-level signal continues to be input to the control terminal ON of LSW3. USB

[0059] The positive terminal of the power supply BAT is connected to the power supply terminal VDD of the protection IC10, the input terminal VIN of the boost DC / DC converter 9, and the charging terminal bat of the charging IC2. Therefore, the power supply voltage V of the power supply BAT BAT is supplied to the protection IC10, the charging IC2, and the boost DC / DC converter 9. A resistor Ra, a switch Sa composed of a MOSFET, a switch Sb composed of a MOSFET, and a resistor Rb are connected in series in this order to the negative terminal of the power supply BAT. The current detection terminal CS of the protection IC10 is connected to the connection point of the resistor Ra and the switch Sa. The control terminals of each of the switch Sa and the switch Sb are connected to the protection IC10. Both ends of the resistor Rb are connected to the remaining amount meter IC12.

[0060] ​The protection IC 10 obtains the current value flowing through the resistor Ra during the charge and discharge of the power supply BAT from the voltage input to the current detection terminal CS, and when this current value becomes excessive (overcurrent), it controls the opening and closing of the switches Sa and Sb to stop the charging or discharging of the power supply BAT, thereby protecting the power supply BAT. More specifically, when the protection IC 10 obtains an excessive current value during the charging of the power supply BAT, it turns off the switch Sb to stop the charging of the power supply BAT. When the protection IC 10 obtains an excessive current value during the discharging of the power supply BAT, it turns off the switch Sa to stop the discharging of the power supply BAT. Also, the protection IC 10 controls the opening and closing of the switches Sa and Sb when the voltage value of the power supply BAT becomes abnormal (in the case of overcharging or overvoltage) from the voltage input to the power supply terminal VDD, and stops the charging or discharging of the power supply BAT, thereby protecting the power supply BAT. More specifically, when the protection IC 10 detects overcharging of the power supply BAT, it turns off the switch Sb to stop the charging of the power supply BAT. When the protection IC 10 detects overdischarging of the power supply BAT, it turns off the switch Sa to stop the discharging of the power supply BAT.

[0061] A resistor Rt1 is connected to a connector connected to a thermistor T1 arranged near the power supply BAT. The series circuit of the resistor Rt1 and the thermistor T1 is connected to the ground line and the regulator terminal TREG of the remaining amount meter IC12. The connection point of the thermistor T1 and the resistor Rt1 is connected to the thermistor terminal THM of the remaining amount meter IC12. The thermistor T1 may be a PTC (Positive Temperature Coefficient) thermistor whose resistance value increases as the temperature increases, or an NTC (Negative Temperature Coefficient) thermistor whose resistance value decreases as the temperature increases.

[0062] The remaining capacity meter IC12 detects the current flowing through the resistor Rb, and based on the detected current value, derives battery information such as the remaining capacity of the power supply BAT, the SOC (State Of Charge) indicating the charge state, and the SOH (State Of Health) indicating the health state. The remaining capacity meter IC12 supplies voltage to the voltage dividing circuit of the thermistor T1 and the resistor Rt1 from the built-in regulator connected to the regulator terminal TREG. The remaining capacity meter IC12 acquires the voltage divided by this voltage dividing circuit from the thermistor terminal THM, and based on this voltage, acquires temperature information regarding the temperature of the power supply BAT. The remaining capacity meter IC12 is connected to the MCU1 by the communication line LN for serial communication and is configured to be able to communicate with the MCU1. The remaining capacity meter IC12 transmits the derived battery information and the acquired temperature information of the power supply BAT to the MCU1 in response to a request from the MCU1. Note that in order to perform serial communication, a plurality of signal lines such as a data line for data transmission and a clock line for synchronization are required. It should be noted that in FIGS. 10 - 19, only one signal line is shown for simplicity.

[0063] The remaining capacity meter IC12 is provided with a notification terminal 12a. The notification terminal 12a is connected to the terminal P6 of the MCU1 and the cathode of the diode D2 described later. When the remaining capacity meter IC12 detects an abnormality such as the temperature of the power supply BAT becoming excessive, it notifies the MCU1 of the occurrence of the abnormality by outputting a low-level signal from the notification terminal 12a. This low-level signal is also input to the CLR(￣) terminal of the FF17 via the diode D2.

[0064] One end of the reactor Lc is connected to the switching terminal SW of the boost DC / DC converter 9. The other end of this reactor Lc is connected to the input terminal VIN of the boost DC / DC converter 9. The boost DC / DC converter 9 boosts the input voltage and outputs it from the output terminal VOUT by performing on / off control of the built-in transistor connected to the switching terminal SW. Note that the input terminal VIN of the boost DC / DC converter 9 constitutes the high-potential side power supply terminal of the boost DC / DC converter 9. The boost DC / DC converter 9 performs a boosting operation when the signal input to the enable terminal EN is at a high level. In the state where USB is connected, the signal input to the enable terminal EN of the boost DC / DC converter 9 may be controlled to a low level by the MCU1. Alternatively, in the state where USB is connected, the potential of the enable terminal EN may be made indeterminate by the MCU1 not controlling the signal input to the enable terminal EN of the boost DC / DC converter 9.

[0065] The source terminal of a switch S4 composed of a P-channel MOSFET is connected to the output terminal VOUT of the boost DC / DC converter 9. The gate terminal of the switch S4 is connected to the terminal P15 of the MCU1. One end of a resistor Rs is connected to the drain terminal of the switch S4. The other end of the resistor Rs is connected to the positive electrode side heater connector Cn which is connected to one end of the heater HTR. A voltage dividing circuit Pb composed of two resistors is connected to the connection point between the switch S4 and the resistor Rs. The connection point of the two resistors constituting the voltage dividing circuit Pb is connected to the terminal P18 of the MCU1. The connection point between the switch S4 and the resistor Rs is further connected to the positive power supply terminal of the operational amplifier OP1.

[0066] To the connection line between the output terminal VOUT of the boost DC / DC converter 9 and the source terminal of the switch S4, the source terminal of the switch S3 composed of a P-channel type MOSFET is connected. The gate terminal of the switch S3 is connected to the terminal P16 of the MCU1. The drain terminal of the switch S3 is connected to the connection line between the resistor Rs and the positive electrode side heater connector Cn. Thus, between the output terminal VOUT of the boost DC / DC converter 9 and the positive electrode side of the heater connector Cn, a circuit including the switch S3 and a circuit including the switch S4 and the resistor Rs are connected in parallel. Since the circuit including the switch S3 does not have a resistor, it is a circuit with lower resistance than the circuit including the switch S4 and the resistor Rs.

[0067] The non-inverting input terminal of the operational amplifier OP1 is connected to the connection line between the resistor Rs and the positive electrode side heater connector Cn. The inverting input terminal of the operational amplifier OP1 is connected to the negative electrode side heater connector Cn connected to the other end of the heater HTR and the drain terminal of the switch S6 composed of an N-channel type MOSFET. The source terminal of the switch S6 is connected to the ground line. The gate terminal of the switch S6 is connected to the terminal P14 of the MCU1, the anode of the diode D4, and the enable terminal EN of the boost DC / DC converter 9. The cathode of the diode D4 is connected to the Q terminal of the FF17. One end of the resistor R4 is connected to the output terminal of the operational amplifier OP1. The other end of the resistor R4 is connected to the terminal P9 of the MCU1 and the drain terminal of the switch S5 composed of an N-channel type MOSFET. The source terminal of the switch S5 is connected to the ground line. The gate terminal of the switch S5 is connected to the connection line between the resistor Rs and the positive electrode side heater connector Cn.

[0068] The input terminal VBUS of the charging IC2 is connected to the anode of each of the LEDs L1 to L8. The cathode of each of the LEDs L1 to L8 is connected to the control terminals PD1 to PD8 of the MCU1 via resistors for current limiting. That is, the LEDs L1 to L8 are connected in parallel to the input terminal VBUS. The LEDs L1 to L8 are operable by the USB voltage V USB supplied from the USB cable connected to the receptacle RCP, and the voltage supplied from the power supply BAT via the charging IC2, respectively. The MCU1 incorporates transistors (switching elements) connected to each of the control terminals PD1 to PD8 and the ground terminal GND. The MCU1 energizes the LED L1 to turn it on by turning on the transistor connected to the control terminal PD1, and turns off the LED L1 by turning off the transistor connected to the control terminal PD1. By rapidly switching the on and off of the transistor connected to the control terminal PD1, the brightness and emission pattern of the LED L1 can be dynamically controlled. The LEDs L2 to L8 are similarly controlled to turn on by the MCU1.

[0069] The charging IC2 has a charging function for charging the power supply BAT based on the USB voltage V USB input to the input terminal VBUS. The charging IC2 obtains the charging current and charging voltage of the power supply BAT from terminals and wirings (not shown), and based on these, performs charging control of the power supply BAT (power supply control from the charging terminal bat to the power supply BAT). Further, the charging IC2 may obtain the temperature information of the power supply BAT transmitted from the remaining amount meter IC12 to the MCU1 by serial communication using the communication line LN, and use it for charging control.

[0070] The charging IC2 further has a BAT power pass function and an OTG function. The BAT power pass function is a function of outputting a system power supply voltage Vcc0 that substantially matches the power supply voltage V BAT input to the charging terminal bat from the output terminal SYS. The OTG function is the power supply voltage V BATIt is a function to output the system power supply voltage Vcc4 obtained by boosting from the input terminal VBUS. The on / off of the OTG function of the charging IC2 is controlled by the MCU1 through serial communication using the communication line LN. In the OTG function, the power supply voltage V BAT input to the charging terminal bat may be output directly from the input terminal VBUS. In this case, the power supply voltage V BAT is substantially the same as the system power supply voltage Vcc4.

[0071] The output terminal SYS of the charging IC2 is connected to the input terminal VIN of the buck-boost DC / DC converter 8. One end of the reactor La is connected to the switching terminal SW of the charging IC2. The other end of the reactor La is connected to the output terminal SYS of the charging IC2. The charging enable terminal CE(￣) of the charging IC2 is connected to the terminal P22 of the MCU1 via a resistor. Further, the collector terminal of the bipolar transistor S1 is connected to the charging enable terminal CE(￣) of the charging IC2. The emitter terminal of the bipolar transistor S1 is connected to the output terminal VOUT of the LSW4 described later. The base terminal of the bipolar transistor S1 is connected to the Q terminal of the FF17. Further, one end of the resistor Rc is connected to the charging enable terminal CE(￣) of the charging IC2. The other end of the resistor Rc is connected to the output terminal VOUT of the LSW4.

[0072] A resistor is connected to the input terminal VIN and the enable terminal EN of the buck-boost DC / DC converter 8. When the system power supply voltage Vcc0 is input from the output terminal SYS of the charging IC2 to the input terminal VIN of the buck-boost DC / DC converter 8, the signal input to the enable terminal EN of the buck-boost DC / DC converter 8 becomes high level, and the buck-boost DC / DC converter 8 starts the boost operation or the buck operation. The buck-boost DC / DC converter 8 boosts or buck-boosts the system power supply voltage Vcc0 input to the input terminal VIN by switching control of the built-in transistor connected to the reactor Lb to generate the system power supply voltage Vcc1 and outputs it from the output terminal VOUT. The output terminal VOUT of the buck-boost DC / DC converter 8 is connected to the feedback terminal FB of the buck-boost DC / DC converter 8, the input terminal VIN of the LSW4, the input terminal VIN of the switch driver 7, the power supply terminal VCC and the D terminal of the FF16. The wiring to which the system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC / DC converter 8 is supplied is described as the power line PL1.

[0073] When the signal input to the control terminal ON of the LSW4 becomes high level, the LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN from the output terminal VOUT. The control terminal ON of the LSW4 and the power line PL1 are connected via a resistor. Therefore, when the system power supply voltage Vcc1 is supplied to the power line PL1, a high-level signal is input to the control terminal ON of the LSW4. The voltage output by the LSW4 is the same as the system power supply voltage Vcc1 if wiring resistance and the like are ignored, but in order to distinguish it from the system power supply voltage Vcc1, the voltage output from the output terminal VOUT of the LSW4 is hereinafter described as the system power supply voltage Vcc2.

[0074] The output terminal VOUT of LSW4 is connected to the power supply terminal VDD of MCU1, the input terminal VIN of LSW5, the power supply terminal VDD of the remaining amount meter IC12, the power supply terminal VCC of ROM6, the emitter terminal of the bipolar transistor S1, the resistor Rc, and the power supply terminal VCC of FF17. The wiring through which the system power supply voltage Vcc2 output from the output terminal VOUT of LSW4 is supplied is described as the power line PL2.

[0075] When the signal input to the control terminal ON of LSW5 becomes high level, LSW5 outputs the system power supply voltage Vcc2 input to the input terminal VIN from the output terminal VOUT. The control terminal ON of LSW5 is connected to the terminal P23 of MCU1. The voltage output by LSW5 is the same as the system power supply voltage Vcc2 if wiring resistance etc. is ignored, but in order to distinguish it from the system power supply voltage Vcc2, the voltage output from the output terminal VOUT of LSW5 is hereinafter described as the system power supply voltage Vcc3. The wiring through which the system power supply voltage Vcc3 output from the output terminal VOUT of LSW5 is supplied is described as the power line PL3.

[0076] A series circuit of the thermistor T2 and the resistor Rt2 is connected to the power line PL3, and the resistor Rt2 is connected to the ground line. The thermistor T2 and the resistor Rt2 constitute a voltage dividing circuit, and the connection point thereof is connected to the terminal P21 of MCU1. MCU1 detects the temperature variation (resistance value variation) of the thermistor T2 based on the voltage input to the terminal P21, and determines the presence or absence of the performance operation according to the amount of the temperature variation.

[0077] A series circuit of the thermistor T3 and the resistor Rt3 is connected to the power line PL3, and the resistor Rt3 is connected to the ground line. The thermistor T3 and the resistor Rt3 constitute a voltage dividing circuit, and the connection point thereof is connected to the terminal P13 of MCU1 and the inverting input terminal of the operational amplifier OP2. MCU1 detects the temperature of the thermistor T3 (corresponding to the temperature of the heater HTR) based on the voltage input to the terminal P13.

[0078] A series circuit of a thermistor T4 and a resistor Rt4 is connected to the power line PL3, and the resistor Rt4 is connected to the ground line. The thermistor T4 and the resistor Rt4 constitute a voltage dividing circuit, and the connection point thereof is connected to the terminal P12 of the MCU1 and the inverting input terminal of the operational amplifier OP3. The MCU1 detects the temperature of the thermistor T4 (corresponding to the temperature of the case 110) based on the voltage input to the terminal P12.

[0079] The source terminal of a switch S7 constituted by a MOSFET is connected to the power line PL2. The gate terminal of the switch S7 is connected to the terminal P20 of the MCU1. The drain terminal of the switch S7 is connected to one of a pair of connectors to which the vibration motor M is connected. The other of this pair of connectors is connected to the ground line. The MCU1 can control the opening and closing of the switch S7 by operating the potential of the terminal P20, and vibrate the vibration motor M in a specific pattern. Instead of the switch S7, a dedicated driver IC may be used.

[0080] The positive power supply terminal of the operational amplifier OP2 and a voltage dividing circuit Pd (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP2 are connected to the power line PL2. The connection point of the two resistors constituting the voltage dividing circuit Pd is connected to the non-inverting input terminal of the operational amplifier OP2. The operational amplifier OP2 outputs a signal corresponding to the temperature of the heater HTR (a signal corresponding to the resistance value of the thermistor T3). In the present embodiment, since a thermistor T3 having NTC characteristics is used, the higher the temperature of the heater HTR (the temperature of the thermistor T3), the lower the output voltage of the operational amplifier OP2. This is because the negative power supply terminal of the operational amplifier OP2 is connected to the ground line, and when the voltage value input to the inverting input terminal of the operational amplifier OP2 (the voltage dividing value by the thermistor T3 and the resistor Rt3) becomes higher than the voltage value input to the non-inverting input terminal of the operational amplifier OP2 (the voltage dividing value by the voltage dividing circuit Pd), the value of the output voltage of the operational amplifier OP2 becomes substantially equal to the value of the ground potential. That is, when the temperature of the heater HTR (the temperature of the thermistor T3) becomes high, the output voltage of the operational amplifier OP2 becomes a low level. When using a thermistor T3 with PTC characteristics, the output of the voltage dividing circuit of the thermistor T3 and the resistor Rt3 may be connected to the non-inverting input terminal of the operational amplifier OP2, and the output of the voltage dividing circuit Pd may be connected to the inverting input terminal of the operational amplifier OP2.

[0081] The positive power supply terminal of the operational amplifier OP3 and a voltage dividing circuit Pe (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP3 are connected to the power supply line PL2. The connection point of the two resistors constituting the voltage dividing circuit Pe is connected to the non-inverting input terminal of the operational amplifier OP3. The operational amplifier OP3 outputs a signal corresponding to the temperature of the case 110 (a signal corresponding to the resistance value of the thermistor T4). In the present embodiment, since a thermistor T4 with NTC characteristics is used, the higher the temperature of the case 110, the lower the output voltage of the operational amplifier OP3. This is because the negative power supply terminal of the operational amplifier OP3 is connected to the ground line, and when the voltage value input to the inverting input terminal of the operational amplifier OP3 (the voltage dividing value by the thermistor T4 and the resistor Rt4) becomes higher than the voltage value input to the non-inverting input terminal of the operational amplifier OP3 (the voltage dividing value by the voltage dividing circuit Pe), the value of the output voltage of the operational amplifier OP3 becomes substantially equal to the value of the ground potential. That is, when the temperature of the thermistor T4 becomes high, the output voltage of the operational amplifier OP3 becomes a low level. When using a thermistor T4 with PTC characteristics, the output of the voltage dividing circuit of the thermistor T4 and the resistor Rt4 may be connected to the non-inverting input terminal of the operational amplifier OP3, and the output of the voltage dividing circuit Pe may be connected to the inverting input terminal of the operational amplifier OP3.

[0082] A resistor R1 is connected to the output terminal of the operational amplifier OP2. The cathode of the diode D1 is connected to the resistor R1. The anode of the diode D1 is connected to the output terminal of the operational amplifier OP3, the D terminal of the FF17, and the CLR(￣) terminal of the FF17. A resistor R2 connected to the power supply line PL1 is connected to the connection line between the resistor R1 and the diode D1. Also, the CLR(￣) terminal of the FF16 is connected to this connection line.

[0083] One end of a resistor R3 is connected to a connection line between the anode of a diode D1 and the output terminal of an operational amplifier OP3 and the D terminal of an FF17. The other end of the resistor R3 is connected to a power supply line PL2. Further, the anode of a diode D2 connected to a notification terminal 12a of a remaining amount meter IC12, the anode of a diode D3, and the CLR(￣) terminal of the FF17 are connected to this connection line. The cathode of the diode D3 is connected to a terminal P5 of an MCU1.

[0084] When the temperature of a heater HTR becomes excessive, the signal output from the operational amplifier OP2 becomes small, and the signal input to the CLR(￣) terminal becomes a low level, an FF16 inputs a high-level signal from a Q(￣) terminal to a terminal P11 of an MCU1. A high-level system power supply voltage Vcc1 is supplied from a power supply line PL1 to the D terminal of the FF16. Therefore, in the FF16, a low-level signal continues to be output from the Q(￣) terminal unless the signal input to the CLR(￣) terminal operating in negative logic becomes a low level.

[0085] The signal input to the CLR(￣) terminal of FF17 goes low when any of the following occurs: when the temperature of the heater HTR becomes excessive, when the temperature of the case 110 becomes excessive, or when a low-level signal indicating abnormal detection is output from the notification terminal 12a of the remaining amount meter IC12. When the signal input to the CLR(￣) terminal of FF17 goes low, FF17 outputs a low-level signal from the Q terminal. This low-level signal is input to the terminal P10 of the MCU1, the gate terminal of the switch S6, the enable terminal EN of the boost DC / DC converter 9, and the base terminal of the bipolar transistor S1 connected to the charging IC2, respectively. When a low-level signal is input to the gate terminal of the switch S6, the gate-source voltage of the N-channel MOSFET constituting the switch S6 becomes less than the threshold voltage, so the switch S6 turns off. When a low-level signal is input to the enable terminal EN of the boost DC / DC converter 9, the boost operation stops because the enable terminal EN of the boost DC / DC converter 9 is positive logic. When a low-level signal is input to the base terminal of the bipolar transistor S1, the bipolar transistor S1 turns on (an amplified current is output from the collector terminal). When the bipolar transistor S1 turns on, a high-level system power supply voltage Vcc2 is input to the CE(￣) terminal of the charging IC2 via the bipolar transistor S1. Since the CE(￣) terminal of the charging IC2 is negative logic, the charging of the power supply BAT stops. As a result, the heating of the heater HTR and the charging of the power supply BAT stop. Note that even if the MCU1 tries to output a low-level enable signal from the terminal P22 to the charging enable terminal CE(￣) of the charging IC2, when the bipolar transistor S1 turns on, the amplified current is input from the collector terminal to the terminal P22 of the MCU1 and the charging enable terminal CE(￣) of the charging IC2. Therefore, it should be noted that a high-level signal is input to the charging enable terminal CE(￣) of the charging IC2.

[0086] The D terminal of FF17 is supplied with a high-level system power supply voltage Vcc2 from the power supply line PL2. Therefore, in FF17, as long as the signal input to the CLR(￣) terminal that operates in negative logic does not become a low level, a high-level signal continues to be output from the Q terminal. When a low-level signal is output from the output terminal of the operational amplifier OP3, a low-level signal is input to the CLR(￣) terminal of FF17 regardless of the level of the signal output from the output terminal of the operational amplifier OP2. It should be noted that when a high-level signal is output from the output terminal of the operational amplifier OP2, the low-level signal output from the output terminal of the operational amplifier OP3 is not affected by this high-level signal by the diode D1. Also, when a low-level signal is output from the output terminal of the operational amplifier OP2, even if a high-level signal is output from the output terminal of the operational amplifier OP3, this high-level signal is replaced with a low-level signal via the diode D1.

[0087] The power supply line PL2 further branches from the MCU-mounted board 161 toward the LED-mounted board 163 and the hall IC-mounted board 164 side. The power supply terminals VDD of the hall IC13, the power supply terminal VCC of the communication IC15, and the power supply terminal VDD of the hall IC14 are connected to this branched power supply line PL2.

[0088] The output terminal OUT of the hall IC13 is connected to the terminal P3 of the MCU1 and the terminal SW2 of the switch driver 7. When the outer panel 115 is removed, a low-level signal is output from the output terminal OUT of the hall IC13. The MCU1 determines the presence or absence of the outer panel 115 based on the signal input to the terminal P3.

[0089] The LED-mounted substrate 163 is provided with a series circuit (a series circuit of a resistor and a capacitor) connected to the operation switch OPS. This series circuit is connected to the power line PL2. The connection point of the resistor and the capacitor in this series circuit is connected to the terminal P4 of the MCU1, the operation switch OPS, and the terminal SW1 of the switch driver 7. When the operation switch OPS is not pressed, the operation switch OPS is non-conductive, and the signals input to the terminal P4 of the MCU1 and the terminal SW1 of the switch driver 7 respectively become high level due to the system power supply voltage Vcc2. When the operation switch OPS is pressed and the operation switch OPS becomes conductive, the signals input to the terminal P4 of the MCU1 and the terminal SW1 of the switch driver 7 respectively become low level because they are connected to the ground line. The MCU1 detects the operation of the operation switch OPS based on the signal input to the terminal P4.

[0090] The switch driver 7 is provided with a reset input terminal RSTB. The reset input terminal RSTB is connected to the control terminal ON of the LSW4. When the levels of the signals input to the terminal SW1 and the terminal SW2 of the switch driver 7 are both low (the outer panel 115 is removed and the operation switch OPS is pressed), the switch driver 7 outputs a low-level signal from the reset input terminal RSTB to stop the output operation of the LSW4. That is, when the operation switch OPS that is originally pressed through the pressing portion 117 of the outer panel 115 is directly pressed by the user with the outer panel 115 removed, the levels of the signals input to the terminal SW1 and the terminal SW2 of the switch driver 7 both become low.

[0091] <Operation for Each Operation Mode of the Suction Device> Hereinafter, with reference to FIGS. 13 to 19, the operation of the electric circuit shown in FIG. 10 will be described. FIG. 13 is a diagram for explaining the operation of the electric circuit in the sleep mode. FIG. 14 is a diagram for explaining the operation of the electric circuit in the active mode. FIG. 15 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode. FIG. 16 is a diagram for explaining the operation of the electric circuit when the heater HTR is heated in the heating mode. FIG. 17 is a diagram for explaining the operation of the electric circuit when the temperature of the heater HTR is detected in the heating mode. FIG. 18 is a diagram for explaining the operation of the electric circuit in the charging mode. FIG. 19 is a diagram for explaining the operation of the electric circuit when the MCU1 is reset (restarted). In each of FIGS. 13 to 19, among the terminals of the chip-sized electronic components, the terminals surrounded by the broken-line ellipse are the terminals where the input or output of the power supply voltage V BAT the USB voltage V USB and the input or output such as the system power supply voltage are made.

[0092] In any operation mode, the power supply voltage V BAT is input to the power supply terminal VDD of the protection IC10, the input terminal VIN of the boost DC / DC converter 9, and the charging terminal bat of the charging IC2.

[0093] <Sleep mode: FIG. 13> The MCU1 enables the V BAT power pass function of the charging IC2 and disables the OTG function and the charging function. Since the USB voltage V USB is not input to the input terminal VBUS of the charging IC2, the V BAT power pass function of the charging IC2 becomes effective. Since the signal for enabling the OTG function is not output from the MCU1 to the charging IC2 from the communication line LN, the OTG function becomes ineffective. Therefore, the charging IC2 supplies the power supply voltage V BATGenerate the system power supply voltage Vcc0 from [the source] and output it from the output terminal SYS. The system power supply voltage Vcc0 output from the output terminal SYS is input to the input terminal VIN and the enable terminal EN of the buck-boost DC / DC converter 8. The buck-boost DC / DC converter 8 is enabled when a high-level system power supply voltage Vcc0 is input to the enable terminal EN which is of positive logic, generates the system power supply voltage Vcc1 from the system power supply voltage Vcc0, and outputs it from the output terminal VOUT. The system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC / DC converter 8 is supplied to the input terminal VIN of LSW4, the control terminal ON of LSW4, the input terminal VIN of the switched driver 7, the power supply terminal VCC and the D terminal of FF16, respectively.

[0094] When the system power supply voltage Vcc1 is input to the control terminal ON of LSW4, LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN as the system power supply voltage Vcc2 from the output terminal VOUT. The system power supply voltage Vcc2 output from LSW4 is input to the power supply terminal VDD of MCU1, the input terminal VIN of LSW5, the power supply terminal VDD of the hall IC13, the power supply terminal VCC of the communication IC15, and the power supply terminal VDD of the hall IC14. Further, the system power supply voltage Vcc2 is supplied to the power supply terminal VDD of the remaining amount meter IC12, the power supply terminal VCC of ROM6, the resistor Rc and the bipolar transistor S1 connected to the charge enable terminal CE(￣) of the charge IC2, the power supply terminal VCC of FF17, the positive power supply terminal of the operational amplifier OP3, the voltage dividing circuit Pe, the positive power supply terminal of the operational amplifier OP2, and the voltage dividing circuit Pd, respectively. The bipolar transistor S1 connected to the charge IC2 is off unless a low-level signal is output from the Q terminal of FF17. Therefore, the system power supply voltage Vcc2 generated by LSW4 is also input to the charge enable terminal CE(￣) of the charge IC2. Since the charge enable terminal CE(￣) of the charge IC2 is of negative logic, in this state, the charging function by the charge IC2 is turned off.

[0095] Thus, in the sleep mode, since LSW5 stops the output of the system power supply voltage Vcc3, the power supply to the electronic components connected to the power line PL3 is stopped. Also, in the sleep mode, since the OTG function of the charging IC2 is stopped, the power supply to the LEDs L1 to L8 is stopped.

[0096] <Active mode: Figure 14> When the MCU1 detects that the signal input to the terminal P8 becomes high level and the slider 119 is opened from the sleep mode state shown in Figure 13, it inputs a high-level signal from the terminal P23 to the control terminal ON of the LSW5. As a result, LSW5 outputs the system power supply voltage Vcc2 input to the input terminal VIN as the system power supply voltage Vcc3 from the output terminal VOUT. The system power supply voltage Vcc3 output from the output terminal VOUT of the LSW5 is supplied to the thermistor T2, the thermistor T3, and the thermistor T4.

[0097] Furthermore, when the MCU1 detects that the slider 119 is opened, it enables the OTG function of the charging IC2 via the communication line LN. As a result, the charging IC2 outputs the system power supply voltage Vcc4 obtained by boosting the power supply voltage V BAT input from the charging terminal bat from the input terminal VBUS. The system power supply voltage Vcc4 output from the input terminal VBUS is supplied to the LEDs L1 to L8.

[0098] <Heating initial setting mode: Figure 15> When the signal input to the terminal P4 becomes low level (the operation switch OPS is pressed) from the state shown in Figure 14, the MCU1 performs various settings necessary for heating and then inputs a high-level enable signal from the terminal P14 to the enable terminal EN of the boost DC / DC converter 9. As a result, the boost DC / DC converter 9 outputs the drive voltage V BAT obtained by boosting the power supply voltage V bst from the output terminal VOUT. The drive voltage V bstIt is supplied to switch S3 and switch S4. In this state, switches S3 and S4 are off. Also, switch S6 is turned on by the high-level enable signal output from terminal P14. As a result, the negative terminal of heater HTR is connected to the ground line, and if switch S3 is turned on, the heater HTR can be heated. After a high-level enable signal is output from terminal P14 of MCU1, it shifts to the heating mode.

[0099] <Heater Heating in Heating Mode: Figure 16> In the state of Figure 15, MCU1 starts the switching control of switch S3 connected to terminal P16 and the switching control of switch S4 connected to terminal P15. These switching controls may be automatically started when the above-described heating initial setting mode is completed, or may be started by pressing the further operation switch OPS. Specifically, as shown in Figure 16, MCU1 turns on switch S3, turns off switch S4, supplies the drive voltage V bst to heater HTR, and performs heating control for heating heater HTR for aerosol generation, and as shown in Figure 17, turns off switch S3, turns on switch S4, and performs temperature detection control for detecting the temperature of heater HTR.

[0100] As shown in Figure 16, during heating control, the drive voltage V bst is also supplied to the gate of switch S5, and switch S5 is turned on. Also, during heating control, the drive voltage V bst passing through switch S3 is input to the positive power supply terminal of operational amplifier OP1 via resistor Rs. The resistance value of resistor Rs is negligibly small compared to the internal resistance value of operational amplifier OP1. Therefore, during heating control, the voltage input to the positive power supply terminal of operational amplifier OP1 is almost equal to the drive voltage V bst .

[0101] Note that the resistance value of resistor R4 is larger than the on-resistance value of switch S5. The operational amplifier OP1 operates even during heating control, but switch S5 turns on during heating control. When switch S5 is on, the output voltage of operational amplifier OP1 is divided by the voltage divider circuit of resistor R4 and switch S5 and input to terminal P9 of MCU1. Since the resistance value of resistor R4 is larger than the on-resistance value of switch S5, the voltage input to terminal P9 of MCU1 becomes sufficiently small. This can prevent a large voltage from being input from operational amplifier OP1 to MCU1.

[0102] <Heater temperature detection in heating mode: Figure 17> As shown in FIG. 17, during temperature detection control, the drive voltage V bst is input to the positive power supply terminal of operational amplifier OP1 and is also input to voltage divider circuit Pb. The voltage divided by voltage divider circuit Pb is input to terminal P18 of MCU1. Based on the voltage input to terminal P18, MCU1 obtains the reference voltage V temp applied to the series circuit of resistor Rs and heater HTR during temperature detection control.

[0103] Also, during temperature detection control, the drive voltage V bst (reference voltage V temp ) is supplied to the series circuit of resistor Rs and heater HTR. Then, the voltage V bst (reference voltage V temp ) divided by resistor Rs and heater HTR is input to the non-inverting input terminal of operational amplifier OP1. Since the resistance value of resistor Rs is sufficiently larger than the resistance value of heater HTR, the voltage V heat is a value sufficiently lower than the drive voltage V heat bst . During temperature detection control, this low voltage V heat is also supplied to the gate terminal of switch S5, turning off switch S5. Operational amplifier OP1 amplifies and outputs the difference between the voltage input to the inverting input terminal and the voltage V heat input to the non-inverting input terminal.

[0104] The output signal of the operational amplifier OP1 is input to terminal P9 of the MCU1. The MCU1 obtains the reference voltage V based on the signal input to terminal P9 and the input voltage of terminal P18 temp and the electrical resistance value of the known resistor Rs, and obtains the temperature of the heater HTR. The MCU1 performs heating control of the heater HTR (for example, control such that the temperature of the heater HTR reaches the target temperature) based on the obtained temperature of the heater HTR.

[0105] Note that the MCU1 can also obtain the temperature of the heater HTR even during the period when the switches S3 and S4 are each turned off (the period when the heater HTR is not energized). Specifically, the MCU1 obtains the temperature of the heater HTR based on the voltage input to terminal P13 (the output voltage of the voltage dividing circuit composed of the thermistor T3 and the resistor Rt3).

[0106] Also, the MCU1 can obtain the temperature of the case 110 at any timing. Specifically, the MCU1 obtains the temperature of the case 110 based on the voltage input to terminal P12 (the output voltage of the voltage dividing circuit composed of the thermistor T4 and the resistor Rt4).

[0107] <Charging mode: Figure 18> Figure 18 illustrates the case where a USB connection is made in the sleep mode. When a USB connection is made, the USB voltage V USB is input to the input terminal VIN of the LSW3 via the overvoltage protection IC11. The USB voltage V USB is also supplied to the voltage dividing circuit Pf connected to the input terminal VIN of the LSW3. Immediately after the USB connection is made, since the bipolar transistor S2 is on, the signal input to the control terminal ON of the LSW3 remains at a low level. The USB voltage V USB is also supplied to the voltage dividing circuit Pc connected to terminal P17 of the MCU1, and the voltage divided by this voltage dividing circuit Pc is input to terminal P17. The MCU1 detects that a USB connection has been made based on the voltage input to terminal P17.

[0108] When the MCU1 detects that a USB connection has been made, it turns off the bipolar transistor S2 connected to the terminal P19. When a low-level signal is input to the gate terminal of the bipolar transistor S2, the USB voltage V divided by the voltage divider circuit Pf is USB is input to the control terminal ON of LSW3. As a result, a high-level signal is input to the control terminal ON of LSW3, and LSW3 is turned on at the USB voltage V USB is output from the output terminal VOUT. The USB voltage V USB is input to the input terminal VBUS of the charging IC2. Also, the USB voltage V USB is supplied as it is to the LEDs L1 to L8 as the system power supply voltage Vcc4.

[0109] When the MCU1 detects that a USB connection has been made, it also outputs a low-level enable signal from terminal P22 to the charge enable terminal CE(￣) of the charger IC2. This causes the charger IC2 to enable the charging function of the power supply BAT and increase the USB voltage V input to the input terminal VBUS. USB Start charging the power supply BAT.

[0110] If a USB connection is made in the active mode, the MCU1 detects this and turns off the bipolar transistor S2 connected to the terminal P19. It also outputs a low-level enable signal from the terminal P22 to the charge enable terminal CE(￣) of the charging IC2, and turns off the OTG function of the charging IC2 through serial communication using the communication line LN. As a result, the system power supply voltage Vcc4 supplied to the LEDs L1 to L8 becomes the voltage (power supply voltage V BAT The USB voltage V output from LSW3 is USB The LEDs L1 to L8 will not operate unless the built-in transistors are turned on by the MCU1. This prevents the unstable voltage that occurs during the transition period when the OTG function is turned on and off from being supplied to the LEDs L1 to L8.

[0111] <Reset of MCU: Figure 19> When the outer panel 115 is removed and the output of the Hall IC 13 becomes low level, and when the on-operation of the operation switch OPS is performed and the signal input to the terminal P4 of the MCU 1 becomes low level, both the terminal SW1 and the terminal SW2 of the switch driver 7 become low level. As a result, the switch driver 7 outputs a low-level signal from the reset input terminal RSTB. The low-level signal output from the reset input terminal RSTB is input to the control terminal ON of the LSW4. Thereby, the LSW4 stops the output of the system power supply voltage Vcc2 from the output terminal VOUT. Since the system power supply voltage Vcc2 is no longer input to the power supply terminal VDD of the MCU 1 when the output of the system power supply voltage Vcc2 is stopped, the MCU 1 stops.

[0112] When the time for which the switch driver 7 outputs a low-level signal from the reset input terminal RSTB reaches the preset time, or when the signal input to either the terminal SW1 or the terminal SW2 becomes high level, the switch driver 7 returns the signal output from the reset input terminal RSTB to high level. Thereby, the control terminal ON of the LSW4 becomes high level, and the state where the system power supply voltage Vcc2 is supplied to each part returns.

[0113] <Details of the functions of the charging IC) Figure 20 is a diagram showing the schematic configuration inside the charging IC 2. The charging IC 2 includes a processor 21, a gate driver 22, and switches Q1 to Q4 each composed of an N-channel MOSFET.

[0114] The source terminal of switch Q1 is connected to the input terminal VBUS. The drain terminal of switch Q1 is connected to the drain terminal of switch Q2. The source terminal of switch Q2 is connected to the switching terminal SW. The drain terminal of switch Q3 is connected to the connection node between switch Q2 and the switching terminal SW. The source terminal of switch Q3 is connected to the ground terminal GND. The drain terminal of switch Q4 is connected to the output terminal SYS. The source terminal of switch Q4 is connected to the charging terminal bat.

[0115] The gate driver 22 is connected to the gate terminals of switch Q2 and switch Q3, and performs on / off control of switches Q2 and Q3 based on the commands of the processor 21.

[0116] The processor 21 is connected to the gate driver 22, the gate terminal of switch Q1, the gate terminal of switch Q4, and the charge enable terminal CE(￣). The processor 21 performs on / off control of switches Q2 and Q3 via the gate driver 22, and on / off control of switches Q1 and Q4.

[0117] The charging IC2 has, in addition to the charging function, V BAT the power pass function, and the OTG function, V USB the power pass function, and V USB &V BAT the power pass function, and is provided with. Hereinafter, the internal control contents of the charging IC2 when each of these functions is enabled will be described. The specific numerical values of the various voltages described above are preferably the values shown below.

[0118] The power supply voltage V BAT (fully charged voltage)=4.2V The power supply voltage V BAT (nominal voltage)=3.7V The system power supply voltage Vcc1 = 3.3V The system power supply voltage Vcc2 = 3.3V The system power supply voltage Vcc3 = 3.3V The system power supply voltage Vcc4 = 5.0V USB voltage V USB = 5.0 V Drive voltage V bst = 4.9 V

[0119] (Charging function) The processor 21 controls the on / off states of the switches Q2 and Q4 with the switch Q1 turned on and the switch Q3 turned off. The on / off control of the switch Q4 is performed to adjust the charging current of the power supply BAT. The processor 21 controls the on / off state of the switch Q2 so that the voltage at the output terminal SYS becomes the same as the voltage suitable for charging the power supply BAT. As a result, the USB voltage V input to the input terminal VBUS USB is stepped down and output from the output terminal SYS. The voltage output from the output terminal SYS is input to the input terminal VIN of the buck-boost DC / DC converter 8 as the system power supply voltage Vcc0 and is output from the charging terminal bat of the charging IC2. As a result, the power supply BAT is charged with the voltage obtained by stepping down the USB voltage V USB . When the charging function is enabled, the system power supply voltage Vcc0 finally becomes the same value as the full charge voltage of the power supply BAT. Therefore, the buck-boost DC / DC converter 8 steps down the 4.2 V system power supply voltage Vcc0 input to the input terminal VIN and generates and outputs a 3.3 V system power supply voltage Vcc1. When the charging function is enabled, in the charging IC2, the potential of the input terminal VBUS is higher than the potential of the output terminal SYS, so power is not output from the power supply BAT to the input terminal VBUS.

[0120] (V USB (Power pass function) V USB The power pass function becomes effective, for example, when the power supply BAT cannot be used due to over-discharge or the like. The processor 21 controls the switch Q1 to be on, the switch Q2 to be on, the switch Q3 to be off, and the switch Q4 to be off. As a result, the USB voltage V input to the input terminal VBUS USBIt is output directly from the switching terminal SW without being stepped down. The voltage output from the switching terminal SW is input to the input terminal VIN of the buck-boost DC / DC converter 8 as the system power supply voltage Vcc0. Also in this case, the buck-boost DC / DC converter 8 steps down the 5V system power supply voltage Vcc0 input to the input terminal VIN and generates and outputs a 3.3V system power supply voltage Vcc1. Note that V USB Even when the power pass function is enabled, the processor 21 may control the on / off of the switch Q2 with the switch Q1 turned on, the switch Q3 turned off, and the switch Q4 turned on. In this way, the bucking from the 5.0V USB voltage V USB to the 3.3V system power supply voltage Vcc1 can be shared by the charging IC2 and the buck-boost DC / DC converter 8. Therefore, it is possible to prevent the load and heat generation from concentrating on the buck-boost DC / DC converter 8.

[0121] (V USB &V BAT Power pass function) V USB &V BAT The power pass function becomes effective, for example, when the charging of the power supply BAT is completed and the USB connection is continued. The processor 21 controls the on / off of the switch Q2 with the switch Q1 turned on, the switch Q3 turned off, and the switch Q4 turned on. The processor 21 controls the switch Q2 so that the voltage of the output terminal SYS becomes the same as the voltage of the power supply BAT (power supply voltage V BAT ). As a result, the USB voltage V USB input to the input terminal VBUS is stepped down and output from the output terminal SYS. The voltage of the USB voltage V USB input to the input terminal VBUS that is stepped down and output from the output terminal SYS and the voltage output from the output terminal SYS via the charging terminal bat from the power supply BAT have the same value. Therefore, the power including the voltage obtained by stepping down the USB voltage V USB and the power supply voltage V BATThe power including [it] is combined and supplied to the input terminal VIN of the buck-boost DC / DC converter 8. V USB &V BAT When the power pass function is enabled, in the charging IC2, since the potential of the input terminal VBUS becomes higher than the potential of the output terminal SYS, the power from the power supply BAT is not output from the input terminal VBUS.

[0122] V USB &V BAT When the power pass function is enabled, the buck-boost DC / DC converter 8 determines whether to perform step-up or step-down according to the magnitude of the power supply voltage V BAT When the power supply voltage V BAT is 3.3 V or more, the buck-boost DC / DC converter 8 steps down the system power supply voltage Vcc0 input to the input terminal VIN to generate and output a system power supply voltage Vcc1 of 3.3 V. When the power supply voltage V BAT is less than 3.3 V, the buck-boost DC / DC converter 8 steps up the system power supply voltage Vcc0 input to the input terminal VIN to generate and output a system power supply voltage Vcc1 of 3.3 V.

[0123] (V BAT (Power pass function) V BAT The power pass function is enabled in modes other than the charging mode (for example, the sleep mode). The processor 21 controls the switch Q1 and the switch Q3 to be off. As a result, the power supply voltage V BAT input to the charging terminal bat is directly output from the output terminal SYS and input to the input terminal VIN of the buck-boost DC / DC converter 8 as the system power supply voltage Vcc0. By this control, the power transmission path between the input terminal VBUS and the switching terminal SW of the charging IC2 is blocked by the parasitic diode of the switch Q1. Therefore, the power supply voltage V BAT output from the output terminal SYS is not output from the input terminal VBUS.

[0124] V BAT When the power pass function is enabled, the buck-boost DC / DC converter 8 is the power supply voltage VBAT Determine whether to step up or step down based on the magnitude. The buck-boost DC / DC converter 8 supplies the power supply voltage V input to the input terminal VIN BAT When it is 3.3V or higher, the power supply voltage V BAT is stepped down to generate and output a system power supply voltage Vcc1 of 3.3V. The buck-boost DC / DC converter 8 supplies the power supply voltage V input to the input terminal VIN BAT When it is less than 3.3V, the power supply voltage V BAT is stepped up to generate and output a system power supply voltage Vcc1 of 3.3V.

[0125] (OTG function) The OTG function becomes effective simultaneously with the V BAT power pass function and becomes effective, for example, in the active mode. When both the OTG function and the V BAT power pass function are effective, the processor 21 controls the switch Q3 to be turned on or off with the switch Q1 controlled to be on. As a result, the power supply voltage V input to the charging terminal bat BAT is directly output from the output terminal SYS and input to the input terminal VIN of the buck-boost DC / DC converter 8 as the system power supply voltage Vcc0. Also, the power supply voltage V output from the output terminal SYS BAT is input to the switching terminal SW of the charging IC2. The processor 21 controls the switch Q3 so that the power supply voltage V input to the switching terminal SW BAT becomes the same as the system power supply voltage Vcc4. As a result, the power supply voltage V input to the switching terminal SW BAT is stepped up and output from the input terminal VBUS. The voltage output from the input terminal VBUS is input to the LEDs L1 to L8 as the system power supply voltage Vcc4.

[0126] In this way, the charging IC2 functions as a buck converter for stepping down the USB voltage V USB and the power supply voltage V BATIt also has the function as a boost converter for boosting. The voltage input from the charging IC2 to the buck-boost DC / DC converter 8 varies in various ways according to the functions enabled in the charging IC2. However, even with such variations, by selectively performing boosting and bucking by the buck-boost DC / DC converter 8, the system power supply voltage Vcc1 (the power including the system power supply voltage Vcc1) can be kept constant. When the voltage of the system power supply voltage Vcc0 input to the input terminal VIN of the buck-boost DC / DC converter 8 is equal to 3.3V which is the voltage of the system power supply voltage Vcc1, the buck-boost DC / DC converter 8 does not perform boosting or bucking, and outputs the system power supply voltage Vcc0 as the system power supply voltage Vcc1 from the output terminal VOUT.

[0127] <Power consumption of the electric circuit> In the suction system including the suction device 100, among all the loads included in the system, the load that consumes the most power is the heater HTR. For example, the power consumption P HTR of the heater HTR is larger than the power consumption P LED of each of the LEDs L1 to L8. Also, the power consumption of the heater HTR is larger than the total value of the power consumptions of all the electronic components connected to the output terminal SYS of the charging IC2. Therefore, it is preferable that the current value that the boost DC / DC converter 9 connected to the heater HTR can receive from the power supply BAT is larger than the maximum current value that the output terminal SYS of the charging IC2 can output.

[0128] <Preferred form of the buck-boost DC / DC converter 8> From the perspective of reducing the cost and size of the buck-boost DC / DC converter 8, it is preferable that at least one of the maximum input current and the maximum output current of the buck-boost DC / DC converter 8 is smaller than the maximum current that the output terminal SYS of the charging IC 2 can output. With such a configuration, when the output terminal SYS of the charging IC 2 outputs the maximum current, there is a risk that an excessive current will be input to the buck-boost DC / DC converter 8. However, since the heater HTR that consumes the most power is not connected to the output terminal VOUT of the buck-boost DC / DC converter 8, an excessive current will not be input to the buck-boost DC / DC converter 8. Therefore, even with such a configuration, the cost and size can be reduced without causing problems in the buck-boost DC / DC converter 8.

[0129] <Preferred embodiment of the boost DC / DC converter 9> The boost DC / DC converter 9 is preferably a switching regulator. In the example of FIG. 20, the boost DC / DC converter 9 operates in either a PFM (Pulse Frequency Modulation) mode that performs PFM control or a PWM (Pulse Width Modulation) mode that performs PWM control to boost the voltage. Specifically, the boost DC / DC converter 9 is equipped with a mode terminal MODE for mode switching, and is configured to be able to switch the operating mode according to the potential of the mode terminal MODE. Note that the maximum current that can be input to the switching terminal SW of the boost DC / DC converter 9 when the boost DC / DC converter 9 operates in the PFM mode is preferably larger than the maximum current that can be input to the switching terminal SW of the boost DC / DC converter 9 when the boost DC / DC converter 9 operates in the PWM mode.

[0130] The voltage applied to the heater HTR varies significantly between the heating control and the temperature detection control. That is, the load of the step-up DC / DC converter 9 fluctuates between a heavy load and a light load. Since the switching frequency is constant regardless of the load in the PWM mode, the switching loss becomes dominant and the efficiency decreases during light load. On the other hand, in the PFM mode, since additional power is not required much during light load, the switching frequency decreases and the switching loss decreases. Therefore, high efficiency can be maintained even during light load. When the degree of load increases from light load to heavy load, this efficiency relationship is reversed, and the PWM mode is more efficient than the PFM mode. The degree of load at which the PWM mode is more efficient is within a limited range. Therefore, when the load of the step-up DC / DC converter 9 fluctuates between heavy load and light load, the step-up DC / DC converter 9 preferably operates in the PFM mode.

[0131] Regardless of whether it operates in the PWM mode or the PFM mode, the efficiency of the step-up DC / DC converter 9 tends to decrease near the maximum current that can be input to the step-up DC / DC converter 9 or near the maximum current that the step-up DC / DC converter 9 can output. In particular, when operating in the PFM mode, since it has the characteristic that the efficiency decreases during heavy load as described above, the efficiency of the DC / DC converter decreases due to double factors near the maximum current. Therefore, as described above, a step-up DC / DC converter 9 is used in which the maximum current that can be input to the switching terminal SW of the step-up DC / DC converter 9 when operating in the PFM mode is larger than the maximum current that can be input to the switching terminal SW of the step-up DC / DC converter 9 when operating in the PWM mode. Thereby, even when the step-up DC / DC converter 9 is operated in the PFM mode, a decrease in efficiency during heavy load can be suppressed.

[0132] From the perspective of the above-mentioned efficiency, it is preferable that the potential of the mode terminal MODE is maintained at the potential at which the PFM mode is selected. In the example of FIG. 20, since the mode terminal MODE is not connected anywhere, the operation mode of the boost DC / DC converter 9 is fixed to the PFM mode. As a result, a larger current can be input to the switching terminal SW of the boost DC / DC converter 9, and a larger current can flow to the heater HTR. Note that it should be noted that the configuration of making the potential of such a mode terminal MODE indefinite is only a specific example. Depending on the specifications of the boost DC / DC converter 9, the PFM mode may be selected by setting the potential of the mode terminal MODE to a high level or a low level. In such a case, the potential of the mode terminal MODE should be maintained at an appropriate potential so that the PFM mode is selected.

[0133] <Effect of the aspirator> According to the aspirator 100, the LEDs L1 to L8 as the notification unit are not directly supplied with voltage from the power supply BAT, but are supplied with voltage via the charging IC2. Although the voltage of the power supply BAT fluctuates, the LEDs L1 to L8 can be stably operated because this fluctuating voltage is not directly supplied to the LEDs L1 to L8. Since the brightness of the LED depends on the supplied voltage, the brightness of the LEDs L1 to L8 can be stabilized if a stable voltage can be supplied to the LEDs L1 to L8. In addition, since the charging IC2 whose main function is the charging control of the power supply BAT generates the system power supply voltage Vcc4 and supplies it to the LEDs L1 to L8, a dedicated IC for generating the system power supply voltage Vcc4 is not required. For this reason, miniaturization and cost reduction of the aspirator 100 can be achieved. Also, the charging IC2 BAT boosts the power supply voltage V to generate the system power supply voltage Vcc4, so that high-voltage power can be supplied to the LEDs L1 to L8. Thereby, the LEDs L1 to L8 can be lit with high brightness, and a good user interface can be realized.

[0134] Moreover, according to the aspirator 100, instead of directly supplying power from the power supply BAT to the MCU1, the power is supplied via the charging IC2. Since the charging IC2, whose main function is to control the charging of the power supply BAT, generates the system power supply voltage Vcc0 and supplies it to the MCU1, a dedicated IC for generating the system power supply voltage Vcc0 becomes unnecessary. Therefore, the aspirator 100 can be miniaturized and its cost can be reduced. Also, since a buck-boost DC / DC converter 8 is provided between the charging IC2 and the MCU1, a constant power can be supplied to the MCU1. Thereby, the operation of the MCU1 can be stabilized.

[0135] Moreover, according to the aspirator 100, in the state where the USB connection is made and the LSW3 is closed, the OTG function cannot be executed. Therefore, the power consumption of the power supply BAT during the USB connection can be suppressed, and the amount of power of the available power supply BAT can be increased. Also, immediately after the USB connection is made, since the LSW3 is open, the noise and inrush current immediately after the USB connection are not supplied to the LEDs L1~L8, and the possibility of the LEDs L1~L8 failing can be reduced. Also, immediately after the USB connection is made, the OTG function is executable. Therefore, even in the transient period when the power from the external power supply immediately after the USB connection cannot be supplied to the LEDs L1~L8, the power can be supplied from the power supply BAT to the LEDs L1~L8 by the OTG function. Therefore, the opportunity to operate the LEDs L1~L8 can be increased, and the marketability of the aspirator 100 can be improved.

[0136] Moreover, according to the aspirator 100, since the charging IC2 can also supply the power of the power supply BAT to loads such as the MCU1, a dedicated IC for supplying power to these loads becomes unnecessary, and the cost of the aspirator 100 can be reduced.

[0137] Note that a notification unit different from the LEDs L1~L8 may be further connected to the input terminal VBUS of the charging IC2. For example, the input terminal VBUS of the charging IC2 and the vibration motor M are connected, and the system power supply voltage Vcc4 or the USB voltage V USBso as to supply the vibration motor M, or to connect the input terminal VBUS of the charging IC2 and a speaker (not shown) so that the system power supply voltage Vcc4 or the USB voltage V USB may be supplied to the speaker. Further, an IC other than the notification unit (an IC separate from the IC shown in FIG. 10) may be connected to the input terminal VBUS of the charging IC2. It is preferable that only at least one of the notification unit and this separate IC is connected to the input terminal VBUS of the charging IC2 as a load.

[0138] Further, the suction device 100 has a first discharge path that supplies power from the power supply BAT to the MCU1 via the charging IC2, and a second discharge path that supplies power from the power supply BAT to the heater HTR without passing through the charging IC2. Therefore, the current value to be passed through the first discharge path (the maximum current that can be output from the output terminal SYS of the charging IC2) can be smaller than the current value to be passed through the second discharge path. Therefore, an expensive and large-scale charging IC2 that can withstand a large current is not required, and the suction device 100 can be miniaturized and cost-reduced. The MCU1 and the heater HTR can operate simultaneously, but even when they operate simultaneously, the presence of the first discharge path and the second discharge path can supply sufficient power to them without imposing an excessive burden on the charging IC2.

[0139] Further, according to the suction device 100, the second discharge path through which a large current flows is provided on a substrate different from the first discharge path. Specifically, the first discharge path is provided on the MCU mounting substrate 161, and the second discharge path is provided on the receptacle mounting substrate 162. Therefore, heat concentration on one substrate can be avoided, and the durability of the suction device 100 can be improved.

[0140] Further, according to the suction device 100, all the electronic components that receive power supply from the power supply BAT without passing through the charging IC2 are provided on the same substrate (receptacle mounting substrate 162). Therefore, it is possible to prevent the electrical circuit from becoming complicated.

[0141] Also, according to the aspirator 100, a boost DC / DC converter 9 is provided in the discharge path from the power supply BAT to the heater HTR. Therefore, without worrying about the maximum current of the output terminal SYS of the charging IC2, a large amount of power can be supplied to the heater HTR by the boost DC / DC converter 9. Thus, while realizing cost reduction and miniaturization of the aspirator 100, heating of the rod 500 by the heater HTR can be efficiently performed.

[0142] Also, the aspirator 100 has a discharge path (a path from the receptacle RCP to the LEDs L1 to L8) that discharges to the LEDs L1 to L8 without passing through the charging IC2 when connected via USB. Thereby, compared with the case of providing a path for discharging from an external power supply to the LEDs L1 to L8 via the charging IC2, an expensive and large-scale charging IC2 that can withstand a large current becomes unnecessary. For this reason, cost reduction and miniaturization of the aspirator 100 can be realized.

[0143] Also, in the aspirator 100, the electronic components connected to the input terminal VBUS of the charging IC2 are notification units such as the LEDs L1 to L8 or an IC separate from the illustrated IC. Therefore, it is possible to prevent power from an external power supply, where noise and inrush current are likely to be mixed in, from being supplied to precision electronic components such as the MCU1, the buck-boost DC / DC converter 8, the ROM6, the remaining amount meter IC12, the protection IC10, and the boost DC / DC converter 9, and the durability can be enhanced.

[0144] Also, in the aspirator 100, an overvoltage protection IC11 is provided between the LSW3 and the receptacle RCP. The presence of the overvoltage protection IC11 can block noise and inrush current that may occur at the moment of USB connection not only by the LSW3 but also by the overvoltage protection IC11. Thereby, the durability of the aspirator 100 can be enhanced.

[0145] In the suction device 100, each of the LEDs L1 to L8 is configured not to operate unless the built-in switch of the MCU1 is turned on. Therefore, it is possible to prevent noise and inrush current immediately after USB connection from being supplied to the LEDs L1 to L8, and the possibility of the LEDs L1 to L8 failing can be reduced. In addition, since the switch is built into the MCU1, the durability of the switch can be improved compared to the case where the switch is provided outside the MCU1.

[0146] Among the voltages supplied by the suction device 100 to the load, the larger ones are the system power supply voltage Vcc4 and the drive voltage V bst There is. The system power supply voltage Vcc4 is generated from the power from the external power supply and the power from the power supply BAT respectively. On the other hand, the drive voltage V bst Is generated only from the power of the power supply BAT. In this way, regarding the drive voltage V bst , By adopting a configuration that is not generated from the power of the external power supply, the line through which high-voltage power flows can be simplified. As a result, the complexity of the circuit is avoided, and the cost of the suction device 100 can be reduced. In addition, the power supply path through which the power including the system power supply voltage Vcc4 is supplied and the drive voltage V bst Are on separate substrates. Specifically, the power supply path through which the power including the system power supply voltage Vcc4 is supplied is provided on the MCU mounting substrate 161 and the LED mounting substrate 163. The drive voltage V bst Is provided on the receptacle mounting substrate 162. In this way, by providing the two power supply paths to which high voltage is applied on separate substrates, it is possible to suppress the noise of these power supply paths from overlapping and becoming more difficult to handle noise. Therefore, the suction device 100 can operate stably.

[0147] In addition, in the suction device 100, the power supply connector connected to the power supply BAT, the receptacle RCP connected to the external power supply, and the heater connector Cn connected to the heater HTR are provided on the same substrate (receptacle mounting substrate 162). As a result, the generation of heat at various locations within the suction device 100 is suppressed, so the durability of the suction device 100 is improved.

[0148] As described above, various embodiments have been described with reference to the drawings. Needless to say, the present invention is not limited to such examples. It is obvious that those skilled in the art can conceive of various modifications or corrections within the scope described in the claims, and it is naturally understood that they also belong to the technical scope of the present invention.

[0149] For example, a configuration may be adopted in which a connector for connecting a heater different from the heater HTR (a heater whose heating target is different from that of the heater HTR) or other loads is connected between the output terminal VOUT of the boost DC / DC converter 9 and the ground line.

[0150] In FIG. 10, a parallel circuit of a circuit including the switch S3 and a circuit including the switch S4 and the resistor Rs is connected between the output terminal VOUT of the boost DC / DC converter 9 and the positive electrode side of the heater connector Cn. However, this parallel circuit may be connected between the negative electrode side of the heater connector Cn and the switch S6, and the output terminal VOUT of the boost DC / DC converter 9 and the positive electrode side of the heater connector Cn may be directly connected.

[0151] At least the following matters are described in this specification. Although the corresponding components etc. in the above-described embodiments are shown in parentheses, it is not limited thereto.

[0152] (1) A power supply unit (suction device 100) of an aerosol generating device that heats an aerosol source (rod 500) to generate an aerosol, a power supply (power supply BAT), a connector (receptacle RCP) electrically connectable to an external power supply, a first load (MCU1), including an input terminal (input terminal VBUS) connected to the connector, a charging terminal (charging terminal bat) connected to the power supply, and an output terminal (output terminal SYS) connected to the first load, and a charging IC (charging IC2) configured to convert the power input to the input terminal and output it from the charging terminal A discharge path that connects the power supply and a second load (heater HTR) without passing through the charging IC. The charging IC is configured to supply power input from the power supply to the charging terminal to the first load via the output terminal. A power supply unit for an aerosol generating device.

[0153] (1) According to this, since there is a discharge path that discharges to the second load without passing through the charging IC, the load connected to the output terminal of the charging IC can be reduced. As a result, an expensive and large-scale charging IC that can withstand a large current is not required, and cost reduction and miniaturization of the aerosol generating device can be achieved.

[0154] (2) A power supply unit for an aerosol generating device according to (1), The first load and the second load operate simultaneously. A power supply unit for an aerosol generating device.

[0155] (2) According to this, even if two loads operate simultaneously, the burden on the charging IC does not become excessive. Therefore, sufficient power can be supplied to the two loads and they can operate sufficiently.

[0156] (3) A power supply unit for an aerosol generating device according to (2), A first substrate (MCU-mounted substrate 161), A second substrate (receptacle-mounted substrate 162) separate from the first substrate, The charging IC and the first load are provided on the first substrate, The discharge path is provided on the second substrate. A power supply unit for an aerosol generating device.

[0157] (3) According to this, the path from the power supply to the first load via the charging IC and the path from the power supply to the second load exist on different substrates. Therefore, heat concentration on one substrate can be avoided and the durability of the aerosol generating device can be improved.

[0158] (4) The power supply unit of the aerosol generating device according to any one of (1) to (3), The power consumption of the first load is less than that of the second load, The power supply unit of the aerosol generating device.

[0159] (4) According to this, the charging IC does not need to discharge to the second load that consumes a large amount of power. Therefore, a cheaper and smaller charging IC can be used, and cost reduction and miniaturization of the aerosol generating device can be achieved.

[0160] (5) The power supply unit of the aerosol generating device according to (4), The second load consumes the most power among the loads provided in the aerosol generating device, The power supply unit of the aerosol generating device.

[0161] (5) According to this, the charging IC does not need to discharge to the second load that consumes the most power. Therefore, a cheaper and smaller charging IC can be used, and cost reduction and miniaturization of the aerosol generating device can be achieved.

[0162] (6) The power supply unit of the aerosol generating device according to any one of (1) to (5), The discharge path includes a boost converter (boost DC / DC converter 9) capable of boosting the output voltage (power supply voltage V BAT ) of the power supply and applying it to the second load, The power supply unit of the aerosol generating device.

[0163] (6) According to this, while improving the operating efficiency of the second load, it is not necessary to pass the boosted or boosted large power through the charging IC. Therefore, while reducing the cost and size of the aerosol generating device, the effect of the second load can be increased.

[0164] (7) The power supply unit of the aerosol generating device according to (6), which is connected to a node between the power supply and the boost converter in the discharge path and includes a third load (protection IC 10) that operates by the power supplied from the node, The power supply unit of the aerosol generating device.

[0165] According to (7), since there is a discharge path that discharges to the third load without passing through the charging IC, an expensive and large-scale charging IC that can withstand a large current becomes unnecessary. Therefore, cost reduction and miniaturization of the aerosol generating device can be achieved.

[0166] (8) The power supply unit of the aerosol generating device according to (7), a power supply connector to which the power supply is connected, a first substrate (MCU-mounted substrate 161), a second substrate (receptacle-mounted substrate 162) separate from the first substrate, and the charging IC is provided on the first substrate, the discharge path and the third load are provided on the second substrate, The power supply unit of the aerosol generating device.

[0167] According to (8), the discharge route that does not pass through the charging IC is aggregated on one substrate. Therefore, it is possible to suppress the complication of the circuit on the substrate, and cost reduction and miniaturization of the aerosol generating device can be achieved.

[0168] (9) The power supply unit of the aerosol generating device according to any one of (1) to (8), which is connected between the output terminal and the first load and includes a voltage converter (buck-boost DC / DC converter 8) configured to output a constant voltage, The power supply unit of the aerosol generating device.

[0169] According to (9), since a constant voltage can be supplied to the first load, the operation of the first load is stabilized.

[0170] (10) The power supply unit of the aerosol generating device according to (9), The charging IC can supply the power input to the input terminal to the first load via the output terminal (V USB Power pass function), The voltage converter, When the power input from the charging terminal is output from the output terminal (V BAT When the power pass function is effective), it boosts or buck-boosts the voltage input from the charging IC and outputs the constant voltage, When the power input from the input terminal is output from the output terminal (V USB When the power pass function is effective), it is configured to buck-boost the voltage input from the charging IC and output the constant voltage, The power supply unit of the aerosol generating device.

[0171] According to (10), a constant voltage is supplied to the first load regardless of whether the external power supply or the power supply is used, so that the operation of the first load is stabilized.

[0172] As described above, various embodiments have been described with reference to the drawings, but it goes without saying that the present invention is not limited to such examples. It is obvious that those skilled in the art can conceive of various modification examples or correction examples within the scope described in the claims, and it is naturally understood that they also belong to the technical scope of the present invention. Further, within the scope not departing from the gist of the invention, the components in the above embodiments may be arbitrarily combined.

[0173] Note that this application is based on a Japanese patent application filed on May 10, 2021 (Japanese Patent Application No. 2021-079870), the content of which is incorporated herein by reference.

Explanation of Reference Numerals

[0174] 100 Suction device 1 MCU HTR Heater BAT power supply Cn heater connector RCP receptacle 2 charging IC L1~L8 LED

Claims

【Claim 1】 An inhaler that heats a rod containing an aerosol source to generate an aerosol, comprising: a heating unit; a power source; a case provided with an opening into which the rod can be inserted, and housing the heating unit and the power source; a connector electrically connectable to an external power source; a first load configured to control heating by the heating unit; a charging IC including a first terminal electrically connected to the connector and into which power supplied from the external power source is input, a second terminal electrically connected to the power source, and a third terminal electrically connected to the first load; a first discharge path for supplying power from the power source to the heating unit without passing through the charging IC; a second discharge path for supplying power from the power source to the first load through the charging IC. The inhaler is provided with these components.

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