Luminaire

Abstract

To provide a luminaire that prevents a hot spot phenomenon of a light-emitting element and includes a novel structure in which a phosphor layer is not exposed to the outside.SOLUTION: A luminaire includes: a substrate including first to fourth side faces; a resin layer comprising a plurality of grooves including bottom faces, emission faces, and inclined faces; a plurality of light-emitting elements arranged in the grooves and emitting first light; reflection layers formed on the inclined faces; and a diffusion layer arranged on the resin layer, wherein the plurality of grooves are formed extending from the third side face to a direction of the fourth side face and arrayed from the first side face to a direction of the second side face, and the plurality of grooves include a first groove most adjacent to the first side face of the substrate and a second groove adjacent to the first groove. The first light emitted from the light-emitting element arranged in the second groove is reflected by the reflection layer formed on an inclined face of the second groove to pass through an emission surface of the second groove, and then reflected by the reflection surface formed on an inclined face of the first groove to pass through the resin layer and the diffusion layer.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] Embodiments of the invention relate to a lighting device that can provide a uniform surface light source and improve the appearance image.

Background Art

[0002] Common lighting applications include not only vehicle lighting but also backlights for displays and signboards.

[0003] Light-emitting elements, such as light-emitting diodes (LEDs), have advantages such as low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness compared to existing light sources such as fluorescent lamps and incandescent lamps. Such light-emitting elements are applied to various lighting devices such as various display devices, indoor lights, or outdoor lights.

[0004] Recently, as vehicle lighting, lamps employing light-emitting diodes have been proposed. Compared with incandescent lamps, light-emitting diodes are advantageous in that they consume less power. Vehicle lighting can emit a surface light source by providing a resin layer and a diffusion layer on the light-emitting diode, and can emit light of a phosphor wavelength contained in the phosphor layer to the outside by disposing a phosphor layer on the light-emitting diode. However, in conventional vehicle lighting, a hot spot phenomenon of the light-emitting diode occurs during lighting, and the color of the phosphor layer is exposed to the outside when not lit, affecting the appearance image. Therefore, in order to improve the appearance image of vehicle lighting, when an ink layer is disposed on the upper part of the light-emitting diode or the content of beads in the diffusion layer is increased, a problem occurs in that the light extraction efficiency of the light-emitting diode decreases.

Summary of the Invention

Problems to be Solved by the Invention

[0005] Embodiments can provide a lighting device including a new structure that prevents the hot spot phenomenon of the light-emitting element and does not expose the phosphor layer to the outside.

[0006] The embodiment can provide an illumination device that emits a uniform surface light source without reducing the light extraction efficiency.

Means for Solving the Problem

[0007] The embodiment includes a substrate including a first side surface, a second side surface opposite to the first side surface, a third side surface connecting the first side surface and the second side surface, and a fourth side surface opposite to the third side surface, a bottom surface with the upper surface of the substrate exposed, an emission surface extending from the bottom surface, and a plurality of grooves including an inclined surface inclined at a predetermined angle from the emission surface, a resin layer provided with the plurality of grooves, a plurality of light-emitting elements disposed on the substrate in the grooves and emitting first light, a reflection layer formed on the inclined surface, and a diffusion layer disposed on the resin layer, the plurality of grooves are formed to extend from the third side surface to the fourth side surface direction of the substrate and are arranged in the first side surface to the second side surface direction of the substrate, the plurality of grooves include a first groove adjacent to the first side surface of the substrate and a second groove adjacent to the first groove, and the first light emitted from the light-emitting element disposed in the second groove is reflected by the reflection layer formed on the inclined surface of the second groove, passes through the emission surface of the second groove, and then is reflected by the reflection layer formed on the inclined surface of the first groove and passes through the resin layer and the diffusion layer. The illumination device can include this.

[0008] The illumination device according to the embodiment can include a phosphor layer disposed on the light-emitting element.

[0009] The illumination device according to the embodiment can include a phosphor layer formed on the lower surface of the reflection layer.

[0010] The illumination device according to the embodiment can include a phosphor layer formed on the upper surface of the reflection layer.

[0011] The illumination device according to the embodiment may be such that the phosphor layer is formed on the emission surface of the first groove.

[0012] The illumination device according to the embodiment may be such that the emission surface has a shape bulging from the second side surface to the first side surface direction of the substrate.

[0013] The lighting device according to the embodiment may include a reflecting member extending in a direction parallel to the upper surface of the substrate from the reflecting layer disposed in a region where the light emitting surface and the inclined surface are connected.

[0014] The first light emitted from the light emitting element disposed in the second groove in the lighting device according to the embodiment can be converted into second light having a wavelength different from that of the first light by the phosphor layer and pass through the diffusion layer.

Advantages of the Invention

[0015] The embodiment can provide a lighting device capable of improving the appearance image because the phosphor layer is not exposed to the outside when the light is not lit.

[0016] The embodiment can provide a lighting device that prevents the hot spot phenomenon of the light emitting element and emits a uniform surface light source.

Brief Description of the Drawings

[0017]

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Mode for Carrying Out the Invention

[0018] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0019] However, the technical idea of the present invention is not limited to the partial embodiments described, but can be embodied in various forms, and within the scope of the technical idea of the present invention, the components between the embodiments can be selectively combined or replaced for use. Also, the terms (including technical and scientific terms) used in the embodiments of the present invention are, unless specifically defined and described, construed to have the meaning generally understood by those with ordinary knowledge in the technical field to which the present invention pertains, and terms generally used as defined in a dictionary can be construed to have their meaning in consideration of the meaning in the context of the relevant technology. Further, the terms used in the embodiments of the present invention are for the purpose of explaining the embodiments and are not intended to limit the present invention.

[0020] In this specification, the singular form can also include the plural form unless otherwise specifically limited in the description, and when described as "at least one (or one or more) of A, B, and C", it can include one or more of all the combinations that can be combined with A, B, and C. Also, in the description of the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. can be used. Such terms are for distinguishing the component from other components, and the essence or order of the component is not limited by such terms. When a component is described as being "connected", "coupled", or "joined" to another component, it includes both the case where the component is directly connected or joined to the other component and the case where one or more additional components are further "connected", "coupled", or "joined" between the components.

[0021] Also, when described as being formed or disposed "above or below" each component, "above or below" includes not only the case where two components are in direct contact, but also the case where one or more additional components are formed or disposed between the two components. Also, when expressed as "above or below", it can include the meaning not only in the upper direction but also in the lower direction with respect to one component as a reference.

[0022] The lighting device according to the present invention is applicable to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, or industrial lighting devices. For example, when applied to vehicle lamps, it can be applied to headlamps, side marker lamps, side mirror lamps, fog lamps, tail lamps, brake lamps, daytime running lamps, vehicle interior lighting, door scuff plates, rear combination lamps, backup lamps, etc. The lighting device of the present invention is also applicable to indoor and outdoor advertising devices, display devices, and various electric vehicle fields. In addition, it can be said that it is applicable to all lighting-related fields and advertising-related fields that are currently developed and commercialized or can be realized by future technological developments.

[0023] FIG. 1 is a plan view of a lighting device 1000 according to a first embodiment, FIG. 2 is a side view showing a resin layer in region B according to the first embodiment, and FIG. 3 is a cross-sectional view of the lighting device 1000 according to the first embodiment taken along A - A'. As shown in FIGS. 1 to 3, the lighting device 1000 according to the first embodiment includes a circuit board 100, a resin layer 300 disposed on the circuit board 100 and having a plurality of grooves 310, 320, 330, 340, 350, 360, 370 including bottom surfaces 311, 321, 331, 341, 351, 361, 371, inclined surfaces 312, 322, 332, 342, 352, 362, 372, and emission surfaces 313, 323, 333, 343, 353, 363, 373, a diffusion layer 500 disposed on the resin layer 300, a plurality of light-emitting elements 200 disposed in the plurality of grooves 310, 320, 330, 340, 350, 360, 370 of the resin layer 300, a phosphor layer 210 disposed on the light-emitting elements 200, and reflection layers 410, 420, 430, 440, 450, 460, 470 formed on the inclined surfaces 312, 322, 323, 343, 353, 363, 373.

[0024] As shown in FIGS. 1 to 3, the lighting device 1000 can emit the light emitted from the light-emitting element 200 as a surface light source. A plurality of the light-emitting elements 200 may be arranged on the circuit board 100. In the lighting device 1000, the plurality of light-emitting elements 200 may be arranged in N columns (N is an integer of 1 or more) or / and M rows (M is an integer of 1 or more). The plurality of light-emitting elements 200 may be arranged in N columns and M rows (N and M are integers of 2 or more) as shown in FIG. 1.

[0025] The lighting device 1000 according to the first embodiment is applicable to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, in the case of a lighting module applied to a vehicle lamp, it can be applied to a headlamp, a side marker lamp, a side mirror lamp, a fog lamp, a tail lamp, a turn signal lamp, a back-up lamp, a stop lamp, a daytime running light, vehicle interior lighting, a door scuff, a rear combination lamp, a back-up lamp, etc.

[0026] Referring to FIGS. 1 and 3, the circuit board 100 can function as a base member or a support member located under the plurality of light-emitting elements 200, the resin layer 300, and the diffusion layer 500. The circuit board 100 may include a printed circuit board (PCB). For example, the circuit board 100 may include at least one of a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or an FR-4 substrate.

[0027] The upper surface of the circuit board 100 has an X-axis - Y-axis plane, and the thickness of the circuit board 100 may be a height in the Z direction orthogonal to the X direction and the Y direction. Here, the X direction is the first direction, the Y direction is the second direction orthogonal to the X direction, and the Z direction may be the third direction orthogonal to the X direction and the Y direction.

[0028] The circuit board 100 includes a wiring layer (not shown) on the upper part, and the wiring layer is electrically connected to the light-emitting element 200. A reflective layer or a protective layer is disposed on the upper part of the circuit board 100, and the reflective layer or the protective layer can protect the wiring layer. The plurality of light-emitting elements 200 may be connected in series, parallel, or series-parallel by the wiring layer of the circuit board 100. Two or more of the plurality of light-emitting elements 200 may be connected in series or parallel in a group, or the groups may be connected in series or parallel.

[0029] The length x1 of the circuit board 100 in the first direction (X direction) and the length y1 in the second direction (Y direction) may be different. For example, the length x1 in the first direction X may be arranged to be longer than the length y1 in the second direction. The length x1 in the first direction X may be arranged to be two times or more the length y1 in the second direction Y. The thickness z1 of the circuit board 100 can have a range of 1.0 mm or less, for example, 0.5 mm to 1.0 mm. Since the thickness z1 of the circuit board 100 is provided to be thin, the thickness of the lighting module is not increased. Since the circuit board 100 is provided with a thickness z1 of 1.0 mm or less, a flexible module can be supported. The distance from the lower surface of the circuit board 100 to the upper surface of the diffusion layer 500 may be the thickness of the lighting device 1000.

[0030] The thickness z4 of the lighting device 1000 may be equal to or less than 1 / 3 of the shorter length among the lengths x1 and y1 of the circuit board 100 in the first direction (X direction) and the second direction (Y direction), but is not limited thereto. The thickness z4 of the lighting device 1000 may be 5.5 mm or less from the bottom of the circuit board 100, or may have a range of 4.5 mm to 5.5 mm or 4.5 mm to 5 mm. The thickness z4 of the lighting device 1000 may be the linear distance between the lower surface of the circuit board 100 and the upper surface of the diffusion layer 500. The thickness z4 of the lighting device 1000 may have a range of 220% or less, for example, 180% to 220% of the thickness z2 of the resin layer 300. Since the thickness z4 of the lighting device 1000 is provided to be 5.5 mm or less, it can be provided as a flexible and slim surface light source module.

[0031] When the thickness z4 of the lighting device 1000 is thinner than the above range, the light diffusion space decreases and hot spots occur. When it is larger than the above range, the spatial installation constraints and the degree of freedom of design decrease due to the increase in the module thickness. The embodiment provides the lighting device 1000 with a thickness z4 of 5.5 mm or less or 5 mm or less, so as to provide a lighting device capable of a curved surface structure, thereby reducing the degree of freedom of design and the spatial constraints. The ratio of the thickness z4 of the lighting device 1000 to the length y1 of the second direction Y of the lighting device 1000 may be 1:m, and may have a ratio relationship of m≥1. The m is a natural number of at least 1, and the number of rows of the light emitting elements 200 is an integer smaller than m. For example, when the m is more than 4 times larger than the thickness z4 of the lighting device 1000, the light emitting elements 200 may be arranged in 4 rows.

[0032] The circuit board 100 is provided with a connector 301 in part and can supply power to the light-emitting element 200. In the circuit board 100, the region 302 where the connector 301 is disposed may be the same as or smaller than the length y1 in the second direction Y of the circuit board 100 as the region where the resin layer 300 is not formed. The connector 301 may be disposed on a part of the upper surface or a part of the lower surface of the circuit board 100. When the connector 301 is disposed on the bottom surface of the circuit board 100, the region may be removed. The circuit board 100 may have a rectangular top view shape, a square shape, or other polygonal shapes, and may have a bar shape with a curved surface shape. The connector 301 may be a terminal connected to the light-emitting element 200, a female connector, or a male connector.

[0033] The protective layer or the reflective layer may include a member having a solder resist material, and the solder resist material can reflect incident light as a white material.

[0034] As another example, the circuit board 100 may include a transparent material. Since the circuit board 100 made of the transparent material is provided, the light emitted from the light-emitting element 200 is emitted in the upper surface direction and the lower surface direction of the circuit board 100.

[0035] The light-emitting element 200 is disposed on the circuit board 100. The light-emitting element 200 has an upper surface S1 and a plurality of side surfaces S2. The upper surface S1 faces the lower surface of the diffusion layer 500, and light is emitted from the light-emitting element 200 in the direction of the diffusion layer 500. Most of the light is emitted through the upper surface S1 of the light-emitting element 200. In addition, the plurality of side surfaces S2 of the light-emitting element 200 include at least four side surfaces, and light is emitted in the lateral direction of the light-emitting element 200 through the side surfaces. Such a light-emitting element 200 may be disposed in a flip-chip form on the circuit board 100 as an LED chip that emits light from at least five surfaces. The light-emitting element 200 may be formed with a thickness of 0.3 mm or less.

[0036] In the light-emitting element 200 according to the embodiment, the distribution of the emission angle becomes large due to five-sided emission. The light-emitting element 200 is arranged on the circuit board 100 by flip-chip. The interval x2 in the first direction X between the light-emitting elements 200 may be the same as or larger than the thickness z2 of the resin layer 300 (x2 ≤ z2). The interval x2 between the light-emitting elements 200 may be, for example, 2.5 mm or more and can be variable according to the size of the LED chip.

[0037] The light-emitting element 200 can emit at least one of blue, red, green, ultraviolet (UV), or infrared as a light-emitting diode (LED) chip. The light-emitting element 200 can emit at least one of, for example, blue, red, and green. The light-emitting element 200 is electrically connected to the circuit board 100, but is not limited thereto.

[0038] A phosphor layer 210 is arranged on the light-emitting element 200. The phosphor layer 210 can cover the upper surface of the light-emitting element 200. The phosphor layer 210 can contain a transparent substance. The phosphor layer 210 can contain a transparent insulating substance. The phosphor layer 210 may be made of a silicon material or a silicon material having different chemical bonds. Silicon has physical properties such as the thermal stability, chemical stability, wear resistance, and glossiness of inorganic substances and the reactivity, solubility, elasticity, and processability of organic substances as a polymer in which inorganic silicon and organic carbon are bonded. Silicon can include general silicon and fluorine silicon with an increased fluorine ratio. Increasing the fluorine ratio of fluorine silicon has the effect of improving moisture resistance.

[0039] The phosphor layer 210 may include wavelength conversion means for receiving the light emitted from the light emitting element 200 and providing wavelength-converted light. For example, the phosphor layer 210 may include at least one selected from the group including phosphors, quantum dots, etc. The phosphor or quantum dot can emit blue, green, or red light. The phosphor is uniformly disposed inside the phosphor layer 210. The phosphor can include a fluoride compound phosphor, and for example, can include at least one of an MGF-based phosphor, a KSF-based phosphor, or a KTF-based phosphor.

[0040] Referring to FIGS. 2 and 3, the resin layer 300 is disposed on the circuit board 100 and the light emitting element 200. The resin layer 300 can diffuse the light emitted from the light emitting element 200.

[0041] The resin layer 300 can include a plurality of grooves 310, 320, 330, 340, 350, 360, 370 each including a bottom surface 311, 321, 333, 341, 351, 361, 371, an inclined surface 312, 322, 332, 342, 352, 362, 372, and an exit surface 313, 323, 333, 343, 353, 363, 373.

[0042] The plurality of grooves 310, 320, 330, 340, 350, 360, 370 may be arranged at a predetermined interval in a first direction X which is from the first side surface 1 to the second side surface 2 of the circuit board 100. The plurality of grooves 310, 320, 330, 340, 350, 360, 370 may be formed by extending in a second direction Y which is from the third side surface 3 to the fourth side surface 4 of the circuit board 100.

[0043] The first groove 310 disposed adjacent to the first side surface 1 of the circuit board 100 can include a first bottom surface 311 where the upper surface of the circuit board 100 is exposed, a first exit surface 313 extending from the first bottom surface 311, and a first inclined surface 312 extending at a predetermined angle from the first exit surface 313.

[0044] The first bottom surface 311 can expose a part of the upper surface of the circuit board 100, and the plurality of light-emitting elements 200 are arranged on a part of the upper surface region of the circuit board 100 exposed by the first bottom surface 311. The first light-emitting surface 313 may extend from the first bottom surface 311. The first light-emitting surface 313 may be formed by extending vertically from the first bottom surface 311. The first inclined surface 312 can be inclined at a predetermined angle from the first light-emitting surface 313. The first inclined surface 312 can be inclined at a predetermined angle from the first bottom surface 311. A first reflective layer 410 is disposed on the first inclined surface 312. Among the plurality of grooves 310, 320, 330, 340, 350, 360, 370, the remaining grooves except the first groove 310 may be formed in the same shape as the first groove 310.

[0045] Referring to FIG. 3, a process in which light emitted from the light-emitting elements 200 disposed in the plurality of grooves 310, 320, 330, 340, 350, 360, 370 travels above the resin layer 300 will be described.

[0046] For example, the first light L1 emitted from the light-emitting element 200 disposed in the first groove 310 closest to the first side surface 1 of the circuit board 100 passes through the phosphor layer 210 disposed on the upper surface of the light-emitting element 200, then travels above the light-emitting element 200, and is converted by the phosphor layer 210 into a second light L2 having a wavelength different from that of the first light L1. The second light L2 travels above the light-emitting element 200 and is reflected in the direction of the first light-emitting surface 313 by the first reflective layer 410 disposed on the first inclined surface 312. The third light L3 passing through the first light-emitting surface 313 is diffused by the resin layer 300 disposed on the side surface of the first groove 310, and travels to the upper part of the resin layer 300 and the side surface of the resin layer 300 disposed on the first side surface 1 of the circuit board 100 and is emitted to the outside of the lighting device 1000. At this time, since the third light L3 is only reflected by the first reflective layer 410 disposed on the first inclined surface 312, it has the same wavelength as the second light L2.

[0047] Then, the first light L1 emitted from the light-emitting elements 200 disposed in the remaining plurality of grooves 3n0 (n≥2, n is an integer) excluding the first groove 310 passes through the phosphor layer 210 disposed on the upper surface of the light-emitting elements 200, then travels above the light-emitting elements 200, and is converted by the phosphor layer 210 into second light L2 having a wavelength different from that of the first light L1. The second light L2 travels above the light-emitting elements 200 and is reflected by the nth reflective layer 4n0 in the direction of the nth exit surface 3n3, and the third light L3 passing through the nth exit surface 3n3 is reflected above the resin layer 300 by the (n-1)th reflective layer 4(n-1)0 adjacent to the nth exit surface 3n3, and the fourth light L4 is emitted to the outside. At this time, since the fourth light L4 and the third light L3 are only reflected by the nth reflective layer 4n0 or the (n-1)th reflective layer 4(n-1)0, they can have the same wavelength as the second light L2.

[0048] As described above, the light-emitting elements 200 are disposed in the plurality of grooves 310, 320, 330, 340, 350, 360, 370 of the resin layer 300, and the light emitted from the light-emitting elements 200 does not directly travel above the resin layer 300, but can be reflected by the reflective layer 400 disposed on the inclined surfaces 312, 322, 332, 342, 352, 362, 372 of the plurality of grooves 310, 320, 330, 340, 350, 360, 370 and travel above the resin layer 300. The lighting device 1000 according to the first embodiment can emit a uniform surface light source.

[0049] And, the reflective layer 400 is formed on the inclined surfaces 312, 322, 332, 342, 352, 362, 372 of the plurality of grooves 310, 320, 330, 340, 350, 360, 370 and overlaps with the light-emitting elements 200 in the vertical direction. Therefore, the light-emitting elements 200 cannot be visually recognized from the outside by the reflective layer 400, preventing the generation of hot spots of the light-emitting elements 200 when the lighting device is lit, and since the phosphor layer 210 disposed on the light-emitting elements 200 cannot be visually recognized from the outside when the lighting device is unlit, the appearance image of the lighting device 1000 can be improved.

[0050] The resin layer 300 may be made of a transparent resin material, such as a UV (Ultra Violet) resin, silicon, or epoxy resin. The resin layer 300 may be a diffusion layer 500 or a molding layer without a diffusing agent. For the UV resin, for example, a resin (oligomer type) mainly made of urethane acrylate oligomer as the main material can be used. For example, urethane acrylate oligomer, which is a synthetic oligomer, can be used. The main material can further contain a monomer mixed with low-boiling-point diluting reactive monomers such as IBOA (isobornyl acrylate), HBA (Hydroxybutyl Acrylate), HEMA (Hydroxy Metaethyl Acrylate), etc., and a photoinitiator (e.g., 1-hydroxycyclohexyl phenyl-ketone, Diphenyl), Diphwnyl(2,4,6-trimethylbenzoyl phosphine oxide), etc. or an antioxidant can be mixed as an additive. The UV resin can be composed of a composition containing 10-21% oligomer, 30-63% monomer, and 1.5-6% additive. In this case, the monomer can be composed of a mixture of 10-21% IBOA (isobornyl Acrylate), 10-21% HBA (Hydroxybutyl Acrylate), and 10-21% HEMA (Hydroxy Metaethyl Acrylate). The additive can be a mixture containing 1-5% photoinitiator to initiate the photoreaction and 0.5-1% antioxidant to improve the yellowing phenomenon. The formation of the resin layer using the above-described composition can form a layer with a resin such as a UV resin instead of a light guide plate, enabling adjustment of the refractive index and thickness, and can satisfy all of the adhesion characteristics, reliability, and mass production speed using the above-described composition.

[0051] The reflective layer 400 is formed in the form of a film such as a silver (Ag) film, and can be made of a synthetic resin containing a white pigment dispersed therein for the property of promoting light reflection and dispersion. For example, as the white pigment, any one of titanium oxide, aluminum oxide, zinc oxide, carbonate, barium sulfate, and calcium carbonate can be included. For example, as the synthetic resin, any one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), acrylic, polycarbonate, polystyrene, polyolefin, cellulose acetate, and vinyl chloride can be included.

[0052] The diffusion layer 500 is disposed on the resin layer 300. The diffusion layer 500 can be attached onto the resin layer 300 by applying a predetermined pressure or pressure / heat. The diffusion layer 500 is adhered to the resin layer 300 by the adhesive force of the resin layer 300 itself without a separate adhesive, so that the process of separately attaching an adhesive in the manufacturing process of the lighting device 1000 according to the embodiment can be reduced, and it is not necessary to use an adhesive harmful to the human body, thus reducing wasteful use of processes and materials.

[0053] The diffusion layer 500 is adhered to the upper surface of the resin layer 300. When the light intensity is high, the specific color of the diffusion layer 500 may not be color-mixed, so the light can be diffused and mixed. The material of the diffusion layer 500 may be a light-transmissive material. For example, the diffusion layer 500 can include at least one of a polyester (PET) film, a PMMA (Poly Methyl Methacrylate) material, and a PC (Poly Carbonate). The diffusion layer 500 may be provided as a film of a resin material such as silicon or epoxy. The diffusion layer 500 can include a single layer or multiple layers.

[0054] The thickness z3 of the diffusion layer 500 is 25 μm or more, and can have, for example, a range of 25 to 250 μm or a range of 100 to 250 μm. Such a diffusion layer 500 can provide the light incident within the range of the thickness z3 as a uniform surface light source.

[0055] As described above, in the lighting device 1000 according to the first embodiment, the light emitted from the light-emitting element 200 is not directly emitted to the outside, but is reflected by the reflection layer 400 and then emitted to the outside, so that a uniform surface light source can be emitted.

[0056] FIG. 4 is a cross-sectional view taken along line A-A' of a lighting device 1100 according to a modified example of the first embodiment. In FIG. 4, the content already described in the lighting device 1000 according to the first embodiment illustrated in FIGS. 1 to 3 can be adopted.

[0057] Referring to FIG. 4, in the lighting device 1100 according to the modified example of the first embodiment, the first emission surface 313 of the first groove 310 is formed in a concave shape from the second side surface 2 to the first side surface 1 of the circuit board 100. The first emission surface 313 may be formed in a concave lens shape, but is not limited thereto.

[0058] The light emitted from the light-emitting element 200 disposed in the first groove 310 can be reflected by the first reflection layer 410 disposed above the light-emitting element 200 and travel to the first emission surface 313. At this time, since the first emission surface 313 is in a concave lens shape, the efficiency of the light passing through the first emission surface 313 can be increased.

[0059] And the second emission surface 323 to the seventh emission surface 373 may be formed in the same shape as the first emission surface 313. Therefore, the light emitted from the light-emitting elements 200 disposed in the second groove 320 to the seventh groove 370 travels and is emitted to the outside in the same manner as the light emitted from the light-emitting elements 200 disposed in the second groove 320 to the seventh groove 370 according to the basic example of the first embodiment.

[0060] Therefore, in the lighting device 1100 according to the modification of the first embodiment, it is possible to provide a lighting device in which the emission surfaces 313, 323, 333, 343, 353, 363, 373 are formed in a concave lens shape and the light extraction efficiency is improved.

[0061] FIG. 5 is a cross-sectional view of the lighting device 1200 according to the modification of the first embodiment taken along the line A-A'. In FIG. 5, the content already described in the lighting devices 1000 and 1100 according to the first embodiment illustrated in FIGS. 1 to 4 can be adopted.

[0062] Referring to FIG. 5, the lighting device 1200 according to the modification of the first embodiment may include a first reflecting member 411 that extends from the first reflecting layer 410 and extends in a direction parallel to the upper surface of the circuit board 100.

[0063] The first reflecting member 411 may be formed by extending from the end of the first reflecting layer 410. The first reflecting member 411 may be formed by protruding from the end of the first reflecting layer 410 in a direction orthogonal to the first emission surface 313. The first emission surface 313 and the first reflecting member 411 may not overlap in the vertical direction. The first reflecting member 411 may be formed by extending in a direction parallel to the upper surface of the circuit board 100 from the first reflecting layer 410 disposed in a region where the first emission surface 313 and the first inclined surface 312 are connected. The first reflecting member 411 may be integrally formed with the first reflecting layer 410, but is not limited thereto. The first reflecting member 411 may be formed of the same material as the first reflecting layer 410, but is not limited thereto.

[0064] The light emitted from the light-emitting element 200 disposed in the first groove 310 can either be reflected by the first reflective layer 410 and travel above the resin layer 300 and the diffusion layer 500, or directly travel above the resin layer 300 and the diffusion layer 500 without being reflected by the first reflective layer 410. Since the intensity of the light reflected by the first reflective layer 410 is different from the intensity of the light directly transmitted from the light-emitting element 200 without being reflected, this causes a decrease in the uniformity of the light. Therefore, the first reflective member 411 can reflect the light directly transmitted from the light-emitting element 200 or prevent the light from traveling. At this time, the first reflective member 411 extends from the end of the first reflective layer 410 to increase the uniformity of the light on the front outside the lighting device 1200, and further prevent the light-emitting element 200 from being recognized on the side surface, thereby improving the appearance image of the lighting device 1200.

[0065] And, similar to the arrangement of the first reflective member 411 at the end of the first reflective layer 410, the second reflective member 421 to the seventh reflective member 471 are arranged at the ends of the second reflective layer 420 to the seventh reflective layer 470. Therefore, the light emitted from the light-emitting elements 200 disposed in the second groove 320 to the seventh groove 370 travels and is emitted to the outside in the same process as the light emitted from the light-emitting elements 200 disposed in the second groove 320 to the seventh groove 370 according to the basic example of the first embodiment.

[0066] Therefore, in the lighting device 1200 according to the modification of the first embodiment, the first reflective member 411 to the seventh reflective member 417 prevent the light from traveling above the resin layer 300 and the diffusion layer 500 in the regions adjacent to the exit surfaces 313, 323, 333, 343, 353, 363, 373, provide a lighting device 1200 having a uniform surface light source, and prevent the light-emitting element 200 from being recognized from the outside, thereby improving the appearance image of the lighting device 1200.

[0067] FIG. 6 is a cross-sectional view of the lighting device 1300 according to a modified example of the first embodiment taken along the line A-A'. In FIG. 6, the content already described in the lighting devices 1000, 1100, and 1200 according to the first embodiment illustrated in FIGS. 1 to 5 can be adopted.

[0068] In the lighting device 1300 according to the modified example of the first embodiment, the emission surfaces 313, 323, 333, 343, 353, 363, and 373 of the plurality of grooves 310, 320, 330, 340, 350, 360, and 370 are formed in a concave shape from the second side surface 2 to the first side surface 1 of the circuit board 100, and the reflecting members 411, 421, 431, 441, 451, 461, and 471 that extend from the reflecting layer 400 and extend in a direction parallel to the upper surface of the circuit board 100 can be included. At this time, the reflecting members 411, 421, 431, 441, 451, 461, and 471 can overlap in a direction perpendicular to the emission surfaces 3, 323, 333, 343, 353, 363, and 373, different from the modified example of the first embodiment in FIG. 5.

[0069] FIG. 7 is a cross-sectional view of the lighting device 1400 according to a modified example of the first embodiment taken along the line A-A'. In FIG. 7, the content already described in the lighting devices 1000, 1100, 1200, and 1300 according to the first embodiment illustrated in FIGS. 1 to 6 can be adopted.

[0070] As shown in FIG. 7, in the lighting device 1400 according to the modified example of the first embodiment, a part of the inclined surfaces 312, 322, 332, 342, 352, 362, and 372 that overlap with the light-emitting elements 200 arranged in the plurality of grooves 310, 320, 330, 340, 350, 360, and 370 in the first direction X is formed as a curved surface. Therefore, a part of the reflecting layer 400 formed in the regions adjacent to the second emission surface 323 to the seventh emission surface 373 is formed as a curved surface. Therefore, since the light emitted from the light-emitting elements 200 arranged in the plurality of grooves 310, 320, 330, 340, 350, 360, and 370 is not reflected upward by the reflecting layer 400 formed as a curved surface, the hot spot phenomenon that may occur in the regions adjacent to the second emission surface 323 to the seventh emission surface 373 can be prevented.

[0071] FIG. 8 is a cross-sectional view taken along the line A-A' of the lighting device 2000 according to the second embodiment. In FIG. 8, the content already described in the lighting devices 1000, 1100, 1200, 1300, 1400 according to the first embodiment illustrated in FIGS. 1 to 7 can be adopted.

[0072] Referring to FIG. 8, the lighting device 2000 according to the second embodiment may include a phosphor layer 210 disposed on the inclined surfaces 312, 322, 332, 342, 352, 362, 372 and a reflective layer 400 disposed on the phosphor layer 210. The reflective layer 400 can be in contact with the entire upper surface of the phosphor layer 210.

[0073] The process in which the light emitted from the light-emitting element 200 disposed in the plurality of grooves 310, 320, 330, 340, 350, 360, 370 travels above the resin layer 300 will be described.

[0074] For example, the first light L1 emitted from the light-emitting element 200 disposed in the first groove 310 is directed upward of the light-emitting element 200 and enters the phosphor layer 210 formed on the first inclined surface 312. The first light L1 incident on the phosphor layer 210 is converted into a second light L2 having a wavelength different from that of the first light L1, and then the first reflective layer 410 disposed on the phosphor layer 210 can reflect the second light L2 in the direction of the first exit surface 313 simultaneously with the conversion. The second light L2 passing through the first exit surface 313 is diffused by the resin layer 300 disposed on the side surface of the first groove 310, travels above and on the side surface of the resin layer 300, and is emitted to the outside of the lighting device 2000.

[0075] Then, the first light L1 emitted from the light-emitting elements 200 disposed in the remaining plurality of grooves 3n0 (n≥2, n is an integer) excluding the first groove 310 travels above the light-emitting elements 200 and is incident on the phosphor layer 210 formed on the n-th inclined surface 3n2. After the first light L1 incident on the phosphor layer 210 is converted into the second light L2 having a wavelength different from that of the first light L1, the second light L2 can be reflected in the direction of the n-th emission surface 3n3 by the n-th reflective layer 420 disposed above the phosphor layer 210 at the same time as the conversion. The second light L2 passing through the n-th emission surface 3n3 is re-reflected upward by the (n-1)-th reflective layer 4(n-1)0 formed on the (n-1)-th inclined surface 3(n-1)2 and is emitted outside the lighting device 2000 as the third light L3.

[0076] Therefore, in the lighting device 2000 according to the second embodiment, the first light L1 emitted from the light-emitting element 200 travels upward and is converted into the second light L2 having a wavelength different from that of the first light L1 by the phosphor layer 210 formed on the inclined surfaces 312, 322, 333, 343, 353, 363, 373 of the plurality of grooves 310, 320, 330, 340, 350, 360, 370, and the third light L3 reflected by the reflective layer 400 disposed above the phosphor layer 210 travels above the resin layer 300 and the diffusion layer 500 to emit a uniform surface light source. At this time, since the third light L3 is only reflected by the (n-1)-th reflective layer 4(n-1)0, it can have the same wavelength as the second light L2.

[0077] And, since the reflective layer 400 is disposed on the inclined surfaces 312, 322, 333, 343, 353, 363, 373 and overlaps the light-emitting element 200 in the vertical direction, the light-emitting element 200 cannot be visually recognized from the outside by the reflective layer 400. Therefore, generation of the hot spot of the light-emitting element 200 is prevented when the lighting device is lit, and since the phosphor layer 210 disposed above the light-emitting element 200 cannot be visually recognized from the outside when the lighting device is not lit, the external appearance image of the lighting device 1300 can be improved.

[0078] FIG. 9 is a cross-sectional view taken along line A-A' of the lighting device 2100 according to a modification of the second embodiment. In FIG. 9, the content already described in the lighting device 2000 according to the second embodiment illustrated in FIG. 8 can be adopted.

[0079] Referring to FIG. 9, in the lighting device 2100 according to the modification of the second embodiment, the first emission surface 313 of the first groove 310 is formed in a concave shape toward the first side surface 1 of the circuit board 100. The first emission surface 313 may be formed in a concave lens shape, but is not limited thereto.

[0080] The light emitted from the light-emitting element 200 disposed in the first groove 310 can be reflected by the first reflection layer 410 disposed above the light-emitting element 200 and travel to the first emission surface 313. At this time, since the first emission surface 313 is in a concave lens shape, the efficiency of the light passing through the first emission surface 313 can be increased.

[0081] And the second emission surface 323 to the seventh emission surface 373 may be formed in the same shape as the first emission surface 313. Therefore, the light emitted from the light-emitting elements 200 disposed in the second groove 320 to the seventh groove 370 travels in the same manner as the light emitted from the light-emitting elements 200 disposed in the second groove 320 to the seventh groove 370 according to the basic example of the second embodiment and is emitted to the outside.

[0082] Therefore, in the lighting device 2100 according to the modification of the second embodiment, the emission surfaces 313, 323, 333, 343, 353, 363, 373 are formed in a concave lens shape to improve the light extraction efficiency, and the phosphor layer 210 is disposed under the reflection layer 400 formed on the inclined surfaces 312, 322, 332, 342, 352, 362, 372 so that the phosphor layer 210 cannot be visually recognized from the outside. Thus, a lighting device 2100 with an improved appearance image can be provided.

[0083] FIG. 10 is a cross-sectional view of the lighting device 2200 according to a modification of the second embodiment taken along A-A'. In FIG. 10, the content already described in the lighting devices according to the second embodiments 2000 and 2100 illustrated in FIGS. 8 to 9 can be adopted.

[0084] Referring to FIG. 10, in the lighting device 2200 according to a modification of the second embodiment, a first reflecting member 411 that extends from the first reflecting layer 410 and extends in a direction parallel to the upper surface of the circuit board 100 can be included.

[0085] The first reflecting member 411 may be formed by extending from the end of the first reflecting layer 410. The first reflecting member 411 may be formed by protruding from the end of the first reflecting layer 410 in a direction orthogonal to the first emission surface 313. The first emission surface 313 and the first reflecting member 411 may not overlap in the vertical direction. The first reflecting member 411 may be formed by extending in a direction parallel to the upper surface of the circuit board 100 from the first reflecting layer 410 disposed in a region where the first emission surface 313 and the first inclined surface 312 are connected. The first reflecting member 411 may be integrally formed with the first reflecting layer 410, but is not limited thereto. The first reflecting member 411 may be formed of the same material as the first reflecting layer 410, but is not limited thereto.

[0086] The light emitted from the light-emitting element 200 disposed in the first groove 310 can be reflected by the first reflective layer 410 and travel to the upper part of the resin layer 300 and the diffusion layer 500, or can travel directly to the upper part of the resin layer 300 and the diffusion layer 500 without being reflected by the first reflective layer 410. Since the intensity of the light reflected by the first reflective layer 410 is different from the intensity of the light directly transmitted from the light-emitting element 200 without being reflected, this causes a decrease in the uniformity of the light. Therefore, the first reflective member 411 can reflect the light directly transmitted from the light-emitting element 200 or prevent the light from traveling. At this time, the first reflective member 411 extends from the end of the first reflective layer 410 to increase the uniformity of light on the front outside the lighting device 1200, and further prevent the light-emitting element 200 from being recognized on the side surface, thereby improving the appearance image of the lighting device 1200.

[0087] And, similar to the arrangement of the first reflective member 411 at the end of the first reflective layer 410, the second reflective member 421 to the seventh reflective member 471 are arranged at the ends of the second reflective layer 420 to the seventh reflective layer 470. Therefore, the light emitted from the light-emitting elements 200 disposed in the second groove 320 to the seventh groove 370 travels and is emitted to the outside in the same process as the light emitted from the light-emitting elements 200 disposed in the second groove 320 to the seventh groove 370 according to the basic example of the second embodiment.

[0088] Therefore, in the lighting device 2200 according to the modified example of the second embodiment, the first reflective member 411 to the seventh reflective member 417 prevent light from traveling to the upper part of the resin layer 300 and the diffusion layer 500 in the region adjacent to the exit surfaces 313, 323, 333, 343, 353, 363, 373, provide a uniform surface light source, and prevent the light-emitting element 200 from being recognized from the outside. In addition, the phosphor layer 210 is disposed under the reflective layer 400 formed on the inclined surfaces 312, 322, 332, 342, 352, 362, 372 to improve the light extraction efficiency, and since the phosphor layer 210 cannot be visually recognized from the outside, a lighting device 2100 with an improved appearance image can be provided.

[0089] FIG. 11 is a cross-sectional view taken along line A-A' of the lighting device 2300 according to a modification of the second embodiment. In FIG. 11, the content already described in the lighting devices 2000, 2100, 2200 according to the second embodiment illustrated in FIGS. 8 to 10 can be adopted.

[0090] In the lighting device 2300 according to the modification of the second embodiment, the emission surfaces 313, 323, 333, 343, 353, 363, 373 of the plurality of grooves 310, 320, 330, 340, 350, 360, 370 are formed in a concave shape from the second side surface 2 to the first side surface 1 of the circuit board 100, and the reflecting members 411, 421, 431, 441, 451, 461, 471 that extend from the reflecting layer 400 and extend in a direction parallel to the upper surface of the circuit board 100 can be included. At this time, the reflecting members 411, 421, 431, 441, 451, 461, 471 can overlap in a direction perpendicular to the emission surfaces 313, 323, 333, 343, 353, 363, 373, which is different from the modification of the first embodiment in FIG. 5. Note that the phosphor layer 210 does not necessarily overlap in a direction perpendicular to the reflecting members 411, 421, 431, 441, 451, 461, 471 and the emission surfaces 313, 323, 333, 343, 353, 363, 373.

[0091] FIG. 12 is a cross-sectional view taken along line A-A' of the lighting device 2400 according to a modification of the second embodiment. In FIG. 12, the content already described in the lighting devices 2000, 2100, 2200, 2300 according to the second embodiment illustrated in FIGS. 8 to 10 can be adopted.

[0092] As shown in FIG. 12, in the lighting device 2400 according to the modified example of the second embodiment, a part of the inclined surfaces 312, 322, 332, 342, 352, 362, 372 overlapping with the light emitting element 200 disposed in the plurality of grooves 310, 320, 330, 340, 350, 360, 370 is formed into a curved surface. Therefore, a part of the reflection layer 400 formed in the region adjacent to the second emission surface 323 to the seventh emission surface 373 is formed into a curved surface. Therefore, since the light emitted from the light emitting element 200 disposed in the plurality of grooves 310, 320, 330, 340, 350, 360, 370 is not reflected upward by the reflection layer 400 formed into a curved surface, it is possible to prevent the hot spot phenomenon that may occur in the region adjacent to the second emission surface 323 to the seventh emission surface 373.

[0093] FIG. 13 is a cross-sectional view of the lighting device 3000 according to the third embodiment taken along A-A'. In FIG. 13, the contents already described in the lighting devices 1000, 1100, 1200, 1300, 1400, 2000, 2100, 2200, 2300, 2400 according to the first and second embodiments illustrated in FIGS. 1 to 12 can be adopted.

[0094] Referring to FIG. 13, in the lighting device 3000 according to the third embodiment, a phosphor layer 210 is formed on the emission surfaces 313, 323, 333, 343, 353, 363, 373 of the plurality of grooves 310, 320, 330, 340, 350, 360, 370.

[0095] The process in which the light emitted from the light emitting element 200 disposed in the plurality of grooves 310, 320, 330, 340, 350, 360, 370 travels to the upper part of the resin layer 300 will be described.

[0096] For example, the first light L1 emitted from the light-emitting element 200 disposed in the first groove 310 faces the upper part of the light-emitting element 200, and the first reflective layer 410 formed on the first inclined surface 312 can reflect the second light L2 to the first emission surface 313. When the second light L2 enters the first emission surface 313, the second light L2 is converted by the phosphor layer 210 formed on the first emission surface 313 into the third light L3 having a wavelength different from that of the second light L2. The third light L3 passing through the first emission surface 313 is diffused by the resin layer 300 disposed on the side surface of the first groove 310, travels to the upper part and the side surface of the resin layer 300, and is emitted to the outside of the lighting device 2000.

[0097] Then, the first light L1 emitted from the light-emitting element 200 disposed in the remaining plurality of grooves 3n0 (n≥2, n is an integer) except the first groove 310 travels to the upper part of the light-emitting element 200 and is reflected by the nth reflective layer 4n0 formed on the nth inclined surface 3n2 in the direction of the nth emission surface 323. The second light L2 incident on the nth emission surface 3n3 is converted by the phosphor layer 210 formed on the nth emission surface 3n3 into the third light L3 having a wavelength different from that of the second light L2. The third light L3 passing through the nth emission surface 3n3 is re-reflected by the (n-1)th reflective layer 4(n-1)0 disposed adjacent to the nth emission surface 3n3 in the upper direction of the resin layer 300 and the diffusion layer 500, and the fourth light L4 having the same wavelength as the third light L3 is emitted to the outside of the lighting device 3000.

[0098] Therefore, in the lighting device 3000 according to the third embodiment, the first light L1 emitted from the light-emitting element 200 travels upward and is reflected by the reflection layer 400 disposed on the inclined surfaces 312, 322, 333, 343, 353, 363, 373 of the plurality of grooves 310, 320, 330, 340, 350, 360, 370 in the direction of the exit surfaces 313, 323, 333, 343, 353, 363, 373 to form the second light L2. While passing through the phosphor layer 210 disposed on the exit surfaces 313, 323, 333, 343, 353, 363, 373, the second light L2 is converted into the third light L3 having a wavelength different from that of the second light L2, and is re-reflected by the adjacent reflection layer 400 so that the fourth light L4 travels above the resin layer 300 and the diffusion layer 500 to emit a uniform surface light source.

[0099] And in the lighting device 3000 according to the third embodiment, the reflection layer 400 is respectively formed on the inclined surfaces 312, 322, 332, 342, 352, 362, 372 and can overlap in the direction perpendicular to the light-emitting element 200. Therefore, since the light-emitting element 200 cannot be visually recognized from the outside by the reflection layer 400, it is possible to prevent the generation of hot spots by the light-emitting element 200 when the lighting device is lit.

[0100] FIG. 14 is a cross-sectional view of the lighting device 3100 according to a modified example of the third embodiment taken along line A-A'. In FIG. 14, the content already described in the lighting device 3000 according to the third embodiment illustrated in FIG. 13 can be adopted.

[0101] Referring to FIG. 14, the lighting device 3100 according to the modified example of the third embodiment may include a first reflecting member 411 that extends from the first reflection layer 410 and extends in a direction parallel to the upper surface of the circuit board 100.

[0102] The first reflecting member 411 may be formed by extending from the end of the first reflecting layer 410. The first reflecting member 411 may be formed to protrude in a direction orthogonal to the first emission surface 313 from the end of the first reflecting layer 410. The first emission surface 313 and the first reflecting member 411 may not overlap in the vertical direction. The first reflecting member 411 may be formed by extending in a direction parallel to the upper surface of the circuit board 100 from the first reflecting layer 410 disposed in a region where the first emission surface 313 and the first inclined surface 312 are connected. The first reflecting member 411 may be integrally formed with the first reflecting layer 410, but is not limited thereto. The first reflecting member 411 may be formed of the same material as the first reflecting layer 410, but is not limited thereto.

[0103] The light emitted from the light-emitting element 200 disposed in the first groove 310 can be reflected by the first reflecting layer 410 and travel to the upper part of the resin layer 300 and the diffusion layer 500, or can travel directly to the upper part of the resin layer 300 and the diffusion layer 500 without being reflected by the first reflecting layer 410. Since the intensity of the light reflected by the first reflecting layer 410 is different from the intensity of the light directly transmitted from the light-emitting element 200 without being reflected, this causes a decrease in the uniformity of the light. Therefore, the first reflecting member 411 can reflect the light directly transmitted from the light-emitting element 200 or prevent the light from traveling. At this time, the first reflecting member 411 extends from the end of the first reflecting layer 410 to increase the uniformity of the light on the front outside the lighting device 1200, and further prevent the light-emitting element 200 from being recognized on the side surface, thereby improving the appearance image of the lighting device 1200.

[0104] And, in the same manner as the first reflecting member 411 is disposed at the end of the first reflecting layer 410, second reflecting members 421 to seventh reflecting members 471 are disposed at the ends of the second reflecting layer 420 to the seventh reflecting layer 470. Accordingly, the light emitted from the light-emitting elements 200 disposed in the second groove 320 to the seventh groove 370 travels and is emitted to the outside in the same manner as the light emitted from the light-emitting elements 200 disposed in the second groove 320 to the seventh groove 370 according to the basic example of the third embodiment.

[0105] Accordingly, in the lighting device 3100 according to the modified example of the third embodiment, the first reflecting member 411 to the seventh reflecting member 417 prevent light from traveling above the resin layer 300 and the diffusion layer 500 in the regions adjacent to the exit surfaces 313, 323, 333, 343, 353, 363, 373, provide a uniform surface light source, and prevent the light-emitting element 200 from being recognized from the outside. Further, since the phosphor layer 210 is disposed under the reflecting members 411, 421, 431, 441, 451, 461, 471 and the phosphor layer 210 cannot be visually recognized from the outside, a lighting device 3100 with an improved appearance image can be provided.

[0106] FIG. 15 is a cross-sectional view taken along line A-A' of a lighting device 3200 according to a modified example of the third embodiment. In FIG. 15, the content already described in the lighting devices 3000 and 3100 according to the third embodiment illustrated in FIGS. 13 and 14 can be adopted.

[0107] Referring to FIG. 15, in the lighting device 3200 according to the modified example of the third embodiment, the first exit surface 313 of the first groove 310 is formed in a concave shape from the second side surface 2 of the circuit board 100 toward the first side surface 1. The first exit surface 313 may be formed in a concave lens shape, but is not limited thereto. Further, the shape of the phosphor layer 210 can be deformed together according to the shape of the first exit surface 313.

[0108] The light emitted from the light-emitting element 200 disposed in the first groove 310 can be reflected by the first reflective layer 410 disposed above the light-emitting element 200 and travel toward the first exit surface 313. At this time, since the first exit surface 313 has a concave lens shape, the efficiency of the light passing through the first exit surface 313 can be increased.

[0109] And the second exit surface 323 to the seventh exit surface 373 may be formed in the same shape as the first exit surface 313. Therefore, the light emitted from the light-emitting elements 200 disposed in the second groove 320 to the seventh groove 370 travels in the same manner as the light emitted from the light-emitting elements 200 disposed in the second groove 320 to the seventh groove 370 according to the basic example of the second embodiment and is emitted to the outside.

[0110] Therefore, in the lighting device 3200 according to the modified example of the third embodiment, it is possible to provide a lighting device in which the exit surfaces 313, 323, 333, 343, 353, 363, 373 and the phosphor layer 210 are formed in a concave lens shape and the light extraction efficiency is improved.

[0111] FIG. 16 is a cross-sectional view of the lighting device 3300 according to the modified example of the third embodiment taken along line A-A'. In FIG. 16, the content already described in the lighting devices 3000, 3100, 3200 according to the third embodiment illustrated in FIGS. 13 to 15 can be adopted.

[0112] As shown in FIG. 16, in the lighting device 3300 according to the modification of the third embodiment, a part of the inclined surfaces 312, 322, 332, 342, 352, 362, 372 overlapping the light emitting elements 200 arranged in the plurality of grooves 310, 320, 330, 340, 350, 360, 370 is formed as a curved surface. Therefore, a part of the reflection layer 400 formed in the regions adjacent to the second emission surface 323 to the seventh emission surface 373 is formed as a curved surface. Therefore, since the light emitted from the light emitting elements 200 arranged in the plurality of grooves 310, 320, 330, 340, 350, 360, 370 is not reflected upward by the reflection layer 400 formed as a curved surface, it is possible to prevent the hot spot phenomenon that may occur in the regions adjacent to the second emission surface 323 to the seventh emission surface 373.

[0113] FIG. 17 is a plan view of a vehicle to which a vehicle lamp to which the lighting module according to the embodiment is applied is applied, and FIG. 18 is a drawing showing a vehicle lamp having the lighting module or the lighting device disclosed in the embodiment.

[0114] Referring to FIGS. 17 and 18, in vehicle 900, the tail lamp 800 can include a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. Here, the first lamp unit 812 may be a light source for serving as a direction indicator lamp, the second lamp unit 814 may be a light source for serving as a side marker lamp, and the third lamp unit 816 may be a light source for serving as a brake lamp, but is not limited thereto. At least one or all of the first to third lamp units 812, 814, 816 can include the lighting module disclosed in the embodiment. The housing 810 can house the first to third lamp units 812, 814, 816 and can be made of a light-transmissive material. At this time, the housing 810 can have a bend according to the design of the vehicle body, and the first to third lamp units 812, 814, 816 can embody a surface light source having a curved surface according to the shape of the housing 810. Such a vehicle lamp can be applied to the turn signal lamp of the vehicle when the lamp unit is applied to the tail lamp, brake lamp, or turn signal lamp of the vehicle.

[0115] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. In addition, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified and implemented for other embodiments by those with ordinary knowledge in the field to which the embodiment belongs. Therefore, the content related to such combinations and modifications should be construed as being included in the scope of the present invention.

[0116] In addition, although the embodiments have been mainly described above, this is merely an illustration and does not limit the present invention. Those with ordinary knowledge in the field to which the present invention pertains can make various modifications and applications not exemplified above without departing from the essential characteristics of the present embodiment. For example, each component specifically presented in the embodiment can be implemented with modifications. And the differences related to such modifications and applications should be construed as being included in the scope of the present invention defined by the appended claims.

Claims

1. A substrate including a first side surface, a second side surface opposite to the first side surface, a third side surface connecting the first side surface and the second side surface, and a fourth side surface opposite to the third side surface; A resin layer disposed on the upper surface of the substrate and having a plurality of grooves. Each of the plurality of grooves of the resin layer includes a bottom surface where the upper surface of the substrate is exposed, an emission surface extending from the bottom surface toward the upper end of each groove, and a plurality of grooves including an inclined surface inclined at a predetermined angle from the emission surface; A plurality of light-emitting elements disposed inside each of the plurality of grooves in the substrate and emitting first light; A reflective layer disposed on the inclined surface; A phosphor layer disposed on the lower surface of the reflective layer; A diffusion layer disposed on the resin layer, including; The plurality of grooves are formed by extending from the third side surface to the fourth side surface direction of the substrate and arranged in the first side surface to the second side surface direction of the substrate; Each emission surface and the inclined surface of the groove are made of the same material as the material of the resin layer; The substrate is disposed on the lower surface between the grooves of the resin layer and the bottom surfaces of the plurality of grooves; The substrate is electrically connected to the light-emitting elements disposed in each of the plurality of grooves; The lower end of the phosphor layer disposed on the reflective layer of each groove contacts the substrate; The light-emitting element, the phosphor layer, and the reflective layer overlap in the vertical direction; The light-emitting element, the lower part of the emission surface, and the lower part of the reflective layer overlap in the horizontal direction; The reflective layer includes a reflective member extending in a direction parallel to the upper surface of the substrate from a region where the emission surface and the inclined surface are connected in each of the plurality of grooves; A part of the resin layer is disposed between the upper surface of the reflective member and the upper surface of the resin layer; The phosphor layer is separated from the upper surface of the light-emitting element; The plurality of grooves include a first groove adjacent to the first side surface of the substrate and a second groove adjacent to the first groove; The first light emitted from the light-emitting element disposed in the second groove is wavelength-converted by the phosphor layer and reflected by the reflective layer disposed on the inclined surface of the second groove. The light reflected by the reflective layer passes through the emission surface of the second groove, and the light passing through the emission surface of the second groove is reflected by the reflective layer disposed on the inclined surface of the first groove and passes through the resin layer and the diffusion layer, a lighting device.

2. A substrate including a first side surface, a second side surface opposite to the first side surface, a third side surface connecting the first side surface and the second side surface, and a fourth side surface opposite to the third side surface, A resin layer disposed on the upper surface of the substrate and having a plurality of grooves. Each of the plurality of grooves of the resin layer includes a bottom surface where the upper surface of the substrate is exposed, an emission surface extending from the bottom surface toward the upper end of each groove, and an inclined surface inclined at a predetermined angle from the emission surface. A plurality of light-emitting elements disposed inside each of the plurality of grooves on the substrate and emitting first light. A reflective layer disposed on the inclined surface. A phosphor layer disposed on the emission surface. A diffusion layer disposed on the resin layer, including The plurality of grooves are formed by extending from the third side surface to the fourth side surface direction of the substrate and are arranged in the first side surface to the second side surface direction of the substrate. The emission surface and the inclined surface of each groove are made of the same material as the material of the resin layer. The substrate is disposed on the lower surface between the grooves of the resin layer and the bottom surfaces of the plurality of grooves. The substrate is electrically connected to the light-emitting elements disposed in each of the plurality of grooves. The lower end of the phosphor layer disposed in each groove and the lower end of the reflective layer are in contact with the substrate. The light-emitting element and the reflective layer overlap in the vertical direction. The light-emitting element, the lower part of the emission surface, and the lower part of the reflective layer overlap in the horizontal direction. The reflective layer includes a reflective member extending in a direction parallel to the upper surface of the substrate from a region where the emission surface and the inclined surface are connected in each of the plurality of grooves. A part of the resin layer is disposed between the upper surface of the reflective member and the upper surface of the resin layer. The phosphor layer is separated from the side surface of the light-emitting element. The plurality of grooves include a first groove adjacent to the first side surface of the substrate and a second groove adjacent to the first groove. The first light emitted from the light-emitting element disposed in the second groove is reflected by the reflective layer disposed on the inclined surface of the second groove. The light reflected by the inclined surface is wavelength-converted by the phosphor layer when passing through the emission surface of the second groove. The light passing through the emission surface of the second groove is reflected by the reflective layer disposed on the inclined surface of the first groove and passes through the resin layer and the diffusion layer. Lighting device.

3. The lighting device according to claim 1, wherein the phosphor layer is not visible from the front of the lighting device. 【Claim The lighting device according to claim 2, wherein the upper end of the phosphor layer is connected to the reflective layer having the reflective member.

5. The lighting device according to claim 1, wherein the light-emitting surface has a shape bulging from the second side surface of the substrate toward the first side surface.

6. The lighting device according to claim 1, wherein the lower surface area of the reflective layer having the reflective member is larger than the upper surface area of the phosphor layer.

7. The first light emitted from the light-emitting element disposed in the second groove is converted by the phosphor layer into second light having a wavelength different from that of the first light and passes through the diffusion layer. The lighting device according to claim 1 or 6, wherein the phosphor layer has a region inclined at the same angle as the inclined surface.

8. The reflective member protrudes in a direction orthogonal to the light-emitting surface so as not to overlap the light-emitting surface in the vertical direction. The lighting device according to claim 1 or 6, wherein the resin layer is disposed above and below the reflective member.

9. A partial region of the inclined surface adjacent to the substrate is formed as a curved surface. The curved surface of the inclined surface overlaps the light-emitting element in the horizontal direction. The lighting device according to any one of claims 1 to 6, wherein the upper end of the curved surface is lower than the upper end of the light-emitting element.

10. The substrate includes a reflective layer on its upper surface. The light-emitting element emits light through its upper surface and a plurality of side surfaces. The first light emitted from the light-emitting element disposed in the first groove is emitted to the first side surface of the resin layer through the light-emitting surface of the first groove. The lighting device according to any one of claims 1 to 6, wherein the direction of the light emitted from the light-emitting element disposed in the first groove and passing through the resin layer is different from the direction of the light emitted from the light-emitting element disposed in the second groove and passing through the resin layer.

Images