Display device and display system

Abstract

To provide a display device capable of displaying high-quality images even when using compact and high-brightness light-emitting elements.SOLUTION: A display device 100 comprises: a plurality of light-emitting elements 112 which are arranged at predetermined intervals on a circuit board 111 and each emit light forward; a reflective layer 122 which is provided on a transparent substrate 121 disposed opposite to the circuit board 111, has openings 122H at positions corresponding to the light-emitting elements 112, allows light emitted from the light-emitting elements 112 to pass through the openings 122H and be emitted forward, and reflects the light from the front; and a light-shielding layer 113 which is provided between the circuit board 111 and the transparent substrate 121, and absorbs part of the light emitted from the light-emitting elements 112 to prevent part of the light from reaching the openings 122H other than the openings 122H corresponding to the light-emitting elements 112.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a display device and a display system. [Background technology]

[0002] Mirror displays are known that have both a display function of emitting light to display a desired image and a mirror function of reflecting light to display surrounding objects.

[0003] As a mirror display, Patent Document 1 below discloses an organic light-emitting display device that includes a first substrate having a plurality of organic light-emitting elements and a second substrate having a reflective layer with a plurality of openings formed in positions corresponding to the plurality of organic light-emitting elements. The organic light-emitting display device described in Patent Document 1 achieves a mirror function by the reflective layer reflecting light, and achieves a display function by emitting light emitted from the organic light-emitting elements to the outside through the openings. With this configuration, a mirror function with high reflectivity can be achieved by the reflective layer, and a display function with high display brightness can be achieved without light loss due to the openings. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] US Patent Application Publication No. 2016 / 0240818 Summary of the Invention [Problem to be solved by the invention]

[0005] Display devices that have both display and mirror functions require higher display brightness and higher reflectivity. To meet this requirement, the application of small, high-brightness light-emitting elements such as micro LEDs (Light Emitting Diodes) is currently being considered. Micro LEDs are inorganic LEDs that can achieve high display brightness, and their small chip size allows for minimizing the opening in the reflective layer and achieving high reflectivity. The multiple micro LEDs that make up each pixel of a display device are arranged closely together.

[0006] However, if the distance between adjacent micro LEDs is short, light emitted from a particular micro LED may be emitted to the outside through openings other than the corresponding opening, which may cause degradation of the image quality of the displayed image.

[0007] The present invention has been made in view of the above-mentioned problems, and therefore an object of the present invention is to provide a display device that has both a display function and a mirror function and that can display high-quality images even when using small, high-brightness light-emitting elements to achieve higher display brightness and higher reflectance.

[0008] Another object of the present invention is to provide a display system including a plurality of the above-described display devices. [Means for solving the problem]

[0009] The above object of the present invention can be achieved by the following means.

[0010] (1) A display device comprising: a plurality of light-emitting elements arranged at predetermined intervals on a circuit board, each emitting light forward; a reflective layer provided on a transparent substrate facing the circuit board, having openings at positions corresponding to the light-emitting elements, allowing light emitted from the light-emitting elements to pass through the openings and be emitted forward, and reflecting light from the front; and a light-shielding layer provided between the circuit board and the transparent substrate, absorbing a portion of the light emitted from the light-emitting elements and preventing the portion of the light from reaching openings other than the openings corresponding to the light-emitting elements.

[0011] (2) The display device according to (1), wherein the light-shielding layer is provided in an area other than an area where the light-emitting elements are provided on the circuit board.

[0012] (3) The display device according to (2), wherein the light-shielding layer covers the side surfaces of the light-emitting element and absorbs light emitted from the side surfaces of the light-emitting element.

[0013] (4) The display device according to (1) or (2), wherein the light-shielding layer is provided on the transparent substrate so as to be located closer to the light-emitting element than the reflective layer.

[0014] (5) The display device according to (1) or (2) above, further comprising a transparent adhesive layer provided between the circuit board and the transparent substrate, bonding the circuit board and the transparent substrate together.

[0015] (6) The display device according to (1) or (2) above, wherein the plurality of light-emitting elements include a blue light-emitting element that emits blue light, a green light-emitting element that emits green light, and a red light-emitting element that emits red light.

[0016] (7) A display device described in (1) or (2) above, wherein the plurality of light-emitting elements are light-emitting elements that emit light of a specific wavelength, and the display device further has a color conversion layer that converts the light of the specific wavelength into light of another wavelength and emits it.

[0017] (8) The display device according to (7), wherein the color conversion layer is provided in the opening.

[0018] (9) A display device described in (1) or (2) above, wherein the thickness of the transparent substrate is determined so that light emitted from the light-emitting element located at the end of the circuit board does not reach the end face of the transparent substrate.

[0019] (10) The display device according to (1) or (2) above, wherein the opening has a size equal to or larger than the size of the light-emitting element.

[0020] (11) The display device according to (1) or (2) above, wherein the light-emitting element is a micro LED.

[0021] (12) The display device according to (1) or (2) above, wherein the transparent substrate is larger than the circuit board, and a plurality of the circuit boards are joined to the transparent substrate.

[0022] (13) A display system comprising a plurality of display devices according to (1) or (2) above, wherein the plurality of display devices, each having the same size transparent substrate and circuit board, are arranged in a tiled pattern. [Effects of the Invention]

[0023] According to the display device of the present invention, even when a small, high-brightness light-emitting element is used to achieve higher display brightness and higher reflectance, a high-quality image can be displayed.

[0024] Furthermore, the display system of the present invention improves the degree of freedom in the shape of the display plane. [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a plan view showing a schematic configuration of a display device according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II' in FIG. [Figure 3A] FIG. 1 is a diagram illustrating the behavior of light in a display device. [Figure 3B] FIG. 10 is a diagram showing, as a comparative example, the behavior of light in a typical display device. [Figure 4A] FIG. 10 is a diagram showing the behavior of light when the transparent substrate is thin. [Figure 4B] FIG. 10 is a diagram showing the behavior of light when the transparent substrate is thick. [Figure 5A] 10A to 10C are diagrams for explaining a manufacturing method of a display device. [Figure 5B] This is a figure following FIG. 5A. [Figure 5C] This is a figure following Figure 5B. [Figure 5D] This is a figure subsequent to Figure 5C. [Figure 5E] This is a figure subsequent to Figure 5D. [Figure 5F] This is a figure following Figure 5E. [Figure 6] FIG. 10 is a cross-sectional view showing a schematic configuration of a display device according to a modified example. [Figure 7] FIG. 10 is a cross-sectional view showing a schematic configuration of a display device according to a second embodiment. [Figure 8] FIG. 10 is a diagram showing a schematic configuration of a display device according to a third embodiment. [Figure 9] FIG. 1 is a diagram illustrating a schematic configuration of a display system. DETAILED DESCRIPTION OF THE INVENTION

[0026] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following drawings, the same reference numerals refer to the same components, and the size of each component in the drawings may be exaggerated for clarity and convenience. Meanwhile, the embodiments described below are merely examples, and various modifications are possible from such embodiments.

[0027] Hereinafter, the terms "upper" and "above" may include not only what is directly above in contact with something, but also what is above without contact. Similarly, the terms "lower" and "below" may include not only what is directly below in contact with something, but also what is below without contact.

[0028] The singular expression includes the plural expression unless the context clearly dictates otherwise. Furthermore, when a part "includes," "comprises," or "has" a certain element, it does not mean that it excludes other elements, but that it may further include other elements, unless otherwise specified to the contrary.

[0029] Unless explicitly stated or stated to the contrary, steps constituting a method may be performed in any suitable order, and are not necessarily limited to the order of the steps described. The use of any examples or exemplary terms is merely for the purpose of illustrating the technical idea, and the scope of the invention is not limited by the claims, and should not be construed as being limited by said examples or exemplary terms.

[0030] (First embodiment) A display device 100 according to a first embodiment of the present invention will be described below with reference to Figures 1 to 5. The display device 100 according to this embodiment is a mirror display that has both a display function of emitting light to display a desired image and a mirror function of reflecting light to display surrounding objects.

[0031] FIG. 1 is a plan view showing a schematic configuration of a display device 100 according to this embodiment, and FIG. 2 is a cross-sectional view taken along line II-II' in FIG. 1. As shown in FIGS. 1 and 2, the display device 100 according to this embodiment includes a display substrate 110 on which a plurality of light-emitting elements 112G, 112B, and 112R (hereinafter also collectively referred to as "light-emitting elements 112") are arranged in an array, and a reflective substrate 120 on which a plurality of openings 122H are formed, through which the plurality of light-emitting elements 112G, 112B, and 112R are exposed to the outside. The display substrate 110 and the reflective substrate 120 are bonded to each other via a transparent adhesive layer 130.

[0032] <Display board 110> The display substrate 110 is configured by mounting a plurality of light-emitting elements 112 on a circuit board 111. In addition, a light-shielding layer 113 for absorbing part of the light emitted from the light-emitting elements 112 is provided in an area on the circuit board 111 other than the area where the light-emitting elements 112 are arranged.

[0033] The circuit board 111 is a TFT substrate on which thin film transistors (TFTs) for controlling the operations of the plurality of light emitting elements 112, wiring layers, and the like (not shown) are formed.

[0034] The light-emitting elements 112 include a blue light-emitting element 112B that emits blue light, a green light-emitting element 112G that emits green light, and a red light-emitting element 112R that emits red light, and display a color image. The light-emitting elements 112B, 112G, and 112R are micro LEDs with a chip size of 100 μm square or less, and three adjacent light-emitting elements 112B, 112G, and 112R form one pixel. The three light-emitting elements 112B, 112G, and 112R are arranged adjacent to one another at intervals smaller than the pixel size and pixel pitch.

[0035] The light-shielding layer 113 is made of a black anisotropic conductive film (ACF). The light-shielding layer 113 mechanically and electrically connects the circuit board 111 and the light-emitting element 112, and absorbs light emitted from the light-emitting element 112. The light-emitting element 112 is embedded in the light-shielding layer 113, and the light-shielding layer 113 covers the side surfaces of the light-emitting element 112.

[0036] <Reflective substrate 120> The reflective substrate 120 is configured by forming a reflective layer 122 on a transparent substrate 121. The transparent substrate 121 is a transparent glass substrate, and the reflective layer 122 is configured from an alloy of aluminum and niobium. The reflective layer 122 functions as a mirror surface that reflects light from the front of the display device 100 and reflects surrounding objects. Meanwhile, the reflective layer 122 is provided with a plurality of openings 122H at positions corresponding to the light emitting elements 112, and the openings 122H allow light emitted from the light emitting elements 112 to be emitted forward. The openings 122H have a rectangular shape, and the size of the openings 122H is slightly larger than the chip size of the light emitting elements 112.

[0037] It is preferable to use a thin glass substrate with a thickness of about 100 μm as the transparent substrate 121. The thickness of the transparent substrate 121 will be described in detail later.

[0038] <Transparent adhesive layer 130> The transparent adhesive layer 130 is disposed between the display substrate 110 and the reflective substrate 120, and bonds the display substrate 110 and the reflective substrate 120 to each other. The transparent adhesive layer 130 is an optically clear resin (OCR).

[0039] According to the display device 100 of this embodiment configured as described above, the light emitted from the light emitting element 112 is emitted forward through the opening 122H, thereby realizing a display function of displaying a desired image. On the other hand, the light incident from the front is reflected by the reflective layer 122 of the reflective substrate 120, thereby realizing a mirror function of reflecting surrounding objects.

[0040] More specifically, high-intensity light emitted from the light-emitting elements 112 is emitted to the outside through the openings 122H, preventing light attenuation and realizing a display function with high display brightness. Meanwhile, by using small light-emitting elements 112, the size of the openings 122H is minimized and the area of the reflective layer 122 is maximized, realizing a mirror function with high reflectivity. In addition, the provision of the light-shielding layer 113 that absorbs part of the light emitted from the light-emitting elements 112 prevents part of the light emitted from a specific light-emitting element 112 from being emitted forward from openings 122H other than the corresponding openings 122H, thereby improving the quality of the displayed image.

[0041] The area ratio of the openings 122H to the surface of the reflective substrate 120 is about 10%, and the area ratio of the reflective layer 122 is about 90%. With this configuration, a mirror performance with a reflectance of 83% or more as specified by the Japanese Industrial Standards (JIS) is realized.

[0042] <Display Operation of the Display Device 100> Next, the display operation of display device 100 will be described in detail with reference to Figures 3A and 3B. Figure 3A is a diagram showing the behavior of light in display device 100, and Figure 3B is a diagram showing, as a comparative example, the behavior of light in a general display device that does not have a light-shielding layer.

[0043] 3B, in a typical display device, for example, light L1 emitted forward from the front surface of light-emitting element 112B enters transparent substrate 121 through corresponding opening 122H1 located in front of light-emitting element 112B and is emitted to the outside. Meanwhile, part of light L2 emitted from the front surface of light-emitting element 112B is reflected by the surface of transparent substrate 121, then reflected within display device 100, and emitted to the outside through opening 122H2 other than the corresponding opening 122H1. In addition, light L3 emitted from side surface 112S of light-emitting element 112G is also emitted to the outside through opening 122H3 other than the corresponding opening 122H2.

[0044] Therefore, in a general display device that does not have a light-shielding layer, so-called optical crosstalk occurs, which may cause deterioration in the quality of the displayed image (such as changes in color).

[0045] 3A, in the display device 100 of this embodiment, light L2 emitted from the light-emitting element 112 and reflected on the surface of the transparent substrate 121 is absorbed by the light-shielding layer 113, and thus the light L2 is prevented from emitting to the outside through the other openings 122H. In addition, in the display device 100 of this embodiment, the side surface 112S of the light-emitting element 112 is covered with the light-shielding layer 113, and therefore the light emitted from the side surface 112S of the light-emitting element 112 is also prevented from emitting to the outside through the other openings 122H.

[0046] Therefore, the display device 100 of this embodiment can display high-quality images without causing optical crosstalk.

[0047] <Thickness of the transparent substrate 121> 4A and 4B, the thickness of the transparent substrate 121 of the display device 100 will be described in detail. As described above, in the display device 100 of this embodiment, a thin glass substrate with a thickness of about 100 μm is used as the transparent substrate 121.

[0048] FIG. 4A is a diagram showing the behavior of light when the transparent substrate 121 is thin, and FIG. 4B is a diagram showing the behavior of light when the transparent substrate 121 is thick.

[0049] 4B, when the transparent substrate 121 is thick, part of the light L1, L2, and L3 emitted from the light emitting element 112R provided at the end of the display substrate 110, the light L3, passes through the opening 122H and then reaches the end surface 121S of the transparent substrate 121. For example, when multiple display devices 100 are connected, the light L3 reaching the end surface 121S of the transparent substrate 121 may undesirably cause a line of light (white seam) to appear at the joint between the display devices 100.

[0050] 4A, when the transparent substrate 121 is thin, the light L1, L2, and L3 emitted from the light emitting element 112R provided at the end of the display substrate 110 passes through the opening 122H, does not reach the end surface 121S of the transparent substrate 121, and is instead emitted to the outside from the front surface 121A of the transparent substrate 121. Therefore, when a plurality of display devices 100 are connected together using the display device 100 that uses a thin glass substrate, no line of light is generated at the joints between the display devices 100, improving the quality of the displayed image.

[0051] As described above, in the display device 100 of this embodiment, the thickness of the transparent substrate 121 is determined so that the light emitted from the light-emitting element 112 located at the end of the circuit board 111 does not reach the end surface 121S of the transparent substrate 121.

[0052] <Manufacturing Method of Display Device 100> Next, a method for manufacturing the display device 100 will be described with reference to FIGS. 5A to 5F.

[0053] First, a metal film 122L made of an aluminum-niobium alloy is formed on a transparent substrate 121, and a photoresist 150 is applied to the metal film 122L (see FIG. 5A). Subsequently, an opening 122H is formed in the metal film 122L using a well-known photolithography process (see FIG. 5B). Thereafter, the photoresist 150 is removed, thereby completing the reflective substrate 120 (see FIG. 5C).

[0054] Next, a black anisotropic conductive film, i.e., a light-shielding layer 113, is formed on the circuit board 111, and the light-emitting elements 112 are embedded in the anisotropic conductive film, thereby completing the display substrate 110 equipped with the light-emitting elements 112 and the light-shielding layer 113 (see FIG. 5D).

[0055] Next, a transparent adhesive layer 130 is applied to the upper surface of the display substrate 110 (see FIG. 5E). Then, the reflective substrate 120 is bonded to the transparent adhesive layer 130 on the display substrate 110 so that the reflective layer 122 of the transparent substrate 121 faces the display substrate 110, thereby completing the display device 100 (see FIG. 5F).

[0056] The materials of the components of the display device 100 are not limited to those mentioned above, and various materials can be used. For example, the transparent substrate 121 can be a transparent resin substrate, and the reflective layer 122 can be made of any metal, such as silver, aluminum, a silver alloy, or an aluminum alloy. The light-shielding layer 113 is not limited to a black anisotropic conductive film, and can be made of a black matrix material or the like. When the light-shielding layer is made of a black matrix material, the light-emitting element 112 is mounted on the circuit board 111 by a well-known bonding technique, such as soldering. The color of the light-shielding layer 113 is not limited to black, and any color that can absorb light can be used.

[0057] (Variation) Next, a modified example of the display device 100 according to this embodiment will be described with reference to FIG.

[0058] 6 is a cross-sectional view showing a schematic configuration of a display device 100 according to a modified example. The display device according to the modified example differs from the display device according to the first embodiment in that it uses a color conversion layer to achieve color display. Note that the same components as those in the first embodiment are denoted by the same reference numerals and their description will be omitted.

[0059] The display device 100 according to the modified example includes a display substrate 110 on which a plurality of light-emitting elements 112B are arranged in an array, and a reflective substrate 120 on which a plurality of openings 122H corresponding to the plurality of light-emitting elements 112B are formed. The display substrate 110 and the reflective substrate 120 are bonded to each other via a transparent adhesive layer 130.

[0060] Display substrate 110 is configured by mounting a plurality of blue light emitting elements 112B on circuit board 111. A light blocking layer 113 is provided in the area on display substrate 110 other than the area where blue light emitting elements 112B are provided.

[0061] The reflective substrate 120 is provided with a reflective layer 122 having openings 122H1, 122H2, and 122H3 formed at positions corresponding to the blue light-emitting elements 112B. Of the three openings 122H1, 122H2, and 122H3 corresponding to the three blue light-emitting elements 112B that make up one pixel, two openings 122H2 and 122H3 are provided with color conversion layers 125G and 125R. The color conversion layers 125G and 125R include a green conversion layer 125G made of a color conversion material that converts blue light to green light, and a red conversion layer 125R made of a color conversion material that converts blue light to red light. The color conversion material includes a phosphor or quantum dots.

[0062] The display device 100 configured as described above can produce a color image using only the blue light-emitting element 112B. In addition, the light-shielding layer 113 provided on the circuit board 111 prevents a portion of the light emitted from a specific light-emitting element 112B from reaching the openings 122H other than the corresponding opening 122H. More specifically, for example, light emitted from the blue light-emitting element 112B corresponding to the opening 122H1 without a color conversion layer is prevented from being reflected by the surface of the transparent substrate 121 or the like and entering the color conversion layers 125G and 125R provided in the other openings 122H2 and 122H3.

[0063] Therefore, according to the display device 100 of the modified example, for example, when only a blue image is displayed, green light and red light are prevented from being mixed with the blue light and being emitted to the outside, thereby making it possible to display a high-quality blue image.

[0064] The light-emitting element according to the modified example is not limited to a blue light-emitting element, and a light-emitting element that emits light of a specific wavelength, such as white light or ultraviolet light, may be used. The color conversion material that constitutes the color conversion layer is changed depending on the light emitted by the light-emitting element.

[0065] (Second embodiment) Next, a display device 100 according to a second embodiment of the present invention will be described with reference to Fig. 7. The display device according to the second embodiment differs from the display device according to the first embodiment in that a light-shielding layer is provided on the reflective substrate side. Note that the same components as those in the first embodiment are denoted by the same reference numerals and their description will be omitted.

[0066] The display device 100 according to this embodiment includes a display substrate 110 on which a plurality of light-emitting elements 112B, 112G, and 112R are arranged in an array, and a reflective substrate 120 on which a plurality of openings 122H corresponding to the plurality of light-emitting elements 112B, 112G, and 112R are formed. The display substrate 110 and the reflective substrate 120 are bonded to each other via a transparent adhesive layer 130.

[0067] The display substrate 110 is configured by mounting a plurality of light emitting elements 112B, 112G, and 112R on a circuit board 111. The light emitting elements 112B, 112G, and 112R are mounted on the circuit board 111 by a well-known bonding technique such as soldering.

[0068] The reflective substrate 120 is provided with a reflective layer 122 having openings 122H formed in positions corresponding to the light-emitting elements 112, and a light-shielding layer 128 is provided on the reflective layer 122. Similar to the reflective layer 122, the light-shielding layer 128 is also provided with openings 128H in positions corresponding to the light-emitting elements 112, and light emitted from the light-emitting elements 112 is emitted to the outside through the openings 122H and 128H. The light-shielding layer 128 is made of, for example, a black matrix material, and absorbs part of the light emitted from the light-emitting elements 112.

[0069] According to the display device 100 configured as described above, a part of the light emitted from the light emitting element 112 is absorbed by the light blocking layer 128 provided on the transparent substrate 121, and the part of the light is prevented from being emitted to the outside through the other openings 122H. Therefore, according to the display device 100 of this embodiment, no optical crosstalk occurs and a high-quality image can be displayed.

[0070] Third Embodiment In the above-described first and second embodiments, the display substrate 110 and the reflective substrate 120 have the same size. However, the display substrate 110 and the reflective substrate 120 may have different sizes.

[0071] 8, in the display device 100 according to the third embodiment of the present invention, the size of the reflective substrate 120 is larger than the size of the display substrate 110. A plurality of small display substrates 110 are bonded to the large reflective substrate 120.

[0072] According to this configuration, the display device 100 can be made larger without increasing the size of the display substrate 110.

[0073] <Display system> Finally, a display system 200 according to an embodiment of the present invention will be described with reference to Fig. 9. The display system 200 according to this embodiment includes a plurality of display devices 100.

[0074] 9, the display system 200 is configured by arranging a plurality of display devices 100 in a tiled pattern. The display substrate 110 and the reflective substrate 120 of the display device 100 have approximately the same size.

[0075] According to such a configuration, the degree of freedom in the shape of the display surface is improved, and it becomes possible to easily provide, for example, a large mirror display having an L-shaped display surface.

[0076] The present invention is not limited to the above-described embodiments, but can be modified in various ways within the scope of the claims.

[0077] For example, in the above-described embodiment, the size of the opening provided in the reflective layer is larger than the size of the front surface of the light-emitting element. However, the size of the opening is not limited to being larger than the size of the front surface of the light-emitting element. The size of the opening may be the same as the size of the front surface of the light-emitting element, or may be smaller than the size of the front surface of the light-emitting element. Furthermore, the shape of the opening is not particularly limited and may be changed appropriately depending on the shape of the front surface of the light-emitting element.

[0078] In the above-described embodiment, the light-emitting element is an inorganic light-emitting element (micro LED). However, the light-emitting element is not limited to an inorganic light-emitting element, and various light-emitting elements such as an organic light-emitting element can be used.

[0079] In the above-described embodiment, the reflective layer is provided on the surface (rear surface) of the transparent substrate facing the display substrate. However, the reflective layer may be provided on the surface (front surface) of the transparent substrate facing away from the display substrate. In this case, it is preferable to form an antioxidant film on the reflective layer. [Explanation of symbols]

[0080] 100 display devices, 110 Display board, 111 circuit board, 112, 112R, 112G, 112B light-emitting elements; 113,128 Light shielding layer, 120 reflective substrate, 121 transparent substrate, 122 reflective layer, 122L metal film, 122H,122H1,122H2,122H3,128H opening, 125G, 125R color conversion layer, 130 transparent adhesive layer, 150 photoresist, 200 display systems, L, L1, L2, L3 Light.

Claims

1. a plurality of light emitting elements arranged at predetermined intervals on a circuit board, each of which emits light forward; a reflective layer that is provided on a transparent substrate facing the circuit board, has an opening at a position corresponding to the light-emitting element, allows light emitted from the light-emitting element to pass through the opening and be emitted forward, and reflects light from the front; a light-shielding layer provided between the circuit board and the transparent substrate, which absorbs a portion of the light emitted from the light-emitting element and prevents the portion of the light from reaching openings other than the openings corresponding to the light-emitting elements; A display device having:

2. The display device according to claim 1 , wherein the light-shielding layer is provided in an area other than an area where the light-emitting elements are provided on the circuit board.

3. The display device according to claim 2 , wherein the light-shielding layer covers a side surface of the light-emitting element and absorbs light emitted from the side surface of the light-emitting element.

4. 3. The display device according to claim 1, wherein the light-shielding layer is provided on the transparent substrate so as to be located closer to the light-emitting element than the reflective layer.

5. 3. The display device according to claim 1, further comprising a transparent adhesive layer provided between the circuit board and the transparent substrate to bond the circuit board and the transparent substrate together.

6. 3. The display device according to claim 1, wherein the plurality of light-emitting elements include a blue light-emitting element that emits blue light, a green light-emitting element that emits green light, and a red light-emitting element that emits red light.

7. the plurality of light-emitting elements are light-emitting elements that emit light of a specific wavelength, The display device includes:

3. The display device according to claim 1, further comprising a color conversion layer that converts the light of the specific wavelength into light of another wavelength and emits the converted light.

8. The display device according to claim 7 , wherein the color conversion layer is provided in the opening.

9. 3. The display device according to claim 1, wherein the thickness of the transparent substrate is determined so that light emitted from the light-emitting element located at the end of the circuit board does not reach the end face of the transparent substrate.

10. The display device according to claim 1 , wherein the opening has a size equal to or larger than a size of the light-emitting element.

11. The display device according to claim 1 , wherein the light-emitting element is a micro LED.

12. the transparent substrate is larger than the circuit board; The display device according to claim 1 , wherein a plurality of the circuit boards are bonded to the transparent substrate.

13. A display system comprising a plurality of display devices according to claim 1 or 2, A display system, wherein the plurality of display devices, each having the transparent substrate and the circuit board of the same size, are arranged in a tiled pattern.

Images