IC module and IC card

Abstract

To provide an IC module and an IC card capable of reducing a manufacturing cost.SOLUTION: An IC module according to the embodiment includes: a substrate having a first main surface and a second main surface; an IC chip mounted on the first main surface; and five contact terminals provided in a region surrounding a region facing the IC chip on the second main surface. The five contact terminals include only contact terminals C1, C2, C3, C5, and C7 defined in an international standard ISO / IEC, and each of the five contact terminals has an area within the surrounding region that encompasses a minimum contact surface defined in the international standard ISO / IEC.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] An embodiment of the present invention relates to an IC module and an IC card. [Background technology]

[0002] Generally, what is called an IC card includes, for example, contact IC cards specified in ISO / IEC 7816, contactless cards specified in ISO / IEC 14443, and contact / contactless hybrid cards that have the functions of both.

[0003] For example, contact IC cards and contact / contactless hybrid cards have a card substrate, an IC module embedded in the card substrate, and multiple contact terminals. ISO / IEC 7816-2 specifies eight contact terminals: C1, C2, C3, C4, C5, C6, C7, and C8. There are also IC cards that have only six terminals, excluding C4 and C8. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Utility Model Application Publication No. 1-67081 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of this embodiment is to provide an IC module and an IC card that can reduce manufacturing costs. [Means for solving the problem]

[0006] The IC module according to the embodiment includes a substrate, an IC chip, and five contact terminals. The substrate has a first main surface and a second main surface. The IC chip is mounted on the first main surface. The five contact terminals are provided in a region on the second main surface surrounding an area facing the IC chip. The five contact terminals include only terminals C1, C2, C3, C5, and C7 defined in International Standard ISO / IEC 7816-2. Each of the five contact terminals has an area within the surrounding region that encompasses the minimum contact surface defined in International Standard ISO / IEC. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view of an IC card according to the first embodiment. [Figure 2] FIG. 2 is a cross-sectional view of the IC card taken along line AA shown in FIG. [Figure 3] FIG. 3 is a plan view of the IC module according to the first embodiment, seen from the second main surface side of the substrate. [Figure 4] FIG. 4 is a cross-sectional view of the IC module taken along line BB shown in FIG. [Figure 5] FIG. 5 is a diagram of the contact terminal positions specified in the international standard ISO / IEC 7816-2. [Figure 6] FIG. 6 is a diagram showing the positions of the IC module and contact terminals according to the first embodiment. [Figure 7] FIG. 7 is a plan view of the IC module according to the second embodiment, seen from the second main surface side of the substrate. [Figure 8] FIG. 8 is a cross-sectional view taken along line CC shown in FIG. [Figure 9] FIG. 9 is a plan view of an IC card according to the third embodiment. [Figure 10] FIG. 10 is a cross-sectional view taken along line DD shown in FIG. [Figure 11] FIG. 11 is a plan view of the IC module according to the third embodiment, as viewed from the first main surface side of the substrate. [Figure 12]FIG. 12 is a plan view of the IC module according to the third embodiment, seen from the first main surface side of the substrate. [Figure 13] FIG. 13 is a cross-sectional view taken along line EE shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0008] Each embodiment of the present invention will be described below with reference to the drawings. The disclosure is merely an example, and appropriate modifications that a person skilled in the art can easily make while maintaining the spirit of the invention are naturally included within the scope of the present invention. Furthermore, to clarify the drawings and explanations, the width, thickness, shape, etc. of each part may be shown schematically compared to the actual embodiment, but these are merely examples and are not intended to limit the interpretation of the present invention. Furthermore, in this specification and each drawing, elements similar to those previously described with reference to the previous drawings may be designated by the same reference numerals, and detailed descriptions may be omitted where appropriate.

[0009] (First embodiment) An IC module according to a first embodiment and an IC card including the same will be described in detail below with reference to the drawings. FIG. 1 is a plan view of an IC card 10 according to a first embodiment. FIG. 2 is a cross-sectional view taken along line AA shown in FIG. 1. In the figure, an X direction, a Y direction, and a Z direction are defined, which are orthogonal to each other. The X direction corresponds to the width direction of the IC card 10. The Y direction corresponds to the length direction of the IC card 10. The Z direction corresponds to the thickness direction of the IC card 10.

[0010] As shown in Fig. 1, an IC card 10 according to the first embodiment is a contact-type IC card. The IC card 10 includes a rectangular plate-shaped card substrate 20 and an IC module 30 embedded in the card substrate 20. The IC module 30 includes five contact terminals 50a, 50b, 50c, 50d, and 50e exposed on the surface of the card substrate 20, and a substrate 40. In the following description, the contact terminals 50a to 50e will be collectively referred to as a "contact terminal group."

[0011] The length D1 in the Y direction and the width W1 in the X direction of the card substrate 20 are dimensions specified as ID-1 size in the international standard ISO / IEC 7810. Specifically, the length D1 in the Y direction of the card substrate 20 is 53.92 mm or more and 54.03 mm or less, and the width W1 in the X direction is 85.47 mm or more and 85.72 mm or less. 2, the card substrate 20 has a recess 21 formed on the surface of the card substrate 20. The recess 21 has a rectangular first recess 21a formed on the surface of the card substrate 20 and a rectangular second recess 21b formed in communication with a bottom 22 of the first recess 21a. The first recess 21a is formed in a size and shape corresponding to the substrate 40 and contact terminal group of the IC module 30. The second recess 21b is formed in a size and shape corresponding to the sealing portion 70 of the IC module 30.

[0012] The card substrate 20 is formed by laminating multiple thin plastic sheets, such as polyethylene terephthalate (PET), PET-G, polyvinyl chloride (PVC), or polycarbonate (PC), and bonding them together using a heat press to form a sheet with a thickness (0.76±0.08 mm) specified in the international standard ISO / IEC 7810. The sheet is then punched into a card shape of a predetermined size, and the recesses 21 are formed by cutting or the like. Alternatively, the card substrate 20 may be injection molded from a synthetic resin using a mold. A transparent overcoat layer may be further laminated on the outermost surface of the card substrate 20.

[0013] Next, the IC module 30 will be described. Fig. 3 is a plan view of the IC module 30 according to the first embodiment, seen from the second main surface S2 side of the substrate. Fig. 4 is a cross-sectional view of the IC module 30 taken along line BB in Fig. 3. As shown in Figures 3 and 4, the IC module 30 includes a substrate 40 having a first main surface S1 and a second main surface S2, an IC chip 60 mounted on the first main surface S1, and five contact terminals 50a, 50b, 50c, 50d, and 50e provided on the second main surface S2.

[0014] 3, the substrate 40 is formed in a plate shape and is rectangular in the XY plane view. The substrate 40 is not limited to a rectangular shape and can have any other shape. The substrate 40 has a first main surface S1 and a second main surface S2 opposite to the first main surface S1. The substrate 40 is made of an electrically insulating material, such as glass epoxy.

[0015] In one example, the IC chip 60 is mounted via an adhesive in the center of the first main surface S1 of the substrate 40. The IC chip 60 is, for example, a semiconductor chip including a large scale integrated circuit (LSI).

[0016] 3, the substrate 40 has an outer periphery that forms a rectangular outline. The outer periphery includes, for example, a pair of first sides La, Lb that extend in the X direction and face each other, and a pair of second sides Sa, Sb that extend in the Y direction and face each other. The second sides Sa, Sb are perpendicular to the first sides La, Lb. The second main surface S2 of the substrate 40 has a central region A1 that faces the IC chip 60, and a peripheral region A2 that is located around the central region A1, i.e., is located between the central region A1 and the outer periphery of the substrate 40.

[0017] Five contact terminals 50a, 50b, 50c, 50d, and 50e are provided in a peripheral region A2 on the second main surface S2 of the substrate 40. The five contact terminals 50a, 50b, 50c, 50d, and 50e include only contact terminals C1, C2, C3, C5, and C7 defined in the international standard ISO / IEC 7816-2. Each of the five contact terminals has an area within the peripheral region A2 that encompasses the minimum contact surface defined in the international standard ISO / IEC 7816-2. In one example, the five contact terminals 50a to 50e are formed in a rectangular shape of the same dimensions. Each contact terminal has a pair of first sides (long sides) extending in the X direction and facing each other, and a pair of second sides (short sides) extending in the Y direction and facing each other. The contact terminals 50a, 50b, and 50c are arranged in a row in the Y direction along one second side Sa of the substrate 40, from one first side La toward the other first side Lb. The contact terminals 50d and 50e are arranged in a row in the Y direction along one second side Sb of the substrate 40, from one first side La toward the other first side Lb. The contact terminals 50a and 50d are arranged in a row in the X direction along one first side La of the substrate 40, from one second side Sa toward the other second side Sb. The contact terminals 50c and 50e are arranged in a row in the X direction along the other first side Lb of the substrate 40, from one second side Sa toward the other second side Sb. The five contact terminals 50a to 50e are arranged at intervals from one another and are electrically insulated from each other.

[0018] Figure 5 is a diagram showing the positions of contact terminals C1, C2, C3, C4, C5, C6, C7, and C8 as specified in the international standard ISO / IEC 7816-2. In this specification, the minimum contact surface of the C1 contact terminal specified in the international standard ISO / IEC 7816-2 refers to a rectangular surface having a length of 1.7 mm in the Y direction and a width of 2.0 mm in the X direction, where the distance l1 from the top edge of the front surface of the card to the top edge of the C1 contact terminal is 19.23 mm and the distance l9 from the left edge of the front surface of the card to the left edge of the C1 contact terminal is 10.25 mm.The minimum contact surface of the C2 contact terminal specified in the international standard ISO / IEC 7816-2 refers to a rectangular surface having a length of 1.7 mm and a width of 2.0 mm, where the distance l3 from the top edge of the front surface of the card to the top edge of the C2 contact terminal is 21.77 mm and the distance l9 from the left edge of the front surface of the card to the left edge of the C2 contact terminal is 10.25 mm. The minimum contact surface of a C3 contact terminal as defined in the international standard ISO / IEC 7816-2 is a rectangular surface with a length of 1.7 mm and a width of 2.0 mm, where the distance l5 from the top edge of the card's front surface to the top edge of the C3 contact terminal is 24.31 mm and the distance l9 from the left edge of the card's front surface to the left edge of the C3 contact terminal is 10.25 mm.The minimum contact surface of a C5 contact terminal as defined in the international standard ISO / IEC 7816-2 is a rectangular surface with a length of 1.7 mm and a width of 2.0 mm, where the distance l1 from the top edge of the card's front surface to the top edge of the C5 contact terminal is 19.23 mm and the distance l11 from the left edge of the card's front surface to the left edge of the C5 contact terminal is 17.87 mm. The minimum contact surface of the C7 contact terminal specified in the international standard ISO / IEC 7816-2 is a rectangular surface with a length of 1.7 mm and a width of 2.0 mm, where the distance l5 from the top edge of the front surface of the card to the top edge of the C7 contact terminal is 24.31 mm, and the distance l11 from the left edge of the front surface of the card to the left edge of the C7 contact terminal is 17.87 mm.

[0019] FIG. 6 is a diagram showing the positions of the IC module 30 and the five contact terminals 50a to 50e according to the first embodiment. The five contact terminals 50a, 50b, 50c, 50d, and 50e are formed with dimensions and shapes that encompass the minimum contact surfaces of the contact terminals C1, C2, C3, C5, and C7 defined in the international standard ISO / IEC 7816-2. In one example, by arranging the IC module 30 in a predetermined position on the card substrate 20 as shown in Fig. 6, the five contact terminals 50a-50e are arranged in positions corresponding to the contact terminals C1, C2, C3, C5, and C7 defined in the international standard ISO / IEC 7816-2, and have areas that encompass the minimum contact surfaces. More specifically, the IC module 30 and the contact terminals 50a-50e are arranged as follows: The IC module 30 is disposed in a position where the first sides (long sides) La, Lb and second sides (short sides) Sa, Sb of the substrate 40 are parallel to the long side Lc and short side Sc of the card base material 20. The five contact terminals 50a to 50e each have a rectangular shape with lengths d11 to 15 in the Y direction of 1.7 mm or more and less than 2.54 mm, and widths w11 to 15 in the X direction of 2.0 mm or more and less than 7.62 mm.

[0020] In one example, the length D1 of the card substrate 20 in the Y direction is 53.98 mm, and the width W1 in the X direction is 85.60 mm. The length d20 of the IC module 30 in the Y direction is 8.32 mm, and the width w20 in the X direction is 11 mm. The distance l21 from the long side (top edge) Lc of the front surface of the card substrate 20 to one first side (top edge) La of the substrate 40 of the IC module 30 is 18.46 mm. Furthermore, the distance l22 from the short side (left edge) Sc of the front surface of the card substrate 20 to one second side (left edge) Sa of the substrate 40 is 9.56 mm. The five contact terminals 50a to 50e are each formed with the same area as the minimum contact surface of the contact terminals C1, C2, C3, C5, and C7 defined in the international standard ISO / IEC 7816-2. Each of the five contact terminals 50a to 50e has a rectangular shape with lengths d11 to d15 of 1.7 mm in the Y direction and widths w11 to w15 of 2.0 mm in the X direction. The distance d21 from one first side (top edge) La of the substrate 40 to one first side (top edge) of the contact terminals 50a and 50d is 0.77 mm, the distance d22 to one first side (top edge) of the contact terminal 50b is 3.31 mm, and the distance d23 to one first side (top edge) of the contact terminals 50c and 50e is 5.85 mm. Furthermore, the distance w21 from one second side (left edge) Sa of the substrate to one second side (left edge) of the contact terminals 50a, 50b, and 50c is 0.69 mm, and the distance w22 to one second side (left edge) of the contact terminals 50d and 50e is 8.31 mm.

[0021] The five contact terminals 50a to 50e are formed by plating a copper foil having the shape of the contact terminals 50a to 50e attached to the second main surface S2 of the substrate 40 with gold, palladium, or the like.

[0022] As shown in FIG. 3, the substrate 40 has five through-holes 41a, 41b, 41c, 41d, and 41e that penetrate the peripheral region A2 and face the five contact terminals 50a to 50e, respectively. The through-holes 41a, 41b, and 41c are arranged in a line in the Y direction from one first side La to the other first side Lb of the substrate 40, along one second side Sa. The through-hole 41b may be located closer to one second side Sa than the through-holes 41a and 41c. The through-holes 41d and 41e are arranged in a line in the Y direction from one first side La to the other first side Lb of the substrate 40, along the other second side Sb. The through-holes 41a, 41b, 41c, and 41e are circular, and the through-hole 41d may be circular or have a shape other than circular, such as a rectangular shape. In one example, the through holes 41a, 41b, 41c, and 41e have a circular shape with a diameter of 0.5 mm to 1.0 mm, and the through hole 41d has a rectangular shape with a side length of 0.5 mm to 1.0 mm.

[0023] 3 and 4, the five contact terminals 50a to 50e provided on the second main surface S2 are electrically connected to the IC chip 60 mounted on the first main surface S1 of the substrate 40 by first connection wirings 61 that pass through the through holes 41a to 41e, respectively. In one example, the first connection wirings 61 are gold wires (bonding wires) formed by wire bonding.

[0024] The IC chip 60 mounted on the substrate 40, the through holes 41a to 41e, and the first connection wiring 61 are covered and sealed with a sealing material 70 made of an electrically insulating molding resin, for example, a thermosetting epoxy resin. The outer contour of the sealing material 70 is formed into, for example, a rectangular shape, and is positioned outside the through holes 41a to 41e.

[0025] 2, the IC module 30 configured as described above is embedded in a recess 21 of a card substrate 20 and is heat-pressed to the card substrate 20 with an adhesive 11. The first recess 21a houses the substrate 40 and a contact terminal group of the IC module 30, and the second recess 21b houses the sealing portion 70 of the IC module 30. The peripheral edge of the first main surface S1 of the substrate 40 is adhered to the bottom 22 of the first recess 21a with the adhesive 11. The contact terminal group is disposed substantially flush with the front surface of the card substrate 20 and is exposed to the outside.

[0026] The manufacturing process of the IC module 30 and IC card 10 configured as above will be described. A reel is formed on which multiple sets of contact terminal groups are formed in a row. An IC chip 60 is mounted on the surface of the reel opposite to the surface on which the contact terminal groups are formed, and five contact terminals 50a to 50e are electrically connected to the IC chip 60 by a method such as wire bonding via first connection wiring 61 that passes through the through holes 41a to 41e, respectively. Next, the IC chip 60, the through holes 41a to 41e, and the first connection wiring 61 are sealed with a sealing material 70. In this way, multiple IC modules 30 are formed on the reel. Each IC module 30 is manufactured by punching it out from the reel. The IC module 30 is embedded in a recess 21 of the card substrate 20 and heat-pressed with an adhesive to manufacture the IC card 10. As described above, the IC module 30 and the IC card 10 can be manufactured.

[0027] The effects of the IC module and IC card according to the first embodiment described above will be described below. The IC module according to the first embodiment has five contact terminals, including only the C1, C2, C3, C5, and C7 contact terminals specified in the international standard ISO / IEC 7816-2, and each of the five contact terminals has an area that encompasses the minimum contact surface specified in the international standard ISO / IEC 7816-2. Because the IC module according to the first embodiment does not include the less frequently used C4, C6, and C8 contact terminals, the number of contact terminals can be reduced, and the area to be plated with gold, palladium, or the like can be reduced during IC module manufacturing. This reduces the manufacturing cost of the IC module. Furthermore, the five contact terminals of the IC module according to the first embodiment each have a rectangular shape with a length of 1.7 mm and a width of 2.0 mm, and are formed to the minimum area specified by the international standard ISO / IEC 7816-2. This allows for a further reduction in the area to be plated with gold, palladium, or the like during IC module manufacturing, thereby further reducing the manufacturing cost of the IC module. The substrate of the IC module according to the first embodiment has a plurality of through-holes facing the five contact terminals, and the five contact terminals are connected to the IC chip by bonding wires passing through the through-holes. This allows the five contact terminals to be connected to the IC chip without exposing the bonding wires on the second main surface of the IC module. This reduces damage to the bonding wires.

[0028] Next, an IC card according to another embodiment will be described. In the following description of the other embodiment, the same parts as those in the first embodiment will be given the same reference numerals, and detailed descriptions thereof will be simplified or omitted. The following description will focus on the parts that are different from the first embodiment.

[0029] (Second embodiment) An IC module and an IC card according to a second embodiment will now be described. The IC module 30 and the IC card 10 according to the second embodiment are configured similarly to those of the first embodiment, except for the configuration described in the second embodiment. Fig. 7 is a plan view of the IC module 30 according to the second embodiment, viewed from the second main surface S2 side of the substrate 40. Fig. 8 is a cross-sectional view of the IC module taken along line CC shown in Fig. 7.

[0030] As shown in FIGS. 7 and 8, of the five contact terminals 50a-50e provided on the second main surface S2 of the substrate 40, at least the contact terminals 50a, 50c, 50d, and 50e located at the corners of the substrate 40 have protrusions 80a, 80b, 80c, and 80d, respectively, that protrude toward the IC chip 60 in an XY-plane view. In one example, the protrusions 80a, 80b, 80c, and 80d have the same shape as the through-holes 42a, 42c, 42d, and 42e, respectively. In one example, as shown in FIG. 7, the protrusions 80a and 80b are each formed in a circular shape that contacts the second side (right edge) of the rectangular contact terminals 50a and 50c that faces the IC chip 60. The protrusion 80c is formed in a rectangular shape that contacts the second side (left edge) of the rectangular contact terminal 50d that faces the IC chip 60. The protrusion 80d is formed in a circular shape that contacts the second side (left edge) of the rectangular contact terminal 50e on the IC chip 60 side. Each of the protrusions 80a to 80d is electrically connected to the corresponding contact terminal 50a, 50c, 50d, and 50e. Each of the protrusions 80a to 80d has a minimum area required for connection to the IC chip 60 by a first connection wiring 61 that passes through the through holes 42a, 42c, 42d, and 42e, which will be described later. In one example, the protrusions 80a to 80d have an area larger than that of the through holes 42a, 42c, 42d, and 42e. Each of the protrusions 80a to 80d and the corresponding contact terminal 50a, 50c, 50d, and 50e may be integrally formed from a common copper foil.

[0031] 7 and 8, contact terminals 50a, 50c, 50d, and 50e including protrusions 80a to 80d, and contact terminal 50b are provided within a peripheral region A2 of a second main surface S2 of the substrate 40. The substrate 40 has four through-holes 42a, 42c, 42d, and 42e formed through the peripheral region A2 and facing the protrusions 80a to 80d, respectively, and a through-hole 42b formed through the peripheral region A2 and facing the contact terminal 50b.

[0032] 7 and 8, the contact terminals 50a, 50c, 50d, and 50e are electrically connected to the IC chip 60 by connecting the protrusions 80a to 80d to the IC chip 60 via first connection wiring 61 that passes through the through holes 42a, 42c, 42d, and 42e, respectively. The contact terminal 50b is electrically connected to the IC chip 60 via the first connection wiring 61 that passes through the through hole 42b.

[0033] Other configurations of the IC card 10 and the IC module 30 are the same as those of the first embodiment described above, and the same parts are given the same reference numerals and detailed description thereof will be omitted.

[0034] The effects of the IC module and IC card according to the second embodiment described above will be described below. The IC module according to the second embodiment can achieve the same effects as those of the first embodiment described above. In the IC module according to the second embodiment, the contact terminals C1, C3, C5, and C7 each have a protrusion that protrudes toward the IC chip. The substrate has a plurality of through-holes that face the protrusions. The protrusions are connected to the IC chip by first connection wiring (bonding wires) that pass through the through-holes, thereby electrically connecting the contact terminals C1, C3, C5, and C7 to the IC chip. This shortens the distance between the through-holes and the center of the substrate on which the IC chip is mounted, thereby shortening the length of the first connection wiring (bonding wires). This reduces the amount of bonding wire used, further reducing the manufacturing cost of the IC module. Damage to the bonding wires is also reduced.

[0035] (Third embodiment) An IC module and an IC card according to the third embodiment will now be described. The IC module 30 and the IC card 10 according to the third embodiment are configured similarly to those of the second embodiment, except for the configuration described in the third embodiment. Fig. 9 is a plan view of the IC card 10 according to the third embodiment. Fig. 10 is a cross-sectional view of the IC card taken along line DD shown in Fig. 9.

[0036] 9 and 10, the IC card 10 according to the third embodiment is a contact / non-contact hybrid IC card. The card substrate 20 of the IC card 10 has a base member 23, sheet materials 24a and 24b, and an antenna 90.

[0037] The base member 23 is formed to extend in a generally plate-like shape and is rectangular in the XY plane view. The base member 23 is not limited to a rectangular shape and can have any other shape. The base member 23 has a first flat surface 231 and a second flat surface 232 opposite the first flat surface 231. The base member 23 is formed of an electrically insulating material, such as glass epoxy.

[0038] The antenna 90 is provided on the second flat surface 232 of the base member 23, and is formed in a spiral shape along the outer periphery of the base member 23 at a predetermined interval from the outer periphery of the base member 23. The antenna 90 is an antenna coil formed of a metal such as aluminum, copper, or silver. The shape of the antenna 90 is not limited to a shape corresponding to the outer periphery of the base member 23, and it may be circular, elliptical, or any other shape.

[0039] 10, the first plane 231 of the base member 23 is covered with a sheet material 24a, and the second plane 232 of the base member 23 and the antenna 90 are covered with a sheet material 24b. The sheet materials 24a and 24b are made of a resin such as polyvinyl chloride or polycarbonate.

[0040] The card substrate 20 has a recess 21 formed on the surface of the card substrate 20. The recess 21 has a rectangular first recess 21a formed on the surface of the card substrate 20 and a rectangular second recess 21b formed in communication with a bottom 22 of the first recess 21a. The first recess 21a is formed in a size and shape corresponding to the substrate 40 and contact terminal group of the IC module 30. The second recess 21b is formed in a size and shape corresponding to the sealing portion 70 of the IC module 30. Both ends 90a, 90b of the antenna 90 are exposed from the bottom 22 of the first recess 21a.

[0041] Next, the IC module 30 will be described. Fig. 11 is a plan view of the IC module 30 according to the third embodiment, as seen from the first main surface S1 side of the substrate. In Fig. 11, both ends 90a, 90b of the antenna 90 are indicated by two-dot chain lines. Fig. 12 is a plan view of the IC module 30 according to the third embodiment, as seen from the first main surface S1 side of the substrate 40, excluding the sealing portion 70. In Fig. 12, the sealing portion 70 is indicated by a two-dot chain line. Fig. 13 is a cross-sectional view of the IC module taken along line EE shown in Fig. 10.

[0042] 11 to 13, the IC module 30 includes an antenna terminal 100 for connecting to an antenna 90. The antenna terminal 100 is provided on the first main surface S1 of the substrate 40. In one example, the antenna terminal 100 includes a pair of antenna connecting terminals 110a and 110b, a coupling portion 120, and a plurality of connecting portions 130. The pair of antenna connecting terminals 110a and 110b are positioned on either side of the IC chip 60 in the X direction. The pair of antenna connecting terminals 110a and 110b are positioned apart from the IC chip 60. The pair of antenna connecting terminals 110a and 110b are positioned outside the outer periphery of the sealing portion 70. The plurality of connecting portions 130 are positioned in the region surrounding the IC chip 60 and inside the outer periphery of the sealing portion 70. The plurality of connecting portions 130 are connected to the antenna connecting terminal 110a or 110b by the coupling portion 120. The antenna connecting terminals 110a and 110b, the linking portion 120, and the plurality of connecting portions 130 are formed by patterning a conductive layer, for example, a metal layer, formed on the first main surface S1.

[0043] 12 and 13, one (130a) of the multiple connection portions 130 connected to the antenna connecting terminal 110a and one (130b) of the multiple connection portions 130 connected to the antenna connecting terminal 110b are each connected to the IC chip 60 by a second connection wiring 62. The antenna connecting terminals 110a, 110b are connected to the connection portions 130a, 130b, respectively, by the linking portion 120, and are thereby each electrically connected to the IC chip 60 via the second connection wiring 62. In one example, the second connection wiring 62 is a gold wire (bonding wire) formed by wire bonding.

[0044] As shown in FIG. 11, the antenna terminal 100 is connected to the antenna 90 by bringing the antenna connection terminals 110a and 110b into contact with both ends 90a and 90b of the antenna 90, respectively.

[0045] As shown in Figure 13, the IC module 30 configured as described above is embedded in the card substrate 20 so that the substrate 40 and contact terminal group of the IC module 30 are accommodated in the first recess 21a, the sealing portion 70 of the IC module 30 is accommodated in the second recess 21b, and the antenna connection terminals 110a and 110b of the antenna terminal 100 are in contact with both ends 90a and 90b of the antenna 90, respectively.

[0046] Other configurations of the IC card 10 and the IC module 30 are the same as those of the second embodiment described above, and the same parts are given the same reference numerals and detailed descriptions thereof will be omitted. The third embodiment configured as described above can also achieve the same effects as the first and second embodiments described above.

[0047] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, as well as within the scope of the invention and its equivalents as set forth in the claims. Multiple embodiments can also be combined as necessary. [Explanation of symbols]

[0048] 10...IC card, 20...card substrate, 30...IC module, 40...substrate, 41, 42...through holes, 50...contact terminal, 60...IC chip, 61...first connecting wiring, 62...second connecting wiring, 70...sealing portion, 80...protruding portion, 90...antenna, 100...antenna terminal.

Claims

1. a substrate having a first major surface and a second major surface; an IC chip mounted on the first main surface; five contact terminals provided in a region surrounding an area facing the IC chip on the second main surface, The five contact terminals include only contact terminals C1, C2, C3, C5 and C7 defined in the international standard ISO / IEC 7816-2, and each of the five contact terminals has an area within the surrounding area that encompasses the minimum contact surface defined in the international standard ISO / IEC 7816-2.

2. 2. The IC module according to claim 1, wherein each of the five contact terminals has a rectangular shape with a length of 1.7 mm and a width of 2.0 mm.

3. the substrate has a plurality of through holes facing the five contact terminals, 3. The IC module according to claim 2, wherein said five contact terminals are connected to said IC chip by bonding wires passing through said through-holes.

4. The contact terminals C1, C3, C5, and C7 each have a protruding portion protruding toward the IC chip, the substrate has a plurality of through holes facing the protrusions, 3. The IC module according to claim 1, wherein said protrusions are connected to said IC chips by bonding wires passing through said through-holes.

5. The IC module according to claim 4 , further comprising an antenna terminal provided on the first main surface of the substrate.

6. A card substrate; an IC module embedded in the card substrate; The IC module comprises: a substrate having a first major surface and a second major surface; an IC chip mounted on the first main surface; five contact terminals provided in a region surrounding an area facing the IC chip on the second main surface, An IC card, wherein the five contact terminals include only contact terminals C1, C2, C3, C5 and C7 defined in the international standard ISO / IEC 7816-2, and each of the five contact terminals has an area within the surrounding area that encompasses the minimum contact surface defined in the international standard ISO / IEC 7816-2.

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