Endoscope, imaging module, and manufacturing method of endoscope

Abstract

To provide a strabismus type endoscope that allows a predetermined direction to be observed and an imaging module of a strabismus type endoscope that allows a predetermined direction to be observed.SOLUTION: In an endoscope, an imaging module 30 is fixed to a tip frame 20 of an insertion part. The imaging module 30 includes a camera unit and a three-dimensional wiring plate. The three-dimensional wiring plate includes a first face, a second face more on a tip side than the first face, and a third face more on a proximal end side than the first face. The camera unit is mounted on the first face inclined at a first angle with respect to a long axis direction of a tip part 11A. The tip frame 20 includes a fourth face that abuts against the second face and a fifth face that abuts against the third face.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an endoscope having an imaging module disposed at the tip of an insertion portion, an imaging module disposed at the tip of an insertion portion of an endoscope, and a method for manufacturing an endoscope having an imaging module disposed at the tip of an insertion portion. [Background technology]

[0002] In an oblique-viewing endoscope, the direction in which the imaging element captures an image (observation direction) is inclined at a predetermined angle with respect to the longitudinal direction of the tip of the insertion section. If an oblique-viewing endoscope cannot observe a predetermined direction, it will be unable to grasp, for example, the position of a treatment tool that protrudes from the side of the tip to perform treatment.

[0003] International Publication No. 2019 / 138606 discloses an oblique-viewing endoscope having an imaging module in which an imaging element is mounted on an inclined surface of a laminated substrate. The imaging element is adhesively fixed to a lens unit via a cover glass. The lens holder of the lens unit is inserted into and fixed in a through-hole in a tip frame. The optical axis direction of the lens unit, i.e., the observation direction of the imaging element, is fixed to the direction of the central axis of the through-hole. The central axis of the through-hole is inclined at a predetermined angle with respect to the tip axis of the endoscope. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2019 / 138606 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the embodiments of the present invention is to provide an oblique-viewing endoscope capable of observing in a predetermined direction, an imaging module for an oblique-viewing endoscope capable of observing in a predetermined direction, and a method for manufacturing an oblique-viewing endoscope capable of observing in a predetermined direction. [Means for solving the problem]

[0006] An endoscope according to an embodiment of the present invention has a tip frame at the tip of an insertion section, and an imaging module fixed to the tip frame. The imaging module includes a camera unit and a three-dimensional wiring board. The three-dimensional wiring board has a first surface, a second surface closer to the tip than the first surface, and a third surface closer to the base than the first surface. The camera unit is mounted on the first surface, which is inclined at a first angle with respect to the longitudinal axis direction of the tip section. The tip frame has a fourth surface abutting the second surface and a fifth surface abutting the third surface.

[0007] An imaging module according to an embodiment of the present invention comprises a camera unit, a first surface on which the camera unit is mounted, and a three-dimensional wiring board having a second surface and a third surface that are at a first angle with the first surface, the second surface being located at one end of the longitudinal direction of the three-dimensional wiring board, the third surface being located on the opposite side of the second surface across the first surface, and the second surface and the third surface being arranged so as to abut against two surfaces of a tip frame of an endoscope, respectively.

[0008] A method for manufacturing an endoscope according to an embodiment of the present invention includes fabricating a three-dimensional wiring board having a first surface, a second surface closer to the tip end than the first surface, and a third surface closer to the base end than the first surface, the second surface and the third surface being arranged on either side of the first surface and forming a first angle with the first surface; mounting a camera unit on the first surface of the three-dimensional wiring board; fabricating an imaging module; and fabricating a tip frame, the tip frame having a fourth surface and a fifth surface, abutting the second surface of the three-dimensional wiring board against the fourth surface of the tip frame and abutting the third surface of the three-dimensional wiring board against the fifth surface of the tip frame; injecting adhesive into the gap between the three-dimensional wiring board and the tip frame; curing the adhesive; and fixing the imaging module to the tip of an insertion portion of an endoscope. [Effects of the Invention]

[0009] According to the embodiments of the present invention, it is possible to provide an endoscope capable of observing in a predetermined direction, an imaging module for an endoscope capable of observing in a predetermined direction, and a method for manufacturing an endoscope capable of observing in a predetermined direction. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram showing the configuration of an endoscope system including an endoscope according to an embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view of the distal end portion of the endoscope according to the embodiment of the present invention. [Figure 3] FIG. 3 is a perspective cross-sectional view of the distal end portion of the endoscope according to the embodiment of the present invention. [Figure 4] FIG. 4 is a perspective view of a three-dimensional wiring board of an endoscope according to an embodiment of the present invention. [Figure 5] FIG. 5 is an exploded cross-sectional view of the distal end portion of the endoscope according to the embodiment of the present invention. [Figure 6] FIG. 6 is a flowchart of a method for manufacturing an endoscope according to an embodiment of the present invention. [Figure 7] FIG. 7 is a perspective cross-sectional view of a camera unit of an endoscope according to an embodiment of the present invention. [Figure 8] FIG. 8 is a perspective cross-sectional view of a three-dimensional wiring board of an endoscope according to an embodiment of the present invention. [Figure 9] FIG. 9 is a cross-sectional view illustrating a method for manufacturing an endoscope according to an embodiment of the present invention. [Figure 10] FIG. 10 is a cross-sectional view illustrating a method for manufacturing an endoscope according to an embodiment of the present invention. [Figure 11] FIG. 11 is a cross-sectional view of the distal end portion of an endoscope according to the first modification of the embodiment of the present invention. [Figure 12] FIG. 12 is a cross-sectional view of the distal end portion of an endoscope according to the second modification of the embodiment of the present invention. [Figure 13] FIG. 13 is a cross-sectional view of the distal end portion of an endoscope according to a third modification of the embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0011] <Embodiment> As shown in FIG. 1, an endoscope system 2 including an endoscope 10 of the embodiment includes the endoscope 10, a processor 17, a light source device 18, and a monitor 19.

[0012] In the following description, the drawings based on each embodiment are schematic diagrams. The relationship between the thickness and width of each part, the thickness ratio of each part, and the relative angle are different from the actual ones. The drawings also include parts where the dimensional relationships and ratios are different from each other. Some components are not shown and have not been assigned reference numerals.

[0013] The endoscope 10 is an oblique-viewing endoscope in which an insertion section 11 is inserted into the body of a subject, captures in-vivo images, and outputs image capture signals. An operation section 12 having various buttons for operating the endoscope 10 is disposed at the base end of the insertion section 11 of the endoscope 10. The insertion section 11 is composed of a tip section 11A in which an imaging module 30 is disposed, a freely bendable bending section 11B connected to the base end of the tip section 11A, and a flexible section 11C connected to the base end of the bending section 11B. The bending section 11B is bent by operating the operation section 12.

[0014] A universal cord 13 extending from the operation unit 12 is connected to a processor 17 and a light source device 18 by a connector 14. A treatment tool is inserted from a treatment tool insertion port 12A of the operation unit 12, as will be described later.

[0015] The processor 17 controls the entire endoscope system 2, and also processes the imaging signal output from the imaging module 30 to output the image signal. The monitor 19 displays the image signal output from the processor 17.

[0016] The light source device 18 has, for example, a white LED. The illumination light emitted by the light source device 18 is guided to the distal end portion 11A by a light guide 40 (see FIG. 3) that passes through the universal cord 13 and the insertion portion 11, and illuminates the subject via an illumination lens 41 (see FIG. 3).

[0017] Although the endoscope 10 is a flexible endoscope for medical use, endoscopes in other embodiments may be rigid endoscopes or industrial endoscopes.

[0018] <Tip configuration> 2 and 3, the distal end frame 20, which is the main component of the distal end portion 11A of the endoscope 10, is a hard component made of a metal such as stainless steel. A bending portion 11B is connected to the proximal end side of the distal end frame 20 disposed at the distal end of the insertion portion 11.

[0019] A raising table accommodating space S20 is formed in the distal end frame 20 to accommodate the raising table 60. Although not shown, the raising table 60 is inserted from the treatment tool insertion port 12A and is used to control the protrusion direction of the treatment tool that protrudes from the opening of the distal end portion 11A via the channel tube.

[0020] An illumination lens 41, an imaging module 30, and a cleaning nozzle 50 are arranged in this order on the tip frame 20 along the longitudinal axis direction LA of the tip portion 11A. The illumination lens 41 emits illumination light toward the subject. The cleaning nozzle 50 sprays fluid toward the illumination lens 41 and the imaging module 30 to remove deposits.

[0021] 3, the tip frame 20 has a through-hole H60 to which the channel tube is connected, a through-hole H30 to which the imaging module 30 is inserted, a through-hole H40 to which the illumination lens 41 is disposed, and a through-hole H50 to which the cleaning nozzle 50 is connected. For example, the through-hole H30 has openings on the outer surface and the inner surface of the tip frame 20. Although not shown, the tip frame 20 has a large opening on the side, and after multiple components are disposed inside, the opening is closed by a side cover.

[0022] Imaging module 30 includes three-dimensional wiring board 31 and camera unit 32. As will be described in detail later, imaging module 30 is fixed to tip frame 20 using adhesive 70.

[0023] As shown in Fig. 4, three-dimensional wiring board 31 has a complex three-dimensional structure. Three-dimensional wiring board 31 is a molded interconnect device (MID) in which a conductor pattern (not shown) is disposed on the surface of an injection-molded three-dimensional product. Unlike flat wiring boards, three-dimensional wiring board 31 allows the shape to have a function, and further allows conductor patterns to be formed on inclined surfaces, vertical surfaces, curved surfaces, through holes, etc.

[0024] The top surface 31SA of the three-dimensional wiring board 31 includes a first surface 31S1, a second surface 31S2 located closer to the distal end than the first surface 31S1, a third surface 31S3 located closer to the proximal end than the first surface 31S1, and a sixth surface 31S6 located between the first surface 31S1 and the third surface 31S3. The three-dimensional wiring board 31 is surrounded by a frame-shaped wall 31F and has a recess H31 with the first surface 31S1 as its bottom surface. Although not shown, multiple wirings are arranged on the bottom surface 31SB of the three-dimensional wiring board 31. The elongated three-dimensional wiring board 31 is fixed to the distal end frame 20 so that its long axis direction is the same as the long axis direction LA of the distal end portion 11A.

[0025] The second surface 31S2 and the third surface 31S3 are located on the same plane and are parallel to each other, sandwiching the first surface 31S1. In contrast, the first surface 31S1 is inclined at a first angle θ1 with respect to the second surface 31S2 and the third surface 31S3.

[0026] As shown in the exploded view of FIG. 5, a camera unit 32 is inserted into a recess H31 of a three-dimensional wiring board 31 of an imaging module 30. That is, the camera unit 32 is mounted on a first surface 31S1 of the three-dimensional wiring board 31. An optical axis O32 of the camera unit 32 is perpendicular to the first surface 31S1. Therefore, a second angle θ2 formed between the optical axis O32 of the camera unit 32 and a line perpendicular to the long axis direction LA is the same as the first angle θ1, which is the inclination angle of the first surface 31S1. The second angle θ2 is the angle of the optical axis O32 of the camera unit 32 in a direction perpendicular to the long axis direction LA.

[0027] The second angle θ2 is, for example, −30 degrees to 30 degrees. In order for the camera unit 32 to observe a predetermined direction, the second angle θ2 needs to be controlled so that the manufacturing error is within, for example, +7 degrees.

[0028] In conventional endoscopes, in which the lens holder of the lens unit is inserted and fixed into a through-hole in the tip frame, as described in the background art, there is a gap between the outer surface of the lens holder and the inner surface of the through-hole, which can cause the optical axis of the lens unit to tilt from the central axis of the through-hole, making it difficult to observe the field of view in a specified direction.

[0029] As already described, in endoscope 10 (imaging module 30), second surface 31S2 and third surface 31S3 of circuit board 31 are located on the same plane and are parallel to each other. Note that first angle θ1 formed between second surface 31S2 and third surface 31S3 and first surface 31S1 is determined when circuit board 31 is designed.

[0030] Meanwhile, fourth surface 20S4 and fifth surface 20S5 of inner surface 20SB of tip frame 20 are parallel to long axis direction LA of tip portion 11A and are located on the same plane. Then, three-dimensional wiring board 31 is fixed to inner surface 20SB of tip frame 20 using adhesive 70, with second surface 31S2 and third surface 31S3 abutting fourth surface 20S4 and fifth surface 20S5 of tip frame 20. At this time, wall 31F constituting recess H31 of three-dimensional wiring board 31 is inserted into through-hole H30 of tip frame 20.

[0031] The second surface 31S2 and the third surface 31S3 of the three-dimensional wiring board 31 abut against the fourth surface 20S4 and the fifth surface 20S5 of the tip frame 20. Because the fourth surface 20S4 and the fifth surface 20S5 are parallel to the long axis direction LA, the second surface 31S2 and the third surface 31S3 of the three-dimensional wiring board 31 are automatically parallel to the long axis direction LA as well. Therefore, the first surface 31S1, which is inclined at a first angle θ1 with respect to the second surface 31S2 of the three-dimensional wiring board 31, is also inclined at the first angle θ1 with respect to the long axis direction LA. The optical axis O32 of the camera unit 32 is inclined at a second angle θ2, which is the same as the first angle θ1, with respect to the long axis direction LA.

[0032] The angle of the imaging module 30 relative to the distal end frame 20 is defined by two surfaces (a second surface 31S2 on the distal end side and a third surface 31S3 on the proximal end side) that are disposed on either side of the first surface 31S1 on which the camera unit 32 is mounted. For this reason, the endoscope 10 ensures a higher degree of accuracy in the angle of the optical axis O32 of the camera unit 32 relative to the distal end frame 20, i.e., the angle of the optical axis O32 relative to the long axis direction LA, than an endoscope in which the angle between the imaging module and the distal end frame is defined by a single surface.

[0033] As described above, the imaging module 30 of this embodiment includes a camera unit 32 and a three-dimensional wiring board 31. The three-dimensional wiring board 31 has a first surface 31S1 on which the camera unit 32 is mounted, and second and third surfaces 31S2 and 31S3 that form a first angle θ1 with the first surface 31S1. The second surface 31S2 is located on one end side of the long axis direction LA of the three-dimensional wiring board 31, and the third surface 31S3 is located on the opposite side of the second surface 31S2, with the camera unit 32 sandwiched between them. The second surface 31S2 and the third surface 31S3 are arranged so as to abut against two surfaces of the distal end frame 20 of the endoscope 10, respectively.

[0034] Adhesive 70 is provided in gap G (see FIG. 9) between sixth surface 31S6 of three-dimensional wiring board 31 and tip frame 20. Adhesive 70 is not provided between second surface 31S2 and third surface 31S3 and inner surface 20SB (fourth surface 20S4, fifth surface 20S5) of tip frame 20. Gaps G may be provided at other positions between three-dimensional wiring board 31 and tip frame 20, and adhesive 70 may be provided therein.

[0035] Because no adhesive is applied to the contact surfaces for positioning (angle setting), there is no risk of variations in the angle of the imaging module 30 relative to the distal end frame 20 due to variations in the thickness of the adhesive. For this reason, the endoscope 10 has particularly small manufacturing errors, and for example, the accuracy of the tilt angle of the optical axis O32 of the camera unit 32 relative to the long axis direction LA is ±3 degrees or less.

[0036] <Endoscope manufacturing method> A method for manufacturing the endoscope 10, particularly the tip portion 11A, will be described with reference to the flowchart of FIG.

[0037] <Step S10> Fabrication of camera unit and three-dimensional wiring board As shown in Fig. 7, the camera unit 32 includes an imaging element 32A and an imaging optical system 32B. The imaging element 32A is a CCD, CMOS, or the like that converts the subject image collected by the imaging optical system 32B into an electrical signal. The imaging element 32A may include a cover glass. The imaging optical system 32B is made up of multiple optical elements (lenses, filters, etc.). The imaging optical system 32B is fabricated by cutting a laminated wafer in which multiple optical wafers, each including multiple optical elements, are stacked.

[0038] A ball grid array made up of a plurality of bonding members 32C is disposed on the back surface of the imaging element 32A. The bonding members 32C are solder balls, gold bumps, or the like.

[0039] As shown in Fig. 8, a plurality of pads 31T1 are arranged on a first surface 31S1, which is the bottom surface of recess H31 of three-dimensional wiring board 31. Three-dimensional wiring board 31 has through-hole wiring 31T2 below pads 31T1, which leads to a bottom surface 31SB opposite first surface 31S1. Pads 31T1 and through-hole wiring 31T2 are arranged by plating, screen printing, sputtering, metal vapor deposition, or the like. Although not shown, wiring extending from through-hole wiring 31T2 is arranged on bottom surface 31SB, and electronic components such as chip capacitors are mounted on the wiring, with cables further connected to the ends.

[0040] A first length L1 in the longitudinal direction LA between the first surface 31S1 and the second surface 31S2 is shorter than a second length L2 in the longitudinal direction LA between the first surface 31S1 and the third surface 31S3. By shortening the length from the camera unit 32 to the tip of the tip frame 20, the endoscope 10 becomes smaller and less invasive.

[0041] In addition, in the direction perpendicular to the long axis direction LA, the positions of the second surface 31S2 and the third surface 31S3 are within the range of the depth H32 of the recess H31 (the length in the optical axis direction of the camera unit 32). Therefore, the length (outer diameter) of the tip portion 11A in the direction perpendicular to the long axis direction LA of the endoscope 10 is short and minimally invasive.

[0042] <Step S20> Imaging module fabrication Camera unit 32 is inserted into recess H31 of three-dimensional wiring board 31, and joining member 32C of camera unit 32 is joined to pad 31T1 on first surface 31S1 of three-dimensional wiring board 31. Sealing resin 32D is filled into the gap between camera unit 32 housed in recess H31 and the wall surface of recess H31. Electronic components such as chip capacitors are mounted on the wiring on bottom surface 31SB of three-dimensional wiring board 31, and cables are joined to the ends of the wiring.

[0043] <Step S30> Attach the imaging module to the front end frame 9, three-dimensional wiring board 31 is temporarily fixed in contact with the inner surface of tip frame 20. That is, second surface 31S2 of three-dimensional wiring board 31 contacts fourth surface 20S4 of tip frame 20, and third surface 31S3 of three-dimensional wiring board 31 contacts fifth surface 20S5 of tip frame 20. A gap G is formed between sixth surface 31S6 of three-dimensional wiring board 31 and tip frame 20. Gap G may be located at a position different from the above, as long as it is between three-dimensional wiring board 31 and tip frame 20.

[0044] <Step S40> Adhesive injection 10 , adhesive 70 is injected into gap G between sixth surface 31S6 of three-dimensional wiring board 31 and tip frame 20. Adhesive 70 is, for example, an ultraviolet-curable, heat-curable, or ultraviolet-heat-curable epoxy resin. Adhesive 70 is also provided in the gap between through-hole H30 and imaging module 30.

[0045] No adhesive 70 is applied between the second surface 31S2 and the fourth surface 20S4, and between the third surface 31S3 and the fifth surface 20S5. However, it goes without saying that a small amount of adhesive 70 may be present between the two abutting surfaces due to unavoidable gaps caused by manufacturing errors or scratches on the surfaces of the surfaces.

[0046] <Step S50> Adhesive hardening The adhesive 70 is cured, and the imaging module 30 is fixed to the tip frame 20.

[0047] <Step S60> Arrangement of illumination lens The illumination lens 41, the light guide 40, etc. are fixed to the end frame 20. The illumination lens 41, etc. may be fixed to the end frame 20 before the imaging module 30 is fixed to the end frame 20.

[0048] <Step S70> Fixing the side cover For example, a side opening (not shown) of the tip frame 20 is closed by fixing a side cover. Before the imaging module 30 is fixed to the tip frame 20, the side opening may be closed by fixing the side cover.

[0049] According to the manufacturing method of the endoscope of this embodiment, it is possible to easily manufacture an endoscope that can accurately observe in a predetermined direction. For example, it is possible to easily manufacture an endoscope in which the inclination angle of the optical axis O32 of the camera unit 32 with respect to the long axis direction LA is accurate to within +3 degrees.

[0050] <Modification> The modified endoscopes 10A-10C (imaging modules 30A-30C) are similar to the endoscope 10 and have the same effects as the endoscope 10. For this reason, in the following description, components having the same functions as those of the endoscope 10 are given the same reference numerals as those of the endoscope 10, and explanations thereof will be omitted.

[0051] <Variation 1> 11, in an endoscope 10A of this modification, the second surface 31S2 and the third surface 31S3 of the three-dimensional wiring board 31A of the imaging module 30A are parallel to each other but are not located on the same plane. That is, the third surface 31S3 is located above the second surface 31S2 in the figure. Similarly, the fourth surface 20S4 and the fifth surface 20S5 of the tip frame 20A are parallel to each other but are not located on the same plane.

[0052] However, the second surface 31S2 abuts against the fourth surface 20S4, and the third surface 31S3 and the fifth surface 20S5 abut against each other, so that the first surface 31S1 is inclined at a predetermined angle with respect to the long axis direction LA. Therefore, the optical axis O32 of the camera unit 32 is inclined at a predetermined angle with respect to the long axis direction LA.

[0053] <Variation 2> 12, in an endoscope 10B of this modified example, the second surface 31S2 and the third surface 31S3 of the three-dimensional wiring board 31B of the imaging module 30B are not parallel to each other, nor are they parallel to the long axis direction LA. In addition, the fourth surface 20S4 and the fifth surface 20S5 of the tip frame 20B are not parallel to each other, nor are they parallel to the long axis direction LA.

[0054] However, second surface 31S2 of three-dimensional wiring board 31B is parallel to fourth surface 20S4 of tip frame 20B, and third surface 31S3 is parallel to fifth surface 20S5. With second surface 31S2 abutting against fourth surface 20S4 and third surface 31S3 abutting against fifth surface 20S5, first surface 31S1 is inclined at a predetermined angle with respect to long axis direction LA. Therefore, optical axis O32 of camera unit 32 is inclined at a predetermined angle with respect to long axis direction LA.

[0055] <Variation 3> 13, an endoscope 10C of this modified example has a three-dimensional wiring board 31C of an imaging module 30C that does not have a recess surrounded by a wall, as in the three-dimensional wiring board 31. The inner diameter of a through hole H20 of a tip frame 20C is slightly larger than the outer diameter of a camera unit 32.

[0056] The endoscope 10C does not have a wall that forms a recess, so the length of the tip portion can be shortened. Furthermore, like the endoscope 10, the endoscope 10C can accurately observe in a predetermined direction.

[0057] The ranges of the numerical values described above are not limited to the ranges described above and can be increased or decreased as appropriate. The endoscope 10 may also have a rigid endoscope with a rigid insertion section 11. The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0058] 2. Endoscope system 10, 10A-10C... Endoscope 11 Insertion section 11A...Tip 11B... Curved section 11C...Soft part 12...Operation unit 12A...Treatment tool insertion port 13. Universal Code 14···Connector 17. Processor 18...Light source device 19 Monitor 20 Tip frame 30 Imaging module 31...Three-dimensional wiring board 32 Camera unit 40 Light guide 41. Lighting lens 50···Cleaning nozzle 60...Elevating platform 70... Adhesive

Claims

1. An endoscope having a distal end frame at a distal end of an insertion section, and an imaging module fixed to the distal end frame, the imaging module includes a camera unit and a three-dimensional wiring board; the three-dimensional wiring board has a first surface, a second surface closer to the tip end than the first surface, and a third surface closer to the base end than the first surface, the camera unit is mounted on the first surface which is inclined at a first angle with respect to the longitudinal axis direction of the tip portion, and the tip frame has a fourth surface abutting the second surface and a fifth surface abutting the third surface.

2. The endoscope according to claim 1 , wherein the second surface, the third surface, the fourth surface, and the fifth surface are parallel to the longitudinal axis direction.

3. 2. The endoscope according to claim 1, wherein the three-dimensional wiring board is an MID.

4. the three-dimensional wiring board has a recess surrounded by a wall and having the first surface as a bottom surface, The camera unit is housed in the recess, The endoscope according to claim 3, wherein the wall constituting the recess is inserted into a through-hole in the distal end frame.

5. 2. The endoscope according to claim 1, wherein a first length between the first surface and the second surface is smaller than a second length between the first surface and the third surface.

6. 2. The endoscope according to claim 1, wherein the first angle is equal to a second angle formed between an optical axis of the camera unit and a perpendicular to the first surface.

7. The endoscope according to claim 1 , wherein the second surface and the third surface are located on a single plane.

8. The endoscope according to claim 7, wherein the fourth surface and the fifth surface are located on the same plane.

9. 8. The endoscope according to claim 7, wherein the positions of the second surface and the third surface are within a range of a length in the optical axis direction of the camera unit in a direction perpendicular to the long axis direction.

10. the three-dimensional wiring board has a sixth surface between the first surface and the third surface, 2. The endoscope according to claim 1, wherein an adhesive is provided in a gap between the sixth surface and the distal end frame.

11. 11. The endoscope according to claim 10, wherein the adhesive is not provided between the second surface and the third surface and the distal end frame.

12. The device includes a camera unit and a three-dimensional wiring board, an imaging module characterized in that the three-dimensional wiring board has a first surface on which the camera unit is mounted, and second and third surfaces that are at a first angle with the first surface, the second surface being located at one end side of the longitudinal axis of the three-dimensional wiring board, the third surface being located on the opposite side of the second surface across the first surface, and the second and third surfaces being arranged so as to abut against two surfaces of a tip frame of an endoscope, respectively.

13. a three-dimensional wiring board having a first surface, a second surface located closer to a distal end than the first surface, and a third surface located closer to a proximal end than the first surface, the second surface and the third surface being disposed on either side of the first surface and forming a first angle with the first surface; a camera unit is mounted on the first surface of the three-dimensional wiring board to fabricate an imaging module; A tip frame is fabricated, the tip frame having a fourth surface and a fifth surface; the second surface of the three-dimensional wiring board is brought into contact with the fourth surface of the tip frame, and the third surface of the three-dimensional wiring board is brought into contact with the fifth surface of the tip frame; Injecting adhesive into the gap between the three-dimensional wiring board and the tip frame; The adhesive is cured, A method for manufacturing an endoscope, comprising: fixing the imaging module to a distal end of an insertion portion of the endoscope.

14. the three-dimensional wiring board has a recess surrounded by a wall, the recess having the first surface as a bottom surface, The method for manufacturing an endoscope according to claim 13, wherein the camera unit including an imaging optical system and an imaging element is housed in the recess.

Images