Light-emitting apparatus, display apparatus, photoelectric conversion apparatus, electronic apparatus, lighting apparatus, mobile body, and wearable device

Abstract

To provide a technique advantageous for suppressing uneven distribution of light emission intensity.SOLUTION: There is provided a light-emitting apparatus in which a first substrate having a display region having a plurality of pixels and a second substrate provided with a circuit for operating the plurality of pixels are stacked. The circuit includes a first circuit and a second circuit located between the first circuit and an outer edge of the second substrate. The first circuit has a greater amount of heat generation per unit area than the second circuit. In an orthogonal projection onto a main surface of the first substrate including the display region, the first circuit is disposed inside an outer edge of the display region, and a center of the display region is disposed inside an outer edge of the first circuit.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a light-emitting device, a display device, a photoelectric conversion device, an electronic device, a lighting device, a moving object, and a wearable device. [Background technology]

[0002] Patent Document 1 shows a display device in which a substrate on which a display region having a plurality of light-emitting elements is arranged and a substrate on which a drive circuit is arranged are stacked. Since the light-emitting intensity of the light-emitting elements is temperature-dependent, Patent Document 1 shows that the power consumption of the drive circuit is reduced to prevent the heat generated by the drive circuit from causing uneven temperature distribution in the display region. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2023-044407 Summary of the Invention [Problem to be solved by the invention]

[0004] In a light-emitting device, power for driving the display area can be supplied from outside the display area, which can result in uneven distribution of light emission intensity due to a voltage drop in the power supply voltage from the periphery to the center of the display area. It is necessary to consider not only the distribution of light emission intensity caused by temperature distribution, but also the distribution of light emission intensity caused by the distribution of power supply voltage supplied to the display area.

[0005] An object of the present invention is to provide a technique that is advantageous in suppressing non-uniform distribution of light emission intensity. [Means for solving the problem]

[0006] In view of the above problems, a light-emitting device according to an embodiment of the present invention is a light-emitting device in which a first substrate having a display area in which a plurality of pixels are arranged and a second substrate having a circuit for operating the plurality of pixels are stacked, wherein the circuit includes a first circuit and a second circuit located between the first circuit and the outer edge of the second substrate, the first circuit generates a larger amount of heat per unit area than the second circuit, and in an orthogonal projection onto a main surface of the first substrate having the display area, the first circuit is arranged inside the outer edge of the display area, and the center of the display area is arranged inside the outer edge of the first circuit. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a technique that is advantageous in suppressing non-uniform distribution of light emission intensity. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a diagram showing a configuration example of a light emitting device according to an embodiment of the present invention; [Figure 2] FIG. 2 is a cross-sectional view showing a configuration example of the light emitting device of FIG. [Figure 3] FIG. 2 is a circuit diagram showing a configuration example of a pixel of the light-emitting device in FIG. [Figure 4] 2 is a diagram showing an example of the arrangement of a signal processing circuit in the light emitting device of FIG. 1. [Figure 5] FIG. 2 is a diagram showing a modification of the light emitting device of FIG. [Figure 6] 7 is a diagram showing an example of the arrangement of a signal processing circuit in the light emitting device of FIG. 6. [Figure 7] FIG. 2 is a diagram showing a modification of the light emitting device of FIG. [Figure 8] 8 is a diagram showing an example of the arrangement of a signal processing circuit in the light emitting device of FIG. 7. [Figure 9] 2 is a cross-sectional view showing a configuration example of a pixel of the light-emitting device of FIG. [Figure 10] FIG. 1 is a diagram showing an example of an image forming apparatus using a light emitting device according to an embodiment of the present invention. [Figure 11] 1A and 1B are diagrams illustrating an example of a display device using the light-emitting device of this embodiment. [Figure 12]FIG. 1 is a diagram showing an example of a photoelectric conversion device using the light emitting device of this embodiment. [Figure 13] 1A to 1C are diagrams illustrating examples of electronic devices using the light-emitting device of this embodiment. [Figure 14] 1A and 1B are diagrams illustrating an example of a display device using the light-emitting device of this embodiment. [Figure 15] 1 is a diagram showing an example of a lighting device using the light-emitting device of this embodiment. [Figure 16] 1A and 1B are diagrams showing an example of a moving object using the light emitting device of the present embodiment. [Figure 17] FIG. 1 is a diagram showing an example of a wearable device using the light-emitting device of the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0010] A light-emitting device according to an embodiment of the present disclosure will be described with reference to Figures 1 to 8. Figure 1 schematically shows the configuration of a light-emitting device 500 according to this embodiment. The light-emitting device 500 is formed by stacking a substrate 10 having a display region 100 in which a plurality of pixels 101 are arranged, and a substrate 20 having a circuit for operating the plurality of pixels 101. The plurality of pixels 101 arranged in the display region 100 of the substrate 10 may be arranged to form a plurality of rows and a plurality of columns.

[0011] The plurality of pixels 101 are supplied with power by an electrode layer 116 that is arranged to cover each of the plurality of pixels and transmits light emitted by each of the plurality of pixels, and by a plurality of electrode patterns 122. In the configuration shown in Fig. 1, each of the plurality of electrode patterns 122 includes an electrode pattern 122 that extends along a row direction (e.g., the horizontal direction in Fig. 1) and an electrode pattern 122 that extends along a column direction that intersects with the row direction. However, the plurality of electrode patterns 122 may extend along only either the row direction or the column direction within the display region 100.

[0012] In an orthogonal projection onto a main surface 151 of the substrate 10 that includes the display region 100, the electrode layer 116 is connected to a power supply pattern 103 that is arranged outside the display region 100. The electrode layer 116 is electrically connected to an external electrode P2 via the power supply pattern 103. A power supply voltage is supplied to each of the multiple pixels 101 from the external electrode P2 via the electrode layer 116 and the power supply pattern 103. The power supply pattern 103 may be arranged to surround the outer edge of the display region 100, as shown in FIG. 1 .

[0013] In orthogonal projection onto the main surface 151 of the substrate 10, the plurality of electrode patterns 122 are connected to a power supply pattern 102 arranged outside the display region 100. The plurality of electrode patterns 122 are electrically connected to an external electrode P1 via the power supply pattern 102. A power supply voltage is supplied to each of the plurality of pixels 101 from the external electrode P1 via the plurality of electrode patterns 122 and the power supply pattern 102. The power supply pattern 102 may be arranged to surround the outer edge of the display region 100, as shown in FIG. 1 .

[0014] Fig. 2 is a cross-sectional view showing an example of the configuration of the substrate 10. In the configuration shown in Fig. 2, the substrate 10 may include a semiconductor substrate 120, an interlayer insulating film 121, a wiring pattern 110, a transistor 111, a shallow trench isolation (STI) 112, a lower electrode 113, a bank 114, a light-emitting layer 115, an electrode layer 116, a sealing film 117, a color filter 118, and a protective film 119.

[0015] A plurality of transistors 111, each isolated by an STI 112, are arranged on a semiconductor substrate 120 made of silicon or the like. An interlayer insulating film 121 having a wiring pattern 110 formed thereon is arranged on the semiconductor substrate 120, and a lower electrode 113 is arranged on the interlayer insulating film 121. The lower electrodes 113 can be arranged corresponding to each of the plurality of pixels 101. The lower electrodes 113 are electrically isolated from each other by banks 114 made of a dielectric material. A light-emitting layer 115 using an organic electroluminescence (EL) or the like is arranged between the lower electrode 113 and the electrode layer 116, and emits light in response to a current flowing between the lower electrode 113 and the electrode layer 116 via the light-emitting layer 115.

[0016] A portion of the wiring pattern 110 formed within the display region 100 functions as the above-mentioned multiple electrode patterns 122. The electrode layer 116 is in contact with the power supply pattern 103, which is formed on the same conductive layer as the lower electrode 113, outside the display region 100. In the configuration shown in FIG. 2, the power supply pattern 103 is formed on the same conductive layer as the lower electrode 113, but this is not a limitation and the power supply pattern 103 may be formed using any appropriate conductive layer. As shown in FIG. 1, the connection portion 123 connecting the electrode layer 116 and the power supply pattern 103 may be arranged to surround the display region 100. The electrode layer 116 may be electrically connected to the lower electrode 113 formed corresponding to each pixel 101 via the light-emitting layer 115. The lower electrode 113 is connected to the electrode pattern 122 via the transistor 111 or the like.

[0017] The sealing film 117 may be provided to protect the light-emitting layer 115, the transistor 111, and the like from moisture and the like. The sealing film 117 may be made of an inorganic material such as silicon nitride or aluminum oxide. Alternatively, the sealing film 117 may be made of an organic material such as resin. The color filter 118 may transmit different colors, such as red, blue, and green, for each pixel 101. This allows the light-emitting device 500 to display in color. Alternatively, the color filter 118 may not be provided. In this case, the light-emitting device 500 may display in monochrome, or may display in color by causing the light-emitting layer 115 to emit light in a different color for each pixel 101. The protective film 119 may be provided to protect the substrate 10 from dust and the like. The protective film 119 may be made of an inorganic material or an organic material.

[0018] The substrate 20 is provided with circuits for operating the plurality of pixels 101 arranged in the display region 100 of the substrate 10. In the configuration shown in FIG. 1, the circuits for operating the plurality of pixels 101 arranged in the display region 100 of the substrate 10 include an input processing circuit 200, a signal processing circuit 201, and a drive circuit 202. In the configuration shown in FIG. 1, the input processing circuit 200 and the drive circuit 202 are located between the signal processing circuit 201 and the outer edge of the substrate 20. The input processing circuit 200 converts an analog video signal supplied from the input terminal IN into a digital video signal. The signal processing circuit 201 is a digital circuit that generates digital signals for controlling light emission of the plurality of pixels 101 based on the digital video signal generated by the input processing circuit 200. The signal processing circuit 201 may have correction functions such as gamma correction and white balance correction. The drive circuit 202 generates drive signals for driving the plurality of pixels 101 based on the digital signal generated by the signal processing circuit 201. The generated drive signals are supplied to each of the plurality of pixels 101 arranged on the substrate 10 via a plurality of electrical connection parts 300 .

[0019] The signal processing circuit 201 is an example of a circuit that generates more heat per unit area than the input processing circuit 200 and the drive circuit 202. For example, the signal processing circuit 201 may be a circuit that generates the largest amount of heat per unit area among circuits for operating the pixels 101 arranged on the substrate 20. Furthermore, for example, the signal processing circuit 201 may be a circuit that constitutes at least a part of a digital circuit that generates digital signals for controlling the plurality of pixels 101 based on externally input signals such as the digital video signals described above. The signal processing circuit 201 may be a circuit that consumes more power per unit area than the input processing circuit 200 and the drive circuit 202, or may be a circuit that consumes the largest amount of power per unit area among circuits for operating the pixels 101 arranged on the substrate 20. Furthermore, the signal processing circuit 201 may be a circuit that has a higher density of transistors 111 than the input processing circuit 200 and the drive circuit 202, or may be a circuit that has the highest density of transistors 111 among circuits for operating the pixels 101 arranged on the substrate 20.

[0020] In addition to the input processing circuit 200, the signal processing circuit 201, and the drive circuit 202, the substrate 20 may also be provided with, for example, a temperature measurement circuit that acquires the temperature of the light emitting device 500. Furthermore, for example, the substrate 20 may also be provided with a circuit having another function, such as an OTP-ROM for storing correction data. In this case, the signal processing circuit 201 may be the circuit that generates the largest amount of heat per unit area among all the circuits provided on the substrate 20. Furthermore, the signal processing circuit 201 may also be the circuit that consumes the largest amount of power per unit area among all the circuits provided on the substrate 20, or may be the circuit that has the highest density of transistors 111 arranged therein.

[0021] FIG. 3 shows an example of the configuration of a pixel 101 arranged in the display region 100. In the configuration shown in FIG. 3, the pixel 101 includes a light-emitting element D1, a reset transistor M1, capacitors C1 and C2, a switching transistor M2, a row selection transistor M3, and a drive transistor M4. When the difference between the power supply voltage supplied from the electrode pattern 122 and the power supply voltage supplied from the electrode layer 116 decreases, the voltage applied to the drive transistor M4 and the light-emitting element D1 decreases, thereby reducing the light emission intensity of the pixel 101. Furthermore, when the temperature of the pixel 101 increases, the drain current of the drive transistor M4 increases, increasing the current driving the light-emitting element D1, thereby increasing the light emission intensity. In this way, the light emission intensity of the pixel 101 arranged in the display region 100 depends on both the temperature and the power supply voltage supplied.

[0022] FIG. 4 shows an example of the arrangement of the signal processing circuit 201 in orthogonal projection onto the main surface 151 of the substrate 10. As shown in FIG. 4, in this embodiment, the signal processing circuit 201 is arranged inside the outer edge of the display region 100. Furthermore, the center C of the display region 100 is arranged inside the outer edge of the signal processing circuit 201. The center C of the display region 100 may be, for example, the geometric center of gravity of the display region 100 in orthogonal projection onto the main surface 151 of the substrate 10. With this arrangement, the temperature of the multiple pixels 101 tends to increase from the outer edge of the display region 100 toward the center C due to heat generation by the signal processing circuit 201. As a result, the emission intensity distribution of the display region 100 due to the temperature distribution tends to increase from the outer edge of the display region 100 toward the center C.

[0023] On the other hand, the electrode layer 116 is supplied with power (voltage) from a power supply pattern 103 (connection portion 123) arranged so as to surround the display region 100. Furthermore, connection portions 124 between the electrode patterns 122 extending in the row and column directions and the power supply pattern 102 are arranged so as to surround the display region 100. In other words, the power (power supply voltage) supplied from the external electrodes P1 and P2 is supplied from around the outer edge of the display region 100. Therefore, due to a voltage drop, the difference between the power supply voltage supplied to the pixels 101 from the external electrode P1 and the power supply voltage supplied to the pixels 101 from the external electrode P2 tends to decrease from the outer edge toward the center C of the display region 100. As a result, the emission intensity distribution of the display region 100 caused by the power supply voltage distribution tends to decrease from the outer edge toward the center C of the display region 100.

[0024] In the light emitting device 500 having the above-described configuration, the emission intensity distribution caused by the temperature distribution associated with heat generation in the signal processing circuit 201 and the emission intensity distribution caused by the distribution of the power supply voltage supplied to the plurality of pixels 101 have opposite distributions, and thus reduce each other. In other words, the light emitting device 500 of this embodiment can effectively suppress the non-uniform emission intensity distribution caused by the non-uniform temperature distribution in the display region 100 and the non-uniform emission intensity distribution caused by a voltage drop in the power supply voltage in the display region.

[0025] Fig. 5 shows a modified example of the light emitting device 500 shown in Fig. 1. Below, differences from the above-mentioned configuration will be mainly described, and descriptions of configurations that may be similar will be omitted as appropriate.

[0026] In the configuration shown in Fig. 1, the multiple electrode patterns 122 are arranged in a grid pattern in the row and column directions. On the other hand, in the configuration shown in Fig. 5, each of the multiple electrode patterns 122 extends along the column direction and is connected (at connection portions 124) to a portion of the power supply pattern 102 that extends along the row direction, intersecting the column direction. Also, each of the multiple electrode patterns 122 is connected to two sides of the power supply pattern 102 that extend along the row direction. With the configuration of the electrode patterns 122 as shown in Fig. 5, the gradient of the power supply voltage supplied from the external electrode P1 to each of the multiple pixels 101 via the electrode patterns 122 tends to be steeper in the column direction than in the row direction.

[0027] FIG. 6 shows an example of the arrangement of the signal processing circuit 201 in an orthogonal projection onto the main surface 151 of the substrate 10. As shown in FIG. 6, depending on the arrangement of the multiple electrode patterns 122, the length of the signal processing circuit 201 in the row direction, which intersects with the direction in which the electrode patterns 122 extend, is longer than the length in the column direction in which the electrode patterns 122 extend. Considering the steep gradient of the power supply voltage in the column direction described above, the power supply voltage supplied to pixels 101 located farther away from the center C of the display area 100 in the row direction may be smaller than that supplied to pixels 101 located farther away from the center C of the display area 100 in the column direction. Therefore, the signal processing circuit 201 is arranged so as to overlap the pixel 101 that is expected to share a smaller power supply voltage from the external electrode P1. In other words, due to heat generation by the signal processing circuit 201, the temperature of the multiple pixels 101 tends to increase more rapidly in the column direction than in the row direction.

[0028] Even when the electrode patterns 122 are arranged in one direction, the signal processing circuit 201 is arranged as shown in Fig. 6. As a result, the emission intensity distribution caused by the temperature distribution associated with heat generation by the signal processing circuit 201 and the emission intensity distribution caused by the distribution of the power supply voltage supplied to the multiple pixels 101 have opposite distributions, thereby reducing each other. In other words, the light emitting device 500 of this embodiment can effectively suppress the non-uniform emission intensity distribution caused by the non-uniform temperature distribution in the display region 100 and the non-uniform emission intensity distribution caused by a voltage drop in the power supply voltage in the display region.

[0029] Figure 7 shows a modified example of the light emitting device 500 shown in Figure 1. Below, differences from the above-mentioned configuration will be mainly described, and descriptions of configurations that may be similar will be omitted as appropriate.

[0030] 1, the connection portions 123 between the electrode layer 116 and the power supply pattern 103 are arranged so as to surround the display region 100. On the other hand, in the configuration shown in FIG. 7, the connection portions 123 between the electrode layer 116 and the power supply pattern 103 are arranged in part of the outer periphery of the display region 100. Here, of the regions surrounding the display region 100, as shown in FIG. 7, the region where the connection portions 123 between the electrode layer 116 and the power supply pattern 103 are arranged is called region 161, and the region where the connection portions 123 are not arranged is called region 162. Due to a voltage drop, the power supply voltage supplied from the external electrode P2 to the plurality of pixels 101 via the electrode layer 116 is higher at positions closer to the connection portions 123 (region 161) and is lower at positions farther from the connection portions 123 (region 161).

[0031] 8 shows an example of the arrangement of the signal processing circuit 201 in orthogonal projection onto the main surface 151 of the substrate 10. When the connection portion 123 between the electrode layer 116 and the power supply pattern 103 has the configuration shown in FIG. 7, the signal processing circuit 201 is arranged so that an imaginary line 170 extending from the center C of the display region 100 toward the center C' of the signal processing circuit 201 does not intersect with the region 161. The signal processing circuit 201 is also arranged so that an imaginary line 170 extending from the center C of the display region 100 toward the center C' of the signal processing circuit 201 intersects with the region 162. As a result, the signal processing circuit 201 is arranged at a position relatively far from the connection portion 123 between the electrode layer 116 and the power supply pattern 103. In other words, the signal processing circuit 201 is arranged so as to overlap with a pixel 101 for which the power supply voltage shared from the external electrode P1 is expected to be smaller. Here, the center C′ of the signal processing circuit 201 can be, for example, the geometric center of gravity position of the signal processing circuit 201 in orthogonal projection onto the main surface 151 of the substrate 10.

[0032] In this way, even when the connection portion 123 between the electrode layer 116 and the power supply pattern 103 is disposed only in a part of the area surrounding the display area, the signal processing circuit 201 is disposed as shown in Fig. 8. As a result, the emission intensity distribution caused by the temperature distribution associated with heat generation from the signal processing circuit 201 and the emission intensity distribution caused by the distribution of the power supply voltage supplied to the plurality of pixels 101 have opposite distributions, and thus reduce each other. In other words, the light emitting device 500 of this embodiment can effectively suppress the non-uniform emission intensity distribution caused by the non-uniform temperature distribution in the display area 100 and the non-uniform emission intensity distribution caused by a voltage drop in the power supply voltage in the display area.

[0033] In the configurations shown in FIGS. 7 and 8, a portion of the signal processing circuit 201 may be disposed outside the outer edge of the display region 100, as shown in FIG. 8. In this case, in orthogonal projection onto the main surface 151 of the substrate 10, for example, the center C' of the signal processing circuit 201 may be disposed inside the outer edge of the display region 100, or the center C' of the signal processing circuit 201 may be disposed outside the outer edge of the display region 100. Also, in the configurations shown in FIGS. 7 and 8, the signal processing circuit 201 may be disposed inside the outer edge of the display region 100, as shown in FIGS. 4 and 6. The signal processing circuit 201 may be disposed at an appropriate position depending on the relationship between the non-uniform emission intensity distribution caused by the non-uniform temperature distribution in the display region 100 and the non-uniform emission intensity distribution caused by a voltage drop in the power supply voltage in the display region.

[0034] 7 and 8, the case where the connection portion 123 between the electrode layer 116 and the power supply pattern 103 is arranged only in a part of the area surrounding the display area has been described. However, this is not limited to this. For example, even if the connection portion 124 between the plurality of electrode patterns 122 and the power supply pattern 102 is arranged in the area 161 and not in the area 162, the signal processing circuit 201 may be arranged in the position described with reference to FIG. 8. This enables the light-emitting device 500 to effectively suppress non-uniform emission intensity distribution caused by non-uniform temperature distribution in the display area 100 and non-uniform emission intensity distribution caused by a voltage drop in the power supply voltage in the display area.

[0035] Here, application examples in which the light emitting device 500 of this embodiment is applied to an image forming device, a display device, a photoelectric conversion device, an electronic device, a lighting device, a mobile object, and a wearable device will be described with reference to FIGS. 9(a) and 9(b) to 17(a) and 17(b). The description will be given assuming that an organic light emitting element such as an organic EL element using an organic light emitting material is disposed in the pixel 101 of the light emitting device 500. First, details of each component disposed in the pixel 101 of the light emitting device 500 will be shown, and then application examples will be described.

[0036] Structure of organic light-emitting element The organic light-emitting element is provided by forming an insulating layer, a first electrode, an organic compound layer, and a second electrode on a substrate. A protective layer, a color filter, a microlens, etc. may be provided on the cathode. When a color filter is provided, a planarizing layer may be provided between the protective layer and the color filter. The planarizing layer may be made of an acrylic resin, etc. The same applies when a planarizing layer is provided between the color filter and the microlens.

[0037] substrate Examples of the substrate include quartz, glass, silicon wafer, resin, and metal. Furthermore, the substrate may be provided with a switching element such as a transistor, a wiring pattern, and the like, and an insulating layer thereon. The insulating layer may be made of any material as long as it allows contact holes to be formed so that a wiring pattern can be formed between the first electrode and the substrate, and insulation from unconnected wiring patterns is ensured. For example, the insulating layer may be made of a resin such as polyimide, silicon oxide, silicon nitride, or the like.

[0038] electrode A pair of electrodes can be used as the electrodes. The pair of electrodes may be an anode and a cathode. When an electric field is applied in the direction in which the organic light-emitting element emits light, the electrode with a higher potential is the anode, and the other is the cathode. It can also be said that the electrode that supplies holes to the light-emitting layer is the anode, and the electrode that supplies electrons is the cathode.

[0039] The anode may be made of a material with a high work function. For example, simple metals such as gold, platinum, silver, copper, nickel, palladium, cobalt, selenium, vanadium, and tungsten, mixtures containing these metals, alloys of these metals, and metal oxides such as tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), and zinc indium oxide can be used. Conductive polymers such as polyaniline, polypyrrole, and polythiophene can also be used as the anode.

[0040] These electrode materials may be used alone or in combination of two or more. The anode may be composed of one layer or multiple layers.

[0041] When the electrode is used as a reflective electrode, for example, chromium, aluminum, silver, titanium, tungsten, molybdenum, or alloys thereof, or laminates thereof can be used. The above materials can also function as a reflective film without functioning as an electrode. Furthermore, when a transparent electrode is used as the electrode, a transparent conductive oxide layer such as indium tin oxide (ITO) or indium zinc oxide can be used, but is not limited to these. Photolithography technology can be used to form the electrode.

[0042] On the other hand, a material with a low work function may be selected as the cathode material. Examples include simple metals such as alkali metals (e.g., lithium), alkaline earth metals (e.g., calcium), aluminum, titanium, manganese, silver, lead, and chromium, as well as mixtures containing these metals. Alternatively, alloys combining these simple metals may be used. For example, magnesium-silver, aluminum-lithium, aluminum-magnesium, silver-copper, and zinc-silver may be used. Metal oxides such as indium tin oxide (ITO) may also be used. These electrode materials may be used alone or in combination. The cathode may have a single-layer or multi-layer structure. Silver may be used as the cathode, and a silver alloy may be used to reduce silver aggregation. The alloy ratio is not important as long as silver aggregation is reduced. For example, the silver:other metal ratio may be 1:1 or 3:1.

[0043] The cathode may be a top-emission element using an oxide conductive layer such as ITO, or a bottom-emission element using a reflective electrode such as aluminum (Al), and is not particularly limited. The method for forming the cathode is not particularly limited, but using a DC or AC sputtering method, for example, can provide good coverage of the formed film and reduce the resistance of the cathode.

[0044] Pixel isolation layer The pixel separation layer may be formed of silicon oxides such as silicon nitride (SiN), silicon oxynitride (SiON), or silicon oxide (SiO) formed using a chemical vapor deposition (CVD) method. To increase the in-plane resistance of the organic compound layer, the thickness of the organic compound layer, particularly the hole transport layer, may be thinned on the sidewalls of the pixel separation layer. Specifically, the thickness of the organic compound layer on the sidewalls can be thinned by increasing the taper angle of the sidewalls of the pixel separation layer or the thickness of the pixel separation layer, thereby increasing vignetting during deposition.

[0045] On the other hand, the sidewall taper angle and film thickness of the pixel separation layer can be adjusted to the extent that voids are not formed in the protective layer formed thereon. By preventing voids from being formed in the protective layer, the occurrence of defects in the protective layer can be reduced. Since the occurrence of defects in the protective layer is reduced, deterioration of reliability such as the occurrence of dark spots and poor conduction of the second electrode can be reduced.

[0046] According to this embodiment, charge leakage to adjacent pixels can be effectively suppressed even if the taper angle of the sidewall of the pixel separation layer is not steep. As a result of this study, it was found that charge leakage can be sufficiently reduced if the taper angle is between 60 degrees and 90 degrees. The thickness of the pixel separation layer may be between 10 nm and 150 nm. Similar effects can also be achieved even if the pixel separation layer is composed only of pixel electrodes without a pixel separation layer. However, in this case, short circuits in organic light-emitting elements can be reduced by making the thickness of the pixel electrode less than half that of the organic layer or by making the edge of the pixel electrode forward tapered at less than 60 degrees.

[0047] Furthermore, even when the first electrode is a cathode and the second electrode is an anode, a wide color gamut and low-voltage operation are possible by forming an electron transport material and a charge transport layer, and an emitting layer on the charge transport layer.

[0048] organic compound layer The organic compound layer may be formed as a single layer or as multiple layers. When multiple layers are present, they may be called hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc., depending on their functions. The organic compound layer is mainly composed of organic compounds but may also contain inorganic atoms or inorganic compounds. The organic compound layer may contain, for example, copper, lithium, magnesium, aluminum, iridium, platinum, molybdenum, zinc, etc. The organic compound layer may be disposed between the first electrode and the second electrode, or may be disposed in contact with the first electrode and the second electrode.

[0049] protective layer A protective layer may be provided on the cathode. For example, by adhering glass with a moisture absorbent on the cathode, the penetration of moisture and other contaminants into the organic compound layer can be reduced, thereby reducing the occurrence of display defects. In another embodiment, a passivation layer such as silicon nitride may be provided on the cathode to reduce the penetration of moisture and other contaminants into the organic compound layer. For example, after forming the cathode, the cathode may be transferred to another chamber without breaking the vacuum, and a 2 μm-thick silicon nitride may be formed by CVD to serve as a protective layer. After forming the protective layer by CVD, a protective layer may be formed by atomic layer deposition (ALD). The material of the protective layer formed by ALD is not limited, and may be silicon nitride, silicon oxide, aluminum oxide, or the like. Silicon nitride may be further formed by CVD on the protective layer formed by ALD. The protective layer formed by ALD may have a thickness smaller than that of the protective layer formed by CVD. Specifically, the thickness of the protective layer formed by ALD may be 50% or less, or even 10% or less, of the protective layer formed by CVD.

[0050] Color filters A color filter may be provided on the protective layer. For example, a color filter taking into consideration the size of the organic light-emitting element may be provided on another substrate, and the substrate on which the color filter is formed may be bonded to the substrate on which the organic light-emitting element is provided. Alternatively, for example, a color filter may be patterned on the above-mentioned protective layer using photolithography technology. The color filter may be made of a polymer.

[0051] planarization layer A planarization layer may be disposed between the color filter and the protective layer. The planarization layer is provided for the purpose of reducing the unevenness of the layers below the planarization layer. It may also be called a material resin layer without limiting the purpose. The planarization layer may be composed of an organic compound, and may be a low molecular weight or a high molecular weight. In consideration of reducing the unevenness, a high molecular weight organic compound may be used for the planarization layer.

[0052] The planarization layers may be provided above and below the color filter. In this case, the constituent materials of the planarization layers may be the same or different. Specific examples of the material for the planarization layer include polyvinyl carbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin.

[0053] Microlenses The organic light-emitting device may have an optical component such as a microlens on its light-emitting side. The microlens may be made of acrylic resin, epoxy resin, or the like. The microlens may be intended to increase the amount of light extracted from the organic light-emitting device or to control the direction of the extracted light. The microlens may have a hemispherical shape. When the microlens has a hemispherical shape, among the tangents to the hemisphere, there is a tangent that is parallel to the insulating layer, and the point of contact between this tangent and the hemisphere is the vertex of the microlens. The vertex of the microlens can be determined in the same way in any cross-sectional view. In other words, among the tangents to the semicircle of the microlens in the cross-sectional view, there is a tangent that is parallel to the insulating layer, and the point of contact between this tangent and the semicircle is the vertex of the microlens.

[0054] It is also possible to define the midpoint of a microlens. In the cross section of the microlens, a line segment is imagined from the point where an arc shape ends to the point where another arc shape ends, and the midpoint of this line segment can be called the midpoint of the microlens. The cross section for determining the vertex and midpoint may be a cross section perpendicular to the insulating layer.

[0055] The microlens has a first surface having a convex portion and a second surface opposite the first surface. The second surface can be disposed closer to the functional layer (light-emitting layer) than the first surface. To achieve this configuration, it is necessary to form the microlens on the light-emitting device. If the functional layer is an organic layer, high-temperature processes can be avoided in the microlens manufacturing process. Furthermore, if the second surface is disposed closer to the functional layer than the first surface, the glass transition temperatures of the organic compounds constituting the organic layer may all be 100°C or higher, and are preferably, for example, 130°C or higher.

[0056] Counter substrate An opposing substrate may be disposed on the planarization layer. The opposing substrate is called an opposing substrate because it is provided at a position corresponding to the aforementioned substrate. The opposing substrate may be made of the same material as the aforementioned substrate. When the aforementioned substrate is defined as a first substrate, the opposing substrate may be a second substrate.

[0057] organic layer The organic compound layers (hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc.) constituting the organic light-emitting element according to an embodiment of the present disclosure may be formed by the following method.

[0058] The organic compound layer constituting the organic light-emitting device according to the embodiment of the present disclosure can be formed by dry processes such as vacuum deposition, ionization deposition, sputtering, plasma, etc. Alternatively to the dry process, a wet process can be used in which the compound is dissolved in an appropriate solvent and a layer is formed by a known coating method (e.g., spin coating, dipping, casting, LB method, inkjet method, etc.).

[0059] Here, when a layer is formed by a vacuum deposition method or a solution coating method, crystallization is unlikely to occur and the layer has excellent stability over time. When a film is formed by a coating method, the film can be formed by combining it with an appropriate binder resin.

[0060] Examples of the binder resin include, but are not limited to, polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin.

[0061] These binder resins may be used singly or in combination as homopolymers or copolymers, and may further contain known additives such as plasticizers, antioxidants, and ultraviolet absorbers, as needed.

[0062] Pixel circuit The light-emitting device may have a pixel circuit connected to the light-emitting element. The pixel circuit may be an active matrix type that controls the emission of the first light-emitting element and the second light-emitting element independently. The active matrix type circuit may be voltage-programmed or current-programmed. The drive circuit has a pixel circuit for each pixel. The pixel circuit may have a light-emitting element, a transistor that controls the emission brightness of the light-emitting element, a transistor that controls the emission timing, a capacitor that holds the gate voltage of the transistor that controls the emission brightness, and a transistor for connecting to GND without going through the light-emitting element.

[0063] The light-emitting device has a display region and a peripheral region arranged around the display region. The display region has pixel circuits, and the peripheral region has a display control circuit. The mobility of a transistor constituting the pixel circuit may be lower than the mobility of a transistor constituting the display control circuit.

[0064] The slope of the current-voltage characteristics of the transistors that make up the pixel circuit may be smaller than the slope of the current-voltage characteristics of the transistors that make up the display control circuit. The slope of the current-voltage characteristics can be measured using the so-called Vg-Ig characteristics.

[0065] The transistors that make up the pixel circuit are transistors connected to the light-emitting elements, such as the first light-emitting element.

[0066] pixel An organic light emitting device includes a plurality of pixels, each of which includes sub-pixels that emit different colors, for example, RGB colors.

[0067] A pixel has an area called a pixel aperture that emits light. The pixel aperture may be 15 μm or less, or 5 μm or more. More specifically, it may be 11 μm, 9.5 μm, 7.4 μm, 6.4 μm, etc.

[0068] The spacing between the subpixels may be 10 μm or less, and specifically may be 8 μm, 7.4 μm, or 6.4 μm.

[0069] The pixels may be arranged in a known manner in a plan view. For example, they may be in a stripe arrangement, a delta arrangement, a pentile arrangement, or a Bayer arrangement. The shape of the subpixels in a plan view may be any known shape. For example, they may be rectangular, quadrilaterals such as diamonds, or hexagons. Of course, a shape that is close to a rectangle, rather than an exact shape, is included in the rectangle. The shape of the subpixels and the pixel arrangement may be used in combination.

[0070] Uses of the organic light-emitting device according to embodiments of the present disclosure The organic light-emitting device according to the embodiment of the present disclosure can be used as a component of a display device or a lighting device, and can also be used as an exposure light source for an electrophotographic image forming device, a backlight for a liquid crystal display device, or a light-emitting device having a white light source and a color filter.

[0071] The display device may be an image information processing device that has an image input unit that inputs image information from an area CCD, linear CCD, memory card, etc., has an information processing unit that processes the input information, and displays the input image on the display unit.

[0072] The display unit of the imaging device or inkjet printer may have a touch panel function. The driving method of this touch panel function may be an infrared method, a capacitance method, a resistive film method, or an electromagnetic induction method, and is not particularly limited. The display device may also be used in the display unit of a multifunction printer.

[0073] Next, further explanation will be given with reference to the drawings. Fig. 9(a) shows an example of a pixel 101 arranged in a light-emitting device 500. The pixel has sub-pixels 810 (pixel 101). The sub-pixels are divided into 810R, 810G, and 810B based on their light emission. The emitted colors may be distinguished by the wavelength of light emitted from the light-emitting layer, or the light emitted from the sub-pixels may be selectively transmitted or color-converted using a color filter or the like. Each sub-pixel has a reflective electrode 802 as a first electrode on an interlayer insulating layer 801, an insulating layer 803 covering the edge of the reflective electrode 802, an organic compound layer 804 covering the first electrode and the insulating layer, a transparent electrode 805 as a second electrode, a protective layer 806, and a color filter 807.

[0074] A transistor and a capacitor may be disposed below or inside the interlayer insulating layer 801. The transistor and the first electrode may be electrically connected via a contact hole (not shown) or the like.

[0075] The insulating layer 803 may also be called a bank or a pixel separation film. The insulating layer 803 covers the edges of the first electrodes and is disposed to surround the first electrodes. The portions of the first electrodes not covered by the insulating layer 803 come into contact with the organic compound layer 804 and become light-emitting regions.

[0076] The organic compound layer 804 includes a hole injection layer 841 , a hole transport layer 842 , a first light-emitting layer 843 , a second light-emitting layer 844 , and an electron transport layer 845 .

[0077] The second electrode may be a transparent electrode, a reflective electrode, or a semi-transparent electrode.

[0078] The protective layer 806 reduces the penetration of moisture into the organic compound layer. Although the protective layer is illustrated as a single layer, it may be multiple layers. Each layer may be an inorganic compound layer and an organic compound layer.

[0079] The color filters 807 are divided into 807R, 807G, and 807B depending on their colors. The color filters may be formed on a planarization film (not shown). A resin protective layer (not shown) may be disposed on the color filters. The color filters may be formed on a protective layer 806. The color filters may be provided on an opposing substrate such as a glass substrate and then bonded thereto.

[0080] A display device 800 in FIG. 9(b) (corresponding to the light-emitting device 500 described above) includes an organic light-emitting element 826 and a TFT 818 as an example of a transistor. A substrate 811 made of glass, silicon, or the like is provided with an insulating layer 812 on top of it. An active element such as the TFT 818 is disposed on the insulating layer, and a gate electrode 813, a gate insulating film 814, and a semiconductor layer 815 of the active element are disposed on top of the insulating layer. The TFT 818 also includes the semiconductor layer 815, a drain electrode 816, and a source electrode 817. An insulating film 819 is provided on top of the TFT 818. An anode 821 constituting the organic light-emitting element 826 and the source electrode 817 are connected via a contact hole 820 provided in the insulating film.

[0081] The electrical connection between the electrodes (anode, cathode) included in the organic light-emitting element 826 and the electrodes (source electrode, drain electrode) included in the TFT is not limited to the embodiment shown in Figure 9(b). In other words, it is sufficient that either the anode or the cathode is electrically connected to either the TFT source electrode or the drain electrode. TFT stands for thin film transistor.

[0082] 9(b), the organic compound layer 822 is illustrated as a single layer, but may be a multi-layer organic compound layer 822. A first protective layer 824 and a second protective layer 825 are provided on the cathode 823 to reduce deterioration of the organic light-emitting element.

[0083] In the display device 800 of FIG. 9(b), transistors are used as switching elements, but other switching elements may be used instead.

[0084] Furthermore, the transistors used in the display device 800 of Figure 9(b) are not limited to transistors using single-crystal silicon wafers, but may also be thin-film transistors having an active layer on an insulating surface of a substrate. Examples of active layers include non-single-crystal silicon such as single-crystal silicon, amorphous silicon, and microcrystalline silicon, and non-single-crystal oxide semiconductors such as indium zinc oxide and indium gallium zinc oxide. Thin-film transistors are also called TFT elements.

[0085] The transistors included in the display device 800 of Figure 9(b) may be formed within a substrate such as a silicon substrate. Here, "formed within a substrate" means that the substrate itself, such as a silicon substrate, is processed to form the transistors. In other words, having a transistor within a substrate can be seen as the substrate and the transistor being formed integrally.

[0086] The organic light-emitting element according to this embodiment has its light emission brightness controlled by a TFT, which is an example of a switching element. By providing multiple organic light-emitting elements on a surface, an image can be displayed based on the respective light emission brightnesses. Here, the switching element according to this embodiment is not limited to a TFT, but may also be a transistor formed from low-temperature polysilicon or an active matrix driver formed on a substrate such as a silicon substrate. "On the substrate" can also be referred to as "inside the substrate." Whether to provide a transistor in the substrate or to use a TFT is determined by the size of the display unit. For example, if the size is about 0.5 inches, the organic light-emitting element may be provided on a silicon substrate.

[0087] 10(a) to 10(c) are schematic diagrams illustrating an example of an image forming apparatus using the light emitting device 500 of this embodiment. The image forming apparatus 926 shown in Fig. 10(a) includes a photoconductor 927, an exposure light source 928, a developing unit 931, a charging unit 930, a transfer unit 932, a transport unit 933 (a transport roller in the configuration of Fig. 10(a)), and a fixing unit 935.

[0088] Light 929 is emitted from an exposure light source 928, and an electrostatic latent image is formed on the surface of the photoconductor 927. The light emitting device 500 can be used as this exposure light source 928. The developing unit 931 contains toner or the like as a developer and can function as a developing device that applies the developer to the exposed photoconductor 927. The charging unit 930 charges the photoconductor 927. The transfer unit 932 transfers the developed image to a recording medium 934. The transport unit 933 transports the recording medium 934. The recording medium 934 can be, for example, paper or film. The fixing unit 935 fixes the image formed on the recording medium.

[0089] 10(b) and 10(c) are schematic diagrams showing an exposure light source 928 in which a plurality of light-emitting sections 936 are arranged along the longitudinal direction of a long substrate. A light-emitting device 500 can be applied to the light-emitting sections 936. That is, a plurality of pixels 101 are arranged along the longitudinal direction of the substrate. A direction 937 is parallel to the axis of the photosensitive member 927. This column direction is the same as the axial direction of the photosensitive member 927 when it rotates. This direction 937 can also be called the long axis direction of the photosensitive member 927.

[0090] FIG. 10(b) shows a configuration in which the light-emitting units 936 are arranged along the longitudinal direction of the photoconductor 927. FIG. 10(c) shows a modified configuration of the arrangement of the light-emitting units 936 shown in FIG. 10(b), in which the light-emitting units 936 are arranged alternately in the column direction in the first and second columns. The light-emitting units 936 are arranged at different positions in the row direction in the first and second columns. In the first column, multiple light-emitting units 936 are arranged at intervals, and in the second column, light-emitting units 936 are arranged at positions corresponding to the gaps between the light-emitting units 936 in the first column. Multiple light-emitting units 936 are also arranged at intervals in the row direction. The arrangement of the light-emitting units 936 shown in FIG. 10(c) can be described as, for example, a grid-like arrangement, a houndstooth arrangement, or a checkerboard pattern.

[0091] FIG. 11 is a schematic diagram illustrating an example of a display device using a light-emitting device 500 according to this embodiment. The display device 1000 may include a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. Flexible printed circuits FPCs 1002 and 1004 are connected to the touch panel 1003 and the display panel 1005. Active elements such as transistors are disposed on the circuit board 1007. The battery 1008 may not be disposed if the display device 1000 is not a portable device, and even if it is a portable device, it does not need to be disposed in this position. The light-emitting device 500 can be applied to the display panel 1005. The pixels 101 disposed in the light-emitting device 500 functioning as the display panel 1005 are connected to active elements such as transistors disposed on the circuit board 1007 and operate.

[0092] The display device 1000 shown in FIG. 11 may be used as a display unit of a photoelectric conversion device (which may also be called an imaging device) that has an optical unit with multiple lenses and an imaging element that receives light that has passed through the optical unit and photoelectrically converts it into an electrical signal. The photoelectric conversion device may have a display unit that displays information acquired by the imaging element. The display unit may be a display unit exposed to the outside of the photoelectric conversion device or a display unit located within a viewfinder. The photoelectric conversion device may be a digital camera or a digital video camera.

[0093] FIG. 12 is a schematic diagram illustrating an example of a photoelectric conversion device using the light-emitting device 500 of this embodiment. The photoelectric conversion device 1100 may include a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The photoelectric conversion device 1100 may also be called an imaging device. The light-emitting device 500 of this embodiment can be applied to the viewfinder 1101 or the rear display 1102, which are display units. In this case, the light-emitting device 500 may display not only an image to be captured, but also environmental information, imaging instructions, and the like. The environmental information may include the intensity of external light, the direction of external light, the moving speed of the subject, the possibility that the subject will be blocked by an obstruction, and the like.

[0094] Since the timing suitable for capturing an image is often very short, it is better to display information as soon as possible. Therefore, a light emitting device 500 in which pixels 101 including light emitting elements using an organic light emitting material such as an organic EL element are arranged may be used in a viewfinder 1101 or a rear display 1102. This is because organic light emitting materials have a fast response speed. A light emitting device 500 using an organic light emitting material is more suitable than a liquid crystal display device for these devices, which require a high display speed.

[0095] The photoelectric conversion device 1100 has an optical section (not shown). The optical section has multiple lenses, which form an image on a photoelectric conversion element (not shown) housed in a housing 1104 that receives light that has passed through the optical section. The focus of the multiple lenses can be adjusted by adjusting their relative positions. This operation can also be performed automatically.

[0096] The light emitting device 500 may be applied to a display unit of an electronic device. In this case, the light emitting device 500 may have both a display function and an operation function. Examples of the portable terminal include a mobile phone such as a smartphone, a tablet, and a head-mounted display.

[0097] FIG. 13 is a schematic diagram showing an example of an electronic device using the light-emitting device 500 of this embodiment. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a touch panel type reaction unit. The operation unit 1202 may be a biometric recognition unit that recognizes a fingerprint to perform unlocking or the like. A portable device having a communication unit can also be called a communication device. The light-emitting device 500 of this embodiment can be applied to the display unit 1201.

[0098] 14(a) and 14(b) are schematic diagrams illustrating an example of a display device using the light-emitting device 500 of this embodiment. FIG. 14(a) illustrates a display device such as a television monitor or a PC monitor. The display device 1300 has a frame 1301 and a display unit 1302. The light-emitting device 500 of this embodiment can be applied to the display unit 1302. The display device 1300 may have a base 1303 that supports the frame 1301 and the display unit 1302. The base 1303 is not limited to the form shown in FIG. 14(a). For example, the bottom edge of the frame 1301 may also serve as the base 1303. The frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0099] FIG. 14(b) is a schematic diagram illustrating another example of a display device using the light-emitting device 500 of this embodiment. The display device 1310 of FIG. 14(b) is configured to be bendable and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The light-emitting device 500 of this embodiment can be applied to the first display unit 1311 and the second display unit 1312. The first display unit 1311 and the second display unit 1312 may be a single display unit without any joints. The first display unit 1311 and the second display unit 1312 can be separated by the bending point. The first display unit 1311 and the second display unit 1312 may display different images, or the first display unit and the second display unit 1312 may display a single image.

[0100] FIG. 15 is a schematic diagram illustrating an example of a lighting device using the light-emitting device 500 of this embodiment. The lighting device 1400 may include a housing 1401, a light source 1402, a circuit board 1403, an optical film 1404, and a light diffusion unit 1405. The light-emitting device 500 of this embodiment can be applied to the light source 1402. The optical film 1404 may be a filter that improves the color rendering of the light source. The light diffusion unit 1405 can effectively diffuse light from the light source, such as for lighting, and deliver the light over a wide area. If necessary, a cover may be provided on the outermost part. The lighting device 1400 may include both the optical film 1404 and the light diffusion unit 1405, or only one of them.

[0101] The lighting device 1400 is, for example, a device that illuminates a room. The lighting device 1400 may emit white, daylight white, or any other color from blue to red. It may have a dimming circuit that adjusts the light intensity. The lighting device 1400 may have a power supply circuit connected to the light-emitting device 500 that functions as the light source 1402. The power supply circuit is a circuit that converts AC voltage into DC voltage. White has a color temperature of 4200K, and daylight white has a color temperature of 5000K. The lighting device 1400 may also have a color filter. The lighting device 1400 may also have a heat sink. The heat sink dissipates heat from within the device to the outside, and examples of the heat sink include metal with a high specific heat, liquid silicon, etc.

[0102] FIG. 16 is a schematic diagram of an automobile having a tail lamp, which is an example of a vehicle lamp using the light-emitting device 500 of this embodiment. The automobile 1500 may have a tail lamp 1501, and may be configured to turn on the tail lamp 1501 when braking or the like is performed. The light-emitting device 500 of this embodiment may be used as a headlamp as a vehicle lamp. An automobile is an example of a mobile body, and the mobile body may be a ship, a drone, an aircraft, a railcar, an industrial robot, or the like. The mobile body may have a body and a lamp provided thereon. The lamp may indicate the current location of the body.

[0103] The light emitting device 500 of this embodiment can be applied to a tail lamp 1501. The tail lamp 1501 may have a protective member that protects the light emitting device 500 functioning as the tail lamp 1501. The protective member may be made of any material as long as it has a certain degree of strength and is transparent, but may be made of polycarbonate or the like. The protective member may also be made by mixing a furandicarboxylic acid derivative, an acrylonitrile derivative, or the like with polycarbonate.

[0104] The automobile 1500 may have a body 1503 and a window 1502 attached thereto. The window may be a window for checking the front and rear of the automobile, or may be a transparent display such as a head-up display. The light-emitting device 500 of this embodiment may be used in the transparent display. In this case, the constituent materials of the electrodes and the like of the light-emitting device 500 are made of transparent materials.

[0105] 17(a) and 17(b), a further application example of the light emitting device 500 of this embodiment will be described. The light emitting device 500 can be applied to systems that can be worn as a wearable device, such as smart glasses, a head-mounted display (HMD), or smart contact lenses. An image capturing and displaying device used in such an application example has an image capturing device capable of photoelectrically converting visible light and a light emitting device capable of emitting visible light.

[0106] 17(a) illustrates glasses 1600 (smart glasses) according to one application example. An imaging device 1602 such as a CMOS sensor or a SPAD is provided on the front side of a lens 1601 of the glasses 1600. Furthermore, a light-emitting device 500 according to this embodiment is provided on the back side of the lens 1601.

[0107] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power source that supplies power to the image capture device 1602 and the light emitting device 500 according to each embodiment. The control device 1603 also controls the operations of the image capture device 1602 and the light emitting device 500. The lens 1601 is formed with an optical system for focusing light onto the image capture device 1602.

[0108] FIG. 17(b) illustrates glasses 1610 (smart glasses) according to one application example. The glasses 1610 include a control device 1612, which is equipped with an imaging device corresponding to the imaging device 1602 and a light-emitting device 500. A lens 1611 includes an optical system for projecting light emitted from the imaging device in the control device 1612 and the light-emitting device 500, and an image is projected onto the lens 1611. The control device 1612 functions as a power source for supplying power to the imaging device and the light-emitting device 500 and controls the operation of the imaging device and the light-emitting device 500. The control device 1612 may also include a gaze detection unit that detects the gaze of the wearer. Infrared light may be used for gaze detection. The infrared light-emitting unit emits infrared light toward the eyeball of a user gazing at a displayed image. An imaging unit having a light-receiving element detects the emitted infrared light reflected from the eyeball, thereby obtaining an image of the eyeball. By providing a reduction means for reducing the amount of light from the infrared light emitting section to the display section in a plan view, degradation of image quality is reduced.

[0109] The gaze of the user relative to the displayed image is detected from an image of the eyeball obtained by capturing infrared light. Any known method can be used for gaze detection using the image of the eyeball. As an example, a gaze detection method based on the Purkinje image formed by reflection of irradiated light on the cornea can be used.

[0110] More specifically, gaze detection processing is performed based on the pupil-corneal reflex method, which calculates a gaze vector representing the direction (rotation angle) of the eyeball based on the pupil image and Purkinje image included in the captured image of the eyeball, thereby detecting the user's gaze.

[0111] The light emitting device 500 according to the embodiment of the present disclosure may have an imaging device having a light receiving element, and may control the display image based on user line of sight information from the imaging device.

[0112] Specifically, the light emitting device 500 determines a first field of view area where the user gazes and a second field of view area other than the first field of view area based on the line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the light emitting device 500, or may be determined by an external control device and received. In the display area of the light emitting device 500, the display resolution of the first field of view area may be controlled to be higher than the display resolution of the second field of view area. In other words, the resolution of the second field of view area may be lower than that of the first field of view area.

[0113] The display area includes a first display area and a second display area different from the first display area, and a high-priority area is determined from the first display area and the second display area based on line-of-sight information. The first display area and the second display area may be determined by a control device of the light-emitting device 500, or may be determined by an external control device and received. The resolution of the high-priority area may be controlled to be higher than the resolution of areas other than the high-priority area. In other words, the resolution of an area with a relatively low priority may be lowered.

[0114] Note that AI may be used to determine the first field of view area and areas with high priority. The AI may be a model configured to estimate the angle of gaze and the distance to an object in the line of sight from the image of the eyeball, using as training data an image of the eyeball and the actual direction in which the eyeball in the image was looking. The AI program may be included in the light-emitting device 500, the imaging device, or an external device. If included in an external device, it is transmitted to the light-emitting device 500 via communication.

[0115] When display control is performed based on visual recognition detection, the smart glasses can be applied to smart glasses that further include an imaging device for capturing images of the outside world. The smart glasses can display captured outside information in real time.

[0116] The disclosure of the present specification includes the following light-emitting device, photoelectric conversion device, and electronic device.

[0117] (Item 1) A light-emitting device in which a first substrate having a display area in which a plurality of pixels are arranged and a second substrate having a circuit for operating the plurality of pixels are stacked, the circuit includes a first circuit and a second circuit located between the first circuit and an outer edge of the second substrate; The first circuit generates a larger amount of heat per unit area than the second circuit, In an orthogonal projection onto a main surface of the first substrate having the display area, the first circuit is disposed inside an outer edge of the display area, The light-emitting device is characterized in that the center of the display area is disposed inside the outer edge of the first circuit.

[0118] (Item 2) the plurality of pixels are supplied with power by an electrode layer that is arranged to cover each of the plurality of pixels and that transmits light emitted by each of the plurality of pixels, and a plurality of electrode patterns; The light-emitting device described in item 1, characterized in that, in an orthogonal projection onto the main surface, the electrode layer is connected to a first power supply pattern arranged outside the display area, and the multiple electrode patterns are connected to a second power supply pattern arranged outside the display area.

[0119] (Item 3) the first power supply pattern and the second power supply pattern are each arranged to surround the display area; 3. The light emitting device according to item 2, wherein the connection portion between the electrode layer and the first power supply pattern is arranged so as to surround the display area.

[0120] (Item 4) the plurality of electrode patterns include an electrode pattern extending along a first direction and an electrode pattern extending along a second direction intersecting the first direction; 4. The light emitting device according to item 3, wherein the connection portions between the plurality of electrode patterns and the second power supply pattern are arranged so as to surround the display area.

[0121] (Item 5) The light-emitting device described in item 3, characterized in that each of the multiple electrode patterns extends along a first direction and is connected to a portion of the second power supply pattern that extends along a second direction that intersects the first direction.

[0122] (Item 6) 6. The light emitting device according to item 5, wherein each of the plurality of electrode patterns is connected to a first side and a second side of the second power supply pattern that extend along the second direction.

[0123] (Item 7) 7. The light emitting device according to item 5 or 6, wherein the first circuit has a length in the second direction longer than a length in the first direction.

[0124] (Item 8) the region surrounding the display region includes a first region and a second region; at least one of a connection portion between the electrode layer and the first power supply pattern and a connection portion between the plurality of electrode patterns and the second power supply pattern is disposed in the first region and is not disposed in the second region; 3. The light emitting device according to item 2, wherein in an orthogonal projection onto the main surface, an imaginary line extending from the center of the display area toward the center of the first circuit does not intersect with the first area.

[0125] (Item 9) 9. The light emitting device according to item 8, wherein the virtual line intersects with the second region.

[0126] (Item 10) The light-emitting device described in any one of items 1 to 9, characterized in that the first circuit constitutes at least a part of a digital circuit that generates digital signals for controlling the plurality of pixels based on signals input from an external source.

[0127] (Item 11) 11. The light emitting device according to any one of items 1 to 10, wherein the first circuit is a circuit that generates the largest amount of heat per unit area among the circuits.

[0128] (Item 12) 12. The light emitting device according to any one of items 1 to 11, wherein the first circuit is a circuit that generates the largest amount of heat per unit area among the circuits arranged on the second substrate.

[0129] (Item 13) A light-emitting device in which a first substrate having a display area in which a plurality of pixels are arranged and a second substrate having a circuit for operating the plurality of pixels are stacked, the circuit includes a first circuit and a second circuit located between the first circuit and an outer edge of the second substrate; The first circuit generates a larger amount of heat per unit area than the second circuit, the plurality of pixels are supplied with power by an electrode layer that is arranged to cover each of the plurality of pixels and that transmits light emitted by each of the plurality of pixels, and a plurality of electrode patterns; In an orthogonal projection onto a main surface of the first substrate having the display area, the electrode layer is connected to a first power supply pattern disposed outside the display area, and the plurality of electrode patterns are connected to a second power supply pattern disposed outside the display area, the region surrounding the display region includes a first region and a second region; at least one of a connection portion between the electrode layer and the first power supply pattern and a connection portion between the plurality of electrode patterns and the second power supply pattern is disposed in the first region and is not disposed in the second region; A light-emitting device, wherein an imaginary line extending from the center of the display area toward the center of the first circuit does not intersect with the first area.

[0130] (Item 14) Item 14. The light-emitting device according to item 13, wherein the first circuit constitutes at least a part of a digital circuit that generates a digital signal for controlling the plurality of pixels based on a signal input from an external source.

[0131] (Item 15) 15. A display device comprising: the light-emitting device according to any one of items 1 to 14; and an active element connected to the light-emitting device.

[0132] (Item 16) an optical unit having a plurality of lenses, an image sensor that receives light that has passed through the optical unit, and a display unit that displays an image; 15. A photoelectric conversion device, wherein the display unit displays an image captured by the imaging element, and the photoelectric conversion device comprises the light-emitting device according to any one of items 1 to 14.

[0133] (Item 17) A display unit is provided in the housing, and a communication unit is provided in the housing and communicates with an external device. 15. An electronic device, wherein the display unit comprises the light-emitting device according to any one of items 1 to 14.

[0134] (Item 18) A lighting device having a light source and at least one of a light diffusion unit and an optical film, 15. A lighting device, wherein the light source comprises the light emitting device according to any one of items 1 to 14.

[0135] (Item 19) A moving body having a body and a lighting fixture provided on the body, The lighting fixture is a moving body having the light emitting device according to any one of items 1 to 14.

[0136] (Item 20) 1. A wearable device having a display device for displaying an image, A wearable device characterized in that the display device has the light-emitting device described in any one of items 1 to 14.

[0137] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0138] 10, 20: substrate, 100: display region, 101: pixel, 151: main surface, 500: light emitting device

Claims

1. A light-emitting device in which a first substrate having a display area in which a plurality of pixels are arranged and a second substrate having a circuit for operating the plurality of pixels are stacked, the circuit includes a first circuit and a second circuit located between the first circuit and an outer edge of the second substrate; the first circuit generates a larger amount of heat per unit area than the second circuit; In an orthogonal projection onto a main surface of the first substrate having the display area, the first circuit is disposed inside an outer edge of the display area, A light-emitting device, characterized in that the center of the display area is disposed inside the outer edge of the first circuit.

2. the plurality of pixels are supplied with power by an electrode layer that is arranged to cover each of the plurality of pixels and that transmits light emitted by each of the plurality of pixels, and a plurality of electrode patterns; 2. The light-emitting device according to claim 1, wherein, in an orthogonal projection onto the main surface, the electrode layer is connected to a first power supply pattern arranged outside the display area, and the plurality of electrode patterns are connected to a second power supply pattern arranged outside the display area.

3. the first power supply pattern and the second power supply pattern are each disposed so as to surround the display area; 3. The light emitting device according to claim 2, wherein a connection portion between the electrode layer and the first power supply pattern is disposed so as to surround the display area.

4. the plurality of electrode patterns include an electrode pattern extending along a first direction and an electrode pattern extending along a second direction intersecting the first direction; 4. The light emitting device according to claim 3, wherein the connection portions between the plurality of electrode patterns and the second power supply pattern are arranged so as to surround the display area.

5. 4. The light-emitting device according to claim 3, wherein each of the plurality of electrode patterns extends along a first direction and is connected to a portion of the second power supply pattern that extends along a second direction that intersects with the first direction.

6. The light emitting device according to claim 5 , wherein each of the plurality of electrode patterns is connected to a first side and a second side of the second power supply pattern that extend along the second direction.

7. The light emitting device according to claim 5 , wherein the first circuit has a length in the second direction longer than a length in the first direction.

8. the region surrounding the display region includes a first region and a second region; at least one of a connection portion between the electrode layer and the first power supply pattern and a connection portion between the plurality of electrode patterns and the second power supply pattern is disposed in the first region and is not disposed in the second region; 3. The light emitting device according to claim 2, wherein in an orthogonal projection onto the main surface, an imaginary line extending from the center of the display area toward the center of the first circuit does not intersect with the first area.

9. The light emitting device according to claim 8 , wherein the imaginary line intersects with the second region.

10. 2. The light-emitting device according to claim 1, wherein the first circuit constitutes at least a part of a digital circuit that generates digital signals for controlling the plurality of pixels based on signals input from an external source.

11. 2. The light emitting device according to claim 1, wherein the first circuit is a circuit that generates the largest amount of heat per unit area among the circuits.

12. 2. The light emitting device according to claim 1, wherein the first circuit is a circuit that generates the largest amount of heat per unit area among the circuits disposed on the second substrate.

13. A light-emitting device in which a first substrate having a display area in which a plurality of pixels are arranged and a second substrate having a circuit for operating the plurality of pixels are stacked, the circuit includes a first circuit and a second circuit located between the first circuit and an outer edge of the second substrate; the first circuit generates a larger amount of heat per unit area than the second circuit; the plurality of pixels are supplied with power by an electrode layer that is arranged to cover each of the plurality of pixels and that transmits light emitted by each of the plurality of pixels, and a plurality of electrode patterns; In an orthogonal projection onto a main surface of the first substrate having the display area, the electrode layer is connected to a first power supply pattern disposed outside the display area, and the plurality of electrode patterns are connected to a second power supply pattern disposed outside the display area, the region surrounding the display region includes a first region and a second region; at least one of a connection portion between the electrode layer and the first power supply pattern and a connection portion between the plurality of electrode patterns and the second power supply pattern is disposed in the first region and is not disposed in the second region; A light-emitting device, wherein an imaginary line extending from the center of the display area toward the center of the first circuit does not intersect with the first area.

14. 14. The light-emitting device according to claim 13, wherein the first circuit constitutes at least a part of a digital circuit that generates digital signals for controlling the plurality of pixels based on signals input from an external source.

15. A display device comprising: a light-emitting device according to claim 1; and an active element connected to the light-emitting device.

16. an optical unit having a plurality of lenses, an image sensor that receives light that has passed through the optical unit, and a display unit that displays an image; A photoelectric conversion device, wherein the display section displays an image captured by the imaging element, and the photoelectric conversion device comprises the light-emitting device according to claim 1 .

17. A display unit is provided in the housing, and a communication unit is provided in the housing and communicates with an external device.

15. An electronic device, wherein the display unit comprises the light-emitting device according to claim 1.

18. A lighting device having a light source and at least one of a light diffusion unit and an optical film, 15. An illumination device, wherein the light source comprises a light emitting device according to claim 1.

19. A moving body having a body and a lighting fixture provided on the body, A moving body, wherein the lighting fixture comprises the light emitting device according to any one of claims 1 to 14.

20. 1. A wearable device having a display device for displaying an image, A wearable device, wherein the display device comprises the light-emitting device according to claim 1 .

Images