Electrode for electroencephalogram measurement

Abstract

To provide an electrode for electroencephalogram measurement that can stabilize conductivity.SOLUTION: An electrode 100 for electroencephalogram measurement comprises a base part 90, protrusions 80, a conductive layer 30 having conductivity, a plate-like conductive plate 71, and a linear conductive wire 40. The base part 90 has a plurality of protrusions 80 of an elastic body on one surface. The conductive layer 30 is formed on at least some of the protrusions 80. The conductive plate 71 is provided for the other surface 22 opposite to the one surface 24. The conductive wire 40 passes through the base part 90 and is electrically connected to the conductive layer 30. The conductive wire 40 is in contact with the conductive plate 71 and passes through the conductive plate 71.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to an electrode for measuring electroencephalograms. [Background technology]

[0002] Patent Document 1 discloses an electrode for measuring electroencephalograms in which a conductive paste layer is provided between an electrode portion and a snap button. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-23458 Summary of the Invention [Problem to be solved by the invention]

[0004] In Patent Document 1, the electrode portion and the snap button are electrically connected via a conductive paste layer. However, if the adhesive strength between the electrode portion and the snap button is low, the stability of the conductivity is impaired.

[0005] One example of a problem that the present invention aims to solve is stabilizing electrical conductivity. [Means for solving the problem]

[0006] According to the present invention, a base portion having a plurality of protrusions on one surface; a conductive layer formed on at least a portion of the protrusion; a plate-shaped conductive plate provided on the other surface opposite to the one surface; a linear conductive wire that penetrates the base portion and is electrically connected to the conductive layer, An electroencephalogram measuring electrode is provided, in which the conductive wire is in contact with the conductive plate and passes through the conductive plate. [Effects of the Invention]

[0007] According to the present invention, an electrode for measuring electroencephalograms that can stabilize conductivity can be provided. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram schematically showing an electroencephalogram measuring device worn on a person's head. [Figure 2] FIG. [Figure 3] FIG. 2 is a schematic front view of the EEG electrode unit. [Figure 4] FIG. 2 is a schematic perspective view of an electrode for measuring an electroencephalogram. [Figure 5] FIG. 2 is a schematic plan view of an electroencephalogram measuring electrode. [Figure 6] 1 is a diagram schematically showing a cross section of an electroencephalogram measuring electrode according to a first embodiment. FIG. [Figure 7] FIG. 10 is a diagram schematically showing a cross section of an electroencephalogram measuring electrode according to a second embodiment. [Figure 8] FIG. 10 is a diagram schematically showing a cross section of an electroencephalogram measuring electrode according to a third embodiment. [Figure 9] FIG. 1 is a diagram showing evaluation results of examples and comparative examples. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all drawings, similar components are designated by similar reference numerals, and their description will be omitted where appropriate. The drawings are schematic diagrams and do not correspond to the actual dimensional proportions.

[0010] First Embodiment Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram schematically showing an electroencephalogram (EEG) measuring device 1 attached to a person's head 99. An electroencephalogram measuring method is carried out in which the electroencephalogram measuring device 1 is attached to the head 99 of a subject and an electroencephalogram is measured. The electroencephalogram measuring device 1 is attached to the head 99, detects electroencephalograms as potential fluctuations from the living body, and outputs the detected electroencephalograms to an electroencephalogram display device (not shown). The electroencephalogram display device acquires the electroencephalograms detected by the electroencephalogram measuring device 1 and displays them on a monitor, stores the data, and performs well-known electroencephalogram analysis processing.

[0011] (Structure of electroencephalogram measuring device 1) 1, the electroencephalogram measuring device 1 has a plurality of electroencephalogram electrode units 10 and a frame 20. In this embodiment, five electroencephalogram electrode units 10 are provided for five channels (five units).

[0012] (Frame 20 structure) 2 is a schematic perspective view of the frame 20. The frame 20 is formed in a belt-like shape from a hard member such as polyamide resin, and is curved so as to fit the shape of a human head 99.

[0013] The frame 20 is provided with five electrode unit mounting sections 21 as openings for mounting the EEG electrode units 10. The positions of the electrode unit mounting sections 21 (i.e., the mounting positions of the EEG electrode units 10) correspond to the positions T3, C3, Cz, C4, and T4 in the International 10-20 electrode placement method.

[0014] The inner circumferential surface of the electrode unit attachment portion 21 is threaded, and the EEG electrode unit 10 is screwed into the threaded portion 13 (see Figure 3) of the body portion 15. By adjusting the amount by which the EEG electrode unit 10 is screwed in, the amount of protrusion toward the head 99 can be adjusted, thereby controlling the amount and pressure of contact with the head 99 (scalp). In addition, the action of screwing in the EEG electrode unit 10 also pushes hair aside.

[0015] (Structure of EEG electrode unit 10) 3 is a schematic front view of the EEG electrode unit 10. The EEG electrode unit 10 has a substantially cylindrical body 15 and an EEG measurement electrode 100 provided on one end side (the lower side in the figure) of the body 15.

[0016] The body 15 integrally has a signal extraction section 12, a threaded section 13, and an electrode fixing section 14. The threaded section 13 is threaded into the side of a cylindrical shape. The signal extraction section 12 is provided at one end (upper side in the figure) of the threaded section 13. A signal output terminal is provided on the signal extraction section 12, and it is operated by an operator using a predetermined jig as necessary when screwing the EEG electrode unit 10 to the frame 20. The other end (lower side in the figure) of the threaded section 13 has a cylindrical electrode fixing section 14. An EEG measurement electrode 100 is attached to the electrode fixing section 14.

[0017] (Electroencephalogram measuring electrode 100) Fig. 4 is a schematic perspective view of the electroencephalogram measuring electrode 100. Fig. 5 is a schematic plan view of the electroencephalogram measuring electrode 100. Fig. 6 is a schematic view showing a cross section of the electroencephalogram measuring electrode 100 according to the first embodiment. Fig. 6 particularly shows the AA cross section of Fig. 5.

[0018] The electroencephalogram measuring electrode 100 includes a base portion 90, a plurality of elastic protrusions 80, an electrically conductive conductive layer 30, linear conductive wires 40, and a snap button portion 70. The base portion 90 and the protrusions 80 are integrally formed using a rubber-like elastic material. The base portion 90 and the protrusions 80 are not limited to being integrally formed, and may be formed separately and assembled using an adhesive or a fitting structure. The snap button portion 70 includes a plate-shaped conductive plate 71 and a columnar columnar portion 72. The conductive plate 71 and the columnar columnar portion 72 may be integrally formed.

[0019] (Base part 90) The base portion 90 has a substantially cylindrical shape, with one end forming a circular first surface 24 and the other end forming a circular second surface 22. The second surface 22 is the surface opposite to the first surface 24. The second surface 22 faces the side where the conductive plate 71 (snap button portion 70) is provided. The base portion 90 may be made of resin or a conductive material. The base portion 90 has a plurality of cone-shaped protrusions 80 made of an elastic body on the first surface 24. In the first embodiment, the diameter of the base portion 90 is larger than the diameter of the conductive plate 71. In the radial direction DR1 of the base portion 90, the end 90a of the base portion 90 is located outside the end 71a of the conductive plate 71.

[0020] (Protrusion 80) A plurality of protrusions 80 are aligned and provided on one surface 24. In the first embodiment, the protrusions 80 have a hexagonal pyramid shape. In the first embodiment, the protrusions 80 are substantially regular hexagonal pyramids. As the shape of the protrusions 80, various shapes can be adopted, such as a regular hexagonal pyramid, a polygonal pyramid such as a triangular pyramid or a square pyramid, or a cone.

[0021] In the first embodiment, 19 regular hexagonal protrusions 80 are arranged at equal intervals. More specifically, in Figures 5 and 6, three protrusions 80 are arranged in the first row, four in the second row, five in the third row, four in the fourth row, and three in the fifth row, with adjacent protrusions 80 arranged symmetrically in the vertical and horizontal directions. In the first embodiment, the multiple protrusions 80 are arranged symmetrically in the vertical and horizontal directions with respect to the center C of one surface 24. Note that adjacent protrusions 80 may be arranged so that their bases are in contact with each other without any gaps, or there may be gaps.

[0022] The protrusion 80 includes a side surface portion 11 that is continuous with the one surface 24. The side surface portion 11 is continuous with the one surface 24. In the first embodiment, the side surface portion 11 is a sloped portion of the surface of the protrusion 80. The side surface portion 11 according to the first embodiment includes the vertex 61 of the protrusion 80. The side surface portion 11 according to the first embodiment connects the vertex 61 of the protrusion 80 and the one surface 24.

[0023] <Materials of the base portion 90 and the protrusion portion 80> The materials of the base portion 90 and the protrusions 80 will be described. The base portion 90 and the protrusions 80 are configured to have a rubber-like elastic body. Specific examples of the rubber-like elastic body include rubber and thermoplastic elastomers (also simply referred to as "elastomers (TPE)"). Examples of rubber include silicone rubber. Examples of thermoplastic elastomers include styrene-based TPE (TPS), olefin-based TPE (TPO), vinyl chloride-based TPE (TPVC), urethane-based TPE (TPU), ester-based TPE (TPEE), and amide-based TPE (TPAE).

[0024] When the base portion 90 and the protruding portion 80 are made of silicone rubber, the rubber hardness A is, for example, 15 or more and 55 or less, when the Type A durometer hardness of the surface (protruding portion 80 and base portion 90) of the electroencephalogram measuring electrode 100 measured at 37°C in accordance with JIS K 6253 (1997) is taken as rubber hardness A.

[0025] Here, the silicone rubber-based hardening composition will be described. The silicone rubber can be a cured product of a silicone rubber-based curable composition. The curing step of the silicone rubber-based curable resin composition is carried out, for example, by heating at 100 to 250°C for 1 to 30 minutes (primary curing) and then post-baking at 100 to 200°C for 1 to 4 hours (secondary curing).

[0026] The insulating silicone rubber is a silicone rubber that does not contain a conductive filler, and the conductive silicone rubber is a silicone rubber that contains a conductive filler.

[0027] The silicone rubber-based curable composition according to this embodiment can contain a vinyl group-containing organopolysiloxane (A). The vinyl group-containing organopolysiloxane (A) is a polymer that serves as the main component of the silicone rubber-based curable composition according to this embodiment.

[0028] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of vinyl group-containing linear organopolysiloxane. The same type of vinyl group-containing linear organopolysiloxane may be different in the amount of vinyl groups in the molecule, the molecular weight distribution, or the amount of vinyl groups added, as long as it contains the same vinyl groups as functional groups and has a linear shape. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different vinyl group-containing organopolysiloxanes.

[0029] The vinyl group-containing organopolysiloxane (A) can contain a vinyl group-containing linear organopolysiloxane (A1) having a linear structure.

[0030] The vinyl group-containing linear organopolysiloxane (A1) has a linear structure and contains vinyl groups, which become crosslinking points during curing.

[0031] The vinyl group content of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but preferably has two or more vinyl groups in the molecule and is 15 mol% or less, more preferably 0.01 to 12 mol%. This optimizes the amount of vinyl groups in the vinyl group-containing linear organopolysiloxane (A1), ensuring the formation of a network with each of the components described below. In this embodiment, the symbol "to" means that both ends of the symbol are included.

[0032] In this specification, the vinyl group content refers to the mole percent of vinyl group-containing siloxane units when all units constituting the vinyl group-containing linear organopolysiloxane (A1) are taken as 100 mole percent, where it is considered that there is one vinyl group per vinyl group-containing siloxane unit.

[0033] The degree of polymerization of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably within a range of, for example, about 1,000 to 10,000, and more preferably about 2,000 to 5,000. The degree of polymerization can be determined, for example, as the polystyrene-equivalent number-average degree of polymerization (or number-average molecular weight) measured by GPC (gel permeation chromatography) using chloroform as a developing solvent.

[0034] Furthermore, the specific gravity of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably in the range of about 0.9 to 1.1.

[0035] By using a vinyl group-containing linear organopolysiloxane (A1) having a degree of polymerization and specific gravity within the above ranges, the heat resistance, flame retardancy, chemical stability, etc. of the resulting silicone rubber can be improved.

[0036] As the vinyl group-containing linear organopolysiloxane (A1), those having a structure represented by the following formula (1) are particularly preferred.

[0037] [ka]

[0038] In formula (1), R1 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, or a hydrocarbon group consisting of a combination thereof, each having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, with a methyl group being preferred. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group, with a vinyl group being preferred. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0039] Furthermore, R2 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, or a hydrocarbon group formed by combining these groups, each having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, with a methyl group being preferred. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0040] Furthermore, R3 is a substituted or unsubstituted alkyl group or aryl group having 1 to 8 carbon atoms, or a hydrocarbon group formed by combining these. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, and a propyl group, with a methyl group being preferred. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group.

[0041] Furthermore, examples of the substituents for R1 and R2 in formula (1) include a methyl group and a vinyl group, and examples of the substituent for R3 include a methyl group.

[0042] In formula (1), multiple R1's are independent of each other and may be different from each other or the same as each other. The same applies to R2 and R3.

[0043] Furthermore, m and n are the numbers of repeating units constituting the vinyl group-containing linear organopolysiloxane (A1) represented by formula (1), where m is an integer of 0 to 2000 and n is an integer of 1000 to 10000. m is preferably 0 to 1000, and n is preferably 2000 to 5000.

[0044] Specific examples of the vinyl group-containing linear organopolysiloxane (A1) represented by formula (1) include those represented by the following formula (1-1).

[0045] [ka]

[0046] In formula (1-1), R1 and R2 each independently represent a methyl group or a vinyl group, and at least one of them is a vinyl group.

[0047] Furthermore, the vinyl group-containing linear organopolysiloxane (A1) preferably contains a first vinyl group-containing linear organopolysiloxane (A1-1) having two or more vinyl groups in the molecule and a vinyl group content of 0.4 mol% or less, and a second vinyl group-containing linear organopolysiloxane (A1-2) having a vinyl group content of 0.5 to 15 mol%. Combining a first vinyl group-containing linear organopolysiloxane (A1-1) with a typical vinyl group content for raw rubber, the raw material for silicone rubber, with a second vinyl group-containing linear organopolysiloxane (A1-2) with a high vinyl group content allows for uneven distribution of vinyl groups, more effectively creating a crosslink density distribution within the crosslinked network of the silicone rubber. As a result, the tear strength of the silicone rubber can be more effectively increased.

[0048] Specifically, as the vinyl group-containing linear organopolysiloxane (A1), it is preferable to use, for example, a first vinyl group-containing linear organopolysiloxane (A1-1) having two or more units in which R1 is a vinyl group and / or units in which R2 is a vinyl group in the molecule, and containing 0.4 mol % or less of these units, and a second vinyl group-containing linear organopolysiloxane (A1-2) containing 0.5 to 15 mol % of units in which R1 is a vinyl group and / or units in which R2 is a vinyl group, in the above formula (1-1).

[0049] The first vinyl group-containing linear organopolysiloxane (A1-1) preferably has a vinyl group content of 0.01 to 0.2 mol %, and the second vinyl group-containing linear organopolysiloxane (A1-2) preferably has a vinyl group content of 0.8 to 12 mol %.

[0050] Furthermore, when the first vinyl group-containing linear organopolysiloxane (A1-1) and the second vinyl group-containing linear organopolysiloxane (A1-2) are combined and blended, the ratio of (A1-1) to (A1-2) is not particularly limited, but for example, the weight ratio of (A1-1):(A1-2) is preferably 50:50 to 95:5, and more preferably 80:20 to 90:10.

[0051] The first and second vinyl group-containing linear organopolysiloxanes (A1-1) and (A1-2) may each be used alone or in combination of two or more.

[0052] The vinyl group-containing organopolysiloxane (A) may also contain a vinyl group-containing branched organopolysiloxane (A2) having a branched structure.

[0053] <<Organohydrogenpolysiloxane (B)>> The silicone rubber-based curable composition of this embodiment may contain a crosslinking agent. The crosslinking agent may contain organohydrogenpolysiloxane (B). The organohydrogenpolysiloxane (B) is classified into a linear organohydrogenpolysiloxane (B1) having a linear structure and a branched organohydrogenpolysiloxane (B2) having a branched structure, and may contain either one or both of these.

[0054] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of crosslinking agent. The same type of crosslinking agent may have at least a common structure, such as a linear or branched structure, and may have different molecular weight distributions or different functional groups in the molecule, or may be added in different amounts. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different crosslinking agents.

[0055] The linear organohydrogenpolysiloxane (B1) has a linear structure and a structure in which hydrogen is directly bonded to Si (≡Si-H), and is a polymer that undergoes a hydrosilylation reaction with the vinyl groups of the vinyl group-containing organopolysiloxane (A) and with vinyl groups of the components blended into the silicone rubber-based curable composition, thereby crosslinking these components.

[0056] The molecular weight of the linear organohydrogenpolysiloxane (B1) is not particularly limited, but for example, the weight average molecular weight is preferably 20,000 or less, and more preferably 1,000 or more and 10,000 or less.

[0057] The weight average molecular weight of the linear organohydrogenpolysiloxane (B1) can be measured, for example, by gel permeation chromatography (GPC) using chloroform as a developing solvent, in terms of polystyrene.

[0058] Furthermore, it is generally preferred that the linear organohydrogenpolysiloxane (B1) does not contain a vinyl group, which can reliably prevent the crosslinking reaction from proceeding within the molecule of the linear organohydrogenpolysiloxane (B1).

[0059] As the linear organohydrogenpolysiloxane (B1) described above, for example, one having a structure represented by the following formula (2) is preferably used.

[0060] [ka]

[0061] In formula (2), R4 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, a hydrocarbon group formed by combining these groups, or a hydride group having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, with a methyl group being preferred. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0062] Furthermore, R5 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, a hydrocarbon group formed by combining these groups, or a hydride group having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, with a methyl group being preferred. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0063] In formula (2), the multiple R4s are independent of each other and may be different or the same. The same applies to R5. However, among the multiple R4s and R5s, at least two or more are hydrido groups.

[0064] Furthermore, R6 is a substituted or unsubstituted alkyl group or aryl group having 1 to 8 carbon atoms, or a hydrocarbon group formed by combining these. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group. Multiple R6s are independent of each other and may be different or the same.

[0065] In addition, examples of the substituents R4, R5, and R6 in formula (2) include a methyl group and a vinyl group, and from the viewpoint of preventing intramolecular crosslinking reactions, a methyl group is preferred.

[0066] Furthermore, m and n are the numbers of repeating units constituting the linear organohydrogenpolysiloxane (B1) represented by formula (2), where m is an integer of 2 to 150 and n is an integer of 2 to 150. Preferably, m is an integer of 2 to 100 and n is an integer of 2 to 100.

[0067] The linear organohydrogenpolysiloxane (B1) may be used alone or in combination of two or more.

[0068] Because the branched organohydrogenpolysiloxane (B2) has a branched structure, it forms regions with high crosslink density, and is a component that significantly contributes to the formation of a sparsely crosslinked structure in the silicone rubber system. Like the linear organohydrogenpolysiloxane (B1), it has a structure in which hydrogen is directly bonded to silicon (≡Si-H), and undergoes a hydrosilylation reaction with the vinyl groups of the vinyl-group-containing organopolysiloxane (A) and with the vinyl groups of other components incorporated into the silicone rubber-based curable composition, forming a polymer that crosslinks these components.

[0069] The specific gravity of the branched organohydrogenpolysiloxane (B2) is in the range of 0.9 to 0.95.

[0070] Furthermore, it is generally preferred that the branched organohydrogenpolysiloxane (B2) does not contain vinyl groups, which can reliably prevent crosslinking reactions from occurring within the molecules of the branched organohydrogenpolysiloxane (B2).

[0071] The branched organohydrogenpolysiloxane (B2) is preferably one represented by the following average composition formula (c).

[0072] Average composition formula (c) (Ha(R7)3-aSiO1 / 2)m(SiO4 / 2)n (In formula (c), R7 is a monovalent organic group, a is an integer ranging from 1 to 3, m is the number of Ha(R7)3-aSiO1 / 2 units, and n is the number of SiO4 / 2 units.)

[0073] In formula (c), R7 is a monovalent organic group, preferably a substituted or unsubstituted alkyl group or aryl group having 1 to 10 carbon atoms, or a hydrocarbon group consisting of a combination thereof. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, with a methyl group being preferred. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0074] In formula (c), a is the number of hydride groups (hydrogen atoms directly bonded to Si), and is an integer ranging from 1 to 3, preferably 1.

[0075] In addition, in formula (c), m is the number of Ha(R7)3-aSiO1 / 2 units, and n is the number of SiO4 / 2 units.

[0076] The branched organohydrogenpolysiloxane (B2) has a branched structure. The linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) differ in their structures, that is, whether they are linear or branched. The number of alkyl groups R bonded to Si (R / Si), where the number of Si is 1, is in the range of 1.8 to 2.1 for the linear organohydrogenpolysiloxane (B1) and 0.8 to 1.7 for the branched organohydrogenpolysiloxane (B2).

[0077] Because the branched organohydrogenpolysiloxane (B2) has a branched structure, it leaves a residue amount of 5% or more when heated, for example, in a nitrogen atmosphere to 1000°C at a heating rate of 10°C / min. In contrast, because the linear organohydrogenpolysiloxane (B1) is linear, it leaves almost no residue amount after heating under the above conditions.

[0078] Specific examples of the branched organohydrogenpolysiloxane (B2) include those having a structure represented by the following formula (3).

[0079] [ka]

[0080] In formula (3), R7 is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group formed by combining these, or a hydrogen atom. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, and a propyl group, with a methyl group being preferred. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group. Examples of the substituent of R7 include a methyl group.

[0081] In addition, in formula (3), multiple R7s are independent of each other and may be different from each other or the same.

[0082] In addition, in formula (3), "-O-Si≡" indicates that Si has a branched structure that spreads three-dimensionally.

[0083] The branched organohydrogenpolysiloxane (B2) may be used alone or in combination of two or more.

[0084] Furthermore, the amount of hydrogen atoms (hydride groups) directly bonded to Si in the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) is not particularly limited. However, in the silicone rubber-based curable composition, the total amount of hydride groups in the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) is preferably 0.5 to 5 moles, more preferably 1 to 3.5 moles, per mole of vinyl groups in the vinyl group-containing linear organopolysiloxane (A1). This ensures the reliable formation of a crosslinked network between the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) and the vinyl group-containing linear organopolysiloxane (A1).

[0085] <<Silica particles (C)>> The silicone rubber-based curable composition according to this embodiment contains a non-conductive filler. The non-conductive filler may contain silica particles (C) as needed. This can improve the hardness and mechanical strength of the elastomer.

[0086] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of non-conductive filler. Non-conductive fillers of the same type may have at least a common constituent material, but may differ in particle size, specific surface area, surface treatment agent, or amount of surface treatment agent added. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different silane coupling agents.

[0087] The silica particles (C) are not particularly limited, but examples thereof include fumed silica, calcined silica, precipitated silica, etc. These may be used alone or in combination of two or more.

[0088] The silica particles (C) preferably have a specific surface area of 50 to 400 m / g, more preferably 100 to 400 m / g, as measured by the BET method, and have an average primary particle size of 1 to 100 nm, more preferably about 5 to 20 nm.

[0089] By using silica particles (C) having a specific surface area and average particle size within the above ranges, it is possible to improve the hardness and mechanical strength of the silicone rubber formed, particularly the tensile strength.

[0090] <<Silane coupling agent (D)>> The silicone rubber-based curable composition of this embodiment may contain a silane coupling agent (D). The silane coupling agent (D) may have a hydrolyzable group, which is hydrolyzed by water to form a hydroxyl group, which undergoes a dehydration condensation reaction with the hydroxyl groups on the surface of the silica particles (C), thereby modifying the surface of the silica particles (C).

[0091] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of silane coupling agent. Silane coupling agents of the same type may have at least a common functional group, but may differ in other functional groups in the molecule or in the amount added. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different silane coupling agents.

[0092] The silane coupling agent (D) may also contain a silane coupling agent having a hydrophobic group. This provides the surface of the silica particles (C), thereby reducing the cohesive strength of the silica particles (C) in the silicone rubber-based curable composition and, ultimately, in the silicone rubber (reducing aggregation due to hydrogen bonding via silanol groups). This is thought to result in improved dispersibility of the silica particles (C) in the silicone rubber-based curable composition. This increases the interface between the silica particles (C) and the rubber matrix, enhancing the reinforcing effect of the silica particles (C). Furthermore, it is thought that the sliding properties of the silica particles (C) within the matrix are improved during deformation of the rubber matrix. The improved dispersibility and sliding properties of the silica particles (C) improve the mechanical strength (e.g., tensile strength, tear strength, etc.) of the silicone rubber due to the silica particles (C).

[0093] Furthermore, the silane coupling agent (D) may contain a silane coupling agent having a vinyl group. This introduces a vinyl group onto the surface of the silica particles (C). Therefore, during curing of the silicone rubber-based curable composition, i.e., when the vinyl groups of the vinyl group-containing organopolysiloxane (A) and the hydride groups of the organohydrogenpolysiloxane (B) undergo a hydrosilylation reaction to form a network (crosslinked structure), the vinyl groups of the silica particles (C) also participate in the hydrosilylation reaction with the hydride groups of the organohydrogenpolysiloxane (B), thereby incorporating the silica particles (C) into the network. This allows for a silicone rubber with a low hardness and a high modulus to be formed.

[0094] As the silane coupling agent (D), a silane coupling agent having a hydrophobic group and a silane coupling agent having a vinyl group can be used in combination.

[0095] An example of the silane coupling agent (D) is one represented by the following formula (4).

[0096] Yn-Si-(X)4-n (4) In the above formula (4), n represents an integer of 1 to 3. Y represents a functional group having a hydrophobic group, a hydrophilic group, or a vinyl group, and when n is 1, it is a hydrophobic group, and when n is 2 or 3, at least one of the groups is a hydrophobic group. X represents a hydrolyzable group.

[0097] The hydrophobic group is an alkyl group having 1 to 6 carbon atoms, an aryl group, or a hydrocarbon group formed by combining these groups, such as a methyl group, an ethyl group, a propyl group, or a phenyl group, with a methyl group being particularly preferred.

[0098] Examples of the hydrophilic group include a hydroxyl group, a sulfonic acid group, a carboxyl group, and a carbonyl group, and among these, a hydroxyl group is particularly preferred. Although a hydrophilic group may be contained as a functional group, it is preferable that the hydrophilic group is not contained from the viewpoint of imparting hydrophobicity to the silane coupling agent (D).

[0099] Furthermore, examples of the hydrolyzable group include alkoxy groups such as methoxy and ethoxy groups, chloro groups, and silazane groups, among which silazane groups are preferred because of their high reactivity with silica particles (C). Note that a compound having a silazane group as a hydrolyzable group has two (Yn-Si-) structures in the above formula (4) due to its structural characteristics.

[0100] Specific examples of the silane coupling agent (D) represented by the above formula (4) are as follows. As the functional group having hydrophobic group, for example, alkoxysilane such as methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, decyltrimethoxysilane; chlorosilane such as methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, phenyltrichlorosilane; hexamethyldisilazane.Among these, the silane coupling agent having trimethylsilyl group, including one or more selected from the group consisting of hexamethyldisilazane, trimethylchlorosilane, trimethylmethoxysilane and trimethylethoxysilane, is preferred.

[0101] As the functional group having a vinyl group, for example, alkoxysilanes such as methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinylmethyldimethoxysilane; chlorosilanes such as vinyltrichlorosilane, vinylmethyldichlorosilane; divinyltetramethyldisilazane.Among these, preferred is the silane coupling agent having a vinyl group-containing organosilyl group, comprising one or more selected from the group consisting of methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, divinyltetramethyldisilazane, vinyltriethoxysilane, vinyltrimethoxysilane, and vinylmethyldimethoxysilane.

[0102] Furthermore, when the silane coupling agent (D) contains two types of silane coupling agents, one having a trimethylsilyl group and the other having a vinyl group-containing organosilyl group, it is preferable that the one having the hydrophobic group contains hexamethyldisilazane and the one having the vinyl group contains divinyltetramethyldisilazane.

[0103] When a silane coupling agent (D1) having a trimethylsilyl group and a silane coupling agent (D2) having a vinyl-containing organosilyl group are used in combination, the ratio of (D1) to (D2) is not particularly limited, but for example, the weight ratio of (D1):(D2) is 1:0.001 to 1:0.35, preferably 1:0.01 to 1:0.20, and more preferably 1:0.03 to 1:0.15. By adjusting the weight ratio within this range, the desired physical properties of the silicone rubber can be obtained. Specifically, a balance can be achieved between the dispersibility of silica in the rubber and the crosslinkability of the rubber.

[0104] In this embodiment, the lower limit of the content of the silane coupling agent (D) is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more, based on 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A). The upper limit of the content of the silane coupling agent (D) is preferably 100% by mass or less, more preferably 80% by mass or less, and even more preferably 40% by mass or less, based on 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A). By setting the content of the silane coupling agent (D) to the above lower limit or more, it is possible to improve the adhesion between the columnar portion containing the elastomer and the conductive resin layer. It also contributes to improving the mechanical strength of the silicone rubber. Furthermore, by setting the content of the silane coupling agent (D) to the above upper limit or less, it is possible to provide the silicone rubber with appropriate mechanical properties.

[0105] <<Platinum or platinum compounds (E)>> The silicone rubber-based curable composition according to this embodiment may contain a catalyst. The catalyst may contain platinum or a platinum compound (E). The platinum or platinum compound (E) is a catalytic component that acts as a catalyst during curing. The amount of platinum or platinum compound (E) added is a catalytic amount.

[0106] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of catalyst. The same type of catalyst is sufficient as long as they have at least common constituent materials, and the catalyst may contain different compositions, or the amounts of the components added may be different. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different catalysts.

[0107] As the platinum or platinum compound (E), known compounds can be used, such as platinum black, platinum supported on silica or carbon black, chloroplatinic acid or an alcohol solution of chloroplatinic acid, a complex salt of chloroplatinic acid and an olefin, and a complex salt of chloroplatinic acid and a vinylsiloxane.

[0108] The platinum or platinum compound (E) may be used alone or in combination of two or more.

[0109] In this embodiment, the content of platinum or platinum compound (E) in the silicone rubber-based curable composition means a catalytic amount, which can be set as appropriate, but specifically, it is an amount such that the platinum group metal is 0.01 to 1000 ppm by weight, and preferably 0.1 to 500 ppm, per 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A), silica particles (C), and silane coupling agent (D). By adjusting the content of platinum or platinum compound (E) to the above lower limit or more, the silicone rubber-based curable composition can be cured at an appropriate rate. Furthermore, by adjusting the content of platinum or platinum compound (E) to the above upper limit or less, production costs can be reduced.

[0110] <<Water(F)>> Furthermore, the silicone rubber-based hardening composition according to this embodiment may contain water (F) in addition to the above components (A) to (E).

[0111] Water (F) functions as a dispersion medium to disperse the components contained in the silicone rubber-based curable composition, and also contributes to the reaction between the silica particles (C) and the silane coupling agent (D). This allows the silica particles (C) and the silane coupling agent (D) to be more reliably bonded to each other in the silicone rubber, allowing the composition to exhibit uniform properties overall.

[0112] (Other ingredients) Furthermore, the silicone rubber-based curable composition of this embodiment may further contain other components in addition to the above components (A) to (F), such as inorganic fillers other than the silica particles (C), such as diatomaceous earth, iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide, cerium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, glass wool, and mica, as well as additives such as reaction inhibitors, dispersants, pigments, dyes, antistatic agents, antioxidants, flame retardants, and thermal conductivity improvers.

[0113] The conductive solution (conductive silicone rubber composition) according to this embodiment contains the above-mentioned conductive filler and solvent in addition to the above-mentioned silicone rubber-based curable composition that does not contain a conductive filler.

[0114] As the solvent, various known solvents can be used, including, for example, high-boiling point solvents, which may be used alone or in combination of two or more.

[0115] Examples of the solvent include aliphatic hydrocarbons such as pentane, hexane, cyclohexane, heptane, methylcyclohexane, ethylcyclohexane, octane, decane, dodecane, and tetradecane; aromatic hydrocarbons such as benzene, toluene, ethylbenzene, xylene, trifluoromethylbenzene, and benzotrifluoride; ethers such as diethyl ether, diisopropyl ether, dibutyl ether, cyclopentyl methyl ether, cyclopentyl ethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, 1,4-dioxane, 1,3-dioxane, and tetrahydrofuran; haloalkanes such as dichloromethane, chloroform, 1,1-dichloroethane, 1,2-dichloroethane, 1,1,1-trichloroethane, and 1,1,2-trichloroethane; carboxylic acid amides such as N,N-dimethylformamide and N,N-dimethylacetamide; and sulfoxides such as dimethyl sulfoxide and diethyl sulfoxide. These may be used alone or in combination of two or more.

[0116] The conductive solution can have a viscosity suitable for various application methods such as spray application and dip application by adjusting the amount of solids in the solution.

[0117] Furthermore, when the conductive solution contains the conductive filler and the silica particles (C), the lower limit of the content of the silica particles (C) contained in the EEG measurement electrode 100 can be, for example, 1% by mass or more, preferably 3% by mass or more, and more preferably 5% by mass or more, relative to 100% by mass of the total amount of the silica particles (C) and the conductive filler. This can improve the mechanical strength of the EEG measurement electrode 100. On the other hand, the upper limit of the content of the silica particles (C) contained in the EEG measurement electrode 100 can be, for example, 20% by mass or less, preferably 15% by mass or less, and more preferably 10% by mass or less, relative to 100% by mass of the total amount of the silica particles (C) and the conductive filler. This can achieve a balance between the conductivity and the mechanical strength and flexibility of the EEG measurement electrode 100.

[0118] The conductive solution is heated and dried as needed to obtain a conductive silicone rubber. The conductive silicone rubber may be configured not to contain silicone oil, which can prevent the silicone oil from bleeding out onto the surface of the EEG measurement electrode 100 (protrusion 80) and thereby prevent a decrease in conductivity.

[0119] (Conductive layer 30) The conductive layer 30 is formed on at least a part of the protruding portion 80. In the first embodiment, the conductive layer 30 is provided so as to cover the entire surface of the protruding portion 80. In the first embodiment, the conductive layer 30 is provided so as to cover the entire side portion 11. The conductive layer 30 may be provided so as to cover at least a part of the one surface 24. In the first embodiment, the conductive layer 30 comes into contact with the head 99 (scalp).

[0120] <Material of Conductive Layer 30> The conductive layer 30 is, for example, a paste containing a highly conductive metal. The highly conductive metal includes one or more metals selected from the group consisting of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, and alloys thereof. In terms of availability and conductivity, silver, silver chloride, and copper are particularly suitable.

[0121] (Conductive wire 40) The conductive wire 40 (40a, 40b) shown in FIG. 6 has a linear shape. The conductive wire 40 has a shape that extends in one direction. The conductive wire 40 is conductive. In the first embodiment, the conductive wire 40 is electrically connected to the conductive layer 30 provided on one surface 24. The conductive wire 40 may also be electrically connected to the conductive layer 30 provided on the surface of the protruding portion 80 (side surface portion 11). The conductive wire 40 penetrates the base portion 90. The conductive wire 40 that penetrates the base portion 90 is in contact with the conductive plate 71. The conductive wire 40 is bent so as to follow the surface (first surface 71b and second surface 71c described below) on which the conductive plate 71 extends. The conductive wire 40 may also be fixed to the conductive plate 71 by soldering, tape, or adhesive. When fixed with tape or adhesive, the length of the bent portion of conductive wire 40 (the length of the portion in contact with conductive plate 71) is preferably 5 mm or more.

[0122] The conductive plate 71 includes a first surface 71b and a second surface 71c. The first surface 71b faces the base portion 90 (other surface 22). The first surface 71b is in contact with the base portion 90 (other surface 22). The second surface 71c is located on the opposite side of the first surface 71b. The first surface 71b and the second surface 71c are surfaces on which the conductive plate 71 extends.

[0123] In the first embodiment, the conductive wire 40 a penetrates from the one surface 24 to the other surface 22 . The conductive wire 40a penetrates the base portion 90 (other surface 22) in a direction along the center line C1. One tip 40a1 of the conductive wire 40a is bent along the first surface 71b (other surface 22). The tip 40a1 is sandwiched between the base portion 90 and the snap button portion 70. The tip 40a1 is sandwiched between the other surface 22 of the base portion 90 and the first surface 71b of the conductive plate 71. The conductive wire 40a is fixed to the conductive plate 71 by soldering or applying an adhesive to the tip 40a1. The conductive wire 40a is electrically connected to the conductive layer 30 provided on the one surface 24 and is also electrically connected to the conductive plate 71 (snap button portion 70).

[0124] In the first embodiment, the conductive wire 40b also penetrates from the one surface 24 to the other surface 22. The conductive wire 40b also penetrates the base portion 90 (other surface 22) in the direction along the center line C1. One tip 40b1 of the conductive wire 40b is bent along the second surface 71c. The tip 40b1 is not sandwiched between the base portion 90 and the snap button portion 70. In the radial direction DR1, the conductive wire 40b is provided outside the end 71a of the conductive plate 71. The conductive wire 40b is fixed to the conductive plate 71 (second surface 71c) by soldering or applying an adhesive to the tip 40b1. The conductive wire 40b is electrically connected to the conductive layer 30 provided on the one surface 24 and also electrically connected to the conductive plate 71 (snap button portion 70).

[0125] <Materials for Conductive Wire 40> The conductive wire 40 may be made of any known material, such as conductive fiber. The conductive fiber may be one or more types selected from the group consisting of metal fiber, metal-coated fiber, carbon fiber, conductive polymer fiber, conductive polymer-coated fiber, and conductive paste-coated fiber. These may be used alone or in combination of two or more types.

[0126] The metal material of the metal fibers and metal-coated fibers is not limited as long as it is conductive, but examples include copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, stainless steel, aluminum, silver / silver chloride, and alloys thereof. These may be used alone or in combination of two or more. Among these, silver can be used from the viewpoint of conductivity. Furthermore, it is preferable that the metal material does not contain metals that put a strain on the environment, such as chromium.

[0127] The fiber materials for the metal-coated fibers, conductive polymer-coated fibers, and conductive paste-coated fibers are not particularly limited, but may be synthetic fibers, semi-synthetic fibers, or natural fibers. Among these, polyester, nylon, polyurethane, silk, cotton, etc. are preferred. These may be used alone or in combination of two or more.

[0128] Examples of the carbon fiber include PAN-based carbon fiber and pitch-based carbon fiber.

[0129] The conductive polymer material for the above-mentioned conductive polymer fibers and conductive polymer-coated fibers may be, for example, a mixture of a conductive polymer such as polythiophene, polypyrrole, polyaniline, polyacetylene, polyphenylene vinylene, polynaphthalene, or a derivative thereof and a binder resin, or an aqueous solution of a conductive polymer such as PEDOT-PSS ((3,4-ethylenedioxythiophene)-poly(styrenesulfonic acid)).

[0130] The resin material contained in the conductive paste of the conductive paste-coated fiber is not particularly limited, but preferably has elasticity, and may contain, for example, one or more selected from the group consisting of silicone rubber, urethane rubber, fluororubber, nitrile rubber, acrylic rubber, styrene rubber, chloroprene rubber, and ethylene propylene rubber. These may be used alone or in combination of two or more.

[0131] The conductive filler contained in the conductive paste of the conductive paste-coated fiber is not particularly limited, and may be any known conductive material, but may include one or more selected from the group consisting of metal particles, metal fibers, metal-coated fibers, carbon black, acetylene black, graphite, carbon fibers, carbon nanotubes, conductive polymers, conductive polymer-coated fibers, and metal nanowires.

[0132] The metal constituting the conductive filler is not particularly limited, but may include, for example, at least one of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, silver / silver chloride, or alloys thereof, or two or more of these. Among these, silver or copper is preferred because of its high conductivity and easy availability.

[0133] The conductive wire 40 may be made of a twisted yarn made by twisting together a plurality of linear conductive fibers, which can prevent the conductive wire 40 from breaking when deforming.

[0134] In this embodiment, the coating of conductive fibers does not simply mean covering the outer surface of the fiber material, but also includes, in the case of a twisted yarn made by twisting together single fibers, impregnating the gaps between the fibers in the twisted yarn with metal, conductive polymer, or conductive paste to coat each single fiber that makes up the twisted yarn.

[0135] The tensile breaking elongation of the conductive wire 40 is, for example, 1% to 50%, and preferably 1.5% to 45%. By keeping the elongation within this range, excessive deformation of the protrusion 80 can be suppressed while preventing breakage during deformation.

[0136] According to the first embodiment, the electroencephalogram measuring electrode 100 includes the protruding portion 80, the base portion 90, the conductive layer 30, the conductive plate 71, and the conductive wire material 40.

[0137] Conventionally, a layer of silver paste or the like is sandwiched between the base and the conductive plate (snap button portion), and electrical continuity between the conductive wire and the conductive plate (snap button portion) is achieved through the silver paste layer. That is, electrical continuity is achieved in the following order: conductive layer, conductive wire, silver paste layer, and conductive plate (snap button portion). However, this method has problems such as a decrease in adhesive strength between the base and the snap button portion, and a decrease in the probability of forming a conductive path between the conductive wire and the snap button depending on the thickness of the silver paste layer, resulting in unstable conductivity of the EEG measurement electrodes.

[0138] However, the electroencephalogram measuring electrode 100 according to the first embodiment does not have a silver paste layer, and the conductive wire 40 according to the first embodiment is in contact with the conductive plate 71 and is bent so as to follow the surfaces (first surface 71b, second surface 71c) along which the conductive plate 71 extends. In this way, by adopting a configuration without using a silver paste layer, it is possible to stabilize conductivity.

[0139] Second Embodiment FIG. 7 is a diagram schematically showing a cross section of an electrode 100 for measuring electroencephalograms according to the second embodiment. Unlike the first embodiment, the electrode 100 for measuring electroencephalograms according to the second embodiment further includes a cap member 60. The cap member 60 has a hollow cylindrical shape. The cap member 60 houses a base portion 90 and a conductive plate 71. The cap member 60 presses the base portion 90 and the conductive plate 71 against each other. By using the cap member 60, the base portion 90 and the conductive plate 71 are tightly attached to each other. The cap member 60 may be made of resin.

[0140] The electroencephalogram measuring electrode 100 according to the second embodiment further includes the cap member 60, which improves the adhesion between the base portion 90 and the conductive plate 71, i.e., the adhesion between the conductive wire 40 and the conductive plate 71. This makes it possible to stabilize the conductivity.

[0141] <Third embodiment> 8 is a diagram schematically showing a cross section of an electroencephalogram measuring electrode 100 according to the third embodiment. The conductive wire 40 according to the third embodiment is in contact with the conductive plate 71 and passes through the conductive plate 71. The conductive wires 40a and 40b according to the third embodiment pass through both the base portion 90 and the conductive plate 71.

[0142] The tip 40a1 of the conductive wire 40a and the tip 40b1 of the conductive wire 40b protrude from and are exposed to the second surface 71c. Note that the tip 40a1 and the tip 40b1 may be bent to fit along the second surface 71c, as in the first embodiment.

[0143] In the third embodiment, the conductive wire 40a and the conductive wire 40b may be fixed to the conductive plate 71 by soldering or adhesive. The tip 40a1 of the conductive wire 40a and the tip 40b1 of the conductive wire 40b may be tied together to prevent the conductive wire 40 from slipping out of the conductive plate 71.

[0144] Although not shown, the electroencephalogram measuring electrode 100 may also further include a cap member 60 in the third embodiment.

[0145] The conductive wire 40 according to the third embodiment is in contact with the conductive plate 71 and penetrates through the conductive plate 71. In the third embodiment as well, the electroencephalogram measuring electrode 100 can be configured without using a silver paste layer, and the conductivity can be stabilized. [Example]

[0146] Examples are described below. As an example, an electroencephalogram measuring electrode 100 in which the conductive wire 40 and the snap button portion 70 (conductive plate 71) are electrically connected without using a silver paste layer was used, and an electroencephalogram measuring electrode in which the conductive wire and the snap button portion (conductive plate) are electrically connected by inserting a silver paste layer between the base portion and the snap button portion was used as a comparative example. Specifically, an evaluation test was conducted using the average contact resistance [Ω] between the base portion and the snap button portion for each lot (1 lot to 5 lots), and the yield rate [%] for each lot was calculated.

[0147] Figure 9 shows the evaluation results of the examples and comparative examples. As shown in Figure 9, the example in which the conductive wire 40 is in direct contact with the snap button portion 70 (conductive plate 71) without using a silver paste layer has a higher yield rate. In other words, by adopting the configuration according to the embodiment, the yield rate can be improved. Note that "OL" in "2 Lot" indicates that measurement was not possible.

[0148] Although the embodiments and examples of the present invention have been described above, these are merely examples of the present invention, and various other configurations can also be adopted.

[0149] The conductive wire 40 according to the first embodiment can be attached to one surface 24 in any manner, and may be attached by applying adhesive to the tip of the conductive wire 40, or by tying a knot at the tip of the conductive wire 40. [Explanation of symbols]

[0150] 11 Side part 22 Other side 24 one side 30 Conductive layer 40 Conductive wire 70 Snap button part 80 Protrusion 90 Base 99 head 100 Electrode for measuring electroencephalograms

Claims

1. a base portion having a plurality of protrusions on one surface; a conductive layer formed on at least a portion of the protrusion; a plate-shaped conductive plate provided on the other surface opposite to the one surface; a linear conductive wire that penetrates the base portion and is electrically connected to the conductive layer, The electroencephalogram measuring electrode, wherein the conductive wire is in contact with the conductive plate and passes through the conductive plate.

2. 2. The electroencephalogram measuring electrode according to claim 1, An electrode for measuring electroencephalograms, wherein the conductive wire is fixed to the conductive plate by soldering, tape, or adhesive.

3. 3. The electroencephalogram measuring electrode according to claim 1, The electroencephalogram measuring electrode further comprises a cap member that presses the base portion and the conductive plate against each other.

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