Electronic device

Abstract

To provide an electronic device having an improved appearance quality while securing cooling performance.SOLUTION: An electronic device comprises a housing, and a fan provided in the housing and having a suction surface in which a suction port is formed, where the housing includes a protrusion provided to protrude from a bottom surface and extending along a width direction, the protrusion has a standing wall extending along a longitudinal direction thereof, and a vent hole is formed in the standing wall. The suction surface is disposed to face an inner space of the protrusion.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to an electronic device equipped with a fan. [Background technology]

[0002] Electronic devices such as notebook PCs are equipped with heat generating elements such as CPUs, etc. Such electronic devices are configured to have a fan installed inside the housing to absorb heat generated by the heat generating elements and dissipate it to the outside (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7104832 Summary of the Invention [Problem to be solved by the invention]

[0004] Conventional electronic devices typically have an air intake consisting of a series of multiple slit-shaped openings on the bottom surface of the housing, through which a fan draws in outside air. Therefore, with this configuration, the air intake on the bottom surface is noticeable, for example, when carrying the device or using it in an upright position, degrading the appearance quality. On the other hand, simply eliminating the air intake on the bottom surface to improve design may result in a decrease in the fan's suction efficiency and airflow, which may result in a decrease in cooling performance.

[0005] The present invention has been made in consideration of the above-mentioned problems of the conventional technology, and has an object to provide an electronic device that can improve the appearance quality while ensuring cooling performance. [Means for solving the problem]

[0006] An electronic device according to one aspect of the present invention comprises a housing and a fan provided within the housing and having an intake surface on which an intake port is formed, the housing having a protrusion extending along the width direction and protruding from the bottom surface, the protrusion having a standing wall extending along its longitudinal direction, an air vent formed in the standing wall, and the intake surface positioned facing the inner space of the protrusion. [Effects of the Invention]

[0007] According to the above aspect of the present invention, it is possible to improve the appearance quality while ensuring the cooling performance. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic plan view of an electronic device according to an embodiment, viewed from above. [Figure 2] FIG. 2 is a plan view schematically showing the internal structure of the housing. [Figure 3] FIG. 3 is a perspective view of the bottom surface of the housing as seen obliquely from behind. [Figure 4] FIG. 4 is a perspective view of the bottom surface of the housing as seen obliquely from the front. [Figure 5] FIG. 5 is a side view of the electronic device. [Figure 6] FIG. 6 is a side cross-sectional view that schematically shows the internal structure of the housing around the cooling module. [Figure 7] FIG. 7 is a front cross-sectional view that schematically shows the internal structure of the housing around the cooling module. [Figure 8] FIG. 8 is a table showing the results of a simulation experiment comparing the cooling performance of an electronic device and the surface temperature of the housing when cooling modules with different configurations are mounted on the housing. DETAILED DESCRIPTION OF THE INVENTION

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an electronic device according to the present invention will be described in detail with reference to the accompanying drawings.

[0010] FIG. 1 is a schematic plan view of an electronic device 10 according to one embodiment, viewed from above. As shown in FIG. 1, the electronic device 10 according to this embodiment is a clamshell notebook PC. The electronic device 10 has a configuration in which a cover 11 and a housing 12 are connected by a hinge 14 so that they can rotate relative to each other. In this embodiment, the electronic device 10 is a notebook PC, but the electronic device may be other than a notebook PC, such as a tablet PC, a smartphone, or a portable game console.

[0011] The cover 11 is a thin, flat, box-shaped housing. The cover 11 is equipped with a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0012] The housing 12 is a thin, flat box. A keyboard device 18 and a touchpad 19 face the top surface (surface 12a) of the housing 12. Hereinafter, the housing 12 and each of the components mounted thereon will be described based on the posture of an operator operating the keyboard device 18, with the width direction (left and right) of the housing 12 referred to as the X1 and X2 directions, the depth direction (front and back) of the housing 12 referred to as the Y1 and Y2 directions, and the thickness direction (top and bottom) of the housing 12 referred to as the Z1 and Z2 directions. The X1 and X2 directions may be collectively referred to as the X direction, and the Y1, Y2 directions and the Z1, Z2 directions may similarly be referred to as the Y direction and the Z direction. These directions are defined for convenience of explanation and may naturally change depending on the usage state or installation posture of the electronic device 10, etc.

[0013] The housing 12 is composed of a housing member 20 that forms the top surface and four peripheral side surfaces, and a cover material 21 that forms the bottom surface. The housing member 20 is formed by forming standing walls 20B on the four peripheral edges of a cover plate 20A that forms the surface 12a of the housing 12. Therefore, the housing member 20 has a roughly bathtub shape with an open bottom surface. The cover material 21 has a roughly flat plate shape and serves as a lid that closes the bottom opening of the housing member 20. The housing member 20 and the cover material 21 are overlapped in the thickness direction and are detachably connected to each other. The standing walls 20B may be formed on the cover material 21. In this case, the housing member 20 may be composed of only the cover plate 20A.

[0014] The hinge 14 is installed in a concave hinge placement groove 12b formed in the rear edge of the housing 12, and connects the housing 12 and the cover 11. The hinge 14 has a structure in which, for example, hinge shafts 14a serving as rotation axes are supported at both longitudinal ends of the hinge housing 14b (see FIG. 5). The hinge 14 of this embodiment is configured in a so-called one-bar shape in which the hinge housing 14b extends along the longitudinal direction of the hinge placement groove 12b. The hinge 14 rotates integrally with the cover 11 and descends obliquely rearward (see FIG. 5). The hinge 14 has a structure that increases the rotation angle of the cover 11 in this way, a so-called drop-down structure. The hinge 14 may have a structure other than that described above.

[0015] Fig. 2 is a plan view schematically showing the internal structure of the housing 12. Fig. 2 is a view of the inside of the housing member 20 from the bottom side with the cover material 21 removed.

[0016] 2, the housing 12 accommodates a cooling module 24, a motherboard 25, and a battery device 26. The housing 12 also accommodates various electronic components, mechanical components, and the like.

[0017] The motherboard (substrate) 25 is a circuit board that serves as the main board of the electronic device 10. The motherboard 25 is disposed near the Y2 side of the housing 12 and extends in the X direction. The battery device 26 is a rechargeable battery that serves as the power source for the electronic device 10. The battery device 26 is disposed near the Y1 side of the motherboard 25 and extends in the X direction.

[0018] The motherboard 25 of this embodiment is equipped with a CPU (Central Processing Unit) 25a. In addition to the CPU 25a, the motherboard 25 can also be equipped with various electronic components such as a GPU (Graphics Processing Unit), memory, and a communication module.

[0019] The motherboard 25 has, for example, an upper surface (first surface 25A) that serves as an attachment surface to the housing member 20, and a lower surface (second surface 25B) that serves as a mounting surface for the CPU 25a and the like.

[0020] Next, an example of the configuration of the cooling module 24 will be described.

[0021] The CPU 25a is a heat generating element that generates the largest amount of heat among the electronic components mounted in the housing 12. The cooling module 24 can absorb and diffuse the heat generated by the CPU 25a and discharge it to the outside of the housing 12. The cooling module 24 may be configured to cool a heat generating element other than the CPU 25a, such as a GPU.

[0022] As shown in FIG. 2, the cooling module 24 of this embodiment includes a metal plate 27, a heat pipe 28, a pair of heat sinks 29, 29, and a pair of fans 30, 30.

[0023] The metal plate 27 is a thin plate made of a metal with high thermal conductivity, such as copper or aluminum. In this embodiment, the metal plate 27 is a copper plate. The metal plate 27 extends in the X direction between the left and right fans 30. The metal plate 27 covers a portion (portion 25C) of the motherboard 25 disposed between the left and right fans 30 and the CPU 25a mounted on portion 25C from the second surface 25B side (Z2 side) (see also FIG. 7). The metal plate 27 functions as a heat diffusion member that absorbs and diffuses heat from the CPU 25a and other components. The metal plate 27 is connected to the surface of the CPU 25a. For example, thermally conductive grease and a copper block of approximately the same size as the CPU 25a are interposed between the metal plate 27 and the CPU 25a. Leaf springs 32 are attached to the edges 27a1 and 27a2 of the metal plate 27 along the X direction. The plate spring 32 is a component that presses the metal plate 27 against the CPU 25a.

[0024] The heat pipe 28 is a pipe-type heat transport device. The heat pipe 28 is constructed by flattening a metal pipe to form a thin, elliptical cross section, with a working fluid sealed inside. Examples of the working fluid include water, alternative chlorofluorocarbons, acetone, and butane. For example, two heat pipes 28 can be used as a pair. The longitudinal center of the heat pipe 28 is fixed to the backside of the surface of the metal plate 27 that is connected to the CPU 25a. Both ends of the heat pipe 28 are fixed to the Z2-side surfaces of the left and right heat sinks 29, respectively. The longitudinal center of each heat pipe 28 overlaps with the CPU 25a in the Z direction. This allows the heat pipe 28 to efficiently receive heat from the CPU 25a transferred to the metal plate 27 and transport it to the heat sinks 29 at both ends with high efficiency.

[0025] The heat sink 29 has a structure in which multiple fins made of thin metal plates are arranged at equal intervals in the X direction. Each fin stands in the Z direction on a predetermined base plate and extends in the Y direction. A gap is formed between adjacent fins of the heat sink 29, allowing air sent from the fan 30 to pass through. The heat sink 29 is made of a metal with high thermal conductivity, such as aluminum or copper. The heat sink 29 is disposed opposite the side surface 30a (outlet port 34a) on the Y2 side of the fan 30.

[0026] The pair of fans 30, 30 are arranged side by side in the X direction, straddling the metal plate 27 between them, and face each other. Each fan 30 has an outlet 34a on its side surface 30a on the Y2 side. The outlet 34a is adjacent to and faces the heat sink 29 behind it. Each fan 30 can also have an outlet 34b on its side surface 30b facing the opposite direction. The outlets 34b of the left and right fans 30 face each other with the metal plate 27 sandwiched between them. Each fan 30 has an intake port 35 on at least the Z2-side end surface 30d of its upper and lower end surfaces 30c, 30d facing the Z direction. The intake port 35 can also be provided on the Z1-side end surface 30c. The end surfaces 30c, 30d are perpendicular to the side surfaces 30a, 30b and perpendicular to the axial direction of the rotation shaft of the impeller 30e.

[0027] Fan 30 is a centrifugal fan that rotates impeller 30e housed inside a housing using a motor (see FIG. 6), allowing fan 30 to draw in air through intake port 35 and discharge it from outlets 34a and 34b.

[0028] Next, an intake / exhaust structure for introducing air into the housing 12 by the fan 30 and discharging the air discharged from the fan 30 to the outside of the housing 12 will be described.

[0029] Fig. 3 is a perspective view of the bottom surface 12c of the housing 12 as seen obliquely from behind. Fig. 4 is a perspective view of the bottom surface 12c of the housing 12 as seen obliquely from the front. Fig. 5 is a side view of the electronic device 10. Fig. 6 is a side cross-sectional view schematically showing the internal structure of the housing 12 at the cooling module 24 and its periphery. Fig. 7 is a front cross-sectional view schematically showing the internal structure of the housing 12 at the cooling module 24 and its periphery.

[0030] 2 to 6, the exhaust structure of electronic device 10 can include exhaust ports 40, 42 formed in upright wall 30B (outer wall 38) at the rear edge (Y2-side edge) of housing 12. Exhaust port 40 is an opening for discharging air (hot air) that is discharged from outlet 34b of fan 30, passes over the surface of metal plate 27, and cools it, to the outside of housing 12. Exhaust port 42 is an opening for discharging air (hot air) that is discharged from outlet 34a of fan 30, passes over heat sink 29, and cools it to the outside of housing 12.

[0031] In this embodiment, the Y2-side standing wall 30B extends along its longitudinal direction and has a hinge arrangement groove 12b recessed toward the Y1 side. The outer wall 38 is the bottom wall (front wall) of the hinge arrangement groove 12b.

[0032] The exhaust port 40 is provided near the center of the outer wall 38 in the longitudinal direction. The exhaust port 40 is composed of multiple (four in FIG. 3) openings 40a lined up closely in the X direction, for example. The exhaust port 40 is located between the fans 30, 30 when the arrangement direction (X direction) of the left and right fans 30, 30 is used as the reference. The metal plate 27 extends in the X direction at a position close to the outer wall 38. Therefore, the exhaust port 40 is close to and faces the edge 27a2 on the Y2 side of the metal plate 27.

[0033] The exhaust port 42 is formed in the outer wall 38 on the same plane as the exhaust port 40. The exhaust port 42 is composed of a plurality of openings 42a (four in FIG. 3 ) lined up closely in the X direction, for example. A pair of exhaust ports 42 is provided and arranged to straddle the exhaust port 40 in the longitudinal direction of the outer wall 38. Each exhaust port 42 faces closely to the Y2 side of the left and right heat sinks 29, 29, respectively, and is located near the left and right ends of the outer wall 38.

[0034] The standing wall 30B may be configured without the hinge arrangement groove 12b, in which case the exhaust ports 40 and 42 may be formed in the standing wall 30B itself, which is the outer wall.

[0035] As shown in FIGS. 2 to 7, the air intake structure of the electronic device 10 includes an air vent 50 formed in a protrusion 48 provided on the bottom surface 12c of the housing 12.

[0036] The protrusion 48 protrudes from the bottom surface 12c. The protrusion 48 has a rectangular cylindrical shape that is long in the X direction and flattened in the Z direction. The length of the protrusion 48 in the X direction corresponds to substantially the entire width of the housing 12 in the X direction. The protrusion 48 is provided at a position closer to the Y2 side in the front-to-rear direction (Y direction) of the bottom surface 12c. The protrusion 48 has a pair of standing walls 48a, 48b extending along its longitudinal direction (X direction). The standing wall 48b on the Y2 side is located immediately in front of the outer wall 38. In a plan view of the housing 12, the protrusion 48 is positioned to vertically overlap the left and right fans 30, 30 (see FIG. 2).

[0037] The protrusion 48 is provided with ventilation holes 50, and functions as part of the air intake structure of the electronic device 10. The ventilation holes 50 are provided in the vertical wall 48a on the Y1 side. The ventilation holes 50 are composed of, for example, multiple openings 50a (three in FIG. 3) lined up closely in the X direction. The openings 50a are, for example, holes with a generally L-shaped cross section that continue from the vertical wall 48a to the cover material 21 (see FIGS. 4 and 6). The openings 50a may be formed only in the vertical wall 48a and may not extend to the cover material 21. A pair of ventilation holes 50 are provided, and are located on the Y1 sides of the left and right fans 30, 30 in the X direction. Each ventilation hole 50 is provided near both left and right ends of the vertical wall 48a. Each fan 30 does not have an outlet on the Y1-side side surface 30f facing the ventilation holes 50.

[0038] 6 and 7, the end surface 30d on which the suction port 35 of each fan 30 is formed faces the inner space 48c of the protrusion 48. Hereinafter, the end surface 30d may also be referred to as the "suction surface 30d." The inner space 48c is a groove-like space that is deeper in the Z2 direction from the inner surface 21a of the cover material 21 that forms the bottom surface 12c by the height of the protrusion 48. In other words, the inner space 48c expands the internal space of the housing 12 in the Z direction.

[0039] The suction surface 30d faces the Z2 side and is disposed so as to cover the upper portion of the inner space 48c. This allows the fan 30 to smoothly draw air from outside the housing 12 through the vents 50 provided in the standing wall 48a into the suction port 35. It is preferable that a portion of the thickness of the fan 30, i.e., the suction surface 30d, is inserted into the inner space 48c.

[0040] The depth of the inner space 48c, i.e., the height in the Z2 direction from the inner surface 21a of the cover material 21 to the inner bottom surface 48d of the protrusion 48, can be, for example, approximately 2.5 to 4 mm. The height in the Z2 direction from the inner surface 21a to the suction surface 30d can be, for example, approximately 0.5 to 1.5 mm. In this case, it is preferable to ensure a gap of 1 mm or more between the suction surface 30d and the inner bottom surface 48d. This allows the fan 30 to more smoothly draw air introduced into the inner space 48c from the ventilation opening 50 through the suction port 35. Furthermore, by providing the inner space 48c directly below the fan 30, the thickness of the fan 30 can be increased, thereby increasing the airflow rate of the fan 30. The suction surface 30d may be located closer to the Z1 side than the inner surface 21a.

[0041] The protrusion 48 may be provided with an input / output port 54 at each of its longitudinal ends (left and right end faces). The input / output port 54 may be compliant with the HDMI (registered trademark) standard or the USB 3.0 communication standard. This allows the electronic device 10 to have a tapered surface 56a on the sidewall 56, as described below, while still allowing the installation of an input / output port 54 that requires a certain height. The protrusion 48 also functions as a rear leg that elevates the rear of the housing 12 placed on a surface such as a desk, relative to the front. This allows the keyboard device 18 of the electronic device 10 to assume a tilted position with its front lowered during use, improving operability. Reference numeral 55 in FIGS. 3 to 7 denotes rubber legs that serve as legs when the electronic device 10 is placed on a surface. The rubber legs 55 on the Y2 side are provided on the bottom surface 48e of the protrusion 48.

[0042] The air intake structure of the electronic device 10 may also include an air intake port 58 formed in the standing wall 30B (side wall 56) on the side edge (X1, X2 side edge) of the housing 12. The air intake port 58 is an opening for introducing air outside the housing 12 into the intake port 35 of the fan 30.

[0043] The left and right side walls 56 extend in the Y direction, which is perpendicular to the X direction, which is the longitudinal direction of the outer wall 38. Each side wall 56 has a vertical surface along the Z direction that forms the outer periphery of the housing 12, and a tapered surface 56a that gradually slopes from this vertical surface toward the center of the housing 12 toward the Z2 side. An air intake port 58 is provided on the tapered surface 56a of each side wall 56. The air intake port 58 is composed of, for example, multiple openings 58a (two in FIG. 3 ) that are closely aligned in the Y direction. The left and right air intake ports 58 are located on the opposite side of the fan 30 from the exhaust ports 40, 42 when the longitudinal direction (Y direction) of the side walls 56 is used as a reference. In other words, the air intake port 58 is located forward (on the Y1 side) of the fan 30.

[0044] By providing the fan 30 with an intake port 35 on the Z1 side end face 30c as well as the Z2 side end face 30d, the fan 30 can more smoothly draw in air outside the housing 12 through each intake port 58 provided in the side wall 56.

[0045] Next, a description will be given of the cooling action of the cooling module 24. The dashed-dotted arrows shown in Figures 2 to 7 schematically indicate the flow of air.

[0046] In electronic device 10, heat generated by heat generating elements such as CPU 25a is transferred to metal plate 27 and diffused, and is also efficiently transported to left and right heat sinks 29 by heat pipes 28. Left and right fans 30 use vents 50 in protrusions 48 as intakes to draw in outside air (cool air) into intake port 35 and discharge it from outlets 34a, 34b. Each fan 30 can also draw in outside air (cool air) through intake port 58.

[0047] The air discharged from the outlets 34a of the left and right fans 30 passes through the heat sink 29 and is cooled. The cooled air (warm air) is discharged to the outside of the housing 12 through exhaust ports 42 that open at both the left and right ends of the outer wall 38. At the same time, the air discharged from the outlets 34b of the left and right fans 30 flows along the surface of the metal plate 27, cooling the metal plate 27 and the heat pipe 28, and also directly cooling the electronic components of the CPU 25a. The cooled air (warm air) is discharged to the outside of the housing 12 through the exhaust port 40 that opens in the center of the outer wall 38.

[0048] Next, the effects of the electronic device 10 of this embodiment will be described with reference to FIG.

[0049] FIG. 8 is a table showing the results of a simulation experiment comparing the cooling performance of an electronic device and the surface temperature of the housing when cooling modules with different configurations are mounted on the housing.

[0050] In FIG. 8, "Housing 12" in the right column shows experimental results in which the cooling module 24 was mounted in the housing 12 described above. "Housing 12A" in the middle column shows experimental results in which the cooling module 24 was mounted in a housing 12A according to a modified example in which the air intake 58 was omitted from the housing 12 described above. "Housing 60" in the left column shows experimental results in which the cooling module 24 was mounted in a comparative example housing 60 in which the air intake 58 and vent 50 were omitted from the housing 12 described above, and instead an air intake 61 was formed on the bottom surface 48e of the protrusion 48. The air intake 61 is positioned so as to overlap each fan 30 vertically.

[0051] 8, "top surface temperature" indicates the temperature (°C) of the high temperature portion on the surface 12a of the housing 12. "bottom surface temperature" indicates the temperature (°C) of the high temperature portion on the bottom surface 12c of the housing 12.

[0052] Experimental results showed that the housings 12 and 12A of the present embodiment had lower top and bottom surface temperatures than the housing 60 of the comparative example. That is, the electronic device 10 of the present embodiment, which uses the housing 12 or 12A, had a lower temperature on the surface 12a of the keyboard device 18 and its surroundings, which are often touched by the operator's hands. Furthermore, the electronic device 10 of the present embodiment also had a lower temperature on the bottom surface 12c, which is likely to come into contact with the operator's lap, etc. In particular, the housing 12 had even lower top and bottom surface temperatures than the housing 12A. This confirmed that the electronic device 10 has improved usability.

[0053] Furthermore, in electronic device 10 of the present embodiment, no openings due to air intakes are formed on bottom surfaces 12c, 48e of housings 12, 12A. Therefore, electronic device 10 including housings 12, 12A has bottom surfaces 12c, 48e with no openings and a generally flat shape even when, for example, it is carried or used in an upright position, improving the appearance quality.

[0054] As described above, electronic device 10 of this embodiment is provided with fan 30, which is disposed within housing 12 (12A) and has suction surface 30d on which suction port 35 is formed. Housing 12 (12A) has protrusion 48 that protrudes from bottom surface 12c and extends along the width direction (X direction). Protrusion 48 has standing wall 48a that extends along its longitudinal direction (X direction). Ventilation port 50 is formed in standing wall 48a. Suction surface 30d of fan 30 is disposed facing inner space 48c of protrusion 48.

[0055] In this manner, the electronic device 10 is disposed so that the suction surface 30d of the fan 30 faces the inner space 48c of the protrusion 48 provided on the bottom surface 12c of the housing 12 (12A). An air intake (vent 50) is formed in the vertical wall 48a of the protrusion 48 for introducing outside air into the suction surface 30d. Therefore, the housing 12 (12A) does not need to have openings in its bottom surfaces 12c, 48e, improving its appearance. Furthermore, by providing the vent 50 in the vertical wall 48a of the protrusion 48, which has the inner space 48c facing the suction surface 30d of the fan 30, high cooling capacity is ensured. As a result, the electronic device 10 can also reduce the surface temperature of the housing 12 (12A) compared to a configuration in which an air intake is provided on the bottom surface 48e as shown in FIG. 8.

[0056] That is, by providing the protrusion 48, the electronic device 10 can achieve a high-quality design without holes in the bottom surfaces 12c, 48e. On the other hand, because the electronic device 10 does not have holes in the bottom surfaces 12c, 48e, the introduction of outside air (air intake) into the fan 30 becomes an issue. In this regard, the electronic device 10 has an air vent 50 in the protrusion 48 where the suction surface 30d of the fan 30 faces the internal space 48c. As a result, the distance between the air intake 35 of the fan 30 and the air vent (air intake) 50 is extremely short in the electronic device 10, increasing the amount of air suction and air volume by the fan 30 and improving cooling capacity.

[0057] The fan 30 is preferably installed in a position that overlaps the protrusion 48 vertically, with a portion of the fan 30 in the thickness direction (Z direction) located within the inner space 48c of the protrusion 48. This allows a sufficiently thick fan 30 to be installed even in a thin housing 12 (12A), further improving cooling capacity. In other words, the fan 30 can more smoothly draw air introduced into the inner space 48c from the vent 50 through the suction port 35, resulting in high cooling capacity as shown in FIG. 8. In this case, it is preferable to ensure a predetermined gap between the suction surface 30d and the inner bottom surface 48d of the protrusion 48. This further improves the suction efficiency from the vent 50 at the suction port 35.

[0058] The housing 12 (12A) has an outer wall 38 in which the exhaust ports 40, 42 are formed and which extends along the longitudinal direction of the protrusion 48. The protrusion 48 is preferably located immediately in front of the outer wall 38. This positions the protrusion 48 near the rear end of the bottom surface 12c of the electronic device 10, improving the cohesiveness of the design on the side of the bottom surface 12c and further improving the appearance quality.

[0059] The housing 12 may also have an air intake port 58 on each of the left and right side walls 56. This increases the amount of air intake by the fan 30 and increases the amount of air discharged, further improving the cooling capacity of the cooling module 24.

[0060] It should be noted that the present invention is not limited to the above-described embodiment, and can be freely modified without departing from the spirit of the present invention. [Explanation of symbols]

[0061] 10 Electronic equipment 11 Lid 12,12A housing 16 Display 18 Keyboard Device 24 Cooling Module 25 Motherboard 25a CPU 27 Metal Plate 28 Heat Pipe 29 Heatsink 30 fans 34a,34b Discharge port 35 Intake port 38 Exterior Wall 40,42 Exhaust port 48 Protrusion 48c inner space 50 Ventilation

Claims

1. An electronic device, The housing and a fan provided in the housing and having an intake surface with an intake port formed thereon; Equipped with the housing has a protrusion that protrudes from a bottom surface and extends along a width direction, The protrusion has a standing wall extending along its longitudinal direction, and a ventilation hole is formed in the standing wall, The suction surface is disposed facing the inner space of the protruding portion. An electronic device characterized by:

2. 10. The electronic device according to claim 1, The fan is installed at a position where it overlaps the protrusion in the vertical direction, and a part of the fan in the thickness direction is disposed within the inner space of the protrusion. An electronic device characterized by:

3. 3. The electronic device according to claim 2, A gap is provided between the suction surface and the inner bottom surface of the protrusion. An electronic device characterized by:

4. The electronic device according to any one of claims 1 to 3, the housing has an outer wall in which an exhaust port is formed and which extends along a longitudinal direction of the protrusion, The protrusion is disposed immediately in front of the outer wall. An electronic device characterized by:

5. 5. The electronic device according to claim 4, A lid with a display mounted on it, a hinge that rotatably connects the cover to one edge of the housing on which the outer wall is provided; Further equipped An electronic device characterized by:

6. 6. The electronic device according to claim 5, the housing has a pair of side walls extending in a direction perpendicular to the outer wall and having an air intake port formed therein; The air intake port is disposed on the opposite side of the protrusion from the outer wall side when the longitudinal direction of the side wall is taken as a reference. An electronic device characterized by:

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