Processing device and processing method

Abstract

To provide a processing device improved in convenience.MEANS: A processing device comprises: a first stage system which has a table (12) on which a work-piece (W) is placed and which moves the work-piece held on the table; a beam irradiation system (500) including a light collection optical system (530) that emits a beam LB; and a control device that controls the first stage system and the irradiation system. The control device controls the table and the irradiation system so that predetermined processing is applied to a target site of the work-piece while relatively moving the table and a beam from the light collection optical system, where at least either of a strength distribution of beams on a first surface (MP) at an emitting surface side of the light collection optical system and a strength distribution of beams on a second surface which is different in terms of a position in a direction of an optical axis (AX) of the light collection optical system from the first surface can be changed.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus and a processing method, and more particularly to a processing apparatus and a processing method for processing a workpiece by irradiating it with a beam. [Background technology]

[0002] In the field of machine tools for building machines, there is a strong demand for improvements in the convenience and performance of processing devices that use laser light or the like (see, for example, Patent Document 1) as machine tools. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2002 / 0017509 Summary of the Invention

[0004] According to a first aspect of the present invention, there is provided a processing apparatus that processes a workpiece by irradiating it with a beam, comprising: a first holding system having a first holding member on which the workpiece is placed and that moves the workpiece held on the first holding member; a beam irradiation system including a focusing optical system that emits the beam; and a control device that controls the first holding system and the irradiation system, wherein the control device controls the first holding system and the irradiation system so that a predetermined processing is performed on a target portion of the workpiece while moving the first holding member and the beam from the focusing optical system relative to each other, and at least one of the intensity distribution of the beam on a first surface on the exit surface side of the focusing optical system and the intensity distribution of the beam on a second surface whose position in the optical axis direction of the focusing optical system is different from the first surface is changeable.

[0005] Here, the first surface may be a virtual surface on which a target portion of a workpiece is to be aligned during machining. The predetermined surface may be, for example, a surface perpendicular to the optical axis of the focusing optical system. The predetermined surface may be the image plane of the focusing optical system or a surface nearby it, or the back focal plane or a surface nearby it.

[0006] According to a second aspect of the present invention, there is provided a processing apparatus that processes a workpiece by irradiating it with a beam, comprising: a first holding system having a first holding member on which the workpiece is placed and that moves the workpiece held on the first holding member; a beam irradiation system including a focusing optical system that emits the beam; and a control device that controls the first holding system and the irradiation system, wherein the control device controls the first holding system and the irradiation system so that a predetermined processing is performed on a target portion of the workpiece while moving the beam irradiated onto a first surface from the focusing optical system and the first holding member relative to each other, and the beam irradiation system has an optical device that can change the cross-sectional intensity distribution of the beam emitted from the focusing optical system at the pupil plane of the focusing optical system.

[0007] According to a third aspect of the present invention, there is provided a processing apparatus that processes a workpiece by irradiating it with a beam, comprising: a first holding system having a first holding member on which the workpiece is placed and that moves the workpiece held on the first holding member; a beam irradiation system including a focusing optical system that emits the beam; and a control device that controls the first holding system and the irradiation system, wherein the control device controls the first holding system and the irradiation system so that a predetermined processing is performed on a target portion of the workpiece while moving the beam irradiated onto a first surface from the focusing optical system and the first holding member relative to each other, and the intensity distribution in the cross section of the beam emitted from the focusing optical system has one-fold rotational symmetry.

[0008] According to a fourth aspect of the present invention, there is provided a processing method for processing a workpiece by irradiating it with a beam, comprising: holding the workpiece on a first holding member; and controlling the movement of the first holding member and the irradiation operation of the beam from the beam irradiation unit so that a predetermined processing is performed on a target portion of the workpiece while moving the beam emitted from a beam irradiation unit including a focusing optical system relative to the first holding member holding the workpiece, and wherein during the processing, at least one of the intensity distribution of the beam on a first surface on the exit surface side of the focusing optical system and the intensity distribution of the beam on a second surface whose position in the optical axis direction of the focusing optical system is different from the first surface is changed.

[0009] According to a fifth aspect of the present invention, there is provided a processing method for processing a workpiece by irradiating it with a beam, the method comprising: holding the workpiece on a first holding member; and controlling the movement of the first holding member and the irradiation operation of the beam from the beam irradiation unit so that a predetermined processing is performed on a target portion of the workpiece while moving the beam irradiated onto a first surface from a beam irradiation unit including a focusing optical system relative to the first holding member holding the workpiece, and changing the intensity distribution of the beam emitted from the focusing optical system at the pupil plane of the focusing optical system during the processing.

[0010] According to a sixth aspect of the present invention, there is provided a processing method for processing a workpiece by irradiating it with a beam, the processing method comprising: holding the workpiece on a first holding member; and controlling the movement of the first holding member and the irradiation operation of the beam from the beam irradiation unit so that a predetermined processing is performed on a target portion of the workpiece while moving the beam irradiated onto a first surface from a beam irradiation unit including a focusing optical system relative to the first holding member holding the workpiece, wherein the intensity distribution in the cross section of the beam emitted from the focusing optical system has one-fold rotational symmetry. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a block diagram showing an overall configuration of a processing device according to an embodiment; [Figure 2]FIG. 2 is a diagram schematically showing the configuration of a first stage system together with a measurement system. [Figure 3] FIG. 1 is a perspective view showing a first stage system on which a workpiece is mounted. [Figure 4] FIG. 1 is a diagram showing a beam irradiation system together with a mask stage on which a mask is provided and a table on which a workpiece is mounted. [Figure 5] FIG. [Figure 6] FIG. 2 is a diagram illustrating an example of the configuration of a light source system included in the beam irradiation system. [Figure 7] 10 is a diagram showing how a parallel beam from a light source system is irradiated onto a second mirror array, and how reflected beams from each of a plurality of mirror elements are incident on a first partial illumination optical system. FIG. [Figure 8] 10 is a diagram showing how a parallel beam from a first partial illumination optical system is irradiated onto a first mirror array, and how reflected beams from each of a plurality of mirror elements are incident on a focusing optical system. FIG. [Figure 9] Figure 9(A) is an enlarged view of the vicinity of the target surface of the workpiece when a beam is irradiated from the focusing optical system onto a target portion of the workpiece to form a slit-shaped irradiation area, and Figure 9(B) is a view showing the relationship between the slit-shaped irradiation area shown in Figure 9(A) and the scanning direction. [Figure 10] Figure 10(A) is an explanatory diagram of an example of a processing mode that can be set in the processing device of this embodiment, Figure 10(B) is a diagram for explaining processing using optical blades of mode 1, mode 2, mode 3 and mode 4, respectively, and Figure 10(C) is a diagram for explaining processing using optical blades of mode 5 and mode 6, respectively. [Figure 11] FIG. 2 is a diagram showing the arrangement of measurement devices on a table. [Figure 12] FIG. 2 is a diagram showing components of the measuring device arranged inside a table together with a measuring member. [Figure 13] Figure 13(A) is a diagram showing the optical arrangement when measuring the intensity distribution of a beam on the image plane of a focusing optical system, and Figure 13(B) is a diagram showing the optical arrangement when measuring the intensity distribution of a beam on the pupil plane. [Figure 14] 2 is a block diagram showing the input / output relationship of a control device that is a central component of the control system of the processing device. FIG. [Figure 15] 4 is a flowchart corresponding to a series of processing algorithms of the control device. [Figure 16] 7 is a flowchart showing an example of a subroutine of step S10 in FIG. 6. [Figure 17] FIG. 1 is a diagram showing the contents of various processes that can be performed by a machining device, in correspondence with conventional machine tools used to perform each process. [Figure 18] FIG. 1 is a diagram showing an example of a measurement device for measuring the intensity distribution of a beam on a processing surface. DETAILED DESCRIPTION OF THE INVENTION

[0012] An embodiment will be described below with reference to Figures 1 to 18. Figure 1 shows in block diagram the overall configuration of a processing apparatus 100 according to an embodiment.

[0013] The processing device 100 is a device that performs various processes, including removal processes (equivalent to cutting processes, grinding processes, etc. performed as mechanical processes), by irradiating a beam (usually a laser beam) onto an object to be processed (also called a workpiece).

[0014] The processing apparatus 100 includes four systems: a first stage system 200A, a second stage system 200B, a transfer system 300, a measurement system 400, and a beam irradiation system 500, and a control device 600 that includes these systems and controls the entire processing apparatus 100. Of these, the transfer system 300, the measurement system 400, and the beam irradiation system 500 are arranged apart from each other in a predetermined direction. In the following description, for convenience, it is assumed that the transfer system 300, the measurement system 400, and the beam irradiation system 500 are arranged apart from each other in the X-axis direction (see FIG. 2) described below.

[0015] Fig. 2 shows a schematic configuration of first stage system 200A together with measurement system 400. Fig. 3 shows a perspective view of first stage system 200A on which workpiece W is mounted. In the following description, the left-right direction within the plane of Fig. 2 is defined as the Y-axis direction, the direction perpendicular to the plane of the paper is defined as the X-axis direction, the direction perpendicular to the X-axis and Y-axis is defined as the Z-axis direction, and the directions of rotation (tilt) about the X-axis, Y-axis, and Z-axis are defined as the θx, θy, and θz directions, respectively.

[0016] The first stage system 200A changes the position and attitude of the workpiece W. Specifically, the position of the workpiece W in the six degrees of freedom is changed by moving a table (described later) on which the workpiece W is mounted in six degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz directions). In this specification, the positions of the table, workpiece, etc. in the three degrees of freedom, θx, θy, and θz directions, are collectively referred to as "attitude" as appropriate, and the positions in the remaining three degrees of freedom (X-axis, Y-axis, and Z-axis directions) are collectively referred to as "position" as appropriate.

[0017] The first stage system 200A is equipped with a Stewart platform type parallel link mechanism with six degrees of freedom as an example of a drive mechanism for changing the position and attitude of the table. Note that the first stage system 200A is not limited to one that can drive the table in six degrees of freedom, nor is it limited to a parallel link mechanism.

[0018] As shown in FIG. 2, first stage system 200A (excluding the stator of the planar motor, which will be described later) is placed on base BS, which is installed on floor F with its upper surface approximately parallel to the XY plane. As shown in FIG. 3, first stage system 200A includes slider 10, which has a regular hexagonal shape in plan view and constitutes the base platform, table 12, which constitutes the end effector, six extendable rods (links) 141-146 that connect slider 10 and table 12, and extension mechanisms 161-166 (not shown in FIG. 3, see FIG. 14) that are provided on rods 141-146 and extend or retract each of the rods. First stage system 200A is structured so that the movement of table 12 can be controlled with six degrees of freedom in three-dimensional space by independently adjusting the lengths of rods 141-146 using extension mechanisms 161-166. The first stage system 200A is equipped with a Stewart platform type six-degree-of-freedom parallel link mechanism as the drive mechanism for the table 12, and is therefore characterized by high precision, high rigidity, large support force, and easy inverse kinematics calculation.

[0019] In the processing apparatus 100 according to this embodiment, in order to perform desired processing on the workpiece during processing, the position and posture of the workpiece W (table 12) are controlled relative to the beam irradiation system 500, more specifically, the beam from the illumination optical system described below. In principle, the beam from the illumination optical system may be movable, or both the beam and the workpiece (table) may be movable. As will be described later, the beam irradiation system 500 has a complex configuration, so it is simpler to move the workpiece.

[0020] Here, the table 12 is made of a plate member shaped like an equilateral triangle with the vertices cut off. A workpiece W to be machined is placed on the upper surface of the table 12. The table 12 is provided with a chuck mechanism 13 (not shown in FIG. 3, see FIGS. 4 and 14) for fixing the workpiece W. The chuck mechanism 13 may be, for example, a mechanical chuck or a vacuum chuck. The table 12 is also provided with a measuring device 110 (see FIGS. 11 and 12) including a measuring member 92 that is circular in plan view as shown in FIG. 3. The measuring device 110 will be described in detail later. The shape of the table 12 is not limited to that shown in FIG. 3, and may be any shape, such as a rectangular plate or a disk.

[0021] 3, both ends of each of the rods 141 to 146 are connected to the slider 10 and the table 12 via universal joints 18. Rods 141 and 142 are connected to the table 12 near one vertex of a triangle, and are arranged such that the slider 10 and the rods 141 and 142 roughly form a triangle. Similarly, rods 143 and 144 and rods 145 and 146 are connected to the table 12 near the remaining vertices of the triangle, and are arranged such that the slider 10 and the rods 143 and 144 and the rods 145 and 146 roughly form a triangle.

[0022] Each of these rods 141 to 146 has a first shaft member 20 and a second shaft member 22 that are relatively movable in their respective axial directions, as shown representatively for rod 141 in Figure 3, and one end (lower end) of the first shaft member 20 is attached to the slider 10 via a universal joint 18, and the other end (upper end) of the second shaft member 22 is attached to the table 12 via a universal joint.

[0023] A stepped cylindrical hollow portion is formed inside the first shaft member 20, and a bellows-type air cylinder, for example, is housed at the bottom end of this hollow portion. A pneumatic circuit and an air pressure source (neither of which are shown) are connected to this air cylinder. The internal pressure of the air cylinder is controlled by controlling the air pressure of the compressed air supplied from the air pressure source via the pneumatic circuit, thereby causing the piston of the air cylinder to reciprocate in the axial direction. The return stroke of the air cylinder utilizes gravity acting on the piston when incorporated into a parallel link mechanism.

[0024] Furthermore, an armature unit (not shown) made up of a plurality of armature coils arranged side by side in the axial direction is disposed on the upper end side within the hollow portion of the first shaft member 20.

[0025] Meanwhile, one end (lower end) of the second shaft member 22 is inserted into the hollow portion of the first shaft member 20. One end of the second shaft member 22 has a small-diameter portion with a smaller diameter than the other portions, and a cylindrical mover yoke made of a magnetic material is provided around this small-diameter portion. A hollow, cylindrical magnet body made of multiple uniformly sized permanent magnets is provided around the outer periphery of the mover yoke. In this case, the mover yoke and the magnet body form a hollow, cylindrical magnet unit. In this embodiment, the armature unit and the magnet unit form a shaft motor, which is a type of electromagnetic linear motor. In this shaft motor configured in this manner, a sinusoidal drive current with a predetermined period and a predetermined amplitude is supplied to each coil of the armature unit, which serves as the stator. This Lorentz force (drive force) is generated by electromagnetic interaction, a type of electromagnetic interaction, between the magnet unit and the armature unit, and the second shaft member 22 is driven axially relative to the first shaft member 20.

[0026] That is, in this embodiment, the above-mentioned air cylinder and shaft motor are used to relatively drive the first shaft member 20 and the second shaft member 22 in the axial direction, thereby configuring the aforementioned extension / retraction mechanisms 161 to 166 (see Figure 14) to extend and retract each of the rods 141 to 146.

[0027] Furthermore, the magnet unit, which is the mover of the shaft motor, is supported in a non-contact manner relative to the armature unit, which is the stator, via air pads provided on the inner peripheral surface of the first shaft member 20.

[0028] 3, absolute linear encoders 241-246 are provided on the rods 141-146, respectively, to detect the axial position of the second shaft member 22 relative to the first shaft member 20, and the outputs of the linear encoders 241-246 are supplied to the control device 600 (see FIG. 14). The axial position of the second shaft member 22 detected by the linear encoders 241-246 corresponds to the length of each of the rods 141-146.

[0029] The telescopic mechanisms 161-166 are controlled by a control device 600 based on the outputs of the linear encoders 241-246 (see FIG. 14). Details of the configuration of a parallel link mechanism similar to the first stage system 200A of this embodiment are disclosed in, for example, U.S. Patent No. 6,940,582, and the control device 600 controls the position and orientation of the table 12 via the telescopic mechanisms 161-166 using inverse kinematics calculations in a manner similar to that disclosed in the above U.S. patent.

[0030] In the first stage system 200A, the extension mechanisms 161-166 provided on the rods 141-146 respectively have air cylinders and shaft motors, which are a type of electromagnetic linear motor, arranged in series (or parallel) with each other, so that the control device 600 can move the table 12 roughly over a large distance by controlling the air pressure of the air cylinders, and can also move it finely and slightly by using the shaft motors. As a result, it becomes possible to accurately control the position of the table 12 in six degrees of freedom (i.e., its position and orientation) in a short time.

[0031] Furthermore, each of the rods 141 to 146 has an air pad that supports the magnet unit, which is the movable part of the shaft motor, without contacting the armature unit, which is the stator, so that friction, which becomes a nonlinear component when controlling the extension and contraction of the rod by the extension and contraction mechanism, can be avoided, thereby enabling the position and posture of the table 12 to be controlled with even greater precision.

[0032] In addition, in this embodiment, shaft motors are used as the electromagnetic linear motors that make up the extension mechanisms 161 to 166, and these shaft motors use magnet units with cylindrical magnets on the mover side, so magnetic flux (magnetic field) is generated in all directions in the radial direction of the magnet, and this omnidirectional magnetic flux can be made to contribute to the generation of Lorentz force (driving force) through electromagnetic interaction, so that a significantly larger thrust can be generated compared to, for example, a normal linear motor, and it is easier to make it smaller than a hydraulic cylinder, etc.

[0033] Therefore, according to the first stage system 200A in which each rod includes a shaft motor, it is possible to simultaneously achieve a small size and light weight and an improved output, and this can be suitably applied to the processing device 100.

[0034] Furthermore, the control device 600 can suppress low-frequency vibrations by controlling the air pressure of the air cylinders that make up each of the extension and contraction mechanisms, and can isolate high-frequency vibrations by controlling the current to the shaft motor.

[0035] The first stage system 200A further includes a planar motor 26 (see FIG. 14). The slider 10 has a mover of the planar motor 26, which is comprised of a magnet unit (or coil unit), mounted on the bottom surface of the slider 10. The base BS houses a corresponding stator of the planar motor 26, which is comprised of a coil unit (or magnet unit). The slider 10 is supported by a plurality of air bearings (hydrostatic air bearings) surrounding the mover on the bottom surface of the slider 10, with a predetermined clearance (gap or space) above the top surface (guide surface) of the base BS, which is finished to a high degree of flatness. The electromagnetic force (Lorentz force) generated by electromagnetic interaction between the stator and mover of the planar motor 26 drives the slider 10 within the XY plane without contacting the top surface of the base BS. In this embodiment, as shown in FIG. 1 , the first stage system 200A can freely move the table 12 between the positions where the measurement system 400, the beam irradiation system 500, and the transport system 300 are arranged. The first stage system 200A may also include multiple tables 12, each of which carries a workpiece W. For example, while processing a workpiece held on one of the multiple tables using the beam irradiation system 500, measurement of a workpiece held on another table using the measurement system 400 may be performed. Even in such a case, each table can freely move between the positions where the measurement system 400, the beam irradiation system 500, and the transport system 300 are arranged. Alternatively, if a configuration is adopted in which a table that holds a workpiece exclusively when measuring using the measurement system 400 and a table that holds a workpiece exclusively when processing using the beam irradiation system 500 are provided and a workpiece can be loaded and unloaded onto and from these two tables using a work transport system or the like, each slider 10 may be fixed to the base BS. Even when a plurality of tables 12 are provided, each table 12 is movable in six degrees of freedom, and the position of each table 12 can be controlled in six degrees of freedom.

[0036] Planar motor 26 is not limited to an air levitation type, and a magnetic levitation type planar motor may also be used. In the latter case, there is no need to provide an air bearing on slider 10. Planar motor 26 may be either a moving magnet type or a moving coil type.

[0037] The control device 600 controls at least one of the magnitude and direction of the current supplied to each coil of the coil unit that constitutes the planar motor 26, thereby allowing the slider 10 to move freely in two dimensions, X and Y, on the base BS.

[0038] In this embodiment, the first stage system 200A is equipped with a position measurement system 28 (see FIG. 14) that measures position information of the slider 10 in the X-axis and Y-axis directions. A two-dimensional absolute encoder can be used as the position measurement system 28. Specifically, a two-dimensional scale having a strip-shaped absolute code of a predetermined width extending over the entire length in the X-axis direction is provided on the upper surface of the base BS. Corresponding to this, an X head and a Y head are provided on the bottom surface of the slider 10. Each head is composed of a light source such as a light-emitting element and a one-dimensional light-receiving element array arranged in the X-axis direction and a one-dimensional light-receiving element array arranged in the Y-axis direction, respectively, that receive light reflected from the two-dimensional scale illuminated by the light beam emitted from the light source. The two-dimensional scale may be, for example, a non-reflective base material (reflectance 0%) on which a plurality of square reflective portions (marks) are two-dimensionally arranged at a regular interval along two mutually perpendicular directions (X-axis and Y-axis directions), and the reflective characteristics (reflectance) of the reflective portions have gradations according to a predetermined rule. The two-dimensional absolute encoder may have a configuration similar to that of the two-dimensional absolute encoder disclosed in, for example, U.S. Patent Application Publication No. 2014 / 0070073. An absolute two-dimensional encoder with a configuration similar to that of U.S. Patent Application Publication No. 2014 / 0070073 can measure two-dimensional position information with high accuracy equivalent to that of a conventional incremental encoder. Because it is an absolute encoder, it does not require origin detection, unlike an incremental encoder. Measurement information from the position measurement system 28 is sent to the control device 600.

[0039] In this embodiment, as will be described later, the measurement system 400 measures position information (shape information in this embodiment) of at least a portion of a target surface (e.g., the upper surface) on the workpiece W mounted on the table 12 in three-dimensional space, and machining of the workpiece W is performed after the measurement. Here, the target surface means a surface on which a target portion to be machined is provided. Therefore, when measuring shape information of at least a portion of the target surface on the workpiece W, the control device 600 associates the measurement results with the measurement results of the linear encoders 241-246 mounted on the rods 141-146 and the measurement results of the position measurement system 28 at the time of the measurement, thereby relating the position and orientation of the target portion provided on the target surface on the workpiece W mounted on the table 12 to the reference coordinate system (hereinafter referred to as the table coordinate system) of the machining apparatus 100. As a result, thereafter, open-loop control of the position of the table 12 in six degrees of freedom based on the measurement results of the linear encoders 241-246 and the position measurement system 28 enables position control of the target portion (target surface) on the workpiece W in six degrees of freedom relative to a target value. In this embodiment, absolute encoders are used as the linear encoders 241-246 and the position measurement system 28, which makes it easy to reset them since there is no need to find the origin. Note that the position information in the three-dimensional space to be measured by the measurement system 400, which is used to enable position control in six degrees of freedom relative to target values of the target portion of the workpiece W by open-loop control of the position of the table 12 in six degrees of freedom, is not limited to shape, and three-dimensional position information of at least three points according to the shape of the target surface is sufficient.

[0040] In this embodiment, the planar motor 26 is used as a drive device for moving the slider 10 within the XY plane, but a linear motor may be used instead of the planar motor 26. In this case, instead of the two-dimensional absolute encoder described above, a position measurement system for measuring the position information of the slider 10 may be configured using an absolute linear encoder. Furthermore, the position measurement system for measuring the position information of the slider 10 is not limited to an encoder, and may be configured using an interferometer system.

[0041] In addition, in this embodiment, the mechanism for moving the table is illustrated as being configured using a planar motor that moves a slider in the XY plane and a Stewart platform-type six-degree-of-freedom parallel link mechanism in which the slider forms a base platform. However, this is not limiting, and the mechanism for moving the table may be configured using other types of parallel link mechanisms or mechanisms other than parallel link mechanisms. For example, a slider that moves in the XY plane and a Z-tilt drive mechanism that moves the table 12 on the slider in the Z-axis direction and in an inclined direction relative to the XY plane may be employed. One example of such a Z-tilt drive mechanism is a mechanism that supports the table 12 from below at each vertex of a triangle via, for example, universal joints or other joints, and has three actuators (such as voice coil motors) that can drive each support point independently in the Z-axis direction. However, the configuration of the mechanism for moving the table of the first stage system 200A is not limited to these. Any configuration is sufficient as long as it can drive the table (movable member) on which the workpiece is placed in at least five degrees of freedom: three degrees of freedom in the XY plane, the Z-axis direction, and the tilt direction relative to the XY plane. It does not have to include a slider that moves within the XY plane. For example, the first stage system may be composed of a table and a robot that moves this table. In either configuration, resetting can be made easier by configuring the measurement system that measures the table position using a combination of an absolute linear encoder, or a combination of the linear encoder and an absolute rotary encoder.

[0042] Alternatively, instead of first stage system 200A, a system capable of driving table 12 in at least five degrees of freedom, i.e., three degrees of freedom in the XY plane, the Z-axis direction, and an inclination direction (θx or θy) relative to the XY plane, may be employed. In this case, table 12 itself may be supported (non-contact supported) by air levitation or magnetic levitation via a predetermined clearance (gap or space) on the upper surface of a support member such as base BS. When such a configuration is employed, the table moves without contact with the member supporting it, which is extremely advantageous in terms of positioning accuracy and greatly contributes to improving machining accuracy.

[0043] The measurement system 400 measures the three-dimensional position information of the workpiece, for example, the shape, to associate the position and orientation of the workpiece placed on the table 12 with a table coordinate system. As shown in Fig. 2, the measurement system 400 includes a laser non-contact three-dimensional measuring device 401. The three-dimensional measuring device 401 includes a frame 30 installed on a base BS, a head unit 32 attached to the frame 30, a Z-axis guide 34 attached to the head unit 32, a rotation mechanism 36 provided at the lower end of the Z-axis guide 34, and a sensor unit 38 connected to the lower end of the rotation mechanism 36.

[0044] The frame 30 is made up of a horizontal member 40 extending in the Y-axis direction and a pair of pillar members 42 that support the horizontal member 40 from below at both ends in the Y-axis direction.

[0045] The head portion 32 is attached to a horizontal member 40 of the frame 30 .

[0046] Z-axis guide 34 is attached to head unit 32 so as to be movable in the Z-axis direction, and is driven in the Z-axis direction by Z drive mechanism 44 (not shown in FIG. 2, see FIG. 14). The position of Z-axis guide 34 in the Z-axis direction (or its displacement from a reference position) is measured by Z encoder 46 (not shown in FIG. 2, see FIG. 14).

[0047] The rotation mechanism 36 can rotate the sensor unit 38 continuously (or in predetermined angular steps) around a rotation center axis parallel to the Z axis within a predetermined angular range (for example, a range of 90 degrees (π / 2) or 180 degrees (π)) relative to the head unit 32 (Z-axis guide 34). In this embodiment, the rotation center axis of the sensor unit 38 rotated by the rotation mechanism 36 coincides with the central axis of a line of light emitted from an irradiation unit (described later) that constitutes the sensor unit 38. The rotation angle of the sensor unit 38 rotated by the rotation mechanism 36 from a reference position (or the position of the sensor unit 38 in the θz direction) is measured by a rotation angle sensor 48 (not shown in FIG. 2, see FIG. 14) such as a rotary encoder.

[0048] The sensor unit 38 is mainly composed of an irradiation unit 50 that irradiates a line of light for optically cutting an object to be inspected (a workpiece W in FIG. 2) placed on the table 12, and a detection unit 52 that detects the surface of the object to be inspected on which an optical section (line) appears as a result of the irradiation of the line of light. Also connected to the sensor unit 38 is an arithmetic processing unit 610 that determines the shape of the object to be inspected based on image data detected by the detection unit 52. In this embodiment, the arithmetic processing unit 610 is included in a control device 600 that comprehensively controls each component of the processing apparatus 100 (see FIGS. 1 and 14).

[0049] The irradiation unit 50 is composed of a cylindrical lens (not shown) and a slit plate with a thin strip-shaped notch, etc., and generates a fan-shaped line of light 50a upon receiving illumination light from a light source. The light source can be an LED, a laser light source, or an SLD (super luminescent diode). Using an LED allows for inexpensive construction of the light source. Furthermore, using a laser light source allows for the generation of line light with minimal aberration due to its point light source, excellent wavelength stability, a small half-width, and the use of a filter with a small half-width to cut stray light, thereby reducing the influence of external disturbances. Furthermore, using an SLD, in addition to the characteristics of a laser light source, has lower coherence than laser light, thereby suppressing the generation of speckles on the surface of the test object. The detection unit 52 captures the line of light 50a projected onto the surface of the test object (workpiece W) from a direction different from the light irradiation direction of the irradiation unit 50. The detection unit 52 is also composed of an imaging lens, a CCD, etc. (not shown), and captures an image of the test object (workpiece W) each time the table 12 is moved and the line of light 50a is scanned at a predetermined interval, as described below. The positions of the irradiation unit 50 and the detection unit 52 are determined so that the incident direction of the line light 50a on the surface of the test object (workpiece W) to the detection unit 52 and the light irradiation direction of the irradiation unit 50 form a predetermined angle θ. In this embodiment, the predetermined angle θ is set to, for example, 45 degrees.

[0050] The image data of the test object (workpiece W) captured by the detection unit 52 is sent to the calculation processing unit 610, where predetermined image calculation processing is performed to calculate the height of the surface of the test object (workpiece W) and determine the three-dimensional shape (surface shape) of the test object (workpiece W). The calculation processing unit 610 calculates the height of the surface of the test object (workpiece W) from a reference plane using the principle of triangulation for each pixel in the longitudinal direction along which the light section (line) (line light 50a) extends, based on position information of the light section (line) formed by the line light 50a in the image of the test object (workpiece W) that has been deformed in accordance with the unevenness of the test object (workpiece W), and performs calculation processing to determine the three-dimensional shape of the test object (workpiece W).

[0051] In this embodiment, the control device 600 moves the table 12 in a direction approximately perpendicular to the longitudinal direction of the line of light 50a projected onto the test object (workpiece W), thereby causing the line of light 50a to scan the surface of the test object (workpiece W). The control device 600 detects the rotation angle of the sensor unit 38 using the rotation angle sensor 48, and moves the table 12 in a direction approximately perpendicular to the longitudinal direction of the line of light 50a based on the detection result. As described above, in this embodiment, the table 12 is moved when measuring the shape, etc., of the test object (workpiece W). Therefore, as a prerequisite, when the table 12 holds the workpiece W and moves below the sensor unit 38 of the measurement system 400, the position and orientation (position in the six degrees of freedom directions) of the table 12 are always set to a predetermined reference state. The reference state is, for example, a state in which all of the rods 141 to 146 have a length (or a minimum length) corresponding to the neutral point of the extension / contraction stroke range, and at this time, the position of the table 12 in each direction of the Z axis, θx, θy, and θz is (Z, θx, θy, θz) = (Z0, 0, 0, 0). Also, in this reference state, the position (X, Y) of the table 12 in the XY plane coincides with the X, Y positions of the slider 10 measured by the position measurement system 28.

[0052] Thereafter, the above-described measurement of the test object (workpiece W) is started, and the position of table 12 in the six degrees of freedom directions, including during this measurement, is managed on the table coordinate system by control device 600. That is, control device 600 controls planar motor 26 based on measurement information from position measurement system 28, and also controls extension / retraction mechanisms 161-166 based on measurement values from linear encoders 241-246, thereby controlling the position of table 12 in the six degrees of freedom directions.

[0053] Incidentally, when using the light-section method as in the three-dimensional measuring device 401 according to this embodiment, it is desirable to arrange the line light 50a irradiated from the irradiation unit 50 of the sensor unit 38 onto the test object (workpiece W) in a direction perpendicular to the relative movement direction between the sensor unit 38 and the table 12 (test object (workpiece W)). For example, in FIG. 2, if the relative movement direction between the sensor unit 38 and the test object (workpiece W) is set to the Y-axis direction, it is desirable to arrange the line light 50a along the X-axis direction. This is because, during measurement, relative movement with respect to the test object (workpiece W) can be performed effectively using the entire area of the line light 50a, thereby enabling optimal measurement of the shape of the test object (workpiece W). A rotation mechanism 36 is provided so that the direction of the line light 50a and the above-mentioned relative movement direction can always be perpendicular to each other.

[0054] The above-described three-dimensional measuring machine 401 has a similar configuration to the shape measuring machine disclosed in, for example, U.S. Patent Application Publication No. 2012 / 0105867. However, the difference is that scanning of the line light on the test object in a direction parallel to the X-Y plane is performed by moving the sensor unit in the device described in U.S. Patent Application Publication No. 2012 / 0105867, whereas in this embodiment, scanning is performed by moving the table 12. Note that in this embodiment, either the Z-axis guide 34 or the table 12 may be driven when scanning the line light on the test object in a direction parallel to the Z axis.

[0055] In the measurement method using the three-dimensional measuring device 401 according to this embodiment, a light-section method is used to project a line-shaped projection pattern consisting of a single line of light onto the surface of the test object, and each time the line-shaped projection pattern is scanned across the entire surface of the test object, an image of the line-shaped projection pattern projected onto the test object is captured from an angle different from the projection direction. Then, from the captured image of the test object surface, the height of the test object surface from a reference plane is calculated for each pixel in the longitudinal direction of the line-shaped projection pattern using the principle of triangulation or the like, and the three-dimensional shape of the test object surface is determined.

[0056] Alternatively, a device having a configuration similar to that of the optical probe disclosed in U.S. Patent No. 7,009,717 can be used as the three-dimensional measuring device constituting the measurement system 400. This optical probe is composed of two or more optical groups and includes two or more viewing directions and two or more projection directions. One optical group includes one or more viewing directions and one or more projection directions, at least one viewing direction and at least one projection direction differs between the optical groups, and data obtained from a viewing direction is generated only from patterns projected in the projection direction of the same optical group.

[0057] The measurement system 400 may include a mark detection system 56 (see FIG. 14) that optically detects alignment marks instead of or in addition to the above-described three-dimensional measuring device 401. The mark detection system 56 can detect alignment marks formed on a workpiece, for example. The control device 600 calculates the position and orientation of the workpiece (or table 12) by accurately detecting the center positions (three-dimensional coordinates) of at least three alignment marks using the mark detection system 56. The mark detection system 56 can include, for example, a stereo camera.

[0058] In this embodiment, the control device 600 uses the three-dimensional measuring device 401 to scan the surface (target surface) of the workpiece W as described above and acquires surface shape data. The control device 600 then performs least squares processing using the surface shape data to associate the three-dimensional position and orientation of the target surface on the workpiece with the table coordinate system. Here, the position of the table 12 in six degrees of freedom, including during the above-described measurement of the test object (workpiece W), is managed on the table coordinate system by the control device 600. Therefore, after the three-dimensional position and orientation of the workpiece are associated with the table coordinate system, all control of the position of the workpiece W in six degrees of freedom (i.e., position and orientation), including during machining, can be performed by open-loop control of the table 12 in accordance with the table coordinate system.

[0059] FIG. 4 shows the beam irradiation system 500 together with a mask stage 15 as a holding member for holding the mask M, and a table 12 on which the workpiece W is placed.

[0060] A mask M serving as an aperture member having a plurality of apertures (aperture patterns) is held on a mask stage 15 constituting a part of the second stage system 200B. A mask having through-holes may be used as the apertures, or a mask may be formed by evaporating a light-shielding material such as chromium onto the upper or lower surface of a beam-transmitting substrate (e.g., synthetic quartz) so that the apertures are formed. In this embodiment, the mask M is permanently mounted on the mask stage 15. However, a configuration in which the mask on the mask stage 15 is replaceable may also be adopted. The second stage system 200B can change the position of the mask M relative to the condensing optical system 530 by moving the mask stage 15, as described below. Specifically, the mask stage 15 on which the mask M is permanently mounted is moved in four degrees of freedom (X-axis, Y-axis, Z-axis, and θz directions) by a mask stage drive system 17 (not shown in FIG. 4 , see FIG. 14 ), thereby changing the position of the mask M in the four degrees of freedom. Position information of the mask stage 15 in the X-axis, Y-axis, θz, and Z-axis directions is measured with a resolution of, for example, about 0.25 to 1 nm by a mask stage position measurement system 19 (not shown in FIG. 4, see FIG. 14) consisting of, for example, an interferometer system. The mask stage position measurement system 19 may also be composed of an encoder system or other sensors.

[0061] The mask stage drive system 17 is configured, for example, by a magnetic levitation type planar motor. Instead of a planar motor, the mask stage drive system may also be configured, for example, by a linear motor system configured to drive the mask stage 15 in the Z-axis direction in addition to the X-axis and Y-axis directions. While the mask stage drive system 17 is capable of moving the mask stage 15 in four degrees of freedom, it may also be configured to move the mask stage 15 in six degrees of freedom, or it may be configured so that the mask stage 15 is movable only in the X-axis direction or the Y-axis direction, as long as the aperture can be changed.

[0062] In this embodiment, a film-like or plate-like mask is used as the mask M. A stencil mask may also be used as the mask M. The mask M may be made of a low-thermal expansion material. The mask stage 15 has a through-hole 15a in the vertical direction (Z-axis direction) formed therein, which serves as a beam passage, as shown in the cross-sectional view of FIG. 4 , and the mask M is disposed above the through-hole 15a. FIG. 5 shows a plan view of the mask M. As shown in FIG. 5 , the mask M has multiple types (four types, for example) of slit-shaped openings, each extending in the X-axis direction and having the same line width (e.g., 10 μm) but different lengths in the X-axis direction, multiple types (four types, for example) of slit-shaped openings, each extending in the Y-axis direction and having the same line width (e.g., 10 μm) but different lengths in the Y-axis direction, multiple types (four types, for example) of circular openings (pinhole-shaped openings) with different diameters, and multiple types (four types, for example) of square openings with different side lengths. As an example, each of the apertures PAa and PAb shown in FIG. 5 is a slit-shaped aperture with a line width of 10 μm and a length of 10 mm. Furthermore, as an example, the aperture PAc is a pinhole-shaped aperture with a diameter of 10 μm. It goes without saying that the shape of the apertures is not limited to slit, circle, or square, and may be other shapes such as rectangle or polygon, and it is not necessary to have at least one of a slit-shaped aperture, a circular aperture, and a square aperture. Furthermore, the number (type) of apertures of each shape is not limited to four, and for example, there may be one circular aperture and three square apertures.

[0063] As shown in Figure 4, the beam irradiation system 500 includes a light source system 510, an illumination optical system 520 that irradiates the beam emitted from the light source system onto the mask M, and a focusing optical system 530 that focuses the beam that has passed through the mask M onto the target surface of the workpiece W.

[0064] As shown in Figure 6, the light source system 510 includes a light source unit 60, a light guide fiber 62 connected to the light source unit 60, a double fly's eye optical system 64 arranged on the exit side of the light guide fiber 62, and a condenser lens system 66.

[0065] The light source unit 60 includes a housing 68 and a plurality of laser units 70 housed inside the housing 68 and arranged parallel to one another in a matrix. The laser units 70 may be any of a variety of lasers that perform pulsed or continuous wave oscillation, such as a carbon dioxide laser, an Nd:YAG laser, a fiber laser, or a GaN-based semiconductor laser. The laser used as the laser units 70 may be a nanosecond laser, a picosecond laser, or a femtosecond laser.

[0066] The light guide fiber 62 is a fiber bundle formed by randomly bundling a large number of optical fiber strands, and has a plurality of input ports 62a individually connected to the output ends of the plurality of laser units 70, and an output portion 62b having a number of output ports greater than the number of input ports 62a. The light guide fiber 62 receives a plurality of laser beams (hereinafter abbreviated as "beams" as appropriate) emitted from the plurality of laser units 70 via each input port 62a, distributes the beams to a plurality of output ports, and emits at least a portion of each laser beam from a common output port. In this way, the light guide fiber 62 mixes and emits the beams emitted from the plurality of laser units 70. This allows the total output to be increased in proportion to the number of laser units 70, compared to when a single laser unit is used. However, if sufficient output can be obtained with a single laser unit, multiple laser units may not be used.

[0067] Here, the exit portion 62b has a cross-sectional shape similar to the overall shape of the entrance end of a first fly-eye lens system that constitutes the entrance end of a double fly-eye optical system 64, which will be described next, and exit ports are provided at approximately equal intervals within the cross section. Therefore, the light guide fiber 62 also serves as a shaping optical system that shapes the beam mixed as described above so that it becomes similar to the overall shape of the entrance end of the first fly-eye lens system.

[0068] The double fly's eye optical system 64 is intended to uniformize the cross-sectional intensity distribution of the beam (illumination light), and is composed of a first fly's eye lens system 72, a lens system 74, and a second fly's eye lens system 76, which are arranged in this order on the beam path (optical path) of the laser beam behind the light guide fiber 62. An aperture is provided around the second fly's eye lens system 76.

[0069] In this case, the entrance surface of the first fly-eye lens system 72 and the entrance surface of the second fly-eye lens system 76 are set optically conjugate to each other. Also, the exit-side focal plane of the first fly-eye lens system 72 (where a surface light source, described later, is formed), the exit-side focal plane of the second fly-eye lens system 76 (where a surface light source, described later, is formed), and the pupil plane (entrance pupil) PP2 of the focusing optical system 530 are set optically conjugate to each other.

[0070] The beam mixed by the light guide fiber 62 enters the first fly-eye lens system 72 of the double fly-eye optical system 64. As a result, a surface light source, i.e., a secondary light source consisting of a large number of light source images (point light sources), is formed on the exit-side focal plane of the first fly-eye lens system 72. Laser light from each of these large number of point light sources enters the second fly-eye lens system 76 via the lens system 74. As a result, a surface light source (tertiary light source) in which a large number of tiny light source images are uniformly distributed within an area of a predetermined shape is formed on the exit-side focal plane of the second fly-eye lens system 76. Note that the exit-side focal plane of the first fly-eye lens system 72 may be a plane away from the exit surface of the first fly-eye lens system 72 toward the beam exit side in order to reduce the possibility of the first fly-eye lens system 72 being damaged by the beam. In this case, the secondary light source formed by the first fly-eye lens system 72 is formed at a position away from the exit surface of the first fly-eye lens system 72. Similarly, the exit-side focal plane of the second fly-eye lens system 76 may be a plane away from the exit surface of the second fly-eye lens system 76 toward the beam exit side. In this case, the tertiary light source formed by the second fly-eye lens system 76 is formed at a position away from the exit surface of the second fly-eye lens system 76.

[0071] The condenser lens system 66 has a front focal point positioned on or near the exit surface of the second fly-eye lens system 76, and outputs the laser light emitted from the tertiary light source as a beam with a uniform illuminance distribution.

[0072] By optimizing the area of the entrance end of the second fly-eye lens system 76, the focal length of the condenser lens system 66, and the like, the beam emerging from the condenser lens system 66 can be regarded as a parallel beam.

[0073] The light source system 510 of this embodiment includes an illuminance homogenizing optical system that includes a light guide fiber 62, a double fly's eye optical system 64, and a condenser lens system 66. Using this illuminance homogenizing optical system, beams emitted from a plurality of laser units 70 are mixed to generate a parallel beam with a homogenized cross-sectional illuminance distribution. Note that homogenizing the cross-sectional illuminance distribution may also include making the illuminance distribution in the beam cross section of the beam emitted from the illuminance homogenizing optical system closer to uniformity than the illuminance distribution in the beam cross section of the beam incident on the illuminance homogenizing optical system.

[0074] The illuminance uniforming optical system is not limited to the above-mentioned configuration, and may be configured using a rod integrator, a collimator lens system, or the like.

[0075] The light source unit 60 of the light source system 510 is connected to a control device 600 (see FIG. 14), and the control device 600 individually controls the on / off of the multiple laser units 70 that make up the light source unit 60. This adjusts the light intensity (laser output) of the laser beam irradiated onto the workpiece W (target surface thereon) from the focusing optical system 530 via the illumination optical system 520 (and mask M).

[0076] As shown in Figure 4, the illumination optical system 520 has an optical device 78, a first partial illumination optical system 79, a mirror array 80, and a second partial illumination optical system 82 arranged sequentially on the optical path of the parallel beam from the light source system 510 (condenser lens system 66).

[0077] The optical device 78 can change the cross-sectional intensity distribution of the collimated beam from the light source system 510 (condenser lens system 66). In this embodiment, the optical device 78 is configured by a mirror array, which is a type of spatial light modulator (SLM). Herein, a spatial light modulator is a general term for an element that spatially modulates the amplitude (intensity), phase, or polarization state of light traveling in a predetermined direction. Hereinafter, the optical device 78 will also be referred to as a second mirror array 78. The second mirror array 78 can change the cross-sectional intensity distribution (and illumination shape) of the collimated beam from the light source system 510 at the pupil plane PP1 of the illumination optical system 520. Note that, hereinafter, the above-mentioned mirror array 80 will be referred to as a first mirror array 80 (or may be referred to as an optical device 80) to distinguish it from the second mirror array 78.

[0078] As shown in FIG. 7, the second mirror array 78 includes a base member 78A having a surface (hereinafter referred to as a reference surface for convenience) that forms an angle of 45 degrees (π / 4) with respect to the XY plane and the XZ plane, and, for example, K (=I×J) mirror elements 81 arranged in a matrix of I rows and J columns on the reference surface of the base member 78A. i,j (i=1 to I, j=1 to J) and each mirror element 81 i,j and a drive unit 78B (not shown in FIG. 7, see FIG. 14) including K actuators (not shown) that individually move the

[0079] Each mirror element 81 of the second mirror array 78 i,j is, for example, each mirror element 81 i,j The angle of the reflecting surface of each mirror element can be set to any angle within a predetermined angle range with respect to the reference plane. The angle of the reflecting surface of each mirror element is detected by a sensor, such as a rotary encoder 83, which detects the rotation angle of the rotation axis. i,j (not shown in FIG. 7, see FIG. 14).

[0080] The driving unit 78B includes, for example, an electromagnet or a voice coil motor as an actuator, and drives each mirror element 81 i,jis driven by an actuator and operates with extremely high response.

[0081] A plurality of mirror elements 81 constituting the second mirror array 78 i,j Each of the first and second partial illumination optical systems 79 is illuminated by a parallel beam from the light source system 510, and emits a plurality of reflected beams (parallel beams) LB in a direction according to the inclination angle of its reflecting surface, which are incident on a first partial illumination optical system 79 (see FIG. 7). The first partial illumination optical system 79 includes a plurality of lenses including a relay lens, and for example, the pupil plane PP1 of the illumination optical system 520 is disposed inside the first partial illumination optical system 79. The first partial illumination optical system 79 has a partial optical system 791 between the second mirror array 78 and the pupil plane PP1. The partial optical system 791 is disposed so that its front focal position is located on or near the plane on which the second mirror array 78 is disposed, and its rear focal position is located on or near the pupil plane PP1, and distributes the plurality of reflected beams LB on the pupil plane PP1 according to the traveling direction of the plurality of reflected beams LB from the second mirror array 78. That is, the second mirror array 78 includes a plurality of mirror elements 81. i,j By adjusting the inclination angle of each of the reflecting surfaces of the mirror elements 81, the cross-sectional intensity distribution of the beam at the pupil plane PP1 can be set or changed. i,j The cross-sectional shape of the beam at pupil plane PP1 (which may also be called illumination shape) can be set or changed by adjusting the inclination angle of each reflecting surface. Here, pupil plane PP1 is a conjugate plane of pupil plane (entrance pupil plane) PP2 of focusing optical system 530.

[0082] The partial optical system 791 can also be considered as an optical system that converts the angle of the incident beam into a position on the exit side. The optical device 78 is not limited to a spatial light modulator such as a mirror array. For example, it can be configured with an illumination system aperture stop plate in which multiple types of aperture stops are formed on a rotatable disk member and the multiple types of aperture stops can be interchangeably positioned on the optical path of the beam. This illumination system aperture stop plate may be positioned on or near a pupil plane PP1 in the first partial illumination optical system 79, or on or near a pupil plane PP2 of the focusing optical system 530. In this case, the optical device 78 does not need to be provided. The second mirror array 78 is positioned on or near a plane conjugate with the image plane (processing plane MP) of the focusing optical system 530, and can prevent part of the parallel beam from the light source system 510 (for example, parallel beams from some mirror elements (also referred to as mirrors as appropriate)) from entering the illumination optical system 520. This makes it possible to adjust the intensity or intensity distribution of the processing beam on the image plane (processing plane MP) of the focusing optical system 530. For example, on the image plane (processing plane MP) of the focusing optical system 530, the intensity distribution within the irradiation region of the processing beam from the focusing optical system 530 can be adjusted.

[0083] In this embodiment, the collimated beam that has passed through the optical device (a second mirror array, as an example) 78 is irradiated onto the mask M via a first partial illumination optical system 79, a first mirror array 80, and a second partial illumination optical system 82, as will be described later, and is incident on the condensing optical system 530 through an opening in the mask M. By changing the cross-sectional intensity distribution of the collimated beam from the light source system 510 using the optical device (a second mirror array, as an example) 78, it is possible to change the intensity distribution of the beam at the pupil plane PP1 of the illumination optical system 520 and the pupil plane (entrance pupil) PP2 of the condensing optical system 530, i.e., the cross-sectional shape of the beam.

[0084] Furthermore, since the optical device 78 is disposed at a position conjugate with or near the image plane (machining plane MP) of the focusing optical system 530, it is possible to substantially change the intensity distribution of the beam emitted from the focusing optical system 530 on the image plane of the focusing optical system 530 by using the optical device 78 to convert the cross-sectional intensity distribution of the collimated beam from the light source system 510. For example, by setting the tilt angles of some mirrors of the second mirror array 78 so that the beam reflected by those mirrors does not enter the illumination optical system 520, it is possible to change the intensity distribution within the beam irradiation area on the image plane (machining plane MP). Furthermore, since the optical device 78 is disposed at a position conjugate with or near the plane on which the aperture of the mask M is located, it is possible to substantially change or adjust the intensity distribution of the beam on the mask M by using the optical device 78 to convert the cross-sectional intensity distribution of the collimated beam from the light source system 510. For example, it is possible to impart a non-uniform intensity distribution to the beam incident on the aperture of the mask M.

[0085] Each mirror element 81 of the second mirror array 78 is incident on the pupil plane PP1 of the illumination optical system 520. i,j A plurality of reflected beams (parallel beams) LB emitted from the pupil plane PP1 in directions according to the inclination angle of the reflecting surface are incident, and the cross-sectional intensity distribution (i.e., cross-sectional shape, illumination shape) of the reflected beams LB on the pupil plane PP1 is determined by the cross-sectional shape of each mirror element 81 of the second mirror array 78. i,j The first partial illumination optical system 79 irradiates a beam having the set cross-sectional intensity distribution onto a first mirror array 80 that is disposed at a position conjugate with or near a pupil plane PP1 of the illumination optical system 520.

[0086] As shown in FIG. 8, the first mirror array 80 includes a base member 80A having a surface (hereinafter referred to as a reference surface for convenience) that forms an angle of 45 degrees (π / 4) with respect to the XY plane and the XZ plane, and, for example, M (=P×Q) mirror elements 81 arranged in a matrix of, for example, P rows and Q columns on the reference surface of the base member 80A. p,q (p=1 to P, q=1 to Q) and each mirror element 81 p,qand a drive unit 80B (not shown in FIG. 4, see FIG. 14) including M actuators (not shown) that individually move the mirrors, and is configured similarly to the second mirror array 78, although its orientation is reversed left to right.

[0087] Among the plurality of mirror elements constituting the first mirror array 80, the mirror element 81 illuminated by the parallel beam from the first partial illumination optical system 79 p,q Each of the first mirror array 80 and the second partial illumination optical system 82 emits a plurality of reflected beams (parallel beams) LB in a direction corresponding to the inclination angle of its reflecting surface, and the reflected beams are incident on the second partial illumination optical system 82. The beams emitted from the second partial illumination optical system 82 can be focused on the mask M in any size and any shape (for example, a spot or a slit). The front focal position of the second partial illumination optical system 82 is located at or near the position of the first mirror array 80, and the rear focal position is located at or near the position of the mask M (for example, on the surface on which the apertures of the mask M are arranged). Therefore, in this embodiment, by adjusting the position of the mask M in the XY plane, it is possible to irradiate the beam only on a partial area on the mask M, including any one aperture. Therefore, in this embodiment, the beam from the illumination optical system 520 can be efficiently incident on the focusing optical system 530 via the mask M. Note that if the beam is irradiated on the aperture of the mask M, the first mirror array 80 need not be provided.

[0088] In this embodiment, the focusing optical system 530 is an optical system with a high numerical aperture (NA) of, for example, 0.5 or more, preferably 0.6 or more, and low aberration. In this embodiment, a reduction projection lens with an NA of 0.75, a projection magnification of 1 / 10, and a maximum field of 1 mm square is used as the focusing optical system 530.

[0089] In this embodiment, the focusing optical system 530 has a large aperture, low aberration, and a high NA, and is therefore capable of focusing multiple beams that are irradiated onto the mask M from the first mirror array 80 via the second partial illumination optical system 82 and that have passed through one aperture of the mask M, at at least one position or area on the image plane. As will be described in detail later, in this embodiment, the beam irradiation system 500 can focus the beams emitted from the focusing optical system 530 into, for example, a spot shape or a slit shape depending on the shape of the aperture of the mask M. In this embodiment, it can also be said that the focusing optical system 530 can reduce and project the aperture pattern on the mask M onto the image plane, thereby forming a reduced image of the aperture pattern on the image plane. Note that, on the image plane of the focusing optical system 530, the image of the aperture (the beam irradiation area) may be formed on the optical axis of the focusing optical system 530 or at a position offset from the optical axis. In this case, the aperture of the mask M used for processing is placed at a position off the optical axis of the condensing optical system 530 so that the beam from the first mirror array 80 is irradiated onto the aperture.

[0090] In addition, by moving the mask stage 15 and changing the aperture used for processing, the size and shape of the beam irradiation area on the image plane (processing plane MP) of the focusing optical system 530 can be changed, so the mask stage 15 can also be considered as part of a mechanism that changes the intensity distribution of the beam on the image plane (processing plane MP) of the focusing optical system 530.

[0091] Furthermore, since the focusing optical system 530 is composed of one or more lenses (one lens is representatively shown in Figures 4, 8, etc.), the area of the incident light can be increased, and as a result, a larger amount of light energy can be captured compared to when a focusing optical system with a small numerical aperture NA is used. Therefore, the beam focused by the focusing optical system 530 according to this embodiment is extremely sharp and has a high energy density, which directly leads to improved processing accuracy when processing a workpiece.

[0092] In this embodiment, as will be described later, the table 12 is moved in a scanning direction parallel to the XY plane (in FIG. 4, the Y-axis direction is taken as an example), so that the processing target surface (also referred to as the target surface as appropriate) TAS of the workpiece W on which the target portion is provided is made parallel to or perpendicular to the XY plane, and processing (processing treatment) is performed while the beam and the workpiece W are relatively scanned in the scanning direction (scanning direction). Needless to say, during processing, the table 12 may be moved in at least one direction of the X-axis direction, Z-axis direction, θx direction, θy direction, and θz direction while the table 12 is moving in the Y-axis direction.

[0093] In the processing apparatus 100 according to this embodiment, in order to realize high-throughput processing that makes the most of the total laser output (laser power) greatly increased by the above-described method, as described below, an image of a slit-shaped opening on the mask M, for example, the slit-shaped opening PAa or PAb, i.e., the slit-shaped beam irradiation area (see symbol LS in FIG. 9(B)), is formed on the image plane (hereinafter referred to as the processing plane) MP (see, for example, FIGS. 4 and 9(A)) of the focusing optical system 530, and the desired processing (e.g., removal processing) can be performed while scanning the workpiece W relatively in a direction perpendicular to the longitudinal direction of the beam that forms the irradiation area LS. This makes it possible to process, for example, remove, a much larger area (e.g., several to several tens of times larger) in one go compared to scanning the workpiece with a spot-shaped beam.

[0094] 4 and 9 show an example of removal processing of the workpiece W, in which the position of the workpiece W is controlled so that the processing plane MP coincides with the processed surface of the workpiece W (the surface after a portion of the workpiece W has been removed by the beam). In this case, as is clear from FIGS. 4 and 9, the pre-processing surface of the workpiece W (target surface TAS) is shifted by ΔZ in the +Z direction from the image plane (processing plane MP). This ΔZ may be determined based on at least one of the intensity of the beam, the material of the workpiece W, and the relative scanning speed of the beam and the workpiece.

[0095] If possible for the desired removal processing, the processing surface MP does not have to coincide with the processed surface of the workpiece W. For example, the position of the workpiece W may be controlled so that the target surface TAS of the workpiece W and the processing surface MP approximately coincide with each other.

[0096] In the processing apparatus 100 of this embodiment, the three-dimensional intensity distribution of the beam at and near the first surface on the exit surface side of the focusing optical system 530 can be changed by combining the cross-sectional intensity distribution of the collimated beam from the light source system 510 at the pupil plane PP1 of the illumination optical system 520 (cross-sectional intensity distribution at the pupil plane PP2 of the focusing optical system 530), which is set using the second mirror array 78, with the aperture on the mask M. This will be described in detail below. In this embodiment, the first surface on the exit surface side of the focusing optical system 530 is the surface on which the image of the aperture on the mask M is formed. For example, when a portion of the surface of a workpiece is removed and machined with the beam from the focusing optical system 530, this refers to the machined surface MP. In this embodiment, the machined surface MP is the image plane of the focusing optical system 530 (see, for example, FIGS. 4 and 9A), but the machined surface MP may be a surface near the image plane. Furthermore, in this embodiment, the machined surface MP is perpendicular to the optical axis AX on the exit side of the focusing optical system 530, but it does not have to be perpendicular. Furthermore, in this embodiment, the beam LB irradiated onto the machining surface MP can be said to function in the same way as a blade used as a tool when performing cutting processing on the workpiece W, and therefore the tip of the beam is also referred to as a light blade in this specification.

[0097] FIG. 10(A) shows an explanatory diagram of an example of processing modes that can be set in the processing apparatus 100 according to this embodiment. Here, six modes, Mode 1 to Mode 6, will be described. In FIG. 10(A), the "illumination shape" diagram shows imaginary axes that intersect at right angles at the center of the pupil plane (optical axis) with dashed lines. In FIG. 10(A), the "illumination shape" is the cross-sectional intensity distribution (cross-sectional shape) of the beam on the pupil plane PP1 of the illumination optical system 520, but can also be said to be the cross-sectional intensity distribution (cross-sectional shape) of the beam on the pupil plane PP2 of the focusing optical system 530.

[0098] Furthermore, in Fig. 10(A), the "front view" and "side view" of the tip of the beam (optical blade) show the shape of the tip of the beam (optical blade) between the image plane (machining plane MP) and a virtual plane perpendicular to the optical axis between the focusing optical system 530 and the image plane (machining plane MP). Note that even when a laser beam in an invisible wavelength band is used, it can be explained using Fig. 10(A) on the assumption that it is visible.

[0099] Mode 1 is a processing mode in which a circular illumination shape (also called normal illumination) with a uniform intensity distribution centered on the optical axis is set, and a slit-shaped opening with a line width of 10 μm and a length of 10 mm, i.e., the above-mentioned opening PAa or PAb, is selected as the opening on the mask M. In this specification, selecting an opening includes using the first mirror array 80 to form (set) an illumination field (illumination light irradiation area) in which illumination light is irradiated only on a partial area on the mask M that includes the selected opening. Here, the reason for using the first mirror array 80 to form an illumination field only on a partial area on the mask M that includes the selected opening is to minimize loss of laser power by concentrating and irradiating the entire beam emitted from the light source system 510 onto the selected pattern portion.

[0100] In mode 1, as shown in Figure 10(A), the shape of the optical blade is an upside-down isosceles trapezoid when viewed from the front, with the cutting edge length being 1 mm, and an upside-down isosceles triangle when viewed from the side, with the cutting edge dimension being 1 μm. Note that the directions indicated by the coordinate axes shown in the front view and side view of the optical blade in Figure 10(A) indicate the scanning direction of the workpiece during machining. In mode 1, when aperture PAa is selected, the scanning direction is the X-axis direction, and when aperture PAb is selected, the scanning direction is the Y-axis direction.

[0101] Mode 2 is a processing mode in which the aforementioned slit-shaped aperture PAa or PAb is selected as the aperture on the mask M, and a semicircular illumination shape is set with a linear portion corresponding to the longitudinal direction of the selected aperture. The illumination shape in Mode 2 has an edge along a virtual axis extending in the left-right direction of the paper in FIG. 10(A), and the beam is distributed in one of the two regions divided by this virtual axis on the pupil plane. The semicircular illumination shape in Mode 2 can be referred to as an illumination shape with one-fold rotational symmetry with respect to the center (optical axis) of the pupil plane. In Mode 2, the virtual axis extending in the left-right direction of the paper corresponds to a direction perpendicular to the scanning direction of the workpiece on the image plane (XY plane).

[0102] In mode 2, as shown in FIG. 10(A), when viewed from the front, the shape of the optical blade is an upside-down isosceles trapezoid with a cutting edge length of 1 mm, similar to mode 1, but when viewed from the side, it has a right-angled triangle shape that is half of the upside-down isosceles triangle in mode 1. In mode 2, when aperture PAa is selected, the scanning direction is the X-axis direction, and when aperture PAb is selected, the scanning direction is the Y-axis direction. In mode 2, as shown in the side view, the optical blade (the tip of the beam) has an outer edge that is substantially contained in a plane parallel to the optical axis of the focusing optical system 530 on the side of the traveling direction of the optical blade (the direction opposite to the scanning direction of the workpiece), and the workpiece and the optical blade move relatively in a direction approximately perpendicular to the plane containing this outer edge (a direction parallel to the scanning direction). In addition, the illumination shape of mode 2 has an edge along a virtual axis extending in the left-right direction of the page, and on the pupil plane, the beam is distributed in one (lower) region of the two regions divided by this virtual axis, but there may be another mode in which the beam is distributed in the other (upper) region.

[0103] Mode 3 is a processing mode in which the aforementioned slit-shaped aperture PAa or PAb is selected as the aperture on the mask M, and a semicircular illumination shape is set with a straight portion corresponding to a direction perpendicular to the longitudinal direction of the selected aperture. The illumination shape in Mode 3 has an edge along a virtual axis extending vertically on the paper surface of FIG. 10(A). On the pupil plane, the beam is distributed in one of two regions divided by this virtual axis. This semicircular illumination shape in Mode 3 can be described as an illumination shape with one-fold rotational symmetry about the center of the pupil plane (optical axis). In Mode 3, the virtual axis extending vertically on the paper surface corresponds to the scanning direction of the workpiece on the image plane (XY plane). In Mode 3, as shown in FIG. 10(A), when viewed from the front, the shape of the optical blade is a trapezoid resembling an upside-down isosceles trapezoid in Mode 1 with the right-angled triangular portion at the right end removed. One leg is perpendicular to the upper and lower bases, and the cutting edge length is 1 mm, as in Modes 1 and 2. When viewed from the side, the blade has the same isosceles triangular shape as in Mode 1, with a cutting edge dimension of 1 μm. In Mode 3, when aperture PAa is selected, the scanning direction is the X-axis direction, and when aperture PAb is selected, the scanning direction is the Y-axis direction. In Mode 3, as shown in the front view, the optical blade (the tip of the beam) has an outer edge that is substantially contained within a plane parallel to the optical axis of the focusing optical system 530, and the workpiece and the optical blade move relatively in a direction parallel to the plane including this outer edge (a direction parallel to the scanning direction). Note that the illumination shape in Mode 3 has an edge along a virtual axis extending vertically on the page. On the pupil plane, the beam is distributed in one region (the left side) of two regions divided by this virtual axis, but there may be another mode in which the beam is distributed in the other region (the right side).

[0104] Mode 4 is a processing mode in which the aforementioned slit-shaped aperture PAa or PAb is selected as the aperture on the mask M, and a quadrant illumination shape is set, with two straight lines corresponding to the longitudinal direction of the selected aperture and the direction perpendicular to the longitudinal direction. The illumination shape in Mode 4 has an edge along a virtual axis extending horizontally in the plane of FIG. 10(A) and an edge along a virtual axis extending vertically in the plane of FIG. 10(A). On the pupil plane, the beam is distributed in one of four regions divided by these two virtual axes. In Mode 4, the shape of the optical blade is a trapezoid, similar to Mode 3, when viewed from the front, and a right-angled triangle, similar to Mode 2, when viewed from the side, as shown in FIG. 10(A). In Mode 4, when Pattern PAa is selected, the scanning direction is the X-axis direction, and when Pattern PAb is selected, the scanning direction is the Y-axis direction. This quadrant illumination shape in Mode 4 can be referred to as an illumination shape with one-fold rotational symmetry with respect to the center of the pupil plane (optical axis). In mode 4, similar to mode 2, the optical blade (the tip of the beam) has a first outer edge that is substantially included in a plane parallel to the optical axis of the focusing optical system 530 on the side of the traveling direction of the optical blade (the direction opposite to the scanning direction of the workpiece), and the workpiece and the optical blade move relatively in a direction that is substantially perpendicular to the plane that includes this first outer edge (a direction parallel to the scanning direction). Furthermore, in mode 4, similar to mode 3, the optical blade (the tip of the beam) has a second outer edge that is substantially included in a plane parallel to the optical axis of the focusing optical system 530, and the workpiece and the optical blade move relatively in a direction that is substantially parallel to the plane that includes this second outer edge (a direction parallel to the scanning direction). The illumination shape of mode 4 has an edge along a virtual axis extending left-to-right on the page and an edge along a virtual axis extending up-to-down on the page, and on the pupil plane, the beam is distributed in one region (third quadrant) of the four regions (quadrants) divided by these two virtual axes, but there may be another mode in which the beam is distributed in another region (quadrant) of the four regions (quadrants), for example, the first quadrant.

[0105] Mode 5 is a processing mode in which a small-diameter circular illumination shape (also called small σ illumination) centered on the optical axis is set at the center of the pupil plane, and a pinhole-shaped aperture PAc with a diameter of 10 μm is selected as the aperture on the mask M. In mode 5, the shape of the optical blade is a straight line extending vertically (in the Z-axis direction) with a diameter of 1 μm when viewed from either the front or side, as shown in FIG. 10(A). In this case, the optical blade is rod-shaped with a circular cross section, and when viewed from the side, it is a straight line extending vertically (in the Z-axis direction) with a diameter of 1 μm when viewed from either direction. Therefore, in mode 5, the scanning direction can be set to any direction.

[0106] Mode 6 is a processing mode in which normal illumination is set as the illumination shape and a pinhole-shaped aperture PAc with a diameter of 10 μm is selected as the aperture on the mask M. In Mode 6, the shape of the optical blade is an upside-down isosceles triangle, similar to the side view of Mode 1, whether viewed from the front or side, as shown in FIG. 10(A). In this case, the optical blade is a cone with a circular cross section, and when viewed from the side, it has the same upside-down isosceles triangle shape. Therefore, in Mode 6, the scanning direction can be set to any direction.

[0107] Note that the workpiece and the beam may be moved relatively in a direction intersecting the X-axis and Y-axis within the image plane (XY plane) using the same opening and illumination shape of the mask M as in mode 2. Similarly, the workpiece and the beam may be moved relatively in a direction intersecting the X-axis and Y-axis within the image plane (XY plane) using the same opening and illumination shape of the mask M as in mode 3. Similarly, the workpiece and the beam may be moved relatively in a direction intersecting the X-axis and Y-axis within the image plane (XY plane) using the same opening and illumination shape of the mask M as in mode 4.

[0108] Figure 10(B) shows examples of target areas of a workpiece suitable for machining using optical blades of modes 1, 2, 3, and 4, respectively, and Figure 10(C) shows examples of target areas of a workpiece suitable for machining using optical blades of modes 5 and 6, respectively.

[0109] The mode 1 blade is particularly suitable for removing the surface of a workpiece, as shown in the front and side views of the blade in Fig. 10(A) and Fig. 10(B), for example. The mode 2, mode 3, and mode 4 blades are each suitable for removing the side surfaces of a groove when forming a groove of a predetermined depth on the surface of a workpiece, as shown in the front and side views of the blade in Fig. 10(A) and Fig. 10(B), for example. Mode 4 is particularly suitable for removing the corners of the groove.

[0110] Furthermore, as is clear from the front view and side view of the blade in Fig. 10(A), the mode 5 blade is suitable for cutting, for example, a plate-shaped member into an arbitrary curved or straight line. "Mode 5" in Fig. 10(C) indicates that a gourd-shaped workpiece is produced as a result of cutting a plate-shaped member with the mode 5 blade, and the side of the workpiece is the cut surface by the mode 5 blade.

[0111] Furthermore, as is clear from the front view and side view of the light blade in Figure 10(A) and Figure 10(C), the mode 6 light blade is particularly suitable for forming fine groove patterns of any shape on the surface of a workpiece, such as fine patterns of biochip channels.

[0112] The processing apparatus 100 is also provided with a liquid supply device 540 (see FIG. 14). The liquid supply device 540 can be used, for example, for hardening using a beam from the focusing optical system 530. The liquid supply device 540 has a supply port for supplying a coolant (cooling water) and supplies the coolant to an object to be cooled. The liquid supply device 540 is connected to a control device 600 (see FIG. 14). During hardening, the control device 600 controls the light source unit 60 to adjust the thermal energy of the beam from the focusing optical system 530 irradiated onto the workpiece to a value appropriate for hardening. The control device 600 then irradiates the beam onto the surface of the workpiece held on the table 12 to heat it up, and then, while the workpiece is still held on the table 12, sprays the coolant from the liquid supply device 540 onto the high-temperature portion to rapidly cool it, thereby performing hardening.

[0113] The processing apparatus 100 according to this embodiment is provided with a measuring device 110 (see FIG. 11 ) that receives the beam from the focusing optical system 530 and performs measurement processing. For example, the measuring device 110 can receive the beam from the focusing optical system 530 and measure the optical characteristics of the beam. In this embodiment, the measuring device 110 can be used, for example, to manage the intensity distribution of the beam. In this embodiment, the measuring device 110 can measure at least one of the intensity distribution of the beam on the image plane of the focusing optical system 530 (which coincides with the processing plane MP in this embodiment) and the intensity distribution of the beam on the pupil plane PP2 of the focusing optical system 530. Note that the intensity distribution of the beam on the pupil plane PP2 of the focusing optical system 530 can also be regarded as the intensity distribution of the beam in the angular direction on the image plane of the focusing optical system 530.

[0114] As shown in FIG. 11, the measuring device 110 has a measuring member 92 that forms part of the upper surface of the table 12, and the remaining components housed inside the table 12.

[0115] 12 is a perspective view of a part of the measurement device 110, which is a component arranged inside the table 12, along with the measurement member 92. As shown in FIG. 12, the measurement device 110 includes the measurement member 92, a first optical system 94, an optical system unit 95, and a photodetector 96.

[0116] The measurement member 92 is disposed in a circular opening formed in the upper surface of the table 12, with its upper surface flush with the rest of the table 12. The measurement member 92 has a base material made of, for example, synthetic quartz, that is transmissive to the beam from the focusing optical system 530. A light-shielding film, which also serves as a reflective film, is formed on the surface of the base material by vapor deposition of a metal such as chromium, and a circular opening 92a is formed in the center of the light-shielding film. Therefore, the upper surface of the measurement member 92 includes the surface of the light-shielding film and the base material surface within the opening 92a. Note that the light-shielding film is formed very thin, and in the following description, the surface of the light-shielding film and the base material surface within the opening 92a will be considered to be located in the same plane. Although the light-shielding film is not necessarily formed, forming the light-shielding film is expected to have the effect of suppressing the effects of flare and the like during measurement.

[0117] The first optical system 94 is disposed below the measurement member 92. The beam passing through the opening 92a of the measurement member 92 is incident on the first optical system 94. In this embodiment, the first optical system 94 is a collimator optical system, but it does not have to be a collimator optical system.

[0118] The optical system unit 95 has a circular rotating plate 101 with a rotating shaft 101a at its center. An opening 97 and a lens (second optical system) 98 are arranged on the rotating plate 101 at predetermined angular intervals around the rotating shaft 101a. By rotating the rotating shaft 101a, i.e., by rotating the rotating plate 101, either the opening 97 or the lens 98 can be selectively positioned on the optical path of the light that has passed through the first optical system 94 (at a position corresponding to the optical axis AX1). The rotation of the rotating shaft 101a is performed by a driving device 102 (not shown in FIG. 12, see FIG. 14) under the instruction of a control device 600.

[0119] The opening 97 passes the parallel light emitted from the first optical system 94 as is. By arranging this opening 97 on the optical path of the beam passing through the focusing optical system 530 and moving the first optical system 94 or at least one optical element constituting the first optical system 94, the light receiver 96 can measure the intensity distribution of the beam on the pupil plane (entrance pupil) of the focusing optical system 530. Note that the measurement device 110 does not have to be able to measure the intensity distribution on the pupil plane (entrance pupil) of the focusing optical system 530. In this case, the lens 98 may be fixed.

[0120] The lens 98 constitutes a relay optical system together with the first optical system 94, and makes the upper surface of the measurement member 92 in which the opening 92a is formed optically conjugate with the light receiving surface of the light receiving element (described later) of the light receiver 96.

[0121] The photodetector 96 has a light-receiving element (hereinafter referred to as "CCD") 96a, such as a two-dimensional CCD, and an electrical circuit 96b, such as a charge transfer control circuit. It goes without saying that a CMOS image sensor may be used as the photodetector 96a. The light-receiving result (light-receiving data) of the photodetector 96 is output to the control device 600 (see FIG. 14). The CCD 96a has an area sufficient to receive all of the parallel light that enters the first optical system 94 through the aperture 92a, exits the first optical system 94, and passes through the aperture 97. The light-receiving surface of the CCD 96a is optically conjugate with the upper surface (the surface on which the aperture 92a is formed) of the measurement member 92 by a relay optical system formed by the first optical system 94 and a lens 98. Each pixel of the CCD 96a is sized so that multiple pixels are included within the irradiation area of the beam converged via the relay optical system. The CCD 96a has one or more reference pixels defined therein, and the positional relationship between the reference pixels and a reference point, such as the center point, of the table 12 is known. Therefore, the control device 600 can determine the positional relationship between the beam incident on the CCD 96a and the reference pixels from the output of the photodetector 96, and can obtain positional information of the beam within the table coordinate system (for example, information on the focused position of the beam).

[0122] In addition, the light receiving surface of the CCD 96a is conjugate with the pupil plane of the focusing optical system 530 when the upper surface (substrate surface) of the measuring member 92 coincides with the image plane (machined surface MP) of the focusing optical system 530 and the opening 97 is positioned on the optical path of the beam passing through the opening 92a and the first optical system 94.

[0123] Moreover, instead of the opening 97, an optical system (optical member) may be arranged on the rotary plate 101, so that the light receiving surface of the CCD 96a and the pupil plane of the light collecting optical system 530 are conjugate. Furthermore, during measurement, the upper surface of the measuring member 92 may be arranged at a position shifted in the direction of the optical axis AX from the image plane of the light collecting optical system 530.

[0124] Furthermore, the optical system unit 95 is not limited to the one described above. For example, instead of using the rotating plate 101, the lens 98 may be held by a movable member, and the movable member may be moved in a direction perpendicular to the optical axis (for example, along the X-axis direction) to insert or remove the lens 98.

[0125] As is clear from the above explanation, in this embodiment, the measuring device 110 including the measuring member 92 is mounted on a table 12 that can move freely in six degrees of freedom. Therefore, the measuring member 92 that functions as the light receiving unit of the measuring device 110 can receive the beam from the focusing optical system 530 while moving in at least one of the Z-axis direction parallel to the optical axis AX on the exit surface side of the focusing optical system 530, the X-axis direction perpendicular to the optical axis AX, and the Y-axis direction.

[0126] Here, although the explanation is out of order, a description will be given of measurement using the measurement device 110. Measurement of the beam intensity distribution on the image plane of the focusing optical system 530 and its vicinity (surface nearby in the Z-axis direction) is performed, for example, as follows.

[0127] The control device 600 first controls the planar motor 26 and the telescopic mechanisms 161-166 based on known target values (such as design information) to move the table 12, and positions the opening 92a of the measurement member 92 at a position on the optical axis AX of the focusing optical system 530, based on the measurement values of the position measurement system 28 and the linear encoders 241-246.

[0128] Furthermore, the control device 600 rotates the rotary plate 101 via the driving device 102, and positions the lens 98 on the optical path of the beam that passes through the opening 92a and the first optical system 94. Then, in this state, the intensity distribution of the beam on the image plane of the focusing optical system 530 is measured based on light reception data (denoted as LRD1, see FIG. 14) that is the light reception result of the beam that is converged by the lens 98 on the light receiving surface of the CCD 96a.

[0129] 13A shows an optical arrangement when measuring the intensity distribution of a beam on the image plane of the focusing optical system 530, developed along the optical axis AX1 of the measurement device 110 and the optical axis AX of the focusing optical system 530 (however, the portion upstream of the focusing optical system 530 is not shown). When measuring the intensity distribution of a beam, for example, the positioning of the mask M in any of the above-mentioned modes 1 to 6 and the positioning of each mirror element 81 of the second mirror array 78 are performed. i,j The reflecting surface of each mirror element 81 of the first mirror array 80 is set. p,q The reflecting surface is set at a design angle so that a desired beam intensity distribution (shape, size, position, etc. of the beam irradiation area) on the mask M can be obtained.

[0130] Under the above preconditions, in the optical arrangement shown in FIG. 13(A), when the control device 600 causes at least one laser unit 70 of the light source unit 60 to emit a laser beam, and a parallel beam is emitted from the light source system 510, the parallel beam is irradiated onto the first mirror array 80 via the second mirror array 78 and the first partial illumination optical system 79, and is reflected by the plurality of mirror elements 81 of the first mirror array 80. p,q The beams are reflected by the second partial illumination optical system 82, and become multiple parallel beams, which are then irradiated onto a larger area surrounding the selected aperture of the mask M via the second partial illumination optical system 82. The multiple beams that have entered the focusing optical system 530 through the aperture of the mask M are focused onto an image plane by the focusing optical system 530, and enter an aperture 92a located on or near the image plane.

[0131] The light that has passed through the opening 92a is collected on an optically conjugate plane of the measurement member 92, i.e., the light receiving surface of the CCD 96a, by a relay optical system consisting of the first optical system 94 and the lens 98. Therefore, the intensity distribution on the light receiving surface of the CCD 96a becomes the intensity distribution of the beam within the upper surface of the measurement member 92. The beam having this intensity distribution is received by the CCD 96a, and photoelectrically converted to obtain light receiving data LRD1, which is transmitted from the light receiver 96 (electrical circuit 96b) to the control device 600 (see FIG. 14).

[0132] Therefore, the control device 600 acquires the light reception data LRD1 while stepping the table 12 in the Z-axis direction via the extension / retraction mechanisms 161-166 based on the measurement values of the linear encoders 241-246. Based on the acquired light reception data LRD1, the control device 600 finds the Z-axis position at which the area of the beam irradiation region formed on the light receiving surface of, for example, the CCD 96a is minimized. The area of the beam irradiation region formed on the light receiving surface of the CCD 96a is minimized when the upper surface of the measuring member 92 coincides with the image plane of the focusing optical system 530, forming the sharpest beam irradiation region within the opening 92a. Therefore, based on the light reception data LRD1 from the light receiver 96, the control device 600 can determine that the Z position of the table 12 at which the number of pixels receiving the beam is smallest is the Z position at which the upper surface of the measuring member 92 coincides with the image plane. In this embodiment, the image plane is the processing plane MP, and the control device 600 can determine the beam intensity distribution (shape, size, position, etc. of the beam irradiation area) on the processing plane MP based on the light reception data LRD1 at that Z position. In this embodiment, the control device 600 can determine the three-dimensional beam intensity distribution between the image plane (processing plane MP) and its nearby (+Z side) surface (the aforementioned virtual surface) based on the light reception data LRD1 acquired for each step position in the Z axis direction in the process of determining the Z position of the table 12 where the upper surface of the measuring member 92 and the image plane coincide. Determining the three-dimensional beam intensity distribution can also be said to be determining the shape of the optical blade. Therefore, if the three-dimensional beam intensity distribution (e.g., cross-sectional intensity distribution on the +Z side surface near the image plane) differs from the desired state, the control device 600, for example, adjusts the mirror elements 81 of the second mirror array 78.i,j The angle of at least a part of the beam is adjusted to adjust the three-dimensional intensity distribution of the beam to a desired state. Adjusting the three-dimensional intensity distribution of the beam can also be said to be adjusting the shape of the optical blade.

[0133] The control device 600 can also adjust the beam intensity distribution (shape, size, position, etc. of the beam irradiation area) on the processing plane MP to a desired state by taking into consideration only the measurement result of the beam intensity distribution on the image plane (processing plane MP) without taking into consideration the three-dimensional intensity distribution of the beam. Note that the first mirror array 80 is disposed at a position conjugate with or near the pupil plane PP2 of the focusing optical system 530, so that the mirror element 81 i,j The three-dimensional intensity distribution of the beam may be adjusted by adjusting the angle of at least a part of the beam.

[0134] Furthermore, if the intensity distribution of the beam on the image plane (processing plane MP) of the focusing optical system 530 is different from the desired state, the control device 600 adjusts the position of the mask M (aperture) and the mirror elements 81 of the second mirror array 78. i,j and adjusting at least one of the angles of at least a portion of the above.

[0135] The mask M (aperture) may be deformed to change the intensity distribution of the beam on the image plane (processing plane MP) of the focusing optical system 530. The size of the image of the aperture may be changed or the image of the aperture may be distorted by adjusting the focusing optical system 530 (for example, by moving some optical elements of the focusing optical system 530).

[0136] Furthermore, when the upper surface of the measuring member 92 and the image plane of the focusing optical system 530 are aligned, the position of the beam irradiation area on the processing surface MP (image plane of the focusing optical system 530) on the table coordinate system can be determined from the positional relationship between the beam intensity distribution on the light receiving surface of the CCD 96a and one or more reference pixels.

[0137] In this embodiment, the control device 600 measures at least one of the beam intensity distribution (shape, size, position, etc. of the beam irradiation area) at the processing plane MP and the beam intensity distribution at a nearby surface, and then measures the beam intensity distribution at a pupil plane (entrance pupil) PP2 of the focusing optical system 530, which will be described next. Note that the measurement of the beam intensity distribution at the pupil plane PP2 may be performed before measuring the beam intensity distribution at the image plane (processing plane MP). Furthermore, the measurement of the beam intensity distribution at the pupil plane PP2 and the measurement of the beam intensity distribution at the image plane (processing plane MP) do not have to be performed consecutively.

[0138] The measurement of the intensity distribution of the beam on the pupil plane (entrance pupil) of the focusing optical system 530 is performed, for example, as follows.

[0139] After completing the measurement of the intensity distribution of the beam at the processing plane MP, the control device 600 rotates the rotating plate 101 via the driving device 102 while maintaining the position of the table 12 so that the upper surface of the measurement member 92 (the surface on which the opening 92a is formed) is located on the optical axis AX of the focusing optical system 530 and is at the same height as the processing plane MP, thereby positioning the opening 97 on the optical path of the beam passing through the opening 92a and the first optical system 94. Then, in this state, the intensity distribution of the beam at the pupil plane PP2 is measured. The measurement of the intensity distribution of the beam at the pupil plane PP2 of the focusing optical system 530 can also be considered as a measurement of the cross-sectional shape of the beam at the pupil plane PP2. Furthermore, because the pupil plane PP1 of the illumination optical system 520 is conjugate with the pupil plane PP2 of the focusing optical system 530, the measurement of the intensity distribution at the pupil plane PP2 can also be considered as a measurement of the intensity distribution at the pupil plane PP1. The measurement of the intensity distribution at the pupil plane PP1 of the illumination optical system 520 can also be considered as a measurement of the cross-sectional shape of the beam at the pupil plane PP1.

[0140] FIG. 13B shows the optical arrangement when measuring the beam intensity distribution on the pupil plane, expanded along the optical axis AX1 of the measurement device 110 and the optical axis AX of the focusing optical system 530 (however, the portion upstream of the focusing optical system 530 is not shown). As shown in FIG. 13B, in this state, an aperture 97 is disposed on the optical path of the beam, and therefore, the collimated light passing through the first optical system 94 is directly incident on the CCD 96a constituting the photodetector 96. In this case, the light receiving surface of the CCD 96a can be considered to be disposed in a position conjugate with the pupil plane of the focusing optical system 530, and it is possible to receive a light beam corresponding to the beam intensity distribution on the pupil plane. Therefore, the control device 600 acquires light reception data (denoted as LRD2, see FIG. 14) from the photodetector 96 and calculates the beam intensity distribution on the pupil plane based on the light reception data LRD2. The calculated intensity distribution data is then stored in memory.

[0141] The control device 600 controls, for example, the plurality of mirror elements 81 of the second mirror array 78 based on the measurement result of the intensity distribution of the beam on the pupil plane. i.j It is possible to adjust at least a portion of the angle of the first mirror array 80 and the second mirror array 78. The beam intensity distribution on the image plane (processing plane MP) and the beam intensity distribution on the pupil plane PP2 may be considered as a three-dimensional beam intensity distribution. In other words, the three-dimensional beam intensity distribution (shape of the optical blade) may be obtained from the beam intensity distribution on the image plane (processing plane MP) and the beam intensity distribution on the pupil plane PP2 measured using the measurement device 110, and based on the result, at least a portion of the angle of at least one of the first mirror array 80 and the second mirror array 78 may be adjusted.

[0142] Returning to FIG. 1 , the control device 600 includes a host system linkage unit 620 connected online to a host system including a host computer via, for example, a local area network (LAN), and a recipe creation unit 630. The host system linkage unit 620 acquires CAD data of a workpiece before and after machining online from the host system based on instructions from an operator. The recipe creation unit 630 creates recipe data (control information for each unit of the processing device 100 during machining, information instructing a series of procedures) to be used in machining by the processing device 100, based on the CAD data of the workpiece before and after machining acquired by the host system linkage unit 620. That is, in the processing device 100, the operator can acquire a recipe to be used in machining by the processing device 100 simply by instructing the creation of recipe data (hereinafter, appropriately abbreviated as a recipe).

[0143] 14 is a block diagram showing the input / output relationship of a control device 600 that centrally configures the control system of the processing apparatus 100. The control device 600 includes a workstation (or a microcomputer) and the like, and controls each component of the processing apparatus 100.

[0144] The processing apparatus 100 according to this embodiment configured as described above can perform various processes on a processing target (workpiece), such as removal processing for removing a portion of the workpiece and cutting processing for cutting the workpiece, using a beam from the focusing optical system 530. The workpiece is loaded into the processing apparatus 100, processed, and then removed from the processing apparatus 100. A series of operations performed by the processing apparatus 100 is automated, and workpieces can be supplied in lots, with a fixed amount collected on a pallet being considered as one lot.

[0145] 15 shows a flowchart corresponding to a series of processing algorithms of the control device 600. The processing (including judgment) of each step in the following flowchart is performed by the control device 600, but explanations regarding the control device 600 will be omitted below unless particularly necessary.

[0146] It is assumed that at least one recipe has been created in advance by the host system linkage unit 620 and recipe creation unit 630 of the control device 600 in response to a recipe creation instruction from an operator, and that the recipe has been stored in a storage device (not shown) as a recipe database. When the operator instructs the control device 600 to select a desired recipe, processing according to the flowchart of Fig. 15 is started.

[0147] First, in step S2, the count value n of the counter indicating the number of the workpiece in the lot is initialized (n←1).

[0148] In the next step S4, a pallet (not shown) carrying one lot of workpieces before machining is carried in from outside to a predetermined carry-in / out position within the processing apparatus 100. This carrying-in is performed by a carry-in / out device (not shown) in response to instructions from the control device 600. Here, one lot may be, for example, i × j pieces, and the i × j pieces of workpieces are mounted on the pallet in a matrix arrangement of i rows and j columns. That is, the mounting positions (mounting positions) of the workpieces are determined on the top surface of the pallet in a matrix arrangement of i rows and j columns, and the workpieces are mounted (placed) at each mounting position. For example, each mounting position is marked, and the position of each mark on the pallet is known. In the following, one lot is assumed to be, for example, 4 × 5 = 20 pieces, and marks are placed on the top surface of the pallet in a matrix arrangement of 4 rows and 5 columns, with workpieces mounted on each mark. For example, the first to fifth workpieces in a lot are placed at positions 1st row, 1st column to 1st row, 5th column, respectively; the sixth to tenth workpieces are placed at positions 2nd row, 1st column to 2nd row, 5th column, respectively; the eleventh to fifteenth workpieces are placed at positions 3rd row, 1st column to 3rd row, 5th column, respectively; and the sixteenth to twentieth workpieces are placed at positions 4th row, 1st column to 4th row, 5th column, respectively.

[0149] In the next step S6, the nth workpiece in the lot is removed from the pallet and mounted on the table 12. At this time, the first stage system 200A is assumed to be in a loading / unloading position set near the position where the transfer system 300 is installed in the processing apparatus 100. Also, at this time, the table 12 is in the above-mentioned reference state (Z, θx, θy, θz) = (Z0, 0, 0, 0), and its XY position coincides with the X, Y position of the slider 10 measured by the position measurement system 28.

[0150] Specifically, the control device 600 refers to the count value n to identify the position (i, j) on the pallet of the workpiece to be removed, and issues an instruction to the transport system 300 to remove the workpiece at the identified position (ij). In response to this instruction, the transport system 300 removes the workpiece from the pallet and places it on the table 12. For example, when n=1, the workpiece located at the first row, first column position on the pallet is removed and placed on the table 12.

[0151] Next, in step S7, table 12 with the workpiece mounted thereon is moved below measurement system 400 (sensor unit 38). This movement of table 12 is performed by control device 600 controlling planar motor 26 based on measurement information from position measurement system 28 to move first stage system 200A in the X-axis direction (and Y-axis direction) on base BS. During this movement, table 12 is maintained in the reference state described above.

[0152] In the next step S8, the measurement system 400 is used to measure the position information (three-dimensional shape information in this embodiment) in three-dimensional space of at least a part of the target surface on the workpiece placed on the table 12 in the reference state. After this, based on the measurement results, the position of the target surface on the workpiece in six degrees of freedom can be managed by open-loop control on the table coordinate system (reference coordinate system).

[0153] In the next step S9, the table 12 carrying the workpiece, for which measurement of the position information (shape information) of at least a portion of the target surface has been completed, is moved below the beam irradiation system 500 in the same manner as the movement below the measurement system 400 described above.

[0154] In the next step S10, a subroutine, machining is performed according to the recipe on the workpiece on the table 12. For the sake of simplicity, it is assumed that machining is specified only once in the same machining mode for the same recipe.

[0155] In the subroutine of step S10, as shown in FIG. 16, first, in step S102, predetermined settings corresponding to the next processing mode specified in the selected recipe (however, the first processing mode will be the processing mode initially specified) are performed, i.e., the setting of the illumination shape and the selection and setting of the opening on the mask M. Here, it is assumed that one of the above-mentioned modes 1 to 6 is specified. For example, if mode 1 is specified initially, normal illumination is set as the illumination shape, and the opening specified in the recipe is selected. As an example, a slit-shaped opening PAa is selected.

[0156] In the next step S104, the three-dimensional intensity distribution of the beam (shape of the optical blade) at and near the machining surface MP is measured using the procedure described above, and adjustments are made based on the measurement results. This adjustment includes, for example, at least one of adjusting the angles of at least some of the mirror elements in the first mirror array 80, adjusting the angles of at least some of the mirror elements in the second mirror array 78, adjusting the focusing optical system 530 (including adjusting the position, tilt, etc. of some lenses), and adjusting the position of the mask M (aperture). Needless to say, adjustments based on the measurement of the three-dimensional intensity distribution of the beam (shape of the optical blade) are made only when necessary. Furthermore, the position of the machining surface MP may be determined based on the measurement results in step S104, or the positional relationship between the machining surface MP and the table 12 may also be determined.

[0157] In the next step S106, the beam intensity distribution at the pupil plane PP2 of the focusing optical system 530 is measured (this can also be considered as measuring the illumination shape), and adjustments are made based on the measurement results. This adjustment includes, for example, adjusting the angles of at least some of the mirror elements of the first mirror array 80 and / or adjusting the angles of at least some of the mirror elements of the second mirror array 78. Again, it goes without saying that adjustments based on the measurement results of the beam intensity distribution at the pupil plane PP2 are made only when necessary. In this way, the necessary preparation work is completed. Note that at least one of steps S104 and S106 may be omitted.

[0158] In the next step S108, in order to process the workpiece W, the first stage system 200A and the beam irradiation system 500 are controlled, and the workpiece is processed in accordance with the recipe (for example, in the case of mode 1, surface removal processing using an optical blade in mode 1) while the table 12 is scanned in the scan direction relative to the beam. The relative movement speed between the workpiece and the beam (in this case, the movement speed of the table 12) is controlled by the control device 600. This relative speed may be determined based on the material of the workpiece W, the type of processing, etc. Note that the relative movement speed may also be determined according to the intensity distribution (intensity) on the processing surface MP measured previously. Here, the position and posture of the target surface (and target portion) on the workpiece during processing are controlled taking into account the position information (shape information in this embodiment) of the target surface measured previously using the measurement system 400. For example, the position information (shape information) of the target surface TAS (see Figure 9(A)) of the workpiece W obtained using the measurement system 400 is used to relatively move the target area TA (see Figure 9(A)) on the target surface TAS of the workpiece W and the beam irradiation area on the processing surface MP in the desired positional relationship.

[0159] In the next step S110, it is determined whether or not there are any modes specified by the recipe that have not yet been completed. If this determination is negative, i.e., if there are any modes that have not yet been completed, the process returns to step S102, and thereafter, the loop processing (including determination) of steps S102 → S104 → S106 → S108 → S110 is repeated until the determination of step S110 is reached. As a result, processing of the workpiece according to the recipe in all processing modes specified in the recipe is sequentially performed. Then, when all processing specified in the recipe has been completed, the determination of step S110 is positive, and the process returns to step S12 of the main routine. Note that even if the determination of step S110 is negative, at least one of steps S104 and S106 after step S102 may be omitted.

[0160] Incidentally, it is also conceivable that a workpiece W placed on the table 12 has a slope inclined at a predetermined angle with respect to the upper surface of the table 12 (e.g., a surface parallel to the XY plane), and that this slope is used as the target surface, for example, to perform removal processing. The machining apparatus 100 according to this embodiment includes a first stage system 200A that can arbitrarily set the position of the table 12 on which the workpiece is placed in six degrees of freedom. In such a case, the control device 600 can easily align the target surface (slope) of the workpiece with the processing surface MP by controlling the first stage system 200A based on the three-dimensional shape of the workpiece measured using the measurement system 400. Naturally, it is also easy to form the above-described slope on a workpiece of any shape placed on the table 12.

[0161] In step S12, the table 12 on which the machined workpiece is placed is moved to the above-mentioned loading / unloading position.

[0162] In the next step S14, the nth workpiece in the machined lot mounted on the table 12 is returned to the pallet. Specifically, the control device 600 refers to the count value n to identify its position on the pallet, and issues an instruction to the transport system 300 to return the workpiece to the identified position on the pallet. In response to this instruction, the transport system 300 removes the machined workpiece from the table 12 and returns it to the identified position on the pallet.

[0163] After the process of step S14 is executed, the process proceeds to step S16. At this point, there is no workpiece on the table 12. In step S16, the count value n of the counter is incremented by 1 (n←n+1).

[0164] In the next step S18, it is determined whether the count value n exceeds N (N is the number of workpieces in one lot; in this embodiment, N=20). If the determination in step S18 is negative, that is, if there are workpieces in the lot that have not been processed, the process returns to step S6, and the processing (including determination) of steps S6 to S18 is repeated until the determination in step S18 is positive. As a result, the above-mentioned series of processing (including determination) is performed for the second and subsequent workpieces in the lot. Then, when processing is completed for all workpieces in the lot and the determination in step S18 is positive, the process proceeds to step S20, where an instruction is given to a loading / unloading device (not shown) to unload the pallet on which the processed workpieces are mounted outside the device, and the series of processing in this routine is then terminated.

[0165] In the subroutine of step S10 described above, the measurement of the beam intensity distribution on the pupil plane is performed after the measurement of the three-dimensional intensity distribution of the beam, but this is not limiting, and the measurement of the beam intensity distribution on the pupil plane may be performed before the measurement of the beam intensity distribution on the image plane (machining plane MP). Furthermore, the measurement of the three-dimensional intensity distribution of the beam and the measurement of the beam intensity distribution on the pupil plane do not have to be performed consecutively. Furthermore, the frequency of measurement of the three-dimensional intensity distribution of the beam may differ from the frequency of measurement of the beam intensity distribution on the image plane (machining plane MP).

[0166] Furthermore, if there is a risk that at least one of the beam intensity distribution at the processing plane MP (image plane) and the beam's three-dimensional intensity distribution may change as a result of adjustment based on the measurement results of the beam intensity distribution at the pupil plane described above, the control device 600 may measure the beam intensity distribution at the processing plane MP and the three-dimensional intensity distribution again and may make adjustments based on the results.

[0167] Furthermore, the above-mentioned steps S104 and S106 are performed each time a mode is set, regardless of whether mode 1 to mode 6 is set. However, this is not limited to this, and the processing of steps S104 and S106 may be performed only for some of modes 1 to 6.

[0168] In the above description, after the workpiece W has been machined, the table 12 carrying the machined workpiece W is moved to the loading / unloading position to return the machined workpiece to the pallet. However, after the workpiece W has been machined, the table 12 carrying the machined workpiece W may be moved below the measurement system 400, and the shape of the workpiece on the table 12 may be inspected using the 3D measuring device 401 of the measurement system 400. For example, the dimensional error of the machined portion may be determined based on the measured shape information (a type of 3D position information). In this case, the dimensional error may be used to further determine whether the machining is acceptable. As a result of the pass / fail determination, among the workpieces determined to be unacceptable, those with a positive dimensional error (workpieces that can be corrected by removal processing, etc.) may be subjected to necessary corrective processing using the beam irradiation system 500 while still placed on the table 12 (held on the table 12 by the chuck mechanism 13) based on the dimensional error. Alternatively, after the workpiece has been machined, the table 12 carrying the machined workpiece W may be moved below the measurement system 400, the shape of the workpiece on the table 12 may be inspected using the three-dimensional measuring device 401 of the measurement system 400, and regardless of the inspection results, the machined workpiece may be moved to the loading / unloading position to be returned to the pallet without any corrective machining. In this case, the shape inspection result data may be sent by the control device 600 to an external device, for example, a higher-level device.

[0169] As described above in detail, the machining apparatus 100 and the machining method executed by the machining apparatus 100 according to this embodiment can change the three-dimensional intensity distribution of the beam near the image plane on the exit surface side of the focusing optical system 530 by combining the cross-sectional intensity distribution of the beam at the pupil plane PP2 of the focusing optical system 530 (the cross-sectional intensity distribution (illumination shape) at the pupil plane of the illumination optical system 520) and the intensity distribution of the beam at the machining plane MP (image plane) (the aperture on the mask M). In other words, the shape of the optical blade described above can be changed. Therefore, as described above for Modes 1 to 6, workpieces can be machined using optical blades of various shapes. Note that Modes 1 to 6 are merely examples. The machining apparatus 100 can set a wide variety of machining modes, and even more machining modes can be set by adding types of apertures on the mask M or adding types of illumination shapes to be set. In this case, the adjustment based on the results of the above-described measurements may be performed representatively for one selected aperture for each mode, or may be performed for each aperture.

[0170] FIG. 17 shows the contents of various processes that can be performed by the processing device 100, in correspondence with the conventional machine tools that have been used to perform each process.

[0171] The types of processes that can be handled by the processing apparatus 100 can be broadly divided into three types: removal processing, heat treatment, and measurement. Of these, the main role of the processing apparatus 100 is removal processing, which changes the shape of a workpiece through processing, and this removal processing has traditionally been classified into flat cutting, flat grinding, cylindrical cutting, cylindrical grinding, drilling and cutting, drilling and grinding, flat polishing, cutting, engraving and stamping of letters or patterns, free-form transfer using a metal mold, and generation of fine shapes, and each of these processes has previously been performed using a machine tool listed in the conventional machine tool column in Figure 17.

[0172] As described above, the processing apparatus 100 according to this embodiment can handle a wide range of removal processes for workpieces, including surface processing (grinding, cutting, etc.), groove processing (cutting during groove formation, surface grinding after formation, etc.), cutting of arbitrary shapes, and formation of micro-machined patterns. Furthermore, while the processing apparatus 100 may be limited in the depth it can process when processing holes, cylinders, and grooves, it can perform each process with high precision. In particular, when patterning micropatterns such as biochip channels and microreactors, it is capable of processing that is on a different level from conventional machine tools in terms of the fineness of the line widths that can be formed, the positional accuracy, and the degree of freedom in the pattern shapes that can be formed. Furthermore, the creation of micropatterns, which was previously achieved using low-end exposure equipment, can now be achieved by direct processing of the workpiece, eliminating the need for development, etching, layer division, etc. Three-dimensional shapes are also possible. The processing apparatus 100 can also handle surface modification processes such as hardening, and three-dimensional shape inspection of objects.

[0173] Although not shown in FIG. 17 , the beam from the focusing optical system 530 may be adapted to be used for joining processes such as welding, or additional processing (three-dimensional modeling) may be performed using the beam from the focusing optical system 530. In this case, the processing apparatus 100 may be equipped with a device that supplies material for joining or additional processing near the image plane. If additional processing is possible, the additional processing may be performed on the surface of the workpiece after removal processing, or removal processing (processing to remove at least a portion of the additional portion) may be performed on the surface of the workpiece after additional processing. Furthermore, when performing joining or additional processing, it is sufficient to set an optimal combination of the beam intensity distribution on the pupil plane and the beam intensity distribution on the image plane (mask opening).

[0174] The material of the workpiece processed by the processing device 100 may be metal or resin.

[0175] Furthermore, according to the processing apparatus 100 of this embodiment, the reaction force associated with processing is negligible, and therefore, unlike machine tools such as machining centers in which the fixed state of the workpiece is directly related to the processing accuracy and finish, there is no need to firmly fix the workpiece on the table 12. Furthermore, since the processing apparatus 100 is equipped with the measurement system 400, even if the workpiece is loaded somewhat roughly on the table 12 by the transfer system 300, this does not pose a problem because the position relative to the coordinate system is later determined again by the measurement system 400. Because the measurement system 400 performs three-dimensional shape measurement (one aspect of three-dimensional alignment), it is possible to automate a series of operations, including loading the workpiece onto the table 12 and unloading the machined workpiece from the table 12 by the transfer system 300, thereby enabling efficient production.

[0176] Furthermore, according to the processing apparatus 100 and the processing method executed by the processing apparatus 100 of this embodiment, the position of the workpiece (table 12) relative to the beam is controlled based on the target position during processing of the workpiece. However, to minimize positional errors relative to the target position due to the control response characteristics and control accuracy of the table 12, tracking control of the mask M (mask stage 15) relative to the workpiece W may be performed in at least one direction of the X-axis, Y-axis, and Z-axis based on position information of the table 12 and measurement information from the mask stage position measurement system 19. This makes it possible to accurately control the relative positional relationship between the target portion of the workpiece W and the area irradiated with the beam via the opening in the mask M. Therefore, submicron or finer processing can be achieved even when the position control accuracy of the table 12 is on the order of microns or higher.

[0177] Furthermore, according to the processing apparatus 100 of this embodiment, the light source system 510 included in the beam irradiation system 500 combines the multiple laser beams output from the multiple laser units 70 to form a large-diameter parallel beam, which is then emitted toward the illumination optical system 520. This makes it possible to increase the total power without damaging components such as lenses.

[0178] Furthermore, according to the processing apparatus 100 of this embodiment, during processing, the first mirror array 80 is used to form (set) an illumination field (illumination light irradiation area) in which the beam (illumination light) is irradiated only to a portion of the mask M containing the selected pattern. The entire beam emitted from the light source system 510 is focused on the selected pattern portion, minimizing laser power loss. The beam passing through the selected aperture of the mask M is then irradiated onto the workpiece via the focusing optical system 530, which is composed of a reduction projection lens with a large NA. Therefore, the field size on the target surface of the workpiece can be expanded to approximately 1 mm while maintaining high energy density. This dramatically expands the area that can be processed per unit time compared to conventional laser processing apparatuses that use spot beams with diameters of approximately 10 μm. Furthermore, the use of a short-wavelength pulsed laser enables the generation of a small spot size and high energy density beam on the target surface, thereby ensuring high absorption by metals.

[0179] Furthermore, with the machining apparatus 100 according to this embodiment, there is no need to provide a strong chuck on the table 12 that can withstand reaction forces. Furthermore, since the shape of the workpiece can be measured by the measurement system 400 while the workpiece is placed on the table 12 and the position of the workpiece can be controlled based on the measurement results, there is no need for jigs for positioning the workpiece or dedicated setup jigs. Furthermore, with the machining apparatus 100, the control device 600 automatically generates a recipe from CAD data of the workpiece before and after machining, eliminating the need for an engineer to program a CAD recipe based on drawings. Furthermore, during machining, the operator only needs to select a recipe that has already been created, eliminating the need for the operator to manually input the tool trajectory in front of the apparatus.

[0180] According to the processing apparatus 100 and the processing method executed by the processing apparatus 100 of this embodiment, it is possible to measure the three-dimensional shape of the target surface of the processed workpiece by the measurement system 400 while the workpiece remains mounted on the table 12 without being removed from the table 12, and based on the measurement results, it is possible to determine, for example, whether the shape after processing is OK / NG. If the workpiece is not acceptable, it is also possible to correct the processing as it is by using the beam irradiation system 500 while the workpiece remains mounted on the table 12, which is extremely efficient.

[0181] Furthermore, in the process of mass-producing parts, performing on-site dimensional inspection after manufacturing the parts is extremely convenient for quality control. This is because drift is inherent in machine precision due to various factors. By performing inspection on-site, the control device 600 can detect the drift tendency and provide feedback to the machining precision based on the result. That is, the control device 600 can determine the drift tendency of the machine during machining based on the position information (shape information) of the target surface of the workpiece obtained using the measurement system 400, and adjust at least one of the measurement system 400, the beam irradiation system 500, and the first stage system 200A according to the determined result. This makes it possible to suppress dimensional fluctuations and improve yield and quality variation.

[0182] The control device 600 may adjust at least one of the measurement system 400, the beam irradiation system 500, and the first stage system 200A based on position information (shape information) of the target surface of the workpiece acquired using the measurement system 400, not just when determining the drift tendency of the device during processing. In this case, the workpiece includes both a workpiece after processing and a workpiece after correction processing. Adjustment of the beam irradiation system also includes adjustment of the beam intensity distribution on the processing surface MP.

[0183] In the above description, a case has been described in which a plurality of beams are incident on the focusing optical system 530 via the mask M, and the plurality of beams are focused on the image plane (processing plane MP) by the focusing optical system 530 (the image of the openings of the mask M is formed on the image plane (processing plane MP)). However, the processing apparatus 100 does not necessarily need to use the mask M.

[0184] The reason is that a method for setting or changing the intensity distribution of the beam on the processing surface MP (for example, a method for forming a slit-shaped illumination area on the processing surface MP as described above) is to control the focusing position or focusing area of the beam on the object surface of the focusing optical system 530, for example, by using the first mirror array 80.

[0185] The focusing optical system may also be configured such that its pupil plane (entrance pupil) coincides with the front focal plane, or such that the pupil plane (entrance pupil) and the front focal plane are located close to each other. In this case, too, the focusing positions of the multiple parallel beams at the back focal plane can be accurately and easily controlled without using a mask (aperture), for example, by changing the angle of incidence of the multiple parallel beams incident on the focusing optical system using the first mirror array 80. When using a focusing optical system with this configuration, the back focal plane of the focusing optical system can be used as the processing plane MP. Even when using this type of focusing optical system, the above-described measurement device 110 can be used to measure the beam intensity distribution at at least one of the back focal plane (processing plane MP), a plane near the back focal plane, the pupil plane, and a plane near the pupil plane.

[0186] Furthermore, in this embodiment, for example, a slit-shaped or spot-shaped irradiation area is formed only by light passing through the same focusing optical system 530. Therefore, a high-quality beam spot can be formed compared to when beam spots (laser spots) are formed by focusing light passing through separate optical systems on the same area.

[0187] Furthermore, in this embodiment, the control device 600 uses the rotary encoder described above to detect the state of each mirror element (here, the tilt angle of the reflective surface), thereby monitoring the state of each mirror element in real time, thereby enabling accurate control of the tilt angle of the reflective surface of each mirror element of the mirror arrays 78 and 80.

[0188] In the processing apparatus 100 according to this embodiment, the control device 600 can measure the three-dimensional intensity distribution of the beam, the intensity distribution of the beam within the processing surface MP, and the like at an appropriate frequency by the above-described method using the measuring device 110, and perform the necessary calibration. For example, the control device 600 can adjust the three-dimensional intensity distribution of the beam, the intensity distribution of the beam within the processing surface MP, and the like based on the measurement results using the measuring device 110.

[0189] Furthermore, the control device 600 may use the measurement device 110 to measure the beam intensity distribution within the processing plane MP or measure the beam intensity distribution on a plane different from the processing plane MP, for example, prior to processing the workpiece, and adjust at least one of the beam irradiation system 500 and the first stage system 200A during the processing based on the measurement results. The plane different from the processing plane MP (image plane) includes a plane near the processing plane MP (image plane) or the pupil plane (PP2).

[0190] In this case, the adjustment (control) of the first stage system 200A is typically the position control of the table 12.

[0191] In addition, the adjustment (control) contents of the beam irradiation system 500 include all of the various control contents of the beam irradiation system described above as a method for setting or changing the intensity distribution of the beam on the processing surface, for example, the shape, size, position, etc. of the irradiation area of the beam formed on the processing surface.

[0192] Furthermore, for example, when the measurement of the beam intensity distribution on the processing surface MP cannot be performed all at once by the photodetector 96 while the table 12 is stationary, for example, when the range of the beam irradiation area on the processing surface MP is wide, particularly when no mask M is used, the measurement of the beam intensity distribution on the processing surface MP is performed while moving the table 12 (opening 92a of the measuring member 92) in at least one of the X-axis direction and the Y-axis direction within the XY plane.

[0193] In the processing apparatus 100 according to this embodiment, all components of the measuring device 110 are provided on the table 12, but this is not limited to this. As long as an optically conjugate relationship is maintained between the light receiving surface of the CCD 96a and the formation surface of the opening 92a of the measuring member 92, which functions as the light receiving section, the components of the measuring device 110 other than the measuring member 92 may be provided outside the table 12.

[0194] Furthermore, a movable member equipped with a sensor device similar to the measuring device 110 described above and movable independently of the table 12 may be provided separately from the table 12. In this case, the movable member only needs to be movable in the three axes, X, Y, and Z, and the control device 600 may be configured to control (manage) the position of the movable member and the sensor on the table coordinate system. The control device 600 can measure the beam intensity distribution described above using the sensor device. Also in this case, the control device 600 may adjust at least one of the beam irradiation system 500 and the first stage system 200A described above during processing based on the beam intensity distribution measured using the sensor device. In addition, the control device 600 can measure the beam intensity distribution described above using the sensor device while measuring the workpiece on the table 12 using the measurement system 400.

[0195] As can be seen from the above explanation, the measuring device 110 can also be used as an unevenness sensor that detects unevenness (intensity distribution) in the intensity of the beam within the irradiation area.

[0196] Furthermore, the measurement device 110 may be used to measure the aberration, such as wavefront aberration, of the focusing optical system 530. For example, a microlens array, in which a plurality of microlenses are arranged in a matrix, optically conjugate between the formation surface of the aperture 92a and the light receiving surface of the CCD 96a, may be disposed in an empty area of the rotating plate 101 shown in FIG. 12, such as the area within the imaginary circle (two-dot chain line) in FIG. 12. In this case, it is possible to configure a Shack-Hartmann wavefront aberration measurement instrument capable of measuring the wavefront aberration of the focusing optical system 530 by rotating the rotating plate 101 to position the microlens array on the optical path of the parallel light emitted from the first optical system 94, selecting a pinhole pattern on the mask M, and focusing the beam on the pinhole pattern via the second partial illumination optical system 82. When a configuration capable of measuring wavefront aberration is employed, even if the position of the image plane of the focusing optical system 530 changes, the position of the image plane of the focusing optical system 530 after the change can be measured from the wavefront aberration measurement results. Based on this, the position of the processing surface MP can be changed or the position of the upper surface of the measurement member 92 during measurement processing by the measurement device 110 can be adjusted. Furthermore, when a configuration capable of measuring wavefront aberration is employed, a configuration capable of adjusting the optical characteristics of the focusing optical system 530 may also be employed. For example, the focusing optical system 530 may be composed of multiple lenses, and some of the lenses may be configured to be drivable in the optical axis AX direction and in an inclined direction (tilt direction) relative to a plane perpendicular to the optical axis AX by a driving element such as a piezoelectric element. In such a case, the optical characteristics of the focusing optical system 530 can be adjusted by moving the movable lens in at least one of the axis AX direction and the tilt direction.

[0197] Alternatively, instead of the measuring device 110, as shown in FIG. 18, the photodetector 96 may be disposed on the upper surface of the table 12 so that the light-receiving surface of the CCD 96a is flush with or conjugate to the rest of the table 12. The photodetector 96 may then be used to measure, for example, the beam intensity distribution at the processing surface MP. In this case, scanning measurement is possible, in which the beam intensity distribution is measured while the table 12 is moving, rather than just while the table 12 is stationary. This eliminates the influence of the finite number of pixels in the CCD or mirror array, and allows for accurate measurement results. In this way, measuring the beam intensity distribution with a sensor that receives the beam from the focusing optical system 530 makes it possible to manage the beam intensity distribution while taking into account fluctuations such as thermal aberration of the focusing optical system 530. Furthermore, adjustments based on the measurement results allow the beam intensity distribution at the processing surface MP (e.g., the image plane) of the focusing optical system 530 to be accurately adjusted to the desired state.

[0198] Furthermore, as the measurement device 110, for example, a slit scanning type aerial image measurement device disclosed in US Patent Application Publication No. 2002 / 0041377 may be used.

[0199] As described above, the machining device 100 according to this embodiment has a major feature in that it is equipped with many conveniences and solutions that meet the requirements of manufacturing sites (machining sites) for actual parts, etc., compared to machine tools that use conventional tools.

[0200] In the above embodiment, as an example, a case has been described in which workpieces are processed in lot units, with a fixed amount collected on a pallet being one lot, but this is not limiting, and workpieces may be processed one by one. In this case, the conveyance system 300 loads the unmachined workpieces received from the external conveyance system onto the table 12, and unloads the machined workpieces from the table and passes them to the external conveyance system.

[0201] In the above embodiment, a transmissive mask having a plurality of openings is used as the mask M, but a reflective mask may be used instead.

[0202] In the above embodiment, the mask M is moved using the mask stage 15 so that the beam from the illumination optical system 520 is irradiated onto at least one of the multiple apertures on the mask M. However, the first mirror array 80 may be used to control the mask M so that the beam is irradiated onto at least one of the multiple apertures on the mask M. In this case, the position of the mask M may be fixed or may be movable. In this case, the size and shape of the irradiation area of the beam on the image plane (processing plane MP) of the focusing optical system 530 can be changed by changing the aperture used for processing. Therefore, the first mirror array 80 may be considered as part of a mechanism for changing the intensity distribution of the beam on the image plane (processing plane MP) of the focusing optical system 530.

[0203] Furthermore, when multiple apertures on the mask M are used (for example, when forming irradiation areas of multiple beams on the image plane (machined surface MP), in other words, when forming images of multiple apertures on the image plane (machined surface MP)), the beams may be irradiated only onto a partial area including the multiple apertures. In this case, the beams may be irradiated onto multiple areas on the mask M that are separated from each other.

[0204] In the above embodiment, the light source unit 60 used generates a beam having a wavelength in the visible to infrared range. However, instead of this, an ultraviolet light source such as an excimer laser that generates a beam having a wavelength in the ultraviolet range, or an X-ray light source that generates a beam having a wavelength in the extreme ultraviolet range may be used.

[0205] In the above embodiment, the first and second mirror arrays 80 and 78 are used as the spatial light modulator. However, instead, a large-area digital mirror device consisting of a large number of digital micromirror devices (DMDs (registered trademark)) fabricated using MEMS technology arranged in a matrix may be used. In such a case, it would be difficult to measure the state (e.g., tilt angle) of each mirror element using an encoder or other device. In such a case, a detection system may be used that irradiates the surface of the large-area digital mirror device with detection light, receives reflected light from the many mirror elements that make up the digital mirror device, and detects the state of each mirror element based on the intensity distribution. In this case, the detection system may detect the state of each of the many mirror elements based on image information obtained by capturing an image formed by the digital mirror device using an imaging means. Furthermore, instead of the first and second mirror arrays 80 and 78, an adaptive mirror that can actively change the surface shape of its reflective surface or a transmissive optical element that can actively change the refractive index locally may be used.

[0206] In the above embodiment, the first mirror array 80 is disposed at or near the pupil position of the illumination optical system 520, but the first mirror array 80 may be disposed at or near a position conjugate with the illuminated surface of the illumination optical system (the surface on which the mask M is disposed). In the above embodiment, the second mirror array 78 is disposed at or near a position conjugate with the illuminated surface of the illumination optical system (the surface on which the mask M is disposed), but the second mirror array may be disposed at or near the pupil position of the illumination optical system.

[0207] In the above embodiment, the optical path is bent by 90 degrees by the first and second mirror arrays 80, 78, but the bending angle of the optical path by the first and second mirror arrays 80, 78 is not limited to 90 degrees and can be any angle, such as 110 to 175 degrees (the incident light and the outgoing light form an acute angle of 5 to 80 degrees) or 5 to 80 degrees (the incident light and the outgoing light form an obtuse angle of 120 to 175 degrees).

[0208] In the above embodiment, a detector for detecting the intensity of the beam from the light source unit 60 may be provided. For example, a part of the beam may be branched upstream of the focusing optical system 530, and the branched beam that does not enter the focusing optical system 530 may be received by a detector. For example, since the intensity (energy) of the beam entering the focusing optical system 530 can be determined from the output of this detector, the output from this detector may be used to estimate the focusing position in the Z-axis direction of the beam toward the processing surface MP (the position of the image plane in the Z-axis direction). Then, using the estimation result, the focusing optical system 530 may be controlled so that the focusing position (the position of the image plane in the Z-axis direction) is at a desired position.

[0209] In the processing apparatus 100 according to the above embodiment, for example, the rotary encoder 83 p,q 14. The detection system 89 may be configured to irradiate the surface of the first mirror array 80 with detection light and detect the reflection of the mirror elements 81 constituting the first mirror array 80. p,q and based on the intensity distribution, each mirror element 81 p,q A detection system for detecting the state of the rotary encoder 83 can be used. As the detection system, for example, a system having a configuration similar to that disclosed in U.S. Patent No. 8,456,624 can be used. i,j In addition, a detection system 89 may be used.

[0210] In the above embodiment, each mirror element 81 i,j or 81 p,qWhile the above example illustrates the use of mirror arrays 78 and 80 in which the tilt angle of the reflecting surface relative to a reference plane can be changed, the present invention is not limited to this. Alternatively, a mirror array in which each mirror element can be tilted relative to the reference plane and displaced in a direction perpendicular to the reference plane may be used. Furthermore, each mirror element does not necessarily have to be tiltable relative to the reference plane. A mirror array capable of displacing mirror elements in a direction perpendicular to the reference plane is disclosed, for example, in U.S. Pat. No. 8,456,624. Alternatively, a mirror array in which each mirror element can rotate around two orthogonal axes parallel to the reference plane (i.e., the tilt angle in two orthogonal directions can be changed) may be used. A mirror array capable of changing the tilt angle in two orthogonal directions is disclosed, for example, in U.S. Pat. No. 6,737,662. In these cases, the state of each mirror element can be detected using the detection system disclosed in U.S. Pat. No. 8,456,624.

[0211] The detection light is irradiated onto the surface of the mirror array 78 or 80, and the mirror elements 81 constituting each of the mirror arrays 78 and 80 are i,j or 81 p,q Alternatively, the detection system may be a mirror array (optical device) provided with sensors that individually detect the tilt angle and spacing of each mirror element relative to a reference surface (base).

[0212] It is not necessary to be able to control (change) the angles of incidence of all of the multiple beams incident on the focusing optical system 530. Therefore, when using a mirror array as in the above embodiment, it is not necessary to be able to change the state of the reflective surface (at least one of the position and tilt angle of the reflective surface) of all mirror elements. Alternatively, the mirror array may be able to change the state of the reflective surface of multiple mirror elements individually, or may be able to change it for each group. The former also includes the case where the control device 600 changes the state of the reflective surface of the mirror array for each group.

[0213] Furthermore, instead of the mirror array of the above embodiment, a spatial light modulator (non-emissive image display element) described below may be used. Examples of transmissive spatial light modulators include transmissive liquid crystal displays (LCDs) and electrochromic displays (ECDs). Examples of reflective spatial light modulators include the above-mentioned micromirror array, reflective liquid crystal displays, electrophoretic displays (EPDs), electronic paper (or electronic ink), grating light valves, and diffractive optical elements.

[0214] In the above embodiment, it goes without saying that the cross-sectional intensity distribution of the beam may be a binary intensity distribution or a multi-value intensity distribution having three or more values. Furthermore, the beam intensity distribution and the cross-sectional shape of the beam (e.g., illumination shape) may be specified within a range in which the cross section has an intensity that is effective for processing the workpiece.

[0215] In addition, in the above embodiment, the illuminance distribution of the beam irradiated onto the opening on the mask M is described as being uniform, but the illuminance distribution of the beam irradiated onto the opening on the mask M may also be non-uniform.

[0216] As described above, it is desirable that the focusing optical system 530 has a large diameter, but a focusing optical system with a numerical aperture NA of less than 0.5 may also be used. Also, immersion processing may be performed in which a liquid is filled between the focusing optical system 530 and the workpiece. In this case, the numerical aperture NA of the focusing optical system may be higher than 1.0. The atmosphere between the focusing optical system 530 and the workpiece may also be a vacuum.

[0217] In the above-described embodiment, the aberration of the condensing optical system 530 may not be completely reduced to zero, but may be left in a state where a predetermined amount of aberration remains.

[0218] In the above embodiment, the control device 600 controls the components of the first stage system 200A, the second stage system 200B, the transfer system 300, the measurement system 400, and the beam irradiation system 500. However, this is not limiting. The control device of the processing system may be configured with multiple pieces of hardware, each including a processing device such as a microprocessor. In this case, the first stage system 200A, the second stage system 200B, the transfer system 300, the measurement system 400, and the beam irradiation system 500 may each be equipped with a processing device. Alternatively, a first processing device that controls at least two of the first stage system 200A, the second stage system 200B, the transfer system 300, the measurement system 400, and the beam irradiation system 500 may be combined with a second processing device that controls the remaining systems. Alternatively, a first processing device that controls two of the four systems may be combined with second and third processing devices that individually control the remaining two systems. In any case, each processing device performs part of the functions of the control device 600. Alternatively, the control device of the machining system may be configured by a plurality of processing devices such as microprocessors and a host computer that controls these processing devices in an integrated manner.

[0219] The processing apparatus 100 does not necessarily have to include the measurement system 400 .

[0220] The components of the above-described embodiments can be combined as appropriate, and therefore some of the components may not be used. [Industrial Applicability]

[0221] As described above, the machining apparatus and machining method according to the present invention are suitable for machining a workpiece. [Explanation of symbols]

[0222] 10... slider, 12... table, 13... chuck mechanism, 15... mask stage, 161 to 166... telescopic mechanism, 17... mask stage drive system, 19... mask stage position measurement system, 241 to 246... linear encoder, 26... planar motor, 28... position measurement system, 62... light guide fiber, 64... double fly's eye optical system, 70... laser unit, 78... second mirror array, 80... first mirror array, 80 p,q ...mirror element, 83 p,q ...rotary encoder, 89...detection system, 92...measuring member, 92a...aperture, 100...processing device, 96...photoreceiver, 110...measuring device, 200A...first stage system, 200B...second stage system, 300...transport system, 400...measurement system, 401...three-dimensional measuring machine, 500...beam irradiation system, 520...illumination optical system, 530...collection optical system, 600...control device, BS...base, LB...beam, M...mask, MP...processing surface, PAa-PAc...aperture pattern, TA...target portion, W...work.

Claims

1. A processing device that processes a workpiece by irradiating it with a beam, a first holding system having a first holding member on which the workpiece is placed and configured to move the workpiece held by the first holding member; a beam irradiation system including a focusing optical system that emits the beam; a control device that controls the first holding system and the irradiation system, the control device controls the first holding system and the irradiation system so that a predetermined processing is performed on a target portion of the workpiece while moving the first holding member and the beam from the focusing optical system relatively; A processing device in which at least one of the intensity distribution of the beam at a first surface on the exit surface side of the focusing optical system and the intensity distribution of the beam at a second surface whose position in the optical axis direction of the focusing optical system is different from the first surface can be changed.

2. The processing apparatus of claim 1, wherein the change in the intensity distribution includes a change from a first state to a second state in which at least one of the intensity distribution of the beam on the first surface and the intensity distribution of the beam on the second surface is different from the first state.

3. The processing apparatus according to claim 2 , wherein an intensity distribution of the beam on the first surface in the first state is different from an intensity distribution of the beam on the first surface in the second state.

4. an intensity distribution of the beam on the first surface in the first state is the same as an intensity distribution of the beam on the first surface in the second state; The processing apparatus according to claim 2 , wherein an intensity distribution of the beam on the first surface in the first state is different from an intensity distribution of the beam on the second surface in the second state.

5. 5. The processing device according to claim 1, wherein the first surface and the second surface are perpendicular to the optical axis.

6. Multiple types of laser processing are possible, 6. The processing device according to claim 1, wherein the first laser processing performed in the first state and the second laser processing performed in the second state are of the same type.

7. 6. The processing device according to claim 1, wherein the first laser processing performed in the first state and the second laser processing performed in the second state are of different types.

8. The processing device according to claim 6 or 7, wherein the first laser processing performed in the first state is performed on the workpiece, and then the second laser processing performed in the second state is performed on the workpiece.

9. The processing device according to any one of claims 1 to 8, wherein the first holding system is capable of moving the workpiece in at least three degrees of freedom directions, including first and second directions that intersect with each other within a predetermined plane, and a third direction that is perpendicular to the predetermined plane.

10. 10. The processing apparatus according to claim 9, wherein the first holding system includes a drive system that moves the first holding member, and a first measuring device that can measure position information of the first holding member in at least the three degrees of freedom directions.

11. The processing apparatus according to any one of claims 1 to 10, wherein the change in the intensity distribution on the first surface involves a change in at least one of a position of the irradiation area of the beam on the first surface, a size of the irradiation area on the first surface, and a shape of the irradiation area on the first surface.

12. The processing apparatus according to any one of claims 1 to 11, wherein the change in the intensity distribution on the second surface involves a change in at least one of a position of the irradiation area of the beam on the second surface, a size of the irradiation area on the second surface, and a shape of the irradiation area on the second surface.

13. 13. The processing apparatus according to claim 1, wherein the intensity distribution is changed by the control device using the beam irradiation system.

14. 14. The processing apparatus according to claim 1, wherein the beam irradiation system has an optical device capable of changing a cross-sectional intensity distribution of the beam on a pupil plane of the focusing optical system.

15. The processing apparatus according to claim 14 , wherein the optical device changes the cross-sectional intensity distribution of the beam at the pupil plane by changing the cross-sectional intensity distribution of the beam at a plane conjugate to the pupil plane.

16. 16. The processing apparatus according to claim 14, wherein the beam intensity distribution at the second plane is changeable by changing the cross-sectional intensity distribution of the beam at a pupil plane of the focusing optical system.

17. 14. The processing apparatus according to claim 1, wherein the beam irradiation system includes an optical device capable of changing the intensity distribution on the second plane.

18. A processing device that processes a workpiece by irradiating it with a beam, a first holding system having a first holding member on which the workpiece is placed and configured to move the workpiece held by the first holding member; a beam irradiation system including a focusing optical system that emits the beam; a control device that controls the first holding system and the irradiation system, the control device controls the first holding system and the irradiation system so that a predetermined processing is performed on a target portion of the workpiece while moving the beam irradiated onto a first surface from the focusing optical system and the first holding member relatively; The beam irradiation system is a processing apparatus having an optical device that can change the cross-sectional intensity distribution of the beam emitted from the focusing optical system on a pupil plane of the focusing optical system.

19. The processing apparatus according to claim 18 , wherein the optical device changes the cross-sectional intensity distribution of the beam at the pupil plane by changing the cross-sectional intensity distribution of the beam at a plane conjugate to the pupil plane.

20. The processing apparatus according to any one of claims 14 to 19, wherein the change in the cross-sectional intensity distribution of the beam on the pupil plane by the optical device includes a change in the cross-sectional shape of the beam on the pupil plane.

21. The processing apparatus according to claim 20 , wherein the optical device changes the cross-sectional shape of the beam at the pupil plane by changing the cross-sectional shape of the beam at a plane conjugate to the pupil plane.

22. 22. The processing apparatus according to claim 20, wherein the beam has an intensity equal to or greater than a predetermined value within a region that defines the cross-sectional shape on the pupil plane.

23. The processing apparatus according to any one of claims 20 to 22, wherein the optical device is capable of setting a cross-sectional shape that is rotationally symmetric once about the center of the pupil plane.

24. 24. The processing device according to claim 20, wherein the cross-sectional shape is defined in one of two regions that are divided into two on the pupil plane by a first imaginary axis that passes through the center of the pupil plane.

25. 25. The processing apparatus according to claim 24, wherein the cross-sectional shape is defined within one of four quadrants defined by the first imaginary axis and a second imaginary axis that passes through a center of the pupil plane on the pupil plane and is perpendicular to the first imaginary axis.

26. 26. The processing apparatus according to claim 20, wherein a part of an edge of the cross-sectional shape coincides with at least a part of a first imaginary axis that passes through a center of the pupil plane on the pupil plane.

27. 27. The processing apparatus according to claim 26, wherein another part of the edge of the cross-sectional shape coincides with at least a part of a second imaginary axis that passes through the center of the pupil plane and is perpendicular to the first imaginary axis.

28. 28. The processing apparatus according to claim 20, wherein at least a part of an edge that defines the cross-sectional shape on the pupil plane is a straight edge.

29. 29. The processing apparatus according to claim 28, wherein the linear edge coincides with at least a portion of a first imaginary axis passing through a center of the pupil plane at the pupil plane.

30. 30. The processing apparatus according to claim 29, wherein the linear edge coincides with at least a part of a second imaginary axis that passes through the center of the pupil plane and is perpendicular to the first imaginary axis.

31. The processing apparatus according to any one of claims 20 to 30, wherein the cross-sectional shape can be set to at least one of a circle, a semicircle, and a quarter circle using the optical device.

32. The processing apparatus according to any one of claims 14 to 31, wherein a cross-sectional intensity distribution at the pupil plane is set using the optical device so that only a beam that has passed through one of two regions divided into two by a first imaginary axis line passing through the center of the pupil plane is irradiated onto the first plane.

33. 33. The processing apparatus according to claim 32, wherein a cross-sectional intensity distribution at the pupil plane is set using the optical device so that only a beam that has passed through one of four quadrants defined by the first imaginary axis and a second imaginary axis that passes through a center of the pupil plane at the pupil plane and is perpendicular to the first imaginary axis is irradiated onto the first surface.

34. The target portion is machined while the workpiece and the beam are moved relatively in a scanning direction perpendicular to the optical axis of the focusing optical system, The processing device according to any one of claims 24 to 27 and 30 to 33, wherein the first virtual axis corresponds to the scanning direction or a non-scanning direction perpendicular to the optical axis and the scanning direction.

35. The processing apparatus according to any one of claims 14 to 34, wherein the optical device has a spatial light modulator.

36. The processing device according to any one of claims 14 to 35, wherein an intensity distribution on the pupil plane is set based on the type of processing.

37. the beam irradiation system includes an illumination uniformization optical system; The processing apparatus according to any one of claims 14 to 36, wherein the beam emitted from the illuminance homogenizing optical system is incident on the optical device.

38. 38. The processing apparatus according to claim 37, wherein the illuminance uniformizing optical system mixes and uniforms a plurality of beams emitted from a plurality of light source units.

39. 39. The processing apparatus according to claim 1, wherein the beam irradiation system has a spatial light modulator, and the intensity distribution is changed using the spatial light modulator.

40. 40. The processing apparatus according to claim 1, wherein the first surface is a rear focal plane of the focusing optical system.

41. 39. The processing apparatus according to claim 1, wherein the first surface is an image plane of the focusing optical system.

42. In the beam irradiation system, the beam incident on the focusing optical system includes a beam that has passed through an aperture disposed on an entrance surface side of the focusing optical system, 42. The processing apparatus according to claim 41, wherein the intensity distribution on the first surface can be changed by changing at least one of the size, shape, and orientation of the opening.

43. 43. The processing apparatus according to claim 42, wherein the aperture defines an intensity distribution of the beam incident on the focusing optical system in a plane conjugate to the first surface with respect to the focusing optical system.

44. 44. The processing apparatus according to claim 42 or 43, further comprising a second holding system having a second holding member that holds the apertured member having the aperture formed therein.

45. 45. The processing device of claim 44, wherein the second holding system is capable of moving the aperture member.

46. 46. The processing apparatus according to claim 44 or 45, wherein the second holding system includes a drive system that moves the second holding member, and a second measuring device that can measure position information of the second holding member.

47. The processing device according to any one of claims 42 to 46, wherein the control device moves at least one of the first holding member and the second holding member so that the irradiation area of the beam within the first plane coincides with the target portion of the workpiece.

48. changing the intensity distribution includes changing a first opening disposed on an incident surface side of the focusing optical system to a second opening; The processing device according to any one of claims 42 to 47, wherein the first opening and the second opening are different in at least one of size, shape, and orientation.

49. the first opening and the second opening are slit-shaped openings, 49. The processing device of claim 48, wherein the first opening differs from the second opening in at least one of length and orientation.

50. 49. The processing device according to claim 48, wherein the first opening and the second opening extend in directions perpendicular to each other.

51. 51. The processing device according to any one of claims 48 to 50, wherein at least one of the first opening and the second opening is a pinhole-shaped opening.

52. The processing apparatus according to any one of claims 42 to 51, wherein the beam irradiation system has a spatial light modulator, and the control device uses the spatial light modulator to change at least one of the position, size, and shape of the irradiation area of the beam incident on the surface on which the opening is located, in accordance with the opening.

53. the spatial light modulator has a plurality of mirrors; each of the plurality of mirrors has a reflective surface; 53. The processing apparatus according to claim 52, wherein the plurality of mirrors are individually movable.

54. 54. The processing apparatus according to claim 53, wherein the spatial light modulator is capable of individually changing the state of the reflective surfaces of the plurality of mirrors, and the change in the state of the reflective surfaces includes a change in at least one of the position and inclination angle of the reflective surfaces.

55. a detection system for detecting a state of the reflective surface of each of the plurality of mirrors; 55. The processing apparatus according to claim 53 or 54, wherein the state of the reflecting surface of each of the plurality of mirrors is controlled based on the output of the detection system.

56. 56. The processing apparatus of claim 55, wherein the detection system includes sensors attached to the plurality of mirrors individually.

57. 57. The processing apparatus according to claim 55 or 56, wherein the detection system irradiates detection light onto surfaces of the plurality of mirrors and receives reflected light from the plurality of mirrors.

58. 58. The processing apparatus according to any one of claims 53 to 57, wherein the states of the reflecting surfaces of the plurality of mirrors are changed individually or for each group.

59. A processing apparatus according to any one of claims 41 to 58, wherein the beam irradiation system is capable of changing the intensity distribution of the beam incident on the focusing optical system at a conjugate plane of the first surface with respect to the focusing optical system.

60. 60. The processing apparatus of claim 59, wherein the beam irradiation system includes a spatial light modulator capable of changing the intensity distribution in a plane conjugate to the first plane.

61. 61. The processing apparatus of claim 60, wherein the spatial light modulator comprises a plurality of mirrors.

62. 62. The processing apparatus according to claim 1, wherein at least one incident beam incident on the focusing optical system is a parallel beam.

63. 63. The processing device according to any one of claims 1 to 62, wherein the control device determines the relative movement speed between the workpiece and the beam in accordance with the intensity distribution on the first surface.

64. 64. The processing device according to any one of claims 1 to 63, wherein the target portion is processed by moving the workpiece and the beam relatively.

65. a base member supporting the first support system; 65. The processing apparatus according to any one of claims 1 to 64, wherein the first holding system is supported by air levitation or magnetic levitation on the base member.

66. 66. The processing apparatus according to any one of claims 1 to 65, wherein the control device controls the first holding system and the irradiation system in accordance with recipe data created in advance.

67. a measurement system for acquiring position information of the workpiece while being movable by the first holding system; A processing apparatus described in any one of claims 1 to 66, wherein the control device controls the first holding system and the beam irradiation system based on processing information for the workpiece and position information of the workpiece obtained using the measurement system.

68. 68. The processing apparatus according to claim 67, wherein the measurement system includes a three-dimensional measuring machine.

69. 69. The processing apparatus according to claim 67 or 68, wherein the measurement system is capable of measuring positional information of at least three points on the workpiece.

70. 70. The processing apparatus according to any one of claims 67 to 69, wherein the measurement system is capable of measuring a three-dimensional shape of a target surface of the workpiece.

71. 71. The processing apparatus according to any one of claims 67 to 70, wherein the control device controls the first holding system and the irradiation system in accordance with recipe data created in advance.

72. 72. The processing device according to claim 71, wherein the control device creates the recipe data based on design data of the workpiece before and after processing.

73. The processing apparatus according to any one of claims 67 to 72, wherein the control device adjusts the intensity distribution of the beam on a first surface perpendicular to the optical axis on the exit surface side of the focusing optical system based on the measurement results of the measurement system.

74. the control device controls the position and attitude of the first holding member under a reference coordinate system; The machining apparatus according to any one of claims 67 to 73, wherein the target portion of the workpiece is associated with the reference coordinate system by acquiring the position information.

75. 75. The processing device according to any one of claims 67 to 74, wherein the control device acquires, after the processing, position information of at least a portion of the workpiece including the processed portion using the measurement system.

76. The processing device according to claim 75, wherein the control device measures a three-dimensional shape as the at least part of the position information.

77. 77. The processing apparatus according to claim 75, wherein the control device determines a dimensional error of the processed portion based on position information acquired by using the measurement system.

78. 78. The processing device according to claim 77, wherein the control device determines whether processing is successful or not using the dimensional error.

79. The processing device described in claim 78, wherein the control device performs corrective processing using the beam irradiation system on workpieces that are determined to be unacceptable as a result of the pass / fail judgment and have a positive dimensional error, while holding them on the first stage based on the dimensional error.

80. The processing apparatus according to any one of claims 75 to 79, wherein the control device adjusts at least one of the measurement system, the irradiation system, and the first holding system based on at least a portion of position information including the processing portion of the workpiece.

81. The processing apparatus of claim 80, wherein the control device determines a drift tendency of the apparatus during the processing based on the position information, and adjusts at least one of the measurement system, the irradiation system, and the first holding system according to the determined result.

82. The processing device according to any one of claims 1 to 81, further comprising a sensor that receives the beam at a light receiving section.

83. 83. The processing apparatus according to claim 82, wherein the sensor is capable of measuring an intensity distribution of the beam.

84. 84. The processing apparatus according to claim 82 or 83, wherein the control device receives the beam at the light receiving portion of the sensor while moving the light receiving portion.

85. 85. The processing apparatus according to any one of claims 82 to 84, wherein the light receiving section of the sensor is capable of receiving the beam emitted from the focusing optical system.

86. 86. The processing apparatus according to claim 85, wherein the light receiving unit is positioned to receive the beam at or near the first surface.

87. 87. The processing apparatus according to claim 85 or 86, wherein the light receiving unit is capable of receiving a beam from the focusing optical system while moving in at least one of a direction parallel to the optical axis on the exit surface side of the focusing optical system and a direction perpendicular to the optical axis.

88. 88. The processing apparatus according to any one of claims 85 to 87, wherein the sensor is capable of measuring an intensity distribution of the beam within a first plane perpendicular to the optical axis on the exit surface side of the focusing optical system.

89. 89. The processing apparatus according to any one of claims 82 to 88, wherein the control device adjusts the intensity distribution of the beam on the first surface based on a result of measurement using the sensor.

90. The processing apparatus according to any one of claims 82 to 89, wherein the control device adjusts at least one of the irradiation system and the first holding system based on measurement results obtained using the sensor.

91. Further provided is a conveyance system that loads the workpiece before processing onto the first holding member and unloads the workpiece from the first holding member after processing is completed, The processing apparatus according to any one of claims 1 to 90, wherein the control device controls the transport system.

92. The processing device according to any one of claims 1 to 91, wherein the processing includes removal processing.

93. The processing device according to any one of claims 1 to 92, wherein the shape of the workpiece is changed by the processing.

94. The processing device according to any one of claims 1 to 93, wherein the surface of the workpiece onto which the beam is irradiated for the processing is a metal surface.

95. A processing device that processes a workpiece by irradiating it with a beam, a first holding system having a first holding member on which the workpiece is placed and configured to move the workpiece held by the first holding member; a beam irradiation system including a focusing optical system that emits the beam; a control device that controls the first holding system and the irradiation system, the control device controls the first holding system and the irradiation system so that a predetermined processing is performed on a target portion of the workpiece while moving the beam irradiated onto a first surface from the focusing optical system and the first holding member relatively; A processing apparatus in which the intensity distribution in the cross section of the beam emitted from the focusing optical system is one-fold rotationally symmetric.

96. 96. The processing apparatus of claim 95, wherein the beam irradiation system includes an optical device capable of changing the intensity distribution in the cross section.

97. 97. The processing apparatus of claim 96, wherein the optical device is capable of changing the cross-sectional intensity distribution of the beam at a pupil plane of the focusing optical system.

98. 98. The processing apparatus of claim 97, wherein the optical device is capable of changing a cross-sectional intensity distribution at the pupil plane by changing a cross-sectional intensity distribution at a plane conjugate to a pupil plane of the focusing optical system.

99. 99. The processing apparatus according to claim 97 or 98, wherein the optical device includes a spatial light modulator arranged at a position different from a conjugate plane of the pupil plane of the focusing optical system.

100. The processing apparatus according to any one of claims 96 to 99, wherein the change in intensity distribution in the cross section by the optical device includes a change in the illumination shape of the beam in the cross section.

101. 101. The processing apparatus according to claim 100, wherein the illumination shape is set so that the beam is distributed in one of two regions on the pupil plane that are divided into two by a first imaginary axis line passing through the center of the pupil plane.

102. 102. The processing apparatus described in 101, wherein the illumination shape is set so that the beam is distributed within one of four quadrants defined by the first virtual axis and a second virtual axis that passes through the center of the pupil plane on the pupil plane and is perpendicular to the first virtual axis.

103. 103. The processing apparatus according to claim 100, wherein the illumination shape is set so that the beam has a linear edge on the pupil plane.

104. The processing device according to any one of claims 100 to 103, wherein the illumination shape can be set to a semicircle or a quadrant.

105. The processing apparatus according to any one of claims 95 to 104, wherein the cross section of the beam is on a plane different from a rear focal plane of the focusing optical system.

106. 106. The processing apparatus according to claim 105, wherein a cross section of the beam on a rear focal plane of the focusing optical system is at least one of a spot shape and a line shape.

107. The processing apparatus according to any one of claims 95 to 106, further comprising a sensor that receives the beam emitted from the focusing optical system at a light receiving unit.

108. 108. The processing apparatus according to claim 107, wherein the sensor is capable of measuring the intensity distribution of the beam.

109. 109. The processing apparatus according to claim 107 or 108, wherein the light receiving unit is arranged to receive the beam on a plane conjugate with a rear focal plane of the focusing optical system or on a plane conjugate with a plane near the rear focal plane of the focusing optical system.

110. 109. The processing apparatus according to claim 107 or 108, wherein the light receiving unit is arranged to receive the beam at a plane conjugate to an image plane of the focusing optical system or at a plane conjugate to a plane near the image plane of the focusing optical system.

111. 109. The processing apparatus according to claim 107, wherein the sensor is capable of measuring an intensity distribution of the beam within a first plane perpendicular to the optical axis on the exit surface side of the focusing optical system.

112. 112. The processing apparatus according to claim 111, wherein the first surface is a rear focal plane of the focusing optical system or a surface in the vicinity thereof.

113. 112. The processing apparatus according to claim 111, wherein the first surface is an image plane of the focusing optical system or a surface in the vicinity thereof.

114. 114. The processing apparatus according to any one of claims 111 to 113, wherein the control device adjusts the intensity distribution of the beam on the first surface based on a result of measurement using the sensor.

115. A processing method for processing a workpiece by irradiating it with a beam, holding a workpiece on a first holding member; and controlling the movement of the first holding member and the irradiation operation of the beam from the beam irradiation unit so that a predetermined processing is performed on a target portion of the workpiece while moving the beam emitted from the beam irradiation unit including a focusing optical system relative to a first holding member that holds the workpiece, During the processing, at least one of the intensity distribution of the beam at a first surface on the exit surface side of the focusing optical system and the intensity distribution of the beam at a second surface whose position in the optical axis direction of the focusing optical system is different from that of the first surface is changed.

116. A processing method for processing a workpiece by irradiating it with a beam, holding a workpiece on a first holding member; and controlling the movement of the first holding member and the irradiation operation of the beam from the beam irradiation unit so that a predetermined processing is performed on a target portion of the workpiece while moving the beam irradiated onto a first surface from the beam irradiation unit including a focusing optical system and a first holding member that holds the workpiece relatively, A processing method for changing the intensity distribution of the beam emitted from the focusing optical system on a pupil plane of the focusing optical system during the processing.

117. A processing method for processing a workpiece by irradiating it with a beam, holding a workpiece on a first holding member; and controlling the movement of the first holding member and the irradiation operation of the beam from the beam irradiation unit so that a predetermined processing is performed on a target portion of the workpiece while moving the beam irradiated onto a first surface from the beam irradiation unit including a focusing optical system and a first holding member that holds the workpiece relatively, A processing method in which the intensity distribution in the cross section of the beam emitted from the focusing optical system is one-fold rotationally symmetric.

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