Display panel and display device

Abstract

To provide a display panel and a display device.SOLUTION: A display panel includes a display area and a non-display area. The display panel includes a substrate, a light-emitting unit, a partition structure, a packaging layer, and a dam structure. The light-emitting unit is provided on a substrate side and positioned in the display area. The partition structure is provided on the substrate side and positioned in the display area. The partition structure is provided with a plurality of partition openings accommodating the light-emitting unit. The packaging layer includes an organic packaging sub-layer covering the light-emitting unit. The dam structure is provided on the substrate side and positioned in the non-display area, and includes a first dam comprising a first metal layer.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present application belongs to the technical field of displays, and in particular to display panels and display devices. [Background technology]

[0002] Flat panel displays based on technologies such as organic light emitting diodes (OLEDs) and light emitting diodes (LEDs) have advantages such as high image quality, power saving, thinness, and a wide range of applications, and are widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers, becoming the mainstream display panel. However, there is still room for improvement in the reliability of current OLED display products. Summary of the Invention [Problem to be solved by the invention]

[0003] The embodiments of the present application provide a display panel and a display device that can reduce the risk of the packaging material of the organic packaging sub-layer overflowing and allowing water and oxygen to invade, thereby improving the reliability of the product. [Means for solving the problem]

[0004] According to one aspect, an embodiment of the present application provides a display panel having a display area and a non-display area, the display panel including: a substrate; a light-emitting unit provided on the substrate side and located in the display area; a partition structure provided on the substrate side and located in the display area and having a plurality of partition openings for accommodating the light-emitting unit; a packaging layer including an organic packaging sub-layer covering the light-emitting unit; and a dam structure provided on the substrate side and located in the non-display area and including a first dam having a first metal layer.

[0005] In some embodiments, the first dam further comprises a first insulating layer disposed over the first metal layer; Preferably, the display panel includes a drive circuit layer provided on the substrate side, the drive circuit layer including a first conductive layer, a second conductive layer, a third conductive layer and a fourth conductive layer arranged in a stacked manner, and the first metal layer is provided in the same layer as at least one of the first conductive layer, the second conductive layer, the third conductive layer and the fourth conductive layer and is made of the same material.

[0006] In some embodiments, the dam structure further includes a second dam disposed adjacent to the first dam, and an overflow channel is formed between the first dam and the second dam; Preferably, the second dam is located on a side of the first dam that is away from the display area, and the height of the second dam is greater than the height of the first dam; Preferably, the dam structure is provided surrounding the display area.

[0007] In some embodiments, the second dam includes a second metal layer and a second insulating layer disposed over the second metal layer; Preferably, the second metal layer is provided in the same layer as at least one of the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer, and is made of the same material as the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer; Preferably, the first metal layer and the second metal layer are spaced apart, Preferably, the first metal layer and the second metal layer are electrically connected to each other, Preferably, the first metal layer includes a first metal sub-layer and a second metal sub-layer stacked in order along a direction away from the substrate, the first metal sub-layer being provided in the same layer as the third conductive layer and being made of the same material, and the second metal sub-layer being provided in the same layer as the fourth conductive layer and being made of the same material; Preferably, the second metal layer includes a third metal sub-layer and a fourth metal sub-layer stacked in order along a direction away from the substrate.

[0008] In some embodiments, the first metal sub-layer and the third metal sub-layer are provided in the same layer and are electrically connected to each other; Preferably, the first metal sub-layer and the third metal sub-layer are provided in the same layer as the third conductive layer and are made of the same material.

[0009] In some embodiments, the second metal sub-layer and the fourth metal sub-layer are provided in the same layer and are electrically connected to each other; Preferably, the second metal sub-layer and the fourth metal sub-layer are provided in the same layer as the fourth conductive layer and are made of the same material.

[0010] In some embodiments, the dam structure further includes a connection layer, the connection layer being disposed between the first dam and the second dam and electrically connecting the first metal layer and the second metal layer; Preferably, the connection layer includes a conductive region and a via hole region, the conductive region electrically connects the first metal layer and the second metal layer, the via hole region has a via hole formed along a direction perpendicular to the substrate, and the overflow trench includes the via hole; Preferably, the number of conductive regions and the number of via hole regions are each plural, and the plural conductive regions and the plural via hole regions are provided in a positionally shifted manner along the direction in which the edge of the display region extends.

[0011] In some embodiments, the first insulating layer includes a first organic insulating sublayer and a first inorganic insulating sublayer, wherein the first metal layer, the first organic insulating sublayer, and the first inorganic insulating sublayer are stacked; and the second insulating layer includes a second organic insulating sublayer and a second inorganic insulating sublayer, wherein the second metal layer, the second organic insulating sublayer, and the second inorganic insulating sublayer are stacked.

[0012] In some embodiments, the display panel includes a first planarization layer located in the display area, and the first planarization layer, the first organic insulating sub-layer, and at least a portion of the second organic insulating sub-layer are provided in the same layer and are made of the same material; Preferably, the display panel further includes a second planarization layer located in the display area, the second organic insulating sub-layer includes a first sub-layer and a second sub-layer, the first sub-layer and the first planarization layer are provided in the same layer and made of the same material, and the second sub-layer and the second planarization layer are provided in the same layer and made of the same material; Preferably, the second sublayer extends from one end of the third metal sublayer to cover a portion of the third metal sublayer, the fourth metal sublayer covers the remaining portion of the third metal sublayer, and the first sublayer covers the second sublayer and the second metal layer; Preferably, the first organic insulating sub-layer covers the first metal layer.

[0013] In some embodiments, the display panel further includes a pixel definition layer located in the display area, the pixel definition layer including a pixel limiting portion and a pixel opening surrounded by the pixel limiting portion, the pixel opening being used to install a light-emitting unit, the partition structure being provided on a side of the pixel limiting portion away from the substrate, the first inorganic insulating sub-layer, the second inorganic insulating sub-layer and the pixel definition layer being provided in the same layer and made of the same material; Preferably, the display panel further includes a third inorganic insulating sub-layer disposed between the first dam and the second dam, the third inorganic insulating sub-layer, the first inorganic insulating sub-layer, the second inorganic insulating sub-layer and the pixel defining layer being disposed in the same layer and made of the same material, and the overflow groove is located on a side of the third inorganic insulating sub-layer remote from the substrate; Preferably, the display panel further includes a third insulating layer, the third insulating layer being located between the dam structure and the substrate along a direction perpendicular to the substrate, and when the first metal layer and the second metal layer are spaced apart, the third inorganic insulating sublayer being attached to the side of the third insulating layer away from the substrate, and when the connecting layer connects the first metal layer and the second metal layer to each other, the third inorganic insulating sublayer being attached to the side of the connecting layer away from the substrate.

[0014] In some embodiments, an orthogonal projection of the first metal layer on the substrate and an orthogonal projection of the first organic insulating sub-layer on the substrate are both located within an orthogonal projection of the first inorganic insulating sub-layer on the substrate, and an orthogonal projection of the second metal layer on the substrate and an orthogonal projection of the second organic insulating sub-layer on the substrate are both located within an orthogonal projection of the second inorganic insulating sub-layer on the substrate; Preferably, the packaging layer further includes a second inorganic packaging sublayer covering the organic packaging sublayer, the second inorganic packaging sublayer extending to the non-display area and covering the dam structure, and the orthogonal projection on the substrate of the part of the second inorganic packaging sublayer located in the non-display area overlaps with the orthogonal projection on the substrate of the first inorganic insulating sublayer and the orthogonal projection on the substrate of the second inorganic insulating sublayer.

[0015] According to a second aspect, an embodiment of the present application provides a display panel having a display area and a non-display area, the display panel including a substrate, a light-emitting unit provided on the substrate side and located in the display area, a packaging layer including an organic packaging sub-layer covering the light-emitting unit, and a dam structure provided on the substrate side and located in the non-display area, the dam including a first dam having a first metal layer and a first insulating layer stacked together.

[0016] In some embodiments, the dam structure further includes a second dam disposed adjacent to the first dam, and an overflow channel is formed between the first dam and the second dam; Preferably, the second dam is located on a side of the first dam that is away from the display area, and the height of the second dam is greater than the height of the first dam; Preferably, the height H3 of the first dam satisfies 3.5 um≦H3≦5 um; Preferably, the height H4 of the second dam satisfies 5.5 um≦H4≦8.5 um; Preferably, the second dam includes a second metal layer and a second insulating layer stacked one on the other, the thickness of the first metal layer is equal to the thickness of the second metal layer, and the thickness of the second insulating layer is greater than the thickness of the first insulating layer; Preferably, the display panel further includes a third insulating layer, the third insulating layer being located between the dam structure and the substrate along a direction perpendicular to the substrate, a groove being formed on a side of the third insulating layer away from the substrate, and the overflow groove including a groove.

[0017] In some embodiments, the first insulating layer comprises a first organic insulating sublayer and a first inorganic insulating sublayer, the second insulating layer comprises a second organic insulating sublayer and a second inorganic insulating sublayer, the first metal layer and the first organic insulating sublayer and the first inorganic insulating sublayer are stacked, and the second metal layer and the second organic insulating sublayer and the second inorganic insulating sublayer are stacked; Preferably, the thickness of the second organic insulating sub-layer along the direction perpendicular to the substrate is greater than the thickness of the first organic insulating sub-layer along the direction perpendicular to the substrate.

[0018] According to a third aspect, an embodiment of the present application further provides a display device including the display panel according to any one of the above claims. [Effects of the Invention]

[0019] An embodiment of the present application provides a display panel and a display device, the display panel having a display area and a non-display area, the display panel including a substrate, a light-emitting unit, a partition structure, a packaging layer, and a dam structure, the light-emitting unit is provided on the substrate side and located in the display area, the partition structure is provided on the substrate side and located in the display area, and the partition structure is provided with a plurality of partition openings to accommodate the light-emitting units, thereby reducing the crosstalk of carriers in the light-emitting layer, improving the display effect of the display panel, and eliminating the need to use precision mask plates to manufacture the light-emitting units, thereby reducing the development and use of precision mask plates and reducing manufacturing costs. The packaging layer includes an organic packaging sub-layer covering the light-emitting unit, and the dam structure includes a first dam provided on the substrate side and located in the non-display area, the first dam having a first metal layer, whereby the first metal layer and the first insulating layer are stacked to form the first dam, thereby increasing the thickness of the first dam in a direction perpendicular to the substrate, improving the blocking effect of the dam structure on the packaging material of the organic packaging sub-layer, reducing the risk of the packaging material of the organic packaging sub-layer overflowing and allowing water or oxygen to invade, and improving the reliability of the product. [Brief explanation of the drawings]

[0020] In order to more clearly explain the technical solutions of the embodiments of the present application, the following briefly describes the drawings that need to be used in the embodiments of the present application, and those skilled in the art can derive other drawings based on these drawings without any creative efforts. [Figure 1] FIG. 1 is a plan view of a display panel according to some embodiments of the present application. [Figure 2] 1 is a schematic cross-sectional view of a display panel according to some embodiments of the present application. [Figure 3]FIG. 2 is another schematic cross-sectional view of a display panel according to some embodiments of the present application. [Figure 4] 10A to 10C are cross-sectional schematic diagrams of display panels according to other embodiments of the present application. [Figure 5] FIG. 10 is another schematic cross-sectional view of a display panel according to some other embodiments of the present application. [Figure 6] FIG. 10 is yet another schematic cross-sectional view of a display panel according to some other embodiments of the present application. [Figure 7] 10A and 10B are further schematic cross-sectional views of display panels according to some other embodiments of the present application. [Figure 8] FIG. 6 is a cross-sectional view taken along the line AA in FIG. 5. [Figure 9] 10A and 10B are cross-sectional schematic diagrams of display panels according to still other embodiments of the present application. [Figure 10] 10A and 10B are cross-sectional schematic diagrams of display panels according to still other embodiments of the present application. [Figure 11] 10A and 10B are cross-sectional schematic diagrams of display panels according to still other embodiments of the present application. DETAILED DESCRIPTION OF THE INVENTION

[0021] The features and exemplary embodiments of each aspect of the present application will be described in detail below. In order to clarify the objectives, technical solutions, and advantages of the present application, the present application will be described in more detail below with reference to the drawings and specific examples. It should be understood that the specific examples described herein are merely configured to illustrate the present application and are not intended to limit the present application. It is apparent to those skilled in the art that the present application can be implemented without some of these specific details. The following description of the examples is intended to facilitate a better understanding of the present application through the illustrations of the present application.

[0022] It should be noted that, in this specification, relational terms such as "first" and "second" are merely used to distinguish one entity or operation from another and do not necessarily require or imply that such an actual relationship or order exists between those entities or operations. Furthermore, the terms "comprise," "include," or any other variation thereof are intended to cover a non-exclusive inclusion, whereby a process, method, article, or device that includes a set of elements not only includes those elements, but also includes other elements not expressly listed or that are inherent in such process, method, article, or device. Absent more limitations, elements qualified by the phrase "comprise..." do not exclude the presence of other identical elements in a process, method, article, or device that includes said elements.

[0023] To ensure product reliability and prevent the display panel materials from being corroded by moisture and oxygen, flexible AMOLED display panels typically add a packaging layer to the surface of the display panel. The packaging layer typically includes an organic packaging sub-layer formed by inkjet printing. During the inkjet printing process, the packaging material forming the organic packaging sub-layer has good fluidity, which can lead to the packaging material flowing outward and spilling over the edges of the packaging layer, thereby affecting the packaging effect of the packaging layer, increasing the risk of moisture and oxygen intrusion, and potentially affecting the product reliability of the display panel. Therefore, to prevent the packaging material of the organic packaging sub-layer from flowing outward and spilling, a dam structure can be installed in the non-display area of the display panel to position and regulate the packaging material of the organic packaging sub-layer. Currently, the dam structure may be formed by stacking support pillars to support a pixel definition layer and a precision mask plate. However, in some display panel light-emitting units, there is no need to use a precision mask plate, i.e., there is no need to manufacture the support pillars on the display panel. As a result, the thickness of the dam structure is reduced, making it difficult for the dam structure to effectively position the packaging material of the organic packaging sub-layer, and increasing the risk of water or oxygen penetrating the packaging layer, which affects the reliability of the product.

[0024] For reference, patent PCT / CN2023 / 134518 and Chinese patent applications 202311499823.9, 202310707209.0, 202311346196.5, 202310692671.8, and 202311091555.7 describe the relevant contents of the partition structure and packaging layer.

[0025] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel, or may be other types of display panels, such as a micro light emitting diode (abbreviated as Micro-LED) or a quantum light emitting diode (abbreviated as QLED) display panel.

[0026] 1 and 2 , in one aspect, an embodiment of the present application provides a display panel 100, which includes a display area AA and a non-display area NA, and includes a substrate 10, light-emitting units, a partition structure 20, a packaging layer 30, and a dam structure 40. The light-emitting units are disposed on the substrate 10 side and are located in the display area AA. The partition structure 20 is disposed on the substrate 10 side and is located in the display area AA. The partition structure 20 has a plurality of partition openings for accommodating the light-emitting units. The packaging layer 30 includes an organic packaging sub-layer 31 that covers the light-emitting units. The dam structure 40 is disposed on the substrate 10 side and is located in the non-display area NA. The dam structure 40 includes a first dam 41, and the first dam 41 includes a first metal layer 411.

[0027] The substrate 10 includes a base material, which may be a rigid base material made of a material such as glass or plastic, or a flexible base material made of a material such as polyethersulfone PES (PES), polyacrylate PAR (PAR), polyetherimide PEI (PEI), polyethylene naphthalate PEN (PEN), polyethylene terephthalate PET (PET), polyphenylene sulfide PPS (PPS), polyarylate, polyimide (PI), polycarbonate PC (PC), or cellulose acetate propionate CAP (CAP).

[0028] The display area AA is an area where the screen can be displayed and where sub-pixels are provided, while the non-display area NA is an area where the screen cannot be displayed and is typically used for wiring, camera installation, terminal fixing, terminal testing, etc. For example, the non-display area NA can be the outer frame of the display panel 100 so as to surround the periphery of the display area AA.

[0029] The partition structure 20 may have a wide upper portion and a narrow lower portion, or may have a recessed sidewall, so long as the deposition material cannot be continuously deposited on the sidewall of the partition structure 20. For example, the vertical cross section of the partition structure 20 may be an inverted trapezoid, an X-shape, a T-shape, or a U-shape.

[0030] The display panel 100 further includes a light-emitting unit, which is disposed in a partition opening surrounded by the partition structure 20. The light-emitting unit may be a stack of multiple film layer structures. For example, the light-emitting unit may include a hole inject layer (HIL), a hole transport layer (HTL), a light-emitting layer, an electron inject layer (EIL), and an electron transport layer (ETL), which are stacked.

[0031] The organic packaging sub-layer 31 is provided on the side of the light-emitting unit away from the substrate 10, and serves to prevent external moisture, oxygen, etc. from entering the interior of the display panel 100. The organic packaging sub-layer 31 includes an organic material. The organic packaging sub-layer 31 is made of an organic material such as a polymer.

[0032] In the display panel 100 according to the embodiment of the present application, the partition structure 20 is located on the substrate 10 side and is configured to be located in the display area AA, and the partition structure 20 is provided with a plurality of partition openings for accommodating the light-emitting units, thereby reducing the carrier crosstalk between each light-emitting unit, improving the display effect of the display panel 100, and eliminating the need to use precision mask plates to manufacture the light-emitting units, thereby reducing the development and use of precision mask plates and reducing manufacturing costs. The packaging layer 30 is disposed on the side of the partition structure 20 away from the substrate 10, and includes an organic packaging sub-layer 31 covering the light-emitting units. The dam structure 40 is disposed on the substrate 10 side and is located in the non-display area NA. The dam structure 40 includes a first dam 41, and the first dam 41 includes a first metal layer 411, thereby forming the first dam 41 with the first metal layer 411. This increases the thickness of the first dam 41 in the direction perpendicular to the substrate 10, and improves the blocking effect of the dam structure 40 on the packaging material of the organic packaging sub-layer 31. This reduces the risk of the packaging material of the organic packaging sub-layer 31 overflowing and allowing moisture and oxygen to invade, thereby improving the reliability of the product.

[0033] Optionally, the packaging layer 30 further includes a first inorganic packaging sub-layer, which is disposed on a side of the partition structure 20 away from the array substrate 10 and is located between the partition structure 20 and the organic packaging sub-layer 31. The first inorganic packaging sub-layer protects the subpixels from the influence of the external environment (e.g., air and water) and prevents air and moisture from penetrating into the display panel 100, thereby extending the service life and improving the stability of the light-emitting structure. The packaging layer 30 can also prevent foreign objects and harmful substances from entering the display panel 100, ensuring the performance and quality of the display panel 100.

[0034] Optionally, the first inorganic packaging sub-layer may include an inorganic material, such as silicon oxide, silicon nitride, or silicon oxynitride, which can provide good mechanical support and packaging protection to prevent the display panel 100 from being affected by the environment. The first inorganic packaging sub-layer can also effectively block harmful substances such as external moisture and oxygen from entering the display panel 100, thereby extending the service life and improving the stability of the display panel 100.

[0035] Optionally, the organic packaging sub-layer 31 has a greater thickness and is more flexible than the first inorganic packaging sub-layer, and can therefore better conform to the bending and curvature of the display panel 100. In addition, the organic material can also play a role in buffering external forces.

[0036] 2 , the packaging layer 30 may optionally further include a second inorganic packaging sub-layer 32, which can further protect the subpixels from the influence of the external environment (e.g., air and water) and prevent air and moisture from penetrating into the display panel 100, thereby extending the service life and improving the stability of the light-emitting structure. The second inorganic packaging sub-layer 32 can also prevent foreign matter and harmful substances from entering the display panel 100, thereby ensuring the performance and quality of the display panel 100. The organic packaging sub-layer 31 may be disposed between the first inorganic packaging sub-layer and the second inorganic packaging sub-layer 32, so that the first inorganic packaging sub-layer and the second inorganic packaging sub-layer 32 surround the organic packaging sub-layer 31 and prevent the packaging material of the organic packaging sub-layer 31 from leaking outward.

[0037] Continuing with FIG. 2, in some embodiments, the first dam 41 further includes a first insulating layer 412 stacked on the first metal layer 411, thereby further increasing the thickness of the first dam 41 along a direction perpendicular to the substrate 10.

[0038] 3 , the display panel 100 preferably includes a driving circuit layer 60 provided on the substrate 10 side. The driving circuit layer 60 includes a first conductive layer, a second conductive layer, a third conductive layer 61, and a fourth conductive layer 62, which are stacked one on top of the other. The first metal layer 411 is disposed in the same layer as at least one of the first conductive layer, the second conductive layer, the third conductive layer 61, and the fourth conductive layer 62 and is made of the same material. Therefore, the first metal layer 411 may be manufactured using the same process as at least one of the first conductive layer, the second conductive layer, the third conductive layer 61, and the fourth conductive layer 62. Alternatively, the first metal layer 411 may be formed to extend from at least one of the first conductive layer, the second conductive layer, the third conductive layer 61, and the fourth conductive layer 62 to the non-display area NA, thereby simplifying process steps and reducing manufacturing costs.

[0039] 4 , in some embodiments, the dam structure 40 further includes a second dam 43 disposed adjacent to the first dam 41, and an overflow groove 42 is formed between the first dam 41 and the second dam 43, thereby sequentially regulating the position of the packaging material of the organic packaging sub-layer 31 by the first dam 41 and the second dam 43 and more effectively preventing the packaging material of the organic packaging sub-layer 31 from overflowing. When the packaging material overflows from the first dam 41, it flows into the overflow groove 42 and is blocked by the second dam 43, thereby regulating the position of the organic packaging sub-layer 31 within the dam structure 40 and preventing the packaging material of the organic packaging sub-layer 31 from overflowing.

[0040] Preferably, the second dam 43 is located on the side away from the display area AA of the first dam 41, and the height H3 of the second dam 43 is greater than the height H3 of the first dam 41, thereby further improving the positioning effect of the dam structure 40 on the organic packaging sub-layer 31.

[0041] As still shown in FIG. 1, preferably, the dam structure 40 is installed surrounding the display area AA, thereby regulating the position of the organic packaging sub-layer 31 within the dam structure 40 along the circumferential direction of the display area AA, and preventing the packaging material of the organic packaging sub-layer 31 from flowing out and overflowing.

[0042] Continuing to refer to FIG. 4, in some embodiments, the second dam 43 includes a second metal layer 431 and a second insulating layer 432 stacked on the second metal layer 431, thereby increasing the thickness of the second dam 43 in a direction perpendicular to the substrate 10 and improving the blocking effect of the organic packaging sub-layer 31 of the dam structure 40 against the packaging material.

[0043] Continuing to show in FIG. 3, preferably, the second metal layer 431 is disposed in the same layer as at least one of the first conductive layer, the second conductive layer, the third conductive layer 61 and the fourth conductive layer 62 and is made of the same material. Therefore, the second metal layer 431 may be manufactured using the same process as at least one of the first conductive layer, the second conductive layer, the third conductive layer 61 and the fourth conductive layer 62, or the second metal layer 431 may be formed extending from at least one of the first conductive layer, the second conductive layer, the third conductive layer 61 and the fourth conductive layer 62 to the non-display area NA, thereby simplifying the process steps and reducing manufacturing costs.

[0044] 4 , preferably, the first metal layer 411 and the second metal layer 431 are spaced apart from each other, thereby isolating the first metal layer 411 and the second metal layer 431 from each other. When the first metal layer 411 and the second metal layer 431 are connected to different voltages, the first metal layer 411 and the second metal layer 431 are configured to be insulated from each other, thereby preventing mutual interference between the voltages received by the first metal layer 411 and the second metal layer 431.

[0045] Alternatively, the first metal layer 411 or the second metal layer 431 may be connected to any one of an initialization voltage, a reference voltage, and a clock signal of the display panel 100. Of course, the first metal layer 411 or the second metal layer 431 may be connected to a positive power supply voltage or a negative power supply voltage, but this embodiment is not limited thereto.

[0046] As shown in Figures 5 to 7, the first metal layer 411 and the second metal layer 431 are preferably electrically connected to each other, and when the first metal layer 411 and the second metal layer 431 are simultaneously connected to the same voltage, the first metal layer 411 and the second metal layer 431 are electrically connected to each other, thereby improving the resistance conductivity.

[0047] Preferably, the first metal layer 411 includes a first metal sub-layer 4111 and a second metal sub-layer 4112 stacked in sequence along a direction away from the substrate 10, thereby increasing the thickness of the first metal layer 411 along a direction perpendicular to the substrate 10 and further increasing the thickness of the dam structure 40 along a direction perpendicular to the substrate 10.

[0048] Continuing to show in FIG. 3, the first metal sub-layer 4111 and the third conductive layer 61 are disposed in the same layer and are made of the same material, and the second metal sub-layer 4112 and the fourth conductive layer 62 are disposed in the same layer and are made of the same material.

[0049] In addition, in the drive circuit layer 60, the thickness of the third conductive layer 61 and the thickness of the fourth conductive layer 62 are greater than the thickness of the first conductive layer and the thickness of the second conductive layer. Therefore, in this embodiment, the first metal sub-layer 4111 and the third conductive layer 61 are arranged in the same layer and made of the same material, and the second metal sub-layer 4112 and the fourth conductive layer 62 are arranged in the same layer and made of the same material. In contrast to the first metal sub-layer 4111 and the first conductive layer being arranged in the same layer and made of the same material, and the second metal sub-layer 4112 and the second conductive layer being arranged in the same layer and made of the same material, the thicknesses of the first metal sub-layer 4111 and the second metal sub-layer 4112 can be increased, and the thickness of the dam structure 40 along the direction perpendicular to the substrate 10 can be further increased.

[0050] Continuing to show in FIG. 4, the second metal layer 431 preferably includes a third metal sub-layer 4311 and a fourth metal sub-layer 4312 stacked in sequence along a direction away from the substrate 10, thereby further increasing the thickness of the second dam 43 along a direction perpendicular to the substrate 10.

[0051] In addition, when the first metal layer 411 includes a first metal sublayer 4111 and a second metal sublayer 4112, and the second metal layer 431 includes a third metal sublayer 4311 and a fourth metal sublayer 4312, the first metal layer 411 and the second metal layer 431 may be electrically connected to each other, and the first metal sublayer 4111 and the third metal sublayer 4311 may be electrically connected to each other, or the second metal sublayer 4112 and the fourth metal sublayer 4312 may be electrically connected to each other, or the first metal sublayer 4111 and the third metal sublayer 4311 may be electrically connected to each other, and the second metal sublayer 4112 and the fourth metal sublayer 4312 may be electrically connected to each other.

[0052] As shown in FIG. 5, in some embodiments, the first metal sub-layer 4111 and the third metal sub-layer 4311 are disposed in the same layer and are electrically connected to each other, thereby improving the resistance conductivity between the first metal layer 411 and the second metal layer 431 when the first metal layer 411 and the second metal layer 431 are simultaneously connected to the same voltage.

[0053] Continuing to refer to FIG. 3, preferably, the first metal sub-layer 4111 and the third metal sub-layer 4311 are disposed in the same layer as the third conductive layer 61 and are made of the same material, so that the first metal sub-layer 4111, the third metal sub-layer 4311 and the third conductive layer 61 may be manufactured using the same process, or the first metal sub-layer 4111 and the third metal sub-layer 4311 may be formed extending from the third conductive layer 61 to the non-display area NA, thereby simplifying the process steps and reducing the manufacturing costs.

[0054] As shown in FIG. 6, in some embodiments, the second metal sublayer 4112 and the fourth metal sublayer 4312 are disposed in the same layer and are electrically connected to each other, so that when the first metal layer 411 and the second metal layer 431 are simultaneously connected to the same voltage, the resistance conductivity between the first metal layer 411 and the second metal layer 431 can be improved.

[0055] Continuing to refer to FIG. 3, preferably, the second metal sublayer 4112 and the fourth metal sublayer 4312 are disposed in the same layer as the fourth conductive layer 62 and are made of the same material, so that the second metal sublayer 4112, the fourth metal sublayer 4312 and the fourth conductive layer 62 may be manufactured using the same process, or the second metal sublayer 4112 and the fourth metal sublayer 4312 may be formed extending from the fourth conductive layer 62 to the non-display area NA, thereby simplifying the process steps and reducing manufacturing costs.

[0056] Continuing to refer to FIGS. 5 to 7, in some embodiments, the dam structure 40 further includes a connecting layer 44, which is disposed between the first dam 41 and the second dam 43 and connects the first metal layer 411 and the second metal layer 431 electrically, thereby providing a higher resistance conductivity between the first metal layer 411 and the second metal layer 431 than when the first metal layer 411 and the second metal layer 431 are connected electrically by other conductive methods such as a wire.

[0057] The connection layer 44 located between the first metal sublayer 4111 and the third metal sublayer 4311 is located in the same layer as the first metal sublayer 4111 and the third metal sublayer 4311 and is made of the same material, and the connection layer 44 located between the second metal sublayer 4112 and the fourth metal sublayer 4312 is located in the same layer as the second metal sublayer 4112 and the fourth metal sublayer 4312 and is made of the same material, thereby simplifying the process steps.

[0058] As shown in FIG. 8, preferably, the connection layer 44 includes a conductive region 441 and a via hole region 442, the conductive region 441 electrically connects the first metal layer 411 and the second metal layer 431, the via hole region 442 has a via hole formed along a direction perpendicular to the substrate 10, and the overflow groove 42 includes a via hole.

[0059] The conductive region 441 is used to electrically connect the first metal layer 411 and the second metal layer 431. In the via hole region 442, via holes are formed in a direction perpendicular to the substrate 10, and the overflow groove 42 includes the via holes, which increases the depth of the overflow groove 42 in the direction perpendicular to the substrate 10 and increases the volume of the overflow groove 42, allowing the overflow groove 42 to accommodate more packaging material of the organic packaging sub-layer 31 and preventing the packaging material from flowing out and overflowing.

[0060] Preferably, the number of conductive regions 441 and via hole regions 442 is plural, and the plural conductive regions 441 and the plural via hole regions 442 are arranged in a shifted position along the extension direction of the edge of the display area AA. By rationally setting the number and installation positions of the conductive regions 441 and via hole regions 442 in the connection layer, the volume of the overflow groove 42 can be increased while ensuring the resistance conductivity between the first metal layer 411 and the second metal sub-layer 4112.

[0061] In some embodiments, when the first metal layer 411 and the second metal layer 431 are simultaneously connected to a non-power supply voltage, the range of the ratio of the length L1 along the extending direction of the edge of the display area AA of the conductive region 441 to the length L2 along the extending direction of the edge of the display area AA of the via hole region 442 satisfies 0:10 < L1:L2 < 5:5. Thereby, when the first metal layer 411 and the second metal layer 431 are simultaneously connected to a non-power supply voltage, by reasonably setting the length L1 of the conductive region 441 and the via hole region 442, while ensuring the resistance conductivity of the first metal layer 411 and the second metal layer 431, the range of the via hole region 442 can be widened, the size of the via holes located in the via hole region 442 can be increased, and the volume of the overflow groove 42 can be further increased.

[0062] Preferably, when the first metal layer 411 and the second metal layer 431 are simultaneously connected to a non-power supply voltage, the ratio (L1:L2) of the length L1 along the extending direction of the edge of the display area AA of the conductive region 441 to the length L2 along the extending direction of the edge of the display area AA of the via hole region 442 is 1:9. Thereby, while guaranteeing the resistance conductivity of the first metal layer 411 and the second metal layer 431, the range of the aperture region can be maximally enlarged.

[0063] In some embodiments, when the first metal layer 411 and the second metal layer 431 are simultaneously connected to a power supply voltage, the range of the ratio of the length L1 along the extending direction of the edge of the display area AA of the conductive region 441 to the length L2 along the extending direction of the edge of the display area AA of the via hole region 442 satisfies 5:5 ≤ L1:L2 ≤ 9:1. Thereby, when the first metal layer 411 and the second metal layer 431 are simultaneously connected to a power supply voltage, by reasonably setting the length L1 of the conductive region 441 and the via hole region 442, while guaranteeing the resistance conductivity of the first metal layer 411 and the second metal layer 431, the range of the aperture region can be widened, the size of the via holes located in the aperture region can be increased, and the volume of the overflow groove 42 can be further increased.

[0064] Preferably, when the first metal layer 411 and the second metal layer 431 are simultaneously connected to a power supply voltage, the ratio (L1:L2) of the length L1 of the conductive region 441 along the extension direction of the edge of the display area AA to the length L2 of the via hole region 442 along the extension direction of the edge of the display area AA is 5:5, thereby maximizing the range of the opening region while ensuring the resistance conductivity of the first metal layer 411 and the second metal layer 431.

[0065] In addition, in the display panel 100, since the power supply voltage value is higher than other non-power supply voltage values, when the first metal layer 411 and the second metal layer 431 are connected to the power supply voltage at the same time, the length L1 of the conductive region 441 can be increased accordingly, and the length L1 of the via hole region 442 can be shortened, thereby improving the resistance conductivity between the first metal layer 411 and the second metal layer 431, compared to when both are connected to the non-power supply voltage at the same time.

[0066] As shown in FIG. 9 , in some embodiments, the first insulating layer 412 includes a first organic insulating sublayer 4121 and a first inorganic insulating sublayer 4122, and the first metal layer 411, the first organic insulating sublayer 4121, and the first inorganic insulating sublayer 4122 are stacked; the second insulating layer 432 includes a second organic insulating sublayer 4321 and a second inorganic insulating sublayer 4322, and the second metal layer 431, the second organic insulating sublayer 4321, and the second inorganic insulating sublayer 4322 are stacked, thereby increasing the thickness of the first insulating layer 412 along the direction perpendicular to the substrate 10 and the thickness of the second insulating layer 432 along the direction perpendicular to the substrate 10, and increasing the thickness of the dam structure 40 along the direction perpendicular to the substrate 10.

[0067] The first insulating layer 412 and the second insulating layer 432 are formed by laminating organic layers and inorganic layers, respectively, and can buffer external forces and provide the dam structure 40 with good mechanical support.

[0068] As shown in FIG. 10 , in some embodiments, the display panel 100 includes a first planarization layer 70 located in the display area AA, and the first planarization layer 70, the first organic insulating sub-layer 4121, and at least a portion of the second organic insulating sub-layer 4321 are disposed in the same layer and are made of the same material. Therefore, the first organic insulating sub-layer 4121 and at least a portion of the second organic insulating sub-layer 4321 may be manufactured using the same process as the first planarization layer 70, thereby simplifying the process steps and reducing manufacturing costs.

[0069] Continuing to show in Figures 9 and 10, preferably, the display panel 100 further includes a second planarization layer 80 located in the display area AA, and the second organic insulating sub-layer 4321 includes a first sub-layer 4324 and a second sub-layer 4323, the first sub-layer 4324 and the first planarization layer 70 are disposed in the same layer and made of the same material, and the second sub-layer 4323 and the second planarization layer 80 are disposed in the same layer and made of the same material.

[0070] In this embodiment, the second organic insulating sub-layer 4321 includes a first sub-layer 4324 and a second sub-layer 4323. The first sub-layer 4324 and the first planarization layer 70 are disposed in the same layer and are made of the same material. Therefore, the thickness of the second organic insulating sub-layer 4321 is greater than that of the first organic insulating sub-layer 4121. That is, the thickness of the second dam 43 may be greater than that of the first dam 41, thereby further improving the positioning effect of the dam structure 40 relative to the organic packaging sub-layer 31. In addition, the first sub-layer 4324 is manufactured using the same process as the first planarization layer 70, and the second sub-layer 4323 is manufactured using the same process as the second planarization layer 80, thereby simplifying the process steps, improving production efficiency, and reducing production costs.

[0071] Preferably, the second sublayer 4323 extends from one end of the third metal sublayer 4311 to cover a portion of the third metal sublayer 4311, the fourth metal sublayer 4312 covers the remaining portion of the third metal sublayer 4311, and the first sublayer 4324 covers the second sublayer 4323 and the second metal layer 431. By rationally setting the positions of the first sublayer 4324, the second sublayer 4323, the third metal sublayer 4311 and the fourth metal sublayer 4312, the thickness of the second organic insulating sublayer 4321 can be increased while ensuring the electrical conductivity between the third metal sublayer 4311 and the fourth metal sublayer 4312.

[0072] Preferably, the first organic insulating sub-layer 4121 covers the first metal layer 411 to protect the first metal layer 411 and ensure the relative insulation of the first metal layer 411 .

[0073] Continuing to refer to FIG. 10, in some embodiments, the display panel 100 further includes a pixel definition layer 90 located in the display area AA, the pixel definition layer 90 including a pixel limiting portion 91 and a pixel opening 92 surrounded by the pixel limiting portion, the pixel opening 92 being used to install a light-emitting unit, the partition structure 20 being provided on the side of the pixel limiting portion 91 away from the substrate 10, the first inorganic insulating sub-layer 4122, the second inorganic insulating sub-layer 4322 and the pixel definition layer 90 being disposed in the same layer and made of the same material.

[0074] In this embodiment, the first inorganic insulating sub-layer 4122, the second inorganic insulating sub-layer 4322, and the pixel defining layer 90 are disposed in the same layer and are made of the same material, so that the first inorganic insulating sub-layer 4122 and the second inorganic insulating sub-layer 4322 can be manufactured using the same process as the pixel defining layer 90, thereby reducing process steps and manufacturing costs. Furthermore, in this embodiment, the first inorganic insulating sub-layer 4122, the second inorganic insulating sub-layer 4322, and the pixel defining layer 90 are disposed in the same layer and are made of the same material, so that the pixel defining layer 90 is manufactured using an inorganic material, which can better block water and oxygen and ensure the packaging effect for each pixel, while reducing the thickness of the pixel defining layer 90 and the overall thickness of the display panel 100, thereby enabling the display panel 100 to be made thinner and lighter.

[0075] It should be noted that, since the pixel definition layer 90 in this embodiment is made of a thinner and lighter inorganic material, the first dam 41 in the dam structure 40 is a stack of the first metal layer 411 and the first insulating layer 412, and the first insulating layer 412 is configured to include the first organic insulating sub-layer 4121 and the first inorganic insulating sub-layer 4122, thereby compensating for the thinner and lighter first inorganic insulating sub-layer 4122 with the first metal layer 411 and the organic insulating sub-layer 4121, thereby ensuring a dam 41 that is thick enough to position and regulate the packaging material in the organic packaging sub-layer 31.

[0076] Continuing to refer to FIG. 10, preferably, the display panel 100 further includes a third inorganic insulating sub-layer 45 disposed between the first dam 41 and the second dam 43, wherein the third inorganic insulating sub-layer 45, the first inorganic insulating sub-layer 4122, the second inorganic insulating sub-layer 4322 and the pixel defining layer 90 are disposed in the same layer and made of the same material, and the overflow groove 42 is located on the side of the third inorganic insulating sub-layer 45 away from the substrate 10.

[0077] Preferably, the display panel 100 further includes a third insulating layer, which is located between the dam structure 40 and the substrate 10 along a direction perpendicular to the substrate 10. When the first metal layer 411 and the second metal layer 431 are spaced apart, the third inorganic insulating sub-layer 45 is attached to the side of the third insulating layer 50 facing away from the substrate 10. When the connecting layer 44 connects the first metal layer 411 and the second metal layer 431, the third inorganic insulating sub-layer 45 is attached to the side of the connecting layer 44 facing away from the substrate 10, thereby rationally adjusting the depth of the overflow groove 42 along a direction perpendicular to the substrate 10 and ensuring the blocking effect of the dam structure 40.

[0078] Continuing to show in FIG. 10, in some embodiments, the orthogonal projection of the first metal layer 411 on the substrate 10 and the orthogonal projection of the first organic insulating sublayer 4121 on the substrate 10 are both located within the orthogonal projection of the first inorganic insulating sublayer 4122 on the substrate 10, and the orthogonal projection of the second metal layer 431 on the substrate 10 and the orthogonal projection of the second organic insulating sublayer 4321 on the substrate 10 are both located within the orthogonal projection of the second inorganic insulating sublayer 4322 on the substrate 10; therefore, the first inorganic insulating sublayer 4122 can protect the first metal layer 411 and the first organic insulating sublayer 4121, and the second inorganic insulating sublayer 4322 can protect the second metal layer 431 and the second organic insulating sublayer 4321.

[0079] Continuing to show in Figures 3 and 10, preferably, the packaging layer 30 further includes a second inorganic packaging sublayer 32 covering the organic packaging sublayer 31, and the second inorganic packaging sublayer 32 extends to the non-display area NA and covers the dam structure 40, and the orthogonal projection on the substrate 10 of the part of the second inorganic packaging sublayer 32 located in the non-display area NA overlaps with the orthogonal projection on the substrate 10 of the first inorganic insulating sublayer 4122 and the orthogonal projection on the substrate 10 of the second inorganic insulating sublayer 4322, thereby protecting the dam structure 40 by the second inorganic packaging sublayer 32 and further preventing air and moisture from penetrating into the interior of the display panel 100.

[0080] As shown in FIG. 11, according to a second aspect, an embodiment of the present application further provides a display panel 100 having a display area AA and a non-display area NA, the display panel 100 including a substrate 10, a light-emitting unit, a packaging layer 30 and a dam structure 40, the light-emitting unit is disposed on the substrate 10 side and is located in the display area AA, the packaging layer 30 includes an organic packaging sub-layer 31 covering the light-emitting unit, the dam structure 40 is disposed on the substrate 10 side and is located in the non-display area NA, the dam structure 40 includes a first dam 41, and the first dam 41 includes a first metal layer 411 and a first insulating layer 412 arranged in a stacked manner.

[0081] In the display panel 100 according to the embodiment of the present application, the dam structure 40 includes a first dam 41, and the first dam 41 is configured to include a first metal layer 411 and a first insulating layer 412 stacked together. The first metal layer 411 and the first insulating layer 412 are stacked to form the first dam 41, thereby increasing the thickness of the first dam 41 in the direction perpendicular to the substrate 10, improving the blocking effect of the dam structure 40 on the packaging material of the organic packaging sub-layer 31, and reducing the risk of the packaging material of the organic packaging sub-layer 31 overflowing and allowing water or oxygen to invade, thereby improving the reliability of the product.

[0082] In some embodiments, the dam structure 40 further includes a second dam 43 disposed adjacent to the first dam 41, and an overflow groove 42 is formed between the first dam 41 and the second dam 43, so that the packaging material of the organic packaging sub-layer 31 can be sequentially positioned and regulated by the first dam 41 and the second dam 43, and the packaging material of the organic packaging sub-layer 31 can be more effectively prevented from overflowing. When the packaging material overflows from the first dam 41, it flows into the overflow groove 42 and is blocked by the second dam 43, thereby regulating the position of the organic packaging sub-layer 31 within the dam structure 40 and preventing the packaging material of the organic packaging sub-layer 31 from overflowing.

[0083] Preferably, the second dam 43 is located on the side of the first dam 41 away from the display area AA, and the height of the second dam 43 is greater than the height of the first dam 41, thereby further improving the positioning effect of the dam structure 40 on the organic packaging sub-layer 31.

[0084] Preferably, the height H3 of the first dam 41 satisfies 3.5 um≦H3≦5 um, so that the height of the first dam 41 can be set reasonably.

[0085] Preferably, the height H4 of the second dam 43 satisfies 5.5 um≦H4≦8.5 um, so that the height of the second dam 43 can be set reasonably.

[0086] Preferably, the second dam 43 includes a second metal layer 431 and a second insulating layer 432 stacked one on top of the other, the thickness of the first metal layer 411 being equal to the thickness of the second metal layer 431, and the thickness of the second insulating layer 432 being greater than the thickness of the first insulating layer 412.

[0087] In the display panel 100, the first metal layer 411 and the second metal layer 431 are manufactured using a PVD sputtering process. Therefore, in this embodiment, the thickness of the first metal layer 411 is configured to be equal to the thickness of the second metal layer 431, thereby reducing the difficulty of the manufacturing process of the first metal layer 411. In addition, the thickness of the second insulating layer 432 is configured to be greater than the thickness of the first insulating layer 412, thereby allowing the height of the dam structure 40 to gradually increase in the direction away from the display area AA, and ensuring the positioning effect of the organic packaging sub-layer 31 relative to the packaging material.

[0088] As shown in FIG. 11, preferably, the display panel 100 further includes a third insulating layer 50, which is located between the dam structure 40 and the substrate 10 in a direction perpendicular to the substrate 10. A groove 51 is formed on the side of the third insulating layer 50 facing away from the substrate 10. The overflow groove 42 includes the groove 51, which increases the depth of the overflow groove 42 in the direction perpendicular to the substrate 10 and allows the overflow groove 42 to accommodate more packaging material of the organic packaging sub-layer 31, thereby preventing the packaging material from flowing out and overflowing.

[0089] Optionally, the third insulating layer 50 can be reused as an insulating layer made of inorganic material in the display area AA of the display panel 100, where the third insulating layer 50 includes, but is not limited to, at least one of a buffer sub-layer, a gate insulating sub-layer, a capacitor insulating sub-layer, and an interlayer insulating sub-layer, thereby eliminating the need to separately process the third insulating layer 50 or the insulating layers in the display area AA, and simplifying the manufacturing process of the display panel 100.

[0090] In some embodiments, the first insulating layer 412 includes a first organic insulating sublayer and a first inorganic insulating sublayer, the second insulating layer 432 includes a second organic insulating sublayer and a second inorganic insulating sublayer, the first metal layer 411 and the first organic insulating sublayer and the first inorganic insulating sublayer are stacked, and the second metal layer 431 and the second organic insulating sublayer and the second inorganic insulating sublayer are stacked, thereby increasing the thickness of the first insulating layer 412 in the direction perpendicular to the substrate 10 and the thickness of the second insulating layer 432 in the direction perpendicular to the substrate 10, further increasing the thickness of the dam structure 40 in the direction perpendicular to the substrate 10, improving the blocking effect of the dam structure 40 on the packaging material of the organic packaging sublayer 31, reducing the risk of the packaging material of the organic packaging sublayer 31 overflowing and introducing water or oxygen, and improving product reliability.

[0091] Preferably, the thickness of the second organic insulating sub-layer along the direction perpendicular to the substrate 10 is greater than the thickness of the first organic insulating sub-layer along the direction perpendicular to the substrate 10, thereby increasing the height of the second dam 43 and improving the positioning effect of the dam structure 40 on the packaging material of the organic packaging sub-layer 31.

[0092] Optionally, the first and second organic insulating sub-layers may be fabricated by multi-level mask technology, so that there is a thickness difference between the first and second organic insulating sub-layers, and the first and second organic insulating sub-layers are formed by a single exposure, thereby reducing manufacturing costs.

[0093] According to a third aspect, the embodiments of the present application further provide a display device, including any one of the display panels 100 described above. The display device according to the embodiments of the present application has the technical effects of the technical solution of the display panel 100 in any one of the embodiments above, and the same or corresponding configurations and terms as those in the above embodiments will not be described again here.

[0094] The display device may be any device with a display capability, such as a mobile device such as a mobile phone, tablet computer, notebook computer, handheld computer, in-vehicle electronic device, wearable device, ultra mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), or a non-mobile device such as a personal computer (PC), television (TV), or an automated teller machine or self-service machine.

[0095] Although the above is merely a specific embodiment of the present application, for convenience and simplification of the description, it is clear to those skilled in the art that the specific operation processes of the above systems, modules, and units can refer to the corresponding processes in the above method examples, and will not be described again here. The scope of protection of the present application is not limited thereto, and those skilled in the art can easily think of various equivalent modifications or substitutions within the technical scope disclosed in the present application, and all of these modifications or substitutions are included in the scope of protection of the present application. [Explanation of symbols]

[0096] 100 Display Panel 10 Substrate 20 Partition structure 30 Packaging Layer First Inorganic Packaging Sub-Layer 32 Second Inorganic Packaging Sublayer 40 Dam Structure 41 Dam No. 1 411 1st metal layer 4111 First Metal Sub-Layer 4112 Second Metal Sub-Layer 412 First insulating layer 4121 First organic insulating sublayer 4122 First inorganic insulating sublayer 42 Overflow groove 43 Second Dam 431 2nd metal layer 4311 3rd Metal Sub-Layer 4312 4th metal sub-layer 432 Second insulating layer 4321 Second organic insulating sublayer 4322 Second inorganic insulating sublayer 4323 Second Sub-Layer 4324 1st Sub-Layer 44 Connection Layer 441 Conductive area 442 Via hole area 50 Third insulating layer 51 Groove 60 Drive Circuit Layer 61 Third conductive layer 62 4th conductive layer AA stands for Area NA Non-display area

Claims

1. A display panel, The display panel has a display area and a non-display area, A substrate; a light-emitting unit provided on the substrate side and positioned in the display area; a partition structure provided on the substrate side and positioned in the display area, the partition structure having a plurality of partition openings for accommodating the light-emitting units; a packaging layer including an organic packaging sub-layer covering the light-emitting unit; a dam structure provided on the substrate side and located in the non-display area, the dam including a first dam having a first metal layer; A display panel characterized by:

2. the first dam further includes a first insulating layer stacked on the first metal layer; the display panel includes a drive circuit layer provided on the substrate side, the drive circuit layer including a first conductive layer, a second conductive layer, a third conductive layer, and a fourth conductive layer that are stacked, and the first metal layer is provided in the same layer as at least one of the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer and is made of the same material; 2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

3. The dam structure further includes a second dam provided adjacent to the first dam, and an overflow groove is formed between the first dam and the second dam; the second dam is located on a side of the first dam that is away from the display area, and the height of the second dam is greater than the height of the first dam; 3. The display panel according to claim 2.

4. the second dam includes a second metal layer and a second insulating layer stacked on the second metal layer; the second metal layer is provided in the same layer as at least one of the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer and is made of the same material; the first metal layer includes a first metal sub-layer and a second metal sub-layer stacked in order along a direction away from the substrate, the first metal sub-layer being provided in the same layer as the third conductive layer and being made of the same material as the third conductive layer, and the second metal sub-layer being provided in the same layer as the fourth conductive layer and being made of the same material as the fourth conductive layer; the second metal layer includes a third metal sub-layer and a fourth metal sub-layer stacked in order along a direction away from the substrate; 4. The display panel according to claim 3.

5. the first metal sub-layer and the third metal sub-layer are provided in the same layer and are electrically connected to each other; The first metal layer and the second metal layer are spaced apart, or the first metal layer and the second metal layer are electrically connected to each other; 5. The display panel according to claim 4.

6. the second metal sub-layer and the fourth metal sub-layer are provided in the same layer and are electrically connected to each other; 5. The display panel according to claim 4.

7. the dam structure further includes a connection layer, the connection layer being provided between the first dam and the second dam and electrically connecting the first metal layer and the second metal layer; the connection layer includes a conductive region and a via hole region, the conductive region electrically connects the first metal layer and the second metal layer, the via hole region has a via hole formed in it along a direction perpendicular to the substrate, and the overflow trench includes the via hole; 5. The display panel according to claim 4.

8. the first insulating layer includes a first organic insulating sublayer and a first inorganic insulating sublayer, the first metal layer, the first organic insulating sublayer, and the first inorganic insulating sublayer being stacked; the second insulating layer includes a second organic insulating sublayer and a second inorganic insulating sublayer, the second metal layer, the second organic insulating sublayer, and the second inorganic insulating sublayer being stacked; 8. The display panel according to claim 7,

9. the display panel includes a first planarization layer located in the display area, the first planarization layer, the first organic insulating sub-layer, and at least a portion of the second organic insulating sub-layer being formed in the same layer and made of the same material; the display panel further includes a second planarization layer located in the display area, the second organic insulating sub-layer includes a first sub-layer and a second sub-layer, the first sub-layer and the first planarization layer are provided in the same layer and made of the same material, and the second sub-layer and the second planarization layer are provided in the same layer and made of the same material; 9. The display panel according to claim 8.

10. the second sublayer extends from one end of the third metal sublayer to cover a portion of the third metal sublayer, the fourth metal sublayer covers the remaining portion of the third metal sublayer, and the first sublayer covers the second sublayer and the second metal layer; the first organic insulating sub-layer overlies the first metal layer; 10. The display panel according to claim 9.

11. the display panel further includes a pixel definition layer located in the display area, the pixel definition layer including a pixel limiting portion and a pixel opening surrounded by the pixel limiting portion, the pixel opening being used to install the light-emitting unit, the partition structure being provided on a side of the pixel limiting portion away from the substrate, the first inorganic insulating sub-layer, the second inorganic insulating sub-layer, and the pixel definition layer being provided in the same layer and made of the same material; 9. The display panel according to claim 8.

12. the display panel further includes a third inorganic insulating sub-layer disposed between the first dam and the second dam, the third inorganic insulating sub-layer, the first inorganic insulating sub-layer, the second inorganic insulating sub-layer, and the pixel defining layer being disposed in the same layer and made of the same material, and the overflow groove is located on a side of the third inorganic insulating sub-layer away from the substrate.

12. The display panel according to claim 11.

13. the display panel further includes a third insulating layer, the third insulating layer being located between the dam structure and the substrate along a direction perpendicular to the substrate, the third inorganic insulating sub-layer being attached to a side of the third insulating layer away from the substrate when the first metal layer and the second metal layer are spaced apart, and the third inorganic insulating sub-layer being attached to a side of the connection layer away from the substrate when the connection layer electrically connects the first metal layer and the second metal layer.

13. The display panel according to claim 12.

14. an orthogonal projection of the first metal layer on the substrate and an orthogonal projection of the first organic insulating sub-layer on the substrate are both located within an orthogonal projection of the first inorganic insulating sub-layer on the substrate, and an orthogonal projection of the second metal layer on the substrate and an orthogonal projection of the second organic insulating sub-layer on the substrate are both located within an orthogonal projection of the second inorganic insulating sub-layer on the substrate.

9. The display panel according to claim 8.

15. the packaging layer further includes a second inorganic packaging sub-layer covering the organic packaging sub-layer, the second inorganic packaging sub-layer extending to the non-display area and covering the dam structure, and an orthogonal projection of a portion of the second inorganic packaging sub-layer located in the non-display area on the substrate overlaps with an orthogonal projection of the first inorganic insulating sub-layer on the substrate and an orthogonal projection of the second inorganic insulating sub-layer on the substrate; 9. The display panel according to claim 8.

16. A display panel, The display panel has a display area and a non-display area, A substrate; a light-emitting unit provided on the substrate side and positioned in the display area; a packaging layer including an organic packaging sub-layer covering the light-emitting unit; a dam structure including a first dam provided on the substrate side and positioned in the non-display area, the first dam including a first metal layer and a first insulating layer that are stacked together; A display panel characterized by:

17. The dam structure further includes a second dam provided adjacent to the first dam, and an overflow groove is formed between the first dam and the second dam; the second dam is located on a side of the first dam that is away from the display area, and the height of the second dam is greater than the height of the first dam; the second dam includes a second metal layer and a second insulating layer stacked one on the other, the thickness of the first metal layer is equal to the thickness of the second metal layer, and the thickness of the second insulating layer is greater than the thickness of the first insulating layer; 17. The display panel according to claim 16.

18. the display panel further includes a third insulating layer, the third insulating layer being located between the dam structure and the substrate along a direction perpendicular to the substrate, a groove being formed on a side of the third insulating layer away from the substrate, and the overflow groove including the groove; 18. The display panel according to claim 17.

19. the first insulating layer includes a first organic insulating sublayer and a first inorganic insulating sublayer, the second insulating layer includes a second organic insulating sublayer and a second inorganic insulating sublayer, the first metal layer, the first organic insulating sublayer, and the first inorganic insulating sublayer are stacked, and the second metal layer, the second organic insulating sublayer, and the second inorganic insulating sublayer are stacked, a thickness of the second organic insulating sub-layer in a direction perpendicular to the substrate is greater than a thickness of the first organic insulating sub-layer in a direction perpendicular to the substrate; 18. The display panel according to claim 17.

20. A display panel comprising the display panel according to any one of claims 1 to 19. A display device characterized by:

Images