Liquid discharge head, liquid discharge device, manufacturing method of liquid discharge head, and manufacturing method of article

Abstract

To attain a high yield when manufacturing a liquid discharge head by bonding an orifice plate having small mechanical strength and a flow passage substrate in which an ink flow passage is formed.SOLUTION: A liquid discharge head includes: a first substrate having a first main surface in which a plurality of rows of grooves are formed; a second substrate in which a plurality of through holes to be liquid discharge ports are arranged in a matrix shape when a main surface is viewed in a plan view; and a first connection member and a second connection member that connect the first substrate and the second substrate. On the first main surface of the first substrate, the plurality of rows of grooves are arrayed along a second direction. The first connection member connects the first main surface and the main surface so as to surround at least a groove which is not positioned at an end in the second direction among the plurality of rows of grooves of the first substrate. The second connection member connects the first main surface and the main surface along a longitudinal direction of the groove outside the groove positioned at the end in the second direction among the plurality of rows of grooves of the first substrate when the first main surface is viewed in the plan view. An elastic modulus of the second connection member is larger than that of the first connection member.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a liquid ejection head, a method for manufacturing a liquid ejection head, and the like. [Background technology]

[0002] Known devices (liquid ejection heads) for ejecting liquids such as ink include bubble jets (registered trademark), which use a heater to instantly vaporize the ink, thereby propelling droplets, and piezo jets, which use a piezoelectric element to propel the droplets. While liquid ejection heads are expected to improve printing performance such as resolution and printing speed, they are also expected to improve mass productivity during the manufacturing stage of liquid ejection heads. Liquid ejection heads are manufactured by bonding multiple components together using an adhesive.

[0003] Patent Document 1 describes that an orifice plate in which a plurality of openings are formed and a flow path substrate in which portions that become ink flow paths are formed are bonded together using an adhesive. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2023-102816 Summary of the Invention [Problem to be solved by the invention]

[0005] An orifice plate, which has a large number of through-holes as ink ejection ports, requires the through-holes to be formed precisely by photolithography etching, so the substrate is thin and has low mechanical strength. To improve the printing quality of an inkjet head, it is desirable that the flow path substrate, in which the ink flow paths are formed, and the orifice plate, in which the openings are formed, be bonded with high positional accuracy, and that sufficient mechanical strength be ensured after bonding.

[0006] To ensure mechanical strength after bonding, an adhesive with a high elastic modulus after bonding (curing) was used, but the orifice plate could be damaged during bonding. Even if it was not damaged, the thin orifice plate could warp, causing the ejection ports to become misaligned, resulting in a decrease in print quality from the inkjet head. [Means for solving the problem]

[0007] A first aspect of the present invention includes the steps of preparing a first substrate having a first main surface on which a plurality of rows of grooves are formed, and a second substrate having a plurality of through holes arranged in a matrix when the main surface is viewed in plan; applying an uncured first adhesive to a first position on the first main surface of the first substrate; applying an uncured second adhesive to a second position on the first main surface of the first substrate; aligning the first substrate and the second substrate so that the plurality of rows of grooves of the first substrate and the through holes provided in the second substrate face each other, and curing the second adhesive; and curing the first adhesive after curing the second adhesive. a first position surrounding at least one of the rows of grooves of the first substrate that is not an end of the second direction when the first main surface is viewed in a plane; a second position surrounding at least one of the rows of grooves of the first substrate that is not an end of the second direction when the first main surface is viewed in a plane; and a second position extending along the longitudinal direction of the groove and located outside a groove that is an end of the second direction when the first main surface is viewed in a plane; and a modulus of elasticity of the second adhesive after hardening is greater than a modulus of elasticity of the first adhesive after hardening.

[0008] A second aspect of the present invention is a liquid ejection head comprising: a first substrate having a first main surface on which a plurality of rows of grooves are formed; a second substrate having a plurality of through holes, which are liquid ejection ports, arranged in a matrix when the main surface is viewed in plan; and a first connecting member and a second connecting member connecting the first substrate and the second substrate, wherein the plurality of through holes formed in the second substrate face the plurality of rows of grooves formed in the first substrate; and in the first main surface of the first substrate, a longitudinal direction of each of the plurality of rows of grooves is along a first direction, and the plurality of rows of grooves is along a second direction intersecting the first direction. the first connecting member connects the first main surface and the main surface so as to surround at least those grooves of the plurality of rows of grooves of the first substrate that are not located at the ends in the second direction, and the second connecting member connects the first main surface and the main surface along the longitudinal direction of the grooves, outward of those grooves of the plurality of rows of grooves of the first substrate that are located at the ends in the second direction, when the first main surface is viewed in a plane, and the elastic modulus of the second connecting member is greater than that of the first connecting member. [Effects of the Invention]

[0009] According to the present invention, a high yield can be achieved when manufacturing a liquid ejection head by bonding an orifice plate having low mechanical strength to a flow path substrate on which an ink flow path is formed. Also, a liquid ejection head can be provided in which the orifice plate has high flatness and mechanical strength is ensured. [Brief explanation of the drawings]

[0010] [Figure 1] 1(a) is a plan view of the liquid ejection head according to Embodiment 1, seen from the ejection port side, and FIG. 1(b) is a schematic cross-sectional view of the liquid ejection head taken along line AA' in FIG. [Figure 2] (a) A plan view of a flow path substrate with an adhesive applied, viewed from a direction perpendicular to the main surface on which grooves are formed. (b) A plan view of an orifice plate, viewed from a direction perpendicular to the main surface. [Figure 3](a) A schematic cross-sectional view showing a third stage of the manufacturing process, (b) a schematic cross-sectional view showing a fourth stage of the manufacturing process, and (c) a schematic cross-sectional view showing a state after a fifth stage of the manufacturing process is completed. [Figure 4] 4(a) is a plan view of a liquid ejection head according to embodiment 2, seen from the ejection port side, and FIG. 4(b) is a schematic cross-sectional view of the liquid ejection head taken along line BB' in FIG. [Figure 5] FIG. 10 is a plan view of a channel substrate to which an adhesive is applied in a second embodiment, viewed from a direction perpendicular to the main surface on which grooves are formed. [Figure 6] 6(a) is a plan view of a liquid ejection head according to embodiment 3, seen from the ejection port side, and FIG. 6(b) is a schematic cross-sectional view of the liquid ejection head taken along line CC' in FIG. [Figure 7] FIG. 11 is a plan view of a channel substrate to which an adhesive is applied in a third embodiment, viewed from a direction perpendicular to the main surface on which grooves are formed. [Figure 8] 10(a) is a schematic top view of a liquid ejection device according to Embodiment 4. FIG. 10(b) is a schematic side view of a liquid ejection device according to Embodiment 4. DETAILED DESCRIPTION OF THE INVENTION

[0011] A liquid ejection head according to an embodiment of the present invention, a method for manufacturing a liquid ejection head, etc. will be described with reference to the drawings. Note that the following embodiment is merely an example, and those skilled in the art can appropriately modify and implement the detailed configuration, for example, without departing from the spirit of the present invention.

[0012] In the drawings referred to in the following description of the embodiments and examples, elements denoted by the same reference numerals have the same functions unless otherwise specified. When a plurality of identical elements are arranged in a drawing, the reference numerals and their descriptions may be omitted.

[0013] In addition, because the drawings may be represented schematically for the convenience of illustration and explanation, the shape, size, and arrangement of elements depicted in the drawings may not strictly correspond to the actual objects. Furthermore, the descriptions "XX or more and YY or less" and "XX to YY" that represent a numerical range mean a numerical range including the endpoints XX (lower limit) and YY (upper limit), unless otherwise specified. When a numerical range is described in stages, the upper and lower limits of each numerical range can be arbitrarily combined.

[0014] In the following description, for example, when "X plus direction" is written, it refers to the same direction as the X axis arrow in the coordinate system shown, and when "X minus direction" is written, it refers to the direction 180 degrees opposite to the direction of the X axis arrow in the coordinate system shown. Also, when simply written as "X direction," it refers to the direction parallel to the X axis, regardless of whether it is different from the direction of the X axis arrow in the drawings. The same applies to directions other than X.

[0015] In addition, in this specification, the term "main component" refers to the component that is the largest in weight when the object is made up of multiple components (materials), meaning that the component in question accounts for 50% or more by weight.

[0016] In this specification, the liquid handled by the liquid ejection head may be referred to as "ink." However, the ink according to the embodiment is not limited to a liquid containing a recording material for forming characters or images. For example, the ink may be a liquid containing a functional material for forming a functional thin film such as an electrode or an optical filter, or a functional element such as an organic electroluminescence (EL) element. It may also be a liquid containing an insoluble solid component. Furthermore, the term "recording" may be used to refer to the application of a liquid to an object, but this does not necessarily mean recording information such as characters or images. For example, this term also includes the application of a liquid to an object to manufacture an article such as a functional thin film, a functional element, or a three-dimensional object. Furthermore, the object to which the liquid is applied may be referred to as a "recording medium." However, this term is not limited to a medium for recording information such as characters or images, but may also include components (e.g., substrates) that serve as base materials for manufacturing articles such as a functional thin film, a functional element, or a three-dimensional object.

[0017] [Embodiment 1] Fig. 1(a) is a plan view of a liquid ejection head 100 according to embodiment 1, seen from the ejection port side, and Fig. 1(b) is a schematic cross-sectional view of the liquid ejection head 100 taken along line AA' in Fig. 1(a).

[0018] The liquid ejection head 100 includes a flow path substrate 101, an example of a first substrate, on which multiple rows of grooves 105 are formed to form liquid flow paths, and an orifice plate 106, an example of a second substrate, on which multiple through holes 107, which form liquid ejection ports, are arranged in a matrix. The flow path substrate 101 and the orifice plate 106 are arranged so that each of the multiple through holes 107 faces one of the multiple rows of grooves 105, and are connected by a connecting member 103S (first connecting member) and a connecting member 102S (second connecting member). For convenience of illustration, five grooves 105 and 5 x 5 through holes 107 are shown, but the number and arrangement of the grooves and through holes are not limited to the illustrated example.

[0019] The orifice plate 106 (second substrate) is a member that constitutes the top plate of the pressure chamber that imparts ejection energy to the liquid, and is provided with a plurality of through-holes 107 that serve as liquid ejection ports. In order to form the through-holes precisely, a thin substrate such as a silicon wafer is used as the base material of the orifice plate 106. Because of its thin thickness and the provision of the plurality of through-holes 107, the orifice plate 106 can be said to be a member with low mechanical strength.

[0020] The flow path substrate 101 (first substrate) is provided with an energy generating element (e.g., a piezoelectric element) (not shown), which can apply energy to the liquid (ink) to eject it from the ejection orifices. The energy generating element is not limited to a piezoelectric element. Any other element capable of applying ejection energy to the liquid (ink), such as an electrothermal conversion element (heater), may be used. Grooves 105, which are ink flow paths, function as supply paths that supply liquid to multiple through-holes 107, which are liquid ejection orifices. The grooves 105 communicate with a common liquid chamber (not shown) and can receive a supply of liquid (ink) from the common liquid chamber. While FIG. 1(b) shows the flow path substrate 101 as a schematic single substrate, it may also be a substrate to which multiple components are bonded to form a liquid flow path structure. The flow path substrate 101 is thicker than the orifice plate 106 to form grooves that serve as common ink flow paths with sufficient depth. The flow path substrate 101 can be made of a metal or alloy material, such as invar or martensitic stainless steel. Therefore, it can be said that the flow path substrate 101 is a member having greater mechanical strength than the orifice plate 106.

[0021] In order to prevent the liquid ejection head 100 from being damaged or deformed due to differences in thermal stress in each part when the temperature changes, it is desirable that the orifice plate 106 and the flow path substrate 101 be made of materials with approximately the same thermal expansion coefficient (close enough to be considered substantially equal). For example, when silicon is used as the base material for the orifice plate 106, which requires high-precision processing, it is preferable that the flow path substrate 101 be made of Invar material or silicon.

[0022] As will be apparent from the manufacturing method described below, the connecting member 103S (first connecting member) and the connecting member 102S (second connecting member) are elastic members formed by hardening an adhesive sandwiched between the flow path substrate 101 and the orifice plate 106.

[0023] The connecting members 103S and 102S ensure the mechanical strength of the liquid ejection head 100 and are arranged to prevent ink from leaking from between the flow path substrate 101 and the orifice plate 106. In other words, when the liquid ejection head 100 is seen through from a direction perpendicular to the main surface of the orifice plate 106 (Z direction), the connecting members 103S and 102S are arranged so that the periphery of each groove 105 is surrounded by the connecting members.

[0024] In the liquid ejection head according to this embodiment, the connecting member 102S is made of a material having a greater modulus of elasticity (flexural modulus) than the connecting member 103S. As a suitable example, the connecting member 102S is made of a material having a modulus of elasticity (room temperature) of 5 GPa or more and 15 GPa or less, and the connecting member 103S is made of a material having a modulus of elasticity (room temperature) of 2 GPa or more and 4 GPa or less. The modulus of elasticity of the connecting member 102S is preferably two to four times the modulus of elasticity of the connecting member 103S.

[0025] The portion of the liquid ejection head 100 that is most susceptible to external forces is the portion located on the outside when the liquid ejection head 100 is viewed from a direction (Z direction) perpendicular to the main surface of the orifice plate 106. In this embodiment, a connecting member 102S with a high modulus of elasticity (flexural modulus of elasticity) is disposed in this portion (second position). Therefore, even if some external force is applied, it is possible to prevent the orifice plate 106, which has low mechanical strength, from being damaged by excessive force.

[0026] Furthermore, when viewing the liquid ejection head 100 from a direction (Z direction) perpendicular to the main surface of the orifice plate 106, the portion of the liquid ejection head 100 where internal stress is likely to occur can be said to be a portion located on the inside. For example, depending on the pattern of ink ejection from each ejection port, the temperature distribution near the energy generating elements varies, which can cause local thermal expansion of the orifice plate 106 or the flow path substrate 101. If the connecting member located on the inside has a large elastic modulus, when such thermal stress occurs inside the liquid ejection head 100, the connecting member has difficulty absorbing the stress, and excessive stress may concentrate on the orifice plate 106, which has low mechanical strength, resulting in damage. According to this embodiment, the connecting member 103S, which has a low elastic modulus (flexural modulus), is located on the inside (first position). This connecting member 103S deforms to absorb the stress, thereby reducing the possibility of excessive force being applied to the orifice plate 106 and causing damage. Next, a method for manufacturing the liquid ejection head 100 according to the first embodiment will be described.

[0027] (Method of manufacturing a liquid ejection head) First, in the first step, a flow path substrate 101 (first substrate) is prepared, on which multiple rows of grooves 105 that serve as ink flow paths are formed, and an orifice plate 106 (second substrate) on which multiple through holes 107 that serve as ink ejection ports are arranged in a matrix.

[0028] The flow path substrate 101 can be fabricated, for example, by forming grooves 105 in a base material made of metal Invar, and then depositing a 15 μm film of parylene to form the protective layer 104 over the entire base material. Invar is preferably used as the base material for the flow path substrate 101, but stainless steel, particularly martensitic SUS, Kovar, and other alloys may also be used depending on the thermal expansion coefficient compatibility with the material used for the orifice plate 106. Furthermore, the material for the protective layer 104 is not necessarily limited to parylene, and SiO2, TiO2, TaN, and the like may also be used as long as it can prevent the elution of the metal from the base material.

[0029] 2(b) shows a plan view of the orifice plate 106 viewed from a direction perpendicular to the main surface (along the negative Z direction). The orifice plate 106 is fabricated, for example, by forming a plurality of through-holes 107 arranged in a matrix in a silicon chip. After forming the through-holes 107 corresponding to the plurality of orifice plates 106 in a silicon wafer using photolithography and etching, the individual orifice plates 106 may be cut out by dicing.

[0030] Next, in the second step, an adhesive, which is a raw material of the connection member, is applied to the flow path substrate 101. In the following description, unless otherwise specified, the term "adhesive" refers to a substance used for adhesion that is uncured and has viscosity or fluidity. In this embodiment, an adhesive that has fluidity or viscosity at room temperature but hardens when heated or exposed to light and reaches a high temperature when hardened, such as a thermosetting adhesive or a UV-curing adhesive, is used. In particular, a thermosetting adhesive is preferably used.

[0031] 2(a) shows a plan view of the flow path substrate 101 to which an adhesive has been applied, viewed from a direction perpendicular to the main surface on which the grooves 105 are formed (i.e., along the minus Z direction). In the plan view, the longitudinal direction of the grooves 105 is defined as a first direction, and the direction in which the multiple grooves 105 are arranged is defined as a second direction. The first and second directions intersect (orthogonal in this example).

[0032] Among the multiple grooves 105, grooves that are not located at the end of the flow path substrate 101 in the second direction (in this example, the three inner grooves) are surrounded by adhesive 103F (first adhesive). The position where adhesive 103F is formed may be referred to as a first position. Furthermore, grooves located at the end of the flow path substrate 101 in the second direction are surrounded by adhesive 102F (second adhesive) and adhesive 103F (first adhesive). That is, in a plan view, adhesive 102F is provided along the outer long sides and short sides of the groove, and adhesive 103F is provided along the inner long side of the groove. The position where adhesive 102F is formed may be referred to as a second position. To prevent ink from leaking from gaps in the adhesive around grooves located at the end, adhesive 102F and adhesive 103F are connected to surround the grooves located at the end.

[0033] The adhesive 102F and the adhesive 103F can be applied to the main surface (first main surface) of the flow path substrate 101 on which the groove 105 is formed, in a pattern with a width of 1 mm and a thickness of 60 μm, for example, using a dispenser.

[0034] The adhesive used in this embodiment is an ink-resistant material that is less likely to deteriorate even when it comes into contact with ink after curing. Furthermore, the combination of adhesives is selected so that, when comparing the elastic modulus (flexural modulus) after curing, adhesive 102F has a greater elastic modulus than adhesive 103F. As a preferred example, adhesive 102F is made of a material with an elastic modulus (at room temperature, e.g., 25°C ± 2°C) of 5 GPa or more and 15 GPa or less after curing, and adhesive 103F is made of a material with an elastic modulus (at room temperature, e.g., 2 GPa or more and 4 GPa or less after curing). It is desirable that the elastic modulus of adhesive 102F after curing be at least two times and not more than four times the elastic modulus of adhesive 103F after curing.

[0035] As a specific example, CV5314 manufactured by Panasonic Industries Co., Ltd. can be used as thermosetting adhesive 102F, and CV5313 manufactured by Panasonic Industries Co., Ltd. can be used as thermosetting adhesive 103F. The specifications of CV5314 published by Panasonic Industries Co., Ltd. are that the flexural modulus after curing is 7 GPa, the recommended curing temperature is 120°C, and the viscosity (25°C) is 130 Pa·s. The specifications of CV5313 are that the flexural modulus after curing is 3 GPa, the recommended curing temperature is 120°C, and the viscosity (25°C) is 2 Pa·s.

[0036] The elastic modulus of the adhesive after curing can be measured, for example, using a DMA (dynamic mechanical analyzer) according to the following method. A predetermined amount (e.g., 1.5 ml) of adhesive is dropped between two fluororesin substrates (e.g., Teflon (registered trademark)), and a load is applied uniformly via a 500 μm-thick spacer to spread the adhesive. In this state, the adhesive is heated to a predetermined curing temperature (e.g., 120°C for 1 hour) to produce a sheet in which the adhesive is cured. The sheet is cut to a predetermined size (e.g., 10 mm × 30 mm × 0.5 mm) to prepare a measurement sample. A tensile test is performed with the top and bottom of this sample fixed. The measured values ​​include the storage modulus, loss modulus, and loss tangent calculated from these. In this embodiment, the measured storage modulus at room temperature (25°C) is used as the elastic modulus after curing.

[0037] Next, in the third step, the flow path substrate 101 to which the adhesive has been applied and the orifice plate 106 are aligned so that they face each other. As shown in the schematic cross-sectional view of FIG. 3(a), the flow path substrate 101 (first substrate) and the orifice plate 106 (second substrate) are aligned in the XY plane so that the rows of grooves 105 face the through-holes 107. Then, while maintaining the parallelism between the main surface of the flow path substrate 101 (first substrate) and the main surface of the orifice plate 106 (second substrate), the distance in the Z direction is reduced until the adhesives 102F and 103F come into contact with the lower surface of the orifice plate 106.

[0038] Next, in the fourth step, the adhesive 102F located on the outer side in the second direction in plan view is selectively cured. For example, the adhesive 102F is locally heated using a spot heater (a halogen heater capable of localized heating) or a laser light source, and the adhesive 102F is cured.

[0039] FIG. 3(b) is a schematic cross-sectional view showing the state at the end of the fourth stage. The adhesive 102F has hardened to form the connecting member 102S, but the adhesive 103F remains unhardened. The adhesive 102F shrinks as it hardens to form the connecting member 102S, so the distance between the flow path substrate 101 and the orifice plate 106 becomes closer than in the third stage. At this time, the adhesive 103F is deformable in its unhardened state, so the main surfaces of the flow path substrate 101 and the orifice plate 106 maintain a high degree of flatness, and the two main surfaces maintain a high degree of parallelism. In this position and orientation, the flow path substrate 101 and the orifice plate 106 are fixed by the connecting member 102S, which has a high elastic modulus.

[0040] Next, in the fifth step, the uncured adhesive 103F located on the inner side in the second direction in plan view is cured. While applying pressure from a direction perpendicular to the main surface, the vicinity of the uncured adhesive 103F may be locally heated, or the entire flow path substrate 101 and orifice plate 106 may be heated. At this time, the flow path substrate 101 and the orifice plate 106 are already fixed by the connecting member 102S, which has a high elastic modulus. Therefore, even if pressure is applied during the process of curing the adhesive 103F, the positions and orientations of the flow path substrate 101 and the orifice plate 106 will not shift. Figure 3(c) is a schematic cross-sectional view showing the state in which the adhesive 103F has cured to become the connecting member 103S and the liquid ejection head 100 is completed.

[0041] As the adhesive 103F hardens, it shrinks toward its center of gravity. However, because the adhesive 103F is thin, the amount of shrinkage in the Z direction is small, and the impact on the planarity of the main surfaces of the flow path substrate 101 and the orifice plate 106 is minimal. Even if a force is applied that shortens the distance between the flow path substrate 101 and the orifice plate 106 in the Z direction due to the shrinkage of the adhesive 103F, the connecting member 103S after the adhesive 103F hardens is made of a material with a low elastic modulus. Therefore, the main surfaces of the flow path substrate 101 and the orifice plate 106 maintain high planarity and maintain a high degree of parallelism between the two main surfaces. Even when the pressure is removed after the adhesive 103F hardens, the connecting member 103S with a low elastic modulus easily deforms, preventing excessive force from being continuously applied to the orifice plate 106, which has low mechanical strength. This prevents damage to the orifice plate 106 and improves the manufacturing yield of the liquid ejection head 100. According to this embodiment, the main surface of the orifice plate 106 maintains a high degree of flatness, so that the ejection direction of droplets from each ejection port is uniform, making it possible to provide an ejection head with high recording quality.

[0042] In the above manufacturing method, one liquid ejection head is fabricated by bonding one flow path substrate 101 and one orifice plate 106 together, but other methods may be used in consideration of mass production. For example, multiple flow path substrates 101 may be bonded to a single silicon wafer on which multiple orifice plates 106 are formed using an adhesive, and then the wafer may be diced to separate the individual liquid ejection heads. In this case, it goes without saying that the individual flow path substrates 101 are bonded by applying two different types of adhesive with different elastic moduli after hardening, as in the above-described embodiment. According to this embodiment, a connecting member with a high elastic modulus is disposed near the dicing line (the boundary between the liquid ejection heads), thereby reducing the possibility of the orifice plate, which has weak mechanical strength, being damaged by excessive external force during dicing.

[0043] [Comparative form 1] Comparative Example 1 will be described. Explanation of matters common to Example 1 may be simplified or omitted. In Example 1, an orifice plate and a flow path substrate are bonded together using an adhesive with a high elastic modulus after curing and an adhesive with a low elastic modulus after curing, to manufacture a liquid ejection head. The liquid ejection head according to Example 1 has a structure in which the orifice plate and the flow path substrate are connected by a connecting member with a high elastic modulus and a connecting member with a low elastic modulus. In contrast to this, in Comparative Example 1, the orifice plate and the flow path substrate were bonded together using only an adhesive with a large elastic modulus after hardening, and a liquid ejection head was manufactured.

[0044] First, similar to the first step in the manufacturing method of embodiment 1, a flow path substrate having multiple rows of grooves 105 formed thereon to serve as ink flow paths, and an orifice plate having multiple through holes arranged in a matrix to serve as ink ejection ports are prepared.

[0045] In the subsequent second stage, in comparative form 1, a thermosetting adhesive having an elastic modulus after hardening of 10 GPa was placed at both the positions where adhesive 102F and adhesive 103F were placed in Figure 2(a) referred to in the description of embodiment 1. In the subsequent third stage, in Comparative Example 1, the same locations as in Example 1 were locally heated to cure part of the thermosetting adhesive. In the subsequent fourth step, in Comparative Example 1, the uncured adhesive was heated and cured by the same heating method as in the first embodiment. In Comparative Example 1, damage to the orifice plate occurred in the third or fourth stage, and the manufacturing yield was lower than that of the First Embodiment.

[0046] [Comparative form 2] Comparative Example 2 will be described. Explanation of matters common to Example 1 may be simplified or omitted. In Example 1, an orifice plate and a flow path substrate are bonded together using an adhesive with a high elastic modulus after curing and an adhesive with a low elastic modulus after curing, to manufacture a liquid ejection head. The liquid ejection head according to Example 1 has a structure in which the orifice plate and the flow path substrate are connected by a connecting member with a high elastic modulus and a connecting member with a low elastic modulus. In contrast to this, in Comparative Example 2, the orifice plate and the flow path substrate were bonded together using only an adhesive with a small modulus of elasticity after hardening, and a liquid ejection head was manufactured.

[0047] First, similar to the first step in the manufacturing method of embodiment 1, a flow path substrate having multiple rows of grooves 105 formed thereon to serve as ink flow paths, and an orifice plate having multiple through holes arranged in a matrix to serve as ink ejection ports are prepared.

[0048] In the subsequent second stage, in comparative form 2, a thermosetting adhesive with an elastic modulus after hardening of 3 GPa was placed at both the positions where adhesive 102F and adhesive 103F were placed in Figure 2(a) referred to in the description of embodiment 1. In the subsequent third stage, in Comparative Example 2, the same location as in Example 1 was locally heated to cure part of the thermosetting adhesive. In the subsequent fourth step, in Comparative Example 2, the uncured adhesive was heated and cured by the same heating method as in Example 1.

[0049] In Comparative Example 2, the elastic modulus of the connecting member formed in the peripheral portion in the third stage was small, resulting in weak fixing strength. Therefore, when heated under pressure in the fourth stage, the positions of the orifice plate and the flow path substrate were unstable and could shift. As a result, the shape of the completed liquid ejection head did not meet the specifications, resulting in a lower manufacturing yield than in Example 1. Even when a liquid ejection head was manufactured whose shape met the specifications, the elastic modulus of the connecting member arranged in a portion susceptible to external force was smaller than in Example 1. Therefore, when some external force was applied, excessive force was applied to the orifice plate, which has low mechanical strength, resulting in damage more frequently than in Example 1.

[0050] [Embodiment 2] A liquid ejection head according to embodiment 2 and a manufacturing method thereof will be described. Descriptions of matters common to embodiment 1 may be simplified or omitted. In embodiment 1, an orifice plate and a flow path substrate are bonded together using an adhesive with a high elastic modulus after curing and an adhesive with a low elastic modulus after curing to manufacture the liquid ejection head. The liquid ejection head according to embodiment 1 has a structure in which the orifice plate and the flow path substrate are connected by a connecting member with a high elastic modulus and a connecting member with a low elastic modulus. In these respects, embodiment 2 is common to embodiment 1, but differs in that the manufacturing method according to embodiment 2 uses an adhesive containing inorganic particles as the adhesive with a low elastic modulus after curing. Furthermore, the connecting member with a low elastic modulus provided in the liquid ejection head according to embodiment 2 differs from embodiment 1 in that it contains inorganic particles.

[0051] Fig. 4(a) is a plan view of the liquid ejection head 100A according to embodiment 2, seen from the ejection port side, and Fig. 4(b) is a schematic cross-sectional view of the liquid ejection head 100A taken along line BB' in Fig. 4(a).

[0052] As in the first embodiment, the liquid ejection head 100A includes a flow path substrate 101 (first substrate) having multiple rows of grooves 105 formed therein to serve as ink flow paths, and an orifice plate 106 (second substrate) having multiple through holes 107 arranged in a matrix to serve as ink ejection ports. The flow path substrate 101 and the orifice plate 106 may be similar to those in the first embodiment. The flow path substrate 101 and the orifice plate 106 are arranged such that each of the multiple through holes 107 faces one of the multiple rows of grooves 105, and are connected by a connecting member 103S (first connecting member) and a connecting member 102S (second connecting member). For convenience of illustration, five grooves 105 and 5 × 5 through holes 107 are shown, but the number and arrangement of the grooves and through holes are not limited to the illustrated example.

[0053] As will be apparent from the manufacturing method described below, the connecting member 203S (first connecting member) and the connecting member 102S (second connecting member) are elastic members formed by curing an adhesive sandwiched between the flow path substrate 101 and the orifice plate 106. The liquid ejection head 100A according to the second embodiment differs from the first embodiment in that, instead of the connecting member 103S provided in the liquid ejection head 100 according to the first embodiment, the liquid ejection head 100A according to the second embodiment is provided with a connecting member 203S that has a small overall elastic modulus but contains inorganic particles FP.

[0054] The liquid ejection head 100A of embodiment 2 is manufactured using procedures similar to the steps of the manufacturing method of embodiment 1, but the adhesive applied to the flow path substrate 101 in the second step is different between embodiment 1 and embodiment 2.

[0055] 5 shows a plan view of the flow path substrate 101 to which adhesive has been applied in the second stage of the manufacturing procedure, viewed from a direction perpendicular to the main surface on which the grooves 105 are formed (along the minus Z direction). In the plan view, the longitudinal direction of the grooves 105 is defined as a first direction, and the direction in which the multiple grooves 105 are arranged is defined as a second direction. The first and second directions intersect (orthogonal in this example).

[0056] Among the multiple grooves 105, grooves that are not located at the end of the flow path substrate 101 in the second direction (three grooves in this example) are surrounded by adhesive 203F (first adhesive). The position where adhesive 203F is formed may be referred to as a first position. Furthermore, grooves located at the end of the flow path substrate 101 in the second direction are surrounded by adhesive 102F (second adhesive) and adhesive 203F (first adhesive). That is, adhesive 102F is provided along the long and short sides of the groove outside the groove in a plan view, and adhesive 203F is provided along the long sides of the groove inside the groove in a plan view. The position where adhesive 102F is formed may be referred to as a second position. To prevent ink from leaking from gaps in the adhesive around grooves located at the end, adhesive 102F and adhesive 203F are connected and surround the groove.

[0057] The adhesive 102F and the adhesive 203F can be applied, for example, using a dispenser to the main surface (first main surface) of the flow path substrate 101 on the side where the groove 105 is formed, in a pattern with a width of 1 mm and a thickness of 70 μm.

[0058] The adhesive used in this embodiment is an ink-resistant material that is unlikely to deteriorate even when it comes into contact with ink after hardening. Furthermore, the combination of adhesives is selected so that, when comparing the elastic modulus (flexural modulus) after hardening, adhesive 102F has a greater elastic modulus than adhesive 203F. As a suitable example, a material with an elastic modulus of 5 GPa to 15 GPa after hardening is used for adhesive 102F, and a material with an elastic modulus of 2 GPa to 4 GPa after hardening is used for adhesive 203F.

[0059] The adhesive 102F used in this embodiment is the same as the adhesive 102F used in embodiment 1. On the other hand, the adhesive 203F used in this embodiment is the adhesive 103F used in embodiment 1 with an appropriate amount of inorganic particles FP dispersed therein.

[0060] As the inorganic particles FP, for example, SiO2 beads with an average particle size of 30 μm are preferably used, but inorganic particles mainly composed of other inorganic materials, such as TiO2 beads, may also be used. Thermosetting or UV-curable adhesives reach high temperatures when cured, and in order to prevent the particles from eluting or deforming, inorganic particles selected from the group consisting of glass beads, alumina, and titanium are preferably used. However, particles made of materials other than those listed above may also be used as long as they do not elute or deform even in the high-temperature environment of the adhesive curing process. The inorganic particles FP are contained in the adhesive 203F at a density of 10 particles / mm 3 ~20 pieces / mm 3 In the connection member 102S after the adhesive 102F has hardened, when viewed from a direction perpendicular to the main surface of the orifice plate 106, the inorganic particles FP are dispersed at a density of 10 particles / mm 2 ~20 pieces / mm 2 It is preferable that the inorganic particles FP are dispersed at a density of 1000 to 15000. For convenience of illustration, the size and arrangement of the inorganic particles FP are shown schematically in Fig. 4(b) and Fig. 5.

[0061] In the third stage of the manufacturing method according to this embodiment, the flow path substrate 101 to which the adhesive has been applied and the orifice plate 106 are aligned so that they face each other. The flow path substrate 101 (first substrate) and the orifice plate 106 (second substrate) are aligned in the XY plane so that the rows of grooves 105 face the through holes 107. Then, while maintaining the parallelism between the main surface of the flow path substrate 101 (first substrate) and the main surface of the orifice plate 106 (second substrate), the distance in the Z direction is reduced until the adhesives 102F and 203F come into contact with the lower surface of the orifice plate 106.

[0062] The shortening of the distance in the Z direction is preferably completed before the inorganic particles FP dispersed in the adhesive 203F come into contact with both the flow path substrate 101 and the orifice plate 106. In a state in which the inorganic particles FP come into contact with both, they function as spacers that determine the distance between the flow path substrate 101 and the orifice plate 106, which may cause problems when selectively curing the adhesive 102F in the fourth stage. In a state in which the inorganic particles FP function as spacers, they are in point contact with the orifice plate, but if the adhesive 102F shrinks in the fourth stage, stress may be concentrated on the orifice plate, which has low mechanical strength, causing it to break.

[0063] Next, in the fourth step, the adhesive 102F located on the outer side in the second direction in plan view is selectively cured to form the connection member 102S.

[0064] Then, in the fifth step, the uncured adhesive 103F located on the inner side in the second direction in plan view is cured. While applying pressure from a direction perpendicular to the main surface, the vicinity of the uncured adhesive 203F may be locally heated, or the entire flow path substrate 101 and orifice plate 106 may be heated. At this time, the flow path substrate 101 and the orifice plate 106 are already fixed by the connecting member 102S, which has a high elastic modulus. Therefore, even if pressure is applied during the process of curing the adhesive 203F, the positions and orientations of the flow path substrate 101 and the orifice plate 106 will not shift. Figure 4(b) is a schematic cross-sectional view of the liquid ejection head 100A after the adhesive 203F has cured and become the connecting member 203S.

[0065] The adhesive 203F shrinks toward its center of gravity during the curing process. However, because the adhesive 203F is thin and contains inorganic particles FP that do not shrink, its shrinkage rate (volume change) is smaller than that of the adhesive 103F used in embodiment 1. Therefore, the change in the distance in the Z direction is small, and the impact on the planarity of the main surfaces of the flow path substrate 101 and the orifice plate 106 is minimal. Even if a force is applied that shortens the distance between the flow path substrate 101 and the orifice plate 106 in the Z direction due to the shrinkage of the adhesive 203F, the connecting member 203S after the adhesive 203F has cured is mainly composed of a material with a low elastic modulus. Therefore, the main surfaces of the flow path substrate 101 and the orifice plate 106 maintain a high degree of planarity, and the parallelism of the two main surfaces is maintained. Even when the pressure is removed after the adhesive 203F has cured, the connecting member 203S with a low elastic modulus easily deforms, preventing excessive force from being continuously applied to the orifice plate 106, which has low mechanical strength. This prevents damage to the orifice plate 106 and improves the manufacturing yield of the liquid ejection head 100 A. According to this embodiment, the main surface of the orifice plate 106 maintains a high degree of flatness, so that the ejection directions of the ejection ports are aligned, making it possible to provide an ejection head with high recording quality.

[0066] In the fifth stage, heating while applying an appropriate amount of pressure allows the adhesive 203F to harden while the inorganic particles FP are in contact with both the flow path substrate 101 and the orifice plate 106, i.e., functioning as spacers. Alternatively, heating with a lower pressure intensity than the former allows the adhesive 203F to harden while the inorganic particles FP are not in contact with either the flow path substrate 101 or the orifice plate 106. In the former case, the main surface of the orifice plate 106 is fixed while maintaining extremely high flatness, thereby aligning the ejection directions of the ejection ports and enabling the manufacture of an ejection head with high recording quality. In the latter case, even if an external force or internal stress is applied to warp the orifice plate 106, the low-elasticity portions interposed between the inorganic particles FP and the flow path substrate 101 or between the inorganic particles FP and the orifice plate 106 can absorb the force. This allows the manufacture of an ejection head with high durability and reliability.

[0067] [Embodiment 3] A liquid ejection head according to embodiment 3 and a manufacturing method thereof will be described. Descriptions of matters common to embodiment 1 may be simplified or omitted. In embodiment 1, a liquid ejection head is manufactured by bonding an orifice plate and a flow path substrate using an adhesive having a high elastic modulus after curing and an adhesive having a low elastic modulus after curing. The liquid ejection head according to embodiment 1 has a structure in which the orifice plate and the flow path substrate are connected by a connecting member having a high elastic modulus and a connecting member having a low elastic modulus. In these respects, embodiment 3 is common to embodiment 1, but the manufacturing method according to embodiment 3 differs in the positions on the flow path substrate where the adhesive having a low elastic modulus after curing and the adhesive having a low elastic modulus after curing are provided. Furthermore, the liquid ejection head according to embodiment 3 differs from embodiment 1 in the positions where the connecting member having a high elastic modulus and the connecting member having a low elastic modulus are provided.

[0068] Fig. 6(a) is a plan view of the liquid ejection head 100B according to embodiment 3, seen from the ejection port side, and Fig. 6(b) is a schematic cross-sectional view of the liquid ejection head 100B taken along line CC' in Fig. 6(a).

[0069] As in the first embodiment, the liquid ejection head 100B includes a flow path substrate 101 (first substrate) on which multiple rows of grooves 105 serving as ink flow paths are formed, and an orifice plate 106 (second substrate) on which multiple through holes 107 serving as ink ejection ports are arranged in a matrix. The flow path substrate 101 and the orifice plate 106 may be the same as those in the first embodiment. The flow path substrate 101 and the orifice plate 106 are arranged such that each of the multiple through holes 107 faces one of the multiple rows of grooves 105, and are connected by a connecting member 303S (first connecting member) and a connecting member 302S (second connecting member). For convenience of illustration, five grooves 105 and 5 × 5 through holes 107 are shown, but the number and arrangement of the grooves and through holes are not limited to the illustrated example.

[0070] As will be apparent from the manufacturing method described below, the connecting member 303S (first connecting member) and the connecting member 302S (second connecting member) are elastic members formed by curing an adhesive sandwiched between the flow path substrate 101 and the orifice plate 106. The connecting member 303S (first connecting member) is a connecting member with a small elastic modulus, and the connecting member 302S (second connecting member) is a connecting member with a large elastic modulus. As a suitable example, the connecting member 302S is made of a material with an elastic modulus of 5 GPa to 15 GPa, and the connecting member 303S is made of a material with an elastic modulus of 2 GPa to 4 GPa.

[0071] In the third embodiment, when the liquid ejection head 100B is seen through from a direction perpendicular to the main surface of the orifice plate 106, each of the grooves 105 is surrounded by a connecting member 303S having a small elastic modulus. Then, a connecting member 302S having a large elastic modulus is arranged along the longitudinal direction of the groove outside the connecting member 303S surrounding the groove 105 located at the end in the second direction.

[0072] The liquid ejection head 100B of embodiment 3 is manufactured by procedures similar to the steps of the manufacturing method of embodiment 1, but the position (pattern) at which adhesive is applied to the flow path substrate 101 in the second step is different from that of embodiment 1.

[0073] 7 shows a plan view of the flow path substrate 101 to which adhesive has been applied in the second stage of the manufacturing procedure, viewed from a direction perpendicular to the main surface on which the grooves 105 are formed (along the minus Z direction). In the plan view, the longitudinal direction of the grooves 105 is defined as a first direction, and the direction in which the multiple grooves 105 are arranged is defined as a second direction. The first and second directions intersect (orthogonal in this example).

[0074] Each of the multiple grooves 105 is surrounded by adhesive 303F (first adhesive). To prevent ink from leaking through gaps in the adhesive around each groove, adhesive 303F surrounds each groove without any gaps. The position where adhesive 303F is formed may be referred to as a first position. Furthermore, adhesive 302F (second adhesive) is formed outside adhesive 303F surrounding grooves 105 located at the end of the flow path substrate 101 in the second direction. In other words, adhesive 302F is provided along the long side of each groove outside the groove in plan view. The position where adhesive 302F is formed may be referred to as a second position.

[0075] The adhesive 302F and the adhesive 303F can be applied, for example, to the main surface (first main surface) of the flow path substrate 101 on which the groove 105 is formed, in a pattern with a width of 1 mm and a thickness of 60 μm using a dispenser.

[0076] The adhesive used in this embodiment is an ink-resistant material that is unlikely to deteriorate even when it comes into contact with ink after hardening. Furthermore, the combination of adhesives is selected so that, when comparing the elastic modulus (flexural modulus) after hardening, adhesive 302F has a greater elastic modulus than adhesive 303F. As a suitable example, a material with an elastic modulus of 5 GPa to 15 GPa after hardening is used for adhesive 302F, and a material with an elastic modulus of 2 GPa to 4 GPa after hardening is used for adhesive 303F.

[0077] In the third stage of the manufacturing method according to this embodiment, the flow path substrate 101 to which the adhesive has been applied and the orifice plate 106 are aligned so that they face each other. The flow path substrate 101 (first substrate) and the orifice plate 106 (second substrate) are aligned in the XY plane so that the rows of grooves 105 face the through holes 107. Then, while maintaining the parallelism between the main surface of the flow path substrate 101 (first substrate) and the main surface of the orifice plate 106 (second substrate), the distance in the Z direction is reduced until the adhesives 302F and 303F come into contact with the lower surface of the orifice plate 106. Next, in a fourth step, the adhesive 302F located on the outer side in the second direction in plan view is selectively cured to form the connection member 302S.

[0078] Then, in the fifth step, the uncured adhesive 303F located on the inner side in the second direction in plan view is cured. While applying pressure from a direction perpendicular to the main surface, the vicinity of the uncured adhesive 303F may be locally heated, or the entire flow path substrate 101 and orifice plate 106 may be heated. At this time, the flow path substrate 101 and the orifice plate 106 are already fixed by the connecting member 302S, which has a large elastic modulus. Therefore, even if pressure is applied during the process of curing the adhesive 303F, the positions and postures of the flow path substrate 101 and the orifice plate 106 will not shift. Figure 6(b) shows the state in which the adhesive 303F has cured to become the connecting member 303S, completing the liquid ejection head 100B.

[0079] In this embodiment, when viewed from a direction perpendicular to the main surface of the orifice plate 106, the peripheries of all of the grooves 105, including the grooves located at the ends in the second direction, are surrounded by the connecting members 303S having a low elastic modulus. Therefore, the orifice plate 106 is supported in the same manner around all of the grooves by the connecting members 303S having a low elastic modulus. Therefore, the orifice plate 106 is fixed with extremely high flatness around the through holes 107 arranged in a matrix, so that the flight direction of the droplets ejected from each through hole 107 is uniform, and a liquid ejection head 100B with high recording quality can be provided.

[0080] Furthermore, the portion of the liquid ejection head 100B that is most susceptible to external forces is the portion located on the outside when the liquid ejection head 100B is viewed from the direction (Z direction) perpendicular to the main surface of the orifice plate 106. In this embodiment, a connecting member 302S with a high modulus of elasticity (flexural modulus of elasticity) is disposed in this portion (second position). Therefore, even if some external force is applied, it is possible to prevent damage to the orifice plate 106, which has low mechanical strength, from being caused by excessive force.

[0081] [Embodiment 4] (Liquid discharge device) A description will now be given of a liquid ejection device according to embodiment 4. The liquid ejection device is equipped with a liquid ejection head according to any one of embodiments 1 to 3 described above.

[0082] First, the overall configuration of the liquid ejection device 1 according to this embodiment will be described. Fig. 8(a) is a schematic top view of the liquid ejection device 1, and Fig. 8(b) is a schematic side view. For ease of illustration, elements constituting the liquid ejection device, such as the power supply and device cover, are not shown.

[0083] The liquid ejection device 1 includes a base 9, on which a stage 10 is provided for setting a recording medium 6 (e.g., a substrate for forming an organic EL element). A sub-scanning guide rail 7 extending in the X direction in a plan view is fixed to the base 9 via a support member 8. A main scanning guide rail 5 serving as a carriage movable on the sub-scanning guide rail 7 in the X direction is mounted on the sub-scanning guide rail 7, and a main scanner 4 movable on the main scanning guide rail 5 in the Y direction is mounted on the main scanning guide rail 5. A liquid ejection unit 2 capable of ejecting liquid toward the recording medium 6 is attached to the main scanner 4. By moving the main scanning guide rail 5 in the X direction and the main scanner 4 in the Y direction, the liquid ejection unit 2 can be freely scanned in the X and Y directions over the recording medium 6 set on the stage 10. While the liquid ejection device 1 can move and scan the liquid ejection unit 2 in this way, the scanning mechanism is not limited to the configuration shown in the figure, and any configuration may be used as long as it is capable of scanning the liquid ejection unit 2 relative to the recording medium 6. For example, the recording medium 6 may be moved in one of the X and Y directions, and the liquid ejection unit 2 may be moved in the other direction. Alternatively, the liquid ejection unit 2 may be fixed, and the recording medium 6 may be moved in both the X and Y directions.

[0084] The liquid ejection unit 2 is equipped with a liquid ejection head 3 according to any one of the above-described first to third embodiments, which is capable of ejecting liquid (e.g., ink for forming organic EL elements) toward a recording medium 6. The liquid ejection head 3 is equipped with a liquid ejection element that applies pressure to ink by utilizing, for example, deformation of a piezoelectric element or boiling caused by a heating element, thereby ejecting the ink from a nozzle.

[0085] A main tank 11 is installed on the base 9. The main tank 11 stores ink to replenish the ink when the remaining ink level in the sub-tank of the liquid ejection unit 2 decreases. The main tank 11 is connected to a first flow path 15 for circulating the stored ink.

[0086] The liquid ejection device 1 is provided with a second flow path 14 that opens and closes between a sub-tank of the liquid ejection unit 2 and the first flow path 15. Since the sub-tank moves as the liquid ejection unit 2 is scanned in the XY directions, the second flow path 14 is configured to include a flexible piping portion.

[0087] The liquid ejection device 1 according to this embodiment includes a liquid ejection head 3 in which multiple ejection ports are aligned and mechanical strength is ensured, and therefore, for example, organic EL elements can be manufactured stably over a long period of time, or high-quality recording can be performed stably over a long period of time using ink for information recording.

[0088] [Other embodiments] The present invention is not limited to the above-described embodiments, and many modifications are possible within the technical spirit of the present invention. For example, the above-described different embodiments may be combined in whole or in part. In the above-described example, an example in which an energy generating element is provided on the flow path substrate 101 (first substrate) as a liquid ejection head is shown, but the present invention is not limited to this. For example, the flow path substrate 101 may be made of metal, and an energy generating element (e.g., a piezoelectric element) may be provided on the orifice plate 106, thereby providing a function of applying energy to the liquid to eject it from the ejection port. In the above example, the orifice plate 106 has been used as an example of the second substrate, but it is sufficient if a plurality of through holes 107 that serve as liquid ejection ports are provided thereon. In other words, the second substrate may be referred to as a substrate that has liquid ejection ports.

[0089] For example, as the adhesive 303F in the third embodiment, the adhesive 203F containing inorganic particles used in the second embodiment can be used.

[0090] In addition, in any embodiment, inorganic particles may be contained in the adhesive with a high elastic modulus after curing. That is, inorganic particles may be contained in both the adhesive with a low elastic modulus after curing and the adhesive with a high elastic modulus after curing, or inorganic particles may be contained only in the adhesive with a high elastic modulus after curing. Both the connecting member with a low elastic modulus and the connecting member with a high elastic modulus may contain inorganic particles, or only the connecting member with a high elastic modulus may contain inorganic particles, or only the connecting member with a low elastic modulus may contain inorganic particles.

[0091] As the adhesive with a high elastic modulus after curing (second adhesive) and the adhesive with a low elastic modulus after curing (first adhesive), a thermosetting adhesive or a photocurable adhesive is preferably used, but a combination of a thermosetting adhesive and a photocurable adhesive may also be used. For example, a photocurable adhesive may be used as the second adhesive and a thermosetting adhesive as the first adhesive, or vice versa.

[0092] Furthermore, the embodiments of the present invention include an embodiment as an article manufacturing method in which an article is manufactured by applying a liquid containing a material for manufacturing the article using the liquid ejection device described above. According to the article manufacturing method of the embodiment, the main surface of the orifice plate 106 is maintained highly flat, so that the ejection direction of droplets from each ejection port is aligned, and an extremely high quality article can be manufactured.

[0093] The method for manufacturing an article according to the embodiment is for manufacturing a functional thin film such as an electrode or an optical filter. The method for manufacturing an article according to the embodiment includes a step of applying a liquid for manufacturing a functional element such as an organic EL element to a substrate using the liquid ejection device (liquid ejection head) described above. The method for manufacturing an article according to the embodiment includes a step of ejecting a liquid for manufacturing a three-dimensional object or the like using the liquid ejection device (liquid ejection head) described above.

[0094] This specification discloses at least the following: [Matter 1] preparing a first substrate having a first main surface on which a plurality of rows of grooves are formed, and a second substrate having a plurality of through holes arranged in a matrix when the main surface is viewed from above; applying an uncured first adhesive to the first major surface of the first substrate at a first location; applying an uncured second adhesive to the first major surface of the first substrate at a second location; aligning the first substrate and the second substrate so that the rows of grooves of the first substrate and the through holes of the second substrate face each other, and curing the second adhesive; and then curing the first adhesive, On the first main surface of the first substrate, a longitudinal direction of each of the rows of grooves is aligned along a first direction, and the rows of grooves are arranged along a second direction intersecting the first direction, the first position surrounds at least a groove that is not located at an end in the second direction among the plurality of rows of grooves of the first substrate when the first main surface is viewed in a plane; the second position is located along a longitudinal direction of a groove, out of the plurality of rows of grooves of the first substrate, and further outward than a groove located at an end in the second direction, when the first main surface is viewed in a plan view; The second adhesive has a modulus of elasticity after curing that is greater than the modulus of elasticity of the first adhesive after curing. A method for manufacturing a liquid ejection head, comprising: [Matter 2] The first adhesive has a modulus of elasticity after curing of 2 GPa or more and 4 GPa or less, The second adhesive has a modulus of elasticity after curing of 5 GPa or more and 15 GPa or less. 2. A method for manufacturing a liquid ejection head according to item 1. [Matter 3] The elastic modulus of the second adhesive after curing is two to four times the elastic modulus of the first adhesive after curing. 3. The method for manufacturing a liquid ejection head according to item 1 or 2. [Matter 4] the first adhesive is a heat-curable adhesive or a light-curable adhesive; The second adhesive is a heat-curable adhesive or a light-curable adhesive. 4. A method for manufacturing a liquid ejection head according to any one of items 1 to 3. [Matter 5] Inorganic particles are dispersed in the first adhesive. 5. A method for manufacturing a liquid ejection head according to any one of items 1 to 4. [Matter 6] The first adhesive contains the inorganic particles at a density of 10 particles / mm 3 ~20 pieces / mm 3 are distributed at a density of 6. A method for manufacturing a liquid ejection head according to item 5. [Matter 7] The inorganic particles include at least one selected from the group consisting of glass beads, alumina, and titanium. 7. The method for manufacturing a liquid ejection head according to item 5 or 6. [Matter 8] When the first main surface is viewed in plan, the first adhesive is applied so as to surround all of the peripheries of the rows of grooves of the first substrate; The second adhesive is applied to the outside of the first adhesive surrounding the groove located at the end in the second direction. 8. A method for manufacturing a liquid ejection head according to any one of items 1 to 7. [Matter 9] The thermal expansion coefficient of the first substrate is approximately equal to the thermal expansion coefficient of the second substrate. 9. A method for manufacturing a liquid ejection head according to any one of items 1 to 8. [Matter 10] The thickness of the first substrate is greater than the thickness of the second substrate. 10. A method for manufacturing a liquid ejection head according to any one of items 1 to 9. [Matter 11] a first substrate having a first main surface on which a plurality of rows of grooves are formed; a second substrate having a main surface on which a plurality of through holes serving as liquid ejection ports are arranged in a matrix when viewed from above; a first connecting member and a second connecting member that connect the first substrate and the second substrate; Equipped with the plurality of through holes provided in the second substrate and the plurality of rows of grooves provided in the first substrate face each other, On the first main surface of the first substrate, a longitudinal direction of each of the rows of grooves is aligned along a first direction, and the rows of grooves are arranged along a second direction intersecting the first direction, the first connecting member connects the first main surface and the main surface so as to surround at least grooves that are not located at ends in the second direction among the plurality of rows of grooves of the first substrate; the second connecting member connects the first main surface and the main surface along a longitudinal direction of a groove located outside a groove positioned at an end in the second direction among the plurality of rows of grooves of the first substrate when the first main surface is viewed in a plane; The elastic modulus of the second connecting member is greater than the elastic modulus of the first connecting member. A liquid ejection head characterized by: [Matter 12] The elastic modulus of the first connection member is 2 GPa or more and 4 GPa or less, The elastic modulus of the second connecting member is 5 GPa or more and 15 GPa or less. Item 12. A liquid ejection head according to item 11. [Matter 13] The elastic modulus of the second connecting member is two or more times and four or less times the elastic modulus of the first connecting member. 13. The liquid ejection head according to item 11 or 12. [Matter 14] The first connection member contains inorganic particles. 14. A liquid ejection head according to any one of items 11 to 13. [Matter 15] When viewed from a direction perpendicular to the main surface of the second substrate, the first connecting member has the inorganic particles at a density of 10 particles / mm 2 ~20 pieces / mm 2 are distributed at a density of Item 15. The liquid ejection head according to item 14. [Matter 16] The inorganic particles include at least one selected from the group consisting of glass beads, alumina, and titanium. 16. The liquid ejection head according to item 14 or 15. [Matter 17] When viewed from a direction perpendicular to the first main surface, the first connection member is disposed so as to surround all of the rows of grooves of the first substrate; the second connecting member is disposed outside the first connecting member surrounding the groove located at the end in the second direction; 17. A liquid ejection head according to any one of items 11 to 16. [Matter 18] The thermal expansion coefficient of the first substrate is approximately equal to the thermal expansion coefficient of the second substrate. 18. A liquid ejection head according to any one of items 11 to 17. [Matter 19] The thickness of the first substrate is greater than the thickness of the second substrate. 19. A liquid ejection head according to any one of items 11 to 18. [Matter 20] A liquid ejection head according to any one of items 11 to 19, a tank for supplying liquid to the liquid ejection head, A liquid ejection device characterized by: [Matter 21] 19. Using the liquid ejection head according to any one of items 11 to 19, a liquid containing a material for manufacturing an article is ejected to manufacture the article. A method for manufacturing an article. [Explanation of symbols]

[0095] 1···Liquid ejection device / 3···Liquid ejection head / 11···Main tank / 100, 100A, 100B··Liquid ejection head / 101···Flow path substrate / 102F···Adhesive / 102S···Connecting member / 103F···Adhesive / 103S···Connecting member / 104···Protective layer / 105···Groove / 106···Orifice plate / 107···Through hole / 203F···Adhesive / 203S···Connecting member / 302F···Adhesive / 302S···Connecting member / 303F···Adhesive / 303S···Connecting member / FP···Inorganic particles

Claims

1. preparing a first substrate having a first main surface on which a plurality of rows of grooves are formed, and a second substrate having a plurality of through holes arranged in a matrix when the main surface is viewed from above; applying an uncured first adhesive to the first major surface of the first substrate at a first location; applying an uncured second adhesive to the first major surface of the first substrate at a second location; aligning the first substrate and the second substrate so that the rows of grooves of the first substrate and the through holes of the second substrate face each other, and curing the second adhesive; and then curing the first adhesive, On the first main surface of the first substrate, a longitudinal direction of each of the rows of grooves is aligned along a first direction, and the rows of grooves are arranged along a second direction intersecting the first direction, the first position surrounds at least a groove that is not located at an end in the second direction among the plurality of rows of grooves of the first substrate when the first main surface is viewed in a plane; the second position is located along a longitudinal direction of a groove, out of the plurality of rows of grooves of the first substrate, and further outward than a groove located at an end in the second direction, when the first main surface is viewed in a plan view; The second adhesive has a modulus of elasticity after curing that is greater than the modulus of elasticity of the first adhesive after curing. A method for manufacturing a liquid ejection head, comprising:

2. The first adhesive has a modulus of elasticity after hardening of 2 GPa or more and 4 GPa or less, The second adhesive has a modulus of elasticity after curing of 5 GPa or more and 15 GPa or less.

2. The method for manufacturing a liquid ejection head according to claim 1.

3. The elastic modulus of the second adhesive after curing is two to four times the elastic modulus of the first adhesive after curing.

2. The method for manufacturing a liquid ejection head according to claim 1.

4. the first adhesive is a heat-curable adhesive or a light-curable adhesive; The second adhesive is a heat-curable adhesive or a light-curable adhesive.

4. The method for manufacturing a liquid ejection head according to claim 1.

5. Inorganic particles are dispersed in the first adhesive.

4. The method for manufacturing a liquid ejection head according to claim 1.

6. The first adhesive contains the inorganic particles at a density of 10 particles / mm ３ ~20 pieces / mm ３ are distributed at a density of 6. The method for manufacturing a liquid ejection head according to claim 5.

7. The inorganic particles include at least one selected from the group consisting of glass beads, alumina, and titanium.

6. The method for manufacturing a liquid ejection head according to claim 5.

8. When the first main surface is viewed in plan, the first adhesive is applied so as to surround all of the peripheries of the rows of grooves of the first substrate; the second adhesive is applied to the outside of the first adhesive surrounding the groove located at the end in the second direction; 4. The method for manufacturing a liquid ejection head according to claim 1.

9. The thermal expansion coefficient of the first substrate is approximately equal to the thermal expansion coefficient of the second substrate.

4. The method for manufacturing a liquid ejection head according to claim 1.

10. The thickness of the first substrate is greater than the thickness of the second substrate.

4. The method for manufacturing a liquid ejection head according to claim 1.

11. a first substrate having a first main surface with a plurality of rows of grooves formed therein; a second substrate having a main surface on which a plurality of through holes serving as liquid ejection ports are arranged in a matrix when viewed from above; a first connecting member and a second connecting member that connect the first substrate and the second substrate; Equipped with the plurality of through holes provided in the second substrate and the plurality of rows of grooves provided in the first substrate face each other, On the first main surface of the first substrate, a longitudinal direction of each of the rows of grooves is aligned along a first direction, and the rows of grooves are arranged along a second direction intersecting the first direction, the first connecting member connects the first main surface and the main surface so as to surround at least grooves that are not located at ends in the second direction among the plurality of rows of grooves of the first substrate; the second connecting member connects the first main surface and the main surface along a longitudinal direction of a groove located outside a groove positioned at an end in the second direction among the plurality of rows of grooves of the first substrate when the first main surface is viewed in a plane; The elastic modulus of the second connecting member is greater than the elastic modulus of the first connecting member. A liquid ejection head characterized by:

12. The elastic modulus of the first connecting member is 2 GPa or more and 4 GPa or less, The elastic modulus of the second connecting member is 5 GPa or more and 15 GPa or less.

12. The liquid ejection head according to claim 11.

13. The elastic modulus of the second connecting member is two to four times the elastic modulus of the first connecting member.

12. The liquid ejection head according to claim 11.

14. The first connecting member contains inorganic particles.

14. The liquid ejection head according to claim 11, wherein the liquid ejection head is a liquid ejection head.

15. When viewed from a direction perpendicular to the main surface of the second substrate, the first connecting member has the inorganic particles at a density of 10 particles / mm ２ ~20 pieces / mm ２ are distributed at a density of 15. The liquid ejection head according to claim 14.

16. The inorganic particles include at least one selected from the group consisting of glass beads, alumina, and titanium.

15. The liquid ejection head according to claim 14.

17. When viewed from a direction perpendicular to the first main surface, the first connection member is disposed so as to surround all of the rows of grooves of the first substrate; the second connecting member is disposed outside the first connecting member surrounding the groove located at the end in the second direction; 14. The liquid ejection head according to claim 11, wherein the liquid ejection head is a liquid ejection head.

18. The thermal expansion coefficient of the first substrate is approximately equal to the thermal expansion coefficient of the second substrate.

14. The liquid ejection head according to claim 11, wherein the liquid ejection head is a liquid ejection head.

19. The thickness of the first substrate is greater than the thickness of the second substrate.

14. The liquid ejection head according to claim 11, wherein the liquid ejection head is a liquid ejection head.

20. A liquid ejection head according to any one of claims 11 to 13, a tank for supplying liquid to the liquid ejection head, A liquid ejection device characterized by:

21. 14. An article is manufactured by discharging a liquid containing a material for manufacturing the article using the liquid discharge head according to claim 11. A method for manufacturing an article.

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