Composition, cured body, display, and solar cell

Abstract

To provide a composition that exhibits improved adhesion to a substrate, and a cured body, a display, and a solar cell employing the composition.SOLUTION: A composition comprising a cationically polymerizable compound (A), a cationic polymerization initiator (B), and an inorganic filler (C), wherein the inorganic filler (C) comprises one or more components selected from talc, alumina, silica, zeolite, and titanium oxide, and wherein the total content of one or more components selected from the talc and the alumina is 1 pt.mass or more and 100 pts.mass or less when the total amount of the inorganic filler (C) is 100 pts.mass.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a composition, a cured product, a display device, and a solar cell. [Background technology]

[0002] In recent years, research has been progressing on organic optical devices using organic thin-film elements such as organic electroluminescence (organic EL) display elements, organic thin-film solar cell elements, etc. Organic thin-film elements have excellent productivity because they can be easily fabricated by vacuum deposition, solution coating, etc. Examples of techniques relating to such sealants for organic electroluminescence display elements include those described in Patent Documents 1 and 2.

[0003] Patent Document 1 discloses a sealant for organic electroluminescence display elements, which contains a cationic polymerizable compound containing an epoxy compound having a hydrogenated bisphenol skeleton and a thermal cationic polymerization initiator having a cationic moiety represented by a specific chemical formula, and is characterized in that the content of the thermal cationic polymerization initiator having a cationic moiety represented by the specific chemical formula is less than 0.1 parts by weight per 100 parts by weight of the cationic polymerizable compound, and describes that the sealant has excellent low-temperature curability, storage stability, and flatness of the cured film.

[0004] Patent Document 2 discloses a curable resin composition containing a cationically polymerizable resin, an acid generator, and a metal alkoxide, wherein the acid generator is a quaternary ammonium salt, and describes that the progress of the curing reaction is unlikely to be inhibited. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-051602 [Patent Document 2] Japanese Patent Publication No. 2022-182017 Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention provides a composition having improved adhesion to a substrate, and a cured product, a display device, and a solar cell using the composition. [Means for solving the problem]

[0007] The present inventors have conducted extensive research to achieve the above object, and as a result have found that the adhesiveness of a composition to a substrate can be improved by including a predetermined amount of one or more selected from talc and alumina, thereby completing the present invention.

[0008] According to the present invention, there are provided a composition, a cured product, a display device, and a solar cell as shown below.

[0009] [1] a cationically polymerizable compound (A); a cationic polymerization initiator (B); an inorganic filler (C); Including, the inorganic filler (C) comprises one or more selected from talc, alumina, silica, zeolite, and titanium oxide, The composition, wherein the total content of one or more selected from the talc and the alumina is 1 part by mass or more and 100 parts by mass or less, when the total amount of the inorganic filler (C) is 100 parts by mass. [2] The composition according to [1], wherein the inorganic filler (C) comprises one or more selected from talc and alumina. [3] The composition according to [2], wherein the inorganic filler (C) comprises talc and silica. [4] The composition according to [3], wherein the ratio of the content of the silica to the content of the talc in the inorganic filler (C) (the content of the silica / the content of the talc) is 1.0 or more. [5] The composition according to any one of [1] to [4], which has a viscosity of 113,400 mPa·s or more and 1,134,000 mPa·s or less according to the following <Measurement Condition 1>. <Measurement condition 1> Apparatus: Cone-plate type viscometer Temperature: 25℃ Cone: 12mm radius, 3° angle Shear rate: 0.0417 s -1 Sample volume: 0.5 mL Atmosphere: Under air [6] The composition according to any one of [1] to [5], which has a viscosity of 31,750 mPa·s or more and 317,000 mPa·s or less according to the following <Measurement Condition 2>. <Measurement condition 2> Apparatus: Cone-plate type viscometer Temperature: 25℃ Cone: 12mm radius, 3° angle Shear rate: 0.0117 s -1 Sample volume: 0.5 mL Atmosphere: Under air [7] Under the following <Measurement Condition 3>, shear rate 0.0417 s -1 The viscosity η1 (mPa·s) measured at a shear rate of 0.0117 s -1 The composition according to any one of [1] to [6], wherein the composition has a thixotropy index, expressed as the ratio (η1 / η2) of the viscosity measured at η1 to the viscosity η2 (mPa·s), of 0.5 or more and 4.0 or less. <Measurement condition 3> Apparatus: Cone-plate type viscometer Temperature: 25℃ Cone: 12mm radius, 3° angle Shear rate: 0.0417 s -1 or 0.0117s -1 Sample volume: 0.5 mL Atmosphere: Under air [8] The composition was irradiated with light of 365 nm wavelength at 6,000 mJ / cm using a high-pressure mercury lamp. 2and then heating at 85°C for 1 hour, the resulting cured product has a glass transition temperature of 70°C or higher and 150°C or lower, as measured by dynamic viscoelasticity measurement at a heating rate of 5°C / min. [9] The composition was irradiated with light of 365 nm wavelength at 6,000 mJ / cm using a high-pressure mercury lamp. 2 The cured product obtained by irradiating the film under the conditions of 100°C and then heating at 85°C for 1 hour had a moisture permeability of 40g / (m2) as measured in accordance with JIS Z 0208:1976. 2 The composition according to any one of [1] to [8], wherein the time is 24 hours or less.

[10] The composition according to any one of [1] to [9], which has a tensile shear strength of 15.0 MPa or more and 45.0 MPa or less according to the following <tensile shear strength>. <Tensile shear strength> The composition was applied to the center of the surface of a 25 mm square non-alkali glass sheet to a diameter of 8 mm and a thickness of 8 mm, and another sheet of non-alkali glass was attached to it. The two sheets of non-alkali glass were then clamped together and irradiated with light of 365 nm wavelength at 6,000 mJ / cm using a high-pressure mercury lamp. 2 and heated at 85°C for 1 hour to prepare a test piece, the clamps were removed, and SPCC plates 100 mm in length, 25 mm in width, and 1.6 mm in thickness were attached to the alkali-free glass on both sides of the test piece using a two-component acrylic adhesive, and then the two SPCC plates were gripped and pulled at a temperature of 23°C and a pulling rate of 10 mm / min in accordance with JIS K 6850:1999, and the tensile shear strength (MPa) was measured.

[11] The composition according to any one of [1] to

[10] , wherein the tensile shear strength reduction rate (%) after storage in an environment of 85°C and 85% RH is 40% or less according to the following <tensile shear strength reduction rate>. <Decrease in tensile shear strength> The composition was applied to the center of the surface of a 25 mm square non-alkali glass sheet to a diameter of 8 mm and a thickness of 8 mm, and another sheet of non-alkali glass was attached to it. The two sheets of non-alkali glass were then clamped together and irradiated with light of 365 nm wavelength at 6,000 mJ / cm using a high-pressure mercury lamp. 2 and heated at 85°C for 1 hour to prepare a test piece. The clamps were removed, and SPCC plates each having a length of 100 mm, a width of 25 mm, and a thickness of 1.6 mm were bonded to the alkali-free glass on both sides of the test piece using a two-component acrylic adhesive. In accordance with JIS K 6850:1999, the two SPCC plates were pulled at a temperature of 23°C and a pulling rate of 10 mm / min. The tensile shear strength measured was defined as the initial tensile shear strength A1 (MPa). The test piece was then left to stand in an environment of a temperature of 85°C and a relative humidity of 85% RH for 7 days, and the tensile shear strength measured in the same manner as the initial tensile shear strength A1 was defined as the tensile shear strength A2 (MPa). The tensile shear strength reduction rate (%) before and after storage was calculated using the formula: ((A1-A2) / A1)×100.

[12] The composition according to any one of [1] to

[11] , which can be applied using a dispenser.

[13] The composition according to any one of [1] to

[12] , wherein the content of the inorganic filler (C) is 10 parts by mass or more and 300 parts by mass or less per 100 parts by mass of the cationically polymerizable compound (A).

[14] The composition according to any one of [1] to

[13] , wherein the content of the cationically polymerizable compound (A) is 20% by mass or more and 90% by mass or less, when the entire composition is taken as 100% by mass.

[15] The composition according to any one of [1] to

[14] , wherein the content of the cationic polymerization initiator (B) is 0.01 parts by mass or more and 5.0 parts by mass or less relative to 100 parts by mass of the cationic polymerizable compound (A).

[16] The composition according to any one of [1] to

[15] , wherein the cationically polymerizable compound (A) contains an epoxy group.

[17] The composition according to

[16] , wherein the cationically polymerizable compound (A) comprises one or more compounds selected from the group consisting of an alicyclic compound (A1) having an epoxy group, an aromatic compound (A2) having an epoxy group, and a glycidyl ether compound (A3).

[18] The composition according to any one of [1] to

[17] , wherein the cationically polymerizable compound (A) contains a bromine atom.

[19] The composition according to any one of [1] to

[18] , wherein the cationic polymerization initiator (B) comprises one or more selected from the group consisting of a photocationic polymerization initiator (B1) and a thermal cationic polymerization initiator (B2).

[20] The composition according to

[19] , wherein the cationic polymerization initiator (B) contains an onium salt compound. [twenty one] The composition according to any one of [1] to

[20] , which can be used as one or two selected from the group consisting of a damming agent and a filling agent in a display device. [twenty two] The composition according to any one of [1] to

[21] , which can be used to encapsulate a light-emitting diode element or a solar cell. [twenty three] The composition according to

[22] , wherein the light-emitting diode element comprises an organic electroluminescence display element or a micro LED. [twenty four] The composition according to

[22] , wherein the solar cell comprises a perovskite solar cell. [twenty five] A cured product obtained by curing the composition according to any one of [1] to

[24] .

[26] A display device comprising: a light-emitting diode element; a substrate; and a cured sealing layer between the light-emitting diode element and the substrate, the cured body according to

[25] .

[27] The display device according to

[26] , wherein the light-emitting diode element comprises an organic electroluminescence display element or a micro LED.

[28] A solar cell comprising a solar cell, a substrate, and a cured sealing layer between the solar cell and the substrate, the cured body according to

[25] .

[29] The solar cell according to

[28] , wherein the solar cell comprises a perovskite solar cell. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a composition having improved adhesion to a substrate, and a cured product, a display device, and a solar cell using the composition. DETAILED DESCRIPTION OF THE INVENTION

[0011] 1. Composition The composition of the present embodiment includes a cationically polymerizable compound (A), a cationic polymerization initiator (B), and an inorganic filler (C), wherein the inorganic filler (C) includes one or more selected from talc, alumina, silica, zeolite, and titanium oxide, and the total content of the one or more selected from talc and alumina may be 1 part by mass or more and 100 parts by mass or less, relative to 100 parts by mass of the total amount of the inorganic filler (C).

[0012] In an organic electroluminescent display device, an organic light-emitting material layer (organic electroluminescent display element) on a substrate is sealed with an inorganic film, a filler, a damming agent, etc. However, there is a problem that non-light-emitting areas (dark spots) are generated when moisture penetrates into the organic light-emitting material layer through defects in the inorganic film or the electrode in contact with the organic electroluminescent display element. Therefore, there is a problem that the above-mentioned filler, damming agent, and other sealants need to improve and maintain their adhesion to the substrate.

[0013] The present inventors have investigated the above-mentioned problems and found that the adhesive strength between a substrate and the composition can be improved by including a predetermined amount of one or more selected from talc and alumina in the composition. Although the reason for this is not clear, it is presumed that the inclusion of these inorganic fillers shortens the distance between oxygen and hydrogen in the hydrogen bonds on the surface of the inorganic filler, forming a strong hydrogen-bonded layer on the surface of the inorganic filler, thereby improving the adhesive strength between the substrate and the composition.

[0014] Below, the components contained in the composition of this embodiment will be further explained.

[0015] [(C) Component: Inorganic filler] In the composition of this embodiment, the inorganic filler (C) includes one or more selected from talc and alumina. In the composition of the present embodiment, the total content of one or more selected from talc and alumina is, from the viewpoint of improving adhesion to the substrate, 1 part by mass or more, preferably 3 parts by mass or more, more preferably 5 parts by mass or more, even more preferably 7 parts by mass or more, even more preferably 10 parts by mass or more, even more preferably 13 parts by mass or more, even more preferably 15 parts by mass or more, even more preferably 18 parts by mass or more, even more preferably 20 parts by mass or more, even more preferably 30 parts by mass or more, and is 100 parts by mass or less, when the total amount of the inorganic filler (C) is 100 parts by mass.

[0016] The inorganic filler (C) may also contain talc and silica. When the inorganic filler (C) contains talc, the adhesiveness to the substrate can be further improved. Also, when the inorganic filler (C) contains silica, the water vapor barrier property can be further improved, and thus the penetration of moisture from the outside can be further suppressed. That is, when the inorganic filler (C) contains both talc and silica, the performance balance between the adhesiveness to the substrate and the moisture permeability can be further improved.

[0017] When the inorganic filler (C) contains talc and silica, the ratio of the silica content to the talc content in the inorganic filler (C) (silica content / talc content) is, from the viewpoint of further improving the performance balance between adhesion to the substrate and water vapor barrier property, preferably 1.0 or more, more preferably 1.5 or more, even more preferably 2.0 or more, and still more preferably 2.5 or more, and the upper limit is not particularly limited, but may, for example, be 50.0 or less, 30.0 or less, 25.0 or less, 20.0 or less, 10.0 or less, 8.0 or less, 6.0 or less, or 4.0 or less.

[0018] In the composition of the present embodiment, the inorganic filler (C) preferably contains one or more selected from the group consisting of talc, alumina, silica, zeolite, and titanium oxide. In the composition of this embodiment, it is preferable to use a combination of two or more inorganic fillers (C). The combination of inorganic fillers (C) is preferably one selected from the group consisting of a combination of silica and talc, a combination of alumina and talc, a combination of titanium oxide and talc, and a combination of silica, talc, and zeolite. Among these, a combination of silica and talc is more preferable from the viewpoint of further improving the balance of adhesion to the substrate and water vapor barrier properties. On the other hand, from the viewpoint of further improving the adhesiveness to the substrate, it is preferable to contain talc alone. However, while talc can improve the adhesive strength to the substrate, it is difficult to improve the water vapor barrier property with talc, and therefore, from the viewpoint of further improving the performance balance between adhesive strength and water vapor barrier property, it is preferable to combine talc with silica, alumina, or the like, which can improve the water vapor barrier property. Although silica can improve the water vapor barrier property, it is difficult to increase the adhesive strength to the substrate, so it is preferable to combine it with talc, alumina, or the like, which can improve adhesive strength. In the composition of the present embodiment, the content of talc, when the total amount of the inorganic filler (C) is taken as 100 parts by mass, is preferably 1 part by mass or more, more preferably 3 parts by mass or more, even more preferably 5 parts by mass or more, even more preferably 7 parts by mass or more, even more preferably 10 parts by mass or more, even more preferably 13 parts by mass or more, even more preferably 15 parts by mass or more, even more preferably 18 parts by mass or more, and even more preferably 20 parts by mass or more, from the viewpoint of improving adhesion to the substrate and further improving the viscosity and thixotropy index; and is preferably 100 parts by mass or less, more preferably 80 parts by mass or less, even more preferably 50 parts by mass or less, and even more preferably 40 parts by mass or less, from the viewpoint of further improving the moisture permeability and further suppressing dripping. In the composition of the present embodiment, the content of silica, when the total amount of the inorganic filler (C) is taken as 100 parts by mass, is preferably 0 parts by mass or more, more preferably 30 parts by mass or more, even more preferably 50 parts by mass or more, and even more preferably 70 parts by mass or more, from the viewpoint of further improving the performance balance between adhesion to the substrate and the water vapor barrier property; and is preferably 99 parts by mass or less, more preferably 95 parts by mass or less, even more preferably 90 parts by mass or less, even more preferably 85 parts by mass or less, and even more preferably 80 parts by mass or less, from the viewpoint of improving adhesion to the substrate. In the composition of the present embodiment, the content of alumina is preferably 50 parts by mass or more, more preferably 70 parts by mass or more, and even more preferably 90 parts by mass or more, and preferably 100 parts by mass or less, from the viewpoint of further improving adhesion to the substrate, when the total amount of the inorganic filler (C) is taken as 100 parts by mass. In the composition of the present embodiment, the content of zeolite is preferably 0 parts by mass or more, more preferably 0.1 parts by mass or more, even more preferably 0.2 parts by mass or more, and preferably 1 part by mass or less, from the viewpoint of further improving the performance balance of adhesion to the substrate, curability, and storage stability, when the total amount of the inorganic filler (C) is taken as 100 parts by mass. In the composition of the present embodiment, the content of titanium oxide is preferably 1 part by mass or more, more preferably 3 parts by mass or more, and preferably 10 parts by mass or less, more preferably 8 parts by mass or less, from the viewpoint of further improving adhesion to the substrate, when the total amount of the inorganic filler (C) is taken as 100 parts by mass. Surface-treated titanium oxide may also be used, and alumina-treated titanium oxide is particularly preferred.

[0019] In the composition of the present embodiment, the content of the inorganic filler (C) is, relative to 100 parts by mass of the cationically polymerizable compound (A), preferably 10 parts by mass or more, more preferably 20 parts by mass or more, even more preferably 30 parts by mass or more, even more preferably 40 parts by mass or more, even more preferably 50 parts by mass or more, even more preferably 70 parts by mass or more, and even more preferably 90 parts by mass or more, and is preferably 300 parts by mass or less, more preferably 280 parts by mass or less, even more preferably 250 parts by mass or less, even more preferably 200 parts by mass or less, and even more preferably 150 parts by mass or less, from the viewpoint of further improving the adhesion to the substrate and further improving the water vapor barrier property.

[0020] [Component (A): Cationic polymerizable compound] Component (A) is a compound having cation polymerization properties, and can also be referred to as a compound having a cation polymerization group. Examples of the cation polymerization group include cyclic ether groups such as an epoxy group (oxirane ring) and an oxetane group (oxetane ring); and a cation polymerization vinyl group. Component (A) preferably contains an epoxy group. That is, the component (A) preferably contains one or more compounds selected from the group consisting of epoxy compounds, oxetane compounds, and cationically polymerizable vinyl compounds, and more preferably contains an epoxy compound. Examples of the epoxy compound include an alicyclic compound (A1) having an epoxy group (alicyclic epoxy compound), an aromatic compound (A2) having an epoxy group (aromatic epoxy compound), and a glycidyl ether compound (A3).

[0021] Component (A) may be a compound having one cationically polymerizable group, or may be a compound having two or more cationically polymerizable groups. Component (A) preferably has two or more cationically polymerizable groups, and more preferably has two cationically polymerizable groups.

[0022] From the viewpoints of further improving the coatability and further improving the balance of adhesion to the substrate and transparency, component (A) preferably contains one or more compounds selected from the group consisting of an alicyclic compound (A1) having an epoxy group, an aromatic compound (A2) having an epoxy group, and a glycidyl ether compound (A3), and more preferably contains an alicyclic compound (A1) having an epoxy group, an aromatic compound (A2) having an epoxy group, and a glycidyl ether compound (A3). Also, component (A) preferably contains an alicyclic compound (A1) having an epoxy group and an aromatic compound (A2) having an epoxy group.

[0023] From the viewpoint of further improving the water vapor barrier property, the component (A) preferably contains a bromine atom. Here, the component (A) containing a bromine atom means that the component (A) contains a bromine atom-containing compound.

[0024] Component (A) is preferably thermally polymerizable.

[0025] (Component (A1): Alicyclic compound having an epoxy group) The component (A1) is a compound having an epoxy group and an alicyclic group. The component (A1) may be a compound having one epoxy group, or may be a compound having two or more epoxy groups. The component (A1) preferably has two or more epoxy groups, and more preferably has two epoxy groups. The component (A1) may be a compound having no aromatic ring. The component (A1) can be used alone or in combination of two or more types.

[0026] The component (A1) may be, for example, a compound obtained by epoxidizing a compound having a cycloalkene ring, or a derivative thereof. Examples of the cycloalkene ring include a cyclohexene ring, a cyclopentene ring, and a pinene ring. Epoxidation can be carried out, for example, using an oxidizing agent. Examples of the oxidizing agent include hydrogen peroxide and peracid. Examples of such component (A1) include one or more selected from the group consisting of 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxycyclohexylalkyl(meth)acrylate (e.g., 3,4-epoxycyclohexylmethyl(meth)acrylate), and (3,3',4,4'-diepoxy)bicyclohexyl.

[0027] The component (A1) may be, for example, a compound obtained by hydrogenating a compound having an epoxy group and an aromatic ring, or a derivative thereof. Examples of the compound having an epoxy group and an aromatic ring include bisphenol A epoxy resins and bisphenol F epoxy resins. Examples of such component (A1) include hydrogenated bisphenol A epoxy resins and hydrogenated bisphenol F epoxy resins.

[0028] The component (A1) is preferably a compound having a 1,2-epoxycyclohexane structure. As the compound having a 1,2-epoxycyclohexane structure, for example, a compound represented by formula (A1-1) is preferred.

[0029] [ka]

[0030] In formula (A1-1), X represents a single bond or a linking group (a divalent group having one or more atoms).

[0031] When X is a single bond, the compound represented by formula (A1-1) is (3,3',4,4'-diepoxy)bicyclohexyl.

[0032] The linking group may be, for example, a divalent hydrocarbon group, a carbonyl group, an ether bond, an ester bond, a carbonate group, an amide bond, or a group in which a plurality of these groups are linked together. X is preferably a linking group. The linking group is preferably a group having an ester bond, more preferably a group in which an ester bond and a divalent hydrocarbon group are linked. An example of a compound having a group having an ester bond as a linking group is 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (molecular weight 252).

[0033] The divalent hydrocarbon group is preferably an alkanediyl group, more preferably an alkanediyl group having 1 to 3 carbon atoms.

[0034] The compound represented by formula (A1-1) is preferably 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate.

[0035] From the viewpoint of further improving the coatability and the storage stability, the molecular weight of the component (A1) is preferably 1,000 or less, more preferably 800 or less, even more preferably 500 or less, and even more preferably 300 or less. The molecular weight of the component (A1) may be, for example, 100 or more, 150 or more, or 200 or more.

[0036] When component (A1) has a molecular weight distribution, the number-average molecular weight of component (A1) is preferably within the above range. In this specification, the number-average molecular weight refers to a polystyrene-equivalent value measured by gel permeation chromatography (GPC) under the following measurement conditions: Solvent (mobile phase): THF Degassing device: ERMA ERC-3310 Pump: JASCO PU-980 ·Flow rate: 1.0ml / min Autosampler: Tosoh AS-8020 Column oven: Hitachi L-5030 ·Set temperature: 40℃ Column configuration: Two Tosoh TSKguardcolumnMP (xL) 6.0mm ID x 4.0cm columns, and two Tosoh TSK-GELMULTIPORE HXL-M 7.8mm ID x 30.0cm columns, for a total of four columns. Detector: RI Hitachi L-3350 Data processing: SIC480 data station

[0037] From the viewpoint of further improving the performance balance between coatability and durability, the content of component (A1) in the composition of this embodiment, relative to 100 parts by mass of the total amount of component (A) in the composition of this embodiment, is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, even more preferably 15 parts by mass or more, and even more preferably 20 parts by mass or more, and is preferably 60 parts by mass or less, more preferably 50 parts by mass or less, even more preferably 40 parts by mass or less, and even more preferably 30 parts by mass or less.

[0038] (Component (A2): Aromatic compound having an epoxy group) Component (A2) is a compound having an epoxy group and an aromatic ring. Component (A2) may be a compound having one epoxy group, or a compound having two or more epoxy groups. Component (A2) preferably has two or more epoxy groups, and more preferably has two epoxy groups. Component (A2) may be a compound without an alicyclic group. Component (A2) can be used alone or in combination of two or more types.

[0039] The (A2) component may be any of a monomer, oligomer, or polymer. Examples include one or more selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, biphenyl epoxy resins, naphthalene epoxy resins, fluorene epoxy resins, novolac phenol epoxy resins, cresol novolac epoxy resins, and modified versions thereof. Further examples of the (A2) component include one or more selected from the group consisting of halophenyl glycidyl ethers such as bromophenyl glycidyl ether and dibromophenyl glycidyl ether; bromine-containing epoxy resins such as brominated bisphenol A epoxy resins, brominated bisphenol F novolac epoxy resins, and brominated phenol novolac epoxy resins; and other bromine-containing aromatic epoxy compounds. The bromine-containing aromatic epoxy compound is preferably a halophenyl glycidyl ether. The halophenyl glycidyl ether is preferably dibromophenyl glycidyl ether.

[0040] The component (A2) preferably comprises one or more compounds selected from the group consisting of compounds having a bisphenol structure (e.g., a bisphenol A structure, a bisphenol F structure, a bisphenol S structure, etc.) and bromine atom-containing aromatic epoxy compounds, more preferably one or more compounds selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and halophenyl glycidyl ethers, even more preferably one or more compounds selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and dibromophenyl glycidyl ethers, and even more preferably at least one compound selected from the group consisting of bisphenol F epoxy resins and dibromophenyl glycidyl ethers.

[0041] From the viewpoint of further improving the balance of application properties and storage stability, the molecular weight of the (A2) component is preferably 100 or more, more preferably 150 or more, even more preferably 200 or more, and even more preferably 300 or more, and is preferably 5000 or less, more preferably 1000 or less, even more preferably 800 or less, and even more preferably 700 or less.

[0042] When component (A2) has a molecular weight distribution, the number-average molecular weight of component (A2) is preferably within the above range. In this specification, the number-average molecular weight refers to a value calculated in terms of polystyrene, measured by gel permeation chromatography (GPC) under the above-mentioned measurement conditions.

[0043] From the viewpoint of improving the performance balance between coatability and durability, the content of component (A2) in the composition of this embodiment, relative to 100 parts by mass of the total amount of component (A) in the composition of this embodiment, is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, preferably 30 parts by mass or more, even more preferably 50 parts by mass or more, even more preferably 60 parts by mass or more, and even more preferably 70 parts by mass or more, and is preferably 90 parts by mass or less, more preferably 85 parts by mass or less.

[0044] (Component (A3): Glycidyl ether compound) Component (A3) is a compound having a glycidyl ether group. Component (A3) may be a compound having one epoxy group, or a compound having two or more epoxy groups. Component (A3) preferably has two or more epoxy groups, and more preferably has two epoxy groups. Component (A3) may be a compound having no alicyclic group or aromatic ring. Component (A3) can be used alone or in combination of two or more. Component (A3) preferably excludes components (A1) and (A2).

[0045] The component (A3) is preferably a diglycidyl ether compound. From the viewpoint of further improving coatability, the diglycidyl ether compound preferably includes one or more compounds selected from the group consisting of diglycidyl ethers of alkylene glycols such as diglycidyl ether of ethylene glycol, diglycidyl ether of propylene glycol, diglycidyl ether of 1,6-hexanediol, and diglycidyl ether of neopentyl glycol; polyglycidyl ethers of polyhydric alcohols such as di- or triglycidyl ethers of glycerin or its alkylene oxide adduct; and diglycidyl ethers of polyalkylene glycols such as diglycidyl ethers of polyethylene glycol or its alkylene oxide adducts, and diglycidyl ethers of polypropylene glycol or its alkylene oxide adducts, and preferably includes a diglycidyl ether of an alkylene glycol. The diglycidyl ether of alkylene glycol preferably includes one or more selected from the group consisting of diglycidyl ether of ethylene glycol, diglycidyl ether of propylene glycol, diglycidyl ether of 1,6-hexanediol, and diglycidyl ether of neopentyl glycol, and more preferably includes one or two selected from the group consisting of diglycidyl ether of 1,6-hexanediol and diglycidyl ether of neopentyl glycol. Examples of alkylene glycols include ethylene glycol, propylene glycol, 1,6-hexanediol, neopentyl glycol, etc. Examples of polyalkylene glycols include polyethylene glycol or its alkylene oxide adduct, polypropylene glycol or its alkylene oxide adduct, etc. Examples of alkylene oxides include ethylene oxide, propylene oxide, etc.

[0046] From the viewpoint of further improving the performance balance between coatability and durability, the content of component (A3) in the composition of this embodiment, relative to 100 parts by mass of the total amount of component (A) in the composition of this embodiment, is preferably at least 0.1 parts by mass, more preferably at least 0.2 parts by mass, even more preferably at least 0.5 parts by mass, even more preferably at least 1.0 part by mass, and even more preferably at least 1.5 parts by mass, and is preferably at most 20 parts by mass, more preferably at most 15 parts by mass, even more preferably at most 10 parts by mass, even more preferably at most 5 parts by mass, and even more preferably at most 3 parts by mass.

[0047] From the viewpoint of further improving the balance between application property and durability, the total amount of component (A1), component (A2), and component (A3) in the composition of this embodiment is, relative to 100 parts by mass of the total amount of component (A) in the composition of this embodiment, preferably 60 parts by mass or more, more preferably 70 parts by mass or more, even more preferably 80 parts by mass or more, even more preferably 95 parts by mass or more, and even more preferably 98 parts by mass or more, and is, for example, 100 parts by mass or less.

[0048] In the composition of the present embodiment, the content of the cationically polymerizable compound (A), when the total composition is taken as 100% by mass, is preferably 20% by mass or more, more preferably 25% by mass or more, even more preferably 30% by mass or more, even more preferably 35% by mass or more, even more preferably 40% by mass or more, and is preferably 90% by mass or less, more preferably 85% by mass or less, even more preferably 80% by mass or less, even more preferably 75% by mass or less, even more preferably 70% by mass or less, from the viewpoint of further improving the balance between application property and durability.

[0049] [(B) Cationic polymerization initiator] Examples of component (B) include one or more selected from the group consisting of photocationic polymerization initiators (B1) that can be activated by light to initiate cationic polymerization of component (A); and thermal cationic polymerization initiators (B2) that can be activated by heat to initiate cationic polymerization of component (A), with photocationic polymerization initiator (B1) being preferred.

[0050] Examples of the photocationic polymerization initiator (B1) include arylsulfonium salt derivatives (e.g., Cyracure UVI-6990 and Cyracure UVI-6974 manufactured by The Dow Chemical Company; Adeka Optomer SP-150, Adeka Optomer SP-152, Adeka Optomer SP-170, and Adeka Optomer SP-172 manufactured by ADEKA Corporation; CPI-100P, CPI-101A, CPI-200K, CPI-210S, CPI-310FG, and LW-S1 manufactured by San-Apro; and Cibacur-1190 manufactured by Double Bond Corporation), aryl iodonium salt derivatives (e.g., Irgacure 250 manufactured by Ciba Specialty Chemicals; and RP-2074 manufactured by Rhodia Japan), allene-ion complex derivatives, diazonium salt derivatives, triazine initiators, and acid generators such as other halides.

[0051] Examples of the thermal cationic polymerization initiator (B2) include any thermal cationic polymerization initiator that is activated by heating to induce ring-opening of a ring-opening polymerizable group, such as an onium salt compound, such as a quaternary ammonium salt, a phosphonium salt, or a sulfonium salt. Commercially available thermal cationic polymerization initiators (B2) include, for example, ADEKAOPTON CP-66, ADEKAOPTON CP-77 (manufactured by ADEKA CORPORATION), SAN-AID SI-60L, SAN-AID SI-80L, SAN-AID SI-100L (manufactured by SANSHIN CHEMICAL INDUSTRY CO., LTD.), and CI series (manufactured by NIPPON SODA CO., LTD.).

[0052] From the viewpoint of more significantly achieving the above-mentioned effects achieved by using two or more cure retarders, component (B) preferably contains an onium salt compound. The onium salt compound preferably contains one or more compounds selected from the group consisting of aryl sulfonium salt derivatives, aryliodonium salt derivatives, and diazonium salt derivatives, and more preferably contains an aryl sulfonium salt derivative. The anion preferably contains one or more compounds selected from the group consisting of antimonate and gallate.

[0053] Component (B) may be dissolved in a solvent in advance to facilitate mixing with other components such as component (A). The solvent is not particularly limited, but examples include carbonates such as propylene carbonate, ethylene carbonate, 1,2-butylene carbonate, dimethyl carbonate, and diethyl carbonate.

[0054] The content of component (B) in the composition of the present embodiment, relative to 100 parts by mass of component (A), is preferably 0.01 part by mass or more, more preferably 0.05 part by mass or more, even more preferably 0.10 part by mass or more, even more preferably 0.30 part by mass or more, even more preferably 0.50 part by mass or more, and even more preferably 0.80 part by mass or more, from the viewpoint of further improving the adhesive durability of the cured product, and is preferably 5.0 parts by mass or less, more preferably 4.0 parts by mass or less, even more preferably 3.0 parts by mass or less, and even more preferably 2.5 parts by mass or less, from the viewpoint of further improving the adhesive durability of the cured product.

[0055] [Component (X): Curing retarder] The composition of this embodiment preferably contains a cure retarder as component (X). From the viewpoint of further improving the performance balance between application property and storage stability, component (X) preferably contains one or more members selected from the group consisting of a phosphoric acid-based cure retarder (component (D)), an ether-based cure retarder (component (E)), a thioether-based cure retarder (component (F)), a metal complex-based cure retarder (component (G)), and a nitroxy radical-based cure retarder (component (H)), and more preferably contains one or more members selected from the group consisting of a phosphoric acid-based cure retarder (component (D)) and an ether-based cure retarder (component (E)).

[0056] The content of component (X) in the composition of the present embodiment is preferably 0.10 parts by mass or more, more preferably 0.20 parts by mass or more, even more preferably 0.50 parts by mass or more, even more preferably 0.80 parts by mass or more, even more preferably 1.0 part by mass or more, and even more preferably 2.0 parts by mass or more, per 100 parts by mass of component (A), from the viewpoint of obtaining a longer pot life; and is preferably 10.0 parts by mass or less, more preferably 8.0 parts by mass or less, and even more preferably 5.0 parts by mass or less, from the viewpoint of further improving the performance balance between moisture permeability and adhesiveness of the cured product.

[0057] (Component (D): Phosphate-based hardening retarder) The phosphoric acid-based cure retarder is a cure retarder selected from the group consisting of phosphate esters (component (D1)) and phosphites (component (D2)). The component (D) can be used alone or in combination of two or more.

[0058] Examples of component (D1) include diethylbenzyl phosphate, trimethyl phosphate, triethyl phosphate, tri-n-butyl phosphate, tris(butoxyethyl)phosphate, tris(2-ethylhexyl)phosphate, (RO)3P=O (R is lauryl, cetyl, stearyl, or oleyl), tris(2-chloroethyl)phosphate, tris(2-dichloropropyl)phosphate, triphenyl phosphate, butyl pyrophosphate, tricresyl phosphate, trixylenyl phosphate, octyl diphenyl phosphate, cresyl diphenyl phosphate, xylenyl diphosphate, monobutyl phosphate, dibutyl phosphate, di-2-ethylhexyl phosphate, monoisodecyl phosphate, ammonium ethyl acid phosphate, and 2-ethylhexyl acid phosphate salts. Component (D1) can be used singly or in combination of two or more.

[0059] From the viewpoints of appropriate reactivity with cations and reduced outgassing, the component (D1) preferably includes one or more compounds selected from the group consisting of compounds represented by formula (D1-1), compounds represented by formula (D1-2), and compounds represented by formula (D1-3), and more preferably includes a compound represented by formula (D1-2).

[0060] [ka]

[0061] [ka]

[0062] [ka]

[0063] In formula (D1-1), formula (D1-2) and formula (D1-3), R 1 , R 2 , R 3 , R 4 , R 5 and R 6 each independently represents a hydrocarbon group which may have a substituent.

[0064] R in formula (D1-2) 2 , R 3 and R 4 , and R in formula (D1-3) 5 and R 6 is preferably the same group in each formula.

[0065] R 1 , R 2 , R 3 , R 4 , R 5 and R 6 Examples of the substituent that the hydrocarbon group in R may have include an oxyalkyl group. 1 , R 2 , R 3 , R4 , R 5 and R 6 The hydrocarbon group in is preferably an unsubstituted hydrocarbon group.

[0066] R 1 , R 2 , R 3 , R 4 , R 5 and R 6 The hydrocarbon group in is preferably an alkyl group or an aryl group, more preferably an alkyl group or a phenyl group, and even more preferably an alkyl group. The number of carbon atoms in the alkyl group may be, for example, 1 to 18, and preferably 4 to 13.

[0067] The compound represented by formula (D1-1) includes, for example, monoalkyl phosphate (i.e., R 1 is an alkyl group), and specific examples include monoethyl phosphate, mono-n-butyl phosphate, mono(butoxyethyl) phosphate, mono(2-ethylhexyl) phosphate, and the like.

[0068] The compound represented by formula (D1-2) includes trialkyl phosphate (i.e., R 2 , R 3 and R 4 In this case, R is an alkyl group. 2 , R 3 and R 4 The alkyl group preferably has 1 or more and 18 or less carbon atoms, more preferably 4 or more and 12 or less carbon atoms, and even more preferably 8 carbon atoms.

[0069] Specific examples of trialkyl phosphates include triethyl phosphate, tri-n-butyl phosphate, tris(butoxyethyl) phosphate, tris(2-ethylhexyl) phosphate, (RO)3P=O (wherein R is a lauryl group, a cetyl group, a stearyl group, or an oleyl group), and the like.

[0070] The compound represented by formula (D1-3) includes, for example, dialkyl phosphate (i.e., R 5 and R 6 is an alkyl group), etc. Specific examples of dialkyl phosphates include dibutyl phosphate and bis(2-ethylhexyl) phosphate.

[0071] Component (D2) is a phosphite ester. Examples of component (D2) include trimethyl phosphite, triethyl phosphite, tri-n-butyl phosphite, tris(2-ethylhexyl) phosphite, triisooctyl phosphite, tridecyl phosphite, triisodecyl phosphite, tris(tridecyl) phosphite, trioleyl phosphite, tristearyl phosphite, triphenyl phosphite, tris(nonylphenyl) phosphite, tris(2,4-di-t-butylphenyl) phosphite, phenyl diisooctyl phosphite, phenyl diisodecyl phosphite, diphenyl mono(2-ethylhexyl) phosphite, diphenyl isooctyl phosphite, diphenyl monodecyl phosphite, diphenyl monoisodecyl phosphite, diphenyl mono(tridecyl) phosphite, bis(nonylphenyl)dinonylphenyl phosphite, tetraphenyl dipropylene glycol, Examples of the (D2) component include bis(tridecyl)pentaerythritol diphosphite, poly(dipropylene glycol)phenyl phosphite, diisodecyl pentaerythritol diphosphite, bis(tridecyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, bis(nonylphenyl)pentaerythritol diphosphite, tetraphenyltetra(tridecyl)pentaerythritol tetraphosphite, tetra(tridecyl)-4,4'-isopropylidene diphenyl phosphite, trilauryl trithiophosphite, dimethyl hydrogen phosphite, dibutyl hydrogen phosphite, di(2-ethylhexyl) hydrogen phosphite, dilauryl hydrogen phosphite, dioleyl hydrogen phosphite, diphenyl hydrogen phosphite, diphenyl mono(2-ethylhexyl) phosphite, and diphenyl mono(tridecyl) phosphite. Component (D2) can be used alone or in combination of two or more.

[0072] From the viewpoint of appropriate reactivity with cations, component (D2) preferably includes one or more compounds selected from the group consisting of compounds represented by formula (D2-1), compounds represented by formula (D2-2), compounds represented by formula (D2-3), compounds represented by formula (D2-4), compounds represented by formula (D2-5), and compounds represented by formula (D2-6).

[0073] [ka]

[0074] [ka]

[0075] [ka]

[0076] [ka]

[0077] [ka]

[0078] [ka]

[0079] In formulas (D2-1) to (D2-6), R 7 , R 8 , R 9 , R 10 , R 11 , R 12 , R 13 , R 14 , R 15 , R 16 and R 17 each independently represents a hydrocarbon group which may have a substituent.

[0080] R 7 , R 8 , R 9 , R 10 , R 11 , R 12 , R 13 , R 14 , R 15 , R 16 and R 17 Examples of the substituent that the hydrocarbon group in R may have include an oxyalkyl group. 7 , R 8 , R 9 , R 10 , R 11 , R 12 , R 13 , R 14 , R 15 , R 16 and R 17 The hydrocarbon group in is preferably an unsubstituted hydrocarbon group.

[0081] R 7 , R 8 , R 9 , R 10 , R 11 , R 12 , R 13 , R 14 , R 15 , R 16 and R 17 The hydrocarbon group in is preferably an alkyl group or an aryl group, more preferably an alkyl group or a phenyl group, and even more preferably an alkyl group. The number of carbon atoms in the alkyl group may be, for example, 1 to 30, preferably 1 to 18. The aryl group is preferably a phenyl group.

[0082] R in formula (D2-2) 8 and R 9 , R in formula (D2-3) 10 , R 11 and R 12 , R in formula (D2-4) 13 and R 14 , and R in formula (D2-5) 15 and R 16are preferably the same in each formula.

[0083] The compound represented by formula (D2-1) includes, for example, monoalkyl phosphite (i.e., R 7 is an alkyl group).

[0084] Examples of the compound represented by formula (D2-2) include dialkyl phosphites (i.e., R 8 and R 9 is an alkyl group).

[0085] Examples of the compound represented by formula (D2-3) include trialkyl phosphites (i.e., R 10 , R 11 and R 12 is an alkyl group), phenyl phosphite (i.e., R 10 , R 11 and R 12 wherein one or more of the alkyl groups are phenyl groups). Specific examples of trialkyl phosphites include triethyl phosphite, tris(2-ethylhexyl) phosphite, tridecyl phosphite, trilauryl phosphite, tris(tridecyl) phosphite, trioleyl phosphite, etc. Specific examples of phenyl phosphites include diphenyl monodecyl phosphite, etc.

[0086] Examples of the compound represented by formula (D2-4) include bis(alkyl)pentaerythritol diphosphites (i.e., R 13 and R 14 is an alkyl group), etc. Specific examples of the compound represented by formula (D2-4) include bis(decyl)pentaerythritol diphosphite, bis(tridecyl)pentaerythritol diphosphite, distearylpentaerythritol diphosphite, etc.

[0087] The compound represented by formula (D2-5) includes, for example, dialkyl hydrogen phosphite (i.e., R15 and R 16 is an alkyl group), etc. Specific examples of the compound represented by formula (D2-5) include diethyl hydrogen phosphite, bis(2-ethylhexyl) hydrogen phosphite, dilauryl hydrogen phosphite, and dioleyl hydrogen phosphite.

[0088] The compound represented by formula (D2-6) includes, for example, monoalkyl hydrogen phosphite (i.e., R 17 is an alkyl group), etc. Specific examples of the compound represented by formula (D2-6) include monoethyl hydrogen phosphite, mono(2-ethylhexyl) hydrogen phosphite, monolauryl hydrogen phosphite, and monooleyl hydrogen phosphite.

[0089] Examples of the component (D2) include trimethyl phosphite, triethyl phosphite, tri-n-butyl phosphite, tris(2-ethylhexyl) phosphite, triisooctyl phosphite, tridecyl phosphite, triisodecyl phosphite, tris(tridecyl) phosphite, trioleyl phosphite, tristearyl phosphite, triphenyl phosphite, tris(nonylphenyl) phosphite, diisodecyl pentaerythritol diphosphite, bis(tridecyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite, bis(nonylphenyl)pentaerythritol diphosphite, dimethyl hydrogen phosphite, and dibutyl phosphate. It is preferable that the phosphate absorbing agent contains one or more selected from the group consisting of hydrogen phosphite, di(2-ethylhexyl)hydrogen phosphite, dilauryl hydrogen phosphite, and dioleyl hydrogen phosphite, and it is more preferable that the phosphate absorbing agent contains one or more selected from the group consisting of trimethyl phosphite, triethyl phosphite, tri-n-butyl phosphite, tris(2-ethylhexyl)phosphite, triisooctyl phosphite, tridecyl phosphite, triisodecyl phosphite, tris(tridecyl)phosphite, trioleyl phosphite, tristearyl phosphite, triphenyl phosphite, and tris(nonylphenyl)phosphite.

[0090] When the composition of the present embodiment contains component (D), the content of component (D) in the composition of the present embodiment is, per 100 parts by mass of component (A), preferably at least 0.001 part by mass, more preferably at least 0.005 part by mass, even more preferably at least 0.01 part by mass, even more preferably at least 0.02 part by mass, even more preferably at least 0.05 part by mass, even more preferably at least 0.10 part by mass, and even more preferably at least 0.30 part by mass, from the viewpoint of obtaining a longer pot life; and is preferably at most 5.0 parts by mass, more preferably at most 3.0 parts by mass, and even more preferably at most 2.0 parts by mass, from the viewpoint of further improving the performance balance between moisture permeability and adhesiveness of the cured product.

[0091] (Component (E): Ether-based cure retarder) Component (E) is a cure retarder having an ether bond. Component (E) can be used alone or in combination of two or more different compounds.

[0092] Component (E) may be a chain ether or a cyclic ether. Examples of chain ethers include polyalkylene oxides such as polyethylene glycol, polypropylene glycol, and polyoxytetramethylene glycol. Examples of polyalkylene oxides include polyoxyethylene-dimethyl ether. Examples of cyclic ethers include crown ethers. Examples of crown ethers include 18-crown-6-ether and 15-crown-5-ether.

[0093] From the viewpoint of appropriate reactivity with cations, the component (E) is preferably a cyclic ether, more preferably a crown ether, and even more preferably 18-crown-6-ether.

[0094] When the composition of the present embodiment contains the component (E), the content of the component (E) in the composition of the present embodiment is, per 100 parts by mass of the component (A), preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, even more preferably 0.10 parts by mass or more, even more preferably 0.50 parts by mass or more, even more preferably 0.80 parts by mass or more, and even more preferably 1.0 part by mass or more, from the viewpoint of obtaining a longer pot life; and, from the viewpoint of further improving the performance balance between moisture permeability and adhesiveness, the content of the component (E) in the composition of the present embodiment is preferably 10.0 parts by mass or less, more preferably 8.0 parts by mass or less, even more preferably 5.0 parts by mass or less, and even more preferably 3.0 parts by mass or less.

[0095] (Component (F): Thioether-based cure retarder) The component (F) is a cure retarder having a thioether bond. The component (F) can be used alone or in combination of two or more different types.

[0096] Component (F) may be a chain thioether or a cyclic thioether. Examples of chain thioethers include diethyl thioether, isobutyl sulfide, and dithiaoctanediol. Examples of cyclic thioethers include 1,3-dithiane, 1,3,5-trithiane, 1,4,7-trithiacyclononane, and 1,4,8,11-tetrathiacyclotetradecane.

[0097] (Component (G): Metal complex-based cure retarder) The component (G) may be any metal complex that functions as a cure retarder. Examples of the component (G) include metal acetylacetonates. The component (G) may be used alone or in combination of two or more.

[0098] Examples of metal acetylacetonates include acetylacetonates of aluminum, titanium, zinc, zirconium, and copper. Among these, acetylacetonates of aluminum and zinc are preferred, and aluminum acetylacetonate is more preferred.

[0099] (Component (H): Nitroxy radical-based cure retarder) Component (H) is a cure retarder having a nitroxide group. Component (H) can be used alone or in combination of two or more different types.

[0100] Examples of the component (H) include 2,2,6,6-tetramethyl-1-piperidinyloxy (hereinafter referred to as TEMPO) or its derivatives such as 4-benzooxyloxy-TEMPO, 4-methoxy-TEMPO, 4-carboxyl-4-amino-TEMPO, 4-chloro-TEMPO, 4-hydroxylimine-TEMPO, 4-hydroxy-TEMPO, 4-oxo-TEMPO, and 4-amino-TEMPO; 2,2,5,5-tetramethyl-1-pyrrolidinyloxy (hereinafter referred to as PROXYL) or its derivatives such as 3-carboxyl-PROXYL, 3-carbamoyl-PROXYL, 2,2-dimethyl-4,5-cyclohexyl-PROXYL, 3-oxo-PROXYL, and 3-hydroxylimine- PROXYL, 3-aminomethyl-PROXYL, 3-methoxy-PROXYL, 3-t-butyl-PROXYL, 3-maleimido-PROXYL, 3,4-di-t-butyl-PROXYL, 3-carboxylic-2,2,5,5-tetramethyl-1-pyrrolidinyloxy, etc.; dialkyl nitroxide radicals or derivatives thereof such as di-t-butyl nitroxide and t-butyl-t-amyl nitroxide; diaryl nitroxide radicals or derivatives thereof such as diphenyl nitroxide; 4,4-dimethyl-1-oxazolidinyloxy (DOXYL) or derivatives thereof such as 2-di-t-butyl-DOXYL, 5-decane-DOXYL, and 2-cyclohexane-DOXYL; and the like.

[0101] As component (H), 2,2,6,6-tetramethyl-1-piperidinyloxy is preferred.

[0102] When the composition of the present embodiment contains the component (H), the content of the component (H) in the composition of the present embodiment is preferably at least 0.01 part by mass, and more preferably at least 0.02 part by mass, per 100 parts by mass of the component (A), from the viewpoint of obtaining a longer pot life, and is preferably at most 2.0 parts by mass, and more preferably at most 1.0 part by mass, from the viewpoint of further improving the performance balance between moisture permeability and adhesiveness.

[0103] The composition of this embodiment preferably contains the component (D) and the component (E) as the component (X). When the composition of this embodiment contains the component (D) and the component (E), the mass ratio (D1 / E1) of the content D1 of the component (D) to the content E1 of the component (E) is preferably 0.001 or more, more preferably 0.005 or more, even more preferably 0.01 or more, even more preferably 0.05 or more, even more preferably 0.10 or more, and even more preferably 0.20 or more, from the viewpoint of further improving the performance balance between moisture permeability and adhesiveness, and is preferably 2.0 or less, more preferably 1.5 or less, and even more preferably 1.0 or less.

[0104] When the total amount of the composition of the present embodiment is taken as 100% by mass, from the viewpoint of further improving coatability, the total amount of the (A), (B), and (X) components in the composition of the present embodiment is preferably 20% by mass or more, more preferably 25% by mass or more, even more preferably 30% by mass or more, even more preferably 35% by mass or more, even more preferably 40% by mass or more, and even more preferably 45% by mass or more, and is preferably 100% by mass or less, more preferably 90% by mass or less, and even more preferably 80% by mass or less.

[0105] [Component (I): Photosensitizer] The composition of this embodiment preferably contains a photosensitizer as component (I). The photopolymerization property can be further improved by using the cationic photopolymerization initiator (B1) and the photosensitizer (I) in combination. The photosensitizer (I) is not particularly limited, and known ones can be used, for example, 9-hydroxymethylanthracene, 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-dibutoxyanthracene, 9,10-dimethoxy-2-ethylanthracene, 9,10-diethoxy-2-ethylanthracene, 9,10-dipropoxy-2-ethylanthracene, 9,10-dimethoxy-2-chloroanthracene, 9,10-bis(octanoyloxy)anthracene, 9,10-dimethoxy ... Examples include helicene-2-sulfonic acid methyl ester, 9,10-diethoxyanthracene-2-sulfonic acid methyl ester, 9,10-dimethoxyanthracene-2-carboxylic acid methyl ester, thioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, anthraquinone, 1,2-dihydroxyanthraquinone, 2-ethylanthraquinone, and 1,4-diethoxynaphthalene.

[0106] In the composition of the present embodiment, the content of the photosensitizer (I), when the total composition is taken as 100% by mass, is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, even more preferably 0.05% by mass or more, and even more preferably 0.08% by mass or more, and is preferably 5% by mass or less, more preferably 3% by mass or less, even more preferably 1.5% by mass or less, and even more preferably 1% by mass or less, from the viewpoint of further improving curability.

[0107] [Component (J): Silane coupling agent] The composition of this embodiment preferably contains a silane coupling agent as component (J). Examples of component (J) include epoxy silanes, isocyanate silanes, amino silanes, mercapto silanes, epoxy silanes, vinyl silanes, and methacryl silanes. Among these, from the viewpoint of further improving adhesiveness, component (J) preferably includes one or two selected from the group consisting of epoxy silanes and amino silanes.

[0108] Examples of epoxy silanes include 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-glycidoxypropylmethyldiethoxysilane. Examples of aminosilanes include 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2(aminoethyl)3-aminopropylmethyldimethoxysilane, N-2(aminoethyl)3-aminopropyltrimethoxysilane, and N-phenyl-3-aminopropyltrimethoxysilane.

[0109] In the composition of the present embodiment, the content of the silane coupling agent (J) is, from the viewpoint of further improving adhesion, preferably 0.1% by mass or more, more preferably 0.3% by mass or more, even more preferably 0.5% by mass or more, and even more preferably 0.8% by mass or more, when the entire composition is taken as 100% by mass, and is preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 3% by mass or less, and even more preferably 1.5% by mass or less.

[0110] (Other ingredients) The composition of the present embodiment may further contain other components in addition to the component (A), the component (B), and the component (X).

[0111] Examples of other components include antioxidants, resin particles, metal deactivators, fillers, stabilizers, neutralizers, lubricants, and antibacterial agents.

[0112] The method for producing the composition of this embodiment is not particularly limited as long as it can sufficiently mix the above components. The method for mixing the components is not particularly limited, but examples include a stirring method that utilizes the stirring force associated with the rotation of a propeller, and a method that uses a conventional disperser such as a planetary stirrer that revolves around its axis. These mixing methods are preferred because they are low-cost and allow stable mixing.

[0113] The composition of the present embodiment can be cured by a curing method appropriate for the composition.

[0114] For example, in the case of a thermosetting composition, it may be cured by heating. The heating temperature of the composition is, from the viewpoint of further improving curability, preferably 45°C or higher, more preferably 50°C or higher, even more preferably 55°C or higher, even more preferably 60°C or higher, even more preferably 65°C or higher, even more preferably 70°C or higher, even more preferably 75°C or higher, even more preferably 80°C or higher, and even more preferably 85°C or higher, and from the viewpoint of preventing deterioration, for example, 200°C or lower, preferably 150°C or lower, more preferably 120°C or lower, even more preferably 110°C or lower, even more preferably 105°C, even more preferably 100°C or lower, and even more preferably 95°C or lower.

[0115] For example, in the case of a photocurable composition, it may be cured by irradiation with light. The light source for the irradiation light is not particularly limited, and examples thereof include a halogen lamp, a metal halide lamp, a high-power metal halide lamp (containing indium or the like), a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a xenon excimer lamp, a xenon flash lamp, and an LED. The above light sources each have different radiation wavelengths and energy distributions. Therefore, the light source can be appropriately selected depending on the reaction wavelength of the photocationic polymerization initiator. Natural light (sunlight) can also be used as a reaction initiation light source. The irradiation method may be direct irradiation, focused irradiation using a reflecting mirror or the like, or focused irradiation using a fiber or the like. Irradiation may also be carried out using a low wavelength cut filter, a heat ray cut filter, a cold mirror, or the like.

[0116] The amount of light irradiation is not particularly limited and may be adjusted appropriately depending on the thickness of the coating film of the composition, etc. The amount of light irradiation is, for example, 50 mJ / cm 2 More than 20000mJ / cm 2 may be less than or equal to 100 mJ / cm 2 More than 10000mJ / cm 2 The following is the result.

[0117] Next, the physical properties of the composition of this embodiment will be described.

[0118] In the composition of this embodiment, the shear rate is 0.0417 s -1 From the viewpoint of further improving the coatability, the viscosity η1 measured by is preferably 113,400 mPa·s or more, more preferably 130,000 mPa·s or more, even more preferably 150,000 mPa·s or more, and even more preferably 180,000 mPa·s or more, and is preferably 1,134,000 mPa·s or less, more preferably 1,000,000 mPa·s or less, even more preferably 900,000 mPa·s or less, even more preferably 800,000 mPa·s or less, even more preferably 700,000 mPa·s or less, and even more preferably 600,000 mPa·s or less.

[0119] In the composition of this embodiment, the shear rate is 0.0117 s -1 From the viewpoint of further improving the coatability, the viscosity η2 measured at is preferably 31,750 mPa·s or more, more preferably 50,000 mPa·s or more, even more preferably 80,000 mPa·s or more, even more preferably 100,000 mPa·s or more, and even more preferably 120,000 mPa·s or more, and is preferably 317,000 mPa·s or less, more preferably 300,000 mPa·s or less.

[0120] In the composition of this embodiment, the shear rate is 0.0417 s -1 The viscosity η1 (mPa·s) measured at a shear rate of 0.0117 s -1The thixotropy index, which is expressed as the ratio (η1 / η2) of the viscosity η2 (mPa s) measured at η1 / η2, is preferably 0.5 or more, more preferably 0.7 or more, and even more preferably 1.0 or more, from the viewpoint of further improving the coatability and further suppressing sagging, and is preferably 4.0 or less, more preferably 3.5 or less, even more preferably 3.0 or less, even more preferably 2.5 or less, and even more preferably 2.0 or less.

[0121] The viscosity and thixotropy index of the composition of this embodiment described above can be adjusted by adjusting the type and content of the inorganic filler (C) in the composition of this embodiment. The composition of the present embodiment has a viscosity and a thixotropic index within the above-described ranges, which improves the applicability of the composition and enables it to be used for dispenser application. More specifically, it is possible to achieve an optimal balance between good spreadability during application and suppression of sagging after application.

[0122] The viscosity and thixotropy index of the composition of the present embodiment described above are measured under the following conditions. Shear rate 0.0417 s -1 Viscosity η1 and 0.0117s -1 The viscosity η2 at is measured as follows: Apparatus: Cone-plate type viscometer Temperature: 25℃ Cone: 12mm radius, 3° angle Shear rate: 0.0417 s -1 or 0.0117s -1 Sample volume: 0.5 mL Atmosphere: Under air Furthermore, the thixotropy index (η1 / η2) can be calculated from the obtained η1 and η2. As the cone-plate viscometer, for example, a cone-plate type DV3T manufactured by BROOKFIELD Corporation can be used, and CPA-52Z can be used as the cone-plate, and CPA-44YZ (standard cup) can be used as the cup.

[0123] In the composition of the present embodiment, the glass transition temperature measured by dynamic viscoelasticity measurement is, from the viewpoint of further improving heat resistance, preferably 70°C or higher, more preferably 75°C or higher, even more preferably 80°C or higher, even more preferably 85°C or higher, and even more preferably 90°C or higher, and is preferably 150°C or lower, more preferably 145°C or lower, and even more preferably 140°C or lower. The glass transition temperature of the composition of this embodiment is measured as follows. The composition of this embodiment is applied to a substrate (for example, a polyethylene terephthalate film), and then another substrate of the same type is placed on top of the substrate and sandwiched between them. The substrate is then spread out to form a circle having a thickness of 100 μm and a diameter of 9 cm. Light of 365 nm wavelength is then irradiated at 6,000 mJ / cm using a high-pressure mercury lamp. 2 The composition is then irradiated under the conditions of and then heated at 85°C for 1 hour to obtain a cured product. The glass transition temperature (°C) of the obtained cured product is measured by dynamic viscoelasticity measurement at a temperature rise rate of 5°C / min.

[0124] In the composition of the present embodiment, the moisture permeability measured in accordance with JIS Z 0208:1976 is preferably 40 g / (m 2 24h) or less, preferably 38g / (m 2 24h) or less, more preferably 35g / (m 2 24h) or less, more preferably 33g / (m 2 24h) or less, more preferably 30g / (m 2 In the composition of the present embodiment, there is no lower limit to the moisture permeability measured in accordance with JIS Z 0208:1976. 2 24h) or more, and 5g / (m 2 24h) or more, and 10g / (m 2 24 hours or more). The moisture permeability of a composition is measured as follows. The composition of this embodiment is applied to a substrate (for example, a polyethylene terephthalate film), and then another substrate of the same type is placed on top of the substrate and sandwiched between them. The substrate is then spread out to form a circle having a thickness of 100 μm and a diameter of 9 cm. Light of 365 nm wavelength is then irradiated at 6,000 mJ / cm using a high-pressure mercury lamp. 2 The cured product was then heated at 85°C for 1 hour to obtain a cured product. The resulting cured product was then measured for moisture permeability (g / (m) in accordance with JIS Z 0208:1976. 2 Measure 24h).

[0125] In the composition of the present embodiment, the tensile shear strength A1 is preferably 15.0 MPa or more, more preferably 20.0 MPa or more, even more preferably 23.0 MPa or more, and even more preferably 25.0 MPa or more, from the viewpoint of further improving adhesion to the substrate, and is preferably 45.0 MPa or less, more preferably 40.0 MPa or less, even more preferably 38.0 MPa or less, and even more preferably 35.0 MPa or less.

[0126] In the composition of this embodiment, the tensile shear strength A2 after storage at 85°C and 85% RH for 7 days is preferably 16.0 MPa or more, more preferably 20.0 MPa or more, even more preferably 23.0 MPa or more, and even more preferably 25.0 MPa or more, from the viewpoint of further improving adhesion to a substrate after storage. In the composition of this embodiment, there is no upper limit to the tensile shear strength A2 after storage at 85°C and 85% RH for 7 days, but it may be, for example, 45.0 MPa or less, or 40.0 MPa or less.

[0127] In the composition of the present embodiment, the rate of decrease in tensile shear strength before and after 7 days of storage at 85°C and 85% RH is, from the viewpoint of further improving adhesion to the substrate, preferably 40% or less, more preferably 38% or less, even more preferably 35% or less, even more preferably 30% or less, even more preferably 25% or less, even more preferably 20% or less, even more preferably 15% or less, even more preferably 10% or less, and even more preferably 6% or less, and may be, for example, -50% or more, -35% or more, -10% or more, -5% or more, or 0% or more.

[0128] The tensile shear strength A1, the tensile shear strength A2 after storage at 85°C and 85% RH for 7 days, and the rate of decrease in tensile shear strength before and after storage at 85°C and 85% RH for 7 days of the composition of this embodiment are measured as follows. The composition of this embodiment was applied to the center of the surface of a 25 mm square non-alkali glass sheet to a diameter of 8 mm and a thickness of 8 mm, and another sheet of non-alkali glass was attached to it. The two sheets of non-alkali glass were then clamped together and irradiated with light of 365 nm wavelength at 6,000 mJ / cm using a high-pressure mercury lamp. 2 The specimen is then irradiated under the conditions of [Impression Irradiation] and heated at 85°C for 1 hour to prepare a test specimen. Next, the clamps are removed, and cold-rolled steel plates (SPCC-SD conforming to JIS G3141) measuring 100 mm in length, 25 mm in width, and 1.6 mm in thickness are bonded to the alkali-free glass on both sides of the specimen using a two-component acrylic adhesive. The two SPCC plates are then gripped and pulled using a tensile tester conforming to JIS K 6850:1999 at a temperature of 23°C, a pulling rate of 10 mm / min, and a jig distance of 70 mm, to measure the initial tensile shear strength A1 (MPa). Furthermore, the test piece is left to stand in an environment of a temperature of 85° C. and a relative humidity of 85% RH for 7 days, and then the tensile shear strength A2 (MPa) is measured in the same manner as the initial tensile shear strength A1. From the obtained A1 and A2 values, the reduction rate (%) of tensile shear strength before and after storage is calculated using the formula: ((A1-A2) / A1)×100.

[0129] The composition of the present embodiment has excellent applicability and can be applied using a dispenser. More specifically, the composition of the present embodiment has the above-described viscosity and thixotropy index, and is therefore suitable for dispenser application.

[0130] The use of the composition of this embodiment is not particularly limited, but since the composition of this embodiment has good adhesion to the substrate, it can be used as one or two of the damming agents and fillers in display devices. The composition of the present embodiment can also be used to encapsulate a light-emitting diode device, which preferably includes an organic electroluminescent display device or a micro LED. The composition of the present embodiment can also be used to seal solar cells, which preferably include perovskite solar cells.

[0131] The composition of the present embodiment may be cured into a predetermined shape (e.g., a film, a sheet, etc.) to form a cured encapsulating layer having a predetermined shape. In this case, for example, when assembling a display device, the cured encapsulating layer can be disposed on a light-emitting diode element to encapsulate the light-emitting diode element.

[0132] 2.Cured body The cured product of this embodiment is obtained by curing the composition of this embodiment.

[0133] The composition of the present embodiment has good adhesion to a substrate, and therefore the cured product of the present embodiment obtained by curing the composition of the present embodiment can be suitably used as a cured encapsulating layer (particularly, a cured encapsulating layer for a light-emitting diode element).

[0134] The conditions for obtaining the cured product of this embodiment are not particularly limited, and the conditions described above can be applied as the conditions for curing the composition of this embodiment.

[0135] 3.Display device The display device of the present embodiment includes a light-emitting diode element, a substrate, and a cured sealing layer containing the above-described cured body between the light-emitting diode element and the substrate.

[0136] The light-emitting diode element included in the display device of this embodiment preferably includes an organic electroluminescence display element or a micro LED, and more preferably includes a micro LED.

[0137] The substrate provided in the display device of this embodiment includes, for example, one or more types selected from the group consisting of a color filter, a glass substrate, a silicon substrate, a plastic substrate, and the like, and preferably includes a color filter.

[0138] 4. Solar cells The solar cell of the present embodiment includes a solar cell, a substrate, and a cured encapsulating layer including the cured body of the present embodiment between the solar cell and the substrate. The solar cell of the present embodiment preferably includes a perovskite solar cell.

[0139] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations can be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention. [Example]

[0140] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. Unless otherwise specified, the examples were tested at 23°C and a relative humidity of 50% RH.

[0141] (Examples 1 to 17, Comparative Examples 1 and 2) <Preparation of Composition> The components shown in Tables 1 to 3 were mixed in the composition ratios (parts by mass) shown in Tables 1 to 3 to prepare compositions of Examples and Comparative Examples. The components shown in Tables 1 to 3 have the following meanings.

[0142] (Component (A1): Alicyclic compound having an epoxy group) (a1-1) (3,3',4,4'-diepoxy)bicyclohexyl ("Celloxide 8010" manufactured by Daicel Chemical Industries, Ltd.) (a1-2) 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate ("Celloxide 2021P" manufactured by Daicel Chemical Industries, Ltd., molecular weight: 252.31)

[0143] (Component (A2): Aromatic compound having an epoxy group) (a2-1) Dibromophenyl glycidyl ether ("BR-250H" manufactured by Nippon Kayaku Co., Ltd., molecular weight 308) (a2-2) Tetrabromobisphenol A epoxy resin (DIC Corporation "EPICLON 152") (a2-3) Tetrabromobisphenol A epoxy resin (DIC Corporation, "EPICLON 153", molecular weight 636) (a2-4) Phenol novolac epoxy resin (DIC Corporation "N-775") (a2-5) Bisphenol F type epoxy resin (molecular weight: 320 to 340, Mitsubishi Chemical Corporation "jER806") (a2-6) Bisphenol A epoxy resin (molecular weight: 360 to 390, Mitsubishi Chemical Corporation "jER828")

[0144] (Component (B): Cationic polymerization initiator) (Component (B1): Photocationic Polymerization Initiator) (b1-1) Triarylsulfonium-tetrakispentafluorophenyl gallate ("CPI-310FG" manufactured by San-Apro Co., Ltd.) (b1-2) Triarylsulfonium salt hexafluoroantimonate (ADEKA Corporation "ADEKA Optomer SP-170", anion species is hexafluoroantimonate)

[0145] ((C) component: inorganic filler) ((C1) component) (c-1) Spherical alumina (Denka Co., Ltd. "DAW-03") (c-2) Spherical alumina (Denka Co., Ltd. "DAW-05") (c-3) Flake talc ("High Filler 5PA" manufactured by Matsumura Sangyo Co., Ltd.) (c-4) Talc ("MY4000" manufactured by Matsumura Sangyo Co., Ltd.) (c-5) Nano-sized zeolite ("Zeoal (registered trademark) 5A" manufactured by Nakamura Choukou Co., Ltd., primary particle diameter: 300 nm, Ca 2+ ionic coordination) ((C) components other than (C1)) (c-6) Spherical silica ("FB-5SDC" manufactured by Denka Co., Ltd.)

[0146] (Component (X): Curing retarder) (Component (D): Phosphate-based hardening retarder) (d-1) Phosphate-based hardening retarder, tris(2-ethylhexyl)phosphate ("TOP" manufactured by Daihachi Chemical Industry Co., Ltd.) (Component (E): Ether-based cure retarder) (e-1) Ether-based cure retarder, 18-crown-6-ether (Tokyo Chemical Industry Co., Ltd., "Crown Ether O-18")

[0147] (Component (I): Sensitizer) (i-1) Photosensitizer: 9,10-diethoxyanthracene (manufactured by Air Water Performance Chemicals Inc., "Anthracure (registered trademark) UVS-1101")

[0148] (Component (J): Silane coupling agent) (j-1) Epoxy silane coupling agent, 3-glycidoxypropyltrimethoxysilane ("KBM-403" manufactured by Shin-Etsu Chemical Co., Ltd.)

[0149] The resulting compositions of each example were measured for glass transition temperature, viscosity, thixotropy index, moisture permeability, and tensile shear strength, and were also evaluated for interfacial adhesion, as described below.

[0150] <Glass transition temperature> Each composition was applied to a polyethylene terephthalate film (Toyobo Co., Ltd., E7002, thickness: 38 μm), and then another polyethylene terephthalate film was placed on top of it, which was then spread out to form a circle with a thickness of 100 μm and a diameter of 9 cm. Light of 365 nm was applied using a high-pressure mercury lamp at a rate of 6,000 mJ / cm. 2 The cured product was then heated at 85°C for 1 hour to obtain a cured product. The glass transition temperature (°C) of the cured product was measured using a dynamic viscoelasticity measuring device (DMS7100 (EXSTAR), manufactured by Hitachi High-Technologies Corporation) at a heating rate of 5°C / min.

[0151] <Viscosity and thixotropy index> For each composition, the shear rate was measured at 0.0417 s under the following <Measurement Condition 1>. -1 The viscosity η1 was measured. <Measurement condition 1> Apparatus: Cone-plate type viscometer (manufactured by BROOKFIELD, product name "Cone-plate type DV3T") Temperature: 25℃ Corn plate: CPA-52Z (manufactured by Eiko Seiki Co., Ltd.) Cone: 12mm radius, 3° angle Shear rate: 0.0417 s -1 Sample volume: 0.5 mL Atmosphere: Under air In addition, under the above <Measurement Condition 1>, the shear rate was set to 0.0117 s -1 The same conditions as in <Measurement Condition 1> were used except that the shear rate was 0.0117 s -1 The viscosity η2 at this point was measured. The thixotropy index (η1 / η2) was calculated from the obtained η1 and η2.

[0152] <Moisture permeability> Each composition was applied to a polyethylene terephthalate film (Toyobo Co., Ltd., E7002, thickness: 38 μm), and then another polyethylene terephthalate film was placed on top of it, which was then spread out to form a circle with a thickness of 100 μm and a diameter of 9 cm. Light of 365 nm was applied using a high-pressure mercury lamp at a rate of 6,000 mJ / cm. 2 The cured product was then heated at 85°C for 1 hour to obtain a cured product. The moisture permeability (g / (m) of the cured product was measured in accordance with JIS Z 0208:1976. 2 The measurement was made over 24 hours. The average value of the two measurements was used as the measurement value.

[0153] <Tensile shear strength> The tensile shear strength of each composition was measured as follows. The composition of each example was applied to the center of the surface of a 25mm square piece of alkali-free glass to a diameter of 8mm and a thickness of 8mm, and another piece of alkali-free glass was attached to it. The two pieces of alkali-free glass were then clamped together and irradiated with light of 365nm wavelength at 6,000mJ / cm using a high-pressure mercury lamp. 2 The specimens were irradiated under the conditions of [Impression Irradiation] and heated at 85°C for 1 hour to prepare test specimens. The clamps were then removed, and cold-rolled steel plates (SPCC-SD, JIS G3141) measuring 100 mm in length, 25 mm in width, and 1.6 mm in thickness were bonded to the alkali-free glass on both sides of the specimen using a two-component acrylic adhesive (SGA adhesive, manufactured by Cemedine Co., Ltd.). The initial tensile shear strength A1 (MPa) was measured using a tensile tester (Shimadzu Corporation, Autograph AGX-VD) in accordance with JIS K 6850:1999, at a temperature of 23°C, a pulling rate of 10 mm / min, and a jig distance of 70 mm. The average value of five measurements was used as the measured value. The failure state of the specimens (cohesive failure or interfacial failure) was also evaluated. The test pieces were then left to stand for 7 days in an environment at 85°C and 85% relative humidity, after which the tensile shear strength A2 (MPa) was measured in the same manner as the initial tensile shear strength A1. The failure state of the test pieces (cohesive failure or interfacial failure) was also evaluated. From the obtained A1 and A2 values, the reduction rate (%) of tensile shear strength before and after storage was calculated using the formula: ((A1-A2) / A1)×100. Regarding the fracture state, "cohesive failure" refers to a fracture state occurring within the cured composition of the test piece. "Interface failure" refers to a fracture state occurring at the interface between the cured composition and the alkali-free glass of the test piece. Furthermore, "thin layer cohesion" refers to a cohesive failure occurring in a portion very close to the alkali-free glass, in contrast to "cohesive failure" which occurs in the center of the cured product, and refers to a state in which the cured product is attached to the extent that the alkali-free glass is visible through the surface. Furthermore, "substrate cracking" refers to a state in which the alkali-free glass is cracked. In addition, for example, "cohesion 9 / interface 1" in the table indicates that 90% of the area of ​​the test piece was cohesive failure and 10% was interfacial failure. Cohesive failure is preferred in that it reduces the variation in tensile shear strength and allows high-quality adhesion to be achieved, and it is preferred that the ratio of the area of ​​the cohesive failure portion to the total area ratio is large.

[0154] [Table 1]

[0155] [Table 2]

[0156] [Table 3]

Claims

1. a cationically polymerizable compound (A); a cationic polymerization initiator (B); an inorganic filler (C); Including, the inorganic filler (C) contains one or more selected from talc, alumina, silica, zeolite, and titanium oxide; the total amount of the one or more selected from the talc and the alumina is 1 part by mass or more and 100 parts by mass or less, when the total amount of the inorganic filler (C) is 100 parts by mass.

2. The composition according to claim 1, wherein the inorganic filler (C) comprises one or more selected from talc and alumina.

3. The composition of claim 2 , wherein the inorganic filler (C) comprises talc and silica.

4. The composition according to claim 3, wherein the ratio of the content of the silica to the content of the talc in the inorganic filler (C) (the content of the silica / the content of the talc) is 1.0 or more.

5. 3. The composition according to claim 1, wherein the viscosity measured under the following <Measurement Condition 1> is 113,400 mPa·s or more and 1,134,000 mPa·s or less. <Measurement Condition 1> Apparatus: Cone-plate type viscometer Temperature: 25℃ Cone: Radius 12mm, angle 3° Shear rate: 0.0417 s －１ Sample volume: 0.5 mL Atmosphere: Under air

6. 3. The composition according to claim 1, wherein the viscosity measured under the following <Measurement Condition 2> is 31,750 mPa·s or more and 317,000 mPa·s or less. <Measurement Condition 2> Apparatus: Cone-plate type viscometer Temperature: 25℃ Cone: Radius 12mm, angle 3° Shear rate: 0.0117 s －１ Sample volume: 0.5 mL Atmosphere: Under air

7. Shear rate 0.0417 s under the following <Measurement Condition 3> －１ Viscosity η measured at １ (mPa·s) and a shear rate of 0.0117 s －１ Viscosity η measured at ２ (mPa s) １ / η ２ 3. The composition according to claim 1, wherein the thixotropy index, expressed as a function of the thixotropy index (T) is 0.5 or more and 4.0 or less. <Measurement condition 3> Apparatus: Cone-plate type viscometer Temperature: 25℃ Cone: Radius 12mm, angle 3° Shear rate: 0.0417 s －１ or 0.0117s －１ Sample volume: 0.5 mL Atmosphere: Under air

8. The composition was irradiated with light of 365 nm wavelength at 6,000 mJ / cm using a high-pressure mercury lamp. ２ and subsequently heating at 85°C for 1 hour, the cured product has a glass transition temperature of 70°C or higher and 150°C or lower, as measured by dynamic viscoelasticity measurement at a heating rate of 5°C / min.

9. The composition was irradiated with light of 365 nm wavelength at 6,000 mJ / cm using a high-pressure mercury lamp. ２ and then heated at 85°C for 1 hour. The cured product had a moisture permeability of 40 g / (m2) as measured in accordance with JIS Z 0208:1976. ２ 3. The composition according to claim 1, wherein the storage time is 24 hours or less.

10. The composition according to claim 1 or 2, wherein the tensile shear strength defined below as <tensile shear strength> is 15.0 MPa or more and 45.0 MPa or less. <Tensile shear strength> The composition was applied to the center of the surface of a 25 mm square non-alkali glass sheet to a diameter of 8 mm and a thickness of 8 mm, and another sheet of non-alkali glass was attached to it. The two sheets of non-alkali glass were then clamped together and irradiated with light of 365 nm wavelength at 6,000 mJ / cm using a high-pressure mercury lamp. ２ and heated at 85°C for 1 hour to prepare a test piece, the clamps were removed, and SPCC plates 100 mm in length, 25 mm in width, and 1.6 mm in thickness were attached to the alkali-free glass on both sides of the test piece using a two-component acrylic adhesive, and then the tensile shear strength (MPa) was measured when the two SPCC plates were gripped and pulled at a temperature of 23°C and a pulling rate of 10 mm / min in accordance with JIS K 6850:1999.

11. The composition according to claim 1 or 2, wherein the tensile shear strength reduction rate (%) after storage in an environment of 85°C and 85% RH is 40% or less, as determined below in terms of <tensile shear strength reduction rate>. <Decrease in tensile shear strength> The composition was applied to the center of the surface of a 25 mm square non-alkali glass sheet to a diameter of 8 mm and a thickness of 8 mm, and another sheet of non-alkali glass was attached to it. The two sheets of non-alkali glass were then clamped together and irradiated with light of 365 nm wavelength at 6,000 mJ / cm using a high-pressure mercury lamp. ２ The specimen was irradiated under the conditions of 100 mm in length, 25 mm in width, and 1.6 mm in thickness, and heated at 85°C for 1 hour to prepare a test piece. The clamps were removed, and SPCC plates each having a length of 100 mm, a width of 25 mm, and a thickness of 1.6 mm were attached to the alkali-free glass on both sides of the test piece using a two-component acrylic adhesive. The two SPCC plates were then pulled at a temperature of 23°C and a pulling rate of 10 mm / min in accordance with JIS K 6850:1999, and the tensile shear strength was measured as the initial tensile shear strength A. １ (MPa), and the test piece was left standing in an environment of a temperature of 85°C and a relative humidity of 85% RH for 7 days, and then the initial tensile shear strength A １ The tensile shear strength measured in the same manner as above was defined as tensile shear strength A ２ (MPa), and the reduction rate (%) of tensile shear strength before and after storage was calculated using the formula: ((A １ -A ２ ) / A １ ) x 100.

12. The composition according to claim 1 or 2, which can be applied using a dispenser.

13. The composition according to claim 1 or 2, wherein the content of the inorganic filler (C) is 10 parts by mass or more and 300 parts by mass or less per 100 parts by mass of the cationically polymerizable compound (A).

14. The composition according to claim 1 or 2, wherein the content of the cationically polymerizable compound (A) is 20% by mass or more and 90% by mass or less, when the total amount of the composition is 100% by mass.

15. The composition according to claim 1 or 2, wherein the content of the cationic polymerization initiator (B) is 0.01 parts by mass or more and 5.0 parts by mass or less relative to 100 parts by mass of the cationic polymerizable compound (A).

16. The composition according to claim 1 or 2, wherein the cationically polymerizable compound (A) contains an epoxy group.

17. 17. The composition according to claim 16, wherein the cationically polymerizable compound (A) comprises one or more compounds selected from the group consisting of an alicyclic compound (A1) having an epoxy group, an aromatic compound (A2) having an epoxy group, and a glycidyl ether compound (A3).

18. The composition according to claim 1 or 2, wherein the cationically polymerizable compound (A) contains a bromine atom.

19. 3. The composition according to claim 1, wherein the cationic polymerization initiator (B) comprises one or more selected from the group consisting of a photocationic polymerization initiator (B1) and a thermal cationic polymerization initiator (B2).

20. 20. The composition of claim 19, wherein the cationic polymerization initiator (B) comprises an onium salt compound.

21. The composition according to claim 1 or 2, which can be used as one or two of the damming agents and fillers in a display device.

22. The composition according to claim 1 or 2, wherein the composition can be used to encapsulate a light-emitting diode device or a solar cell.

23. 23. The composition of claim 22, wherein the light emitting diode device comprises an organic electroluminescent display device or a micro LED.

24. 23. The composition of claim 22, wherein the solar cell comprises a perovskite solar cell.

25. A cured product obtained by curing the composition according to claim 1 or 2.

26. A display device comprising: a light-emitting diode element; a substrate; and a cured sealing layer between the light-emitting diode element and the substrate, the cured body according to claim 25.

27. 27. The display device of claim 26, wherein the light emitting diode elements comprise organic electroluminescent display elements or micro LEDs.

28. A solar cell comprising: a solar cell; a substrate; and a cured encapsulating layer between the solar cell and the substrate, the cured body according to claim 25.

29. 30. The solar cell of claim 28, wherein the solar cell comprises a perovskite solar cell.

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