Manufacturing method for polishing member

Abstract

To provide a manufacturing method for a polishing member that is excellent in environmental performance.SOLUTION: The manufacturing method for a polishing member comprises: a first applying step of applying conductive resin to a base material that is an insulator; a second applying step of electrostatically applying powder resin and polishing particles to the base material; and a heating step of heating the base material so that powder resin is melted and the polishing particles are fixed to the base material.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a polishing member. [Background technology]

[0002] Many methods for manufacturing abrasive members have been proposed (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 05-253851 [Patent Document 2] Japanese Patent Application Laid-Open No. 2005-144628 Summary of the Invention [Problem to be solved by the invention]

[0004] For example, abrasive members are manufactured by coating a substrate with a binder resin and then attaching abrasive particles to the binder resin. Organic solvents are used in this type of binder resin. These organic solvents have a significant environmental impact because they are released into the atmosphere during the manufacturing process.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a method for producing an abrasive member that is environmentally friendly. [Means for solving the problem]

[0006] The above object can be achieved by a method for manufacturing an abrasive member, which includes a first application step of applying a conductive resin to an insulating substrate, a second application step of electrostatically applying powder resin and abrasive particles to the substrate, and a heating step of heating the substrate so that the powder resin melts and the abrasive particles are fixed to the substrate.

[0007] The second application step may include electrostatically applying the powder resin to the substrate, electrostatically applying the abrasive particles toward the powder resin on the substrate, and electrostatically applying the powder resin again toward the abrasive particles on the substrate.

[0008] The second application step may include electrostatically applying the mixture of the powder resin and the abrasive particles to the substrate.

[0009] The heating step may be carried out during the second applying step.

[0010] The heating step may heat the substrate using a heating element heated by induction heating.

[0011] The second applying step may be performed before the conductive resin applied to the base material in the first applying step is cured, and the heating step may be performed to cure the conductive resin.

[0012] The substrate may be a sheet, a film, or a continuous strip-shaped member.

[0013] The substrate may be any of a plastic film, paper, nonwoven fabric, and woven fabric.

[0014] The powder resin may be thermosetting and contain at least one of epoxy-based, epoxy polyester-based, polyester-based, acrylic-based, and fluororesin-based powders.

[0015] The powder resin may be thermoplastic and may contain powder of at least one of vinyl chloride, polyethylene, and nylon.

[0016] The powder resin may be thermoplastic and may include powder of an engineering plastic.

[0017] The engineering plastic may be PPS, PEEK, or PI. [Effects of the Invention]

[0018] According to the present invention, it is possible to provide an environmentally friendly method for producing a polishing member. [Brief explanation of the drawings]

[0019] [Figure 1] 3A to 3C are explanatory diagrams of a method for manufacturing a polishing member. DETAILED DESCRIPTION OF THE INVENTION

[0020] FIG. 1 is an explanatory diagram of the manufacturing method of the polishing member of this embodiment. The substrate W is wound into a roll. One end of the substrate W is transported to the right in FIG. 1 by a roller or the like (not shown). The substrate W is an insulator. The coating devices 5, 10, 20, and 30 are installed so as to face the substrate W in order in the transport direction of the substrate W. The coating devices 5, 10, 20, and 30 are arranged at predetermined intervals from each other in the transport direction of the substrate W. The heating device 40 is installed so as to face the substrate W across the area where the coating devices 10, 20, and 30 are installed.

[0021] The coating device 5 coats the conductive resin onto the upper surface of the substrate W. The process performed by the coating device 5 is an example of a first coating process. The conductive resin is coated by spraying using compressed air, for example.

[0022] Next, the coating device 10 electrostatically coats the powder resin onto the upper surface of the substrate W. The electrostatic coating is performed by charging the conductive resin coated on the substrate W described above. The process performed by the coating device 10 is a so-called undercoating process. Next, the coating device 20 electrostatically coats abrasive particles onto the surface of the substrate W onto which the powder resin has been coated. Next, the coating device 30 electrostatically coats powder resin again onto the surface of the substrate W onto which the abrasive particles have been coated. The process performed by the coating device 30 is a so-called topcoating process. The process performed by the coating devices 10, 20, and 30 is an example of a second coating process.

[0023] During the coating process performed by the coating devices 10, 20, and 30, the substrate W is heated by the heating device 40. The heating device 40 includes a coil through which an alternating current flows and a conductive heating element that generates heat when an induced current flows through the coil when current is applied. The substrate W is heated by the heat from this heating element. The process performed by the heating device 40 corresponds to a heating process. As a result, the conductive resin sprayed onto the substrate W from the coating device 5 and the powdered resin sprayed onto the substrate W from the coating devices 10 and 30 melt. As a result, when the substrate W separates from the heating device 40, the substrate W cools, and the conductive resin and powdered resin on the substrate W solidify. The abrasive particles coated on the substrate W in this manner are fixed to the substrate W. The substrate W is then cut to the desired size to produce a sheet-like abrasive member.

[0024] As described above, this manufacturing method is environmentally friendly because it does not use organic solvents. Furthermore, compared to when organic solvents are used, when powder resins are used, maintenance and management are easier. Therefore, the manufacturing of abrasive members using this manufacturing method can be carried out unmanned.

[0025] As described above, before applying powder resin or the like to the insulating substrate W, the conductive resin is applied. This makes it possible to subsequently electrostatically apply the powder resin or the like to the insulating substrate W. Electrostatic application makes it possible to apply the powder resin and abrasive particles to the substrate W with a uniform thickness.

[0026] Furthermore, before the abrasive particles are applied, powder resin is applied to the base material W, and after the abrasive particles are applied, powder resin is again applied to the base material W. This improves the fixation of the abrasive particles.

[0027] Furthermore, the substrate W is heated while the powder resin and abrasive particles are being applied to the substrate W. This reduces the manufacturing time. Note that the substrate W may be heated while the conductive resin is being applied by the application device 5, as long as the conductive resin applied to the substrate W by the application device 5 is not hardened. This allows the substrate W to be heated to a certain temperature before the powder resin is applied, so that the powder resin applied thereafter can be melted quickly, reducing the manufacturing time. Note that the conductive resin may be applied to the substrate W and hardened before the powder resin or the like is applied to the substrate W.

[0028] The applicators 10, 20, and 30 are spaced apart from one another. Therefore, even if, for example, the powder resin sprayed from the applicator 10 or 30 falls off the substrate W, and the abrasive particles sprayed from the applicator 20 fall off the substrate W, the powder resin and the abrasive particles are prevented from mixing around the applicators 10, 20, and 30. As a result, the powder resin and the abrasive particles can be easily collected separately. The collected powder resin and the abrasive particles can be reused. In this way, the material reuse rate is improved. The powder resin and the abrasive particles may be mixed in advance, and the mixture may be applied to the substrate W. In this case, the number of applications is reduced.

[0029] The powder resins applied by the application devices 10 and 30 may be the same or different types of powder resins. The amounts of the powder resins applied by the application devices 10 and 30 may be the same or different.

[0030] The powder of the powder resin may be thermosetting or thermoplastic. Thermosetting powders include epoxy-based powder resins, polyester-based powder resins, epoxy-polyester-based powder resins, fluororesin-based powder resins, and acrylic-based powder resins. Thermoplastic powders include vinyl chloride, polyethylene, nylon, and the like.

[0031] The substrate W is, for example, a sheet, film, or continuous strip-shaped member. The substrate W is, for example, any of a plastic film, paper, nonwoven fabric, and woven fabric. Commercially available alumina (Al2O3), silica (SiO2), silicon carbide (SiC), diamond, cubic boron nitride (cBN), etc. can be used as abrasive particles. Abrasive particles of various particle sizes can be selected to suit the object to be polished.

[0032] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and variations are possible within the scope of the gist of the present invention as defined in the claims. [Explanation of symbols]

[0033] W Base material 5, 10, 20, 30 Coating equipment 40 Heating device

Claims

1. a first application step of applying a conductive resin to a base material that is an insulator; a second coating step of electrostatically coating the powder resin and the abrasive particles onto the substrate; a heating step of heating the substrate so that the powder resin melts and the abrasive particles are fixed to the substrate; A method for manufacturing a polishing member comprising:

2. 2. The method for manufacturing an abrasive member according to claim 1, wherein the second application step includes electrostatically applying the powder resin to the substrate, electrostatically applying the abrasive particles toward the powder resin on the substrate, and again electrostatically applying the powder resin toward the abrasive particles on the substrate.

3. The method for manufacturing an abrasive member according to claim 1 , wherein the second coating step comprises electrostatically coating the mixture of the powdered resin and the abrasive particles onto the substrate.

4. 4. The method for manufacturing an abrasive member according to claim 1, wherein the heating step is carried out during the second applying step.

5. 4. The method for manufacturing a polishing member according to claim 1, wherein the heating step heats the substrate using a heater heated by induction heating.

6. the second coating step is performed before the conductive resin coated on the base material in the first coating step is cured, 4. The method for manufacturing a polishing member according to claim 1, wherein the heating step hardens the conductive resin.

7. 4. The method for manufacturing an abrasive member according to claim 1, wherein the substrate is a sheet, a film, or a continuous strip-shaped member.

8. 4. The method for manufacturing an abrasive member according to claim 1, wherein the substrate is one of a plastic film, paper, a nonwoven fabric, and a woven fabric.

9. 4. The method for manufacturing an abrasive member according to claim 1, wherein the powder resin is thermosetting and contains at least one powder selected from the group consisting of epoxy, epoxy polyester, polyester, acrylic, and fluororesin.

10. 4. The method for manufacturing an abrasive member according to claim 1, wherein the powdered resin is thermoplastic and contains at least one powder of vinyl chloride, polyethylene, or nylon.

11. 4. The method for manufacturing an abrasive member according to claim 1, wherein the powdered resin is thermoplastic and contains powder of engineering plastic.

12. The method for manufacturing an abrasive member according to claim 11, wherein the engineering plastic is PPS, PEEK, or PI.

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