Radiation detection module and radiation detector

Abstract

To provide a radiation detection module having high manufacturing yield, and a radiation detector comprising the radiation detection module.SOLUTION: A radiation detection module comprises a radiation detection panel, a first wiring board, and a first adhesive AD1. A photoelectric conversion substrate 2 of the radiation detection panel has a substrate 2a having flexibility and including a body part 2aa and a first projection (2ab), a plurality of photoelectric conversion elements 2b1, a plurality of first pads (2d1), and a plurality of first wires. The first adhesive AD1 joins a first projection area PAb of the photoelectric conversion substrate 2 and the first wiring board to each other. In regard to the shortest distance D1, D1>0.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] FIELD OF THE INVENTION Embodiments of the present invention relate to a radiation detection module and a radiation detector. [Background technology]

[0002] Known radiation detectors include, for example, X-ray detectors (X-ray flat panel detectors). The X-ray detection module of the X-ray detector includes an X-ray detection panel and an FPC (flexible printed circuit board). The X-ray detection panel includes a photoelectric conversion substrate having a glass substrate as a base material, and a scintillator layer formed on the photoelectric conversion substrate. The scintillator layer converts X-rays into fluorescence. The scintillator layer contains, for example, cesium iodide (CsI). The photoelectric conversion substrate converts the fluorescence into an electrical signal.

[0003] The FPC is connected to the photoelectric conversion substrate by thermocompression bonding using an anisotropic conductive film (ACF). The photoelectric conversion substrate is connected to a drive circuit and a readout circuit via the FPC. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2020-197441 [Patent Document 2] Japanese Patent Application Laid-Open No. 2015-50327 Summary of the Invention [Problem to be solved by the invention]

[0005] The present embodiment provides a radiation detection module with a high manufacturing yield and a radiation detector including the radiation detection module, or provides a radiation detection module with excellent product reliability and a radiation detector including the radiation detection module. [Means for solving the problem]

[0006] The radiation detection module according to one embodiment includes: a radiation detection panel; a first flexible printed circuit board; a first adhesive material; The radiation detection panel comprises: a photoelectric conversion substrate including a flexible base material including a main body portion located in a detection region and a non-detection region surrounding the detection region, and a first protrusion portion protruding from a first end of the main body portion, being formed physically continuous with the main body portion, and located in a first protrusion region outside the non-detection region; a plurality of photoelectric conversion elements provided above the main body portion and located in the detection region; a plurality of first pads provided above the first protrusion portion; and a plurality of first wirings located above the main body portion and the first protrusion portion; each of the first wirings is electrically connected to a corresponding one of the plurality of first pads and to two or more corresponding photoelectric conversion elements of the plurality of photoelectric conversion elements; the first adhesive material bonds the first protruding region of the photoelectric conversion substrate and the first flexible printed circuit board, and electrically connects the plurality of first pads and the first flexible printed circuit board; When the shortest distance from the first end to the first adhesive along the surface on which the plurality of first pads of the first protruding portion are provided is D1, D1>0.

[0007] Moreover, the radiation detector according to one embodiment includes: the radiation detection module; a circuit board electrically connected to the first flexible printed circuit board and driving the photoelectric conversion board, the detection region and the non-detection region of the base material are located between a group including the circuit board and the first flexible printed circuit board and the plurality of photoelectric conversion elements; The first protruding region of the photoelectric conversion substrate is curved. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a cross-sectional view showing an X-ray detector according to the first embodiment. [Figure 2] FIG. 2 is an exploded perspective view showing the support substrate, the X-ray detection panel, and the circuit board of the X-ray detector, and also showing the image transmission unit. [Figure 3] FIG. 3 is an enlarged cross-sectional view showing a detection area of ​​the X-ray detection module of the X-ray detector. [Figure 4] FIG. 4 is a plan view showing a part of the X-ray detector, showing a plurality of first projecting regions and a plurality of second projecting regions of the photoelectric conversion substrate in an expanded state. [Figure 5] FIG. 5 is a cross-sectional view showing a part of the X-ray detector shown in FIG. 4 along line VV. [Figure 6] FIG. 6 is an enlarged cross-sectional view showing the detection area, non-detection area, and first protruding area of ​​the X-ray detection panel, the light reflecting layer, the moisture-proof cover, the sealing portion, the flexible printed circuit board (FPC), and the first adhesive, and is a view showing the first protruding area in an expanded state. [Figure 7] FIG. 7 is an enlarged plan view showing the non-detection region and first protruding region of the X-ray detection panel, the FPC, and the first adhesive, and is a view showing the first protruding region in a developed state. [Figure 8] FIG. 8 is an enlarged plan view showing the non-detection region and second projecting region of the X-ray detection panel, the FPC, and the second adhesive, and is a view showing the second projecting region in a developed state. [Figure 9] FIG. 9 is an enlarged cross-sectional view showing a part of the X-ray detector. [Figure 10] FIG. 10 is an enlarged plan view showing the non-detection region and the first protruding region of the X-ray detection panel according to the first modification of the first embodiment, and the first adhesive, and is a view showing the first protruding region in an expanded form. [Figure 11] FIG. 11 is an enlarged plan view showing the non-detection region and the first protruding region of the X-ray detection panel according to the second modification of the first embodiment, and the first adhesive, and is a view showing the first protruding region in an expanded form. [Figure 12]FIG. 12 is an enlarged plan view showing the non-detection region and the first protruding region of the X-ray detection panel according to the third modification of the first embodiment, and the first adhesive, and is a view showing the first protruding region in an expanded form. [Figure 13] FIG. 13 is an enlarged plan view showing the non-detection region and the first protruding region of the X-ray detection panel according to the fourth modification of the first embodiment, and the first adhesive, and is a view showing the first protruding region in an expanded form. [Figure 14] FIG. 14 is an enlarged plan view showing the non-detection region and the first protruding region of the X-ray detection panel according to the fifth modification of the first embodiment, and the first adhesive, and is a view showing the first protruding region in an expanded form. [Figure 15] FIG. 15 is a plan view showing a part of an X-ray detector according to a sixth modification of the first embodiment, and is a diagram showing a developed view of a plurality of first projecting regions and a plurality of second projecting regions of a photoelectric conversion substrate. [Figure 16] FIG. 16 is an enlarged plan view showing the non-detection region and the first protruding region of the X-ray detection panel according to the sixth modification, an FPC, and a first adhesive, and is a view showing the first protruding region in a developed form. [Figure 17] FIG. 17 is an enlarged plan view showing the non-detection region and second protruding region of the X-ray detection panel according to the sixth modification, an FPC, and a second adhesive, and is a view showing the second protruding region in an expanded state. [Figure 18] FIG. 18 is a cross-sectional view for explaining the manufacturing method of the X-ray detector according to the sixth modification, showing a state in which a laser beam is irradiated onto the base material of the X-ray detection panel from the back side of the substrate using a laser. [Figure 19] FIG. 19 is a cross-sectional view illustrating the manufacturing method, following FIG. 18, showing a state in which the X-ray detection panel is being peeled off from the substrate. [Figure 20] FIG. 20 is a cross-sectional view for explaining another method of manufacturing the X-ray detector according to the sixth modification, showing a state in which the X-ray detection panel is peeled off from the substrate using a winding machine. [Figure 21]FIG. 21 is a plan view showing a photoelectric conversion substrate according to Modification 7 of the first embodiment, and is a developed view showing a plurality of first projected regions and a plurality of second projected regions of the photoelectric conversion substrate. [Figure 22] FIG. 22 is a plan view showing a part of an X-ray detector according to Modification 8 of the first embodiment, and is a diagram showing a developed view of a plurality of first projecting regions and a plurality of second projecting regions of a photoelectric conversion substrate. [Figure 23] FIG. 23 is a plan view showing a part of an X-ray detector according to Modification 9 of the first embodiment, and is a view showing a plurality of first projecting regions of a photoelectric conversion substrate in a developed state. [Figure 24] FIG. 24 is a plan view showing a part of an X-ray detector according to a tenth modification of the first embodiment, and is a developed view showing the first and second protruding regions of the photoelectric conversion substrate. [Figure 25] FIG. 25 is a cross-sectional view showing a part of the X-ray detector according to the second embodiment, and is a developed view of the second protruding region of the photoelectric conversion substrate. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, each embodiment of the present invention will be described with reference to the drawings. The disclosure is merely an example, and appropriate modifications that a person skilled in the art can easily conceive while maintaining the gist of the invention are naturally included within the scope of the present invention. Furthermore, in order to clarify the explanation, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment, but these are merely examples and are not intended to limit the interpretation of the present invention. Furthermore, in this specification and each drawing, elements similar to those described above with reference to the previous drawings will be designated by the same reference numerals, and detailed descriptions may be omitted as appropriate.

[0010] First, the basic concept of the embodiment of the present invention will be described. An X-ray detector serving as a radiation detector includes an X-ray detection module. In the X-ray detection panel of the X-ray detection module, the base material of the photoelectric conversion substrate is made of glass. Recently, technological development has been underway to attempt to use a flexible and bendable base material for the photoelectric conversion substrate. An example of the material for the base material is resin. Compared to glass base materials, resin base materials are lighter and bendable, and therefore have the characteristics of being more resistant to impact and less likely to break.

[0011] In the manufacturing process of an X-ray detector, it is undesirable for the base material of the photoelectric conversion substrate to deform during the manufacturing period in which multiple photoelectric conversion units, scintillator layers, etc. of an X-ray detection panel are formed. Therefore, when manufacturing a flexible photoelectric conversion substrate, it is conceivable to form a resin base material on a highly rigid substrate such as a glass substrate, and then form multiple photoelectric conversion units, scintillator layers, etc. above the base material. A commonly used method is to peel the highly rigid substrate from the base material after manufacturing the multiple photoelectric conversion units, scintillator layers, etc.

[0012] Several methods are known for peeling the substrate from the base material, such as mechanical peeling and laser irradiation. In particular, when the substrate is mechanically peeled, the base material (photoelectric conversion substrate) is significantly bent near the area where the substrate is peeled from the base material. Furthermore, during the manufacture and use of the X-ray detector, an external force that deforms the photoelectric conversion substrate may act on the X-ray detector.

[0013] For example, when a flexible photoelectric conversion substrate is transported, if the photoelectric conversion substrate is supported from below near both ends, the photoelectric conversion substrate may bend significantly due to gravity acting on the photoelectric conversion substrate.

[0014] In addition, the FPC (Flexible Printed Circuit) is connected to the peripheral edge of the photoelectric conversion substrate by thermocompression bonding using anisotropic conductive film (ACF). The FPC is electrically connected to multiple pads located on the peripheral edge of the photoelectric conversion substrate. If local deformation occurs on the peripheral edge of the photoelectric conversion substrate while the FPC is connected to the photoelectric conversion substrate, there is a risk that the FPC will peel off from the photoelectric conversion substrate.

[0015] Therefore, embodiments of the present invention are intended to improve upon these problems, and to provide an X-ray detection module with a high manufacturing yield and an X-ray detector equipped with the X-ray detection module. Alternatively, an X-ray detection module with excellent product reliability and an X-ray detector equipped with the X-ray detection module can be provided. An X-ray detector in which the FPC does not peel off from the photoelectric conversion substrate even if deformation occurs in the photoelectric conversion substrate can be provided. Next, means and techniques for improving the above problems will be described.

[0016] (First embodiment) First, a first embodiment will be described. Fig. 1 is a cross-sectional view showing an X-ray detector 1 according to the first embodiment. The X-ray detector 1 is an X-ray image detector, and is a flat panel X-ray detector that uses an X-ray detection panel.

[0017] As shown in FIG. 1, the X-ray detector 1 includes an X-ray detection module 10, a support substrate 12, a circuit board 11, spacers 9a and 9b, a housing 51, an entrance window 52, ​​etc. The X-ray detection module 10 includes an X-ray detection panel PNL, a moisture-proof cover 7, and a flexible printed circuit (FPC) 3c serving as a wiring board. The FPC 3c in FIG. 1 is a second FPC serving as a second wiring board. The X-ray detection panel PNL is located between the support substrate 12 and the moisture-proof cover 7. The moisture-proof cover 7 faces the entrance window 52.

[0018] The entrance window 52 is attached to an opening of the housing 51. The entrance window 52 allows X-rays to pass through. Therefore, the X-rays pass through the entrance window 52 and enter the X-ray detection module 10. The entrance window 52 is formed in a plate shape and has the function of protecting the inside of the housing 51. It is desirable that the entrance window 52 be formed thin and made of a material with low X-ray absorption. In this embodiment, the entrance window 52 is formed of carbon-fiber-reinforced plastic (CFRP). This makes it possible to reduce scattering of X-rays and attenuation of the X-ray amount that occur at the entrance window 52. As a result, a thin and lightweight X-ray detector 1 can be realized.

[0019] The X-ray detection module 10, the support substrate 12, the circuit board 11, etc. are housed inside a space surrounded by a housing 51 and an entrance window 52. The support substrate 12 has a first main surface SU1, a second main surface SU2 opposite to the first main surface SU1, and a side surface SU4 between the first main surface SU1 and the second main surface SU2.

[0020] The X-ray detection module 10 is configured by laminating thin members, and is therefore light and has low mechanical strength. For this reason, the X-ray detection panel PNL (X-ray detection module 10) is fixed to a first main surface SU1 of the support substrate 12. The support substrate 12 is formed into a plate shape from, for example, lead, and has the strength (elastic modulus) required to stably hold the X-ray detection panel PNL. This makes it possible to prevent damage to the X-ray detection panel PNL when vibrations or impacts are applied to the X-ray detector 1 from the outside. The support substrate 12 may be formed from any material with a high elastic modulus, such as an aluminum alloy, stainless steel, glass, or CFRP.

[0021] The circuit board 11 is fixed to a support substrate 12. In this embodiment, the circuit board 11 is fixed to a second main surface SU2 of the support substrate 12. The circuit board 11 is fixed to the inner surface of the housing 51 via spacers 9a and 9b. By using the spacers 9a and 9b, an electrical insulation distance can be maintained between the housing 51, which is mainly made of metal, and the circuit board 11. The housing 51 supports the support substrate 12 and the like via the circuit board 11 and the spacers 9a and 9b.

[0022] The X-ray detection panel PNL has a wiring portion 2e2 on its periphery. The wiring portion 2e2 functions as an FPC. An FPC 3c is connected to the wiring portion 2e2. The FPC 3c is connected to a circuit board 11. The wiring portion 2e2 can be bent 180 degrees and passes through a space facing a side surface SU4 of the support substrate 12. A connector corresponding to the FPC 3c is mounted on the circuit board 11, and the FPC 3c is electrically connected to the circuit board 11 via the connector. The circuit board 11 is electrically connected to the X-ray detection panel PNL via the connector. The circuit board 11 electrically drives the X-ray detection panel PNL and electrically processes output signals from the X-ray detection panel PNL.

[0023] 2 is an exploded perspective view showing the support substrate 12, the X-ray detection panel PNL, and the circuit board 11 of the X-ray detector 1 of this embodiment, and also showing the image transmission unit 4. Note that Fig. 2 does not show all of the components of the X-ray detector 1. Some components of the X-ray detector 1, such as a sealing unit described below, are not shown in Fig. 2.

[0024] As shown in Fig. 2, the X-ray detection panel PNL includes a photoelectric conversion substrate 2, a scintillator layer 5, etc. The photoelectric conversion substrate 2 includes a base material 2a, a plurality of photoelectric conversion units 2b, a plurality of control lines (or gate lines) 2c1, a plurality of data lines (or signal lines) 2c2, a plurality of wiring units 2e1, 2e2, etc. The wiring unit 2e1 functions as an FPC. Note that the numbers, arrangements, etc. of the photoelectric conversion units 2b, the control lines 2c1, the data lines 2c2, and the wiring units 2e1, 2e2 are not limited to those shown in Fig. 2.

[0025] The plurality of control lines 2c1 extend in the row direction X and are arranged at predetermined intervals in the column direction Y. The plurality of data lines 2c2 extend in the column direction Y, intersect with the plurality of control lines 2c1, and are arranged at predetermined intervals in the row direction X. In this embodiment, the row direction X and the column direction Y are orthogonal to each other, but they may intersect at an angle other than 90°.

[0026] A plurality of photoelectric conversion units 2b are provided on one main surface of the substrate 2a. The photoelectric conversion units 2b are provided in a rectangular region defined by control lines 2c1 and data lines 2c2. One photoelectric conversion unit 2b corresponds to one pixel of an X-ray image. The plurality of photoelectric conversion units 2b are arranged in a matrix in the row direction X and the column direction Y. As described above, the photoelectric conversion units 2b are an array substrate.

[0027] Each photoelectric conversion unit 2b has a photoelectric conversion element 2b1 and a TFT (thin film transistor) 2b2 as a switching element. The TFT 2b2 is connected to a corresponding one of the control lines 2c1 and a corresponding one of the data lines 2c2. The photoelectric conversion element 2b1 is electrically connected to the TFT 2b2. The control lines 2c1 are electrically connected to the circuit board 11 via the FPC 3c etc. The circuit board 11 provides control signals S1 to the plurality of control lines 2c1. Therefore, the circuit board 11 can drive the photoelectric conversion board 2.

[0028] The X-ray detection panel PNL has a wiring portion 2e1 on its periphery. The wiring portion 2e1 functions as an FPC. An FPC 3b is connected to the wiring portion 2e1. The FPC 3b is connected to the circuit board 11 in the same manner as the FPC 3c. The FPC 3b is a first FPC that serves as a first wiring board.

[0029] The wiring portion 2e1, like the wiring portion 2e2, can be bent 180° and passes through a space facing the side surface SU3 of the support substrate 12. The side surface SU3 is located between the first main surface SU1 and the second main surface SU2 of the support substrate 12. A connector corresponding to the FPC 3b is mounted on the circuit board 11, and the FPC 3b is electrically connected to the circuit board 11 via the connector. The circuit board 11 is electrically connected to the X-ray detection panel PNL via the connector.

[0030] The data line 2c2 is electrically connected to the circuit board 11 via the FPC 3b etc. The image data signal S2 (charges accumulated in the photoelectric conversion unit 2b) converted by the photoelectric conversion element 2b1 is transmitted to the circuit board 11 via the TFT 2b2, the data line 2c2, the FPC 3b etc.

[0031] The X-ray detector 1 further includes an image transmission unit 4. The image transmission unit 4 is connected to the circuit board 11 via wiring 4a. The image transmission unit 4 may be incorporated into the circuit board 11. The image transmission unit 4 generates an X-ray image based on image data signals that have been converted into digital signals by a plurality of analog-to-digital converters (not shown). The generated X-ray image data is output from the image transmission unit 4 to an external device.

[0032] FIG. 3 is an enlarged cross-sectional view showing the detection area DA of the X-ray detection module 10 of the X-ray detector 1 according to this embodiment. 3, the photoelectric conversion substrate 2 has a base material 2a, a plurality of photoelectric conversion units 2b, and insulating layers 21, 22, 23, 24, and 25. The plurality of photoelectric conversion units 2b are located in a detection area DA. Each photoelectric conversion unit 2b includes a photoelectric conversion element 2b1 and a TFT 2b2.

[0033] The TFT 2b2 has a gate electrode GE, a semiconductor layer SC, a source electrode SE, and a drain electrode DE. The photoelectric conversion element 2b1 is configured as a photodiode. Note that the photoelectric conversion element 2b1 may be configured to convert light into electric charges.

[0034] The base material 2a has a plate-like shape and is made of an insulating material. The base material 2a is flexible and can be bent. Examples of materials for the base material 2a include polyimide (PI), which is a resin. The base material 2a is a flexible substrate (or a flexible layer), whereas the support substrate 12 is a rigid substrate. The support substrate 12 has a higher rigidity than the base material 2a. In this embodiment, the modulus of elasticity of the support substrate 12 is higher than the modulus of elasticity of the base material 2a.

[0035] The plurality of photoelectric conversion units 2b (photoelectric conversion elements 2b1 and TFTs 2b2) are located above the base material 2a. The insulating layer 21 is provided on the base material 2a. The gate electrode GE is formed on the insulating layer 21. The gate electrode GE is electrically connected to the control line 2c1. The insulating layer 22 is provided on the insulating layer 21 and the gate electrode GE. The semiconductor layer SC is provided on the insulating layer 22 and faces the gate electrode GE. The semiconductor layer SC is formed of a semiconductor material such as amorphous silicon as an amorphous semiconductor or polycrystalline silicon as a polycrystalline semiconductor.

[0036] A source electrode SE and a drain electrode DE are provided on the insulating layer 22 and the semiconductor layer SC. The gate electrode GE, the source electrode SE, the drain electrode DE, the control line 2c1, and the data line 2c2 are formed using a low-resistance metal such as aluminum or chromium.

[0037] The source electrode SE is electrically connected to the source region of the semiconductor layer SC, and is also electrically connected to the data line 2c2. The drain electrode DE is electrically connected to the drain region of the semiconductor layer SC.

[0038] The insulating layer 23 is provided on the insulating layer 22, the semiconductor layer SC, the source electrode SE, and the drain electrode DE. The photoelectric conversion element 2b1 is electrically connected to the drain electrode DE. The insulating layer 24 is provided on the insulating layer 23 and the photoelectric conversion element 2b1. The bias line BL is provided on the insulating layer 24 and is connected to the photoelectric conversion element 2b1 through a contact hole formed in the insulating layer 24. The insulating layer 25 is provided on the insulating layer 24 and the bias line BL.

[0039] The insulating layers 21, 22, 23, 24, and 25 are made of insulating materials such as inorganic insulating materials and organic insulating materials. Examples of inorganic insulating materials include oxide insulating materials, nitride insulating materials, and oxynitride insulating materials. Examples of organic insulating materials include resins.

[0040] The scintillator layer 5 is provided above the photoelectric conversion substrate 2 (plurality of photoelectric conversion sections 2b). The scintillator layer 5 faces the plurality of photoelectric conversion sections 2b. The scintillator layer 5 is located at least in the detection region DA, and covers the upper parts of the plurality of photoelectric conversion sections 2b. The scintillator layer 5 is configured to convert incident X-rays into light (fluorescence).

[0041] The photoelectric conversion units 2b are located in the detection area DA. Therefore, when the photoelectric conversion substrate 2 is focused on, the detection area DA is an area where light (visible light) can be detected. Photoelectric conversion element 2b1 converts light incident from scintillator layer 5 into electric charges. The converted electric charges are accumulated in photoelectric conversion element 2b1. TFT 2b2 can switch between charging and discharging electric charges in photoelectric conversion element 2b1. If the self-capacitance of photoelectric conversion element 2b1 is insufficient, photoelectric conversion substrate 2 may further include a capacitor, and the electric charges converted by photoelectric conversion element 2b1 may be accumulated in the capacitor.

[0042] The scintillator layer 5 is made of thallium-activated cesium iodide (CsI:Tl). If the scintillator layer 5 is formed directly on the photoelectric conversion substrate 2 using a vacuum deposition method, the scintillator layer 5 is made up of an aggregate of a plurality of columnar crystals. The thickness of the scintillator layer 5 is, for example, 600 μm. At the outermost surface of the scintillator layer 5, the thickness of the columnar crystals of the scintillator layer 5 is 8 to 12 μm.

[0043] The material forming the scintillator layer 5 is not limited to CsI:Tl, but may also be formed of cesium iodide (CsI), thallium-activated sodium iodide (NaI:Tl), sodium-activated cesium iodide (CsI:Na), europium-activated cesium bromide (CsBr:Eu), sodium iodide (NaI), or the like.

[0044] When forming the scintillator layer 5 using the vacuum deposition method, a mask with an opening is used. In this case, the scintillator layer 5 is formed in the area facing the opening on the photoelectric conversion substrate 2. The scintillator material deposited by deposition is also deposited on the surface of the mask. The scintillator material is also deposited near the opening of the mask, and crystals grow so as to gradually extend into the opening. When the crystals extend from the mask into the opening, deposition of the scintillator material onto the photoelectric conversion substrate 2 near the opening is suppressed. Therefore, as shown in FIG. 2, the thickness of the scintillator layer 5 near the periphery gradually decreases outward.

[0045] Alternatively, the scintillator layer 5 may have a plurality of scintillator sections arranged in a matrix, each having a rectangular prism shape, and provided in a one-to-one correspondence with the photoelectric conversion section 2b. When forming such a scintillator layer 5, a scintillator material obtained by mixing gadolinium oxysulfide (Gd2O2S) phosphor particles with a binder is applied to the photoelectric conversion substrate 2, and the scintillator material is baked and hardened. Then, dicing is performed using a dicer or the like to form lattice-shaped grooves in the scintillator material. In this case, air or an inert gas such as nitrogen (N2) for preventing oxidation is sealed between the plurality of scintillator sections. Alternatively, the space between the plurality of scintillator sections may be set to a space reduced in pressure below atmospheric pressure.

[0046] In this embodiment, the X-ray detection panel PNL further includes a light reflecting layer 6. The light reflecting layer 6 is provided on the scintillator layer 5. In other words, the light reflecting layer 6 is provided on the X-ray incident side of the scintillator layer 5. The light reflecting layer 6 is located at least in the detection region DA, and covers the upper surface of the scintillator layer 5. The light reflecting layer 6 is provided to increase the utilization efficiency of light (fluorescence) and improve sensitivity characteristics. In other words, the light reflecting layer 6 reflects light generated in the scintillator layer 5 that is directed toward the side opposite to the side where the photoelectric conversion unit 2b is provided, so that the light is directed toward the photoelectric conversion unit 2b. However, the light reflecting layer 6 is not necessarily required, and may be provided depending on the sensitivity characteristics, etc., required for the X-ray detection module 10.

[0047] For example, a coating material made of a mixture of light-scattering particles such as titanium oxide (TiO2), a resin, and a solvent can be applied onto the scintillator layer 5, and then the coating material can be dried to form the light-reflecting layer 6.

[0048] The structure of the light-reflecting layer 6 and the manufacturing method of the light-reflecting layer 6 are not limited to the above examples and can be modified in various ways. For example, the light-reflecting layer 6 may be formed by depositing a layer made of a metal with high light reflectivity, such as a silver alloy or aluminum, on the scintillator layer 5. Alternatively, the light-reflecting layer 6 may be formed by arranging, on the scintillator layer 5, a sheet whose surface includes a metal layer with high light reflectivity, such as a silver alloy or aluminum, or a resin sheet containing light-scattering particles.

[0049] When a paste-like coating material is applied onto the scintillator layer 5 and then dried, the coating material shrinks as it dries, which applies tensile stress to the scintillator layer 5, and the scintillator layer 5 may peel off from the photoelectric conversion substrate 2. For this reason, it is preferable to provide a sheet-like light-reflecting layer 6 on the scintillator layer 5. In this case, the light-reflecting layer 6 can be bonded onto the scintillator layer 5 using, for example, double-sided tape, but it is more preferable to place the light-reflecting layer 6 on the scintillator layer 5. By placing the sheet-like light-reflecting layer 6 on the scintillator layer 5, peeling of the scintillator layer 5 from the photoelectric conversion substrate 2 due to expansion or contraction of the light-reflecting layer 6 can be easily prevented.

[0050] The moisture-proof cover (moisture-proof portion) 7 is provided on the photoelectric conversion substrate 2, the scintillator layer 5, and the light-reflecting layer 6. The moisture-proof cover 7 covers the scintillator layer 5 and the light-reflecting layer 6. The moisture-proof cover 7 is provided to prevent the properties of the light-reflecting layer 6 and the scintillator layer 5 from deteriorating due to moisture contained in the air. The moisture-proof cover 7 completely covers the exposed portion of the scintillator layer 5. The moisture-proof cover 7 is in contact with the light-reflecting layer 6, but a gap may be provided between the moisture-proof cover 7 and the light-reflecting layer 6.

[0051] The moisture-proof cover 7 is formed of a sheet containing a metal. Examples of the metal include aluminum-containing metals, copper-containing metals, magnesium-containing metals, tungsten-containing metals, stainless steel, and Kovar. When the moisture-proof cover 7 contains a metal, the moisture-proof cover 7 can prevent or significantly reduce moisture penetration.

[0052] The moisture-proof cover 7 may also be formed of a laminated sheet in which a resin layer and a metal layer are laminated. In this case, the resin layer may be formed of a material such as polyimide resin, epoxy resin, polyethylene terephthalate resin, Teflon (registered trademark), low-density polyethylene, high-density polyethylene, or elastic rubber. The metal layer may contain, for example, the metals described above. The metal layer may be formed using a sputtering method, a lamination method, or the like.

[0053] Examples of the moisture-proof cover 7 include a sheet including a metal layer, a sheet including an inorganic insulating layer, a laminated sheet in which a resin layer and a metal layer are laminated, and a laminated sheet in which a resin layer and an inorganic insulating layer are laminated. From the above, the inorganic layer of the moisture-proof cover 7 is not limited to a metal layer, but may also be an inorganic insulating layer. Alternatively, the moisture-proof cover 7 may have both a metal layer and an inorganic insulating layer. The inorganic insulating layer may be formed of a layer containing silicon oxide, aluminum oxide, or the like. The inorganic insulating layer may be formed using a sputtering method or the like.

[0054] The thickness of the moisture-proof cover 7 can be determined taking into consideration the amount of X-ray absorption, rigidity (elastic modulus), etc. In this case, the thicker the moisture-proof cover 7, the greater the amount of X-rays absorbed by the moisture-proof cover 7. On the other hand, the thinner the moisture-proof cover 7, the lower the rigidity of the moisture-proof cover 7, making it more susceptible to breakage.

[0055] For example, if the thickness of the moisture-proof cover 7 is less than 10 μm, the moisture-proof cover 7 will have too little rigidity, and pinholes may form in the moisture-proof cover 7 due to damage from external forces, which may result in leaks. If the thickness of the moisture-proof cover 7 exceeds 50 μm, the moisture-proof cover 7 will have too much rigidity, and will not be able to conform to the irregularities at the top end of the scintillator layer 5. This may make it difficult to check for the gaps and leak paths described above. Furthermore, it may be difficult to conform to deformations in the photoelectric conversion substrate 2.

[0056] Therefore, the thickness of the moisture-proof cover 7 is preferably 10 μm or more and 50 μm or less. In this case, the moisture-proof cover 7 can be formed, for example, from aluminum foil having a thickness of 10 to 50 μm. If the aluminum foil has a thickness of 10 to 50 μm, the amount of X-ray transmission can be increased by approximately 20 to 30% compared to aluminum foil having a thickness of 100 μm. Furthermore, if the moisture-proof cover 7 is made of aluminum foil having a thickness of 10 to 50 μm, the occurrence of the above-mentioned leak can be suppressed and the above-mentioned gaps and leak paths can be easily confirmed. Furthermore, the moisture-proof cover 7 can follow deformation such as warping of the photoelectric conversion substrate 2.

[0057] To minimize the thermal expansion and contraction of metal, it is preferable that the thickness of metal such as aluminum be 30 μm or less, and therefore it is preferable that the moisture-proof cover 7 includes aluminum foil having a thickness of 10 to 30 μm.

[0058] The moisture-proof cover 7 according to this embodiment is an aluminum laminate film including an aluminum foil having a thickness of 10 to 30 μm and a resin layer. For example, when the moisture-proof cover 7 is formed of an aluminum laminate film, the moisture-proof cover 7 is flexible and can accommodate bending. In this case, the rigidity of the moisture-proof cover 7 is lower than the rigidity of the support substrate 12. The flexible moisture-proof cover 7, together with the base material 2a, can contribute to the formation of a flexible X-ray detection module 10.

[0059] Here, since irradiating the human body with a large amount of X-rays can have adverse health effects, the amount of X-ray irradiation to the human body is kept to a minimum. Therefore, in the case of X-ray detector 1 used in medical care, the intensity of the irradiated X-rays is low, and there is a risk that the intensity of the X-rays that pass through moisture-proof cover 7 will be very low. Because the thickness of the aluminum foil of moisture-proof cover 7 is 10 to 30 μm, it is possible to capture X-ray images even when the intensity of the irradiated X-rays is low.

[0060] Fig. 4 is a plan view showing a portion of the X-ray detector 1, and is a view showing an expanded view of the multiple first protrusion regions PAb and multiple second protrusion regions PAc of the photoelectric conversion substrate 2. In Fig. 4, the scintillator layer 5 is marked with diagonal lines slanting upward to the right, and the sealing portion 8 is marked with diagonal lines slanting downward to the right. Fig. 5 is a cross-sectional view showing a portion of the X-ray detector 1 shown in Fig. 4 along line VV. In Figs. 4 and 5, the photoelectric conversion substrate 2 will be described in a state where it is extended in the XY plane.

[0061] As shown in FIGS. 4 and 5, the base material 2a of the photoelectric conversion substrate 2 includes a main body portion 2aa, a plurality of protrusions 2ab, and a plurality of protrusions 2ac, and is flexible. The plurality of protrusions 2ab protrude from a first end E1, one of two adjacent ends of the main body portion 2aa, and the plurality of protrusions 2ac protrude from a second end E2, the other end. To form the base material 2a, a base material larger than the base material 2a is prepared. Next, the portions of the prepared base material other than the main body portion 2aa, the plurality of protrusions 2ab, and the plurality of protrusions 2ac are removed by laser processing. This completes the formation of the base material 2a.

[0062] The protrusion 2ab functions as a first protrusion, and the protrusion 2ac functions as a second protrusion. The main body 2aa is located in a detection area DA and a non-detection area NDA that surrounds the detection area DA. The detection area DA is, for example, a rectangular area, and the non-detection area NDA is, for example, a rectangular frame-shaped area. The planar shape of the main body 2aa (the planar shape of the photoelectric conversion substrate 2 located in the detection area DA and non-detection area NDA) is, for example, a rectangle.

[0063] At least the detection area DA and non-detection area NDA of the photoelectric conversion substrate 2 are fixed to the first main surface SU1 of the support substrate 12. In addition, at least the main body portion 2aa of the base material 2a is fixed to the first main surface SU1 of the support substrate 12.

[0064] Each protrusion 2ab protrudes from the first end E1 of the main body portion 2aa, is formed physically continuous with the main body portion 2aa, and is located in a first protrusion area PAb outside the non-detection area NDA. Each protrusion 2ac protrudes from a second end E2 of the main body 2aa, is formed physically continuous with the main body 2aa, and is located in a second protrusion area PAc outside the non-detection area NDA. The second end E2 is continuous with the first end E1 and is bent relative to the first end E1.

[0065] The first protrusion region PAb of the photoelectric conversion substrate 2 corresponds to the wiring portion 2e1 of the X-ray detection panel PNL, and the second protrusion region PAc of the photoelectric conversion substrate 2 corresponds to the wiring portion 2e2 of the X-ray detection panel PNL. In this embodiment, each of the first protrusion region PAb and the second protrusion region PAc is a quadrangular region, for example, a rectangular region.

[0066] The scintillator layer 5 is located at least in the entire detection area DA. The light reflecting layer 6 is located at least in the detection area DA. In this embodiment, the light reflecting layer 6 does not cover any of the side surfaces 5a of the scintillator layer 5. However, the light reflecting layer 6 may cover only a portion of the side surfaces 5a of the scintillator layer 5, or may cover the entire side surfaces 5a of the scintillator layer 5.

[0067] The X-ray detector 1 further includes a sealing portion 8. The sealing portion 8 is provided around the scintillator layer 5. The sealing portion 8 has a frame-like shape and extends continuously around the scintillator layer 5. In this embodiment, the sealing portion 8 is located in the non-detection area NDA. The sealing portion 8 bonds the photoelectric conversion substrate 2 (for example, the insulating layer 25) and the moisture-proof cover 7 together.

[0068] The moisture-proof cover 7 is located in the detection area DA and the non-detection area NDA in the plan view shown in Fig. 4. The moisture-proof cover 7 seals the scintillator layer 5 and the light-reflecting layer 6 together with the photoelectric conversion substrate 2. In this embodiment, the moisture-proof cover 7 seals the scintillator layer 5 and the light-reflecting layer 6 together with the photoelectric conversion substrate 2 and the sealing portion 8. As shown in Fig. 5, the portion of the scintillator layer 5 that is not covered by the photoelectric conversion substrate 2 and the sealing portion 8 is completely covered by the moisture-proof cover 7.

[0069] The moisture-proof cover 7 is bonded to the outer surface 8a of the sealing portion 8. The moisture-proof cover 7 covers at least a part of the sealing portion 8. For example, if the moisture-proof cover 7 and the sealing portion 8 are bonded in an environment where the pressure is reduced below atmospheric pressure, the moisture-proof cover 7 can be brought into contact with the light-reflecting layer 6 and the like.

[0070] Furthermore, the scintillator layer 5 generally has voids that account for approximately 10 to 40% of its volume. Therefore, if the voids contain gas, the gas may expand and damage the moisture-proof cover 7 when the X-ray detector 1 is transported by aircraft or the like. If the moisture-proof cover 7 and the sealing portion 8 are joined in an environment where the pressure is reduced below atmospheric pressure, damage to the moisture-proof cover 7 can be suppressed even when the X-ray detector 1 is transported by aircraft or the like or when the X-ray detector 1 is used at high altitudes. For the above reasons, it is preferable that the pressure in the space defined by the sealing portion 8 and the moisture-proof cover 7 be lower than atmospheric pressure.

[0071] The sealing portion 8 is formed of a material containing a thermoplastic resin. The sealing portion 8 is formed of a material containing a thermoplastic resin as a main component. The sealing portion 8 may be formed of 100% thermoplastic resin. Alternatively, the sealing portion 8 may be formed of a material in which an additive is mixed into a thermoplastic resin. If the sealing portion 8 contains a thermoplastic resin as a main component, the sealing portion 8 can be bonded to the photoelectric conversion substrate 2 and the moisture-proof cover 7 by heating.

[0072] Examples of thermoplastic resins that can be used include nylon, PET (Polyethyleneterephthalate), polyurethane, polyester, polyvinyl chloride, ABS (Acrylonitrile Butadiene Styrene), acrylic, polystyrene, polyethylene, and polypropylene.

[0073] FPC 3b is connected to wiring portion 2e1, and FPC 3c is connected to wiring portion 2e2. Focusing on FPC 3c as a representative of FPC 3b and FPC 3c, in this embodiment, FPC 3c is mounted on the upper surface of wiring portion 2e2 (the surface of wiring portion 2e2 facing scintillator layer 5). However, FPC 3c may also be mounted on the lower surface of wiring portion 2e2 (the surface of wiring portion 2e2 facing support substrate 12).

[0074] FIG. 6 is an enlarged cross-sectional view showing the detection area DA, non-detection area NDA, and first protrusion area PAb of the X-ray detection panel PNL, the light reflecting layer 6, the moisture-proof cover 7, the sealing portion 8, the FPC 3b, and the first adhesive AD1, and is a view showing the first protrusion area PAb in an expanded form. As shown in Fig. 6, the photoelectric conversion elements 2b1 are provided above the main body portion 2aa. The photoelectric conversion substrate 2 is formed so that the detection area DA, non-detection area NDA, and protrusion area PA (first protrusion area PAb) are physically continuous. In the photoelectric conversion substrate 2, not only the base material 2a but also the insulating layers 21 to 25 are formed so that the detection area DA, non-detection area NDA, and protrusion area PA (first protrusion area PAb) are physically continuous. Note that not all of the insulating layers 21 to 25 need to be formed in the protrusion area PA (first protrusion area PAb) of the photoelectric conversion substrate 2.

[0075] The photoelectric conversion substrate 2 has a plurality of pads 2d1 provided above the protruding portion 2ab of the base material 2a. The pads 2d1 are located in the first protruding region PAb, formed on the insulating layer 23, and are not covered with the insulating layers 24 and 25. In this embodiment, the pads 2d1 function as first pads.

[0076] The X-ray detection module 10 includes a first adhesive material AD1 and an FPC 3b. The first adhesive material AD1 bonds the first protrusion area PAb of the photoelectric conversion substrate 2 to the FPC 3b and electrically connects the pads 2d1 to the FPC 3b. The first adhesive material AD1 is an anisotropic conductive film (ACF). The FPC 3b is fixed to the photoelectric conversion substrate 2 (X-ray detection panel PNL) by the first adhesive material AD1 using a thermocompression bonding method and is electrically connected to the pads 2d1.

[0077] Here, D1 is the shortest distance from the first end E1 to the first adhesive AD1 along the surface of the protrusion 2ab on which the pads 2d1 are provided. In this embodiment, the first end E1 extends in the row direction X, and the shortest distance D1 is a value in the column direction Y. D1>0. In the column direction Y, the first adhesive AD1 is located away from the first end E1.

[0078] Even if an external force is applied to the detection area DA and non-detection area NDA of the photoelectric conversion substrate 2, causing deformation of the detection area DA and non-detection area NDA of the photoelectric conversion substrate 2, the external force is unlikely to be transmitted to the first protrusion area PAb of the photoelectric conversion substrate 2. Deformation of the first protrusion area PAb of the photoelectric conversion substrate 2 can be suppressed compared to the detection area DA and non-detection area NDA of the photoelectric conversion substrate 2. Therefore, compared to when D1 = 0, the connection state between the photoelectric conversion substrate 2 and the FPC 3b by the first adhesive AD1 can be maintained in a good condition. For example, the FPC 3b is unlikely to undesirably peel off from the photoelectric conversion substrate 2.

[0079] FIG. 7 is an enlarged plan view showing the non-detection area NDA and the first protruding area PAb of the X-ray detection panel PNL, the FPC 3b, and the first adhesive AD1, and is a view showing the first protruding area in a developed form. 7, in the region where the wiring portion 2e1 (first protruding region PAb of the photoelectric conversion substrate 2) and the FPC 3b overlap, the first adhesive AD1 has a first longitudinal direction dL1 and a first lateral direction dS1. In this embodiment, the first longitudinal direction dL1 is parallel to the direction in which the first end E1 extends and is parallel to the row direction X. The first lateral direction dS1 is parallel to the direction in which the protruding portion 2ab protrudes and is parallel to the column direction Y. The multiple pads 2d1 are arranged in the first longitudinal direction dL1.

[0080] The multiple data lines 2c2 are located above the main body portion 2aa and the protruding portion 2ab of the substrate 2a. The data lines 2c2 are formed physically continuous across the detection area DA, the non-detection area NDA, and the first protruding area PAb (FIG. 2). The data lines 2c2 are located between the insulating layer 22 and the insulating layer 23 shown in FIG. 6. However, the data lines 2c2 do not have to be located between the insulating layer 22 and the insulating layer 23. For example, a portion of the data lines 2c2 may be located between the insulating layer 21 and the insulating layer 22. In this embodiment, the data lines 2c2 function as first wiring.

[0081] Each data line 2c2 is electrically connected to a corresponding one of the plurality of pads 2d1 and two or more corresponding photoelectric conversion elements 2b1 among the plurality of photoelectric conversion elements 2b1. In this embodiment, each data line 2c2 is electrically connected to a plurality of photoelectric conversion elements 2b1 arranged in one column in the column direction Y (FIG. 2). From the above, the wiring portion 2e1 is a region of the photoelectric conversion substrate 2 where the protrusion 2ab, data line 2c2, pad 2d1, etc. are located.

[0082] Next, a more desirable range of the shortest distance D1 for maintaining a better connection state between the photoelectric conversion substrate 2 and the FPC 3b by the first adhesive AD1 will be described. As shown in FIGS. 6 and 7, the bending rigidity of the wiring portion 2e1 (first protruding region PAb of the photoelectric conversion substrate 2) in a cross section parallel to the direction in which the first end E1 extends is defined as k [N mm 2]. The adhesive strength between wiring portion 2e1 and FPC 3b by first adhesive material AD1 is P [N / mm]. In the region where wiring portion 2e1 and FPC 3b overlap, the width of first adhesive material AD1 in the first short-side direction dS1 is W [mm]. It is therefore more desirable that X-ray detection module 10 satisfy the following formula 1. Note that π is the ratio of the circumference of a circle to its circumference.

[0083]

number

[0084] When X-ray detector module 10 satisfies formula 1 above, the magnitude of the external force required to bend wiring portion 2e1 is smaller than the peeling force required to peel FPC 3b from wiring portion 2e1. Therefore, even if an external force that peels FPC 3b from wiring portion 2e1 is applied to X-ray detector module 10, the stress applied to the adhesive portion between wiring portion 2e1 and FPC 3b is alleviated, and peeling of FPC 3b from wiring portion 2e1 can be prevented.

[0085] Here, the Young's modulus of the wiring portion 2e1 is E α [N / mm 2 ], the moment of inertia of the wiring portion 2e1 is I, the width of the wiring portion 2e1 in the direction along the first end E1 (row direction X) is b [mm], and the thickness of the wiring portion 2e1 is h [mm]. In this embodiment, the width b of the wiring portion 2e1 is constant over the entire area. If the width of the wiring portion 2e1 is not constant over the entire area, the average width of the wiring portion 2e1 is defined as width b. The thickness h is a value in a direction perpendicular to the main surface of the protrusion 2ab, and is a value in a direction perpendicular to both the row direction X and the column direction Y. In this embodiment, the thickness h corresponds to the linear distance from the back surface of the protrusion 2ab to the upper surface of the insulating layer 25. However, the method of calculating the thickness h is not limited to the above example. For example, the linear distance from the back surface of the protrusion 2ab to the upper surface of the insulating layer 23 may be calculated as the thickness h.

[0086] The bending stiffness k can be calculated using the following equation 2. k=E α I=Eα ·(b·h 3 / 12)...(Formula 2)

[0087] For example, Young's modulus E α is 9000N / mm 2 (9GPa), the width b is 30 mm, and the thickness h is 0.04 mm. From the above formula 2, k = 1.44 [N·mm 2 Furthermore, when the adhesive strength P is 0.6 N / mm, the width W is 1 mm, and the shortest distance D1 is 5 mm, it can be seen that the X-ray detection module 10 satisfies the above formula 1.

[0088] The wiring portion 2e1 has a quadrangular shape. In this embodiment, the wiring portion 2e1 has a rectangular shape. In the wiring portion 2e1, the width b in the row direction X is greater than the length in the column direction Y. However, unlike this embodiment, in the wiring portion 2e1, the width b in the row direction X may be smaller than the length in the column direction Y. Alternatively, the wiring portion 2e1 may have a square shape.

[0089] Fig. 8 is an enlarged plan view showing the non-detection area NDA and second protrusion area PAc of the X-ray detection panel PNL, the FPC 3c, and the second adhesive AD2, and is a view showing the second protrusion area in a developed form. Note that the configurations of the wiring portion 2e1, the FPC 3b, the first adhesive AD1, etc. described using Figs. 6 and 7 are applicable to the configurations of the wiring portion 2e2, the FPC 3c, the second adhesive AD2, etc. Next, examples of the configurations of the wiring portion 2e2, the FPC 3c, the second adhesive AD2, etc. will be described.

[0090] 8, the photoelectric conversion substrate 2 has a plurality of pads 2d2 provided above the protruding portion 2ac of the base material 2a. The pads 2d2 are located in second protruding regions PAc. In this embodiment, the pads 2d2 function as second pads.

[0091] The X-ray detection module 10 includes a second adhesive AD2 and an FPC 3c. The second adhesive AD2 bonds the second protruding area PAc of the photoelectric conversion substrate 2 to the FPC 3c and electrically connects the pads 2d2 to the FPC 3c. The second adhesive AD2 is an anisotropic conductive film. The FPC 3c is fixed to the photoelectric conversion substrate 2 (X-ray detection panel PNL) by the second adhesive AD2 using a thermocompression bonding method and is electrically connected to the pads 2d2.

[0092] Here, D2 denotes the shortest distance from the second end E2 to the second adhesive AD2 along the surface of the protrusion 2ac on which the multiple pads 2d2 are provided. In this embodiment, the second end E2 extends in the column direction Y, and the shortest distance D2 is a value in the row direction X. D2>0. In the row direction X, the second adhesive AD2 is positioned farther away from the second end E2. Compared to when D2=0, the connection state between the photoelectric conversion substrate 2 and the FPC 3c by the second adhesive AD2 can be maintained in a good condition.

[0093] In the region where the wiring portion 2e2 (second protruding region PAc of the photoelectric conversion substrate 2) and the FPC 3c overlap, the second adhesive AD2 has a second longitudinal direction dL2 and a second lateral direction dS2. In this embodiment, the second longitudinal direction dL2 is parallel to the direction in which the second end E2 extends and is parallel to the column direction Y. The second lateral direction dS2 is parallel to the direction in which the protruding portion 2ac protrudes and is parallel to the row direction X. The multiple pads 2d2 are arranged in the second longitudinal direction dL2.

[0094] The plurality of control lines 2c1 are located above the main body portion 2aa and the protruding portion 2ac of the base material 2a. The control lines 2c1 are formed physically continuous across the detection area DA, the non-detection area NDA, and the second protruding area PAc (FIG. 2). The control lines 2c1 are located between the insulating layer 21 and the insulating layer 22 shown in FIG. 6. However, the control lines 2c1 do not have to be located between the insulating layer 21 and the insulating layer 22. For example, a portion of the control lines 2c1 may be located between the insulating layer 22 and the insulating layer 23. In this embodiment, the control lines 2c1 function as second wiring.

[0095] Each control line 2c1 is electrically connected to a corresponding one of the plurality of pads 2d2 and two or more corresponding photoelectric conversion elements 2b1 among the plurality of photoelectric conversion elements 2b1. In this embodiment, each control line 2c1 is electrically connected to a plurality of photoelectric conversion elements 2b1 arranged in one row in the row direction X (FIG. 2). From the above, the wiring portion 2e2 is a region of the photoelectric conversion substrate 2 where the protrusion 2ac, the control line 2c1, the pad 2d2, etc. are located.

[0096] It is also desirable that the wiring portion 2e2, FPC 3c, and second adhesive AD2 also satisfy the above formula 1. In that case, the shortest distance D1 in the above formula 1 can be replaced with the shortest distance D2. Additionally, the bending rigidity k is the bending rigidity of the wiring portion 2e2 (the second protruding region PAc of the photoelectric conversion substrate 2) in a cross section parallel to the direction in which the second end E2 extends. The adhesive strength P is the adhesive strength between the wiring portion 2e2 and the FPC 3c by the second adhesive AD2. The width W is the width in the second short-side direction dS2 of the second adhesive AD2 in the region where the wiring portion 2e2 and the FPC 3c overlap.

[0097] Furthermore, in this embodiment, the width b of the wiring portion 2e2 in the direction along the second end E2 (column direction Y) is constant over the entire area. Note that the width W shown in Fig. 7 and the width W shown in Fig. 8 may be the same as or different from each other. Similarly, the width b shown in Fig. 7 and the width b shown in Fig. 8 may be the same as or different from each other.

[0098] Fig. 9 is an enlarged cross-sectional view showing a part of the X-ray detector 1. Note that in Fig. 9, the light reflecting layer 6 and the like are omitted from the illustration. As shown in FIGS. 3 and 9, the main body 2aa (detection area DA and non-detection area NDA of the substrate 2a) is located between the group including the circuit board 11 and FPC 3b and the plurality of photoelectric conversion elements 2b1.

[0099] According to the X-ray detector 1 according to the first embodiment configured as described above, the X-ray detection module 10 includes the X-ray detection panel PNL, the FPC 3b, and the first adhesive AD1. The photoelectric conversion substrate 2 of the X-ray detection panel PNL has a flexible base material 2a including a main body portion 2aa and a protrusion portion 2ab, a plurality of photoelectric conversion elements 2b1, a plurality of pads 2d1, and a plurality of data lines 2c2.

[0100] Each data line 2c2 is electrically connected to a corresponding one of the plurality of pads 2d1 and two or more corresponding photoelectric conversion elements 2b1 among the plurality of photoelectric conversion elements 2b1. The first adhesive AD1 bonds the first protrusion area PAb of the photoelectric conversion substrate 2 to the FPC 3b, and electrically connects the plurality of pads 2d1 to the FPC 3b.

[0101] The adhesive strength between the wiring portion 2e1 and the FPC 3b by the first adhesive AD1 is proportional to the width of the first adhesive AD1. Even if the wiring portion 2e1 is bent as shown in Fig. 9, the adverse effect on the connection state between the wiring portion 2e1 and the FPC 3b is small. On the other hand, in the wiring portion 2e1 shown in Fig. 7, when the wiring portion 2e1 is bent in a direction in which the first side edge portion SI1 and the second side edge portion SI2 of the wiring portion 2e1 approach each other, the adverse effect on the connection state between the wiring portion 2e1 and the FPC 3b becomes relatively large.

[0102] If, while FPC 3b is connected to wiring portion 2e1, deformation occurs in which wiring portion 2e1 is bent in a direction in which first side edge portion SI1 and second side edge portion SI2 approach each other, the connection between wiring portion 2e1 and FPC 3b may be released from the end. For example, some of multiple data lines 2c2 may become disconnected from FPC 3b, and a band-like defect may appear on an image detected by X-ray detector 1.

[0103] Therefore, the shortest distance D1 is set to D1>0. This can prevent the wiring portion 2e1 from being deformed in a direction in which the first side edge portion SI1 and the second side edge portion SI2 approach each other near the first adhesive AD1. This can maintain a good connection between the photoelectric conversion substrate 2 and the FPC 3b via the first adhesive AD1.

[0104] It is more desirable that the X-ray detection module 10 satisfies the above formula 1 regarding the shortest distance D1. Even when an external force is applied to the X-ray detection module 10, the bending of the wiring portion 2e1 near the first adhesive AD1 can be reduced. Therefore, the stress applied to the adhesive portion between the wiring portion 2e1 and the FPC 3b is alleviated, and peeling of the FPC 3b from the wiring portion 2e1 can be prevented.

[0105] When assembling the X-ray detector 1, instead of bending the FPC 3b, the wiring portion 2e1 is formed on the photoelectric conversion substrate 2 and the wiring portion 2e1 is then bent. It is not necessary to form the pad 2d1 or to connect the FPC 3b using the first adhesive AD1 in the non-detection area NDA of the X-ray detection panel PNL. This makes it possible to prevent the non-detection area NDA of the X-ray detection panel PNL from undesirably expanding, thereby enabling the frame of the X-ray detector 1 to be narrowed.

[0106] Furthermore, when the FPC 3b is connected to the non-detection area NDA of the X-ray detection panel PNL using the first adhesive material AD1 and the FPC 3b is curved, if the FPC 3b is curved near the first adhesive material AD1, a large load is applied to the first adhesive material AD1, which may cause the FPC 3b to peel off from the X-ray detection panel PNL, for example.

[0107] In contrast, in this embodiment, a wiring portion 2e1 is formed on the photoelectric conversion substrate 2, and an FPC 3b is connected to the wiring portion 2e1 using a first adhesive AD1. The wiring portion 2e1 is curved between the non-detection area NDA of the photoelectric conversion substrate 2 and the first adhesive AD1. Therefore, even if the portion where the wiring portion 2e1 is curved is brought closer to the non-detection area NDA of the photoelectric conversion substrate 2, the load on the first adhesive AD1 does not increase.

[0108] As described above, the first embodiment can provide an X-ray detection module 10 and an X-ray detector 1 with high manufacturing yield. Furthermore, the first embodiment can provide an X-ray detection module 10 and an X-ray detector 1 with excellent product reliability.

[0109] (Modification 1 of the first embodiment) Next, a first modification of the first embodiment will be described. Fig. 10 is an enlarged plan view showing the non-detection area NDA and first protrusion area PAb of the X-ray detection panel PNL according to this first modification, and the first adhesive material AD1, and is a view showing the first protrusion area in a developed state. In the figure, the first adhesive material AD1 is indicated by a dashed line, and the data lines 2c2 and the like are not shown. Note that the configurations of the first protrusion area PAb, the first adhesive material AD1, and the like of the X-ray detection panel PNL described in this first modification are applicable to the configurations of the second protrusion area PAc, the second adhesive material AD2, and the like of the X-ray detection panel PNL. Furthermore, the X-ray detector 1 is configured similarly to the first embodiment, except for the configuration described in this first modification.

[0110] As shown in Figure 10, the width b of the wiring portion 2e1 in the row direction X (the width b of the first protrusion region PAb of the photoelectric conversion substrate 2 in the direction in which the first end E1 extends) monotonically decreases as it moves away from the non-detection region NDA.

[0111] The first end E1 of the main body 2aa of the substrate 2a has a first section C1 and a second section C2 that is adjacent to the first section with the wiring section 2e1 in between. The outer peripheral edge of the wiring section 2e1 has a first side edge SI1 and a second side edge SI2. The first side edge SI1 is continuous with the first section C1, extends linearly, and is bent relative to the first section. The second side edge SI2 is continuous with the second section C2, extends linearly, and is bent relative to the second section. Here, "straight" does not necessarily mean a perfectly straight line. The term "straight" takes into consideration manufacturing errors and the like, and also includes cases where the line extends with some bending or curvature. For example, in the case of a linear portion extending in the row direction X, the straightness in the column direction Y may be 500 μm or less.

[0112] The angle formed between the first section C1 and the first side edge SI1 is defined as θ1, and the angle formed between the second section C2 and the second side edge SI2 is defined as θ2. The angles θ1 and θ2 are both obtuse angles (90°<θ1<180° and 90°<θ2<180°). In this first modification, the angles θ1 and θ2 are the same. The wiring portion 2e1 has a trapezoidal shape.

[0113] In this first modification, the same effects as those of the first embodiment can be obtained. The width b of the wiring portion 2e1 becomes smaller as it moves away from the non-detection area NDA. In other words, the wiring portion 2e1 expands toward the non-detection area NDA. This increases the rigidity of the wiring portion 2e1.

[0114] Furthermore, when considering the contribution of gravity and inertial forces acting on wiring portion 2e1 to the bending moment that tends to bend wiring portion 2e1, the influence on the bending moment becomes greater toward the tip of wiring portion 2e1. Because gravity and inertial forces acting on wiring portion 2e1 are proportional to the mass of wiring portion 2e1, the smaller the mass of the tip of wiring portion 2e1, i.e., the more tapered wiring portion 2e1 is, the smaller the bending of wiring portion 2e1 due to gravity and inertial forces of wiring portion 2e1 can be.

[0115] When the angles θ1 and θ2 are each a right angle (FIG. 7), and deformation occurs in the detection area DA and non-detection area NDA of the photoelectric conversion substrate 2, stress tends to concentrate on a portion of the wiring portion 2e1. Therefore, in this modification, the angles θ1 and θ2 are each an obtuse angle. This can mitigate stress concentration on a portion of the wiring portion 2e1 (for example, the boundary between the first side edge portion SI1 and the first section C1), thereby suppressing or preventing damage to the photoelectric conversion substrate 2 (for example, the wiring portion 2e1).

[0116] (Modification 2 of the first embodiment) Next, a second modification of the first embodiment will be described. Fig. 11 is an enlarged plan view showing the non-detection area NDA and first protrusion area PAb of the X-ray detection panel PNL according to this second modification, and the first adhesive material AD1, and is a view showing the first protrusion area in a developed state. In the figure, the first adhesive material AD1 is indicated by a dashed line, and the data lines 2c2 and the like are not shown. Note that the configurations of the first protrusion area PAb, the first adhesive material AD1, and the like of the X-ray detection panel PNL described in this second modification are applicable to the configurations of the second protrusion area PAc, the second adhesive material AD2, and the like of the X-ray detection panel PNL. Furthermore, the X-ray detector 1 has the same configuration as the first modification, except for the configuration described in this second modification.

[0117] As shown in FIG. 11, the first end E1 has a first section C1 and a second section C2. The outer peripheral edge of the wiring portion 2e1 has a first side edge SI1, a second side edge SI2, and a third side edge SI3. The first side edge SI1 is continuous with the first section C1. The second side edge SI2 is continuous with the second section C2. The third side edge SI3 is continuous with the first side edge SI1 on one side and with the second side edge SI2 on the other side.

[0118] In the direction in which the protrusion 2ab protrudes (column direction Y), the first adhesive AD1 is located between the third side edge SI3 and the first end E1. The first side edge SI1 has a first recess O1. The first recess O1 is continuous with the first section C1 and is recessed and curved toward the second side edge SI2. The second side edge SI2 has a second recess O2. The second recess O2 is continuous with the second section C2 and is recessed and curved toward the first side edge SI1.

[0119] In this second modification, the entire first side edge SI1 is the first recess O1, and the entire second side edge SI2 is the second recess O2. In the direction in which the first end E1 extends (row direction X), the first recess O1 and the second recess O2 are adjacent to the first adhesive AD1. In the direction in which the first end E1 extends, the width b of the wiring portion 2e1 gradually decreases with increasing distance from the first end E1. In this second modification, the same effects as those of the first modification can be obtained.

[0120] (Modification 3 of the first embodiment) Next, a third modification of the first embodiment will be described. Fig. 12 is an enlarged plan view showing the non-detection area NDA and first protrusion area PAb of the X-ray detection panel PNL according to the third modification, and the first adhesive material AD1, and is a view showing the first protrusion area in a developed state. In the figure, the first adhesive material AD1 is indicated by a dashed line, and the data lines 2c2 and the like are not shown. Note that the configurations of the first protrusion area PAb, the first adhesive material AD1, and the like of the X-ray detection panel PNL described in the third modification are applicable to the configurations of the second protrusion area PAc, the second adhesive material AD2, and the like of the X-ray detection panel PNL. Furthermore, the X-ray detector 1 has the same configuration as the second modification, except for the configuration described in the third modification.

[0121] 12, the first side edge SI1 has not only the first recess O1 but also a first linear portion F1. The first linear portion F1 is continuous with the first recess O1 on one side and with the third side edge SI3 on ​​the other side. Similarly, the second side edge SI2 has not only the second recess O2 but also a second linear portion F2. The second linear portion F2 is continuous with the second recess O2 on one side and with the third side edge SI3 on ​​the other side.

[0122] The first protrusion region PAb of the photoelectric conversion substrate 2 has a first region A1 and a second region A2. The first region A1 includes a first recess O1 and a second recess O2. The second region A2 includes a first linear portion F1, a second linear portion F2, and a third side edge portion SI3, and is located closer to the tip of the first protrusion region PAb than the first region A1. The first adhesive AD1 overlaps the second region A2 of the photoelectric conversion substrate 2. In the direction in which the first end E1 extends (row direction X), the width b of the first region A1 of the photoelectric conversion substrate 2 gradually decreases with increasing distance from the first end E1. In the third modification, the same effects as those of the first modification can be obtained.

[0123] (Fourth modification of the first embodiment) Next, a fourth modification of the first embodiment will be described. Fig. 13 is an enlarged plan view showing the non-detection area NDA and first protrusion area PAb of the X-ray detection panel PNL according to the fourth modification, and the first adhesive material AD1, and is a view showing the first protrusion area in a developed state. In the figure, the first adhesive material AD1 is indicated by a dashed line, and the data lines 2c2 and the like are not shown. Note that the configurations of the first protrusion area PAb, the first adhesive material AD1, and the like of the X-ray detection panel PNL described in the fourth modification are applicable to the configurations of the second protrusion area PAc, the second adhesive material AD2, and the like of the X-ray detection panel PNL. Furthermore, the X-ray detector 1 has the same configuration as the second modification, except for the configuration described in the fourth modification.

[0124] As shown in FIG. 13, the first side edge SI1 has a first recess O1 and a first linear portion F1. The first recess O1 is continuous with the first section C1 and recessed toward the second side edge SI2. The first linear portion F1 is continuous with the first recess O1 on one side and with the third side edge SI3 on ​​the other side. The second side edge SI2 has a second recess O2 and a second linear portion F2. The second recess O2 is continuous with the second section C2 and recessed toward the first side edge SI1. The second linear portion F2 is continuous with the second recess O2 on one side and with the third side edge SI3 on ​​the other side.

[0125] The first protrusion region PAb of the photoelectric conversion substrate 2 has a first region A1 and a second region A2. The first region A1 includes a first recess O1 and a second recess O2 and is a constricted region of the first protrusion region PAb. The second region A2 includes a first linear portion F1, a second linear portion F2, and a third side edge portion SI3 and is located closer to the tip of the first protrusion region PAb than the first region A1. The first adhesive AD1 is superposed on the second region A2 of the photoelectric conversion substrate 2.

[0126] In the direction in which the first end E1 extends (row direction X), the first region A1 has multiple widths b, including a first width b1, a second width b2, and a third width b3. The first width b1 is a value at a first position P1 where a first end G1 on the first end E1 side of the first region A1 is located. The second width b2 is a value at a second position P2 where a second end G2 on the second region A2 side of the first region A1 is located. The third width b3 is a value at a third position P3 between the first position P1 and the second position P2. Of the multiple widths b of the first region A1, the third width b3 is the smallest.

[0127] In this modification, each of the first recess O1 and the second recess O2 is curved. Specifically, the shape of each of the first recess O1 and the second recess O2 is semicircular in plan view. However, the shape of each of the first recess O1 and the second recess O2 may be formed by a curve other than a circular arc in plan view, or may be formed by multiple line segments that are continuously bent. When each of the first recess O1 and the second recess O2 is formed by a plurality of continuous linear portions, stress is concentrated at the boundaries between the linear portions, so it is preferable that each of the first recess O1 and the second recess O2 is curved. In this fourth modification, the same effects as those of the second modification can be obtained.

[0128] (Fifth Modification of the First Embodiment) Next, a fifth modification of the first embodiment will be described. Fig. 14 is an enlarged plan view showing the non-detection area NDA and first protrusion area PAb of the X-ray detection panel PNL according to the fifth modification, and the first adhesive material AD1, and is a view showing the first protrusion area in a developed state. In the figure, the first adhesive material AD1 is indicated by a dashed line, and the data lines 2c2 and the like are not shown. Note that the configurations of the first protrusion area PAb, the first adhesive material AD1, and the like of the X-ray detection panel PNL described in the fifth modification are applicable to the configurations of the second protrusion area PAc, the second adhesive material AD2, and the like of the X-ray detection panel PNL. Furthermore, the X-ray detector 1 has the same configuration as the fourth modification, except for the configuration described in the fifth modification.

[0129] As shown in Figure 14, the first side edge SI1 has a first linear portion F1, a first recess O1, and a third linear portion F3. The first linear portion F1 is continuous with the first section C1. The first recess O1 is continuous with the first linear portion F1 and is recessed toward the second side edge SI2. The third linear portion F3 is continuous with the first recess O1 on one side and with the third side edge SI3 on ​​the other side.

[0130] The second side edge SI2 has a second linear portion F2, a second recess O2, and a fourth linear portion F4. The second linear portion F2 is continuous with the second section C2. The second recess O2 is continuous with the second linear portion F2 and is recessed toward the first side edge SI1. The fourth linear portion F4 is continuous with the second recess O2 on one side and with the third side edge SI3 on ​​the other side.

[0131] The first protrusion region PAb of the photoelectric conversion substrate 2 has a first region A1, a second region A2, and a third region A3. The first region A1 includes a first linear portion F1 and a second linear portion F2. The second region A2 includes a first recess O1 and a second recess O2, is located closer to the tip of the first protrusion region PAb than the first region A1, and is a constricted region of the first protrusion region PAb. The third region A3 includes a third linear portion F3, a fourth linear portion F4, and a third side edge portion SI3, and is located closer to the tip of the first protrusion region PAb than the second region A2. The first adhesive AD1 is superposed on the third region A3 of the photoelectric conversion substrate 2.

[0132] In the direction in which the first end E1 extends (row direction X), the second region A2 has multiple widths b, including a first width b1, a second width b2, and a third width b3. The first width b1 is a value at a first position P1 where the first end G1 of the second region A2 on the first region A1 side is located. The second width b2 is a value at a second position P2 where the second end G2 of the second region A2 on the third region A3 side is located. The third width b3 is a value at a third position P3 between the first position P1 and the second position P2. Of the multiple widths b of the second region A2, the third width b3 is the smallest.

[0133] In this modification, each of the first recess O1 and the second recess O2 is curved. Specifically, each of the first recess O1 and the second recess O2 has a semicircular shape in a plan view. However, the shapes of each of the first recess O1 and the second recess O2 can be modified in various ways. In this fifth modification, the same effects as those of the fourth modification can be obtained.

[0134] (Modification 6 of the first embodiment) Next, a sixth modification of the first embodiment will be described. FIG. 15 is a plan view showing a portion of the X-ray detector 1 according to the sixth modification, and is a view showing a developed view of the plurality of first protrusion regions PAb and the plurality of second protrusion regions PAc of the photoelectric conversion substrate 2. FIG. 16 is an enlarged plan view showing the non-detection region NDA and the first protrusion region PAb of the X-ray detection panel PNL according to the sixth modification, the FPC 3b, and the first adhesive AD1, and is a view showing the developed view of the first protrusion region. FIG. 17 is an enlarged plan view showing the non-detection region NDA and the second protrusion region PAc of the X-ray detection panel PNL according to the sixth modification, the FPC 3c, and the second adhesive AD2, and is a view showing the developed view of the second protrusion region. The X-ray detector 1 has the same configuration as the first embodiment, except for the configuration described in the sixth modification.

[0135] As shown in FIG. 15, the FPCs 3b and 3c extend in the row direction X. The internal wiring of each of the FPCs 3b and 3c roughly extends in the row direction X. The main body 2aa has not only a first end E1 and a second end E2, but also a third end E3 and a fourth end E4. The third end E3 faces the first end E1 and extends parallel to the first end E1. The fourth end E4 faces the second end E2 and extends parallel to the second end E2.

[0136] 16, in the region where the wiring portion 2e1 (first protruding region PAb of the photoelectric conversion substrate 2) and the FPC 3b overlap, the first adhesive AD1 has a first longitudinal direction dL1. The pads 2d1 are arranged in the first longitudinal direction dL1.

[0137] 17, in the region where the wiring portion 2e2 (the second protruding region PAc of the photoelectric conversion substrate 2) and the FPC 3c overlap, the second adhesive AD2 has a second longitudinal direction dL2. The pads 2d2 are arranged in the second longitudinal direction dL2.

[0138] 15 to 17, the first longitudinal direction dL1 and the second longitudinal direction dL2 are substantially parallel to each other. In this modification, the first longitudinal direction dL1 and the second longitudinal direction dL2 are both parallel to the column direction Y. Since the first longitudinal direction dL1 of the first adhesive AD1 and the second longitudinal direction dL2 of the second adhesive AD2 can be made substantially parallel to each other, the reliability of the adhesive portion of the FPC3 can be improved against bending of the X-ray detection panel PNL in a specific direction.

[0139] As shown in FIG. 18, the manufacturing process of the X-ray detector 1 includes a step of forming an X-ray detection panel PNL including a base material 2a and an upper portion 101 including a scintillator layer 5, etc., on a substrate (glass substrate) 100, and connecting an FPC 3 to the X-ray detection panel PNL.

[0140] Next, using a laser 200, laser light is irradiated onto the base material 2a from the back side of the substrate 100. The laser light reaches the surface of the base material 2a facing the substrate 100. At the interface between the base material 2a and the substrate 100, the laser light is absorbed and decomposed, causing ablation. This creates a space at the interface between the base material 2a and the substrate 100, making it possible to peel the base material 2a from the substrate 100.

[0141] 19, thereafter, the X-ray detection panel PNL (base material 2a) is peeled off from the substrate 100. At this time, peeling starts from the fourth end E4 side of the base material 2a, and continues up to the second end E2 of the base material 2a, and finally the protruding portion 2ac of the base material 2a is peeled off.

[0142] Even when X-ray detector 1 is manufactured as described above, wiring portion 2e1 bends, but the position of the stress applied to first adhesive AD1 changes to the first short-side direction dS1. Wiring portion 2e2 also bends, but the position of the stress applied to second adhesive AD2 changes to the second short-side direction dS2. Therefore, even if wiring portion 2e1 and wiring portion 2e2 are bent as described above, the connection state of FPC 3b to wiring portion 2e1 and the connection state of FPC 3c to wiring portion 2e2 can be maintained favorably.

[0143] 20, when peeling the X-ray detection panel PNL (base material 2a) from the substrate 100, the X-ray detection panel PNL may be mechanically peeled off. For example, a winding machine (drum) 300 may be used to peel the X-ray detection panel PNL (base material 2a) from the substrate 100. The winding machine 300 is configured to be pressed against the X-ray detection panel PNL and rotate.

[0144] The adhesive force (suction force) between the winder 300 and the X-ray detection panel PNL is higher per unit area than the adhesive force (suction force) between the substrate 100 and the X-ray detection panel PNL. Therefore, by first pressing the winder 300 against the fourth end E4 of the X-ray detection panel PNL and rotating the winder 300, peeling starts from the fourth end E4 of the base material 2a, and continues up to the second end E2 of the base material 2a, and finally the protruding portion 2ac of the base material 2a is peeled off. Because the adhesive surface (suction surface) of the winder 300 is cylindrical, the X-ray detection panel PNL and FPC 3 wound by the winder 300 are significantly curved.

[0145] However, even in the mechanical peeling process using the winding machine 300, the position of the stress applied to the first adhesive AD1 changes to the first short-side direction dS1, and the position of the stress applied to the second adhesive AD2 changes to the second short-side direction dS2. Therefore, the connection state of the FPC 3b to the wiring portion 2e1 and the connection state of the FPC 3c to the wiring portion 2e2 can be maintained well.

[0146] In this sixth modification, the same effects as those of the first embodiment can be obtained. Furthermore, in this sixth modification, the reliability of the adhesive portion of the FPC 3 can be improved with respect to the curvature of the X-ray detection panel PNL in a specific direction. Note that the technique described in this sixth modification may be combined with the techniques described in the first to fifth modifications.

[0147] (Seventh modification of the first embodiment) Next, a seventh modification of the first embodiment will be described. Fig. 21 is a plan view showing a photoelectric conversion substrate 2 according to the seventh modification, and is a diagram showing an expanded view of a plurality of first protrusion regions PAb and a plurality of second protrusion regions PAc of the photoelectric conversion substrate. The X-ray detector 1 has the same configuration as the first embodiment, except for the configuration described in the seventh modification.

[0148] 21, in each wiring portion 2e1, the first side edge portion SI1 has the first recess O1 shown in Fig. 12, but does not have the second recess O2 shown in Fig. 12. In the manufacturing process of the X-ray detector 1 in which the X-ray detection panel PNL (base material 2a) is peeled off from the substrate 100, when peeling is performed from the fourth end E4 side to the second end E2 side of the base material 2a, stress concentration on a part of the wiring portion 2e1 (protrusion 2ab) can be suppressed.

[0149] In the present modified example 7, the same effects as those of the first embodiment can be obtained. Furthermore, in the present modified example 7, the reliability of the adhesive portion of the FPC 3 can be improved with respect to the curvature of the X-ray detection panel PNL in a specific direction. The technique described in the present modified example 7 may be combined with the techniques described in the above modified examples 1, 2, and 4 to 6. For example, when the technique described in the present modified example 7 is combined with the above modified example 1, the angle θ1 may be an obtuse angle, and the angle θ2 may be a right angle (FIG. 10).

[0150] (Eighth Modification of the First Embodiment) Next, an eighth modification of the first embodiment will be described. Fig. 22 is a plan view showing a part of the X-ray detector 1 according to the eighth modification, and is a diagram showing an expanded view of the plurality of first protrusion regions PAb and the plurality of second protrusion regions PAc of the photoelectric conversion substrate 2. The X-ray detector 1 has the same configuration as the first embodiment, except for the configuration described in the eighth modification.

[0151] As shown in FIG. 22, the plurality of protrusions of the base material 2a may protrude from four end portions E of the main body portion 2aa. The protrusion 2ab protrudes from the third end E3 of the main body 2aa, is formed physically continuous with the main body 2aa, and is located in a first protrusion area PAb outside the non-detection area NDA. The X-ray detection panel PNL (photoelectric conversion board 2) has a plurality of wiring portions 2e1, each including a protrusion 2ab, on both sides of the main body 2aa in the column direction Y. An FPC 3b is connected to each of the wiring portions 2e1.

[0152] The protrusion 2ac protrudes from the fourth end E4 of the main body 2aa, is formed physically continuous with the main body 2aa, and is located in a second protrusion area PAc outside the non-detection area NDA. The X-ray detection panel PNL (photoelectric conversion substrate 2) has a plurality of wiring portions 2e2, each including a protrusion 2ac, on both sides of the main body 2aa in the row direction X. An FPC 3c is mounted on each of the wiring portions 2e2. In this modification 8, the same effects as in the first embodiment can be obtained. Note that the number of wiring portions 2e1 on the first end E1 side, the number of wiring portions 2e2 on the second end E2 side, the number of wiring portions 2e1 on the third end E3 side, and the number of wiring portions 2e2 on the fourth end E4 side may each be 2 or more. The technique described in this modification 8 may be combined with the techniques described in the modifications 1 to 7.

[0153] (Modification 9 of the first embodiment) Next, a ninth modification of the first embodiment will be described. Fig. 23 is a plan view showing a part of the X-ray detector 1 according to the ninth modification, and is a developed view of a plurality of first protrusion areas PAb of the photoelectric conversion substrate 2. The X-ray detector 1 has the same configuration as the first embodiment, except for the configuration described in the ninth modification.

[0154] 23, the X-ray detector 1 may be configured without the multiple wiring portions 2e2. The wiring portion 2e1 further includes a portion of the control line 2c1. The wiring portion 2e1 functions as a transmission path for both the control signal S1 and the image data signal S2.

[0155] As described above, the multiple protrusions may only protrude from one end (first end E1) of the main body portion 2aa. In this modification 9, the same effects as in the first embodiment can be obtained. The number of wiring portions 2e1 may be two or more. The technique described in this modification 9 may be combined with the techniques described in modifications 1 to 7.

[0156] (Modification 10 of the first embodiment) Next, a tenth modification of the first embodiment will be described. Fig. 24 is a plan view showing a part of the X-ray detector 1 according to the tenth modification, and is a developed view of the first protrusion region PAb and the second protrusion region PAc of the photoelectric conversion substrate 2. The X-ray detector 1 has the same configuration as the first embodiment, except for the configuration described in the tenth modification.

[0157] 24, the photoelectric conversion substrate 2 has a single wiring portion 2e1 on the first end E1 side of the main body portion 2aa. The photoelectric conversion substrate 2 has a single wiring portion 2e2 on the second end E2 side of the main body portion 2aa.

[0158] Roughly speaking, the configuration of wiring portion 2e1 in this modification 10 corresponds to the configuration in which a plurality of wiring portions 2e1 shown in Fig. 4 are physically connected without any gaps. Also, the configuration of wiring portion 2e2 in this modification 10 corresponds to the configuration in which a plurality of wiring portions 2e2 shown in Fig. 4 are physically connected without any gaps. FPC 3b is connected to wiring portion 2e1, and FPC 3c is connected to wiring portion 2e2. In this modification 10, the same effects as those of the first embodiment can be obtained. The technique described in this modification 10 may be combined with the techniques described in modifications 1 to 9.

[0159] (Second embodiment) Next, a second embodiment will be described. Fig. 25 is a cross-sectional view showing a part of an X-ray detector 1 according to the second embodiment, and is a view showing an expanded second protrusion region PAc of a photoelectric conversion substrate 2. The X-ray detector 1 has the same configuration as the first embodiment, except for the configuration described in this embodiment.

[0160] 25 , the scintillator layer 5 does not have to be formed directly on the photoelectric conversion substrate 2. The X-ray detector 1 includes a support substrate 12, a photoelectric conversion substrate 2, an FPC 3c, a scintillator panel SP, etc. The scintillator panel SP includes a substrate 15, a light reflecting layer 16, the scintillator layer 5, and a moisture-proof body 17.

[0161] The substrate 15 is located in the detection area DA and the non-detection area NDA, and is made of CFRP, a material with high X-ray transmittance. The scintillator layer 5 is located between the substrate 15 and the photoelectric conversion substrate 2. The scintillator layer 5 faces the substrate 15 with a gap provided. The scintillator layer 5 is located at least in the detection area DA. In this embodiment, the scintillator layer 5 is located in the detection area DA and the non-detection area NDA.

[0162] The light reflecting layer 16 is provided between the substrate 15 and the scintillator layer 5. The light reflecting layer 16 is located in the detection area DA and the non-detection area NDA. The light reflecting layer 16 is provided to increase the utilization efficiency of the fluorescence and improve the sensitivity characteristics. In other words, the light reflecting layer 16 has the function of reflecting the fluorescence converted by the scintillator layer 5. The light reflecting layer 16 reflects light directed in the direction opposite to the photoelectric conversion substrate 2 side, thereby increasing the amount of light directed toward the photoelectric conversion section 2b.

[0163] The moisture-proof body 17 encases the substrate 15, the light-reflecting layer 16, and the scintillator layer 5. The moisture-proof body 17, together with the light-reflecting layer 16, airtightly seals the scintillator layer 5. The moisture-proof body 17 is formed of an organic material such as poly-para-xylylene resin using a chemical vapor deposition (CVD) method. The moisture-proof body 17 formed of poly-para-xylylene resin can be referred to as an organic film.

[0164] The X-ray detector 1 further includes an adhesive layer AL. The adhesive layer AL is located between the photoelectric conversion substrate 2 and the scintillator panel SP. More specifically, the adhesive layer AL adheres to the insulating layer 25 of the photoelectric conversion substrate 2 and the moisture-proof body 17 of the scintillator panel SP. The photoelectric conversion substrate 2 and the scintillator panel SP are bonded together by the adhesive layer AL.

[0165] In the second embodiment, the X-ray detection module 10 is configured similarly to the X-ray detection module 10 of the first embodiment. Therefore, in the second embodiment, the same effects as those of the first embodiment can be obtained. Note that the techniques described in the second embodiment may be combined with the techniques described in the first to tenth modifications.

[0166] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims.

[0167] For example, the above-described technology is not limited to application to the X-ray detection panel PNL, the X-ray detection module 10, and the X-ray detector 1, but can be applied to other X-ray detection panels, other X-ray detection modules, and other X-ray detectors. Furthermore, the above-described technology is not limited to application to X-ray detectors, but can be applied to radiation detection panels, radiation detection modules, and radiation detectors. [Explanation of symbols]

[0168] 1...X-ray detector, 10...X-ray detection module, PNL...X-ray detection panel, 2...Photoelectric conversion board, 2a...base material, 2aa...main body part, 2ab, 2ac...projection part, 2b...photoelectric conversion unit, 2b1...photoelectric conversion element, 2b2...TFT, 2c1...control line, 2c2...data line, 2e, 2e1, 2e2...wiring section, 2d1, 2d2...pad, 3b, 3c...FPC, 5...scintillator layer, 6...light-reflecting layer, 7...moisture-proof cover, 8...Sealing part, 11...Circuit board, 12...Support board, AD1...First adhesive material, AD2...second adhesive, SU3,SU4...side, E,E1,E2,E3,E4...end, C1...first section, C2...second section, SI1, SI2, SI3...side edge portions, F1, F2, F3, F4...straight part, O1, O2...concave part, G1...first end, G2...second end, 100...substrate, 200...laser, 300...winder, DA...detection area, NDA: non-detection area, PAb: first protruding area, PAc: second protruding area, A1: first area, A2...Second area, A3...Third area, D1, D2...Shortest distance, k...Bending rigidity, P... adhesive strength, W... width, dL1, dL2... longitudinal direction, dS1, dS2... transverse direction, P1,P2,P3...position, b,b1,b2,b3...width, θ1,θ2...angle, X...row direction, Y...column direction.

Claims

1. a radiation detection panel; a first wiring substrate; a first adhesive material; The radiation detection panel comprises: a photoelectric conversion substrate including a flexible base material including a main body portion located in a detection region and a non-detection region surrounding the detection region, and a first protrusion portion protruding from a first end of the main body portion, being formed physically continuous with the main body portion, and located in a first protrusion region outside the non-detection region; a plurality of photoelectric conversion elements provided above the main body portion and located in the detection region; a plurality of first pads provided above the first protrusion portion; and a plurality of first wirings located above the main body portion and the first protrusion portion; each of the first wirings is electrically connected to a corresponding one of the plurality of first pads and to two or more corresponding photoelectric conversion elements of the plurality of photoelectric conversion elements; the first adhesive bonds the first protruding region of the photoelectric conversion substrate to the first wiring substrate and electrically connects the plurality of first pads to the first wiring substrate; When the shortest distance from the first end to the first adhesive along the surface on which the plurality of first pads of the first protruding portion are provided is defined as D1, D1>0; Radiation detection module.

2. k denotes a bending rigidity in a cross section of the first protruding region of the photoelectric conversion substrate that is parallel to the direction in which the first end portion extends; P is the adhesive strength between the first protruding region of the photoelectric conversion substrate and the first wiring substrate by the first adhesive; In the region where the first protruding region of the photoelectric conversion substrate and the first wiring substrate overlap, the width of the first adhesive in the short side direction is defined as W. [Equation 1] That is, The radiation detection module according to claim 1 .

3. a width of the first protruding region of the photoelectric conversion substrate in a direction in which the first end portion extends monotonically decreasing with increasing distance from the non-detection region; The radiation detection module according to claim 1 .

4. the first end portion has a first section and a second section that is adjacent to the first section with the first protruding region of the photoelectric conversion substrate interposed therebetween, an outer peripheral edge portion of the first projecting region of the photoelectric conversion substrate has a first side edge portion that is continuous with the first section of the first end portion, extends linearly, and is bent relative to the first section; an angle formed between the first section of the first end portion and the first side edge portion is an obtuse angle; The radiation detection module according to claim 3 .

5. an outer peripheral edge portion of the first projecting region of the photoelectric conversion substrate has a second side edge portion that is continuous with the second section of the first end portion, extends linearly, and is bent relative to the second section; an angle formed between the second section of the first end and the second side edge is an obtuse angle; The radiation detection module according to claim 4 .

6. the first end portion has a first section and a second section that is adjacent to the first section with the first protruding region of the photoelectric conversion substrate interposed therebetween, an outer peripheral edge portion of the first protruding region of the photoelectric conversion substrate has a first side edge portion continuing from the first section of the first end portion, a second side edge portion continuing from the second section of the first end portion, and a third side edge portion continuing from the first side edge portion on one side and from the second side edge portion on the other side; the first adhesive is located between the third side edge and the first end in a direction in which the first protruding portion protrudes; The first side edge portion has a first recess portion that is continuous with the first section and curved toward the second side edge portion. The radiation detection module according to claim 1 .

7. The second side edge portion has a second recess portion that is continuous with the second section and curved toward the first side edge portion. The radiation detection module according to claim 6 .

8. the entire first side edge portion is the first recessed portion, In the direction in which the first end portion extends, the first recess is adjacent to the first adhesive; a width of the first protruding region of the photoelectric conversion substrate gradually decreases with increasing distance from the first end; The radiation detection module according to claim 6 .

9. the first side edge portion further includes a first linear portion continuing from the first recess on one side and continuing from the third side edge on the other side; the first protruding region of the photoelectric conversion substrate further includes a first region including the first recess, and a second region including the first linear portion and the third side edge portion and positioned closer to a tip end of the first protruding region than the first region; the first adhesive is overlaid on the second region of the photoelectric conversion substrate; In a direction in which the first end portion extends, a width of the first region of the photoelectric conversion substrate gradually decreases with increasing distance from the first end portion. The radiation detection module according to claim 6 .

10. the first end portion has a first section and a second section that is adjacent to the first section with the first protruding region of the photoelectric conversion substrate interposed therebetween, an outer peripheral edge portion of the first protruding region of the photoelectric conversion substrate has a first side edge portion continuing from the first section of the first end portion, a second side edge portion continuing from the second section of the first end portion, and a third side edge portion continuing from the first side edge portion on one side and from the second side edge portion on the other side; the first side edge portion has a first recessed portion continuing from the first section and recessed toward the second side edge portion, and a first linear portion continuing from the first recessed portion on one side and continuing from the third side edge portion on the other side, the first protruding region of the photoelectric conversion substrate further includes a first region including the first recess, and a second region including the first linear portion and the third side edge portion and positioned closer to a tip end of the first protruding region than the first region; the first adhesive is overlaid on the second region of the photoelectric conversion substrate; In a direction in which the first end portion extends, the first region has a plurality of widths including a first width, a second width, and a third width; the first width is a value at a first position where a first end of the first region on the first end side is located, the second width is a value at a second position where a second end of the first region on the second region side is located, the third width is a value at a third position between the first position and the second position, Among the plurality of widths of the first region, the third width is minimum. The radiation detection module according to claim 1 .

11. The first recess is curved. The radiation detection module according to claim 10.

12. the second side edge portion has a second recessed portion continuing from the second section and recessed toward the first side edge portion, and a second linear portion continuing from the second recessed portion on one side and from the third side edge portion on the other side, the first region further includes the second recess and is a constricted region in the first protruding region; The second region further includes the second linear portion. The radiation detection module according to claim 10.

13. the first end portion has a first section and a second section that is adjacent to the first section with the first protruding region of the photoelectric conversion substrate interposed therebetween, an outer peripheral edge portion of the first protruding region of the photoelectric conversion substrate has a first side edge portion continuing from the first section of the first end portion, a second side edge portion continuing from the second section of the first end portion, and a third side edge portion continuing from the first side edge portion on one side and from the second side edge portion on the other side; the first side edge portion has a first linear portion continuing from the first section, a first recessed portion continuing from the first linear portion and recessed toward the second side edge portion, and a third linear portion continuing from the first recessed portion on one side and from the third side edge portion on the other side, the first protruding region of the photoelectric conversion substrate further includes a first region including the first linear portion, a second region including the first recess and positioned closer to the tip of the first protruding region than the first region, and a third region including the third linear portion and the third side edge portion and positioned closer to the tip of the first protruding region than the second region, the first adhesive is overlaid on the third region of the photoelectric conversion substrate; In a direction in which the first end portion extends, the second region has a plurality of widths including a first width, a second width, and a third width; the first width is a value at a first position where a first end of the second region on the first region side is located, the second width is a value at a second position where a second end of the second region on the third region side is located, the third width is a value at a third position between the first position and the second position, Among the plurality of widths of the second region, the third width is minimum. The radiation detection module according to claim 1 .

14. The first recess is curved. The radiation detection module of claim 13.

15. the second side edge portion has a second linear portion continuing from the second section, a second recessed portion continuing from the second linear portion and recessed toward the first side edge portion, and a fourth linear portion continuing from the second recessed portion on one side and from the third side edge portion on the other side, the first region further includes the second linear portion, the second region further includes the second recess and is a constricted region in the first protruding region; the third region further includes the fourth linear portion; The radiation detection module of claim 13.

16. a second wiring substrate; a second adhesive material, the main body portion further has a second end portion that is continuous with the first end portion and bent relative to the first end portion; the substrate further includes a second protrusion protruding from the second end of the body portion, being physically continuous with the body portion, and positioned in a second protrusion region outside the non-detection region; the photoelectric conversion substrate further includes a plurality of second pads provided above the second protrusion, and a plurality of second wirings positioned above the main body and the second protrusion, each of the second wirings is electrically connected to a corresponding one of the plurality of second pads and to two or more corresponding photoelectric conversion elements of the plurality of photoelectric conversion elements; the second adhesive bonds the second protruding region of the photoelectric conversion substrate to the second wiring substrate and electrically connects the plurality of second pads to the second wiring substrate; When the shortest distance from the second end portion to the second adhesive along the surface on which the plurality of second pads of the second protruding portion are provided is defined as D2, D2>0; The radiation detection module according to claim 1 .

17. the first adhesive has a first longitudinal direction in a region where the first protruding region of the photoelectric conversion substrate and the first wiring substrate overlap; The plurality of first pads are aligned in the first longitudinal direction, the second adhesive has a second longitudinal direction in a region where the second protruding region of the photoelectric conversion substrate and the second wiring substrate overlap; The plurality of second pads are aligned in the second longitudinal direction, the first longitudinal direction and the second longitudinal direction are substantially parallel; 17. The radiation detection module of claim 16.

18. The substrate is formed of polyimide. The radiation detection module according to claim 1 .

19. the radiation detection panel further includes a scintillator layer provided above the photoelectric conversion substrate and positioned in the detection region; The radiation detection module according to claim 1 .

20. The radiation detection module according to claim 1 ; a circuit board electrically connected to the first wiring board and driving the photoelectric conversion board, the main body is located between a group including the circuit board and the first wiring board and the plurality of photoelectric conversion elements; the first protruding region of the photoelectric conversion substrate is curved; Radiation detector.

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