Method for measuring strength of chip and testing device

Abstract

To provide a method for measuring the strength of a chip and a testing device, capable of grasping that the chip is placed in the direction of any degree with respect to a first direction of a support unit before a breaking test, after the breaking test, when measuring the strength of the chip.SOLUTION: A method for measuring the strength of a planar and rectangular chip includes: a preparation step 1001 for preparing the testing device; a support step 1002 for placing and supporting the chip on a support unit; an imaging step 1003 for imaging the chip supported on the support unit from above; an inclination angle detection step 1004 for detecting and storing an inclination angle of the chip with respect to a first direction where a first support part and a second support part are extended on the basis of a captured image; and a chip-breaking step 1005 for moving an indenter toward the chip, pressing and breaking the chip by the indenter, and acquiring the measured value of a load measuring unit when the chip is broken, after the inclination angle detection step 1004.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a chip strength measuring method and testing device for measuring the strength of a flat, rectangular chip. [Background technology]

[0002] As a method for measuring the strength (transverse strength, bending strength) of chips cut out from a semiconductor wafer, three-point bending defined in SEMI (Semiconductor Equipment and Materials International) standard G86-0303 is generally widely used, and for example, a measuring device for accurately measuring the fracture toughness value known as the JIC value has been disclosed (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-017054 Summary of the Invention [Problem to be solved by the invention]

[0004] When measuring the strength of multiple chips to compare them, the cut chips are set in the same orientation in a testing device and then crushed by pressing with an indenter. The chips are set on first and second support portions of a support unit that extend parallel to each other with a gap between them, so that they are oriented in a predetermined direction relative to the first direction in which the first and second support portions extend. If the orientation of the chip is misaligned with respect to the first direction, the correct strength may not be obtained. Because the method for measuring chip strength is a destructive test, it is difficult to determine the orientation of the chip whose strength was measured later relative to the first direction.

[0005] The present invention has been made in consideration of such problems, and its purpose is to provide a chip strength measurement method and testing device that, when measuring the strength of a chip, can determine after the destructive test how oriented the chip was relative to the first direction of the support unit before the destructive test. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the method for measuring the strength of a chip of the present invention is a method for measuring the strength of a flat, rectangular chip, and includes: a support unit having a first support portion and a second support portion that extend parallel to each other with a gap therebetween and support the underside of the chip; an indenter that is disposed above the support unit and between the first support portion and the second support portion and extends in a first direction that is the direction in which the first support portion and the second support portion extend; a moving unit that moves the indenter relatively close to the chip supported by the support unit; and a measuring unit that measures the load with which the indenter presses the chip supported by the support unit. a support step of placing the chip on the support unit and supporting it after the preparation step; an imaging step of imaging the chip supported in the support step with an imaging unit; an inclination angle detection step of detecting and storing the inclination angle of the chip with respect to the first direction based on the image captured in the imaging step; and a chip destruction step of moving the indenter toward the chip, pressing the chip with the indenter to destroy it, and obtaining the measurement value of the load measurement unit when the chip is destroyed after the inclination angle detection step.

[0007] After the tilt angle detection step, the method may include a determination step of determining that the tilt angle of the chip is defective when the detected tilt angle of the chip exceeds a predetermined threshold, and an alarm step of notifying that the tilt angle of the chip is defective by an alarm unit when the tilt angle of the chip is determined to be defective in the determination step.

[0008] In the method for measuring the strength of a chip, the length of the first support portion and the second support portion in the first direction may be longer than the length of the side of the chip along the first direction, and the first support portion and the second support portion may be exposed from the chip in a planar view.

[0009] In addition, in order to solve the above-mentioned problems and achieve the object, the testing apparatus of the present invention is a testing apparatus for measuring the strength of a flat, rectangular chip, and comprises: a support unit having a first support portion and a second support portion that extend parallel to each other with a gap between them and support the underside of the chip; an indenter that is arranged above the support unit and between the first support portion and the second support portion and extends in a first direction, the first direction being the direction in which the first support portion and the second support portion extend; a moving unit that moves the indenter closer to the chip supported by the support unit; a load measuring unit that measures the load with which the indenter presses the chip supported by the support unit; an imaging unit that images the chip supported by the support unit; and a control unit that controls at least the moving unit, the load measuring unit, and the imaging unit, and the control unit has a memory unit that detects and stores the tilt angle of the chip with respect to the first direction based on the image captured by the imaging unit.

[0010] The control unit may further include an alarm unit that notifies an operator, and the control unit may have a judgment unit that determines that the tilt angle of the tip is defective when the tilt angle of the tip stored in the memory unit exceeds a predetermined threshold, and when the judgment unit determines that the tilt angle is defective, the alarm unit may notify the operator that the tip is defective.

[0011] In the test device, the length of the first support portion and the second support portion in the first direction may be longer than the length of the side of the chip along the first direction, and the first support portion and the second support portion may be exposed from the chip in a planar view. [Effects of the Invention]

[0012] The present invention places a chip on a support unit to support it, then captures an image of the chip supported on the support unit from above, and based on this image, detects and stores the tilt angle of the chip with respect to a first direction in which the first support portion and the second support portion extend, before conducting a destructive test to destroy the chip. Therefore, the present invention has the effect of being able to determine, after the destructive test to destroy the chip, the orientation and tilt at which the chip was placed with respect to the first direction in which the first support portion and the second support portion extend, when measuring the strength of the chip through a destructive test to destroy the chip. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a perspective view of a chip that is the test subject of the testing device according to the first embodiment and the strength measurement subject of the chip strength measurement method according to the first embodiment. [Figure 2] FIG. 2 is a perspective view showing an example of the configuration of a test device according to the first embodiment. [Figure 3] FIG. 3 is a perspective view showing a support unit of the testing apparatus according to the first embodiment. [Figure 4] FIG. 4 is a perspective view showing a configuration of a part of the test device according to the first embodiment. [Figure 5] FIG. 5 is a cross-sectional view showing a partial configuration of the test device according to the first embodiment. [Figure 6] FIG. 6 is a diagram showing an example of an image captured by the first imaging unit of the test device according to the first embodiment. [Figure 7] FIG. 7 is a diagram showing an example of an image captured by the first imaging unit of the test device according to the first embodiment. [Figure 8] FIG. 8 is a flowchart showing the procedure of the tip strength measuring method according to the first embodiment. [Figure 9] FIG. 9 is a flowchart showing the procedure of the tip strength measuring method according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0015] [Embodiment 1] A chip strength measurement method and test apparatus 1 according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a chip 100, which is the test subject of the test apparatus 1 according to the first embodiment and the strength measurement subject of the chip strength measurement method according to the first embodiment. FIG. 2 is a perspective view showing an example of the configuration of the test apparatus 1 according to the first embodiment. FIG. 3 is a perspective view showing a support unit 10 of the test apparatus 1 according to the first embodiment. FIG. 4 is a perspective view showing a partial configuration of the test apparatus 1 according to the first embodiment. FIG. 5 is a cross-sectional view showing a partial configuration of the test apparatus 1 according to the first embodiment. FIGS. 6 and 7 are both views showing images 201 and 202, which are examples of images captured by the first imaging unit 50 of the test apparatus 1 according to the first embodiment.

[0016] The chip strength measuring method according to the first embodiment is an example of the operation process of the test apparatus 1 shown in Fig. 2 according to the first embodiment, and is a method of breaking the chip 100 shown in Fig. 1 and measuring the strength (transverse strength, bending strength) of the chip 100. The test apparatus 1 shown in Fig. 2 according to the first embodiment is an example of an apparatus that performs the chip strength measuring method according to the first embodiment, and is an apparatus that breaks the chip 100 shown in Fig. 1 and measures the strength (transverse strength, bending strength) of the chip 100.

[0017] The chip 100, which is the test subject of the test apparatus 1 according to the first embodiment and the strength measurement subject of the chip strength measurement method according to the first embodiment, is formed in a flat, rectangular shape as shown in FIG. 1 and has two pairs of parallel, opposing sides. In the example of the first embodiment shown in FIG. 1, the chip 100 has a length 110 of the long side, which is the longer of the two pairs of sides, of 5 mm to 30 mm (e.g., 20 mm), a length 120 of the short side, which is the shorter of the two pairs of sides, of 5 mm to 30 mm (e.g., 12 mm), and a thickness 130 in a direction perpendicular to the long and short side directions of 0.01 mm to 1 mm (e.g., 0.1 mm). The chip 100 may be formed in a square shape in which the long side length 110 and the short side length 120 are equal.

[0018] The chip 100 is obtained by cutting and dividing a wafer, such as a disk-shaped semiconductor device wafer or an optical device wafer, made of a base material such as silicon, sapphire, silicon carbide (SiC), or gallium arsenide, along a plurality of planned division lines formed in a grid pattern on the surface of the wafer, to separate devices formed in areas partitioned by the plurality of planned division lines. Thus, in the first embodiment, the chip 100 includes a portion of the wafer and a device, and the device is formed on the front surface side of the wafer, but the present invention is not limited to this, and the chip may include only a portion of the wafer, with no device formed on the front surface side of the wafer.

[0019] As shown in FIG. 2, the testing apparatus 1 according to the first embodiment includes a support unit 10, an indenter 20, a moving unit 30, a load measuring unit 40, a first imaging unit 50, a second imaging unit 60, an alarm unit 70, and a control unit 80.

[0020] The support unit 10 supports the chip 100 and includes a pair of support bases 11, a first support portion 13, a second support portion 14, a contact member 15, and a support base moving mechanism 16, as shown in FIG. 3. The pair of support bases 11 are each formed in a rectangular parallelepiped shape and are arranged spaced apart from each other so that a predetermined interval 12 (gap) is provided between the pair of support bases 11. In the example of embodiment 1 shown in FIG. 3, the pair of support bases 11 are arranged such that a first direction 18, which is the direction in which one pair of sides parallel to the horizontal direction extends, is aligned with the Y-axis direction shown in FIGS. 2 and 3, which is parallel to the horizontal direction, and a second direction 19, which is the direction in which the other pair of sides parallel to the horizontal direction extends, is aligned with the X-axis direction shown in FIGS. 2 and 3, which is parallel to the horizontal direction, and the direction in which the pair of support bases 11 are spaced apart from each other to form the predetermined interval 12 is perpendicular to the first direction 18 and parallel to the second direction 19.

[0021] 3, the pair of support bases 11 are each provided with a first support portion 13 and a second support portion 14 in a columnar (rod-like) shape that extend along a first direction 18 and protrude upward on adjacent edges of the upper surface, and the upper surface is covered with a contact member 15 except for the aforementioned edges. That is, the support unit 10 has a first support portion 13 in a columnar (rod-like) shape that extends along the first direction 18 and protrudes upward on an edge of one of the upper surfaces of the pair of support bases 11 that is adjacent to the other support base 11, and a second support portion 14 in a columnar (rod-like) shape that extends along the first direction 18 and protrudes upward on an edge of the other upper surface of the pair of support bases 11 that is adjacent to the one support base 11. Both the first support portion 13 and the second support portion 14 are made of a metal such as stainless steel, and support the back surface 102, which is the lower surface of the chip 100, from below upward. Thus, the support unit 10 has a first support portion 13 and a second support portion 14 that extend parallel to each other along a first direction 18 with a distance 12 therebetween and support the back surface 102 side, which is the underside of the chip 100. In the first embodiment, the cross-sectional shapes of the upper surfaces of the first support portion 13 and the second support portion 14 are formed as upwardly convex curved surfaces.

[0022] The contact member 15 is made of a material (for example, sponge rubber) that is softer than the first support portion 13 and the second support portion 14, and is formed in a plate shape with a constant thickness. As shown in Fig. 5, the contact member 15 is formed in a rectangular planar shape, and its thickness in an undeformed state is greater than the amount by which the first support portion 13 and the second support portion 14 protrude from the upper surfaces of the pair of support bases 11.

[0023] As shown in FIG. 5 , the contact member 15 supports the chip 100 with the back surface 102 of the chip 100 placed on its upper surface. For this reason, the upper surface of the contact member 15 supports the back surface 102 of the chip 100. In the first embodiment, the upper surface of the contact member 15 in an undeformed state is located approximately 1 mm above the upper ends of the first support portion 13 and the second support portion 14. For this reason, the back surface 102 of the chip 100 placed on the pair of support bases 11 contacts the upper surface of the contact member 15 with a gap between it and the first support portion 13 and the second support portion 14. Furthermore, when the indenter 20 presses the chip 100, the contact member 15 deforms and the upper ends of the first support portion 13 and the second support portion 14 contact the back surface 102 of the chip 100, supporting the back surface 102.

[0024] Note that if the back surface 102 of the chip 100 comes into contact with the first support portion 13 and the second support portion 14 when the chip 100 is placed on the pair of support bases 11, the back surface 102 of the chip 100 may be damaged by the impact during placement. In this case, the flexural strength of the chip 100 may change, making it difficult to measure the flexural strength of multiple chips 100 under the same conditions. For this reason, as shown in FIG. 5 , the test apparatus 1 according to the first embodiment has contact members 15 made of a flexible material on the upper surface sides of the pair of support bases 11 of the support unit 10, and the upper surface of the contact members 15 is positioned above the upper ends of the first support portion 13 and the second support portion 14. For this reason, in the test apparatus 1 according to the first embodiment, when the chip 100 is placed on the pair of support bases 11, as shown in FIG. 5 , the chip 100 comes into contact with the upper surface of the contact members 15 without coming into contact with the first support portion 13 and the second support portion 14, and is supported by the upper surface. As a result, the test apparatus 1 of embodiment 1 can prevent the back surface 102 of the chip 100 from coming into contact with the first support portion 13 and the second support portion 14 and being damaged when the chip 100 is placed, and can suppress changes in the flexural strength of the chip 100.

[0025] The support base moving mechanism 16 moves each of the pair of support bases 11 along the second direction 19 (X-axis direction), and by moving each of the pair of support bases 11, the predetermined gap 12 between the pair of support bases 11, i.e., the predetermined gap 12 between the first support portion 13 and the second support portion 14, is changed. The support base moving mechanism 16 is configured to include, for example, a well-known ball screw that is rotatable about an axis along the X-axis direction, a well-known pulse motor that rotates the ball screw about the axis, and a well-known guide rail that supports each of the pair of support bases 11 so that it can be moved in the X-axis direction.

[0026] The indenter 20 performs a destructive test by pressing the chip 100 supported by the support unit 10. In the example of embodiment 1 shown in Figures 2, 4, and 5, the indenter 20 presses the chip 100 supported by the support unit 10 to perform a three-point bending test, but the present invention is not limited to this and the indenter 20 may also perform a four-point bending test, etc. The indenter 20 is disposed above the pair of support bases 11 and above between the first support portion 13 and the second support portion 14, and extends in a first direction 18, which is the direction in which the first support portion 13 and the second support portion 14 extend.

[0027] As shown in FIGS. 2, 4, and 5, the indenter 20 is formed as a tapered, integral plate with a width 21 in the second direction 19 that narrows downward, and the lower end 22 is formed as a downwardly convex curved surface. As shown in FIGS. 2 and 4, the lower end 22 of the indenter 20 extends in the first direction 18. As shown in FIG. 5, the lower end 22 of the indenter 20 abuts against and presses against a surface 101, which is the upper surface of a chip 100 supported on a pair of support bases 11 of the support unit 10. As shown in FIG. 4, the upper end of the indenter 20 is supported by the clamping member 38 of the moving unit 30 in parallel with the first direction 18. As shown in FIG. 5, the lower end 22 is positioned above and between the first support portion 13 and the second support portion 14. The lower end 22 of the indenter 20 faces the predetermined gap 12 between the first support portion 13 and the second support portion 14 along the vertical Z-axis direction. In addition, in the first embodiment, the length in the first direction 18 of the pair of support bases 11 (the first support portion 13 and the second support portion 14) and the length in the first direction 18 of the indenter 20 (the lower end 22) are approximately equal.

[0028] The moving unit 30 is provided above the support unit 10 and moves the indenter 20 relatively close to the chip 100 supported by the support unit 10, and presses the chip 100 supported by the support unit 10 with the indenter 20 to break it. As shown in FIGS. 2 and 4 , the moving unit 30 includes a support plate 31, a ball screw 32, a motor 33, guide rails 34, a moving base 35, an upper support member 36, a lower support member 37, and a clamping member 38. The support plate 31 is disposed to extend vertically. The ball screw 32 is supported by the support plate 31 so as to be rotatable about an axis along the Z-axis direction. The motor 33 rotates the ball screw 32 about its axis. The guide rails 34 support the moving base 35 so as to be movably in the Z-axis direction.

[0029] The longitudinal directions of the support plate 31, ball screw 32, and guide rail 34 are parallel to the Z-axis direction. The ball screw 32 is threaded into a threaded hole provided in a movable base 35. The guide rail 34 is attached to the support plate 31. The moving unit 30 moves the indenter 20 in the Z-axis direction via the movable base 35 by the motor 33 rotating the ball screw 32 around its axis.

[0030] As shown in FIGS. 2 and 4 , the movable base 35 is formed in a rectangular parallelepiped shape, and a cylindrical upper support member 36 extending downward is connected to the lower surface thereof. A load measurement unit 40 consisting of a load cell or the like is fixed to the lower end of the upper support member 36. The load measurement unit 40 measures the load with which the indenter 20 presses against the chip 100 supported on the pair of support bases 11 of the support unit 10 and outputs the measurement result to the control unit 80. A clamping member 38 is attached to the lower side of the load measurement unit 40 via a cylindrical lower support member 37. In this way, the movable unit 30 supports the load measurement unit 40 via the upper support member 36 and the lower support member 37. The clamping member 38 is formed in a substantially gate-like shape when viewed from the front, and the indenter 20 is fixed between a pair of opposing clamping surfaces to press against the chip 100 supported by the pair of support bases 11.

[0031] Before placing the chip 100 on the pair of support stages 11, the testing apparatus 1 uses the support stage moving mechanism 16 to adjust the positions of the pair of support stages 11 in the second direction 19 while positioning the moving base 35 and the indenter 20 above using the moving unit 30, and adjusts the spacing between the first support portion 13 and the second support portion 14 to a predetermined spacing 12 that corresponds to the dimensions of the chip 100 (length 110, length 120, and thickness 130). The chip 100 is placed on the pair of support stages 11 so that the directions of any pair of sides are parallel to the first direction 18, i.e., so that the long side direction or the short side direction is parallel to the first direction 18. The chip 100 is also placed on the pair of support stages 11 so that it straddles both the first support portion 13 and the second support portion 14 in the second direction 19. When the chip 100 is placed on the pair of support bases 11 in this manner, both ends of the chip 100 are supported by the support bases 11 and the center portion of the chip 100 overlaps between the pair of support bases 11 .

[0032] In the first embodiment, the length of the first support portion 13 and the second support portion 14 in the first direction 18 is longer than the length of the sides of the chip 100 placed on the pair of support bases 11 along the first direction 18, and the first support portion 13 and the second support portion 14 are exposed and protrude from the chip 100 along the first direction 18 in a plan view seen from above. That is, when the chip 100 is placed on the pair of support bases 11 so that the long side direction of the chip 100 is along the first direction 18, the length of the first support portion 13 and the second support portion 14 in the first direction 18 is longer than the length 110 of the long side of the chip 100. Furthermore, when the chip 100 is placed on the pair of support bases 11 so that the short side direction of the chip 100 is along the first direction 18, the length of the first support portion 13 and the second support portion 14 in the first direction 18 is longer than the length 120 of the short side of the chip 100.

[0033] The moving base 35 of the moving unit 30 is provided with a pair of plate-shaped connecting members on both side surfaces in the second direction 19, and a rectangular parallelepiped transparent container 39 that covers the lower end 22 of the indenter 20 is fixed via the pair of connecting members. The transparent container 39 is transparent to light rays such as visible light captured by the first imaging unit 50 and the second imaging unit 60, and is formed in a box shape from a material that is transparent to visible light, such as glass or plastic. An indenter insertion hole is formed in the transparent container 39, and the indenter 20 is inserted into the indenter insertion hole and positioned above the lower end 22 of the indenter 20. The transparent container 39 is moved in the Z-axis direction together with the indenter 20 via the moving base 35 by the moving unit 30. The transparent container 39 moves downward along the Z-axis direction together with the indenter 20, and when the lower end 22 of the indenter 20 approaches the surface 101 of the chip 100 supported on a pair of support stands 11 of the support unit 10, it is positioned in a position covering the upper part of the pair of support stands 11 of the support unit 10, as shown in Figure 5.

[0034] The first imaging unit 50 is disposed at a position where it can photograph the chip 100 supported on the pair of support bases 11 of the support unit 10 from above. The first imaging unit 50 is an example of an imaging unit according to the present invention. The second imaging unit 60 is disposed at a position where it can photograph the chip 100 supported on the pair of support bases 11 of the support unit 10 from the side. Both the first imaging unit 50 and the second imaging unit 60 are disposed outside the transparent container 39 and capture images of light passing through the transparent container 39 from inside the transparent container 39. For example, both the first imaging unit 50 and the second imaging unit 60 are visible light cameras that capture visible light passing through the transparent container 39, but the present invention is not limited to this.

[0035] 2, the first imaging unit 50 is disposed outside the transparent container 39 and obliquely above the pair of support stands 11 of the support unit 10, and images the pair of support stands 11 of the support unit 10 and the chips 100 supported on the pair of support stands 11 from obliquely above through the transparent container 39. The second imaging unit 60 is disposed outside the transparent container 39 and laterally with respect to the pair of support stands 11 of the support unit 10, and images the pair of support stands 11 of the support unit 10 and the chips 100 supported on the pair of support stands 11 from the side through the transparent container 39.

[0036] The first imaging unit 50 and the second imaging unit 60 each include an imaging element that images the pair of support bases 11 of the support unit 10 and the chip 100 supported on the pair of support bases 11. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The first imaging unit 50 images the pair of support bases 11 of the support unit 10 and the chip 100 supported on the pair of support bases 11 from diagonally above, and outputs the image obtained by imaging to the control unit 80. The second imaging unit 60 images the pair of support bases 11 of the support unit 10 and the chip 100 supported on the pair of support bases 11 from the side, and outputs the image obtained by imaging to the control unit 80.

[0037] After the chip 100 is placed on the pair of support bases 11 and before the indenter 20 presses the chip 100, i.e., before a destructive test is performed to destroy the chip 100, the first imaging unit 50 images the pair of support bases 11 of the support unit 10 and the chip 100 supported on the pair of support bases 11 from above, thereby making it possible to determine the orientation of the chip 100 with respect to the first direction 18 of the support unit 10. Here, the orientation of the chip 100 with respect to the first direction 18 of the support unit 10 can be represented by the tilt angle θ of the chip 100 with respect to the first direction 18 (see Figures 6 and 7), i.e., the angle between the direction of the side of the chip 100 set to be parallel to the first direction 18 and the first direction 18 of the support unit 10.

[0038] The first imaging unit 50 captures an image of the pair of support bases 11 of the support unit 10 and the chip 100 supported on the pair of support bases 11 from above, thereby acquiring, for example, an image 201 shown in Fig. 6 or an image 202 shown in Fig. 7. In practice, the first imaging unit 50 captures an image of the pair of support bases 11 of the support unit 10 and the chip 100 supported on the pair of support bases 11 from diagonally above, and therefore may acquire an image that includes a tilt component relative to the vertical direction of the imaging direction, as compared to the image 201 shown in Fig. 6 or the image 202 shown in Fig. 7. In this case, the control unit 80 performs predetermined image processing on these images based on the tilt component to correct the tilt component, thereby acquiring the image 201 shown in Fig. 6 or the image 202 shown in Fig. 7, which appears as if the pair of support bases 11 of the support unit 10 and the chip 100 supported on the pair of support bases 11 were captured from above in a completely vertical direction.

[0039] As shown in FIGS. 6 and 7, images 201 and 202 each include image information of a pair of support bases 11 of the support unit 10 viewed from above and image information of a chip 100 supported on the pair of support bases 11. For illustrative purposes, images 201 and 202 in FIGS. 6 and 7 include dashed-dotted auxiliary lines indicating a center line that passes through the center of the predetermined distance 12 between the first support portion 13 and the second support portion 14 in the second direction 19 and is parallel to the first direction 18, and dashed-dotted auxiliary lines indicating center lines of a pair of sides of the chip 100 that are set parallel to the first direction 18. The angles formed by these auxiliary lines indicate the tilt angles θ1 and θ2 of the chip 100 with respect to the first direction 18 in each of images 201 and 202. In this way, images 201 and 202 include information on the tilt angles θ1 and θ2 of the chip 100 with respect to the first direction 18.

[0040] When the indenter 20 presses the chip 100, the second imaging unit 60 captures images from the side of the pair of support bases 11 of the support unit 10 and the chip 100 supported on the pair of support bases 11, as well as the lower end 22 of the indenter 20 pressing against the chip 100, thereby allowing observation of the state of the chip 100 being pressed and destroyed by the lower end 22 of the indenter 20, the state of the chip 100 being pressed against the lower end 22 of the indenter 20, the state of the lower end 22 of the indenter 20 (whether or not there is any foreign matter attached, whether or not there is any chipping, etc.), etc.

[0041] The notification unit 70 notifies the operator of various processing results, detection results, judgment results, etc., performed by the test device 1 in a recognizable manner in response to commands output from the control unit 80. In the first embodiment, the notification unit 70 is, for example, a display unit, a light-emitting unit, an audio unit, etc.

[0042] The display unit serving as the notification unit 70 is provided on a cover (not shown) of the test apparatus 1 with its display surface facing outward. The display unit displays, in a manner that allows an operator to visually confirm, various conditions related to various processes of the test apparatus 1, such as tests by the test apparatus 1 and image capture by the first and second imaging units 50 and 60, as well as acquired images and data, various processing results, detection results, and calculation results by the control unit 80, and judgment results by the judgment unit 82 of the control unit 80 (described later). The display unit is configured with a liquid crystal display device or the like. The display unit is provided with an input unit that the operator uses to input information related to the various conditions of the test apparatus 1 and information related to the display of images, etc. The input unit provided on the display unit is configured with at least one of a touch panel provided on the display unit and a keyboard, etc. The display unit is not fixed to the test apparatus 1 but may be provided on any communication device, and the communication device may be connected to the test apparatus 1 wirelessly or via a wire.

[0043] The light-emitting unit serving as the notification unit 70 is provided above a cover (not shown) of the test device 1. The light-emitting unit is composed of, for example, a light-emitting diode, and by lighting up, blinking, changing the color of light, etc., the light-emitting diode notifies the operator of errors and judgment results that have occurred during various processes by the test device 1 in a recognizable manner. The audio unit serving as the notification unit 70 is composed of, for example, a speaker, and by emitting audio from the speaker, etc., notifies the operator of errors and judgment results that have occurred during various processes by the test device 1 in a recognizable manner.

[0044] 2, the testing apparatus 1 is further provided with a gas supply unit 91. The gas supply unit 91 injects gas supplied from a gas supply source toward the lower end 22 of the indenter 20 and the periphery of the lower end 22 of the indenter 20, which are covered by the transparent container 39. By injecting gas in this manner, the gas supply unit 91 can remove foreign matter adhering to the lower end 22 of the indenter 20 and the periphery of the lower end 22 of the indenter 20, thereby maintaining the lower end 22 of the indenter 20 in good condition.

[0045] As shown in Fig. 2, the testing device 1 is further provided with a fragment discharge unit 92. The fragment discharge unit 92 introduces negative pressure supplied from a suction source into the space covered by the transparent container 39, thereby collecting and removing fragments of the chip 100 that are generated during the destructive testing of the chip 100. By introducing such negative pressure, the fragment discharge unit 92 can suitably collect and remove fragments of the chip 100 that are generated during the destructive testing of the chip 100, thereby maintaining good conditions within the space covered by the transparent container 39 where the destructive testing of the chip 100 is performed.

[0046] In the first embodiment, the control unit 80 controls the operation of each component of the test device 1, including at least the moving unit 30, the load measuring unit 40, and the first imaging unit 50, and causes the test device 1 to perform various operational processes including the chip strength measuring method according to the first embodiment. The control unit 80 includes a memory unit 81 and a determination unit 82.

[0047] The control unit 80 acquires images 201 and 202 captured by the first imaging unit 50 and an image captured by the second imaging unit 60, and stores the acquired images in the memory unit 81 in association with information representing the chip 100 and the time when the images were captured by the first imaging unit 50. Here, the information representing the chip 100 is represented by, for example, an arrangement of symbols, letters, numbers, etc., and may include information about the wafer from which the chip 100 is cut and its position on the wafer.

[0048] The control unit 80 performs predetermined image processing based on the images 201, 202 captured by the first imaging unit 50 stored in the memory unit 81, detects the tilt angle θ (tilt angles θ1, θ2) of the chip 100 relative to the first direction 18, and stores the detected tilt angle θ in the memory unit 81 in association with information representing the chip 100 and the time the image was captured by the first imaging unit 50.

[0049] The control unit 80 acquires from the load measurement unit 40 the measurement results obtained by measuring the load (force in the Z-axis direction) applied to the indenter 20 by the pressing of the tip 100 during the period from immediately before the indenter 20 starts pressing the tip 100 to immediately after the tip 100 breaks, and stores the measurement results acquired from the load measurement unit 40 in the memory unit 81, linking them with information representing the tip 100 and the time measured by the load measurement unit 40. The control unit 80 acquires the load at break, which is the measurement value of the load measurement unit 40 at the time (moment) when the tip 100 breaks, based on the measurement results acquired from the load measurement unit 40, and stores the acquired load at break in the memory unit 81, linking it with information representing the tip 100 and the time (moment) when the tip 100 breaks.

[0050] The control unit 80 calculates the strength (transverse strength, bending strength) of the broken chip 100 according to the following formula (1) based on the acquired breaking load, the specified distance 12 between the first support part 13 and the second support part 14 when the chip 100 is broken, the dimensions of the broken chip 100 (length 110, length 120 and thickness 130), and the inclination angle θ of the broken chip 100 with respect to the first direction 18, and stores the calculated strength of the chip 100 in the memory unit 81, linking it to information representing the chip 100 and the time (moment) when the chip 100 was broken.

[0051] σ=3LW / 2bh 2 ...Equation (1)

[0052] Here, in the above formula (1), σ is the strength (transverse strength, bending strength) of the broken chip 100 [unit: N / mm 2 ], L indicates a predetermined distance 12 [unit: mm], W indicates the load at break [unit: N], b indicates the contact distance between the lower end 22 of the indenter 20 and the surface 101 of the chip 100 [unit: mm], and h indicates the thickness 130 [unit: mm] of the broken chip 100. Furthermore, b in the above formula (1) is calculated according to the following formula (2).

[0053] b=H / cosθ...Equation (2)

[0054] Here, in the above equation (2), b indicates the contact distance [unit: mm] between the lower end 22 of the indenter 20 and the surface 101 of the chip 100, as in equation (1), H indicates the length [unit: mm] of the side set to be parallel to the first direction 18 of the broken chip 100, which in embodiment 1 is 110 [unit: mm] or 120 [unit: mm], and θ indicates the inclination angle θ of the broken chip 100 with respect to the first direction 18.

[0055] The storage unit 81 stores images 201 and 202 captured by the first imaging unit 50 and images captured by the second imaging unit 60. The storage unit 81 stores images captured by the first imaging unit 50 and the second imaging unit 60 in accordance with the imaging process therein.

[0056] The storage unit 81 also stores the tilt angle θ of the chip 100 with respect to the first direction 18, which the control unit 80 detected based on the images 201, 202 captured by the first imaging unit 50, in association with information representing the chip 100 and the time of capturing the image by the first imaging unit 50. The storage unit 81 stores the tilt angle θ of the chip 100 in accordance with the detection process of the tilt angle θ of the chip 100 performed by the control unit 80.

[0057] Furthermore, the memory unit 81 stores the measurement results measured by the load measurement unit 40 in association with information representing the chip 100 and the time of measurement by the load measurement unit 40. The memory unit 81 also stores the fracture load obtained by the control unit 80 based on the measurement results measured by the load measurement unit 40 and the strength of the chip 100 calculated by the control unit 80 in association with information representing the chip 100 and the time (moment) when the chip 100 fractured.

[0058] The storage unit 81 also stores a predetermined threshold value that serves as a criterion for the determination unit 82 to determine the tilt angle θ of the tip 100. In the first embodiment, the predetermined threshold value is, for example, a value greater than 0 and equal to or less than 1°, preferably greater than 0 and equal to or less than 0.5°, and more preferably greater than 0 and equal to or less than 0.2°. The predetermined threshold value is stored in advance in the storage unit 81 by an operator or the like, and the stored predetermined threshold value is changed by the operator or the like as appropriate.

[0059] The determination unit 82 determines whether the tilt angle θ of the chip 100 stored in the memory unit 81 exceeds a predetermined threshold. If the determination unit 82 determines that the tilt angle θ of the chip 100 stored in the memory unit 81 does not exceed the predetermined threshold, such as the tilt angle θ1 shown in FIG. 6, that is, is equal to or less than the predetermined threshold, the determination unit 82 determines that the tilt angle θ of the chip 100 is not defective. If the determination unit 82 determines that the tilt angle θ of the chip 100 stored in the memory unit 81 exceeds the predetermined threshold, such as the tilt angle θ2 shown in FIG. 7, the determination unit 82 determines that the tilt angle θ of the chip 100 is defective.

[0060] When the determination unit 82 determines that the tilt angle θ of the chip 100 is defective, the control unit 80 outputs command information to the notification unit 70 to notify that the tilt angle θ of the chip 100 is defective. When the determination unit 82 determines that the tilt angle θ of the chip 100 is defective, the control unit 80 outputs such command information to the notification unit 70, causing the notification unit 70 to notify that the tilt angle θ of the chip 100 is defective.

[0061] In the first embodiment, the control unit 80 includes a computer system. The computer system included in the control unit 80 includes an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit), a storage device having memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input / output interface device. The arithmetic processing device of the control unit 80 performs arithmetic processing in accordance with a computer program stored in the storage device of the control unit 80, and outputs control signals for controlling the test apparatus 1 to each component of the test apparatus 1 via the input / output interface device of the control unit 80.

[0062] In the first embodiment, the function of the storage unit 81 is realized by a storage device of the control unit 80. In the first embodiment, the function of the determination unit 82 is realized by the arithmetic processing unit of the control unit 80 executing a computer program stored in the storage device.

[0063] Next, this specification will explain an example of operation processing performed by the test apparatus 1 according to embodiment 1 with reference to the drawings. Fig. 8 is a flowchart showing the processing steps of the chip strength measurement method according to embodiment 1. As shown in Fig. 8, the chip strength measurement method according to embodiment 1 includes a preparation step 1001, a support step 1002, an imaging step 1003, a tilt angle detection step 1004, and a chip destruction step 1005.

[0064] The preparation step 1001 is a step of preparing a testing apparatus 1 including a support unit 10 having a first support portion 13 and a second support portion 14 extending parallel to each other with a gap 12 therebetween and supporting the back surface 102, which is the underside of the chip 100; an indenter 20 arranged above the support unit 10 and between the first support portion 13 and the second support portion 14, and extending in the first direction 18, which is the direction in which the first support portion 13 and the second support portion 14 extend; a moving unit 30 that moves the indenter 20 closer to the chip 100 supported by the support unit 10; and a load measurement unit 40 that measures the load with which the indenter 20 presses the chip 100 supported by the support unit 10.

[0065] Specifically, in the preparation step 1001, in the test apparatus 1, the movable base 35 and the indenter 20 are positioned upward by the movable unit 30, and in this state, the position of the pair of support bases 11 in the second direction 19 is adjusted by the support base moving mechanism 16, and the distance between the first support portion 13 and the second support portion 14 is adjusted to a predetermined distance 12 according to the dimensions of the chip 100 (length 110, length 120 and thickness 130), etc.

[0066] The supporting step 1002 is a step of placing and supporting the chip 100 on the supporting unit 10, as shown in FIG. 5, after the preparing step 1001. In the supporting step 1002, the chip 100 is placed on the pair of supporting stages 11 so that the direction of one pair of sides (long side direction or short side direction) of the chip 100 is parallel to the first direction 18, and so that both the first supporting portion 13 and the second supporting portion 14 straddle the second direction 19. In the supporting step 1002, the chip 100 is transported and placed on the pair of supporting stages 11 by a transport unit (not shown) that holds and transports the chip 100 so as to satisfy these conditions. In the supporting step 1002, the chip 100 is thus supported on the pair of supporting stages 11.

[0067] Here, in the support step 1002, the chip 100 is placed on a pair of support tables 11 so that the direction of one pair of sides (long side direction or short side direction) of either set is exactly parallel to the first direction 18, i.e., so that the inclination angle θ of the chip 100 with respect to the first direction 18 is exactly 0°; however, there are cases in which the inclination angle θ of the chip 100 with respect to the first direction 18 deviates from 0°.

[0068] The imaging step 1003 is a step that follows the supporting step 1002 and involves using the first imaging unit 50 to image the chip 100 supported in the supporting step 1002. In the imaging step 1003, after the supporting step 1002 in which the chip 100 is placed on the pair of support bases 11 is performed and before the chip breaking step 1005 in which the indenter 20 presses the chip 100, i.e., before a destructive test is performed to destroy the chip 100, the first imaging unit 50 images the pair of support bases 11 of the support unit 10 and the chip 100 supported on the pair of support bases 11 from above. In the imaging step 1003, images 201 and 202 are acquired, which include image information of the pair of support bases 11 of the support unit 10 viewed from above and image information of the chip 100 supported on the pair of support bases 11, as shown in FIGS. 6 and 7 .

[0069] The tilt angle detection step 1004 is a step of detecting and storing the tilt angle θ (tilt angles θ1, θ2) of the chip 100 with respect to the first direction 18 based on the images 201, 202 captured in the imaging step 1003. In the tilt angle detection step 1004, after the imaging step 1003 is performed, the control unit 80 executes predetermined image processing based on the images 201, 202 captured by the first imaging unit 50 and stored in the storage unit 81 to detect the tilt angle θ (tilt angles θ1, θ2) of the chip 100 with respect to the first direction 18, and stores the detected tilt angle θ in the storage unit 81 in association with information representing the chip 100 and the time when the image was captured by the first imaging unit 50. In the tilt angle detection step 1004, the storage unit 81 also stores the tilt angle θ detected by the control unit 80 in association with information representing the chip 100 and the time when the image was captured by the first imaging unit 50.

[0070] The chip breaking step 1005 is a step that follows the tilt angle detection step 1004, in which the indenter 20 is moved toward the chip 100 supported on the pair of support bases 11, the indenter 20 presses against the chip 100 to break it, and the measurement value of the load measurement unit 40 is obtained when the chip 100 breaks. In the chip breaking step 1005, after the tilt angle detection step 1004 is performed, the moving unit 30 lowers the moving base 35, the indenter 20, the transparent container 39, etc., and the indenter 20 presses against the chip 100 supported on the pair of support bases 11, the load (force in the Z-axis direction) applied to the indenter 20 by the pressing of the chip 100 is measured by the load measurement unit 40, and the indenter 20 breaks the chip 100 while outputting the measurement result to the control unit 80 as appropriate.

[0071] More specifically, in the chip breaking step 1005, under the control of the control unit 80, the lower end 22 of the indenter 20 is brought into contact with the front surface 101 of the chip 100 supported on the pair of supports 11, and the lower end 22 of the indenter 20 presses the chip 100 supported on the pair of supports 11 from the front surface 101 side. The indenter 20 is then further lowered so that the lower end 22 of the indenter 20 further presses the chip 100, deforming the contact member 15 supporting the chip 100 and bending the chip 100. As a result, the back surface 102 side of the chip 100 comes into contact with the first support portion 13 and the second support portion 14 of the support unit 10, and the chip 100 is supported by the first support portion 13 and the second support portion 14, increasing the load on the indenter 20 pressing the chip 100. Note that at this time, depending on the flexibility of the contact member 15, only deformation of the contact member 15 may occur and bending of the chip 100 may not occur. In chip breaking step 1005, under the control of control unit 80, indenter 20 is further lowered, causing the pressing force applied from indenter 20 to chip 100 to exceed a predetermined value, thereby breaking chip 100. In chip breaking step 1005, a three-point bending test is thus performed using first support portion 13, second support portion 14 of chip 100 and lower end 22 of indenter 20, and the load during this three-point bending test is measured by load measurement unit 40 and the measurement result is output to control unit 80.

[0072] In chip destruction step 1005, when chip 100 is destroyed in this manner, the load measured by load measurement unit 40 changes from its maximum value to zero. Therefore, in chip destruction step 1005, control unit 80 can detect the timing at which chip 100 is destroyed from the change in the value of the load measured by load measurement unit 40. Also, in chip destruction step 1005, control unit 80 can acquire the maximum value of this load measured by load measurement unit 40 as the load at destruction at the timing at which chip 100 is destroyed.

[0073] In the chip destruction step 1005, when it is detected that the chip 100 has been destroyed, for example by detecting the timing at which the chip 100 has been destroyed, the indenter 20 is raised by the moving unit 30, and the operational processing of the chip destruction step 1005 is terminated.

[0074] After the chip destruction step 1005 is performed, the control unit 80 can calculate the strength (flexural strength, bending strength) of the destroyed chip 100 according to the above formula (1) based on the load at destruction, which is the measurement value of the load measurement unit 40 at the time (moment) when the chip 100 is destroyed, which can be obtained by measurement in the chip destruction step 1005, the predetermined distance 12 between the first support part 13 and the second support part 14 when the chip 100 is destroyed, the dimensions of the destroyed chip 100 (length 110, length 120 and thickness 130), and the inclination angle θ of the destroyed chip 100 with respect to the first direction 18.

[0075] The test apparatus 1 according to the first embodiment and the method for measuring chip strength according to the first embodiment having the above-described configuration place and support the chip 100 on the support unit 10, then capture an image of the chip 100 supported on the support unit 10 from above, and based on this image, detect and store the tilt angle θ of the chip 100 with respect to the first direction 18 in which the first support portion 13 and the second support portion 14 extend, before performing a destructive test to destroy the chip 100. Therefore, the test apparatus 1 according to the first embodiment and the method for measuring chip strength according to the first embodiment have the advantage that, when measuring the strength of the chip 100 by a destructive test of the chip 100, it is possible to determine, after the destructive test to destroy the chip 100, the orientation and tilt at which the chip 100 was placed with respect to the first direction 18 in which the first support portion 13 and the second support portion 14 extend.

[0076] In the test device 1 according to the first embodiment and the chip strength measuring method according to the first embodiment, in particular, a plurality of chips 100 are broken to perform a destructive test on the plurality of chips 100, and various data obtained by performing the destructive test on the plurality of chips 100, such as data on the dimensions (length 110, length 120, and thickness 130) of the chip 100, image data by the first imaging unit 50 and the second imaging unit 60, detection data on the tilt angle θ of the chip 100, data on the measurement results by the load measuring unit 40, data on the load at the time of breakage, and strength (transverse strength) of the chip 100 are recorded. In an operation in which calculated data of the strength (flexural strength, bending strength) of a chip 100 is accumulated and an operator reviews the accumulated data collectively after the destructive testing of a plurality of chips 100 is performed, the accumulated data can be sorted based on the tilt angle θ of the chip 100, for example, whether the tilt angle θ of the chip 100 exceeds a predetermined threshold, thereby making it possible to suitably separate and handle the calculated data of the strength (flexural strength, bending strength) of the chip 100 that is not adopted and discarded from the calculated data of the strength (flexural strength, bending strength) of the chip 100 that is adopted. Furthermore, in the test apparatus 1 according to embodiment 1 and the chip strength measurement method according to embodiment 1, when such an operation is performed, the accumulated data can be sorted based on the tilt angle θ of the chip 100, for example, whether the tilt angle θ of the chip 100 exceeds a predetermined threshold, thereby making it possible to suitably separate and handle the data that is used to investigate in more detail whether or not there is a malfunction or the like in the operation process of the test apparatus 1 or the destructive testing, and the data that is not used to investigate in such detail whether or not there is a malfunction or the like in the operation process of the test apparatus 1 or the destructive testing. Furthermore, in the test device 1 according to embodiment 1 and the chip strength measurement method according to embodiment 1, when operating in this manner, the judgment unit 82 may automatically determine whether the tilt angle θ of the chip 100 exceeds a predetermined threshold value based on the tilt angle θ of the chip 100, and then perform the classification.

[0077] Furthermore, in the test apparatus 1 according to embodiment 1 and the method for measuring strength of a tip according to embodiment 1, the lengths in the first direction 18 of the first support portion 13 and the second support portion 14 are longer than the lengths of the sides of the tip 100 along the first direction 18, and the first support portion 13 and the second support portion 14 are exposed from the tip 100 in a planar view. Therefore, the test apparatus 1 according to embodiment 1 and the method for measuring strength of a tip according to embodiment 1 can reduce the risk that the ends of the first support portion 13, the second support portion 14, and the lower end 22 of the indenter 20 in the first direction 18 will come into contact with the tip 100 when the tip 100 is broken, and therefore a three-point bending test can be more accurately performed on the tip 100 at the first support portion 13, the second support portion 14, and the lower end 22 of the indenter 20. Furthermore, in the test device 1 according to embodiment 1 and the chip strength measurement method according to embodiment 1, the first support portion 13 and the second support portion 14 are both exposed from the chip 100, which exposes the reference line for calculating the tilt angle θ, making it easier to calculate the tilt angle θ and enabling the tilt angle θ to be calculated more accurately.

[0078] [Embodiment 2] A test device 1 according to a second embodiment of the present invention and a method for measuring chip strength according to the second embodiment will be described with reference to the drawings. Fig. 9 is a flowchart showing the processing steps of the method for measuring chip strength according to the second embodiment. In Fig. 9, the same parts as those in the first embodiment are assigned the same reference numerals and their description will be omitted.

[0079] The test apparatus 1 according to the second embodiment has the same configuration as that of the first embodiment. The test apparatus 1 according to the second embodiment differs from the first embodiment in the operational processing in that the notification unit 70 and the determination unit 82 are operated when the method for measuring chip strength according to the second embodiment is performed. As shown in FIG. 9 , the method for measuring chip strength according to the second embodiment includes a preparation step 1001, a support step 1002, an imaging step 1003, a tilt angle detection step 1004, a determination step 1006, and a notification step 1007. That is, the method for measuring chip strength according to the second embodiment performs the same preparation step 1001, support step 1002, imaging step 1003, and tilt angle detection step 1004 as in the first embodiment, and is modified by adding a new determination step 1006 and notification step 1007.

[0080] The determining step 1006 is a step for determining that the tilt angle θ of the chip 100 is defective when the tilt angle θ of the chip 100 detected after the tilt angle detecting step 1004 exceeds a predetermined threshold value.

[0081] In the determination step 1006, the determination unit 82 first determines whether the tilt angle θ of the chip 100 stored in the storage unit 81 exceeds a predetermined threshold. Next, in the determination step 1006, if the determination unit 82 determines that the tilt angle θ of the chip 100 stored in the storage unit 81 does not exceed the predetermined threshold, such as the tilt angle θ1 shown in FIG. 6, i.e., is equal to or less than the predetermined threshold, the determination unit 82 determines that the tilt angle θ of the chip 100 is not defective (NO in the determination step 1006), and terminates the operational processing of the chip strength measurement method according to the second embodiment. On the other hand, in the determination step 1006, if the determination unit 82 determines that the tilt angle θ of the chip 100 stored in the storage unit 81 exceeds the predetermined threshold, such as the tilt angle θ2 shown in FIG. 7, the determination unit 82 determines that the tilt angle θ of the chip 100 is defective (YES in the determination step 1006), and the operational processing of the chip strength measurement method according to the second embodiment proceeds to the notification step 1007.

[0082] Informing step 1007 is a step in which, when a determination is made in determination step 1006 that the inclination angle θ of chip 100 is defective (YES in determination step 1006), the control unit 80 notifies the notification unit 70 that the inclination angle θ of chip 100 is defective by outputting command information to the notification unit 70 to notify that the inclination angle θ of chip 100 is defective, thereby causing the notification unit 70 to notify that the inclination angle θ of chip 100 is defective.

[0083] The test apparatus 1 of embodiment 2 having the above-described configuration and the chip strength measurement method of embodiment 2 place and support the chip 100 on the support unit 10, then capture an image of the chip 100 supported on the support unit 10 from above, and based on this image, detect and store the tilt angle θ of the chip 100 relative to the first direction 18 in which the first support portion 13 and the second support portion 14 extend, and then determine whether the tilt angle θ of the chip 100 exceeds a predetermined threshold value, and if the tilt angle θ of the chip 100 exceeds the predetermined threshold value, report that the tilt angle θ of the chip 100 is defective. Therefore, the test apparatus 1 of embodiment 2 and the chip strength measurement method of embodiment 2 notify the operator in a recognizable manner whether the inclination angle θ of the chip 100 does not exceed a predetermined threshold value during the operation process of placing and supporting the chip 100 on the support unit 10, thereby enabling the operator to recognize the accuracy of the operation process of placing and supporting the chip 100 on the support unit 10.Therefore, for example, it is possible to select a decision to perform the chip destruction step 1005 similar to embodiment 1 only if the inclination angle θ of the chip 100 does not exceed a predetermined threshold value, or to select a decision to interrupt the destruction test of the chip 100 if the inclination angle θ of the chip 100 exceeds the predetermined threshold value when placed.

[0084] The present invention is not limited to the above-described embodiment, and can be implemented in various modifications without departing from the gist of the present invention. [Explanation of symbols]

[0085] 1 Test equipment 10 Support Unit 12 intervals 13 First support part 14 Second support part 18 First direction 20 indenter 30 Mobile Units 40 Load measurement unit 50 First Imaging Unit 70 Alarm unit 80 Control Unit 81 Storage section 82 Judgment section 100 chips 102 Back side 201,202 images 1001 Preparation Steps 1002 Support Step 1003 Imaging Steps 1004 tilt angle detection steps 1005 Chip destruction step 1006 Judgment step 1007 Notification step θ,θ1,θ2 tilt angles

Claims

1. A method for measuring the strength of a flat, rectangular chip, comprising: a preparation step of preparing a testing device including: a support unit having a first support portion and a second support portion extending parallel to each other with a gap therebetween and supporting the underside of the chip; an indenter disposed above the support unit and between the first support portion and the second support portion, and extending in a first direction that is the direction in which the first support portion and the second support portion extend; a movement unit that moves the indenter relatively closer to the chip supported by the support unit; and a load measurement unit that measures the load with which the indenter presses the chip supported by the support unit; a supporting step of placing and supporting the chip on the supporting unit after the preparing step; an imaging step of imaging the chip supported in the supporting step with an imaging unit; a tilt angle detection step of detecting and storing a tilt angle of the chip with respect to the first direction based on the image captured in the imaging step; a tip breaking step of, after the tilt angle detection step, moving the indenter toward the tip, pressing the tip with the indenter to break it, and obtaining a measurement value of the load measuring unit when the tip breaks; A method for measuring the strength of a chip comprising:

2. a determining step of determining that the tilt angle of the chip is defective when the tilt angle of the chip detected after the tilt angle detecting step exceeds a predetermined threshold value; a notification step of notifying the fact that the product is defective by a notification unit when the product is determined to be defective in the determination step; 2. The method for measuring the strength of a tip according to claim 1, further comprising:

3. A method for measuring the strength of a chip as described in claim 1 or claim 2, characterized in that the length of the first support portion and the second support portion in the first direction is longer than the length of the side of the chip along the first direction, and the first support portion and the second support portion are exposed from the chip in a planar view.

4. A test device for measuring the strength of a flat, rectangular chip, a support unit having a first support portion and a second support portion extending parallel to each other with a gap therebetween and supporting a lower surface of the chip; an indenter that is disposed above the support unit and between the first support portion and the second support portion, and that extends in a first direction, which is a direction in which the first support portion and the second support portion extend; a moving unit that moves the indenter relatively close to the tip supported by the supporting unit; a load measuring unit that measures the load that the indenter presses against the tip supported by the support unit; an imaging unit that images the chip supported by the support unit; a control unit that controls at least the moving unit, the load measuring unit, and the imaging unit; Equipped with The control unit includes a memory section that detects and stores the tilt angle of the chip with respect to the first direction based on the image captured by the imaging unit.

5. Further provided is an alarm unit for notifying an operator, the control unit has a determination unit that determines that the tilt angle of the chip is defective when the tilt angle of the chip stored in the storage unit exceeds a predetermined threshold value; 5. The test apparatus according to claim 4, wherein when the determining section determines that the test piece is defective, the notifying unit notifies the fact that the test piece is defective.

6. A test device as described in claim 4 or claim 5, characterized in that the length of the first support portion and the second support portion in the first direction is longer than the length of the side of the chip along the first direction, and the first support portion and the second support portion are exposed from the chip in a planar view.

Images