Semiconductor device manufacturing device and semiconductor device manufacturing method, and semiconductor device verification method

Abstract

To provide a semiconductor device manufacturing device and a semiconductor device manufacturing method, and a semiconductor device verification method with which a semiconductor device can be verified with a new verification technique.SOLUTION: A semiconductor device manufacturing device comprises: pasting means 10 that pastes a coating material AS containing filler FL to a semiconductor body WF to form a semiconductor device SD; and first image forming means 30 that picks up an image of the coating material AS on the semiconductor device SD to form a first image PT1. The first image forming means 30 comprises: a first image forming machine 31 that captures unique characteristics appearing in the coating material AS due to the filler FL contained in the coating material AS to form the first image PT1; and an image outputting machine 32 that outputs the first image PT1 to a verification device 50 that verifies the semiconductor device SD.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a semiconductor device manufacturing apparatus, a semiconductor device manufacturing method, and a semiconductor device verification method. [Background technology]

[0002] BACKGROUND ART A method for manufacturing a semiconductor device is known (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-242973 Summary of the Invention [Problem to be solved by the invention]

[0004] For a semiconductor device 100 (semiconductor device) manufactured by the manufacturing method described in Patent Document 1, a verification technique is disclosed in which the mottled pattern of the sealing resin 120 is imaged to verify the semiconductor device, but in recent years this level of verification technique has become outdated, and new verification techniques are required.

[0005] An object of the present invention is to provide a semiconductor device manufacturing apparatus, a semiconductor device manufacturing method, and a semiconductor device verification method that are capable of verifying a semiconductor device using a new verification technique. [Means for solving the problem]

[0006] The present invention employs the configurations described in the claims. [Effects of the Invention]

[0007] According to the present invention, a first image is formed by capturing the unique characteristics that appear in the coating material due to the filler contained in the coating material, and the first image is output to a verification device that verifies the semiconductor device, thereby enabling verification of the semiconductor device using a new verification technology. Furthermore, according to the present invention, the unique characteristics that appear in the coating material due to the filler contained in the coating material are captured to form a first image and a second image, and the unique characteristics in the first image are compared with the unique characteristics in the second image to verify the semiconductor device, thereby enabling verification of the semiconductor device using a new verification technology. [Brief explanation of the drawings]

[0008] [Figure 1] 1A to 1F are explanatory views of a semiconductor device manufacturing apparatus according to an embodiment of the present invention and an explanatory view of the operation of the apparatus, and FIG. 1G is an explanatory view of a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In this embodiment, the X-axis, Y-axis, and Z-axis are orthogonal to each other, and the X-axis and Y-axis are axes within a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. Furthermore, in this embodiment, the view from the front in Fig. 1(A) parallel to the Y-axis is used as the reference, and when directions are indicated without specifying the figure, "up" is the direction of the Z-axis arrow, "down" is the opposite direction, "left" is the direction of the X-axis arrow, "right" is the opposite direction, "front" is the direction toward the front in Fig. 1(A) parallel to the Y-axis, and "rear" is the opposite direction.

[0010] The semiconductor device manufacturing apparatus (hereinafter also simply referred to as "manufacturing apparatus") EA of the present invention comprises an attachment means 10 that performs an attachment process in which an adhesive sheet AS as a coating material containing a filler FL (see Figure 1(B)) such as silica or titanium oxide is attached to a semiconductor wafer (hereinafter also simply referred to as "wafer") WF as a semiconductor body to form a semiconductor device SD (see Figure 1(F)), an energy application means 20 that performs an energy application process in which heat HA as a predetermined energy is applied to the adhesive sheet AS, and a first image formation means 30 that performs a first image formation process in which the adhesive sheet AS on the semiconductor device SD is imaged to form a first image PT1 (see Figure 1(C)), and is located near a moving means 40 that performs a moving process in which the wafer WF is transported. The adhesive sheet AS of this embodiment contains a filler FL, such as an epoxy-based material, an acrylic-based material, or an amine-based material, as a binder, and further hardens as a change specific to the thermal HA when subjected to thermal HA. The filler FL used in this embodiment has a maximum width of 10 nm (nanometers) to 1 μm (micrometer), and is blended in an amount of 0.01% to 1% by weight of the total weight of the adhesive sheet AS.

[0011] The bonding means 10 includes a base plate 11 that directly or indirectly supports the components that make up the sheet bonding means 10, a support roller 12 that supports the raw roll RS on which the adhesive sheet AS has been temporarily attached to a strip-shaped release sheet RL, a guide roller 13 that guides the raw roll RS, a release plate 14 that serves as a peeling means that folds the release sheet RL at the peeling edge 14A and peels the adhesive sheet AS from the release sheet RL, a pressure roller 15 that serves as a pressing means that presses the adhesive sheet AS onto the wafer WF to bond it, a drive roller 16 that is supported by an output shaft (not shown) of a rotary motor 16A that serves as a drive device and that pinches the release sheet RL between itself and a pinch roller 16B, and a recovery roller 17 that serves as a recovery means that is supported by an output shaft (not shown) of the drive device and that constantly applies a predetermined tension to the release sheet RL that is between itself and the pinch roller 16B while the semiconductor device manufacturing equipment EA is operating automatically, and recovers the release sheet RL.

[0012] The energy applying means 20 includes a hot air blower 21 as an energy applying device capable of applying heat HA.

[0013] The first image forming means 30 includes a first camera 31 as a first image forming device that performs a first image forming step of capturing the unique features that appear in the adhesive sheet AS due to the filler FL contained in the adhesive sheet AS and forming a first image PT1, and an image output device 32 that performs an image output step of outputting the first image PT1 to a verification device 50 that verifies the semiconductor device SD. The first camera 31 takes an image of the adhesive sheet AS in the semiconductor device SD at a magnification of 10,000 times, and thereby captures, for example, as shown in Figures 1(B) and (C), how the binder is raised by the filler FL, how the filler FL is embedded in the binder, and how the filler FL is exposed from the binder, thereby capturing the unique characteristics that appear in the adhesive sheet AS due to the filler FL and forming a first image PT1.

[0014] The moving means 40 includes a linear motor 41 as a driving device, and a support table 42 supported by a slider 41A of the linear motor 41 and having a support surface 42A that can be adsorbed and held by a pressure reduction means (holding means) such as a pressure reduction pump or a vacuum ejector (not shown).

[0015] The verification device 50 includes a second camera 51 as a second image forming device that takes an image of the adhesive sheet AS, captures the unique features that appear in the adhesive sheet AS due to the filler FL contained in the adhesive sheet AS, and forms a second image PT2 (see Figures 1(D) and (E)), and a verification device 52 that inputs the first image PT1 output by the image output device 32 and compares the first image PT1 with the second image PT2 to verify the semiconductor device SD, and is provided in a next process execution device TA such as a cutting device that performs the next process of cutting the semiconductor device SD to a predetermined size, for example. The second camera 51 takes an image of the adhesive sheet AS in the semiconductor device SD at a magnification of 10,000 times, and captures, for example, images of the binder being raised by the filler FL, the filler FL being embedded in the binder, and the filler FL emerging from the binder, as shown in Figures 1(D) and (E), thereby capturing the unique features that appear in the adhesive sheet AS due to the filler FL and forming a second image PT2. The verification device 52 is an image processing device that performs pattern matching, measurement, and analysis between the first image PT1 and the second image PT2, and verifies the semiconductor device SD by comparing the unique features in the first image PT1 with the unique features in the second image PT2. The second camera 51 of this embodiment is configured to be the same type as the first camera 31.

[0016] The operation of the manufacturing equipment EA will now be described. First, a user of the manufacturing equipment EA (hereinafter simply referred to as the "user") sets the web RS on the manufacturing equipment EA, with each component positioned in the initial position indicated by the solid lines in FIG. 1(A), and then inputs a signal to start automatic operation via an operation means (not shown), such as an operation panel or a personal computer. Then, the bonding means 10 drives the rotation motor 16A to pay out the web RS. As shown in FIG. 1(A), when the leading edge of the leading adhesive sheet AS in the payout direction is peeled off a predetermined length from the release sheet RL at the folded portion of the release sheet RL folded back by the peeling edge 14A of the peeling plate 14, the rotation motor 16A is stopped. Next, the user or a transport means (not shown), such as an articulated robot or a belt conveyor, places the wafer WF on the support table 42, as shown in FIG. 1(A). The moving means 40 then drives the pressure-reducing means (not shown), which starts suction and holding the wafer WF on the support surface 42A.

[0017] Thereafter, the moving means 40 drives the linear motor 41 to move the wafer WF supported by the support table 42 to the right, and when the wafer WF reaches a predetermined position relative to the bonding means 10, the bonding means 10 drives the rotating motor 16A to pay out the raw web RS in accordance with the movement speed of the wafer WF. As a result, the adhesive sheet AS is peeled off from the release sheet RL at the folded portion of the release sheet RL and is bonded to the wafer WF by the pressure roller 15, as shown by the two-dot chain line in Figure 1(A), to form a semiconductor device SD. Next, the entire leading adhesive sheet AS is bonded to the wafer WF to form the semiconductor device SD, and when the leading end of the next adhesive sheet AS in the payout direction following the leading adhesive sheet AS is peeled off from the release sheet RL at the folded portion of the release sheet RL by a predetermined length, the bonding means 10 stops driving the rotating motor 16A.

[0018] When the semiconductor device SD being transported by the moving means 40 reaches just before the hot air blowing area of ​​the energy applying means 20, the energy applying means 20 drives the hot air blower 21 to emit heat HA. Next, as shown by the two-dot chain line in Figure 1(A), as the semiconductor device SD passes through the hot air blowing area, the adhesive sheet AS hardens, and when the entire adhesive sheet AS passes through the hot air blowing area, the energy applying means 20 stops driving the hot air blower 21. Thereafter, when the semiconductor device SD being transported by the moving means 40 reaches an imaging position RP, which is a predetermined position for the first image forming means 30, the first image forming means 30 drives the first camera 31 to capture an image of the adhesive sheet AS to form a first image PT1, and then drives the image output device 32 to output the first image PT1 to the verification device 50.

[0019] Next, when the support table 42 reaches the right end of the linear motor 41, the moving means 40 stops driving the linear motor 41. Then, the moving means 40 stops driving the pressure reducing means (not shown) and releases the suction hold on the support surface 42A, and the user or the transport means (not shown) holds the semiconductor device SD and transports the semiconductor device SD to the next process execution device TA, after which the moving means 40 drives the linear motor 41 to return the support table 42 to its initial position, and the same operations as those described above are repeated thereafter.

[0020] In addition, in the next process execution device TA to which the semiconductor device SD is transported, before or after performing a specified processing on the semiconductor device SD, the verification device 50 drives the second camera 51 to capture an image of the adhesive sheet AS and form a second image PT2, and then drives the verification equipment 52 to perform verification by comparing the first image PT1 and the second image PT2. Here, if an image such as that shown in Figure 1(C) is formed as the first image PT1 and an image such as that shown in Figure 1(D) is formed as the second image PT2, verification by the verification device 52 will determine that there is no difference between the first image PT1 and the second image PT2, and the verification will be determined to have passed, and the normal process will be carried out by the next process execution device TA. On the other hand, if a semiconductor device SD manufactured by a device other than the manufacturing device EA is mixed into the next-process performing device TA due to some mistake, fraud, intentional trick, or the like, an image such as that shown in Fig. 1(E) is formed as the second image PT2. In such a case, the verification by the verification device 52 determines that there is a difference between the first image PT1 and the second image PT2, and determines that the verification has failed, the normal process by the next-process performing device TA is canceled, and the semiconductor device SD on which the image of Fig. 1(E) has been formed is removed from the next-process performing device TA.

[0021] According to the above-described embodiment, the filler FL contained in the adhesive sheet AS captures the unique characteristics that appear in the adhesive sheet AS to form a first image PT1, and the first image PT1 is output to a verification device 50 that verifies the semiconductor device SD, so that the semiconductor device SD can be verified using a new verification technology. Furthermore, according to the present invention, the unique features that appear in the adhesive sheet AS due to the filler FL contained in the adhesive sheet AS are captured to form a first image PT1 and a second image PT2, and the unique features in the first image PT1 are compared with the unique features in the second image PT2 to verify the semiconductor device SD, so that the semiconductor device SD can be verified using a new verification technology.

[0022] The means and steps of the present invention are not limited in any way as long as they can perform the operations, functions, or steps described for those means and steps, and are in no way limited to the components and steps of a single embodiment shown in the above embodiment. For example, the attachment means may be any means capable of attaching a coating material containing a filler to a semiconductor body to form a semiconductor device, and is not limited in any way as long as it is within the scope of the common general technical knowledge at the time of filing (the same applies to other means and steps).

[0023] The bonding means 10 may employ a semiconductor chip (hereinafter also simply referred to as "chip") CP (see FIG. 1(G)) as the semiconductor body, or may employ a strip-shaped adhesive sheet base material temporarily attached to a strip-shaped release sheet RL, with a closed-loop slit or a slit spanning the entire short width direction formed in the base material, with the adhesive sheet AS defined in a predetermined area defined by the slit, from which the adhesive sheet AS is peeled and bonded, or may employ a strip-shaped adhesive sheet base material having a strip-shaped adhesive sheet base material temporarily attached to a strip-shaped release sheet RL, and while the strip-shaped adhesive sheet base material is being unwound, a cutting blade as cutting means is used to form a closed-loop slit or a slit spanning the entire short width direction in the adhesive sheet base material, with the adhesive sheet base material being unwound, and the adhesive sheet AS is peeled and bonded from the base material RS having the adhesive sheet AS defined in a predetermined area defined by the slit, or may employ a strip-shaped adhesive sheet base material having a strip-shaped adhesive sheet base material temporarily attached to a strip-shaped release sheet RL, and while the strip-shaped adhesive sheet base material is being unwound, a cutting blade as cutting means is used, and the adhesive sheet AS is peeled and bonded from the base material RS having the strip-shaped adhesive sheet AS temporarily attached to a strip-shaped release sheet RL, or may employ a strip-shaped adhesive sheet base material having a strip-shaped adhesive sheet base material temporarily attached to a strip-shaped release sheet RL, with the adhesive sheet base material being unwound, with the adhesive sheet AS defined in a predetermined area defined by the slit, The application tension may be controlled so that a predetermined tension is applied to the adhesive sheet AS or so that no tension is applied; the adhesive sheet AS may be peeled off from, for example, a fan-folded original roll RS and applied without being rolled up; a pressing means may be employed in which the adhesive sheet AS is held by a holding member that is supported by the output shaft of a linear motor as a driving device and is capable of being adsorbed and held by a pressure reducing means (not shown) such as a pressure reducing pump or vacuum ejector, and the adhesive sheet AS held by the holding member is pressed against the semiconductor body to be applied; a recovery means may be employed in which the release sheet RL is recovered without being rolled up, for example, by fan-folding it, by shredding it with a shredder or by piling it up randomly, or no recovery means may be employed; the adhesive sheet AS may be applied to the semiconductor body by moving the base plate 11 without moving the semiconductor body or while moving it; or an adhesive sheet AS that is not temporarily attached to a release sheet RL may be employed. The attachment means 10 may attach the coating material to the surface of the semiconductor body on which the circuit is formed, or to the surface opposite to the surface on which the circuit is formed, or to both the surface on which the circuit is formed and the surface opposite to the surface on which the circuit is formed, or may attach the coating material to the entirety of one surface of the semiconductor body as shown in Figure 1(G), or to part of one surface of the semiconductor body as shown in Figure 1(F), or may attach the coating material to all or part of all surfaces of the semiconductor body.

[0024] The energy applying means 20 may be provided at a location other than that shown in the above embodiment, and may be provided at any location as long as it is capable of applying a predetermined energy to the coating material. The predetermined energy may be applied to the coating material without the moving means 40 stopping the movement of the support table 42, or the predetermined energy may be applied to the coating material after the moving means 40 stops the movement of the support table 42, or the predetermined energy may be applied to the coating material by moving the energy applying device while the moving means 40 is moving the support table 42 or with the movement of the support table 42 stopped. Alternatively, a predetermined energy may be applied to the entire coating material or to a part of the coating material, and the predetermined energy may be any energy that is applied, such as electromagnetic waves such as ultraviolet rays, infrared rays, visible light, sound waves, X-rays or gamma rays, a heating medium such as hot water or hot air, or a cooling medium such as cold water or cold air.Any energy that can cause a change specific to that energy in the coating material taking into account the characteristics, properties, properties, material, composition and configuration of the coating material may be applied, and may or may not be included in the manufacturing apparatus EA of the present invention.

[0025] The first image forming means 30 may image the covering material without the moving means 40 stopping the movement of the support table 42, or may image the covering material after the moving means 40 stops the movement of the support table 42, or may be configured with the first camera 31 and the image output device 32 integrated together, or may be configured with the image output device 32 incorporated into the first camera 31, or may be configured with the first camera 31 incorporated into the image output device 32, or may be configured with the first camera 31 and the image output device 32 as separate entities, or one function of the first camera 31 may be the image output device 32. The first image forming device may be the same type as the second image forming device, or may be a different type.

[0026] The first image forming means 30 or the second image forming device may image the entire coating material to form the first image PT1 or the second image PT2, or may image a portion of the coating material to form the first image PT1 or the second image PT2.When imaging a portion of the coating material, the first image PT1 or the second image PT2 may be formed by imaging, for example, a predetermined area determined by coordinates in two orthogonal axes directions with a V-notch or orientation flat formed on the wafer WF as the reference position, a predetermined area determined by coordinates in two orthogonal axes directions with a corner or center of the chip CP as the reference position, the internal area of ​​a predetermined mark formed on the coating material, or the internal area of ​​a predetermined colored portion formed on the coating material. The first image forming device or the second image forming device may be any type, such as a microscope camera, CCD camera, infrared camera, ultraviolet camera, ultrasonic camera, X-ray camera, optical sensor, ultrasonic sensor, area sensor, line sensor, etc., and the coating material may be imaged at a magnification of 10,000 times or more, or at a magnification of 10,000 times or less. Depending on the size of the filler FL, the coating material may be imaged without magnification or at a reduced magnification. As long as the unique characteristics that appear in the coating material due to the filler FL contained in the coating material can be captured and the first image PT1 or the second image PT2 can be formed, the coating material may be imaged at any magnification, and the magnification at which the first image forming device images the coating material and the magnification at which the second image forming device images the coating material may be the same or different.

[0027] The moving means 40 may employ a support table 42 that cannot be held by suction on the support surface 42A, and may or may not be provided in the manufacturing apparatus EA of the present invention.

[0028] The verification device 50 may be provided in the manufacturing equipment EA of the present invention, or may be provided outside the manufacturing equipment EA in the same building, on the same premises, or in a different building where the manufacturing equipment EA is located, or may be provided in the building or premises to which the semiconductor device SD is shipped, and may or may not be provided in the manufacturing equipment EA of the present invention. The second image forming device may have the same configuration as the first image forming device, a different configuration, the same functions, or different functions, or may be a combination of the second camera 51 and the verification device 52, or may be a combination of the second camera 51 with the verification device 52 built in, or may be a combination of the second camera 51 with the verification device 52 built in, or may be a combination of the second camera 51 and the verification device 52 built in, or may be a combination of the second camera 51 and the verification device 52 built in, or may be a combination of the second camera 51 and the verification device 52 built in, or one function of the second camera 51 may be the verification device 52. When comparing the first image PT1 and the second image PT2, the verification device 52 may perform any comparison, such as the position of one or more fillers FL, the spacing between the multiple fillers FL, or the pattern formed by the multiple fillers FL, and may determine that the verification has passed when the entire first image PT1 and the entire second image PT2 match, or when a part of the first image PT1 and a part of the second image PT2 match, or when the entire first image PT1 and a part of the second image PT2 match, or when the entire first image PT1 and a part of the second image PT2 match, or when the first image PT Verification may be deemed successful if a portion of image PT1 matches all of the second image PT2, or if verification is unsuccessful if all of the first image PT1 does not match all of the second image PT2, or if verification is unsuccessful if part of the first image PT1 does not match part of the second image PT2, or if all of the first image PT1 does not match part of the second image PT2, or if verification is unsuccessful if part of the first image PT1 does not match all of the second image PT2. The verification device 52 may be any device, such as an image processing system or an appearance inspection device. The next process execution device equipped with the verification device 50 may be any device, such as a cleaning device, an etching device, a dipping device, a cutting device, an oxide film forming device, a nitriding device, a grinding device, a sandblasting device, a polishing device, a painting device, a laminating device, a sheet bonding device, a surface treatment device, a drilling device, a bending device, an inspection device, a verification device, an irradiation device, a plating device, etc.

[0029] The manufacturing apparatus EA may employ a laser printer, inkjet printer, letterpress printer, intaglio printer, lithographic printer, silk printer, screen printer, thermal printer, thermal transfer printer, dot impact printer, adhesive tape applicator, etc. as an imaging position forming means for forming a position on the covering material where the first image forming device and the second image forming device will take an image.

[0030] The covering material may be any material capable of covering the wafer WF or chip CP, such as an adhesive sheet, adhesive tape, adhesive tape, glue, pressure sensitive adhesive, resin material, rubber material, metal material, solder, wax, varnish, etc., as long as it contains the filler FL, and may be a solid substance, a liquid substance, or a gel substance. The change that the coating material undergoes in response to a given energy may be any change, such as hardening, softening, shrinking, expanding, vaporizing, liquefying, solidifying, discoloring, oxidation, penetration, settling, loss of adhesive strength, or increase in adhesive strength. The coating material may be larger, smaller, or the same size as the wafer WF, or larger, smaller, or the same size as the chip CP, and may not undergo changes specific to the specified energy when a specified energy is applied to it. The components and binders other than the filler FL in the coating material may contain any substance, such as epoxy-based materials, acrylic-based materials, silicone-based materials, rubber-based materials, amines, imidazole, polyvinyl acetal, etc., and may consist of one type of substance or multiple types of substances. The materials constituting the coating material other than the filler FL may be transparent, translucent, or non-transparent.

[0031] The filler FL may be any substance, such as silica, titanium oxide, alumina, talc, calcium carbonate, iron, stainless steel, nickel, cobalt, glass, stone, wood, ceramic, or steel; it may be composed of a single material, such as silica alone or alumina alone, or may be composed of multiple materials, such as titanium oxide and nickel, or talc, iron, and ceramic; it may be composed of particles of the same size or different sizes; it may be composed of particles of the same shape or different shapes; it may be composed of particles of the same color or different colors; it may be composed of particles of the same weight or different weights; and it may have any shape, such as a sphere, an ellipsoid, a cube, a rectangular parallelepiped, a cylinder, a cylindrical shape, a truncated cone, a pyramid, a cone, a ring shape, or any other shape. The size of the filler FL may be 10 nm or less in maximum width or 1 μm or more, and may be any size as long as the first image forming device and the second image forming device can capture the unique characteristics that appear in the coating material due to the filler FL contained in the coating material and form the first image PT1 or the second image PT2. The amount of filler FL to be blended may be a weight percentage of 0.01% or less relative to the weight of the entire coating material, or a weight percentage of 1% or more, or a volume percentage of 0.01% to 1% relative to the volume of the entire coating material, or a volume percentage of 0.01% or less relative to the volume of the entire coating material, or a volume percentage of 1% or more, or any percentage that constitutes the coating material.

[0032] The wafer WF and the chip CP may have an orientation flat or V-notch formed on their outer edges to indicate their orientation, or they may not have an orientation flat or V-notch formed on their outer edges, may have circuits formed on them, may not have circuits formed on them, may have circuits formed on only one side or only the other side, may have circuits formed on both one side and the other side, or may not have circuits formed on either one side or the other side. The semiconductor device SD having a covering material attached to the wafer WF may be cut, for example, from the state shown in FIG. 1(F) along a cut line CL to form the semiconductor device SD as shown in FIG. 1(G). The semiconductor device SD in which the covering material is attached to the chip CP does not have to be one obtained by cutting the wafer WF along the cut line CL. The first image PT1 and the second image PT2 shown in Figures 1(C), (D), and (E) are examples, and the first image PT1 and the second image PT2 are not limited to the images shown in Figures 1(C), (D), and (E).

[0033] The materials, types, shapes, etc. of the covering material, adhesive sheet AS, wafer WF, chips CP, and semiconductor device SD in the present invention are not particularly limited. For example, the covering material, adhesive sheet AS, wafer WF, chips CP, and semiconductor device SD may be circular, elliptical, polygonal such as triangular or rectangular, or other shapes, and the covering material and adhesive sheet AS may be pressure-sensitive, heat-sensitive, or other adhesive forms. When a heat-sensitive covering material or adhesive sheet AS is used, it may be bonded by an appropriate method, such as providing a heating means for heating the covering material or adhesive sheet AS, such as an appropriate coil heater or the heating side of a heat pipe. Furthermore, such covering materials and adhesive sheets AS may be of any type, such as a single layer consisting of only a covering material layer or adhesive layer, a two-layer structure consisting of a substrate and a covering material layer or a substrate and an adhesive layer, a three-layer structure or more layers consisting of one or more intermediate layers laminated between the substrate and the covering material layer or between the substrate and the adhesive layer, a three-layer structure or more layers consisting of one or more cover layers laminated on the top surface of the substrate, a structure in which the substrate, intermediate layer, or cover layer are releasably provided, a double-sided adhesive sheet consisting of only a covering material layer or adhesive layer, or a double-sided adhesive sheet in which a covering material layer or adhesive layer is laminated on both outermost surfaces of one or more intermediate layers. Furthermore, the semiconductor body may be any semiconductor, such as a silicon semiconductor wafer, a compound semiconductor wafer, a silicon semiconductor chip, or a compound semiconductor chip. The adhesive sheet AS may also be any sheet, film, tape, etc., such as an information label, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, or a recording layer-forming resin sheet.

[0034] The driving equipment in the above embodiments may be electric equipment such as rotary motors, linear motors, single-axis robots, so-called articulated robots with joints on two or three or more axes, actuators such as air cylinders, hydraulic cylinders, rodless cylinders and rotary cylinders, which may be used alone, or may be a direct or indirect combination of such electric equipment and actuators, or may be electric equipment, actuators, etc. that are capable of torque control, speed control, etc. for the output parts of such electric equipment, actuators, etc., or may not be capable of torque control, speed control, etc.

[0035] In the above embodiment, some object (hereinafter referred to as "object A") and an object (hereinafter referred to as "object B") that moves relative to object A, i.e., object A and object B that move relatively, object B may move relative to object A, which is not moving, object A may move relative to object B, which is not moving, or both object A and object B may move. As long as the result achieved by the movement is the same, either object A or object B may move. When a rotating member such as a roller is used, a driving device that rotates the rotating member may be provided. The surface of the rotating member or the rotating member itself may be made of a deformable member such as rubber or resin, or the surface of the rotating member or the rotating member itself may be made of a non-deformable member. Other members such as a rotating or non-rotating shaft or blade may be used instead of the roller. When a pressing means or pressing member such as a pressing roller or a pressing head that presses an object to be pressed is used, rollers, round rods, blade materials, brush-like members, or members that spray air or gas may be used instead of or in combination with the above-mentioned examples. The peeling means may be made of a deformable material such as rubber, resin, sponge, etc., or may be made of a non-deformable material such as metal or glass. When peeling means or peeling members such as peeling plates or peeling rollers are used to peel the material to be peeled, members such as plate-shaped members, round rods, rollers, etc. may be used instead of or in combination with the above examples. The peeling means may be made of a deformable material such as rubber or resin, or may be made of a non-deformable material. When supporting (holding) means or supporting (holding) members are used to support (hold) the supported member (held member), In this case, a configuration may be adopted in which the supported member is supported (held) by gripping means such as a chuck motor or chuck cylinder, Coulomb force, adhesive (adhesive sheet, adhesive tape), pressure sensitive adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli suction, suction, driving equipment, etc., or when a cutting means or cutting member that cuts the member to be cut or forms an incision or cutting line in the member to be cut is used, cutting means that cut by a cutter blade, laser cutter, ion beam, fire, heat, water pressure, an electric heating wire, spraying of gas or liquid, etc., may be used instead of or in combination with the above examples,It is also possible to move the cutting object by combining appropriate driving devices. [Explanation of symbols]

[0036] EA: Semiconductor device manufacturing equipment 10...Attachment means 30...first image forming means 31...First camera (first image forming device) 32...Image output device 50...Verification device 51...Second camera (second image forming device) 52...Verification equipment AS...Adhesive sheet (covering material) CP: Semiconductor chip (semiconductor body) FL...filler PT1...First image PT2...Second image SD: Semiconductor device WF: Semiconductor wafer (semiconductor body)

Claims

1. an application means for applying the filler-containing coating material to a semiconductor body to form a semiconductor device; a first image forming means for forming a first image by capturing an image of the coating material of the semiconductor device; a first image forming device that forms the first image by capturing the unique characteristics that appear in the coating material due to the filler contained in the coating material, and an image output device that outputs the first image to a verification device that verifies the semiconductor device.

2. 2. The semiconductor device manufacturing apparatus according to claim 1, wherein the verification device comprises: a second image forming device that images the coating material and captures unique characteristics that appear in the coating material due to the filler contained in the coating material to form a second image; and a verification device that inputs the first image output by the image output device and compares the first image with the second image to verify the semiconductor device.

3. 3. The semiconductor device manufacturing apparatus according to claim 2, wherein the second image forming device is of the same type as the first image forming device.

4. applying a coating material containing the filler to a semiconductor body to form a semiconductor device; a first image forming step of imaging the coating material on the semiconductor device to form a first image; A method for manufacturing a semiconductor device, characterized in that the first image forming step comprises: a first image forming step of forming the first image by capturing unique characteristics that appear in the coating material due to the filler contained in the coating material; and an image output step of outputting the first image to a verification device that verifies the semiconductor device.

5. a first image forming step of forming a first image by imaging a coating material containing a filler attached to a semiconductor body of a semiconductor device; a second image forming step of forming a second image by imaging the coating material on the semiconductor device again after the first image forming step; a verification step of verifying the semiconductor device by comparing the first image with the second image, In the first image forming step and the second image forming step, a first image and a second image are formed by capturing the specific characteristics that appear in the coating material due to the filler contained in the coating material; A semiconductor device verification method, characterized in that the verification step verifies the semiconductor device by comparing the unique features in the first image with the unique features in the second image.

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