Semiconductor processing apparatus and semiconductor device processing method, and semiconductor device collation method

Abstract

To provide a semiconductor device processing apparatus, a semiconductor device processing method, and a semiconductor device collation method that prevents as mush as possible the occurrence of defective collation in collation for a semiconductor device.SOLUTION: In a processing apparatus EA for a semiconductor device SD, reference image forming means 30 comprises: first image forming means 31 that picks up an image of the semiconductor device SD to form a first image PT1; second image forming means 32 that picks up an image of the semiconductor device SD to form a second image PT2; and pre-collation means 33 that checks whether the first image PT1 and the second image PT2 match each other through pre-collation before forming a reference image PT. The processing apparatus determines, as the reference image PT, at least one of the first image PT1 and the second image PT2 checked to match each other through pre-collation performed by the pre-collation means 33.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device and a processing method for a semiconductor device, and a verification method for a semiconductor device. [Background technology]

[0002] A semiconductor device processing method for verifying semiconductor devices is known (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-242973 Summary of the Invention [Problem to be solved by the invention]

[0004] In Patent Document 1, the mottled pattern of the sealing resin 120 that seals the semiconductor device 100 (semiconductor device) is photographed to form an image (reference image), and the formed reference image is registered in a database server (matching device).The authenticity of the semiconductor device is determined by comparing an image of the semiconductor device (matching image) photographed at the shipping destination of the semiconductor device with the reference image.However, if the reference image is unclear or the reference image contains reflected light from lighting or dust, etc., matching errors will occur during matching, resulting in problems such as a genuine semiconductor device being identified as a fake or the semiconductor device being incorrectly processed.

[0005] An object of the present invention is to provide a semiconductor device processing device, a semiconductor device processing method, and a semiconductor device verification method that can prevent verification failures as much as possible when verifying semiconductor devices. [Means for solving the problem]

[0006] The present invention employs the configurations described in the claims. [Effects of the Invention]

[0007] According to the present invention, before forming a reference image, a pre-matching is performed to check whether the first image and the second image match, and at least one of the first image and the second image that match is used as the reference image, thereby minimizing the occurrence of matching errors when matching semiconductor devices. [Brief explanation of the drawings]

[0008] [Figure 1] 1A to 1E are explanatory diagrams of a processing apparatus for semiconductor devices according to an embodiment of the present invention and an explanatory diagram of the operation of the apparatus, and FIGS. 1F to 1M are explanatory diagrams of modified examples. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In this embodiment, the X-axis, Y-axis, and Z-axis are orthogonal to each other, and the X-axis and Y-axis are axes within a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. Furthermore, in this embodiment, the view from the front in Fig. 1(A) parallel to the Y-axis is used as the reference, and when directions are indicated without specifying the figure, "up" is the direction of the Z-axis arrow, "down" is the opposite direction, "left" is the direction of the X-axis arrow, "right" is the opposite direction, "front" is the direction toward the front in Fig. 1(A) parallel to the Y-axis, and "rear" is the opposite direction.

[0010] The semiconductor device processing apparatus (hereinafter also simply referred to as the "processing apparatus") EA that implements the semiconductor device processing method of the present invention comprises: a pasting means 10 that performs a pasting process of forming a semiconductor device SD (see Figure 1(E)) by pasting an adhesive sheet AS as a covering material to a semiconductor wafer (hereinafter also simply referred to as the "wafer") WF as a semiconductor body; an energy application means 20 that performs an energy application process of applying heat HA as a predetermined energy to the adhesive sheet AS; a reference image forming means 30 that performs a reference image formation process of imaging the semiconductor device SD to form a reference image PT; a reference image output means 40 that outputs the reference image PT to a comparison device 80 that performs a comparison process of comparing the comparison image PTa output by a comparison image forming device 70 that images the semiconductor device SD to form a comparison image PTa with the reference image PT; and a removal means 50 that performs a removal process of removing the semiconductor device SD that was the subject of confirmation by the pre-comparison means when it is confirmed by the pre-comparison means 33 that there is no match, and is arranged near a moving means 60 that performs a moving process of moving the wafer WF. The adhesive sheet AS of this embodiment contains a binder such as an epoxy-based material, an acrylic-based material, or an amine-based material, and a filler FL such as silica or titanium oxide (see Figures 1(B) to (D)), and further hardens as a change specific to the thermal HA when thermal HA is applied. The filler FL used in this embodiment has a maximum width of 10 nm (nanometers) to 1 μm (micrometer), and is blended in an amount of 0.01% to 1% by weight of the total weight of the adhesive sheet AS.

[0011] The bonding means 10 comprises a base plate 11 that directly or indirectly supports the components that make up the sheet bonding means 10, a support roller 12 that supports the raw roll RS on which the adhesive sheet AS has been temporarily attached to a strip-shaped release sheet RL, a guide roller 13 that guides the raw roll RS, a release plate 14 as a peeling means that folds the release sheet RL at the peeling edge 14A and peels the adhesive sheet AS from the release sheet RL, a pressure roller 15 as a pressing means that presses the adhesive sheet AS onto the wafer WF to bond it, a drive roller 16 that is supported by an output shaft (not shown) of a rotary motor 16A as a drive device and that pinches the release sheet RL between itself and a pinch roller 16B, and a recovery roller 17 that is supported by an output shaft (not shown) of the drive device and that constantly applies a predetermined tension to the release sheet RL that is between itself and the pinch roller 16B while the semiconductor device processing device EA is operating automatically, and that recovers the release sheet RL.

[0012] The energy applying means 20 includes a hot air blower 21 as an energy applying device capable of applying heat HA.

[0013] The reference image forming means 30 includes a first image forming means 31 that performs a first image forming step of imaging the semiconductor device SD to form a first image PT1, a second image forming means 32 that performs a second image forming step of imaging the semiconductor device SD to form a second image PT2, and a pre-matching means 33 that performs a pre-matching step of confirming by pre-matching whether the first image PT1 and the second image PT2 match before forming the reference image PT, and the first image PT1 that is confirmed to match by pre-matching by the pre-matching means 33 is set as the reference image PT. The first image forming means 31 can be, for example, a microscope camera or a CCD camera, and by taking an image of the adhesive sheet AS in the semiconductor device SD at 10,000 times magnification, it captures the appearance of the filler FL, such as the binder being raised by the filler FL, the filler FL being embedded in the binder, or the filler FL exposing from the binder (see Figures 1(B) to (D)), as unique features appearing in the semiconductor device SD, and forms a first image PT1. The second image forming means 32 can be exemplified by one equivalent to the first image forming means 31, and by taking an image of the adhesive sheet AS in the semiconductor device SD at a magnification of 10,000 times, the appearance of the filler FL is captured as a unique feature appearing in the semiconductor device SD, and a second image PT2 is formed. The pre-comparison means 33 can be exemplified by an image processing device or a computer that performs pre-comparison by pattern matching, aligning, measuring, measuring, and analyzing the first image PT1 and the second image PT2, and when it confirms that the first image PT1 and the second image PT2 match, it outputs a match signal to the removal means 50 and the moving means 60 via a communication medium such as electricity, electromagnetic waves, or sound waves, while when it confirms that the first image PT1 and the second image PT2 do not match, it outputs a mismatch signal to the removal means 50 and the moving means 60 via the communication medium.

[0014] The reference image output means 40 includes a reference image output device 41 that outputs the first image PT1, which has been determined as the reference image PT by the pre-collation means 33, via a communication medium. The reference image output device 41 can be exemplified by a CCD (Charge Coupled Device) or a wireless video transmission device, and outputs the reference image PT to the collation device 80 via a communication medium.

[0015] The removal means 50 is composed of multiple arms and includes a so-called articulated robot 51 as a driving device that can displace what is supported by the tip arm 51A, which is the working part, to any position and any angle within its working range, a holding member 52 that is supported by the tip arm 51A and can be adsorbed and held by a pressure reduction means (holding means) not shown, such as a pressure reduction pump or vacuum ejector, and a recovery table 53 that recovers the semiconductor device SD.

[0016] The moving means 60 includes a linear motor 61 as a driving device, and a support table 62 supported by a slider 61A of the linear motor 61 and having a support surface 62A that can be adsorbed and held by a pressure reduction means (holding means) not shown, such as a pressure reduction pump or a vacuum ejector.

[0017] The collation image forming device 70 comprises a collation image forming means 71 which performs a collation image forming process of imaging the semiconductor device SD to form a collation image PTa, and a collation image output means 72 which performs a collation image output process of outputting the collation image PTa, and is disposed in a next process performing device TA such as a cutting device or plating device which performs predetermined processing on the semiconductor device SD transported from the processing device EA. The collation image forming means 71 can be exemplified by the same as the first image forming means 31 and the second image forming means 32, and by taking an image of the adhesive sheet AS in the semiconductor device SD at a magnification of 10,000 times, the appearance of the filler FL is captured as a unique feature appearing in the semiconductor device SD, and a collation image PTa is formed. The collation image output means 72 can be exemplified by an equivalent to the reference image output device 41, and outputs the collation image PTa to the collation device 80 via a communication medium.

[0018] The collation device 80 includes a collation means 81 that receives and stores the reference image PT output by the reference image output means 40 and compares the reference image PT with the collation image PTa output by the collation image output means 72. The comparison means 81 can be exemplified by one equivalent to the pre-comparison means 33, and when it confirms that the reference image PT and the comparison image PTa match, it outputs a match signal to the next process execution device TA via the communication medium, and when it confirms that the reference image PT and the comparison image PTa do not match, it outputs a mismatch signal to the next process execution device TA via the communication medium.

[0019] The operation of the processing device EA will now be described. First, a user of the processing device EA (hereinafter simply referred to as "user") places the raw web RS in the processing device EA, with each component positioned in the initial position indicated by the solid lines in Fig. 1(A), and then inputs a signal to start automatic operation via an operation means (not shown), such as an operation panel or a personal computer. Then, the bonding means 10 drives the rotation motor 16A to pay out the raw web RS. As shown in Fig. 1(A), when the leading edge of the leading adhesive sheet AS in the payout direction is peeled off a predetermined length from the release sheet RL at the folded portion of the release sheet RL folded back by the peeling edge 14A of the peeling plate 14, the rotation motor 16A is stopped. Next, the user or a transport means (not shown), such as an articulated robot or a belt conveyor, places the wafer WF on the support table 62, as shown in Fig. 1(A). The moving means 60 then drives the pressure-reducing means (not shown), which starts suction and holding the wafer WF on the support surface 62A.

[0020] Thereafter, the moving means 60 drives the linear motor 61 to move the wafer WF supported by the support table 62 to the right, and when the wafer WF reaches a predetermined position relative to the bonding means 10, the bonding means 10 drives the rotation motor 16A to pay out the raw web RS in accordance with the movement speed of the wafer WF. As a result, the adhesive sheet AS is peeled off from the release sheet RL at the folded portion of the release sheet RL and is bonded to the wafer WF by the pressure roller 15, as shown by the two-dot chain line in Figure 1(A), to form a semiconductor device SD. Next, the entire leading adhesive sheet AS is bonded to the wafer WF to form the semiconductor device SD, and when the leading end of the next adhesive sheet AS in the payout direction following the leading adhesive sheet AS is peeled off from the release sheet RL at the folded portion of the release sheet RL by a predetermined length, the bonding means 10 stops driving the rotation motor 16A.

[0021] Then, when the semiconductor device SD being transported by the moving means 60 reaches just before the hot air blowing area of ​​the energy applying means 20, the energy applying means 20 drives the hot air blower 21 to emit heat HA. Next, as shown by the two-dot chain line in Figure 1(A), when the semiconductor device SD passes through the hot air blowing area, the adhesive sheet AS hardens, and when the entire adhesive sheet AS has passed through the hot air blowing area, the energy applying means 20 stops driving the hot air blower 21.

[0022] Thereafter, when the semiconductor device SD transported by the moving means 60 reaches a first imaging position RP1, which is a predetermined position relative to the first image forming means 31, the reference image forming means 30 drives the first image forming means 31 to image the semiconductor device SD and form a first image PT1. Next, when the semiconductor device SD transported by the moving means 60 reaches a second imaging position RP2, which is a predetermined position relative to the second image forming means 32, the reference image forming means 30 drives the second image forming means 32 to image the semiconductor device SD and form a second image PT2. Then, the reference image forming means 30 drives the pre-verification means 33 to perform pre-verification to confirm whether the first image PT1 and the second image PT2 match.

[0023] For example, if the first image PT1 and the second image PT2 are both images as shown in FIG. 1C, the pre-collation performed by the pre-collation means 33 confirms that the first image PT1 and the second image PT2 match. The reference image forming means 30 then drives the pre-collation means 33, outputs a match signal to the removal means 50 and the moving means 60, and forms the first image PT1 as the reference image PT. The reference image output means 40 then drives the reference image output device 41 to output the reference image PT to the collation device 80, which then drives the image processing device 81 to input and store the reference image PT. When the support table 62 reaches the right end of the linear motor 61, the moving means 60 stops driving the linear motor 61, and then stops driving the pressure reducing means (not shown), releasing the support surface 62A from suction. Since the removing means 50 and the moving means 60 have received the coincidence signal, even if the semiconductor device SD reaches the holding position HP where it can be held by the removing means 50, the moving means 60 does not stop driving the linear motor 61, nor does the removing means 50 drive the articulated robot 51, etc. Next, when a user or transporting means (not shown) holds the semiconductor device SD and transports the semiconductor device SD to the next process performing device TA, the moving means 60 drives the linear motor 61 to return the support table 62 to its initial position, and the same operations as those described above are repeated thereafter.

[0024] On the other hand, if the reference image PT (first image PT1 in this embodiment) output to the verification device 80 is unclear, as shown in the upper part of FIG. 1(D), or if there is a reflection RF in the image, as shown in the lower part of the same figure, a verification failure will occur during verification by the verification device 80. Therefore, the processing device EA of the present invention performs the following operation. That is, if an image such as that shown in FIG. 1(D) is formed as the first image PT1 and an image such as that shown in FIG. 1(C) is formed as the second image PT2, the pre-verification by the pre-verification means 33 will confirm that the first image PT1 and the second image PT2 do not match. Then, the reference image forming means 30 drives the pre-verification means 33 and outputs a mismatch signal to the removal means 50 and the movement means 60. In this case, the reference image forming means 30 does not form a reference image PT, or even if it does form a reference image PT, the reference image output means 40 does not output the reference image PT. When the semiconductor device SD being transported by the moving means 60 reaches the holding position HP, the removing means 50 and the moving means 60, which have received the mismatch signal, perform the following removal operation. In this removal operation, when the semiconductor device SD reaches the holding position HP, the moving means 60 stops driving the linear motor 61, then stops driving the pressure reducing means (not shown), and releases the suction and holding of the semiconductor device SD on the support surface 62A. Next, the removing means 50 drives the articulated robot 51 and the pressure reducing means (not shown), suction-holds the semiconductor device SD with the holding member 52, and places the suction-held semiconductor device SD on the recovery stage 53, as shown by the two-dot chain line in FIG. 1(A). Thereafter, the removing means 50 stops driving the pressure reducing means (not shown), releases the suction and holding of the semiconductor device SD with the holding member 52, then drives the articulated robot 51 to return the holding member 52 to its initial position, and the moving means 60 drives the linear motor 61 to return the support table 62 to its initial position, and the same operations as those described above are repeated thereafter. The semiconductor device SD transferred onto the recovery stage 53 is transferred by a user or a transfer means (not shown) to a recovery device or the like that performs a recovery step for recovering the semiconductor device SD.

[0025] In the next-process execution device TA to which the semiconductor device SD has been transported as described above, before the semiconductor device SD is subjected to predetermined processing, the collation image forming device 70 drives the collation image forming means 71 to capture an image of the semiconductor device SD to form a collation image PTa, and then drives the collation image output means 72 to output the collation image PTa to the collation device 80. Next, the collation device 80 drives the collation means 81 to input the collation image PTa and compare it with a stored reference image PT, thereby determining, for example, the authenticity of the semiconductor device SD or determining the content of predetermined processing to be performed on the semiconductor device SD. In this case, for example, if the collation image PTa is an image such as that shown in FIG. 1(C), the collation means 81 confirms that the reference image PT (first image PT1) and the collation image PTa match, and the semiconductor device SD for which the collation image PTa was captured is recognized as genuine, and outputs a match signal to the next-process execution device TA. On the other hand, if the collation image PTa is an image (not shown) different from that in Figure 1(C), the collation by the collation means 81 confirms that the reference image PT (first image PT1) and the collation image PTa do not match, the semiconductor device SD that was the subject of the image capture of the collation image PTa is determined to be a fake, and a mismatch signal is output to the next process performing device TA. Here, the next process performing device TA can perform a predetermined processing only on the semiconductor device SD to which the match signal has been input, while not performing the predetermined processing on the semiconductor device SD to which the mismatch signal has been input, or can remove the semiconductor device SD to which the mismatch signal has been input from the next process performing device TA.

[0026] According to the above-described embodiment, before forming the reference image PT, a pre-matching is performed to check whether the first image PT1 and the second image PT2 match, and the first image PT1 that is confirmed to match is used as the reference image PT, thereby minimizing the occurrence of matching errors when matching the semiconductor device SD.

[0027] The means and steps of the present invention are not limited in any way as long as they can perform the operations, functions, or steps described for those means and steps, and are in no way limited to the components and steps of a single embodiment shown in the above embodiment. For example, the reference image output means may be anything that can output a reference image to a verification device that verifies the verification image output by a verification image forming device that images a semiconductor device to form a verification image with the reference image, and is not limited in any way as long as it is within the scope of the common general technical knowledge at the time of filing (the same applies to other means and steps). Furthermore, the semiconductor body in the present invention may be a semiconductor chip (hereinafter also simply referred to as "chip") CP as shown in FIGS. 1(F), (H), and (M).

[0028] The bonding means 10 may form a closed-loop slit or a slit extending over the entire short width direction in a strip-shaped adhesive sheet base material temporarily attached to a strip-shaped release sheet RL, so that a predetermined area partitioned by the slit serves as the adhesive sheet AS, and peel the adhesive sheet AS from the raw roll RS and apply it; or may employ a strip-shaped adhesive sheet base material in which a strip-shaped adhesive sheet base material is temporarily attached to a strip-shaped release sheet RL, and form a closed-loop slit or a slit extending over the entire short width direction in the adhesive sheet base material with a cutting blade as cutting means while the strip-shaped adhesive sheet base material is being unwound, so that the adhesive sheet AS is peeled from the raw roll RS in which the predetermined area partitioned by the slit serves as the adhesive sheet AS and apply it; or may peel the strip-shaped adhesive sheet AS from the raw roll RS in which the strip-shaped adhesive sheet AS is temporarily attached to a strip-shaped release sheet RL and apply it; or may control the speed and tension of the unwound roll RS to apply a predetermined tension to the adhesive sheet AS when applying the adhesive sheet AS to the semiconductor body. Alternatively, application tension control may be performed to prevent tension from being applied, or the adhesive sheet AS may be peeled off from, for example, a fan-folded original roll RS and applied without being rolled up, or a pressing means may be employed in which the adhesive sheet AS is held by a holding member that is supported by the output shaft of a linear motor as a driving device and is capable of being adsorbed and held by a pressure reducing means (not shown) such as a pressure reducing pump or vacuum ejector, and the adhesive sheet AS held by the holding member is pressed against the semiconductor body to be applied, or a recovery means may be employed that recovers the release sheet RL without rolling up, for example, by fan-folding it, cutting it up with a shredder or the like, or piling it up randomly, or no recovery means may be employed, or the adhesive sheet AS may be applied to the semiconductor body by moving the base plate 11 without moving the semiconductor body or while moving it, or an adhesive sheet AS that is not temporarily attached to the release sheet RL may be employed. The application means 10 may apply the coating material to the surface of the semiconductor body on which the circuit is formed, or to the surface opposite the surface on which the circuit is formed, or to both the surface on which the circuit is formed and the surface opposite the surface on which the circuit is formed, or may apply the coating material to the entirety of one surface of the semiconductor body as shown in Figures 1(F) and (H), or to a portion of one surface of the semiconductor body as shown in Figures 1(E), (G), and (M), or may apply the coating material to the entirety or portions of all surfaces of the semiconductor body, and may or may not be provided in the processing device EA of the present invention.

[0029] The energy applying means 20 may be provided at a location other than that shown in the above embodiment, and may be provided at any location as long as it is capable of applying a predetermined energy to the coating material. The predetermined energy may be applied to the coating material without the moving means 60 stopping the movement of the support table 62, or the predetermined energy may be applied to the coating material after the moving means 60 stops the movement of the support table 62. Alternatively, the predetermined energy may be applied to the coating material by moving the energy applying device while the moving means 60 is moving the support table 62 or with the movement of the support table 62 stopped. Alternatively, a predetermined energy may be applied to the entire coating material or to a portion of the coating material, or the predetermined energy may be any type of energy, such as electromagnetic waves such as ultraviolet rays, infrared rays, visible light, sound waves, X-rays or gamma rays, a heating medium such as hot water or hot air, or a cooling medium such as cold water or cold air.Any type of energy may be applied as long as it is capable of causing a change specific to the energy in the coating material, taking into account the characteristics, properties, properties, material, composition and configuration of the coating material, and may or may not be included in the processing device EA of the present invention.

[0030] The reference image forming means 30 may use the second image PT2, for which a match has been confirmed by pre-matching in the pre-matching means 33, as the reference image PT, or may use both the first image PT1 and the second image PT2, for which a match has been confirmed by pre-matching in the pre-matching means 33, as the reference image PT. If both the first image PT1 and the second image PT2 are used as the reference image PT, the matching device 80 may, for example, match the first image PT1 with the match image PTa, match the second image PT2 with the match image PTa, match the first image PT1 and the second image PT2 with the match image PTa, or match the first image PT1 and the second image PT2 with the match image PTa when matching the first image PT1 with the match image PTa and it is confirmed that they do not match, match the second image PT2 with the match image PTa again, or when matching the second image PT2 with the match image PTa and it is confirmed that they do not match, match the first image PT1 with the match image PTa again. The reference image forming means 30 may image the semiconductor device SD using the first image forming means 31 or the second image forming means 32 without the moving means 60 stopping the movement of the support table 62, or may image the semiconductor device SD using the first image forming means 31 or the second image forming means 32 after the moving means 60 stops the movement of the support table 62, or the first image forming means 31 and the second image forming means 32 may image the semiconductor device SD at the same time. The first image forming means 31 and the second image forming means 32 may be configured as separate entities, or may be configured as an integrated entity, or one function of the other may be configured as the other.

[0031] The first image forming means 31, the second image forming means 32 and the collation image forming means 71 may all be equivalent, all have equivalent functions, at least one may not be equivalent, or at least one may not have equivalent functions. The first image forming means 31, the second image forming means 32 or the reference image forming means 71 may take an image of the semiconductor body to form the first image PT1, the second image PT2 or the reference image PTa, or may capture, for example, small holes, wrinkles, irregularities that originally exist on the surface of the semiconductor body or the coating material, as well as holes, grooves, scratches, etc. formed by surface treatment or processing, as unique features that appear on the semiconductor device SD to form the first image PT1, the second image PT2 or the reference image PTa, or may take an image of the entire semiconductor device SD to form the first image PT1, the second image PT2 or the reference image PTa, or may capture, for example, small holes, wrinkles, irregularities that originally exist on the surface of the semiconductor body or the coating material, as well as holes, grooves, scratches, etc. formed by surface treatment or processing, as unique features that appear on the semiconductor device SD. A portion of the device SD may be imaged to form the first image PT1, the second image PT2 or the match image PTa. When imaging a portion of the semiconductor device SD, for example, a predetermined area determined by coordinates in two orthogonal axes directions with a V-notch or orientation flat formed on the wafer WF as the reference position, a predetermined area determined by coordinates in two orthogonal axes directions with a corner or center of the chip CP as the reference position, an inner area of ​​a predetermined mark formed on the semiconductor device SD, or a predetermined colored portion formed on the semiconductor device SD may be imaged to form the first image PT1, the second image PT2 or the match image PTa. The first image forming means 31, the second image forming means 32 or the collation image forming means 71 may be any type of device, such as an infrared camera, an ultraviolet camera, an ultrasonic camera, an X-ray camera, an optical sensor, an ultrasonic sensor, an area sensor, a line sensor, etc., and may image the semiconductor device SD at a magnification of 10,000 times or more, or at a magnification of 10,000 times or less, or may image the semiconductor device SD without magnification or at a reduced magnification depending on the size of the unique features appearing in the semiconductor device SD.The semiconductor device SD may be imaged at any magnification as long as it can capture the unique features appearing in the semiconductor device SD and form the first image PT1, the second image PT2 or the collation image PTa, and the magnification at which the first image forming means 31 images the semiconductor device SD, the magnification at which the second image forming means 32 images the semiconductor device SD and the magnification at which the collation image forming means 71 images the semiconductor device SD may all be the same, or at least one of them may be different. At least one of the first image forming means 31, the second image forming means 32 and the collation image forming means 71 may be configured to capture additional information such as the manufacturing number, serial number, model number, type, name, dimensions, weight, etc. assigned to the semiconductor device SD.

[0032] The pre-collation means 33 may be, for example, an image processing system, an appearance inspection device, or any other device that can perform a pre-collation to determine whether the first image PT1 and the second image PT2 match, and if it is confirmed in the pre-collation that the first image PT1 and the second image PT2 do not match, it may output a mismatch signal to an alarm means such as a monitor, lamp, or buzzer via a communication medium to notify the user that a match was not confirmed by the pre-collation, or it may output a match signal or mismatch signal to at least one of the removal means 50, the moving means 60, the warning means, or other devices, or it may be equivalent to the collation device 80, have equivalent functions, or be not equivalent, or have no equivalent functions, or it may be capable of comparing the entire first image PT1 and the entire second image PT2. The condition for a match may be that all of the first image PT1 and all of the second image PT2 match, or that part of the first image PT1 and all of the second image PT2 match, or that part of the first image PT1 and all of the second image PT2 match, or that part of the first image PT1 and all of the second image PT2 do not match, or that part of the first image PT1 and all of the second image PT2 do not match, or that part of the first image PT1 and all of the second image PT2 do not match, or that part of the first image PT1 and all of the second image PT2 do not match, or that part of the first image PT1 and all of the second image PT2 do not match, or that part of the first image PT1 and all of the second image PT2 do not match. The pre-checking means 33 may output only a match signal or only a mismatch signal to the removal means 50, the moving means 60, the warning means, or other devices. When the pre-checking means 33 outputs only a match signal, for example, the removal means 50 and the moving means 60 may perform a removal operation when a semiconductor device SD that did not receive a match signal reaches the holding position HP. When the pre-checking means 33 outputs only a mismatch signal, for example, the removal means 50 and the moving means 60 may perform a removal operation when a semiconductor device SD that received a mismatch signal reaches the holding position HP. The pre-collation means 33 may be configured integrally with at least one of the first image forming means 31 and the second image forming means 32, may be incorporated into at least one of the first image forming means 31 and the second image forming means 32, may be configured as a function of at least one of the first image forming means 31 and the second image forming means 32, or may be configured separately from at least one of the first image forming means 31 and the second image forming means 32. The pre-verification means 33 may be configured to pre-verify the supplementary information captured by the first image forming means 31 and the second image forming means 32.

[0033] The reference image output means 40 may be configured integrally with the reference image forming means 30, or may be incorporated into the reference image forming means 30, or may be configured as a single function of the reference image forming means 30, or may be configured separately from the reference image forming means 30, or may output supplementary information captured by the first image forming means 31 or the second image forming means 32 to the matching device 80, or may output supplementary information whose match is confirmed by pre-matching in the pre-matching means 33 to the matching device 80, or may output a match signal or mismatch signal to the removal means 50, moving means 60, warning means or other device instead of the pre-matching means 33, or may be equivalent to the matching image output means 72, have equivalent functions, are not equivalent, or do not have equivalent functions.

[0034] The removing means 50 may be configured to include the moving means 60 as a constituent member, or may employ a driving device for moving the collection table 53, or may employ a belt conveyor for transporting the semiconductor device SD, a collection box capable of collecting a plurality of semiconductor devices SD, or the like, instead of the collection table 53, or may be configured to transport the semiconductor device SD placed on the collection table 53 to, for example, the first imaging position RP1 and the second imaging position RP2, and perform pre-verification again by the reference image forming means 30, or may be configured to transport the semiconductor device SD to an inspection device for inspecting the semiconductor device SD, or may be transported to a coating material removing means for removing the coating material from the semiconductor body, and the coating material may be removed from the semiconductor body. Alternatively, the semiconductor device SD may be transported to a destruction means for destroying the semiconductor device SD, or may be transported to a disposal means for discarding the semiconductor device SD, and the semiconductor device SD may be discarded. The processing device EA of the present invention may or may not be provided with the removal means 50. In the case where the processing device EA of the present invention is not provided with the removal means 50, for example, when the support table 62 supporting the semiconductor device SD for which a match has not been confirmed by the pre-checking in the pre-checking means 33 reaches the right end of the linear motor 61, the user or a transport means (not shown) may hold the semiconductor device SD and transport the semiconductor device SD to a recovery device, an inspection device, or the like.

[0035] The moving means 60 may be a support table 62 that cannot be held by suction on the support surface 62A, and may or may not be provided in the processing apparatus EA of the present invention.

[0036] The matching image forming device 70 may be located inside or near the next process execution device TA, or may form a matching image PTa after or at the same time as performing a predetermined processing in the next process execution device TA, and output the matching image PTa to the matching device 80, or may or may not be included in the processing device EA of the present invention. The match image output means 72 may be configured integrally with the match image forming means 71, may be incorporated into the match image forming means 71, may be configured as a single function of the match image forming means 71, may be configured separately from the match image forming means 71, may output supplementary information captured by the match image forming means 71 to the matching device 80, or may be equivalent to the reference image output means 40, may have equivalent functions, may not be equivalent, or may not have equivalent functions. The collation image forming device 70 may include, for example, a first collation image forming means for performing a first collation image forming step of imaging the semiconductor device SD to form a first collation image, a second collation image forming means for performing a second collation image forming step of imaging the semiconductor device SD to form a second collation image, and a second pre-verification means for performing a second pre-verification step of confirming whether the first collation image and the second collation image match each other before forming the collation image PTa. Similar to the reference image forming means 30, at least one of the first collation image and the second collation image whose match is confirmed by the second pre-verification performed by the second pre-verification means may be used as the collation image PTa, or additional information whose match is confirmed by the second pre-verification performed by the second pre-verification means may be output to the collation device 80. The first collation image forming means and the second collation image forming means may have the same configuration or function as the first image forming means 31, the second image forming means 32, or the collation image forming means 71. The second pre-verification means may have the same configuration or function as the pre-verification means 33.

[0037] The matching device 80 may be equivalent to the pre-matching means 33, have equivalent functions, are not equivalent, or do not have equivalent functions, and may be configured independently, shared with something else, be configured as part of something else, be configured as a so-called hoist computer that controls other devices and factory equipment collectively, be configured as part or a function of a host computer, and may or may not be included in the processing device EA of the present invention. When it is confirmed that the reference image PT and the match image PTa do not match in the comparison by the comparison means 81, the comparison device 80 may output a mismatch signal to the warning means via a communication medium to notify an operator that it has been confirmed that the reference image PT and the match image PTa do not match, or may output a match signal or mismatch signal to the warning means or other device, or may not output a match signal or mismatch signal to the warning means or other device. As the comparison means 81, for example, an image processing system, an appearance inspection device, or any other device may be used as long as it can compare whether the reference image PT and the match image PTa match, and the condition for match may be that the entire reference image PT and the entire match image PTa match. The condition for a match may be that a part of the reference image PT matches a part of the matching image PTa, that the whole of the reference image PT matches a part of the matching image PTa, that the condition for a match may be that a part of the reference image PT matches a whole of the matching image PTa, that the condition for a mismatch may be that the whole of the reference image PT does not match a whole of the matching image PTa, that the condition for a mismatch may be that a part of the reference image PT does not match a part of the matching image PTa, that the condition for a mismatch may be that the whole of the reference image PT does not match a part of the matching image PTa, or that the condition for a mismatch may be that a part of the reference image PT does not match a part of the matching image PTa. The matching device 80 may be configured integrally with at least one of the matching image forming means 71 and the matching image output means 72, may be incorporated into at least one of the matching image forming means 71 and the matching image output means 72, may be configured as a function of at least one of the matching image forming means 71 and the matching image output means 72, or may be configured separately from at least one of the matching image forming means 71 and the matching image output means 72. The collation device 80 may be configured to collate the additional information output by the reference image output means 40 with the additional information output by the collation image output means 72 .

[0038] The next process execution equipment TA may be any equipment, such as a cleaning equipment, etching equipment, immersion equipment, cutting equipment, oxide film forming equipment, nitriding equipment, grinding equipment, sandblasting equipment, polishing equipment, painting equipment, laminating equipment, sheet bonding equipment, surface treatment equipment, drilling equipment, bending equipment, inspection equipment, verification equipment, irradiation equipment, plating equipment, etc., and may be located inside the processing equipment EA of the present invention, or outside the processing equipment EA, in the same building, on the same premises, or in a different building where the processing equipment EA is located, or in the building or premises to which the semiconductor device SD is shipped.

[0039] The processing device EA may employ a laser printer, inkjet printer, letterpress printer, intaglio printer, lithographic printer, silk printer, screen printer, thermal printer, thermal transfer printer, dot impact printer, adhesive tape applicator, etc. as an imaging position forming means for forming a position on the semiconductor device SD where the first image forming means 31, second image forming means 32, or matching image forming means 71, etc., will be imaged. The processing device EA may employ a mark forming means such as a laser printer, inkjet printer, letterpress printer, intaglio printer, lithographic printer, silk screen printer, screen printer, thermal printer, thermal transfer printer, or dot impact printer to form a predetermined mark MK (see FIGS. 1(G)-(M)) having a unique feature on the semiconductor device SD, and the first image forming means 31, the second image forming means 32, or the verification image forming means 71 may capture the predetermined mark MK to form a first image PT1, a second image PT2, or a verification image PTa. Note that the mark MK1 as the mark MK is, for example, a mark engraved by a laser printer and has a unique feature due to the way the outlines of the characters are cut, as shown in FIGS. 1(I) and 1(J). The mark MK2 as the mark MK is, for example, a mark printed by an inkjet printer and has a unique feature due to the way the ink is applied to the outlines of the characters and the scattered ink SM, as shown in FIGS. 1(I) and 1(J). Furthermore, the mark MK may be any character, number, symbol, figure, mark, etc. formed by a mark forming means, and the unique feature may be not only the outline of the mark MK or scattered ink SM, but also a combination of the marks MK, a coded character, a coded symbol, or any other unique feature. For example, even if the first image forming means 31 forms a first image PT1 as shown in Figure 1(K) and the second image forming means 32 or the matching image forming means 71 forms the first image PT1 or the matching image PTa as shown in Figure 1(L), the processing device EA can perform pre-matching or matching by comparing part or all of the first image PT1 with part or all of the second image PT2 or the matching image PTa.

[0040] The covering material may be any material that can cover the wafer WF or chip CP, such as an adhesive sheet, adhesive tape, adhesive tape, glue, pressure sensitive adhesive, resin material, rubber material, metal material, solder, wax, varnish, etc., and may be a solid substance, a liquid substance, or a gel substance. The change that the coating material undergoes in response to a predetermined energy may be any change, such as hardening, softening, shrinking, expanding, vaporizing, liquefying, solidifying, discoloring, oxidation, penetration, settling, loss of adhesive strength, or increase in adhesive strength. The filler FL may be any substance, such as silica, titanium oxide, alumina, talc, calcium carbonate, iron, stainless steel, nickel, cobalt, glass, stone, wood, ceramic, or steel; it may be composed of a single material, such as silica alone or alumina alone, or may be composed of multiple materials, such as titanium oxide and nickel, or talc, iron, and ceramic; it may be composed of particles of the same size or different sizes; it may be composed of particles of the same shape or different shapes; it may be composed of particles of the same color or different colors; it may be composed of particles of the same weight or different weights; and it may have any shape, such as a sphere, an ellipsoid, a cube, a rectangular parallelepiped, a cylinder, a cylindrical shape, a truncated cone, a pyramid, a cone, a ring shape, or any other shape. The size of the filler FL may be 10 nm or less in maximum width or 1 μm or more, and may be any size as long as the first image forming means 31, the second image forming means 32 or the collation image forming means 71 can capture the appearance of the filler FL contained in the coating material as a unique feature appearing on the semiconductor device SD and form the first image PT1, the second image PT2 or the collation image PTa. The amount of filler FL to be blended may be a weight percentage of 0.01% or less relative to the weight of the entire coating material, or a weight percentage of 1% or more, or a volume percentage of 0.01% to 1% relative to the volume of the entire coating material, or a volume percentage of 0.01% or less relative to the volume of the entire coating material, or a volume percentage of 1% or more, or any percentage that constitutes the coating material. The components and binders other than the filler FL in the coating agent may be made of any substance, such as epoxy-based materials, acrylic-based materials, silicone-based materials, rubber-based materials, amines, imidazole, polyvinyl acetal, etc., and may be made of one type of substance or multiple types of substances. The coating material may be larger, smaller, or the same size as the semiconductor body, may be composed of only a binder, may not contain a binder, may not contain a filler FL, may not undergo a change specific to the given energy when a given energy is applied, and may not be attached to the semiconductor body. The semiconductor body may have an orientation flat or V-notch formed on its outer edge to indicate the orientation, or may not have an orientation flat or V-notch formed on its outer edge, may have circuits formed on only one side or only the other side, may have circuits formed on both one side and the other side, or may have circuits not formed on either one side or the other side. The semiconductor device SD having a coating applied to the wafer WF may be cut, for example, from the state shown in FIG. 1(E) along the cut line CL to form a semiconductor device SD as shown in FIG. 1(F), or may be cut from the state shown in FIG. 1(G) along the cut line CL to form a semiconductor device SD as shown in FIG. 1(H). The semiconductor device SD in which the covering material is attached to the chip CP does not have to be one obtained by cutting the wafer WF along the cut line CL. The first image PT1, second image PT2, or match image PTa shown in Figures 1(C), (D), (I) to (L) are examples, and the first image PT1, second image PT2, or match image PTa are not limited to the images shown in those figures. The semiconductor device SD may be only a semiconductor body without any covering material laminated thereon, or may be a semiconductor body with a covering material and other components laminated thereon, or a semiconductor body with other components laminated thereon without any covering material laminated thereon. The semiconductor body is not limited to the semiconductor wafer WF and the semiconductor chip CP, but may be any body that can form a known semiconductor device.

[0041] The materials, types, shapes, etc. of the covering material, adhesive sheet AS, wafer WF, chips CP, and semiconductor device SD in the present invention are not particularly limited. For example, the covering material, adhesive sheet AS, wafer WF, chips CP, and semiconductor device SD may be circular, elliptical, polygonal such as triangular or rectangular, or other shapes, and the covering material and adhesive sheet AS may be pressure-sensitive, heat-sensitive, or other adhesive forms. When a heat-sensitive covering material or adhesive sheet AS is used, it may be bonded by an appropriate method, such as providing a heating means for heating the covering material or adhesive sheet AS, such as an appropriate coil heater or the heated side of a heat pipe. Furthermore, such coating agents and adhesive sheets AS may be of any type, such as a single layer consisting of only a coating layer or adhesive layer, a two-layer structure consisting of a substrate and a coating layer or a substrate and an adhesive layer, a three-layer structure or more, in which one or more intermediate layers are laminated between the substrate and the coating layer or between the substrate and the adhesive layer, a three-layer structure or more, in which one or more cover layers are laminated on the top surface of the substrate, a structure in which the substrate, intermediate layer, or cover layer are releasably provided, a double-sided adhesive sheet consisting of only a coating layer or adhesive layer, or a double-sided adhesive sheet in which a coating layer or adhesive layer is laminated on both outermost surfaces of one or more intermediate layers. Furthermore, the semiconductor body may be any semiconductor, such as a silicon semiconductor wafer, a compound semiconductor wafer, a silicon semiconductor chip, or a compound semiconductor chip. The adhesive sheet AS may also be any sheet, film, tape, etc., such as an information label, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, or a recording layer-forming resin sheet.

[0042] The driving equipment in the above embodiments may be electric equipment such as rotary motors, linear motors, single-axis robots, so-called articulated robots with joints on two or three or more axes, actuators such as air cylinders, hydraulic cylinders, rodless cylinders and rotary cylinders, which may be used alone, or may be a direct or indirect combination of such electric equipment and actuators, or may be electric equipment, actuators, etc. that are capable of torque control, speed control, etc. for the output parts of such electric equipment, actuators, etc., or may not be capable of torque control, speed control, etc.

[0043] In the above embodiment, some object (hereinafter referred to as "object A") and an object (hereinafter referred to as "object B") that moves relative to object A, i.e., object A and object B that move relatively, object B may move relative to object A, which is not moving, object A may move relative to object B, which is not moving, or both object A and object B may move. As long as the result achieved by the movement is the same, either object A or object B may move. When a rotating member such as a roller is used, a driving device that rotates the rotating member may be provided. The surface of the rotating member or the rotating member itself may be made of a deformable member such as rubber or resin, or the surface of the rotating member or the rotating member itself may be made of a non-deformable member. Other members such as a rotating or non-rotating shaft or blade may be used instead of the roller. When a pressing means or pressing member such as a pressing roller or a pressing head that presses an object to be pressed is used, rollers, round rods, blade materials, brush-like members, or members that spray air or gas may be used instead of or in combination with the above-mentioned examples. The peeling means may be made of a deformable material such as rubber, resin, sponge, etc., or may be made of a non-deformable material such as metal or glass. When peeling means or peeling members such as peeling plates or peeling rollers are used to peel the material to be peeled, members such as plate-shaped members, round rods, rollers, etc. may be used instead of or in combination with the above examples. The peeling means may be made of a deformable material such as rubber or resin, or may be made of a non-deformable material. When supporting (holding) means or supporting (holding) members are used to support (hold) the supported member (held member), In this case, a configuration may be adopted in which the supported member is supported (held) by gripping means such as a chuck motor or chuck cylinder, Coulomb force, adhesive (adhesive sheet, adhesive tape), pressure sensitive adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli suction, suction, driving equipment, etc., or when a cutting means or cutting member that cuts the member to be cut or forms an incision or cutting line in the member to be cut is used, cutting means that cut by a cutter blade, laser cutter, ion beam, fire, heat, water pressure, an electric heating wire, spraying of gas or liquid, etc., may be used instead of or in combination with the above examples,It is also possible to move the cutting object by combining appropriate driving devices. [Explanation of symbols]

[0044] EA: Processing equipment for semiconductor devices 30...Reference image forming means 31...first image forming means 32...second image forming means 33...Pre-checking measures 40...Reference image output means 50...Removal means 70...collation image forming device 80...Collation device PT...reference image PT1...First image PT2...Second image PTa…matching image SD: Semiconductor device

Claims

1. a reference image forming means for forming a reference image by imaging the semiconductor device; a reference image output means for outputting a reference image to a verification device that compares the reference image output by a verification image forming device that images the semiconductor device and forms a verification image with the reference image, The reference image forming means comprises a first image forming means that images the semiconductor device and forms a first image, a second image forming means that images the semiconductor device and forms a second image, and a pre-matching means that confirms by pre-matching whether the first image and the second image match before forming the reference image, and at least one of the first image and the second image that are confirmed to match by pre-matching by the pre-matching means is used as the reference image.

2. 2. The semiconductor device processing device according to claim 1, further comprising a removal means for removing the semiconductor device that has been the subject of the pre-check when a mismatch is confirmed by the pre-check means.

3. a reference image forming step of imaging a semiconductor device to form a reference image; a reference image output step of outputting the reference image to a verification device that compares the verification image output by a verification image forming device that captures an image of the semiconductor device and forms a verification image with the reference image, The reference image forming process includes a first image forming process of imaging the semiconductor device to form a first image, a second image forming process of imaging the semiconductor device to form a second image, and a pre-matching process of confirming whether the first image and the second image match by pre-matching before forming the reference image, and at least one of the first image and the second image that are confirmed to match by pre-matching in the pre-matching process is used as the reference image.

4. a reference image forming step of imaging a semiconductor device to form a reference image; a reference image output step of outputting the reference image; a reference image forming step of imaging the semiconductor device to form a reference image; a match image output step of outputting the match image; a comparison step of comparing the reference image outputted in the reference image outputting step with the comparison image outputted in the comparison image outputting step, The reference image forming step includes a first image forming step of imaging the semiconductor device to form a first image, a second image forming step of imaging the semiconductor device to form a second image, and a pre-matching step of confirming whether the first image and the second image match by pre-matching before forming the reference image, and at least one of the first image and the second image that are confirmed to match by pre-matching in the pre-matching step is used as the reference image.

Images