Function panel

Abstract

To provide a novel function panel, a novel device, and a novel information processing device.SOLUTION: A first surface, a second surface facing the first surface, and a neutral surface between the first surface and the second surface are provided. In a region from the first surface to the neutral surface, a part of a function layer having a thickness that is more than or equal to a thickness of the function layer is disposed.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] One aspect of the present invention relates to a function panel, a device, or an information processing device.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. The technical field of one aspect relates to an article, a method, or a manufacturing method. One aspect of the present invention is a process, machine, manufacture, or composition. Therefore, the invention disclosed herein more specifically relates to The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, Examples include their driving methods and their manufacturing methods. [Background technology]

[0003] The social infrastructure related to information transmission methods has been improved. This allows diverse and abundant information to be shared at work and in the workplace. It is now possible to acquire, process, or send information using information processing devices not only at home but also on the go. are.

[0004] In this context, portable information processing devices have been actively developed.

[0005] For example, portable information processing devices are often carried around while in use, and if they are dropped, they can be damaged unexpectedly. Forces may be applied to the information processing device and the display device used therein. As an example of a display device, the adhesion between the structure separating the light-emitting layer and the second electrode layer is improved. The configuration is known (Patent Document 1). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-190794 Summary of the Invention [Problem to be solved by the invention]

[0007] An object of one aspect of the present invention is to provide a novel functional panel that is highly convenient and reliable. Alternatively, one of the objectives is to provide a novel device that is highly convenient and reliable. Or, to provide a new functional panel, a new device, or a new semiconductor device. This is one of the challenges.

[0008] The description of these problems does not preclude the existence of other problems. It is not necessary for the present invention to solve all of these problems. The above will be made clear from the description, drawings, claims, etc. It is possible to extract other issues from the descriptions in the patent, claims, etc. [Means for solving the problem]

[0009] One aspect of the present invention is a semiconductor device including a first surface, a second surface opposite to the first surface, and a first surface extending from the first surface to the second surface. A neutral surface is formed in the region from the first surface to the neutral surface, and at least a portion of the region from the first surface to the neutral surface is The functional panel has a functional layer disposed thereon and a support that supports the functional layer. A portion of the functional layer has a thickness that is equal to or greater than half the thickness of the functional layer.

[0010] In the functional panel according to one aspect of the present invention, the functional layer has a thickness of 1 / 2 mm in a region from the first surface to the neutral surface. A portion of the functional layer having a thickness equal to or greater than half the thickness of the functional layer is disposed. This applies compressive stress to the portion of the functional layer. The first surface can be bent inward so that a force can be applied. A panel can be provided.

[0011] In addition, one aspect of the present invention is a method for manufacturing a semiconductor device, comprising: a first region overlapping a part of a functional layer; and a second region adjacent to the first region. The functional panel has two regions, and the support is a second region of the first region. a first member in a region from the surface to the functional layer and a second member in a region from the second surface to the functional layer of the second region; The first member has a higher rigidity than the second member. can.

[0012] In the functional panel according to one aspect of the present invention, the functional layer has a thickness of 1 / 2 mm in a region from the first surface to the neutral surface. A first region in which a part of the functional layer having a thickness of half or more is disposed, and a second region adjacent to the first region and a second region, and the support is disposed between the second surface of the second region and the functional layer. a second member having higher rigidity than the second member and extending from a second surface of the first region; and a first member disposed between the first region and the functional layer. The flexible layer can be bent with the first surface facing inward so that a compressive stress is applied to a portion of the flexible layer. As a result, a novel functional panel can be provided.

[0013] In addition, one aspect of the present invention is a semiconductor device including a first surface, a second surface facing the first surface, and a second surface extending from the first surface to the third surface. A central surface is located in the center of the area from the first surface to the second surface, and at least The functional panel has a functional layer on which a part of the functional layer is disposed, and a support body that supports the functional layer. The part of the functional layer has a thickness equal to or greater than half the thickness of the functional layer, and extends from the first surface to the central surface. The part in the region at has approximately the same stiffness as the part in the region from the second surface to the central surface. Prepare.

[0014] In the functional panel according to one aspect of the present invention, the functional layer has a thickness of 1 / 2 mm in the region from the first surface to the central surface. A portion of the functional layer having a thickness equal to or greater than half the thickness of the functional layer is disposed. This applies compressive stress to the portion of the functional layer. The first surface can be bent inward so that a force can be applied. A panel can be provided.

[0015] In addition, one aspect of the present invention is a method for manufacturing a semiconductor device, comprising: a first region overlapping a part of a functional layer; and a second region adjacent to the first region. The functional panel has two regions, and the support is a second region of the first region. a first member in a region from the surface to the functional layer and a second member in a region from the second surface to the functional layer of the second region; The first member has a thickness equal to or greater than that of the second member.

[0016] In the functional panel according to one aspect of the present invention, the functional layer has a thickness of 1 / 2 mm in the region from the first surface to the central surface. A first region in which a part of the functional layer having a thickness of half or more is disposed, and a second region adjacent to the first region and a second region, and the support is disposed between the second surface of the second region and the functional layer. a second member disposed on the first region from the second surface of the first region to the functional layer, the second member being thicker than the second member; and a first member disposed between the first and second regions. The first surface can be bent inward so that a compressive stress is applied to the It is possible to provide a functional panel.

[0017] Another aspect of the present invention is the functional panel, wherein the functional layer includes a display element.

[0018] Another aspect of the present invention is the functional panel described above, wherein the functional layer includes a sensing element.

[0019] Furthermore, one aspect of the present invention is a device having the above-mentioned functional panel and a framework supporting the functional panel. The framework is a device for bending the functional panel with the first surface facing inward. It has the function of

[0020] Furthermore, one aspect of the present invention is a device having the above-mentioned functional panel and a framework supporting the functional panel. The framework is a device that has a curvature radius equal to or greater than a first curvature radius with the first surface facing inward. The function of bending the functional panel is to form a fold with a diameter. In addition, a fold having a radius of curvature larger than the radius of curvature of the first surface is formed with the second surface facing inward. and a function of bending the functional panel so that the functional panel can be bent.

[0021] The device according to one aspect of the present invention includes the functional panel and a first surface of the functional panel facing inward. and a framework having a function of bending the functional panel. The coil can be bent with the first surface facing inward. As a result, a novel device can be provided. can be done.

[0022] Furthermore, one aspect of the present invention is a device having the above-mentioned functional panel and a framework supporting the functional panel. The framework has a first surface formed therein so that folds are formed in the first region. It has a function of bending the functional panel to the side.

[0023] Furthermore, one aspect of the present invention is a device having the above-mentioned functional panel and a framework supporting the functional panel. The framework has a first surface facing inward and a curvature of at least a first radius of curvature in the first region. The function of bending the functional panel is to form a fold with a radius. Also, the second surface faces inward, and the first region has a radius of curvature larger than the first radius of curvature. and a function of bending the functional panel so that folds are formed.

[0024] The device according to one aspect of the present invention includes the functional panel and a first area with the first surface facing inward. A framework having a function of bending the functional panel so that folds are formed. This allows the functional panel to be folded in the first area with the first surface facing inward. As a result, a novel device can be provided. .

[0025] Another embodiment of the present invention is a device including the above device, a microphone, an antenna, a battery, and an operation switch. Or it is an information processing device having a housing.

[0026] The information processing device according to the aspect of the present invention has a functional panel and a first surface facing inward. The functional panel is configured to include a frame that can be bent. The result is a novel information processing system. It is possible to provide a processing device.

[0027] In this specification, FPC (Flexible Printed Circuit) t) or TCP (Tape Carrier Package) connectors are attached. A printed wiring board is attached to the end of the TCP of the module. or IC (Integrated Circuit) mounted by COG (Chip On Glass) method The device also includes a substrate on which the light emitting device is formed. [Effects of the Invention]

[0028] According to one aspect of the present invention, a novel functional panel that is highly convenient or reliable can be provided. Alternatively, a novel device with excellent convenience or reliability can be provided. It is possible to provide a novel information processing device with excellent reliability. Thus, a novel information processing device or a novel semiconductor device can be provided.

[0029] The description of these effects does not preclude the existence of other effects. The embodiment does not necessarily have to have all of these effects. , the specification, drawings, claims, etc., and It is possible to extract other effects from the claims and other descriptions. [Brief explanation of the drawings]

[0030] [Figure 1] 1A to 1C are diagrams illustrating a function panel according to an embodiment. [Figure 2] 1A to 1C are diagrams illustrating a function panel according to an embodiment. [Figure 3] 1A to 1C are diagrams illustrating a function panel according to an embodiment. [Figure 4] 1A to 1C are diagrams illustrating a function panel according to an embodiment. [Figure 5] 1A and 1B are diagrams illustrating an apparatus according to an embodiment. [Figure 6] 1A and 1B are diagrams illustrating an apparatus according to an embodiment. [Figure 7] 1A and 1B are diagrams illustrating an apparatus according to an embodiment. [Figure 8] 1A and 1B are diagrams illustrating an apparatus according to an embodiment. [Figure 9] 5A to 5C are schematic diagrams illustrating a manufacturing process of a laminate according to an embodiment. [Figure 10] 5A to 5C are schematic diagrams illustrating a manufacturing process of a laminate according to an embodiment. [Figure 11] 5A to 5C are schematic diagrams illustrating a manufacturing process of a laminate according to an embodiment. [Figure 12] 5A to 5C are schematic diagrams illustrating a manufacturing process of a laminate having an opening in a support according to an embodiment. [Figure 13] 1A and 1B are schematic diagrams illustrating a configuration of a processed member according to an embodiment. [Figure 14] 1A and 1B illustrate an input / output device according to an embodiment. [Figure 15] 1A and 1B illustrate an input / output device according to an embodiment. [Figure 16] 1 is a projection diagram illustrating a configuration of an information processing device according to an embodiment. [Figure 17] 1A and 1B are diagrams illustrating the configuration of a device and a functional panel according to an embodiment. [Figure 18] 2A and 2B are diagrams illustrating a configuration of a detection panel according to an embodiment. [Figure 19] 3A and 3B are diagrams illustrating a configuration of electrodes of a detection panel according to an embodiment. [Figure 20] 3A and 3B are diagrams illustrating a configuration of electrodes of a detection panel according to an embodiment. [Figure 21] 3A and 3B are diagrams illustrating a configuration of electrodes of a detection panel according to an embodiment. [Figure 22] 1A to 1C illustrate a structure of a display panel according to an embodiment. [Figure 23] 1A to 1C illustrate a structure of a display panel according to an embodiment. [Figure 24] 1A and 1B illustrate an input / output device according to an embodiment. [Figure 25] 1A and 1B illustrate an input / output device according to an embodiment. [Figure 26] 1A and 1B illustrate an input / output device according to an embodiment. [Figure 27] 1A and 1B illustrate an input / output device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0031] A functional panel according to one aspect of the present invention includes a first surface, a second surface opposite to the first surface, and a second surface opposite to the first surface. and a neutral surface between the first surface and the second surface, and a thickness of the functional layer is A portion of the functional layer having a thickness greater than half is disposed.

[0032] This allows bending the substrate with the first surface facing inward so that compressive stress is applied to a portion of the functional layer. As a result, a new functional panel or a new device can be provided. Alternatively, a novel information processing device can be provided.

[0033] The words "film" and "layer" may be used interchangeably depending on the situation. For example, the term "conductive layer" can be replaced with "conductive film." ". Alternatively, for example, the term "insulating film" may be used. It may be possible to change the term to "insulating layer."

[0034] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiments, and various changes and modifications may be made in the form and details thereof without departing from the spirit and scope of the present invention. It will be readily understood by those skilled in the art that the present invention can be achieved by the following embodiments. It should not be construed as being limited to the contents of the description. The same reference numerals are used in common between different drawings for the same parts or parts having similar functions. A repeated explanation will be omitted.

[0035] (Embodiment 1) In this embodiment, a structure of a functional panel according to one embodiment of the present invention will be described with reference to FIGS. While explaining.

[0036] FIG. 1 is a diagram illustrating the configuration of a functional panel according to one embodiment of the present invention. 1B is a top view of the functional panel 100A of the embodiment, and FIG. 1B is a cross-sectional view of the functional panel 100A of the embodiment, taken along the cutting line X1- This is a cross-sectional view at X2.

[0037] FIG. 1C is a top view of a functional panel 100A2 according to one embodiment of the present invention, and FIG. 1(C) is a cross-sectional view taken along the line X3-X4 shown in FIG.

[0038] <Example 1 of the function panel configuration> The functional panel 100A described in this embodiment has a first surface 1 and a second surface 2 facing the first surface 1. The first surface 1 is connected to the second surface 2, and the neutral surface 5A is formed in the region from the first surface 1 to the second surface 2. a functional layer 3 at least partly arranged in the region from the center line 1 to the neutral plane 5A; and a support member (member 4A and member 4B) for supporting the member (FIGS. 1(A) and 1(B)). The part 3A of the functional layer 3 has a thickness equal to or greater than half the thickness d of the functional layer 3.

[0039] The functional panel 100A described in this embodiment has a region from the first surface 1 to the neutral surface 5A. , a portion 3A of the functional layer 3 having a thickness equal to or greater than half the thickness d of the functional layer 3 is disposed.

[0040] As a result, the first surface 1 is bent inward so that a compressive stress is applied to the portion 3A of the functional layer 3. As a result, a novel functional panel can be provided.

[0041] The functional layer 3 can also include a display element 9A (see FIG. 1(A)).

[0042] The functional layer 3 may also include a sensing element 9B.

[0043] The functional panel 100A may also have an opening. An opening having an area overlapping the terminal T can be provided.

[0044] Modified examples of the functional panel are shown in Fig. 1(C) and Fig. 1(D). The functional panel 100A2 shown in FIG. 1 has a first surface 1 on which one surface of the functional layer 3 is exposed, and a support The point where one surface of the functional layer 3 is in contact with the other surface of the functional layer 3 is shown in FIG. 1(A) and FIG. 1(B). However, this differs from the functional panel 100A which will be described later.

[0045] The individual elements that make up the functional panel 100A will be described below. The components cannot be clearly separated, and one component may also contain other components or parts of other components. There is.

[0046] <<Configuration of the Function Panel>> The functional panel 100A described in this embodiment has a first surface 1, a second surface 2, a neutral surface 5A, It has a functional layer 3 or a support (member 4A or member 4B).

[0047] First Plane, Second Plane, Neutral Plane Various shapes can be used for the functional panel 100A. For example, a plate or sheet A box-shaped outer shape can be used for the functional panel 100A.

[0048] The first surface or the second surface is included in the surface of the functional panel 100A, and various shapes can be formed on the first surface. It can be used for the first surface 1 or the second surface 2. For example, a square, a polygon, a circle, etc. can be used for the first surface 1 or the second surface 2. It can be face 1.

[0049] The first surface 1 or the second surface 2 is a part of the surface of the support or a part of the surface of the functional layer 3. may include:

[0050] The neutral surface 5A is a surface that expands and contracts when the functional panel 100A is bent with the first surface 1 facing inward. Specifically, it is a plane that cannot be recognized when the first surface 1 is bent inward. The change in dimension is -15 ppm or more, +15 ppm or less, preferably -10 ppm or more, +10 ppm or less. pm or less.

[0051] By selecting and using various configurations for the functional panel 100A, the position of the neutral plane 5A can be can be changed.

[0052] For example, a member (for example, member 4B) used in the region from the second surface 2 to the neutral surface 5A is provided. A member having a rigidity smaller than that of the first surface 1 is used in the region from the first surface 1 to the neutral surface 5A. When used in a material (for example, component 4A), the neutral plane 5A can be brought closer to the second surface 2.

[0053] For example, a material that is thinner than the material used in the region from the second surface 2 to the functional layer 3 is used on the first surface. When used in a member used in the region from 1 to the functional layer 3, the neutral plane 5A is brought closer to the second surface 2. It is possible.

[0054] 《Support》 One or more members can be used as the support. For example, member 4A and member 4B Specifically, a plate-shaped, sheet-shaped or film-shaped member 4 can be used as the support. A and member 4B can be laminated together and used as a support.

[0055] For example, inorganic materials, organic materials, or composite materials of inorganic and organic materials can be used as the support. can be done.

[0056] The support should have a heat resistance sufficient to withstand the manufacturing process, a thickness that can be applied to the manufacturing equipment, and It has size.

[0057] For example, organic materials such as resin, resin film, or plastic are used as the member 4A or the member 4B. Specifically, polyester, polyolefin, polyamide, poly Thin films or plates containing imide, polycarbonate or acrylic resins can be used. do.

[0058] For example, inorganic materials such as glass, ceramics, and metals can be used for the member 4A or the member 4B. Specifically, alkali-free glass, soda-lime glass, potash glass, or clay glass can be used. Plates containing stainless steel or the like can be used. Specifically, SUS, aluminum or For the insulating layer, a metal foil or metal plate containing magnesium or the like can be used.

[0059] For example, inorganic oxides, inorganic nitrides, inorganic oxynitrides, etc. are used for the member 4A or the member 4B. Specifically, thin films containing silicon oxide, silicon nitride, silicon oxynitride, alumina, etc. can be used.

[0060] For example, a single material or a composite material of multiple materials may be used for the member 4A or the member 4B. Specifically, composite materials in which multiple materials are laminated, or fibrous or particulate materials A composite material in which the above-mentioned is dispersed in another material can be used. For example, an insulating layer, a resin film, etc. A composite material including an insulating layer and a resin layer for bonding the resin film is used for the member 4A. This can be done.

[0061] For example, a material in which a base material and an insulating layer that prevents the diffusion of impurities contained in the base material are laminated is called a member 4A. Or it can be used for the member 4B. Specifically, it is glass and impurities contained in glass. One or more materials selected from silicon oxide, silicon nitride, silicon oxynitride, etc. that prevent diffusion are Alternatively, a laminated material can be used. One or more materials selected from silicon oxide, silicon nitride, silicon oxynitride, etc. are laminated. Materials that have been used can be used.

[0062] For example, a metal plate, a thin glass plate, or a film of an inorganic material or the like is bonded to a resin film or the like. A composite material can be used for member 4A or member 4B.

[0063] For example, a film of an inorganic material with a thickness of a few μm or less and a resin film with a thickness of 10 to several hundred μm are used. When a composite material with a laminated oil film is used, the thickness can be increased to 5 mm or more, preferably 4 mm or more. The material is preferably bendable with a curvature radius of 3 mm or more, particularly preferably 1 mm or more. It can be used for component 4A or component 4B.

[0064] Functional Layer For example, a functional circuit, a functional element, an optical element, a functional film, or a plurality of elements selected from these. The layer can be used for the functional layer 3.

[0065] The functional layer 3 may be a layer including one or more functional elements. For example, a layer in which a plurality of functional elements are arranged in a matrix can be used.

[0066] For example, an electric element or a biochip can be used as the functional element. Using a transistor, a capacitor, a resistor, a memory element, a light-emitting element, a display element, or the like can be done.

[0067] For example, the functional layer 3 can include a functional element and a functional circuit that drives the functional element.

[0068] For example, a film that suppresses the diffusion of impurities can be used for the functional layer 3.

[0069] For example, optical elements such as a colored layer and a light-shielding layer can be used for the functional layer 3 .

[0070] Display element For example, a display element 9A, a pixel circuit that drives the display element 9A, and a drive circuit that drives the pixel circuit. The functional layer 3 may be formed of a color film having an area overlapping the display element 9A. A filter or a layer that prevents impurities from diffusing into the display element can be used as the functional layer 3 ( See Figure 1(A)).

[0071] For example, a light-emitting element can be used as the display element 9A. A luminescence element can be used.

[0072] This makes it possible to provide a functional panel that can be used as a display panel.

[0073] Detector Element For example, the detection element 9B can be used in the functional layer 3. Specifically, a proximity sensor can be used to detect For example, a capacitance element can be used for the sensing element 9B. (See Figure 1(A)).

[0074] This makes it possible to provide a functional panel that can be used as a touch panel.

[0075] <Example 2 of the function panel configuration> Another configuration of the functional panel according to an embodiment of the present invention will be described with reference to FIG.

[0076] 2A and 2B are diagrams illustrating the configuration of a functional panel according to an embodiment of the present invention. 2(B) is a top view of the functional panel 100B of the embodiment, taken along the cutting line X5- shown in FIG. 2(A). This is a cross-sectional view at X6.

[0077] The functional panel 100B described in this embodiment has a first region overlapping a part 3A of the functional layer 3. 2A and 2B, which are adjacent to the first region 7A. (B)). The support is a region from the second surface 2 of the first region 7A to the functional layer 3. The second member 4C and the second region 7B are provided in a region from the second surface 2 to the functional layer 3. The first member 4C has a higher rigidity than the second member 4D.

[0078] The functional panel 100B described in this embodiment has a region from the first surface 1 to the neutral surface 5B. a first region in which a portion 3A of the functional layer 3 having a thickness equal to or greater than half the thickness of the functional layer 3 is disposed; The support has a first region 7A and a second region 7B adjacent to the first region 7A. a second member 4D disposed between the second surface 2 and the functional layer 3 in the second region 7B; and a first member 4C disposed between the second surface 2 and the functional layer 3 in the region 7A. The first member 4C has a higher rigidity than the second member 4D. The first surface is bent inward so that a compressive stress is applied to a portion 3A of the functional layer 3 in the region. As a result, a novel functional panel can be provided.

[0079] In the functional panel 100B, the support has higher rigidity than the second member 4D. The fact that the first member 4C is provided is a function that will be described with reference to FIGS. 1(A) and 1(B). The panel 100A is different from the panel 100A. Here, the different configuration will be described in detail, and the panel 100A will be described using the same configuration. The above description is incorporated herein for the parts that can be used.

[0080] 《Support》 One or more members can be used as the support. For example, member 4A, first member 4 C and the second member 4D can be used as supports.

[0081] A member having a shape (for example, a belt shape) that conforms to the bending portion and has higher rigidity than the second member 4D. Specifically, the rigidity of the first member 4C is preferably 3% or more higher than that of the second member 4D. A member having a rigidity higher than that of the first member 4C by 5% or more is used for the first region 7A. The distance from the neutral plane 5B in the second region 7B to the second surface 2 is defined as the distance from the neutral plane 5B in the second region 7B to the second surface 2. The distance to face 2 can be made shorter than the distance to face 2.

[0082] For example, from materials that can be used for the functional panel 100A, a material that satisfies the above conditions can be selected. It can be selected and used for the functional panel 100B.

[0083] Specifically, a resin film is used for the second member 4D, and the rigidity of the second member 4D is 3% or more. Preferably, a metal plate having a rigidity higher than that of the first member 4C by 5% or more can be used.

[0084] In addition, a member having a lower rigidity than the member 4A is provided between the neutral plane 5B of the first region 7A and the first surface 1. Alternatively, a configuration in which the

[0085] <Example 3 of the function panel configuration> Another configuration of the functional panel according to an embodiment of the present invention will be described with reference to FIG.

[0086] FIG. 3 is a diagram illustrating the configuration of a functional panel 100C according to an embodiment of the present invention. 3(B) is a top view of a functional panel 100C according to an embodiment of the present invention; FIG. 3(B) is a cross-sectional view of the functional panel 100C shown in FIG. FIG. 10 is a cross-sectional view taken along line X7-X8.

[0087] The functional panel 100C described in this embodiment has a first surface 1 and a second surface 2 facing the first surface 1. a central surface 5C located in the center of the area from the first surface 1 to the second surface 2; a functional layer 3, at least a portion of which is disposed in a region from the surface 1 to the central surface 5C; 3, and a support (member 4A, member 4B, and member 4E) for supporting the member 3 (FIG. 3(A) and 3(B)). The part 3A has a thickness equal to or greater than half the thickness d of the functional layer 3. , the portion in the region from the first surface 1 to the central surface 5C is the portion in the region from the second surface 2 to the central surface 5C. The functional panel 100C has a rigidity approximately equal to that of the portion in the region. The area from the center plane 5C includes the entire member 4A, a part 3A of the functional layer 3, and the member The portion of the member 4B that includes a part of the member 4E and is in the region from the second surface 2 to the central surface 5C is the entire member 4B. and part of member 4E.

[0088] In this specification, for example, the magnitude of the bending rigidity of one support is larger than the bending rigidity of the other support. If the magnitude of the bending stiffness is 85% or more and 115% or less, preferably 90% or more and 110% or less If the stiffness of one support is approximately equal to the stiffness of the other support, , the magnitude of the bending stiffness is N m 2 can be used as a unit.

[0089] The functional panel 100C described in this embodiment has a region from the first surface 1 to the central surface 5C. A portion 3A of the functional layer 3 having a thickness equal to or greater than half the thickness d of the functional layer 3 is disposed. As a result, the functional layer 3 is bent with the first surface 1 facing inward so that a compressive stress is applied to the portion 3A of the functional layer 3. As a result, a novel functional panel can be provided.

[0090] The functional layer 3 can also include a display element 9A (see FIG. 3(A)).

[0091] The functional layer 3 may also include a sensing element 9B.

[0092] The functional panel 100C may also have an opening. An opening having an area overlapping the terminal T can be provided.

[0093] The functional panel 100C has a portion in the region from the first surface 1 to the central surface 5C that is the second surface 2. The point having approximately the same rigidity as the part in the region from the center plane 5C to the center plane 5D is shown in FIG. 1(B) and 1(C). The configuration will be described in detail, and the above description will be used to refer to parts where a similar configuration can be used. do.

[0094] <<Configuration of the Function Panel>> In this embodiment, the functional panel 100C includes a first surface 1, a second surface 2, a central surface 5C, and a functional layer 3. or supports (members 4A, 4B and 4E).

[0095] "First side, second side, central side" Various shapes can be used for the functional panel 100C. For example, a plate or sheet A box-shaped outer shape can be used for the functional panel 100C.

[0096] The first surface or the second surface is included in the surface of the functional panel 100C, and various shapes can be formed on the first surface. It can be used for the first surface 1 or the second surface 2. For example, a square, a polygon, a circle, etc. can be used for the first surface 1 or the second surface 2. It can be face 1.

[0097] The first surface 1 or the second surface 2 is a part of the surface of the support or a part of the surface of the functional layer 3. may include:

[0098] The central plane 5C passes through the middle between the first surface 1 and the second surface 2 facing the first surface 1.

[0099] 《Support》 The support supports the functional layer 3. A plurality of members can be used for the support. For example, 4A, a member 4B having approximately the same stiffness and thickness as the member 4A, and a member 4B having approximately the same stiffness and thickness as the member 4A. The member 4E to which the first surface 1 is bonded can be used as a support. The stiffness of the region up to the central surface 5C and the stiffness of the region from the second surface 2 to the central surface 5C are approximately equal. It can be done more efficiently.

[0100] For example, from materials that can be used for the functional panel 100A, a material that satisfies the above conditions can be selected. It can be selected and used for the functional panel 100C.

[0101] Specifically, a resin film is used for the member 4A, and the stiffness and thickness are approximately equal to those of the member 4A. A resin film having the above properties is used as the member 4B, and an adhesive layer is formed to bond the members 4A and 4B together. It can be used for the member 4E.

[0102] <Function panel configuration example 4.> Another configuration of the functional panel according to an embodiment of the present invention will be described with reference to FIG.

[0103] 4A and 4B are diagrams illustrating the configuration of a functional panel according to one embodiment of the present invention. 4(B) is a top view of the functional panel 100D of the embodiment, and FIG. 4(B) is a top view of the functional panel 100D of the embodiment, taken along the cutting line X9- Cross-sectional view at X10.

[0104] The functional panel 100D described in this embodiment has a first region overlapping a part 3A of the functional layer 3. The support has a first region 7A and a second region 7B adjacent to the first region 7A. The first member 4C and the second region 7A are disposed in the region from the second surface 2 to the functional layer 3 of the region 7A of the first member 4C. The second member 4D is provided in the region from the second surface 2 of B to the functional layer 3, and the first member 4C is 2 is thicker than the thickness of the member 4D.

[0105] The functional panel 100D illustrated in this embodiment has a region from the first surface 1 to the central surface 5D. The first region in which the part 3A of the functional layer 3 having a thickness equal to or greater than half the thickness d of the functional layer 3 is arranged. The support has a first region 7A and a second region 7B adjacent to the first region 7A. a second member 4D disposed between the second surface 2 and the functional layer 3 in the second region 7B; The second region 7A is thicker than the first region 4D and is disposed between the second surface 2 and the functional layer 3. The first member 4C is provided. This applies a compressive stress to the portion 3A of the functional layer 3 in the first region. The first surface can be bent inward so that a force can be applied. A panel can be provided.

[0106] The functional panel 100D has a support body made of a second member 4D and a first member 4B that is thicker than the second member 4D. The difference between the functional panel 100B described with reference to FIG. The different configurations are described in detail, and where similar configurations can be used, the above description is used as a reference.

[0107] 《Support》 One or more members can be used as the support. For example, member 4A, member 4D, and The thickness of the first region 7A can be made thicker than that of the second region 7B. can.

[0108] A member having a shape (for example, a strip shape) that conforms to the bending portion is used as the first member 4C. The distance from the central surface 5D to the second surface 2 in the first region 7A is It can be longer than the distance from the central plane 5D to the second surface 2 in the drawing.

[0109] For example, a material that satisfies the above conditions is selected from materials that can be used for the functional panel 100A. The selected one can be used for the functional panel 100D.

[0110] Specifically, a resin film is used for the member 4A, another resin film is used for the member 4D, and a strip-shaped For example, a strip-shaped resin film can be used as the member 4C. A resin or metal plate coated in a strip shape can be used as the member 4C.

[0111] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0112] (Embodiment 2) In this embodiment, a configuration of a device according to one embodiment of the present invention will be described with reference to FIGS. 5 to 8. explain.

[0113] 5A and 5B are diagrams illustrating the configuration of a device according to one embodiment of the present invention. 5(B) is a perspective view illustrating the device 200A according to one embodiment of the present invention. 5(C) is a cross-sectional view taken along the line Y1-Y2 of the present invention in an unfolded state. 5(D) is a perspective view illustrating the device 200A according to one embodiment, and FIG. ... 3-Y4 is a cross-sectional view.

[0114] FIG. 6 is a diagram illustrating a hinge portion that can be used in a device according to one embodiment of the present invention. FIG. 6(A) is a side view illustrating the configuration of the hinge portion 213 in a bent state, and FIG. 6(B) is an expanded view. FIG. 10 is a side view illustrating the configuration of a hinge portion 213 in an open state.

[0115] <Device configuration example 1.> The device 200A described in this embodiment is the same as the functional panel 100A described in the first embodiment. , and a framework 210A that supports the functional panel 100A. The function of the functional panel 100A is to bend the first surface 1 inward (see FIG. 5(A) and Fig. 5(B)).

[0116] The device 200A illustrated in this embodiment is the same as the functional panel 100A described in the first embodiment. A framework having a function of bending the functional panel 100A with the first surface 1 facing inward. 210A, whereby the functional panel is bent with the first surface facing inward. As a result, a novel device can be provided.

[0117] The individual elements that make up the device 200A will be described below. It is not possible to separate them exactly, and one component may also be another component or may contain parts of another component. .

[0118] <Device Configuration> The device 200A described in this embodiment has a functional panel 100A or a framework 210A. do.

[0119] <<Framework Structure>> The framework 210A includes a hinge portion 213 and a first guide portion 21 connected to the hinge portion 213. The hinge portion 213 is connected to the first guide portion 211 and the second guide portion 212. The portion 213 connects the second guide portion 212 to the first guide portion 211 so as to be rotatable. It has the function (see Figure 5(B)).

[0120] Various configurations can be used for the hinge portion 213. For example, a rotation axis 213S and a rotation axis 213S and a plurality of components 213P connected to each other. This is possible (see Figure 6(A)).

[0121] For example, a hinge part 213 to which a plurality of parts 213P are connected so as to open in a fan shape is used. The hinge portion 213 rotates the second guide portion 212 relative to the first guide portion 211. Specifically, the state shown in FIG. 6(B) can be rotated to the state shown in FIG. It can be moved.

[0122] The second guide portion 212 is moved relative to the first guide portion 211 from the state shown in FIG. 5(D), but the part 213P can be rotated as shown in FIG. 6(B). If the hinge part 213 comes into contact with the adjacent part in this way, it cannot rotate. Therefore, the functional panel 100A can be bent in only one direction.

[0123] The first guide portion 211 can have a structure that is less prone to bending than the hinge portion 213. For example, a box-shaped, plate-shaped, or sheet having a thickness of 0.2 mm or more, preferably 1 mm or more. A similar configuration to the first guide portion 211 can be used as the second guide portion. It can be used in the section 212.

[0124] In addition, the adhesive layer that bonds the functional panel 100A and the first guide portion 211 is It may also be provided on the surface of the functional panel 211 facing the functional panel 100A.

[0125] In addition, as the hinge portion 213 bends, the functional panel 100A moves along the first guide portion 211. For example, a sliding structure can be used in which the area overlapping the edge of the functional panel 100A is In this case, a first guide portion 211 having a gap for holding the end portion of the functional panel 100A can be used. Cut.

[0126] For example, inorganic materials such as metals, glass, and ceramics, organic materials such as resins, or natural materials. The material can be used for the framework 210A.

[0127] Specifically, engineering plastics and silicone rubber can be used. In addition, stainless steel, aluminum, magnesium alloy, etc. may be used.

[0128] <<Function Panel>> For example, the functional panel described in the first embodiment can be used. Panel 100A, function panel 100A2, function panel 100B, function panel 100C or A functional panel 100D or the like can be used.

[0129] When the functional panel 100B is used, the first region 7A of the functional panel 100B (where the member 4C is The functional panel 100 is positioned so that the area where the functional panel 100 is positioned overlaps the hinge portion 213 of the framework 210A. Place B (see Figure 6(C)).

[0130] When the functional panel 100D is used, the first region 7A (where the member 4C is The functional panel 100 is positioned so that the area where the functional panel 100 is positioned overlaps the hinge portion 213 of the framework 210A. Place D (see Figure 6(D)).

[0131] <Device configuration example 2.> Another configuration of the device according to one embodiment of the present invention will be described with reference to FIG.

[0132] 7A and 7B are diagrams illustrating the configuration of a device according to one embodiment of the present invention. 7(B) is a cross-sectional view illustrating a device 200B according to one embodiment of the present invention. 7(C) is a cross-sectional view illustrating a device 200B according to one embodiment of the present invention. FIG. 7(C) is different from FIG. 7(A). FIG. 2 is a cross-sectional view illustrating a device 200B according to an embodiment of the present invention in a reverse bent state.

[0133] The device 200B described in this embodiment is the same as the functional panel 100A described in the first embodiment. , and a framework 210B that supports the functional panel 100A. With the first surface 1 facing inward, a fold having a curvature radius equal to or greater than the first curvature radius R1 is formed. The function of bending the functional panel 100A so that the second surface 2 faces inward is to The functional part is formed so that a fold having a radius of curvature R2 larger than the first radius of curvature R1 is formed. and a function of bending the panel 100A (see FIGS. 7(A) to 7(C)). .

[0134] The device 200B illustrated in this embodiment is the same as the functional panel 100A described in the first embodiment. A framework having a function of bending the functional panel 100A with the first surface 1 facing inward. 210B. This allows the functional panel to be bent with the first surface facing inward. As a result, a novel device can be provided.

[0135] The device 200B has a frame 210B with a first surface 1 facing inward and a first radius of curvature R1 or more. A mechanism for bending the functional panel 100A so that folds with a curvature radius are formed. and a second surface 2 facing inward and having a second radius of curvature R2 greater than the first radius of curvature R1. and a function of bending the functional panel 100A so that a fold that can be formed is formed. This is different from the device 200A described with reference to FIG. The above description will be used in detail for parts where a similar configuration can be used.

[0136] <Device Configuration> The device 200B described in this embodiment has a functional panel 100A or a framework 210B. do.

[0137] <<Framework Structure>> The frame 210B includes a hinge portion 213B and a first guide portion connected to the hinge portion 213B. 211 and a second guide portion 212 connected to the hinge portion 213B. The hinge portion 213B allows the second guide portion 212 to rotate relative to the first guide portion 211. It has a function to connect (see Figures 7(A) to 7(C)).

[0138] Various configurations can be used for the hinge portion 213B. For example, a rotation axis 213S and a rotation A configuration including a plurality of parts 213PB connected to each other using a shaft 213S is used. This is possible (see FIG. 8(A)).

[0139] For example, a hinge part 213B to which a plurality of parts 213PB are connected so as to open in a fan shape is used. The hinge portion 213B is configured to connect the second guide portion 211 to the first guide portion 211. Specifically, the state shown in FIG. 8(A) can be changed to the state shown in FIG. 8(B). It can be rotated freely.

[0140] The second guide portion 212 is moved relative to the first guide portion 211 from the state shown in FIG. 7(B) to the state shown in FIG. 7(C). When 13PB comes into contact with an adjacent part as shown in FIG. 8(B), it cannot rotate. The hinge portion 213B thus restricts bending in the opposite direction, and keeps the functional panel 100A in a fixed position. It can bend greatly in the direction.

[0141] The frame 210A is selected from the structures that can be used to satisfy the above conditions. The member can be used for the framework 210B.

[0142] <<Function Panel>> For example, the functional panel described in the first embodiment can be used. Panel 100A, function panel 100A2, function panel 100B, function panel 100C or A functional panel 100D or the like can be used.

[0143] When the functional panel 100B is used, the functional panel 100B is attached to the hinge portion 213 of the framework 210B. 0B so that the first area 7A (area where the member 4C is arranged) of the functional panel 100 overlaps with the first area 7A of the functional panel 100. Place B (see Figure 8(C)).

[0144] When the functional panel 100D is used, the functional panel 100D is attached to the hinge portion 213 of the framework 210B. 0D overlaps with the first area 7A (area where the member 4C is arranged) of the functional panel 100. Place D (see Figure 8(D)).

[0145] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0146] (Embodiment 3) In this embodiment, a method for fabricating a stack that can be used to fabricate a functional panel according to one embodiment of the present invention will be described. The manufacturing method will be described with reference to FIG.

[0147] 9 is a schematic diagram illustrating the process of producing a laminate. Cross-sectional views illustrating the structure of the layered body are shown, and corresponding top views are shown on the right, except for FIG. 9(C). .

[0148] <Method for producing laminate> A method for producing a laminate 81 from a processed member 80 will be described with reference to FIG.

[0149] The processed member 80 includes a first substrate F1, a first release layer F2 on the first substrate F1, and a first release layer F3. A first peeled layer F3 has one side in contact with the release layer F2, and a second side of the first peeled layer F3 has one side in contact with the release layer F2. The bonding layer 30 is in contact with one surface of the bonding layer 30, and the substrate S5 is in contact with the other surface of the bonding layer 30 (see FIG. 9(A-1) and Fig. 9(A-2)).

[0150] The details of the structure of the processed member 80 will be described in the fifth embodiment.

[0151] <<Formation of the starting point of peeling>> A processed member 80 in which a peeling starting point F3s is formed near the end of the bonding layer 30 is prepared.

[0152] The peeling starting point F3s is a structure in which a part of the first peeled layer F3 is separated from the first substrate F1. Has.

[0153] A method of piercing the first peeled layer F3 from the first substrate F1 side with a sharp tip or using a laser or the like A part of the first peeled layer F3 is peeled off by a method such as laser ablation. The peeling layer F2 can be partially peeled off. This forms the peeling starting point F3s. It is possible.

[0154] First Step A processed member 80 in which a peeling starting point F3s is formed in advance near the end of the bonding layer 30 is prepared. (See Figure 9(B-1) and Figure 9(B-2)).

[0155] Second Step One surface layer 80b of the processed member 80 is peeled off. As a result, a first remaining portion is left from the processed member 80. Get 80a.

[0156] Specifically, the peeling starting point F3s formed near the end of the bonding layer 30 is peeled off from the first substrate F1. The first peel layer F2 is then separated from the first peeled layer F3 (see FIG. 9(C)). As a result, the first peeled layer F3, the bonding layer 30 having one surface in contact with the first peeled layer F3, and the bonding layer 30 having one surface in contact with the first peeled layer F3 are A first remainder 80a is obtained, which comprises the substrate S5 with which the other surface of the composite layer 30 is in contact.

[0157] In addition, ions are irradiated near the interface between the first peeling layer F2 and the first peeled layer F3 to remove static electricity. Specifically, ions generated by an ionizer can be used to peel off the surface. Irradiation may also be performed.

[0158] When the first layer to be peeled F3 is peeled from the first peeling layer F2, the first peeling layer F2 and the first layer to be peeled F3 are separated. The liquid is then permeated into the interface of the peeled layer F3 of the first layer. Alternatively, the liquid is sprayed from a nozzle 99. For example, water, polar solvents, etc. may be used as the liquid to be penetrated or sprayed. It is possible.

[0159] By allowing the liquid to penetrate, the effects of static electricity that occurs during peeling can be suppressed. Alternatively, the release layer may be peeled off while being soaked in a liquid that dissolves the release layer.

[0160] In particular, when a film containing tungsten oxide is used for the first release layer F2, the penetration of a liquid containing water is difficult. When the first peeled layer F3 is peeled off while being heated or sprayed, the first peeled layer F3 This is preferable because it can reduce the stress that is applied to the substrate due to peeling.

[0161] The third step The first adhesive layer 31 is formed on the first remaining portion 80a (see FIG. 9(D-1) and FIG. 9(D-2)). (see FIG. 1), the first remaining portion 80 a and the first support 41 are bonded together using the first adhesive layer 31 . As a result, a laminate 81 is obtained from the first remaining portion 80a.

[0162] Specifically, the first support 41, the first adhesive layer 31, the first peeled layer F3, and the first The bonding layer 30 has one surface in contact with the peeled layer F3, and the other surface of the bonding layer 30 has the substrate S5 in contact with the peeled layer F3. A laminate 81 having the above is obtained (see FIG. 9(E-1) and FIG. 9(E-2)).

[0163] Various methods can be used to form the bonding layer 30. For example, The bonding layer 30 is formed by using a pen or screen printing method. The material is cured by a method appropriate for the material used. For example, a photo-curable adhesive is used for the bonding layer 30. In this case, light containing light of a predetermined wavelength is irradiated.

[0164] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0165] (Fourth embodiment) In this embodiment, a method for fabricating a stack that can be used to fabricate a functional panel according to one embodiment of the present invention will be described. The manufacturing method will be described with reference to FIGS.

[0166] 10 and 11 are schematic diagrams illustrating the process of producing a laminate. 1 shows a cross-sectional view illustrating the configuration of the workpiece and the laminate on the left side, and the corresponding top view is shown in Shown on the right side except for Figures 10(C), 11(B) and 11(C).

[0167] <Method for producing laminate> A method for producing a laminate 92 from a processed member 90 will be described with reference to FIGS. 10 and 11. explain.

[0168] The processed member 90 is pressed at a point where the other surface of the bonding layer 30 contacts one surface of the second peeled layer S3. It is different from the construction member 80.

[0169] Specifically, the processed member 90 is made of a second substrate S1, a substrate S2, and a substrate S3. A laminate including a second release layer S2 and a second layer S3 to be peeled, the other side of which is in contact with the second release layer S2. The second peeled layer S3 has a layer structure, and one surface of the second peeled layer S3 is in contact with the other surface of the bonding layer 30 at a different position. become.

[0170] The processed member 90 includes a first substrate F1, a first release layer F2, and a first surface of the first release layer F2. The first peeled layer F3 is in contact with the other surface of the first peeled layer F3. a second peeled layer S3 having one surface in contact with the other surface of the bonding layer 30; A second release layer S2, one side of which is in contact with the other side of the release layer S3, and a second substrate S1 are included in this. They are arranged in this order (see FIG. 10(A-1) and FIG. 10(A-2)).

[0171] The details of the structure of the processed member 90 will be described in the fifth embodiment.

[0172] First Step A processed member 90 in which a peeling starting point F3s is formed near the end of the bonding layer 30 is prepared (FIG. 10 (B-1) and Figure 10(B-2)).

[0173] The peeling starting point F3s is a structure in which a part of the first peeled layer F3 is separated from the first substrate F1. Has.

[0174] For example, a method of piercing the first peeled layer F3 with a sharp tip from the first substrate F1 side or The first peeled layer F3 is peeled off by a method using a laser or the like (for example, a laser ablation method). This allows a part of the peeling starting point F3s to be partially peeled off from the peeling layer F2. can be formed.

[0175] Second Step One surface layer 90b of the processed member 90 is peeled off. As a result, a first remaining portion is left from the processed member 90. Get 90a.

[0176] Specifically, the peeling starting point F3s formed near the end of the bonding layer 30 is peeled off from the first substrate F1. The first peel layer F2 is then separated from the first peeled layer F3 (see FIG. 10(C)). As a result, the first peeled layer F3, the bonding layer 30 having one surface in contact with the first peeled layer F3, A second peeled layer S3, one surface of which is in contact with the other surface of the bonding layer 30, and a second peeled layer S3 A second release layer S2, one surface of which is in contact with the other surface, and a second substrate S1 are arranged in this order. A first remainder 90a is obtained.

[0177] In addition, ions are irradiated near the interface between the second peeling layer S2 and the second peeled layer S3 to remove static electricity. Specifically, ions generated by an ionizer can be used to peel off the surface. Irradiation may also be performed.

[0178] When the second peeled layer S3 is peeled from the second peeling layer S2, the second peeling layer S2 and the second peeled layer S3 are The liquid is then permeated into the interface of the layer S3 to be peeled off from the nozzle 99. For example, water, polar solvents, etc. may be used as the liquid to be penetrated or sprayed. It is possible.

[0179] By allowing the liquid to penetrate, the effects of static electricity that occurs during peeling can be suppressed. Alternatively, the release layer may be peeled off while being soaked in a liquid that dissolves the release layer.

[0180] In particular, when a film containing tungsten oxide is used for the second release layer S2, the penetration of a liquid containing water is difficult. When the second peeled layer S3 is peeled off while being heated or sprayed, the second peeled layer S3 This is preferable because it can reduce the stress that is applied to the substrate due to peeling.

[0181] The third step A first adhesive layer 31 is formed on the first remaining portion 90a (FIG. 10(D-1) and FIG. 10(D-2)). )), the first remaining portion 90a and the first support 41 are bonded together using the first adhesive layer 31. In this way, a laminate 91 is obtained from the first remaining portion 90a.

[0182] Specifically, the first support 41, the first adhesive layer 31, the first peeled layer F3, and the first The bonding layer 30 has one surface in contact with the peeled layer F3, and the other surface of the bonding layer 30 has one surface in contact with the other surface of the bonding layer 30. and a second peeling layer S3, one surface of which is in contact with the other surface of the second peeling layer S3. A laminate 91 is obtained in which the layer S2 and the second substrate S1 are arranged in this order (FIG. 10(E-1) ) and Figure 10(E-2)).

[0183] The Fourth Step A part of the second peeled layer S3 in the vicinity of the end of the first adhesive layer 31 of the laminate 91 is peeled off by the second substrate. It separates from the plate S1 to form a second peeling initiation point 91s.

[0184] For example, the first support 41 and the first adhesive layer 31 are cut from the first support 41 side, Also, a part of the second peeled layer S3 is peeled along the edge of the newly formed first adhesive layer 31. The substrate S1 is separated from the substrate S1.

[0185] Specifically, the first layer S2 is located in the region where the second layer S3 is provided on the second release layer S2. The adhesive layer 31 and the first support 41 are cut using a blade or the like having a sharp tip, and Along the edge of the newly formed first adhesive layer 31, a part of the second peeled layer S3 is attached to the second It is separated from the substrate S1 (see FIG. 11(A-1) and FIG. 11(A-2)).

[0186] This step removes the edge of the newly formed first support 41b and the first adhesive layer 31. A peeling starting point 91s is formed near the part.

[0187] The fifth step The second remaining portion 91a is separated from the laminate 91. 1a is obtained (see Figure 11(C)).

[0188] Specifically, the peeling starting point 91s formed near the end of the first adhesive layer 31 is peeled off from the second substrate 32. The plate S1 is separated from the second peeled layer S3 together with the second peeled layer S2. The support 41b, the first adhesive layer 31, the first peeled layer F3, and the first peeled layer F3. The bonding layer 30 has one surface in contact with the other surface of the bonding layer 30, and the second layer to be peeled has one surface in contact with the other surface of the bonding layer 30. S3 and S4 are arranged in this order to obtain a second remainder 91a.

[0189] In addition, ions are irradiated near the interface between the second peeling layer S2 and the second peeled layer S3 to remove static electricity. Specifically, ions generated by an ionizer can be used to peel off the surface. Irradiation may also be performed.

[0190] When the second peeled layer S3 is peeled from the second peeling layer S2, the second peeling layer S2 and the second peeled layer S3 are The liquid is then permeated into the interface of the layer S3 to be peeled off from the nozzle 99. For example, water, polar solvents, etc. may be used as the liquid to be penetrated or sprayed. It is possible.

[0191] By allowing the liquid to penetrate, the effects of static electricity that occurs during peeling can be suppressed. Alternatively, the release layer may be peeled off while being soaked in a liquid that dissolves the release layer.

[0192] In particular, when a film containing tungsten oxide is used for the second release layer S2, the penetration of a liquid containing water is difficult. When the second peeled layer S3 is peeled off while being heated or sprayed, the second peeled layer S3 This is preferable because it can reduce the stress that is applied to the substrate due to peeling.

[0193] Step 6 The second adhesive layer 32 is formed on the second remaining portion 91a (FIG. 11(D-1) and FIG. 11(D- See 2).

[0194] The second remaining portion 91a and the second support 42 are bonded together using the second adhesive layer 32. In this step, a laminate 92 is obtained from the second remaining portion 91a (see FIG. 11(E-1) and FIG. 1 1(E-2)).

[0195] Specifically, the first support 41b, the first adhesive layer 31, the first peeled layer F3, and the first The bonding layer 30 has one surface in contact with the peeled layer F3, and the other surface of the bonding layer 30 has one surface in contact with the other surface of the bonding layer 30. The second peeled layer S3, the second adhesive layer 32, and the second support 42 are arranged in this order. A laminate 92 is obtained.

[0196] <Method for producing a laminate having an opening in a support> A method for producing a laminate having openings in a support will be described with reference to FIG.

[0197] FIG. 12 illustrates a method for producing a laminate having an opening in a support through which a part of a layer to be peeled is exposed. The left side of FIG. 12 shows a cross-sectional view for explaining the structure of the laminate, and the corresponding top view is shown in FIG. Shown on the right.

[0198] 12(A-1) to 12(B-2) show a second support 41b that is smaller than the first support 41b. 4A and 4B are diagrams illustrating a method for producing a laminate 92c having an opening using the laminate 42b.

[0199] 12(C-1) to 12(D-2) show a second support 42 having an opening formed therein. 10A and 10B are diagrams illustrating a method for producing a laminate 92d.

[0200] Example 1 of a method for producing a laminate having an opening in a support In the sixth step, the second support 42 is replaced with a support smaller than the first support 41b. The laminate was fabricated in the same steps except that a second support 42b was used. This method produces a laminate in which a part of the second peeled layer S3 is exposed. (See FIG. 12(A-1) and FIG. 12(A-2)).

[0201] A liquid adhesive can be used for the second adhesive layer 32. Alternatively, a liquid adhesive with reduced flowability and It is possible to use adhesive that has been preformed into sheets (also called sheet adhesive). When a sheet-like adhesive is used, the adhesive layer 32 protruding outside the second support 42b is In addition, the thickness of the adhesive layer 32 can be easily made uniform. .

[0202] Also, the exposed portion of the second peeled layer S3 is cut away to expose the first peeled layer F3. The state may be the same as that shown in FIG. 12(B-1) and FIG. 12(B-2).

[0203] Specifically, a blade having a sharp tip or the like is used to create scratches on the exposed second peeled layer S3. Next, for example, adhesive tape or the like is applied so that stress is concentrated near the scratch. The tape is attached to a part of the second peelable layer S3, and the second peelable layer S A portion of 3 can be peeled off and selectively removed.

[0204] In addition, a layer capable of suppressing the adhesive force of the bonding layer 30 to the first peeled layer F3 is For example, the adhesive layer 30 may be made of a material that is difficult to bond to the bonding layer 30. Specifically, an organic material may be vapor-deposited in an island shape. This allows a portion of the bonding layer 30 to be selectively and easily removed together with the second peeled layer S3. As a result, the first layer to be peeled F3 can be left exposed.

[0205] For example, the first peeled layer F3 may be a functional layer and a conductive layer F3 electrically connected to the functional layer. b, the conductive layer F3b can be exposed to the opening of the second laminate 92c. This allows the conductive layer F3b exposed in the opening to be used as a terminal to which a signal is supplied, for example. You can be there.

[0206] As a result, the conductive layer F3b, part of which is exposed in the opening, can extract the signal supplied by the functional layer. Alternatively, the signal supplied to the functional layer can be transmitted to an external device. It can be used for terminals that can be supplied.

[0207] <<Example 2 of Method for Producing a Laminate Having an Opening in a Support>> A mask 48 having openings provided so as to overlap the openings provided in the second support 42 is provided. Then, a solvent 49 is dropped into the openings of the mask 48. The second support 42 exposed through the openings of the mask 48 is swelled or dissolved using a solvent 49. (See FIG. 12(C-1) and FIG. 12(C-2)).

[0208] After removing the excess solvent 49, the second support 42 exposed through the openings of the mask 48 is rubbed. As a result, the second support in the area overlapping with the opening of the mask 48 is 42 etc. can be removed.

[0209] Furthermore, if a solvent that swells or dissolves the bonding layer 30 is used, the first peeled layer F3 can be exposed. (See FIG. 12(D-1) and FIG. 12(D-2)).

[0210] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0211] (Embodiment 5) In this embodiment, a structure of a processed member that can be processed into a functional panel according to one embodiment of the present invention will be described. This will be described with reference to FIG.

[0212] FIG. 13 is a schematic diagram illustrating the structure of a processed member that can be processed into a laminate.

[0213] FIG. 13(A-1) is a cross-sectional view illustrating the structure of a processed member 80 that can be processed into a laminate. 13(A-2) is a corresponding top view.

[0214] FIG. 13(B-1) is a cross-sectional view illustrating the structure of a processed member 90 that can be processed into a laminate. 13(B-2) is a corresponding top view.

[0215] <1. Example of processed material configuration> The processed member 80 includes a first substrate F1, a first release layer F2 on the first substrate F1, and a first release layer F3. A first peeled layer F3 has one side in contact with the release layer F2, and a second side of the first peeled layer F3 has one side in contact with the release layer F2. The bonding layer 30 is in contact with one surface of the bonding layer 30, and the substrate S5 is in contact with the other surface of the bonding layer 30 (see FIG. 13(A-1) and 13(A-2)).

[0216] The peeling starting point F3s may be provided near the end of the bonding layer 30.

[0217] <<First board>> The first substrate F1 has a heat resistance sufficient to withstand the manufacturing process and a thickness that is compatible with the manufacturing equipment. There are no particular limitations as long as it has the required size.

[0218] The first substrate F1 is made of an organic material, an inorganic material, or a composite material of an organic material and an inorganic material. It is possible.

[0219] For example, inorganic materials such as glass, ceramics, and metals can be used for the first substrate F1. do.

[0220] Specifically, alkali-free glass, soda-lime glass, potash glass, or crystal glass etc. can be used for the first substrate F1.

[0221] Specifically, a metal oxide film, a metal nitride film, a metal oxynitride film, or the like is formed on the first substrate F1. For example, silicon oxide, silicon nitride, silicon oxynitride, alumina film, etc. can be used as the first 1 can be used for the substrate F1.

[0222] Specifically, SUS, aluminum, or the like can be used for the first substrate F1.

[0223] For example, the first substrate F1 is made of an organic material such as a resin, a resin film, or plastic. It is possible.

[0224] Specifically, polyester, polyolefin, polyamide, polyimide, polycarbonate A resin film or a resin plate such as polyethylene terephthalate or acrylic resin is used as the first substrate F1. can be done.

[0225] For example, a metal plate, a thin glass plate, or a film of an inorganic material is laminated to a resin film or the like. The composite material can be used for the first substrate F1.

[0226] For example, fibrous or particulate metal, glass, or inorganic material is dispersed in a resin film. The composite material can be used for the first substrate F1.

[0227] For example, a composite material in which fibrous or particulate resin or organic material is dispersed in an inorganic material , can be used for the first substrate F1.

[0228] In addition, a single layer material or a laminated material in which multiple layers are laminated may be used for the first substrate F1. For example, a laminated structure can be used in which a base material and an insulating layer that prevents the diffusion of impurities contained in the base material are laminated. The material can be used for the first substrate F1.

[0229] Specifically, the glass and the silicon oxide film, silicon nitride film or a laminated material in which one or more films selected from a silicon oxynitride film or the like are laminated on a first substrate; Applicable to F1.

[0230] Alternatively, a silicon oxide film, silicon nitride film or oxynitride film that prevents the diffusion of impurities that penetrate the resin. A laminated material in which silicon nitride films or the like are laminated can be applied to the first substrate F1.

[0231] First peeling layer The first peeling layer F2 is provided between the first substrate F1 and the first layer to be peeled F3. The separation layer F2 has a boundary formed in its vicinity that allows the first layer F3 to be separated from the first substrate F1. The first release layer F2 is a layer on which a layer to be peeled is formed. There is no particular limitation as long as it has heat resistance sufficient to withstand the manufacturing process of the separation layer F3. .

[0232] For example, an inorganic material or an organic resin can be used for the first release layer F2.

[0233] Specifically, tungsten, molybdenum, titanium, tantalum, niobium, nickel, and cobalt Zirconium, Zinc, Ruthenium, Rhodium, Palladium, Osmium, Iridium a metal containing an element selected from silicon, an alloy containing said element, or a compound containing said element Inorganic materials such as the above can be used for the first release layer F2.

[0234] Specifically, polyimide, polyester, polyolefin, polyamide, polycarbonate Organic materials such as polyethylene terephthalate or acrylic resin can be used.

[0235] For example, a single layer material or a multi-layer laminated material may be used for the first release layer F2. can.

[0236] Specifically, a material in which a layer containing tungsten and a layer containing tungsten oxide are stacked is used. It can be used for the first release layer F2.

[0237] The layer containing tungsten oxide can be formed by stacking another layer on the layer containing tungsten. Specifically, a layer containing tungsten oxide can be formed by using tungsten. The insulating film may be formed by stacking silicon oxide, silicon oxynitride, or the like on a layer containing stainless steel.

[0238] In addition, the surface of the layer containing tungsten oxide is subjected to thermal oxidation treatment, and the layer containing tungsten is subjected to oxidation treatment. The treatment is carried out using oxygen plasma, nitrous oxide (NO) plasma, or a highly oxidizing solution (e.g., It may be formed by a treatment using ozone water or the like.

[0239] Specifically, a layer containing polyimide can be used for the first release layer F2. The layer containing the first peeled layer F3 is required to have a sufficient strength to withstand various manufacturing steps required for forming the first peeled layer F3. It has heat resistance.

[0240] For example, the polyimide-containing layer is heated to 200° C. or higher, preferably 250° C. or higher, and more preferably has a heat resistance of 300°C or higher, more preferably 350°C or higher.

[0241] The film containing the monomer formed on the first substrate F1 is heated, and the film containing the condensed polyimide is It can be used.

[0242] <<First layer to be peeled>> The first peeled layer F3 can be separated from the first substrate F1 and can withstand the manufacturing process. There are no particular limitations as long as the material has heat resistance to that extent.

[0243] The boundary at which the first peeled layer F3 can be separated from the first substrate is and the first release layer F2, and between the first release layer F2 and the first substrate F1 It may be formed.

[0244] When a boundary is formed between the first peeled layer F3 and the first peeling layer F2, the first peeling layer F 2 is not included in the stack and a boundary is formed between the first release layer F2 and the first substrate F1. In this case, a first release layer F2 is included in the laminate.

[0245] The first layer is made of an inorganic material, an organic material, a single layer material, or a laminated material in which multiple layers are laminated. It can be used for the release layer F3.

[0246] For example, an inorganic material such as a metal oxide film, a metal nitride film, or a metal oxynitride film is formed on the first substrate. It can be used for the release layer F3.

[0247] Specifically, silicon oxide, silicon nitride, silicon oxynitride, alumina film, etc. are applied to the first peeled layer F3. It can be used.

[0248] For example, resin, resin film, plastic, etc. may be used for the first peelable layer F3. can be done.

[0249] Specifically, a polyimide film or the like can be used for the first peeled layer F3.

[0250] For example, a functional layer having an area overlapping with the first release layer F2 and a functional layer having an area overlapping with the first release layer F2 and the functional layer and an insulating layer between the functional layer and the insulating layer that can prevent the diffusion of impurities that impair the function of the functional layer. Structured materials can be used.

[0251] Specifically, a glass plate having a thickness of 0.7 mm is used as the first substrate F1, and from the first substrate F1 side, A stack of a 200 nm thick silicon oxynitride film and a 30 nm thick tungsten film stacked in this order. The material is used for the first release layer F2. Then, from the first release layer F2 side, The film containing the laminated material in which the silicon oxynitride film and the silicon nitride film having a thickness of 200 nm are laminated is first The silicon oxynitride film can be used as the peeled layer F3. The silicon nitride oxide film has a higher nitrogen content than the oxygen content.

[0252] Specifically, instead of the first peeled layer F3, a 60 mm thick layer is formed in order from the first peeled layer F2 side. 0 nm thick silicon oxynitride film, 200 nm thick silicon nitride film, 200 nm thick silicon oxynitride film A silicon nitride oxide film having a thickness of 140 nm and a silicon oxynitride film having a thickness of 100 nm were stacked. A film containing a laminate material can be used for the first peeled layer F3.

[0253] Specifically, from the first release layer F2 side, a polyimide film and a silicon oxide or silicon nitride film are sequentially formed. A laminated material in which a layer containing the above and a functional layer are laminated in this order can be used.

[0254] Functional Layer The functional layer is included in the first layer to be peeled F3.

[0255] For example, a functional circuit, a functional element, an optical element, a functional film, or a plurality of elements selected from these. A layer containing the above can be used as the functional layer.

[0256] Specifically, the present invention relates to a display element that can be used in a display device, a pixel circuit that drives the display element, a pixel circuit that drives the display element, a display device, a display element, a pixel circuit that drives the display element, a display element that can be used in a display device, a pixel circuit that drives the display element ... A driving circuit for driving the element circuit, a color filter, a moisture-proof film, or the like, or a film selected from these A layer containing a plurality of layers can be mentioned.

[0257] 《Joining layer》 The bonding layer 30 is not particularly limited as long as it bonds the first peeled layer F3 and the substrate S5. stomach.

[0258] The bonding layer 30 may be made of an inorganic material, an organic material, or a composite material of an inorganic material and an organic material. can.

[0259] For example, a glass layer or adhesive having a melting point of 400°C or less, preferably 300°C or less, is used. It is possible.

[0260] For example, light-curing adhesives, reaction-curing adhesives, heat-curing adhesives, and / or anaerobic adhesives. The bonding layer 30 may be made of an organic material such as an adhesive.

[0261] Specifically, epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyrate) Adhesives containing Ethylene Vinyl Acetate (EVA) resin, etc. can be used. do.

[0262] 《Base material》 The substrate S5 has a heat resistance sufficient to withstand the manufacturing process and a thickness and thickness that are applicable to the manufacturing equipment. There are no particular limitations as long as it has a certain size.

[0263] The material that can be used for the base material S5 may be the same as that for the first substrate F1. This can be done.

[0264] "Starting point of peeling" The processed member 80 may have a peeling starting point F3s near the end of the bonding layer 30.

[0265] The peeling starting point F3s is a structure in which a part of the first peeled layer F3 is separated from the first substrate F1. Has.

[0266] A method of piercing the first peeled layer F3 from the first substrate F1 side with a sharp tip or using a laser or the like A part of the first peeled layer F3 is peeled off by a method such as laser ablation. The peeling layer F2 can be partially peeled off. This forms the peeling starting point F3s. It is possible.

[0267] <2. Example 2 of the processed material configuration> Regarding the structure of the processed member different from the above that can be laminated, see Figure 13 (B-1). This will be explained with reference to FIG. 13(B-2).

[0268] The processed member 90 has the other surface of the bonding layer 30 formed on one side of the second peeled layer S3 instead of the base material S5. The point of contact with the surface of the processed member 80 is different from that of the processed member 80.

[0269] Specifically, the processed member 90 has a first release layer F2 and a second surface contacting the first release layer F2. The first substrate F1 has a first peeled layer F3 formed thereon, and the second peeled layer S2 and the second a second substrate S1 on which a second layer S3 to be peeled is formed, the other surface of which is in contact with the peeling layer S2; one surface of the second layer F3 is in contact with the other surface of the first layer F4 and the other surface of the second layer S3 is in contact with the other surface of the first layer F5. and a bonding layer 30 that is in contact with the surface (see FIG. 13(B-1) and FIG. 13(B-2)). .

[0270] "Second board" The second substrate S1 can be the same as the first substrate F1. Plate S1 does not need to have the same construction as first substrate F1.

[0271] Second peeling layer The second release layer S2 can have the same structure as the first release layer F2. The second release layer S2 may have a different structure from the first release layer F2.

[0272] <<Second peeled layer>> The second layer to be peeled S3 can have the same structure as the first layer to be peeled F3. The second layer to be peeled S3 may have a different structure from that of the first layer to be peeled F3.

[0273] Specifically, the first peeled layer F3 has a functional circuit, and the second peeled layer S3 has the functional circuit. A functional layer that prevents impurities from diffusing into the semiconductor layer may be provided.

[0274] Specifically, the first layer to be peeled F3 is a light emitting element that emits light toward the second layer to be peeled S3, a pixel circuit for driving the light-emitting element, and a drive circuit for driving the pixel circuit; Color filters that transmit part of the emitted light and moisture-proofing that prevents impurities from diffusing into the light-emitting element The film may be provided on the second peeled layer S3. The member can be a laminate that can be used as a flexible display device.

[0275] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0276] (Sixth embodiment) In this embodiment, as an example of a configuration of a functional panel according to one embodiment of the present invention, a configuration of an input / output device This will be described with reference to FIGS. 14, 15 and 24 to 27.

[0277] FIG. 14 is a projection diagram illustrating the configuration of an input / output device 500TP of one embodiment of the present invention. For ease of explanation, a part of the detection panel 600 and a part of the pixel 502 are shown enlarged. There are.

[0278] FIG. 15A illustrates a part Z1-Z2 of an input / output device 500TP of one embodiment of the present invention shown in FIG. 15(B) and 15(C) are cross-sectional views of the structure shown in FIG. 15(A). 10 is a cross-sectional view of a structure that can replace the portion.

[0279] FIG. 24 illustrates an input / output device 500 according to one embodiment of the present invention, in which part of the structure shown in FIG. 15A is replaced. FIG. 2 is a cross-sectional view illustrating the configuration of TP(1).

[0280] FIG. 25 illustrates an input / output device 500 according to one embodiment of the present invention, in which part of the structure shown in FIG. 15A is replaced. FIG. 2 is a cross-sectional view illustrating the configuration of TP(2).

[0281] FIG. 26 illustrates an input / output device 500 according to one embodiment of the present invention, in which part of the structure illustrated in FIG. 15A is replaced. FIG. 10 is a cross-sectional view illustrating the configuration of TP(3).

[0282] FIG. 27 illustrates an input / output device 500 according to one embodiment of the present invention, in which part of the structure illustrated in FIG. 15A is replaced. FIG. 10 is a cross-sectional view illustrating the configuration of TP(4).

[0283] <Example 1 of input / output device configuration> The input / output device 500TP described in this embodiment includes a display panel 500 and a display panel 5 00 (see FIG. 14).

[0284] The detection panel 600 has a function of receiving a control signal and supplying a detection signal. The detection panel 600 can be folded with the first surface facing inward and unfolded. It can be made into a state where

[0285] The detection panel 600 includes a plurality of control lines CL(i) extending in the row direction and supplied with control signals. In addition, the pixel electrodes 11a and 11b are provided with a plurality of control lines including a signal line ML(j) extending in the column direction and supplying a detection signal. The control line CL(i) and the signal line ML(j) are supported by a flexible The substrate 610 comprises:

[0286] The detection panel 600 includes a first electrode C1(i) ​​electrically connected to the control line CL(i), and a signal The first electrode C1(i) ​​is electrically connected to the line ML(j) and has a portion that does not overlap with the first electrode C1(i). and a second electrode C2(j).

[0287] Substrate 610 supports first electrode C1(i) ​​and second electrode C2(j).

[0288] The display panel 500 includes pixels 502 .

[0289] The first electrode C1(i) ​​or the second electrode C2(j) has an opening at a position overlapping the pixel 502. 667 includes a mesh-like conductive film.

[0290] The input / output device 500TP described in this embodiment includes a detection panel 600 and a detection panel 60 0 and folded and unfolded together with the detection panel 600. and a display panel 500 capable of displaying a first or second electrode of the display panel. The display device includes a mesh-like conductive film having openings at positions overlapping with the pixels.

[0291] For example, the sensing panel 600 of the input / output device 500TP provides sensing information along with position information. It is possible.

[0292] Specifically, the user of the input / output device 500TP approaches or touches the detection panel 600. Use your finger as a pointer to perform various gestures (tap, drag, swipe or pinch) You can do things like (chi-in, etc.).

[0293] The detection panel 600 detects a finger or the like approaching or touching the detection panel 600, and Sensing information can be provided, including location or trajectory, etc.

[0294] The computing device determines whether the supplied information satisfies a predetermined condition and performs a predetermined gesture. The associated instructions are executed based on a program or the like.

[0295] This allows the user of the sensing panel 600 to provide a predetermined gesture and The instructions associated with the char can be executed by a computing device.

[0296] The display panel 500 of the input / output device 500TP receives display information supplied by, for example, a computing device. It has the function of providing information.

[0297] In addition to the above configuration, the following configuration can be used for the input / output device 500TP.

[0298] The flexible printed circuit board FPC1 is electrically connected to the detection panel 600 of the input / output device 500TP. may be connected to

[0299] The flexible printed circuit board FPC2 is electrically connected to the display panel 500 of the input / output device 500TP. may be connected to

[0300] The display panel 500 may include a driving circuit 503g or a driving circuit 503s.

[0301] The display panel 500 may include wiring 511 or terminals 519 .

[0302] The input / output device 500TP may include a protective layer 670.

[0303] The input / output device 500TP uses an anti-reflection layer 670p having an area that overlaps the pixel 502. It is possible.

[0304] The individual elements that make up the input / output device 500TP will be described below. The components cannot be clearly separated, and one component may serve as another component or may contain parts of another component. There is a match.

[0305] For example, the detection panel 600 having a colored layer at a position overlapping the plurality of openings 667 is It is both a Nel 600 and a color filter.

[0306] For example, an input / output device 500TP in which the detection panel 600 is superimposed on the display panel 500 is , the detection panel 600 is also the display panel 500. The input / output device 500TP with the detection panel 600 superimposed thereon is also called a touch panel.

[0307] Overall composition The input / output device 500TP described in this embodiment is a detection panel 600 or a display panel 5 00.

[0308] An example of a method for manufacturing a laminate that can be applied to manufacturing the input / output device 500TP will be described. This will be explained in detail in the third to fifth embodiments.

[0309] <Detection Panel> The detection panel 600 includes a control line CL(i), a signal line ML(j), or a substrate 610 ( See Figure 14).

[0310] In addition, a method of forming a film for forming the detection panel 600 on the substrate 610 and processing the film is also available. The sensing panel 600 may be fabricated using the method.

[0311] Alternatively, a portion of the detection panel 600 may be fabricated on another substrate and then transposed onto the substrate 610. The method may be used to fabricate a sensing panel 600 .

[0312] The detection panel 600 detects proximity or contact and supplies a detection signal. Detects changes in capacitance, illuminance, magnetic force, radio waves, or pressure, and outputs information based on the detected physical quantity. Specifically, a capacitance element, a photoelectric conversion element, a magnetic detection element, a piezoelectric element, or a resonator etc. can be used as the sensing element.

[0313] In addition, when an object having a higher dielectric constant than the air, such as a finger, comes close to the conductive film in the air, When the finger is touched, the capacitance between the finger and the conductive film changes. This change in capacitance is detected and the detection information is provided. Specifically, a conductive film and a container having one electrode connected to the conductive film can be supplied. A quantum element or the like can be used.

[0314] For example, charge sharing due to a change in capacitance occurs between the capacitance element and the capacitance element. The voltage between the pair of electrodes changes, and this voltage change can be used as a detection signal.

[0315] "wiring" The detection panel 600 includes wiring. The wiring includes a control line CL(i), a signal line ML(j), etc. nothing.

[0316] The conductive material can be used for wiring and the like.

[0317] For example, inorganic conductive materials, organic conductive materials, metals, conductive ceramics, etc. are used for wiring. It can be used for.

[0318] Specifically, aluminum, gold, platinum, silver, chromium, tantalum, titanium, molybdenum, tungsten, nickel, iron, cobalt, yttrium, zirconium, palladium or A metal element selected from manganese, an alloy containing the above-mentioned metal element, or an alloy containing the above-mentioned metal element The alloys of aluminum, chromium, and copper can be used for wiring. , containing one or more elements selected from tantalum, titanium, molybdenum, and tungsten In particular, an alloy of copper and manganese is suitable for microfabrication using wet etching. is.

[0319] Specifically, a two-layer structure in which a titanium film is laminated on an aluminum film, a titanium nitride film on a titanium nitride film, Two-layer structure with a tungsten film laminated on a titanium nitride film, two-layer structure with a tungsten film laminated on a titanium nitride film, a two-layer structure in which a tungsten film is laminated on a titanium film or a tungsten nitride film; A three-layer structure in which an aluminum film is layered on top of the titanium film, and a titanium film is then formed on top of that. etc. can be used.

[0320] Specifically, aluminum, titanium, tantalum, tungsten, molybdenum, chromium, An alloy film or nitride film made by combining one or more selected from neodymium and scandium A membrane can be used.

[0321] Alternatively, indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, gallium Conductive oxides such as zinc oxide doped with ammonium can be used.

[0322] Alternatively, graphene or graphite can be used. The graphene-containing film can be For example, the graphene oxide film can be formed by reducing a film containing the graphene oxide. Examples of the method include a method of applying heat and a method of using a reducing agent.

[0323] Alternatively, a conductive polymer can be used.

[0324] 《Base material》 The substrate 610 has a heat resistance sufficient to withstand the manufacturing process and a thickness and shape that are applicable to the manufacturing equipment. There is no particular limitation as long as the substrate 6 has the required size and flexibility. 10, the sensing panel 600 can be in a folded or unfolded state. In addition, when the detection panel 600 is disposed on the side where the display panel 500 displays, A light-transmitting material is used for the base material 610 .

[0325] The substrate 610 may be made of an organic material, an inorganic material, or a composite material of an organic material and an inorganic material. can be done.

[0326] For example, inorganic materials such as glass, ceramics, or metals can be used for the substrate 610. do.

[0327] Specifically, alkali-free glass, soda-lime glass, potash glass, or crystal glass etc. can be used for the substrate 610.

[0328] Specifically, a metal oxide film, a metal nitride film, a metal oxynitride film, or the like is used for the substrate 610. For example, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, an alumina film, or the like can be formed on the substrate 6. It can be used for 10.

[0329] For example, organic materials such as resin, resin film, or plastic may be used for the substrate 610. can be done.

[0330] Specifically, polyester, polyolefin, polyamide, polyimide, polycarbonate A resin film or a resin plate such as polyethylene terephthalate or acrylic resin can be used as the substrate 610. Cut.

[0331] For example, a composite material in which a thin glass plate or a film of an inorganic material is bonded to a resin film or the like. The material can be used for the substrate 610.

[0332] For example, fibrous or particulate metal, glass, or inorganic material is dispersed in a resin film. A composite material such as this can be used for the substrate 610.

[0333] For example, a composite material in which fibrous or particulate resin or organic material is dispersed in an inorganic material It can be used for the substrate 610.

[0334] Also, a single layer material or a laminated material having multiple layers stacked together can be used for the substrate 610. For example, a laminated material in which a base material and an insulating layer that prevents the diffusion of impurities contained in the base material are laminated. can be used for the substrate 610.

[0335] Specifically, the glass and the silicon oxide film that prevents the diffusion of impurities contained in the glass, silicon nitride A laminated material in which one or more films selected from a silicon oxide nitride film, a silicon nitride film, etc. are laminated. , can be applied to the substrate 610.

[0336] Alternatively, a silicon oxide film, silicon nitride film, or other film that prevents the diffusion of impurities that penetrate the resin A laminated material in which a silicon oxynitride film or the like is laminated can be applied to the base material 610 .

[0337] Specifically, the substrate 610b has flexibility, the barrier film 610a prevents the diffusion of impurities, and A laminate of a base material 610b and a resin layer 610c that bonds the barrier film 610a can be used. This is possible (see Figure 15(A)).

[0338] <Flexible Printed Circuit Board> The flexible printed circuit board FPC1 supplies timing signals, power supply potential, etc., and detects (See Figure 14).

[0339] Display panel The display panel 500 includes pixels 502, scan lines, signal lines or a substrate 510.

[0340] A film for forming the display panel 500 is formed on the substrate 510, and the film is processed to form the display panel 500. A display panel 500 may be formed.

[0341] Alternatively, a part of the display panel 500 is formed on another substrate, and the part is transposed onto the substrate 510. , the display panel 500 may be formed.

[0342] 《Pixels》 The pixel 502 includes subpixels 502B, 502G, and 502R, each of which The sub-pixel comprises a display element and a pixel circuit for driving the display element.

[0343] 《Pixel circuit》 Active matrix type with active elements in pixels, or no active elements in pixels A passive matrix system can be used for the display panel 500 .

[0344] Various active elements (active elements, nonlinear elements) It can be used in the active matrix system as a transistor. , MIM (Metal Insulator Metal), or TFD (Thin Film These elements can be manufactured using fewer processes. Therefore, it is possible to reduce the manufacturing cost or improve the yield. The small size of the element allows for an improved aperture ratio, resulting in lower power consumption and higher brightness. It is possible to achieve this.

[0345] Use a passive matrix type that does not use active elements (active elements, non-linear elements) The manufacturing process is simplified because no active elements (active elements, non-linear elements) are used. This makes it possible to reduce manufacturing costs and improve yields. Since it does not use active elements (active elements, nonlinear elements), it can improve the aperture ratio. This allows for lower power consumption and higher brightness.

[0346] For example, the transistor 502t can be used in a pixel circuit (see FIG. 15A).

[0347] The display panel 500 includes an insulating film 521 that covers the transistor 502t.

[0348] A film thicker than the irregularities caused by the structure of the pixel circuit can be used for the insulating film 521. This makes it possible to flatten the unevenness caused by the pixel circuits.

[0349] A stacked film including a film that can suppress diffusion of impurities can be used as the insulating film 521. This makes it possible to prevent a decrease in reliability due to the diffusion of impurities in the transistor 502t, etc. do.

[0350] Display element Various display elements can be used for the display panel 500. For example, electrophoretic display elements Display using methods such as electronic liquid powder (registered trademark) and electrowetting methods display elements (also known as electronic ink), shutter-type MEMS display elements, and optical interference MEMS display elements, liquid crystal elements, etc. can be used.

[0351] Also, transmissive LCD displays, semi-transmissive LCD displays, reflective LCD displays, A display element that can be used for a direct-view liquid crystal display or the like can be used.

[0352] For example, organic electroluminescence elements that emit different colors of light are applied to each sub-pixel. That's fine.

[0353] For example, an organic electroluminescence element that emits white light can be used.

[0354] For example, the light emitting element 550R includes a lower electrode, an upper electrode, and a light emitting element between the lower electrode and the upper electrode. The layer includes an organic compound.

[0355] The subpixel 502R includes a light-emitting module 580R. R and a transistor 502t capable of supplying power to light emitting element 550R. The light emitting module 580R includes a light emitting element 550R and an optical element (e.g., For example, a colored layer (CFR) is provided.

[0356] In order to efficiently extract light of a specific wavelength, the light-emitting module 580R is equipped with a micro-resonator. Specifically, it can be arranged so that specific light can be extracted efficiently. The film contains a luminescent organic compound between a film that reflects visible light and a semi-reflective / semi-transparent film. Layers may be arranged.

[0357] The light emitting module 580R has a colored layer CFR in the direction in which light is extracted. Any material may be used as long as it transmits light having a certain wavelength. For example, a colored layer that selectively transmits red light may be used. CFR: A colored layer that selectively transmits green light CFG: A colored layer that selectively transmits blue light A colored layer that selectively transmits CFB or yellow light or the like can be used. The sub-pixels are arranged so as to overlap with the window portions where no colored layers are provided, and the colored layers are not transmitted. The light emitted by the light emitting element may be emitted.

[0358] The colored layer CFR is located so as to overlap the light emitting element 550R. A part of the emitted light passes through the colored layer CFR and travels to the light emitting module 58 in the direction of the arrow shown in the figure. It is ejected outside 0R.

[0359] A light-shielding layer BM is provided so as to surround the colored layer (for example, the colored layer CFR).

[0360] In addition, when the sealing material 560 is provided on the side from which light is extracted, the sealing material 560 50R may be in contact with the colored layer CFR.

[0361] The lower electrode is disposed on the insulating film 521. The partition wall 521 has an opening that overlaps the lower electrode. 28. A part of the partition wall 528 overlaps the edge of the lower electrode.

[0362] The lower electrode sandwiches a layer containing a light-emitting organic compound between the lower electrode and the upper electrode to form a light-emitting element (e.g., The pixel circuit supplies power to the light emitting element.

[0363] Furthermore, spacers for controlling the distance between the substrates 610 and 510 are provided on the partition wall 528 .

[0364] When realizing a semi-transmissive or reflective LCD display, the pixel voltage A part or all of the electrodes may be made to function as a reflective electrode. For example, A part or all of the pixel electrodes may be made of aluminum, silver, or the like.

[0365] It is also possible to provide a memory circuit such as an SRAM under the reflective electrode. Furthermore, it is possible to reduce power consumption. A variety of pixel circuits can be selected and used.

[0366] 《Base material》 A flexible material can be used for the substrate 510. For example, the substrate 610 can be The same materials that can be used for the substrate 510 can be applied.

[0367] In addition, when the base material 510 does not need to be transparent, it may be made of a colored material or a material that does not have the transparency. It is recommended to use materials that are suitable for the purpose, such as yellow colored resin, SUS, or aluminum. can.

[0368] For example, a flexible substrate 510b, a barrier film 510a that prevents the diffusion of impurities, and a substrate 510b and a resin layer 510c that bonds the barrier film 510a. can be suitably used for the base material 510 (see FIG. 15(A)).

[0369] <Sealing material> The encapsulant 560 bonds the substrate 610 to the substrate 510. For example, a refractive index greater than 1.1 A material having a high refractive index can be used for the sealing material 560. In this case, the sealing material 560 may also serve as a layer having an optical bonding function. A material with a refractive index greater than that of air, preferably a material with a refractive index of 1.1 or greater, more preferably The encapsulant 560 may be made of a material having a refractive index of 1.2 or greater.

[0370] The pixel circuit or the light emitting element (for example, the light emitting element 550R) is formed between the substrate 510 and the substrate 610. It's in between.

[0371] <<Drive circuit configuration>> The driving circuit 503g supplies a selection signal. For example, the driving circuit 503g supplies a selection signal to a scanning line (see FIG. 14). reference).

[0372] The display device may also include a driver circuit 503s, which supplies an image signal.

[0373] For example, a shift register, a flip-flop circuit, a combinational circuit, etc. are used as the driving circuit 503. g or the driver circuit 503s.

[0374] For example, a transistor 503t or a capacitor 503c can be used in the driver circuit 503s. Cut.

[0375] It should be noted that the transistors that can be formed on the same substrate as the pixel circuits in the same process are used as the driving circuits. It can be used on roads.

[0376] "wiring" The display panel 500 has wiring such as scanning lines, signal lines, and power lines. For example, a conductive film similar to that used in the detection panel 600 can be used. Materials can be used.

[0377] The display panel 500 includes wiring 511 through which signals can be supplied, and a terminal 519 511. Signals such as image signals and synchronization signals can be supplied. A flexible printed circuit board FPC2 is electrically connected to the terminal 519.

[0378] The flexible printed circuit board FPC2 is equipped with a printed wiring board (PWB). It is okay to use it.

[0379] Other Configurations For example, a ceramic coating layer or a hard coating layer can be used for the protective layer 670. Specifically, a layer containing aluminum oxide or a UV-cured resin layer can be used. This makes it possible to prevent scratches from occurring and protect the input / output device 500TP.

[0380] For example, a circular polarizer can be used for the anti-reflection layer 670p. 00TP can reduce the intensity of reflected external light.

[0381] <Modifications of Input / Output Devices> Various transistors can be applied to the sensing panel 600 or / and the display panel 500 .

[0382] FIG. 15(A) shows a configuration in which a bottom-gate transistor is applied to a display panel 500. and is illustrated in FIG. 15(B).

[0383] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is shown in FIG. The present invention can be applied to the transistors 502t and 503t.

[0384] For example, a semiconductor layer containing polycrystalline silicon crystallized by a process such as laser annealing. is applied to the transistor 502t and the transistor 503t shown in FIG. It is possible.

[0385] A configuration in which a top-gate type transistor is applied to a display panel 500 is shown in FIG. 15(C ) is illustrated.

[0386] For example, polycrystalline silicon or a single crystal silicon film transferred from a single crystal silicon substrate, etc. The semiconductor layer including the transistor 502t and the transistor 502t shown in FIG. Can be applied to 03t.

[0387] <Example 2 of input / output device configuration> The configuration of an input / output device 500TP(1) of one embodiment of the present invention will be described with reference to FIG. Reveal.

[0388] The input / output device 500TP(1) has a surface of the detection panel 600 which is the first surface 1 and a The surface of the display panel 500 is the second surface 2 facing the first surface 1, and the surface of the display panel 500 is the second surface 2 facing the first surface 1. A neutral surface 5A is formed in the region at the point, and at least a portion of the first surface 1 is formed in the region from the first surface 1 to the neutral surface 5A. The functional layer 3 on which a part is disposed and the support supporting the functional layer 3 (substrate 510 and substrate 610) ) and.

[0389] The functional layer 3 including the subpixel 502R is provided between the neutral surface 5A and the first surface 1. It is being done.

[0390] For example, a material having a higher stiffness than that of the substrate 610b is used for the substrate 510b. This allows the neutral plane 5A to be closer to the base material 510b. A functional layer 3 including 2R can be provided between the neutral plane 5A and the first surface 1.

[0391] <Configuration example 3 of input / output device> The configuration of an input / output device 500TP(2) of one embodiment of the present invention will be described with reference to FIG. Reveal.

[0392] The input / output device 500TP(2) has a first region 7A that overlaps a part of the functional layer 3, and a first region The support has a second region 7B adjacent to the first region 7A. The substrate 510d and the functional layer 3 are connected to the second surface 2 of the second region 7B. The substrate 510b is provided in the region up to the functional layer 3, and the substrate 510d has a rigidity greater than that of the substrate 510b. It has higher rigidity.

[0393] <Example 4 of input / output device configuration> The configuration of an input / output device 500TP(3) of one embodiment of the present invention will be described with reference to FIG. Reveal.

[0394] The input / output device 500TP(3) has a first surface 1, a second surface 2 opposite to the first surface 1, and a third surface 3. A central surface 5C is located in the center of the area from the first surface 1 to the second surface 2, and a central surface 5B is located in the area from the first surface 1 to the center a functional layer 3 at least part of which is disposed in the region up to the surface 5C; and a support body supporting the functional layer 3. (substrate 510 and substrate 610).

[0395] The functional layer 3 including the subpixel 502R is provided between the central surface 5C and the first surface 1. It is being done.

[0396] The portion in the region from the first surface 1 to the central surface 5C is the same as the portion in the region from the second surface 2 to the central surface 5C. It has a stiffness approximately equal to that of the part in the region at

[0397] <Configuration example 5 of input / output device> The configuration of an input / output device 500TP(4) according to one embodiment of the present invention will be described with reference to FIG. Reveal.

[0398] The input / output device 500TP(4) has a first region 7A that overlaps a part of the functional layer 3, and a first region The support has a second region 7B adjacent to the first region 7A. The substrate 510d and the functional layer 3 are connected to the second surface 2 of the second region 7B. The substrate 510b is provided in the region up to the active layer 3, and the substrate 510d has a thickness greater than that of the substrate 510b. Thick.

[0399] <Example 6 of I / O device configuration> Electrodes that can be used in the detection panel 600 of the input / output device 500TP of one embodiment of the present invention The configuration will be described with reference to FIGS. 18 to 21. Specifically, the first electrode C1 ( i) or the configuration of an electrode that can be used for the second electrode C2(j) will be described.

[0400] 18(A) shows a schematic top view of the detection panel 1010. The detection panel 1010 is made of a substrate On 1030, a plurality of electrodes 1031, a plurality of electrodes 1032, a plurality of wirings 1041, a plurality of wirings The substrate 1030 also has a plurality of wirings 1041 and a plurality of wirings 1042. 2 and each electrically connected FPC (Flexible Printed Circuit) 18(A), the FPC 1050 is provided with an IC 105 1 is provided as an example.

[0401] 18(B) shows an enlarged view of the area surrounded by the dashed line in FIG. 18(A). The electrode pattern has a shape in which multiple diamond-shaped electrode patterns are lined up in the horizontal direction of the paper. The diamond-shaped electrode patterns are electrically connected to each other. , a plurality of diamond-shaped electrode patterns are arranged in a row in the vertical direction of the paper, and the diamond-shaped The electrode patterns are electrically connected to each other. At this intersection, the electrode 1031 and the electrode An insulator is sandwiched between the terminal 1032 to prevent an electrical short circuit.

[0402] As shown in FIG. 18(C), the electrode 1032 is formed by a plurality of diamond-shaped electrodes 1033. and a bridge electrode 1034. The electrode 1033 is arranged in the vertical direction of the drawing. The two adjacent electrodes 1033 are electrically connected by a bridge electrode 1034. By adopting such a configuration, the electrode 1033 and the electrode 1031 are connected to the same The conductive film can be processed and formed at the same time. This can suppress the variation in the resistance value and light transmittance of each electrode depending on the location. In this example, the electrode 1032 is configured to have a bridge electrode 1034. However, the electrode 1031 may have such a configuration.

[0403] As shown in FIG. 18(D), the diamond-shaped electrodes 1031 and 1032 shown in FIG. 18(B) The inside of the electrode pattern may be hollowed out, leaving only the outline. In this case, when the width of the electrodes 1031 and 1032 is thin enough not to be visible to the user, As will be described later, the electrodes 1031 and 1032 are made of a light-shielding material such as a metal or alloy. In addition, the electrode 1031 or the electrode 1032 shown in FIG. 18(D) may be used. A configuration having a ridge electrode 1034 may also be used.

[0404] One electrode 1031 is electrically connected to one wiring 1041. 1032 is electrically connected to one wiring 1042. 032 corresponds to a row wiring, and the other corresponds to a column wiring.

[0405] The signal output from IC 1051 is transmitted to electrode 1 via wiring 1041 or wiring 1042. Electrode 1031 or electrode 1032. 2 through the wiring 1041 or the wiring 1042. Input to IC1051.

[0406] Here, when the detection panel 1010 is placed on the display surface of the display panel to form a touch panel, In this case, it is preferable to use a light-transmitting conductive material for the electrodes 1031 and 1032. In addition, the electrodes 1031 and 1032 are formed using a light-transmitting conductive material, and the electrodes 1031 and 1032 are formed using a light-transmitting conductive material. When light from the electrode 1031 or the electrode 1032 is extracted, the electrode 1031 and the electrode A conductive film containing the same conductive material is disposed as a dummy pattern between the electrode 1032 and the In this way, it is preferable to fill a part of the gap between the electrode 1031 and the electrode 1032 with a dummy pad. By filling the gap with turns, the variation in light transmittance can be reduced. This can reduce uneven brightness of light passing through the filter 1010.

[0407] Examples of the conductive material having light-transmitting properties include indium oxide, indium tin oxide, and indium Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide doped with gallium can be used. It is also possible to use a film containing graphene. The film containing graphene can be, for example, For example, the graphene oxide film can be formed by reducing a film containing the graphene oxide. As a method for this, a method of applying heat can be mentioned.

[0408] Alternatively, a metal or alloy thin enough to have light transmission properties can be used. For example, gold, Silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt Metals such as copper, palladium, or titanium, or alloys containing such metals can be used. Alternatively, nitrides of the metals or alloys (for example, titanium nitride) may be used. A laminated film in which two or more conductive films containing the above-mentioned materials are laminated may also be used.

[0409] In addition, the electrodes 1031 and 1032 are thin enough to be invisible to the user. For example, such a conductive film may be processed into a lattice (mesh) shape. By doing so, high conductivity and high visibility of the display device can be obtained. 0 nm or more and 100 μm or less, preferably 50 nm or more and 50 μm or less, more preferably 50 It is preferable that the width of the part is 10 μm or less. A conductive film having a turn width is preferable because it is extremely difficult for a user to visually recognize the conductive film.

[0410] As an example, FIGS. 19A to 19D show enlarged views of a portion of the electrode 1031 or the electrode 1032. FIG. 19(A) shows an example in which a lattice-shaped conductive film 1061 is used. At this time, the conductive film 1061 is arranged so as not to overlap with a display element of the display device. This is preferable because it does not block the light from the display device. The direction of the grid is the same as the arrangement of the display elements, and the period of the grid is an integer number of the period of the arrangement of the display elements. Preferably, it is doubled.

[0411] Also, in FIG. 19(B), a lattice-shaped conductive film 1 is processed so that triangular openings are formed. 19(A) shows an example of 062. By adopting such a configuration, Therefore, it is possible to reduce the overall resistance.

[0412] Also, as shown in FIG. 19(C), a conductive film 106 having a pattern shape without periodicity 3. With this configuration, when the display unit of the display device is overlapped, moire is prevented. This can prevent the following from occurring.

[0413] Alternatively, conductive nanowires may be used for the electrodes 1031 and 1032. D) shows an example in which a nanowire 1064 is used. By distributing them at an appropriate density so that 64 contact each other, a two-dimensional network is created. For example, the average diameter of The average value is 1 nm or more and 100 nm or less, preferably 5 nm or more and 50 nm or less, and more preferably Nanowires of 5 nm or more and 25 nm or less can be used. is a metal nanowire such as Ag nanowire, Cu nanowire, or Al nanowire, or Carbon nanotubes can be used. For example, Ag nanowires have high optical transparency. The efficiency can be 89% or more, and the sheet resistance can be 40 to 100 Ω / □.

[0414] In FIG. 18A and the like, the top surfaces of the electrodes 1031 and 1032 are formed of a plurality of diamonds. Although an example in which the electrodes 1031 and 1032 are connected in the same direction is shown, the shape of the electrodes 1031 and 1032 may be However, various top surfaces such as a strip (rectangular), a curved strip, a zigzag shape, etc. may be used. In the above example, the electrodes 1031 and 1032 are perpendicular to each other. Although shown as being arranged perpendicular to the The angle between the two electrodes may be less than 90 degrees.

[0415] In FIGS. 20A to 20C, instead of the electrodes 1031 and 1032, thin wire-shaped electrodes are used. 20(A) shows an example in which electrodes 1036 and 1037 having a shape are used. In the example shown in FIG. 1, linear electrodes 1036 and 1037 are arranged in a grid pattern. This shows:

[0416] In addition, in FIG. 20B, the electrode 1036 and the electrode 1037 have a zigzag top surface. In this case, as shown in FIG. 20(B), By arranging the electrodes with a relative offset rather than overlapping the centers, the electrodes 1036 and 1037 are The length of the portion where the electrodes 037 face each other in parallel can be increased, and the mutual capacitance between the electrodes is increased. This is preferable because it improves the detection sensitivity. The upper surface shape of the electrode 6 and the electrode 1037 is a shape in which a part of the straight line part of the zigzag shape protrudes. Then, even if the center positions of the straight line portions are arranged to overlap, the length of the opposing portions can be increased. This allows the mutual capacitance between the electrodes to be increased.

[0417] Enlarged views of the area enclosed by the dashed line in Figure 20(B) are shown in Figures 21(A), 21(B), and 21(C), and Figure 20 Enlarged views of the areas enclosed by the dashed line in (C) are shown in Figures 21(D), (E), and (F), respectively. Each figure also shows an electrode 1036, an electrode 1037, and an intersection 1038 where these intersect. As shown in FIGS. 21(B) and 21(E), the electrode 10 in FIGS. 21(A) and 21(D) The straight portions of the electrodes 36 and 1037 may have a meandering shape with corners. As shown in Fig. 21(C) and (F), the shape may be a meandering shape with continuous curves. stomach.

[0418] <Example 7 of input / output device configuration> A configuration that can be used for the detection panel 600 of the input / output device 500TP of one embodiment of the present invention. 22 and 23, the following will be described. Specifically, instead of the light emitting element, a liquid crystal The configuration of an in-cell type touch panel using an element as a display element will be described.

[0419] FIG. 22(A) shows a part of a pixel circuit provided in the display unit of the touch panel exemplified in this configuration example. FIG.

[0420] One pixel has at least a transistor 2503 and a liquid crystal element 2504. The gate of the transistor 2503 is connected to a wiring 2501, and the source or drain is connected to a wiring 250 2 are electrically connected to each other.

[0421] The pixel circuit includes a plurality of wirings (for example, wiring 2510_1, wiring 2510_ 2) and a plurality of wirings (for example, wiring 2511) extending in the Y direction, which are mutually The electrodes are arranged to intersect with each other, forming a capacitance therebetween.

[0422] In addition, among the pixels provided in the pixel circuit, some adjacent pixels are provided with The electrodes of the liquid crystal elements are electrically connected to each other to form one block. The blocks are divided into island blocks (e.g., block 2515_1, block 2515_2) and Linear blocks extending in the Y direction (e.g., block 2516) are classified into two types. Although FIG. 22 shows only a part of the pixel circuit, these two types of The blocks are arranged repeatedly in the X and Y directions.

[0423] The wiring 2510_1 (or 2510_2) extending in the X direction is arranged in an island-shaped block 2515 _1 (or block 2515_2). The wiring 2510_1 extending in the X direction is discontinuously arranged along the X direction via a linear block. The island-shaped blocks 2515_1 are electrically connected to each other. The wiring 2511 is electrically connected to a linear block 2516 .

[0424] FIG. 22B shows a plurality of wirings 2510 extending in the X direction and a plurality of wirings 2510 extending in the Y direction. 2510. The wiring 2510 extends in the X direction. An input voltage or a common potential can be input to the wiring 25 extending in the Y direction. A ground potential is input to each of the wirings 2511, or the wiring 2511 is electrically connected to the detection circuit. It is possible.

[0425] The operation of the above-mentioned touch panel will be described below with reference to FIGS.

[0426] Here, one frame period is divided into a writing period and a detection period. This is the period in which the image data is written, and the wiring 2510 (also called the gate line) is selected in order. On the other hand, the detection period is the period during which sensing is performed by the touch sensor, and the X direction The wiring 2510 extending from the input terminal 2510 is selected in sequence, and an input voltage is input.

[0427] 23A is an equivalent circuit diagram during the writing period. A common potential is input to both the wiring 2510 extending in the Y direction and the wiring 2511 extending in the Y direction. do.

[0428] 23B is an equivalent circuit diagram at a certain point in the detection period. Each of the wirings 2511 extending in the X direction is electrically connected to a detection circuit. Of the wirings 2510, the input voltage is input to the selected one, and the other ones are common. A conducting potential is input.

[0429] In this way, the image writing period and the period for sensing by the touch sensor are separated. This prevents noise caused by touch sensitivity when writing to pixels. This can suppress the decrease in sensitivity of the sensor.

[0430] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. .

[0431] (Embodiment 7) In this embodiment, a configuration of a data processing device of one embodiment of the present invention will be described with reference to FIG. We will explain.

[0432] FIG. 16 illustrates an information processing device according to one embodiment of the present invention.

[0433] 16A-1 to 16A-3 are projection views of a data processing device of one embodiment of the present invention. do.

[0434] 16(B-1) and 16(B-2) are projection views of a data processing device of one embodiment of the present invention. be.

[0435] 16(C-1) and 16(C-2) are top views and diagrams of a data processing device of one embodiment of the present invention. and bottom view.

[0436] <<Information processing device A>> The information processing device 3000A includes an input / output unit 3120 and a housing 3 supporting the input / output unit 3120. 101 (see FIGS. 16(A-1) to 16(A-3)).

[0437] The information processing device 3000A also includes a processor and a program for causing the processor to execute the program. The device is equipped with a power source such as a battery that supplies power to drive the memory unit and the calculation unit.

[0438] The housing 3101 houses a computing unit, a storage unit, a battery, and the like.

[0439] The information processing device 3000A can display information on the side and / or top surface. .

[0440] The user of the information processing device 3000A issues operation commands using fingers in contact with the side and / or top surface. Orders can be provided.

[0441] <<Information processing device B>> The information processing device 3000B includes an input / output unit 3120 and an input / output unit 3120b (see FIG. 1 6(B-1) and Fig. 16(B-2)).

[0442] The information processing device 3000B includes a housing 3101 that supports an input / output unit 3120 and a flexible The belt-shaped housing 3101b has:

[0443] The information processing device 3000B also has a housing 3101 that supports an input / output unit 3120b.

[0444] The information processing device 3000B also includes a processor and a program for causing the processor to execute the program. The device is equipped with a power source such as a battery that supplies power to drive the memory unit and the calculation unit.

[0445] The housing 3101 houses a computing unit, a storage unit, a battery, and the like.

[0446] The information processing device 3000B is made up of a housing 3101 and a flexible belt-like housing 3101b. Display information can be displayed on the supported input / output unit 3120.

[0447] The user of the information processing device 3000B provides an operation command using a finger in contact with the input / output unit 3120. can be provided.

[0448] <<Information processing device C>> The information processing device 3000C includes an input / output unit 3120 and a housing that supports the input / output unit 3120. 3101 and a housing 3101b (see FIG. 16(C-1) and FIG. 16(C-2) ).

[0449] The input / output unit 3120 and the housing 3101b are flexible.

[0450] The information processing device 3000C also stores a calculation unit and a program to be executed by the calculation unit. The device is equipped with a power source such as a battery that supplies power to drive the memory unit and the calculation unit.

[0451] The housing 3101 houses a computing unit, a storage unit, a battery, and the like.

[0452] The information processing device 3000C can be folded in two at the housing 3101b.

[0453] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. . [Example]

[0454] In this example, the structure of a manufactured functional panel and device according to one embodiment of the present invention and the functional panel The characteristics of the filter will be described with reference to FIG.

[0455] FIG. 17 is a diagram illustrating the configuration of a functional panel and a device according to one embodiment of the present invention.

[0456] FIG. 17(A) is a projection view that schematically explains the configuration of the device 200C.

[0457] FIG. 17(B) is a cross-sectional view illustrating the structure of the manufactured functional panel 100(1).

[0458] FIG. 17(C) is a cross-sectional view illustrating the structure of the manufactured functional panel 100(2).

[0459] FIG. 17(D) is a cross-sectional view illustrating the structure of the manufactured functional panel 100(3).

[0460] The functional panel thus produced includes a first surface 1, a second surface 2, a central surface 5C, a functional layer 3, and a support. The functional panel is fixed to the framework 210C. 0C can bend the functional panel so that the first surface 1 is on the inside.

[0461] The second surface 2 faces the first surface 1, and the central surface 5C is the area from the first surface 1 to the second surface 2. Located in the center of the area.

[0462] The functional layer 3 has a thickness of 20 μm. The functional layer 3 was arranged so that a portion having a thickness equal to or greater than half the thickness of the functional layer 3 was arranged.

[0463] The functional layer 3 is made up of two functional layers that prevent the diffusion of impurities and a matrix between the two functional layers. a layer including a plurality of pixels arranged in a square shape, and a bonding layer that bonds the two functional layers together; The bonding layer was made of epoxy resin.

[0464] The pixel is made up of a colored layer, a light-emitting element overlapping the colored layer, and an epoxy resin that bonds the colored layer and the light-emitting element. The display panel is provided with a white resin and a pixel circuit for driving the light-emitting element. An organic EL element that emits light is used as the light-emitting element, and a colored layer is disposed between the second surface 2 and the light-emitting element. Placed.

[0465] The support includes a member 4A, a member 4B, and a member 4E for bonding the members 4A and 4B together. A part of the surface of the member 4A is included in the first surface 1, and a part of the surface of the member 4B is included in the second surface 1. The member 4E is included in the surface 2 of the member 4A. The member 4E supports the functional layer 3 between the member 4A and the member 4B. In addition, aromatic condensed polymer films formed using a biaxial stretching method are used as members 4A and 4B. A mortar and a resin were used for member 4B, and an epoxy resin was used for member 4E.

[0466] The fabricated functional panel was repeatedly bent to evaluate its reliability. In practice, the radius of curvature is controlled so as not to fall below a predetermined value, and bending and unfolding are controlled by the first surface. Repeated 100,000 times with 1 inside. After that, display the image on the function panel and The image quality was evaluated. For example, defects such as line defects on the display and dark spots were evaluated. The evaluation was carried out to see whether defects such as circular areas of low brightness occurred.

[0467] In addition, the functional panel was bent 100,000 times and stored in a specified environment for a specified period. The reliability of the functional panel was evaluated. Specifically, it was tested for 1000 times under an environment of 65°C and 95% humidity. The images were then displayed on the functional panel after saving, and the quality of the displayed images was evaluated.

[0468] The functional panels 100(1), 100(2), and 100(3) were fabricated. ) configuration, the radius of curvature used in the bending test, and the display quality after the bending test and storage test were evaluated. The results are shown in the table. Specifically, for all functional panels, the area from the center surface 5C to the first surface The functional layer 3 has a configuration in which a portion occupying more than half of the thickness of the functional layer 3 is arranged between the first and second layers.

[0469] [Table 1]

[0470] All functional panels were tested to 100,000 degrees Celsius with a good curvature radius of less than 5 mm without any defects. The display quality after the bending test was good. The display quality after the storage test conducted after the bending test was also good.

[0471] In addition, functional panels that have been repeatedly bent 100,000 times were subjected to high temperature and humidity conditions. The results of displaying the images after storing them under the same conditions are shown in the table. No deterioration in display quality was observed during storage.

[0472] This embodiment can be appropriately combined with other embodiment modes shown in this specification.

[0473] For example, in this specification, when it is explicitly stated that X and Y are connected, In this case, X and Y are electrically connected, and X and Y are functionally connected. The case where X and Y are directly connected is also considered to be disclosed in this specification. Therefore, the present invention is not limited to the predetermined connection relationships, for example, the connection relationships shown in the drawings or text. Connections other than those shown in the drawings or text are also treated as if they were described in the drawings or text. do.

[0474] Here, X and Y are the object (for example, a device, an element, a circuit, a wiring, an electrode, a terminal, a conductive film, a layer, etc.). , etc.).

[0475] An example of a direct connection between X and Y is a circuit that allows electrical connection between X and Y. The elements to be considered (e.g., switches, transistors, capacitance elements, inductors, resistance elements, When no external device (such as a diode, display element, light-emitting element, or load) is connected between X and Y, The elements that allow electrical connection between X and Y (e.g., switches, transistors, capacitors) elements, inductors, resistors, diodes, display elements, light-emitting elements, loads, etc.) , X and Y are connected.

[0476] An example of an electrical connection between X and Y is The elements to be considered (e.g., switches, transistors, capacitance elements, inductors, resistance elements, One or more devices (such as diodes, display elements, light-emitting elements, and loads) can be connected between X and Y. It is possible. The switch has a function to control on / off. A switch can be in a conducting state (ON state) or a non-conducting state (OFF state), allowing current to flow. The switch has the function of controlling whether or not the current flows. When X and Y are electrically connected, This includes the case where Y is directly connected.

[0477] An example of a functional connection between X and Y is a function that allows the functional connection between X and Y. Circuits that perform the above functions (for example, logic circuits (inverters, NAND circuits, NOR circuits, etc.), signal conversion conversion circuits (DA conversion circuits, AD conversion circuits, gamma correction circuits, etc.), potential level conversion circuits (voltage power supply circuits (voltage boost circuits, voltage drop circuits, etc.), level shifter circuits that change the signal potential level, etc.) , voltage source, current source, switching circuit, amplifier circuit (which can increase the signal amplitude or current amount, etc.) circuits, operational amplifiers, differential amplifier circuits, source follower circuits, buffer circuits, etc.), signal generation One or more circuits (e.g., memory circuits, control circuits, etc.) can be connected between X and Y. For example, even if another circuit is inserted between X and Y, the signal output from X If X is transmitted to Y, then X and Y are considered to be functionally connected. When X and Y are functionally connected, there is a direct connection between X and Y and a direct connection between X and Y. This also includes the case where the and are electrically connected.

[0478] In addition, if it is explicitly stated that X and Y are electrically connected, are electrically connected (i.e., there is another element or circuit between X and Y) X and Y are functionally connected (i.e., X and Y are functionally connected) and (When there is a functional connection between them via another circuit) and when X and Y are directly connected (i.e., when X and Y are connected without any other element or circuit between them) is considered to be disclosed in the present specification. If it is explicitly stated that it is connected, The same content is considered to be disclosed in the present specification.

[0479] For example, if the source (or first terminal, etc.) of the transistor is connected via Z1 (or (not shown), electrically connected to X, and the drain (or second terminal, etc.) of the transistor is connected to Z 2 (or not), and is electrically connected to Y, or the source of the transistor (or the first terminal, etc.) is directly connected to a part of Z1, and another part of Z1 is directly connected to X. The drain (or second terminal, etc.) of the transistor is directly connected to a part of Z2. and another part of Z2 is directly connected to Y, It is possible to do so.

[0480] For example, "X and Y and the source (or first terminal, etc.) and drain (or second terminal, etc.) of a transistor" The terminals of the transistor (or the first terminal) are electrically connected to each other. 1 terminal, etc.), the drain of the transistor (or the second terminal, etc.), and Y. It can be expressed as "connected to the source (or the first The first terminal of the transistor is electrically connected to X, and the drain of the transistor is electrically connected to the second terminal of the transistor. The transistor source (or first terminal, etc.) is electrically connected to Y, and the transistor source (or first terminal, etc.) is electrically connected to X. The drain (or second terminal, etc.) of the transistor, Y, is electrically connected in this order. " Alternatively, "X is the source (or first terminal, etc.) of the transistor. and the drain (or second terminal, etc.) are electrically connected to Y, and X, the source (or first terminal, etc.) of a transistor, the drain (or second terminal, etc.) of a transistor ), Y is provided in this order of connection. By specifying the order of connections in the circuit configuration using a simple expression method, Distinguish between the source (or first terminal, etc.) and the drain (or second terminal, etc.) of a transistor. The technical scope can be determined by the above.

[0481] Alternatively, for example, "the source (or first terminal, etc.) of a transistor" is electrically connected to X through at least a first connection path, and the first connection path is , and the second connection path is a transistor through a transistor. The source (or first terminal, etc.) of the transistor and the drain (or second terminal, etc.) of the transistor The first connection path is a path via Z1, and the second connection path is a path between the first and second transistors. The drain (or second terminal, etc.) of the capacitor is electrically connected to Y through at least a third connection path. the third connection path does not have the second connection path, and the third connection path The connection path is the path via Z2. The source (or first terminal, etc.) of the resistor is connected to the resistor via Z1 by at least the first connection path. and electrically connected to X, and the first connection path does not have a second connection path; The second connection path has a connection path through a transistor, and (or the second terminal, etc.) is connected to Y via Z2 by at least a third connection path. The third connection path does not have the second connection path. Alternatively, the source (or first terminal, etc.) of the transistor may be at least The first electrical path is electrically connected to X through Z1. The primary path does not have a second electrical path, and the second electrical path is a From the source (or first terminal, etc.) to the drain (or second terminal, etc.) of the transistor The drain (or second terminal, etc.) of the transistor is connected to at least a third The third electrical path is electrically connected to Y through Z2. , does not have a fourth electrical path, and the fourth electrical path is (or second terminal, etc.) to the source (or first terminal, etc.) of the transistor. Using the same expression as these examples, the circuit configuration By defining the connection path in Distinguishing between the first terminal (or the second terminal, etc.) and the drain (or the second terminal, etc.) to determine the technical scope. can be done.

[0482] These representation methods are merely examples, and the present invention is not limited to these representation methods. , Y, Z1, Z2 are objects (e.g., devices, elements, circuits, wiring, electrodes, terminals, conductive films, layer, etc.).

[0483] In addition, the circuit diagram shows independent components as if they are electrically connected to each other. Even if the components are different, one component may have the functions of multiple components. For example, when a part of the wiring also functions as an electrode, one conductive film functions as both the wiring and the electrode. Therefore, the electrode in this specification has the functions of both components. The term "electromagnetic connection" refers to a case where one conductive film has the functions of multiple components. This also falls within the scope of the above. [Explanation of symbols]

[0484] F1 board F2 release layer F3 Peeling layer F3b conductive layer F3s starting point FPC1 Flexible Printed Circuit Board FPC2 flexible printed circuit board S1 board S2 release layer S3 Peeling layer S5 base material T terminal 1 page 2 sides 3 Functional Layer 3A part 4 Support 4A Materials 4B Materials 4C Materials 4D parts 4E materials 5A Neutral plane 5B Neutral plane 5C central plane 5D midplane 7A area 7B area 9A Display element 9B Detector element 30 Bonding layer 31 Adhesive layer 32 Adhesive layer 41 Support 41b Support 42 Support 42b Support 48 Mask 49 Solvents 80 processed parts 80a remainder 80b surface layer 81 Laminate 90 processed parts 90a remainder 90b Surface layer 91 Laminate 91a remainder 91s starting point 92 Laminate 92c laminate 92d laminate 99 nozzles 100A Function Panel 100A2 Function Panel 100B Function Panel 100C Function Panel 100D Function Panel 100(1) Function Panel 100(2) Function Panel 100(3) Function Panel 200A device 200B equipment 200C equipment 210A Framework 210B Framework 210C Framework 211 Guide section 212 Guide section 213 Hinge part 213B Hinge part 213P Parts 213PB parts 213S Rotating shaft 500 display panel 500TP I / O device 502 pixels 502B subpixel 502G subpixel 502R subpixel 502t transistor 503c capacity 503g drive circuit 503s drive circuit 503t transistor 510 Base material 510a Barrier film 510b base material 510c resin layer 510d base material 511 Wiring 519 terminal 521 Insulating film 528 Bulkhead 550R light emitting element 560 Encapsulating material 580R Light Emitting Module 600 detection panel 610 Base material 610a Barrier film 610b base material 610c resin layer 667 Opening 670 protective layer 670p anti-reflection layer 1010 Detection Panel 1030 board 1031 Electrode 1032 electrode 1033 Electrode 1034 Bridge electrode 1036 Electrode 1037 Electrode 1038 Intersection 1041 Wiring 1042 Wiring 1050 FPC 1051 IC 1061 Conductive film 1062 Conductive film 1063 Conductive film 1064 nanowires 2501 Wiring 2502 Wiring 2503 Transistor 2504 Liquid crystal element 2510 Wiring 2510_1 Wiring 2510_2 Wiring 2511 Wiring 2515_1 Block 2515_2 Block 2516 blocks 3000A Information Processing Device 3000B Information Processing Equipment 3000C Information Processing Device 3101 Housing 3101b housing 3120 Input / output section 3120b input / output section

Claims

[Claim 1] a first region, a second region, a first member, and a second member; the first region overlaps the portion of the functional layer; the second region is adjacent to the first region; the support comprises a first member and a second member; the first member is disposed in a region from the second surface of the first region to the functional layer, the second member is disposed in a region from the second surface of the second region to the functional layer, The functional panel according to claim 1 , wherein the first member has a stiffness higher than that of the second member.

Images