Movable device, image projection device, head-up display, laser headlamp, head-mounted display, object recognition device, and mobile body

Abstract

To provide a movable device which offers larger displacement and improved displacement stability.SOLUTION: A movable device is provided, comprising a movable part, a drive beam having one end connected directly or indirectly to the movable part to drive the movable part, and a fixed frame connected to the other end of the drive beam. The drive beam is made up of a plurality of drive beams, each having a drive unit. The drive beam comprises an upper drive beam and a lower drive beam spaced apart from the upper drive beam in the normal direction of the fixed frame.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a movable device, an image projection device, a head-up display, a laser headlamp, a head-mounted display, an object recognition device, and a moving body. [Background technology]

[0002] 2. Description of the Related Art Movable devices such as MEMS (Micro Electro Mechanical Systems) devices manufactured by microfabricating silicon or glass are known.

[0003] For example, Patent Document 1 discloses a displacement control actuator having a piezoelectric element in which the first principal surfaces of at least two piezoelectric substrates having first and second principal surfaces are directly bonded to each other in order to obtain a large displacement amount. Summary of the Invention [Problem to be solved by the invention]

[0004] However, in a movable device such as the displacement control actuator described in Patent Document 1, the rigidity of the deforming part is reduced in order to obtain a large amount of displacement. However, there is room for improvement in that the low rigidity of the deforming part reduces operational stability.

[0005] An object of the present invention is to provide a movable device that can obtain a large amount of displacement while improving the displacement stability. [Means for solving the problem]

[0006] A movable device according to one aspect of the present invention comprises a movable part, a drive beam having one end connected directly or indirectly to the movable part and driving the movable part, and a fixed frame to which the other end of the drive beam is connected, wherein the drive beams are a plurality of drive beams each having a drive part, and the drive beams include an upper drive beam and a lower drive beam arranged spaced apart from the upper drive beam in a normal direction of the fixed frame. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a movable device that can obtain a large amount of displacement while improving the displacement stability. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic top view showing a movable device according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 2 is a schematic cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 2 is a schematic bottom view showing the movable device according to the first embodiment of the present invention. [Figure 5] FIG. 2 is a schematic cross-sectional view taken along line VV in FIG. [Figure 6] FIG. 4 is a first schematic perspective view showing a state in which a movable section is swung by a second upper drive section in the movable device according to the first embodiment of the present invention. [Figure 7] FIG. 10 is a second schematic perspective view showing how the movable section is swung by the second upper drive section in the movable device according to the first embodiment of the present invention. [Figure 8] FIG. 10 is a third schematic perspective view showing a state in which the movable section is swung by the second upper drive section in the movable device according to the first embodiment of the present invention. [Figure 9] FIG. 10 is a fourth schematic perspective view showing a state in which the movable section is swung by the second upper drive section in the movable device according to the first embodiment of the present invention. [Figure 10] FIG. 3 is a first diagram showing waveforms of driving voltages applied to a group of driving parts of the movable device according to the first embodiment of the present invention. [Figure 11] FIG. 4 is a second diagram showing waveforms of drive voltages applied to the drive unit group of the movable device according to the first embodiment of the present invention. [Figure 12] 12 is a diagram in which the waveform of the driving voltage in FIG. 10 and the waveform of the driving voltage in FIG. 11 are superimposed. [Figure 13] FIG. 10 is a schematic top view showing a movable device according to a second embodiment of the present invention. [Figure 14] 14 is a schematic cross-sectional view taken along line XIV-XIV in FIG. 13. [Figure 15] 14 is a schematic cross-sectional view taken along line XV-XV in FIG. 13. [Figure 16] FIG. 10 is a schematic bottom view showing a movable device according to a second embodiment of the present invention. [Figure 17] 14 is a schematic cross-sectional view taken along line XVII-XVII in FIG. 13. [Figure 18] FIG. 10 is a schematic top view showing a movable device according to a third embodiment of the present invention. [Figure 19] 21 is a schematic top view taken along line XIX-XXV in FIG. 20. [Figure 20] FIG. 19 is a schematic cross-sectional view taken along line XX-XX in FIG. 18. [Figure 21] FIG. 19 is a schematic cross-sectional view taken along line XXI-XXI in FIG. 18. [Figure 22] FIG. 10 is a schematic bottom view showing a movable device according to a third embodiment of the present invention. [Figure 23] FIG. 19 is a schematic cross-sectional view taken along line XXIII-XXIII in FIG. 18. [Figure 24] FIG. 10 is a schematic top view showing a movable device according to a fourth embodiment of the present invention. [Figure 25] FIG. 25 is a schematic cross-sectional view taken along line XXV-XXV in FIG. 24. [Figure 26] FIG. 26 is a schematic cross-sectional view taken along line XXVI-XXVI in FIG. 24. [Figure 27] FIG. 10 is a schematic bottom view showing a movable device according to a fourth embodiment of the present invention. [Figure 28] FIG. 25 is a schematic cross-sectional view taken along line XXVIII-XXVIII in FIG. 24. [Figure 29] FIG. 10 is a schematic top view showing a movable device according to a fifth embodiment of the present invention. [Figure 30] FIG. 30 is a schematic cross-sectional view taken along the line XXX-XXX in FIG. 29. [Figure 31] FIG. 31 is a schematic cross-sectional view taken along line XXXI-XXXI in FIG. 29. [Figure 32]FIG. 13 is a schematic bottom view showing a movable device according to a fifth embodiment of the present invention. [Figure 33] FIG. 30 is a schematic cross-sectional view taken along line XXXIII-XXXIII in FIG. 29. [Figure 34] FIG. 10 is a schematic top view showing a movable device according to a sixth embodiment of the present invention. [Figure 35] FIG. 35 is a schematic cross-sectional view taken along line XXXV-XXXV in FIG. 34. [Figure 36] 36 is a schematic cross-sectional view taken along line XXXVI-XXXVI in FIG. 34. [Figure 37] FIG. 13 is a schematic bottom view showing a movable device according to a sixth embodiment of the present invention. [Figure 38] FIG. 35 is a schematic cross-sectional view taken along line XXXVIII-XXXVIII in FIG. 34. [Figure 39] FIG. 1 is a schematic diagram of an example optical scanning system. [Figure 40] FIG. 1 is a diagram illustrating a hardware configuration of an example of an optical scanning system. [Figure 41] FIG. 2 is a functional block diagram of an example of a control device. [Figure 42] 10 is a flowchart of an example of processing related to the optical scanning system. [Figure 43] FIG. 1 is a schematic diagram of an example of an automobile equipped with a head-up display device. [Figure 44] FIG. 1 is a schematic diagram of an example of a head-up display device. [Figure 45] FIG. 1 is a schematic diagram of an example of an image forming apparatus equipped with an optical writing device. [Figure 46] FIG. 1 is a schematic diagram of an example of an optical writing device. [Figure 47] FIG. 1 is a schematic diagram of an example of a vehicle equipped with a lidar device. [Figure 48] FIG. 1 is a schematic diagram of an example of a lidar device. [Figure 49] FIG. 1 is a schematic diagram illustrating an example of the configuration of a laser headlamp. [Figure 50] FIG. 1 is a schematic perspective view showing an example of the configuration of a head-mounted display. [Figure 51]FIG. 1 is a diagram illustrating an example of a portion of the configuration of a head-mounted display. [Figure 52] 1 is a first schematic diagram showing an example of a pupil or cornea position detection device. [Figure 53] FIG. 2 is a second schematic diagram showing an example of a pupil or cornea position detection device. DETAILED DESCRIPTION OF THE INVENTION

[0009] A movable device, an image projection device, a head-up display, a laser headlamp, a head-mounted display, an object recognition device, and a moving body according to embodiments of the present invention will be described in detail with reference to the drawings. However, the following embodiments are merely examples of the movable device, the image projection device, the head-up display, the laser headlamp, the head-mounted display, the object recognition device, and the moving body according to embodiments of the present invention, and are not limited to the following.

[0010] Unless otherwise specified, the dimensions, materials, shapes, relative positions, etc. of components described in the embodiments of the present invention are merely illustrative examples and are not intended to limit the scope of the embodiments of the present invention. The sizes, positional relationships, etc. of components shown in the drawings may be exaggerated for clarity. In the following description, the same names and symbols indicate the same or similar components, and detailed descriptions will be omitted where appropriate.

[0011] For ease of explanation, the following describes the arrangement and configuration of each part using an XYZ Cartesian coordinate system. The three axes in the XYZ Cartesian coordinate system are mutually orthogonal. In the XYZ Cartesian coordinate system, the direction in which the X axis extends is referred to as the "X direction," the direction in which the Y axis extends is referred to as the "Y direction," and the direction in which the Z axis extends is referred to as the "Z direction." The direction in which the arrow indicating the X axis points is referred to as the +X direction, and the direction opposite to the +X direction is referred to as the -X direction. The direction in which the arrow indicating the Y axis points is referred to as the +Y direction, and the direction opposite to the +Y direction is referred to as the -Y direction. The direction in which the arrow indicating the Z axis points is referred to as the +Z direction, and the direction opposite to the +Z direction is referred to as the -Z direction.

[0012] In the embodiments of the present invention, the +Z direction is referred to as "up" and the -Z direction is referred to as "down." Viewing an object from the +Z direction is referred to as a top view. However, these directional expressions merely describe the relationship between relative positions, orientations, directions, etc., and do not necessarily correspond to the relationship during use. Furthermore, these directions are unrelated to the direction of gravity. For example, the upper drive unit in the embodiments of the present invention does not necessarily have to be arranged on the upper side in the direction of gravity, but may be arranged on the relatively opposite side to the lower drive unit in the embodiments of the present invention.

[0013] "To be arranged" does not only mean to be in direct contact, but also means to be indirectly arranged, for example, via another member. In this specification, "orthogonal" may include an error of ±10° from 90°. Also, in this specification, "parallel" may include an error of ±10° from 0°.

[0014] [First embodiment] <Configuration of the movable device according to the first embodiment of the present invention> A movable device according to a first embodiment of the present invention will be described with reference to Figs. 1 to 5. Fig. 1 is a schematic top view showing an example of a movable device 13 according to the first embodiment of the present invention. Fig. 2 is a schematic cross-sectional view taken along line II-II in Fig. 1. Fig. 3 is a schematic cross-sectional view taken along line III-III in Fig. 1. Fig. 4 is a schematic bottom view showing an example of a movable device 13 according to the first embodiment of the present invention. Fig. 5 is a schematic cross-sectional view taken along line VV in Fig. 1.

[0015] The movable device 13 has a movable part 101, a drive beam 112 having one end 135 (see FIG. 1) indirectly connected to the movable part 101 via a support part 120 and driving the movable part 101, and a fixed frame 140 to which the other end 136 (see FIG. 4) of the drive beam 112 is connected. In the example shown in FIGS. 1 to 5, the movable device 13 has a support part 120 and an electrode connection part 150.

[0016] The drive beams 112 are a plurality of drive beams, each having a drive unit 131. As shown in FIGS. 2 and 3, the drive beams 112 include a plurality of upper drive beams 112u and a plurality of lower drive beams 112v that are spaced apart from the upper drive beams 112u in the normal direction of the fixed frame 140. Each of the upper drive beams 112u includes a first SOI substrate 361 and an upper drive unit 131u. Each of the lower drive beams 112v includes a second SOI substrate 362 and a lower drive unit 131v.

[0017] The normal direction of the fixed frame 140 is a direction parallel to the normal to an imaginary plane including the outer edge of the fixed frame 140 when viewed from above. From another perspective, the normal direction of the fixed frame 140 is a direction perpendicular to each of the first axis E1 and the second axis E2. From yet another perspective, the normal direction of the fixed frame 140 is a direction parallel to the normal to the movable part 101 in a state where it is not driven by the drive beam 112. In the example shown in FIGS. 1 to 5, the normal direction of the fixed frame 140 is along the Z axis.

[0018] 1, the movable part 101 is driven by the drive beam 112 to be displaced so as to oscillate (rotationally oscillate) around a second axis E2 along the Y axis as the rotation axis. The drive beam 112 includes a first upper drive beam 112u-1 arranged on one side (+Y direction) of the movable part 101 in the direction along the second axis E2, and a second upper drive beam 112u-2 arranged on the other side (-Y direction) of the movable part 101. The drive unit 131 includes a first upper drive unit 131u-1 included in the first upper drive beam 112u-1 and a second upper drive unit 131u-2 included in the second upper drive beam 112u-2. The one end 135 includes a first end 135-1 where the first upper actuation beam 112u-1 is connected to the movable part 101, and a second end 135-2 where the second upper actuation beam 112u-2 is connected to the movable part 101.

[0019] In the example shown in FIG. 1 , the reference numerals of the first upper drive beam 112u-1 and the drive beam 112 are written in parentheses next to each other to indicate that the drive beam 112 includes the first upper drive beam 112u-1. Furthermore, the reference numerals of the second upper drive beam 112u-2 and the drive beam 112 are written in parentheses next to each other to indicate that the drive beam 112 includes the second upper drive beam 112u-2. Furthermore, the reference numerals of the first upper drive unit 131u-1 and the drive unit 131 are written in parentheses next to each other to indicate that the drive unit 131 includes the first upper drive unit 131u-1. Furthermore, the reference numerals of the second upper drive unit 131u-2 and the drive unit 131 are written in parentheses next to each other to indicate that the drive unit 131 includes the second upper drive unit 131u-2. Reference numerals may also be written in parentheses for the same purpose in subsequent figures other than FIG. 1 .

[0020] 2, the drive beam 112 includes an upper drive beam 112u and a lower drive beam 112v. The upper drive beam 112u includes a first upper drive beam 112u-1 and a second upper drive beam 112u-2. The lower drive beam 112v includes a first lower drive beam 112v-1 and a second lower drive beam 112v-2. The drive unit 131 includes an upper drive unit 131u arranged on the upper drive beam 112u and a lower drive unit 131v arranged on the lower drive beam 112v. The upper drive unit 131u includes a first upper drive unit 131u-1 arranged on the first upper drive beam 112u-1 and a second upper drive unit 131u-2 arranged on the second upper drive beam 112u-2. 4, the other end 136 includes a first other end 136-1 at which the first lower drive beam 112v-1 is connected to the fixed frame 140, and a second other end 136-2 at which the second lower drive beam 112v-2 is connected to the fixed frame 140.

[0021] In the example shown in FIGS. 1 and 2, the first upper drive unit 131u-1 includes a first upper drive unit 131a, a first upper drive unit 131b, a first upper drive unit 131c, and a first upper drive unit 131d. The second upper drive unit 131u-2 includes a second upper drive unit 132a, a second upper drive unit 132b, a second upper drive unit 132c, and a second upper drive unit 132d. In the example shown in FIG. 2, the first lower drive unit 131v-1 includes a first lower drive unit 133a, a first lower drive unit 133b, a first lower drive unit 133c, and a first lower drive unit 133d. The second lower drive unit 131v-2 includes a second lower drive unit 134a, a second lower drive unit 134b, a second lower drive unit 134c, and a second lower drive unit 134d.

[0022] Here, in a movable device, for example, if a large drive voltage is applied to a drive beam in order to displace a movable part by a large amount, the drive part, such as a piezoelectric film, may not be able to withstand the drive voltage and the drive beam may be destroyed. Also, if the rigidity of the structure supporting the movable part is reduced in order to displace the movable part by a large amount, the resonant frequency of the movable device may decrease, which may impair the displacement stability of the movable part.

[0023] In the movable device 13 according to the embodiment of the present invention, the drive beam 112 includes an upper drive beam 112u and a lower drive beam 112v, and displaces the movable part 101 by a displacement amount that is a combination of the displacement caused by the upper drive beam 112u and the displacement caused by the lower drive beam 112v. This allows the movable part 101 to be displaced by a large displacement amount without applying a large drive voltage to the drive beam 112. Furthermore, by configuring the structure that supports the movable part 101 so that its rigidity is not reduced, the displacement stability of the movable part 101 is not impaired. As described above, the embodiment of the present invention can provide a movable device 13 that can obtain a large displacement amount while improving its displacement stability.

[0024] In the movable device 13, the upper drive beam 112u overlaps with the lower drive beam 112v when viewed from the normal direction of the fixed frame 140. When viewed from the normal direction of the fixed frame 140, the upper drive beam 112u overlaps with the lower drive beam 112v, which reduces the area of ​​the movable device 13 in a virtual plane perpendicular to the normal line of the fixed frame 140, compared to when the upper drive beam 112u does not overlap with the lower drive beam 112v, thereby enabling the size of the movable device 13 to be reduced. Note that the overlap between the upper drive beam 112u and the lower drive beam 112v only needs to be such that at least a portion of the upper drive beam 112u overlaps with the lower drive beam 112v when viewed from the normal direction of the fixed frame 140. When viewed from the normal direction of the fixed frame 140, if almost the entire upper drive beam 112u overlaps with the lower drive beam 112v, the area of ​​the movable device 13 in a virtual plane perpendicular to the normal line of the fixed frame 140 is minimized, and the movable device 13 can be made as small as possible.

[0025] In the movable device 13, the upper actuation beam 112u is connected to the lower actuation beam 112v by an adhesive. In the example shown in Fig. 5, the upper actuation beam 112u is connected to the lower actuation beam 112v by an adhesive at the inter-substrate connection portion 160. The adhesive can be selected appropriately depending on the materials of the upper actuation beam 112u and the lower actuation beam 112v.

[0026] Here, when a driving part such as a piezoelectric film is configured to have multiple layers in order to displace the movable part by a large amount, the film must be multi-layered using a film formation process such as physical vapor deposition, sputtering, or chemical vapor deposition. In the film formation process, in order to form the film with precision, it is necessary to optimize the manufacturing process or various parameters for each manufacturing process, which may increase the difficulty of the manufacturing method of the movable device. As the difficulty of the manufacturing method increases, the yield of the movable device may decrease.

[0027] In the movable device 13, the upper actuation beam 112u and the lower actuation beam 112v are mechanically connected by an adhesive, so the upper actuation beam 112u and the lower actuation beam 112v can be connected more easily than by a film formation process. This makes it possible to easily manufacture the movable device 13, which can obtain a large amount of displacement while improving displacement stability. Furthermore, by simplifying the manufacturing process, the yield of the movable device 13 can be improved.

[0028] In the movable device 13, the movable part 101 is disposed apart from either the upper drive beam 112u or the lower drive beam 112v in the normal direction of the fixed frame 140. This arrangement allows the movable part 101 to be disposed overlapping either the upper drive beam 112u or the lower drive beam 112v without contacting them when viewed from above. This allows the movable device 13 to be more compact than when the movable part 101 is not disposed overlapping either the upper drive beam 112u or the lower drive beam 112v when viewed from above. Furthermore, by reducing the size of the movable device 13, the resonance frequency of the oscillation of the movable part 101 about the second axis E2 as the rotation axis can be increased.

[0029] The one end 135 of the drive beam 112 does not necessarily have to be indirectly connected to the movable part 101 via the support part 120 , but may be directly connected to the movable part 101 .

[0030] The configuration of the movable device 13 will be described in detail below.

[0031] The movable part 101 includes a movable part base 102 and a mirror surface 14 arranged on the movable part base 102. The mirror surface 14 reflects light incident on the mirror surface 14. The movable device 13 is capable of swinging the movable part 101 around a first axis E1 as a rotation axis, and is also capable of swinging the movable part 101 around a second axis E2 as a rotation axis. The tilt of the mirror surface 14 changes in accordance with the swing of the movable part 101. By changing the tilt of the mirror surface 14 by swinging the movable part, the movable device 13 can deflect the light incident on the mirror surface 14 and cause it to scan in the directions along each of the first axis E1 and the second axis E2.

[0032] The support unit 120 includes a first torsion bar spring 111a, a second torsion bar spring 111b, a third drive unit 112a, and a fourth drive unit 112b. The support unit 120 supports the movable unit 101 and causes the movable unit 101 to oscillate around a first axis E1 as a rotation axis using the third drive unit 112a and the fourth drive unit 112b. The support unit 120 is composed of, for example, a silicon support layer 361a, a silicon oxide layer 361b, and a silicon active layer 361c. The support unit 120 includes a frame having a substantially rectangular outer edge shape in a top view. The frame of the support unit 120 surrounds the movable unit 101, the third drive unit 112a, and the fourth drive unit 112b in a top view.

[0033] The first torsion bar spring 111a and the second torsion bar spring 111b are each a torsion beam. In the example shown in FIG. 1, the first torsion bar spring 111a is disposed in the -X direction of the movable part 101. One end of the first torsion bar spring 111a is connected to the movable part 101. The other end of the first torsion bar spring 111a is connected to a base material on which the third driver 112a is disposed via a driver connection part 113a. The second torsion bar spring 111b is disposed in the +X direction of the movable part 101. One end of the second torsion bar spring 111b is connected to the movable part 101. The other end of the second torsion bar spring 111b is connected to a base material on which the fourth driver 112b is disposed via a driver connection part 113b. The third driver 112a drives the movable part 101 via the first torsion bar spring 111a. The fourth driving portion 112b drives the movable portion 101 via the second torsion bar spring 111b.

[0034] The fixed frame 140 is a frame-shaped member having a substantially rectangular outer edge shape in a top view. The movable section 101, the drive beams 112, and the support section 120 are disposed inside the fixed frame 140. The electrode connection section 150 is disposed on the +Z side surface of the +X side edge of the fixed frame 140. The electrode connection section 150 electrically connects the first drive section 131-1, the second drive section 131-2, the third drive section 112a, and the fourth drive section 112b to a control device that controls the drive of the movable device 13. A drive voltage from the control device is applied to the first drive section 131-1, the second drive section 131-2, the third drive section 112a, and the fourth drive section 112b through the electrode connection section 150.

[0035] 3, the movable device 13 is formed by bonding two SOI (Silicon On Insulator) substrates, a first SOI substrate 361 and a second SOI substrate 362, with a silicon oxide layer 363 sandwiched therebetween. An upper electrode 201, a lower electrode 203, and a piezoelectric portion 202 sandwiched between the lower electrode 203 and the upper electrode 201 are formed on the surface of each of the first SOI substrate 361 and the second SOI substrate 362. Each of the driving portions included in the driving portion 131 is composed of the piezoelectric portion 202 sandwiched between the lower electrode 203 and the upper electrode 201.

[0036] Each of the first SOI substrate 361 and the second SOI substrate 362 is a substrate in which a silicon oxide layer is provided on a first silicon layer made of single-crystal silicon (Si), and a second silicon layer made of single-crystal silicon is further provided on the silicon oxide layer. Hereinafter, the first silicon layers are referred to as silicon support layer 361a and silicon support layer 362a, and the second silicon layers are referred to as silicon active layer 361c and silicon active layer 362c.

[0037] The first SOI substrate 361 is formed of a silicon support layer 361a, a silicon oxide layer 361b, and a silicon active layer 361c. The second SOI substrate 362 is formed of a silicon support layer 362a, a silicon oxide layer 362b, and a silicon active layer 362c. The first SOI substrate 361 and the second SOI substrate 362 are each formed by etching or other processes. The mirror surface 14, the first drive unit 131-1, the second drive unit 131-2, the third drive unit 112a, the fourth drive unit 112b, the electrode connection unit 150, and the like are formed on the formed first SOI substrate 361 and the second SOI substrate 362, respectively, thereby integrally forming each component. Note that the formation of each of the above components may be performed after the formation of the first SOI substrate 361 and the second SOI substrate 362, or may be performed during the formation of the first SOI substrate 361 and the second SOI substrate 362, respectively. The method for bonding the two SOI substrates, the first SOI substrate 361 and the second SOI substrate 362, is not limited to bonding with an adhesive, but may be joining. In the case of bonding, the silicon oxide layer 363 serves as the adhesive.

[0038] Since the silicon active layer 361c is thinner in the Z direction than in the X and Y directions, a member formed only by the silicon active layer 361c functions as an elastic part. Note that the first SOI substrate 361 and the second SOI substrate 362 do not necessarily have to be flat, and may have curvature or the like. Furthermore, the base material used to form the movable device 13 is not limited to an SOI substrate, as long as it can be integrally formed by etching or the like and can be made partially elastic.

[0039] Next, the main scanning structure for oscillating around the first axis E1 as the rotation axis will be described in detail. The movable part base 102 is made of, for example, a silicon active layer 361c. The mirror surface 14 is made of, for example, a metal thin film containing aluminum, gold, silver, or the like. The movable part 101 shown in FIG. 4 has a rib 103 for reinforcing the mirror part formed on the -Z side surface of the movable part base 102. The rib 103 is made of, for example, a silicon support layer 361a and a silicon oxide layer 361b. The rib 103 can reduce distortion of the mirror surface 14 that occurs when the movable part 101 oscillates.

[0040] The fourth driving unit 112b shown in Fig. 3 is configured by laminating an upper electrode 201, a piezoelectric unit 202, and a lower electrode 203 in this order on the +Z side surface of the silicon active layer 361c, which is the elastic unit. The upper electrode 201 and the lower electrode 203 are configured from, for example, gold (Au) or platinum (Pt). The piezoelectric unit 202 is configured from, for example, PZT (lead zirconate titanate), which is a piezoelectric material. The configuration of the third driving unit 112a is similar to that of the fourth driving unit 112b.

[0041] As shown in FIG. 4, the first torsion bar spring 111a and the second torsion bar spring 111b are members extending in a direction along the first axis E1. The first torsion bar spring 111a and the second torsion bar spring 111b are formed from the silicon active layer 361c of the first SOI substrate 361. The third drive unit 112a and the fourth drive unit 112b each have a unimorph structure and deform only in one direction when a drive voltage is applied. However, the movable device 13 can reciprocate the movable part 101 supported by the support part 120 by the spring action of the first torsion bar spring 111a and the second torsion bar spring 111b. The oscillation of the movable part 101 around the first axis E1 as the rotation axis is a resonant oscillation. The resonant frequency is designed using information such as the moment of inertia of the movable part 101 or the rigidity of the first torsion bar spring 111a and the second torsion bar spring 111b.

[0042] As shown in FIG. 4, the torsion central axis C0 of the first torsion bar spring 111a and the second torsion bar spring 111b is shifted, i.e., offset, from the first axis E1 passing through the center of the movable part 101. Due to this offset, the movable device 13 converts the displacement in the Z direction of the tip end in the +Y direction of the base material on which the third driving unit 112a and the fourth driving unit 112b are arranged into a rotational force (moment), thereby swinging the movable part 101. In the example shown in FIG. 4, the torsion central axis C0 is the torsion central axis of the first torsion bar spring 111a and the torsion central axis of the second torsion bar spring 111b. The offset ΔS represents the amount of offset of the torsion central axis C0 from the first axis E1.

[0043] The base material on which the third driving unit 112a and the fourth driving unit 112b are arranged has a free tip, so that a large displacement can be obtained without interfering with the piezoelectric driving force. Furthermore, by setting the bending mode resonance of the base material on which the third driving unit 112a and the fourth driving unit 112b are arranged near the torsion mode resonance of the first torsion bar spring 111a and the second torsion bar spring 111b, respectively, the rotation angle of the movable unit 101 can be greatly expanded, and a large displacement can be obtained even when a low driving voltage is applied.

[0044] Next, the structure for performing oscillation around the second axis E2 as the rotation axis will be described in detail. The oscillation of the movable part 101 around the first axis E1 as the rotation axis is a resonant oscillation. Therefore, the waveform of the drive voltage is a sine wave. Oscillation of the movable part 101 around the second axis E2 as the rotation axis often requires uniform oscillation. Furthermore, a sawtooth waveform is often required for the drive voltage waveform. To achieve uniform oscillation using a drive voltage with a sawtooth waveform, non-resonant oscillation is preferable. Non-resonant oscillation makes it difficult to obtain large displacements like resonant oscillations. Furthermore, for oscillation around the second axis E2 as the rotation axis, it is preferable to deform the drive beam in both directions. As described above, the drive beam has a meander structure in which multiple drive beams are folded back. The meander structure allows oscillation of two channels, channel A and channel B, and the drive beam can be deformed in both directions. Furthermore, the displacement of the movable part 101 can be increased by accumulating the deformations of multiple drive beams.

[0045] In the example shown in FIGS. 1 to 3, the upper actuator beam 112u is formed from a first SOI substrate 361. The lower actuator beam 112v is formed from a second SOI substrate 362. The upper actuator section 131u is formed in a silicon active layer 361c of the first SOI substrate 361. The lower actuator section 131v is formed in a silicon active layer 361c of the second SOI substrate 362. The upper actuator beam 112u and the lower actuator beam 112v each have a meander structure.

[0046] The first end 135-1 where the first upper drive beam 112u-1 is connected to the movable part 101, the second end 135-2 where the second upper drive beam 112u-2 is connected to the movable part 101, the connection portion where the first upper drive beam 112u-1 is connected to the first lower drive beam 112v-1, the connection portion where the second upper drive beam 112u-2 is connected to the second lower drive beam 112v-2, the connection portion where the first lower drive beam 112v-1 is connected to the fixed frame 140, and the connection portion where the second lower drive beam 112v-2 is connected to the fixed frame 140 are point-symmetric with respect to the center of the mirror surface 14.

[0047] As shown in FIG. 2, the first upper driver 131u-1 and the second upper driver 131u-2 are formed by laminating a lower electrode 203, a piezoelectric section 202, and an upper electrode 201 in this order on the +Z direction surface of the silicon active layer 361c, which is an elastic section. The first lower driver 131v-1 and the second lower driver 131v-2 are formed by laminating a lower electrode 203, a piezoelectric section 202, and an upper electrode 201 in this order on the +Z direction surface of the silicon active layer 362c, which is an elastic section. The upper electrode 201 and the lower electrode 203 are made of gold (Au), platinum (Pt), or the like. The piezoelectric section 202 is made of, for example, PZT (lead zirconate titanate), which is a piezoelectric material.

[0048] In the example shown in FIGS. 1 and 3, the fixed frame 140 is configured by bonding two SOI substrates, a first SOI substrate 361 and a second SOI substrate 362, with a silicon oxide layer 363 sandwiched therebetween.

[0049] In the example shown in FIG. 5, the upper actuation beam 112u is electrically connected to the lower actuation beam 112v by wire bonding 161. From another perspective, in the inter-substrate connection portion 160, electrical wiring is established between the first SOI substrate 361 and the second SOI substrate 362 by wire bonding 161 in order to apply a drive voltage to the piezoelectric portion 202. By electrically connecting the upper actuation beam 112u and the lower actuation beam 112v by wire bonding 161, wiring can be established between the first SOI substrate 361 and the second SOI substrate 362, which are different substrates. By establishing wiring between the first SOI substrate 361 and the second SOI substrate 362, a drive voltage can be applied to each of the upper actuation beam 112u and the lower actuation beam 112v. The upper electrode 201 or the lower electrode 203 may be directly connected to the electrode connection portion 150, or may be indirectly connected by, for example, connecting the electrodes to each other.

[0050] The piezoelectric portion 202 is not limited to being formed only on the +Z side surface of the silicon active layer 361c, which is the elastic portion, but may be provided on the -Z side surface of the silicon active layer 361c, or on both the +Z side surface and the -Z side surface of the silicon active layer 361c. Furthermore, each piezoelectric portion 202 may be formed of a multi-layer piezoelectric film instead of a single layer.

[0051] As long as the movable part 101 can be oscillated around each of the first axis E1 and the second axis E2 as a rotation axis, the shape of each component is not limited to the shapes shown in Figures 1 to 5. For example, the shape of each of the first torsion bar spring 111a, the second torsion bar spring 111b, the upper drive beam 112u, and the lower drive beam 112v may have a curvature.

[0052] An insulating layer made of a silicon oxide film may be formed on at least one of the +Z-side surfaces of the upper electrode 201 of each of the upper driver 131u, the lower driver 131v, the third driver 112a, and the fourth driver 112b, the +Z-side surface of the support 120, and the +Z-side surface of the fixed frame 140. When forming an insulating layer, electrode wiring may be provided on the insulating layer, and the insulating layer may be partially removed or not formed at only the connection spots where the upper electrode 201 or the lower electrode 203 is connected to the electrode wiring as openings. This increases the design flexibility of the upper driver 131u, the lower driver 131v, the third driver 112a, the fourth driver 112b, and the electrode wiring, and reduces short circuits due to contact between electrodes. The silicon oxide film also functions as an anti-reflection material.

[0053] <Swing of the movable part 101 in the movable device 13> Next, details of the swinging of the movable part 101 by the upper drive part 131u, the lower drive part 131v, the third drive part 112a and the fourth drive part 112b in the movable device 13 will be described.

[0054] In the movable device 13, to oscillate the movable part 101, a driving voltage that is positive or negative in the polarization direction is applied to the piezoelectric parts 202 of the upper driving part 131u, the lower driving part 131v, the third driving part 112a, and the fourth driving part 112b. This driving voltage causes deformation (e.g., expansion and contraction) in the piezoelectric parts 202 that is proportional to the potential of the applied driving voltage, resulting in the so-called inverse piezoelectric effect. Each of the upper driving part 131u, the lower driving part 131v, the third driving part 112a, and the fourth driving part 112b oscillates the movable part 101 by utilizing this inverse piezoelectric effect.

[0055] In the following description, the angle formed by the XY plane and mirror surface 14 when mirror surface 14 of movable part 101 is tilted in the +Z direction or the Z direction with respect to the XY plane is referred to as the deflection angle. The direction in which the +X side of movable part 101 tilts in the +Z direction is referred to as a positive deflection angle, and the direction in which the +X side of movable part 101 tilts in the -Z direction is referred to as a negative deflection angle.

[0056] (Swinging by the third driving unit 112a and the fourth driving unit 112b) First, the driving of the movable part 101 by the third driving unit 112a and the fourth driving unit 112b will be described. In the third driving unit 112a and the fourth driving unit 112b, when a driving voltage is applied in parallel to the piezoelectric part 202 of each of the third driving unit 112a and the fourth driving unit 112b via the upper electrode 201 and the lower electrode 203, the piezoelectric part 202 is deformed. The deformation of the piezoelectric part 202 causes the third driving unit 112a and the fourth driving unit 112b to bend and deform. The bending deformation of the third driving unit 112a and the fourth driving unit 112b causes the first torsion bar spring 111a and the second torsion bar spring 111b to twist. In response to the twisting of the first torsion bar spring 111a and the second torsion bar spring 111b, a driving force is applied to the movable part 101 around the first axis E1 as a rotation axis. The application of this driving force causes the movable part 101 to swing around the first axis E1 as a rotation axis.

[0057] The drive voltages applied to the third drive unit 112a and the fourth drive unit 112b are controlled by a control device. For example, by applying a predetermined sinusoidal drive voltage to the third drive unit 112a and the fourth drive unit 112b in parallel from the control device, the movable unit 101 can be oscillated with the period of the sinusoidal drive voltage around the first axis E1 as the axis of rotation. When the frequency of the sinusoidal voltage is set to approximately 20 kHz, which is similar to the resonance frequency of the first torsion bar spring 111a and the second torsion bar spring 111b, mechanical resonance occurs due to torsion of the first torsion bar spring 111a and the second torsion bar spring 111b, and the movable unit 101 can be resonantly oscillated at approximately 20 kHz. By resonantly oscillating the movable unit 101, a large displacement of the movable unit 101 can be obtained even when a small drive voltage is applied.

[0058] (Swinging by the upper drive unit 131u and the lower drive unit 131v) 1 and 6 to 12, the oscillation of the movable part 101 by the upper drive part 131u and the lower drive part 131v will be described. In the movable device 13, the first upper drive part 131u-1, the second upper drive part 131u-2, the first lower drive part 131v-1, and the second lower drive part 131v-2 have the same shape and perform substantially the same function, so the oscillation of the movable part 101 by the second upper drive part 131u-2 will be described as a representative example.

[0059] 1, among the second upper drive unit 132a, the second upper drive unit 132b, the second upper drive unit 132c, and the second upper drive unit 132d, the odd-numbered second upper drive units 132a and 132c counting from the second upper drive unit 132a that is closest to the movable unit 101 are similarly referred to as drive unit group 200A. Furthermore, among the second upper drive unit 132a, the second upper drive unit 132b, the second upper drive unit 132c, and the second upper drive unit 132d, the even-numbered second upper drive units 132b and 132d counting from the second upper drive unit 132a that is closest to the movable unit 101 are similarly referred to as drive unit group 200B.

[0060] FIG. 6 is a first schematic perspective view showing an example of how the movable part 101 is oscillated by the second upper driving unit 131u-2 of the movable device 13 according to the first embodiment of the present invention. FIG. 7 is a second schematic perspective view showing an example of how the movable part 101 is oscillated by the second upper driving unit 131u-2 of the movable device 13 according to the first embodiment of the present invention. FIG. 8 is a third schematic perspective view showing an example of how the movable part 101 is oscillated by the second upper driving unit 131u-2 of the movable device 13 according to the first embodiment of the present invention. FIG. 9 is a fourth schematic perspective view showing an example of how the movable part 101 is oscillated by the second upper driving unit 131u-2 of the movable device 13 according to the first embodiment of the present invention. FIG. 10 is a first diagram showing the waveform of a driving voltage applied to the driving unit group 200A of the movable device 13 according to the first embodiment of the present invention. FIG. 11 is a second diagram showing the waveform of a driving voltage applied to the driving unit group 200B of the movable device 13 according to the first embodiment of the present invention. FIG. 12 is a diagram in which the drive voltage waveforms of FIG. 10 and FIG. 11 are superimposed.

[0061] 6 to 9 show how the support part 120 connected to the second upper drive part 131u-2 is swung by the second upper drive part 131u-2. The support part 120 is indicated by a dashed line. When the support part 120 oscillates, the movable part 101 supported by the support part 120 oscillates together with the support part 120.

[0062] 6, when no drive voltage is applied to the second upper drive unit 131u-2, the deflection angle of the support unit 120 caused by the second upper drive unit 131u-2 is zero. An imaginary plane including the outer edge of the support unit 120 in a top view is approximately parallel to the XY plane, and the mirror surface 14 of the movable unit 101 supported by the support unit 120 is also approximately parallel to the XY plane.

[0063] As shown in FIG. 7, when drive voltages are applied in parallel to the drive section group 200A, the drive section group 200A is bent and deformed in the same direction, and the support section 120 tilts in the negative direction around the second axis E2 as the rotation axis.

[0064] As shown in FIG. 8, when the amount of displacement of the support part 120 by the drive part group 200A due to voltage application and the amount of displacement of the support part 120 by the drive part group 200B due to voltage application are balanced, the deflection angle is zero.

[0065] As shown in FIG. 9, when drive voltages are applied in parallel to the drive section group 200B, the drive section group 200B bends and deforms in the same direction, and the movable section 101 swings in the +Z direction around the second axis E2 as the rotation axis.

[0066] By applying a drive voltage to the second upper drive unit 131u-2 so as to continuously repeat Figures 7 to 9, the support unit 120 can be swung around the second axis E2 as a rotation axis, and the movable unit 101 supported by the support unit 120 can be swung around the second axis E2 as a rotation axis.

[0067] 7 and 9, by simultaneously bending and deforming the plurality of piezoelectric units 202 included in the drive unit group 200A or the plurality of piezoelectric units 202 included in the drive unit group 200B, the amount of displacement due to the bending deformation can be accumulated, and the deflection angle around the second axis E2 of the support unit 120 as the axis of rotation can be increased. In the movable device 13, the upper drive unit 131u and the lower drive unit 131v are connected in point symmetry with respect to the center point of the mirror surface 14, which coincides with the center point of the support unit 120. Therefore, when a drive voltage is applied to the drive unit group 200A, a drive force is generated at the second end 135-2 of the second upper drive unit 131u-2 connected to the support unit 120 to move it in the +Z direction, and a drive force is generated at the first end 135-1 of the first upper drive unit 131u-1 connected to the support unit 120 to move it in the -Z direction. The displacement amounts caused by the first upper driving portion 131u-1 and the second upper driving portion 131u-2 are accumulated, and the swing angle of the movable portion 101 supported by the support portion 120 about the second axis E2 as the rotation axis can be increased.

[0068] The displacement amount is also accumulated in the lower drive unit 131v in a similar manner. In the movable device 13, the displacement amount of the upper drive unit 131u and the displacement amount of the lower drive unit 131v are accumulated, thereby making it possible to obtain an even larger displacement amount. The oscillation of the movable unit 101 by the upper drive beam 112u and the lower drive beam 112v is not limited to non-resonant oscillation, and may be resonant oscillation. Even when the oscillation of the movable unit 101 by the upper drive beam 112u and the lower drive beam 112v is non-resonant oscillation, it is possible to obtain a large displacement amount by accumulating the displacement amount of the upper drive unit 131u and the displacement amount of the lower drive unit 131v.

[0069] In the movable device 13, the upper actuation beam 112u is driven by a drive voltage that is in the opposite phase to the drive voltage that drives the lower actuation beam 112v. This eliminates the need to place the A channel and the B channel on the same substrate as in the meander structure, allowing the movable device 13 to be made smaller.

[0070] The drive voltages applied to the upper drive unit 131u and the lower drive unit 131v are controlled by a control device. The drive voltages applied to the drive unit group 200A and the drive voltages applied to the drive unit group 200B will be described with reference to FIGS. 10 to 12.

[0071] Fig. 10 is a diagram showing the waveform of the driving voltage applied to the driving unit group 200A of the movable device 13 according to the first embodiment of the present invention. Fig. 11 is a diagram showing the waveform of the driving voltage applied to the driving unit group 200B of the movable device 13 according to the first embodiment of the present invention. Fig. 12 is a diagram in which the driving voltage waveforms of Fig. 10 and Fig. 11 are superimposed.

[0072] As shown in Fig. 10, the drive voltage applied to the driver group 200A is, for example, a drive voltage with a sawtooth waveform. The frequency is, for example, 60 Hz. The waveform of the drive voltage applied to the driver group 200A is preset to have a ratio of, for example, TrA:TfA = 9:1, where TrA is the duration of the rise period during which the voltage value increases from a minimum value to the next maximum value, and TfA is the duration of the fall period during which the voltage value decreases from the maximum value to the next minimum value. In this case, the ratio of TrA to one period is referred to as the symmetry of the drive voltage applied to the driver group 200A.

[0073] As shown in FIG. 11, the drive voltage applied to the driver group 200B is, for example, a drive voltage with a sawtooth waveform. The frequency is, for example, 60 Hz. The waveform of the drive voltage applied to the driver group 200B is preset to have a ratio of, for example, TfB:TrB=9:1, where TrB is the duration of the rise period during which the voltage value increases from a minimum value to the next maximum value and TfB is the duration of the fall period during which the voltage value decreases from the maximum value to the next minimum value. The ratio of TfB to one period is referred to as the symmetry of the drive voltage B. As shown in FIG. 12, for example, the period TA of the waveform of the drive voltage applied to the driver group 200A and the period TB of the waveform of the drive voltage applied to the driver group 200B are set to be the same.

[0074] The drive voltage applied to the drive unit group 200B and the sawtooth waveform of the drive voltage applied to the drive unit group 200B are generated by superimposing sine waves. However, the drive voltage applied to the drive unit group 200B and the drive voltage applied to the drive unit group 200B are not limited to drive voltages with sawtooth waveforms. The waveforms can also be changed appropriately depending on the device characteristics of the movable device 13, such as a drive voltage with rounded peaks of the sawtooth waveform or a drive voltage with a waveform in which the linear regions of the sawtooth waveform are curved.

[0075] [Second embodiment] Next, a movable device according to a second embodiment of the present invention will be described. The same names and symbols as those in the previously described embodiments indicate the same or similar components or configurations, and detailed descriptions will be omitted as appropriate. This also applies to the other examples and embodiments described below.

[0076] The configuration of a movable device according to a second embodiment of the present invention will be described with reference to Figs. 13 to 17. Fig. 13 is a schematic top view showing an example of a movable device 13 according to the second embodiment of the present invention. Fig. 14 is a schematic cross-sectional view taken along line XIV-XIV in Fig. 13. Fig. 15 is a schematic cross-sectional view taken along line XV-XV in Fig. 13. Fig. 16 is a schematic bottom view showing an example of a movable device 13 according to the second embodiment of the present invention. Fig. 17 is a schematic cross-sectional view taken along line XVII-XVII in Fig. 13.

[0077] The movable device 13 according to the third embodiment of the present invention differs from the movable device 13 according to the first embodiment in that the upper actuation beam 112u is electrically connected to the lower actuation beam 112v by a through silicon via (Through Silicon Via: TSV) 162. The through silicon via 162 is an electrode formed by drilling a hole in a silicon substrate and connecting upper and lower chips with the electrode.

[0078] The upper actuation beam 112u and the lower actuation beam 112v are electrically connected by the silicon through electrode 162, thereby enabling wiring between different substrates, the first SOI substrate 361 and the second SOI substrate 362. By providing wiring between the first SOI substrate 361 and the second SOI substrate 362, it is possible to apply a driving voltage to each of the upper actuation beam 112u and the lower actuation beam 112v.

[0079] [Third embodiment] Next, a movable device according to a third embodiment of the present invention will be described with reference to Figs. 18 to 23. Fig. 18 is a schematic top view showing an example of a movable device 13 according to the third embodiment of the present invention. Fig. 19 is a schematic top view taken along line XIX-XXV in Fig. 20. Fig. 20 is a schematic cross-sectional view taken along line XX-XX in Fig. 18. Fig. 21 is a schematic cross-sectional view taken along line XXI-XXI in Fig. 18. Fig. 22 is a schematic bottom view showing an example of a movable device 13 according to the third embodiment of the present invention. Fig. 23 is a schematic cross-sectional view taken along line XXIII-XXIII in Fig. 18.

[0080] The movable device 13 according to the third embodiment differs from the movable device 13 according to the first embodiment of the present invention in that the shapes of the upper drive beams 112u and the lower drive beams 112v are different.

[0081] 19, of the multiple drive beams in the lower drive beam 112v, the width of the drive beam closer to the fixed frame 140 is increased to increase local rigidity, and the width of the drive beam closer to the support part 120 is narrowed to decrease local rigidity. This makes it possible to increase the resonant frequency. Increasing the resonant frequency makes it possible to stabilize the operation of the movable device 13.

[0082] The thickness of the lower actuation beam 112v may be made thicker than the thickness of the upper actuation beam 112u by making the silicon active layer 362c of the second SOI substrate 362 thicker than the silicon active layer 361c of the first SOI substrate 361. This configuration also makes it possible to raise the resonant frequency, thereby stabilizing the operation of the movable device 13.

[0083] [Fourth embodiment] Next, a movable device according to a fourth embodiment of the present invention will be described with reference to Figs. 24 to 28. Fig. 24 is a schematic top view showing an example of a movable device 13 according to the fourth embodiment of the present invention. Fig. 25 is a schematic cross-sectional view taken along line XXV-XXV in Fig. 24. Fig. 26 is a schematic cross-sectional view taken along line XXVI-XXVI in Fig. 24. Fig. 27 is a schematic bottom view showing an example of a movable device 13 according to the fourth embodiment of the present invention. Fig. 28 is a schematic cross-sectional view taken along line XXVIII-XXVIII in Fig. 24.

[0084] In the movable device 13 according to the fourth embodiment of the present invention, the fifth driving unit 115a and the sixth driving unit 115b are disposed on the second SOI substrate 362, thereby increasing the amount of displacement of the oscillation of the movable unit 101 about the first axis E1 as the axis of rotation. This widens the scanning range of the light incident on the mirror surface 14 in the direction along the second axis E2. The fifth driving unit 115a and the sixth driving unit 115b are each an example of an elastic support member.

[0085] The third drive unit 112a and the fourth drive unit 112b are formed on the silicon active layer 361c of the first SOI substrate 361. One end of the third drive unit 112a is connected to the first torsion bar spring 111a. The other end of the third drive unit 112a is connected to the fifth drive unit 115a via the inter-substrate connector 160. One end of the fourth drive unit 112b is connected to the second torsion bar spring 111b. The other end of the fourth drive unit 112b is connected to the sixth drive unit 115b via the inter-substrate connector 160. The other ends of the fifth drive unit 115a and the sixth drive unit 115b are connected to the inner periphery of the support unit 120.

[0086] The support part 120 is composed of a silicon support layer 362a, a silicon oxide layer 362b, and a silicon active layer 362c of the second SOI substrate 362. The support part 120 surrounds the movable part 101, the third drive part 112a, the fourth drive part 112b, the fifth drive part 115a, and the sixth drive part 115b.

[0087] In the fourth embodiment of the present invention, the driving force for swinging the movable part 101 about the first axis E1 as the rotation axis can be obtained from both the third driving part 112a and the fifth driving part 115a, thereby obtaining a large amount of displacement. Furthermore, by applying driving voltages of opposite phases to the third driving part 112a and the fifth driving part 115a through separate wiring, displacement in both directions can be obtained, like a meander structure in driving the movable part 101 about the second axis E2 as the rotation axis, and thus a large displacement can be obtained.

[0088] The lower actuator 131v is formed in the silicon active layer 362c of the second SOI substrate 362. The lower actuator 131v has a meander structure in which multiple actuator beams are connected in a folded manner. One end of each of the first lower actuator beam 112v-1 and the second lower actuator beam 112v-2 is connected to the outer periphery of the support 120. The other end of the first lower actuator beam 112v-1 is connected to the first upper actuator beam 112u-1 via the inter-substrate connector 160. The other end of the second lower actuator beam 112v-2 is connected to the second upper actuator beam 112u-2 via the inter-substrate connector 160.

[0089] The first upper actuation beam 112u-1 and the second upper actuation beam 112u-2 are formed in the silicon active layer 361c of the first SOI substrate 361, and have a meander structure with a plurality of actuation beams connected in a folded manner.

[0090] One end of the first upper actuation beam 112u-1 is connected to the first lower actuation beam 112v-1 via an inter-substrate connection portion 160. The other end of the first upper actuation beam 112u-1 is connected to the inner periphery of the fixed frame 140. In the inter-substrate connection portion 160, electrical wiring is provided between the first SOI substrate 361 and the second SOI substrate 362 by a silicon through electrode 162 in order to apply a voltage to the piezoelectric portion 202.

[0091] [Fifth embodiment] Next, a movable device according to a fifth embodiment of the present invention will be described with reference to Figs. 29 to 33. Fig. 29 is a schematic top view showing an example of a movable device 13 according to the fifth embodiment of the present invention. Fig. 30 is a schematic cross-sectional view taken along line XXX-XXX in Fig. 29. Fig. 31 is a schematic cross-sectional view taken along line XXXI-XXXI in Fig. 29. Fig. 32 is a schematic bottom view showing an example of a movable device according to the fifth embodiment of the present invention. Fig. 33 is a schematic cross-sectional view taken along line XXXIII-XXXIII in Fig. 29.

[0092] The movable device 13 according to the fifth embodiment of the present invention differs from the movable device 13 according to the first embodiment of the present invention in that the second SOI substrate 362 is upside down.

[0093] The movable device 13 is formed, for example, by bonding two SOI substrates, a first SOI substrate 361 and a second SOI substrate 362, with a silicon oxide layer 363 sandwiched between them. The first SOI substrate 361 is formed of a silicon support layer 361a, a silicon oxide layer 361b, and a silicon active layer 361c, and the second SOI substrate 362 is formed of a silicon support layer 362a, a silicon oxide layer 362b, and a silicon active layer 362c.

[0094] In the movable device 13 according to the fifth embodiment of the present invention, a bonding surface is formed between a silicon support layer 361a of a first SOI substrate 361 and a silicon support layer 362a of a second SOI substrate 362. That is, the second SOI substrate 362 is turned upside down.

[0095] In the movable device 13 according to the fifth embodiment of the present invention, the area of ​​the fifth drive unit 115a can be increased by inverting the second SOI substrate 362 upside down, thereby enabling a larger displacement of the movable unit 101. For example, when the lower drive beam 112v and the fifth drive unit 115a are driven to swing the movable unit 101 about the first axis E1 as the rotation axis, the lower drive beam 112v needs to be shaped to avoid the rib 103 so that the fifth drive unit 115a does not interfere with the rib 103 on the rear surface of the movable unit 101. In the fifth embodiment of the present invention, the silicon support layer 362a of the second SOI substrate 362 ensures space in the Z direction, thereby preventing interference with the rib 103 on the rear surface of the movable unit 101. This allows the area of ​​the fifth drive unit 115a to be increased, thereby enabling a larger displacement during swing of the movable unit 101 about the first axis E1 as the rotation axis.

[0096] [Sixth embodiment] Next, a movable device according to a sixth embodiment of the present invention will be described with reference to Figs. 34 to 38. Fig. 34 is a schematic top view showing an example of a movable device 13 according to the sixth embodiment of the present invention. Fig. 35 is a schematic cross-sectional view taken along line XXXV-XXXV in Fig. 34. Fig. 36 is a schematic cross-sectional view taken along line XXXVI-XXXVI in Fig. 34. Fig. 37 is a schematic bottom view showing an example of a movable device according to the sixth embodiment of the present invention. Fig. 38 is a schematic cross-sectional view taken along line XXXVIII-XXXVIII in Fig. 34.

[0097] The movable device 13 according to the sixth embodiment of the present invention differs from the movable device 13 according to the first embodiment of the present invention in that the size of the movable part 101 is larger than the structure that oscillates around the first axis E1 as the rotation axis.

[0098] In the movable device 13 according to the sixth embodiment of the present invention, the movable part 101 is formed slightly larger than the structure that oscillates about the first axis E1 as the rotation axis, and is larger than the support part 120. Because the support part 120 is formed of a thick silicon support layer, the size of the support part 120 has a large effect on the moment of inertia. By forming the support part 120 smaller than the size of the movable part 101, the moment of inertia can be kept small.

[0099] In the movable device 13 according to the sixth embodiment of the present invention, the upper drive beam 112u is composed of four drive beams, and the lower drive beam 112v is composed of six drive beams. In other words, the number of drive beams in the upper drive beam 112u is fewer than the number of drive beams in the lower drive beam 112v. By making the number of drive beams in the upper drive beam 112u fewer than the number of drive beams in the lower drive beam 112v, the movable section 101 can be made larger, that is, the main frame can be made relatively smaller.

[0100] In the movable device 13 according to the sixth embodiment of the present invention, the ribs 103 of the movable part 101 and the support part 120 are arranged so as not to overlap in the Z direction, so that they do not interfere with each other when deforming in the Z direction during operation.

[0101] [Application embodiment] Hereinafter, various embodiments in which the movable device 13 according to the embodiment of the present invention is applied to applications will be described.

[0102] [Optical scanning system] First, an optical scanning system 10 employing a movable device 13 according to an embodiment of the present invention will be described in detail with reference to Figs. 39 to 42. Fig. 39 shows a schematic diagram of an example of the optical scanning system 10. As shown in Fig. 39, the optical scanning system 10 is a system that optically scans a scanned surface 15 by deflecting light emitted from a light source device 12 using a mirror surface 14 of a movable device 13 under the control of a control device 11.

[0103] The optical scanning system 10 comprises a control device 11, a light source device 12, and a movable device 13 having a mirror surface 14.

[0104] The control device 11 is an electronic circuit unit including, for example, a CPU (Central Processing Unit) and an FPGA (Field-Programmable Gate Array). The movable device 13 is, for example, a MEMS (Micro Electromechanical Systems) device that has a mirror surface 14 and can move the mirror surface 14. The light source device 12 is, for example, a laser device that irradiates a laser. The scanned surface 15 is, for example, a screen.

[0105] The control device 11 generates control commands for the light source device 12 and the movable device 13 based on the acquired optical scanning information, and outputs drive signals to the light source device 12 and the movable device 13 based on the control commands.

[0106] The light source device 12 emits light based on the input drive signal. The moving device 13 moves the mirror surface 14 in at least one of one axial direction and two axial directions based on the input drive signal.

[0107] As a result, for example, by controlling the control device 11 based on image information, which is an example of optical scanning information, the mirror surface 14 of the movable device 13 can be moved back and forth in two axial directions within a predetermined range, and the irradiation light from the light source device 12 that enters the mirror surface 14 can be deflected around a certain axis to perform optical scanning, thereby projecting any image onto the scanned surface 15.

[0108] Next, the hardware configuration of an example of the optical scanning system 10 will be described with reference to Fig. 40. Fig. 40 is a hardware configuration diagram of an example of the optical scanning system 10. As shown in Fig. 40, the optical scanning system 10 includes a control device 11, a light source device 12, and a movable device 13, which are electrically connected to each other. Of these, the control device 11 includes a CPU 20, a RAM (Random Access Memory) 21, a ROM (Read Only Memory) 22, an FPGA 23, an external I / F 24, a light source device driver 25, a movable device driver 26, etc.

[0109] The CPU 20 is a computing device that reads programs and data from storage devices such as the ROM 22 onto the RAM 21 and executes the processing to realize the overall control and functions of the control device 11. The RAM 21 is a volatile storage device that temporarily stores programs and data. The ROM 22 is a non-volatile storage device that can retain programs and data even when the power is turned off, and stores processing programs and data that the CPU 20 executes to control each function of the optical scanning system 10. The FPGA 23 is a circuit that outputs control signals suitable for the light source device driver 25 and the movable device driver 26 in accordance with the processing of the CPU 20.

[0110] The external I / F 24 is, for example, an interface with an external device or a network. Examples of external devices include higher-level devices such as a PC (Personal Computer), and storage devices such as a USB memory, an SD card, a CD, a DVD, a HDD, and an SSD. Examples of networks include a CAN (Controller Area Network) or LAN (Local Area Network) in an automobile, the Internet, etc. The external I / F 24 may have any configuration as long as it enables connection or communication with an external device, and an external I / F 24 may be provided for each external device.

[0111] The light source device driver supplies a driving signal such as a driving voltage to the light source device 12 in accordance with the input control signal. The movable device driver 26 is an electric circuit that outputs a drive signal such as a drive voltage to the movable device 13 in accordance with an input control signal. In the control device 11, the CPU 20 acquires optical scanning information from an external device or a network via the external I / F 24. Note that any configuration is acceptable as long as the CPU 20 can acquire the optical scanning information, and the optical scanning information may be stored in the ROM 22 or FPGA 23 within the control device 11, or a new storage device such as an SSD may be provided within the control device 11 and the optical scanning information may be stored in that storage device.

[0112] Here, the optical scanning information is information indicating how to optically scan the scanned surface 15. For example, when an image is displayed by optical scanning, the optical scanning information is image data. Also, for example, when optical writing is performed by optical scanning, the optical scanning information is writing data indicating the writing order and writing locations. In addition, for example, when object recognition is performed by optical scanning, the optical scanning information is irradiation data indicating the timing and irradiation range of irradiating light for object recognition.

[0113] The control device 11 can realize the following functional configuration by instructions from the CPU 20 and the hardware configuration shown in FIG.

[0114] Next, the functional configuration of the control device 11 of the optical scanning system 10 will be described with reference to FIG. 41 is a functional block diagram of an example of a control device of an optical scanning system. As shown in FIG. 41, the control device 11 has a control unit 30 and a drive signal output unit 31 as functions.

[0115] The control unit 30 is realized by, for example, the CPU 20, FPGA 23, etc., and acquires optical scanning information from an external device, converts the optical scanning information into a control signal, and outputs it to the drive signal output unit 31. For example, the control unit 30 acquires image data from an external device, etc. as optical scanning information, generates a control signal from the image data by performing predetermined processing, and outputs it to the drive signal output unit 31. The drive signal output unit 31 is realized by the light source device driver 25, movable device driver 26, etc., and outputs a drive signal to the light source device 12 or the movable device 13 based on the input control signal.

[0116] The drive signal is a signal for controlling the drive of the light source device 12 or the movable device 13. For example, in the light source device 12, it is a drive voltage that controls the irradiation timing and irradiation intensity of the light source. Also, in the movable device 13, it is a drive voltage that controls the timing and movable range of moving the mirror surface 14 of the movable device 13.

[0117] Next, the process of optically scanning the surface 15 to be scanned by the optical scanning system 10 will be described with reference to Fig. 42. Fig. 42 is a flowchart showing an example of the process related to the optical scanning system.

[0118] In step S11, the control unit 30 acquires optical scanning information from an external device, etc. In step S12, the control unit 30 generates a control signal from the acquired optical scanning information and outputs the control signal to the drive signal output unit 31. In step S13, the drive signal output unit 31 outputs a drive signal to the light source device 12 and the movable device 13 based on the input control signal.

[0119] In step S14, the light source device 12 emits light based on the input drive signal. Also, the movable device 13 moves the mirror surface 14 based on the input drive signal. By driving the light source device 12 and the movable device 13, the light is deflected in any direction and optical scanning is performed.

[0120] In the optical scanning system 10, one control device 11 has the devices and functions to control the light source device 12 and the movable device 13, but the control device for the light source device and the control device for the movable device may be provided separately.

[0121] In the optical scanning system 10, the functions of the control unit 30 for the light source device 12 and the movable device 13 and the drive signal output unit 31 are provided in one control device 11, but these functions may exist separately, and for example, a drive signal output device having the drive signal output unit 31 may be provided separately from the control device 11 having the control unit 30. Note that, in the optical scanning system 10, the movable device 13 having the mirror surface 14 and the control device 11 may form an optical deflection system that performs optical deflection.

[0122] The optical scanning system 10 has the movable device 13 that can obtain a large amount of displacement while improving the displacement stability, and therefore can scan light over a wide range with high precision.

[0123] [Image projection device] Next, an image projection device to which the movable device of this embodiment is applied will be described in detail with reference to Fig. 43 and Fig. 44. Fig. 43 is a schematic diagram of an embodiment of an automobile 400 equipped with a head-up display device 500, which is an example of an image projection device. Fig. 44 is a schematic diagram of an example of the head-up display device 500.

[0124] The image projection device is a device that projects an image by optical scanning, and is, for example, a head-up display device.

[0125] 43, the head-up display device 500 is installed near the windshield (windshield 401 or the like) of an automobile 400, for example. Projection light L emitted from the head-up display device 500 is reflected by the windshield 401 and directed toward an observer (driver 402) who is a user. This allows the driver 402 to view an image projected by the head-up display device 500 as a virtual image. Note that a combiner may be installed on the inner wall surface of the windshield, and the user may view a virtual image by the projection light reflected by the combiner.

[0126] 44, in the head-up display device 500, laser beams are emitted from red, green, and blue laser light sources 501R, 501G, and 501B. The emitted laser beams pass through an incident optical system including collimator lenses 502, 503, and 504 provided for each laser light source, two dichroic mirrors 505 and 506, and a light amount adjuster 507, and are then deflected by a movable device 13 having a mirror surface 14. The deflected laser beams then pass through a projection optical system including a free-form surface mirror 509, an intermediate screen 510, and a projection mirror 511, and are projected onto a screen. In the head-up display device 500, the laser light sources 501R, 501G, and 501B, the collimator lenses 502, 503, and 504, and the dichroic mirrors 505 and 506 are unitized by an optical housing as a light source unit 530.

[0127] The head-up display device 500 projects an intermediate image displayed on an intermediate screen 510 onto a windshield 401 of an automobile 400, thereby allowing a driver 402 to visually recognize the intermediate image as a virtual image.

[0128] The color laser beams emitted from the laser light sources 501R, 501G, and 501B are converted into approximately parallel beams by collimator lenses 502, 503, and 504, respectively, and then combined by two dichroic mirrors 505 and 506. The combined laser beams have their light intensity adjusted by a light intensity adjuster 507, and are then two-dimensionally scanned by a movable device 13 having a mirror surface 14. The projection light L two-dimensionally scanned by the movable device 13 is reflected by a free-form surface mirror 509, where distortion is corrected, and then focused on an intermediate screen 510, displaying an intermediate image. The intermediate screen 510 is composed of a microlens array in which microlenses are arranged two-dimensionally, and the projection light L incident on the intermediate screen 510 is magnified in microlens units.

[0129] The movable device 13 reciprocates the mirror surface 14 in two axial directions, thereby two-dimensionally scanning the projection light L incident on the mirror surface 14. The drive control of this movable device 13 is performed in synchronization with the light emission timing of the laser light sources 501R, 501G, and 501B.

[0130] The above has described the head-up display device 500 as an example of an image projection device, but the image projection device may be any device that projects an image by performing optical scanning with the movable device 13 having the mirror surface 14. For example, the present invention can be similarly applied to a projector that is placed on a desk or the like and projects an image onto a display screen, or a head-mounted display device that is mounted on a mounting member that is worn on the observer's head or the like and projects an image onto a reflective / transmissive screen that the mounting member has, or projects an image using the observer's eyeball as a screen.

[0131] Furthermore, the image projection device may be mounted not only on a vehicle or a mounting member, but also on a moving body such as an aircraft, a ship, or a mobile robot, or on a non-moving body such as a work robot that operates a driving object such as a manipulator without moving from its location.

[0132] The head-up display device 500 is an example of a head-up display, and the automobile 400 is an example of a vehicle.

[0133] The head-up display device 500 has the movable device 13 that can obtain a large amount of displacement while improving the displacement stability, and therefore can display a large-screen image with high image quality.

[0134] [Optical writing device] Next, an optical writing device to which the movable device 13 of this embodiment is applied will be described in detail with reference to FIGS.

[0135] Fig. 45 shows an example of an image forming apparatus incorporating an optical writing device 600. Fig. 46 is a schematic diagram of an example of an optical writing device.

[0136] 45, the optical writing device 600 is used as a component of an image forming apparatus such as a laser printer 650 having a laser light printer function. In the image forming apparatus, the optical writing device 600 optically writes on the photosensitive drum, which is the scanned surface 15, by optically scanning the photosensitive drum with one or more laser beams.

[0137] As shown in Fig. 46, in an optical writing device 600, laser light from a light source device 12 such as a laser element passes through an imaging optical system 601 such as a collimator lens, and is then deflected in one or two axial directions by a movable device 13 having a mirror surface 14. The laser light deflected by the movable device 13 then passes through a scanning optical system 602 consisting of a first lens 602a, a second lens 602b, and a reflective mirror portion 602c, and is irradiated onto a surface to be scanned 15 (for example, a photosensitive drum or photosensitive paper), thereby performing optical writing. The scanning optical system 602 forms an image of the light beam in a spot shape on the surface to be scanned 15. The light source device 12 and the movable device 13 having the mirror surface 14 are driven under the control of a control device 11.

[0138] In this way, the optical writing device 600 can be used as a component of an image forming device having a laser light printer function. Also, by changing the scanning optical system to enable optical scanning not only in one axis direction but also in two axes directions, the optical writing device 600 can be used as a component of an image forming device such as a laser label device that prints by deflecting and optically scanning a laser light onto a thermal medium and heating it.

[0139] The movable device 13 having the mirror surface 14 used in the optical writing device described above consumes less power to drive than a rotating polygon mirror such as a polygon mirror, which is advantageous for reducing the power consumption of the optical writing device. In addition, the wind noise generated when the movable device 13 vibrates is smaller than that of a rotating polygon mirror, which is advantageous for improving the quietness of the optical writing device. The optical writing device requires significantly less installation space than a rotating polygon mirror, and the movable device 13 generates only a small amount of heat, making it easy to reduce the size, which is advantageous for reducing the size of the image forming device.

[0140] The optical writing device 600 has a movable device 13 that can obtain a large amount of displacement while improving the displacement stability, and therefore can form a high-quality image over a wide area of ​​the recording medium.

[0141] [Object recognition device] Next, an object recognition device to which the movable device of this embodiment is applied will be described in detail with reference to FIGS.

[0142] Fig. 47 is a schematic diagram of an automobile equipped with a LiDAR (Laser Imaging Detection and Ranging) device, which is an example of an object recognition device. It is also a schematic diagram of an automobile in which the LiDAR device is mounted in a lighting unit that mounts the automobile's headlights. Fig. 48 is a schematic diagram of an example of the LiDAR device.

[0143] The object recognition device is a device that recognizes an object in a target direction, such as a LIDAR device. As shown in Fig. 47, a LIDAR device 700 is mounted on, for example, an automobile 701, and recognizes an object 702 by optically scanning the target direction and receiving reflected light from the object 702 present in the target direction.

[0144] As shown in FIG. 48, laser light emitted from light source device 12 passes through an incident optical system consisting of a collimating lens 703, which converts divergent light into approximately parallel light, and a plane mirror 704, and is scanned in one or two axes by movable device 13 having mirror surface 14. The light then passes through a projection lens 705 and other components of a projection optical system and is irradiated onto an object 702 in front of the device. The drive of light source device 12 and movable device 13 is controlled by control device 11. The reflected light reflected by object 702 is detected by a photodetector 709. That is, the reflected light passes through a condenser lens 706 and other components of an incident light detection and light receiving optical system and is received by an image sensor 707, which outputs a detection signal to a signal processing circuit 708. The signal processing circuit 708 performs predetermined processing, such as binarization and noise reduction, on the input detection signal and outputs the result to a distance measurement circuit 710.

[0145] The distance measurement circuit 710 recognizes the presence or absence of the target object 702 based on the time difference between when the light source device 12 emits laser light and when the laser light is received by the photodetector 709, or the phase difference between each pixel of the image sensor 707 that receives the light, and further calculates distance information from the target object 702.

[0146] The movable device 13 having the mirror surface 14 is less likely to break than a polygonal mirror and is small, making it possible to provide a highly durable and small radar device. Such a lidar device can be attached to, for example, a vehicle, an aircraft, a ship, a robot, etc., and can optically scan a predetermined area to determine the presence or absence of obstacles and the distance to the obstacles.

[0147] In the above object recognition device, a lidar device 700 has been described as an example, but the object recognition device may be any device that performs optical scanning by controlling a movable device 13 having a mirror surface 14 with a control device 11, and recognizes an object 702 by receiving reflected light with a photodetector, and is not limited to the above-described embodiment.

[0148] For example, it can be similarly applied to biometric authentication that calculates object information such as shape from distance information obtained by optically scanning a hand or face and recognizes the target by referring to a record, security sensors that recognize intruding objects by optically scanning a target range, and components of 3D scanners that calculate and recognize object information such as shape from distance information obtained by optical scanning and output it as 3D data.

[0149] The object recognition device has a movable device 13 that can obtain a large amount of displacement while improving the displacement stability, and therefore can recognize objects present in a wide range with high accuracy.

[0150] [Laser headlamp] Next, a laser headlamp 50 in which the movable device of the present embodiment is applied to an automobile headlight will be described with reference to Fig. 49. Fig. 49 is a schematic diagram illustrating an example of the configuration of the laser headlamp 50.

[0151] The laser headlamp 50 includes a control device 11, a light source device 12b, a movable device 13 having a mirror surface 14, a mirror 51, and a transparent plate 52.

[0152] Light source device 12b is a light source that emits blue laser light. The light emitted from light source device 12b is incident on movable device 13 and reflected by mirror surface 14. Movable device 13 moves the mirror surface in the X and Y directions based on a signal from control device 11, and performs two-dimensional scanning of the blue laser light from light source device 12b in the X and Y directions.

[0153] The scanning light from the movable device 13 is reflected by a mirror 51 and enters a transparent plate 52. The front or back surface of the transparent plate 52 is coated with a yellow phosphor. When the blue laser light from the mirror 51 passes through the yellow phosphor coating on the transparent plate 52, it changes to white, which is within the legal range for headlight colors. As a result, the front of the vehicle is illuminated with white light from the transparent plate 52.

[0154] The scanning light from the movable device 13 is scattered in a predetermined manner when passing through the phosphor of the transparent plate 52. This reduces glare on the illuminated object in front of the automobile.

[0155] When the movable device 13 is applied to an automobile headlight, the colors of the light source device 12b and the phosphor are not limited to blue and yellow, respectively. For example, the light source device 12b may be near-ultraviolet, and the transparent plate 52 may be covered with a uniform mixture of phosphors of the three primary colors of light: blue, green, and red. Even in this case, the light passing through the transparent plate 52 can be converted to white, and the front of the automobile can be illuminated with white light.

[0156] The laser headlamp 50 has a movable device 13 that can obtain a large amount of displacement while improving the displacement stability, and therefore can irradiate light over a wide range with high precision.

[0157] [Head-mounted display] Next, a head-mounted display 60 to which the movable device of the present embodiment is applied will be described with reference to Figures 50 and 51. Here, the head-mounted display 60 is a head-mounted display that can be worn on a human head, and can have a shape similar to glasses, for example. The head-mounted display will be abbreviated as HMD hereinafter.

[0158] Fig. 50 is a perspective view illustrating an example of the appearance of the HMD 60. In Fig. 50, the HMD 60 is composed of a front 60a and temples 60b, which are provided in a pair on the left and right sides and are substantially symmetrical. The front 60a can be composed of, for example, a light guide plate 61, and the optical system, control device, etc. can be built into the temples 60b.

[0159] Fig. 51 is a diagram illustrating a portion of the configuration of the HMD 60. Note that Fig. 51 illustrates the configuration for the left eye, but the HMD 60 has a similar configuration for the right eye.

[0160] The HMD 60 includes a control device 11 , a light source unit 530 , a light amount adjusting section 507 , a movable device 13 having a mirror surface 14 , a light guide plate 61 , and a half mirror 62 .

[0161] As described above, the light source unit 530 is a unit formed by combining the laser light sources 501R, 501G, and 501B, the collimator lenses 502, 503, and 504, and the dichroic mirrors 505 and 506 using an optical housing. In the light source unit 530, the three color laser beams from the laser light sources 501R, 501G, and 501B are combined by the dichroic mirrors 505 and 506. The light source unit 530 emits the combined parallel light.

[0162] The light from the light source unit 530 is adjusted in intensity by the light intensity adjustment section 507 and then enters the movable device 13. The movable device 13 moves the mirror surface 14 in the X and Y directions based on a signal from the control device 11, and performs two-dimensional scanning with the light from the light source unit 530. The drive control of this movable device 13 is performed in synchronization with the light emission timing of the laser light sources 501R, 501G, and 501B, and a color image is formed by the scanning light.

[0163] The scanning light from the movable device 13 is incident on the light guide plate 61. The light guide plate 61 reflects the scanning light on its inner wall surface and guides it to the half mirror 62. The light guide plate 61 is made of a material such as a resin that is transparent to the wavelength of the scanning light.

[0164] The half mirror 62 reflects the light from the light guide plate 61 towards the back side of the HMD 60 and emits it in the direction of the eyes of a wearer 63 of the HMD 60. The half mirror 62 has, for example, a free-form surface shape. An image formed by the scanning light is formed on the retina of the wearer 63 by reflection on the half mirror 62. Alternatively, an image is formed on the retina of the wearer 63 by reflection on the half mirror 62 and the lens effect of the crystalline lens in the eyeball. Alternatively, spatial distortion of the image is corrected by reflection on the half mirror 62. The wearer 63 can observe an image formed by the light scanned in the X and Y directions.

[0165] Since 62 is a half mirror, an image based on light from the outside world and an image based on the scanning light are superimposed and observed by the wearer 63. By providing a mirror instead of half mirror 62, it is possible to eliminate light from the outside world and to configure so that only the image based on the scanning light can be observed.

[0166] The HMD 60 has a movable device 13 that can obtain a large amount of displacement while improving the displacement stability, and therefore can display a large-screen image with high image quality.

[0167] [Eyeball tilt position detection device (pupil or cornea position detection device 80)] Next, an eyeball tilt position detection device equipped with a movable device 13 will be described. The eyeball tilt position detection device is a pupil or cornea position detection device 80 that detects the position of the pupil or cornea. Fig. 52 is a first schematic diagram showing an example of pupil or cornea position detection device 80. Fig. 53 is a second schematic diagram showing an example of pupil or cornea position detection device 80.

[0168] In this embodiment, the "eyeball tilt position" refers to the position of the pupil or cornea of ​​the eyeball, or the direction of the user's gaze. In the following, the "eyeball tilt position" refers to the position of the pupil or cornea, and the "eyeball tilt position detection device" refers to the "pupil or cornea position detection device." The pupil or cornea position detection device described below is synonymous with a gaze direction tracking device (eye tracking device) that detects or tracks the user's gaze direction continuously or at time intervals.

[0169] The pupil or cornea position detection device 80 shown in FIG. 52 includes a light source 82, a first light deflection unit 83, a movable device 13, a second light deflection unit 85, and a light receiving unit 86.

[0170] The light source 82 includes, for example, laser light sources 82r, 82g, and 82b that emit red, green, and blue laser beams, and an infrared laser light source 82ir that emits infrared laser beams. The laser light sources 82r, 82g, and 82b may be any one of them or a combination of two of them. The laser light sources 82r, 82g, and 82b emit light for drawing an image using the movable device 13.

[0171] The infrared laser light source 82ir emits light for detecting the position of the pupil or cornea. The light for detecting the position of the pupil or cornea is not limited to infrared light and may be visible light. From the viewpoint of improving the visibility of the drawn image, it is preferable that the light for detecting the position of the pupil or cornea be invisible light.

[0172] The first light deflection unit 83 is, for example, a dichroic mirror, and deflects the light emitted from the light source 82 toward the mirror surface 14 of the movable device 13 while combining the light. The pupil or cornea position detection device 80 may be provided with a plurality of first light deflection units 83-1, 83-2, 83-3, 83-4, and 83-5 depending on the number of laser light sources 82r, 82g, and 82b and infrared laser light source 82ir. The first light deflection unit 83 includes a plurality of first light deflection units 83-1, 83-2, 83-3, 83-4, and 83-5. The plurality of first light deflection units 83-1, 83-2, 83-3, 83-4, and 83-5 deflect the respective light while combining the light.

[0173] The movable device 13 includes a mirror surface 14, and scans the light deflected by the first light deflection unit 83 in a two-dimensional direction toward the second light deflection unit 85. At this time, the movable device 13 scans the light deflected by the first light deflection unit 83 by, for example, raster scanning, to form an image. The movable device 13 can scan the light deflected by the first light deflection unit 83 by spiral scanning.

[0174] The second light deflection unit 85 is, for example, a holographic optical element, and deflects the light L1 scanned by the movable device 13 toward the user's eyeball 87. At least a portion of the light L2 deflected by the second light deflection unit 85 is incident on the user's eyeball 87 as display image light. The second light deflection unit 85 may also include multiple light deflection members. For example, multiple types of light deflection members that reflect specific light from the light source 82 may be used, and a different mirror surface may be used for each light emitted from the light source 82. A specific example is a configuration in which, in order of proximity to the eyeball 80, light deflection members that reflect light emitted from the laser light sources 82r, 82g, and 82b and a light deflection member that reflects light emitted from the infrared laser light source 82ir are stacked.

[0175] The light receiving unit 86 receives light L3 reflected by the user's eyeball 87 from the light L2 deflected by the second light deflection unit 85 and outputs a detection signal SD corresponding to the received light. The light receiving unit 86 is, for example, an imaging element capable of detecting infrared light. Furthermore, multiple light receiving units 86 may be provided at positions where they can receive light L3 reflected by the user's eyeball 87. The intensity of the light received by the light receiving unit 86 changes depending on changes in the position of the eyeball (pupil, cornea, etc.), i.e., changes in the line of sight. Therefore, the pupil or cornea position detection device 80 in this embodiment detects or estimates the pupil or cornea position based on the intensity of light received by the light receiving unit 86. Furthermore, the light receiving unit 86 may be configured to capture an image of the eyeball 87 illuminated with light L2 deflected by the second light deflection unit 85. In this case, the pupil or cornea position detection device 80 detects or estimates the tilt position of the eyeball based on the position of the pupil or cornea contained in the captured image (detection signal SD) and the position at which the light L2 deflected by the second light deflection unit 85 is reflected on the eyeball 87.

[0176] As described above, the pupil or corneal position detection device 80 according to this embodiment can detect the position of the pupil or cornea while forming an image with the movable device 13. Furthermore, the movable device 13 is configured to scan light more efficiently, so image formation and pupil or corneal position detection can be achieved with lower power consumption. Furthermore, the movable device 13 can achieve the above-described effects without changing the area required for installation in the pupil or corneal position detection device 80 compared to the configuration of the conventional technology. This allows the pupil or corneal position detection device 80 to be configured without increasing in size.

[0177] Furthermore, the pupil or cornea position detection device 80 can be mounted on a head-mounted display as, for example, an eye tracking device to detect or track the direction of the user's gaze. In this case, for example, by lowering the resolution of images displayed in the area near the user's gaze direction compared to images displayed in other areas (foveal rendering), image processing can be speeded up compared to when high-resolution images are displayed across the entire area.

[0178] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments of the present invention without departing from the scope of the claims.

[0179] All ordinal numbers, quantitative numbers, and other figures used in the description of the embodiments of the present invention are provided as examples to specifically explain the technology of the present invention, and the present invention is not limited to the illustrated figures. Furthermore, the connection relationships between components are provided as examples to specifically explain the technology of the present invention, and do not limit the connection relationships that realize the functions of the present invention.

[0180] For example, aspects of the present invention are as follows. <1> The movable device has a movable part, a drive beam having one end connected directly or indirectly to the movable part and driving the movable part, and a fixed frame to which the other end of the drive beam is connected, the drive beam being a plurality of drive beams each having a drive part, and the drive beams including an upper drive beam and a lower drive beam arranged at a distance from the upper drive beam in a normal direction of the fixed frame. <2> the upper drive beam overlaps with the lower drive beam when viewed from the normal direction of the fixed frame; <1> 1 is a movable device according to the first embodiment. <3> the number of the upper drive beams is different from the number of the lower drive beams; <1> or the above <2> 1 is a movable device according to the first embodiment. <4> The upper drive beam is connected to the lower drive beam by an adhesive. <1> From the above <3> The movable device is described in any one of the above. <5> the upper drive beam is driven by a drive voltage having an opposite phase to a drive voltage that drives the lower drive beam; <1> From the above <4> The movable device is described in any one of the above. <6> an elastic support member disposed between the upper drive beam or the lower drive beam and the movable portion, and the movable portion is resonantly driven; <1> From the above <5> The movable device is described in any one of the above. <7> the movable portion is disposed apart from either the upper drive beam or the lower drive beam in a normal direction of the fixed frame; <1> From the above <6> The movable device is described in any one of the above. <8> the upper drive beam is electrically connected to the lower drive beam by wire bonding; <1> From the above <7> The movable device is described in any one of the above. <9> the upper actuation beam is electrically connected to the lower actuation beam by a silicon through electrode; <1> From the above <7> The movable device is described in any one of the above. <10> The aforementioned <1> From the above <9> 10 is an image projection device having the movable device according to any one of the above. <11> The aforementioned <1> From the above <9> A head-up display having the movable device according to any one of the above. <12> The aforementioned <1> From the above <9> A laser headlamp having a movable device according to any one of the above. <13> The aforementioned <1> From the above <9> A head-mounted display having the movable device described in any one of the above. <14> The aforementioned <1> From the above <9> An object recognition device having the movable device according to any one of claims 1 to 4. <15> The aforementioned <11> The head-up display according to <12> The laser headlamp according to <14> A mobile object has at least one object recognition device according to the present invention. [Explanation of symbols]

[0181] 13 Mobile Devices 14 Mirror Surface 101 Moving parts 102 Movable part base 103 Ribs 111a First torsion bar spring 111b Second torsion bar spring 112u Upper driving beam 112u-1 First upper driving beam 112u-2 Second upper driving beam 112v lower drive beam 112v-1 First lower driving beam 112v-2 Second lower driving beam 112a Third drive unit 112b Fourth drive unit 113a, 113b Drive unit connection part 120 Support part 131u Upper drive unit 131u-1, 131a, 131b, 131c, 131d First upper drive unit 131u-2, 132a, 132b, 132c, 132d Second upper drive unit 131v-1, 133a, 133b, 133c, 133d First lower drive section 131v-2, 134a, 134b, 134c, 134d Second lower drive unit 135 one end 135-1 First End 135-2 Second End 136 other end 136-1 The other end of the first 136-2 The other end of the second 140 fixed frame 150 Electrode connection part 160 Board-to-board connection 161 Wire Bonding 162 Through-silicon via 200A, 200B drive group 201 Upper electrode 202 Piezoelectric part 203 Lower electrode 361 First SOI substrate 361a Silicon support layer 361b silicon oxide layer 361c Silicon active layer 362 Second SOI substrate 362a Silicon support layer 362b silicon oxide layer 362c Silicon active layer 363 Silicon oxide layer C0 Torsion center axis E1 First axis E2 Second axis [Prior art documents] [Patent documents]

[0182] [Patent Document 1] Japanese Patent Application Publication No. 10-215009

Claims

1. A movable part; a drive beam having one end directly or indirectly connected to the movable part and driving the movable part; a fixed frame to which the other end of the drive beam is connected, the actuation beam is a plurality of actuation beams each having an actuation portion, The movable device, wherein the drive beam includes an upper drive beam and a lower drive beam disposed spaced apart from the upper drive beam in a normal direction of the fixed frame.

2. The movable device according to claim 1 , wherein the upper drive beam overlaps with the lower drive beam when viewed from a normal direction of the fixed frame.

3. The movable device of claim 1 , wherein the number of the upper drive beams is different from the number of the lower drive beams.

4. The movable device of claim 1 , wherein the upper drive beam is connected to the lower drive beam by an adhesive.

5. The movable device according to claim 1 , wherein the upper drive beam is driven by a drive voltage having an opposite phase to a drive voltage that drives the lower drive beam.

6. an elastic support member disposed between the movable portion and either the upper drive beam or the lower drive beam; The movable device according to claim 1 , wherein the movable part is resonantly driven.

7. The movable device according to claim 1 , wherein the movable portion is disposed apart from either the upper drive beam or the lower drive beam in a normal direction of the fixed frame.

8. The movable device of claim 1 , wherein the upper drive beam is electrically connected to the lower drive beam by wire bonding.

9. The movable device of claim 1 , wherein the upper actuation beam is electrically connected to the lower actuation beam by a through-silicon via.

10. An image projection device comprising the movable device according to any one of claims 1 to 9.

11. A head-up display comprising a movable device according to any one of claims 1 to 9.

12. A laser headlamp comprising a movable device according to any one of claims 1 to 9.

13. A head-mounted display comprising the movable device according to any one of claims 1 to 9.

14. An object recognition device comprising the movable device according to any one of claims 1 to 9.

15. A mobile object comprising the head-up display according to claim 11.

16. A moving object comprising the laser headlamp according to claim 12.

17. A moving object comprising the object recognition device according to claim 14.

Images