Lighting device

Abstract

To provide a lighting device capable of suppressing warpage to improve heat radiation property even when a circuit substrate is made thin.SOLUTION: A lighting device (100) has: a circuit board (30) on a first surface of which a light-emitting element (10) is mounted; a heat radiation member (40) arranged on a second surface of the circuit board (30); and a heat conduction member (37) arranged between the circuit board (30) and the heat radiation member (40). The circuit board (30) is provided with a fastening hole (36) into which a fastening member (50) is inserted. In the plane of the first surface, a line connecting the center of the fastening hole (36) and the center of the light-emitting element (10) is defined as an imaginary line, a line perpendicular to the imaginary line is defined as an imaginary boundary line, a portion of an area farther from the fastening hole (36) than the imaginary boundary line is defined as a pressing area, and at least one pressing member (71) is in contact within the pressing area.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a lighting device, and more particularly to a lighting device in which a light-emitting element is mounted on a circuit board. [Background technology]

[0002] In recent years, vehicle lamps using light-emitting diodes (LEDs) as light sources have become widespread. Also, as a lighting device used in a vehicle lamp, a lighting device in which a plurality of LEDs are arranged on a circuit board to irradiate light with a desired brightness and light distribution pattern has been proposed (see Patent Document 1, etc.).

[0003] It is generally known that LEDs generate heat as they emit light, which causes their temperature to rise, resulting in changes in the wavelength of light emitted and a decrease in light-emitting efficiency. Therefore, in headlights and other devices that emit a large amount of light, it is important to effectively dissipate the heat generated by the LED to the outside and suppress temperature increases. Another proposal is to form through-hole wiring and heat-dissipation wiring on a circuit board made of insulating material, effectively transferring the heat from the LED to the heat-dissipation wiring on the back side, and dissipating the heat from a heat-dissipating member in contact with the heat-dissipation wiring. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-073762 Summary of the Invention [Problem to be solved by the invention]

[0005] In such conventional lighting devices, a thermally conductive member is placed in contact between the heat dissipation member and the circuit board to improve heat dissipation from the light emitting element. However, when the circuit board is made thinner to further improve heat dissipation, the rigidity of the circuit board decreases, and the thermally conductive member sandwiched between the heat dissipation member and the circuit board does not expand sufficiently, causing the circuit board to warp and hindering heat dissipation.

[0006] Therefore, the present invention has been made in consideration of the above-mentioned conventional problems, and aims to provide a lighting device that can suppress warping and improve heat dissipation even when the circuit board is made thin. [Means for solving the problem]

[0007] In order to solve the above problem, the lighting device of the present invention comprises a circuit board having a light-emitting element mounted on a first surface thereof, a heat dissipation member arranged on a second surface of the circuit board, and a heat conduction member arranged between the circuit board and the heat dissipation member, wherein the circuit board is provided with fastening holes for inserting fastening members, and within the plane of the first surface, a line connecting the center of the fastening hole and the center of the light-emitting element is defined as a virtual line, a line perpendicular to the virtual line is defined as a virtual boundary line, a part of the area farther from the fastening hole than the virtual boundary line is defined as a pressing area, and the lighting device has at least one pressing member abutting within the pressing area.

[0008] In the lighting device of the present invention, the pressing member abuts against the first surface of the circuit board in the pressing region located farther from the fastening hole, so that the fastening hole and the pressing member can apply force to the circuit board on both sides of the light-emitting element in the direction of the heat dissipation member, thereby making it possible to suppress warping and improve heat dissipation even when the circuit board is made thinner.

[0009] In one aspect of the present invention, the pressing area is within 50 mm from the center of the light emitting element.

[0010] In one aspect of the present invention, the circuit board has through-hole wiring formed through the first surface to the second surface, and the light-emitting element is mounted in a position overlapping the through-hole wiring in a planar view.

[0011] In one aspect of the present invention, the heat conducting member is disposed at a position overlapping the through-hole wiring in a plan view.

[0012] In one aspect of the present invention, a plurality of combinations of the pressing region and the pressing member are provided.

[0013] In addition, in one aspect of the present invention, the device includes a housing portion to which the circuit board is attached and a light distribution adjustment portion to adjust the light distribution pattern from the light-emitting element, and the pressing member is formed integrally with the housing portion or the light distribution adjustment portion. [Effects of the Invention]

[0014] The present invention can provide a lighting device that can suppress warping and improve heat dissipation even when the circuit board is made thinner. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a schematic cross-sectional view illustrating an overview of an illumination device 100 according to a first embodiment. [Figure 2] 2 is a schematic plan view showing an example of arrangement on a circuit board 30 according to the first embodiment. FIG. [Figure 3] 2 is a schematic plan view showing the position of a pressing area 12 in the plane of a circuit board 30. FIG. [Figure 4] 3 is a schematic perspective view showing an example of mounting the circuit board 30 to the housing portion 70. FIG. [Figure 5] 3 is a schematic partial enlarged view showing an example of the structure of a housing portion 70 to which a circuit board 30 is attached. FIG. [Figure 6] 10 is a schematic perspective view showing examples of pressing members 71 and 81 that come into contact with a circuit board 30. FIG. [Figure 7] 10A and 10B are schematic cross-sectional views showing examples of pressing members 71 and 81 that come into contact with a circuit board 30. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0016] (First embodiment) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The same or equivalent components, members, and processes shown in each drawing will be denoted by the same reference numerals, and redundant description will be omitted where appropriate. In the following description, an illumination device 100 according to the present invention will be described as being applied to a vehicle lamp. FIG. 1 is a schematic cross-sectional view illustrating an overview of the illumination device 100 according to this embodiment. As shown in FIG. 1, the illumination device 100 includes a light-emitting element 10, an electronic component 20, a circuit board 30, and a heat dissipation member 40. The circuit board 30 includes a connection terminal portion 21, a first wiring layer 31, a second wiring layer 32, through-hole wiring 33, a hole-filling resin 34, a protective layer 35, fastening holes 36, and a heat-conducting member 37. The circuit board 30 is fixed to the heat dissipation member 40 by a fastening member 50, and a pressing member 71 abuts against a first surface of the circuit board 30. A connector 60 is connected to the connection terminal portion 21.

[0017] The light-emitting element 10 is a component mounted on the surface (first surface) of the circuit board 30 and emits light of a predetermined wavelength when a voltage is applied. While FIG. 1 illustrates a surface-mounted light-emitting element 10 electrically connected to the first wiring layer 31 using solder, the light-emitting element 10 may be electrically connected to the first wiring layer 31 by wire bonding. For example, when the lighting device 100 is used as a headlamp for a vehicle lamp, a white LED may be used as the light-emitting element 10; when used as a tail lamp or stop lamp, a red LED may be used; and when used as a turn signal lamp, an amber LED may be used. The structure of the light-emitting element 10 is not limited, and may be a packaged LED chip, or a bare LED chip may be directly mounted. The white LED may be a combination of a GaN-based LED emitting primary light in the blue to ultraviolet wavelength range and a phosphor, or a combination of LED chips of each color (RGB).

[0018] The electronic component 20 is mounted on the front surface (first surface) or back surface (second surface) of the circuit board 30, and is a component that constitutes an electronic circuit by realizing various functions when supplied with power and control signals. While Fig. 1 illustrates a surface-mounted case in which the electronic component 20 is electrically connected to the first wiring layer 31 using solder, it may also be electrically connected to the first wiring layer 31 by wire bonding using a wire. The type and number of the electronic component 20 are not limited, and known components such as resistors, capacitors, and integrated circuits can be used.

[0019] The connection terminal portion 21 is a component mounted on the front surface (first surface) or back surface (second surface) of the circuit board 30, and is electrically connected to a connector 60 of a cable (not shown) that transmits power and signals from the outside. The shape and structure of the connection terminal portion 21 are not limited. The shape and structure of the cable are also not limited, and a conventionally known flexible cable or the like can be used. The connector 60 has a shape corresponding to the connection terminal portion 21, and is mechanically and electrically connectable to the connection terminal portion 21.

[0020] The circuit board 30 is a plate-like member having a substantially plate-like base material on which a first wiring layer 31, a second wiring layer 32, through-hole wiring 33, a hole-filling resin 34, a protective layer 35, and fastening holes 36 are formed. A thermally conductive member 37 is disposed between the circuit board 30 and the heat dissipation member 40. The material constituting the base material of the circuit board 30 is not particularly limited, but it is preferable to use a resin material with excellent electrical insulation properties, and a glass epoxy resin or the like used in ordinary printed wiring boards can be used, such as FR4 (Flame Retardant Type 4).

[0021] The heat dissipation member 40 is made of a material with a higher thermal conductivity than the base material of the circuit board 30, and is disposed on the rear surface (second surface) of the circuit board 30 to dissipate heat from the circuit board 30. The material constituting the heat dissipation member 40 is not limited, but metals such as anodized aluminum or copper can be used. In FIG. 1, the heat dissipation member 40 is shown in a shape in which a plurality of heat dissipation fins are erected from a plate-like portion, but the shape and structure are not limited.

[0022] The fastening members 50 are inserted into the fastening holes 36 provided in the circuit board 30 to fasten the circuit board 30 to the heat dissipation member 40. The specific configuration of the fastening members 50 is not limited, and they may be screws or bolts that screw into screw holes formed in the heat dissipation member 40, or crimped portions formed to protrude from the heat dissipation member 40. By fastening with the fastening members 50, the circuit board 30 is fixed at the position of the fastening holes 36 while being pressed toward the heat dissipation member 40.

[0023] The pressing member 71 is a member that comes into contact with the surface (first surface) of the circuit board 30 and applies a force to the circuit board 30 in the direction of the heat dissipation member 40 to press it. Although the pressing member 71 is shown in a columnar shape in FIG. 1, the specific shape and structure of the pressing member 71 are not limited to these. As an example, a part of the housing 70 or the reflector 80, which will be described later, may extend toward the circuit board 30 so that a force is applied to the position where the pressing member 71 comes into contact with the circuit board 30. The position on the circuit board 30 where the pressing member 71 comes into contact will be described in detail below.

[0024] The first wiring layer (element wiring) 31 is a wiring pattern formed on the surface (first surface) of the circuit board 30. Part of the first wiring layer 31 functions as a land portion on which the light emitting element 10 or electronic component 20 is mounted, and as a terminal portion to which wires are electrically connected. The light emitting element 10 and electronic component 20 are electrically connected to the first wiring layer 31, and an electronic circuit is formed on the circuit board 30. In the first wiring layer 31, a through-hole wiring 33 is formed in the region of the land portion on which the light emitting element 10 is mounted.

[0025] The second wiring layer (heat dissipation wiring) 32 is a wiring pattern formed on the back surface (second surface) of the circuit board 30. As shown in FIG. 1, the second wiring layer 32 may be provided with a region electrically connected to the first wiring layer 31 by the through-hole wiring 33 and a region electrically isolated from the through-hole wiring 33, in different regions. The region of the second wiring layer 32 connected to the through-hole wiring 33 functions as a heat dissipation path, as will be described later. Furthermore, the region of the second wiring layer 32 electrically isolated from the through-hole wiring 33 may be connected to a ground potential.

[0026] The through-hole wiring 33 is an electrically conductive wiring formed on the inner wall of a through-hole (penetrating hole) that penetrates from the front surface side to the back surface side of the circuit board 30. A conventionally known plating method or the like can be used as a method for forming the through-hole wiring 33. The through-hole wiring 33 is electrically connected to a part of the first wiring layer 31 and a part of the second wiring layer 32. There are no limitations on the region where the through-hole wiring 33 is provided, but by providing the through-hole wiring 33 at a position in the first wiring layer 31 that corresponds to the land portion on which the light-emitting element 10 is mounted, heat generated by light emission can be efficiently transmitted to the back surface side.

[0027] Filling resin 34 is a resin material that fills the through holes in which through-hole wiring 33 is formed. There are no limitations on the material that constitutes filling resin 34, and one example is a thermosetting epoxy resin. In order to improve the thermal conductivity of filling resin 34, a filler with high thermal conductivity may be mixed into the resin material.

[0028] The protective layer 35 is formed on the back surface of the circuit board 30 to cover the second wiring layer 32, and is made of an insulating material. The material for the protective layer 35 is not limited, and a conventionally known resist material can be used. Although not shown in FIG. 1 , the protective layer 35 may also be formed on the front surface of the circuit board 30 to cover a portion of the first wiring layer 31. In the example shown in FIG. 1 , the protective layer 35 is formed over the entire back surface of the circuit board 30, but the back surface of the circuit board 30 may be partially exposed as long as it covers at least the area where the second wiring layer 32 is formed.

[0029] The fastening holes 36 are through-holes that penetrate from the front surface (first surface) to the back surface (second surface) of the circuit board 30. As described above, the fastening members 50 are inserted into the fastening holes 36 and fastened, thereby fixing the circuit board 30 to the heat dissipation member 40. The position and shape of the fastening holes 36 are not limited, but inserting and fastening the fastening members 50 into the fastening holes 36 may cause distortion of the circuit board 30 in the vicinity of the fastening holes 36. Therefore, it is preferable not to mount the light emitting elements 10 or electronic components 20 within 15 mm from the center of the fastening holes 36.

[0030] The heat conduction member 37 is a member with high thermal conductivity that is disposed between the circuit board 30 and the heat dissipation member 40. In order to improve the voltage resistance of the lighting device 100, it is preferable that the heat conduction member 37 be insulating. There are no restrictions on the material that constitutes the heat conduction member 37, but one example is heat dissipation grease mixed with a filler of metal particles or metal oxide particles. Alternatively, a heat conduction sheet molded into a sheet shape may be used as the heat conduction member 37.

[0031] Fig. 2 is a schematic plan view showing an example of an arrangement on a circuit board 30 according to this embodiment. In the example shown in Fig. 2, a first wiring layer 31 is patterned on the circuit board 30, and a plurality of light-emitting elements 10 are surface-mounted in a light-emitting element mounting region 11 indicated by a dashed line on the first wiring layer 31. Furthermore, a plurality of electronic components 20 and connection terminal portions 21 are mounted on the first wiring layer 31 on the circuit board 30. Furthermore, a fastening hole 36 is formed near the center of the circuit board 30.

[0032] 2, the light-emitting element mounting region 11 is provided in a position on the surface of the circuit board 30 closer to the outer periphery than the fastening holes 36. Also, as shown in FIG. 1, the heat conductive member 37 is disposed directly below the light-emitting element 10 and the through-hole wiring 33. Therefore, the heat conductive member 37 is disposed in a position overlapping the light-emitting element mounting region 11, the light-emitting element 10, and the through-hole wiring 33 in a plan view of the circuit board 30.

[0033] 1 and 2, the light emitting element 10 emits light when power and a control signal are transmitted from the outside to an electronic circuit formed by the first wiring layer 31, the light emitting element 10, and the electronic component 20 via a cable, a connector 60, and a connection terminal portion 21. Heat generated by the light emission of the light emitting element 10 is transmitted to the heat dissipation member 40 via the first wiring layer 31, the through-hole wiring 33, the second wiring layer 32, the protective layer 35, and the heat conduction member 37. The heat dissipation member 40 dissipates the heat to the outside of the lighting device 100, thereby cooling the lighting device 100.

[0034] 3 is a schematic plan view showing the position of the pressure area 12 on the surface of the circuit board 30. In the example shown in FIG. 3, the areas indicated by thin dashed lines in the upper left and lower right of the circuit board 30 are the pressure areas 12. The thick dashed lines, dashed lines, and double-dashed lines shown in the figure are all imaginary lines for setting the pressure area 12.

[0035] When setting the pressing area 12, first, a line segment connecting the center of the fastening hole 36 and the center of the light-emitting element 10 is assumed as a virtual line. Next, a line perpendicular to the virtual line within the plane of the circuit board 30 is assumed as a virtual boundary line. Finally, a virtual square including the virtual line and the virtual boundary line is assumed. Here, the length of the virtual line is the distance D between the fastening hole 36 and the light-emitting element 10, and the virtual square has one side equal to the distance D. FIG. 3 shows an example in which virtual lines, virtual boundary lines, and virtual squares are set for three light-emitting elements 10, but virtual lines, virtual boundary lines, and virtual squares can be set in the same way for all light-emitting elements 10.

[0036] Next, at least a portion of the region farther from the fastening hole 36 than the imaginary boundary line set in the above-described procedure is set as the pressing region 12. In the example shown in FIG. 3 , the lower right region farther from the imaginary square indicated by the dashed-dotted line and the upper left region farther from the imaginary square indicated by the dashed-dotted line are set as the pressing region 12. The pressing region 12 set in the upper left is further from the imaginary boundary line of the imaginary square indicated by the thick dashed line. Although not shown in FIG. 3 , pressing regions 12 may be set for each of multiple light-emitting elements 10. As an example, a pressing region 12 can be set within a larger imaginary square indicated by the dashed-dotted line, based on the imaginary boundary line indicated by the thick dashed line. In the example shown in FIG. 3 , the pressing region 12 is set based on the light-emitting element 10 located farther from the fastening hole 36, and the region not included in any of the imaginary squares is set as the pressing region 12.

[0037] As described above, the pressing area 12 is an area farther from the fastening hole 36 than the imaginary boundary line, but if it is too far from the light emitting element 10, it becomes difficult to suppress warping of the circuit board 30, so it is preferable to set it within a predetermined distance from the light emitting element 10. More specifically, it is preferably within 50 mm from the center of the light emitting element 10, and more preferably within 30 mm.

[0038] As described with reference to FIGS. 1 to 3 , in the lighting device 100, the circuit board 30 is fixed to the heat dissipation member 40 by the fastening member 50 at the fastening hole 36, and the pressing members 71 and 81 abut against the surface of the circuit board 30 in the pressing region 12. The pressing region 12 is located farther from the fastening hole 36 than the imaginary boundary line, and the light emitting element 10 is located midway between the fastening hole 36 and the position where the pressing members 71 and 81 abut. This allows the pressing members 71 and 81 and the fastening member 50 to apply force toward the heat dissipation member 40 to two locations on the surface of the circuit board 30 that sandwich the light emitting element 10, even if the circuit board 30 is thin and has low rigidity. This prevents warping of the circuit board 30, which occurs when the heat conduction member 37 is sandwiched between the circuit board 30 and the heat dissipation member 40, and ensures a uniform thickness of the heat conduction member 37, improving heat dissipation.

[0039] Fig. 4 is a schematic perspective view showing an example of mounting the circuit board 30 to the housing part 70. In the example shown in Fig. 4, the heat dissipation member 40 is provided with a flange part and a frame part 41, and the circuit board 30 is fastened to the heat dissipation member 40 within the frame part 41 with fastening members 50. The lighting device 100 also includes the housing part 70, and the heat dissipation member 40 is mounted to the housing part 70 by inserting the frame part 41 into an opening provided at a predetermined position in the housing part 70. The specific structure and method for mounting the heat dissipation member 40 to the housing part 70 are not limited, and conventionally known methods such as fitting or screw fastening can be used.

[0040] Fig. 5 is a schematic partial enlarged view showing an example of the structure of the housing 70 to which the circuit board 30 is attached. In the example shown in Fig. 5, the housing 70 has an opening shaped to correspond to the frame 41, and the frame 41 is inserted into the opening to attach the heat dissipation member 40 to the housing 70. In addition, a reflector 80, pressing members 71, 81, and inner lenses 91, 92 are provided within the opening of the housing 70.

[0041] The housing 70 is a housing portion that forms the outer shape of the lighting device 100 and houses and holds the various components, and is made of a light-blocking material that blocks light. Although not shown in FIG. 5, the housing 70 has a front opening formed therein, and an outer lens is provided to cover the front opening. Furthermore, a portion of the housing 70 is erected within the opening as a pressing member 71, and the pressing member 71 extends toward the circuit board 30.

[0042] The reflector 80 is an optical element having a reflective surface that reflects light, and reflects the light emitted from the light emitting element 10 toward the outer lens, adjusting the light distribution pattern and emitting the adjusted light. Therefore, the reflector 80 corresponds to the light distribution adjusting unit of the present invention. Furthermore, a portion of the reflector 80 is erected within the opening as a pressing member 81, and the pressing member 81 extends toward the circuit board 30.

[0043] The inner lenses 91 and 92 are optical components arranged on the light emission surface side of the light emitting element 10, and adjust and emit the light distribution pattern of light emitted from the light emitting element 10. Therefore, the inner lenses 91 and 92 also correspond to the light distribution adjustment unit of the present invention. The shape and size of the inner lenses 91 and 92 are not limited, and conventionally known convex lenses, concave lenses, Fresnel lenses, TIR (Total Internal Reflection) lenses, etc. can be used.

[0044] The pressing member 71 is a part of the housing part 70 that extends toward the circuit board 30. The pressing member 81 is a part of the reflector 80 that extends toward the circuit board 30. As described above, the pressing members 71, 81 come into contact with the surface (first surface) of the circuit board 30 and apply a force toward the heat dissipation member 40 to press the circuit board 30.

[0045] 6 is a schematic perspective view showing an example of pressing members 71, 81 that come into contact with the circuit board 30. For simplicity, FIG. 6 shows only the tip portions of the pressing members 71, 81 that extend from the housing portion 70 and the reflector 80 in a cutaway view. As shown in FIG. 6, the multiple pressing members 71, 81 come into contact with the surface (first surface) of the circuit board 30 that they face at their respective positions. Furthermore, the pressing members 71, 81 provided at positions facing the above-described pressing region 12 come into contact with the surface (first surface) of the circuit board 30 within the pressing region 12.

[0046] FIG. 7 is a schematic cross-sectional view showing an example of pressing members 71, 81 contacting circuit board 30. The example shown in FIG. 7 schematically shows the pressing members 71, 81 contacting circuit board 30 in areas other than pressing area 12 on circuit board 30. As shown in FIG. 7, pressing member 81 extends from reflector 80 provided around light-emitting element 10, and inner lenses 91, 92 are arranged facing light-emitting element 10. The inner lenses 91, 92 may be held by housing 70 or reflector 80. While FIGS. 5 and 7 show an example of an extended portion of reflector 80 as pressing member 81, portions of inner lenses 91, 92, which are light distribution adjustment units, may be extended and used as pressing member 81.

[0047] As described above, in the lighting device 100 of this embodiment, the pressing members 71, 81 abut against the first surface of the circuit board 30 in the pressing regions 12 located farther from the fastening holes 36, and this allows the fastening holes 36 and the pressing members 71, 81 to apply force to the circuit board 30 on both sides of the light emitting element 10 in the direction of the heat dissipation member 40. This makes it possible to suppress warping and improve heat dissipation even when the circuit board 30 is made thinner.

[0048] The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present invention. [Explanation of symbols]

[0049] 100...Lighting equipment 10...Light emitting element 20...Electronic components 30...Circuit board 40...Heat dissipation member 50...Fastening member 60...Connector 70...Housing section 80...Reflector 11...Light emitting element mounting area 12...Pressure area 21...Connection terminal 31...First wiring layer 32...Second wiring layer 33...Through-hole wiring 34...Hole-filling resin 35…Protective layer 36…Fastening hole 37...Heat conductive material 41...Frame section 71, 81...Pressing members 91,92...Inner lens

Claims

1. a circuit board on which a light emitting element is mounted on a first surface; a heat dissipation member disposed on a second surface of the circuit board; a heat conduction member disposed between the circuit board and the heat dissipation member, the circuit board is provided with fastening holes for inserting fastening members; Within the plane of the first surface, a line connecting the center of the fastening hole and the center of the light emitting element is defined as a virtual line, a line perpendicular to the virtual line is defined as a virtual boundary line, and a part of an area farther from the fastening hole than the virtual boundary line is defined as a pressing area; A lighting device comprising at least one pressing member that abuts within the pressing area.

2. 10. The lighting device according to claim 1, The lighting device is characterized in that the pressing area is within 50 mm from the center of the light-emitting element.

3. 10. The lighting device according to claim 1, the circuit board has through-hole wiring formed to penetrate from the first surface to the second surface, The lighting device is characterized in that the light emitting element is mounted at a position overlapping the through-hole wiring in a plan view.

4. 4. The lighting device according to claim 3, The lighting device is characterized in that the heat conduction member is disposed at a position overlapping the through-hole wiring in a plan view.

5. 10. The lighting device according to claim 1, A lighting device characterized in that a plurality of combinations of the pressing area and the pressing member are provided.

6. 6. The lighting device according to claim 1, a housing portion to which the circuit board is attached; a light distribution adjustment unit that adjusts a light distribution pattern from the light emitting element, The lighting device according to claim 1, wherein the pressing member is integrally formed with the housing portion or the light distribution adjustment portion.

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