Lighting device

Abstract

To provide a lighting device capable of suppressing warpage to improve heat radiation property even when a circuit substrate is made thin.SOLUTION: A lighting device (100) has: a circuit board (30) on a first surface of which a light-emitting element (10) is mounted; a heat radiation member (40) arranged on a second surface of the circuit board (30); a heat conduction member (37) arranged between the circuit board (30) and the heat radiation member (40); and a pressing member (71) that is in contact with the first surface at a pressing position on the first surface. The circuit board (30) is provided with a plurality of fastening holes (36) into which a fastening member (50) is inserted. The center of the light emitting element (10) is positioned within a warp reduction area connecting an outer periphery of the plurality of fastening holes (36) and the pressing position.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a lighting device, and more particularly to a lighting device in which a light-emitting element is mounted on a circuit board. [Background technology]

[0002] In recent years, vehicle lamps using light-emitting diodes (LEDs) as light sources have become widespread. Also, as a lighting device used in a vehicle lamp, a lighting device in which a plurality of LEDs are arranged on a circuit board to irradiate light with a desired brightness and light distribution pattern has been proposed (see Patent Document 1, etc.).

[0003] It is generally known that LEDs generate heat as they emit light, which causes their temperature to rise, resulting in changes in the wavelength of light emitted and a decrease in light-emitting efficiency. Therefore, in headlights and other devices that emit a large amount of light, it is important to effectively dissipate the heat generated by the LED to the outside and suppress temperature increases. Another proposal is to form through-hole wiring and heat-dissipation wiring on a circuit board made of insulating material, effectively transferring the heat from the LED to the heat-dissipation wiring on the back side, and dissipating the heat from a heat-dissipating member in contact with the heat-dissipation wiring. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-073762 Summary of the Invention [Problem to be solved by the invention]

[0005] In such conventional lighting devices, a thermally conductive member is placed in contact between the heat dissipation member and the circuit board to improve heat dissipation from the light emitting element. However, when the circuit board is made thinner to further improve heat dissipation, the rigidity of the circuit board decreases, and the thermally conductive member sandwiched between the heat dissipation member and the circuit board does not expand sufficiently, causing the circuit board to warp and hindering heat dissipation.

[0006] Therefore, the present invention has been made in consideration of the above-mentioned conventional problems, and aims to provide a lighting device that can suppress warping and improve heat dissipation even when the circuit board is made thin. [Means for solving the problem]

[0007] In order to solve the above problem, the lighting device of the present invention comprises a circuit board on which a light-emitting element is mounted on a first surface, a heat dissipation member arranged on a second surface of the circuit board, a heat conduction member arranged between the circuit board and the heat dissipation member, and a pressing member abutting the first surface at a pressing position on the first surface, wherein the circuit board is provided with a plurality of fastening holes for inserting fastening members, and the center of the light-emitting element is located within a warp reduction area connecting the outer peripheries of the plurality of fastening holes and the pressing position.

[0008] In the lighting device of the present invention, the area connecting the outer peripheries of the multiple fastening holes and the pressing position is defined as the warp reduction area, and the center of the light-emitting element is located within the warp reduction area. Therefore, the fastening member and the pressing member can press down on the vicinity of the light-emitting element, making it possible to suppress warping and improve heat dissipation even when the circuit board is made thinner.

[0009] In one aspect of the present invention, the pressing position is within 50 mm from the center of any one of the light emitting elements.

[0010] In one aspect of the present invention, the circuit board has through-hole wiring formed through the first surface to the second surface, and the light-emitting element is mounted in a position overlapping the through-hole wiring in a planar view.

[0011] In one aspect of the present invention, the heat conducting member is disposed at a position overlapping the through-hole wiring in a plan view.

[0012] In one aspect of the present invention, a plurality of the pressing members and the pressing positions are provided.

[0013] In addition, in one aspect of the present invention, the device includes a housing portion to which the circuit board is attached and a light distribution adjustment portion to adjust the light distribution pattern from the light-emitting element, and the pressing member is formed integrally with the housing portion or the light distribution adjustment portion. [Effects of the Invention]

[0014] The present invention can provide a lighting device that can suppress warping and improve heat dissipation even when the circuit board is made thinner. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a schematic cross-sectional view illustrating an overview of an illumination device 100 according to a first embodiment. [Figure 2] 2 is a schematic plan view showing an example of arrangement on a circuit board 30 according to the first embodiment and the position of a pressing area 12. FIG. [Figure 3] 3 is a schematic perspective view showing an example of mounting the circuit board 30 to the housing portion 70. FIG. [Figure 4] 10 is a schematic partial enlarged view showing an example of the structure of a housing portion 70 to which a circuit board 30 is attached, and examples of pressing members 71 and 81. FIG. [Figure 5] 10 is a schematic plan view illustrating a fastening hole 36, a pressing position 72, and a mounting position of a light emitting element 10. FIG. [Figure 6] 10 is a schematic plan view illustrating a fastening hole 36, a pressing position 72, and a mounting position of a light emitting element 10 in a lighting device 100 according to a second embodiment. FIG. [Figure 7] 10 is a schematic plan view illustrating a fastening hole 36, a pressing position 72, and a mounting position of a light emitting element 10 in a lighting device 100 according to a third embodiment. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0016] (First embodiment) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The same or equivalent components, members, and processes shown in each drawing will be denoted by the same reference numerals, and redundant description will be omitted where appropriate. In the following description, an illumination device 100 according to the present invention will be described as being applied to a vehicle lamp. FIG. 1 is a schematic cross-sectional view illustrating an overview of the illumination device 100 according to this embodiment. As shown in FIG. 1, the illumination device 100 includes a light-emitting element 10, an electronic component 20, a circuit board 30, and a heat dissipation member 40. The circuit board 30 includes a connection terminal portion 21, a first wiring layer 31, a second wiring layer 32, through-hole wiring 33, a hole-filling resin 34, a protective layer 35, fastening holes 36, and a heat-conducting member 37. The circuit board 30 is fixed to the heat dissipation member 40 by a fastening member 50, and a pressing member 71 abuts against a first surface of the circuit board 30. A connector 60 is connected to the connection terminal portion 21.

[0017] The light-emitting element 10 is a component mounted on the surface (first surface) of the circuit board 30 and emits light of a predetermined wavelength when a voltage is applied. While FIG. 1 illustrates a surface-mounted light-emitting element 10 electrically connected to the first wiring layer 31 using solder, the light-emitting element 10 may be electrically connected to the first wiring layer 31 by wire bonding. For example, when the lighting device 100 is used as a headlamp for a vehicle lamp, a white LED may be used as the light-emitting element 10; when used as a tail lamp or stop lamp, a red LED may be used; and when used as a turn signal lamp, an amber LED may be used. The structure of the light-emitting element 10 is not limited, and may be a packaged LED chip, or a bare LED chip may be directly mounted. The white LED may be a combination of a GaN-based LED emitting primary light in the blue to ultraviolet wavelength range and a phosphor, or a combination of LED chips of each color (RGB).

[0018] The electronic component 20 is mounted on the front surface (first surface) or back surface (second surface) of the circuit board 30, and is a component that constitutes an electronic circuit by realizing various functions when supplied with power and control signals. While Fig. 1 illustrates a surface-mounted case in which the electronic component 20 is electrically connected to the first wiring layer 31 using solder, it may also be electrically connected to the first wiring layer 31 by wire bonding using a wire. The type and number of the electronic component 20 are not limited, and known components such as resistors, capacitors, and integrated circuits can be used.

[0019] The connection terminal portion 21 is a component mounted on the front surface (first surface) or back surface (second surface) of the circuit board 30, and is electrically connected to a connector 60 of a cable (not shown) that transmits power and signals from the outside. The shape and structure of the connection terminal portion 21 are not limited. The shape and structure of the cable are also not limited, and a conventionally known flexible cable or the like can be used. The connector 60 has a shape corresponding to the connection terminal portion 21, and is mechanically and electrically connectable to the connection terminal portion 21.

[0020] The circuit board 30 is a plate-like member having a substantially plate-like base material on which a first wiring layer 31, a second wiring layer 32, through-hole wiring 33, a hole-filling resin 34, a protective layer 35, and fastening holes 36 are formed. A thermally conductive member 37 is disposed between the circuit board 30 and the heat dissipation member 40. The material constituting the base material of the circuit board 30 is not particularly limited, but it is preferable to use a resin material with excellent electrical insulation properties, and a glass epoxy resin or the like used in ordinary printed wiring boards can be used, such as FR4 (Flame Retardant Type 4).

[0021] The heat dissipation member 40 is made of a material with a higher thermal conductivity than the base material of the circuit board 30, and is disposed on the rear surface (second surface) of the circuit board 30 to dissipate heat from the circuit board 30. The material constituting the heat dissipation member 40 is not limited, but metals such as anodized aluminum or copper can be used. In FIG. 1, the heat dissipation member 40 is shown in a shape in which a plurality of heat dissipation fins are erected from a plate-like portion, but the shape and structure are not limited.

[0022] The fastening members 50 are inserted into the fastening holes 36 provided in the circuit board 30 to fasten the circuit board 30 to the heat dissipation member 40. The specific configuration of the fastening members 50 is not limited, and they may be screws or bolts that screw into screw holes formed in the heat dissipation member 40, or crimped portions formed to protrude from the heat dissipation member 40. By fastening with the fastening members 50, the circuit board 30 is fixed at the position of the fastening holes 36 while being pressed toward the heat dissipation member 40.

[0023] The pressing member 71 is a member that comes into contact with the surface (first surface) of the circuit board 30 and applies a force to the circuit board 30 in the direction of the heat dissipation member 40 to press it. Although the pressing member 71 is shown in FIG. 1 to have a columnar shape, the specific shape and structure of the pressing member 71 are not limited to these. As an example, a part of the housing part 70 or the reflector, which will be described later, may extend toward the circuit board 30 so that a force is applied to the position where the pressing member 71 comes into contact with the circuit board 30. The position on the circuit board 30 where the pressing member 71 comes into contact (pressing position 72) will be described in detail below.

[0024] The first wiring layer (element wiring) 31 is a wiring pattern formed on the surface (first surface) of the circuit board 30. Part of the first wiring layer 31 functions as a land portion on which the light emitting element 10 or electronic component 20 is mounted, and as a terminal portion to which wires are electrically connected. The light emitting element 10 and electronic component 20 are electrically connected to the first wiring layer 31, and an electronic circuit is formed on the circuit board 30. In the first wiring layer 31, a through-hole wiring 33 is formed in the region of the land portion on which the light emitting element 10 is mounted.

[0025] The second wiring layer (heat dissipation wiring) 32 is a wiring pattern formed on the back surface (second surface) of the circuit board 30. As shown in FIG. 1, the second wiring layer 32 may be provided with a region electrically connected to the first wiring layer 31 by the through-hole wiring 33 and a region electrically isolated from the through-hole wiring 33, in different regions. The region of the second wiring layer 32 connected to the through-hole wiring 33 functions as a heat dissipation path, as will be described later. Furthermore, the region of the second wiring layer 32 electrically isolated from the through-hole wiring 33 may be connected to a ground potential.

[0026] The through-hole wiring 33 is an electrically conductive wiring formed on the inner wall of a through-hole (penetrating hole) that penetrates from the front surface side to the back surface side of the circuit board 30. A conventionally known plating method or the like can be used as a method for forming the through-hole wiring 33. The through-hole wiring 33 is electrically connected to a part of the first wiring layer 31 and a part of the second wiring layer 32. There are no limitations on the region where the through-hole wiring 33 is provided, but by providing the through-hole wiring 33 at a position in the first wiring layer 31 that corresponds to the land portion on which the light-emitting element 10 is mounted, heat generated by light emission can be efficiently transmitted to the back surface side.

[0027] Filling resin 34 is a resin material that fills the through holes in which through-hole wiring 33 is formed. There are no limitations on the material that constitutes filling resin 34, and one example is a thermosetting epoxy resin. In order to improve the thermal conductivity of filling resin 34, a filler with high thermal conductivity may be mixed into the resin material.

[0028] The protective layer 35 is formed on the back surface of the circuit board 30 to cover the second wiring layer 32, and is made of an insulating material. The material for the protective layer 35 is not limited, and a conventionally known resist material can be used. Although not shown in FIG. 1 , the protective layer 35 may also be formed on the front surface of the circuit board 30 to cover a portion of the first wiring layer 31. In the example shown in FIG. 1 , the protective layer 35 is formed over the entire back surface of the circuit board 30, but the back surface of the circuit board 30 may be partially exposed as long as it covers at least the area where the second wiring layer 32 is formed.

[0029] The fastening holes 36 are through-holes that penetrate from the front surface (first surface) to the back surface (second surface) of the circuit board 30. As described above, the fastening members 50 are inserted into the fastening holes 36 and fastened, thereby fixing the circuit board 30 to the heat dissipation member 40. The position and shape of the fastening holes 36 are not limited, but inserting and fastening the fastening members 50 into the fastening holes 36 may cause distortion of the circuit board 30 in the vicinity of the fastening holes 36. Therefore, it is preferable not to mount the light emitting elements 10 or electronic components 20 within 15 mm from the center of the fastening holes 36.

[0030] The heat conduction member 37 is a member with high thermal conductivity that is disposed between the circuit board 30 and the heat dissipation member 40. In order to improve the voltage resistance of the lighting device 100, it is preferable that the heat conduction member 37 be insulating. There are no restrictions on the material that constitutes the heat conduction member 37, but one example is heat dissipation grease mixed with a filler of metal particles or metal oxide particles. Alternatively, a heat conduction sheet molded into a sheet shape may be used as the heat conduction member 37.

[0031] FIG. 2 is a schematic plan view showing an example of an arrangement on a circuit board 30 according to this embodiment and the position of a pressing region 12. FIG. 2 shows a first wiring layer 31, but the pattern shape is partially omitted for simplicity of explanation. In the example shown in FIG. 2, the first wiring layer 31 is patterned on the circuit board 30, and a plurality of light-emitting elements 10 are surface-mounted on the first wiring layer 31 near the center of the circuit board 30. Furthermore, a plurality of electronic components 20 and connection terminal portions 21 are mounted on the first wiring layer 31 on the circuit board 30. Furthermore, a plurality of fastening holes 36 are formed near the lower right and upper left of the circuit board 30.

[0032] In the example shown in FIG. 2, a pressing area 12 is set near the light-emitting element 10 on the surface of the circuit board 30. The multiple light-emitting elements 10 are arranged at positions sandwiched between multiple fastening holes 36. As will be described later, the pressing area 12 is an area on the first surface (front surface) of the circuit board 30 where a pressing position 72 with which a pressing member 71 abuts can be set. In FIG. 2, the pressing area 12 is depicted as a rectangle with a dashed line, but the specific shape of the pressing area 12 is not limited. The pressing area 12 is a virtual area in the design, and no specific structure is required to be provided on the circuit board 30.

[0033] 1, the heat conductive member 37 is disposed directly below the light emitting element 10 and the through-hole wiring 33. Therefore, the heat conductive member 37 is disposed at a position overlapping with the light emitting element 10 and the through-hole wiring 33 in a plan view of the circuit board 30.

[0034] 1 and 2, the light emitting element 10 emits light when power and a control signal are transmitted from the outside to an electronic circuit formed by the first wiring layer 31, the light emitting element 10, and the electronic component 20 via a cable, a connector 60, and a connection terminal portion 21. Heat generated by the light emission of the light emitting element 10 is transmitted to the heat dissipation member 40 via the first wiring layer 31, the through-hole wiring 33, the second wiring layer 32, the protective layer 35, and the heat conduction member 37. The heat dissipation member 40 dissipates the heat to the outside of the lighting device 100, thereby cooling the lighting device 100.

[0035] FIG. 3 is a schematic perspective view showing an example of how the circuit board 30 is attached to the housing 70. FIG. 4 is a schematic partial enlarged view showing an example of the structure of the housing 70 to which the circuit board 30 is attached, and examples of pressing members 71 and 81. In the example shown in FIGS. 3 and 4, the heat dissipation member 40 is provided with a flange portion and a frame portion 41, and the circuit board 30 is fastened to the heat dissipation member 40 within the frame portion 41 with fastening members 50. The lighting device 100 also includes the housing 70, and the heat dissipation member 40 is attached to the housing 70 by inserting the frame portion 41 into an opening provided at a predetermined position in the housing 70. The specific structure and method for attaching the heat dissipation member 40 to the housing 70 are not limited, and conventionally known methods such as fitting or screw fastening can be used.

[0036] The housing 70 is a housing portion that forms the outer shape of the lighting device 100 and houses and holds the various components, and is made of a light-blocking material that blocks light. Although not shown in Figures 3 and 4, the housing 70 has a front opening that is covered by an outer lens. Furthermore, a portion of the housing 70 is erected within the opening as a pressing member 71, and the pressing member 71 extends toward the circuit board 30.

[0037] 3 and 4, a reflector may be provided in the opening of the housing portion 70. The reflector has a reflective surface that reflects light, and is an optical element that reflects light emitted from the light-emitting element 10 toward the outer lens, adjusting the light distribution pattern and emitting the adjusted light. Therefore, the reflector corresponds to the light distribution adjustment portion of the present invention. Furthermore, within the opening, a part of the reflector is erected as a pressing member 81, and the pressing member 81 extends toward the circuit board 30.

[0038] The pressing member 71 is a part of the housing part 70 that extends toward the circuit board 30. The pressing member 81 is a part of the reflector that extends toward the circuit board 30. As described above, the pressing members 71 and 81 come into contact with the surface (first surface) of the circuit board 30 and apply a force toward the heat dissipation member 40 to press the circuit board 30.

[0039] For simplicity, Fig. 4 shows only the distal end portions of the pressing members 71, 81 extending from the housing portion 70 and the reflector in a cutaway view. As shown in Fig. 4, the pressing members 71, 81 abut against the surface (first surface) of the circuit board 30 at their respective positions. Furthermore, the pressing members 71, 81 provided at positions facing the pressing region 12 abut against the surface (first surface) of the circuit board 30 within the pressing region 12.

[0040] 5 is a schematic plan view illustrating the fastening holes 36, pressing positions 72, and mounting positions of the light-emitting elements 10. In the example shown in FIG. 5, two fastening holes 36 are provided on the surface (first surface) of the circuit board 30, and multiple light-emitting elements 10 are mounted between the two fastening holes 36. In the figure, an imaginary diagonal line is drawn across one of the light-emitting elements 10 to indicate the center position of the light-emitting element 10 in a plan view. While FIG. 5 shows an example in which rectangular light-emitting elements 10 are arranged in a row, the shape and arrangement of the light-emitting elements 10 are not limited.

[0041] 5, one pressing position 72 is shown as an imaginary rectangle in a direction intersecting the direction connecting the two fastening holes 36. A virtual line connecting the peripheries of the two fastening holes 36 is shown as dashed line 73a, and a virtual line connecting the pressing position 72 and the periphery of the two fastening holes 36 is shown as dashed line 73b. In a plan view of the circuit board 30, if the area surrounded by dashed lines 73a and 73b is defined as a warp reduction region, all of the multiple light-emitting elements 10 are disposed within the warp reduction region. While FIG. 5 shows an example in which the entire multiple light-emitting elements 10 are located within the warp reduction region, some of the light-emitting elements 10 may be located outside the warp reduction region as long as at least the center of the light-emitting element 10 is located within the warp reduction region.

[0042] 5, the circuit board 30 is fastened at two fastening holes 36 by fastening members 50, and a pressing member 71 abuts against one pressing position 72, so that a force is applied to the circuit board 30 in the direction of the heat dissipation member 40 at at least three points. As a result, even if the circuit board 30 is formed thin and has low rigidity, warping of the circuit board 30 that occurs when the heat conduction member 37 is sandwiched between the circuit board 30 and the heat dissipation member 40 can be suppressed within the warpage reduction region, and the heat conduction member 37 can have a uniform thickness, thereby improving heat dissipation.

[0043] As described above, the heat conductive member 37 is disposed at a position overlapping the light emitting elements 10 and the through-hole wiring 33 in a plan view of the circuit board 30, and therefore the fastening holes 36 and the pressing positions 72 are preferably located within a predetermined range from the center of any of the light emitting elements 10. Specifically, the fastening holes 36 are preferably located within 50 mm, and more preferably within 30 mm, from the center of any of the light emitting elements 10. Furthermore, the pressing positions 72 are preferably located within 50 mm, and more preferably within 30 mm, from the center of any of the light emitting elements 10.

[0044] Furthermore, in the lighting device 100, an inner lens may be disposed opposite the light-emitting element 10, or a reflector may be provided around the light-emitting element 10. While an example in which the pressing member 71 is in contact with the pressing position 72 is shown in Fig. 5, the pressing member 81 may be extended from a light distribution adjustment unit such as a reflector or inner lens, and the pressing member 81 may be in contact with the pressing position 72.

[0045] As described above, in the lighting device 100 of this embodiment, the area connecting the outer peripheries of the multiple fastening holes 36 and the pressing position 72 is the warp reduction area, and the center of the light-emitting element 10 is located within the warp reduction area. Therefore, the fastening member 50 and the pressing members 71, 81 can press down on the vicinity of the light-emitting element 10, and even if the circuit board 30 is made thinner, warping can be suppressed and heat dissipation can be improved.

[0046] Second Embodiment Next, a second embodiment of the present invention will be described with reference to Fig. 6. Description of content that overlaps with the first embodiment will be omitted. Fig. 6 is a schematic plan view illustrating fastening holes 36, pressing positions 72, and mounting positions of light-emitting elements 10 in a lighting device 100 according to this embodiment. In the example shown in Fig. 6, two fastening holes 36 are provided on the surface (first surface) of the circuit board 30, and two pressing positions 72 are shown as virtual rectangles in a direction intersecting the direction connecting the two fastening holes 36.

[0047] The plurality of light-emitting elements 10 are mounted between the two fastening holes 36 and the two pressing positions 72. A virtual straight line connecting the pressing positions 72 and the outer peripheries of the two fastening holes 36 is indicated by a dashed line 73b. If the area surrounded by the dashed line 73b is defined as a warp reduction area in a plan view of the circuit board 30, all of the plurality of light-emitting elements 10 are disposed within the warp reduction area. While FIG. 6 shows an example in which the entirety of the plurality of light-emitting elements 10 is located within the warp reduction area, some of the light-emitting elements 10 may be located outside the warp reduction area as long as at least the center of the light-emitting element 10 is located within the warp reduction area.

[0048] 6, the circuit board 30 is fastened at two fastening holes 36 with fastening members 50, and pressing members 71 abut against two pressing positions 72, thereby applying a force toward the heat dissipation member 40 and pressing the circuit board 30 at at least four points. As a result, even if the circuit board 30 is formed thin and has low rigidity, warping of the circuit board 30 that occurs when the heat conduction member 37 is sandwiched between the circuit board 30 and the heat dissipation member 40 can be suppressed within the warpage reduction region, ensuring a uniform thickness of the heat conduction member 37 and improving heat dissipation. In the example shown in FIG. 6, the region surrounded by two fastening holes 36 and two pressing positions 72 is defined as the warpage reduction region, but the number of fastening holes 36 and pressing positions 72 is not limited.

[0049] As described above, in the lighting device 100 of this embodiment, the area connecting the outer peripheries of the multiple fastening holes 36 and the pressing position 72 is the warp reduction area, and the center of the light-emitting element 10 is located within the warp reduction area, so that the fastening member 50 and the pressing members 71, 81 can press down on the vicinity of the light-emitting element 10, and even if the circuit board 30 is made thinner, warping can be suppressed and heat dissipation can be improved.

[0050] (Third embodiment) Next, a third embodiment of the present invention will be described with reference to Fig. 7. Description of content that overlaps with the first embodiment will be omitted. Fig. 7 is a schematic plan view illustrating fastening holes 36, pressing positions 72, and mounting positions of light-emitting elements 10 in a lighting device 100 according to this embodiment. In the example shown in Fig. 7, two fastening holes 36 are provided on the surface (first surface) of the circuit board 30, and one pressing position 72 is shown as a virtual rectangle in a direction intersecting the direction connecting the two fastening holes 36.

[0051] A plurality of light emitting elements 10 are mounted between the two fastening holes 36. Some of the light emitting elements 10 are located outside the warp reduction area surrounded by the dashed line 73b, but the centers of the light emitting elements 10 are located within the warp reduction area. Even if some of the light emitting elements 10 are located outside the warp reduction area, because their centers are within the warp reduction area, warping of the circuit board 30 that occurs when the heat conductive member 37 is sandwiched between the circuit board 30 and the heat dissipation member 40 can be suppressed, and the heat conductive member 37 can have a uniform thickness, improving heat dissipation.

[0052] As described above, in the lighting device 100 of this embodiment, the area connecting the outer peripheries of the multiple fastening holes 36 and the pressing position 72 is the warp reduction area, and the center of the light-emitting element 10 is located within the warp reduction area, so that the fastening member 50 and the pressing members 71, 81 can press down on the vicinity of the light-emitting element 10, and even if the circuit board 30 is made thinner, warping can be suppressed and heat dissipation can be improved.

[0053] The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present invention. [Explanation of symbols]

[0054] 100...Lighting equipment 10...Light emitting element 20...Electronic components 30...Circuit board 40...Heat dissipation member 50...Fastening member 60...Connector 70...Housing section 12...Pressure area 21...Connection terminal 31...First wiring layer 32...Second wiring layer 33...Through-hole wiring 34...Hole-filling resin 35…Protective layer 36…Fastening hole 37...Heat conductive material 41...Frame section 71...Pressing member 72...Pressing position 81...Pressing member

Claims

1. a circuit board on which a light emitting element is mounted on a first surface; a heat dissipation member disposed on a second surface of the circuit board; a heat conduction member disposed between the circuit board and the heat dissipation member; a pressing member that contacts the first surface at a pressing position on the first surface, the circuit board is provided with a plurality of fastening holes for inserting fastening members; The lighting device is characterized in that the center of the light-emitting element is located within a warp reduction region that connects the outer peripheries of the multiple fastening holes and the pressing position.

2. 10. The lighting device according to claim 1, The lighting device is characterized in that the pressing position is within 50 mm from the center of any one of the light-emitting elements.

3. 10. The lighting device according to claim 1, the circuit board has through-hole wiring formed to penetrate from the first surface to the second surface, The lighting device is characterized in that the light emitting element is mounted at a position overlapping the through-hole wiring in a plan view.

4. 4. The lighting device according to claim 3, The lighting device is characterized in that the heat conduction member is disposed at a position overlapping the through-hole wiring in a plan view.

5. 10. The lighting device according to claim 1, A lighting device comprising a plurality of the pressing members and the pressing positions.

6. 6. The lighting device according to claim 1, a housing portion to which the circuit board is attached; a light distribution adjustment unit that adjusts a light distribution pattern from the light emitting element, The lighting device according to claim 1, wherein the pressing member is integrally formed with the housing portion or the light distribution adjustment portion.

Images