Multilayer ceramic electronic component
JP2025132729APending Publication Date: 2025-09-10MURATA MFG CO LTD
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Patent Information
- Application Number
- JP2024030487
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-02-29
- Publication Date
- 2025-09-10
AI Technical Summary
Technical Problem
Multilayer ceramic capacitors face issues with bending stress causing cracks in the laminate when mounted on a substrate due to external electrode transmission.
Method used
A multilayer ceramic electronic component design featuring a laminate with internal conductor layers extending to end surfaces and external electrodes recessed towards the laminate, with increased surface roughness in the recess area, enhancing bending resistance.
Benefits of technology
Improves resistance to bending, reducing the likelihood of cracks in the laminate during mounting.
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Smart Images
Figure 2025132729000001_ABST
Abstract
To provide a multilayer ceramic electronic component capable of improving bending resistance.SOLUTION: The multilayer ceramic electronic component includes a multilayer body 10 and a pair of external electrodes 40 disposed at both ends of the multilayer body 10. The external electrode 40 includes a main surface side external electrode 411A. In a cross-sectional view along the stacking and length directions of the multilayer body 10, the main surface side external electrode 411A includes a recess 510A indented toward the multilayer body 10 side, and peripheral regions 560, 570 adjacent to the recess 510A in the length direction L. The surface roughness of the recess 510A is greater than that of the peripheral regions 560 and 570.SELECTED DRAWING: Figure 2
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Citation Information
Patent Citations
Laminated ceramic capacitor and its manufacturing method
JP2003243249A