Gravure printing plate

Abstract

To improve transferability in a gravure printing plate for printing paste to be used for electronic components.SOLUTION: A gravure printing plate 10 as a gravure printing plate for printing paste to be used for electronic components includes: a base material 11 having a cylindrical shape or a columnar shape, and disposed with a printing pattern composed of a plurality of embankment parts 101 and a plurality of recesses 105 divided by the plurality of embankment parts 101 on an outer peripheral surface 11a; and a first coating layer 13 disposed on the inner surfaces of the plurality of recesses 105. In the gravure printing plate 10, the first coating layer 13 contains fluorine.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a gravure printing plate for printing paste used in electronic components. [Background technology]

[0002] For example, Japanese Patent Laid-Open Publication No. 2023-140689 (Patent Document 1) discloses a substantially cylindrical gravure printing plate with a plurality of recesses on its circumferential surface. This gravure printing plate is used in the manufacture of electronic components. For example, in the manufacture of multilayer ceramic capacitors, the gravure printing plate is immersed in a paste tank containing a conductive paste that will become the internal electrodes, filling the recesses of the gravure printing plate with the paste, and the filled paste is transferred onto a green sheet. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-140689 Summary of the Invention [Problem to be solved by the invention]

[0004] In the gravure printing plate disclosed in Patent Document 1, the above-mentioned paste may remain in the recesses of the gravure printing plate after transfer. In this case, printing of the paste on the green sheet may be insufficient, and the manufactured electronic component may not have the desired performance.

[0005] Therefore, the present invention has been made to solve the above-mentioned problems, and an object of the present invention is to improve the transferability of a gravure printing plate for printing a paste used in electronic components. [Means for solving the problem]

[0006] The gravure printing plate according to the present invention is a gravure printing plate for printing a paste used in electronic components, and comprises a cylindrical or columnar substrate having a printing pattern on its outer surface, the printing pattern consisting of a plurality of banks and a plurality of recesses separated by the plurality of banks, and a first coating layer provided on the inner surfaces of the plurality of recesses. In the gravure printing plate according to the present invention, the first coating layer contains fluorine. [Effects of the Invention]

[0007] According to the present invention, it is possible to improve the transferability of a gravure printing plate for printing a paste used in electronic components. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic diagram showing a gravure printing apparatus equipped with a gravure printing plate according to an embodiment. [Figure 2] FIG. 2 is a perspective view of the gravure printing plate shown in FIG. 1. [Figure 3] FIG. 2 is a schematic enlarged view of a part of the printing pattern of the gravure printing plate shown in FIG. 1. [Figure 4] FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG. [Figure 5] FIG. 3 is a schematic cross-sectional view taken along line VV in FIG. [Figure 6] FIG. 3 is a flow chart showing a method for forming a first coating layer and a second coating layer. [Figure 7] FIG. 2 is a flow diagram showing a method for manufacturing a laminated electronic component using the gravure printing plate shown in FIG. [Figure 8] FIG. 10 is a schematic cross-sectional view of a recessed portion of a gravure printing plate according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiments shown below, the same or common parts are denoted by the same reference numerals in the drawings, and the description thereof will not be repeated.

[0010] (Embodiment) (A. Schematic configuration of gravure printing plate and gravure printing apparatus) FIG. 1 is a schematic diagram showing a gravure printing apparatus provided with a gravure printing plate according to an embodiment. FIG. 2 is a perspective view of the gravure printing plate shown in FIG. 1. First, with reference to FIGS. 1 and 2, a schematic configuration of the gravure printing plate 10 according to the present embodiment and the gravure printing apparatus 1 provided with the same will be described.

[0011] As shown in FIGS. 1 and 2, the gravure printing apparatus 1 includes a gravure printing plate 10, a backup roll 20, a paste tank 30, and a blade 40.

[0012] The gravure printing plate 10 has a cylindrical shape or a tubular shape. The gravure printing plate 10 is configured to be rotatable in the direction of arrow AR1 in FIG. 1. A plurality of printing patterns 100 are provided on the outer peripheral surface 11a of the base material 11 of the gravure printing plate 10. The base material 11 will be described in detail later. In FIG. 2, two of the plurality of printing patterns 100 appear.

[0013] The diameter of the gravure printing plate 10 is, for example, 30 mm or more and 200 mm or less. The width dimension parallel to the axial direction of the gravure printing plate 10 is, for example, 200 mm or more and 300 mm or less.

[0014] The backup roll 20 has a cylindrical shape or a tubular shape. The backup roll 20 is configured to be rotatable in the direction of arrow AR2 in FIG. 1 (that is, the direction opposite to the rotation direction of the gravure printing plate 10).

[0015] The gravure printing plate 10 and the backup roll 20 are arranged to face each other so that a nip portion N is formed. The green sheet 50 passes through the nip portion N such that the dielectric sheet 50a is sandwiched in the nip portion N.

[0016] The paste tank 30 stores a conductive paste 31. A part of the gravure printing plate 10 is immersed in the conductive paste 31. When performing gravure printing using the gravure printing plate 10, as the gravure printing plate 10 rotates, the conductive paste 31 is filled into a plurality of recesses 105 (see FIG. 3) described later.

[0017] The blade 40 is arranged at a position downstream of the position of the paste tank 30 in the rotation direction of the gravure printing plate 10. The blade 40 is in contact with the gravure printing plate 10 with a predetermined pressure. The blade 40 scrapes off the surplus portion of the conductive paste 31 attached to the gravure printing plate 10.

[0018] The gravure printing plate 10 in a state where an appropriate amount of the conductive paste 31 is held by passing through the blade 40 transfers the conductive paste 31 filled in the recess 105 to the green sheet 50 at the nip portion N. Thereby, an electrode pattern 51 corresponding to the printing pattern 100 is printed on the green sheet 50.

[0019] <B. Detailed Configuration of Gravure Printing Plate> FIG. 3 is a schematic enlarged view of a portion of the printing pattern of the gravure printing plate shown in FIG. 1. FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG. 3. More specifically, FIG. 4 is a cross-section parallel to both the depth direction of the recesses and the axial direction of the gravure printing plate, near the center of the vertical bank portions in the circumferential direction of the gravure printing plate. The vertical bank portions and recesses will be described in detail later. FIG. 5 is a schematic cross-sectional view taken along line VV in FIG. 2. More specifically, FIG. 5 is a cross-section parallel to both the radial and axial directions of the gravure printing plate, of a portion of the outer peripheral surface of the substrate of the gravure printing plate other than the portion that defines the printing pattern. Next, the detailed configuration of gravure printing plate 10 will be described with reference to FIGS. 3 to 5.

[0020] 3 and 4, the print pattern 100 is composed of a plurality of bank portions 101 and a plurality of recessed portions 105 separated by the bank portions 101. The bank portions 101 and the recessed portions 105 are provided on the outer peripheral surface 11a of the substrate 11 of the gravure printing plate 10, which will be described later.

[0021] The multiple bank portions 101 are arranged, for example, in a grid pattern. The multiple bank portions 101 include vertical bank portions 102 extending in the circumferential direction of the gravure printing plate 10 and horizontal bank portions 103 extending in a direction parallel to the axial direction of the gravure printing plate 10.

[0022] The recesses 105 are arranged, for example, in a matrix with rows parallel to the axial direction and columns parallel to the circumferential direction. Adjacent recesses 105 may be connected to each other by providing a notch in at least one of the vertical bank portions 102 and the horizontal bank portions 103.

[0023] The print pattern 100 has a substantially rectangular shape. However, the shape of the print pattern 100 is not particularly limited to a substantially rectangular shape, and can be changed appropriately depending on the shape of the electrode pattern 51.

[0024] As shown in FIGS. 4 and 5, the gravure printing plate 10 mainly comprises a substrate 11, a plating layer 12, a first coating layer 13, and a second coating layer 14.

[0025] For example, a metal roll can be used as the substrate 11. The material of the metal roll can be an appropriate metal such as stainless steel. The metal roll may be columnar or cylindrical.

[0026] The outer peripheral surface 11a of the substrate 11 has a first surface 111, a second surface 112, a third surface 113, and a fourth surface 114. The first to third surfaces 111 to 113 are surfaces of the portions of the outer peripheral surface 11a that constitute the print pattern 100. The fourth surface 114 is a surface of the portion of the outer peripheral surface 11a other than the portion that constitutes the print pattern 100.

[0027] As shown in FIG. 4, the first surface 111 forms the top surface of the bank portion 101. The first surface 111 includes a flat surface. The second surface 112 forms the bottom surface of the recess 105. The second surface 112 includes a flat surface. The third surface 113 connects the first surface 111 and the second surface 112. Note that the second surface 112 does not necessarily have to include a flat surface.

[0028] The depth of the recess 105 (more specifically, the depth h from the opening surface OP of the recess 105 to the portion of the first coating layer 13 corresponding to the second surface 112) is, for example, 4 μm or more and 100 μm or less. In this embodiment, the opening surface OP has a rectangular shape when viewed from the normal direction. Note that the shape of the opening surface OP when viewed from the normal direction is not particularly limited to a rectangular shape and can be changed as appropriate. The recess 105 is formed, for example, by etching the outer peripheral surface 11a of the substrate 11.

[0029] The plating layer 12 is provided on the outer peripheral surface 11a of the base material 11 so as to cover the entire outer peripheral surface 11a. A high-hardness material such as Cr is used as the material for the plating layer 12. This improves the hardness of the outer peripheral surface 11a. The plating layer 12 is disposed with a uniform thickness. A uniform thickness means that the thickness variation is 0.1 μm or more and 0.3 μm or less.

[0030] The thickness of the plating layer 12 is preferably 3 μm or more. This is because it allows the first coating layer 13 and the second coating layer 14 to be firmly fixed. On the other hand, the thickness of the plating layer 12 is preferably 10 μm or less. If the thickness of the plating layer 12 is greater than 10 μm, the portions covering the tops of the bank portions 101 (more specifically, the vertical bank portions 102 and the horizontal bank portions 103) will be rounded, which will reduce printability.

[0031] The first coating layer 13 is provided on the inner surfaces of the plurality of recesses 105. More specifically, the first coating layer 13 is provided on the plating layer 12 in the portions covering the second surface 112 and the third surface 113 of the outer peripheral surface 11a of the base material 11.

[0032] The first coating layer 13 extends onto the surfaces of the multiple bank portions 101. More specifically, the first coating layer 13 is provided on the plating layer 12 in a portion covering the first surface 111 of the outer peripheral surface 11a of the base material 11.

[0033] The first coating layer 13 may be a single layer or may be composed of multiple layers. Here, the first coating layer 13 contains fluorine. By configuring it in this way, it is possible to obtain a gravure printing plate 10 with improved transferability, which will be described in detail later. Furthermore, the first coating layer 13 is preferably composed of a DLC (Diamond-Like Carbon) layer containing the above-mentioned fluorine.

[0034] Here, the DLC layer refers to a layer made of a substance whose main component is carbon, which has both the carbon-carbon bonds of diamond and graphite. The DLC layer has properties of higher hardness and lower friction than general materials. For example, the DLC layer has higher hardness and a lower coefficient of friction than stainless steel, which is one example of the material that constitutes the substrate 11.

[0035] The thickness of the first covering layer 13 is preferably 0.3 μm or more. This is because it is possible to reduce variations in the thickness of the first covering layer 13. Furthermore, the thickness of the first covering layer 13 is preferably 2.0 μm or less. This is because it is possible to ensure a sufficient volume for the cell defined by the first covering layer 13 and the opening surface OP, thereby improving printability.

[0036] 5, the second coating layer 14 is provided on the surface of a portion of the outer peripheral surface 11a of the substrate 11 other than the portion that defines the printing pattern 100 (i.e., on the fourth surface 114). More specifically, the second coating layer 14 covers the surface of the plating layer 12 that covers the portion of the outer peripheral surface 11a other than the portion that defines the printing pattern 100.

[0037] The second coating layer 14 may be a single layer or may be composed of multiple layers. Here, the second coating layer 14 is composed of a DLC layer containing silicon. By configuring it in this way, wear of the gravure printing plate 10 can be suppressed, as will be described in detail later.

[0038] The thickness of the second coating layer 14 is preferably 0.3 μm or more, because this effectively suppresses wear of the gravure printing plate 10. The thickness of the second coating layer 14 is also preferably 2.0 μm or less, because this prevents excessive formation of the second coating layer 14.

[0039] The fluorine contained in the first coating layer 13 and the silicon contained in the second coating layer 14 can be detected using energy dispersive X-ray spectroscopy (EDX) or the like.

[0040] The thickness of the first coating layer 13 and the thickness of the second coating layer 14 can be observed by removing the surface of the gravure printing plate 10 and using a microscope such as a scanning electron microscope (SEM).

[0041] 4 and 5, the base material 11 is provided with a plurality of protruding portions 15 that protrude outward from its surface. In this embodiment, a plurality of protruding members 15a that are provided separately from the base material 11 are hammered into the entire outer peripheral surface 11a of the base material 11. As a result, a plurality of protruding portions 15 made up of the plurality of protruding members 15a are provided on the outer peripheral surface 11a of the base material 11.

[0042] The protruding member 15a and the protrusion 15 formed thereby have a wedge-shaped cross section. However, the cross section is not limited to a wedge shape and can be appropriately changed to a rectangular shape or the like.

[0043] The material of the protruding member 15a and the protrusion 15 is not particularly limited, but is preferably silicon carbide. Silicon carbide is harder than common materials, and is even harder than stainless steel, which is one example of a material that constitutes the base material 11. This makes it possible to more reliably drive the protruding member 15a into the base material 11.

[0044] The plurality of protrusions 15 penetrate the plating layer 12 in its thickness direction. The tips of the plurality of protrusions 15 are located inside the first coating layer 13 or inside the second coating layer 14. The first coating layer 13 extends so as to surround the protrusions 15 provided on the first to third surfaces 111 to 113 of the outer peripheral surface 11a of the base material 11 among the plurality of protrusions 15. The second coating layer 14 extends so as to surround the protrusions 15 provided on the fourth surface 114 of the outer peripheral surface 11a of the base material 11 among the plurality of protrusions 15.

[0045] By configuring in this way, a so-called anchor effect can be obtained. Therefore, the first coating layer 13 and the second coating layer 14 can be firmly fixed on the surface of the base material 11. The anchor effect is an effect in which by providing irregularities on the bonding surface, the irregularities serve as wedges and the bonding force is improved.

[0046] <C. Formation method of the first coating layer and the second coating layer> FIG. 6 is a flowchart showing the formation method of the first coating layer and the second coating layer. Next, referring to FIG. 6, an example of the formation method of the first coating layer and the second coating layer on the surface of the base material 11 of the gravure printing plate 10 according to the present embodiment will be described.

[0047] As shown in FIG. 6, first, in step S1, a plurality of protrusions 15 are provided on the outer peripheral surface 11a of the base material 11. More specifically, a plurality of projection members 15a are driven into the entire outer peripheral surface 11a of the base material 11 coated with the plating layer 12. Thereby, a plurality of protrusions 15 are provided on the outer peripheral surface 11a of the base material 11. Here, the plurality of protrusions 15 are provided such that their tips protrude outward from the surface of the plating portion 12.

[0048] Next, in step S2, the plating layer 12 of the portion other than the portion located on the first to third surfaces 111 to 113 of the outer peripheral surface 11a of the base material 11 (that is, the plating layer 12 of the portion other than the portion defining the printing pattern 100) is covered with the first mask. As the first mask, a known one can be used.

[0049] Next, in step S3, a first coating layer 13 is formed on the entire surface of the base material 11. As a result, the first coating layer 13 is formed on both the plating layer 12 in the portion not covered by the first mask and on the first mask. The first coating layer 13 can be formed by a method such as sputtering or the like.

[0050] Next, in step S4, the first mask is removed. As a result, the first coating layer 13 will be located only on the plating layer 12 in the portion defining the printed pattern 100. Also, the plating layer 12 in the portion covered by the first mask is exposed to the outside.

[0051] Next, in step S5, the first coating layer 13 is covered by a second mask. A known mask can be used as the second mask.

[0052] Next, in step S6, a second coating layer 14 is formed on the entire surface of the base material 11. As a result, the second coating layer 14 is formed on both the plating layer 12 in the portion not covered by the second mask and on the second mask. The second coating layer 14 can be formed by a method such as sputtering or the like.

[0053] Next, in step S7, the second mask is removed. As a result, the second coating layer 14 will be located only on the plating layer 12 in the portion other than the portion defining the printed pattern 100. Also, the first coating layer 13 covered by the second mask is exposed to the outside.

[0054] By going through steps S1 to S7 described above, a first coating layer and a second coating layer are formed on the surface of the base material.

[0055] Note that the methods for forming the first coating layer and the second coating layer described above are merely examples, and the order and the like can be appropriately changed. Also, when a plurality of protruding portions 15 are not provided on the outer peripheral surface 11a of the base material 11, step S1 is of course omitted.

[0056] <D. Parentheses> As described above, gravure printing plate 10 according to the present embodiment has first coating layer 13 containing fluorine provided on the inner surface of recess 105.

[0057] The first coating layer 13 contains fluorine, making it a layer with excellent water repellency. Therefore, by configuring it in this way, the conductive paste 31 filled in the recesses 105 is easily peeled from the recesses 105 during transfer at the nip N. As a result, it is possible to provide a gravure printing plate 10 with improved transferability, in which the conductive paste 31 is prevented from remaining in the recesses 105 after transfer.

[0058] Therefore, by using the gravure printing plate 10 according to this embodiment, it is possible to improve the transferability of gravure printing plates used in the manufacture of electronic components.

[0059] Furthermore, in the gravure printing plate 10 according to this embodiment, as described above, the first coating layer 13 is composed of a DLC layer containing fluorine.

[0060] As described above, the DLC layer has a low coefficient of friction, and therefore, by configuring it in this way, it is possible to significantly reduce the amount of conductive paste 31 remaining in the recesses 105 after transfer.

[0061] Furthermore, in the gravure printing plate 10 according to this embodiment, as described above, the first coating layer 13 extends onto the surfaces of the plurality of bank portions 101. This prevents the conductive paste 31 from remaining on the surfaces of the plurality of bank portions 101 after the above-described transfer, thereby further improving the transferability.

[0062] Furthermore, in the gravure printing plate 10 according to this embodiment, as described above, a second coating layer 14 composed of a silicon-containing DLC ​​layer is provided on the surface of the outer peripheral surface 11a of the substrate 11 of the gravure printing plate 10 other than the portion defining the printing pattern 100.

[0063] As described above, the DLC layer is a high-hardness layer. Further, the DLC layer constituting the second coating layer 14 contains silicon, thereby further increasing its hardness. Therefore, by configuring the second coating layer in this manner, when the blade 40 is in sliding contact with the gravure printing plate 10, the wear of the gravure printing plate 10 can be significantly suppressed.

[0064] As described above, by providing the first coating layer 13 and the second coating layer 14 having different properties on the surface of the base material 11, a gravure printing plate 10 having excellent water repellency and wear resistance can be obtained.

[0065] In the gravure printing plate 10 according to the above-described embodiment, the case where the plating layer 12 is provided on the surface of the base material 11 has been exemplified. However, the plating layer 12 does not necessarily have to be provided on the surface of the base material 11. In this case, the first coating layer 13 may be provided on the surface of the base material 11. The same applies to the second coating layer 14.

[0066] In the gravure printing plate 10 according to the above-described embodiment, the case where the first coating layer 13 is provided on the inner surfaces of the plurality of recesses 105 and the surfaces of the plurality of land portions 101 has been exemplified. However, the first coating layer 13 only needs to be provided on at least the inner surfaces of the plurality of recesses 105.

[0067] Furthermore, in the gravure printing plate 10 according to the above-described embodiment, the case where the plurality of protruding members 15a are driven into the outer peripheral surface 11a of the base material 11 to provide the plurality of protrusions 15 on the outer peripheral surface 11a has been exemplified. However, the plurality of protrusions 15 may be formed, for example, by performing a surface treatment such as embossing on the outer peripheral surface 11a of the base material 11.

[0068] <E. Manufacturing Method of Multilayer Electronic Component> FIG. 7 is a flowchart showing a method for manufacturing a multilayer electronic component using the gravure printing plate shown in FIG. 1. Next, an example of a method for manufacturing a multilayer electronic component using the gravure printing plate 10 according to the present embodiment will be described with reference to FIG. 7.

[0069] As shown in Fig. 7, first, in step T1, a green sheet 50 and a conductive paste 31 for the internal electrodes are prepared. The green sheet 50 is formed from a dielectric paste obtained by kneading ceramic powder, typically barium titanate, a binder, a dispersant, a plasticizer, etc. The conductive paste 31 is obtained by kneading conductive powder, a solvent, a binder, ceramic powder, etc. Known green sheets 50 and conductive paste 31 can be used.

[0070] Next, in step T2, the conductive paste 31 for the internal electrodes is transferred in a predetermined pattern onto the green sheet 50 using a gravure printing plate 10. This forms a dielectric sheet 50a on which the electrode pattern 51 is formed. The gravure printing plate 10 may also be used when transferring the dielectric paste.

[0071] Next, in step T3, a laminated sheet is produced by stacking multiple dielectric sheets. Specifically, first, a predetermined number of outer layer dielectric sheets without electrode patterns printed thereon are stacked. Next, dielectric sheets 50a with electrode patterns 51 printed thereon are stacked in sequence on top of these. Next, a predetermined number of the outer layer dielectric sheets are stacked on top of these.

[0072] Next, in step T4, a laminated block is produced. Specifically, the laminated sheet is pressed in the lamination direction using a press such as a hydrostatic press.

[0073] Next, in step T5, a laminated chip is produced. Specifically, the laminated block is cut into a predetermined size using a cutting blade to cut out the laminated chip. At this time, the corners and ridges of the laminated chip may be rounded by barrel polishing or the like.

[0074] Next, in step T6, the laminated chip is fired at a firing temperature of, for example, 900° C. to 1300° C., although this depends on the materials of the dielectric and electrode patterns.

[0075] Next, in step T7, external electrodes are formed. For example, a conductive paste for the external electrodes is applied to both end surfaces of the laminated chip and baked to form baked layers on the end surfaces. At this time, the baking temperature is set to, for example, 700°C or higher and 900°C or lower.

[0076] Next, if necessary, a plating layer is provided on the surface of the baked layer. Through the steps T1 to T7 described above, a laminated electronic component is manufactured.

[0077] If the laminated electronic component is a piezoelectric component, the dielectric can be made of piezoelectric ceramic. Examples of piezoelectric ceramic include PZT (lead zirconate titanate) ceramics. If the laminated electronic component is a thermistor, the dielectric can be made of semiconductor ceramic. Examples of semiconductor ceramic include spinel ceramics. If the laminated electronic component is an inductor, the dielectric can be made of magnetic ceramic. In this case, the internal electrode is a coil-shaped conductor. Examples of magnetic ceramic include ferrite.

[0078] (Variation) Figure 8 is a schematic cross-sectional view of recesses in a gravure printing plate according to a modified example. In detail, Figure 8 is a schematic cross-sectional view of recesses in a gravure printing plate according to a modified example, corresponding to the aforementioned Figure 4. Hereinafter, a gravure printing plate 10A according to a modified example based on the above-described embodiment will be described with reference to Figure 8.

[0079] As shown in FIG. 8, when compared with the gravure printing plate 10 according to the embodiment described above, the gravure printing plate 10A according to this modification differs only in the configuration of the portion that defines the printing pattern of the gravure printing plate.

[0080] More specifically, in the gravure printing plate 10A according to this modification, a second coating layer 14 is provided on the surfaces of the plurality of bank portions 101. More specifically, the second coating layer 14 is provided on the plating layer 12 in a portion covering the fourth surface 114 of the outer peripheral surface 11a of the base material 11, as well as on the plating layer 12 in a portion covering the first surface 111 of the outer peripheral surface 11a of the base material 11. Therefore, in the gravure printing plate 10A, the first coating layer 13 is not provided on the surfaces of the plurality of bank portions 101.

[0081] This configuration also provides the same effects as those described in the above-described embodiment, making it possible to improve the transferability of gravure printing plates used in the manufacture of electronic components. Furthermore, this configuration also makes it possible to suppress wear on the multiple bank portions 101.

[0082] (Addendum) The characteristic configurations of the gravure printing plates disclosed in the above-described embodiments and their modifications can be summarized as follows.

[0083] [Appendix 1] A gravure printing plate for printing a paste used in electronic components, a substrate having a cylindrical or columnar shape and having a printing pattern formed on its outer circumferential surface, the printing pattern being composed of a plurality of bank portions and a plurality of recessed portions separated by the plurality of bank portions; a first coating layer provided on the inner surfaces of the plurality of recesses, A gravure printing plate, wherein the first coating layer contains fluorine.

[0084] [Appendix 2] 2. The gravure printing plate according to claim 1, wherein the first coating layer is composed of the fluorine-containing DLC ​​layer.

[0085] [Appendix 3] 3. The gravure printing plate according to claim 1, wherein the first coating layer extends onto the surfaces of the plurality of bank portions.

[0086] [Appendix 4] a second coating layer is provided on a surface of a portion of the outer circumferential surface other than a portion that defines the printing pattern; 4. The gravure printing plate according to any one of claims 1 to 3, wherein the second coating layer is composed of a DLC layer containing silicon.

[0087] [Appendix 5] The substrate is provided with a plurality of protrusions that protrude outward from a surface of the substrate, 5. A gravure printing plate according to any one of claims 1 to 4, wherein the first coating layer extends to surround at least some of the plurality of protrusions.

[0088] [Appendix 6] The substrate is provided with a plurality of protrusions that protrude outward from a surface of the substrate, 5. The gravure printing plate of claim 4, wherein the second coating layer extends to surround at least some of the plurality of protrusions.

[0089] (Other forms, etc.) The characteristic configurations shown in the above-described embodiments of the present invention and their modifications can naturally be combined with one another within the scope of the gist of the present invention.

[0090] The above-described embodiments and their modifications disclosed herein are illustrative in all respects and are not limiting. The technical scope of the present invention is defined by the claims, and includes all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0091] 1 gravure printing apparatus, 10, 10A gravure printing plate, 11 substrate, 11a outer peripheral surface, 12 plating layer, 13 first coating layer, 14 second coating layer, 15 protrusion, 15a protruding member, 20 backup roll, 30 paste tank, 31 conductive paste, 40 blade, 50 green sheet, 50a dielectric sheet, 51 electrode pattern, 100 printing pattern, 101 bank portion, 102 vertical bank portion, 103 horizontal bank portion, 105 recess, 111 first surface, 112 second surface, 113 third surface, 114 fourth surface, N nip portion, OP opening surface.

Claims

1. A gravure printing plate for printing a paste used in electronic components, a substrate having a cylindrical or columnar shape and having a printing pattern formed on its outer circumferential surface, the printing pattern being composed of a plurality of bank portions and a plurality of recessed portions separated by the plurality of bank portions; a first coating layer provided on the inner surfaces of the plurality of recesses, The gravure printing plate, wherein the first coating layer contains fluorine.

2. 2. The gravure printing plate according to claim 1, wherein the first coating layer is composed of the DLC layer containing fluorine.

3. The gravure printing plate according to claim 2 , wherein the first coating layer extends onto the surfaces of the plurality of banks.

4. a second coating layer is provided on a surface of a portion of the outer circumferential surface other than a portion that defines the printing pattern; 4. The gravure printing plate according to claim 1, wherein the second coating layer is a DLC layer containing silicon.

5. The substrate is provided with a plurality of protrusions that protrude outward from a surface of the substrate, The gravure printing plate according to claim 1 , wherein the first coating layer extends to surround at least some of the plurality of protrusions.

6. The substrate is provided with a plurality of protrusions that protrude outward from a surface of the substrate, The gravure printing plate according to claim 4 , wherein the second coating layer extends to surround at least some of the plurality of protrusions.

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