Circuit heat dissipation mechanism and circuit heat dissipation method

Abstract

To provide a circuit heat dissipation mechanism capable of reducing heat generation of a current amplification circuit without providing a pattern suitable for heat dissipation or a separate member such as a dedicated heat dissipation member.SOLUTION: A circuit heat dissipation mechanism includes: a substrate; a first current amplification circuit that outputs a first current to a first load; a second current amplification circuit that outputs a second current to a second load; and a switch circuit that switches an input destination of an input signal between the first current amplification circuit and the second current amplification circuit. The first current amplification circuit and the second current amplification circuit are formed on the substrate.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a circuit heat dissipation mechanism and a circuit heat dissipation method. [Background technology]

[0002] In a current amplifier circuit that passes a current through a load such as a motor, suppressing heat generation from the current amplifier circuit is an issue. Conventionally, in a circuit that requires heat dissipation, heat has been dissipated from the circuit by providing a pattern suitable for heat dissipation on a printed circuit board on which the circuit is mounted, or by providing a dedicated heat dissipation member in the circuit (for example, Patent Document 1 and Patent Document 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-032841 [Patent Document 2] Japanese Patent Application Laid-Open No. 2003-188565 Summary of the Invention [Problem to be solved by the invention]

[0004] However, it is desired to reduce the heat generated by the current amplifier circuit without providing a separate member such as a pattern suitable for heat dissipation or a dedicated heat dissipation member.

[0005] In view of the above circumstances, an object of the present invention is to provide a circuit heat dissipation mechanism and a circuit heat dissipation method that can reduce heat generation from a current amplifier circuit without providing a separate member such as a pattern suitable for heat dissipation or a dedicated heat dissipation member. [Means for solving the problem]

[0006] In order to solve the above problems, the present invention proposes the following means. A circuit heat dissipation mechanism according to a first aspect of the present invention comprises a substrate, a first current amplifier circuit that outputs a first current to a first load, a second current amplifier circuit that outputs a second current to a second load, and a switch circuit that switches the input destination of an input signal to either the first current amplifier circuit or the second current amplifier circuit, wherein the first current amplifier circuit and the second current amplifier circuit are formed on the substrate.

[0007] In a circuit heat dissipation method according to a second aspect of the present invention, an input signal is exclusively input to a first current amplifier circuit and a second current amplifier circuit formed on the same substrate. [Effects of the Invention]

[0008] According to the circuit heat dissipation mechanism and circuit heat dissipation method of the present invention, heat generation in a current amplifier circuit can be reduced without providing a separate member such as a pattern suitable for heat dissipation or a dedicated heat dissipation member. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a block diagram of a drive circuit including a circuit heat dissipation mechanism according to an embodiment. [Figure 2] FIG. 10 is a block diagram of a modified example of the circuit heat dissipation mechanism. [Figure 3] 10 is a control flowchart of the circuit heat dissipation mechanism. DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment of the present invention will be described with reference to FIGS.

[0011] 1 is a block diagram of a drive circuit 200 including a circuit heat dissipation mechanism 100 according to this embodiment. The drive circuit 200 includes the circuit heat dissipation mechanism 100, a first load 210, a second load 220, and a processor 250. The drive circuit 200 is a circuit that causes current to flow through loads (first load 210, second load 220) that are motors or resolvers, based on a command signal output by the processor 250.

[0012] The circuit heat dissipation mechanism 100 includes a first current amplifier circuit 1, a second current amplifier circuit 2, a switch circuit 3, a control unit 4, and a substrate 5.

[0013] The first current amplifier circuit 1 is a circuit that outputs a first current I1 obtained by amplifying the current of an input command signal (input signal) to the first load 210. The first current amplifier circuit 1 includes an amplifier circuit and the like.

[0014] The second current amplifier circuit 2 is a circuit that outputs a second current I2 obtained by amplifying the current of an input command signal (input signal) to the second load 220. The second current amplifier circuit 2 includes an amplifier circuit and the like.

[0015] The first current amplifier circuit 1 and the second current amplifier circuit 2 may have the same configuration or different configurations.

[0016] The switch circuit 3 is a circuit that switches the input destination of a command signal between the first current amplifier circuit 1 and the second current amplifier circuit 2. The switch circuit 3 exclusively selects one current amplifier circuit from the plurality of current amplifier circuits.

[0017] The control unit 4 controls the switch circuit 3. The control unit 4 is a programmable device (computer) that includes a processor such as a CPU (Central Processing Unit), a memory, a storage unit, and an input / output control unit. The functions of the control unit 4 are realized by executing a predetermined program. At least some of the functions of the control unit 4 may be configured using a dedicated logic circuit or the like.

[0018] The switch circuit 3 may be controlled by the control unit 4, by the processor 250, or by a manual operation by the user.

[0019] The control unit 4 may have a temperature sensor capable of acquiring the temperature of the first current amplifier circuit 1 and the temperature of the second current amplifier circuit 2.

[0020] The substrate 5 is a printed circuit board on which electronic circuits are mounted. The substrate 5 has a first current amplifier circuit 1, a second current amplifier circuit 2, a switch circuit 3, and a control unit 4 provided thereon.

[0021] The first current amplifier circuit 1 and the second current amplifier circuit 2 are connected by a common pattern on the substrate 5. It is desirable that the first current amplifier circuit 1 and the second current amplifier circuit 2 are disposed adjacent to each other.

[0022] 2 is a block diagram of a circuit heat dissipation mechanism 100B, which is a modified example of the circuit heat dissipation mechanism 100. The circuit heat dissipation mechanism 100B includes three current amplifier circuits (a first current amplifier circuit 1, a second current amplifier circuit 2, and a third current amplifier circuit 6). In this case, the switch circuit 3 switches the input destination of the command signal between the first current amplifier circuit 1, the second current amplifier circuit 2, and the third current amplifier circuit 6. The circuit heat dissipation mechanism may include four or more current amplifier circuits.

[0023] Next, a description will be given of the operation (circuit heat dissipation method) of the circuit heat dissipation mechanism 100. The following description will be given along the control flowchart of the circuit heat dissipation mechanism 100 shown in FIG.

[0024] In step S110, the control unit 4 controls the switch circuit 3 to switch the input destination of the command signal to either the first current amplifier circuit 1 or the second current amplifier circuit 2, and inputs the command signal to either the first current amplifier circuit 1 or the second current amplifier circuit 2. The control unit 4 then executes step S120.

[0025] When a command signal is input to the first current amplifier circuit 1, the first current amplifier circuit 1 generates heat. The second current amplifier circuit 2, which is connected to the first current amplifier circuit 1 via a common pattern, functions as a heat sink. The heat generated in the first current amplifier circuit 1 is also dissipated via the second current amplifier circuit 2.

[0026] In step S120, the control unit 4 determines whether the switching condition is satisfied. If the switching condition is satisfied, the control unit 4 then executes step S130.

[0027] The switching condition is, for example, that a predetermined time has elapsed since the current amplifier circuit to which the command signal is input is switched. In this case, the current amplifier circuit to which the command signal is input is alternately switched every predetermined time.

[0028] If the control unit 4 has a temperature sensor, the switching condition may be that the current amplifier circuit to which the command signal is input reaches a predetermined temperature or higher. In this case, the current amplifier circuit to which the command signal is input will not be switched until the current amplifier circuit to which the command signal is input reaches a predetermined temperature or higher.

[0029] In step S130, the control unit 4 switches the current amplifier circuit to which the command signal is input. The control unit 4 switches the input destination of the command signal from one of the first current amplifier circuit 1 and the second current amplifier circuit 2 to the other (or from the other to one). The control unit 4 then executes step S140.

[0030] When a command signal is input to the second current amplifier circuit 2, the second current amplifier circuit 2 generates heat. The first current amplifier circuit 1, which is connected by a common pattern, functions as a heat sink. The heat generated in the second current amplifier circuit 2 is also dissipated via the first current amplifier circuit 1. do.

[0031] In step S140, the control unit 4 determines whether to end the current control to the load. If the current control to the load is not to be ended, the control unit 4 executes step S110 again. If the current control to the load is to be ended, the control unit 4 next executes step S150 and ends the control flow shown in FIG.

[0032] According to the circuit heat dissipation mechanism 100 of this embodiment, the current amplifier circuits that receive command signals are switched exclusively, and the current amplifier circuits that do not receive command signals are used as heat sinks, eliminating the need for dedicated heat dissipation members. This simplifies the circuit configuration and reduces the number of components.

[0033] Although one embodiment of the present invention has been described above in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and design modifications and the like are also included within the scope of the present invention. Furthermore, the components shown in the above embodiment and modifications can be configured by appropriately combining them. [Industrial Applicability]

[0034] The present invention can be applied to a device having a current amplifier circuit. [Explanation of symbols]

[0035] 200 Drive Circuit 210 First load 220 Second load 250 processors 100,100B circuit heat dissipation mechanism 1. First current amplifier circuit 2 Second current amplifier circuit 3 Switch Circuit 4. Control Unit 5. Substrate 6 Third current amplifier circuit

Claims

1. A substrate; a first current amplifier circuit that outputs a first current to a first load; a second current amplifier circuit that outputs a second current to a second load; a switch circuit for switching an input destination of an input signal to either the first current amplifier circuit or the second current amplifier circuit; Equipped with the first current amplifier circuit and the second current amplifier circuit are formed on the substrate. Circuit heat dissipation mechanism.

2. the first current amplifier circuit and the second current amplifier circuit are arranged adjacent to each other. The circuit heat dissipation mechanism according to claim 1 .

3. a control unit that controls the switch circuit; The circuit heat dissipation mechanism according to claim 1 .

4. the control unit switches the input destination of the input signal from one of the first current amplifier circuit and the second current amplifier circuit to the other after a predetermined time has elapsed. The circuit heat dissipation mechanism according to claim 3 .

5. the control unit switches an input destination of the input signal from one of the first current amplifier circuit and the second current amplifier circuit to the other when one of the first current amplifier circuit and the second current amplifier circuit reaches a predetermined temperature or higher. The circuit heat dissipation mechanism according to claim 3 .

6. an input signal is exclusively input to the first current amplifier circuit and the second current amplifier circuit formed on the same substrate; Circuit heat dissipation method.

7. after a predetermined time has elapsed, the input destination of the input signal is switched from one of the first current amplifier circuit and the second current amplifier circuit to the other. The circuit heat dissipation method according to claim 6.

8. when one of the first current amplifier circuit and the second current amplifier circuit reaches or exceeds a predetermined temperature, an input destination of the input signal is switched from one of the first current amplifier circuit and the second current amplifier circuit to the other. The circuit heat dissipation method according to claim 6.

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