Dual interface IC card, antenna sheet, laminate with antenna, laminate with multi-face attached antenna, and method for manufacturing dual interface IC card

Abstract

To provide a dual interface IC card that can easily determine whether or not an antenna wire constituting an antenna terminal unit is disconnected.SOLUTION: In a dual interface IC card 10 capable of contact communication and contactless communication with an external apparatus, an antenna 30 is partially embedded in a surface of an antenna substrate layer 21 opposite to a surface on a core layer 22 side, is composed of an antenna wire 31, is exposed in a recess 20C, and has a terminal portion 32A electrically connected to an IC chip 54, a colored layer 40 is provided between the antenna substrate layer 21 and the core layer 22, and is in contact with the antenna substrate layer 21 and the core layer 22. In a thickness direction of a card substrate 20, the colored layer 40 is provided in an area corresponding to at least the terminal portion 32A and its periphery. The color difference between the colored layer 40 and the terminal portion 32A is greater than a color difference between the core layer 22 and the terminal portion 32A and is 20 or more, and lightness L* of the colored layer 40 in an L*a*b* color system is 20 or more.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a dual interface IC card, an antenna sheet, a laminate with an antenna, a laminate with a multi-face antenna, and a method for manufacturing a dual interface IC card. [Background technology]

[0002] Conventionally, contact IC cards have been used, which communicate with external devices through contact terminals on the surface of the card, contactless IC cards which communicate with external devices through an antenna using electromagnetic induction or the like, and dual interface IC cards which can achieve both the functions of a contact IC card and a contactless IC card using a single IC chip on the card.

[0003] Of these, in dual interface IC cards, an IC module equipped with an IC chip is placed in a recess provided on the surface side of the card base, and the terminal portion of an antenna placed inside the card base is exposed in the recess, and the IC module and the terminal portion of the antenna are electrically connected (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 7142484 Summary of the Invention [Problem to be solved by the invention]

[0005] When manufacturing such a dual interface IC card, it is necessary to cut the card base to expose the antenna terminal, but there is a risk that excessive cutting may cut the antenna wire that makes up the antenna terminal. For this reason, after cutting the card base, it is necessary to visually inspect the antenna wire that makes up the antenna terminal for any breaks.

[0006] On the other hand, currently, in order to impart a sense of luxury and unity, it is being considered to use a core layer that is a color other than white, such as a chromatic color such as yellow or ochre, or black, as the core layer that constitutes the card base.

[0007] However, if the color of the core layer located directly below the antenna terminal portion is the same as or similar to the color of the antenna wire, there is a problem in that it is difficult to detect a break in the antenna wire that constitutes the antenna terminal portion during visual inspection.

[0008] The present invention has been made to solve the above problems. Specifically, it is an object of the present invention to provide a dual interface IC card and a method for manufacturing the same that can easily determine whether or not the antenna wire constituting the antenna terminal has been broken. It is also an object of the present invention to provide an antenna sheet, a laminate with an antenna, and a laminate with a multi-faceted antenna that can be used in the manufacture of a dual interface IC card and can easily determine whether or not the antenna wire constituting the antenna terminal has been broken. [Means for solving the problem]

[0009] [1] A dual interface IC card capable of contact communication and contactless communication with an external device, comprising: a laminated card base having a recess on its surface; an antenna disposed inside the card base; a colored layer disposed inside the card base; and an IC module disposed in the recess and having an IC chip; the card base comprises a transparent or semi-transparent antenna substrate layer and a core layer located on the back side of the card base opposite the front side of the card base from the antenna substrate layer; the antenna is partially embedded on the surface of the antenna substrate layer opposite to the surface on the core layer side; the antenna is composed of an antenna wire, has a terminal portion exposed in the recess and electrically connected to the IC chip; the colored layer is provided between the antenna substrate layer and the core layer, is in contact with the antenna substrate layer and the core layer, and is provided in a region corresponding to at least the terminal portion and the periphery of the terminal portion in the thickness direction of the card base; the colored layer and the terminal portion have a color difference greater than the color difference between the core layer and the terminal portion and are 20 or more; and the L of the colored layer is * a * b * Color system lightness L * is more than 20, dual interface IC card.

[0010] [2] The dual interface IC card according to [1] above, wherein the terminal portion is configured by a structure in which the antenna wire is repeatedly folded back from the outer periphery of the recess toward the center.

[0011] [3] The dual interface IC card according to [1] or [2] above, wherein the core layer is colored.

[0012] [4] The dual-interface IC card according to any one of [1] to [3] above, wherein the core layer is chromatic, black, or gray.

[0013] [5] The dual interface IC card according to any one of [1] to [4] above, wherein the colored layer is white.

[0014] [6] An antenna sheet used in the manufacture of a dual interface IC card capable of contact communication and contactless communication with an external device, the dual interface IC card comprising a laminated card base having a recess on the surface, an antenna disposed inside the card base, and an IC module disposed in the recess and having an IC chip electrically connected to the antenna, the antenna sheet comprising: a transparent or semi-transparent antenna substrate layer; an antenna partially embedded on one surface of the antenna substrate layer; and a colored layer disposed on the other surface of the antenna substrate layer, the antenna being composed of an antenna wire and having a terminal portion for electrically connecting to the IC chip; the colored layer being disposed in a thickness direction of the antenna sheet in an area corresponding to at least the terminal portion and the periphery of the terminal portion; a color difference between the colored layer and the terminal portion being 20 or more; and a L in the colored layer. * a * b * Color system lightness L * is 20 or more, antenna sheet.

[0015] [7] The antenna sheet according to [6] above, wherein the colored layer is white.

[0016] [8] The antenna sheet according to [6] or [7] above, wherein the antenna is attached to two or more surfaces.

[0017] [9] A laminate with an antenna used for manufacturing a dual interface IC card capable of contact communication and contactless communication with an external device, the dual interface IC card comprising: a card base having a laminated structure with a recess on its surface; an antenna disposed inside the card base; and an IC module disposed in the recess and having an IC chip electrically connected to the antenna. The laminate with an antenna comprises: a transparent or semi-transparent antenna substrate layer; an antenna partially embedded on one surface of the antenna substrate layer; a core layer disposed on the other surface of the antenna substrate layer; and a colored layer disposed at least partially between the antenna substrate layer and the core layer and in contact with the antenna substrate layer and the core layer. The antenna is composed of an antenna wire and has a terminal portion for electrically connecting to the IC chip. The colored layer is disposed in a thickness direction of the laminate with an antenna at least in a region corresponding to the terminal portion and a periphery of the terminal portion. The color difference between the colored layer and the terminal portion is greater than the color difference between the core layer and the terminal portion and is 20 or more. The L of the colored layer * a * b * Color system lightness L * is 20 or more.

[0018]

[10] The laminate with an antenna according to [9] above, wherein the core layer is colored.

[0019]

[11] The laminate with an antenna according to [9] above, wherein the core layer is chromatic, black, or gray.

[0020]

[12] The laminate with an antenna according to any one of [9] to

[11] above, wherein the colored layer is white.

[0021]

[13] A multi-faceted laminate with an antenna, in which two or more laminates with an antenna according to any one of [9] to

[12] above are attached to multiple faces.

[0022]

[14] A method for manufacturing a dual interface IC card capable of contact communication and contactless communication with an external device, comprising the steps of: preparing a laminate including a card base and an antenna disposed inside the card base and having a terminal portion constituted by an antenna wire; cutting the card base to form a recess in which the terminal portion of the antenna is exposed, for disposing an IC module having an IC chip; electrically connecting the terminal portion of the antenna to the IC chip and disposing the IC module in the recess; wherein the card base comprises a transparent or semi-transparent antenna substrate layer; and a core layer positioned closer to the back surface than the antenna substrate layer, when the surface of the card base on which the recess is formed is defined as the front surface and the surface opposite to the front surface is defined as the back surface, the antenna is partially embedded in the surface of the antenna substrate layer opposite to the surface on the core layer side; the colored layer is provided in a thickness direction of the laminate at least in a region corresponding to the terminal portion and the periphery of the terminal portion; the color difference between the colored layer and the terminal portion is greater than the color difference between the core layer and the terminal portion and is 20 or more; * a * b * Color system lightness L * 20 or more. [Effects of the Invention]

[0023] According to one aspect of the present invention, it is possible to provide a dual interface IC card and a method for manufacturing the same, which are capable of easily determining whether or not an antenna wire constituting the antenna terminal portion has been broken. Also, according to another aspect of the present invention, it is possible to provide an antenna sheet, an antenna-equipped laminate, and a multi-faceted antenna-equipped laminate, which are used in manufacturing a dual interface IC card and are capable of easily determining whether or not an antenna wire constituting the antenna terminal portion has been broken. [Brief explanation of the drawings]

[0024] [Figure 1]FIG. 1 is a schematic plan view of a dual interface IC card according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along the line AA in FIG. [Figure 3] FIG. 3 is an enlarged plan view of the vicinity of the terminal portion of the antenna in a state where the IC module and the anisotropic conductive film are removed from the dual interface IC card in FIG. [Figure 4] FIG. 4 is a schematic plan view of a multi-face laminate used in manufacturing a dual-interface IC card according to an embodiment. [Figure 5] FIG. 5 is a schematic plan view of a laminate according to an embodiment. [Figure 6] FIG. 6 is a cross-sectional view taken along line BB in FIG. [Figure 7] FIG. 7 is an enlarged plan view of the vicinity of the terminal portion of the antenna in FIG. [Figure 8] 8A and 8B are schematic diagrams showing the manufacturing process of a multi-face laminate used in manufacturing a dual-interface IC card according to an embodiment. [Figure 9] 9A and 9B are schematic diagrams showing the manufacturing process of a multi-face laminate used in manufacturing a dual-interface IC card according to an embodiment. [Figure 10] 10A to 10C are schematic diagrams showing other manufacturing steps of a multi-face laminate used in manufacturing a dual-interface IC card according to an embodiment. [Figure 11] 11A and 11B are schematic diagrams showing other manufacturing steps of a multi-face laminate used in manufacturing a dual-interface IC card according to an embodiment. [Figure 12] 12A and 12B are schematic diagrams showing other manufacturing steps of a multi-face laminate used in manufacturing a dual-interface IC card according to an embodiment. [Figure 13] 13A and 13B are schematic diagrams showing the manufacturing process of the dual-interface IC card according to the embodiment. [Figure 14]14A and 14B are schematic diagrams showing the manufacturing process of the dual-interface IC card according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0025] Hereinafter, a dual interface IC card according to an embodiment of the present invention, a method for manufacturing the same, an antenna sheet, a laminate with an antenna, and a laminate with a multi-sided antenna will be described with reference to the drawings. Fig. 1 is a schematic plan view of the dual interface IC card according to this embodiment, Fig. 2 is a cross-sectional view taken along line AA in Fig. 1, and Fig. 3 is an enlarged plan view of the vicinity of the terminal portion of the antenna in a state in which the IC module and the anisotropic conductive film have been removed from the dual interface IC card in Fig. 1. Fig. 4 is a schematic plan view of a multi-sided laminate used in manufacturing the dual interface IC card according to this embodiment, Fig. 5 is a schematic plan view of the laminate according to this embodiment, Fig. 6 is a cross-sectional view taken along line BB in Fig. 5, and Fig. 7 is an enlarged plan view of the vicinity of the terminal portion of the antenna in Fig. 5. Figures 8A and 8B, 9A and 9B are schematic diagrams showing the manufacturing process of a multi-sided laminate used in manufacturing a dual interface IC card according to the embodiment, Figures 10A to 10C, 11A, 11B, 12A and 12B are schematic diagrams showing other manufacturing processes of a multi-sided laminate used in manufacturing a dual interface IC card according to the embodiment, and Figures 13A, 13B, 14A and 14B are schematic diagrams showing the manufacturing process of a dual interface IC card according to the embodiment.

[0026] <<<Dual interface IC card>>> 1 and 2 (hereinafter, sometimes simply referred to as "IC card 10") includes a laminated card base 20 having a recess 20C on a surface 20A, an antenna 30 disposed inside the card base 20, a colored layer 40 disposed inside the card base 20, an IC module 50 disposed in the recess 20C, and an anisotropic conductive film 60 for electrically connecting the antenna 30 to an IC chip 54 (described later) of the IC module 50. Note that the anisotropic conductive film 60 is used to electrically connect the antenna 30 and the IC module 50, but the antenna 30 and the IC module 50 may also be electrically connected by a conductive paste method, a coil-on-module method, or solder welding method.

[0027] <<Card base>> For ease of explanation, an XYZ coordinate system is set for the card base 20. First, the normal direction to the front surface 20A of the card base 20 is defined as the Z axis. The direction from the back surface 20B, which is the opposite side of the card base 20 to the front surface 20A, toward the front surface 20A is defined as the +Z direction or upward in the thickness direction, and the opposite direction is defined as the -Z direction or downward in the thickness direction.

[0028] When card base 20 is viewed from the +Z direction, the X axis is a straight line perpendicular to both short sides of card base 20, which has long and short sides described below, and the Z axis, and the direction from one short side closer to recess 20C to the other short side is the +X direction or rightward, and the opposite direction is the -X direction or leftward. Furthermore, the Y axis is an axis perpendicular to the X and Z axes, and the direction from one long side farther from recess 20C to the other long side is the +Y direction or upward, and the opposite direction is the -Y direction or downward.

[0029] The recess 20C is composed of a first recess 20D and a second recess 20E that is connected to the first recess 20D. The second recess 20E is located deeper than the first recess 20D in the depth direction (from the +Z side to the -Z side) from the front surface 20A toward the back surface 20B. The hole diameter of the second recess 20E is smaller than the hole diameter of the first recess 20D. The first recess 20D is a portion that mainly stores the substrate 51 and the like of the IC module 50, and the second recess 20E is a portion that mainly stores the molded portion 55 and the like.

[0030] The card base 20 includes at least a transparent or semi-transparent antenna substrate layer 21 and a core layer 22 located closer to the back surface 20B than the antenna substrate layer 21.

[0031] 2 has a configuration in which an over-sheet layer 23, a core layer 24, an inner layer 25, an antenna substrate layer 21, a core layer 22, an inner layer 26, an inner layer 27, a core layer 28, and an over-sheet layer 29 are laminated in this order in the depth direction from the front surface 20A to the back surface 20B. In addition, printing or a magnetic stripe may be embedded on the surface of the over-sheet layer 23 of the card base 20 opposite to the core layer 24 side or on the surface of the over-sheet layer 29 opposite to the core layer 28 side.

[0032] <Antenna substrate layer> The antenna substrate layer 21 is a transparent or translucent layer, but is preferably a transparent layer from the viewpoint of being able to visually check the colored layer 40 through the antenna substrate layer 21 during a visual inspection to check whether or not there is a break in the antenna wire 31 of the terminal portion 32A, which will be described later. The antenna substrate layer 21 is not particularly limited, but examples thereof include the plastic sheets described in the section on the core layers 22, 24, and 28. The thickness of the antenna substrate layer 21 can be appropriately selected taking into consideration the overall thickness of the card body 20, but may be, for example, approximately 0.03 mm or more and 0.20 mm or less.

[0033] <Core layer> The core layers 22, 24, and 28 may be colored. In this specification, "colored" includes white. Examples of colors include yellow, ochre, red, blue, silver, gold, shiny colors, black, gray, white, translucent colors, and colors including colored translucent colors. Colors not listed here may also be used. Among the colors, chromatic, black, or gray is preferred. When manufacturing an IC card 10, the surface 20A of the card base 20 is printed in gold or black, but the side surfaces of the card base are typically not printed. Therefore, if the core layers 22, 24, and 28 are chromatic, black, or gray, the side surfaces of the card base 20 can also be colored similarly to the surface of the IC card 10, thereby imparting a sense of luxury and unity. Examples of chromatic colors include yellow and ochre.

[0034] When manufacturing a gold-colored IC card, it is preferable that the core layers 22, 24, 28 be yellow or ochre-colored, when manufacturing a black-colored IC card, it is preferable that the core layers 22, 24, 28 be black, and when manufacturing a silver-colored IC card, it is preferable that the core layers 22, 24, 28 be gray.

[0035] The core layers 22, 24, and 28 are not particularly limited, but may be, for example, plastic sheets. Examples of plastic sheets that can be used include polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, copolymer polyester, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylic ester, polypropylene, polyethylene, and polyurethane, as well as composite films thereof. From an environmental perspective, the plastic sheets may also be recycled plastic sheets made from waste materials generated during manufacturing or marine plastics. Note that using a crystallized plastic sheet, such as C-PET (crystalline PET), as the core layer results in poor adhesion to the IC module substrate.

[0036] The thickness of the core layers 22, 24, 28 can be appropriately selected taking into consideration the overall thickness of the IC card 10, and may be, for example, approximately 0.03 mm to 0.45 mm. The core layers 22, 24, 28 may have a laminated structure of two or more layers. In this case, the above-mentioned thickness of the core layer refers to the overall thickness of the core layer.

[0037] When a pattern is printed on the core layers 24, 28, the core layers 22, 24, 28 preferably have marks for alignment, such as reference lines. When the marks and colored layer 40 are formed by printing, it is preferable to use the same ink for forming the marks as the ink for forming the colored layer 40, from the viewpoint of reducing the number of inks used by using a common ink.

[0038] <Oversheet layer> The over-sheet layers 23, 29 may be transparent, semi-transparent, or opaque layers such as white, but the over-sheet layers 23, 29 shown in Fig. 2 are transparent layers. The thickness of the over-sheet layers 23, 29 may be approximately 0.03 mm or more and 0.18 mm or less. From the viewpoint of preventing curling when the multi-sided laminate 70 described below is integrated by heat pressing or the like, it is preferable that the over-sheet layers 23, 29 have the same thickness, but they do not necessarily have to be the same.

[0039] The material of the over-sheet layers 23, 29 may be any material that is adhesive when heated, but even if the over-sheet layers themselves are not adhesive when heated, the two can be integrated by additionally forming a layer of a known adhesive that generates adhesive force when heated, etc., between the over-sheet layer 23 and the core layer 24 or between the over-sheet layer 29 and the core layer 28.

[0040] <Inner layer> The inner layers 25 to 27 are not particularly limited, but examples thereof include the plastic sheets described in the section on the core layers 22, 24, and 28. The thickness of the inner layers 25 to 27 can be appropriately selected taking into consideration the overall thickness of the IC 10, and may be, for example, approximately 0.03 mm or more and 0.20 mm or less.

[0041] <<Antenna>> The antenna 30 is coil-shaped. The antenna 30 is partially embedded in the surface 21A (front surface 21A) of the antenna substrate layer 21 opposite to the surface 21B (back surface 21B) on the core layer 22 side. The antenna 30 is electrically connected to the IC module 50, whereby the IC chip 54 of the IC module 50 and the antenna 30 form a communication circuit for contactless communication. The communication circuit may be one that performs close-proximity communication using an HF frequency band of 13.56 MHz, for example, or one that performs communication using another frequency band, for example, a UHF frequency band of 920 MHz.

[0042] When a dual interface IC card is held over an external device such as a reader / writer, a magnetic field generated by the reader / writer generates a current in the communication circuit, which supplies power to the IC chip. This enables the IC chip to send and receive information contactlessly with the reader / writer, and to read and rewrite information from and to the memory.

[0043] The antenna wire 31 constituting the antenna 30 is typically formed of a coated conductor wire in which the periphery of a copper wire is coated with an insulating material. Alternatively, copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires and metal alloy wires such as iron, stainless steel, and aluminum can also be selected. By using a coated conductor wire as the antenna wire 31, it can be manufactured more inexpensively than, for example, a copper foil etching method.

[0044] The diameter of the antenna wire 31 is not particularly limited as long as it can ensure the characteristics required for a contactless communication circuit, but it can be, for example, 0.03 mm to 0.30 mm, and preferably 0.05 mm to 0.15 mm. By setting the diameter in the latter range, durability against heat and pressure during embedding and external forces due to cutting can be improved, ensuring good communication characteristics.

[0045] The antenna 30 has a pair of terminal portions 32A. The terminal portions 32A are exposed in the recess 20C and are electrically connected to the IC chip 54. The terminal portions 32A shown in Fig. 2 are located on the bottom surface 20D1 of the first recess 20D.

[0046] Terminal portion 32A has a repeated folded structure as shown in Fig. 3. Specifically, for example, terminal portion 32A has a repeated folded structure extending from the outer periphery toward the center of recess 20C. That is, antenna wire 31 extends from the -X direction toward the +X direction so that the folded structure is repeated multiple times. Note that end portion 32 shown in Fig. 3 also has the above-described folded structure in addition to terminal portion 32A.

[0047] The folded structure has approximately arc-shaped bent portions at the ends on the +Y direction side and the -Y direction side, i.e., the upper end and the lower end, and the portion other than the bent portion connecting the bent portion at the upper end and the bent portion at the lower end is approximately straight or curved. However, from the viewpoint of saving material for the antenna wire 31, it is preferable to form the portion other than the bent portion as approximately straight as possible.

[0048] In addition, the parts other than the bent parts of the folded structure are inclined clockwise at a predetermined angle θ (see Figure 3) with respect to the Y axis, which is a straight line along the outer edge of the recess 20C, and the pitch of the zigzag shape between adjacent parts other than the bent parts is approximately constant.

[0049] The typical outline shape of an IC module in a plan view is a substantially rectangular shape with rounded corners. In this case, the outline shape of recess 20C is also substantially the same as the outline shape of IC module 50. Specifically, in consideration of the accuracy of the mounting position of IC module 50 on card base 20, the outline shape is often made approximately 0.1 mm to 0.2 mm larger than the outline shape of IC module 50. In this case, the outer periphery of recess 20C is a substantially rectangular shape with sides substantially parallel to the short and long sides of card base 20, and terminal portion 32A is configured by a structure in which antenna wire 31 is repeatedly folded back from the outer periphery, which is a side substantially parallel to the short sides of card base 20, toward the center.

[0050] On the other hand, if the contour shape of IC module 50 and recess 20C is elliptical or the like, the straight line along the outer circumferential side of recess 20C refers to a tangent to the center of that side because that side is a curve such as an arc. Usually, the contour of an IC module is configured to be symmetrical in the vertical and horizontal directions, so if end portions are formed in the horizontal directions, the straight line along the outer circumferential side of the recess will be a straight line parallel to the Y axis.

[0051] The inclination angle θ is preferably 2 degrees or more and 20 degrees or less, and more preferably 5 degrees or more and 15 degrees or less. The inclination angle θ does not need to be strictly the same in all portions of the folded structure other than the bent portions, and may vary within the above-mentioned range. When the inclination angle θ is in the former range, the antenna wire 31 is inclined relative to the direction along the Y-axis, which is the movement direction of the end mill when cutting the recess, and this makes it possible to prevent the antenna wire from unintentionally branching, or the occurrence of whiskers.

[0052] The inclination angle θ is the angle at which the portion other than the bent portion is inclined clockwise with respect to the Y-axis, which is a straight line along the outer peripheral side of the recess 20C. However, there is no problem in replacing the above-mentioned θ with the angle at which the portion other than the bent portion is inclined counterclockwise with respect to the Y-axis, which is a straight line along the outer peripheral side of the recess. This is because even if the portion other than the bent portion is inclined counterclockwise, the same effect as when it is inclined clockwise can be obtained.

[0053] The pitch is preferably 0.50 mm or less, and more preferably 0.25 mm or less, although it depends on factors such as the capacity of the winding machine and the quality of the antenna sheet after the antenna wire 31 is embedded in the antenna substrate layer 21. By setting the pitch within the former range, the exposed area of ​​the antenna wire 31 per unit area at the end 32 can be increased, and the area for electrical connection with the antenna connection terminal 53 of the IC module 50 can be expanded. This improves the reliability of the electrical connection and reduces the electrical resistance at the contact point between the antenna wire 31 and the antenna connection terminal 53 of the IC module 50.

[0054] <Colored layer> The colored layer 40 is disposed at least partially between the antenna substrate layer 21 and the core layer 22. The colored layer 40 is in contact with the antenna substrate layer 21 and the core layer 22. The colored layer 40 is disposed in the thickness direction of the card base 20 (from the +Z direction toward the -Z direction or from the -Z direction toward the +Z direction) at least in the region R corresponding to the terminal portion 32A and the periphery of the terminal portion 32A. The colored layer 40 is preferably disposed so as to be larger than the terminal portion 32A so that disconnection of the entire exposed terminal portion 32A can be confirmed. In FIG. 3, there are a pair of terminal portions 32A, and therefore there are also a pair of colored layers 40. The colored layer 40 may be disposed outside the recessed portion 20C as long as it is present in the recessed portion 20C as shown in FIG. 3.

[0055] Color difference ΔE between the colored layer 40 and the terminal portion 32A * ab1 is the color difference ΔE between the core layer 22 and the terminal portion 32A * ab2 is larger than the color difference ΔE * ab is as specified in JIS Z8781-4:2013.

[0056] The method for measuring and calculating the color difference is as follows. First, the L of the colored layer 40 through the antenna substrate layer 21 is measured. * a * b * Color space L * , a * and b * is measured using a spectrophotometer ("eXact Standard NGH-XRX10" manufactured by X-Rite Inc.) by irradiating the surface of the colored layer 40 with light (D65 light source) at an incident angle of 10 degrees (the normal direction to the surface of the colored layer 40 is set to 0 degrees) and based on the total reflected light (specular reflected light + diffuse reflected light). * a * b * "Color system" refers to the color system standardized by the CIE (International Commission on Illumination) and adopted in JIS Z8781-4:2013. * a * b * In the color system, lightness is L *The chromaticity, which indicates the hue and saturation, is a * , b * The antenna wire 31 constituting the terminal portion 32A of the antenna 30 has a small wire diameter, so a plate made of the same material as the antenna wire 31 is used to form the L * a * b * Color space L * , a * and b * is measured in the same manner as for the colored layer 40. Furthermore, the L * a * b * Color space L * , a * and b * is measured in the same manner as for the colored layer 40. * , a * and b * L1 * , a1 * and b1 * and the L of the antenna wire 31 * , a * and b * respectively L2 * , a2 * and b2 * and L of the core layer 22 * , a * and b * L3 * , a3 * and b3 * When the color difference ΔE between the colored layer 40 and the terminal portion 32A of the antenna 30 is * ab1 and the color difference between the core layer 22 and the terminal portion 32A of the antenna 30 are calculated by the following formula. ΔE * ab1=((L1 * -L2 * ) 2 +(a1 * -a2 * ) 2 +(b1 * -b2 * ) 2 ) 1 / 2 ΔE * ab2=((L3* -L2 * ) 2 +(a3 * -a2 * ) 2 +(b3 * -b2 * ) 2 ) 1 / 2

[0057] Color difference ΔE between the colored layer 40 and the terminal portion 32A * ab1 and the color difference ΔE between the core layer 22 and the terminal portion 32A * The absolute value of the difference with ab2 (|ΔE * ab1-ΔE * ab2|) is 20 or more. If the absolute value of this difference is 20 or more, the color difference between the colored layer 40 and the terminal portion 32A becomes clear, making it easier to distinguish the terminal portion 32A. * The lower limit of the absolute value of ab1 is preferably 30 or more, or 40 or more, and the upper limit may be 60 or less. For example, the color difference ΔE between the colored layer 40 and the terminal portion 32A * ab1 may be 20 or more and 60 or less, 30 or more and 60 or less, or 40 or more and 60 or less.

[0058] Lightness L of colored layer 40 * The lightness L is 20 or more. * However, if the lightness L of the colored layer 40 is 20 or more, the light absorption by the colored layer 40 present in the background of the terminal portion 32A can be suppressed, making it easier to distinguish the terminal portion 32A. * The lower limit of the lightness L of the colored layer 40 is preferably 30 or more, or 40 or more, and the upper limit may be 95 or less. * may be 20 or more and 95 or less, 30 or more and 95 or less, or 40 or more and 95 or less.

[0059] The color of the colored layer 40 is not particularly limited, but is preferably white, for example, when the core layer 22 is chromatic or black. When the antenna wire 31 is a copper wire, if the colored layer 40 is white, the terminal portion 32A of the antenna 30 becomes more easily distinguishable when the IC module 50 and the anisotropic conductive film 60 are removed from the recess 20C of the card base 20 to expose the terminal portion 32A. Even when the antenna wire 31 is a coated copper wire, the copper wire in the coated copper wire is exposed by cutting the laminate 70A described below. Therefore, if the colored layer 40 is white, the terminal portion 32A becomes more easily distinguishable.

[0060] The colored layer 40 can be composed of a pigment or dye and a binder resin. In this case, for example, the colored layer 40 can be formed by printing a resin composition containing a pigment or dye using a printing method such as offset printing or silk screen printing. The colored layer 40 may also be a colored tape, such as white.

[0061] The thickness of the colored layer 40 is preferably, for example, 1 μm or more and 30 μm or less. If the thickness of the colored layer 40 is 1 μm or more, the color of the colored layer 40 can be clearly confirmed, and if it is 30 μm or less, the thickness of the colored layer 40 is thin, so unevenness and deformation of the pattern can be suppressed during hot press molding. The lower limit of the thickness of the colored layer 40 is preferably 3 μm or more or 5 μm or more, and the upper limit of the thickness of the colored layer 40 is preferably 15 μm or less or 10 μm or less. For example, the thickness of the colored layer 40 is preferably 3 μm or more and 15 μm or less or 5 μm or more and 10 μm or less.

[0062] <<ICモジュール> > 2, the IC module 50 includes a flat substrate 51, external contact terminals 52 arranged on a front surface 51A of the substrate 51, an antenna connection terminal 53 arranged on a back surface 51B of the substrate 51, an IC chip 54 arranged on the back surface 51B of the substrate 51, a molded portion 55 that covers the IC chip 54, and wires 56 such as gold wires that electrically connect the antenna connection terminals 53 and the IC chip 54. Note that the wires that electrically connect the external contact terminals 52 and the IC chip 54 are not shown in the figure.

[0063] <Board, external contact terminals, and antenna connection terminals> The substrate 51 can be made of a flexible resin film such as glass epoxy resin or polyimide resin. The external contact terminals 52 and the antenna connection terminals 53 are made of patterned copper foil. Specifically, copper foil is provided on the front surface 51A and the back surface 51B of the substrate 51, and the copper foil is etched into a predetermined pattern to form the external contact terminals 52 and the antenna connection terminals 53. The substrate 51 is also provided with a plurality of through holes (not shown) in advance for wire bonding to the external contact terminals 52.

[0064] <ICチップ> The IC chip 54 is fixed via an adhesive (not shown) to the rear surface 51B of the substrate 51. Specifically, it is disposed in the center of the surface of the substrate 51 where the antenna connection terminal 53 is formed. The IC chip 54 includes a CPU for controlling both contact and contactless communication operations, storage devices such as RAM, EEPROM, and flash memory, and various circuits such as an interface circuit for decoding input signals and generating output signals for contact and contactless communication, and a power generation circuit.

[0065] <Molded part> The molded portion 55 is intended to protect the IC chip 54 and the wires 56 from external force loads and environmental loads. The molded portion 55 is made of an ultraviolet curable resin, a thermosetting resin, or the like.

[0066] <<Anisotropic Conductive Film>> The anisotropic conductive film 60 is disposed between the exposed terminal portion 32A of the antenna 30 and the antenna connection terminal 53 of the IC module 50, and is in contact with the terminal portion 32A and the antenna connection terminal 53.

[0067] According to this embodiment, the terminal portion 32A of the antenna is embedded in a transparent or semi-transparent antenna substrate layer 21, and the colored layer 40 is provided in at least the terminal portion 32A and the region R corresponding to the periphery of the terminal portion 32A in the thickness direction of the card body 20. Therefore, when visually inspecting whether or not the antenna wire 31 constituting the terminal portion 32A has been broken, the colored layer 40 is present on the back surface of the terminal portion 32A and can be seen through the antenna substrate layer 21. In addition, the color difference ΔE between the colored layer 40 and the terminal portion 32A is * ab1 is the color difference ΔE between the core layer 22 and the terminal portion 32A * ab2 and 20 or more, and L * a * b * Color system lightness L * Since the value is 20 or more, the visibility of the terminal portion 32A of the antenna 30 is improved compared to when the terminal portion 32A is embedded in the core layer 22. This makes it easy to determine whether or not a break has occurred in the antenna wire 31 that constitutes the terminal portion 32A.

[0068] It is also possible to embed the terminal portion 32A of the antenna 30 in the colored layer 40. However, if the colored layer 40 is thin, there is a risk that the colored layer 40 will be cut away depending on variations in the embedding depth or cutting depth of the antenna 30. In contrast, according to this embodiment, the terminal portion 32A of the antenna 30 is embedded in the transparent or translucent antenna substrate layer 21 located closer to the surface 20A than the colored layer 40 so that a portion of the terminal portion 32A is exposed. This prevents cutting of the colored layer 40 even if the embedding depth or cutting depth of the antenna 30 varies. This allows the colored layer 40 to be seen through the antenna substrate layer 21. This makes it easier to determine whether or not a break has occurred in the antenna wire 31 that constitutes the terminal portion 32A.

[0069] When the terminal portion 32A of the antenna 30 is configured with a repeated folded structure as shown in FIG. 3, the antenna wires 31 that make up the terminal portion 32A are closely packed together, making it difficult to check whether or not there is a break in the antenna wires 31. However, according to this embodiment, since a colored layer 40 is present on the back surface of the terminal portion 32A, even if the terminal portion 32A of the antenna 30 has such a structure, it is easier to determine whether or not there is a break in the antenna wires 31 that make up the terminal portion 32A.

[0070] <<Dual Interface IC Card Manufacturing Method>> When manufacturing the dual interface IC card 10, first, a multi-faceted laminate 70 shown in Fig. 4 is prepared. The multi-faceted laminate 70 is formed by attaching two or more laminates 70A together as shown in Figs. 4 and 5. In this embodiment, the IC card 10 is manufactured using the multi-faceted laminate 70, but the IC card 10 may also be manufactured using the laminate 70A alone instead of the multi-faceted laminate 70.

[0071] As shown in Fig. 6, each laminate 70A is composed of a card base 20, an antenna 30, and a colored layer 40, similar to the IC card 10, but the card base 20 does not have a recess 20C. Also, as shown in Figs. 6 and 7, the terminal portion 32A of the antenna 30 and the colored layer 40 are present in a recess-planned region 20F, a portion of which will become the recess 20C after cutting. Note that the terminal portion 32A of the antenna 30 in the multi-surface laminate 70 and the laminate 70A is a portion that is exposed when the recess 20C is formed, but is not exposed in the multi-surface laminate 70 and the laminate 70A.

[0072] Each laminate 70A may be given a serial number, but when the serial number and colored layer 40 are formed by a printing method, it is preferable to use the same ink to form the serial number as the ink to form the colored layer 40, in order to reduce the number of inks used by using a common ink.

[0073] The multi-layer laminate 70 can be obtained, for example, by the following manufacturing method (1), (2), or (3).

[0074] <Manufacturing method (1)> First, as shown in Fig. 8A, antennas 30 are partially embedded in each antenna planned area on the surface 21A of the antenna substrate layer 21, thereby forming an antenna sheet 80 with two or more antennas attached on the antenna substrate layer 21. Furthermore, as shown in Fig. 8B, a pair of colored layers 40 is formed by a printing method such as silk screen printing on at least each antenna terminal planned area on one surface 22A of the core layer 22 and an area 22B corresponding to the surrounding area, thereby forming a core sheet 90 with two or more pairs of colored layers 40 attached on the core layer 22.

[0075] 9A, the over-sheet layer 23, the core layer 24, the inner layer 25, the antenna sheet 80, the core sheet 90, the inner layer 26, the inner layer 27, the core layer 28, and the over-sheet layer 29 are stacked in this order from the +Z direction side toward the −Z direction to obtain the multi-surface laminate precursor 100. The antenna sheet 80 is arranged so that the antenna substrate layer 21 faces the colored layer 40, and the core sheet 90 is arranged so that the colored layer 40 faces the antenna substrate layer 21.

[0076] 9B, multi-surface laminate precursor 100 is sandwiched between stainless steel plates 101 from above and below in the thickness direction, and heat and pressure are applied to multi-surface laminate precursor 100 via stainless steel plates 101. By undergoing this heat pressing process, an integrated multi-surface laminate can be obtained. Furthermore, if any of the layers constituting the multi-surface laminate are heat resistant and do not heat-seal at a predetermined temperature, an adhesive sheet that heat-seals at a predetermined temperature can be sandwiched between the layers, or an adhesive can be applied, and then the heat pressing process can be performed to obtain integrated multi-surface laminate 70.

[0077] <Manufacturing method (2)> First, as shown in Fig. 10A, a pair of colored layers 40 are formed by a printing method such as silk screen printing in at least each antenna terminal planned area and an area 21C corresponding to the periphery thereof on the back surface 21B, which is the other surface of the antenna substrate layer 21. Then, as shown in Fig. 10B, an antenna 30 is partially embedded in an antenna planned area within each laminate planned area on the front surface 21A, which is one surface of the antenna substrate layer 21. This forms an antenna sheet 110 in which two or more antennas 30 are attached to the front surface 21A of the antenna substrate layer 21 and colored layers 40 are attached to the back surface 21B.

[0078] The antenna sheet 110 includes an antenna substrate layer 21, an antenna 30 partially embedded in a surface 21A of the antenna substrate layer 21, and a colored layer 40 provided on a back surface 21B of the antenna substrate layer 21. The colored layer 40 is provided in at least the terminal portion 32A and a region 21C corresponding to the periphery of the terminal portion 32A in the thickness direction of the antenna sheet 110 (the direction from the +Z direction side toward the -Z direction or the direction from the -Z direction side toward the +Z direction), and the color difference ΔE between the colored layer 40 and the terminal portion 32A is * ab1 is equal to or greater than 20. The color difference ΔE between the colored layer 40 and the terminal portion 32A * The lower limit, upper limit and range of ab1 are as described above.

[0079] 10C, the over-sheet layer 23, the core layer 24, the inner layer 25, the antenna sheet 110, the core layer 22, the inner layer 26, the inner layer 27, the core layer 28, and the over-sheet layer 29 are stacked in this order from the +Z direction side toward the −Z direction to obtain a multi-surface laminate precursor 120. The antenna sheet 110 is arranged so that the colored layer 40 faces the core layer 22.

[0080] Thereafter, similarly to manufacturing method (1), the multi-surface laminate precursor 120 is sandwiched between stainless steel plates from above and below in the thickness direction, and heat and pressure are applied to the multi-surface laminate precursor 120 via the stainless steel plates. By undergoing such a heat pressing process, an integrated multi-surface laminate 70 can be obtained.

[0081] When the antenna is formed on the antenna substrate layer after the antenna substrate layer, colored layer, and core layer are integrated by a heat press process, the antenna is embedded in the antenna substrate layer after the heat press process. However, if the thermal shrinkage rate of the antenna substrate layer, etc. is large, embedding the antenna in the antenna substrate layer after shrinkage may cause the antenna to become misaligned. In contrast, according to the manufacturing methods (1) and (2) for manufacturing the multi-surface laminate 70, the antenna 30 is partially embedded in the antenna substrate layer 21 before the heat press process is performed, so that misalignment of the antenna 30 when partially embedding the antenna 30 can be suppressed. Furthermore, when embedding an antenna in the antenna substrate layer after integrating the antenna substrate layer, colored layer, and core layer through a heat pressing process, if the antenna embedding process fails, there is a risk that the colored layer and core layer will be wasted. However, according to the manufacturing method for the multi-sided laminate 70 using the above manufacturing methods (1) and (2), the antenna 30 is partially embedded in a single antenna substrate layer 21, so even if the embedding process for the antenna 30 fails, it is possible to prevent the colored layer 40 and core layer 22 from being wasted, thereby improving yield.

[0082] <Manufacturing method (3)> First, a core sheet 90 is formed by attaching two or more pairs of colored layers 40 to a core layer 22 using the same procedure as in manufacturing method (1). Next, as shown in Fig. 11A, the antenna base material layer 21, the core sheet 90, and the inner layer 26 are stacked in this order from the +Z direction side toward the -Z direction to obtain a multi-faceted laminate precursor 130. The colored layer 40 is arranged so as to face the antenna base material layer 21.

[0083] Thereafter, multi-surface laminate precursor 130 is sandwiched between stainless steel plates from above and below in the thickness direction, and heat and pressure are applied via the stainless steel plates to multi-surface laminate precursor 130. By undergoing this heat pressing process, a multi-surface laminate 140 can be obtained in which antenna base material layer 21, core sheet 90, and inner layer 26 are integrated, as shown in Fig. 11B.

[0084] After obtaining the integrated multi-surface laminate 140, an antenna 30 is partially embedded in each antenna-designated area on the surface 21A of the antenna substrate layer 21 of the multi-surface laminate 140 as shown in Figure 12A, thereby forming an antenna sheet 80 in which two or more antennas 30 are attached to the antenna substrate layer 21, and a multi-surface antenna-equipped laminate 150 in which this antenna sheet 80, core sheet 84, and inner layer 26 are integrated.

[0085] The laminate 150 with a multi-surface antenna includes an antenna substrate layer 21, an antenna 30 partially embedded in a front surface 21A of the antenna substrate layer 21, a core layer 22 provided on a back surface 21B side of the antenna substrate layer 21, and a colored layer 40 provided at least partially between the antenna substrate layer 21 and the core layer 22 and in contact with the antenna substrate layer 21 and the core layer 22. The colored layer 40 is provided in at least a region 22B corresponding to the terminal portion 32A and the periphery of the terminal portion 32A in the thickness direction of the laminate 150 with a multi-surface antenna (the direction from the +Z direction toward the -Z direction or the direction from the -Z direction toward the +Z direction), and the color difference between the colored layer 40 and the terminal portion 32A is greater than the color difference between the core layer 22 and the terminal portion 32A.

[0086] After forming the laminate 150 with a multi-surface antenna, as shown in Figure 12B, the over-sheet layer 23, core layer 24, inner layer 25, laminate 150 with a multi-surface antenna, inner layer 27, core layer 28, and over-sheet layer 29 are stacked in this order from the +Z direction side toward the -Z direction to obtain the multi-surface laminate precursor 160.

[0087] Thereafter, similarly to manufacturing method (1), the multi-surface laminate precursor 160 is sandwiched between stainless steel plates from above and below in the thickness direction, and heat and pressure are applied to the multi-surface laminate precursor through the stainless steel plates. Through this heat pressing process, an integrated multi-surface laminate 70 can be obtained.

[0088] When the antenna substrate layer is thin, it is difficult to embed the antenna in the antenna substrate layer. In contrast, according to the manufacturing method (3) for manufacturing the multi-surface laminate 70, the antenna 30 is embedded in the antenna substrate layer 21 after forming the multi-surface laminate 140 in which the antenna substrate layer 21, the colored layer 40, and the core layer 22 are integrated. Therefore, even when the antenna substrate layer 21 is thin, it is easy to embed the antenna 30.

[0089] As described above, when the antenna substrate layer, colored layer, and core layer are integrated by a heat press process and then the antenna is formed on the antenna substrate layer, there is a risk of the antenna being misaligned. In contrast, according to the manufacturing method for the multi-surface laminate 70 using manufacturing method (3) described above, when the antenna substrate layer 21, colored layer 40, and core layer 22 are integrated by a heat press process, the colored layer 40 is present, so the antenna 30 can be partially embedded in the antenna substrate layer 21 so that the terminal portion 32A of the antenna 30 is located on the colored layer 40. This also eliminates the problem of misalignment.

[0090] After forming the multi-faceted laminate 70, laminates 70A are separated from the multi-faceted laminate 70. Then, first recesses 20D are formed along the outer periphery of the recess-planned region 20F of the card base 20 in the laminate 70A. Specifically, as shown in FIG. 13A, the card base 20 is cut from the surface 20A of the card base 20 in the depth direction of the card base 20 along the outer periphery of the recess-planned region 20F. This cutting of the card base 20 is continued until the terminal portions 32A are exposed.

[0091] 13B, a portion of the bottom surface 20D1 of the first recess 20D is further cut to form the second recess 20E. This cutting is performed so that the hole diameter of the second recess 20E is smaller than the hole diameter of the first recess 20D. This results in a card base 20 having a recess 20C consisting of the first recess 20D and the second recess 20E, and having a step between the bottom surfaces 20D1 and 20E1.

[0092] After forming the recess 20C in the card base 20, a visual inspection may be performed to check whether or not there is any break in the antenna wire 31 of the terminal portion 32A in the card base 20. After this visual inspection, if it is confirmed that there is no break in the antenna wire 31 of the terminal portion 32A in the card base 20, an anisotropic conductive film 60 is attached to the terminal portion 32A as shown in Fig. 14A.

[0093] 14B, the IC module 50 is placed in the recess 20C so that the back surface 51B of the substrate 51 of the IC module 50 contacts the anisotropic conductive film 60 and the molded portion 55 is located in the second recess 20E. This electrically connects the IC module 50 and the antenna 30 via the anisotropic conductive film 60, and the dual-interface IC card 10 is obtained. [Example]

[0094] In order to explain the present invention in detail, examples are given below, but the present invention is not limited to these descriptions.

[0095] Example 1 First, an antenna sheet was prepared by embedding an antenna made of a copper wire with a wire diameter of 0.11 mm in the antenna formation area on the surface of a transparent PVC sheet ("M1009" manufactured by Taihei Chemical Products Co., Ltd.) with a thickness of 0.10 mm as the antenna substrate layer.

[0096] A core sheet was also prepared by silkscreen printing an adhesive white silkscreen printing ink (product name "VAHS White Conc. No. 1" manufactured by Showa Ink Co., Ltd.) onto the surface of a core layer made of ochre-colored polyvinyl chloride (J6.2-Y (7556C) manufactured by Jiangsu Huaxin New Materials Co., Ltd.) with a thickness of 0.36 mm in each area intended for antenna terminals, forming a 3 μm-thick white colored layer.

[0097] After preparing the antenna sheet and core sheet, an intermediate laminate was formed. The intermediate laminate was produced as follows. An upper inner sheet having a thickness of 50 μm, an antenna sheet, a core sheet, a lower inner sheet 1 having a thickness of 100 μm, and a lower inner sheet 2 having a thickness of 50 μm were laminated in this order to form an intermediate laminate precursor. The intermediate laminate precursor was then sandwiched between heat press plates, heated to 140°C, and pressed at 2 MPa to integrate the intermediate laminate, obtaining an intermediate laminate.

[0098] After obtaining the intermediate laminate, a laminate was formed using the intermediate laminate. The laminate was produced as follows. A 100 μm thick upper over-sheet, the intermediate laminate, and a 100 μm thick lower over-sheet were laminated in this order to form a laminate precursor. The laminate precursor was then sandwiched between heat press plates, heated to 140°C, and pressed at 2 MPa to integrate the laminate.

[0099] After obtaining the laminate, the laminate was removed from the heat press plate and then punched out to obtain a laminate measuring 53.98 mm x 85.60 mm. The laminate was then cut from the upper oversheet side to expose the antenna terminal, thereby obtaining a laminate with an exposed antenna terminal. In the laminate with an exposed antenna terminal according to Example 1, the background of the antenna terminal was a white colored layer.

[0100] In the above laminate, no core layer is provided between the upper over-sheet and the upper inner layer, and between the lower over-sheet and the lower inner sheet. * a * b * Since the color measurement of the color system and the visibility of the location of the disconnection are determined by the antenna sheet and the core layer having the colored layer, there is no effect depending on whether or not there is a core layer between the upper oversheet and the upper inner layer, or between the lower oversheet and the lower inner sheet.

[0101] <Example 2> In Example 2, instead of the white colored layer, a red colored layer having a thickness of 3 μm was formed using an ink blended in a ratio of 55:120 between "SS 8-1003 Red" manufactured by Toyo Ink Co., Ltd. and "SS 8-121 Crimson" manufactured by Toyo Ink Co., Ltd. as the ink used for silk screen printing, and a laminate with an exposed antenna terminal was obtained by the same procedure as in Example 1. In the laminate with an exposed antenna terminal according to Example 2, the background of the antenna terminal was a red colored layer.

[0102] <Comparative Example 1> In Comparative Example 1, except that no colored layer was provided, a laminate with an exposed antenna terminal portion was obtained by the same procedure as in Example 1. In the laminate with an exposed antenna terminal portion according to Comparative Example 1, the background of the antenna terminal portion was the ochre-colored core layer.

[0103] <Comparative Example 2> In Comparative Example 2, a laminate with an exposed antenna terminal was obtained by the same procedure as in Example 1, except that a black colored layer with a thickness of 3 μm was formed using "SS 8-911 Black" manufactured by Toyo Ink Co., Ltd. as the ink used for silk screen printing instead of the white colored layer. In the laminate with an exposed antenna terminal according to Comparative Example 2, the background of the antenna terminal was a black colored layer.

[0104] <L * , a * , b * and color difference measurement> The L in the laminates in which the antenna terminal portion is exposed according to Examples 1 and 2 and Comparative Examples 1 and 2 (hereinafter referred to as "laminates") * a * b * The color tone of the color system was measured. * a * b * Color space L * , a * and b *Using a spectrophotometer ("eXact Standard NGH-XRX10" manufactured by X-Rite Inc.), light (D65 light source) was irradiated onto the surface of the colored layer in Examples 1 and 2 and Comparative Example 2, and the core layer in Comparative Example 1, at an incident angle of 10 degrees (the normal direction to the surface of the colored layer or core layer is set to 0 degrees) through a transparent PVC sheet, which is the antenna substrate layer, and measurements were taken at five points based on total light reflection (specular reflection light + diffuse reflection light). In addition, as a reference color, a copper plate made of the same material as the antenna used in the laminate was also similarly measured. * a * b * Color space L * , a * and b * The L of each color obtained by the measurement was * , a * , b * Using the average values ​​of each, ΔL was calculated using the copper plate value as the standard color. * , Δa * , Δb * and color difference ΔE * ab was calculated.

[0105] <Visibility evaluation> The laminates according to Examples 1 and 2 and Comparative Examples 1 and 2 were visually inspected for disconnection at the antenna terminals under fluorescent lighting of 1000 lux.

[0106] The results are shown in Tables 1 and 2 below. [Table 1]

[0107] [Table 2]

[0108] When comparing the laminate having a white colored layer according to Example 1 with the laminate having no colored layer according to Comparative Example 1, the visibility of the antenna terminal portion of the laminate according to Example 1 was good, while the visibility of the antenna terminal portion of the laminate according to Comparative Example 1 was poor. This is thought to be due to the color difference between the respective portions. Specifically, the color difference ΔE between the white colored layer and the antenna terminal portion in Example 1 * The large ab of 40.40 ensured good visibility of the antenna terminal, while the color difference ΔE between the ochre-colored core layer and the antenna terminal in Comparative Example 1 was * It can be determined that the visibility of the antenna terminal portion is poor because ab is small at 14.27. In Example 1, the color difference between the colored layer and the antenna terminal portion is larger than the color difference between the core layer and the antenna terminal portion, which is the color difference ΔE * ab is the color difference ΔE between the core layer and the antenna terminal portion in Comparative Example 1 * This can be confirmed by the fact that it is larger than ab.

[0109] When comparing the laminate of Example 1 having a white colored layer with the laminate of Comparative Example 2 having a black colored layer, the color difference between the colored layer and the antenna terminal portion is large in both cases, but the visibility of the antenna terminal portion of the laminate of Example 1 is good, whereas the visibility of the antenna terminal portion of the laminate of Comparative Example 2 is poor. * and b * Although there is not much difference in the values ​​of * There is a large difference between Example 1 and Comparative Example 2, with an average value of 91.30 and 4.17, respectively. Generally, the lower the lightness, i.e., the closer to black the color, the more light-absorbing the material is. Therefore, it is believed that the lower the lightness of the colored layer and the easier it is to absorb light, the lower the visibility of the antenna terminal. Conversely, if the lightness is above a certain value, light absorption can be suppressed, and the visibility of the antenna terminal can be ensured.

[0110] Furthermore, when comparing the laminate having a red colored layer according to Example 2 with the laminate having a black colored layer according to Comparative Example 2, the color difference was smaller in Example 2, but the visibility of the antenna terminal part in Example 2 was good. This can also be considered to be due to the lightness, and the lightness L * In Comparative Example 2, where the average value is 4.17, the visibility of the antenna terminal is poor, and the brightness L * It can be judged that Example 2, in which the average value was 38.52, had good visibility of the antenna terminal portion.

[0111] However, when comparing the laminate of Example 2 having a red colored layer with the laminate of Comparative Example 1 having an ochre core layer, the lightness L * The visibility of the antenna terminal portion was higher in Comparative Example 1 than in Example 2, whereas the visibility of the antenna terminal portion was better in Example 2 than in Comparative Example 1. * Visibility cannot be judged solely by brightness L * It can be determined that the visibility of the antenna terminal requires a value of 20 or more and a color difference of 20 or more. In Example 2, the color difference between the colored layer and the antenna terminal is larger than the color difference between the core layer and the antenna terminal. * ab is the color difference ΔE between the core layer and the antenna terminal portion in Comparative Example 1 * This can be confirmed by the fact that it is larger than ab. [Explanation of symbols]

[0112] 10...Dual interface IC card 20...Card base 20A…Surface 20C...recess 21...Antenna substrate layer 22...Core layer 30...Antenna 32A…Terminal section 40...Colored layer 50...IC module

Claims

1. A dual interface IC card capable of contact communication and contactless communication with an external device, a laminated card base having a recess on its surface; an antenna disposed inside the card base; a colored layer disposed inside the card substrate; an IC module having an IC chip disposed in the recess, the card body comprises a transparent or semi-transparent antenna substrate layer and a core layer located on a back surface side of the card body opposite to the front surface relative to the antenna substrate layer, the antenna is partially embedded in a surface of the antenna substrate layer opposite to a surface on the core layer side, the antenna is made of an antenna wire, has a terminal portion exposed in the recess, and is electrically connected to the IC chip; the colored layer is provided between the antenna substrate layer and the core layer, is in contact with the antenna substrate layer and the core layer, and is provided in an area corresponding to at least the terminal portion and a periphery of the terminal portion in a thickness direction of the card body, a color difference between the colored layer and the terminal portion is greater than a color difference between the core layer and the terminal portion and is 20 or more; L in the colored layer ＊ a ＊ b ＊ Color system lightness L ＊ A dual interface IC card, wherein the number of times is 20 or more.

2. 2. The dual interface IC card according to claim 1, wherein said terminal portion is configured by a structure in which said antenna wire is repeatedly folded back from the outer periphery of said recess toward the center thereof.

3. 2. The dual interface IC card according to claim 1, wherein the core layer is colored.

4. 2. The dual interface IC card according to claim 1, wherein the core layer is chromatic, black, or gray.

5. 2. The dual interface IC card according to claim 1, wherein the colored layer is white.

6. An antenna sheet used in the manufacture of a dual interface IC card capable of contact communication and contactless communication with an external device, the dual interface IC card comprising: a laminated card base having a recess on its surface; an antenna disposed inside the card base; and an IC module having an IC chip disposed in the recess and electrically connected to the antenna, a transparent or semi-transparent antenna substrate layer; an antenna partially embedded in one surface of the antenna substrate layer; a colored layer provided on the other surface of the antenna substrate layer, the antenna is made of an antenna wire and has a terminal portion for electrically connecting to an IC chip; the colored layer is provided in a region corresponding to at least the terminal portion and a periphery of the terminal portion in a thickness direction of the antenna sheet, the color difference between the colored layer and the terminal portion is 20 or more; L in the colored layer ＊ a ＊ b ＊ Color system lightness L ＊ The antenna sheet has a value of 20 or more.

7. The antenna sheet according to claim 6 , wherein the colored layer is white.

8. The antenna sheet according to claim 6 or 7, wherein the antenna is provided on two or more surfaces.

9. A laminate with an antenna used for manufacturing a dual interface IC card capable of contact communication and contactless communication with an external device, the laminate comprising: a card base having a laminated structure with a recess on a surface; an antenna disposed inside the card base; and an IC module having an IC chip disposed in the recess and electrically connected to the antenna, a transparent or semi-transparent antenna substrate layer; an antenna partially embedded in one surface of the antenna substrate layer; a core layer provided on the other surface side of the antenna substrate layer; a colored layer provided at least partially between the antenna substrate layer and the core layer and in contact with the antenna substrate layer and the core layer, the antenna is made of an antenna wire and has a terminal portion for electrically connecting to an IC chip; the colored layer is provided in a region corresponding to at least the terminal portion and a periphery of the terminal portion in a thickness direction of the antenna-equipped laminate, a color difference between the colored layer and the terminal portion is greater than a color difference between the core layer and the terminal portion and is 20 or more; L in the colored layer ＊ a ＊ b ＊ Color system lightness L ＊ The laminate with an antenna, wherein the number of antennas is 20 or more.

10. The laminate with an antenna according to claim 9 , wherein the core layer is colored.

11. The laminate with an antenna according to claim 9 , wherein the core layer is chromatic, black, or gray.

12. The laminate with an antenna according to claim 9 , wherein the colored layer exhibits a white color.

13. A multi-faceted laminate with antennas, comprising two or more laminates with antennas according to any one of claims 9 to 12 attached to multiple surfaces.

14. A method for manufacturing a dual interface IC card capable of contact communication and contactless communication with an external device, comprising: preparing a laminate including a card base and an antenna disposed inside the card base and having a terminal portion formed of an antenna wire; a step of cutting the card base to form a recess in which the terminal portion of the antenna is exposed and in which an IC module having an IC chip is to be placed; a step of electrically connecting the terminal portion of the antenna and the IC chip, and placing the IC module in the recess, the card base comprises a transparent or semi-transparent antenna substrate layer, and a core layer located closer to the back surface than the antenna substrate layer, when the surface of the card base on which the recess is formed is defined as the front surface and the surface opposite to the front surface is defined as the back surface, the antenna is partially embedded in a surface of the antenna substrate layer opposite to a surface on the core layer side, the colored layer is provided in a region corresponding to at least the terminal portion and a periphery of the terminal portion in a thickness direction of the laminate, a color difference between the colored layer and the terminal portion is greater than a color difference between the core layer and the terminal portion and is 20 or more; L in the colored layer ＊ a ＊ b ＊ Color system lightness L ＊ A method for manufacturing a dual interface IC card, wherein the number of times is 20 or more.

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