Processing liquid storage container, substrate processing apparatus, and substrate processing method

Abstract

To suppress generation of particles in a supply path of processing liquid with a simple configuration.SOLUTION: A processing liquid storage container that stores processing liquid comprises a container body that retains the processing liquid and a processing liquid suction part connected to the container body. The processing liquid suction part includes: a take-out base which is provided above a body-side opening that communicates with the container body and has a take-out port for the processing liquid at a position corresponding to the body-side opening; an elastic member 22 which is provided above the take-out base and has an opening; an actuator 23 which is provided above the elastic member so as to expose the opening and is extendable and contractible in the vertical direction according to a magnitude of the applied voltage; and a top plate member 24 which is provided above the actuator so as to expose the opening and defines an upper end position of the actuator. When the actuator extends in the vertical direction, the compression amount of the elastic member increases to close the opening. When the actuator contracts in the vertical direction, the compression amount of the elastic member decreases to open the opening.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a processing liquid container, a substrate processing apparatus, and a substrate processing method. [Background technology]

[0002] Patent Document 1 discloses a treatment liquid storage container that stores a treatment liquid. This treatment liquid storage container includes a container body that stores the treatment liquid and a treatment liquid suction unit connected to the container body. The treatment liquid suction unit has a hollow portion, a top opening provided at the top of the hollow portion, a bottom opening provided at the bottom of the hollow portion, a gas supply port provided at a side of the hollow portion for supplying gas into the hollow portion, and a gas discharge port provided at the side of the hollow portion for discharging gas from the hollow portion. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2023-56612 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology according to the present disclosure suppresses the generation of particles in a supply path of a treatment liquid with a simple configuration. [Means for solving the problem]

[0005] One aspect of the present disclosure is a treatment liquid storage container that contains a treatment liquid, comprising: a container body that stores the treatment liquid; and a treatment liquid suction unit connected to the container body, wherein the treatment liquid suction unit is provided above a body-side opening that communicates with the container body, has a larger area than the body-side opening in a top view, and has a treatment liquid outlet at a position corresponding to the body-side opening; an elastic member that is provided above the removal base, has chemical resistance to the treatment liquid, and has an opening at a position corresponding to the outlet in a top view; an actuator that is provided above the elastic member to expose the opening, and is expandable and contractible in the vertical direction depending on the magnitude of an applied voltage; and a top plate member that is provided above the actuator to expose the opening, and determines the position of the upper end of the actuator, wherein when the actuator expands in the vertical direction, the amount of compression of the elastic member by the actuator increases, thereby closing the opening; and when the actuator contracts in the vertical direction, the amount of compression of the elastic member by the actuator decreases, thereby opening the opening. [Effects of the Invention]

[0006] According to the present disclosure, it is possible to suppress the generation of particles in the supply path of the treatment liquid with a simple configuration. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a side cross-sectional view schematically illustrating an outline of the configuration of a resist coating apparatus as a substrate processing apparatus including a processing liquid storage container according to an embodiment of the present invention. [Figure 2] FIG. 2 is an explanatory diagram for explaining the function of each part constituting the resist coating apparatus of FIG. [Figure 3] 1 is a perspective view schematically illustrating an outline of the configuration of a resist storage container according to an embodiment of the present invention. [Figure 4] 3 is an explanatory diagram of a resist container and a mechanism for supplying gas to the resist container; FIG. [Figure 5] FIG. 10 is a cross-sectional view of the resist suction portion, showing a state in which the opening of the elastic member is opened. [Figure 6] 10 is a cross-sectional view of the resist suction portion, showing a state in which the opening of the elastic member is closed. FIG. [Figure 7] FIG. 10 is a diagram illustrating a first modified example of the resist container. [Figure 8] FIG. 10 is a diagram illustrating a modified example 2 of the resist container. DETAILED DESCRIPTION OF THE INVENTION

[0008] In the manufacturing process of semiconductor devices and the like, there is a process of applying a resist liquid to a substrate to form a resist pattern. In this process, a semiconductor wafer (hereinafter referred to as "wafer") serving as a substrate held by, for example, a spin chuck is rotated, and resist liquid is ejected as a processing liquid onto the center of the wafer. The resist liquid is ejected from a nozzle, and the resist liquid ejected from the nozzle is supplied from a resist container that contains the resist liquid.

[0009] Resist patterns formed on wafers are becoming increasingly finer, and in order to accommodate these further finer resist patterns, it is necessary to reduce the amount of particles that can adhere to the wafer. Conventional coating processing equipment has attempted to reduce the amount of particles by, for example, using highly clean parts or by suppressing the generation of particles in the process of passing the resist liquid through the nozzle that ejects the resist liquid, or in the subsequent coating processing process.

[0010] However, in conventional coating processing apparatuses, valves and pumps that may generate particles are installed in the resist solution supply path from the resist container to the nozzle, leaving room for improvement in terms of suppressing particle generation. The technology disclosed in the aforementioned Patent Document 1 aims to solve this problem. However, this technology leaves room for improvement in terms of the simplicity of the device configuration.

[0011] Therefore, the technology according to the present disclosure suppresses the generation of particles in the supply path of the treatment liquid with a simple configuration.

[0012] Hereinafter, a processing liquid container, a substrate processing apparatus, and a substrate processing method according to the present embodiment will be described with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0013] <Resist coating equipment> FIG. 1 is a side cross-sectional view that schematically shows the outline of the configuration of a resist coating apparatus as a substrate processing apparatus equipped with a processing liquid storage container according to this embodiment.

[0014] The resist coating apparatus 100 in FIG. 1 coats a resist liquid as a processing liquid on a wafer W as a substrate. The resist coating apparatus 100 has a processing vessel 101, and a loading / unloading port (not shown) for the wafer W is formed on the side of the processing vessel 101. The processing vessel 101 contains a spin chuck 102 as a substrate holder. The spin chuck 102 holds the wafer W, specifically, holds the wafer W horizontally. The spin chuck 102 is connected to a rotating unit 103 that can be raised and lowered, and the rotating unit 103 is connected to a rotation driving unit 104 configured by a motor or the like. Therefore, the wafer W held on the spin chuck 102 can be rotated by driving the rotation driving unit 104.

[0015] A cup 105 is disposed outside the spin chuck 102 to receive and recover the resist solution scattered or dropped from the wafer W. An opening 106 is formed in the upper surface of the cup 105, through which the wafer W passes before and after being transferred to and from the spin chuck 102. A drain pipe 107 and an exhaust pipe 108 are provided at the bottom of the cup 105. The exhaust pipe 108 is connected to an exhaust device 109 such as an exhaust pump.

[0016] A nozzle 110 that discharges a resist liquid toward the surface of the wafer W is disposed within the processing vessel 101. The nozzle 110 is supported by a nozzle support 111, such as an arm, which can be raised and lowered by a drive mechanism (not shown) as indicated by a reciprocating arrow A and horizontally moved as indicated by a reciprocating arrow B. The nozzle 110 is configured to be able to suck and discharge a liquid based on a control signal from a control unit 200, which will be described later. The specific configuration of the nozzle 110 is not particularly limited as long as it is capable of sucking and discharging a liquid. For example, a known electric micropipette can be used as the nozzle 110.

[0017] A resist container 120 containing resist liquid and a nozzle cleaner 130 for cleaning the nozzle 110 are provided outside the cup 105. The resist container 120 and the nozzle cleaner 130 will be described later.

[0018] The resist coating apparatus 100 includes a control unit 200. The control unit 200 processes computer-executable instructions that cause the resist coating apparatus 100 to perform the various processes described herein. The control unit 200 may be configured to control each element of the resist coating apparatus 100 to perform the various processes described herein. In one embodiment, part or all of the control unit 200 may be included in the resist coating apparatus 100. The control unit 200 may include a processing unit, a storage unit, and a communication interface. The control unit 200 may be implemented, for example, by a computer. The processing unit may be configured to read from the storage unit a program that provides logic or routines that enable various control operations and execute the read program to perform various control operations. This program may be stored in the storage unit in advance or may be acquired via a medium when needed. The acquired program is stored in the storage unit and read from the storage unit by the processing unit for execution. The medium may be various computer-readable storage media or a communication line connected to the communication interface. The storage medium may be temporary or non-temporary. The processing unit may be a CPU (Central Processing Unit) or may be one or more circuits. The storage unit may include a RAM (Random Access Memory), a ROM (Read Only Memory), an HDD (Hard Disk Drive), an SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with the resist coating apparatus 100 via a communication line such as a LAN (Local Area Network).

[0019] Specifically, the control unit 200 controls the suction operation by the nozzle 110 and the discharge operation of the resist liquid onto the wafer W held by the spin chuck 102, etc.

[0020] 2 is an explanatory diagram for explaining the function of each part constituting the resist coating apparatus 100. The nozzle 110 is movable between the resist storage part 120, above the wafer W held by the spin chuck 102 (not shown in FIG. 2), and the nozzle cleaning part 130.

[0021] The resist storage unit 120 includes a plurality of resist storage containers 1 (hereinafter, sometimes referred to as "containers 1") as processing liquid storage containers. Each container 1 may store, for example, different types of resist liquid, or the same type of resist liquid. Alternatively, each container 1 may store a solvent such as thinner used in a pre-wetting process of the wafer W. The type of processing liquid stored in the container 1 and the number of containers 1 are changed as appropriate depending on the processing content performed in the substrate processing apparatus.

[0022] The nozzle cleaning unit 130 includes a cleaning liquid spraying unit 131 that sprays a cleaning liquid onto the surface of the nozzle 110, a cleaning liquid storage unit 132 that stores the cleaning liquid, and a gas spraying unit 133 that sprays a gas onto the surface of the nozzle 110. The nozzle 110 moves to the nozzle cleaning unit 130 at a predetermined timing, for example, when changing the type of resist liquid to be discharged onto the wafer W, and is cleaned by moving sequentially through the cleaning liquid spraying unit 131, the cleaning liquid storage unit 132, and the gas spraying unit 133. Note that if cleaning of the nozzle 110 is not necessary, the nozzle cleaning unit 130 does not need to be provided.

[0023] In the cleaning liquid spraying unit 131, a cleaning liquid such as pure water is sprayed onto the surface of the nozzle 110, thereby removing the resist liquid adhering to the surface of the nozzle 110.

[0024] In the cleaning liquid storage section 132, the nozzle 110 is immersed in a cleaning liquid such as pure water, and the inside of the nozzle 110 is cleaned by repeatedly suctioning the resist liquid and discharging it to a predetermined discharge location. The predetermined discharge location may be within the cleaning liquid storage section 132 or may be a dedicated discharge location (not shown).

[0025] In the gas blowing unit 133, a gas such as air is blown onto the surface of the nozzle 110 to dry the surface of the nozzle 110.

[0026] Next, an outline of the configuration of the container 1 will be described. Fig. 3 is a perspective view that schematically shows the outline of the configuration of the container 1 according to this embodiment. Fig. 4 is an explanatory diagram of the container 1 and a mechanism for supplying gas to the container 1. Figs. 5 and 6 are cross-sectional views of a resist suction unit, which will be described later, with Fig. 5 showing a state in which an opening of an elastic member, which will be described later, is open, and Fig. 6 showing a state in which the opening is closed.

[0027] As shown in FIGS. 3 and 4, the container 1 includes a container body 10 for storing a resist liquid, and a resist suction section 20 connected to the container body 10 as a processing liquid suction section.

[0028] The container body 10 is formed, for example, of a glass bottle, and has a gas supply port 11 formed on the top surface for supplying gas to the container body 10. One end of a gas supply pipe 140 is connected to the gas supply port 11, and the other end of the gas supply pipe 140 is connected to a gas supply unit 141 that supplies an inert gas, such as nitrogen gas or argon gas. The gas supply unit 141 has, for example, an on-off valve that switches the supply of the inert gas on and off and a flow rate control valve that adjusts the flow rate of the inert gas. The gas supply pipe 140 is also provided with a gas filter 142 that removes impurities from the gas flowing through the gas supply pipe 140. The flow rate of the gas flowing through the gas supply pipe 140 is adjusted by the control unit 200 controlling the gas supply unit 141. The configuration of the supply mechanism for the gas supplied to the container body 10 is not limited to the configuration described in this embodiment, and may be any configuration that can supply a predetermined gas to the gas supply port 11.

[0029] The container body 10 is also provided with a body-side opening 12 that communicates with the interior of the container body 10, i.e., the storage space for the resist liquid. The body-side opening 12 is formed to a size that allows the nozzle 110 to pass through, and is formed, for example, in a circular shape when viewed from above. In this embodiment, the body-side opening 12 is located in the following position. That is, the body-side opening 12 is located at the end of a resist suction pipe 13, one end of which is connected to the lower part of the container body 10, the other end of which is connected to the lower part of the container body 10. The resist suction pipe 13 extends downward from an outlet 25 of an extraction base 21 (described below) of the resist suction unit 20, and is connected to the lower part of the container body 10 (specifically, the bottom surface 10a).

[0030] The resist suction pipe 13 is provided with a resist filter 14, which removes impurities from the resist liquid passing through the resist suction pipe 13. Note that if the cleanliness of the resist liquid stored in the container body 10 is sufficiently high for use as a resist liquid to be applied to the wafer W, the resist filter 14 does not need to be provided.

[0031] Furthermore, a liquid level sensor 15 that detects the liquid level of the resist liquid in the resist suction pipe 13 is provided downstream of the resist filter 14 in the resist suction pipe 13. Note that the specific configuration of the liquid level sensor 15 is not particularly limited as long as it is possible to detect the liquid level.

[0032] Furthermore, as will be described later, when the resist liquid in the resist suction pipe 13 is sucked by the nozzle 110, the liquid level of the resist liquid in the resist suction pipe 13 drops, but in the container 1 of this embodiment, the liquid level can be adjusted by supplying gas from the gas supply port 11 of the container body 10. If the liquid level of the resist liquid is maintained at a constant height, it is possible to keep the lower end position of the nozzle 110, which is lowered when sucking the resist liquid, constant. This eliminates the need to adjust the amount of descent of the nozzle 110 depending on the liquid level of the resist liquid, and makes it possible to simplify movement control of the nozzle 110.

[0033] The liquid level is preferably adjusted by supplying gas to the container body 10 based on the liquid level in the resist suction pipe 13 detected by the liquid level sensor 15. For example, when the liquid level sensor 15 detects a drop in the liquid level of the resist liquid, the gas supply unit 141 is controlled to supply gas to the container body 10, thereby automatically raising the liquid level to a predetermined height.

[0034] The resist suction part 20 is connected to the container body 10, specifically, via a resist suction pipe 13. The resist suction part 20 is a closing part that closes the body-side opening 12, and has an extraction base 21, an elastic member 22, an actuator 23, and a top plate member 24, as shown in FIG.

[0035] The take-out base 21 is provided above the body-side opening 12 and has a larger area than the body-side opening 12 in a top view. A resist liquid take-out port 25 is provided in the take-out base 21 at a position corresponding to the body-side opening 12. The take-out base 21 is formed from a material (e.g., polypropylene resin) that is chemically resistant to the resist liquid and electrically insulating. The take-out port 25 is formed to a size that allows the nozzle 110 to pass through. In a top view, the take-out port 25 is smaller than the body-side opening 12.

[0036] The removal base 21 also has a bottom wall 26 and a peripheral wall 27 . The bottom wall 26 is a flat plate portion that supports the elastic member 22 from below, and the outlet 25 is formed to penetrate the bottom wall 26 in the vertical direction. When viewed from above, the bottom wall 26 has, for example, a circular shape with a larger diameter than the main body side opening 12. The peripheral wall 27 is a restricting member that restricts lateral expansion of the elastic member 22. The peripheral wall 27 has, for example, an annular shape with approximately the same outer diameter as the main body side opening 12 when viewed from above.

[0037] The elastic member 22 is provided above the take-out base 21. The elastic member 22 has chemical resistance to the resist solution. That is, the elastic member 22 is made of a material that has resistance to the resist solution in addition to elasticity. The material is, for example, perfluoroelastomer (FFKM).

[0038] The elastic member 22 has an opening 28 at a position corresponding to the outlet 25 in a top view. The opening 28 is formed so as to penetrate the elastic member 22 in the vertical direction. The portion of the elastic member 22 surrounding the opening 28 may become gradually thinner toward the center of the opening 28. When the opening 28 has a cone shape that becomes gradually narrower downward, the portion of the elastic member 22 surrounding the opening 28 becomes gradually thinner toward the center of the opening 28 as described above.

[0039] As will be described later, opening 28 is opened and closed by actuator 23. Opening 28 is formed to a size that allows nozzle 110 to pass through when opening 28 is in an opened state by actuator 23. Furthermore, opening 28 does not have to be completely closed when closing by actuator 23. This makes it possible to suppress the generation of particles due to contact between the parts that form opening 28 when opening 28 is completely closed.

[0040] The actuator 23 is provided above the elastic member 22 so as to expose the opening 28, and is capable of expanding and contracting in the vertical direction according to the magnitude of the voltage applied to the actuator 23. For example, a dielectric actuator in which a dielectric elastomer is sandwiched between electrodes or a piezoelectric element is used as the actuator 23. Note that the actuator 23 does not need to be chemically resistant. The actuator 23 extends in the vertical direction, for example, when a voltage is applied thereto. Furthermore, in order to expose the opening 28 upward, the actuator 23 has an intermediate opening 29 at a position corresponding to the opening 28 in a top view. The intermediate opening 29 is formed so as to penetrate the actuator 23 in the vertical direction. The intermediate opening 29 is formed to a size that allows the nozzle 110 to pass through. In a top view, the intermediate opening 29 is larger than, for example, the outlet 25.

[0041] Top plate member 24 is provided above actuator 23 to expose opening 28, and is a member that determines the position of the upper end of actuator 23. Top plate member 24 has an upper opening 30 provided at a position corresponding to intermediate opening 29 to expose opening 28 upward. Upper opening 30 is formed to a size that allows nozzle 110 to pass through. In addition, when viewed from above, upper opening 30 is formed to a size that is the same as that of intermediate opening 29, for example. The top plate member 24 is formed of, for example, the same material as the removal base 21.

[0042] The top plate member 24 also has a top wall 31 and a peripheral wall 32 . The top wall 31 is in contact with the upper surface of the actuator 23 and fixes the position of the upper end of the actuator 23 even when the actuator 23 extends in the vertical direction, and is formed so that the upper opening 30 penetrates it in the vertical direction. When viewed from above, the top wall 31 has, for example, an annular shape with approximately the same diameter as the bottom wall 26 of the removal base 21. The peripheral wall 32 defines the horizontal position of the actuator 23. When viewed from above, the peripheral wall 32 has, for example, an annular shape with substantially the same inner and outer diameters as the peripheral wall 27 of the removal base 21.

[0043] In the resist suction part 20, the elastic member 22 and the actuator 23 are provided sandwiched between the removal base 21 and the top plate member 24. Specifically, the elastic member 22 and the actuator 23 are housed in a housing space formed by the bottom wall 26 and the peripheral wall 27 of the removal base 21 and the top wall 31 and the peripheral wall 32 of the top plate member 24, and are sandwiched between the bottom wall 26 and the top wall 31 in the vertical direction.

[0044] In the resist suction section 20, the outlet 25, the opening 28, the intermediate opening 29, and the upper opening 30 are connected in this order from the main body side opening 12, for example.

[0045] In the container 1 having the above configuration, as shown in Fig. 6, when the actuator 23 expands in the vertical direction, the amount of compression of the elastic member 22 by the actuator 23 increases, thereby closing the opening 28. Specifically, in the resist suction unit 20, when a voltage is applied to the actuator 23 and the actuator 23 expands in the vertical direction, the top plate member 24 prevents the upper end of the actuator 23 from rising, causing the lower end of the actuator 23 to descend, thereby compressing the elastic member 22. This compression pushes the portion of the elastic member 22 around the opening 28, which is sandwiched between the actuator 23 and the take-out base 21, inward, i.e., toward the center of the opening 28, thereby closing the opening 28. As a result, the main body-side opening 12 is blocked.

[0046] 5, in the container 1, when the actuator 23 contracts in the vertical direction, the amount of compression of the elastic member 22 by the actuator 23 decreases, thereby opening the opening 28. Specifically, in the resist suction unit 20, when the application of voltage to the actuator 23 is released and the actuator 23 contracts in the vertical direction, the lower end of the actuator 23 rises, and the compression of the elastic member 22 by the actuator 23 is released. As a result, the inner peripheral end of the opening 28 moves outward, thereby opening the opening 28. Specifically, the portion of the elastic member 22 that was pushed inward when the voltage was applied to the actuator 23 returns to its original position, thereby opening the opening 28. With the opening 28 open, the nozzle 110 is inserted below the main body opening 12 via the upper opening 30, the middle opening 29, the opening 28, and the outlet 25. The nozzle 110 then sucks the resist liquid from the container body 10 (specifically, from the resist suction pipe 13).

[0047] Incidentally, if the resist suction section 20 that blocks the main body opening 12 is not provided, there is a concern that particles may enter the resist suction pipe 13 from the main body opening 12, reducing the cleanliness of the resist liquid in the resist suction pipe 13 and the container main body 10. In contrast, in the container 1 according to this embodiment, as described above, the opening 28 is closed and the main body opening 12 is blocked, so that particles that may enter through the upper opening 30 of the top plate member 24 can be prevented from reaching the resist suction pipe 13, and the cleanliness of the resist liquid can be maintained.

[0048] <Resist coating process> Next, a resist coating method using the resist coating apparatus 100 will be described.

[0049] First, the wafer W is placed on the spin chuck 102 . Next, the nozzle support part 111 is moved toward the container 1 of the resist storage part 120 so that the nozzle 110 moves above the resist suction part 20. Thereafter, the nozzle support part 111 is lowered toward the inside of the resist suction pipe 13 of the container 1.

[0050] Furthermore, the actuator 23 of the resist suction unit 20 is contracted in the vertical direction, the amount of compression of the elastic member 22 by the actuator 23 is reduced, and the opening 28 is opened. The timing at which the opening 28 is opened under the control of the control unit 200 as described above is linked to, for example, the timing at which the control unit 200 issues a command to control the movement of the nozzle support unit 111 toward the container 1. For example, the opening 28 is opened when the control unit 200 outputs a command to start the nozzle support unit 111 descending toward the resist suction pipe 13 of the container 1. Alternatively, the opening 28 may be opened when the control unit 200 outputs a command to start the nozzle support unit 111 moving toward the container 1 of the resist storage unit 120.

[0051] After the opening 28 is opened, the nozzle support portion 111 is lowered until the lower end of the nozzle 110 passes through the opening 28 and the outlet 25 and is immersed in the resist liquid in the resist suction pipe 13 .

[0052] After the nozzle support portion 111 has been lowered, the resist liquid is sucked into the nozzle 110. In the resist liquid suction process, the resist liquid is sucked by the nozzle 110, thereby lowering the liquid level of the resist liquid in the resist suction pipe 13. In the container body 10 filled with the resist liquid, the supply of gas to the container body 10 is stopped, but when the liquid level sensor 15 detects a drop in the liquid level, gas is automatically supplied to the container body 10 so that the liquid level rises to a predetermined height. In other words, the liquid level that has dropped after the nozzle 110 has sucked the resist liquid automatically rises to the initial liquid level.

[0053] Next, the nozzle support part 111 is raised, and the nozzle 110 is moved to above the resist suction part 20. Thereafter, the nozzle support part 111 is moved toward the spin chuck 102 so that the nozzle 110 moves to above the wafer W held on the spin chuck 102.

[0054] Furthermore, the actuator 23 of the resist suction part 20 is extended in the vertical direction, the amount of compression of the elastic member 22 by the actuator 23 is increased, and the opening 28 is closed. The timing at which the opening 28 is closed under the control of the control part 200 as described above is linked to, for example, the timing at which the control part 200 issues a command to control the movement of the nozzle support part 111 from the container 1. For example, the opening 28 is closed when the control part 200 outputs a command to start moving the nozzle support part 111 toward the spin chuck 102 after the nozzle 110 has been moved above the resist suction part 20.

[0055] After the nozzle support 111 has completed moving toward the spin chuck 102, the sucked resist liquid is discharged from the nozzle 110 onto the wafer W held on the spin chuck 102. In accordance with this discharge, the spin chuck 102 is rotated, and a resist film is formed on the wafer W.

[0056] Thereafter, if necessary, the nozzle 110 is moved to the nozzle cleaning unit 130 and the nozzle 110 is cleaned.

[0057] Through the above steps, the resist coating process for the wafer W is completed.

[0058] <Major Effects of This Embodiment> The resist container 1 according to this embodiment does not require valves, pumps, or the like that may generate particles in the supply path of the resist liquid to the nozzle 110. Therefore, it is possible to suppress the generation of particles in the supply path of the resist liquid, and improve the cleanliness of the resist liquid. Furthermore, in the resist container 1, the resist suction unit 20 is intended to prevent particles from being mixed into the resist solution being sucked by the nozzle 110. The resist suction unit 20 does not require multiple gas pipes, a gas supply unit, a gas filter, etc., as in the technology disclosed in Patent Document 1, and does not require the preparation of a highly clean inert gas. Therefore, the system using the resist suction unit 20 has a simple configuration overall. Therefore, the resist container 1 can suppress the generation of particles in the supply path of the processing liquid with a simple configuration.

[0059] Furthermore, in this embodiment, the elastic member 22 is exposed to the vapor of the resist liquid stored in the container body 10 when the opening 28 is closed. Also, the opening 28 of the elastic member 22 (specifically, its narrowest portion) is narrower than the outlet 25, the middle opening 29, and the upper opening 30. Therefore, even if the size of the opening 28 of the elastic member 22 is set so that the elastic member 22 does not come into contact with the nozzle 110 from the viewpoint of particles, there is a high possibility that the resist liquid adhering to the nozzle 110 will come into contact with the elastic member 22. In the resist suction unit 20, this elastic member 22 has chemical liquid resistance. Therefore, it is possible to prevent the elastic member 22 from being damaged by the resist liquid itself or the vapor of the resist liquid.

[0060] In other words, in this embodiment, the opening and closing of the outlet 25 by the actuator 23 is performed indirectly via the elastic member 22, but it is also possible to consider a configuration that differs from this embodiment in that the outlet 25 is opened and closed directly by a dielectric actuator or piezoelectric element used in the actuator 23. However, since dielectric actuators and piezoelectric elements generally do not have chemical resistance, the above-mentioned configuration of direct opening and closing leaves room for improvement in terms of durability.

[0061] Furthermore, in the resist storage container 1 according to this embodiment, the take-out base 21 of the resist suction part 20 has a peripheral wall 27 that restricts lateral expansion of the elastic member 22. Therefore, compared to a case where the peripheral wall 27 is not provided, the opening 28 can be closed even if the amount of compression of the elastic member 22 by the actuator 23 is small. In other words, since there is no need to make the elastic member 22 thick, the resist suction part 20 can be made smaller in size.

[0062] As described above, the portion of the elastic member 22 surrounding the opening 28 may be gradually thinner toward the center of the opening 28. With such a thinner portion, the opening 28 can be closed even if the amount of compression of the elastic member 22 by the actuator 23 is small.

[0063] <Modification 1 of the resist container> FIG. 7 is a diagram for explaining a first modified example of the resist container. The resist storage container 1A in FIG. 7 has a proximity detection sensor 301 that detects the proximity of an object. The proximity detection sensor 301 is provided, for example, in the resist suction section 20A, and more specifically, in the top plate member 24 (see FIG. 3, etc.).

[0064] When the proximity detection sensor 301 is provided in this manner, the control unit 200 performs control such as the following: That is, when the proximity detection sensor 301 detects the proximity of an object, the control unit 200 performs control to open the opening 28 because it is considered that the nozzle 110 is near the resist suction unit 20A and that the nozzle 110 needs to be prepared to suction the resist liquid. Furthermore, when the proximity detection sensor 301 does not detect the proximity of an object, the control unit 200 performs control to close the opening 28 because it is considered that the nozzle 110 is not near the resist suction unit 20A and that the nozzle 110 does not need to be prepared to suction the resist liquid.

[0065] By controlling in this manner, the opening 28 can be opened and closed in conjunction with the position of the nozzle 110, and the time during which the opening 28 is open can be shortened as much as possible.

[0066] <Modification 2 of Resist Storage Container> FIG. 8 is a diagram for explaining a second modification of the resist container. The resist container 1B in FIG. 8 has a chemical solution detection sensor 302 that detects the chemical solution components of the resist solution. The chemical liquid detection sensor 302 is provided, for example, in the resist suction part 20B, and more specifically, in the top plate member 24 (see FIG. 3, etc.).

[0067] When the chemical liquid detection sensor 302 is provided in this manner, the control unit 200 performs control such as the following. That is, when the chemical liquid detection sensor 302 detects the chemical liquid components, the control unit 200 determines that a nozzle 110 with resist liquid adhering to its tip after discharging or with resist liquid remaining on its tip after discharging is near the resist suction unit 20B and that preparation for suction of the resist liquid by the nozzle 110 is necessary, and performs control to open the opening 28. Furthermore, when the chemical liquid detection sensor 302 does not detect the chemical liquid components, the control unit 200 determines that a nozzle 110 with resist liquid adhering to its tip is not near the resist suction unit 20B and that preparation for suction of the resist liquid by the nozzle 110 is not necessary, and performs control to close the opening 28.

[0068] By controlling in this manner, the opening 28 can be opened and closed in conjunction with the position of the nozzle 110, and the time during which the opening 28 is open can be shortened as much as possible.

[0069] <Other variations> In this embodiment, the resist coating apparatus 100 is provided with one nozzle 110, but may be provided with multiple nozzles 110. For example, two nozzles 110 and two spin chucks 102 may be provided in the processing vessel 101, and one nozzle 110 may be assigned to one spin chuck 102 to coat the resist liquid on the wafer W. In the resist coating apparatus 100 configured as above, a resist storage unit 120 and a nozzle cleaning unit 130 are disposed between the two spin chucks 102, for example.

[0070] In the above-described embodiment, the liquid level of the resist liquid in the resist suction pipe 13 is adjusted by supplying gas to the container body 10. However, if the resist liquid can be sucked without adjusting the liquid level, a configuration for adjusting the liquid level is not necessary. For example, if the container body 10 is a low-height container and the lower end of the nozzle 110 can be positioned near the bottom of the container body 10 during suction of the resist liquid, the resist liquid can be sucked without adjusting the liquid level of the resist liquid in the container body 10. In this case, the container 1 is configured by, for example, directly connecting the outlet 25 of the resist suction unit 20 and the gas supply port 11 of the container body 10. In this case, the gas supply port 11 becomes the body-side opening 12. Alternatively, the container 1 may be configured by connecting the outlet 25 of the resist suction unit 20 and the gas supply port 11 of the container body 10 via a pipe or the like. In this case, the end of the pipe on the resist suction unit 20 side becomes the body-side opening 12.

[0071] Furthermore, in the above-described embodiment, an example in which one nozzle 110 is used to suction and discharge the resist liquid has been described. However, for example, one nozzle 110 may be used to suction and discharge the pre-wet liquid (an organic solvent such as thinner) and the resist liquid. Specifically, a pre-wet liquid storage section (not shown) is provided near the resist storage section 120, and the nozzle 110 suctions the resist liquid from the resist storage section 120 and then suctions the pre-wet liquid from the pre-wet liquid storage section. At this time, a liquid layer of the resist liquid and a liquid layer of the pre-wet liquid are formed overlapping each other inside the nozzle 110, and the liquid layer of the pre-wet liquid is present at the tip side of the nozzle 110. Then, the nozzle 110 in this state is moved above the wafer W, and the pre-wet liquid is discharged onto the surface of the wafer W, and then the resist liquid is discharged. In this manner, the nozzle 110 sequentially suctions the resist liquid, suctions the pre-wet liquid, discharges the pre-wet liquid, and discharges the resist liquid, thereby continuously performing the pre-wet process and the resist coating process on the wafer W.

[0072] In the above example, the opening 28 of the elastic member 22 is closed when a voltage is applied to the actuator 23, and the opening 28 is open when no voltage is applied. Alternatively, the opening 28 of the elastic member 22 may be closed when no voltage is applied to the actuator 23, and may be opened when a voltage is applied.

[0073] Furthermore, the processing liquid container and the substrate processing apparatus according to the present disclosure can also be applied to processing apparatuses for processing substrates other than semiconductor wafers, for example, FPD (flat panel display) substrates.

[0074] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the components of the above-described embodiments may be arbitrarily combined. Such an arbitrary combination naturally provides the functions and effects of each of the components involved in the combination, and also provides other functions and effects that are apparent to those skilled in the art from the description of this specification.

[0075] Furthermore, the effects described herein are merely descriptive or exemplary and are not limiting. In other words, the technology according to the present disclosure may achieve other effects that are apparent to those skilled in the art from the description of this specification, in addition to or in place of the above-described effects.

[0076] Note that the following configuration examples also fall within the technical scope of the present disclosure. (1) A treatment liquid storage container for storing a treatment liquid, a container body that stores the treatment liquid; a treatment liquid suction unit connected to the container body, The processing liquid suction unit a take-out base provided above a main body opening communicating with the container main body, the take-out base having a larger area than the main body opening in a top view, and having a treatment liquid take-out port at a position corresponding to the main body opening; an elastic member provided above the removal base, the elastic member having chemical resistance to the treatment liquid and having an opening at a position corresponding to the removal port in a top view; an actuator provided above the elastic member so as to expose the opening, the actuator being expandable and contractible in the vertical direction in response to a voltage applied thereto; a top plate member that is provided above the actuator so as to expose the opening and that defines the position of an upper end of the actuator; When the actuator expands in the vertical direction, the amount of compression of the elastic member by the actuator increases, thereby closing the opening; When the actuator contracts in the vertical direction, the amount of compression of the elastic member by the actuator decreases, thereby opening the opening. (2) The treatment liquid storage container described in (1) above, wherein the removal base has a flat plate portion that supports the elastic member from below, and a regulating member that is located on the periphery of the flat plate portion and regulates the lateral expansion of the elastic member. (3) The treatment liquid storage container according to (1) or (2), wherein the opening of the elastic member is large enough to allow a nozzle capable of suctioning and discharging the treatment liquid to pass through when the opening is opened by the actuator. (4) The treatment liquid storage container according to (3), wherein the elastic member has a portion around the opening that is gradually thinner toward the center of the opening. (5) The treatment liquid storage container according to any one of (1) to (4), wherein the elastic member is made of perfluoroelastomer. (6) A treatment liquid storage container according to any one of (1) to (5) above; a substrate holder for holding a substrate; a nozzle that can be inserted into the opening of the elastic member of the treatment liquid storage container and the removal port of the removal base, and that can suck and discharge the treatment liquid; a control unit that controls a suction operation of the nozzle and a discharge operation of the processing liquid onto the substrate held by the substrate holding unit. (7) The control unit contracting the actuator in the vertical direction to reduce the amount of compression of the elastic member by the actuator, thereby opening the opening; The processing liquid is sucked into the nozzle, After the treatment liquid has been sucked, the actuator is extended in a vertical direction to increase the amount of compression of the elastic member by the actuator, thereby closing the opening. The substrate processing apparatus according to (6) above, wherein the substrate processing apparatus performs control. (8) A nozzle support part is provided to movably support the nozzle, The control unit opening the opening in response to a command timing for controlling movement of the nozzle support portion toward the processing liquid storage container; The substrate processing apparatus according to (7), wherein the opening is closed in response to a command timing for movement control of the nozzle support portion from the processing liquid storage container. (9) The treatment liquid storage container further includes a proximity detection sensor that detects the proximity of an object, The control unit When the proximity detection sensor detects the proximity, the opening is opened. The substrate processing apparatus according to (7), wherein the opening is closed when the proximity is not detected by the proximity detection sensor. (10) The treatment liquid storage container further includes a chemical detection sensor that detects chemical components of the treatment liquid, The control unit When the chemical solution component is detected by the chemical solution detection sensor, the opening is opened. The substrate processing apparatus according to (7), wherein the opening is closed when the chemical component is not detected by the chemical detection sensor. (11) A substrate processing method for processing a substrate with a processing liquid in a processing liquid storage container, comprising: The treatment liquid storage container is a container body that stores the treatment liquid; a treatment liquid suction unit connected to the container body, The processing liquid suction unit a take-out base provided above a main body opening communicating with the container main body, the take-out base having a larger area than the main body opening in a top view, and having a treatment liquid take-out port at a position corresponding to the main body opening; an elastic member provided above the removal base, the elastic member having chemical resistance to the treatment liquid and having an opening at a position corresponding to the removal port in a top view; an actuator provided above the elastic member so as to expose the opening, the actuator being expandable and contractible in the vertical direction in response to a voltage applied thereto; a top plate member that is provided above the actuator so as to expose the opening and that defines the position of an upper end of the actuator; contracting the actuator in a vertical direction to reduce the amount of compression of the elastic member by the actuator, thereby opening the opening; a step of sucking the treatment liquid into a nozzle; a step of extending the actuator in a vertical direction to increase the amount of compression of the elastic member by the actuator, thereby closing the opening; and discharging the sucked processing liquid from the nozzle onto the substrate. [Explanation of symbols]

[0077] 1, 1A, 1B Resist container 10 Container body 12 Main unit side opening 20, 20A, 20B Resist suction part 21 Foundation 22 Elastic member 23 Actuator 24 Top plate material 25 Outlet 28 Aperture W wafer

Claims

1. A processing liquid storage container that stores a processing liquid, a container body that stores the treatment liquid; a treatment liquid suction unit connected to the container body, The processing liquid suction unit a take-out base provided above a main body opening communicating with the container main body, the take-out base having a larger area than the main body opening in a top view, and having a treatment liquid take-out port at a position corresponding to the main body opening; an elastic member provided above the removal base, the elastic member having chemical resistance to the treatment liquid and having an opening at a position corresponding to the removal port in a top view; an actuator provided above the elastic member so as to expose the opening, the actuator being expandable and contractible in the vertical direction in response to a voltage applied thereto; a top plate member that is provided above the actuator so as to expose the opening and that defines the position of an upper end of the actuator; When the actuator expands in the vertical direction, the amount of compression of the elastic member by the actuator increases, thereby closing the opening; When the actuator contracts in the vertical direction, the amount of compression of the elastic member by the actuator decreases, thereby opening the opening.

2. The treatment liquid storage container according to claim 1, wherein the removal base has a flat plate portion that supports the elastic member from below, and a regulating member that is located on the periphery of the flat plate portion and regulates lateral expansion of the elastic member.

3. 3. The treatment liquid storage container according to claim 1, wherein the opening of the elastic member is sized to allow a nozzle capable of suctioning and discharging the treatment liquid to pass through when the opening is opened by the actuator.

4. The treatment liquid storage container according to claim 3 , wherein the elastic member has a portion around the opening that is gradually thinner toward the center of the opening.

5. 3. The treatment liquid storage container according to claim 1, wherein the elastic member is made of perfluoroelastomer.

6. The treatment liquid storage container according to claim 1 or 2; a substrate holder for holding a substrate; a nozzle that can be inserted into the opening of the elastic member of the treatment liquid storage container and the removal port of the removal base, and that can suck and discharge the treatment liquid; a control unit that controls a suction operation of the nozzle and a discharge operation of the processing liquid onto the substrate held by the substrate holding unit.

7. The control unit contracting the actuator in the vertical direction to reduce the amount of compression of the elastic member by the actuator, thereby opening the opening; The processing liquid is sucked into the nozzle, After the treatment liquid has been sucked, the actuator is extended in a vertical direction to increase the amount of compression of the elastic member by the actuator, thereby closing the opening. The substrate processing apparatus according to claim 6 , further comprising: a control unit for controlling the substrate processing apparatus;

8. a nozzle support portion that movably supports the nozzle, The control unit opening the opening in response to a command timing for controlling movement of the nozzle support portion toward the processing liquid storage container; The substrate processing apparatus according to claim 7 , wherein the opening is closed in response to a command timing for movement control of the nozzle support portion from the processing liquid storage container.

9. the treatment liquid storage container further includes a proximity detection sensor that detects the proximity of an object; The control unit When the proximity detection sensor detects the proximity, the opening is opened. The substrate processing apparatus according to claim 7 , wherein the opening is closed when the proximity is not detected by the proximity detection sensor.

10. the treatment liquid storage container further includes a chemical detection sensor that detects chemical components of the treatment liquid; The control unit When the chemical solution component is detected by the chemical solution detection sensor, the opening is opened. The substrate processing apparatus according to claim 7 , wherein the opening is closed when the chemical component is not detected by the chemical detection sensor.

11. A substrate processing method for processing a substrate with a processing liquid in a processing liquid storage container, comprising: The treatment liquid storage container is a container body that stores the treatment liquid; a treatment liquid suction unit connected to the container body, The processing liquid suction unit a take-out base provided above a main body opening communicating with the container main body, the take-out base having a larger area than the main body opening in a top view, and having a treatment liquid take-out port at a position corresponding to the main body opening; an elastic member provided above the removal base, the elastic member having chemical resistance to the treatment liquid and having an opening at a position corresponding to the removal port in a top view; an actuator provided above the elastic member so as to expose the opening, the actuator being expandable and contractible in the vertical direction in response to a voltage applied thereto; a top plate member that is provided above the actuator so as to expose the opening and that defines the position of an upper end of the actuator; contracting the actuator in a vertical direction to reduce the amount of compression of the elastic member by the actuator, thereby opening the opening; a step of sucking the treatment liquid into a nozzle; a step of extending the actuator in a vertical direction to increase the amount of compression of the elastic member by the actuator, thereby closing the opening; and discharging the sucked processing liquid from the nozzle onto the substrate.

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